Transfer film for forming optical waveguide, laminate, method for manufacturing optical waveguide, and compound

Abstract

The first problem addressed by the present invention is to provide a transfer film for forming an optical waveguide, the transfer film being alkali developable and being capable of forming an optical waveguide that can achieve a low optical transmission loss. The second problem addressed by the present invention is to provide: a laminate which relates to the transfer film for forming an optical waveguide; and a method for manufacturing an optical waveguide. The third problem addressed by the present invention is to provide a compound which relates to the transfer film for forming an optical waveguide.　A transfer film for forming an optical waveguide according to the present invention has a provisional support and a photosensitive composition layer. The photosensitive composition layer contains a compound having no hydroxyl group and a carboxy group, and a compound for reducing the amount of the carboxy group.

Description

Transfer film for forming optical waveguide, laminate, method for manufacturing optical waveguide, compound

[0001] The present invention relates to a transfer film for forming an optical waveguide, a laminate, a method for producing an optical waveguide, and a compound.

[0002] In recent years, optical transmission has been considered as an alternative to conventional electrical wiring for power transmission to further improve high-speed, high-density signal transmission between electronic elements and wiring boards. Polymer optical waveguides have also attracted attention as optical transmission paths connecting electronic elements and wiring boards because of their ease of processing, high degree of freedom in placement, and high-density mounting. For example, Patent Document 1 discloses a manufacturing method for forming an optical waveguide that is easy to manufacture industrially and has low optical propagation loss (optical transmission loss). In the manufacturing method for an optical waveguide disclosed in Patent Document 1, a core portion is formed using a core-forming resin composition containing (A) an alkali-soluble (meth)acrylic polymer, (B) a polymerizable compound, (C) a polymerization initiator, and (D) a thermosetting resin.

[0003] JP 2017-187654 A

[0004] The present inventors have studied the core-forming resin composition described in Patent Document 1 and have found that there is room for further reduction in optical transmission loss while ensuring alkaline developability.

[0005] Therefore, an object of the present invention is to provide a transfer film for forming an optical waveguide that can be developed in an alkali and that can form an optical waveguide that can achieve low optical transmission loss. Another object of the present invention is to provide a laminate related to the transfer film for forming an optical waveguide and a method for producing an optical waveguide. Another object of the present invention is to provide a compound related to the transfer film for forming an optical waveguide.

[0006] The present inventors have found that the above problems can be solved by the following configuration.

[0007] [1] A transfer film for forming an optical waveguide having a temporary support and a photosensitive composition layer, wherein the photosensitive composition layer contains a compound having a carboxy group and no hydroxyl group, and a compound that reduces the amount of the carboxy group, or the photosensitive composition layer contains the compound having a carboxy group and no hydroxyl group, and is substantially free of scatterers. [2] The transfer film for forming an optical waveguide according to [1], further comprising a thermoplastic resin layer between the temporary support and the photosensitive composition layer. [3] The transfer film for forming an optical waveguide according to [1] or [2], further comprising an intermediate layer between the temporary support and the photosensitive composition layer. [4] The transfer film for forming an optical waveguide according to any one of [1] to [3], wherein the compound having a carboxy group and no hydroxyl group is a polymer. [5] The transfer film for forming an optical waveguide according to any one of [1] to [4], wherein the compound that reduces the amount of carboxy groups is an isocyanate compound. [6] The transfer film for forming an optical waveguide according to any one of [1] to [4], wherein the compound that reduces the amount of carboxy groups is a compound that, upon exposure, causes a decarboxylation reaction of a carboxy group derived from the compound that does not have a hydroxyl group and has a carboxy group. [7] The transfer film for forming an optical waveguide according to [6], wherein the compound that reduces the amount of carboxy groups is one or more compounds selected from the group consisting of a quinoline compound, an isoquinoline compound, and a quinoxaline compound. [8] The transfer film for forming an optical waveguide according to [7], wherein the quinoline compound, the isoquinoline compound, and the quinoxaline compound have at least one radically polymerizable group. [9] The transfer film for forming an optical waveguide according to [8], wherein the radically polymerizable group is selected from the group consisting of a styryl group, an acryloyl group, and a methacryloyl group.

[10] The transfer film for forming an optical waveguide according to [7], wherein the compound that reduces the amount of carboxy groups is a quinoline compound.

[11] The transfer film for forming an optical waveguide according to any one of [1] to [3], wherein the compound having no hydroxyl group and a carboxy group is a polymer, and the compound that reduces the amount of carboxy groups is a compound that, upon exposure, causes a decarboxylation reaction of a carboxy group derived from the compound having no hydroxyl group and a carboxy group, and is one or more compounds selected from the group consisting of quinoline compounds, isoquinoline compounds, and quinoxaline compounds.

[12] The transfer film for forming an optical waveguide according to

[11] , wherein the quinoline compound, the isoquinoline compound, and the quinoxaline compound have at least one radically polymerizable group.

[13] The transfer film for forming an optical waveguide according to

[12] , wherein the radically polymerizable group is selected from the group consisting of a styryl group, an acryloyl group, and a methacryloyl group.

[14] A laminate having a substrate, a resin layer, and the transfer film for forming an optical waveguide according to any one of [1] to

[13] , wherein the photosensitive composition layer of the transfer film for forming an optical waveguide is disposed on the resin layer side.

[15] The laminate according to

[14] , wherein the refractive index of the resin layer is lower than the refractive index of a cured layer of the photosensitive composition layer.

[16] A method for producing an optical waveguide, comprising: Step 1 of exposing the photosensitive composition layer in the laminate according to

[15] to light; Step 2 of performing an alkali development treatment on the exposed photosensitive composition layer to form a core portion; and Step 3 of forming a resin layer having a lower refractive index than the core portion on the core portion so as to cover the core portion, thereby forming an optical waveguide having the core portion and a cladding portion, wherein Step 4 of peeling off the temporary support is performed before Step 1 or between Steps 1 and 2, and Step 5 of performing a treatment to reduce the amount of carboxy groups between Steps 2 and 3 or after Step 3, or the amount of carboxy groups is reduced in Step 1.

[17] The method for producing an optical waveguide according to

[16] , wherein the content of carboxy groups in the core portion that has been treated to reduce the amount of carboxy groups in Step 5 is 0.01 to 3.0 mass % relative to the total mass of the core portion.

[18] The method for producing an optical waveguide according to

[16] , wherein the content of carboxy groups in the core portion in which the amount of carboxy groups has been reduced by step 1 is 0.01 to 3.0 mass % relative to the total mass of the core portion.

[19] A compound represented by formula (B1) described later.

[20] A compound represented by formula (B1-1) described later.

[21] A compound represented by formula (B1-2) described later.

[22] A compound represented by formula (B1-3) described later.

[0008] According to the present invention, there is provided a transfer film for forming an optical waveguide, which is alkali-developable and capable of forming an optical waveguide capable of realizing low optical transmission loss. Furthermore, according to the present invention, there are provided a laminate related to the transfer film for forming an optical waveguide, and a method for producing an optical waveguide. Furthermore, according to the present invention, there is provided a compound related to the transfer film for forming an optical waveguide.

[0009] 1 is a schematic diagram showing an example of an embodiment of a transfer film for forming an optical waveguide of the present invention (a first transfer film for forming an optical waveguide and a second transfer film for forming an optical waveguide); FIG. 2 is a schematic diagram showing an example of an embodiment of a laminate (a first laminate and a second laminate) of the present invention; and FIG. 3 is a schematic diagram for explaining a method for manufacturing an optical waveguide using the laminate (a first laminate and a second laminate) of the present invention.

[0010] The present invention will be described in detail below. The following description of the constituent elements may be based on a representative embodiment of the present invention, but the present invention is not limited to such an embodiment. The present invention will be described in detail below. In this specification, a numerical range expressed using "to" means a range that includes the numerical values ​​before and after "to" as the upper and lower limits. Furthermore, in the numerical ranges described in stages in this specification, the upper or lower limit stated in a certain numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Furthermore, in the numerical ranges described in this specification, the upper or lower limit stated in a certain numerical range may be replaced with a value shown in an example.

[0011] Furthermore, the term "process" in this specification does not only refer to an independent process, but also includes a process that cannot be clearly distinguished from other processes as long as the intended purpose of the process is achieved.

[0012] In this specification, unless otherwise specified, the temperature condition may be 25° C. For example, the temperature when performing each of the above steps may be 25° C. unless otherwise specified.

[0013] In this specification, "transparent" means that the average transmittance of visible light having a wavelength of 400 to 700 nm is 80% or more, and preferably 90% or more. Therefore, for example, a "transparent resin layer" refers to a resin layer having an average transmittance of visible light having a wavelength of 400 to 700 nm of 80% or more. The average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a spectrophotometer U-3310 manufactured by Hitachi, Ltd.

[0014] In this specification, "actinic rays" or "radiation" means, for example, the bright line spectrum of a mercury lamp such as g-line, h-line, and i-line, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams (EB), etc. In addition, in the present invention, light means actinic rays or radiation.

[0015] In this specification, unless otherwise specified, the term "exposure" includes not only exposure using far ultraviolet light typified by mercury lamps and excimer lasers, extreme ultraviolet light, X-rays, EUV light, and the like, but also exposure using particle beams such as electron beams and ion beams.

[0016] In this specification, unless otherwise specified, the refractive index is a value measured by an Abbe refractometer (Abbe method) at a wavelength of 589 nm. In this specification, when the measurement target is a film (for example, a photosensitive composition layer or a cured film thereof), the refractive index is a value measured by an ellipsometry method, unless otherwise specified.

[0017] In this specification, unless otherwise specified, when a molecular weight distribution is present, the molecular weight is a weight average molecular weight. In this specification, the weight average molecular weight of a resin is a weight average molecular weight determined in terms of polystyrene by gel permeation chromatography (GPC).

[0018] In this specification, "(meth)acrylic" is a concept that includes both acrylic and methacrylic, "(meth)acryloyl" is a concept that includes both acryloyl and methacryloyl, and "(meth)acrylate" is a concept that includes both acrylate and methacrylate.

[0019] In the present disclosure, a compound or a layer constituting a transfer film is "alkali-soluble" means that the dissolution rate determined by the following method is 0.01 μm / sec or higher. A propylene glycol monomethyl ether acetate solution containing a 25% by mass concentration of the target substance (e.g., a resin) is applied to a glass substrate, and then heated in an oven at 100°C for 3 minutes to form a coating film (thickness 2.0 μm) of the target substance. The coating film is immersed in a 1% by mass aqueous solution of sodium carbonate (liquid temperature 30°C) to determine the dissolution rate (μm / sec) of the coating film. If the target substance is not soluble in propylene glycol monomethyl ether acetate, the target substance is dissolved in an organic solvent other than propylene glycol monomethyl ether acetate that has a boiling point of less than 200°C (e.g., tetrahydrofuran, toluene, or ethanol).

[0020] As used herein, "water-soluble" means that the solubility in 100 g of water having a pH of 7.0 and a liquid temperature of 22° C. is 0.1 g or more. Therefore, for example, a water-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions.

[0021] The "solid content" of a composition refers to components that form a composition layer (e.g., a photosensitive composition layer) formed using the composition, and when the composition contains a solvent (e.g., an organic solvent, water, etc.), it refers to all components excluding the solvent. Furthermore, liquid components that form a composition layer are also considered to be solid content.

[0022] Unless otherwise specified, the thickness (film thickness) of a layer in this specification is the average thickness measured using a scanning electron microscope (SEM) for thicknesses of 0.5 μm or more, and the average thickness measured using a transmission electron microscope (TEM) for thicknesses of less than 0.5 μm. The average thickness is obtained by cutting a sample to be measured using an ultramicrotome, measuring the thickness at any five points, and calculating the arithmetic average of the thicknesses.

[0023] The transfer film for forming an optical waveguide of the present invention (the first transfer film for forming an optical waveguide and the second transfer film for forming an optical waveguide) will be described below.

[0024] [First transfer film for forming optical waveguide] The first transfer film for forming optical waveguide of the present invention (hereinafter also simply referred to as "first transfer film") is a transfer film for forming optical waveguide having a temporary support and a photosensitive composition layer, wherein the photosensitive composition layer contains a compound that does not have a hydroxyl group but has a carboxy group (hereinafter also referred to as "compound A"), and a compound that reduces the amount of the carboxy group (hereinafter also referred to as "compound B").

[0025] The first transfer film having the above configuration exhibits good affinity for alkaline developers during development due to the presence of carboxy groups derived from compound A, and therefore exhibits excellent pattern-forming properties in alkaline developers. Furthermore, in a pattern formed by transferring the photosensitive composition layer of the first transfer film to a substrate, the action of compound B reduces carboxy groups that have absorption in wavelengths typically used in optical transmission (particularly at and around 1310 nm) and can cause high optical transmission loss (note that carboxy groups and hydroxyl groups exhibit vibration-induced absorption in the wavelength range of 1400 to 1700 nm, with the base of the absorption peak located at and around 1310 nm). In other words, the first transfer film allows for the formation of an optical waveguide that can be developed in an alkaline environment and achieve low optical transmission loss.

[0026] The photosensitive composition layer in the first transfer film may be either a negative photosensitive composition layer or a positive photosensitive composition layer, but is preferably a negative photosensitive composition layer.

[0027] Hereinafter, an example of a pattern formation method using a first transfer film will be described, divided into a case where the photosensitive composition layer contains a polymerization initiator (hereinafter also referred to as "photosensitive composition layer E1") and a case where the photosensitive composition layer does not substantially contain a polymerization initiator (hereinafter also referred to as "photosensitive composition layer E2"), and the mechanism of action of compound A and compound B in the first transfer film will be explained. Note that, hereinafter, better alkaline developability and / or lower optical transmission loss may also be referred to as "better effects of the present invention."

[0028] [Pattern Forming Method of First Embodiment (Photosensitive Composition Layer E1)] The pattern forming method of the first embodiment includes steps X1 to X5. When the photosensitive composition layer is the photosensitive composition layer E1, it is preferable to apply the pattern forming method of the first embodiment. Step X1: A step of bringing the surface of the photosensitive composition layer in the first transfer film opposite to the temporary support side into contact with a substrate, and laminating the first transfer film and the substrate together. Step X2: A step of exposing the photosensitive composition layer in a pattern (pattern exposure). Step X3: A step of developing the exposed photosensitive composition layer using an alkaline developer. Step X4: A step of performing a treatment to reduce the amount of carboxy groups on the photosensitive composition layer that has undergone alkaline development. Step X5: A step of peeling off the temporary support between steps X1 and X2, or between steps X2 and X3.

[0029] In the pattern formation method of the first embodiment, in step X1, the photosensitive composition layer of the first transfer film is bonded to an arbitrary substrate to form a laminate having the substrate and the photosensitive composition layer disposed on the substrate. Next, when the photosensitive composition layer of the obtained laminate is subjected to an exposure step in step X2, a polymerization reaction of the polymerizable component proceeds in the exposed areas. In the subsequent development step in step X3, the unexposed areas of the photosensitive composition layer are dissolved and removed in an alkaline developer to form a negative-type patterned photosensitive composition layer (cured layer). Then, in step X4, the patterned photosensitive composition layer obtained in step X3 is subjected to a treatment such as exposure and / or heating to activate compound B, and the amount of carboxy groups (particularly carboxy groups derived from compound A) in the photosensitive composition layer is reduced by the action of compound B. In other words, in the pattern formation method of the first embodiment, during the alkaline development step in step X3, the photosensitive composition layer after patterned exposure has excellent pattern formability in an alkaline developer due to the presence of a predetermined amount of carboxy groups in the photosensitive composition layer. Furthermore, by carrying out the step X4, the amount of carboxy groups in the photosensitive composition layer after development is reduced, and a pattern with low light propagation loss is formed.

[0030] [Pattern Forming Method of Second Embodiment (Photosensitive Composition Layer E2)] The pattern forming method of the second embodiment includes steps Y1 to Y4. Note that the following step Y2 corresponds to a step of reducing the amount of carboxy groups (particularly carboxy groups derived from Compound A) in the photosensitive composition layer. When the photosensitive composition layer is the photosensitive composition layer E2, it is preferable to apply the pattern forming method of the second embodiment. Step Y1: a step of bringing the surface of the photosensitive composition layer in the first transfer film opposite to the temporary support side into contact with a substrate, and laminating the first transfer film and the substrate together; Step Y2: a step of exposing the photosensitive composition layer in a pattern (pattern exposure); Step Y3: a step of developing the exposed photosensitive composition layer using an alkaline developer; and Step Y4: a step of peeling off the temporary support between Step Y1 and Step Y2, or between Step Y2 and Step Y3.

[0031] In the pattern formation method of the second embodiment, in step Y1, the photosensitive composition layer of the first transfer film is bonded to an arbitrary substrate to form a laminate having a substrate and a photosensitive composition layer disposed on the substrate. Next, when the photosensitive composition layer of the resulting laminate is subjected to patternwise exposure in step Y2, the amount of carboxy groups in the exposed areas decreases. Meanwhile, the amount of carboxy groups in the unexposed areas remains largely unchanged. That is, by undergoing step Y2, a difference in solubility in a developer (dissolution contrast) can occur between the exposed and unexposed areas of the photosensitive composition layer. As a result, in the subsequent development treatment in step Y3, the unexposed areas of the photosensitive composition layer that has undergone step Y2 are dissolved and removed in an alkaline developer, forming a negative pattern. Because the amount of carboxy groups in the exposed areas (residual film) is reduced in step Y2, the light propagation loss caused by the carboxy groups can be suppressed in the formed pattern.

[0032] [Configuration of First Transfer Film] The configuration of the first transfer film will be described below. FIG. 1 is a cross-sectional schematic diagram showing an example of an embodiment of the first transfer film. The transfer film 10 shown in FIG. 1 has a configuration in which a temporary support 12, a thermoplastic resin layer 14, an intermediate layer 16, a photosensitive composition layer 18, and a cover film 20 are laminated in this order. Note that the transfer film 10 shown in FIG. 1 has a configuration in which a cover film 20 is disposed, but the cover film 20 does not have to be disposed. Also, the transfer film 10 shown in FIG. 1 has a configuration in which a thermoplastic resin layer 14 and an intermediate layer 16 are disposed, but the thermoplastic resin layer 14 and the intermediate layer 16 do not have to be disposed. Also, in the transfer film 10 shown in FIG. 1, an intermediate layer (not shown) may be disposed on the photosensitive composition layer 18 side of the temporary support 14. Each element constituting the transfer film will be described below.

[0033] <<Temporary Support>> The first transfer film has a temporary support. The temporary support is a member that supports the photosensitive composition layer and is ultimately removed by a peeling treatment.

[0034] The temporary support may have either a single-layer structure or a multi-layer structure. As the temporary support, a film that is flexible and does not undergo significant deformation, shrinkage, or elongation under pressure or under pressure and heat is preferred, and among these, a resin film is more preferred because of its superior strength and flexibility. Examples of the resin film include polyethylene terephthalate film (e.g., biaxially oriented polyethylene terephthalate film), polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film, and polycarbonate film, with polyethylene terephthalate film being preferred. Furthermore, it is preferable that the film used as the temporary support is free of deformations such as wrinkles and scratches. The temporary support may be a glass substrate, paper, or the like.

[0035] The temporary support is preferably transparent in that the photosensitive composition layer can be exposed through the temporary support when the photosensitive composition layer is subjected to patternwise exposure. More specifically, the transmittance of the temporary support at wavelengths of 313 nm, 365 nm, 313 nm, 405 nm, and 436 nm is preferably 60% or more, more preferably 70% or more, even more preferably 80% or more, and most preferably 90% or more. As a method for measuring the transmittance, a method using an MCPD Series manufactured by Otsuka Electronics Co., Ltd. can be mentioned.

[0036] The thickness of the temporary support is not particularly limited, but is preferably 5 to 200 μm, and from the viewpoints of ease of handling and versatility, is more preferably 5 to 150 μm, still more preferably 5 to 50 μm, and most preferably 5 to 25 μm. The thickness of the temporary support is calculated as the average value of any five points measured by cross-sectional observation using an SEM (Scanning Electron Microscope).

[0037] In order to improve the adhesion between the temporary support and the photosensitive composition layer, the side of the temporary support that comes into contact with the photosensitive composition layer may be surface-modified by UV irradiation, corona discharge, plasma, or the like.

[0038] Examples of the temporary support include a biaxially oriented polyethylene terephthalate film having a thickness of 16 μm, a biaxially oriented polyethylene terephthalate film having a thickness of 12 μm, and a biaxially oriented polyethylene terephthalate film having a thickness of 9 μm. The temporary support may be a recycled product. Examples of recycled products include those obtained by cleaning used films and turning them into chips, and then using these as materials to form films. A specific example of a recycled product is the Ecouse series from Toray Industries, Inc.

[0039] Preferred forms of the temporary support include those described in, for example, paragraphs

[0017] to

[0018] of JP 2014-085643 A, paragraphs

[0019] to

[0026] of JP 2016-027363 A, paragraphs

[0041] to

[0057] of WO 2012 / 081680 A, and paragraphs

[0029] to

[0040] of WO 2018 / 179370 A, the contents of which are incorporated herein by reference.

[0040] To improve handling properties, a layer containing fine particles (lubricant layer) may be provided on the surface of the temporary support. The lubricant layer may be provided on one side or both sides of the temporary support. The diameter of the particles contained in the lubricant layer is preferably 0.05 to 0.8 μm. The thickness of the lubricant layer is preferably 0.05 to 1.0 μm.

[0041] Commercially available temporary supports include Lumirror 16KS40, Lumirror 16FB40, Lumirror #38-U48, Lumirror #75-U34, and Lumirror #25T60 (all manufactured by Toray Industries, Inc.), and COSMOSHINE A4100, COSMOSHINE A4160, COSMOSHINE A4300, COSMOSHINE A4360, and COSMOSHINE A8300 (all manufactured by Toyobo Co., Ltd.).

[0042] <<Photosensitive Composition Layer>> The first transfer film has a photosensitive composition layer. The photosensitive composition layer contains a compound (compound A) that has no hydroxyl group but has a carboxy group, and a compound (compound B) that reduces the amount of the carboxy group.

[0043] The photosensitive composition layer may be either a negative-type photosensitive composition layer or a positive-type photosensitive composition layer, but is preferably a negative-type photosensitive composition layer. Specific examples of the photosensitive composition layer include the photosensitive composition layers of the first to third embodiments shown below.

[0044] <Photosensitive Composition Layer of First Aspect> The photosensitive composition layer of the first aspect is a photosensitive composition layer (corresponding to photosensitive composition layer E1) containing a compound having no hydroxyl groups but having a carboxy group and a polymerizable group (compound A), a compound that reduces the amount of carboxy groups (compound B), and a polymerization initiator. <Photosensitive Composition Layer of Second Aspect> The photosensitive composition layer of the second aspect is a photosensitive composition layer (corresponding to photosensitive composition layer E1) containing a compound having no hydroxyl groups but having a carboxy group (compound A), a compound that reduces the amount of carboxy groups (compound B), a polymerizable compound, and a polymerization initiator. <Photosensitive Composition Layer of Third Aspect> The photosensitive composition layer of the third aspect is a photosensitive composition layer (corresponding to photosensitive composition layer E2) containing a compound having no hydroxyl groups but having a carboxy group (compound A), and a compound that reduces the amount of carboxy groups (compound B), and substantially not containing a polymerization initiator.

[0045] In the photosensitive composition layer of the first embodiment, the compound (corresponding to compound A) that does not have a hydroxyl group and has a carboxy group and a polymerizable group is preferably a polymer. Furthermore, the photosensitive composition layer of the first embodiment may further contain a polymerizable compound in addition to compound A, or may be substantially free of a polymerizable compound. The phrase "the photosensitive composition layer is substantially free of a polymerizable compound" means that the content of the polymerizable compound is less than 0.1% by mass, preferably 0 to 0.05% by mass, and more preferably 0 to 0.01% by mass, relative to the total mass of the photosensitive composition layer.

[0046] In the photosensitive composition layer of the second embodiment, the compound having a carboxyl group but no hydroxyl group (corresponding to compound A) is preferably a polymer. The polymer may or may not have a polymerizable group.

[0047] In the photosensitive composition layer of the third embodiment, the compound having a carboxyl group but no hydroxyl group (corresponding to compound A) is preferably a polymer. The polymer may or may not have a polymerizable group, but preferably does not have one. In the photosensitive composition layer of the third embodiment, "the photosensitive composition layer is substantially free of a polymerization initiator" means that the content of the polymerization initiator is less than 0.1% by mass, preferably 0 to 0.05% by mass, and more preferably 0 to 0.01% by mass, relative to the total mass of the photosensitive composition layer.

[0048] <Components of Photosensitive Composition Layer> Each component contained in the photosensitive composition layer will be described in detail below.

[0049] (Compound (Compound A) Having No Hydroxyl Groups and Having Carboxy Groups) The photosensitive composition layer contains a compound (Compound A) having no hydroxyl groups and having a carboxy group. With respect to Compound A, "having no hydroxyl groups" means that Compound A has no hydroxyl groups other than the hydroxyl groups contained in the carboxy groups. When Compound A has no hydroxyl groups, the optical transmission loss of the pattern formed by transferring the photosensitive composition layer of the first transfer film to a transfer target tends to be low.

[0050] Compound A may be a low molecular weight compound or a high molecular weight compound (hereinafter also referred to as "polymer"), but is preferably a polymer. When compound A is a low molecular weight compound, the molecular weight of compound A is preferably less than 5,000. When compound A is a polymer, the lower limit of the weight average molecular weight of compound A is preferably 5,000 or more, more preferably 10,000 or more, and even more preferably 15,000 or more, from the viewpoint of excellent formability of the photosensitive composition layer (in other words, excellent film-forming ability for forming the photosensitive composition layer). The upper limit is not particularly limited, but is preferably 50,000 or less, from the viewpoint of excellent adhesion (lamination adhesion) when pasted (transferred) to an arbitrary substrate.

[0051] When compound A is a polymer, the polymer is an alkali-soluble resin. When compound A is a polymer, from the viewpoint of developability, the acid value of compound A, which is a polymer, is preferably 60 to 300 mgKOH / g, more preferably 60 to 275 mgKOH / g, still more preferably 75 to 250 mgKOH / g, and particularly preferably 100 to 250 mgKOH / g. In this specification, the acid value of the resin is a value measured by the titration method specified in JIS K0070 (1992).

[0052] In addition, some or all of the carboxy groups of compound A may be anionized or not in the photosensitive composition layer. In this specification, the term "carboxy group" includes both anionized and non-anionized carboxy groups.

[0053] Compound A is preferably a monomer that does not have a hydroxyl group but contains a carboxy group (hereinafter also referred to as a "carboxy group-containing monomer"), or a polymer that does not have a hydroxyl group but contains a carboxy group (hereinafter also referred to as a "carboxy group-containing polymer"), and is more preferably a carboxy group-containing polymer in terms of better pattern forming performance of the photosensitive composition layer and better film formability. As described above, some or all of the carboxy groups (-COOH) in the carboxy group-containing monomer and the carboxy group-containing polymer may or may not be anionized in the photosensitive composition layer, and anionized carboxy groups (-COOH) may be used. － The term "carboxy group" includes both anionized and non-anionized carboxy groups.

[0054] In the photosensitive composition layer, the lower limit of the content of compound A (when multiple types are contained, the total content) is preferably 1 mass % or more, more preferably 25 mass % or more, even more preferably 30 mass % or more, and particularly preferably 40 mass % or more, relative to the total mass of the photosensitive composition layer. The upper limit of the content of compound A is preferably 95 mass % or less, more preferably 90 mass % or less, even more preferably 85 mass % or less, particularly preferably 80 mass % or less, and most preferably 70 mass % or less, relative to the total mass of the photosensitive composition layer. Compound A may be used alone or in combination of two or more types.

[0055] <<Carboxy Group-Containing Monomer>> Examples of the carboxy group-containing monomer include polymerizable compounds that do not have a hydroxyl group, contain a carboxy group, and contain one or more (e.g., 1 to 15) ethylenically unsaturated groups. Examples of the ethylenically unsaturated group include a (meth)acryloyl group, a vinyl group, and a styryl group, with a (meth)acryloyl group being preferred. The number of ethylenically unsaturated groups in the carboxy group-containing monomer is preferably 2 or more, more preferably 2 to 15, in terms of superior film-forming properties. The carboxy group-containing monomer may further contain an acid group other than a carboxy group. Examples of acid groups other than a carboxy group include a phenolic hydroxyl group, a phosphoric acid group, and a sulfonic acid group. Known compounds can be used as the carboxy group-containing monomer as appropriate.

[0056] <<Carboxy Group-Containing Polymer>> The carboxy group-containing polymer is a polymer that does not have a hydroxyl group but contains a carboxy group. Typically, the carboxy group-containing polymer is an alkali-soluble resin. The carboxy group-containing polymer may further contain an acid group other than the carboxy group. Examples of the acid group other than the carboxy group include a phenolic hydroxyl group, a phosphate group, and a sulfonic acid group. From the viewpoint of developability, the acid value of the carboxy group-containing polymer is preferably 60 to 300 mgKOH / g, more preferably 60 to 275 mgKOH / g, even more preferably 75 to 250 mgKOH / g, and particularly preferably 100 to 250 mgKOH / g.

[0057] <<Repeating unit having a carboxy group>> The carboxy group-containing polymer preferably has a repeating unit having a carboxy group. The repeating unit having a carboxy group does not have a hydroxyl group. Examples of the repeating unit having a carboxy group include a repeating unit represented by the following general formula (A):

[0058]

[0059] In general formula (A), R Ａ１ represents a hydrogen atom, a halogen atom, or an alkyl group. The alkyl group may be linear or branched. The alkyl group preferably has 1 to 5 carbon atoms, more preferably 1. In general formula (A), A １ represents a single bond or a divalent linking group. Examples of the divalent linking group include -CO-, -O-, -S-, -SO-, and -SO ２ -, -NR Ｎ - (R Ｎ represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), a hydrocarbon group (for example, an alkylene group, a cycloalkylene group, an alkenylene group, an arylene group such as a phenylene group, etc.), and a linking group in which a plurality of these groups are linked together.

[0060] Examples of monomers from which repeating units having a carboxy group are derived include (meth)acrylic acid, crotonic acid, itaconic acid, maleic acid, and fumaric acid. Among these, (meth)acrylic acid is preferred because of its superior patterning properties. That is, the repeating unit having a carboxy group is preferably a repeating unit derived from (meth)acrylic acid.

[0061] The content of repeating units having a carboxy group in the carboxy group-containing polymer (when multiple types are contained, the total content) is preferably 1 to 100 mass %, more preferably 5 to 70 mass %, and even more preferably 12 to 50 mass %, based on all repeating units of the carboxy group-containing polymer. One type of repeating unit having a carboxy group may be used alone, or two or more types may be used.

[0062] <Repeating unit having polymerizable group> In addition to the repeating units described above, the carboxyl group-containing polymer also preferably has a repeating unit having a polymerizable group. Note that the repeating unit having a polymerizable group does not have a hydroxyl group. Examples of the polymerizable group include ethylenically unsaturated groups (e.g., (meth)acryloyl group, vinyl group, styryl group, etc.) and cyclic ether groups (e.g., epoxy group, oxetanyl group, etc.), and the like. Ethylenically unsaturated groups are preferred, and (meth)acryloyl groups are more preferred. Examples of the repeating unit having a polymerizable group include a repeating unit represented by the following general formula (B):

[0063]

[0064] In general formula (B), X Ｂ１ and X Ｂ２ are each independently —O— or —NR Ｎ - represents. Ｎ represents a hydrogen atom or an alkyl group. The alkyl group may be linear or branched, and preferably has 1 to 5 carbon atoms. L represents an alkylene group or an arylene group. The alkylene group may be linear or branched, and preferably has 1 to 5 carbon atoms. The arylene group may be monocyclic or polycyclic, and preferably has 6 to 15 carbon atoms. R Ｂ１ and R Ｂ２ each independently represents a hydrogen atom or an alkyl group. The alkyl group may be linear or branched. The alkyl group preferably has 1 to 5 carbon atoms, and more preferably 1 carbon atom.

[0065] Examples of repeating units having a polymerizable group include repeating units having an allyl group. Specific examples of repeating units having an allyl group include repeating units derived from an allyl group-containing (meth)acrylate. Examples of the allyl group-containing (meth)acrylate include allyl (meth)acrylate, 2-methylallyl acrylate, crotyl acrylate, chloroallyl acrylate, phenylallyl acrylate, and cyanoallyl acrylate, with allyl (meth)acrylate being preferred. The repeating units having an allyl group may be used alone or in combination of two or more. When the carboxy group-containing polymer contains a repeating unit having an allyl group, the carboxy group-containing polymer is preferably configured to include a repeating unit derived from an allyl group-containing (meth)acrylate, a repeating unit derived from (meth)acrylic acid, and, as an optional component, a repeating unit derived from an allyl group-free (meth)acrylate.

[0066] In the carboxy group-containing polymer, the content of repeating units having a polymerizable group (when multiple types are contained, the total content) is preferably 1 to 70 mass %, more preferably 5 to 50 mass %, and even more preferably 12 to 45 mass %, based on all repeating units of the carboxy group-containing polymer. The repeating units having a polymerizable group may be used alone or in combination of two or more types.

[0067] <<Repeating Unit Having an Aromatic Ring>> In addition to the repeating units described above, the carboxyl group-containing polymer also preferably has a repeating unit having an aromatic ring (preferably an aromatic hydrocarbon ring). Examples include a repeating unit based on a (meth)acrylate having an aromatic ring, and a repeating unit based on styrene and a polymerizable styrene derivative. The repeating unit having an aromatic ring does not have a hydroxyl group. Examples of (meth)acrylates having an aromatic ring include benzyl (meth)acrylate, phenethyl (meth)acrylate, and phenoxyethyl (meth)acrylate. Examples of styrene and polymerizable styrene derivatives include methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinylbenzoic acid, styrene dimer, and styrene trimer. As the repeating unit having an aromatic ring, for example, a repeating unit represented by the following general formula (C) is also preferred.

[0068]

[0069] In general formula (C), R Ｃ１ represents a hydrogen atom, a halogen atom, or an alkyl group. The alkyl group may be linear or branched. The alkyl group preferably has 1 to 5 carbon atoms, more preferably 1. Ar Ｃ represents a phenyl group or a naphthyl group. The phenyl group and naphthyl group may have one or more substituents, and examples of the substituents include an alkyl group, an alkoxy group, an aryl group, and a halogen atom. Examples of repeating units having an aromatic ring are shown below.

[0070]

[0071] The content of the repeating unit having an aromatic ring in the carboxyl group-containing polymer (when multiple types are contained, the total content) is preferably 5 to 90 mass %, more preferably 10 to 80 mass %, and even more preferably 30 to 70 mass %, based on all repeating units of the carboxyl group-containing polymer. The repeating unit having an aromatic ring may be used alone or in combination of two or more types.

[0072] <Other Repeating Units> The carboxyl group-containing polymer may have other repeating units in addition to the repeating units described above. The other repeating units do not have a hydroxyl group. An example of the other repeating unit is a repeating unit derived from a (meth)acrylic acid alkyl ester, and the alkyl group may be an alkyl group having a chain structure. The chain structure may be a linear or branched structure. The alkyl group may have 1 to 50 carbon atoms, and more preferably 1 to 10 carbon atoms. A specific example is methyl (meth)acrylate. Another example of the other repeating unit is a repeating unit having an alicyclic structure. The alicyclic structure may be monocyclic or polycyclic. Examples of the alicyclic structure include a dicyclopentanyl ring structure, a dicyclopentenyl ring structure, an isobornyl ring structure, an adamantane ring structure, and a cyclohexyl ring structure. Examples of monomers from which repeating units having an alicyclic structure are derived include dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, and cyclohexyl (meth)acrylate.

[0073] The content of the other repeating units in the carboxyl group-containing polymer (when multiple types are contained, the total content thereof) is preferably 1 to 70 mass% based on the total repeating units of the carboxyl group-containing polymer. The other repeating units may be used alone or in combination of two or more types.

[0074] The weight average molecular weight of the carboxy group-containing polymer is preferably from 5,000 to 200,000, more preferably from 10,000 to 100,000, and even more preferably from 11,000 to 49,000.

[0075] The carboxyl group-containing polymer may be used alone or in combination of two or more. The content of the carboxyl group-containing polymer in compound A (when a plurality of carboxyl group-containing polymers are contained, the total content thereof) is preferably 75 to 100 mass %, more preferably 85 to 100 mass %, still more preferably 90 to 100 mass %, and particularly preferably 95 to 100 mass %, based on the total content of compound A.

[0076] The content of the carboxy group-containing monomer in compound A (when a plurality of types are contained, the total content thereof) is preferably 0 to 25 mass%, more preferably 0 to 10 mass%, and still more preferably 0 to 5 mass%, based on the total content of compound A.

[0077] (Compound (Compound B) that Reduces the Amount of Carboxy Groups) The photosensitive composition layer contains a compound (compound B) that reduces the amount of carboxy groups. The mechanism by which compound B reduces the amount of carboxy groups is not particularly limited, and examples thereof include a mechanism in which compound B has a crosslinkable group that can react with a carboxy group (particularly, a carboxy group derived from compound A) in the photosensitive composition layer, and this crosslinkable group reacts with the carboxy group to reduce the amount of carboxy groups (hereinafter also referred to as "mechanism A"); and a mechanism in which compound B causes a decarboxylation reaction of a carboxy group (particularly, a carboxy group derived from compound A) in the photosensitive composition layer (in other words, a mechanism in which compound B converts a carboxy group (particularly, a carboxy group derived from compound A) in the photosensitive composition layer to CO ２ and a mechanism (hereinafter also referred to as "mechanism B") in which the amount of carboxyl groups is reduced by eliminating (decarboxylating) the carboxyl groups.

[0078] Compound B that reduces the amount of carboxy groups by mechanism A Examples of the crosslinkable group include an isocyanate group. Among these, the crosslinkable group is preferably a thermally crosslinkable group, and more preferably a blocked isocyanate group. The blocked isocyanate group refers to a group having a structure in which an isocyanate group is protected (so-called masked) with a blocking agent. The number of crosslinkable groups in Compound B is not particularly limited, and is, for example, preferably 1 to 10, more preferably 1 to 6, and even more preferably 2 to 6.

[0079] Compound B is preferably a compound having an isocyanate group (isocyanate compound), and more preferably a compound having a blocked isocyanate group (blocked isocyanate compound). The dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably 90 to 180°C, and more preferably 100 to 160°C. The dissociation temperature of the blocked isocyanate means "the temperature of the endothermic peak associated with the deprotection reaction of the blocked isocyanate when measured by DSC (Differential Scanning Calorimetry) analysis using a differential scanning calorimeter." As the differential scanning calorimeter, for example, a differential scanning calorimeter (Model: DSC6200) manufactured by Seiko Instruments Inc. can be suitably used. However, the differential scanning calorimeter is not limited thereto.

[0080] Examples of blocking agents having a dissociation temperature of 100 to 160°C include active methylene compounds [malonic acid diesters (e.g., dimethyl malonate, diethyl malonate, di-n-butyl malonate, and di-2-ethylhexyl malonate)] and oxime compounds (e.g., compounds having a structure represented by -C(=N-OH)- in the molecule, such as formaldoxime, acetaldoxime, acetoxime, methyl ethyl ketoxime, and cyclohexanone oxime). Among these, from the viewpoint of storage stability, at least one blocking agent having a dissociation temperature of 90 to 160°C is preferably at least one selected from the group consisting of oxime compounds and pyrazole compounds.

[0081] The blocked isocyanate compound preferably has an isocyanurate structure from the viewpoints of improving the brittleness of the film and improving the adhesion to the transfer target. Blocked isocyanurate compounds having an isocyanurate structure can be obtained by protecting hexamethylene diisocyanate through isocyanuration. Among these, as blocked isocyanurate compounds having an isocyanurate structure, compounds having an oxime structure in which an oxime compound is used as a blocking agent are preferred because they make it easier to adjust the dissociation temperature to a preferred range and to reduce development residues compared to compounds not having an oxime structure.

[0082] The blocked isocyanate compound may have a polymerizable group. The polymerizable group is not particularly limited, and known polymerizable groups can be used, and a radical polymerizable group is preferred. Examples of the polymerizable group include ethylenically unsaturated groups such as a (meth)acryloyl group, a (meth)acrylamide group, and a styryl group. Among them, a (meth)acryloyl group is preferred, and an acryloyl group is more preferred.

[0083] Commercially available blocked isocyanate compounds can be used, such as Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP (all manufactured by Showa Denko K.K.), and the blocked Duranate series (e.g., Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) SBN-70D, Duranate (registered trademark) WT32-B75P, etc., manufactured by Asahi Kasei Chemicals Corporation).

[0084] Compound B that reduces the amount of carboxy groups by mechanism B includes a compound that reduces the amount of carboxy groups by causing a decarboxylation reaction of the carboxy groups (particularly, the carboxy groups derived from compound A) in the photosensitive composition layer upon exposure, thereby reducing the amount of carboxy groups. Compound B transitions from a ground state to an excited state upon exposure, and in the excited state, accepts electrons from the carboxy groups (particularly, the carboxy groups derived from compound A) in the photosensitive composition layer, converting the carboxy groups to CO ２ It can be released as

[0085] Examples of compound B capable of inducing a decarboxylation reaction of a carboxy group in an excited state include nitrogen-containing aromatic compounds. The nitrogen-containing aromatic compound is a compound having an aromatic ring (nitrogen-containing aromatic ring) having one or more (e.g., 1 to 4) nitrogen atoms as ring members. The nitrogen-containing aromatic ring may be either monocyclic or polycyclic, with polycyclic being preferred. When the nitrogen-containing aromatic ring is an aromatic ring formed by condensing multiple (e.g., 2 to 6) aromatic ring structures, it is sufficient that at least one of the multiple aromatic ring structures contains a nitrogen atom as a ring member. Furthermore, the nitrogen-containing aromatic ring may have a heteroatom other than a nitrogen atom (e.g., an oxygen atom and a sulfur atom) as a ring member. Furthermore, the nitrogen-containing aromatic compound may further have a substituent.

[0086] As the nitrogen-containing aromatic compound, in view of having a higher molar absorption coefficient at a wavelength of 365 nm and having excellent photosensitivity at a wavelength of 365 nm, examples thereof include quinoline compounds (quinoline and quinoline derivatives), isoquinoline compounds (isoquinoline and isoquinoline derivatives), quinoxaline compounds (quinoxaline and quinoxaline derivatives), acridine compounds (acridine and acridine derivatives), phenanthroline compounds (phenanthroline and phenanthroline derivatives), and phenazine compounds (phenazine and phenazine derivatives), among which quinoline compounds, isoquinoline compounds, or quinoxaline compounds are preferred, and quinoline compounds are more preferred.The substituent that the nitrogen-containing aromatic compound may have is not particularly limited, and examples thereof include alkyl groups, aryl groups, halogen atoms, acyl groups, alkoxycarbonyl groups, arylcarbonyl groups, carbamoyl groups, cyano groups, nitro groups, and groups represented by the following formula (PB1):

[0087] Formula (PB1): *-L Ｂ１ - (P Ｂ１ ) ｎＢ１ In the ceremony, L Ｂ１ represents a single bond or a nB1+1-valent linking group. Ｂ１ represents a polymerizable group. nB1 represents an integer of 1 to 3. Ｂ１ If there are multiple P Ｂ１may be the same or different from each other.

[0088] L Ｂ１ The nB1+1 valent linking group represented by the formula (I) is, for example, —CO—, —O—, —S—, —SO—, —SO ２ -, -NR Ｎ - (R Ｎ is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or a linking group formed by combining two or more of these. The aliphatic hydrocarbon group and the aromatic hydrocarbon group may further have a substituent. Examples of the substituent include an alkyl group, an aryl group, a halogen atom, an acyl group, an alkoxycarbonyl group, an arylcarbonyl group, a carbamoyl group, a cyano group, and a nitro group.

[0089] The above L Ｂ１ As for -(L Ｂ２ ) ｎＢ２ -L Ｂ３ It is also preferable that L is a group represented by -. Ｂ２ is an oxygen atom or CH ２ nB2 represents 0 or 1. L Ｂ３ represents a single bond or an nB1+1-valent linking group. Ｂ３ Specific examples of the nB1+1-valent linking group represented by the formula (I) include, for example, a linear, branched, or cyclic nB1+1-valent aliphatic hydrocarbon group which may have a substituent and at least one methylene group may be substituted with an oxygen atom (—O—), and an nB1+1-valent aromatic hydrocarbon group which may have a substituent. The number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 10. Furthermore, a benzene ring group is preferable as the aromatic hydrocarbon group. Note that examples of the substituent which the aliphatic hydrocarbon group and the aromatic hydrocarbon group may have include the substituents described above. Note that when nB2 represents 0, -(L Ｂ２ ) ｎＢ２ The moiety represented by - represents a single bond.

[0090] In formula (PB1), P Ｂ１Examples of the polymerizable group represented by the formula (I) include a radical polymerizable group and a cation polymerizable group, with the radical polymerizable group being preferred. Examples of the radical polymerizable group include a styryl group, a (meth)acryloyl group, and a vinyl group, with the styryl group or a (meth)acryloyl group being preferred.

[0091] In formula (PB1), nB1 is preferably 1 or 2, and more preferably 1.

[0092] Furthermore, L in formula (PB1) Ｂ１ It is also preferable that the nB1+1-valent linking group represented by the formula (I) is a divalent linking group. Ｂ１ An example of a divalent linking group represented by the formula: ２ is -CO-, -O-, -S-, -SO-, -SO ２ -, -NR Ｎ - (R Ｎ is an alkylene group (preferably having 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms, and even more preferably 1 to 12 carbon atoms) which may be substituted with a hydrogen atom or an alkyl group having 1 to 5 carbon atoms), and an arylene group. The alkylene group and the arylene group may further have a substituent, and examples of the substituent include the above-mentioned substituents. Ｂ１ Another example of the divalent linking group represented by the formula: Ｂ４ ) ｎＢ４ - (L Ｂ５ ) ｎＢ５ Also included are divalent linking groups represented by the formula -. Ｂ４ is an oxygen atom or CH ２ nB4 represents 0 or 1. L Ｂ５ represents a linear, branched, or cyclic alkylene group having 1 to 10 carbon atoms, which may have a substituent, and in which a methylene group may be substituted with an oxygen atom (—O—), or an arylene group (preferably a phenylene group) which may have a substituent. nB5 represents an integer of 0 to 3, provided that the total number of nB4 and nB5 is 1 or more. Note that, L Ｂ５ If there are multiple L Ｂ５ may be the same or different. When nB4 represents 0, -(L Ｂ４ )ｎＢ４ The portion represented by - represents a single bond. When nB5 represents 0, -(L Ｂ５ ) ｎＢ５ The moiety represented by - represents a single bond. Examples of the substituent that the alkylene group and arylene group may have include the substituents described above. Ｂ５ As the linear, branched or cyclic alkylene group having 1 to 10 carbon atoms, which may have a substituent and in which the methylene group may be substituted with an oxygen atom, represented by the following formula (I), a linear alkylene group having 1 to 10 carbon atoms, which may have a substituent and in which the methylene group may be substituted with an oxygen atom, is particularly preferred. Ｂ５ ) ｎＢ５ The number of atoms excluding hydrogen atoms in the moiety represented by - is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 12.

[0093] The nitrogen-containing aromatic compound preferably has a polymerizable group, and more preferably has a radically polymerizable group, in that volatilization during the manufacturing process of the optical waveguide is suppressed, thereby providing better effects of the present invention.

[0094] A suitable example of the nitrogen-containing aromatic compound having a radical polymerizable group is a compound represented by the following formula (B1).

[0095]

[0096] In the ceremony, L １ is an oxygen atom or CH ２ n1 represents 0 or 1. ２ represents a single bond, or a linear, branched, or cyclic (n2+1)-valent aliphatic hydrocarbon group having 1 to 10 carbon atoms, which may have a substituent and at least one methylene group may be substituted with an oxygen atom, or an (n2+1)-valent aromatic hydrocarbon group, which may have a substituent. n2 represents an integer from 1 to 3. P represents a styryl group, an acryloyl group, or a methacryloyl group. When there are multiple Ps, the multiple Ps may be the same or different from one another. When n1 represents 0, -(L １ The moiety represented by n1- represents a single bond.

[0097] L ２ Among these, a linear (n2+1) alkylene group having 1 to 10 carbon atoms, which may have a substituent and in which at least one methylene group may be substituted with an oxygen atom, is preferred. n2 is preferably 1 or 2, and more preferably 1.

[0098] Specific examples of the compound represented by formula (B1) include compounds represented by formulas (B1-1) to (B1-3) described below. The compound represented by formula (B1) can be synthesized by a conventional method.

[0099] Specific examples of the nitrogen-containing compound include quinoline, 2-methylquinoline, 3-methylquinoline, 4-methylquinoline, 6-methylquinoline, 7-methylquinoline, 8-methylquinoline, 4-methoxyquinoline, 6-methoxyquinoline, 8-methoxyquinoline, 2,4-dimethylquinoline, 2,6-dimethylquinoline, 4-methyl-6-methoxyquinoline, 4-methyl-6,8-dimethoxyquinoline, 4-chloroquinoline, and 4-phenylquinoline. quinoline compounds such as quinoxaline, 2-methylquinoxaline, 2,3-dimethylquinoxaline, and 5-methylquinoxaline; isoquinoline compounds such as isoquinoline and 1-methylisoquinoline; acridine compounds such as acridine and 9-methylacridine; and phenazine compounds such as phenazine.

[0100]

[0101] Examples of compound B include acridinium salts, (iso)quinolinium salts, and iridium complexes. (Iso)quinolinium salts refer to quinolinium salts and isoquinolinium salts. Compound B may exhibit the function of compound B through the action of two compounds. Examples of such two compounds include a combination of an aromatic compound (b1) that is unsubstituted or substituted with an electron-donating group (preferably an alkyl group or an alkoxy group) and an aromatic compound (b2) that is substituted with an electron-withdrawing group (preferably a cyano group or an alkoxycarbonyl group). In this combination, electrons are transferred from the photoexcited aromatic compound (b1) to the aromatic compound (b2), and the resulting cation radical of the aromatic compound (b1) accepts electrons from the carboxy group, thereby exhibiting the function of compound B.

[0102] Compound B may be used alone or in combination of two or more. In order to obtain a more excellent pattern-forming ability, the content of compound B (the total content when multiple types are contained) is preferably 0.1 mass % or more, more preferably 1 mass % or more, relative to the total mass of the photosensitive composition layer. The upper limit is preferably 50 mass % or less, more preferably 30 mass % or less, even more preferably 20 mass % or less, and particularly preferably 15 mass % or less, relative to the total mass of the photosensitive composition layer.

[0103] (Polymerizable Compound) The photosensitive composition layer preferably contains a polymerizable compound, which is a component different from the above-mentioned compound A and compound B.

[0104] The polymerizable compound is preferably a compound having a molecular weight (weight average molecular weight when the compound has a molecular weight distribution) of less than 5,000, and is also preferably a polymerizable monomer.

[0105] The polymerizable compound is a polymerizable compound having one or more (e.g., 1 to 15) polymerizable groups per molecule. Examples of the polymerizable group include ethylenically unsaturated groups, such as (meth)acryloyl groups, vinyl groups, and styryl groups, with (meth)acryloyl groups being preferred. The polymerizable compound preferably contains a bifunctional or higher functional polymerizable compound. Here, a bifunctional or higher functional polymerizable compound refers to a polymerizable compound having two or more (e.g., 2 to 15) polymerizable groups per molecule. The photosensitive composition layer preferably contains a bifunctional polymerizable compound and a trifunctional or higher functional polymerizable compound.

[0106] A preferred embodiment of the bifunctional polymerizable compound is a compound represented by formula (M) (hereinafter also referred to as "compound M"). ２ -R １ -Q １ Formula (M) In formula (M), Q １ and Q ２ R each independently represents a (meth)acryloyloxy group. １ represents a divalent linking group having a chain structure.

[0107] Q １ and Q ２ may be the same or different, but from the viewpoint of ease of synthesis, １ and Q ２ are preferably the same group. １ Examples of the alkylene oxides include divalent hydrocarbon groups and alkylene oxides of divalent hydrocarbon groups (-L １ and alkylene oxides (-L-O-) of divalent hydrocarbon groups having 6 to 20 carbon atoms. １ The divalent hydrocarbon group may have a chain structure at least in part, and the portion other than the chain structure may be, for example, a branched, cyclic, or linear alkylene group having 1 to 20 carbon atoms, an arylene group, an ether bond, or a combination thereof, and an alkylene group or a group combining two or more alkylene groups and one or more arylene groups is preferred. Examples of alkylene oxide adducts of divalent hydrocarbon groups include alkyleneoxyalkylene groups (-L１ -O-L １ -), polyalkyleneoxyalkylene group (-(L １ -O) ｐ -L １ -), and alkylene oxide adducts of divalent hydrocarbon groups other than polyalkyleneoxyalkylene groups. １ each independently represents an alkylene group, preferably an ethylene group, a propylene group, or a butylene group, and more preferably an ethylene group or a 1,2-propylene group. p represents an integer of 2 or more, preferably an integer of 10 to 30.

[0108] In addition, Q in compound M １ and Q ２ The number of atoms in the shortest linking chain connecting "Q" and "Q" is preferably 20 to 150, more preferably 30 to 120, and even more preferably 40 to 90. １ and Q ２ The number of atoms in the shortest chain connecting Q １ R connected to １ Q from atoms in ２ R connected to １ is the shortest number of atoms that connects to the atom in

[0109] Examples of compound M include 1,6-hexanediol di(meth)acrylate, 1,7-heptanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,4-cyclohexanediol di(meth)acrylate, di(meth)acrylate of bisphenol A or hydrogenated bisphenol A and its ethylene oxide / propylene oxide adduct, di(meth)acrylate of bisphenol F or hydrogenated bisphenol F and its ethylene oxide / propylene oxide adduct, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, poly(ethylene glycol / propylene glycol) di(meth)acrylate, and polybutylene glycol di(meth)acrylate. Other examples include tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol di(meth)acrylate, fluorene structure-containing (meth)acrylate, and epoxy (meth)acrylate. The above ester monomers can also be used as a mixture.

[0110] More specific examples of the bifunctional polymerizable compound include tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), and fluorene structure-containing (meth)acrylates (OGSOL EA-F5710, OGSOL EA-0300, and OGSOL GA-2800, all manufactured by Osaka Gas Chemicals).

[0111] The tri- or higher functional polymerizable compound is not particularly limited and can be appropriately selected from known compounds. Examples of the tri- or higher functional polymerizable compound include dipentaerythritol (tri / tetra / penta / hexa)(meth)acrylate, pentaerythritol (tri / tetra)(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and (meth)acrylate compounds having a glycerin tri(meth)acrylate skeleton.

[0112] Here, "(tri / tetra / penta / hexa)(meth)acrylate" is a concept that encompasses tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, and "(tri / tetra)(meth)acrylate" is a concept that encompasses tri(meth)acrylate and tetra(meth)acrylate.

[0113] The polymerizable compound also includes urethane (meth)acrylate. The lower limit of the number of functional groups is more preferably 6 or more, and even more preferably 8 or more. The upper limit of the number of functional groups is, for example, 20 or less. The urethane (meth)acrylate includes urethane di(meth)acrylate, such as propylene oxide-modified urethane di(meth)acrylate and ethylene oxide and propylene oxide-modified urethane di(meth)acrylate. The urethane (meth)acrylate also includes trifunctional or higher urethane (meth)acrylate. Examples of tri- or higher functional urethane (meth)acrylates include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.); UA-32P, U-15HA, and UA-1100H (all manufactured by Shin-Nakamura Chemical Co., Ltd.); AH-600 (trade name) manufactured by Kyoeisha Chemical Co., Ltd.; and UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000 (all manufactured by Nippon Kayaku Co., Ltd.).

[0114] Another preferred embodiment of the polymerizable compound is an ethylenically unsaturated compound having an acid group. Examples of the acid group include a phosphate group, a sulfo group, and a carboxy group, with the carboxy group being preferred. Examples of the ethylenically unsaturated compound having an acid group include a tri- or tetrafunctional ethylenically unsaturated compound having an acid group [a compound having a carboxy group introduced into a pentaerythritol tri- or tetraacrylate (PETA) skeleton (acid value: 80 to 120 mg KOH / g)] and a penta- or hexafunctional ethylenically unsaturated compound having an acid group [a compound having a carboxy group introduced into a dipentaerythritol penta- or hexaacrylate (DPHA) skeleton (acid value: 25 to 70 mg KOH / g)]. These tri- or higher functional ethylenically unsaturated compounds having an acid group may be used in combination with a difunctional ethylenically unsaturated compound having an acid group, if necessary. Examples of the difunctional or higher functional ethylenically unsaturated compound having a carboxy group include ARONIX (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), ARONIX (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and ARONIX (registered trademark) M-510 (manufactured by Toagosei Co., Ltd.).

[0115] As the ethylenically unsaturated compound having an acid group, the polymerizable compound having an acid group described in paragraphs

[0025] to

[0030] of JP-A No. 2004-239942 is preferred, the contents of which are incorporated herein by reference.

[0116] The weight average molecular weight (Mw) of the polymerizable compound is preferably from 200 to 3,000, more preferably from 250 to 2,600, and even more preferably from 280 to 2,200.

[0117] When the photosensitive composition layer contains a polymerizable compound, the content of the polymerizable compounds (when multiple types are contained, the total content of the polymerizable compounds) is preferably 3 to 70 mass %, more preferably 10 to 70 mass %, and particularly preferably 20 to 55 mass %, relative to the total mass of the photosensitive composition layer. When the photosensitive composition layer contains a polymerizable compound and a carboxy group-containing polymer, the mass ratio of the polymerizable compound to the carboxy group-containing polymer (mass of polymerizable compound / mass of carboxy group-containing polymer) is preferably 0.2 to 2.0, more preferably 0.6 to 1.5. The polymerizable compounds may be used alone or in combination of two or more types.

[0118] (Polymerization initiator) The photosensitive composition layer preferably contains a polymerization initiator (preferably a photopolymerization initiator). The photopolymerization initiator may be a photoradical polymerization initiator, a photocationic polymerization initiator, or a photoanionic polymerization initiator, and is preferably a photoradical polymerization initiator.

[0119] The photopolymerization initiator is not particularly limited, and known photopolymerization initiators can be used. The photopolymerization initiator is preferably one or more selected from the group consisting of oxime ester compounds (photopolymerization initiators having an oxime ester structure) and aminoacetophenone compounds (photopolymerization initiators having an aminoacetophenone structure), and more preferably contains both of these compounds. When both compounds are contained, the content of the oxime ester compound relative to the total content of both compounds is preferably 5 to 90 mass%, more preferably 15 to 50 mass%. Furthermore, other photopolymerization initiators may be used in combination, such as hydroxyacetophenone compounds, acylphosphine oxide compounds, and bistriphenylimidazole compounds.

[0120] Furthermore, as the photopolymerization initiator, for example, the polymerization initiators described in paragraphs 0031 to 0042 of JP-A No. 2011-095716 and paragraphs 0064 to 0081 of JP-A No. 2015-014783 may be used.

[0121] Specific examples of the photopolymerization initiator include the following: Examples of oxime ester compounds include 1,2-octanedione, 1-[4-(phenylthio)phenyl-, 2-(O-benzoyloxime)] (trade name: IRGACURE OXE-01, the IRGACURE series is a product of BASF), ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) (trade name: IRGACURE OXE-02, manufactured by BASF), [8-[5-(2,4,6-trimethylphenyl)-11-(2-ethylhexyl)-11H-benzo[a]carbazol-3-yl][2-(2,2,3,3-tetrafluoropropoxy)phenyl]methanone-(O-acetyloxime) (trade name: IRGACURE OXE-03, manufactured by BASF), and methyl ... OXE-03, manufactured by BASF), 1-[4-[4-(2-benzofuranylcarbonyl)phenyl]thio]phenyl]-4-methylpentanone-1-(O-acetyloxime) (trade name: IRGACURE OXE-04, manufactured by BASF, and trade name: Lunar 6, manufactured by DKSH Japan Co., Ltd.), 1-[4-(phenylthio)phenyl]-3-cyclopentylpropane-1,2-dione-2-(O-benzoyloxime) (trade name: TR-PBG-305, manufactured by Changzhou New Power Electronic Materials Co., Ltd.), 1,2-propanedione,3-cyclohexyl-1-[9-ethyl-6-(2-furanylcarbonyl)-9H-carbazol-3-yl]-,2-(O-acetyloxime) (trade name: TR-PBG-326, manufactured by Changzhou New Power Electronic Materials Co., Ltd.), and 3-cyclohexyl-1-(6-(2-(benzoyloxyimino)hexanoyl)-9-ethyl-9H-carbazol-3-yl)-propane-1,2-dione-2-(O-benzoyloxime) (trade name: TR-PBG-391, manufactured by Changzhou New Power Electronic Materials Co., Ltd.).Examples of aminoacetophenone compounds include 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (trade name: Omnirad 379EG, the Omnirad series is a product of IGM Resins B.V.), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (trade name: Omnirad 907), and APi-307 (1-(biphenyl-4-yl)-2-methyl-2-morpholinopropan-1-one, manufactured by Shenzhen UV-ChemTech Ltd.). Other photopolymerization initiators include, for example, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one (trade name: Omnirad 127), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (trade name: Omnirad 369), 2-hydroxy-2-methyl-1-phenyl-propan-1-one (trade name: Omnirad 1173), 1-hydroxy-cyclohexyl-phenyl-ketone (trade name: Omnirad 184), 2,2-dimethoxy-1,2-diphenylethan-1-one (trade name: Omnirad 651), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO), H), and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (trade name: Omnirad 819).

[0122] When the photosensitive composition layer contains a polymerization initiator (preferably a photopolymerization initiator) (when multiple types are contained, the total content thereof), the content is preferably 0.1 to 15 mass %, more preferably 0.5 to 10 mass %, and even more preferably 0.5 to 3 mass %, relative to the total mass of the photosensitive composition layer. If the photosensitive composition layer contains a large amount of polymerization initiator and the polymerization initiator is prone to volatilization or decomposition at high temperatures, the high-temperature process resistance may be reduced, and the optical properties, such as the refractive index, of the formed pattern may vary. For this reason, the photosensitive composition layer preferably contains a photopolymerization initiator that is highly sensitive and can be cured at a small content. The polymerization initiator may be used alone or in combination of two or more types.

[0123] (Surfactant) The photosensitive composition layer may contain a surfactant. Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic (nonionic) surfactants, and amphoteric surfactants, and nonionic surfactants are preferred. Examples of the nonionic surfactant include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone surfactants, and fluorine surfactants.

[0124] As the surfactant, for example, surfactants described in paragraphs 0120 to 0125 of WO 2018 / 179640 can be used. In addition, as the surfactant, surfactants described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of JP 2009-237362 A can also be used. Commercially available fluorine-based surfactants include, for example, Megafac F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F-144, F-437, F-475, F-477, F-479 , F-482, F-551-A, F-552, F-554, F-555-A, F-556, F-557, F-558, F-559, F-560, F-561, F-565, F -563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (all manufactured by DIC Corporation), Fluorad FC430, FC431, FC171 (all manufactured by Sumitomo 3M Limited), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.), PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Ftergent Examples of suitable surfactants include 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, and 683 (all manufactured by NEOS Corporation). Furthermore, acrylic compounds having a molecular structure with a functional group containing a fluorine atom, in which the fluorine atom-containing functional group is cleaved upon application of heat, causing the fluorine atom to volatilize, can also be suitably used as fluorosurfactants. Examples of such fluorosurfactants include the Megafac DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), The Nikkei Business Daily (February 23, 2016)), such as Megafac DS-21.Furthermore, as the fluorosurfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound. Furthermore, a block polymer can also be used as the fluorosurfactant. Furthermore, as the fluorosurfactant, a fluorine-containing polymer compound containing a repeating unit derived from a (meth)acrylate compound having a fluorine atom and a repeating unit derived from a (meth)acrylate compound having two or more (preferably five or more) alkyleneoxy groups (preferably ethyleneoxy groups or propyleneoxy groups) can also be preferably used. Furthermore, as the fluorosurfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain can also be used. Examples of such a fluorosurfactant include Megafac RS-101, RS-102, RS-718K, and RS-72-K (all manufactured by DIC Corporation).

[0125] From the viewpoint of improving environmental friendliness, the fluorine-based surfactant is preferably a surfactant derived from an alternative material to compounds having a linear perfluoroalkyl group having 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS). Examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and their ethoxylates and propoxylates (e.g., glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid esters, Pluronic (registered trademark) L10, L31, L61, L62, 10R5, 17R2, 25R2 (all manufactured by BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (all manufactured by BASF), and Solsperse 20000 (all manufactured by Lubrizol Nippon Corp.), NCW-101, NCW-1001, NCW-1002 (all manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), Paionin D-6112, D-6112-W, D-6315 (all manufactured by Takemoto Yushi Co., Ltd.), Olfine E1010, Surfynol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.), and the like.

[0126] Examples of silicone surfactants include linear polymers consisting of siloxane bonds and modified siloxane polymers in which organic groups have been introduced into the side chains or terminals.

[0127] Specific examples of surfactants include DOWSIL 8032 ADDITIVE, Toray Silicone DC3PA, Toray Silicone SH7PA, Toray Silicone DC11PA, Toray Silicone SH21PA, Toray Silicone SH28PA, Toray Silicone SH29PA, Toray Silicone SH30PA, and Toray Silicone SH8400 (all manufactured by Dow Corning Toray Co., Ltd.), as well as X-22-4952, X-22-4272, X-22-6266, KF-351A, K354L, KF-355A, and KF- 945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicones Co., Ltd.), F-4440, TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (all manufactured by BYK-Chemie).

[0128] Other examples of non-fluorine-based surfactants include the MEGAFACE EFS series (EFS-131, EFS-321, EFS-521, and EFS-801) manufactured by DIC Corporation, and Marproof AP manufactured by NOF Corporation.

[0129] The surfactant is also preferably polymer (X) shown below. Polymer (X) is a polymer containing a structural unit α selected from the group consisting of general formula (A-1), general formula (A-2), and (meth)acrylate structural units having a fluorinated alkyl group (preferably a fluorinated alkyl group having 1 to 18 carbon atoms) on the side chain, and a structural unit β that contains neither a silicon atom nor a fluorine atom.

[0130]

[0131] In formula (A-1), R １ represents a hydrogen atom or a methyl group. ２ represents an alkylene group having 1 to 10 carbon atoms. ３ represents an alkyl group having 1 to 4 carbon atoms. 1 represents an integer of 5 to 100.

[0132] In formula (A-2), R ４represents a hydrogen atom or a methyl group. ５ represents an alkylene group having 1 to 10 carbon atoms. L represents a trimethylsilyl group or a tris(trimethylsiloxy)silyl group.

[0133] The structural unit β is preferably a structural unit having an aromatic ring (for example, a monocyclic or polycyclic aromatic hydrocarbon), and examples thereof include repeating units represented by the following formulas (B-1) to (B-4).

[0134]

[0135] In formula (B-1), R Ｂ１１ represents a hydrogen atom or a methyl group. Ｂ１１ represents a single bond or —COO—. Ｂ１２ represents a single bond or a divalent linking group. Ｂ１２ represents a monovalent aromatic ring group which may have a substituent.

[0136] L Ｂ１２ Examples of the divalent linking group represented by the formula (I) include -O-, -S-, -CO-, -NR Ｔ -, alkylene groups, and divalent linking groups selected from the group consisting of combinations thereof. The alkylene group is preferably chain-shaped (straight-chain or branched-chain). The number of carbon atoms in the alkylene group is preferably 1 to 30, more preferably 1 to 20, even more preferably 1 to 10, and particularly preferably 1 to 6. L Ｂ１２ The number of atoms excluding hydrogen atoms in the divalent linking group represented by the formula (I) is preferably 1 to 30, more preferably 1 to 20, and even more preferably 1 to 10. Ｔ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, preferably a hydrogen atom. Ｂ１２ Examples of the divalent linking group represented by the formula (I) include -AL1-, -(AL2-O)p-, and -(AL2-O)n-CO-. AL1 and AL2 represent an alkylene group. p represents an integer of 1 to 10 (preferably 1 to 6). The number of carbon atoms in the alkylene group represented by AL2 is preferably 2 to 6, more preferably 2 to 4. AL1 and AL2 may have a substituent such as a hydroxyl group. When there are multiple p's and multiple n's, the multiple AL2's may be the same or different. RＢ１２ The monovalent aromatic ring group represented by the formula (I) is preferably a monovalent aromatic hydrocarbon ring group, more preferably a phenyl group or a naphthyl group. The monovalent aromatic ring group may further have a substituent. The substituent is not particularly limited, and examples thereof include a hydroxyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, and a monovalent aromatic ring group (for example, a monovalent aromatic hydrocarbon ring group such as a phenyl group). In addition, examples of the substituent that the monovalent aromatic ring group may have include a monovalent group represented by the following formula (M1):

[0137] Formula (M1): *-L Ｍ１ - (A Ｍ１ -L Ｍ２ ) ｑ -R Ｍ１ In the ceremony, L Ｍ１ and L Ｍ２ represents a single bond, —O—, —S—, —CO—, or —NR Ｔ and divalent linking groups selected from the group consisting of - and combinations thereof, such as -O-, -CO-, and -COO-. Ｔ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and preferably a hydrogen atom. Ｍ１ represents a divalent aromatic ring group which may have a substituent or a divalent alicyclic group which may have a substituent. As the divalent aromatic ring group, a divalent aromatic hydrocarbon ring group is preferred, and a phenylene group or a naphthylene group is more preferred. As the divalent alicyclic group, a divalent aliphatic hydrocarbon ring group is preferred, and a divalent cyclohexane ring group is more preferred. In addition, the substituent that the divalent aromatic ring group and the divalent alicyclic group may have is not particularly limited, and examples thereof include a hydroxyl group, an alkyl group (linear, branched, and cyclic), an alkoxy group, an alkoxycarbonyl group, and a monovalent aromatic ring group (for example, a monovalent aromatic hydrocarbon ring group such as a phenyl group). q represents an integer of 1 to 6, and preferably 1 to 3. R Ｍ１ represents a hydrogen atom or a substituent. Ｍ１The substituent represented by R is not particularly limited, but examples thereof include a hydroxyl group, an alkyl group (linear, branched, and cyclic), an alkoxy group, an alkoxycarbonyl group, a cyano group, a primary to tertiary amino group, and an acylamino group. Ｍ１ The number of carbon atoms in the alkyl group, alkoxy group, and alkoxycarbonyl group represented by the formula (I) is, for example, preferably 1 to 10, and more preferably 1 to 6. Examples of the primary, secondary, and tertiary amino groups include -NH ２ , -NHR Ｙ , and -NR Ｙ ２ etc. Ｙ represents an alkyl group. The acylamino group is —NHCOR Ｙ and -NR Ｙ COR Ｙ etc. Ｙ represents an alkyl group. Ｙ The alkyl group mentioned above is preferably a straight-chain or branched-chain alkyl group, and the number of carbon atoms therein is preferably 1 to 10, and more preferably 1 to 6.

[0138] R in formula (B-1) Ｂ１２ and R in formula (M1). Ｍ１ Examples of the substituent represented by the formula (I) include an unsubstituted or substituted amino group, a substituted or unsubstituted acylamino group, a nitro group, a cyano group, a halogen-substituted saturated or unsaturated hydrocarbon group (e.g., a halogen-substituted alkyl group, a halogen-substituted alkenyl group, a halogen-substituted aromatic hydrocarbon ring group), a nitrogen-containing heterocyclic group, an oxygen-containing heterocyclic group, and a sulfur-containing heterocyclic group. Examples of the unsubstituted or substituted amino group include -NH ２ , -NHR Ｙ , and -NR Ｙ ２ etc. Ｙ represents an alkyl group. The substituted or unsubstituted acylamino group includes —NHCOR Ｙ and -NR Ｙ COR Ｙ etc. Ｙ represents an alkyl group. ＹThe alkyl group mentioned above is preferably a straight-chain or branched-chain alkyl group, and the number of carbon atoms therein is preferably 1 to 10, and more preferably 1 to 6.

[0139]

[0140] In formula (B-2), R Ｂ２１ represents a hydrogen atom or a methyl group. Ｂ２１ represents a single bond or —COO—. Ｂ２２ represents a single bond or a divalent linking group. Ｂ２２ represents a hydrogen atom or a substituent other than an aromatic group.

[0141] L Ｂ２２ Examples of the divalent linking group represented by the formula (I) include -O-, -S-, -CO-, -NR Ｔ Examples of the alkylene group include a divalent linking group selected from the group consisting of -, an alkylene group, and a combination thereof. The alkylene group is preferably a chain (straight chain or branched chain). The number of carbon atoms in the alkylene group is preferably 1 to 100, more preferably 1 to 50, and even more preferably 1 to 30. L Ｂ２２ The number of atoms excluding hydrogen atoms of the divalent linking group represented by the formula (I) is preferably 1 to 100, more preferably 1 to 50, and even more preferably 1 to 30. Ｔ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, preferably a hydrogen atom. Ｂ２２ Examples of the divalent linking group represented by the formula include -AL1- and -(AL2-O)q-. AL1 and AL2 represent an alkylene group. q represents an integer of 1 to 60 (preferably 1 to 20). The alkylene group represented by AL2 preferably has 2 to 6 carbon atoms, more preferably 2 to 4 carbon atoms. AL1 and AL2 may have a substituent such as a hydroxyl group. When there are multiple q's, the multiple AL2's may be the same or different. R Ｂ２２ The substituent other than the aromatic group represented by the formula (I) is not particularly limited, and examples thereof include a hydroxyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, and an unsubstituted or substituted amino group (—NH ２ , -NHR Ｙ , and -NR Ｙ ２ ) etc.Ｙ represents an alkyl group. Ｙ and the number of carbon atoms in the alkyl group (preferably linear or branched) in the alkoxy group and the alkoxycarbonyl group is, for example, preferably 1 to 10, more preferably 1 to 6. Ｙ The alkyl group represented by the formula (I), the alkoxy group, and the alkoxycarbonyl group may have a substituent such as a hydroxyl group.

[0142]

[0143] In formula (B-3), R Ｂ３１ and R Ｂ３４ Each of L independently represents a hydrogen atom or a methyl group. Ｂ３１ and L Ｂ３３ each independently represents a single bond or a divalent linking group. Ｂ３２ is a single bond or -C(R ｗ ) ２ - represents. ｗ Each of Ar independently represents a hydrogen atom or a monovalent organic group. Ｂ３１ and Ar Ｂ３２ each independently represents a divalent aromatic ring group which may have a substituent.

[0144] L Ｂ３１ and L Ｂ３３ The divalent linking group represented by the formula (I) is not particularly limited, but examples thereof include -O-, -S-, -CO-, -NR Ｔ Examples of the alkylene group include a divalent linking group selected from the group consisting of -, an alkylene group, and a combination thereof. The alkylene group is preferably a chain (straight chain or branched chain). The number of carbon atoms in the alkylene group is preferably 1 to 100, more preferably 1 to 50, and even more preferably 1 to 30. L Ｂ３１ and L Ｂ３３ The number of atoms excluding hydrogen atoms of the divalent linking group represented by the formula (I) is preferably 1 to 100, more preferably 1 to 50, and even more preferably 1 to 30. Ｔ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, preferably a hydrogen atom. Ｂ３１ and L Ｂ３３Examples of the divalent linking group represented by the formula (I) include -CO-O- and -CO-O-(AL-O)r-. AL represents an alkylene group. r represents an integer of 1 to 60 (preferably 3 to 20). The number of carbon atoms in the alkylene group represented by AL is preferably 2 to 6, and more preferably 2 to 4. AL may have a substituent such as a hydroxyl group. Furthermore, when there are multiple r's, the multiple AL's may be the same or different.

[0145] R ｗ Examples of the monovalent organic group represented by the formula (I) include an alkyl group or a monovalent aromatic ring group. The alkyl group is preferably chain-like (straight-chain or branched-chain). The alkyl group preferably has 1 to 6 carbon atoms, more preferably 1 to 3 carbon atoms. The monovalent aromatic ring group is preferably a monovalent aromatic hydrocarbon ring group, and preferably a phenyl group. The monovalent aromatic ring group may further have a substituent. The substituent is not particularly limited, and examples include a hydroxyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, and a monovalent aromatic ring group (for example, a monovalent aromatic hydrocarbon ring group such as a phenyl group).

[0146] Ar Ｂ１１ and Ar Ｂ１２ The divalent aromatic ring group represented by the formula (I) is preferably a divalent aromatic hydrocarbon ring group (preferably having 6 to 10 carbon atoms), and more preferably a phenylene group. The divalent aromatic ring group may further have a substituent. The substituent is not particularly limited, and examples thereof include a hydroxyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, and a monovalent aromatic ring group (for example, a monovalent aromatic hydrocarbon ring group such as a phenyl group).

[0147]

[0148] In formula (B-4), R Ｂ４１ and R Ｂ４２ Each of L independently represents a hydrogen atom or a methyl group. Ｂ４１ ~L Ｂ４３ each independently represents a single bond or a divalent linking group. Ｂ４１ represents a divalent aromatic ring group which may have a substituent. p represents an integer of 1 or more. When p represents an integer of 2 or more, a plurality of ArＢ４１ L Ｂ４２ They may be the same or different from each other.

[0149] L Ｂ４１ ~L Ｂ４３ The divalent linking group represented by is not particularly limited, and examples thereof include Ｂ３１ and L Ｂ３３ Examples of the divalent linking group include those similar to those represented by the following formula: Ｂ４２ Among these, the divalent linking group represented by the formula (I) is preferably —O—, —S—, —CO—, —CO—O—, —O—CO—O—, —CO—NR Ｔ - or -OCH ２ - and the like are preferred.

[0150] Ar Ｂ４１ The divalent aromatic ring group represented by the formula (I) is preferably a divalent aromatic hydrocarbon ring group (preferably having 6 to 10 carbon atoms), and more preferably a phenylene group. The divalent aromatic ring group may further have a substituent. The substituent is not particularly limited, and examples thereof include a hydroxyl group, an alkyl group, an alkoxy group, an alkoxycarbonyl group, and a monovalent aromatic ring group (for example, a monovalent aromatic hydrocarbon ring group such as a phenyl group).

[0151] In the polymer (X), the content of the structural unit α is preferably 20 to 90% by mass, more preferably 30 to 90% by mass, and even more preferably 40 to 80% by mass, based on all repeating units of the polymer (X). The polymer (X) may contain only one type of structural unit α, or two or more types. The content of the structural unit β in the polymer (X) is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and even more preferably 20 to 60% by mass, based on all repeating units of the polymer (X). The polymer (X) may contain only one type of structural unit β, or two or more types. When two or more types of second repeating units are contained, the above content is preferably the total content of the second repeating units.

[0152] The weight average molecular weight (Mw) of the polymer (X) is preferably 500 or more, more preferably 1,000 or more, even more preferably 10,000 or more, particularly preferably 15,000 or more, and most preferably 18,000 or more. The upper limit is preferably 100,000 or less, more preferably 80,000 or less. The polymer (X) preferably does not have a carboxy group.

[0153] The content of the surfactant (the total content when multiple surfactants are contained) is preferably 0.0001 to 10% by mass, more preferably 0.001 to 5% by mass, and even more preferably 0.005 to 3% by mass, based on the total mass of the photosensitive composition layer. The surfactants may be used alone or in combination of two or more.

[0154] (Other Additives) The photosensitive composition layer may contain other additives as needed. Examples of other additives include polymerization inhibitors, chain transfer agents, antioxidants, plasticizers, sensitizers, heterocyclic compounds, and alkoxysilane compounds. Examples of polymerization inhibitors, plasticizers, sensitizers, heterocyclic compounds, and alkoxysilane compounds include those described in paragraphs 0097 to 0119 of WO 2018 / 179640. Reference can also be made to the additives contained in the photosensitive composition layer described in JP 2024-052274 A, JP 2022-185008 A, JP 2024-034089 A, and WO 2023 / 119998 A. Examples of polymerization inhibitors include phenothiazine-based compounds. On the other hand, phenothiazine-based compounds may decompose at high temperatures and develop color. Therefore, when the photosensitive composition layer contains a phenothiazine-based compound, the optical loss of the formed pattern may decrease depending on the temperature history during storage and pattern formation. Therefore, an embodiment in which the photosensitive composition layer is substantially free of a phenothiazine-based compound is also preferred. Here, "substantially free of a phenothiazine-based compound" means that the content of the phenothiazine-based compound is less than 0.3% by mass, preferably less than 0.1% by mass, and more preferably less than 0.01% by mass, relative to the total mass of the photosensitive composition layer.

[0155] The photosensitive composition layer may further contain other known additives such as rust inhibitors, metal oxide particles, dispersants, acid multipliers, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, thickeners, and organic or inorganic suspending agents. Preferred embodiments of these components are described in paragraphs

[0165] to

[0184] of JP2014-085643A, the contents of which are incorporated herein by reference.

[0156] The photosensitive composition layer may contain impurities. Examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and ions thereof. Among these, halide ions, sodium ions, and potassium ions are easily mixed in as impurities, so it is particularly preferable to set the contents to the following ranges.

[0157] The content of impurities in the photosensitive composition layer is preferably 80 ppm by mass or less, more preferably 10 ppm by mass or less, and even more preferably 2 ppm by mass or less, relative to the total mass of the photosensitive composition layer. The content of impurities in the photosensitive composition layer may be 1 ppb by mass or more, or 0.1 ppm by mass or more, relative to the total mass of the photosensitive composition layer.

[0158] Methods for keeping the impurity content within the above range include, for example, selecting raw materials for the photosensitive material that contain a small amount of impurities, preventing impurities from being mixed in when forming the photosensitive material, and removing them by washing. By using such methods, the amount of impurities can be kept within the above range.

[0159] Impurities can be quantified by known methods such as ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, and ion chromatography.

[0160] Furthermore, the content of compounds such as benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive composition layer is preferably low. The content of these compounds in the photosensitive composition layer is preferably 100 ppm by mass or less, more preferably 20 ppm by mass or less, and even more preferably 4 ppm by mass or less, relative to the total mass of the photosensitive composition layer. The lower limit of the content may be 10 ppb by mass or more, or 100 ppb by mass or more, relative to the total mass of the photosensitive composition layer. The content of these compounds can be reduced in the same manner as for the metal impurities described above. Furthermore, they can be quantified by known measurement methods.

[0161] The content of water in the photosensitive composition layer is preferably from 0.01 to 1.0% by mass, more preferably from 0.05 to 0.5% by mass, based on the total mass of the photosensitive composition layer, from the viewpoint of improving patterning properties.

[0162] <<Scatterers>> It is also preferable that the photosensitive composition layer is substantially free of scatterers. Here, "the photosensitive composition layer is substantially free of scatterers" means that, when the photosensitive composition layer is dissolved in a solvent to obtain a solution and the presence or absence of scatterers in the solution state is visually confirmed, there are 5 or fewer scatterers per 100 mL of solution with a solid content concentration of 25% by mass. The number is preferably 3 or fewer, more preferably 0. For example, when the photosensitive composition layer is a layer formed by a coating method, examples of the solvent include a solvent used to dissolve the components (solids) constituting the photosensitive composition layer. Furthermore, the solution (coating liquid) for forming the photosensitive composition layer may be visually confirmed in an amount equivalent to the mass of 25 g of the photosensitive composition layer. It is sufficient that there are 5 or fewer scatterers per observation area, preferably 3 or fewer, and more preferably 0.

[0163] Furthermore, when the photosensitive composition layer is not dissolved in a solvent, the photosensitive composition layer in the first transfer film may be observed with a 10x magnifying glass to count the number of scattering bodies. In this case, the observation range is set to a range equivalent to the mass of 25 g of the photosensitive composition layer. There may be 5 or less scattering bodies per observation range, preferably 3 or less scattering bodies, and more preferably 0 scattering bodies. The photosensitive composition layer in the transfer film may be observed with the above-mentioned method relative to the film (cured film) after transfer to count the number of scattering bodies.

[0164] The scatterers referred to here include dirt and dust that are brought into the photosensitive composition layer as contaminants during the production of the first transfer film, as well as aggregates derived from the components of the raw material composition of the photosensitive composition layer used in the production of the first transfer film, and correspond to those that are ultimately present in the photosensitive composition layer in the first transfer film. If the first transfer film is substantially free of scatterers, the optical waveguide formed after transfer of the photosensitive composition layer in the first transfer film will have lower optical loss.

[0165] Specific methods for substantially eliminating scattering bodies from the photosensitive composition layer of the first transfer film include, for example, a method of not using raw materials containing impurity components that can become scattering bodies such as aggregates and structures when forming the photosensitive composition layer of the first transfer film; a method of ensuring that each component is well soluble in the solvent when a solvent is used to form the photosensitive composition layer, and a method of selecting a combination of compounds that are easily compatible to suppress the occurrence of aggregates; and a method of filtering the coating liquid used to form the photosensitive composition layer to remove aggregates, dust, etc. that have been unintentionally mixed in.

[0166] <<Average Thickness of Photosensitive Composition Layer>> The average thickness of the photosensitive composition layer is preferably 1 to 50 μm, more preferably 2 to 10 μm, and even more preferably 2 to 5 μm.

[0167] <<Residual Ratio and Content of Carboxy Groups in Photosensitive Composition Layer After Treatment to Reduce the Amount of Carboxy Groups>> In the photosensitive composition layer that has been treated to reduce the amount of carboxy groups, the content of carboxy groups relative to the total mass of the photosensitive composition layer is preferably 0.01 to 4.0 mass%, more preferably 0.01 to 3.0 mass%, and even more preferably 0.01 to 2.5 mass%. That is, for example, when the photosensitive composition layer is photosensitive composition layer E1 and a pattern is formed using the pattern formation method of the first embodiment, the content of carboxy groups relative to the total mass of the photosensitive composition layer after curing obtained through Steps X1 to X5 is preferably 0.01 to 4.0 mass%, more preferably 0.01 to 3.0 mass%, and even more preferably 0.01 to 2.5 mass%. Furthermore, for example, when the photosensitive composition layer is the photosensitive composition layer E2 and a pattern is formed by applying the pattern formation method of the second embodiment, the content of the amount of carboxy groups relative to the total mass of the photosensitive composition layer obtained through steps Y1 to Y4 is preferably 0.01 to 4.0 mass%, more preferably 0.01 to 3.0 mass%, and even more preferably 0.01 to 2.5 mass%.

[0168] Furthermore, the residual ratio of carboxy groups after the treatment to reduce the amount of carboxy groups is preferably 30 mol % or less relative to the initial content of carboxy groups (the content of carboxy groups in the photosensitive composition layer before exposure). The residual ratio of the content of carboxy groups (particularly, carboxy groups derived from compound A) in the photosensitive composition layer can be obtained by measuring the IR (infrared) spectrum of the content of carboxy groups in each layer of the photosensitive composition layer before exposure and the photosensitive composition layer after the treatment to reduce the amount of carboxy groups, and calculating the residual ratio of the peak derived from the carboxy groups. The residual ratio of the content of carboxy groups can be calculated by measuring the IR (infrared) spectrum of the content of carboxy groups in each layer of the photosensitive composition layer before exposure and the photosensitive composition layer after the treatment to reduce the amount of carboxy groups. －１The content of carboxy groups in the photosensitive composition layer after treatment to reduce the amount of carboxy groups can be calculated by substituting hydrogen atoms of the carboxy groups with metal ions such as lithium, and analyzing and quantifying the amount of these metal ions using an ICP-OES (Inductivity Coupled Plasma Optical Emission Spectrometer).

[0169] <<Intermediate Layer>> The first transfer film may further have an intermediate layer between the temporary support and the photosensitive composition layer. The intermediate layer is preferably disposed between the thermoplastic resin layer and the photosensitive composition layer, and between the temporary support and the photosensitive composition layer when no thermoplastic resin layer is disposed. When the intermediate layer is disposed between the thermoplastic resin layer and the photosensitive composition layer, layer mixing during coating and formation of the thermoplastic resin layer and the photosensitive composition layer can be suppressed. Furthermore, when no thermoplastic resin layer is disposed in the first transfer film, disposing the intermediate layer between the temporary support and the photosensitive composition layer can suppress surface roughening of the photosensitive composition layer when the temporary support is peeled off, and thus can suppress poor exposure during exposure after peeling off the temporary support.

[0170] As the intermediate layer, a water-soluble resin layer containing a water-soluble resin can be used. Alternatively, an oxygen-blocking layer having an oxygen-blocking function, as described as a "separation layer" in JP-A-5-072724, can also be used. The oxygen-blocking layer used as the intermediate layer may be appropriately selected from known layers described in the above publication. Among these, an oxygen-blocking layer that exhibits low oxygen permeability and disperses or dissolves in water or an alkaline aqueous solution (a 1% by mass aqueous solution of sodium carbonate at 22°C) is preferred.

[0171] Hereinafter, each component that the intermediate layer (water-soluble resin layer) may contain will be described.

[0172] <Water-Soluble Resin> The intermediate layer contains a resin. The resin contains a water-soluble resin as part or all of it. Examples of resins that can be used as the water-soluble resin include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, acrylamide-based resins, polyethylene oxide-based resins, gelatin, vinyl ether-based resins, polyamide resins, and copolymers thereof. Furthermore, copolymers of (meth)acrylic acid / vinyl compounds can also be used as the water-soluble resin. As the copolymer of (meth)acrylic acid / vinyl compounds, a copolymer of (meth)acrylic acid / allyl (meth)acrylate is preferred, and a copolymer of methacrylic acid / allyl methacrylate is more preferred. When the water-soluble resin is a copolymer of (meth)acrylic acid / vinyl compound, the composition ratio (mol %) of each is, for example, preferably 90 / 10 to 20 / 80, and more preferably 80 / 20 to 30 / 70.

[0173] The lower limit of the weight average molecular weight of the water-soluble resin is preferably 5,000 or more, more preferably 7,000 or more, and even more preferably 10,000 or more. The upper limit is preferably 200,000 or less, more preferably 100,000 or less, and even more preferably 50,000 or less. The dispersity (Mw / Mn) of the water-soluble resin is preferably 1 to 10, and more preferably 1 to 5.

[0174] In order to further improve the ability of the intermediate layer to suppress interlayer mixing, it is preferable that the resin contained in the intermediate layer be different from the resin contained in the layer disposed on one side of the intermediate layer and the resin contained in the layer disposed on the other side of the intermediate layer. In other words, for example, if the layer adjacent to one side of the intermediate layer is a thermoplastic resin layer and the layer adjacent to the other side of the intermediate layer is a photosensitive composition layer, it is preferable that the resin contained in the intermediate layer be different from the resin contained in the thermoplastic resin layer and the photosensitive composition layer.

[0175] The water-soluble resin preferably contains polyvinyl alcohol, more preferably both polyvinyl alcohol and polyvinylpyrrolidone, in order to further improve the oxygen barrier property and the ability to inhibit interlayer mixing.

[0176] The water-soluble resin may be used alone or in combination of two or more. The content of the water-soluble resin is not particularly limited, but in order to further improve the oxygen barrier property and the interlayer mixing suppression ability, it is preferably 50% by mass or more, more preferably 70% by mass or more, based on the total mass of the intermediate layer. The upper limit is not particularly limited, but for example, it is preferably 99.9% by mass or less, more preferably 99.8% by mass or less.

[0177] The thickness of the intermediate layer is preferably 3.0 μm or less, more preferably 2.0 μm or less, and the lower limit thereof is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1.0 μm or more.

[0178] <<Thermoplastic Resin Layer>> The first transfer film may have a thermoplastic resin layer between the temporary support and the photosensitive composition layer. When the first transfer film has a thermoplastic resin layer, when the first transfer film is transferred to a transfer-receiving member to form a laminate, bubbles are less likely to be generated in the photosensitive composition layer of the laminate. Hereinafter, each component that the thermoplastic resin layer may contain will be described.

[0179] <Thermoplastic Resin Layer> The thermoplastic resin layer contains a thermoplastic resin. The thermoplastic resin is preferably an alkali-soluble resin. Examples of thermoplastic resins include acrylic resins, polystyrene resins, styrene-acrylic copolymers, polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, polyamide resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimine, polyallylamine, and polyalkylene glycols. The alkali-soluble resin is preferably an acrylic resin in terms of developability and adhesion to adjacent layers. Here, "acrylic resin" refers to a resin containing at least one repeating unit selected from the group consisting of a repeating unit derived from (meth)acrylic acid, a repeating unit derived from a (meth)acrylic acid ester, and a repeating unit derived from a (meth)acrylic acid amide.

[0180] The alkali-soluble resin is preferably a resin having an acid group, and more preferably a resin containing a repeating unit having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphate group, and a phosphonate group, with a carboxy group being preferred. The alkali-soluble resin is also preferably an acrylic resin having a repeating unit derived from (meth)acrylic acid, in terms of better developability and / or better adhesion to adjacent layers. When the alkali-soluble resin contains a repeating unit having an acid group, the content thereof is preferably 5 to 50% by mass, more preferably 10 to 40% by mass, and even more preferably 12 to 30% by mass, relative to the total mass of the acrylic resin.

[0181] The acid value of the alkali-soluble resin is preferably 60 mgKOH / g or more from the viewpoint of developability. The upper limit is preferably 300 mgKOH / g or less, more preferably 250 mgKOH / g or less, and even more preferably 200 mgKOH / g or less. As the acrylic resin having a carboxy group with an acid value of 60 mgKOH / g or more, for example, a known resin can be appropriately selected and used. Specific examples include those described in paragraph

[0025] of JP 2011-095716 A, paragraphs

[0033] to

[0052] of JP 2010-237589 A, and paragraphs

[0053] to

[0068] of JP 2016-224162 A.

[0182] The alkali-soluble resin may have a polymerizable group. The polymerizable group may be any group that is involved in a polymerization reaction, and examples thereof include groups having an ethylenically unsaturated group such as a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group; and groups having a cationic polymerizable group such as an epoxy group and an oxetane group. Among these, the polymerizable group is preferably a group having an ethylenically unsaturated group, and more preferably an acryloyl group or a methacryloyl group.

[0183] The weight average molecular weight of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and even more preferably 20,000 to 50,000.

[0184] The thermoplastic resin may be used alone or in combination of two or more. The content of the thermoplastic resin is preferably from 10 to 99% by mass, more preferably from 20 to 90% by mass, and even more preferably from 400 to 90% by mass, based on the total mass of the thermoplastic resin layer, in terms of developability and adhesion to adjacent layers.

[0185] (Plasticizer) The thermoplastic resin layer may contain a plasticizer from the viewpoints of resolution, adhesion to adjacent layers, and developability. The molecular weight (weight average molecular weight) of the plasticizer is preferably 200 to 2,000. The plasticizer is not particularly limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity, but from the viewpoints of resolution and storage stability, it is preferable that the plasticizer contain a (meth)acrylate compound. From the viewpoints of compatibility, resolution, and adhesion to adjacent layers, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth)acrylate compound. Examples of (meth)acrylate compounds include (meth)acrylate compounds that can be included as polymerizable compounds in the photosensitive composition layer. Plasticizers may be used alone or in combination of two or more types. The content of the plasticizer is preferably 0.5 to 40% by mass, more preferably 5 to 40% by mass, based on the total mass of the thermoplastic resin layer, from the viewpoints of the resolution of the thermoplastic resin layer, adhesion to adjacent layers, and developability.

[0186] (Other Additives) The thermoplastic resin layer may contain additives other than the above components. Examples of the other additives include dyes, compounds that generate acids, bases, or radicals when exposed to light (such as acid generators, photobase generators, and photoradical polymerization initiators), sensitizers, polymerization inhibitors, and surfactants.

[0187] The average thickness (layer thickness) of the thermoplastic resin layer is preferably 3 to 30 μm, more preferably 4 to 25 μm, and even more preferably 5 to 20 μm, from the viewpoint of adhesion with adjacent layers. Furthermore, the thermoplastic resin layer is preferably, for example, a thermoplastic resin layer described in paragraphs

[0189] to

[0193] of JP 2014-085643 A, the contents of which are incorporated herein by reference.

[0188] <<Cover Film (Protective Film)>> The first transfer film may have a cover film (protective film).

[0189] The cover film contains 5 fish eyes with a diameter of 80 μm or more per m. ２ The term "fisheye" refers to foreign matter, undissolved matter, and / or oxidized and deteriorated matter of the material that is introduced into the film when the material is thermally melted and then kneaded, extruded, and / or biaxially stretched, cast, or other methods are used to produce the film.

[0190] The number of particles with a diameter of 3 μm or more contained in the cover film is 30 / mm ２ Preferably, 10 pieces / mm or less ２ More preferably, 5 or less pieces / mm ２ The following is more preferable: This can suppress defects caused by the transfer of irregularities due to particles contained in the cover film to the photosensitive composition layer.

[0191] The arithmetic mean roughness Ra of the surface of the cover film is preferably 0.01 μm or more, more preferably 0.02 μm or more, and even more preferably 0.03 μm or more. If Ra is within this range, for example, when the first transfer film is long, the winding property of the first transfer film can be improved. Furthermore, from the viewpoint of suppressing defects during transfer, Ra is preferably less than 0.50 μm, more preferably 0.40 μm or less, and even more preferably 0.30 μm or less.

[0192] Examples of the cover film include polyethylene terephthalate film, polypropylene film, polystyrene film, and polycarbonate film. For example, the cover film described in paragraphs 0083 to 0087 and 0093 of JP-A No. 2006-259138 may be used.

[0193] Examples of the cover film that can be used include Alphan (registered trademark) FG-201 manufactured by Oji F-Tex Co., Ltd., Alphan (registered trademark) E-201F manufactured by Oji F-Tex Co., Ltd., Therapeel (registered trademark) 25WZ manufactured by Toray Advanced Film Co., Ltd., and Lumirror (registered trademark) 16QS62 (16KS40) manufactured by Toray Industries, Inc.

[0194] [Method for manufacturing the first transfer film] The method for manufacturing the first transfer film is not particularly limited, and known manufacturing methods can be applied. As a method for manufacturing the first transfer film, it is preferable to form a thermoplastic resin layer, an intermediate layer, and a photosensitive composition layer that can be arranged on a temporary support by a coating method. For example, an example of a method for manufacturing the transfer film 10 shown in FIG. 1 includes a step of applying a thermoplastic resin composition to the surface of the temporary support to form a coating film, and then drying the coating film to form a thermoplastic resin layer; a step of applying a water-soluble resin composition to the surface of the thermoplastic resin layer to form a coating film, and then drying the coating film to form an intermediate layer; and a step of applying a photosensitive composition to the surface of the intermediate layer to form a coating film, and then drying the coating film to form a photosensitive composition layer.

[0195] A cover film is pressed onto the photosensitive composition layer of the laminate produced by the above-described production method to produce the transfer film 10 shown in Fig. 1. The transfer film 10 shown in Fig. 1 may also be wound up after production and stored as a roll of transfer film. The roll of transfer film can be provided in its original form for the lamination step with a substrate in a roll-to-roll system, which will be described later.

[0196] <<Method for Forming Thermoplastic Resin Composition and Thermoplastic Resin Layer>> The method for forming the thermoplastic resin layer is not particularly limited, and known methods can be used. For example, a method of forming the thermoplastic resin layer by applying and drying a thermoplastic resin composition can be used. The coating method is not particularly limited, and examples include slit coating, spin coating, curtain coating, and inkjet coating. The thermoplastic resin composition preferably contains the various components forming the thermoplastic resin layer described above and a solvent. Note that, in the thermoplastic resin composition, the preferred range of the content of each component relative to the total solid content of the composition is the same as the preferred range of the content of each component relative to the total mass of the thermoplastic resin layer described above. The solvent is not particularly limited as long as it can dissolve or disperse each component other than the solvent, and known solvents can be used. The solvent can be any of the solvents listed below as solvents for the photosensitive composition. The content of the solvent is preferably 50 to 1,900 parts by mass, more preferably 100 to 900 parts by mass, relative to 100 parts by mass of the total solid content of the composition.

[0197] <<Method for Forming Water-Soluble Resin Composition and Intermediate Layer (Water-Soluble Resin Layer)>> The method for forming the intermediate layer is not particularly limited, and known methods can be used, such as a method of forming the intermediate layer by applying and drying a water-soluble resin composition. The coating method is not particularly limited, and examples include slit coating, spin coating, curtain coating, and inkjet coating. The water-soluble resin composition preferably contains the various components forming the intermediate layer described above and a solvent. The preferred range of the content of each component relative to the total solids content of the composition is the same as the preferred range of the content of each component relative to the total mass of the intermediate layer described above. The solvent is not particularly limited as long as it can dissolve or disperse the water-soluble resin. Preferably, the solvent is at least one selected from the group consisting of water and water-miscible organic solvents, and more preferably water or a mixed solvent of water and a water-miscible organic solvent. Examples of water-miscible organic solvents include C1-3 alcohols, acetone, ethylene glycol, and glycerin. C1-3 alcohols are preferred, and methanol or ethanol are more preferred. The solvents may be used alone or in combination. The content of the solvent is preferably 50 to 2,500 parts by mass, more preferably 50 to 1,900 parts by mass, and even more preferably 100 to 900 parts by mass, per 100 parts by mass of the total solid content of the composition.

[0198] <<Photosensitive Composition and Method for Forming Photosensitive Composition Layer>> The method for forming the photosensitive composition layer is not particularly limited, and known methods can be used, such as a method of forming the photosensitive composition layer by coating and drying the photosensitive composition. The coating means is not particularly limited, and examples include slit coating, spin coating, curtain coating, and inkjet coating. The photosensitive composition preferably contains the various components forming the photosensitive composition layer described above and a solvent. In the photosensitive composition, the preferred range of the content of each component relative to the total solid content of the composition is the same as the preferred range of the content of each component relative to the total mass of the photosensitive composition layer described above. The solvent is not particularly limited as long as it can dissolve or disperse each component other than the solvent, and known solvents can be used. Specific examples include water, alkylene glycol ether solvents, alkylene glycol ether acetate solvents, alcohol solvents (methanol, ethanol, etc.), ketone solvents (acetone, methyl ethyl ketone, etc.), aromatic hydrocarbon solvents (toluene, etc.), aprotic polar solvents (N,N-dimethylformamide, etc.), cyclic ether solvents (tetrahydrofuran, etc.), ester solvents (n-propyl acetate, etc.), amide solvents, lactone solvents, and mixed solvents containing two or more of these.

[0199] The solvent may be used alone or in combination of two or more. The content of the solvent is preferably 50 to 1,900 parts by mass, more preferably 100 to 1,200 parts by mass, and still more preferably 100 to 900 parts by mass, relative to 100 parts by mass of the total solid content of the composition.

[0200] The coatings of the thermoplastic resin layer-forming composition, the intermediate layer-forming composition, and the photosensitive composition may be subjected to a drying treatment if necessary. As the drying method, heat drying and reduced pressure drying are preferred.

[0201] In order to form an optical waveguide with lower optical transmission loss, it is preferable that the photosensitive composition layer in the first transfer film is substantially free of scatterers that may contribute to optical transmission loss. In the manufacturing method of the first transfer film, in order to reduce scatterers in the photosensitive composition layer in the first transfer film, it is preferable to use, in forming the photosensitive composition layer, raw materials containing impurity components that may become scatterers such as aggregates and structures, to thoroughly dissolve each component in the photosensitive composition (coating liquid) that forms the photosensitive composition layer in a solvent, to select a combination of compounds that are easily compatible to suppress the generation of aggregates in the photosensitive composition, and / or to apply a method such as filtering the photosensitive composition to remove unintentionally mixed aggregates, dust, etc. The manufacturing method of the first transfer film preferably includes, among other things, a step of filtering the photosensitive composition that forms the photosensitive composition layer to remove unintentionally mixed aggregates, dust, etc.

[0202] The pore size of the filter is preferably 1 mm or less, more preferably 0.1 mm or less, even more preferably 0.01 mm or less, and particularly preferably 0.001 mm or less. The filter is preferably made of polytetrafluoroethylene, polyethylene, or nylon.

[0203] [Pattern formation method using a first transfer film] It is also preferable to form a pattern using a first transfer film. The pattern formation method using a first transfer film corresponds to the pattern formation method of the first embodiment and the pattern formation method of the second embodiment described in the upper part. In addition, in the pattern formation methods of the first and second embodiments described in the upper part, if the first transfer film has a cover film, it is preferable to include a step of peeling off the cover film of the first transfer film before carrying out step X1 and step Y1. The method of peeling off the cover film is not particularly limited, and known methods can be applied.

[0204] Hereinafter, each step in the pattern forming method of the first and second embodiments will be described.

[0205] <<<Step X1, Step Y1>>> Step X1 and step Y1 include a step of bringing the surface of the photosensitive composition layer in the first transfer film opposite the temporary support side into contact with a substrate, thereby bonding the first transfer film to the substrate.

[0206] <<Substrate>> The substrate is not particularly limited, and can be selectively used depending on the application of the optical waveguide, such as a quartz substrate, a silicon substrate, or a printed wiring board (e.g., an FR4 substrate, a glass epoxy substrate, a polyimide substrate, etc.). A resin layer having a refractive index lower than that of the pattern after step X4 or step Y3 may be formed on the substrate.

[0207] <<Procedure of Step X1 and Step Y1>> Step X1 and Step Y1 are preferably lamination steps using pressure and heat with a roll or the like. A known laminator such as a laminator, a vacuum laminator, or an auto-cut laminator can be used for lamination. Step X1 and Step Y1 are also preferably performed using a roll-to-roll method. The roll-to-roll method uses a substrate that can be wound and unwound, and includes a step of unwinding the substrate (also referred to as an "unwinding step") before any of the steps included in the pattern formation method using the first transfer film, and a step of winding the substrate (also referred to as a "winding step") after any of the steps, in which at least any of the steps (preferably all of the steps, or all of the steps except the heating step) are performed while the substrate is being transported. The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and any known method may be used in a manufacturing method that employs the roll-to-roll method.

[0208] <<Step X2>> The pattern forming method of embodiment 1 includes a step (Step X2) of patternwise exposing the photosensitive composition layer. When the photosensitive composition layer is subjected to Step X2, a polymerization reaction of the polymerization component proceeds. The light source used for exposure in Step X2 can be appropriately selected as long as it irradiates light in a wavelength range capable of inducing a reaction of the polymerizable compound in the photosensitive composition layer (when the photosensitive composition layer contains a polymerization initiator, preferably light with a wavelength that sensitizes the polymerization initiator; for example, light with a wavelength of 254 nm, 313 nm, 365 nm, 405 nm, etc.). Specific examples include an ultra-high pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, and an LED (Light Emitting Diode). The exposure dose is 5 to 1000 mJ / cm. ２ is preferred, and 10 to 500 mJ / cm ２ is more preferred.

[0209] <<Step X5>> Step X5 is a step of peeling off the temporary support. The peeling off of the temporary support is performed between Step X1 and Step X2, or between Step X2 and Step X3. That is, the patterned exposure of Step X2 may be performed after peeling off the temporary support from the photosensitive composition layer, or the patterned exposure of Step X2 may be performed via the temporary support before peeling off the temporary support, and then the temporary support may be peeled off before performing the alkaline development of Step X3. From the viewpoints of preventing mask contamination due to contact between the photosensitive composition layer and the mask and avoiding the influence of foreign matter attached to the mask on the exposure, it is preferable to perform the patterned exposure of Step X2 without peeling off the temporary support. From the viewpoints of further suppressing exposure blur and further improving resolution, it is preferable to perform the patterned exposure of Step X2 after peeling off the temporary support from the photosensitive composition layer. Note that the patterned exposure may be exposure through a mask or direct exposure using a laser or the like.

[0210] <<Step X4>> The pattern forming method of embodiment 1 includes a step of performing a treatment to reduce the amount of carboxy groups on the photosensitive composition layer (pattern) that has been subjected to the alkali development treatment in step X3. The treatment to reduce the carboxy groups in the photosensitive composition layer (particularly, carboxy groups derived from compound A) in step X4 is preferably an exposure treatment or a heat treatment. Furthermore, both an exposure treatment and a heat treatment may be performed as the treatment to reduce the carboxy groups in the photosensitive composition layer (particularly, carboxy groups derived from compound A) in step X4.

[0211] (Exposure Treatment) The exposure treatment may be either full-surface exposure or patterned exposure, but full-surface exposure is preferred. The light source used for exposure can be appropriately selected as long as it irradiates light in a wavelength range that can reduce the content of carboxy groups (particularly carboxy groups derived from compound A) in the photosensitive composition layer (light with a wavelength that excites compound B in the photosensitive composition layer, for example, light in wavelength ranges of 254 nm, 313 nm, 365 nm, 405 nm, etc.). Specific examples include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, xenon lamps, and LEDs (Light Emitting Diodes). The exposure dose is 1 to 10 J / cm. ２ is preferred, and 2 to 10 J / cm ２ More preferably, 2 to 5 J / cm ２ is more preferred.

[0212] (Heat Treatment) Heat treatment can be carried out using, for example, an oven. Heat treatment is preferably carried out in an environment of 8.1 to 121.6 kPa, more preferably in an environment of 50.66 kPa or higher. On the other hand, heat treatment is more preferably carried out in an environment of 111.46 kPa or lower, and even more preferably in an environment of 101.3 kPa or lower. Heat treatment may be carried out in an air environment or in a nitrogen-substituted environment. The heat treatment temperature is preferably 80 to 250°C, more preferably 110 to 170°C, and even more preferably 130 to 150°C. The heat treatment time is preferably 1 to 120 minutes, more preferably 2 to 90 minutes, and even more preferably 5 to 60 minutes.

[0213] <<Step Y2>> The pattern forming method of Embodiment 2 includes, after Step X1, a step of patternwise exposing the photosensitive composition layer (Step X2). Step Y2 corresponds to a step of reducing the content of carboxy groups (particularly carboxy groups derived from Compound A) in the photosensitive composition layer by exposure. More specifically, it is preferable to patternwise expose the photosensitive composition layer using light of a wavelength that excites Compound B in the photosensitive composition layer.

[0214] The light source used for exposure can be appropriately selected as long as it irradiates light in a wavelength range capable of reducing carboxy groups (particularly carboxy groups derived from compound A) in the photosensitive composition layer (light having a wavelength that excites compound B in the photosensitive composition layer, for example, light in a wavelength range of 254 nm, 313 nm, 365 nm, 405 nm, etc.). Specific examples include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, xenon lamps, and LEDs (light emitting diodes). The exposure dose is 1 to 10 J / cm. ２ is preferred, and 2 to 10 J / cm ２ More preferably, 2 to 5 J / cm ２ is more preferred.

[0215] <<Step Y4>> Step Y4 is a step of peeling off the temporary support. The peeling off of the temporary support is carried out between Step Y1 and Step Y2, or between Step Y2 and Step Y3. That is, the patterned exposure of Step Y2 may be carried out after peeling off the temporary support from the photosensitive composition layer, or the patterned exposure of Step Y2 may be carried out via the temporary support before peeling off the temporary support, and then the temporary support may be peeled off before carrying out the alkaline development of Step Y3. From the viewpoints of preventing mask contamination due to contact between the photosensitive composition layer and the mask and avoiding the influence of foreign matter attached to the mask on the exposure, it is preferable to carry out the patterned exposure of Step Y2 without peeling off the temporary support. From the viewpoints of further suppressing exposure blur and further improving resolution, it is preferable to carry out the patterned exposure of Step Y2 after peeling off the temporary support from the photosensitive composition layer. Note that the patterned exposure may be exposure through a mask or direct exposure using a laser or the like.

[0216] <<Step X3, Step Y3>> The pattern forming method of Embodiment 1 includes, after Step X2, a step (Step X3) of developing the pattern-exposed photosensitive composition layer using an alkaline developer. Furthermore, the pattern forming method of Embodiment 2 includes, after Step Y2, a step (Step Y3) of developing the pattern-exposed photosensitive composition layer using an alkaline developer. The photosensitive composition layer that has undergone Step X2 or Step Y2 has a difference in solubility in the developer (dissolution contrast) between the exposed and unexposed areas due to a decrease in the carboxy group content in the exposed areas of the photosensitive composition layer. The formation of the dissolution contrast in the photosensitive composition layer enables the formation of a pattern in Step Y3. By performing Step X3 or Step Y3, the unexposed areas are removed, forming a negative pattern.

[0217] (Alkaline Developer) The alkaline developer is not particularly limited as long as it can remove the unexposed portions of the photosensitive composition layer. For example, known developers such as the developer described in JP-A-5-072724 can be used. As the alkaline developer, for example, an aqueous alkaline developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 to 5 mol / L (liter) is preferred. The alkaline developer may further contain a water-soluble organic solvent, a surfactant, and the like. As the alkaline developer, for example, the developer described in paragraph

[0194] of WO 2015 / 093271 is preferred. The concentration of water in the alkaline developer is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 85% by mass or more, particularly preferably 90% by mass or more, and most preferably 95% by mass or more. The upper limit is, for example, less than 100% by mass.

[0218] The development method is not particularly limited, and may be any of puddle development, shower development, spin development, dip development, etc. Here, shower development will be explained. By spraying a developer onto the photosensitive composition layer after exposure, unnecessary portions can be removed. It is also preferable to spray a detergent or the like by showering after development, and remove development residues by scrubbing with a brush or the like. The liquid temperature of the developer is preferably 20 to 40°C.

[0219] The pattern forming method of embodiment 2 may or may not further include a post-baking step in which the pattern including the photosensitive composition layer obtained through step Y3 is heat-treated. Post-baking is preferably performed in an environment of 8.1 to 121.6 kPa, more preferably in an environment of 50.66 kPa or higher. On the other hand, it is more preferably performed in an environment of 111.46 kPa or lower, and even more preferably in an environment of 101.3 kPa or lower. The post-baking temperature is preferably 80 to 250°C, more preferably 110 to 170°C, and even more preferably 130 to 150°C. The post-baking time is preferably 1 to 120 minutes, more preferably 2 to 90 minutes, and even more preferably 5 to 60 minutes. Post-baking may be performed in an air environment or a nitrogen-substituted environment.

[0220] [Laminate using first transfer film] Hereinafter, a laminate using a first transfer film (hereinafter also referred to as "first laminate") will be described. The first laminate has a substrate, a resin layer, and a first transfer film, with the photosensitive composition layer disposed on the resin layer side. Hereinafter, the configuration of the first laminate will be described. FIG. 2 is a cross-sectional schematic diagram showing an example of an embodiment of the first laminate. The laminate 30 shown in FIG. 2 comprises a substrate 22, a resin layer 24, and a transfer film 10 (see FIG. 1) arranged so that the photosensitive composition layer 18 side faces the resin layer 24. In addition, the transfer film 10 shown in FIG. 2 has a form in which a thermoplastic resin layer 14 and an intermediate layer 16 are arranged, but the thermoplastic resin layer 14 and the intermediate layer 16 do not have to be arranged. In addition, in the transfer film 10 shown in FIG. 2, an intermediate layer (not shown) may be arranged on the photosensitive composition layer 18 side of the temporary support 14.

[0221] The elements constituting the first laminate will be described below, with the configuration of the first transfer film being as described above.

[0222] <Substrate> The substrate is not particularly limited, and for example, a quartz substrate, a silicon substrate, a printed wiring board (for example, an FR4 substrate, a glass epoxy substrate, a polyimide substrate, etc.) or the like can be selectively used depending on the application of the optical waveguide.

[0223] <Resin Layer> The resin layer preferably has a refractive index lower than that of the cured layer of the photosensitive composition (e.g., the layer obtained through the above-described steps X4 and Y3). The difference in refractive index between the resin layer and the cured layer of the photosensitive composition is, for example, preferably 0.01 or more, more preferably 0.02 or more. There is no particular upper limit, but a preferable upper limit is 0.50 or less. The refractive index is the refractive index at a wavelength of 589 nm or the refractive index at the wavelength of the light to be guided (e.g., a wavelength of 1310 nm). Examples of resins constituting the resin layer include ultraviolet-curable fluorinated acrylate resins, polymethacrylate resins, fluorinated polyimide resins, and epoxy resins. The thickness of the resin layer is preferably, for example, 5 to 200 μm. A first laminate in which the refractive index of the resin layer is lower than that of the cured layer of the photosensitive composition can be suitably used as a material for manufacturing an optical waveguide.

[0224] The resin layer may be a layer formed by the first transfer film, that is, a photosensitive composition layer (cured layer) obtained by performing a predetermined process (processes X1 to X5 or Y1 to Y4) using the first transfer film.

[0225] [Method for manufacturing an optical waveguide using a first laminate] The method for manufacturing an optical waveguide using a first laminate is a manufacturing method having the following steps 1 to 5 (hereinafter also referred to as "method for manufacturing an optical waveguide of the first embodiment"), or a manufacturing method having the following steps 1 to 4, in which carboxy groups are reduced by exposure treatment in step 1 (hereinafter also referred to as "method for manufacturing an optical waveguide of the second embodiment"). Step 1: A step of performing an exposure treatment (preferably pattern exposure) on the photosensitive composition layer in the first laminate. Step 2: A step of performing an alkali development treatment on the photosensitive composition layer that has been subjected to the exposure treatment to form a core portion. Step 3: A step of forming a resin layer having a lower refractive index than the core portion on the core portion so as to cover the core portion, thereby forming an optical waveguide having the core portion and a clad portion. Step 4: A step of peeling off the temporary support before step 1 or between steps 1 and 2. Step 5: A step of performing a treatment to reduce the amount of carboxy groups between steps 2 and 3, or after step 3.

[0226] Hereinafter, methods for manufacturing the optical waveguides of the first and second embodiments will be described. [Method for manufacturing the optical waveguide of the first embodiment] The method for manufacturing the optical waveguide of the first embodiment is a manufacturing method including the above-mentioned steps 1 to 5. The method for manufacturing the optical waveguide of the first embodiment is preferably applied when the photosensitive composition layer in the first laminate is the photosensitive composition layer E1.

[0227] <<Step 1, Step 2, Step 4>> The procedures of Step 1, Step 2, and Step 4 are the same as the procedures of Step X2, Step X3, and Step X4 described in the upper part, and the preferred embodiments are also the same.

[0228] <<Step 3>> Step 3 is a step of forming a resin layer (second resin layer) having a lower refractive index than the core portion on the core portion (a layer formed by curing the curable component of the photosensitive composition layer) so as to cover the core portion (a layer formed by curing the curable component of the photosensitive composition layer) obtained through the alkali development of Step 2, or obtained through Step 5 if Step 5, a treatment to reduce the amount of carboxy groups, is performed after Step 2. By performing Step 3, an optical waveguide 40 is formed, as shown in FIG. 3, having a substrate 22, a first resin layer 32, a core portion 34, and a second resin layer 36. The first resin layer 32 is the same as the resin layer (resin layer 24 in FIG. 2) provided in the first laminate used in Step 1, and the second resin layer 36 is a resin layer disposed to cover the core portion in Step 3. The first resin layer and the second resin layer function as cladding portions. The refractive index difference between the core portion and the cladding portion (first resin layer and second resin layer) is, for example, preferably 0.01 or more, more preferably 0.02 or more. There is no particular upper limit, but a value of 0.5 or less is preferred. The refractive index is the refractive index at a wavelength of 589 nm or the refractive index at the wavelength of light to be guided (for example, a wavelength of 1310 nm). Examples of resins constituting the second resin layer include ultraviolet-curable fluorinated acrylate resins, polymethacrylate resins, fluorinated polyimide resins, and epoxy resins. The method for forming the second resin layer is not particularly limited, and examples include a formation method in which a coating film is formed by a known coating method using a composition containing a resin or a precursor thereof, and then the coating film is photocured or thermally cured. The thickness of the second resin layer is preferably, for example, 5 to 200 μm.

[0229] The second resin layer may also be a layer formed from the first transfer film, i.e., a photosensitive composition layer (cured layer) obtained by subjecting the first transfer film to a predetermined treatment (steps X1 to X5 or Y1 to Y4).

[0230] Methods for adjusting the refractive index of the first resin layer and the second resin layer to a relatively high refractive index include selectively using a component selected from the group consisting of high-refractive-index polymers and high-refractive-index monomers, increasing the content ratio of a component selected from the group consisting of high-refractive-index polymers and high-refractive-index monomers, and / or increasing the crosslink density. A high refractive index can also be easily achieved by using a compound containing a heterocyclic ring or a fused ring structure and / or a compound containing a heavy element such as a sulfur atom. Methods for adjusting the refractive index of the second resin layer to a relatively low refractive index include selectively using a component selected from the group consisting of low-refractive-index polymers and low-refractive-index monomers, increasing the content ratio of a component selected from the group consisting of low-refractive-index polymers and low-refractive-index monomers, and / or decreasing the crosslink density.

[0231] <<Step 5>> Step 5 is a step of carrying out a treatment to reduce the amount of carboxy groups. Step 5 is carried out between Step 2 and Step 3, or after Step 3. The procedure of Step 5 is the same as the procedure of Step X4 described in the upper part, and the preferred embodiment is also the same.

[0232] In the core portion that has been subjected to the treatment to reduce the amount of carboxy groups in step 5, the content of carboxy groups relative to the total mass of the core portion is preferably 0.01 to 4.0 mass%, more preferably 0.01 to 3.0 mass%, and even more preferably 0.01 to 2.5 mass%. Furthermore, the residual rate of carboxy groups after the treatment to reduce the amount of carboxy groups in step 5 is preferably 30 mol % or less relative to the content of carboxy groups in the photosensitive composition layer before the exposure treatment in step 1 is carried out.

[0233] [Method for manufacturing an optical waveguide according to a second embodiment] The method for manufacturing an optical waveguide according to a second embodiment includes the above-described steps 1 to 4, and reduces the carboxyl groups by the exposure treatment in step 1. The method for manufacturing an optical waveguide according to the second embodiment is preferably applied when the photosensitive composition layer in the first laminate is the photosensitive composition layer E2.

[0234] <<Step 1, Step 2, Step 4>> The procedures of Step 1, Step 2, and Step 4 are the same as the procedures of Step Y2, Step Y3, and Step Y4 described in the upper part, and the preferred embodiments are also the same.

[0235] <<Step 3>> Step 3 is a step of forming a resin layer (second resin layer) having a lower refractive index than the core portion on the core portion so as to cover the core portion obtained through the alkali development in Step 2. This step is the same as Step 3 in the method for manufacturing an optical waveguide according to the first embodiment.

[0236] In the core portion that has been subjected to the treatment to reduce the amount of carboxy groups in step 1, the content of carboxy groups relative to the total mass of the core portion is preferably 0.01 to 4.0 mass%, more preferably 0.01 to 3.0 mass%, and even more preferably 0.01 to 2.5 mass%. Furthermore, the residual rate of carboxy groups after the treatment to reduce the amount of carboxy groups in step 1 is preferably 30 mol% or less relative to the carboxy groups in the photosensitive composition layer before the exposure treatment in step 1 (before the treatment to reduce the amount of carboxy groups).

[0237] The optical waveguide obtained by the method for manufacturing an optical waveguide using the first laminate can be used as an optical transmission line for an optical module. Examples of the optical module include an optical fiber-attached optical waveguide in which optical fibers are connected to both ends of the optical waveguide, a connector-attached optical waveguide in which connectors are connected to both ends of the optical waveguide, an opto-electrical composite board in which an optical waveguide is combined with a printed wiring board, an opto-electrical conversion module in which an optical waveguide is combined with an opto-electrical conversion element that converts optical signals into electrical signals and vice versa, and a wavelength multiplexer / demultiplexer in which an optical waveguide is combined with a wavelength division filter.

[0238] Furthermore, the optical waveguide formed by transferring the first transfer film does not contain a hydroxyl group, and the amount of carboxylic acid is reduced in the cured film, so it is less likely to absorb moisture, has low water absorbency, and has the effect of reducing water-related absorption and deterioration of durability. Furthermore, if the first transfer film has been treated to reduce the number of scatterers in the photosensitive composition layer, the optical waveguide formed by transferring the first transfer film is more likely to have lower optical transmission loss.

[0239] [Second transfer film for forming an optical waveguide] The second transfer film for forming an optical waveguide of the present invention (hereinafter also simply referred to as "second transfer film") is a transfer film for forming an optical waveguide having a temporary support and a photosensitive composition layer, wherein the photosensitive composition layer does not have a hydroxyl group but has a carboxy group (compound A), and is substantially free of scatterers.

[0240] The second transfer film having the above configuration exhibits good affinity for alkaline developers during development due to the presence of carboxy groups derived from compound A, and therefore exhibits excellent pattern formability in alkaline developers. Furthermore, the photosensitive composition layer in the second transfer film is substantially free of scatterers that can cause optical transmission loss. As described below, the scatterers referred to here include dirt and dust introduced as contaminants into the photosensitive composition layer during the preparation of the transfer film, as well as aggregates derived from the components of the raw material composition of the photosensitive composition layer used to prepare the transfer film. Even the presence of even a small amount of scatterers in an optical waveguide for optical communication can interfere with wave propagation, resulting in significant optical loss. However, since the photosensitive composition layer in the second transfer film is substantially free of scatterers, low optical loss can be achieved. The pattern formed by transferring the photosensitive composition layer of the second transfer film to a transfer target does not contain hydroxyl groups, which have absorption in the wavelength range typically used in optical transmission (particularly at and around 1310 nm) and can cause high optical transmission loss (hydroxyl groups have vibrational absorption in the wavelength range of 1400 to 1700 nm, with the base of the absorption peak positioned at and around 1310 nm). This is also one of the factors that enable low optical transmission loss to be achieved.

[0241] Hereinafter, better alkaline developability and / or less optical transmission loss may be referred to as "better effects of the present invention."

[0242] The second transfer film will now be described.

[0243] In the second transfer film, the photosensitive composition layer is substantially free of scatterers. Here, "the photosensitive composition layer is substantially free of scatterers" means that, when the photosensitive composition layer is dissolved in a solvent to obtain a solution and the presence or absence of scatterers in the solution is visually confirmed, 5 or fewer scatterers are found per 100 mL of a solution with a solid content of 25% by mass. The number is preferably 3 or fewer, more preferably 0. Examples of the solvent include, when the photosensitive composition layer is a layer formed by a coating method, solvents used to dissolve the components (solids) constituting the photosensitive composition layer. Furthermore, the solution (coating liquid) for forming the photosensitive composition layer may be visually confirmed in an amount equivalent to the mass of 25 g of the photosensitive composition layer. It is sufficient to have 5 or fewer scatterers per observation area, preferably 3 or fewer, and more preferably 0.

[0244] Furthermore, when the photosensitive composition layer is not dissolved in the solvent, the photosensitive composition layer in the second transfer film may be observed with a 10x magnifying glass to count the number of scattering bodies. In this case, the observation range is set to a range equivalent to the mass of 25 g of the photosensitive composition layer. There may be 5 or less scattering bodies per observation range, preferably 3 or less scattering bodies, and more preferably 0 scattering bodies. The photosensitive composition layer in the transfer film may be observed with the above method relative to the film (cured film) after transfer to count the number of scattering bodies.

[0245] The term "scatterers" as used herein refers to dirt and dust that are brought into the photosensitive composition layer as contaminants during the production of the second transfer film, as well as aggregates derived from the components of the raw material composition of the photosensitive composition layer used in the production of the second transfer film, and refers to those that are ultimately present in the photosensitive composition layer in the second transfer film. If the second transfer film is substantially free of scatterers, the optical waveguide formed after transfer of the photosensitive composition layer in the second transfer film will have lower optical loss.

[0246] Specific methods for substantially preventing the inclusion of scatterers in the photosensitive composition layer of the second transfer film include, for example, a method of not using raw materials containing impurity components that can become scatterers such as aggregates and structures when forming the photosensitive composition layer of the second transfer film; a method of ensuring that each component is well soluble in the solvent when a solvent is used to form the photosensitive composition layer, and a method of selecting a combination of compounds that are easily compatible to suppress the occurrence of aggregates; and a method of filtering the coating liquid used to form the photosensitive composition layer to remove aggregates, dust, etc. that have been unintentionally mixed in.

[0247] [Configuration of the second transfer film] The configuration of the second transfer film is the same as that of the first transfer film except for the photosensitive composition layer. The preferred embodiments are also the same. Below, only the photosensitive composition layer provided in the second transfer film will be described.

[0248] <<Photosensitive Composition Layer>> The second transfer film has a photosensitive composition layer. The photosensitive composition layer contains a compound (compound A) that does not have a hydroxyl group and has a carboxy group. Furthermore, as described above, the photosensitive composition layer is substantially free of scatterers.

[0249] The photosensitive composition layer may be either a negative-type photosensitive composition layer or a positive-type photosensitive composition layer, but is preferably a negative-type photosensitive composition layer. Specific examples of the photosensitive composition layer include the photosensitive composition layers of the first and second embodiments shown below.

[0250] <Photosensitive Composition Layer of First Aspect> The photosensitive composition layer of the first aspect is a photosensitive composition layer containing a compound (compound A) that has no hydroxyl group and has a carboxy group and a polymerizable group, and a polymerization initiator. <Photosensitive Composition Layer of Second Aspect> The photosensitive composition layer of the second aspect is a photosensitive composition layer containing a compound (compound A) that has no hydroxyl group and has a carboxy group, a polymerizable compound, and a polymerization initiator.

[0251] In the photosensitive composition layer of the first embodiment, the compound (corresponding to compound A) that does not have a hydroxyl group and has a carboxy group and a polymerizable group is preferably a polymer. Furthermore, the photosensitive composition layer of the first embodiment may further contain a polymerizable compound in addition to compound A, or may be substantially free of a polymerizable compound. The phrase "the photosensitive composition layer is substantially free of a polymerizable compound" means that the content of the polymerizable compound is less than 0.1% by mass, preferably 0 to 0.05% by mass, and more preferably 0 to 0.01% by mass, relative to the total mass of the photosensitive composition layer.

[0252] In the photosensitive composition layer of the second embodiment, the compound having a carboxyl group but no hydroxyl group (corresponding to compound A) is preferably a polymer. The polymer may or may not have a polymerizable group.

[0253] <Components of Photosensitive Composition Layer> Each component contained in the photosensitive composition layer will be described in detail below.

[0254] (Compound A having no hydroxyl group and a carboxy group) The photosensitive composition layer contains a compound A having no hydroxyl group and a carboxy group. Compound A has the same meaning as the compound A having no hydroxyl group and a carboxy group contained in the photosensitive composition layer in the first transfer film, and preferred embodiments are also the same.

[0255] In the photosensitive composition layer, the lower limit of the content of compound A (when multiple types are contained, the total content) is preferably 1 mass % or more, more preferably 25 mass % or more, even more preferably 30 mass % or more, and particularly preferably 40 mass % or more, relative to the total mass of the photosensitive composition layer. The upper limit of the content of compound A is preferably 95 mass % or less, more preferably 90 mass % or less, even more preferably 85 mass % or less, particularly preferably 80 mass % or less, and most preferably 70 mass % or less, relative to the total mass of the photosensitive composition layer. Compound A may be used alone or in combination of two or more types.

[0256] (Polymerizable Compound) The photosensitive composition layer preferably contains a polymerizable compound. This polymerizable compound is a component different from the above-mentioned compound A. The polymerizable compound has the same meaning as the polymerizable compound contained in the photosensitive composition layer in the first transfer film, and preferred embodiments are also the same.

[0257] When the photosensitive composition layer contains a polymerizable compound, the content of the polymerizable compounds (when multiple types are contained, the total content of the polymerizable compounds) is preferably 3 to 70 mass %, more preferably 10 to 70 mass %, and particularly preferably 20 to 55 mass %, relative to the total mass of the photosensitive composition layer. When the photosensitive composition layer contains a polymerizable compound and a carboxy group-containing polymer, the mass ratio of the polymerizable compound to the carboxy group-containing polymer (mass of polymerizable compound / mass of carboxy group-containing polymer) is preferably 0.2 to 2.0, more preferably 0.6 to 1.5. The polymerizable compounds may be used alone or in combination of two or more types.

[0258] (Polymerization initiator) The photosensitive composition layer preferably contains a polymerization initiator (preferably a photopolymerization initiator). Examples of the polymerization initiator include the same as the polymerization initiator contained in the photosensitive composition layer in the first transfer film, and the preferred embodiments are also the same. When the photosensitive composition layer contains a polymerization initiator (preferably a photopolymerization initiator) (when multiple types are contained, the total content thereof), the content is preferably 0.1 to 15 mass %, more preferably 0.5 to 10 mass %, relative to the total mass of the photosensitive composition layer. The polymerization initiator may be used alone, or two or more types may be used.

[0259] (Surfactant) The photosensitive composition layer may contain a surfactant. Examples of the surfactant include the same surfactants as those contained in the photosensitive composition layer in the first transfer film, and preferred embodiments are also the same. The content of the surfactant (the total content when multiple types are contained) is preferably 0.0001 to 10 mass %, more preferably 0.001 to 5 mass %, and even more preferably 0.005 to 3 mass %, relative to the total mass of the photosensitive composition layer. The surfactant may be used alone, or two or more types may be used.

[0260] (Other Additives) The photosensitive composition layer may contain other additives as needed. Examples of additives include the same additives as those contained in the photosensitive composition layer in the first transfer film, and the preferred embodiments are also the same. In addition, an embodiment in which the photosensitive composition layer is substantially free of a phenothiazine-based compound, which is a polymerization inhibitor, is also preferred. Here, "substantially free of a phenothiazine-based compound" means that the content of the phenothiazine-based compound is less than 0.3% by mass, preferably less than 0.1% by mass, and more preferably less than 0.01% by mass, relative to the total mass of the photosensitive composition layer.

[0261] The photosensitive composition layer may contain impurities. Examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogens, and ions thereof. Among these, halide ions, sodium ions, and potassium ions are easily mixed in as impurities, so it is particularly preferable to set the contents to the following ranges.

[0262] The content of impurities in the photosensitive composition layer is preferably 80 ppm by mass or less, more preferably 10 ppm by mass or less, and even more preferably 2 ppm by mass or less, relative to the total mass of the photosensitive composition layer. The content of impurities in the photosensitive composition layer may be 1 ppb by mass or more, or 0.1 ppm by mass or more, relative to the total mass of the photosensitive composition layer.

[0263] Methods for keeping the impurity content within the above range include, for example, selecting raw materials for the photosensitive material that contain a small amount of impurities, preventing impurities from being mixed in when forming the photosensitive material, and removing them by washing. By using such methods, the amount of impurities can be kept within the above range.

[0264] Impurities can be quantified by known methods such as ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, and ion chromatography.

[0265] Furthermore, the content of compounds such as benzene, formaldehyde, trichloroethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N,N-dimethylformamide, N,N-dimethylacetamide, and hexane in the photosensitive composition layer is preferably low. The content of these compounds in the photosensitive composition layer is preferably 100 ppm by mass or less, more preferably 20 ppm by mass or less, and even more preferably 4 ppm by mass or less, relative to the total mass of the photosensitive composition layer. The lower limit of the content may be 10 ppb by mass or more, or 100 ppb by mass or more, relative to the total mass of the photosensitive composition layer. The content of these compounds can be reduced in the same manner as for the metal impurities described above. Furthermore, they can be quantified by known measurement methods.

[0266] The content of water in the photosensitive composition layer is preferably from 0.01 to 1.0% by mass, more preferably from 0.05 to 0.5% by mass, based on the total mass of the photosensitive composition layer, from the viewpoint of improving patterning properties.

[0267] <<Average Thickness of Photosensitive Composition Layer>> The average thickness of the photosensitive composition layer is preferably 1 to 50 μm, more preferably 2 to 10 μm, and even more preferably 2 to 5 μm.

[0268] [Method for manufacturing the second transfer film] The method for manufacturing the second transfer film is not particularly limited, and known manufacturing methods can be applied. As the method for manufacturing the second transfer film, the same method as the method for manufacturing the first transfer film described above can be mentioned. Specifically, it is preferable to form each layer of the thermoplastic resin layer, the intermediate layer, and the photosensitive composition layer, which can be arranged on the temporary support of the second transfer film, by a coating method.

[0269] In the second method for producing a transfer film, in order to ensure that the photosensitive composition layer in the transfer film is substantially free of scatterers, it is preferable to use, in forming the photosensitive composition layer, raw materials containing impurity components that can become scatterers such as aggregates and structures, to thoroughly dissolve each component in the solvent of the photosensitive composition (coating liquid) that forms the photosensitive composition layer, to select a combination of compounds that are easily compatible so as to suppress the generation of aggregates in the photosensitive composition, and / or to apply a method such as filtering the photosensitive composition to remove unintentionally mixed aggregates, dust, etc. The second method for producing a transfer film preferably includes, among other things, a step of filtering the photosensitive composition that forms the photosensitive composition layer to remove unintentionally mixed aggregates, dust, etc.

[0270] The pore size of the filter used for filtration is preferably 1 mm or less, more preferably 0.1 mm or less, even more preferably 0.01 mm or less, and particularly preferably 0.001 mm or less. The filter is preferably made of polytetrafluoroethylene, polyethylene, or nylon.

[0271] [Pattern Forming Method Using Second Transfer Film] An example of a pattern forming method using the second transfer film is shown below. Pattern formation using the second transfer film includes steps Z1 to Z4. Step Z1: A step of bringing the surface of the photosensitive composition layer in the second transfer film opposite to the temporary support side into contact with a substrate, and laminating the second transfer film and the substrate together. Step Z2: A step of exposing the photosensitive composition layer in a pattern (pattern exposure). Step Z3: A step of developing the exposed photosensitive composition layer using an alkaline developer. Step Z4: A step of peeling off the temporary support between steps Z1 and Z2, or between steps Z2 and Z3.

[0272] In the pattern formation method including steps Z1 to Z4, step Z1 involves bonding the photosensitive composition layer of the second transfer film to an arbitrary substrate to form a laminate comprising the substrate and the photosensitive composition layer disposed on the substrate. Next, when the photosensitive composition layer of the resulting laminate is subjected to an exposure step in step X2, a polymerization reaction of the polymerizable component proceeds in the exposed areas. In the subsequent development step in step X3, the unexposed areas of the photosensitive composition layer are dissolved and removed in an alkaline developer to form a negative-type patterned photosensitive composition layer (cured layer). In the pattern formation method including steps Z1 to Z4, if the second transfer film has a cover film, it is preferable to include a step of peeling the cover film from the second transfer film before performing step Z1. The method for peeling the cover film is not particularly limited, and known methods can be used.

[0273] The specific procedures of each step in the pattern formation method having steps Z1 to Z5 are the same as steps X1, X2, X3, and X5 described in the pattern formation method using the first transfer film, and the preferred embodiments are also the same.

[0274] [Laminate using second transfer film] Hereinafter, a laminate using a second transfer film (hereinafter also referred to as "second laminate") will be described. The second laminate has a substrate, a resin layer, and a second transfer film, and the photosensitive composition layer is disposed on the resin layer side. The configuration of the second laminate is the same as the configuration of the first laminate, except that the second transfer film is provided instead of the first transfer film, and the preferred embodiments are also the same.

[0275] In the second laminate, the resin layer may be a layer formed by the second transfer film, i.e., a photosensitive composition layer (cured layer) obtained by performing predetermined treatments (treatments of steps Z1 to Z4) using the second transfer film.

[0276] When the second laminate is used to form an optical waveguide, which will be described later, the resin layer in the second laminate needs to have a refractive index lower than that of the core portion formed in step 2. Therefore, in the second laminate used to form the optical waveguide, which will be described later, the refractive index of the resin layer is preferably lower than that of the cured product of the photosensitive composition layer.

[0277] [Method for manufacturing an optical waveguide using a second laminate] The method for manufacturing an optical waveguide using a second laminate includes the following steps 1 to 4. Step 1: A step of performing an exposure treatment (preferably pattern exposure) on the photosensitive composition layer in the second laminate. Step 2: A step of performing an alkali development treatment on the photosensitive composition layer that has been subjected to the exposure treatment to form a core portion. Step 3: A step of forming a resin layer having a lower refractive index than the core portion on the core portion so as to cover the core portion, thereby forming an optical waveguide having the core portion and a clad portion. Step 4: A step of peeling off the temporary support before step 1 or between steps 1 and 2.

[0278] The specific procedures of each step in the method for manufacturing an optical waveguide including steps 1 to 4 are the same as steps 1 to 4 described in the method for manufacturing an optical waveguide using the first laminate, and the preferred embodiments are also the same. The resin layer having a lower refractive index than the core portion (the second resin layer in FIG. 3 ) may be a layer formed from a second transfer film. That is, the resin layer having a lower refractive index than the core portion (the second resin layer in FIG. 3 ) may be a photosensitive composition layer (cured layer) obtained through a predetermined process (the process of steps Z1 to Z4) using the second transfer film.

[0279] The optical waveguide obtained by the method for manufacturing an optical waveguide using the second laminate can be used as an optical transmission line for an optical module. Examples of the optical module include an optical fiber-attached optical waveguide in which optical fibers are connected to both ends of the optical waveguide, a connector-attached optical waveguide in which connectors are connected to both ends of the optical waveguide, an opto-electrical composite board in which an optical waveguide is combined with a printed wiring board, an opto-electrical conversion module in which an optical waveguide is combined with an opto-electrical conversion element that converts optical signals into electrical signals and vice versa, and a wavelength multiplexer / demultiplexer in which an optical waveguide is combined with a wavelength division filter.

[0280] Furthermore, the optical waveguide formed by transferring the second transfer film does not contain hydroxyl groups, and in some embodiments, the amount of carboxylic acid is also reduced in the cured film, so it is less likely to absorb moisture, has low water absorption, and has the effect of reducing water-related absorption and deterioration of durability.

[0281] [Compound] The present invention also relates to a compound. The compound of the present invention is a compound represented by the above-mentioned formula (B1) and formulas (B1-1) to (B1-3), and preferred embodiments thereof are also as described above.

[0282] The present invention will be described in more detail below with reference to examples. The materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the examples shown below.

[0283] [Preparation of Photosensitive Composition] Photosensitive compositions were prepared based on the components and formulations shown in Table 1. The numerical values ​​listed in the column for each component in Table 1 represent the content (unit: parts by mass). The photosensitive composition was adjusted so that the solids concentration was 27% by mass. In preparing the photosensitive composition, the resin to be used as the binder polymer was dissolved in an organic solvent (a mixed solvent of propylene glycol monomethyl ether and methyl ethyl ketone (mass ratio: 43 / 57)). The photosensitive composition was prepared by mixing the above-mentioned binder polymer solution with the various components shown in Table 1. The binder polymer content shown in Table 1 represents the solids content of the binder polymer (excluding the solvent).

[0284] Table 1 (No. 1 to No. 13) is shown below.

[0285]

[0286]

[0287]

[0288]

[0289]

[0290]

[0291]

[0292]

[0293]

[0294]

[0295]

[0296]

[0297]

[0298] The various components shown in Table 1 will be explained below. [Binder Polymer] The binder polymers (polymers I to IV) shown in Table 1 are as follows. Polymers I and III correspond to compounds (compound A) that do not have a hydroxyl group but have a carboxy group. Polymer II and polymer IV do not correspond to compound A.

[0299] <Polymer I> An alkali-soluble resin having the following structure (weight average molecular weight (Mw): 15,000, dispersity (Mw / Mn): 2.2, acid value: 124 mg KOH / g). The numerical values ​​attached to the repeating units in the polymer indicate the content (% by mass) of the repeating units.

[0300]

[0301] <Polymer II> An alkali-soluble resin having the following structure (weight average molecular weight (Mw): 18,000): wherein the numerical value attached to the repeating unit in the polymer indicates the content (mass %) of the repeating unit.

[0302]

[0303] <Polymer III> Alkali-soluble resin having the following structure (weight average molecular weight (Mw): 37,000). The numerical values ​​attached to the repeating units in the polymer indicate the content (mass%) of the repeating units. Polymer III was prepared in accordance with Example Material 49 of WO 2016 / 031615.

[0304]

[0305] <Polymer IV> Alkali-soluble resin having the following structure (weight average molecular weight (Mw): 29,000). Note that the numerical values ​​attached to the repeating units in the polymer indicate the content (mass%) of the repeating units. Polymer IV was prepared in accordance with the description of Example Material 8 in WO 2016 / 031615.

[0306]

[0307] [Polymerizable Compounds] A-NOD-N: 1,9-nonanediol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) DPHA: dipentaerythritol hexaacrylate (manufactured by Toshin Yushi Co., Ltd.) TO-2349: Aronix TO-2349 (manufactured by Toagosei Co., Ltd.) OGSOL EA-F5710: fluorene group-containing bifunctional acrylate (manufactured by Osaka Gas Chemicals Co., Ltd.)

[0308] [Polymerization initiator] B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Kurogane Chemical Co., Ltd.) OXE-02: 1-(0-acetyloxime) (trade name: IRGACURE OXE-02, manufactured by BASF)

[0309] [Sensitizer] SB-PI 701: 4,4'-bis(diethylamino)benzophenone (Sanyo Trading Co., Ltd.)

[0310] [Chain transfer agent] N-phenylcarbamoylmethyl-N-carboxymethylaniline: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. LCV: Leuco Crystal Violet (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0311] [Rust inhibitor] CBT-1: Carboxybenzotriazole (manufactured by Johoku Chemical Industry Co., Ltd.)

[0312] [Surfactants] F-552: Megafac F-552 (fluorine-based surfactant, manufactured by DIC Corporation) EFS-521: MEGAFACE EFS-521 (non-fluorine-based surfactant, manufactured by DIC Corporation) Surfactants 1 to 14: compounds shown in Table 2 below

[0313]

[0314] The repeating units (A-1 to A-2, B-1 to B-11) shown in Table 2 are shown below.

[0315]

[0316]

[0317] [Polymerization inhibitor] TDP-G: phenothiazine (manufactured by Kawaguchi Chemical Industry Co., Ltd.) MEHQ: p-methoxyphenol (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.)

[0318] [Compound for reducing the amount of carboxy groups (compound B)] The following compounds were used as compounds for reducing the amount of carboxy groups (compound B): Duranate WT32-B75P: a thermally crosslinkable compound manufactured by Asahi Kasei Chemicals Corporation B1-1: a compound having the following structure (a synthetic product synthesized by the synthesis method shown later):

[0319]

[0320] B1-2: Compound having the following structure (synthetic product synthesized by the synthesis method shown below)

[0321] B1-3: Compound having the following structure (synthetic product synthesized by the synthesis method shown below)

[0322] (Synthesis of Compound B1-1) 4-hydroxyethyl methacrylate (60 g, 0.461 mol), 390 ml of ethyl acetate, and triethylamine (51.3 g, 0.5072 mol) were added to a three-neck flask equipped with a condenser, mixed, and then cooled to 5°C. While stirring the contents of the flask, methanesulfonic acid chloride (55.5 g, 0.4841 mol) was added dropwise over 30 minutes, and the mixture was allowed to react at room temperature for an additional hour. 300 mL of pure water was added, and the aqueous layer was removed by a separation operation. 30 mg of BHT (butylated hydroxytoluene) was then added to the organic layer. The ethyl acetate in the organic layer was distilled off under reduced pressure to obtain 90 g of compound (B1-1A) having the following structure.

[0323]

[0324] Next, 4-hydroxyquinoline (15 g, 0.1153 mol), B1-1A (27.7 g, 0.1268 mol), tetrabutylammonium bromide (3.72 g, 0.01153 mol), cesium carbonate (56.33 g, 0.1729 mol), 75 μL of nitrobenzene, and 150 mL of THF (tetrahydrofuran) were added to a three-neck flask equipped with a condenser, and the mixture was allowed to react for 1 hour with stirring at 70°C. After completion of the reaction, 180 mL each of ethyl acetate and pure water were added and thoroughly stirred. The aqueous layer was removed by a separation operation, and the organic layer was dried over magnesium sulfate. After removing the magnesium sulfate by filtration, the mixture was purified by silica gel column chromatography using hexane / ethyl acetate as a developing solvent, yielding 14.5 g of compound (B1-1).

[0325] (Synthesis of Compound B1-2) 4-Hydroxybutyl acrylate (50 g, 0.3468 mol), 325 ml of ethyl acetate, and triethylamine (38.6 g, 0.3815 mol) were added to a three-neck flask equipped with a condenser and mixed, followed by cooling to 5°C. While stirring the contents of the flask, methanesulfonic acid chloride (41.7 g, 0.3642 mol) was added dropwise over 30 minutes, and the mixture was then allowed to react at room temperature for an additional hour. 300 mL of pure water was added, and the aqueous layer was removed by a separation operation. 30 mg of BHT was then added to the organic layer. The ethyl acetate in the organic layer was distilled off under reduced pressure to obtain 72 g of compound (B1-2A) having the following structure.

[0326]

[0327] Next, 4-hydroxyquinoline (8 g, 0.0615 mol), B1-2A (15.6 g, 0.0676 mol), tetrabutylammonium bromide (1.98 g, 0.00615 mol), cesium carbonate (30.04 g, 0.0922 mol), 40 μL of nitrobenzene, and 80 mL of THF were added to a three-neck flask equipped with a condenser, and the mixture was allowed to react for 1 hour with stirring at 70°C. After completion of the reaction, 96 mL each of ethyl acetate and pure water were added and the mixture was thoroughly stirred. The aqueous layer was removed by a separation operation, and the organic layer was dried over magnesium sulfate. After removing the magnesium sulfate by filtration, the mixture was purified by silica gel column chromatography using hexane / ethyl acetate as a developing solvent, yielding 8.2 g of compound (B1-2).

[0328] (Synthesis of B1-3) 4-chloroquinoline (3 g, 0.0183 mol), p-styrylboronic acid (5.43 g, 0.0367 mol), 45 mL of 1,4-dioxane, and potassium carbonate (7.6 g, 0.055 mol) were added to a three-neck flask equipped with a condenser. While stirring under a nitrogen atmosphere, tetrakis(triphenylphosphine)palladium (0.64 g, 0.550 mmol) was added and the mixture was allowed to react at 90°C for 12 hours. After completion of the reaction, ethyl acetate and pure water were added and the mixture was thoroughly stirred. The aqueous layer was removed by a separation operation, and the organic layer was dried over magnesium sulfate. After removing the magnesium sulfate by filtration, the mixture was purified by silica gel column chromatography using hexane / ethyl acetate as a developing solvent, yielding 3.0 g of compound (B1-3).

[0329] [Preparation of composition for forming intermediate layer] A composition for forming an intermediate layer was prepared having the following composition: PVA 67.5 parts by mass PVP 31.5 parts by mass HPMC 1.0 part by mass Fluorine-based surfactant 0.1 part by mass Methanol 630 parts by weight Water 270 parts by mass

[0330] Details of each component of the composition for forming the intermediate layer are shown below. PVA (polyvinyl alcohol): Kuraray Poval PVA-205, manufactured by Kuraray Co., Ltd. PVP (polypyrrolidone): Polyvinylpyrrolidone K-30, manufactured by Nippon Shokubai Co., Ltd. HPMC (hydroxypropyl methylcellulose): Metrose 60SH-03, manufactured by Shin-Etsu Chemical Co., Ltd. Fluorosurfactant: Megafac F-444 (manufactured by DIC Corporation)

[0331] [Preparation of composition for thermoplastic resin layer] A composition for thermoplastic resin layer was prepared having the following composition: - Binder A (shown below) 8.47 parts by mass - 1-methoxy-2-propyl acetate 3.47 parts by mass - Binder B (shown below) 24.6 parts by mass - Plasticizer: 2,2-bis[4-(methacryloxypolyethoxy)phenyl]propane (manufactured by Shin-Nakamura Kogyo Co., Ltd.) 5.40 parts by mass - Surfactant 1: Megafac F-780-F (manufactured by Dainippon Ink and Chemicals, Inc.) 0.83 parts by weight - Methyl ethyl ketone 42.6 parts by mass - Methanol 13.5 parts by mass

[0332] Details of each component of the thermoplastic resin layer-forming composition are shown below. <Binder A> Aromatex FM601 (manufactured by Mitsui Chemicals, Inc., weight average molecular weight = 90,000, solid content concentration 21 mass %, methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer ((molar ratio = 55 / 11.7 / 4.5 / 28.2): 21 parts by mass, methyl ethyl ketone: 26 parts by mass, 1-methoxy-2-propyl acetate: 13 parts by mass, methanol: 40 parts by mass).

[0333] Binder B: Arosset 7055 (manufactured by Nippon Shokubai Co., Ltd., weight average molecular weight = 8,000, solids concentration 41 mass%, styrene / acrylic acid copolymer (molar ratio 63 / 37): 41 parts by mass, methyl ethyl ketone: 50 parts by mass, 1-methoxy-2-propyl acetate: 9 parts by mass)

[0334] [Preparation of Transfer Film] [Preparation of Transfer Film with Temporary Support / Intermediate Layer / Photosensitive Composition Layer / Protective Film Configuration] A transfer film having a temporary support, an intermediate layer, and a photosensitive composition layer in this order was prepared according to the following procedure. The specific preparation procedure is described below. An intermediate layer-forming composition was applied to a temporary support (a polyethylene terephthalate film having a thickness of 25 μm) using a bar coater to a thickness of 2.0 μm after drying, and then dried in an oven at 100°C to form an intermediate layer. Next, a photosensitive composition was applied to the intermediate layer using a bar coater to a thickness of 4.0 μm after drying, and then dried in an oven at 100°C to form a photosensitive composition layer (corresponding to photosensitive composition layer E1). A protective film (16 μm-thick polyethylene terephthalate, 16KS40, Toray Industries, Inc.) was pressure-bonded onto the photosensitive composition layer.

[0335] [Preparation of Transfer Film with Temporary Support / Thermoplastic Resin Layer / Intermediate Layer / Photosensitive Composition Layer / Protective Film Configuration] A transfer film having a temporary support, a thermoplastic resin layer, an intermediate layer, and a photosensitive composition layer in this order was prepared according to the following procedure. The specific preparation procedure is described below. A thermoplastic resin layer-forming composition was slot-die coated onto a temporary support (a polyethylene terephthalate film having a thickness of 25 μm) to form a coating, which was then dried at 100°C for 3 minutes to form a thermoplastic resin layer with a thickness of 5 μm. Next, an intermediate layer-forming composition was applied onto the thermoplastic resin layer using a bar coater to a thickness of 2.0 μm after drying, and then dried in an oven at 100°C to form an intermediate layer. Next, a photosensitive composition was applied onto the intermediate layer using a bar coater to a thickness of 4.0 μm after drying, and then dried in an oven at 100°C to form a photosensitive composition layer (corresponding to photosensitive composition layer E1). A protective film (16 μm thick polyethylene terephthalate, 16KS40, Toray Industries, Inc.) was pressed onto the photosensitive composition layer.

[0336] (Filtration Treatment) A portion of each composition used in the preparation of the above-described transfer film was subjected to filtration. Specifically, for Examples 1 to 7 and Comparative Examples 1 and 2 listed in Tables 3 and 4, filtration was not performed on the compositions (photosensitive composition, intermediate layer-forming composition, and thermoplastic resin layer-forming composition) constituting each composition layer of the transfer film. For Examples 8 to 82, the following filtration treatment was performed on the compositions (photosensitive composition, intermediate layer-forming composition, and thermoplastic resin layer-forming composition) constituting the composition layer of the transfer film. In addition, the following filtration treatment was also performed on compositions Y1 to Y17 and compositions B1 and B2 used in the subsequent step. <Filtration Treatment Method> Before application, syringe filtration was performed once using a Simple Pure™ syringe filter PTFE 0.5 μm manufactured by Membrane Solutions Limited.

[0337] [Pattern Preparation] [Laminate Preparation] The prepared transfer film was cut into 50 cm square pieces, and the protective film was then peeled off. The photosensitive composition layer of the transfer film was bonded to a glass substrate under conditions of a roller temperature of 100°C, a linear pressure of 0.6 MPa, and a linear speed of 1.0 m / min. The laminate obtained by bonding the transfer film to the glass substrate has a structure of "glass substrate / photosensitive composition layer / intermediate layer / temporary support" or a structure of "glass substrate / photosensitive composition layer / intermediate layer / thermoplastic layer / temporary support".

[0338] [Pattern Preparation] For the laminates marked "with peeling" in the "Temporary support peeling step before exposure" column in Tables 3 and 4, the temporary support was peeled from the laminate to expose the thermoplastic layer or intermediate layer (note that for the laminates marked "without peeling" in the "Temporary support peeling step before exposure" column, the temporary support was peeled from the laminate after the exposure treatment and before the development treatment). Next, a photomask was brought into close contact with the outermost layer of the laminate (the surface of the laminate opposite the glass substrate). The line and space pattern formed on the photomask was designed to have a line width of 2 to 4 μm and a space width of 125 μm. The photosensitive composition layer was irradiated with light using a high-pressure mercury lamp exposure machine (MAP-1200L, Japan Science Research Institute, dominant wavelength: 365 nm). During exposure, the exposure dose was adjusted so that the line width of the pattern corresponding to the 2 to 4 μm lines formed on the photomask was 2 to 4 μm.

[0339] Next, the exposed laminate was subjected to an alkaline development treatment using a 1.0% aqueous sodium carbonate solution (pH 11.8) at 30°C as a developer, to form a pattern. Specifically, a shower treatment was performed using the developer for 90 seconds, and then an air knife treatment was performed to remove the developer. Furthermore, a shower treatment was performed using pure water for 30 seconds, and then an air knife treatment was performed. Note that for laminates marked "No peeling" in the "Pre-exposure temporary support peeling step" column, the temporary support was peeled from the laminate after the exposure treatment, and the laminate after the temporary support peeling was subjected to a development treatment.

[0340] Next, the laminate that had been subjected to the AirKnife treatment was subjected to a treatment to reduce the amount of carboxy groups according to the procedure described in the "Carboxy Group Reduction Step" in Tables 3 and 4. Even when the photosensitive composition did not contain a compound that reduces the amount of carboxy groups (compound B), the above treatment was performed as long as described in the tables. More specifically, a xenon lamp was used to apply 2 J / cm as shown in Tables 3 and 4. ２ or 0.65 J / cm ２ After the exposure treatment with the exposure amount of 1000 ppm, the laminate was subjected to a heat treatment in an oven at 150° C. for 30 minutes.

[0341] [Various Measurements and Evaluations] [Carboxy Group Content] (Remaining Amount of Carboxy Groups (Ratio to Initial Content, IR Measurement)) Each of the photosensitive compositions prepared above was applied onto a silicon wafer using a bar coater to a thickness of 4.0 μm after drying, and then dried at 100° C. using an oven to form a photosensitive composition layer (hereinafter, the photosensitive composition layer formed at this stage will also be referred to as an "uncured photosensitive composition layer"). Next, the entire surface of the photosensitive composition layer was irradiated with light using a high-pressure mercury lamp exposure machine (MAP-1200L, Japan Science Research Institute, Inc., dominant wavelength: 365 nm) at the same exposure dose as during pattern formation. Thereafter, a predetermined carboxy group reduction treatment (exposure treatment described below was performed, followed by a heat treatment described below) was performed. <<Exposure Conditions>> Using a xenon lamp, 2 J / cm ２ or 0.65 J / cm ２ (See Tables 3 and 4. The same exposure amount as the conditions for the carboxy group reducing treatment during pattern formation.) <Heat Treatment Conditions> The photosensitive composition layer was heat-treated using an oven at 150°C for 30 minutes.

[0342] The IR spectrum of the uncured photosensitive composition layer and the photosensitive composition layer after the predetermined carboxyl group reduction treatment was measured, and the peak of the C═O stretching of the carboxyl group (1710 cm －１The residual carboxyl group ratio [(amount of carboxyl groups in the photosensitive composition layer after the specified carboxyl group reduction treatment / amount of carboxyl groups in the uncured photosensitive composition layer) x 100 (mol %)] was calculated for each peak (peak). A lower residual carboxyl group amount indicates a more advanced decarboxylation reaction. The results are shown in the "Remaining carboxyl group amount A (ratio to initial value (unit: mol %))" column in Tables 3 and 4.

[0343] (Evaluation of Carboxy Group Residual Amount (Ashing Measurement)) Each of the photosensitive compositions prepared above was applied onto a silicon wafer using a bar coater to a thickness of 4.0 μm after drying, and then dried at 100° C. in an oven to form a photosensitive composition layer. Next, the entire surface of the photosensitive composition layer was irradiated with light using a high-pressure mercury lamp exposure machine (MAP-1200L, Japan Science Research Institute, dominant wavelength: 365 nm) at the same exposure dose as during pattern formation. Thereafter, a predetermined carboxy group reduction treatment (exposure treatment shown in the upper part was performed, followed by a heat treatment shown in the upper part) was performed. Approximately 20 mg in total of the photosensitive composition layer that had been subjected to the predetermined carboxy group reduction treatment was scraped off and freeze-pulverized, and then 150 μL of NMP (N-methyl-2-pyrrolidone) was added, followed by pulverization with lithium carbonate (Li ２ CO ３ The particles were stirred for 6 days in an aqueous solution (1.2 g / 100 mL, prepared by dissolving lithium carbonate in ultrapure water and then filtering). After stirring, the particles were sedimented by ultracentrifugation (140,000 rpm x 30 min), and the supernatant was replaced with ultrapure water (replacement was repeated five times). The resulting precipitate was then dried to obtain an analytical sample (n = 2 samples prepared). This analytical sample was analyzed using an ICP-OES (Optima 7300DV, manufactured by PerkinElmer). The above-mentioned ICP-OES measurement was carried out according to the following procedure. Approximately 1.5 mg to 2 mg of the analytical sample was weighed (n = 3), and 60% HNO ３After adding 5 mL of aqueous solution, the mixture was subjected to MW Teflon (registered trademark) ashing (microwave sample decomposition apparatus UltraWAVE max: 260°C). After ashing, ultrapure water was added to make 50 mL, and the amount of Li was quantified using an ICP-OES (PerkinElmer Optima 7300DV) by the absolute calibration curve method. The amount of carboxyl groups was calculated by converting the obtained Li amount. However, this method has a detection limit. When the carboxyl group content is 1.05 mmol / g or less, 90% or more of Li substitution is possible. For ranges above this, a calibration curve was prepared using a crosslinked polymer with a known acid value, and calculations were performed. The amount of carboxyl groups remaining (mass %) relative to the total mass of the photosensitive composition layer (cured layer) that had been subjected to the specified carboxyl group reduction treatment was calculated using the carboxyl groups obtained by the above measurement. The results are shown in the "Carboxy Group Residual Amount B (unit: mass %)" column in Tables 3 and 4.

[0344] [Measurement of refractive index] The refractive index (1310 nm wavelength) of the photosensitive composition layer (cured layer) of the transfer film of Examples 8 to 82 was determined by the following procedure. A photosensitive composition layer was laminated to a thickness of 100 μm. Next, the 100 μm thick photosensitive composition layer was subjected to the predetermined carboxy group reduction treatment using the same procedure (exposure, development, predetermined carboxy group reduction treatment) as in the pattern formation method described in the upper section. The refractive index at a wavelength of 1310 nm of the resulting photosensitive composition layer (cured layer) that had been subjected to the carboxy group reduction treatment was determined by ellipsometry.

[0345] [Presence or absence of scattering bodies in the photosensitive composition layer] The presence or absence of scattering bodies in the photosensitive composition layer of each transfer film in Examples 1 to 82 and Comparative Examples 1 and 2 was measured. Specifically, the photosensitive composition layer of each transfer film was mixed with a mixed solvent of propylene glycol monomethyl ether and methyl ethyl ketone (mass ratio: 43 / 57) to prepare a solution with a solids concentration of 25 mass %. The prepared solution was then visually observed to count the number of scattering bodies per 100 mL.

[0346] In Examples 1 to 7 and Comparative Examples 1 and 2, no filtration was performed, and therefore the number of scattering bodies per 100 mL of a solution with a solid content of 25% by mass was more than 5. On the other hand, in Examples 8 to 82, the number of scattering bodies per 100 mL of a solution with a solid content of 25% by mass was 5 or less. In other words, it was confirmed that the transfer films of Examples 8 to 82 were substantially free of scattering bodies.

[0347] [Optical Loss] A photosensitive composition layer was laminated to a thickness of 100 μm. Next, the 100 μm thick photosensitive composition layer was subjected to the predetermined carboxy group reduction treatment using the same procedure (exposure, development, predetermined carboxy group reduction treatment) as the pattern formation method described in the upper part. The transmittance (%) and reflectance (%) of the obtained photosensitive composition layer (cured layer) subjected to the carboxy group reduction treatment were measured using a spectrophotometer equipped with an integrating sphere, and the absorbance (%) was calculated by subtracting the values ​​of transmittance (%) and reflectance (%) from 100%. Next, the optical loss (dB / cm) at a wavelength of 1310 nm was calculated based on the following formula (OP1). Formula (OP1): Optical loss (dB / cm) = -10 × log １０ (Absorptivity (%) / 100) / film thickness The results are shown in Tables 3 and 4. The smaller the optical loss, the lower the optical transmission loss of the optical waveguide that can be formed.

[0348] [Maximum Resolution] The minimum line width of the pattern formed without development residue or collapse was adopted as the minimum resolution line width. The results are shown in Tables 3 and 4.

[0349] [Step-conforming ability] Each transfer film of the Examples and Comparative Examples, from which the protective film had been peeled off, was transferred onto a glass substrate on which a pattern of rectangular convex portions measuring 1 μm in length, 1 μm in width, and 1 μm in height was arranged. The laminate after transfer was observed under an optical microscope to evaluate step-conforming ability. The fewer voids observed, the better the step-conforming ability. The results are shown in Tables 3 and 4. 1: No voids were observed around the rectangular convex portion pattern. 2: Voids were observed around the rectangular convex portion pattern.

[0350] Tables 3 and 4 (parts 1 to 8) are shown below. In Tables 3 and 4, Examples 1 to 7 correspond to the first transfer film described above. Also, Examples 8, 10, 12, 14, 31 to 46, 63 to 78, 81, and 82 correspond to both the first transfer film and the second transfer film described above. Also, Examples 9, 11, 13, 15 to 30, 47 to 62, 79, and 80 correspond to the second transfer film described above.

[0351]

[0352]

[0353]

[0354]

[0355]

[0356]

[0357]

[0358]

[0359]

[0360] The results in Tables 3 and 4 clearly show that the transfer films of the examples are alkali-developable and capable of forming optical waveguides capable of achieving low optical transmission loss. Furthermore, it was confirmed that when the transfer film includes a thermoplastic resin layer, the step conformability is superior. Furthermore, it was confirmed that when the transfer film includes an intermediate layer, the resolution is superior. Furthermore, it was confirmed that when the carboxyl group content in the cured layer formed by the photosensitive composition layer of the transfer film is 3.0 mass% or less (preferably 2.5 mass% or less) relative to the total mass of the cured layer, the optical transmission loss is further reduced (particularly in comparison with Examples 1 to 7). On the other hand, it is clear that the transfer films of the comparative examples do not achieve the expected effect. Furthermore, the results of Examples 8, 10, 12, 14, 31 to 46, and 63 to 82 clearly show that when the photosensitive composition layer in the transfer film is substantially free of scatterers and contains a compound (compound B) that reduces the amount of carboxyl groups, an optical waveguide with even lower optical loss can be formed. Furthermore, comparisons between Example 15 and Example 79, between Example 16 and Example 80, between Example 31 and Example 81, and between Example 32 and Example 82 reveal that an optical waveguide with even lower optical loss can be formed by selecting additives such as a polymerization initiator, a polymerization inhibitor, and / or a chain transfer agent.

[0361] [Production of Optical Waveguide] [Production of Optical Waveguide (1)] (Formation of Lower Cladding Portion) The transfer film of Example 10 was cut to a predetermined size and angle, and then the protective film was peeled off. Next, the protective film of the transfer film was peeled off and the exposed surface (the surface on the photosensitive composition layer side) was attached to a glass substrate to obtain a laminate A. The temporary support was peeled off from the obtained laminate A, and a photomask having a predetermined opening was closely attached to the surface of the laminate A exposed by peeling off the temporary support, and the photosensitive composition layer was irradiated with light using a high-pressure mercury lamp exposure machine (MAP-1200L, Japan Science Research Institute, dominant wavelength: 365 nm). Next, the exposed laminate A was subjected to an alkali development treatment and a washing treatment with pure water to form a pattern on the glass substrate. Next, the obtained pattern was exposed using a xenon lamp at 2 J / cm ２After that, a heat treatment was performed using an oven at 150° C. for 30 minutes. In this way, a laminate B having a first resin layer (resin pattern; lower clad portion) on a glass substrate was produced.

[0362] (Formation of Core Portion) Except for the film thickness being 4 microns, the transfer film of Example 1 was cut to a predetermined size and angle, and then the protective film was peeled off. Next, the protective film of the transfer film was peeled off and the exposed surface (the surface on the photosensitive composition layer side) was bonded to the surface on the first resin layer side of the laminate B prepared above to obtain a laminate C. The temporary support was peeled off from the obtained laminate C, and a photomask having a predetermined opening was closely attached to the surface exposed by peeling off the temporary support of the laminate C, and the photosensitive composition layer was irradiated with light using a high-pressure mercury lamp exposure machine (MAP-1200L, Japan Science Research Institute, dominant wavelength: 365 nm). Next, the exposed laminate C was subjected to an alkali development treatment and a washing treatment with pure water to form a pattern with a line width of 4 microns on the first resin layer. Next, the obtained pattern was subjected to 2 J / cm using a xenon lamp. ２ After that, a heat treatment was performed using an oven at 150° C. for 30 minutes. In this way, a laminate D having a first resin layer (lower clad portion) and a core portion on a glass substrate was produced.

[0363] (Formation of upper cladding portion) Except for the film thickness being 15 microns, the transfer film of Example 10 was cut to a predetermined size and angle, and then the protective film was peeled off. Next, the surface of the transfer film exposed by peeling off the protective film (the surface on the photosensitive composition layer side) and the core portion of the laminate D were bonded so that the transfer film covered the core portion of the laminate D, thereby obtaining a laminate E. The temporary support was peeled off from the obtained laminate E, and a photomask having a predetermined opening was closely attached to the surface of the laminate E exposed by peeling off the temporary support, and the photosensitive composition layer was irradiated with light using a high-pressure mercury lamp exposure machine (MAP-1200L, Japan Science Research Institute, dominant wavelength: 365 nm). Next, the exposed laminate E was subjected to an alkali development treatment and a washing treatment with pure water to form a pattern on the glass substrate. Next, the obtained pattern was subjected to 2 J / cm using a xenon lamp. ２After that, the film was heated in an oven at 150°C for 30 minutes. In this way, an optical waveguide having a core and a clad was fabricated. The obtained optical waveguide exhibited good optical guiding properties.

[0364] [Production of Optical Waveguide (2)] Optical waveguides were produced in the same manner as in Production of Optical Waveguide (1), except that the transfer film of Example 1 was changed to the transfer films of Examples 2, 3, 5 to 9, and 12 to 46. The obtained optical waveguides exhibited good optical waveguiding properties.

[0365] [Production of Optical Waveguide (3)] Optical waveguides were produced in the same manner as in Production of Optical Waveguide (1), except that the transfer film of Example 10 was changed to the transfer films of Examples 11, 47 to 82. The obtained optical waveguides exhibited good optical waveguiding properties.

[0366] [Production of Optical Waveguides (4)] Optical waveguides were produced in the same manner as in Production of Optical Waveguides (3), except that the transfer film of Example 1 was changed to the transfer films of Examples 2, 3, 5 to 9, and 12 to 46. The obtained optical waveguides exhibited good optical waveguiding properties.

[0367] [Production of Optical Waveguide (5)] Optical waveguides were produced in the same manner as in Production of Optical Waveguide (1), except that the transfer film of Example 10 was changed to any of transfer films Y1 to Y17 shown in Table 5 below, or transfer films B1 and B2 shown in Table 6 below. The obtained optical waveguides exhibited good optical waveguiding properties.

[0368] <Transfer film Y1> Transfer film Y1 was obtained in the same manner as the manufacturing method of the transfer film of Example 10 (with intermediate layer, without thermoplastic resin layer, filtered), except that composition Y1 in Table 5 was used. No scattering bodies were found in the photosensitive composition layer in transfer film Y1. In addition, the same measurements as in Example 10 were carried out on transfer film Y1. The measurement results are shown in Table 5. The refractive index at a wavelength of 1310 nm of the photosensitive composition after curing of transfer film Y1 was 1.51. The method for measuring the refractive index was as described above.

[0369] <Transfer Films Y2 to Y17> Transfer films Y2 to Y17 were obtained in the same manner as the production method of transfer film Y1 (with intermediate layer, without thermoplastic resin layer, filtered), except for changing the surfactant to that in Table 1. No scattering bodies were found in the photosensitive composition layer of transfer films Y2 to Y17. Furthermore, the same measurements as in Example 10 were carried out on transfer films Y2 to Y17. The measurement results are shown in Table 5. The refractive index at a wavelength of 1310 nm of the photosensitive composition after curing of transfer films Y2 to Y17 was 1.51. The method for measuring the refractive index was as described above.

[0370] <Transfer Film B1> Transfer film B1 was obtained in the same manner as the transfer film of Example 10 (with intermediate layer, without thermoplastic resin layer, filtered), except that composition B1 in Table 6 was used. No scattering bodies were found in the photosensitive composition layer of transfer film B1. The same measurements as in Example 10 were also carried out on transfer film B1. The measurement results are shown in Table 6. The refractive index of the photosensitive composition after curing of transfer film B1 at a wavelength of 1310 nm was 1.50. The method for measuring the refractive index was as described above. The photosensitive composition B1 used to prepare transfer film B1 was generally the same as photosensitive composition Y2, except that the added components such as the polymerization initiator, polymerization inhibitor, and / or chain transfer agent were changed.

[0371] <Transfer Film B2> Transfer film B1 was obtained in the same manner as the transfer film of Example 10 (with intermediate layer, without thermoplastic resin layer, filtered), except that composition B2 in Table 6 was used. No scattering bodies were found in the photosensitive composition layer of transfer film B1. The same measurements as in Example 10 were also carried out on transfer film B1. The measurement results are shown in Table 6. The refractive index of the photosensitive composition after curing of transfer film B1 at a wavelength of 1310 nm was 1.50. The method for measuring the refractive index was as described above. The photosensitive composition B2 used to prepare transfer film B2 was generally the same as photosensitive composition Y3, except that the added components such as the polymerization initiator, polymerization inhibitor, and / or chain transfer agent were changed.

[0372]

[0373]

[0374] [Production of Optical Waveguide (6)] Optical waveguides were produced in the same manner as in Production of Optical Waveguide (5), except that the transfer film of Example 1 was changed to the transfer films of Examples 2, 3, 5 to 9, and 12 to 46. The obtained optical waveguides exhibited good optical waveguiding properties.

[0375] REFERENCE SIGNS LIST 10 Transfer film 12 Temporary support 14 Thermoplastic resin layer 16 Intermediate layer 18 Photosensitive composition layer 20 Cover film 30 Laminate 22 Substrate 24 Resin layer 24 32 First resin layer 34 Core portion 36 Second resin layer 40 Optical waveguide

Claims

1. A transfer film for forming an optical waveguide, comprising a temporary support and a photosensitive composition layer, wherein the photosensitive composition layer contains a compound having a carboxy group but no hydroxyl group, and a compound that reduces the amount of the carboxy group, or the photosensitive composition layer contains the compound having a carboxy group but no hydroxyl group, and is substantially free of scatterers.

2. The transfer film for forming an optical waveguide according to claim 1, further comprising a thermoplastic resin layer between the temporary support and the photosensitive composition layer.

3. The transfer film for forming an optical waveguide according to claim 1, further comprising an intermediate layer between the temporary support and the photosensitive composition layer.

4. The transfer film for forming an optical waveguide according to claim 1, wherein the compound having no hydroxyl group but a carboxy group is a polymer.

5. The transfer film for forming an optical waveguide according to claim 1, wherein the compound that reduces the amount of carboxy groups is an isocyanate compound.

6. A transfer film for forming an optical waveguide as described in claim 1, wherein the compound that reduces the amount of carboxy groups is a compound that, upon exposure, causes a decarboxylation reaction of carboxy groups derived from the compound that does not have a hydroxyl group but has a carboxy group.

7. A transfer film for forming an optical waveguide according to claim 6, wherein the compound that reduces the amount of carboxy groups is one or more compounds selected from the group consisting of quinoline compounds, isoquinoline compounds, and quinoxaline compounds.

8. The transfer film for forming an optical waveguide according to claim 7, wherein the quinoline compound, the isoquinoline compound, and the quinoxaline compound each have at least one radically polymerizable group.

9. The transfer film for forming an optical waveguide according to claim 8, wherein the radical polymerizable group is selected from the group consisting of a styryl group, an acryloyl group, and a methacryloyl group.

10. The transfer film for forming an optical waveguide according to claim 7, wherein the compound that reduces the amount of carboxy groups is a quinoline compound.

11. A transfer film for forming an optical waveguide according to claim 1, wherein the compound having a carboxy group and no hydroxyl group is a polymer, and the compound that reduces the amount of carboxy groups is a compound that, upon exposure, causes a decarboxylation reaction of the carboxy group derived from the compound having a carboxy group and no hydroxyl group, and is one or more compounds selected from the group consisting of quinoline compounds, isoquinoline compounds, and quinoxaline compounds.

12. The transfer film for forming an optical waveguide according to claim 11, wherein the quinoline compound, the isoquinoline compound, and the quinoxaline compound each have at least one radically polymerizable group.

13. The transfer film for forming an optical waveguide according to claim 12, wherein the radical polymerizable group is selected from the group consisting of a styryl group, an acryloyl group, and a methacryloyl group.

14. A laminate having a substrate, a resin layer, and the transfer film for forming an optical waveguide according to any one of claims 1 to 13, wherein the photosensitive composition layer of the transfer film for forming an optical waveguide is disposed on the resin layer side.

15. The laminate according to claim 14, wherein the refractive index of the resin layer is lower than the refractive index of the cured layer of the photosensitive composition layer.

16. A method for manufacturing an optical waveguide, comprising: step 1 of exposing the photosensitive composition layer in the laminate described in claim 15; step 2 of performing an alkali development treatment on the exposed photosensitive composition layer to form a core portion; and step 3 of forming a resin layer having a lower refractive index than the core portion on the core portion so as to cover the core portion, thereby forming an optical waveguide having the core portion and a clad portion; and step 4 of peeling off the temporary support before step 1 or between steps 1 and 2; and step 5 of performing a treatment to reduce the amount of carboxy groups between steps 2 and 3 or after step 3, or the amount of carboxy groups is reduced in step 1.

17. The method for producing an optical waveguide according to claim 16, wherein the content of carboxy groups in the core portion that has been treated to reduce the amount of carboxy groups in step 5 is 0.01 to 3.0 mass % relative to the total mass of the core portion.

18. A method for producing an optical waveguide according to claim 16, wherein the content of carboxy groups in the core portion in which the amount of carboxy groups has been reduced in step 1 is 0.01 to 3.0 mass % relative to the total mass of the core portion.

19. A compound represented by the following formula (B1): In the ceremony, L １ is an oxygen atom or CH ２ n1 represents 0 or 1. ２ represents a single bond, a linear, branched, or cyclic (n2+1)-valent aliphatic hydrocarbon group having 1 to 10 carbon atoms, which may have a substituent and at least one methylene group may be substituted with an oxygen atom, or an (n2+1)-valent aromatic hydrocarbon group, which may have a substituent. n2 represents an integer from 1 to 3. P represents a styryl group, an acryloyl group, or a methacryloyl group. When there are multiple Ps, the multiple Ps may be the same or different from one another. When n1 represents 0, -(L １ The moiety represented by n1- represents a single bond.

20. A compound represented by the following formula (B1-1):

21. A compound represented by the following formula (B1-2):

22. A compound represented by the following formula (B1-3):

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