Device processing quality control method and system based on quartz device processing drawing library

Abstract

A device processing quality control method and system based on a quartz device processing drawing library. The specific method comprises: establishing a drawing library for quartz devices to be processed; establishing three-dimensional digital models for the quartz devices on the basis of processing guidance data, performing search and match on the drawing library for said quartz devices and a quartz device historical processing drawing library of a quartz processing plant; dynamically adjusting and planning a processing technology route for the quartz devices to be processed; collecting processing technology parameters from a manual craftsmanship process; and importing the processing technology parameters from the manual craftsmanship process into a processing quality check strategy, and executing a quality correction strategy on the basis of quality check data.

Description

Device processing quality control method and system based on quartz device processing drawing library TECHNICAL FIELD

[0001] The present application relates to the technical field of drawing management, and is a device processing quality control method and system based on a quartz device processing drawing library. BACKGROUND

[0002] Drawings are very important technical materials for manufacturing enterprises, and the processing drawings of quartz processing enterprises often have the industry characteristics of special custom drawings, large quantity and dispersion, and high accuracy. As the starting point of quartz device processing and production, drawings play a guiding role in the planning of quartz processing procedures and the procurement of quartz raw materials and other business processes. How to take appropriate measures to ensure the accuracy, uniqueness and security of drawings is a difficult problem faced by the quartz industry.

[0003] For example, Chinese Patent No. CN104268672A discloses a management method and classification steps for wood floor processing cutter electronic drawings, which include a first folder, the first folder contains a second folder, the second folder includes board model, process flow chart, assembly drawing, theoretical cutter blade diagram for cutter allocation, actual cutter blade diagram for cutter allocation, and cutter disc diagram folder, the second folder contains a third folder, the third folder includes board model, process flow, assembly drawing sub, theoretical cutter blade diagram for cutter allocation, actual cutter blade diagram for cutter allocation, and cutter disc diagram sub folder, the third folder contains a fourth folder, the fourth folder includes board model, process flow, assembly drawing, theoretical cutter blade diagram for cutter allocation, actual cutter blade diagram for cutter allocation, and cutter disc diagram sub folder, and contains board type information, equipment information, customer information, and cutter disc processing diagram information file, and the fourth folder contains a fifth file.

[0004] With the increase in the number of files, it becomes difficult to manage and maintain the multi-level folder structure, and the transmission of processing drawings between various processing departments has problems of information loss or confusion. SUMMARY

[0005] The present application solves the technical problem that in the prior art, the transmission of processing drawings between various processing procedures has information lag, resulting in many errors in the processing process, and the unified sequential sending of drawings to various departments for processing results in low processing efficiency. The present application provides a device processing quality control method and system based on a quartz device processing drawing library.

[0006] In order to achieve the above object, the technical scheme of the quartz device processing quality control method based on the quartz device processing drawing library of the application comprises the following steps: S1: collecting the to-be-processed drawing of the to-be-processed quartz device in the project order, extracting the processing guide data in the to-be-processed drawing, and establishing the to-be-processed drawing library of the quartz device; S2: establishing a three-dimensional digital model of the quartz device according to the processing guide data, performing cutting processing on the three-dimensional digital model, and performing lookup matching between the to-be-processed drawing library of the quartz device and the historical processing drawing library of the quartz device of the quartz processing factory; S3: importing the lookup matching data into a minimum machine processing unit similarity calculation strategy, performing process similarity level judgment on the to-be-processed quartz device, and dynamically adjusting and planning the processing process route of the to-be-processed quartz device; S4: extracting the processing process route of the to-be-processed quartz device after dynamic adjustment and planning, and collecting the processing process parameters in the manual process; S5: importing the processing process parameters in the manual process into a processing quality checking strategy, and executing a quality correction strategy according to the quality checking data.

[0007] Specifically, in the step S1, the processing guide data includes size data, shape data, hole position and aperture data, surface roughness standard, and material specification; the size data includes the length, width and height of the device; the shape data includes the quartz device curve, angle and chamfer; the hole position and aperture data includes the position, size and shape of each aperture on the quartz device; the surface roughness standard includes the finish and roughness of the device surface; and the material specification includes the type, strength and transparency of the quartz material used.

[0008] Specifically, the step S3 comprises the following specific steps: S31: obtaining the model components of the three-dimensional digital model of the to-be-processed quartz device after digital cutting; S32: inputting a minimum processing unit lookup instruction into the quartz device machine processing database, and finding out the minimum processing unit and the historical processing process data of each minimum processing unit constituting the to-be-processed quartz device according to a minimum machine processing unit similarity calculation strategy; S33: extracting the minimum processing unit similarity data, and performing machine processing process similarity level judgment to obtain the process similarity level of the to-be-processed quartz device; S34: dynamically adjusting and planning the processing process route of the to-be-processed quartz device according to the process similarity level of the to-be-processed quartz device; and the minimum processing unit includes basic geometric shapes, local holes, local grooves and specific processing areas.

[0009] Specifically, in the step S32, the minimum machine processing unit similarity calculation strategy is as follows: wherein, S1 is the minimum machine processing unit similarity; i, j are both subscripts, the three-dimensional digital model of the quartz device to be processed is divided into I model components after digital cutting, and there are J minimum machine processing units in the quartz device machine processing database; i≤I, j≤J; n i is the i-th model component of the three-dimensional digital model of the quartz device to be processed after digital cutting; m j is the j-th minimum machine processing unit in the quartz device machine processing database; ∩, ∪ are intersection and union symbols respectively; w[∩] is the data number of the intersection of data sets; w[∪] is the data number of the union of data sets.

[0010] Specifically, the step S33 further comprises the following specific steps: S331: judging the similarity level of the machine processing technology; when , it is judged that the similarity level of the machine processing technology of the quartz device to be processed is similar, and step S332 is executed; when , it is judged that the similarity level of the machine processing technology of the quartz device to be processed is not similar, and step S333 is executed; S332: the minimum processing unit of the quartz device to be processed and the historical processing technology data of each minimum processing unit obtained by searching are preferentially transmitted to the machine processing pipeline data cloud of the quartz processing factory, so that the machine processing pipeline can perform preferential processing according to the historical processing technology data; S333: input the minimum processing unit searching instruction into the quartz device manual processing database, calculate the minimum manual processing unit similarity according to the minimum manual processing unit similarity calculation strategy, and the minimum manual processing unit similarity calculation strategy is: wherein, S2 is the minimum manual processing unit similarity; q, p are both subscripts, there are Q model components that do not match the minimum machine processing unit in the three-dimensional digital model of the quartz device to be processed, and there are P minimum manual processing units in the quartz device manual processing database; q≤Q, p≤P; X q is the q-th model component of the model component that does not match the minimum machine processing unit; Y p is the p-th minimum manual processing unit in the quartz device manual processing database; S334: judging the similarity level of the manual processing technology; when , it is judged that the similarity level of the manual processing technology of the quartz device to be processed is similar, and step S335 is executed; when When the similarity level of the manual processing technology of the to-be-processed quartz device is determined to be dissimilar, step S336 is performed.

[0011] Specifically, in step S4, the processing parameters in the manual processing process include: the use parameters of the processing equipment used by the technical workers in the processing process, and the use parameters of the processing equipment include: the actual processing speed of a single model part, the actual processing temperature of a single model part, the actual processing pressure of a single model part, and the actual cleaning and cooling time of a single model part.

[0012] Specifically, step S5 includes the following specific steps: wherein θ is the processing quality check value; R is the number of model parts matched in the quartz device manual processing database, r is the subscript, r≤R; v r ,v′ r are the actual processing speed of a single model part and the historical processing speed in the historical processing data, respectively; T r ,T′ r are the actual processing temperature of a single model part and the historical processing temperature in the historical processing data, respectively; G r ,G′ r are the actual processing pressure of a single model part and the historical processing pressure in the historical processing data, respectively; L r ,L′ r are the actual cleaning and cooling time of a single model part and the historical cleaning and cooling time in the historical processing data, respectively; S52: Extract the processing quality check value, judge the processing quality, and perform the quality correction strategy; when θ<2.67, it is determined that the processing quality of the technical workers on the quartz device is qualified, and the manual processing is completed; when θ≥2.67, it is determined that the processing quality of the technical workers on the quartz device is unqualified, and the feedback is performed to the technical workers with more than 3 years of processing experience for repeated processing.

[0013] In addition, the device processing quality control system based on the quartz device processing drawing library of the application comprises the following modules: a to-be-processed drawing library construction module for collecting to-be-processed drawings of quartz devices in a project order, extracting processing guide data in the to-be-processed drawings, and establishing a to-be-processed drawing library of the quartz devices; a search and matching module for establishing a three-dimensional digital model of the quartz devices according to the processing guide data, performing cutting processing on the three-dimensional digital model, and searching and matching the to-be-processed drawing library of the quartz devices with a historical processing drawing library of the quartz devices of a quartz processing factory; a processing process route planning module for importing the search and matching data into a minimum machine processing unit similarity calculation strategy, performing process similarity level judgment on the to-be-processed quartz devices, and dynamically adjusting and planning a processing process route of the to-be-processed quartz devices; a processing parameter extraction module for extracting the processing process route of the to-be-processed quartz devices after dynamic adjustment and planning, and collecting processing parameters in a manual process; and a processing quality checking module for importing the processing parameters in the manual process into a processing quality checking strategy, and executing a quality correction strategy according to the quality checking data.

[0014] A storage medium having instructions stored therein, when read by a computer, causes the computer to execute the device processing quality control method based on the quartz device processing drawing library.

[0015] An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor implements the device processing quality control method based on the quartz device processing drawing library when executing the computer program.

[0016] Compared with the prior art, the technical effects of the application are as follows: 1. The application automatically extracts processing guide data and establishes a three-dimensional digital model, saving labor costs and time and improving work efficiency.

[0017] 2. The application can understand the similarity level of processing process planning in a timely manner by matching with a historical drawing library of a quartz processing factory, thereby avoiding repeated labor or processing errors.

[0018] 3. The application dynamically adjusts the processing process route, which can be flexibly adjusted according to actual conditions to improve processing quality and efficiency.

[0019] 4. The application can discover and correct processing quality problems in a timely manner by collecting manual process parameters and executing a quality correction strategy, thereby ensuring controllable product quality.

[0020] 5. The application integrates digital technology and manual process experience, which can better combine the advantages of the two and improve the precision and stability of quartz device processing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Specifically: Figure 1 is a flowchart illustrating the device processing quality control method based on a quartz device processing drawing library according to the present invention; Figure 2 is a structural schematic diagram illustrating the device processing quality control system based on a quartz device processing drawing library according to the present invention. Detailed Implementation

[0022] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0025] As shown in Figure 1, the device processing quality control method based on the quartz device processing drawing library of the present invention includes the following specific steps: S1: Collect the drawings of the quartz devices to be processed in the project order, extract the processing guidance data in the drawings, and establish a quartz device processing drawing library.

[0026] In S1, the processing guidance data includes: dimensional data, shape data, hole position and diameter data, surface roughness standard, and material specifications; the dimensional data includes the length, width, and height of the device; the shape data includes: the curve, angle, and chamfer of the quartz device; the hole position and diameter data includes the position, size, and shape of each hole on the quartz device; the surface roughness standard includes the smoothness and roughness of the device surface; and the material specifications include: the type, strength, and transparency of the quartz material used.

[0027] S2: Establish a three-dimensional digital model of the quartz device according to the processing guide data, and perform cutting processing on the three-dimensional digital model, and find and match the to-be-processed drawing library of the quartz device with the historical processing drawing library of the quartz device of the quartz processing factory.

[0028] In S2, the historical processing drawing library of the quartz device of the quartz processing factory includes a quartz device machine processing database and a quartz device manual processing database.

[0029] S3: Import the found and matched data into a minimum machine processing unit similarity calculation strategy, judge the process similarity level of the to-be-processed quartz device, and dynamically adjust and plan the processing process route of the to-be-processed quartz device.

[0030] S3 includes the following specific steps: S31: Obtain the model components after the three-dimensional digital model of the to-be-processed quartz device is digitally cut.

[0031] S32: Input a minimum processing unit search instruction into the quartz device machine processing database, and find out the minimum processing units constituting the to-be-processed quartz device and the historical processing process data of each minimum processing unit according to the minimum machine processing unit similarity calculation strategy.

[0032] S33: Extract the minimum processing unit similarity data and judge the machine processing process similarity level.

[0033] S34: Dynamically adjust and plan the processing process route of the to-be-processed quartz device according to the process similarity level of the to-be-processed quartz device.

[0034] The minimum processing unit includes a basic geometric shape, a local hole, a groove, and a specific processing area.

[0035] In S32, the minimum machine processing unit similarity calculation strategy is as follows: Wherein, S1 is the minimum machine processing unit similarity.

[0036] i, j are both subscripts, the three-dimensional digital model of the to-be-processed quartz device obtains I model components after digital cutting, and the quartz device machine processing database has J minimum machine processing units, i≤I, j≤J.

[0037] n i is the i-th model component after the three-dimensional digital model of the to-be-processed quartz device is digitally cut.

[0038] m j is the j-th minimum machine processing unit in the quartz device machine processing database.

[0039] ∩,∪ are intersection and union symbols respectively.

[0040] w[∩] is the number of data in the intersection of the data sets; w[∪] is the number of data in the union of the data sets.

[0041] The S33 further comprises the following specific steps: S331: judging the similarity level of the machining process.

[0042] When , it is judged that the similarity level of the machining process of the quartz device to be processed is similar, and step S332 is executed.

[0043] When , it is judged that the similarity level of the machining process of the quartz device to be processed is not similar, and step S333 is executed.

[0044] S332: The minimum processing unit of the quartz device to be processed obtained by searching and the historical processing data of each minimum processing unit are preferentially transmitted to the machine processing pipeline data cloud of the quartz processing factory, so that the machine processing pipeline can perform preferential processing according to the historical processing data.

[0045] S333: Input the minimum processing unit search instruction into the quartz device manual processing database, and calculate the minimum manual processing unit similarity according to the minimum manual processing unit similarity calculation strategy, wherein the minimum manual processing unit similarity calculation strategy is: Wherein, S2 is the minimum manual processing unit similarity.

[0046] q, p are subscripts, there are Q model components in the three-dimensional digital model of the quartz device to be processed that do not match the minimum machine processing unit, and there are P minimum manual processing units in the quartz device manual processing database, q≤Q, p≤P.

[0047] X q is the qth model component in the model component that does not match the minimum machine processing unit; Y p is the pth minimum manual processing unit in the quartz device manual processing database.

[0048] S334: Judging the similarity level of the manual processing process.

[0049] When , it is judged that the similarity level of the manual processing process of the quartz device to be processed is similar, and step S335 is executed.

[0050] When , it is judged that the similarity level of the manual processing process of the quartz device to be processed is not similar, and step S336 is executed.

[0051] S335: The minimum processing unit of the quartz device to be processed and the historical processing process data of each minimum processing unit obtained by searching are preferentially transmitted to the manual processing department data cloud of the quartz processing factory, and the minimum processing unit and the historical processing process data of each minimum processing unit are preferentially allocated to technical workers with less than or equal to 3 years of processing experience, and step S4 is performed.

[0052] S336: The model components of the three-dimensional digital model of the Q quartz devices to be processed are cloned, and the cloned model components are updated to the quartz device manual processing database of the quartz processing factory, and the model components of the three-dimensional digital model of the Q quartz devices to be processed are preferentially allocated to technical workers with more than 3 years of processing experience.

[0053] S4: The processing process route of the quartz device to be processed after dynamic adjustment is extracted, and the processing process parameters in the manual process are collected.

[0054] In S4, the processing process parameters in the manual process include the use parameters of the processing equipment used by the technical workers during the processing process, and the use parameters of the processing equipment include the actual processing speed of a single model component, the actual processing temperature of a single model component, the actual processing pressure of a single model component, and the actual cleaning and cooling time of a single model component.

[0055] S5: The processing process parameters in the manual process are imported into the processing quality checking strategy, and the quality correction strategy is executed according to the quality checking data.

[0056] The S5 includes the following specific steps: S51: The processing process parameters in the manual process are imported into the processing quality checking strategy, and the processing quality checking value is calculated, and the processing quality checking strategy is: Wherein, θ is the processing quality checking value.

[0057] R is the number of model components matched in the quartz device manual processing database, r is the subscript, and r≤R.

[0058] v r ,v′ r are the actual processing speed of a single model component and the historical processing speed in the historical processing process data, respectively.

[0059] T r ,T′ r are the actual processing temperature of a single model component and the historical processing temperature in the historical processing process data, respectively.

[0060] G r ,G′ rrespectively actual machining pressure and historical machining pressure in historical machining process data of single model part.

[0061] L r ,L′ r respectively actual cleaning and cooling time length and historical cleaning and cooling time length in historical machining process data of single model part.

[0062] S52: extract machining quality check value, make machining quality judgment, and execute quality correction strategy.

[0063] When θ < 2.67, it is judged that the machining quality of the quartz device of the technician is qualified, and the manual machining is completed.

[0064] When θ ≥ 2.67, it is judged that the machining quality of the quartz device of the technician is unqualified, and is fed back to the technician with more than 3 years of machining experience for repeated machining.

[0065] Embodiment two, as shown in Figure 2, the device machining quality control system based on the quartz device machining drawing library of the embodiment of the application comprises the following modules: a to-be-machined drawing library construction module, a lookup matching module, a machining process route planning module, a machining process parameter extraction module, and a machining quality check module.

[0066] The to-be-machined drawing library construction module is used to collect the to-be-machined drawings of the quartz devices to be machined in the project order, extract the machining guide data in the to-be-machined drawings, and establish a to-be-machined drawing library of the quartz devices.

[0067] The lookup matching module establishes a three-dimensional digital model of the quartz device according to the machining guide data, performs cutting processing on the three-dimensional digital model, and performs lookup matching between the to-be-machined drawing library of the quartz devices and a historical machining drawing library of the quartz devices of the quartz machining factory.

[0068] The machining process route planning module is used to import the lookup matching data into a minimum machine machining unit similarity calculation strategy, make a process similarity level judgment of the to-be-machined quartz devices, and dynamically adjust and plan a machining process route of the to-be-machined quartz devices.

[0069] The machining process parameter extraction module is used to extract the machining process route of the to-be-machined quartz devices after dynamic adjustment and planning, and collect machining process parameters in the manual process machining process.

[0070] The machining quality check module is used to import the machining process parameters in the manual process machining process into a machining quality check strategy, and execute a quality correction strategy according to the quality check data.

[0071] Embodiment three provides an electronic device, comprising: a processor and a memory, wherein the memory stores a computer program which can be invoked by the processor; the processor invokes the computer program stored in the memory to execute the quartz device processing drawing library based device processing quality control method described above.

[0072] The electronic device can have great differences due to different configurations or performances, and can include one or more processors (Central Processing Units, CPUs) and one or more memories, wherein the memory stores at least one computer program, which is loaded and executed by the processor to implement the quartz device processing drawing library based device processing quality control method provided by the above method embodiments. The electronic device can also include other components for realizing the functions of the device, for example, the electronic device can also have a wired or wireless network interface and an input and output interface, etc., so as to input and output data. This embodiment will not be described here.

[0073] Embodiment four provides a computer readable storage medium, which stores an erasable computer program; when the computer program runs on a computer device, the computer device executes the quartz device processing drawing library based device processing quality control method described above.

[0074] For example, the computer readable storage medium can be a Read-Only Memory (ROM), a Random Access Memory (RAM), a Compact Disc Read-Only Memory (CD-ROM), a magnetic tape, a floppy disk and an optical data storage device, etc.

[0075] It should be understood that in various embodiments of the present application, the size of the sequence number of each process described above does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0076] It should be understood that according to A, B is determined, which does not mean that B is determined only according to A, but also can be determined according to A and / or other information.

[0077] The above-described embodiments can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, the above-described embodiments can be implemented in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions according to the embodiments of the present application are wholly or partially generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center through a wired network or / and a wireless network. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. containing one or more available medium collections. The available medium can be a magnetic medium (for example, a floppy disk, a hard disk, a magnetic tape), an optical medium (for example, a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state disk.

[0078] Those skilled in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed in the present application can be realized in electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to realize the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0079] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be described here.

[0080] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the above-described device embodiments are merely schematic, for example, the division of units is only one, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed units can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0081] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0082] In addition, each functional unit in various embodiments of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit.

[0083] In the description of the specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0084] In summary, compared with the prior art, the technical effects of the present application are as follows: 1. The present application automatically extracts processing guide data and establishes a three-dimensional digital model, saving labor cost and time and improving work efficiency.

[0085] 2. The present application can match with the historical drawing library of the quartz processing plant to timely understand the similar level of the processing technology planning, and avoid repeated labor or processing errors.

[0086] 3. The present application dynamically adjusts the processing technology route, which can be flexibly adjusted according to the actual situation to improve the processing quality and efficiency.

[0087] 4. The present application collects manual process parameters and executes quality correction strategies to timely discover and correct processing quality problems, ensuring controllable product quality.

[0088] 5. The present application integrates digital technology and manual process experience to better combine the advantages of both, improving the precision and stability of quartz device processing.

[0089] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A device processing quality control method based on a quartz device processing drawing library, characterized in that: The method comprises the following steps: S1: Collecting the to-be-processed drawings of the quartz device in the project order, extracting the processing guide data in the to-be-processed drawings, and establishing a to-be-processed drawing library of the quartz device; S2: Establishing a three-dimensional digital model of the quartz device according to the processing guide data, performing cutting processing on the three-dimensional digital model, and performing lookup matching between the to-be-processed drawing library of the quartz device and a historical processing drawing library of the quartz device of the quartz processing factory; S3: Importing the lookup matching data into a minimum machine processing unit similarity calculation strategy, performing process similarity level judgment on the to-be-processed quartz device, and dynamically adjusting and planning the processing process route of the to-be-processed quartz device; S4: Extracting the processing process route of the to-be-processed quartz device after dynamic adjustment and planning, and collecting the processing process parameters in the manual process; S5: Importing the processing process parameters in the manual process into a processing quality checking strategy, and performing a quality correction strategy according to the quality checking data.

2. The device processing quality control method based on a quartz device processing drawing library according to claim 1, characterized in that, In the step S1, the processing guide data includes size data, shape data, hole position and hole diameter data, surface roughness standard, and material specification; the size data includes the length, width and height of the device; the shape data includes the quartz device curve, angle and chamfer; the hole position and hole diameter data includes the position, size and shape of each hole diameter on the quartz device; the surface roughness standard includes the smoothness and roughness of the device surface; and the material specification includes the type, strength and transparency of the quartz material used. In the step S2, the historical processing drawing library of the quartz device of the quartz processing factory includes a quartz device machine processing database and a quartz device manual processing database.

3. The device processing quality control method based on a quartz device processing drawing library according to claim 2, characterized by, The step S3 comprises the following steps: S31: Obtaining the model components after digital cutting of the three-dimensional digital model of the to-be-processed quartz device; S32: Inputting a minimum processing unit lookup instruction into the quartz device machine processing database, and finding out the minimum processing unit and the historical processing process data of each minimum processing unit constituting the to-be-processed quartz device according to a minimum machine processing unit similarity calculation strategy; S33: Extracting the minimum processing unit similarity data, and performing machine processing process similarity level judgment to obtain the process similarity level of the to-be-processed quartz device; S34: Dynamically adjusting and planning the processing process route of the to-be-processed quartz device according to the process similarity level of the to-be-processed quartz device. The minimum processing unit includes a basic geometric shape, a local hole, a local groove and a specific processing area.

4. The device processing quality control method based on a quartz device processing drawing library according to claim 3, characterized by, In the step S32, the minimum machining unit similarity calculation strategy is as follows: Wherein, S1 is the minimum machine processing unit similarity; i, j are both subscripts, I model components are obtained after digital cutting of the three-dimensional digital model of the to-be-processed quartz device, and there are J minimum machine processing units in the quartz device machine processing database; i≤I, j≤J; n i the i-th model part after digital cutting of a three-dimensional digital model of a quartz device to be processed; m j machine the jth smallest machineable unit in the quartz device machineability database; ∩, ∪ are intersection and union symbols respectively; w[∩] is the data number of the intersection of data sets; w[∪] is the data number of the union of data sets.

5. The device processing quality control method based on the quartz device processing drawing library according to claim 4, wherein, The step S33 further comprises the following specific steps: S331: Performing machine processing process similarity level judgment; When When the similarity level of the machine processing technology of the quartz device to be processed is similar, the step S332 is performed. When When the similarity level of the machine processing technology of the quartz device to be processed is not similar, the step S333 is performed. S332: The minimum processing unit of the quartz device to be processed and the historical processing technology data of each minimum processing unit are preferentially transmitted to the machine processing flow line data cloud of the quartz processing factory, so that the machine processing flow line performs preferential processing according to the historical processing technology data. S333: input the minimum machining unit search instruction in the quartz device manual machining database, and calculate the minimum manual machining unit similarity according to the minimum manual machining unit similarity calculation strategy, wherein the minimum manual machining unit similarity calculation strategy is: S2 is the similarity of the minimum manual processing unit; q and p are subscripts, and there are Q model components in the three-dimensional digital model of the quartz device to be processed that do not match the minimum machine processing unit, and there are P minimum manual processing units in the quartz device manual processing database; q≤Q, p≤P; X q is the qth model part in the model part that does not match the minimum machine processing unit; Y p p-th minimum manual processing unit in the quartz device manual processing database; S334: The similarity level of the manual processing technology is judged. When When the similarity level of the manual processing technology of the quartz device to be processed is similar, the step S335 is performed. When When the similarity level of the manual processing technology of the quartz device to be processed is not similar, the step S336 is performed. S335: The minimum processing unit of the quartz device to be processed and the historical processing technology data of each minimum processing unit are preferentially transmitted to the manual processing department data cloud of the quartz processing factory, and at the same time, the historical processing technology data of the minimum processing unit and each minimum processing unit is preferentially allocated to a technical worker with processing experience less than or equal to 3 years, and the step S4 is performed. S336: The model components of the three-dimensional digital model of the Q quartz devices to be processed are cloned, and the cloned model components are updated to the quartz device manual processing database of the quartz processing factory, and at the same time, the model components of the three-dimensional digital model of the Q quartz devices to be processed are preferentially allocated to a technical worker with processing experience greater than 3 years.

6. The device processing quality control method based on a quartz device processing drawing library according to claim 5, wherein, In the step S4, the processing parameters in the manual processing process include: the use parameters of the processing equipment used by the technical worker in the processing process, and the use parameters of the processing equipment include: the actual processing speed of a single model component, the actual processing temperature of a single model component, the actual processing pressure of a single model component, and the actual cleaning and cooling time of a single model component.

7. The device processing quality control method based on a quartz device processing drawing library according to claim 6, wherein, The step S5 includes the following steps: S51: import the machining process parameters in the manual process into the machining quality checking strategy, and calculate to obtain a machining quality checking value, wherein the machining quality checking strategy is: θ is the processing quality check value; R is the number of model components matched in the quartz device manual processing database, and r is a subscript; r≤R; v r ,v′ r are the actual machining speed of the individual model part and the historical machining speed in the historical machining process data, respectively; T r ,T′ r are the actual and historical machining temperatures, respectively, of the individual model part and historical machining process data. G r ,G′ r respectively actual machining pressure and historical machining pressure in historical machining process data of the single model component L r ,L′ r are the actual cleaning and cooling time length of the individual model part and the historical cleaning and cooling time length in the historical process data, respectively; S52: Extract the processing quality check value, judge the processing quality, and perform the quality correction strategy. When θ<2.67, it is judged that the processing quality of the technical worker on the quartz device is qualified, and the manual processing is completed. When θ≥2.67, it is judged that the processing quality of the technical worker on the quartz device is unqualified, and is fed back to a technical worker with processing experience greater than 3 years for repeated processing.

8. A device processing quality control system based on a quartz device processing drawing library, which is implemented based on the device processing quality control method based on a quartz device processing drawing library according to any one of claims 1-7, characterized in that, The system includes the following modules: A to-be-processed drawing library construction module is configured to collect to-be-processed drawings of quartz devices to be processed in project orders, extract processing guide data in the to-be-processed drawings, and construct a to-be-processed drawing library of quartz devices. The searching matching module is used to establish a three-dimensional digital model of the quartz device according to the processing guide data, to perform cutting processing on the three-dimensional digital model, and to search and match the to-be-processed drawing library of the quartz device with the historical processing drawing library of the quartz device of the quartz processing factory. The processing technology route planning module is used to import the searching matching data into a minimum machine processing unit similarity calculation strategy, to perform a process similarity level judgment on the to-be-processed quartz device, and to dynamically adjust and plan a processing technology route of the to-be-processed quartz device. The processing technology parameter extraction module is used to extract the processing technology route of the to-be-processed quartz device after dynamic adjustment and planning, and to collect processing technology parameters in a manual process. The processing quality checking module is used to import the processing technology parameters in the manual process into a processing quality checking strategy, and to perform a quality correction strategy according to quality checking data.

9. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by a processor, and a device processing quality control method based on a quartz device processing drawing library is realized.

10. An electronic device, comprising: The computer program product comprises: a memory for storing instructions; a processor for executing the instructions, so that the device performs steps of realizing the device processing quality control method based on the quartz device processing drawing library according to any one of claims 1-7.

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