Surface height distribution measurement method and surface height distribution measurement device
The method and device efficiently measure surface height distributions of disk-shaped objects by moving displacement meters between positions, rotating, and measuring both surfaces simultaneously, addressing inefficiencies in existing technologies and reducing measurement time.
Patent Information
- Application Number
- PCT/JP2025/018124
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-05-27
- Filing Date
- 2025-05-19
- Publication Date
- 2025-12-04
AI Technical Summary
Existing methods for measuring the surface height distribution of disk-shaped objects are inefficient in terms of measurement time due to the need to scan and measure one straight line at a time, requiring multiple back-and-forth movements.
A method and device that measure surface height distributions by moving a displacement meter relative to a disk-shaped object between two positions, rotating it by a predetermined angle at each position, and then moving back, allowing simultaneous measurement of both surfaces at different positions.
This approach significantly reduces measurement time by enabling simultaneous measurement of both surfaces of the disk-shaped object, aligning measurement centers on a straight line, and utilizing displacement meters positioned through the object's center.
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Figure JP2025018124_04122025_PF_FP_ABST
Abstract
Description
Surface height distribution measuring method and device
[0001] The present invention relates to a surface height distribution measuring method and a surface height distribution measuring device for measuring the surface height distribution of a disk-shaped measurement target.
[0002] A shape measurement method for measuring the surface height of a disk-shaped measurement target is disclosed, for example, in Patent Document 1. The flatness measurement method disclosed in Patent Document 1 includes three support parts for supporting the disk-shaped measurement target at three points, a pair of capacitance-type displacement sensors for measuring the distances from the top and bottom of the measurement target to the top and bottom surfaces of the measurement target, an elevator and rotation device, and a computer, in which the elevator and rotation device lifts the measurement target, rotates it by a predetermined angle, and then lowers it so that it is supported by the support parts, a line passing through the center of the measurement target is scanned and measured with each of the pair of capacitance-type displacement sensors, the computer determines the thickness of the measurement target based on the measured values on the top surface and the measured values on the bottom surface, the measurement target is returned to the elevator and rotation device, and the elevator and rotation device lifts, rotates, and lowers the measurement target to scan and measure the next line.
[0003] However, the flatness measurement method disclosed in Patent Document 1 scans and measures one straight line on the way from the elevator and rotation device, and then returns to the elevator and rotation device on the way back to scan and measure the next straight line, so there is room for improvement from the perspective of shortening the measurement time.
[0004] Japanese Patent Application Laid-Open No. 2003-75147
[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a surface height distribution measuring method and a surface height distribution measuring device that can shorten the measurement time.
[0006] A surface height distribution measuring method and apparatus according to one aspect of the present invention are a method and apparatus for measuring the surface height distribution of a disk-shaped measurement object, which measure a first surface height distribution on a first line of the measurement object by using a displacement meter that measures the distance to the surface of the measurement object while moving the measurement object relative to the first position from the first position to the second position at first and second positions, rotate the measurement object by a predetermined angle in the circumferential direction at the second position, measure a second surface height distribution on a second line of the measurement object by using the displacement meter while moving the displacement meter relative to the measurement object between the second position and the first position, and rotate the measurement object by a predetermined angle in the circumferential direction at the first position.
[0007] These and other objects, features and advantages of the present invention will become apparent from the following detailed description and accompanying drawings.
[0008] It is a diagram for explaining the structural configuration of the surface height distribution measuring device in an embodiment. It is a block diagram showing the electrical configuration of the surface height distribution measuring device. It is a flowchart showing the operation of the surface height distribution measuring device. It is a diagram for explaining the operation of the surface height distribution measuring device.
[0009] Hereinafter, one or more embodiments of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the disclosed embodiments. In addition, components with the same reference numerals in each drawing indicate the same components, and their description will be omitted as appropriate. In this specification, when referring to a general term, a reference numeral without a subscript is used, and when referring to an individual component, a reference numeral with a subscript is used.
[0010] Fig. 1 is a diagram for explaining the structural configuration of a surface height distribution measuring device in an embodiment. Fig. 1A is a front view, Fig. 1B is a side view, and Fig. 1C is a top view. Fig. 2 is a block diagram showing the electrical configuration of the surface height distribution measuring device.
[0011] The surface height distribution measuring device 1000 in the embodiment includes, for example, first and second lifting and rotating units 1A and 1B, first and second displacement meters 2A and 2B, a support moving unit 3, a control processing unit 4, an input unit 5, an output unit 6, an interface unit (IF unit) 7, and a memory unit 8, as shown in Figures 1 and 2.
[0012] The first and second lifting and rotating units 1A and 1B are each electrically connected to the control processing unit 4 and are devices that lift and lower a disk-shaped measurement target WA and rotate the measurement target WA by a predetermined angle in the circumferential direction under the control of the control processing unit 4. The first lifting and rotating unit 1A is disposed at a predetermined first position P1, and the second lifting and rotating unit 1B is disposed at a predetermined second position P2 different from the first position P1. Since the first lifting and rotating unit 1A and the second lifting and rotating unit 1B have the same structure, the following description will mainly focus on the first lifting and rotating unit 1A. By listing the reference numerals in the configuration of the first lifting and rotating unit 1A corresponding to the reference numerals in the configuration of the second lifting and rotating unit 1B in parentheses, a description of the second lifting and rotating unit 1B will be omitted.
[0013] More specifically, the first lifting and rotating unit 1A (1B) includes a rotating unit 1-1A (1-1B) and a lifting unit 1-2A (1-2B). The rotating unit 1-1A (1-1B) includes a rotating member and a rotation mechanism electrically connected to the control processing unit 4 and configured to rotate the rotating member in a circumferential direction under the control of the control processing unit 4. By rotating the rotating member in a circumferential direction with the rotation mechanism, the measurement object WA placed on the upper surface of the rotating member is rotated in a circumferential direction. The rotation mechanism includes, for example, a stepping motor and a transmission mechanism connected to the output shaft of the stepping motor, connecting its outer circumferential surface to the inner circumferential surface of the cylindrical member, and transmitting the rotational force of the stepping motor to the rotating member. The lifting unit 1-2A (1-2B) includes a guide member that guides the rotating unit 1-1A (1-1B), and a lifting mechanism that is electrically connected to the control processing unit 4 and that lifts and lowers the rotating unit 1-1A (1-1B) according to the control of the control processing unit 4, and that includes, for example, an electromagnetic cylinder, and by lifting and lowering the rotating unit 1-1A (1-1B) using the lifting mechanism, the measurement object WA placed on the upper surface of the rotating member is lifted and lowered.
[0014] The first and second lifting and rotating units 1A and 1B are disposed at predetermined first and second positions P1 and P2, respectively, on the upper surface of a first support unit 11, which is a plate-like member extending in one direction. The first support unit 11 is connected and fixed at both ends to a pair of first and second legs 12-1 and 12-2, which are plate-like members erected on a base plate BP, for example. Therefore, the first leg 12-1, first support unit 11, and second leg 12-2 are connected in this order, and as shown in FIG. 2B, the first support unit 11 and second leg 12-2 form a generally downward-facing U-shape in side view.
[0015] For ease of explanation, as shown in FIG. 1, an xyz Cartesian coordinate system is set up in which the extension direction of the support part 11 is the x-axis (x-direction, front-to-back direction), the width direction of the support part 11, which is perpendicular to the extension direction, is the y-axis (y-direction, left-to-right direction), and the direction perpendicular to each of the x-direction and y-direction is the z-axis (z-direction, height direction), and is used as appropriate.
[0016] In one example, the first position P1 is a position at the center of the measurement object WA where the measurement object WA can be raised and lowered and rotated after the first and second displacement gauges 2A and 2B have finished scanning the measurement object WA along a straight line passing through the center of the measurement object WA on the return path from the second position P2 to the first position P1. For example, the first position P1 is a position on one side of the x-direction relative to the positions of the first and second displacement gauges 2A and 2B, and away from the positions of the first and second displacement gauges 2A and 2B by a distance greater than the diameter of the measurement object WA. Similarly, in one example, the second position P2 is a position at the center of the measurement object WA where the measurement object WA can be raised and lowered and rotated after the first and second displacement gauges 2A and 2B have finished scanning the measurement object WA along a straight line passing through the center of the measurement object WA on the outward path from the first position P1 to the second position P2. For example, the second position P2 is a position on the other side of the x-direction relative to the positions of the first and second displacement gauges 2A and 2B, and is farther away from the positions of the first and second displacement gauges 2A and 2B than the diameter of the measurement object WA.
[0017] The measurement object WA may be any member that is disk-shaped, such as a wafer (e.g., silicon wafer) used in semiconductor manufacturing or an aluminum or glass magnetic disk substrate used in hard disks.
[0018] The first and second displacement meters 2A, 2B are each electrically connected to the control processing unit 4 and are devices that measure the distance to the surface of the measurement object WA under the control of the control processing unit 4. For example, they may be capacitance displacement meters, eddy current displacement meters, laser displacement meters, or confocal displacement meters. The first and second displacement meters 2A, 2B are arranged facing each other with a predetermined gap (first gap) between them so that the measurement object WA can pass through. With this arrangement, the first displacement meter 2A measures a first distance to one surface of the measurement object WA, and the second displacement meter 2B measures a second distance to one surface of the measurement object WA. The first and second displacement meters 2A, 2B each output their measurement results to the control processing unit 4.
[0019] The first displacement gauge 2A is disposed at one end (location) on the underside of the first support arm 22-1, which is a plate-like member extending in one direction (x direction), and the second displacement gauge 2B is disposed at one end (location) on the upper surface of the second support arm 22-2, which is a plate-like member extending in one direction (x direction) and whose width in the y direction is wider than the outer diameter of the second lifting and rotating unit 1B. The first and second support arms 22-1, 22-2 are each connected and fixed at the other end to a second support unit 21, which is a columnar member erected on the base plate BP, on the outer side in the x direction of the second leg 12-2 (or on the outer side in the x direction of the first leg 12-1), so that the first displacement gauge 2A and the second displacement gauge 2B face each other with the first gap between them. Therefore, the first and second support arm portions 22-1 and 22-2 are spaced apart in the z direction, and the first support arm portion 22-1, the second support arm portion 22-2, and the second support portion 21 are generally F-shaped in side view, as shown in Fig. 2B. A through-opening is formed in the second support arm portion 22-2 at a location corresponding to the location of the second lifting and rotating portion 1B, so that the second lifting and rotating portion 1B can appear and disappear in the z direction relative to the second support arm portion 22-2.
[0020] The first displacement gauge 2A and the second displacement gauge 2B may be held by other means so as to pass through the approximate center of the measurement object WA.
[0021] The support movement unit 3 is electrically connected to the control processing unit 4 and, under the control of the control processing unit 4, supports the measurement object WA and moves the measurement object WA and the first and second displacement gauges 2A, 2B relatively between the first and second positions P1, P2 so that the first and second displacement gauges 2A, 2B pass through approximately the center of the measurement object WA. In this embodiment, as described above, the first and second displacement gauges 2A, 2B are fixedly disposed by the first and second support arm units 22-1, 22-2 and the second support unit 21, and the support movement unit 3 supporting the measurement object WA moves so that the measurement object WA moves relative to the first and second displacement gauges 2A, 2B. Note that the surface height distribution measuring device 1000 may also be configured so that the first and second displacement gauges 2A, 2B move relative to the fixedly disposed measurement object WA.
[0022] More specifically, the support movement unit 3 includes three first through third support pins 31-1 through 31-3, a pair of third and fourth support units 32-1 and 32-2, a connecting unit 33, and a movement unit 34. The first through third support pins 31-1 through 31-3 are each needle-shaped or thin columnar members, and support the measurement object WA from its underside at their respective tips, which are one end in the z direction (three-point support). The first support pin 31-1 is erected at its base end, which is the other end in the z direction, from one end face in the z direction of the third support unit 32-1, which is a plate-shaped member. The second support pin 31-2 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the fourth support portion 32-2, which is a plate-like member, and similarly, the third support pin 31-3 stands upright at its base end, which is the other end in the z direction, from one end face in the z direction of the fourth support portion 32-2, which is a plate-like member, and the second support pin 31-2 and the third support pin 31-3 are arranged at a predetermined interval (second interval) from each other in the x direction. The connecting portion 33 is a plate-like member that is wider in the y direction than the first support portion 11, and is connected and fixed at both ends in the y direction to the other end faces in the z direction of the third and fourth support portions 32-1 and 32-2, respectively, so as to stand upright. The third support portion 32-1 and the fourth support portion 32-2 are disposed on the outside of the first support portion 11 at a predetermined interval (third interval) in the y direction, and the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2 are sequentially connected in this order, forming a generally upward U-shape in front view, as shown in FIG. 2A. The first support portion 11 is disposed inside the U-shape formed by the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2. The first through third support pins 31-1 to 31-3 are disposed on the third and fourth support portions 32-1 and 32-2 so as to be located at the vertices of a triangle. The moving unit 34 is electrically connected to the control processing unit 4 and is a device for moving the first to third support pins 31-1 to 31-3 supported by the third and fourth support units 32-1, 32-2 and the connecting unit 33 in accordance with the control of the control processing unit 4 so that the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 can move along the x direction at least between the first position P1 and the second position P2.The moving unit 34 includes, for example, a box-shaped housing 34-1 and a pedestal 34-2 extending in the x direction from the inside of the first leg 12-1 to the inside of the second leg 12-2, the pedestal 34-1 including a rack extending in the x direction, the housing 34-1 being fixed by being connected to the connecting unit 33 at its upper surface and including a pinion for linear movement on the rack and an actuator such as a servo motor for rotating the pinion, and the moving unit 34 is configured to linearly move the housing 34-1 and the connecting unit 33 relative to the pedestal 34-1 by the rack and pinion. The movement of the connecting unit 33 causes the measurement object WA supported by the first to third support pins 31-1 to 31-3 to move along the x direction.
[0023] The number of support pins 31 may be more than three. The shape of the support pins 31 may be a shape other than a needle-like member or a thin column-like member.
[0024] The first leg 12-1, first support 11, and second leg 12-2 on which the first and second lifting and rotating units 1A and 1B are arranged, and the first support arm 22-1, second support arm 22-2, and second support 21 on which the first and second displacement gauges 2A and 2B are arranged are arranged so that the center of the first lifting and rotating unit 1A (first position P1), the centers of the first and second displacement gauges 2A and 2B, and the center of the second lifting and rotating unit 1B (second position P2) are aligned in that order on a straight line along the x direction. The moving unit 3 is positioned relative to the first leg 12-1, first support unit 11, and second leg 12-2, and the first support arm 22-1, second support arm 22-2, and second support unit 21, which are arranged as described above, so that when the measurement object WA is placed on the first lifting and rotating unit 1A (or the second lifting and rotating unit 1B) with the center of the first lifting and rotating unit 1A (or the center of the second lifting and rotating unit 1B) aligned with the center of the measurement object WA, and the placed measurement object WA is supported by the first to third support pins 31-1 to 31-3, the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 moves on a straight line passing through the center of the first lifting and rotating unit 1A (first position P1) and the center of the second lifting and rotating unit 1B (second position P2).
[0025] The input unit 5 is electrically connected to the control processing unit 4 and is a device that inputs various commands, such as a command to start measurement, and various data necessary for operating the surface height distribution measuring device 1000, such as the name of the measurement object WA and a predetermined angle, to the surface height distribution measuring device 1000, and is, for example, a plurality of input switches to which predetermined functions are assigned, a keyboard, a mouse, etc. The output unit 6 is electrically connected to the control processing unit 4 and is a device that outputs the commands, data, calculation results, etc. input from the input unit 5 under the control of the control processing unit 4, and is, for example, a display device such as a CRT display, an LCD (liquid crystal display), or an organic EL display, or a printing device such as a printer.
[0026] The input unit 5 and the output unit 6 may be configured as a touch panel. In this touch panel configuration, the input unit 5 is a position input device, such as a resistive or capacitive type, that detects and inputs an operation position, and the output unit 6 is a display device. In this touch panel, a position input device is provided on the display surface of the display device, and one or more input content candidates that can be input are displayed on the display device. When a user touches the display position showing the input content they want to input, the position is detected by the position input device, and the display content displayed at the detected position is input to the surface height distribution measuring device 1000 as the user's operation input content. Such a touch panel makes it easy for the user to intuitively understand input operations, thereby providing a surface height distribution measuring device 1000 that is easy for the user to use.
[0027] The IF unit 7 is electrically connected to the control processing unit 4 and is a circuit that inputs and outputs data to and from, for example, an external device under the control of the control processing unit 4, and is, for example, an interface circuit for RS-232C, which is a serial communication method, an interface circuit using the Bluetooth (registered trademark) standard, an interface circuit using the USB standard, etc. The IF unit 7 may also be, for example, a communication interface circuit that transmits and receives communication signals to and from an external device, such as a data communication card or a communication interface circuit conforming to the IEEE 802.11 standard, etc.
[0028] The storage unit 8 is electrically connected to the control processing unit 4 and is a circuit that stores various predetermined programs and various predetermined data under the control of the control processing unit 4.
[0029] The various predetermined programs include, for example, a control processing program, which in turn includes, for example, a control program and a measurement control program. The control program controls each of the units 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring device 1000 according to the function of each unit. The measurement control program is a program that controls the measurement of the measurement object WA.
[0030] The various types of predetermined data include data necessary for executing each of these programs, such as the name of the measurement object WA, a predetermined angle, a predetermined sampling interval, and measurement results.
[0031] The storage unit 8 includes, for example, a ROM (Read Only Memory), which is a nonvolatile storage element, or an EEPROM (Electrically Erasable Programmable Read Only Memory), which is a rewritable nonvolatile storage element. The storage unit 8 also includes a RAM (Random Access Memory), which serves as a working memory for the control processing unit 4 and stores data generated during execution of the predetermined program. The storage unit 8 may also be configured with a hard disk drive or solid state drive (SSD) with a relatively large storage capacity.
[0032] The control processing unit 4 is a circuit that controls each of the units 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring device 1000 according to the function of each unit, and measures the surface height distribution of the measurement object. The control processing unit 4 is configured to include, for example, a CPU (Central Processing Unit) and its peripheral circuits. The control processing unit 4 is functionally configured to include a control unit 41 and a measurement control unit 42 by executing the control processing program.
[0033] The control unit 41 controls each of the units 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring apparatus 1000 according to the function of each unit, and is in charge of overall control of the surface height distribution measuring apparatus 1000.
[0034] The measurement control unit 42 controls the measurement of the measurement object WA. More specifically, the measurement control unit 42 controls the first lifting and rotating unit 1A to rotate the measurement object WA by a predetermined angle in the circumferential direction, controls the first lifting and rotating unit 1A and the support moving unit 3 to support the measurement object WA from the first lifting and rotating unit 1A to the support moving unit 3, controls the support moving unit 3 and the first and second displacement gauges 2A and 2B to measure a first distance to the one surface of the measurement object WA and a second distance to the other surface of the measurement object WA at predetermined sampling intervals while the measurement object WA is moved by the support moving unit 3 from the first position P1 to the second position P2, and controls the support moving unit 3 and the first and second displacement gauges 2A and 2B to support the measurement object WA from the support moving unit 3 to the second lifting and rotating unit 1B. The moving unit 3 and the second lifting and rotating unit 1B are controlled to rotate the measurement object WA circumferentially by the specified angle, the second lifting and rotating unit 1B and the support moving unit 3 are controlled to support the measurement object WA from the second lifting and rotating unit 1B to the support moving unit 3, the support moving unit 3 and the first and second displacement gauges 2A, 2B are controlled to measure the first and second distances at the specified sampling intervals while the measurement object WA is moved from the second position P2 to the first position P1 by the support moving unit 3, and the support moving unit 3 and the first lifting and rotating unit 1A are controlled to support the measurement object WA on the first lifting and rotating unit 1A from the support moving unit 3.
[0035] The thickness of the measurement object WA can be calculated using the following method: The distance between the arrangement positions of the first displacement gauge 2A and the second displacement gauge 2B is determined in advance, and the thickness can be calculated from the distance from the first displacement gauge 2A to the surface of the measurement object WA and the distance from the second displacement gauge 2B to the back surface of the measurement object WA ((thickness of measurement object WA) = (distance between the arrangement positions of the first displacement gauge 2A and the second displacement gauge 2B) - ((first distance to the surface of the WA measured by the first displacement gauge 2A) + (first distance to the surface of the WA measured by the second displacement gauge 2B)).
[0036] The control processing unit 4, input unit 5, output unit 6, IF unit 7 and storage unit 8 in the surface height distribution measuring device 1000 can be configured by, for example, a desktop or notebook computer.
[0037] Next, the operation of this embodiment will be described. Fig. 3 is a flowchart showing the operation of the surface height distribution measuring device. Fig. 4 is a diagram for explaining the operation of the surface height distribution measuring device.
[0038] When the power is turned on, the surface height distribution measuring device 1000 having such a configuration initializes the necessary parts and starts its operation. The control processing unit 4 functionally configures a control unit 41 and a measurement control unit 42 by executing a control processing program.
[0039] 2 and 3, when the measurement object WA is placed on the first lifting and rotating unit 1A with its centers aligned, for example, by a user or a robot arm (not shown), and an instruction to start measurement is given, the surface height distribution measuring device 1000 controls the first lifting and rotating unit 1A using the measurement control unit 42 of the control processing unit 4 so as to rotate the measurement object WA in the circumferential direction by a predetermined angle (S1, 1. Rotation of the measurement object WA).
[0040] Next, the surface height distribution measuring device 1000 controls the first lifting and rotating unit 1A and the support moving unit 3 by the measurement control unit 42 so that the measurement object WA is supported by the support moving unit 3 by lifting and lowering from the first lifting and rotating unit 1A (S2).
[0041] Next, the surface height distribution measuring device 1000 controls the support and movement unit 3 and the first and second displacement gauges 2A and 2B by the measurement control unit 42 so that the first and second displacement gauges 2A and 2B measure a first distance to the one surface of the measurement object WA and a second distance to the other surface of the measurement object WA at a predetermined sampling interval while moving the measurement object WA from the first position P1 to the second position P2 using the support and movement unit 3 (S3, 2. Measurement of the measurement object WA). The surface height distribution of one surface of the measurement object WA (the first-A surface height distribution (the heights of each measurement point at the predetermined sampling interval)) measured by the first displacement gauge 2A and the surface height distribution of the other surface of the measurement object WA (the first-B surface height distribution (the heights of each measurement point at the predetermined sampling interval)) measured by the second displacement gauge 2B are stored in the memory unit 8 in association with the measurement order n (or the cumulative rotation angle from the initial position (= (the rotation angle of one time) × (the number of measurements n)).
[0042] Next, the surface height distribution measuring device 1000 controls the support moving unit 3 and the second lifting and rotating unit 1B by the measurement control unit 42 so that the measurement object WA is supported by the second lifting and rotating unit 1B from the support moving unit 3 by raising and lowering (S4, measurement of 3.n line completed).
[0043] Next, the surface height distribution measuring device 1000 controls the second lifting and rotating unit 1B using the measurement control unit 42 to rotate the measurement object WA in the circumferential direction by the specified angle (S5, 4. Rotation of the measurement object WA to the next line).
[0044] Next, the surface height distribution measuring device 1000 controls the second lifting and rotating unit 1B and the support moving unit 3 by the measurement control unit 42 so that the measurement object WA is supported by the support moving unit 3 from the second lifting and rotating unit 1B by raising and lowering (S6).
[0045] Next, the surface height distribution measuring device 1000 controls the support and movement unit 3 and the first and second displacement gauges 2A and 2B by the measurement control unit 42 so that the first and second distances are measured by the first and second displacement gauges 2A and 2B at the predetermined sampling intervals while the support and movement unit 3 moves the measurement object WA from the second position P2 to the first position P1 (S7, 5. Measurement of measurement object WA). The surface height distribution of one surface of the measurement object WA (the second-A surface height distribution), which is the measurement result of the first displacement gauge 2A, and the surface height distribution of the other surface of the measurement object WA (the second-B surface height distribution), which is the measurement result of the second displacement gauge 2B, are stored in the memory unit 8 in association with the measurement order n (or the cumulative rotation angle from the initial position).
[0046] Next, the surface height distribution measuring device 1000 controls the support moving unit 3 and the first lifting and rotating unit 1A by the measurement control unit 42 so that the measurement object WA is supported by the first lifting and rotating unit 1A from the support moving unit 3 by raising and lowering (S8, 6. Measurement of (n+1) line completed).
[0047] Next, the surface height distribution measuring device 1000 determines whether or not the measurement has ended (S9) using the measurement control unit 42. If the result of this determination is that the measurement has ended (Yes), the surface height distribution measuring device 1000 outputs each measurement result to the output unit 6 (S10) and ends this process. On the other hand, if the result of the determination is that the measurement has not ended (No), the surface height distribution measuring device 1000 returns to process S1. The determination of whether or not the measurement has ended is made based on whether or not measurements have been performed a required number of times, which is calculated by dividing 360 degrees by one rotation angle (if the required number of measurements is an even number, the end of the measurement is determined when the required number of measurements has been performed, and if the required number of measurements is an odd number, the end of the measurement is determined when (the required number of measurements + 1) has been performed).
[0048] If necessary, the measurement control unit 42 may output each measurement result to an external device via the IF unit 7. In addition, in the above description, this step S1 may be omitted in the first measurement immediately after the start of measurement.
[0049] As described above, the surface height distribution measuring device 1000 in the embodiment and the surface height distribution measuring method implemented therein measure each surface height distribution on both the outbound path moving from the first position P1 to the second position P2 and the inbound path moving from the second position P2 to the first position P1, thereby shortening the measurement time.
[0050] The surface height distribution measuring device 1000 and the surface height distribution measuring method are provided with first and second displacement meters 2A, 2B that face each other across the measurement object WA, and therefore can simultaneously measure the surface height distributions of one surface and the other surface of the measurement object WA.
[0051] This specification discloses various aspects of the technology as described above, but the main technologies among them are summarized below.
[0052] A surface height measurement method according to one embodiment is a method for measuring a surface height distribution of a disk-shaped measurement object, and includes: a first measurement step of measuring a first surface height distribution on a first straight line of the measurement object by using a displacement meter that measures the distance to the surface of the measurement object while moving the measurement object relative to the first position from the first position to the second position, which are different from each other; a first rotation step of rotating the measurement object by a predetermined angle in a circumferential direction at the second position after the first measurement step is completed; a second measurement step of measuring a second surface height distribution on a second straight line of the measurement object by using the displacement meter to measure a second surface height distribution on the measurement object while moving the displacement meter relative to the measurement object between the second position and the first position; and a second rotation step of rotating the measurement object by a predetermined angle in a circumferential direction at the first position after the second measurement step is completed.
[0053] Such a surface height distribution measuring method measures each surface height distribution on both the outward path from the first position to the second position and the return path from the second position to the first position, thereby reducing the measurement time.
[0054] In another aspect, in the above-mentioned surface height distribution measurement method, the displacement meter includes a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to another surface of the measurement object that faces the one surface, and the first measurement step measures the surface height distributions of the one surface and the other surface as the first surface height distribution, and the second measurement step measures the surface height distributions of the one surface and the other surface as the second surface height distribution.
[0055] Such a surface height distribution measuring method includes the first and second displacement meters via the object to be measured, and therefore can simultaneously measure the surface height distributions of one surface and the other surface of the object to be measured.
[0056] In another aspect, in the above-described surface height distribution measurement method, the center around which the measurement object at the first position is rotated circumferentially by a predetermined angle, the center around which the measurement object at the second position is rotated circumferentially by a predetermined angle, and the center of the disk-shaped measurement object are aligned on a straight line.
[0057] This provides a surface height distribution measuring method for measuring the surface height distribution when the centers are aligned in a straight line.
[0058] In another aspect, in the above-described surface height distribution measuring method, the displacement meter is disposed at a position passing through the center of the disk-shaped measurement object.
[0059] This provides a surface distribution measuring method in which the displacement meter is disposed at a position that passes through the center of the disk-shaped measurement object.
[0060] Another aspect of the surface height distribution measuring device is a device for measuring the surface height distribution of a disk-shaped measurement object, and includes a displacement meter that measures the distance to the surface of the measurement object, a first rotating unit that is arranged at a first position and rotates the measurement object circumferentially by a predetermined angle, a second rotating unit that is arranged at a second position different from the first position and rotates the measurement object circumferentially by the predetermined angle, and a moving unit that moves the measurement object and the displacement meter relatively between the first and second positions.
[0061] Such a surface height distribution measuring device measures each surface height distribution on both the outward path from the first position to the second position and the return path from the second position to the first position, thereby reducing the measurement time.
[0062] In another aspect, in the above-mentioned surface height distribution measuring device, the displacement meter includes a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to another surface of the measurement object that faces the one surface.
[0063] Such a surface height distribution measuring method includes the first and second displacement meters via the object to be measured, and therefore can simultaneously measure the surface height distributions of one surface and the other surface of the object to be measured.
[0064] In another aspect, in the above-mentioned surface height distribution measuring device, the center around which the measurement object at the first position is rotated circumferentially by a predetermined angle, the center around which the measurement object at the second position is rotated circumferentially by a predetermined angle, and the center of the disk-shaped measurement object are arranged to be aligned on a straight line.
[0065] This makes it possible to provide a surface height distribution measuring device that measures the surface height distribution when the centers are aligned in a straight line.
[0066] In another aspect, in the above-described surface height distribution measuring device, the displacement meter is provided at a position passing through the center of the disk-shaped measurement target.
[0067] This makes it possible to provide a surface distribution measuring device in which the displacement meter is provided at a position that passes through the center of the disk-shaped measurement object.
[0068] This application is based on Japanese Patent Application No. 2024-85640, filed on May 27, 2024, the contents of which are incorporated herein by reference.
[0069] In order to express the present invention, the present invention has been properly and sufficiently described above through the embodiments with reference to the drawings, but it should be recognized that those skilled in the art can easily change and / or improve the above-mentioned embodiments. Therefore, unless the changes or improvements made by those skilled in the art are at a level that causes departure from the scope of the claims described in the claims, such changes or improvements are interpreted as being included in the scope of the claims.
[0070] According to the present invention, it is possible to provide a surface height distribution measuring method and a surface height distribution measuring device for measuring the surface height distribution of a disk-shaped measurement target.
Claims
1. A surface height distribution measurement method for measuring the surface height distribution of a disk-shaped measurement object, comprising: a first measurement step of measuring a first surface height distribution on a first straight line of the measurement object by using a displacement meter that measures the distance to the surface of the measurement object while moving the measurement object relative to the first position from the first position to the second position at mutually different first and second positions; a first rotation step of rotating the measurement object by a predetermined angle in the circumferential direction at the second position after the first measurement step is completed; a second measurement step of measuring a second surface height distribution on a second straight line of the measurement object by using the displacement meter to measure the second surface height distribution on the second straight line of the measurement object while moving the displacement meter relative to the measurement object between the second position and the first position; and a second rotation step of rotating the measurement object by a predetermined angle in the circumferential direction at the first position after the second measurement step is completed.
2. The surface height distribution measuring method according to claim 1, wherein the displacement meter comprises a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to the other surface of the measurement object that faces the one surface, and wherein the first measuring step measures the surface height distributions of the one surface and the other surface as the first surface height distribution, and wherein the second measuring step measures the surface height distributions of the one surface and the other surface as the second surface height distribution.
3. The surface height distribution measurement method according to claim 1, wherein the center around which the measurement object at the first position is rotated by a predetermined angle in the circumferential direction, the center around which the measurement object at the second position is rotated by a predetermined angle in the circumferential direction, and the center of the disk-shaped measurement object are aligned on a straight line.
4. The surface height distribution measuring method according to claim 3, wherein the displacement meter is arranged at a position passing through the center of the disk-shaped measurement object.
5. A surface height distribution measuring device for measuring the surface height distribution of a disk-shaped measurement object, comprising: a displacement meter for measuring the distance to the surface of the measurement object; a first rotating unit arranged at a first position and rotating the measurement object by a predetermined angle in the circumferential direction; a second rotating unit arranged at a second position different from the first position and rotating the measurement object by the predetermined angle in the circumferential direction; and a moving unit for moving the measurement object and the displacement meter relatively between the first and second positions.
6. The surface height distribution measuring device according to claim 5, wherein the displacement meter comprises a first displacement meter that measures a first distance to one surface of the measurement object, and a second displacement meter that measures a second distance to another surface of the measurement object that faces the one surface.
7. A surface height distribution measuring device according to claim 5, wherein the center for rotating the measurement object at the first position by a predetermined angle in the circumferential direction, the center for rotating the measurement object at the second position by a predetermined angle in the circumferential direction, and the center of the disk-shaped measurement object are arranged to be aligned on a straight line.
8. The surface height distribution measuring device according to claim 7, wherein the displacement meter is provided at a position passing through the center of the disk-shaped measurement object.
Citation Information
Patent Citations
Instrument for measuring disk surface shape
JP1989207615A
Flatness measuring jig
JP1994341804A
Method and device for measurement of flatness
JP2003075147A
Shape determining device
WO2010087390A1
Wafer thickness measurement device and method for same
WO2023084952A1