Electrical connection assembly and electronic apparatus

Abstract

Disclosed in the present application are an electrical connection assembly and an electronic apparatus. The electrical connection assembly is used for electrically connecting to a first device, and comprises a second device and a conductive elastic piece. The second device is spaced apart from the first device, and a recess is provided at the side of the second device facing the first device. One end of the conductive elastic piece is used for fixedly connecting to the first device, and the other end of the conductive elastic piece is provided with a protrusion, the protrusion being used for abutting against at least part of the recess wall of the recess. In the electrical connection assembly of the present application, the recess adapted to the protrusion is provided in the second device, such that under driving of the conductive elastic piece, the protrusion can extend into the recess to abut against the recess wall of the recess, and, under the condition of achieving a same effective contact area, the degree of compressive deformation to which the protrusion is subjected is smaller, that is, the elastic force of the conductive elastic piece to which the protrusion is subjected is smaller; therefore, the requirement for the elastic force of the conductive elastic piece can be reduced, such that even under the condition of weak compression force, the electrical connection assembly can also achieve sufficient contact between same and the second device.

Description

Electric connection assembly and electronic device TECHNICAL FIELD

[0001] The present application relates to the technical field of electric connectors, and more particularly, to an electric connection assembly and an electronic device. BACKGROUND

[0002] In electronic devices such as mobile phones, televisions, displays, notebook computers, tablet computers, and vehicle navigation systems, conductive springs are often used for electrical connection between a shielding cover of an internal electronic component and a reference ground, or for electrical connection between a functional device such as a screen, a camera module, a system on chip (SOC), and a reference ground.

[0003] When the conductive spring is applied to a connection scheme of a functional device such as a screen, exerting a large extrusion force on the conductive spring can cause film printing on the screen and affect the texture. If film printing on the screen is to be avoided, the extrusion force on the conductive spring needs to be weakened, and weakening the extrusion force can result in insufficient contact between the conductive spring and the screen, which can cause third harmonic waves to be easily generated at the contact interface, and thus can cause problems of wireless signal distortion, and can result in a risk that a radiated spurious emission (RSE) test cannot be passed.

[0004] It can be seen that how to achieve sufficient contact between the conductive spring and the connection interface under a weak extrusion force is a problem that needs to be solved in the industry.

[0005] SUMMARY

[0006] The present application aims to provide an electric connection assembly and an electronic device. By providing a groove on the second device that is adapted to the convex bump, the convex bump can be extended into the groove and abut against the groove wall under the driving of the conductive spring. Under the condition of achieving the same effective contact area, the degree of extrusion deformation of the convex bump is smaller, that is, the elastic force of the conductive spring on the convex bump is smaller. Therefore, the elastic force requirement of the conductive spring can be weakened, and the electric connection assembly can achieve sufficient contact with the second device under a weak extrusion force.

[0007] In a first aspect, the present application provides an electric connection assembly for electrically connecting a first device, the electric connection assembly comprising a second device and a conductive spring.

[0008] The second device is spaced apart from the first device, and the second device is provided with a groove on a side facing the first device.

[0009] One end of the conductive spring is used for fixed connection with the first device, and the other end of the conductive spring is provided with a convex bump, and the convex bump is used for abutting against at least part of the groove wall of the groove.

[0010] The electric connection assembly provided in the application, by setting a groove on the second device, and the groove is matched with the convex of the conductive spring piece, so that the convex can be inserted into the groove and abut with the groove wall under the driving of the conductive spring piece. Under the condition that the conductive spring piece in the related art has the same effective contact area with the device to be connected, the degree of extrusion deformation of the convex of the conductive spring piece in the application is smaller, that is, the elastic force of the conductive spring piece received by the convex is smaller, so that the elastic force requirement of the conductive spring piece can be weakened, and thus the conductive spring piece in the application can also realize sufficient contact with the second device under the condition of weak extrusion force.

[0011] When the electric connection assembly in the application is applied in the scene of screen grounding, under the premise of achieving the same effective contact area of the conductive spring piece in the related art, that is, achieving the same third harmonic, the extrusion force required by the conductive spring piece in the application is smaller, which can avoid the screen from appearing the impression. If the conductive spring piece in the related art receives the same extrusion force, the conductive spring piece in the application can increase the effective contact area with the screen, thereby increasing the conductive path of the conductive spring piece and the screen, enhancing the conductivity of the conductive spring piece, thereby weakening or even avoiding the generation of the third harmonic, so as to ensure the smooth passing of the radiation spurious test of the electronic equipment.

[0012] In addition, since the electric connection assembly in the application, the convex of the conductive spring piece can also realize sufficient contact with the second device under the condition of weak extrusion force, the elastic force requirement of the conductive spring piece can be weakened, and thus the use amount of the base material of the conductive spring piece can be reduced, so that the hand feeling of the conductive spring piece is soft, that is, the elastic modulus of the conductive spring piece is reduced, so that the elastic force generated by the conductive spring piece under the condition of the same deformation amount is weaker. Based on this, in order to reduce the use amount of the base material of the conductive spring piece, the conductive spring piece can be thinned or thinned, which will inevitably reduce the free height and overall size of the conductive spring piece, so that the electric connection assembly provided in the application can meet the requirements of miniaturization and lightness in use scene.

[0013] In addition, when the electric connection assembly in the application is applied to electric connection between other functional elements, for example, the electric connection between the antenna radiation branches on the back cover and the circuit board is achieved through the conductive spring, the bulge of the back cover can be avoided, and the connection reliability of the back cover and the middle frame can be ensured. The reason is as follows: since the number of the antenna radiation branches on the back cover is large, and each antenna radiation branch has two connection points that need to be electrically connected with the circuit board, if the conventional conductive spring is used, the extrusion force of the antenna radiation branch and the circuit board on the conductive spring needs to be increased under the condition of ensuring that the convex bump and the antenna radiation branch are in sufficient contact. However, the elasticity of the conductive spring will act on the back cover to cause the deformation of the back cover and form the bulge. In addition, the static stress of the back cover will be large when multiple conductive springs act on the back cover at the same time, which will further cause the unstable connection of the back cover and the middle frame. In the case of falling or vibration, the risk of separation of the back cover and the middle frame will be increased, and the connection reliability is poor. However, when the electric connection assembly in the application is used, the convex bump and the antenna radiation branch can be in sufficient contact under the condition of weak extrusion force, the bulge of the back cover can be avoided, and the static stress of the back cover will not be large even if the number of the conductive springs needed is large, so that the connection reliability of the back cover and the middle frame can be ensured.

[0014] In a possible design, the groove is a strip-shaped groove.

[0015] The structure of the strip-shaped groove does not need to consider the concentricity with the convex bump, so the strip-shaped groove is easier to process and assemble with the convex bump, and the manufacturing and assembly difficulties of the electric connection assembly can be reduced.

[0016] In a possible design, the conductive spring includes a spring arm, the end of the spring arm that is close to the convex bump is a first end, the end of the spring arm that is away from the convex bump is a second end, the projection of the first end on the surface of the second device is parallel to the length direction of the strip-shaped groove in the projection of the second end on the surface of the second device, and the convex bump can slide along the length direction of the strip-shaped groove on the groove wall of the strip-shaped groove.

[0017] The above design can improve the abutment stability of the convex bump and the strip-shaped groove, and further ensure that the convex bump and the second device are reliably and sufficiently in contact.

[0018] In a possible design, the surface type of the outer surface of the convex bump is a spherical surface or an ellipsoidal surface.

[0019] The convex bump with the spherical surface or the ellipsoidal surface slides more smoothly on the groove wall of the strip-shaped groove, and the abutment stability of the convex bump and the strip-shaped groove is further improved.

[0020] In a possible design, the convex bump is a semi-cylindrical body, the circular arc surface of the semi-cylindrical body abuts against the groove wall of the strip-shaped groove, and the axis of the semi-cylindrical body is parallel to the length direction of the strip-shaped groove.

[0021] The axis of the semi-cylinder is parallel to the length direction of the strip-shaped groove, so that the convex bump can be in full contact with the groove wall of the strip-shaped groove.

[0022] In a possible design, the number of the grooves is multiple, and the multiple grooves are arranged in a straight line.

[0023] The convex bump can be easily in contact with the groove wall of any strip-shaped groove, so that the assembly difficulty can be reduced.

[0024] In a possible design, the conductive elastic sheet includes an elastic arm, the end of the convex bump as the first end, the end of the elastic arm away from the convex bump as the second end, the projection of the first end on the surface of the second device to the direction of the projection of the second end on the surface of the second device is parallel to the arrangement direction of the grooves.

[0025] Through the above design, when the conductive elastic sheet and the second device are assembled, the convex bump can be easily in contact with the groove wall of any strip-shaped groove without using special alignment devices for accurate alignment, so that the assembly difficulty of the conductive elastic sheet and the second device can be reduced, and the assembly difficulty of the whole assembly can be reduced.

[0026] In a possible design, the groove is a strip-shaped groove, the length directions of any two strip-shaped grooves are parallel, the convex bump is a semi-cylinder, the arc surface of the semi-cylinder is in contact with the groove wall of the strip-shaped groove, and the axis of the semi-cylinder is parallel to the length direction of the strip-shaped groove.

[0027] Through the above design, the multiple strip-shaped grooves can be regularly arranged, and the convex bump can be in contact with the groove wall of any strip-shaped groove.

[0028] In a possible design, the surface type of the groove wall is at least one of a spherical surface, an ellipsoidal surface, and a conical surface, and the surface type of the outer surface of the convex bump is a spherical surface or an ellipsoidal surface.

[0029] In a possible design, the cross section of the strip-shaped groove is arc-shaped or V-shaped.

[0030] In a possible design, the maximum cross-sectional area of the convex bump is smaller than the opening area of the groove.

[0031] In this way, when the convex bump and the groove are aligned and in contact, the convex bump can be easily inserted into the groove, so that the assembly difficulty of the conductive elastic sheet, the first device, and the second device can be reduced.

[0032] In a possible design, the side surface of the second device facing the first device is provided with the groove.

[0033] The groove is directly provided on the second device, so that the space between the first device and the second device is not occupied by the component for forming the groove, and the electrical connection assembly can be applied to a narrower installation space.

[0034] In a possible design, the second device is provided with an electrically-conductive block on the side facing the first device, and the electrically-conductive block is provided with a groove on the side facing the first device.

[0035] The groove is provided on the second device in an indirect manner, which can reduce the manufacturing difficulty of the product and improve the yield of the product.

[0036] In a possible design, the second device is provided with a relief groove, and at least part of the electrically-conductive block is fixedly arranged in the relief groove.

[0037] The relief groove is provided in the second device to accommodate and mount the electrically-conductive block, so that the electrically-conductive block can be conveniently positioned and mounted on the second device, and the electrically-conductive block can be sunk into the interior of the second device, avoiding the electrically-conductive block protruding from the surface of the second device, so that the space between the second device and the first device is not affected by the occupation of the electrically-conductive block, and the electric connection assembly can be applied to a narrower installation space.

[0038] In a possible design, the relief groove penetrates through both side walls of the second device in the thickness direction of the second device.

[0039] The position of the groove relative to the second device in the thickness direction is adjustable, and in particular when the gap height between the second device and the first device is too small, the installation difficulty of the electrically-conductive spring piece can be reduced, and the present embodiment can also be applicable to electrically-conductive spring pieces with a higher free height, and has higher universality.

[0040] In a possible design, the electrically-conductive spring piece is further provided with a base, and the electrically-conductive spring piece is fixedly arranged on the first device through the base.

[0041] The electrically-conductive spring piece can be conveniently mounted on the first device.

[0042] In a second aspect, the present application also provides an electronic device, which comprises a first device and an electric connection assembly according to any one of the above, the electrically-conductive spring piece is fixedly arranged on the first device, and the convex block abuts against at least part of the groove wall.

[0043] The electronic device in the present embodiment comprises the electric connection assembly, the degree of extrusion deformation of the convex block of the electric connection assembly is smaller, that is, the elastic force of the electrically-conductive spring piece acting on the convex block is smaller, so that the requirement for the elastic force of the electrically-conductive spring piece can be weakened, and thus the electric connection assembly in the present application can also realize sufficient contact with the second device under a weak extrusion force. When applied in a screen grounding scenario, screen moulage can be avoided, and the generation of third harmonic waves can also be weakened or even avoided. When the electrically-conductive spring piece is made thin or thin, the free height and the overall size of the electrically-conductive spring piece can be reduced, so that the development requirement of miniaturization and lightness of the electronic device can be met.

[0044] In a possible design, the electronic device further includes a screen, the screen including a display module and a metal layer arranged in a stack; the second device includes the metal layer, and the metal layer is provided with a groove on a side facing the first device.

[0045] In a possible design, the electronic device further includes a middle plate, the middle plate being arranged in a space apart from the metal layer; the first device includes the middle plate, and the conductive spring piece is fixedly arranged on the middle plate.

[0046] In a possible design, the electronic device further includes a middle plate; the second device includes the middle plate, and the middle plate is provided with a groove on a side facing the first device.

[0047] In a possible design, the electronic device further includes a back cover and an antenna radiation branch, the back cover being provided with the antenna radiation branch; the second device includes the antenna radiation branch, and the antenna radiation branch is provided with a groove on a side facing the first device. BRIEF DESCRIPTION OF DRAWINGS

[0048] FIG. 1 is a schematic diagram of a use state of a conductive spring piece in the related art;

[0049] FIG. 2 is an enlarged view of A in FIG. 1;

[0050] FIG. 3 is a schematic diagram of a smartphone according to an embodiment of the present application;

[0051] FIG. 4 is a cross-sectional view of an example of B-B in FIG. 3;

[0052] FIG. 5 is a cross-sectional view of another example of B-B in FIG. 3;

[0053] FIG. 6 is a cross-sectional view of another example of B-B in FIG. 3;

[0054] FIG. 7 is a schematic diagram of an example of a conductive spring piece according to an embodiment of the present application;

[0055] FIG. 8 is a side view of the conductive spring piece in FIG. 7;

[0056] FIG. 9 is a schematic diagram of another example of a conductive spring piece according to an embodiment of the present application;

[0057] FIG. 10 is a side view of the conductive spring piece in FIG. 9;

[0058] FIG. 11 is a cross-sectional view of an example of a conductive spring piece and a second device according to an embodiment of the present application;

[0059] FIG. 12 is a schematic diagram of an application of an electric connection assembly according to an embodiment of the present application to a screen grounding scenario;

[0060] FIG. 13 is a schematic diagram of an application of an electric connection assembly according to an embodiment of the present application to a shielding cover grounding scenario;

[0061] FIG. 14 is a schematic diagram of an application of the electric connection assembly to a scenario of electrically connecting an antenna radiation branch and a circuit board according to an embodiment of the present application;

[0062] FIG. 15 is a sectional view of another example of the electrically-conductive spring and the second device according to an embodiment of the present application;

[0063] FIG. 16 is a sectional view of another example of the electrically-conductive spring and the second device according to an embodiment of the present application;

[0064] FIG. 17 is a sectional view of another example of the electrically-conductive spring and the second device according to an embodiment of the present application;

[0065] FIG. 18 is a sectional view of another example of the electrically-conductive spring and the second device according to an embodiment of the present application;

[0066] FIG. 19 is a comparative schematic diagram of an example of the electrically-conductive spring and the second device according to an embodiment of the present application;

[0067] FIG. 20 is a schematic diagram of an example of the second device according to an embodiment of the present application;

[0068] FIG. 21 is a schematic diagram of an example of the convex protruding into the concave according to an embodiment of the present application;

[0069] FIG. 22 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0070] FIG. 23 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0071] FIG. 24 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0072] FIG. 25 is a schematic diagram of another example of the second device according to an embodiment of the present application;

[0073] FIG. 26 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0074] FIG. 27 is a comparative schematic diagram of another example of the electrically-conductive spring and the second device according to an embodiment of the present application;

[0075] FIG. 28 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0076] FIG. 29 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0077] FIG. 30 is a schematic diagram of another example of the convex protruding into the concave according to an embodiment of the present application;

[0078] FIG. 31 is a schematic diagram of another example of the second device according to an embodiment of the present application;

[0079] FIG. 32 is a partial schematic view of a conductive spring according to an embodiment of the present application;

[0080] FIG. 33 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application;

[0081] FIG. 34 is a schematic view of another example of a second device according to an embodiment of the present application;

[0082] FIG. 35 is a schematic view of another example of a conductive spring according to an embodiment of the present application;

[0083] FIG. 36 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application;

[0084] FIG. 37 is a top view of the convexity and the second device in FIG. 36;

[0085] FIG. 38 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application;

[0086] FIG. 39 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application;

[0087] FIG. 40 is a top view of the convexity and the second device in FIG. 39;

[0088] FIG. 41 is a sectional view of C-C in FIG. 39;

[0089] FIG. 42 is a schematic view of a half-cylinder having an angle between an axis of the half-cylinder and a length direction of a strip-shaped groove;

[0090] FIG. 43 is a schematic view of another example of a second device according to an embodiment of the present application;

[0091] FIG. 44 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application;

[0092] FIG. 45 is a schematic view of another example of a second device according to an embodiment of the present application;

[0093] FIG. 46 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application;

[0094] FIG. 47 is a schematic view of another example of a convexity protruding into a groove according to an embodiment of the present application.

[0095] Label: 01, conductive spring; 02, convex bump; 03, screen; 04, metal frame; 05, metal layer; 10, conductive spring; 11, spring arm; 12, convex bump; 13, base; 14, first end; 15, second end; 20, groove; 21, strip-shaped groove; 30, conductive block; 50, axis; 200, first device; 300, second device; 301, avoiding groove; 302, pad; 400, case; 401, middle frame; 401a, middle plate; 401b, frame; 402, back cover; 500, screen; 501, display module; 502, metal layer; 600, circuit board; 601, shielding cover; 700, antenna radiation branch. DETAILED DESCRIPTION

[0096] The related content that the embodiments of the present application can involve is exemplarily introduced below. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0097] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected or can communicate with each other; can be directly connected, or indirectly connected through an intermediate medium, or the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0098] In the description of the present application, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom" and the like indicate the orientation or positional relationship based on the installation, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0099] It should also be noted that the same reference signs in the embodiments of the present application represent the same component or the same part, and for the same parts in the embodiments of the present application, only one part or component may be labeled with a reference sign in the drawing, and it should be understood that the reference sign is also applicable to other identical parts or components.

[0100] In the description of the present application, it should be noted that the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone.

[0101] In electronic devices such as mobile phones, televisions, displays, notebook computers, tablet computers, and vehicle navigation systems, conductive springs are often used to connect to a reference ground, or to electrically connect an electronic component in the electronic device to a reference ground, or to electrically connect a functional device such as a screen, a camera module, or a system-on-chip to a reference ground.

[0102] Taking screen grounding as an example, FIG. 1 is a use state diagram of a conductive spring 01 in the related art. As shown in FIG. 1, in a screen 03 grounding scheme of an electronic device, at least one conductive spring 01 is usually welded on a metal frame 04 to electrically connect the conductive spring 01 to the screen 03. The metal frame 04, which can also be referred to as a middle frame, is assembled with a back cover and the screen 03 to form an inner cavity of the electronic device, and the inner cavity is used to install functional elements such as chips, speakers, and communication modules. The metal frame 04 includes a middle plate and a bezel arranged around the middle plate. The conductive spring 01 is compressed and arranged between the screen 03 and the middle plate. The inner side of the screen 03 is provided with a metal layer 05, which can be a copper sheet, and the metal layer 05 plays a shielding and supporting role. The conductive spring 01 is in elastic contact with the metal layer 05 to achieve stable electrical connection between the metal layer 05 and the metal frame 04, and thus the screen 03 is grounded. FIG. 2 is an enlarged view of A in FIG. 1. As shown in FIG. 2, the end of the conductive spring 01 is provided with a convexity 02, and the convexity 02 is in abutment with the metal layer 05 under the elastic force of the conductive spring 01. The effective contact surface of the conductive spring 01 and the metal layer 05 is the area where the convexity 02 is flattened by the metal layer 05.

[0103] Referring back to FIG. 2, it can be seen from FIG. 2 that, in order to increase the effective contact area of the convexity 02 and the metal layer 05 and achieve sufficient contact between the convexity 02 and the metal layer 05, the compression force of the conductive spring 01 must be increased, so that the surface of the convexity 02 is flattened by the metal layer 05, and thus the effective contact area of the convexity 02 and the metal layer 05 is increased. However, excessive compression force will cause the compressed position of the metal layer 05 to deform, and thus the light propagation path in the screen 03 changes, resulting in a screen 03 imprint problem. In order to avoid the screen 03 imprint, the compression force of the conductive spring 01 needs to be weakened, but weakening the compression force will result in insufficient contact between the convexity 02 and the metal layer 05. In the case where the convexity 02 cannot fully contact the metal layer 05, the contact interface between the convexity 02 and the metal layer 05 is prone to generate third harmonics, and thus wireless signal distortion problems occur, resulting in a risk that the radiation spurious test cannot be passed.

[0104] As can be seen, the main problem of the conductive spring in the related art is that it cannot fully contact the connection interface under weak compression force.

[0105] Therefore, in order to solve the above technical problems, the application provides an electric connection assembly and an electronic device. A groove is arranged on the second device to match the convex bump, so that the convex bump can be inserted into the groove and abut against the groove wall under the driving of the conductive spring piece. Under the condition of realizing the same effective contact area, the degree of extrusion deformation of the convex bump is smaller, that is, the elastic force of the conductive spring piece is smaller, so that the elastic force requirement of the conductive spring piece can be weakened, and the electric connection assembly can realize sufficient contact with the second device under the condition of weak extrusion force.

[0106] The electronic device provided by the embodiments of the application can also be referred to as a mobile device, a terminal device, a mobile terminal or a terminal. The electronic device includes but is not limited to a handheld device, a vehicle-mounted device, a wearable device, a computing device or other processing devices connected to a wireless modem. For example, the electronic device can include a smart watch, a smart wristband, a smart phone, a personal digital assistant (PDA) computer, a tablet computer, a notebook computer, a vehicle-mounted computer, smart glasses, a game console and other electronic devices with a conductive spring piece and requiring a reliable electric connection design under weak extrusion force.

[0107] In order to more conveniently describe the electronic device provided by the embodiments of the application, as an example but not limitation, the technical solutions of the application will be described in detail below with the electronic device being a smart phone as an example. Meanwhile, in order to facilitate the description of each embodiment below, an XYZ coordinate system is established for the smart phone. Specifically, the extension direction of the short side of the smart phone is defined as the X direction, the extension direction of the long side of the smart phone is defined as the Y direction, and the thickness direction of the smart phone is defined as the Z direction, and the X direction, the Y direction and the Z direction are perpendicular to each other.

[0108] FIG. 3 is a schematic diagram of the smart phone provided by the embodiments of the application. In FIG. 3, (a) is a front view of the smart phone, and (b) is a back view of the smart phone.

[0109] As shown in FIG. 3, the smart phone provided by the embodiment of the present application includes a screen 500, a casing 400, and a conductive spring 10 (not shown in FIG. 3). The casing 400 further includes a middle frame 401 and a back cover 402 (or a battery cover). The front end surface of the middle frame 401 is fixedly provided with the screen 500, and the rear end surface of the middle frame 401 is fixedly provided with the back cover 402. The screen 500, the middle frame 401, and the back cover 402 jointly define a containing space of the smart phone, which is used for installing various functional elements of the smart phone, such as the conductive spring 10, a camera module, a circuit board 600, and other functional elements mentioned below.

[0110] FIG. 4 is a sectional view of an example of B-B in FIG. 3.

[0111] As shown in FIG. 4, the middle frame 401 can be made of metal and includes a middle plate 401a and a frame 401b arranged around the middle plate 401a. The back cover 402 can be coupled to the frame 401b by screwing, clamping, bonding, or the like. A sealing ring can be arranged between the back cover 402 and the frame 401b to improve the sealing and waterproof effect of the joint between the back cover 402 and the frame 401b. The sealing ring can be made of a high-elasticity material such as silica gel or rubber.

[0112] In addition, the smart phone can further include functional elements such as a processor, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, a microphone, a mobile communication module, an antenna, a wireless communication module, an audio module, an earphone interface, a sensor module, a key, and a subscriber identification module (SIM) card interface.

[0113] The processor can include one or more processing units. For example, the processor can include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a memory, a video codec, a digital signal processor (DSP), a baseband processor, a neural-network processing unit (NPU), and the like. Different processing units can be independent devices or integrated into one or more processors.

[0114] The USB interface is an interface conforming to the USB standard specification, and can be a Mini USB interface, a Micro USB interface, a USB Type C interface, etc. The USB interface can be used to connect a charger to charge the outer folding mobile phone, and can also be used to transmit data between the outer folding mobile phone and peripheral equipment. It can also be used to connect earphones to play audio through the earphones. The interface can also be used to connect other electronic devices, such as projectors, game controllers, etc.

[0115] The mobile communication module can provide a solution for wireless communication including 2G / 3G / 4G / 5G, etc. applied to the outer folding mobile phone. The wireless communication module can provide a solution for wireless communication including wireless local area networks (WLAN), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared technology (IR), etc. applied to the outer folding mobile phone.

[0116] These functional elements can be changed according to user needs. It can be understood that the specific embodiments described above are only one specific implementation of the present application, and other ways that can implement the solutions of the present application are also within the scope of protection of the present application, and are not described here.

[0117] Referring back to FIG. 4, in the scenario of grounding the screen 500 of the smart phone, the inner side of the screen 500, i.e. the side of the screen 500 facing the inside of the mobile phone, is connected with the conductive spring 10, and the side of the screen 500 facing the inside of the mobile phone is also spaced apart from the middle plate 401a, so that the conductive spring 10 is compressed between the screen 500 and the middle plate 401a, thereby achieving grounding of the screen 500.

[0118] FIG. 5 is another example of a cross-sectional view of B-B in FIG. 3.

[0119] As shown in FIG. 5, the circuit board 600 of the smart phone has various electronic components such as resistors, capacitors, chips, etc. In order to shield the influence of external electromagnetic waves on the internal circuit and the radiation of internal electromagnetic waves to the outside, part of the electronic components need to be covered with a shielding cover 601, and in the scenario of grounding the shielding cover 601, the side of the shielding cover 601 away from the circuit board 600 is provided with a conductive spring 10, and the side of the shielding cover 601 away from the circuit board 600 is also spaced apart from the middle plate 401a, so that the conductive spring 10 is compressed between the shielding cover 601 and the middle plate 401a, thereby achieving grounding of the shielding cover 601.

[0120] Fig. 6 is a sectional view of another example of B-B in Fig. 3.

[0121] In addition to the grounding of the screen 500 and the circuit board 600, the conductive spring 10 in the present application can also be used for electrical connection between other functional elements, for example, as shown in Fig. 6, the antenna radiation branch 700 is made on the back cover 402 of the smart phone by laser direct structuring (LDS) technology or by flexible circuit board, the conductive spring 10 is arranged between the circuit board 600 and the back cover 402, so that the antenna radiation branch 700 on the circuit board 600 and the back cover 402 is electrically connected through the conductive spring 10. Generally, the back cover 402 is provided with two to four antenna radiation branches 700, each antenna radiation branch 700 is provided with two connection points, one of which is connected with the transmitting end of the excitation signal of the circuit board 600 through the conductive spring 10, the excitation signal is transmitted to the antenna radiation branch 700 through the conductive spring 10, the antenna radiation branch 700 generates electromagnetic wave signal according to the excitation signal, and the other connection point is connected with the grounding contact of the circuit board 600 through another conductive spring 10.

[0122] The electrical connection assembly provided by the embodiment of the present application will be described in detail in combination with the drawings.

[0123] The electrical connection assembly provided by the embodiment of the present application includes the second device 300 and the conductive spring 10, and the conductive spring 10 is electrically connected between the first device 200 and the second device 300. The first device 200 and the second device 300 can be the circuit board 600, the screen 500, the middle plate 401a, the antenna radiation branch 700, the shielding cover 601 and the like mentioned above, for example: the first device 200 can be the middle plate 401a, and the second device 300 can be the screen 500; or, the first device 200 can be the shielding cover 601, and the second device 300 can be the middle plate 401a; or, the first device 200 can be the circuit board 600, and the second device 300 can be the antenna radiation branch 700. It can be understood that the first device 200 and the second device 300 can also be any two functional elements which need to realize electrical connection.

[0124] Fig. 7 is a schematic view of an example of the conductive spring 10 provided by the embodiment of the present application. Fig. 8 is a side view of the conductive spring 10 in Fig. 7.

[0125] As shown in Figs. 7-8, in one embodiment provided by the present application, one end of the conductive spring 10 is used for fixed connection with the first device 200, and the other end of the conductive spring 10 is provided with the convex 12.

[0126] The material of the conductive spring 10 can be any of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, rhodium, or an alloy of multiple metals.

[0127] The convex bump 12 can be formed on the conductive spring 10 by stamping. Stamping refers to a processing and forming method in which a plate, a strip, a pipe, and a profile are subjected to an external force by a press and a die to produce plastic deformation or separation, thereby obtaining a workpiece (stamped part) with a desired shape and size. In this application, the convex bump 12 is formed on the conductive spring 10 by stamping, which has the advantages of simple process and large-scale production.

[0128] The convex bump 12 can also be formed on the conductive spring 10 by a laser etching process. The laser etching process refers to placing the conductive spring 10 blank after cutting into a laser etching machine. The laser etching machine can complete the processing of the convex bump 12 on the conductive spring 10 according to the image and parameter value of the convex bump 12. The principle is to focus a small-power laser with high beam quality on a very small light spot, form a high-power density on the light spot, move the light to the part of the conductive spring 10 blank where the convex bump 12 needs to be processed, and make the irradiated blank evaporate instantaneously, thereby forming the convex bump 12. The size accuracy of the convex bump 12 formed by laser etching is extremely high, thereby improving the matching accuracy of the convex bump 12 and the groove 20, and making the electrical connection assembly have a high yield.

[0129] The convex bump 12 can also be a separately processed convex bump structure, which is installed and fixed on the conductive spring 10 by welding, conductive adhesive bonding, clamping, or the like.

[0130] The first device 200 is provided with a solder pad or a contact. When the conductive spring 10 is connected to the first device 200, the conductive spring 10 and the solder pad or the contact of the first device 200 are electrically connected by welding, conductive adhesive bonding, or the like.

[0131] The first device 200 is provided with a metal-plated threaded hole, and the end of the conductive spring 10 away from the convex bump 12 is provided with a mounting hole. The conductive spring 10 can be installed on the first device 200 by a bolt to realize electrical connection between the two.

[0132] FIG. 9 is a schematic view of another example of the conductive spring 10 provided in the embodiments of the application. FIG. 10 is a side view of the conductive spring 10 in FIG. 9. FIG. 11 is a sectional view of an example of the conductive spring 10 and a second device 300 provided in the embodiments of the application.

[0133] As shown in FIGS. 9-11, in an embodiment provided by the present application, the second device 300 is spaced apart from the first device 200, and the second device 300 is provided with the groove 20 on the side facing the first device 200. One end of the conductive spring 10 is used to be fixedly connected with the first device 200, and the other end of the conductive spring 10 is provided with the convex 12 which is used to abut against at least part of the groove wall of the groove 20. The conductive spring 10 is further provided with the base 13, and the conductive spring 10 is fixedly connected with the first device 200 through the base 13.

[0134] The base 13 and the conductive spring 10 can be connected together by welding, conductive glue bonding, clamping, bolt locking, etc. Alternatively, the base 13 and the conductive spring 10 can also be integrally formed, which can be formed by a metal plate bending process.

[0135] The first device 200 is provided with a pad or a contact, and when the base 13 is connected with the first device 200, the base 13 and the pad or the contact of the first device 200 are electrically connected by welding, conductive glue bonding, etc.

[0136] The groove 20 is arranged on the side of the second device 300 facing the first device 200, and the groove wall of the groove 20 has conductivity, and the convex 12 can be driven by the conductive spring 10 to extend into the groove 20 and abut against the groove wall of the groove 20. The groove 20 arranged on the second device 300 can be that the second device 300 directly forms the groove 20, or the groove 20 can be indirectly arranged on the second device 300 by adding an intermediate component, which will be described in detail as follows.

[0137] As shown in FIG. 11, in an embodiment provided by the present application, the second device 300 directly forms the groove 20.

[0138] The groove wall of the groove 20 has conductivity, so that the convex 12 can be electrically connected after abutting contact. For example, when the second device 300 is a metal middle plate 401a, the groove 20 is formed on the middle plate 401a, and the groove wall of the groove 20 naturally has conductivity. When the second device 300 is a screen 500, the groove 20 can be arranged on the metal layer of the screen 500, so that the groove wall of the groove 20 has conductivity.

[0139] When the distance between the first device 200 and the second device 300 is small, the groove 20 is directly formed on the second device 300, so as to avoid using the components for forming the groove 20 to occupy the space between the first device 200 and the second device 300. Therefore, the electrical connection assembly in the embodiment can be applied to a narrower installation space.

[0140] The groove 20 can be directly formed on the second device 300 by a laser etching process, or can be processed on the second device 300 by a CNC (Computer Numerical Control) through grinding, cutting, drilling, turning, milling and the like.

[0141] Fig. 12 is a schematic view of the application of the electric connection assembly to a screen 500 grounding scenario.

[0142] As shown in Fig. 12, when the electric connection assembly in the embodiment is applied to a screen 500 grounding scenario, the specific technical solution is that the screen 500 includes a display module 501 and a metal layer 502, the metal layer 502 is arranged on one side of the display module 501 facing the middle plate 401a, the metal layer 502 is arranged on one side facing the middle plate 401a and is provided with a groove 20, the conductive spring 10 is fixed on the middle plate 401a through the base 13, and the convex bump 12 is abutted in the groove 20 of the metal layer 502, so as to realize the electric connection between the screen 500 and the middle plate 401a.

[0143] Fig. 13 is a schematic view of the application of the electric connection assembly to a shielding cover 601 grounding scenario.

[0144] As shown in Fig. 13, when the electric connection assembly in the embodiment is applied to a shielding cover 601 grounding scenario, the specific technical solution is that the middle plate 401a is arranged on one side facing the circuit board 600 and is provided with a groove 20, the conductive spring 10 is fixed on the shielding cover 601 through the base 13, and the convex bump 12 is abutted in the groove 20 of the middle plate 401a, so as to realize the electric connection between the shielding cover 601 and the middle plate 401a.

[0145] Fig. 14 is a schematic view of the application of the electric connection assembly to an antenna radiation branch and a circuit board electric connection scenario.

[0146] As shown in Fig. 14, when the electric connection assembly in the embodiment is applied to an antenna radiation branch 700 and a circuit board 600 electric connection scenario, the specific technical solution is that the back cover 402 is arranged on one side facing the circuit board 600 and is provided with an antenna radiation branch 700, the antenna radiation branch 700 is arranged on one side facing the circuit board 600 and is provided with two grooves 20, two conductive springs 10 are fixed on the circuit board 600 through the base 13, and two convex bumps 12 are abutted in the two grooves 20 of the antenna radiation branch 700, so as to realize the electric connection between the antenna radiation branch 700 and the circuit board 600.

[0147] Fig. 15 is a sectional view of another example of the conductive spring 10 and the second device 300.

[0148] As shown in FIG. 15, in an embodiment provided by the present application, the second device 300 is provided with the conductive block 30, the conductive block 30 is provided with the groove 20, the conductive block 30 is fixedly connected to the second device 300 and the groove 20 faces the first device 200, so that the groove 20 is arranged on the second device 300 through the conductive block 30.

[0149] In the embodiment, the groove 20 is arranged on the second device 300 in an indirect way, which can reduce the manufacturing difficulty of the product and improve the yield of the product, and the specific reasons are as follows: the groove 20 is directly arranged on the second device 300, which is difficult to process, and the inaccurate position of the groove 20 will cause the second device 300 to be scrapped as a whole, and the groove 20 is arranged on the conductive block 30, even if the conductive block 30 is scrapped due to the processing error, it will not affect the second device 300, and because the size of the conductive block 30 is larger, when the conductive block 30 and the second device 300 are electrically connected through the contact or the pad, the assembly difficulty of the two is smaller, and the position of the conductive block 30 relative to the second device 300 in the horizontal direction, that is, the X direction and the Y direction in FIG. 15, can be adjusted, which makes the position of the groove 20 relative to the second device 300 in the X direction and the Y direction adjustable, so that the groove 20 has higher flexibility when it is aligned with the convex block 12, thereby reducing the assembly difficulty of the conductive spring piece 10, and overall, reducing the manufacturing difficulty of the product and improving the yield of the product.

[0150] The material of the conductive block 30 can be any one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, rhodium, or an alloy of multiple metals.

[0151] As shown in FIG. 15, in an embodiment provided by the present application, the conductive block 30 can be fixedly connected to the side surface of the second device 300 facing the first device 200.

[0152] FIG. 16 is a sectional view of another example of the conductive spring piece 10 and the second device 300 provided by the embodiment of the present application.

[0153] As shown in FIG. 16, in an embodiment provided by the present application, the second device 300 is provided with the avoiding groove 301, and part of the conductive block 30 is fixedly connected in the avoiding groove 301.

[0154] In the embodiment, the second device 300 is provided with the avoiding groove 301 for accommodating and mounting the conductive block 30, so that the conductive block 30 is conveniently positioned and mounted on the second device 300, and part of the conductive block 30 can be sunk into the interior of the second device 300, avoiding too much conductive block 30 protruding from the surface of the second device 300, so that the space between the second device 300 and the first device 200 is less affected by the occupation of the conductive block 30, and the electric connection assembly can be applied to a narrower installation space.

[0155] FIG. 17 is a sectional view of another example of the conductive spring 10 and the second device 300 provided in the embodiment.

[0156] As shown in FIG. 17, in an embodiment provided in the application, the second device 300 is provided with the avoiding groove 301, and the conductive block 30 is fixedly connected in the avoiding groove 301, and the conductive block 30 is sunk in the avoiding groove 301.

[0157] In the embodiment, the second device 300 is provided with the avoiding groove 301 for accommodating and mounting the conductive block 30, so that the conductive block 30 is conveniently positioned and mounted on the second device 300, and part of the conductive block 30 can be sunk into the interior of the second device 300, avoiding too much conductive block 30 protruding from the surface of the second device 300, so that the space between the second device 300 and the first device 200 is less affected by the occupation of the conductive block 30, and the electric connection assembly can be applied to a narrower installation space.

[0158] FIG. 18 is a sectional view of another example of the conductive spring 10 and the second device 300 provided in the embodiment.

[0159] As shown in FIG. 18, in an embodiment provided in the application, along the thickness direction of the second device 300, i.e. the Z direction in FIG. 18, the avoiding groove 301 can pass through the two side walls of the second device 300.

[0160] In the embodiment, by designing the avoiding groove 301 as a through groove, i.e. the avoiding groove 301 passing through the two side walls of the second device 300 in the thickness direction, the conductive block 30 has a certain position adjustment allowance in the thickness direction of the second device 300, which makes the position of the recess 20 adjustable relative to the second device 300 in the thickness direction, especially when the gap height between the second device 300 and the first device 200 is too small, the installation difficulty of the conductive spring 10 can be reduced, and the embodiment is also applicable to the conductive spring 10 with a higher free height, and has higher universality.

[0161] The pads 302 or contacts of the second device 300 can be arranged on the groove wall of the relief groove 301, so that the electrical connection with the conductive block 30 can be facilitated. The pads 302 or contacts of the second device 300 can be arranged on the groove bottom wall of the relief groove 301, for example, as shown in FIG. 16; or the pads 302 or contacts of the second device 300 can also be arranged on the groove side wall of the relief groove 301, for example, as shown in FIGS. 17 and 18.

[0162] Optionally, the conductive block 30 can have a certain amount of interference, and is fixed in the relief groove 301 by clamping; or in the case where there is a gap between the conductive block 30 and the relief groove 301, the conductive block 30 can be adhered in the relief groove 301 by conductive glue.

[0163] FIG. 19 is a comparison schematic diagram of an example of the conductive spring in the electrical connection assembly and related technologies provided by the embodiments of the present application.

[0164] As shown in FIG. 19, and in combination with FIG. 2, in the conductive spring in the related technologies, the convex bump 02 is in abutment with the screen 03 under the elastic force of the conductive spring 01, and the effective contact surface of the entire conductive spring with the screen 03 is the flat area where the convex bump 02 is pressed flat, and the deformed part of the convex bump 02 under pressure is the filling part indicated by D in FIG. 19.

[0165] Continuing to refer to FIG. 19, and in combination with FIG. 11, in the electrical connection assembly in the embodiments of the present application, the convex bump 12 is also in abutment with the groove wall of the recess 20 under the elastic force of the conductive spring 10, and assuming that the surface type of the groove wall of the recess 20 is a spherical surface, then the effective contact surface of the entire conductive spring 10 with the second device 300 is the area where the convex bump 12 is pressed into a spherical surface, and the deformed part of the convex bump 12 under pressure is the filling part indicated by C in FIG. 19.

[0166] Again assuming that the area where the convex bump 12 is pressed into a spherical surface is approximately equal to the area of the flat area of the convex bump 02 described above, it can be seen from the comparison in FIG. 19 that the deformed part indicated by C is obviously smaller than the deformed part indicated by D, and therefore it can be determined that, under the condition of achieving the same effective contact area of the conductive spring 10 in the related technologies with the opposite side, the degree of deformation of the convex bump 12 of the conductive spring 10 in the embodiments of the present application is smaller, that is, the elastic force of the conductive spring 10 on the convex bump 12 is smaller, and therefore the requirement for the elastic force of the conductive spring 10 can be weakened, and the conductive spring 10 in the embodiments of the present application can also achieve sufficient contact with the second device 300 under a weak pressing force.

[0167] In summary, the electric connection assembly provided by the embodiments of the present application sets the groove 20 on the second device 300, and the convex 12 of the conductive spring 10 is matched with the groove 20, so that the convex 12 can be inserted into the groove 20 and abut against the groove wall under the driving of the conductive spring 10. Under the condition that the conductive spring 01 in the related art and the device to be connected have the same effective contact area, the degree of extrusion deformation of the convex 12 of the conductive spring 10 in the embodiments of the present application is smaller, that is, the elastic force of the conductive spring 10 acting on the convex 12 is smaller, so that the elastic force requirement of the conductive spring 10 can be weakened, and thus the conductive spring 10 in the embodiments of the present application can also achieve sufficient contact with the second device 300 under the condition of weak extrusion force.

[0168] When the electric connection assembly in the embodiments of the present application is applied to the scenario of grounding the screen 500, under the premise of achieving the same effective contact area of the conductive spring 01 in the related art, that is, achieving the same third harmonic, the extrusion force required by the conductive spring 10 in the embodiments of the present application is smaller, which can avoid the screen 500 from appearing in the mold. If the conductive spring 10 in the embodiments of the present application is subjected to the same extrusion force as the conductive spring 01 in the related art, the effective contact area of the conductive spring 10 with the screen 500 can be increased, thereby increasing the conductive path of the conductive spring 10 with the screen 500, enhancing the conductivity of the conductive spring 10, thereby weakening or even avoiding the generation of the third harmonic, so as to ensure that the radiation spurious test of the electronic equipment is successfully passed.

[0169] When the conventional conductive spring 01 is used, the required extrusion force is greater than 0.5N when the conductive spring 01 is compressed to a working height of 1mm, while the electric connection assembly in the embodiments of the present application is used, the required extrusion force is only 0.3-0.4N when the conductive spring 10 is compressed to a working height of 1mm.

[0170] In addition, due to the electric connection assembly in the embodiment of the present application, the convex 12 of the conductive spring 10 can be in full contact with the second device 300 under the condition of weak extrusion force, so that the elastic force requirement of the conductive spring 10 can be weakened, and the base material usage of the conductive spring 10 can be reduced, so that the hand feeling of the conductive spring 10 is soft, that is, the elastic modulus of the conductive spring 10 is reduced, so that the elastic force generated by the conductive spring 10 under the condition of the same deformation amount is weaker. Based on this, in order to reduce the base material usage of the conductive spring 10, the conductive spring 10 can be made thin or thin, which will inevitably reduce the free height and overall size of the conductive spring 10, so that the electric connection assembly provided by the embodiment of the present application can meet the requirements of miniaturization and light and thin use scene. For example, as shown in FIG. 5, under the development trend of the smart phone becoming lighter and thinner, the internal space of the smart phone is very compact, which leads to that the circuit board 600 is very close to the middle plate 401a, and it is very difficult to additionally arrange the shielding cover 601 between the circuit board 600 and the middle plate 401a, and additionally arrange the conventional conductive spring 01 between the shielding cover 601 and the middle plate 401a, while the electric connection assembly provided by the embodiment of the present application can be conveniently applied in such a scene.

[0171] The free height of the conventional conductive spring 01 which is not compressed is 1.5-2mm, and it is assumed that it is used between the shielding cover 601 and the middle plate 401a, it is necessary to ensure that the gap height between the shielding cover 601 and the middle plate 401a is greater than 0.5mm, so that the assembly and use can be smoothly carried out. While using the electric connection assembly provided by the embodiment of the present application, the free height of the conductive spring 10 which is not compressed is 1-1.5mm, and it is only necessary to ensure that the gap height between the shielding cover 601 and the middle plate 401a is greater than 0.2mm, so that it can be used, and it is more suitable for the use scene of narrow gap.

[0172] In addition, when the electric connection assembly in the embodiment of the present application is applied to electric connection between other functional elements, for example, as shown in FIG. 6, the antenna radiation branches 700 on the circuit board 600 and the back cover 402 are electrically connected through the conductive spring 10, and the bulge of the back cover 402 can be avoided, and the connection reliability of the back cover 402 and the middle frame 401 can be ensured. The specific reasons are as follows: since the number of the antenna radiation branches 700 on the back cover 402 is large, and each antenna radiation branch 700 has two connection points that need to be electrically connected with the circuit board 600, if the conventional conductive spring 01 in FIG. 2 is used, the extrusion force of the antenna radiation branches 700 and the circuit board 600 on the conductive spring 01 needs to be increased under the condition that the convex bump 02 and the antenna radiation branches 700 are in sufficient contact, and the elastic force of the conductive spring 01 will act on the back cover 402 to cause the back cover 402 to be deformed to form a bulge. In addition, the static stress of the back cover 402 caused by the multiple conductive springs 01 acting on the back cover 402 at the same time is large, which further causes the connection between the back cover 402 and the middle frame 401 to be unstable. For example, in the case of falling or vibration, the risk of separation between the back cover 402 and the middle frame 401 is increased, and the connection reliability is poor. However, by using the electric connection assembly in the embodiment of the present application, the convex bump 12 and the antenna radiation branches 700 can be in sufficient contact under the condition of weak extrusion, and the bulge of the back cover 402 can be avoided. Even if the number of the conductive springs 10 needed is large, the static stress of the back cover 402 will not be large, so that the connection reliability of the back cover 402 and the middle frame 401 can be ensured.

[0173] The conductive spring 10 can be a straight plate structure as shown in FIGS. 7 and 8, or the conductive spring 10 can also be a bent structure as shown in FIGS. 9 and 10. The conductive spring 10 in the two structures drives the convex bump 12 to move when the conductive spring 10 is elastically swung, and the movement trajectory of the convex bump 12 is an arc. In another embodiment provided by the present application, the conductive spring 10 can also be a spiral structure similar to a spring. The conductive spring 10 in this structure drives the convex bump 12 to move when the conductive spring 10 is elastically swung, and the movement trajectory of the convex bump 12 is a straight line along the Z direction.

[0174] In an embodiment provided by the present application, the maximum cross-sectional area of the convex bump 12 is smaller than the opening area of the groove 20. Alternatively, it can be said that the transverse dimension of the convex bump 12 on the conductive spring 10 is smaller than the opening area of the groove 20.

[0175] In the embodiment, the maximum cross-sectional area of the convex bump 12 is smaller than the opening area of the groove 20, so that the convex bump 12 can be easily inserted into the groove 20 when the convex bump 12 and the groove 20 are aligned and abutted, thereby reducing the assembly difficulty of the conductive spring 10, the first device 200 and the second device 300.

[0176] The structure of the convex bump 12 and the groove 20 provided by the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0177] FIG. 20 is a schematic view of an example of a second device 300 provided by the embodiments of the present application. As shown in FIG. 20, the groove 20 is formed on the second device 300, and the surface type of the groove wall of the groove 20 can be a spherical surface, or the surface type of the groove wall of the groove 20 can also be an ellipsoidal surface. As further shown in FIG. 20, the groove 20 can also be directly formed on the second device 300.

[0178] FIG. 21 is a schematic view of an example of the convex bump 12 extending into the groove 20 provided by the embodiments of the present application.

[0179] As shown in FIG. 21, in one embodiment provided by the present application, the surface type of the groove wall of the groove 20 is a spherical surface, and the surface type of the outer surface of the convex bump 12 is also a spherical surface. In this embodiment, the curvature radius of the groove 20 is greater than the curvature radius of the convex bump 12, so that the projected area of the convex bump 12 on the surface of the conductive spring 10 is less than the opening area of the groove 20.

[0180] FIG. 22 is a schematic view of another example of the convex bump 12 extending into the groove 20 provided by the embodiments of the present application.

[0181] As shown in FIG. 22, in one embodiment provided by the present application, the surface type of the groove wall of the groove 20 is an ellipsoidal surface, and the surface type of the outer surface of the convex bump 12 is a spherical surface.

[0182] FIG. 23 is a schematic view of another example of the convex bump 12 extending into the groove 20 provided by the embodiments of the present application.

[0183] As shown in FIG. 23, in one embodiment provided by the present application, the surface type of the groove wall of the groove 20 is a spherical surface, and the surface type of the outer surface of the convex bump 12 is an ellipsoidal surface.

[0184] FIG. 24 is a schematic view of another example of the convex bump 12 extending into the groove 20 provided by the embodiments of the present application.

[0185] As shown in FIG. 24, in one embodiment provided by the present application, the surface type of the groove wall of the groove 20 and the surface type of the outer surface of the convex bump 12 are both ellipsoidal surfaces.

[0186] FIG. 25 is a schematic view of another example of the second device 300 provided by the embodiments of the present application. As shown in FIG. 25, the groove 20 is formed on the second device 300, and the surface type of the groove wall of the groove 20 can be a conical surface, or the surface type of the groove wall of the groove 20 can also be a combination of a spherical surface and a conical surface, or the surface type of the groove wall of the groove 20 can also be a combination of an ellipsoidal surface and a conical surface.

[0187] FIG. 26 is a schematic view of another example of the convex bump 12 extending into the groove 20 provided by the embodiments of the present application.

[0188] As shown in FIG. 26, in an embodiment provided by the present application, the surface type of the groove wall of the recess 20 is a conical surface, and the surface type of the outer surface of the convex 12 is a spherical surface.

[0189] FIG. 27 is a contrastive schematic view of another example of the conductive spring in the electric connection assembly and related art provided by the embodiment of the present application.

[0190] As shown in FIG. 27, and in combination with FIG. 26, in the electric connection assembly of the embodiment of the present application, when the surface type of the groove wall of the recess 20 is a conical surface, and the surface type of the outer surface of the convex 12 is a spherical surface, the convex 12 is in abutment with the groove wall of the recess 20 under the elastic force of the conductive spring 10, and then the effective contact surface of the entire electric connection assembly with the second device 300 is the region where the convex 12 is squeezed into a conical surface, and the deformed part of the convex 12 under pressure is the filling part indicated by E in the figure. As can be seen from the contrast in FIG. 27, the deformed part indicated by E is obviously smaller than the deformed part indicated by D, and therefore it can be determined that, under the condition of achieving the same effective contact area of the conductive spring in related art with the opposite side, the degree of deformation of the convex 12 in the electric connection assembly of the embodiment of the present application is smaller, that is, the elastic force of the conductive spring 10 on the convex 12 is smaller, and therefore the elastic force requirement of the conductive spring 10 can be weakened, and the electric connection assembly of the embodiment of the present application can also achieve sufficient contact with the second device 300 under the condition of weak extrusion force.

[0191] FIG. 28 is a schematic view of another example of the convex 12 extending into the recess 20 provided by the embodiment of the present application.

[0192] As shown in FIG. 28, in an embodiment provided by the present application, the surface type of the groove wall of the recess 20 is a conical surface, and the surface type of the outer surface of the convex 12 is an ellipsoidal surface.

[0193] FIG. 29 is a schematic view of another example of the convex 12 extending into the recess 20 provided by the embodiment of the present application.

[0194] As shown in FIG. 29, in an embodiment provided by the present application, the surface type of the groove wall of the recess 20 is a combination of a spherical surface and a conical surface, and the surface type of the outer surface of the convex 12 is a spherical surface.

[0195] The surface type of the groove wall of the groove 20 is a combination of a spherical surface and a conical surface. Specifically, the groove wall of the groove 20 is divided into two regions along the depth direction of the groove 20 (i.e., the thickness direction of the second device 300, i.e., the Z direction in FIG. 29). The region close to the opening of the groove 20 is provided as a conical surface, and the region away from the opening of the groove 20 is provided as a spherical surface. In this way, when the convex bump 12 extends into the groove 20, part of the convex bump 12 abuts against the conical surface groove wall of the groove 20, and part of the convex bump 12 abuts against the spherical surface groove wall of the groove. This can increase the abutting position and the contact area of the convex bump 12 and the groove 20.

[0196] As shown in FIG. 29, the surface type of the groove wall of the groove 20 is a combination of a spherical surface and a conical surface. Compared with the groove 20 with a single surface type, such as the groove 20 with a groove wall of only a spherical surface as shown in FIG. 21, or the groove 20 with a groove wall of only a conical surface as shown in FIG. 26, the convex bump 12 and the groove 20 in this embodiment have more abutting positions and contact areas.

[0197] FIG. 30 is a schematic view of another example of the convex bump 12 extending into the groove 20 according to an embodiment of the present application.

[0198] As shown in FIG. 30, in an embodiment provided by the present application, the surface type of the groove wall of the groove 20 is a combination of a spherical surface and a conical surface, and the surface type of the outer surface of the convex bump 12 is an ellipsoidal surface.

[0199] FIG. 31 is a schematic view of another example of the second device 300 according to an embodiment of the present application. As shown in FIG. 31, in an embodiment provided by the present application, the groove 20 is formed on the second device 300. The groove 20 can be a strip-shaped groove 21 with an arc-shaped cross section.

[0200] As shown in FIG. 31, in an embodiment provided by the present application, the strip-shaped groove 21 penetrates through the opposite side walls of the second device 300 along the length direction of the strip-shaped groove 21. In another embodiment provided by the present application, the strip-shaped groove 21 penetrates through any one side wall of the second device 300 along the length direction of the strip-shaped groove 21. In another embodiment provided by the present application, the strip-shaped groove 21 does not penetrate through the side wall of the second device 300 along the length direction of the strip-shaped groove 21.

[0201] In an embodiment provided by the present application, the groove 20 can be a strip-shaped groove 21 with an arc-shaped cross section, and the surface type of the outer surface of the convex bump 12 is a spherical surface or an ellipsoidal surface.

[0202] In this embodiment, the surface type of the groove wall of the groove 20 is spherical surface, ellipsoidal surface, conical surface, etc., the structure of the strip-shaped groove 21 does not need to consider the concentricity with the convex bump 12 excessively, thus the strip-shaped groove 21 is easier to process and easier to assemble with the convex bump 12, and the manufacturing difficulty and assembly difficulty of the electric connection assembly can be reduced.

[0203] FIG. 32 is a partial schematic view of the conductive elastic sheet 10 according to an embodiment of the present application. FIG. 33 is a schematic view of another example of the convex bump 12 extending into the groove 20 according to an embodiment of the present application.

[0204] As shown in FIGS. 32 and 33, in an embodiment provided by the present application, the groove 20 can be a strip-shaped groove 21 with an arc-shaped cross section, and the convex bump 12 is a semi-cylindrical body, and the arc surface of the semi-cylindrical body abuts against the groove wall of the strip-shaped groove 21.

[0205] It can be understood that the semi-cylindrical body refers to a cylindrical body formed by cutting a complete cylinder along its axial direction, and the cutting surface is connected with the conductive elastic sheet 10, and the arc surface opposite to the cutting surface abuts against the groove wall of the strip-shaped groove 21.

[0206] It can be understood that the semi-cylindrical body refers to a cylindrical body formed by cutting a complete cylinder along its axial direction, and the cutting surface is connected with the conductive elastic sheet 10, and the arc surface opposite to the cutting surface abuts against the groove wall of the strip-shaped groove 21.

[0207] FIG. 34 is a schematic view of another example of the second device 300 according to an embodiment of the present application. FIG. 35 is a schematic view of another example of the conductive elastic sheet 10 according to an embodiment of the present application. FIG. 36 is a schematic view of another example of the convex bump 12 extending into the groove 20 according to an embodiment of the present application, wherein the conductive elastic sheet 10 in FIG. 36 only shows the elastic arm 11.

[0208] As shown in FIGS. 34-36, in an embodiment provided by the present application, the groove 20 is a plurality of strip-shaped grooves 21, the cross section of each strip-shaped groove 21 is arc-shaped, the plurality of strip-shaped grooves 21 are arranged along a straight line, and the convex bump 12 is a semi-cylindrical body. In addition, the conductive elastic sheet 10 and the strip-shaped groove 21 also need to satisfy a certain positional relationship, specifically, as shown in FIG. 35, a substantially flat part of the conductive elastic sheet 10 is defined as the elastic arm 11, the convex bump 12 is arranged on the elastic arm 11, one end of the elastic arm 11 with the convex bump 12 is defined as the first end portion 14, and an end of the elastic arm 11 away from the convex bump 12 is defined as the second end portion 15. The projection of the elastic arm 11 on the surface of the second device 300, the projection of the first end portion 14 points to the direction of the projection of the second end portion 15, and is parallel or consistent with the arrangement direction of the strip-shaped groove 21.

[0209] Fig. 37 is a top view of the convex bump 12 and the second device 300 in Fig. 36, as shown in Fig. 37, the direction in which the projection of the first end portion 14 points to the projection of the second end portion 15 is the b direction in Fig. 37, and the arrangement direction of the strip-shaped slot 21 is the c direction in Fig. 37, the b direction is parallel to the c direction.

[0210] In the embodiment, the position relationship between the conductive spring 10 and the strip-shaped slot 21 is defined as above, when the conductive spring 10 and the second device 300 are assembled, the slot wall of the convex bump 12 and any strip-shaped slot 21 can be easily abutted without using special alignment devices (for example, a visual alignment system (CCD)) to perform accurate alignment operation, thereby reducing the assembly difficulty of the conductive spring 10 and the second device 300, and further reducing the assembly difficulty of the entire assembly.

[0211] Fig. 38 is a schematic view of another example of the convex bump 12 extending into the recess 20 provided in the embodiment of the application, wherein the conductive spring 10 in Fig. 38 only shows the spring arm 11.

[0212] As shown in Fig. 38, in an embodiment provided by the application, the recess 20 is a plurality of strip-shaped slots 21, the cross section of each strip-shaped slot 21 is arc-shaped, the plurality of strip-shaped slots 21 are arranged along a straight line, and the surface type of the outer surface of the convex bump 12 is spherical. In addition, the position relationship between the conductive spring 10 and the strip-shaped slot 21 in the embodiment is that the projection of the spring arm 11 to the surface of the second device 300, the direction in which the projection of the first end portion 14 points to the projection of the second end portion 15 is parallel or consistent with the arrangement direction of the strip-shaped slot 21.

[0213] Continuing to refer to Fig. 38, assuming that the surface type of the outer surface of the convex bump 12 is spherical, the radius of the convex bump 12 is 0.3-0.4 mm, and the convex height is 0.1-0.2 mm; the number of the strip-shaped slots 21 is four, the cross section of each strip-shaped slot 21 is circular arc-shaped, the circular arc radius is 0.5 mm-0.8 mm, and the width of the strip-shaped slot 21 is about 1 mm. Without using special alignment devices for alignment, the convex bump 12 of the conductive spring 10 can easily extend into any strip-shaped slot 21 and abut the slot wall of the strip-shaped slot 21, so that the conductive spring 10 and the second device 300 are fully contacted. Therefore, in the embodiment, through the design of the strip-shaped slot 21 as above, the conductive spring 10, the first device 200 and the second device 300 can be easily assembled, and the assembly difficulty of the entire assembly can be reduced.

[0214] Fig. 39 is a schematic view of another example of the convex bump 12 extending into the recess 20 provided in the embodiment of the application, wherein the conductive spring 10 in Fig. 39 only shows the spring arm 11.

[0215] As shown in FIG. 39, in an embodiment provided by the present application, the cross section of the strip-shaped groove 21 is arc-shaped, the number is one, and the surface type of the outer surface of the convex 12 is spherical. In addition, the conductive elastic sheet 10 and the strip-shaped groove 21 also need to satisfy a certain positional relationship, specifically: the projection of the elastic arm 11 to the surface of the second device 300, the projection of the first end portion 14 points to the direction of the projection of the second end portion 15, and is parallel or consistent with the length direction of the strip-shaped groove 21. The convex 12 can slide along the length direction of the strip-shaped groove 21 on the groove wall of the strip-shaped groove 21.

[0216] FIG. 40 is a top view of the convex 12 and the second device 300 in FIG. 39. As shown in FIG. 40, the direction of the projection of the first end portion 14 pointing to the projection of the second end portion 15 is the b direction in FIG. 40, and the length direction of the strip-shaped groove 21 is the a direction in FIG. 40, which is parallel to the b direction.

[0217] In the embodiment, the positional relationship between the conductive elastic sheet 10 and the strip-shaped groove 21 is limited as described above, which can improve the abutting stability of the convex 12 and the strip-shaped groove 21, and further ensure that the convex 12 reliably and sufficiently contacts the second device 300. How to understand this advantage will be described in detail below in combination with the drawings.

[0218] FIG. 41 is a sectional view of C-C in FIG. 39, which is also a dynamic effect diagram of the convex 12 extending into the groove 20.

[0219] As shown in FIG. 41, the solid conductive elastic sheet 10 and the convex 12 represent the effect diagram of the conductive elastic sheet 10 being slightly extruded, and also represent the effect diagram of the conductive elastic sheet 10 at a larger working height; the dashed conductive elastic sheet 10 and the convex 12 represent the effect diagram of the conductive elastic sheet 10 being severely extruded, and also represent the effect diagram of the conductive elastic sheet 10 at a smaller working height; the a direction in the figure represents the length direction of the strip-shaped groove 21. Continue to refer to FIG. 41, the fixed positions of the solid conductive elastic sheet 10 and the dashed conductive elastic sheet 10 on the first device 200, that is, the positions in the a direction are the same, while the positions of the solid convex 12 and the dashed convex 12 in the a direction are different, and there is a displacement d in the a direction. This is because the swing track of the end portion of the conductive elastic sheet 10 is an arc when the conductive elastic sheet 10 is extruded, which causes the convex 12 to produce displacement in the a direction. Since the length direction of the strip-shaped groove 21 is the a direction, no matter whether the conductive elastic sheet 10 is slightly extruded or severely extruded, or the change between slight extrusion and severe extrusion, the convex 12 is always located in the strip-shaped groove 21 and abuts against the groove wall, the abutting stability of the convex 12 and the strip-shaped groove 21 is good, and further the convex 12 can reliably and sufficiently contact the second device 300.

[0220] In some special use scenarios, for example, the antenna radiation branch 700 on the circuit board 600 and the back cover 402 is electrically connected through the electrical connection assembly. When a user uses the smart phone, the user is bound to press the back cover 402 of the smart phone, and the pressing action will cause the distance between the antenna radiation branch 700 and the circuit board 600 to change. In this case, the electrical connection assembly adopts the design in the above embodiment, which can ensure that the convex bump 12 reliably and sufficiently contacts the antenna radiation branch 700, thereby ensuring the electrical connection stability of the circuit board 600 and the antenna radiation branch 700.

[0221] Optionally, in another embodiment provided in the present application, the surface type of the outer surface of the convex bump 12 is a spherical surface or an ellipsoidal surface, and the positional relationship between the conductive spring piece 10 and the strip-shaped groove 21 is not specially limited.

[0222] As shown in FIG. 36, in an embodiment provided in the present application, the groove 20 is a plurality of strip-shaped grooves 21, the cross section of each strip-shaped groove 21 is arc-shaped, and the convex bump 12 is a semi-cylindrical body, and the axis 50 of the semi-cylindrical body is parallel to the length direction of the strip-shaped groove 21.

[0223] In the embodiment, the axis 50 of the semi-cylindrical body is parallel to the length direction of the strip-shaped groove 21, which can enable the convex bump 12 to sufficiently contact the groove wall of the strip-shaped groove 21. How to understand the advantage will be described below in conjunction with the drawings.

[0224] FIG. 42 is a schematic view of the axis 50 of the semi-cylindrical body and the length direction of the strip-shaped groove 21 having an included angle. As shown in FIG. 42, if the axis 50 of the semi-cylindrical body is not parallel to the length direction of the strip-shaped groove 21, it may cause the convex bump 12 to be unable to completely extend into the strip-shaped groove 21, thereby causing the convex bump 12 to be unable to sufficiently contact the groove wall of the strip-shaped groove 21. Or, even if the convex bump 12 can extend into the strip-shaped groove 21, only the axial two ends of the convex bump 12 can contact the groove wall of the strip-shaped groove 21, and most of the surface of the convex bump 12 cannot contact the groove wall of the strip-shaped groove 21. Therefore, in order to avoid the problem, the embodiment limits that the axis 50 of the semi-cylindrical body is parallel to the length direction of the strip-shaped groove 21, which can ensure that the convex bump 12 can extend into the strip-shaped groove 21, and ensure that most of the surface of the convex bump 12 contacts the groove wall of the strip-shaped groove 21.

[0225] FIG. 43 is a schematic view of another example of the second device 300 provided in the embodiment of the present application. As shown in FIG. 43, the second device 300 is provided with a groove 20, which can be a strip-shaped groove 21 with a V-shaped cross section.

[0226] In an embodiment provided in the present application, the groove 20 can be a strip-shaped groove 21 with a V-shaped cross section, and the surface type of the outer surface of the convex bump 12 is a spherical surface or an ellipsoidal surface.

[0227] Fig. 44 is a schematic view of another example of the convex bump 12 extending into the groove 20 according to an embodiment of the present application.

[0228] As shown in Fig. 44, in an embodiment of the present application, the groove 20 can be a strip-shaped groove 21 with a V-shaped cross section, and the convex bump 12 can be a semi-cylindrical body.

[0229] Fig. 45 is a schematic view of another example of the second device 300 according to an embodiment of the present application. Fig. 46 is a schematic view of another example of the convex bump 12 extending into the groove 20 according to an embodiment of the present application.

[0230] As shown in Figs. 45 and 46, in an embodiment of the present application, the number of the strip-shaped grooves 21 with a V-shaped cross section can be multiple, and the multiple strip-shaped grooves 21 can be arranged in a row. The surface type of the outer surface of the convex bump 12 can be a spherical surface.

[0231] Fig. 47 is a schematic view of another example of the convex bump 12 extending into the groove 20 according to an embodiment of the present application.

[0232] As shown in Fig. 47, in an embodiment of the present application, the number of the strip-shaped grooves 21 with a V-shaped cross section can be multiple, and the multiple strip-shaped grooves 21 can be arranged in a row. The convex bump 12 can be a semi-cylindrical body.

[0233] Further, in order to enable the side surface of the convex bump 12 to sufficiently contact the groove wall of the strip-shaped groove 21, in an embodiment of the present application, the axis 50 of the convex bump 12 can be parallel to the length direction of the strip-shaped groove 21 with a V-shaped cross section.

[0234] In some embodiments of the present application, the number of the grooves 20 can be multiple, and the multiple grooves 20 can be arranged in a straight line. The surface type of the groove wall of each groove 20 can be at least one of a spherical surface, an ellipsoidal surface, and a conical surface. The surface type of the outer surface of the convex bump 12 can be a spherical surface or an ellipsoidal surface.

[0235] Finally, it should be noted that the above description is merely specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electrical connection assembly for electrically connecting a first device (200), characterized by, The electric connection assembly comprises: a second device (300) disposed apart from the first device (200), one side of the second device (300) being provided with a groove (20) facing the first device (200); a conductive spring piece (10), one end of the conductive spring piece (10) being used for fixed connection with the first device (200), the other end of the conductive spring piece (10) being provided with a convex bump (12), the convex bump (12) being used for abutting with at least part of the groove wall of the groove (20).

2. The electrical connection assembly of claim 1, wherein, The groove (20) is a strip-shaped groove (21).

3. An electrical connection assembly according to claim 2, wherein, The conductive spring piece (10) comprises a spring arm (11), an end of the spring arm (11) being a first end (14) of the convex bump (12), the other end of the spring arm (11) being a second end (15) away from the convex bump (12), the direction of the projection of the first end (14) on the surface of the second device (300) to the projection of the second end (15) on the surface of the second device (300) being parallel to the length direction of the strip-shaped groove (21); the convex bump (12) can slide along the length direction of the strip-shaped groove (21) along the groove wall of the strip-shaped groove (21).

4. An electrical connection assembly according to claim 3, wherein, The surface type of the outer surface of the convex bump (12) is a spherical surface or an ellipsoidal surface.

5. The electrical connection assembly of claim 2, wherein, The convex bump (12) is a semi-cylinder, the arc surface of the semi-cylinder abutting with the groove wall of the strip-shaped groove (21), the axis (50) of the semi-cylinder being parallel to the length direction of the strip-shaped groove (21).

6. The electrical connection assembly of claim 1, wherein, The number of the grooves (20) is multiple, and the multiple grooves (20) are arranged along a straight line.

7. An electrical connection assembly according to claim 6, wherein, The conductive spring piece (10) comprises a spring arm (11), an end of the spring arm (11) being a first end (14) of the convex bump (12), the other end of the spring arm (11) being a second end (15) away from the convex bump (12), the direction of the projection of the first end (14) on the surface of the second device (300) to the projection of the second end (15) on the surface of the second device (300) being parallel to the arrangement direction of the groove (20).

8. An electrical connection assembly according to claim 7, wherein, The groove (20) is a strip-shaped groove (21), the length directions of any two strip-shaped grooves (21) being parallel, the convex bump (12) being a semi-cylinder, the arc surface of the semi-cylinder abutting with the groove wall of the strip-shaped groove (21), the axis (50) of the semi-cylinder being parallel to the length direction of the strip-shaped groove (21).

9. An electrical connection assembly according to claim 7, wherein, The surface type of the groove wall of the groove (20) is at least one of a spherical surface, an ellipsoidal surface and a conical surface, and the surface type of the outer surface of the convex bump (12) is a spherical surface or an ellipsoidal surface.

10. An electrical connection assembly according to any one of claims 2-5, 8, wherein, The cross section of the strip-shaped groove (21) is arc-shaped or V-shaped.

11. The electrical connection assembly of any one of claims 1-10, wherein, The maximum cross-sectional area of the convex bump (12) is smaller than the opening area of the groove (20).

12. The electrical connection assembly of any one of claims 1-11, wherein, The groove (20) is arranged on the surface of one side of the second device (300) facing the first device (200).

13. The electrical connection assembly of any one of claims 1-11, wherein, The second device (300) is provided with a conductive block (30) on one side of the first device (200), and the conductive block (30) is provided with the groove (20) on one side of the first device (200).

14. An electrical connection assembly according to claim 13, wherein, The second device (300) is provided with an avoiding groove (301), and at least part of the conductive block (30) is fixedly arranged in the avoiding groove (301).

15. An electrical connection assembly according to claim 14, wherein, The avoiding groove (301) penetrates through two side walls of the second device (300) in the thickness direction of the second device (300).

16. The electrical connection assembly of any one of claims 1-15, wherein, The conductive elastic sheet (10) is further provided with a base (13), and the conductive elastic sheet (10) is fixedly arranged on the first device (200) through the base (13).

17. An electronic device, comprising: The electronic device comprises a first device (200) and an electric connection assembly as claimed in any one of claims 1-16, the conductive elastic sheet (10) is fixedly arranged on the first device (200), and the convex block (12) abuts against at least part of the groove wall of the groove (20).

18. The electronic device of claim 17, wherein, The electronic device further comprises a screen (500), and the screen (500) comprises a display module (501) and a metal layer (502) arranged in a stack. The second device (300) comprises the metal layer (502), and the metal layer (502) is provided with the groove (20) on one side of the first device (200).

19. The electronic device of claim 18, wherein, The electronic device further comprises a middle plate (401a), and the middle plate (401a) is arranged in a space with the metal layer (502); the first device (200) comprises the middle plate (401a), and the conductive elastic sheet (10) is fixedly arranged on the middle plate (401a).

20. The electronic device of claim 17, wherein, The electronic device further comprises a middle plate (401a). The second device (300) comprises the middle plate (401a), and the middle plate (401a) is provided with the groove (20) on one side of the first device (200).

21. The electronic device of claim 17, wherein, The electronic device further comprises a back cover (402) and an antenna radiation branch (700), and the back cover (402) is provided with the antenna radiation branch (700). The second device (300) comprises the antenna radiation branch (700), and the antenna radiation branch (700) is provided with the groove (20) on one side of the first device (200).

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