Method for producing multiple pcbs

Abstract

A method for producing multiple PCBs according to an embodiment of the present invention is a method for producing multiple PCBs on which components are mounted by using a plurality of pieces of equipment, the method comprising the steps of: selecting a PCB type to be preferentially produced from among various types of PCBs planned to be produced; calculating a board importance value of the various types of PCBs by assigning a weight to the PCB type to be preferentially produced; calculating a board similarity value based on the ratio of common components between a plurality of different boards; and moving and allocating the common components between different pieces of equipment by reflecting the board importance value and the board similarity value.

Description

Multi-PCB production method

[0001] Embodiments of the present invention relate to a method for producing multiple PCBs.

[0002] Multi-product manufacturing involves a wide variety of products and small volumes of each. To efficiently produce a variety of PCBs, manufacturers prefer to use a multi-PCB production process, where multiple PCBs are produced simultaneously, rather than producing each PCB individually.

[0003] As the number of customers producing multiple types of PCBs increases, the convenience of customization capabilities for multi-PCB production is also becoming increasingly important. In other words, it is necessary to secure priority production capabilities for the PCBs customers desire to meet their needs.

[0004] In general, when there is a PCB among multiple PCBs for which production performance is to be prioritized, the desired production performance of the PCB is secured through a somewhat manual method of establishing an optimized production plan for a single PCB, then loading the feeder layout data for the single PCB, arranging the feeders, and then establishing a re-optimized production plan with other PCBs.

[0005] However, in order to achieve favorable production performance results for some PCBs that require a large production quantity or a large number of mounting points in a multi-PCB production process and thus require a long production time, there are many things to consider when establishing a production plan, so manual planning requires considerable effort.

[0006] Furthermore, manually achieving favorable production performance results for some PCBs can lead to overuse of feeders in some areas, making optimal feeder placement difficult. Furthermore, the lack of a process to consider the common component ratio for each PCB and similarity between PCBs can degrade overall production performance.

[0007] According to one aspect of the present invention, a main object is to provide a method for producing multiple PCBs that optimizes productivity by giving priority to a selected PCB among multiple PCBs.

[0008] However, these tasks are exemplary, and the tasks to be solved by the present invention are not limited thereto.

[0009] A method for producing multiple PCBs according to one embodiment of the present invention comprises a step of selecting a type of PCB to be produced preferentially among several types of PCBs for which a production plan is in progress; a step of calculating board importance values ​​of several types of PCBs by assigning weights to the types of PCBs to be produced preferentially; a step of calculating a board similarity value based on a ratio of common components between a plurality of different boards; and a step of moving and allocating the common components between different pieces of equipment by reflecting the board importance value and the board similarity value.

[0010] The step of calculating the board importance value of the various types of PCBs by assigning weights to the types of PCBs to be produced with priority may include the step of calculating a scale value normalized by min-max scaling for the PCB production quantity value for each of the various types of PCBs; the step of calculating a score for each type of PCB by multiplying the weighted value for the type of PCB to be produced with priority and the general value for types of PCBs other than the type of PCB to be produced with priority for the scale value for the various types of PCBs; and the step of calculating the board importance value for each type of PCB through the ratio of the scores for each type of PCB.

[0011] The above scale values ​​are,

[0012]

[0013] It could be.

[0014] The above minimum board quantity value may be 0.

[0015] If the above input board quantity is not entered, the above input board quantity is entered as 1 and the above scale value can be calculated.

[0016] The step of moving and allocating the common components between different equipment by reflecting the board importance value and the board similarity value may include comparing a first LOB additional correction value in which the board importance value and the board similarity value are reflected in a first LOB correction value of a first PCB type with a second LOB correction value of a second PCB type, and if the first LOB additional correction value of the first PCB type is greater than the second LOB correction value of the second PCB type, common components of the first PCB type and the second PCB type may be moved between equipment and allocated to multiple equipment.

[0017] The step of moving and allocating the common components between different equipment by reflecting the board importance value and the board similarity value may include the step of calculating a 1-1 LOB compensation value by multiplying a 1 LOB compensation value of the 1st PCB type and a board similarity value of the 1st PCB type and the 2nd PCB type; the step of calculating a 1-2 LOB compensation value by multiplying the 1-1 LOB compensation value and a board importance difference value of the 1st PCB type and the 2nd PCB type; the step of comparing the 1-2 LOB compensation value of the 1st PCB type with the 2 LOB compensation value of the 2nd PCB type; and the step of moving and allocating the common components between the 1st PCB type and the 2nd PCB type between equipment when the 1-2 LOB compensation value of the 1st PCB type is greater than the 2 LOB compensation value of the 2nd PCB type.

[0018] The difference value of the board importance between the first PCB type and the second PCB type may be a value obtained by subtracting a smaller value from a larger value among the board importance values ​​of the first PCB type and the second PCB type.

[0019] The first LOB correction value may be a value obtained by subtracting the LOB value of the first PCB type from 1, and the second LOB correction value may be a value obtained by subtracting the LOB value of the second PCB type from 1.

[0020] Among the various types of PCBs for which the above production plan is in place, at the stage where the type of PCB to be produced first is selected, multiple types of PCBs to be produced first are selected, and the multiple types can be selected in order of priority.

[0021] Considering the production quantity of each type of board among the above multiple PCB types, weights for the above multiple PCB types can be given differently according to priority.

[0022] The method for producing the above multiple PCBs can produce multiple PCBs in multiple production lines.

[0023] Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

[0024] According to one embodiment of the present invention, a method for producing multiple PCBs discloses an optimization algorithm that reflects board importance values ​​and board similarity values ​​so that a selected PCB among multiple PCBs is produced with priority.

[0025] According to the above optimization algorithm, whether common components of PCBs can be moved is determined, and common components determined to be movable are allocated to each piece of equipment or to each gantry within the equipment and mounted on the PCB, thereby optimizing the productivity of the PCB selected by the user in a multi-PCB production device.

[0026] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0027] Figure 1 is a conceptual diagram illustrating a component mounting process through multiple pieces of equipment in a production line according to one embodiment of the present invention.

[0028] Figure 2 is a conceptual diagram illustrating a component mounting process through a gantry of one piece of equipment according to one embodiment of the present invention.

[0029] FIG. 3 is a flowchart of a multi-PCB production method according to one embodiment of the present invention.

[0030] FIG. 4 is a display diagram showing an example in which a type of PCB to be preferentially produced is selected according to one embodiment of the present invention.

[0031] FIG. 5 is a flowchart showing detailed steps of a step of calculating board importance values ​​of various types of PCBs by assigning weights to the types of PCBs to be preferentially produced according to one embodiment of the present invention.

[0032] FIG. 6(a) and FIG. 6(b) are tables exemplarily showing a process for calculating board importance values ​​of PCBs according to one embodiment of the present invention.

[0033] FIG. 7 is a diagram exemplarily showing a grouping into the same band when the board similarity is above a certain value according to one embodiment of the present invention.

[0034] FIG. 8 is a drawing exemplarily showing how to move and allocate common components between different pieces of equipment according to one embodiment of the present invention.

[0035] FIG. 9 is a flowchart showing detailed steps of a step of moving and allocating common components between different pieces of equipment according to one embodiment of the present invention.

[0036] Fig. 10(a) is a table exemplarily showing board importance values ​​by PCB type according to one embodiment of the present invention. Fig. 10(b) is a table exemplarily showing the difference between PCB and board importance values ​​to be preferentially produced in a common component-containing board according to one embodiment of the present invention. Fig. 10(c) is a table exemplarily determining whether common components can be moved by comparing LOB compensation values ​​by PCB.

[0037] The present invention is susceptible to various modifications and embodiments. Specific embodiments are illustrated in the drawings and described in detail in the description. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention. In describing the present invention, identical components are identified by the same reference numerals even when illustrated in different embodiments.

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals and redundant descriptions thereof will be omitted.

[0039] In the examples below, the terms first, second, etc. are not used in a limiting sense, but are used for the purpose of distinguishing one component from another.

[0040] In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0041] In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not preclude the possibility that one or more other features or components may be added.

[0042] For convenience of explanation, the sizes of components in the drawings may be exaggerated or reduced. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily indicated for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0043] In some embodiments, where implementations are otherwise feasible, specific process sequences may be performed in a different order than described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the described order.

[0044] The terminology used in this application is only used to describe specific embodiments and is not intended to limit the present invention. In this application, terms such as "comprise" or "have" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood to not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0045] Hereinafter, PCB may be used interchangeably with board.

[0046] Hereinafter, with reference to FIGS. 1 and 2, a multi-PCB production device according to one embodiment of the present invention will be described.

[0047] Figure 1 is a conceptual diagram illustrating a component mounting process through multiple pieces of equipment in a production line according to one embodiment of the present invention. Figure 2 is a conceptual diagram illustrating a component mounting process through a gantry of one piece of equipment according to one embodiment of the present invention.

[0048] Referring to FIGS. 1 and 2, equipment (100) for mounting components on a PCB is arranged. A plurality of equipment (M1, M2, M3) may be arranged along the direction of the production line on a single production line. Although three equipments are exemplarily illustrated in FIG. 1, the number of equipments is not limited thereto, and more than three equipments may be arranged depending on the type of PCB being produced.

[0049] Through each piece of equipment, a component (C) can be mounted on a PCB passing through the production line. At this time, a single production line with multiple pieces of equipment can produce various types of PCBs at the same time. In other words, a multi-PCB production process can be performed through the production line. As illustrated in Fig. 1, components can be mounted on different types of PCBs, such as PCB1, PCB2, and PCB3, using multiple pieces of equipment in a single production line. At this time, a common component (20), which is a common component among the components mounted on PCB1, PCB2, and PCB3, can be mounted on different types of PCBs in a single production line. Through a multi-PCB production process, various types of PCBs can be produced at the same time, thereby improving the productivity of each type of PCB.

[0050] Referring to FIG. 2, equipment (100) can mount a component (20) on a PCB (10). The equipment can be defined as a mounter. In order to mount the component (20) on the PCB (10), the equipment (100) can allocate mounting to some of the components to be mounted on the PCB (10). That is, all components can be mounted on the PCB (10) using multiple equipment (100).

[0051] In each piece of equipment (100), when the parts (20) to be mounted are allocated to each piece of equipment (100), information on the order in which the parts (20) are to be mounted, i.e., step information, can also be transmitted. At this time, information on the part allocation and mounting order for the equipment (100) is defined as job information, and the job information can be input to the control unit (200).

[0052] Each device (100) may include a PCB moving unit (160) on which a PCB (10) is mounted and moved, a feeder (not shown) for preparing components (20), a gantry (120) for mounting components, and a driving unit (110) connected to a control unit (200) and controlling the gantry (120).

[0053] The gantry (120) can move the head (130), nozzle (140), and component (20) through the driving unit (110). The gantry (120) can be moved from the upper part to the lower part based on the mounting position to mount the component (20). The gantry (120) can be equipped with at least one head (130) to simultaneously mount multiple components in a single operation. Each head (130) can be equipped with a nozzle (140) according to the size of the component (20), etc., to adsorb the component (20).

[0054] The difference (error) between the intended mounting position of a component on the PCB (10) and the actual mounting position of the component may be affected by the position and angle at which the component is mounted, the state of the nozzle (140), etc., as a result of the control of the gantry (120) or the head (130). The above configurations are all components that constitute the equipment (100), and may be components corresponding to the moving parts of the equipment (100).

[0055] The head (130) may be a component for performing a pick-and-place operation on a target placed on a PCB (10). For example, the head (130) may include a suction-type head, a finger-driven head, a magnetic head, or a custom-type head. For example, in some cases, the equipment (100) may include multiple arms or multiple heads (130). In the following description of the present invention, the head (130) is described as a suction-type head, but the scope of the present invention is not limited thereto.

[0056] The driving unit (110) may be a component for moving the head (130). The driving unit (110) may drive the head (130) in vertical and horizontal axes. However, the shaft operation of the driving unit (110) may have a certain degree of error when driven for a long period of time. Therefore, it is necessary to perform the manufacturing process while compensating for such errors in the semiconductor manufacturing process.

[0057] The control unit (200) may be a component that controls components of the equipment (100), generates and transmits control commands, and receives and stores data generated from other components. For example, the control unit (200) may be a user terminal, a computing device, a server, etc.

[0058] According to the present embodiment, the equipment (100) may include first and second gantries (120a, 120b). Although two gantries are illustrated in FIG. 2, more than two gantries may be arranged within one equipment.

[0059] The first and second gantries (120a, 120b) can mount components on the front and rear sides of a single PCB (10), respectively. That is, the first and second gantries (120a, 120b) can be driven individually according to separate commands through separate control signals. The first and second gantries (120a, 120b) can each receive components from a feeder and mount the components on the PCB (10). At this time, if there are common components that must be mounted among the components that the first and second gantries (120a, 120b) must mount even if the PCB types are different, the productivity of the corresponding PCB (10) can be improved by moving the common components between the first and second gantries (120a, 120b). For example, even if the number of gantries within a single piece of equipment exceeds two, common components can be moved between each gantry.

[0060] If there is a common component among the components that the first and second gantries (120a, 120b) must mount, the control unit (200) can transmit a common component movement signal to each gantry so that the common component (20) can be moved from the first gantry (120a) to the second gantry (120b), or from the second gantry (120b) to the first gantry (120a).

[0061] Additionally, in a multi-PCB production device (1), if there is a common component to be mounted among the plurality of pieces of equipment (M1, M2, M3) of FIG. 1 even though the types of PCBs are different, the control unit (200) can move the common component between the plurality of pieces of equipment (M1, M2, M3) to improve the productivity of the corresponding PCB (10). For example, even if the number of pieces of equipment exceeds three, movement of common components between each piece of equipment is possible.

[0062] FIG. 3 is a flowchart of a multi-PCB production method according to one embodiment of the present invention.

[0063] A method for producing multiple PCBs according to one embodiment of the present invention can be performed by a multiple PCB production device (1). For example, the multiple PCB production device (1) according to one embodiment of the present invention can be a device that produces multiple PCBs using multiple pieces of equipment in an SMT (Surface Mounting Technology) line equipped with multiple pieces of equipment. The multiple PCB production device according to one embodiment of the present invention can include a memory, a processor, and a communication module. However, the present invention is not limited thereto, and some components of the multiple PCB production device can be separated into multiple devices, or multiple components can be merged into one device.

[0064] Memory is a computer-readable storage medium, which may include random access memory (RAM), read-only memory (ROM), and permanent mass storage devices such as disk drives. Furthermore, memory may temporarily or permanently store program code for controlling multiple PCB production devices.

[0065] The processor controls the overall operation of the multi-PCB production device. For example, the processor may be implemented in a form that optionally includes a processor, an Application-Specific Integrated Circuit (ASIC), another chipset, a logic circuit, a register, a communication modem, and / or a data processing device known in the art to perform the above-described operations. For example, the processor may perform basic arithmetic, logic, and input / output operations, and may execute program code stored in memory, for example. The processor may store data in memory or load data stored in memory.

[0066] The communication module may provide functionality for communicating with an external server via a network. For example, a request generated by a processor based on program code stored in a storage device such as memory may be transmitted to an external server via a network under the control of the communication module. Conversely, control signals, commands, content, files, etc. provided by the external server's processor under the control of the communication module may be received via the network through the communication module. For example, control signals or commands from an external server received via the communication module may be transmitted to the processor or memory.

[0067] The communication method is not limited, and may include not only a communication method that utilizes a communication network that the network may include (e.g., a mobile communication network, a wired Internet, a wireless Internet, a broadcasting network), but also short-range wireless communication between devices. For example, the network may include any one or more of a personal area network (PAN), a local area network (LAN), a campus area network (CAN), a metropolitan area network (MAN), a wide area network (WAN), a broadband network (BBN), and the Internet. In addition, the network may include any one or more of a network topology including, but not limited to, a bus network, a star network, a ring network, a mesh network, a star-bus network, a tree, or a hierarchical network.

[0068] Additionally, the communication module can communicate with production equipment installed on the line via a network. The communication method is not limited, but the network can be a short-range wireless communication network. For example, the network can be Bluetooth, Bluetooth Low Energy (BLE), or Wi-Fi.

[0069] Additionally, the multi-PCB production device according to the present invention may include an input / output interface. The input / output interface may be a means for interfacing with an input / output device. The input / output interface may display status information of the production equipment. For example, the input device may include a device such as a keyboard or mouse, and the output device may include a device such as a display for displaying a communication session of an application. As another example, the input / output interface may be a means for interfacing with a device that integrates input and output functions, such as a touchscreen.

[0070] Such a processor can control a multi-PCB production device to perform the steps included in the multi-PCB production method of FIG. 1. For example, the processor and its components can be implemented to execute instructions according to the code of an operating system and the code of at least one program contained in the memory. Here, the components of the processor can be representations of different functions of the processor performed by the processor according to instructions provided by the program code stored in the multi-PCB production device. The internal configuration and specific operation of the processor will be described with reference to the flowchart of the multi-PCB production method of FIG. 3.

[0071] Referring to FIG. 3, a method for producing multiple PCBs according to an embodiment of the present invention includes a step (S100) of selecting a type of PCB to be produced preferentially among several types of PCBs for which a production plan is in progress, a step (S200) of calculating board importance values ​​of several types of PCBs by assigning weights to the types of PCBs to be produced preferentially, a step (S300) of calculating a board similarity value based on the ratio of common components between a plurality of different boards, and a step (S400) of moving and allocating common components between different equipment by reflecting the board importance value and the board similarity value.

[0072] FIG. 4 is a display diagram showing an example in which a type of PCB to be preferentially produced is selected according to one embodiment of the present invention.

[0073] Referring to Fig. 4, when producing multiple PCBs, if there is a type of PCB that is to be produced first among several types of PCBs, the PCB production steps can be executed so that the type of PCB is given priority over other PCB types during the production of multiple PCBs. In this case, the step for producing the type of PCB that is to be produced first can be defined as a key job, and the type of PCB that is to be produced first can be defined as a keyboard.

[0074] Therefore, after the type of PCB to be produced first is selected, the board importance values ​​of various types of PCBs can be calculated by assigning weights to the types of PCBs to be produced first.

[0075] Fig. 5 is a flowchart illustrating detailed steps of a step of calculating board importance values ​​of various types of PCBs by assigning weights to the types of PCBs to be preferentially produced according to one embodiment of the present invention. Fig. 6(a) and Fig. 6(b) are tables exemplarily illustrating a process of calculating board importance values ​​of PCBs according to one embodiment of the present invention.

[0076] Referring to FIGS. 5, 6(a), and 6(b), the step (S200) of calculating the board importance values ​​of the various types of PCBs by assigning weights to the types of PCBs to be produced preferentially includes the step (S210) of calculating a scale value by normalizing the PCB production quantity value by min-max scaling for each of the various types of PCBs, the step (S220) of calculating a score for each type of PCB by multiplying the weighted value for the type of PCB to be produced preferentially and the general value for the types of PCBs that are not the types of PCBs to be produced preferentially for the scale values ​​for the various types of PCBs, and the step (S230) of calculating the board importance value for each type of PCB through the ratio of the scores for each type of PCB.

[0077] The importance of a board can be influenced not only by the type of PCB it is intended to produce, but also by the quantity of PCBs it is intended to produce. However, in terms of priority, the type of PCB it is intended to produce is more important than the quantity of boards it is intended to produce.

[0078] Accordingly, according to one embodiment of the present invention, a weight (W) of 100 may be assigned to the type of PCB to be produced with priority, and a weight (W) of 1 may be assigned to a type of PCB other than the type of PCB to be produced with priority. This allows the type of PCB to be produced with priority to be weighted so that it is 100 times more important than the number of boards to be produced, thereby significantly increasing the board importance of the type of PCB to be produced with priority.

[0079] According to one embodiment of the present invention, first, a scale value normalized by Min-Max Scaling of the PCB production quantity value is obtained, and then the scale value for each PCB type can be compared. Here, the scale value for each PCB type can be calculated using the following equation.

[0080]

[0081] Here, the minimum board quantity is 0, as the minimum is when no boards are being produced. The entered PCB quantity represents the quantity of the currently selected PCB type among several PCB types. The total PCB quantity represents the total quantity of all PCB types to be produced.

[0082] According to this embodiment, when calculating the PCB type scale value, if the number of boards of the corresponding PCB type is not entered, the quantity of the corresponding PCB type can be calculated by entering an arbitrary quantity of 1. This is because the production quantity of PCBs is less important than the type of PCB to be produced first.

[0083] In Figures 6(a) and 6(b), PCB production quantity values, scale values, weights (W), scores, and board importance values ​​by PCB type are exemplarily disclosed.

[0084] Here, the score is the product of the scale value and the weight (W) for each PCB type. The board importance value is a value expressed as an importance ratio with the sum of the scores for each PCB type as 1.

[0085] Referring to Fig. 6(a), the production quantities of three PCB types A, B, and C are 100, 200, and 5,000 sheets, respectively. In addition, the scale values ​​for each PCB type are approximately 0.018, 0.037, and 0.943, respectively. For example, if you want to produce PCB types A and B first among the three PCB types, you can assign a weight of 100 to PCB types A and B, respectively. Therefore, the score values ​​of the three PCB types considering the weights are approximately 0.018*100=1.8, 0.037*100=3.7, and 0.943*1=0.9, respectively. If you convert the score values ​​of the three PCB types into a board importance value with a total sum of 1, you can see that the board importance values ​​of the three PCB types are approximately 0.281, 0.578, and 0.140, respectively.

[0086] Referring to Fig. 6(b), the production quantities of the three PCB types D, E, and F are 1, 200, and 1, respectively. In addition, the scale values ​​for each PCB type are approximately 0.005, 0.990, and 0.005, respectively. For example, if you want to produce the D and E PCB types among the three PCB types with priority, you can assign a weight of 100 to the D and E PCB types, respectively. Therefore, you can see that the score values ​​of the three PCB types considering the weights are approximately 0.005*100=0.5, 0.990*100=99, and 0.005*1=0.005. If you convert the score values ​​of the three PCB types into a board importance value with a total sum of 1, you can see that the board importance values ​​of the three PCB types are approximately 0.005, 0.995, and 0.0005, respectively.

[0087] Based on the board importance value calculated at this stage, the common component movement allocation described later may be possible.

[0088] FIG. 7 is a diagram exemplarily illustrating grouping into the same band when board similarity exceeds a certain value according to one embodiment of the present invention. FIG. 8 is a diagram exemplarily illustrating moving and assigning common components between different pieces of equipment according to one embodiment of the present invention.

[0089] Referring to Figures 7 and 8, common components may exist between one PCB type and another PCB type. That is, common components may be mounted on one PCB type or another PCB type. Common components mounted on multiple PCB types may be allocated to multiple pieces of equipment in multi-PCB production and mounted on multiple PCB types.

[0090] In this way, in the process of producing multiple types of PCBs at once through multiple pieces of equipment, common components can be moved and reallocated between each piece of equipment or between gantries within one piece of equipment by considering the board importance value reflecting the type of PCB to be produced first and the production quantity, according to the present embodiment.

[0091] According to this embodiment, if the board similarity value between devices to which common components are moved is greater than a preset value, the devices are grouped into the same band, and movement of common components may be possible between multiple devices grouped into the same band. At this time, the board similarity value is a ratio value of common components between devices, and when the common components are 0%, the value may mean 0, and when the common components are 100%, the value may mean 1.

[0092] For example, the preset value may be 0.85. That is, if the ratio of common parts between the main equipment and the other equipment is 85% or more, the main equipment and the other equipment can be grouped into the same band.

[0093] Referring to Fig. 7, equipment A, B, and C can be grouped into Band 1 if the board similarity between the equipment is greater than or equal to a preset value, and equipment D, E, and F can be grouped into Band 2 if the board induction between the equipment is greater than or equal to a preset value. At this time, common component movement processing can be enabled between equipment A, B, and C and equipment D, E, and F. At this time, the movement of the common component can be movement between each equipment as illustrated in Fig. 8, and movement in a manner in which it is assigned to each equipment from the feeder is also possible.

[0094] Fig. 9 is a flowchart illustrating detailed steps of a step of moving and allocating common components between different equipment according to an embodiment of the present invention. Fig. 10(a) is a table exemplarily illustrating board importance values ​​by PCB type according to an embodiment of the present invention. Fig. 10(b) is a table exemplarily illustrating the difference between PCB and board importance values ​​to be preferentially produced in a common component-containing board according to an embodiment of the present invention. Fig. 10(c) is a table exemplarily illustrating whether common components can be moved by comparing LOB compensation values ​​by PCB.

[0095] The step of moving and allocating common components between different equipment according to one embodiment of the present invention may include the step of calculating LOB (Line of Balancing) of a first PCB type and a second PCB type having common components with the first PCB type between different equipment. For example, LOB is a cycle time equalization rate between equipment (machines), and may be calculated as LOB = Average Machine Cycle Time / Max Machine Cycle Time.

[0096] Additionally, each board may have its own LOB value. Here, the first PCB type may be the board currently selected as the PCB type to be produced first for calculations for moving common components, and the second PCB type may be another PCB type that has components in common with the first PCB type.

[0097] According to the present embodiment, the step (S400) of moving and allocating common components between different equipment by reflecting the board importance value and the board similarity value is performed by comparing a first LOB additional correction value in which the board importance value and the board similarity value are reflected in the first LOB correction value of the first PCB type with a second LOB correction value of the second PCB type, and if the first LOB additional correction value of the first PCB type is greater than the second LOB correction value of the second PCB type, common components of the first PCB type and the second PCB type can be moved between equipment and reallocated to multiple equipment.

[0098] Here, the board similarity value may be the ratio of common components between the first PCB type and the second PCB type. And the board importance difference value may be a value obtained by subtracting the smaller value from the larger value among the board similarity values ​​of the first PCB type and the second PCB type.

[0099] More specifically, the step (S400) of moving and allocating common components between different equipment by reflecting the board importance value and the board similarity value may include the step (S410) of calculating the 1-1 LOB compensation value by multiplying the 1 LOB compensation value of the 1st PCB type and the board similarity values ​​of the 1st PCB type and the 2nd PCB type, the step (S420) of calculating the 1-2 LOB compensation value by multiplying the 1-1 LOB compensation value and the board importance difference value of the 1st PCB type and the 2nd PCB type, the step (S430) of comparing the 1-2 LOB compensation value of the 1st PCB type and the 2nd LOB compensation value of the 2nd PCB type, and the step (S440) of moving and allocating common components between the 1st PCB type and the 2nd PCB type between the equipment if the 1-2 LOB compensation value of the 1st PCB type is greater than the 2 LOB compensation value of the 2nd PCB type.

[0100] Here, if the first-second LOB correction value of the first PCB type is smaller than the second LOB correction value of the second PCB type, a step may further be included in which common components of the first PCB type and the second PCB type are not moved.

[0101] At this time, the difference value of the board importance between the first PCB type and the second PCB type may be a value obtained by subtracting the smaller value from the larger value between the board importance values ​​of the first PCB type and the second PCB type. Through this, it can be seen that the larger the difference value of the board importance values, the higher the 1-1 LOB compensation value, and thus the higher the possibility of movement of the common component.

[0102] The first LOB correction value may be a value obtained by subtracting the LOB value of the first PCB type from 1, and the second LOB correction value may be a value obtained by subtracting the LOB value of the second PCB type from 1. This serves to relatively increase the LOB correction value of the PCB type to be preferentially produced by lowering the LOB correction value of the PCB type other than the PCB type to be preferentially produced.

[0103] When common parts are moved, the common parts can be reallocated to each piece of equipment to improve the productivity of the type of PCB to be produced first.

[0104] Below, the possibility of movement of common parts between equipment will be examined as examples through FIG. 10(a), FIG. 10(b), and FIG. 10(c).

[0105] Referring to Fig. 10(a), PCB types A, B, and C are disclosed as examples. For example, the scale values ​​of the three PCB types A, B, and C may be the same as 1, and only PCB type A may be given a weight of 100. In this case, the scores may be 100, 1, and 1, respectively. In this case, the board importance values ​​of the three PCB types A, B, and C may be approximately 0.9803922, 0.0098039, and 0.0098039, respectively.

[0106] Referring to Fig. 10(b), before determining whether common components can be moved between PCB types A and B of Fig. 10(a), the PCB type to be produced can be confirmed as A first. In addition, the board importance difference value between PCB types A and B can be set to approximately 0.9803922-0.0098039=0.970.

[0107] Referring to Fig. 10(c), PCB type A can be defined as the first PCB type, and PCB type B can be defined as the second PCB type. In this case, the LOB value of the first PCB type can be 0.7, and the LOB value of the second PCB type can be 0.9.

[0108] Therefore, the first LOB correction value of the first PCB type can be 1-0.7=0.3, and the second LOB correction value of the second PCB type can be 1-0.9=0.1.

[0109] The board similarity value between the first PCB type and the second PCB type may be 0.34. Additionally, the board importance difference value between the first PCB type and the second PCB type may be 0.97.

[0110] Here, the 1-1 LOB correction value can be calculated as 0.102 by multiplying the 1st LOB correction value of the 1st PCB type, 0.3, and the board similarity value of the 1st and 2nd PCB types, 0.34.

[0111] After that, the 1-2 LOB correction value can be calculated as 0.09894, which is the product of 0.102, the 1-1 LOB correction value, and 0.970, the difference in board importance between the 1st and 2nd PCB types.

[0112] After that, the 1st-2nd LOB correction value of the 1st PCB type, 0.09894, and the 2nd LOB correction value of the 2nd PCB type, 0.1, can be compared.

[0113] In this example, it can be seen that the 1-2 LOB correction value of the 1st PCB type, 0.09894, is less than the 2nd LOB correction value of the 2nd PCB type, 0.1, so the movement processing of the common component is not possible.

[0114] According to another embodiment of the present invention, movement of common components may be possible even between different gantries within the same equipment. The step of moving and allocating common components according to the present embodiment may include the step of calculating GOB (Gantry of Balancing) of a first PCB type and a second PCB type having common components with the first PCB type within the same equipment. For example, GOB is a cycle time equalization rate between the gantry and may be calculated as GOB = Average Gantry Cycle Time / Max Gantry Cycle Time.

[0115] Additionally, each board may have a GOB value for each device. Here, the first PCB type is the board currently selected as the PCB type to be produced first for calculations for moving common components, and the second PCB type may refer to another PCB type that has common components with the first PCB type.

[0116] The step of moving and allocating a common component according to the present embodiment may include a step of moving the common component from a first gantry to a second gantry within the same equipment when the GOB of the second PCB type increases before and after the movement of the common component.

[0117] In addition, the step of moving and allocating common components according to the present embodiment may include a step of moving common components between gantries within the same equipment, if the GOB change before and after the movement of the common components of the first PCB type is greater than the product of the GOB change before and after the movement of the common components of the second PCB type and the board similarity between the first PCB type and the second PCB type.

[0118] According to another embodiment of the present invention, in a step of selecting a type of PCB to be produced preferentially among several types of PCBs for which production is planned, a plurality of types of PCBs to be produced preferentially may be selected, and the plurality of types may be selected sequentially according to priority. At this time, the movement processing of common components may be performed to correspond to the selected priority.

[0119] According to another embodiment of the present invention, weights for multiple PCB types can be assigned differently based on priority, taking into account the production quantity of each type of board among multiple PCB types. Accordingly, weights based on priority can be assigned numerically and sequentially, so that PCB types to be produced with priority are sequentially moved to common components.

[0120] According to another embodiment of the present invention, rather than being limited to a single production line as described above, multiple PCBs can be produced simultaneously across multiple production lines. In this case, board importance and board similarity values ​​are applied across all production lines, allowing not only the movement of components between equipment within the same production line, but also the movement of common components between equipment within different production lines.

[0121] The devices and / or systems described above may be implemented as hardware components, software components, and / or a combination of hardware components and software components. The devices and components described in the embodiments may be implemented using one or more general-purpose computers or special-purpose computers, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing instructions and responding to them. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. In addition, the processing device may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing device is sometimes described as being used alone; however, one of ordinary skill in the art will recognize that the processing device may include multiple processing elements and / or multiple types of processing elements. For example, a processing unit may include multiple processors, or a processor and a controller. Other processing configurations, such as parallel processors, are also possible.

[0122] Software may include computer programs, codes, instructions, or a combination of one or more of these, which may configure a processing device to perform a desired operation or may, independently or collectively, command the processing device. The software and / or data may be permanently or temporarily embodied in any type of machine, component, physical device, virtual equipment, computer storage media or device, or transmitted signal waves, for interpretation by the processing device or for providing instructions or data to the processing device. The software may also be distributed over networked computer systems and stored or executed in a distributed manner. The software and data may be stored on one or more computer-readable recording media.

[0123] The method according to the embodiment may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the medium may be those specially designed and configured for the embodiment or may be those known and available to those skilled in the art of computer software. Examples of the computer-readable recording medium include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of the program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc. The above-mentioned hardware devices may be configured to operate as one or more software modules to perform the operations of the embodiment, and vice versa.

[0124] Although the embodiments described above have been described by way of limited examples and drawings, those skilled in the art will appreciate that various modifications and variations can be made based on the above teachings. For example, appropriate results can still be achieved even if the described techniques are performed in a different order than described, and / or components of the described systems, structures, devices, circuits, etc. are combined or combined in a different manner than described, or are replaced or substituted with other components or equivalents.

[0125] Therefore, other implementations, other embodiments, and equivalents to the claims also fall within the scope of the claims described below.

Claims

1. A method for producing a multi-PCB on which components are mounted using multiple equipment, A step in which the type of PCB to be produced first is selected among several types of PCBs for which production plans exist; A step of calculating board importance values ​​of the various types of PCBs by assigning weights to the types of PCBs to be produced with priority; A step of calculating a board similarity value based on the ratio of common components between multiple different boards; and A multi-PCB production method, comprising a step of moving and allocating the common components between different equipments by reflecting the board importance value and the board similarity value.

2. In paragraph 1, The step of calculating the board importance value of the various types of PCBs by giving weight to the types of PCBs to be produced with priority is as follows: For each of the above PCB types, a step of obtaining a scale value normalized by Min-Max Scaling the PCB production quantity value; A step of obtaining a score for each PCB type by multiplying the scale values ​​for the above-mentioned various PCB types by a weight value for the PCB type to be preferentially produced and by multiplying the general value for the PCB type other than the PCB type to be preferentially produced; and A multi-PCB production method, comprising a step of calculating a board importance value for each PCB type through a ratio of scores for each PCB type.

3. In paragraph 2, The above scale values ​​are, A method for producing multiple PCBs.

4. In paragraph 3, Multi-PCB production method with minimum board quantity value of 0.

5. In paragraph 3, If the above input board quantity is not entered, A multi-PCB production method in which the above input board quantity is input as 1 and the above scale value is calculated.

6. In paragraph 1, The step of moving and allocating the common components between different devices by reflecting the above board importance value and the above board similarity value is as follows: The first LOB additional correction value, in which the board importance value and the board similarity value are reflected in the first LOB correction value of the first PCB type, is compared with the second LOB correction value of the second PCB type, A multi-PCB production method in which common components of the first PCB type and the second PCB type are moved between equipment and allocated to multiple equipment when the first LOB additional correction value of the first PCB type is greater than the second LOB correction value of the second PCB type.

7. In paragraph 6, The step of moving and allocating the common components between different devices by reflecting the board importance value and the board similarity value is as follows: A step of calculating a first LOB correction value by multiplying a first LOB correction value of a first PCB type and a board similarity value of the first PCB type and the second PCB type; A step of calculating a 1-2 LOB correction value by multiplying the 1-1 LOB correction value and the board importance difference value between the 1st PCB type and the 2nd PCB type; A step of comparing the first and second LOB correction values ​​of the first PCB type with the second LOB correction value of the second PCB type; A multi-PCB production method, comprising a step of moving and allocating common components of the first PCB type and the second PCB type between equipment when the first-second LOB correction value of the first PCB type is greater than the second LOB correction value of the second PCB type.

8. In paragraph 6, The difference value of the board importance between the first PCB type and the second PCB type is A method for producing multiple PCBs, wherein the value is obtained by subtracting the smaller value from the larger value among the board importance values ​​of the first PCB type and the second PCB type.

9. In paragraph 6, The above first LOB correction value is a value obtained by subtracting the LOB value of the first PCB type from 1, A multi-PCB production method, wherein the second LOB correction value is a value obtained by subtracting the LOB value of the second PCB type from 1.

10. In paragraph 1, Among the various types of PCBs with the above production plan, at the stage where the type of PCB to be produced first is selected, First, multiple types of PCBs to be produced are selected. A multi-PCB production method in which the above plurality are selected in order of priority.

11. In paragraph 10, Considering the production quantity of each type of board among the above multiple PCB types, A multi-PCB production method in which weights for the above-mentioned multiple PCB types are given differently according to priority.

12. In paragraph 1, The method for producing the above multi-PCB is a multi-PCB production method in which multiple PCBs are produced in multiple production lines.

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