Mounting apparatus

Abstract

A mounting apparatus for a device in which one object to be joined is mounted on another object to be joined comprises: a stage for placing the one object to be joined on a placing surface; a mechanism for fixing the one object to be joined to the stage; a mechanism for conveying the other object to be joined to the upper surface of the one object to be joined; and a mechanism for heating the one object to be joined from the rear surface side of the placing surface of the stage. The mechanism for fixing the one object to be joined to the stage is configured to fix the lower surface of the one object to be joined to the placing surface of the stage by suction.

Description

Mounting Equipment

[0001] The present invention relates to a mounting apparatus, and more particularly to a mounting apparatus for a device in which one of a plurality of objects to be bonded is mounted on the other.

[0002] Conventionally, optical components used in the fields of optical communications and optical sensing have been required to be smaller, more functional, and less expensive, necessitating technology for integrating multiple chips with different functions. Three-dimensional surface-mounted complementary metal-oxide-semiconductor (CMOS) components (e.g., Non-Patent Document 1) and optical components in which a semiconductor optical amplifier is surface-mounted on a planar lightwave circuit (PLC) (e.g., Non-Patent Document 2) have been reported.

[0003] Various methods have been reported for fixing multiple chips when they are surface mounted, such as connection using solder (solder connection) or fixing using resin or Ag paste, but the use of solder connection has been reported more frequently for mass-produced components (e.g., Non-Patent Documents 3 and 4).

[0004] In monolithic integration of PLCs, it is necessary to align the optical waveguides of each chip with high precision to reduce optical coupling loss, and the alignment accuracy must be submicron in each of the three orthogonal axes (x, y, and z).

[0005] Yasuhiko Arakawa, et al.,“Silicon photonics for next generation system integration platform”,IEEE Communications Magazine,Volume 51,Issue 3,IEEE,March 2013Toshikazu Hashimoto,et al.,“Multichip optical hybrid integration technique with planar lightwave circuit platform”,Journal of Lightwave Technology,Volume 16,Issue 7,IEEE,July 1998Takanori Shimizu,et al.,“High Density Hybrid Integrated Light Source with a Laser Diode Array on a Silicon Optical Waveguide Platform for Inter-Chip Optical Interconnection”,8th IEEE International Conference on Group IV Photonics,pp.181-183,IEEE,September 2011Eiji Higurashi,et al.,“Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films”, EEE Photonics Technology Letters,Volume 19,Issue 24,IEEE,December 2007

[0006] Referring to FIG. 1 , a general method for assembling a device in which multiple objects to be bonded are mounted on one another using a mounting apparatus will be described. The mounting apparatus generally assembles devices using the procedure shown in FIG. 1 . Here, an example will be described in which Part B, which is one of the objects to be bonded, is soldered to the surface of Part A, which is one of the objects to be bonded. For example, Part A is a PCL, and Part B is a semiconductor amplifier (SOA). As shown in FIG. 1 , the stage 10 of the mounting apparatus includes a sapphire plate 11 and an aluminum frame 12, and is configured to heat the objects to be bonded on the surface side of the stage 10 by laser irradiation from the back side of the stage 10.

[0007] First, as shown in FIGS. 1( a) and 1(b), the PLC 20 is transported to and fixed on the stage 10. Specifically, the PLC 20 is transported using a collet to the inside of the opening in the aluminum frame 12 on the surface of the sapphire plate 11, and at least two of the four sides of the PLC 20 are fixed to the aluminum frame 12 using a mechanical chuck or suction to prevent misalignment. Even when suction is used, at least one side of the PLC 20 is in contact with the aluminum frame 12, as shown in FIGS. 1(a) and 1(b). As shown in FIG. 1(b), a gap is formed between the lower surface of the aluminum frame 12, which is in contact with at least one side of the aluminum frame 12, and the upper surface of the sapphire plate 11. This gap forms an air flow path when the PLC 20 is suction-mounted. By transporting and fixing the PLC 20, which is one of the objects to be bonded, on the stage 10 using a mechanical chuck or suction, the PLC 10 can be placed in approximately the same position each time.

[0008] In this state, the positions of the alignment marks 21 formed on the PLC 20 are read by an IR camera (not shown), and the position of the PLC 20 is recorded. Solder (AuSn solder 130 in this example) is placed on the upper surface, which is the joining surface, of the PLC 20. The PLC 20 with the solder placed thereon in advance may be delivered to the stage 10 and fixed there.

[0009] Next, as shown in Figures 1(c) and (d), a collet is used to transport the other object to be bonded, the SOA 40, to the upper surface, which is the bonding surface, of the one object to be bonded, the PLC 20, and an IR camera is used to read the alignment mark 21 of the PLC 20 and the alignment mark 22 of the SOA 40, and the PLA 20 and the SOA 40 are aligned based on these alignment marks.

[0010] Thereafter, as shown in Figures 1(e) and (f), with the PLC 20 and the SOA 40 in contact with the AuSn solder 130, the PLC 20 and the SOA 40 are heated to about 300 degrees by local heating using a high-power infrared laser or by heating using a heater, thereby melting the AuSn solder and rapidly cooling it, thereby joining the PLC 20 and the SOA 40.

[0011] In this way, the position of one object to be joined and the position of the other object to be joined are aligned accurately by recognizing the alignment marks with a camera, but there is a problem in that the heat generated when melting the solder can cause the positions of the objects to be joined and the other object to be joined to deviate by several microns.

[0012] This misalignment occurs when the position of Part A is displaced due to thermal expansion when the object to be joined, Part A, fixed to the stage 10, or the aluminum frame 12 that fixes Part A is heated. The cause of the misalignment will be described in detail with reference to FIG. 2.

[0013] 2A shows a state in which the PLC 20, which is Part A, is fixed to the stage 10 before heating. At this time, the PLC 20 is fixed to the aluminum frame 12 by suction. The position of the bottom left of the PLC 20 before heating is set to (x, y) = (0, 0). The size of the PLC 20 is defined as the length in the x direction as Lx and the length in the y direction as Ly. The SOA 40, which is Part B to be bonded and fixed to the mounting surface of the PLC 20, is mounted at the center X (Lx / 2, Ly / 2) of Part A.

[0014] As shown in FIG. 2B, when heated, the PLC 20 thermally expands. For example, the thermal expansion coefficient α of silicon Si is 3 x 10 -5[m / K], so when heated from room temperature of 25 degrees to 300 degrees, the center position of the PLC 20 shifts by ΔXpart and ΔYpart. ΔXpart = (Lx / 2) × α × (300-25) ΔYpart = (Ly / 2) × α × (300-25)

[0015] 2C, when the PLC 20 is heated, the heat of the PLC 20 is transferred to the aluminum frame 12 that fixes the PLC 20, and the aluminum frame 12 also thermally expands. Since the PLC 20 is fixed to the aluminum frame 12, the position of the PLC 20 shifts by ΔXstage and ΔYstage. The thermal expansion coefficient α of the aluminum frame 12 Al is 2.3 x 10 -5 The coefficient of thermal expansion is [m / K]. The frame material may be a metal other than aluminum, such as stainless steel, but in this case, like aluminum, the coefficient of thermal expansion is high. The heat transmitted from the PLC 20 will cause the temperature of the aluminum frame 12 to rise by 200 degrees. As the temperature of the aluminum frame 12 rises by several tens to several hundred degrees, the position (x, y) = (0, 0) at the bottom left of the aluminum frame 12 will be misaligned by several microns.

[0016] 2(d), the x and y coordinates of the position of the center X of the PLC 20 are shifted by ΔXpart+ΔXstage and ΔYpart+ΔYstage, respectively. If the positions of the objects to be bonded are shifted by even a few microns in this way, the optical coupling loss between the objects to be bonded in the completed device will increase, leading to deterioration of the characteristics of the device.

[0017] The present disclosure has been made in consideration of such problems, and its purpose is to provide a mounting apparatus that can achieve high-precision alignment between multiple objects to be bonded that are mounted on a device.

[0018] To achieve this object, one embodiment of the present disclosure is a device mounting apparatus in which one object to be bonded is mounted on another object to be bonded, the device comprising: a stage for mounting the one object to be bonded on a mounting surface; a mechanism for fixing the one object to be bonded to the stage; a mechanism for transporting the other object to the upper surface of the one object to be bonded; and a mechanism for heating the one object to be bonded from the back side of the mounting surface of the stage. The mechanism for fixing the one object to be bonded to the stage is configured to adsorb the lower surface of the one object to be bonded to the mounting surface of the stage.

[0019] According to the mounting device of an embodiment of the present disclosure, it is possible to achieve highly accurate alignment when fixing a plurality of objects to be joined together by heating solder, a thermosetting adhesive, or the like.

[0020] 1A and 1B are diagrams illustrating a general method for assembling a device in which one of a plurality of workpieces to be bonded is mounted on another using a mounting apparatus, where (a) is a top view showing how the PLC 20 is transported to and fixed on the stage 10, (b) is a cross-sectional view of (a), (c) is a top view showing how the SOA 40 is aligned on the top surface of the PLC 20, (d) is a cross-sectional view of (c), (e) is a top view showing how the PLC 20 and the SOA 40 are fixed, and (f) is a cross-sectional view of (e).

[0023]

[0024]

[0025]

[0026]

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

[0033]

[0034]

[0035]

[0036]

[0037]

[0038]

[0039]

[0040]

[0041]

[0042]

[0043]

[0044]

[0045]

[0046]

[0047]

[0048]

[0049]

[0050]

[0051]

[0052]

[0053]

[0054]

[0055]

[0056]

[0057]

[0058]

[0059]

[0060]

[0061]

[0062]

[0063]

[0064]

[0065]

[0066]

[0067]

[0068]

[0069]

[0070]

[0071] 1A and 1B are diagrams showing the configuration of an optical device 100 in which an InP optical semiconductor LD chip is mounted on a silicon photo chip (PLC) 110 using a mounting apparatus according to one embodiment of the present invention, where (a) is a top view and (b) is a cross-sectional view of (a). 1B are diagrams showing the configuration of a mounting apparatus according to one embodiment of the present invention, where (a) is a top view and (b) is a cross-sectional view of (a). 1C are diagrams showing the configuration of a mounting apparatus according to one embodiment of the present invention, where (a) is a top view, (b) is a cross-sectional view of (a), and (c) is a diagram showing the back surface of an aluminum frame 514. 1C are diagrams showing the configuration of a mounting apparatus according to one embodiment of the present invention, where (a) is a top view and (b) is a cross-sectional view of (a).

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The same or similar reference symbols indicate the same or similar elements, and repeated description may be omitted. The materials and values ​​shown below are examples, and embodiments of the present disclosure may be implemented using other materials and values ​​without departing from the spirit of the present disclosure. Embodiments of the present disclosure may be implemented by omitting some elements, changing some elements to other elements, and / or adding other elements without departing from the spirit of the present disclosure.

[0022] The present disclosure provides various mounting apparatuses for devices in which one of a plurality of objects to be bonded is mounted on the other. The mounting apparatuses of various embodiments are used to connect Part B, which is one of the objects to be bonded, to the surface of Part A, which is one of the objects to be bonded. Before describing the mounting apparatuses of various embodiments, the configuration of an optical device 100 fabricated using the mounting apparatus of an embodiment of the present disclosure will be described, in which Part A, which is one of the objects to be bonded, is a silicon photo chip 110 and Part B, which is the other of the objects to be bonded, is an InP optical semiconductor LD chip 120.

[0023] Fig. 3 is a diagram showing the configuration of an optical device 100 fabricated using the mounting apparatus according to various embodiments of the present disclosure. The optical device 100 shown in Fig. 3 includes a silicon photo chip 110 and an InP optical semiconductor LD chip 120. The silicon photo chip 110 is a PLC including a waveguide 112 formed on a substrate. In Fig. 3, the waveguide 112 is indicated by a dashed-dotted line. The silicon photo chip 110 further includes a recess 114 that divides the waveguide 112.

[0024] The InP optical semiconductor LD chip 120 is fixed to the bottom surface of the recess 114 of the silicon photo chip 110 by AuSn solder 130 formed in advance. The flip-chip mounted InP optical semiconductor LD chip 120 is butt-jointed to the waveguide 112 of the silicon photo chip 110. The waveguide 112 of the silicon photo chip 110 and the optical axis of the InP optical semiconductor LD chip 120 (shown by the two-dot dash line in FIG. 3 ) are aligned with high precision and then fixed by the AuSn solder 130, resulting in an optical device 100 with less deterioration in characteristics. Therefore, after the InP optical semiconductor LD chip 120 is aligned on the bottom surface of the recess 114 of the silicon photo chip 110, the AuSn solder 130 is melted and fixed, i.e., soldered.

[0025] Highly accurate alignment is required to couple the waveguide 112 of the silicon photo chip 110 and the optical axis (waveguide) of the InP optical semiconductor LD chip 120 with low loss.

[0026] First Embodiment A mounting apparatus according to this embodiment will be described with reference to FIG. 4 . The mounting apparatus according to this embodiment includes a stage 410. The stage 410 includes a sapphire plate 412 having a mounting surface on which an object to be bonded is placed, and an air flow path 414 formed for adsorbing the object to be bonded. The air flow path 414 is formed between the area of ​​the mounting surface of the stage 410 on which the object to be bonded is placed and another surface of the sapphire plate 412. In the configuration shown in FIG. 4 , the other surface is a side surface that is substantially perpendicular to the mounting surface of the sapphire plate 412, but the other surface may also be a bottom surface that faces the mounting surface of the sapphire plate 412. There are no limitations on the arrangement or route of the end of the air flow path 414, as long as it does not interfere with local heating by high-power infrared laser irradiation from the bottom surface of the sapphire plate 412 or heater heating.

[0027] Next, a method for fabricating the optical device 100 shown in Fig. 3 using a mounting apparatus having the stage 410 of this embodiment will be described. As described above, the optical device 100 is formed by flip-chip mounting the InP optical semiconductor LD chip 120 on the silicon photonics chip 110.

[0028] First, the silicon photonics chip 110 is transported to the mounting area near the center of the stage 410 using the collet 150 and fixed by suction. The mounting area of ​​the stage 410 has an end of an air flow path for suction, and the silicon photonics chip 110 can be fixed by suction by placing it thereon.

[0029] Thereafter, the alignment mark 121 formed on the silicon photonics chip 110 is read by an IR camera (not shown) to obtain the installation position coordinates.

[0030] Next, the InP optical semiconductor LD chip 120 is transported to the recess in the silicon photonics chip 110 using a collet 150, and the positions of the alignment marks 121 formed on the silicon photonics chip 110 and the alignment marks 122 formed on the InP optical semiconductor LD chip 120 are aligned while being read by an IR camera.

[0031] Then, with the InP optical semiconductor LD chip 120 pressed against the AuSn solder 130 formed on the bottom surface of the recess in the silicon photonics chip 110, a high-power laser is irradiated from the back side of the sapphire plate 412 to heat it at 300 degrees for 10 seconds to melt the AuSn solder 130, which is then rapidly cooled.

[0032] On the stage 410 of the mounting apparatus of this embodiment, the four end faces of the silicon photonics chip 110 are free and do not come into contact with anything. Therefore, there is no displacement of the silicon photonics chip 110 on the stage 410 due to the influence of thermal expansion of the aluminum frame 12 as described with reference to FIG.

[0033] Furthermore, by suctioning the silicon photonics chip 110 as close as possible to the lower mounting position of the InP optical semiconductor LD chip 120, and locating it in the center position when the silicon photonics chip 110 thermally expands, it is possible to suppress the thermal expansion of the silicon photonics chip 110 itself, and therefore it is possible to suppress the displacement of the silicon photonics chip 110 on the stage 410.

[0034] Second Embodiment The mounting device of the first embodiment has a structure in which the four end faces of the silicon photonics chip 110 are fixed to the stage 410 in a free state. On the other hand, the mounting device of the present embodiment has a structure in which two of the four end faces of the silicon photonics chip 110 are fixed to the stage in a state in which parts of the two end faces are in contact with an aluminum frame that is a component of the stage.

[0035] The mounting apparatus of this embodiment will be described with reference to Fig. 5. The mounting apparatus of this embodiment includes a stage 500. The stage 500 includes a sapphire plate 512 having a mounting surface on which an object to be bonded is placed, and an aluminum frame 514. As shown in Fig. 5(a), the aluminum frame 514 has an opening. The object to be bonded is placed and fixed in the area within the opening.

[0036] The aluminum frame 514 has two protrusions 514a formed on the opening side. The protrusions 514a are semicircular, quadrangular, or quadrangular (semicircular, trapezoidal, or triangular when viewed from above). From the viewpoint of suppressing heat conduction from the silicon photonics chip 110 to the aluminum frame 514, it is desirable that the tip of the protrusions 514a be small. Furthermore, from the viewpoint of preventing damage when coming into contact with the end face of the silicon photonics chip 110, it is desirable that the tip of the protrusions 514a not be acute.

[0037] 5(b) and 5(c), a region including two protrusions 514a on the rear surface of the aluminum frame 514 is stepped and is thinner than other portions. The stepped portion on the rear surface of the aluminum frame 514 forms an air flow path 516 when the workpiece is attracted to the region within the opening.

[0038] The method for fabricating the optical device 100 shown in FIG. 3 using a mounting apparatus having the stage 500 of this embodiment is the same as that of the first embodiment. The silicon photonics chip 110 is transported to a mounting area within an opening in the aluminum frame 514 of the stage 500 using a collet 150 and fixed by suction. In other words, the mechanism for fixing the silicon photonics chip 110 to the stage 500 in the mounting apparatus of this embodiment is configured to suction two of the four end faces of the silicon photonics chip 110 that intersect with the upper and lower surfaces of the silicon photonics chip 110 toward the aluminum frame 514. The end face of the silicon photonics chip 110 that is suctioned may be one of the four end faces.

[0039] As can be seen from Figure 5, the silicon photonics chip 110 is mounted so that the two end faces of the silicon photonics chip 110 are pressed against the two protrusions 514a of the aluminum frame 514 of the stage 500, and is fixed by suction in the lower left direction of Figure 5(a).

[0040] Thereafter, the InP optical semiconductor LD chip 120 and the silicon photonics chip 110 are aligned, and the AuSn solder 130 is melted and rapidly cooled by irradiation with a high-power laser, whereby the InP optical semiconductor LD chip 120 and the silicon photonics chip 110 are soldered together.

[0041] Unlike the general mounting device described with reference to Fig. 1, the contact between the silicon photonics chip 110 and the aluminum frame 514 is limited to the protruding portion 514a, and the contact area is small. This makes it difficult for heat to be transferred from the silicon photonics chip 110 to the aluminum frame 514. This makes it possible to suppress the thermal expansion of the aluminum frame 515 as described with reference to Fig. 2, and to suppress displacement of the silicon photonics chip 110 on the stage 500. Note that the protruding portion 514a may be formed from a highly heat-resistant, highly heat-insulating, and low-thermal-conductive material as described below.

[0042] Third Embodiment The mounting device of the second embodiment has a structure in which the silicon photonics chip 110 is fixed to the stage 500 with parts of the two end faces of the silicon photonics chip 110 in contact with the protrusions 514a of the aluminum frame 514. On the other hand, the mounting device of the present embodiment has a structure in which two of the four end faces of the silicon photonics chip 110 are fixed to the stage in contact with the aluminum frame, which is a component of the stage, via a member formed from a material with high heat resistance, high thermal insulation, and low thermal conductivity (hereinafter, a highly heat-resistant, highly thermally insulating, low thermal conductivity member).

[0043] The mounting apparatus of this embodiment will be described with reference to Fig. 6. The mounting apparatus of this embodiment includes a stage 600. The stage 600 includes a sapphire plate 612 having a mounting surface on which an object to be bonded is placed, and an aluminum frame 614. As shown in Fig. 6(a), the aluminum frame 614 has an opening. The object to be bonded is placed and fixed in the area within the opening.

[0044] Similar to the aluminum frame 514 of the mounting device of the second embodiment described with reference to Figures 5(b) and (c), a step is provided on the rear surface of the aluminum frame 614. As shown in Figure 6(b), the step on the rear surface of the aluminum frame 614 forms an air flow path 616 when an object to be joined is sucked into the region within the opening of the aluminum frame 614.

[0045] Two high-heat-resistant, high-insulation, low-thermal-conductivity members 615 are provided on the opening side of the aluminum frame 614. The high-heat-resistant, high-insulation, low-thermal-conductivity members 615 suppress heat conduction from the silicon photonics chip 110 to the aluminum frame 614. From the viewpoint of preventing damage when they come into contact with the end face of the silicon photonics chip 110, the high-heat-resistant, high-insulation, low-thermal-conductivity members 615 can be made of an elastic material such as heat-resistant rubber.

[0046] The method for fabricating the optical device 100 shown in FIG. 3 using a mounting apparatus having the stage 600 of this embodiment is the same as that of the first embodiment. The silicon photonics chip 110 is transported to a mounting area within an opening in the aluminum frame 614 of the stage 600 using a collet 150 and fixed by suction. In other words, the mechanism for fixing the silicon photonics chip 110 to the stage 600 in the mounting apparatus of this embodiment is configured to suction two of the four end faces of the silicon photonics chip 110 that intersect with the upper and lower surfaces of the silicon photonics chip 110 toward the aluminum frame 614. The end face of the silicon photonics chip 110 that is suctioned may be one of the four end faces.

[0047] As can be seen from Figure 6, the silicon photonics chip 110 is mounted so that the two end faces of the silicon photonics chip 110 are pressed against two high-heat-resistant, high-insulation, low-thermal-conductivity members 615 of the aluminum frame 614 of the stage 600, and is fixed by suction in the lower left direction of Figure 6(a).

[0048] Thereafter, the InP optical semiconductor LD chip 120 and the silicon photonics chip 110 are aligned, and the AuSn solder 130 is melted and rapidly cooled by irradiation with a high-power laser, whereby the InP optical semiconductor LD chip 120 and the silicon photonics chip 110 are soldered together.

[0049] 1, the silicon photonics chip 110 contacts the aluminum frame 614 via the highly heat-resistant, highly heat-insulating, and low-thermal-conductivity member 615, making it difficult for heat to be transferred from the silicon photonics chip 110 to the aluminum frame 614. Therefore, it is possible to suppress the thermal expansion of the aluminum frame 515 as described with reference to FIG. 2, and to suppress displacement of the silicon photonics chip 110 on the stage 600.

[0050] According to the mounting device of the present disclosure, it is possible to achieve highly accurate alignment when fixing a plurality of objects to be joined together by heating solder, a thermosetting adhesive, or the like.

[0051] 10, 410, 500, 600 Stage 11, 412, 512, 612 Sapphire plate 12, 514, 614 Aluminum frame 13, 414, 516, 616 Air flow path 20 PCL 21, 22, 121, 122 Alignment mark Alignment mark 30 Solder 40 SOA 50, 150 Collet 100 Optical device 110 Silicon photo chip (PLC) 112 Waveguide 114 Recess 120 InP optical semiconductor LD chip 130 AuSn solder 514a Convex portion 615 High heat resistance, high heat insulation, low thermal conductivity member

Claims

1. A mounting apparatus for a device in which one object to be bonded is mounted on another object to be bonded, comprising: a stage for placing the one object to be bonded on a placement surface; a mechanism for fixing the one object to be bonded on the stage; a mechanism for transporting the other object to be bonded to the upper surface of the one object to be bonded; and a mechanism for heating the one object to be bonded from the back side of the placement surface of the stage, wherein the mechanism for fixing the one object to be bonded on the stage is configured to adsorb the lower surface of the one object to be bonded to the placement surface of the stage.

2. A mounting apparatus for a device in which one object to be bonded is mounted on another object to be bonded, comprising: a stage on which the one object to be bonded is placed on a placement surface, the stage having a metal frame; a mechanism for fixing the one object to be bonded to the stage; a mechanism for transporting the other object to be bonded to the upper surface of the one object to be bonded; and a mechanism for heating the one object to be bonded from the back side of the placement surface of the stage, wherein the metal frame has a convex portion, and the mechanism for fixing the one object to be bonded to the stage is configured to fix the one object to be bonded to the stage with the tip of the convex portion in contact with the one object to be bonded.

3. The mounting device according to claim 2, wherein the shape of the convex portion is a semi-sphere.

4. The mounting device according to claim 2, wherein the protrusion is formed from a highly heat-resistant, highly heat-insulating, and low-thermal-conductive material.

5. A mounting apparatus for a device in which one object to be bonded is mounted on another object to be bonded, comprising: a stage on which the one object to be bonded is placed on a placement surface, the stage having a metal frame; a high-heat resistant, highly insulating, low-thermal conductive member arranged along the metal frame; a mechanism for fixing the one object to be bonded on the stage; a mechanism for transporting the other object to be bonded to an upper surface of the one object to be bonded; and a mechanism for heating the one object to be bonded from the back side of the placement surface of the stage, wherein the mechanism for fixing the one object to be bonded on the stage is configured to fix the one object to be bonded on the stage with the one object to be bonded and the high-heat resistant, highly insulating, low-thermal conductive member in contact with each other.

6. A mounting device according to any one of claims 2 to 5, wherein the mechanism for fixing the one object to be bonded to the stage is configured to adsorb the end face of the one object to be bonded that intersects with the top surface toward the metal frame.

Images