Cooling device and server with same

Abstract

A cooling device (100) and a server with same. The cooling device (100) comprises: a housing (10), wherein a first accommodating cavity (11) is defined in the housing (10), and the housing (10) is provided with a water inlet (12) and a water outlet (13) in communication with the first accommodating cavity (11); a first heat dissipation member (20), which is arranged in the first accommodating cavity (11); and a plurality of spray plates (30), which are arranged in the first accommodating cavity (11) and sequentially arranged between the water inlet (12) and the first heat dissipation member (20), wherein each of the plurality of spray plates (30) is provided with a plurality of spray holes (31).

Description

Cooling device and server with same

[0001] Cross-reference to Related Applications

[0002] The present application is based on Chinese Patent Application No. 202410718100.1, filed on June 4, 2024, and claims priority to the Chinese Patent Application No. 202410718100.1, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the technical field of servers, and in particular to a cooling device and a server with the same. BACKGROUND

[0004] A large power chip in a server generates a large amount of heat during operation. Some cooling devices are arranged in the server to cool the chip. In related technologies, the cooling speed of the cooling device for the chip is insufficient, which affects the reliability of the server during operation.

[0005] SUMMARY

[0006] The present application aims to at least partially solve one of the above technical problems in the prior art.

[0007] Therefore, the present application provides a cooling device that can improve the reliability of a server during operation.

[0008] The present application also provides a server with the above cooling device.

[0009] The cooling device provided by the present application comprises a housing, a first containing cavity is defined in the housing, a water inlet and a water outlet are formed on the housing and communicate with the first containing cavity; a first heat dissipation member is arranged in the first containing cavity; a plurality of spray plates are arranged in the first containing cavity and are sequentially arranged between the water inlet and the first heat dissipation member, and a plurality of spray holes are formed on each spray plate.

[0010] According to the cooling device provided by the present application, the plurality of spray plates can improve the cooling speed of the cooling device for the chip, thereby improving the reliability of the server during operation.

[0011] In addition, the cooling device provided by the present application can have the following additional technical features:

[0012] According to an example of the present application, in the direction from the water inlet to the first heat dissipation member, the cross-sectional size of the spray holes on the spray plate arranged close to the water inlet is greater than the cross-sectional size of the spray holes on the spray plate arranged close to the first heat dissipation member.

[0013] According to an example of the present application, the spray holes are circular holes, and in the direction from the water inlet to the first heat dissipation member, the diameters of the spray holes on the plurality of spray plates are sequentially reduced.

[0014] According to an example of the present application, a second accommodating cavity is further defined in the shell, the water outlet communicates with the first accommodating cavity through the second accommodating cavity, a second heat dissipation member is arranged in the second accommodating cavity, and the second heat dissipation member is arranged on the side of the second accommodating cavity away from the water outlet.

[0015] According to an example of the present application, a water passing plate is arranged in the second accommodating cavity, the water passing plate is arranged between the second heat dissipation member and the water outlet, and a plurality of water passing holes are formed in the water passing plate.

[0016] According to an example of the present application, the number of water passing plates is a plurality, and the plurality of water passing plates are sequentially arranged between the second heat dissipation member and the water outlet.

[0017] According to an example of the present application, in the direction from the water outlet to the second heat dissipation member, the cross-sectional size of the water passing holes on the water passing plate arranged close to the water outlet is greater than the cross-sectional size of the water passing holes on the water passing plate arranged close to the second heat dissipation member.

[0018] According to an example of the present application, the water passing holes are circular holes, and in the direction from the water outlet to the second heat dissipation member, the diameters of the water passing holes on the plurality of water passing plates are sequentially reduced.

[0019] According to an example of the present application, a partition plate is arranged in the shell, the first accommodating cavity and the second accommodating cavity are respectively located on the two sides in the thickness direction of the partition plate, a communication hole is formed in the partition plate and communicates the first accommodating cavity and the second accommodating cavity, at least one water passing plate is arranged between the second heat dissipation member and the water outlet, the communication hole is located on the side of the spray plate adjacent to the first heat dissipation member and facing the first heat dissipation member, and the communication hole is located on the side of the water passing plate adjacent to the second heat dissipation member and facing the second heat dissipation member.

[0020] According to an example of the present application, the first heat dissipation member includes a plurality of first heat dissipation fins extending in a first direction and spaced apart in a second direction, the first direction being perpendicular to the second direction, and / or the second heat dissipation member includes a plurality of second heat dissipation fins extending in the first direction and spaced apart in the second direction, the communication hole being provided on at least one side of the first heat dissipation member and the second heat dissipation member in the first direction.

[0021] According to an example of the present application, the housing includes a cover plate portion and a flat plate portion, the cover plate portion defining a cavity with an open end inside, and the flat plate portion being provided at the opening of the cavity.

[0022] According to an example of the present application, a positioning groove is formed around the opening of the cavity, and the flat plate portion is provided in the positioning groove.

[0023] According to an example of the present application, the water inlet and the water outlet are provided on the cover plate portion, and the first heat dissipation member is provided on the flat plate portion.

[0024] According to an example of the present application, the housing further includes a water inlet connector and a water outlet connector, the water inlet connector being in communication with the water inlet, and the water outlet connector being in communication with the water outlet.

[0025] The server provided by the present application includes the cooling device provided by the present application.

[0026] The server provided by the present application, by providing the cooling device provided by the present application, has higher cooling efficiency of the chip, and can improve the reliability of the server during operation.

[0027] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0028] FIG. 1 is a schematic view of a cooling device according to an embodiment of the present application;

[0029] FIG. 2 is a sectional view in the A-A direction shown in FIG. 1;

[0030] FIG. 3 is a sectional view in the D-D direction shown in FIG. 2;

[0031] FIG. 4 is a sectional view in the B-B direction shown in FIG. 1;

[0032] FIG. 5 is a sectional view in the E-E direction shown in FIG. 4;

[0033] FIG. 6 is a sectional view in the C-C direction shown in FIG. 1;

[0034] Fig. 7 is a sectional view of the F-F direction shown in Fig. 6;

[0035] Fig. 8 is a schematic view of another angle of the cooling device shown in Fig. 1;

[0036] Fig. 9 is a schematic view of yet another angle of the cooling device shown in Fig. 1.

[0037] Reference signs: 100, cooling device; 10, housing; 11, first accommodating cavity; 12, water inlet; 13, water outlet; 14, second accommodating cavity; 15, partition plate; 151, communication hole; 16, cover plate part; 17, flat plate part; 18, water inlet joint; 19, water outlet joint; 20, first heat dissipation member; 30, spray plate; 31, spray hole; 40, second heat dissipation member; 50, water passing plate; 51, water passing hole; 60, mounting buckle. DETAILED DESCRIPTION

[0038] Embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.

[0039] The disclosure below provides many different embodiments or examples for implementing different structures of the present application. For the purpose of simplicity, the description of the certain examples below are described. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application can repeatedly refer to the reference numbers and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific examples of processes and materials, but those of ordinary skill in the art can realize the applicability of other processes and / or the use of other materials.

[0040] The cooling device 100 according to the first embodiment of the present application is described in detail below with reference to Figs. 1-7.

[0041] As shown in Figs. 1 and 5, the cooling device 100 according to the first embodiment of the present application comprises a housing 10, a first heat dissipation member 20 and a plurality of spray plates 30, for example, two, three or four spray plates 30.

[0042] Specifically, the first accommodating cavity 11 is defined in the shell 10, the water inlet 12 and the water outlet 13 are formed on the shell 10 and communicate with the first accommodating cavity 11, the first heat dissipation member 20 is arranged in the first accommodating cavity 11, and the plurality of spray plates 30 are arranged in the first accommodating cavity 11 and arranged between the water inlet 12 and the first heat dissipation member 20 in sequence. Each of the plurality of spray plates 30 is provided with a plurality of spray holes 31.

[0043] The cooling device 100 is arranged close to a chip generating heat in the server, for example, the cooling device 100 can be arranged close to a CPU, and the first heat dissipation member 20 is a component with high heat exchange efficiency.

[0044] During the working process of the server, the cooling device 100 exchanges heat with the chip. During the working process of the cooling device 100, the cooling liquid flows into the first accommodating cavity 11 from the water inlet 12, then the cooling liquid is sprayed onto the first heat dissipation member 20 through the spray holes 31 of the plurality of spray plates 30 in sequence, and then the cooling liquid flows out of the shell 10 through the water outlet 13. In this way, the cooling liquid can take away the heat on the cooling device 100, so that the cooling device 100 can continuously exchange heat with the chip and cool the chip.

[0045] After the cooling liquid passes through the spray holes 31 of the plurality of spray plates 30 in sequence, the cooling liquid can be more uniformly distributed in the shell 10, so that the heat exchange efficiency of the cooling liquid with the shell 10 and the spray plates 30 can be improved. Meanwhile, it can be understood that the first heat dissipation member 20 accounts for a large proportion of the heat absorbed in the cooling device 100. After the cooling liquid passes through the spray holes 31 of the plurality of spray plates 30 in sequence, on the one hand, the cooling liquid can be more uniformly sprayed on the first heat dissipation member 20, and on the other hand, the spray holes 31 on each of the plurality of spray plates 30 can disperse the cooling liquid, so that the cooling liquid is more dispersed when sprayed on the first heat dissipation member 20, which produces a misting effect, so that the contact degree of the cooling liquid with the first heat dissipation member 20 can be improved, and the heat exchange efficiency of the cooling liquid with the first heat dissipation member 20 can be improved. Thus, the heat exchange efficiency of the cooling liquid with the cooling device 100 can be improved, so that the cooling efficiency of the cooling device 100 on the chip can be improved.

[0046] It can be understood by those skilled in the art that when the server is in a low-temperature environment and the performance of the chip is limited, the cooling liquid flowing into the cooling device 100 can also be heated, so that the cooling device 100 can heat the chip, thereby improving the performance of the chip in the low-temperature environment.

[0047] According to the cooling device 100 of the first aspect of the present application, by arranging the plurality of spray plates 30, the cooling speed of the cooling device 100 on the chip can be improved, so that the reliability of the server during the working process can be improved.

[0048] In some embodiments of the present application, as shown in FIG. 2, FIG. 3 and FIG. 5, in the direction from the water inlet 12 to the first heat dissipation member 20, the cross-sectional size of the spray holes 31 on the spray plate 30 arranged close to the water inlet 12 is larger than the cross-sectional size of the spray holes 31 on the spray plate 30 arranged close to the first heat dissipation member 20. That is, the cooling liquid flowing from the water inlet 12 will pass through the spray holes 31 on at least one spray plate 30 whose cross-sectional size is smaller than the cross-sectional size of the spray holes 31 on the first spray plate 30 after passing through the spray holes 31 on the first spray plate 30. It can be understood that, under the condition that the driving pressure of the water inlet 12 is constant, the smaller the size of the spray holes 31, the higher the dispersion degree of the cooling liquid, so that the heat exchange efficiency of the cooling liquid with the shell 10 and the first heat dissipation member 20 can be further improved, thereby further improving the cooling speed of the chip.

[0049] In some embodiments of the present application, as shown in FIG. 2, FIG. 3 and FIG. 5, the spray holes 31 are circular holes, and the diameters of the spray holes 31 on the plurality of spray plates 30 are gradually reduced in the direction from the water inlet 12 to the first heat dissipation member 20. Thus, the dispersion degree of the cooling liquid is gradually increased in the process of passing through the spray holes 31 on the plurality of spray plates 30, so that the heat exchange efficiency of the cooling liquid with the shell 10 and the first heat dissipation member 20 can be further improved, thereby further improving the cooling speed of the chip. By setting the spray holes 31 as circular holes, the force acting on the cooling liquid during the process of passing through the circular holes is uniform, so that the stability of the cooling device 100 during the flow of the cooling liquid can be improved.

[0050] In some embodiments of the present application, as shown in FIG. 1, FIG. 6 and FIG. 7, a second accommodating cavity 14 is further defined in the shell 10, the water outlet 13 communicates with the first accommodating cavity 11 through the second accommodating cavity 14, and the second accommodating cavity 14 is provided with a second heat dissipation member 40, and the second heat dissipation member 40 is arranged on the side of the second accommodating cavity 14 away from the water outlet 13.

[0051] In the process of working of the cooling device 100, the cooling liquid flows into the shell 10 from the water inlet 12, passes through the plurality of spray plates 30 in sequence, then exchanges heat with the first heat dissipation member 20, then enters the second accommodating cavity 14 and exchanges heat with the second heat dissipation member 40, and then flows out of the shell 10 from the water outlet 13.

[0052] By setting the second accommodating cavity 14 and the second heat dissipation member 40, on the one hand, the cooling liquid is cooled in the second accommodating cavity 14 and the shell 10 and the second heat dissipation member 40, thereby further improving the cooling efficiency of the cooling device 100, on the other hand, the second accommodating cavity 14 can provide accommodation space for the cooling liquid, when the cooling liquid flowing into the water inlet 12 is relatively fast, the second accommodating cavity 14 can buffer the cooling liquid, and during the flow of the cooling liquid in the shell 10, the stability of the cooling device 100 is improved.

[0053] In some embodiments of the present application, as shown in FIGS. 3, 5 and 6, the second accommodating cavity 14 is provided with a water passing plate 50, the water passing plate 50 is arranged between the second heat dissipation member 40 and the water outlet 13, and a plurality of water passing holes 51 are formed on the water passing plate 50. In this way, after the cooling liquid entering the second accommodating cavity 14 exchanges heat with the second heat dissipation member 40, the cooling liquid flows out of the water outlet 13 by passing through the water passing holes 51 on the water passing plate 50, and the cooling liquid passing through the water passing holes 51 is more dispersed, which can increase the heat exchange efficiency of the cooling liquid with the shell 10 and the water passing plate 50, thereby further improving the cooling speed of the cooling device 100 on the chip.

[0054] In some embodiments of the present application, as shown in FIGS. 3, 5 and 6, the number of water passing plates 50 is multiple, for example, the water passing plate 50 can be two, three or four, and a plurality of water passing plates 50 are arranged in sequence between the second heat dissipation member 40 and the water outlet 13. In this way, during the process of the cooling liquid passing through the water passing holes 51 on the plurality of water passing plates 50 in sequence, the water passing holes 51 on each water passing plate 50 can make the cooling liquid more dispersed, thereby further improving the heat exchange efficiency of the cooling liquid with the shell 10 and the water passing plate 50, thereby further improving the cooling speed of the cooling device 100 on the chip.

[0055] In some embodiments of the present application, as shown in FIGS. 3 and 5, in the direction of the water outlet 13 towards the second heat dissipation member 40, among the at least two water passing plates 50, the cross-sectional size of the water passing holes 51 on the water passing plate 50 arranged close to the water outlet 13 is greater than the cross-sectional size of the water passing holes 51 on the water passing plate 50 arranged close to the second heat dissipation member 40. That is, during the process of the cooling liquid in the second accommodating cavity 14 flowing out of the water outlet 13, after the cooling liquid passes through the water passing holes 51 on the first water passing plate 50, it will pass through the water passing holes 51 on at least one water passing plate 50 with a larger cross-sectional size than the water passing holes 51 on the first water passing plate 50.

[0056] It can be understood that the temperature of the part of the shell 10 close to the second heat dissipation member 40 is higher, the cross-sectional size of the water passing hole 51 on the water passing plate 50 arranged close to the second heat dissipation member 40 is smaller, which can make the cooling liquid passing through the water passing plate 50 disperse in the area close to the second heat dissipation member 40 at a higher degree, so that the heat exchange efficiency between the cooling liquid and the area environment in this part of the area is higher, and the cross-sectional size of the water passing hole 51 on the water passing plate 50 arranged close to the water outlet 13 is larger, so that the cooling liquid passing through the water passing hole 51 is subjected to smaller resistance, which can improve the flow speed of the cooling liquid.

[0057] In some embodiments of the present application, as shown in FIGS. 3 and 5, the water passing hole 51 is a circular hole, and the diameter of the water passing hole 51 on the plurality of water passing plates 50 gradually decreases in the direction of the water outlet 13 towards the second heat dissipation member 40. Thus, in the process of the cooling liquid passing through the water passing hole 51 on the plurality of water passing plates 50, the resistance of the cooling liquid gradually decreases, so that the flow speed of the cooling liquid can be improved. Wherein, by setting the water passing hole 51 as a circular hole, the force acting on the cooling liquid passing through the circular hole is more uniform, which can improve the stability of the cooling device 100 in the process of the cooling liquid flowing.

[0058] In some embodiments of the present application, the spray plate 30 is a copper material piece, and the water passing plate 50 is a copper material piece. The copper material piece has excellent heat conduction performance, and by setting the spray plate 30 and the water passing plate 50 as copper material pieces, the heat exchange efficiency between the spray plate 30 and the water passing plate 50 and the cooling liquid can be further improved, so that the heat exchange efficiency between the cooling liquid and the cooling device 100 is further improved, and the cooling speed of the cooling device 100 on the chip is improved.

[0059] In some embodiments of the present application, as shown in FIGS. 1, 4, 5 and 7, the shell 10 is provided with a partition plate 15, the first containing cavity 11 and the second containing cavity 14 are respectively located on both sides of the thickness direction of the partition plate 15, the partition plate 15 is formed with a communication hole 151 communicating the first containing cavity 11 and the second containing cavity 14, at least one water passing plate 50 is arranged between the second heat dissipation member 40 and the water outlet 13, the communication hole 151 is located on the side of the spray plate 30 adjacent to the first heat dissipation member 20 and facing the first heat dissipation member 20, and is located on the side of the water passing plate 50 adjacent to the second heat dissipation member 40 and facing the second heat dissipation member 40.

[0060] In the process of the cooling device 100 working, the cooling liquid flows into the first containing cavity 11 from the water inlet 12, then passes through the plurality of spray holes 31 on the plurality of spray plates 30 in turn and exchanges heat with the first heat dissipation plate, then the cooling liquid passes through the communication hole 151 into the second containing cavity 14 and exchanges heat with the second heat dissipation member 40, and then the cooling liquid passes through the water passing hole 51 on the water passing plate 50 and flows out of the shell 10 from the water outlet 13.

[0061] The first accommodating cavity 11 and the second accommodating cavity 14 are separated by the partition plate 15 in the shell 10, the structure of the cooling device 100 is relatively simple, the product design difficulty and the production difficulty can be reduced, the first accommodating cavity 11 and the second accommodating cavity 14 are communicated by the communication hole 151 arranged on the partition plate 15, the structure of the cooling device 100 can be further simplified, and the cooling liquid flows from the first accommodating cavity 11 to the second accommodating cavity 14 in a short distance, so that the flow speed of the cooling liquid in the shell 10 can be improved.

[0062] In some embodiments of the present application, as shown in FIGS. 2, 6 and 7, the first heat dissipation member 20 includes a plurality of first heat dissipation fins extending in a first direction and arranged at intervals in a second direction, the first direction being perpendicular to the second direction, and / or the second heat dissipation member 40 includes a plurality of second heat dissipation fins extending in the first direction and arranged at intervals in the second direction.

[0063] That is, the first heat dissipation member 20 can include a plurality of first heat dissipation fins, the second heat dissipation member 40 can include a plurality of second heat dissipation fins, or the first heat dissipation member 20 can include a plurality of first heat dissipation fins and the second heat dissipation member 40 can include a plurality of second heat dissipation fins.

[0064] The communication hole 151 is arranged on at least one side of the first heat dissipation member 20 and the second heat dissipation member 40 in the first direction, that is, the first heat dissipation member 20 and the second heat dissipation member 40 can be arranged with the communication hole 151 on one side in the first direction, or the first heat dissipation member 20 and the second heat dissipation member 40 can be arranged with the communication hole 151 on both sides in the first direction.

[0065] In the present embodiment, preferably, the first heat dissipation member 20 includes a plurality of first heat dissipation fins, the second heat dissipation member 40 includes a plurality of second heat dissipation fins, and the first heat dissipation member 20 and the second heat dissipation member 40 are arranged with the communication hole 151 on both sides in the first direction.

[0066] It can be understood that the first heat dissipation member 20 and the second heat dissipation member 40 are arranged with the communication hole 151 on both sides in the first direction, and the first heat dissipation member 20 and the second heat dissipation member 40 are arranged at intervals from the inner wall of the shell 10 in the first direction.

[0067] After the cooling liquid is sprayed onto the plurality of first heat dissipation fins through the spray holes 31 on the spray plate 30, the cooling liquid moves along the channels between the first heat dissipation fins in a first direction, and the cooling liquid flowing out of the channels between the first heat dissipation fins flows into the communication holes 151 from the channels between the first heat dissipation fins and the inner wall of the shell 10. After the cooling liquid enters the second cavity through the communication holes 151, the cooling liquid moves along the channels between the second heat dissipation fins and the inner wall of the shell 10 and sequentially enters the channels between the second heat dissipation fins. In this way, the flow of the cooling liquid can be smoother during the heat exchange between the cooling liquid and the first heat dissipation member 20 and the second heat dissipation member 40, and the contact degree between the cooling liquid and the first heat dissipation member 20 and the second heat dissipation member 40 can be improved, thereby further improving the cooling speed of the cooling device 100 on the chip.

[0068] In some embodiments of the present application, as shown in FIGS. 2, 4 and 6, the shell 10 includes a cover plate portion 16 and a flat plate portion 17. The cover plate portion 16 defines a cavity with an open end in the cover plate portion 16, and the flat plate portion 17 is arranged at the open end of the cavity. In this way, during production, after the components in the cavity are installed, the flat plate portion 17 is sealed at the open end of the cavity. The production process is relatively simple, and the structure of the shell 10 is simple, which can reduce the difficulty of product design.

[0069] In some embodiments of the present application, a positioning groove is formed around the open end of the cavity, and the flat plate portion 17 is arranged in the positioning groove. By arranging the positioning groove, the flat plate portion 17 can be positioned during assembly, so that the flat plate portion 17 can be quickly placed in position, thereby improving production efficiency. After production is completed, the displacement of the flat plate portion 17 can be limited by the positioning groove, and the positioning groove can be sealed with the flat plate portion 17 through two different angle surfaces, thereby improving the structural stability of the shell 10 and the sealing reliability between the cover plate portion 16 and the flat plate portion 17.

[0070] In some embodiments of the present application, as shown in FIGS. 1, 2 and 6, the water inlet 12 and the water outlet 13 are arranged on the cover plate portion 16, and the first heat dissipation member 20 is arranged on the flat plate portion 17. In this way, when the second accommodating cavity 14 and the second heat dissipation member 40 are arranged in the shell 10, the second heat dissipation member 40 is also arranged on the flat plate portion 17, and the water inlet 12 and the water outlet 13 are located at different ends of the first heat dissipation member 20 and the second heat dissipation member 40 in the cooling device 100. When the cooling device 100 is assembled on the server, the flat plate portion 17 can face the chip, and the cooling liquid pipeline can be connected to the cover plate portion 16, thereby reducing the arrangement difficulty of the cooling device 100 on the server.

[0071] In some embodiments of the present application, the flat plate part 17 is a copper material piece. The copper material piece has excellent heat conduction performance. By setting the flat plate part 17 as a copper material piece, the heat exchange efficiency between the cooling device 100 and the chip and the heat exchange efficiency between the cooling liquid and the flat plate part 17 can be further improved, so that the cooling speed of the cooling device 100 on the chip is further improved.

[0072] In some embodiments of the present application, as shown in FIGS. 1, 2 and 6, the shell 10 is further provided with a water inlet joint 18 and a water outlet joint 19. The water inlet joint 18 is in communication with the water inlet 12, and the water outlet joint 19 is in communication with the water outlet 13. By setting the water inlet joint 18 and the water outlet joint 19, the connection of the water inlet 12 and the water outlet 13 with the cooling liquid pipeline can be facilitated.

[0073] In some embodiments of the present application, as shown in FIGS. 1, 8 and 9, the shell 10 is further provided with a plurality of mounting buckles 60. The mounting buckles 60 are in the shape of bent pipes. When the cooling device 100 is assembled on the server, the mounting buckles 60 are buckled on the mounting positions of the server. In this way, the installation of the cooling device 100 on the server can be achieved, and the assembly is relatively simple.

[0074] According to the second aspect of the present application, the server comprises the cooling device 100 according to the first aspect of the present application.

[0075] According to the second aspect of the present application, by setting the cooling device 100 according to the first aspect of the present application, the cooling efficiency of the cooling device 100 on the chip is higher, and the reliability of the server during operation can be improved.

[0076] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0077] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0078] In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", and "fixedly" should be construed as broadest possible terms, for example, can be fixed connection, can be detachable connection, or integral; can be direct connection, or indirect connection via intermediate medium; can be internal connection of two elements, or interaction between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0079] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0080] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or features of different embodiments or examples described in the present application without contradiction.

[0081] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A cooling device, wherein, The application relates to a shell, which is internally defined with a first accommodating cavity, and is externally formed with a water inlet and a water outlet, which are communicated with the first accommodating cavity; a first heat radiating member is arranged in the first accommodating cavity; a plurality of spray plates are arranged in the first accommodating cavity and are sequentially arranged between the water inlet and the first heat radiating member, and each of the spray plates is formed with a plurality of spray holes. In the direction from the water inlet to the first heat radiating member, the cross-sectional size of the spray holes on the spray plate arranged close to the water inlet is larger than that of the spray holes on the spray plate arranged close to the first heat radiating member. The spray holes are circular holes, and the diameters of the spray holes on the plurality of spray plates are sequentially reduced in the direction from the water inlet to the first heat radiating member. The shell is internally further defined with a second accommodating cavity, the water outlet is communicated with the first accommodating cavity through the second accommodating cavity, the second accommodating cavity is arranged with a second heat radiating member, and the second heat radiating member is arranged on the side of the second accommodating cavity far from the water outlet.

2. Cooling device according to claim 1, wherein The second accommodating cavity is arranged with a water passing plate, the water passing plate is arranged between the second heat radiating member and the water outlet, and the water passing plate is formed with a plurality of water passing holes.

3. Cooling device according to claim 1 or 2, wherein The number of the water passing plates is plural, and the plurality of water passing plates are sequentially arranged between the second heat radiating member and the water outlet.

4. Cooling device according to any of claims 1-3, wherein In the direction from the water outlet to the second heat radiating member, the cross-sectional size of the water passing holes on the water passing plate arranged close to the water outlet is larger than that of the water passing holes on the water passing plate arranged close to the second heat radiating member.

5. Cooling device according to claim 4, wherein The water passing holes are circular holes, and the diameters of the water passing holes on the plurality of water passing plates are sequentially reduced in the direction from the water outlet to the second heat radiating member.

6. Cooling device according to claim 5, wherein The shell is arranged with a partition plate, the first accommodating cavity and the second accommodating cavity are respectively arranged on the two sides in the thickness direction of the partition plate, the partition plate is formed with a communicating hole which communicates the first accommodating cavity and the second accommodating cavity, 7. Cooling device according to claim 6, wherein At least one water passing plate is arranged between the second heat radiating member and the water outlet, the communicating hole is arranged on the side of the spray plate adjacent to the first heat radiating member and facing the first heat radiating member, and is arranged on the side of the water passing plate adjacent to the second heat radiating member and facing the second heat radiating member.

8. Cooling device according to any of claims 5-7, wherein The first heat radiating member comprises a plurality of first heat radiating fins, the plurality of first heat radiating fins extend along a first direction and are arranged at intervals in a second direction, the first direction is perpendicular to the second direction, and / or 9. Cooling device according to any of claims 4-8, wherein The second heat radiating member comprises a plurality of second heat radiating fins, the plurality of second heat radiating fins extend along the first direction and are arranged at intervals in the second direction, The communicating hole is arranged on at least one side of the first heat radiating member and the second heat radiating member in the first direction.

10. Cooling device according to claim 9, wherein The shell comprises a cover plate part and a flat plate part, the cover plate part is internally defined with a cavity with an open end, and the flat plate part is arranged on the opening of the cavity. ​ ​ 11. Cooling device according to any of claims 1-10, wherein ​ 12. The cooling device of claim 11, wherein, ​ 13. Cooling device according to claim 11 or 12, wherein The water inlet and the water outlet are arranged on the cover plate part, and the first heat dissipation member is arranged on the flat plate part.

14. Cooling device according to any of claims 1-13, wherein The shell is further provided with a water inlet connector and a water outlet connector, the water inlet connector is communicated with the water inlet, and the water outlet connector is communicated with the water outlet.

15. A server, wherein, Comprising: The cooling device of any one of claims 1-14.

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