Electronic device

Abstract

An electronic device S100 includes a first electronic component 10, and an adapter 30 in which an accommodating portion 35 for accommodating the first electronic component 10 is formed, wherein: the adapter 30 includes an adapter main body 31 having a first surface 31a and a second surface 31b on the opposite side to the first surface 31a in the thickness direction of the adapter 30, and electrically conductive posts 38 that penetrate through the adapter main body 31 from the first surface 31a to the second surface 31b; the accommodating portion 35 is formed as a recessed portion in the first surface 31a; and a mounting portion P1 on which a second electronic component 20 is mounted is formed on the second surface 31b.

Description

Electronic Devices

[0001] The present invention relates to electronic devices.

[0002] Conventionally, electronic devices have been known in which multiple electronic components are molded with resin and packaged (see, for example, Patent Document 1). The molded electronic components are electrically connected to a circuit pattern of a substrate on which the electronic device is mounted via external terminals formed on the bottom surface of the electronic device.

[0003] Japanese Patent Application Laid-Open No. 2018-018867

[0004] In conventional configurations, molded electronic components are connected to external circuit patterns through the external terminals of the electronic device, which means that each time an electronic device is developed, it is necessary to design the circuit configuration inside the package and evaluate its performance, which causes a long development period.On the other hand, in recent years, there has been a demand for electrical devices that can handle large currents and high voltages.

[0005] The present invention has been made in view of these points, and has as its object to provide an electric device that can shorten the development period and can handle large currents and high withstand voltages.

[0006] One form of the present invention for solving the above problem provides an electronic device comprising a first electronic component and an adapter having a storage section for storing the first electronic component, wherein the adapter has an adapter body having a first surface and a second surface opposite the first surface in the thickness direction of the adapter, and a conductive post penetrating the adapter body from the first surface to the second surface, wherein the storage section is formed as a recess on the first surface, and a mounting section on the second surface on which a second electronic component is mounted.

[0007] The conductive post may include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the accommodating section therebetween, and the second electronic component mounted on the mounting section may be electrically connected to the first conductive post and the second conductive post.

[0008] The conductive posts may include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the accommodating portion interposed therebetween, and the adapter body may be divided into a plurality of constituent members, the plurality of constituent members including a first member on which the first conductive post is provided and a second member on which the second conductive post is provided, the first member having a first thick portion where the first conductive post is provided and a first extending portion extending from the first thick portion toward the second member, the second member having a second thick portion where the second conductive post is provided and a second extending portion extending from the second thick portion toward the first member, the first extending portion and the second extending portion extending to cover the first electronic component, and a gap may be formed between the first extending portion and the second extending portion when the electronic device is assembled.

[0009] The gap may extend from one end surface to the other end surface of the adapter body, forming a heat dissipation path through which air can flow.

[0010] The heat dissipation path may face a part of an outer surface of the second electronic component.

[0011] The heat dissipation passage may be formed between the first extension portion and the second extension portion.

[0012] The adapter may further have at least one of a first protruding electrode portion formed to protrude from the first conductive post toward the second conductive post and exposed to the second surface in the mounting portion, and a second protruding electrode portion formed to protrude from the second conductive post toward the first conductive post and exposed to the second surface in the mounting portion.

[0013] The adapter may further have another mounting portion on the second surface on which a third electronic component is mounted, the third electronic component having electrode portions on both ends, the distance between the electrode portions being shorter than the distance between the electrode portions of the second electronic component.

[0014] The adapter may further include a connection electrode portion extending from the conductive post toward a side end surface of the adapter body and exposed at the side end surface.

[0015] The present invention has the effect of shortening the development period and providing an electric device that can handle large currents and high voltages.

[0016] 7 is a diagram showing an electronic device according to a first embodiment; FIG. 8 is a diagram showing the electronic device of FIG. 1; FIG. 9 is a diagram showing an electronic device according to a second embodiment; FIG. 10 is a diagram showing an exploded state of the electronic device of FIG. 3; FIG. 11 is a diagram showing an electronic device according to a third embodiment; FIG. 12 is a diagram showing a modified example of the third embodiment; FIG. 13 is a diagram showing an electronic device according to a fourth embodiment; FIG. 14 is a cross-sectional view taken along line BB of FIG. 7; FIG. 15 is a diagram showing an electronic device according to a modified example of the present invention.

[0017] <First embodiment> Fig. 1 is a diagram showing an electronic device of a first embodiment. Fig. 1(a) is a side view, and Fig. 1(b) is a cross-sectional view taken along line A-A in Fig. 2. Fig. 2 is a diagram showing the electronic device of Fig. 1. Fig. 2(a) is a plan view, and Fig. 2(b) is a bottom view.

[0018] In the following description, terms such as up, down, left, right, front, and rear are used to indicate directions according to the orientation of objects depicted in the drawings, but these terms are not intended to limit the present invention. The up and down directions correspond to the thickness direction of the electronic device and the adapter.

[0019] The electronic device S100 is a single packaged device, and includes a first electronic component 10 , a second electronic component 20 , and an adapter 30 .

[0020] The first electronic component 10 is any electronic component, and in this embodiment, as an example, it is a DFN (Dual-Flat No-Leads) type component. The first electronic component 10 has a structure in which a semiconductor chip is molded with resin. As an example, the first electronic component 10 has a rectangular parallelepiped shape, and has a rectangular outline shape in a plan view as shown in FIG. 2(b). The first electronic component 10 is not limited to a particular thickness, but as an example, it is 1 mm or less, specifically, for example, 0.7 mm or less. A plurality of terminals 11 are formed on the underside of the first electronic component 10.

[0021] The terminals 11 are formed of a conductive material and are electrically connected to the internal semiconductor chip. The terminals 11 are exposed on the bottom and side surfaces of the first electronic component 10. The terminals 11 are soldered to a predetermined printed circuit board, for example. In this embodiment, since the first electronic component 10 forms part of the outer shape of the electronic device S100, it can also be said that the terminals 11 are exposed on the bottom and side surfaces of the electronic device S100.

[0022] The second electronic component 20 is disposed on the upper surface of the adapter 30. The second electronic component 20 may be any electronic component, such as an inductor, a capacitor, a resistor, or a semiconductor device. In the present embodiment, the second electronic component 20 is, for example, a coil (chip inductor). The second electronic component 20 has a main body 21 and a pair of electrodes 22. The use of the electronic device S100 is not particularly limited, but when a semiconductor chip including a transistor for switching current is built into the electronic device S100, a small DC / DC converter can be configured by mounting such a chip inductor.

[0023] The adapter 30 is a member to which the first electronic component 10 and the second electronic component 20 are fixed. The adapter 30 has, for example, a rectangular parallelepiped or substantially rectangular parallelepiped outer shape. The adapter 30 has an adapter body 31 and conductive posts 38.

[0024] 1 and 2, the adapter body 31 has a first surface 31a which is the lower surface, a second surface 31b which is the upper surface, a front surface 31c, a rear surface 31d, a first side surface 31e, and a second side surface 31f. The second surface 31b is the surface opposite to the first surface 31a in the thickness direction of the adapter 30.

[0025] An accommodation portion 35 is formed on the first surface 31 a of the adapter 30. The accommodation portion 35 is a portion that accommodates the first electronic component 10. Specifically, as shown in FIGS. 1( b) and 2( b), the accommodation portion 35 is a recess that has a rectangular cross section in the thickness direction of the electronic device S100 and extends linearly from the front surface 31 c to the back surface 31 d. As an example, the accommodation portion 35 is formed to a depth such that, when the first electronic component 10 is placed inside the recess, the bottom surface of the first electronic component 10 does not protrude from the first surface 31 a.

[0026] The accommodation portion 35 can be formed by any processing step, and as an example, it may be formed by making cuts in the first surface 31a of the adapter body 31 using a dicer.

[0027] In this embodiment, the accommodation portion 35 is a recess connecting the front surface 31c and the back surface 31d. However, the accommodation portion 35 does not have to be exposed on the side surfaces of the adapter 30. The accommodation portion 35 may be a recess carved from the first surface 31a in the thickness direction of the adapter 30 and not exposed on any of the front surface 31c, the back surface 31d, the first side surface 31e, and the second side surface 31f of the adapter body 31. Any manufacturing method may be used to form such a recess. For example, the recess may be formed using a mold, or may be formed by machining using an end mill or the like.

[0028] 1B, a mounting portion P1 on which the second electronic component 20 is mounted is formed on the second surface 31b. The mounting portion P1 is an area that includes an area on which the second electronic component 20 is placed and the upper surfaces of the two conductive posts 38.

[0029] The conductive posts 38 are conductive members that penetrate the adapter body 31. The conductive posts 38 are made of copper, for example. In this embodiment, a first conductive post 38-1 and a second conductive post 38-2 are provided as the conductive posts 38. The first conductive post 38-1 is provided on the left side of FIG. 1, and the second conductive post 38-2 is provided on the right side of FIG. 1, i.e., on the opposite side of the first conductive post 38-1 with the housing portion 35 interposed therebetween. Because the first conductive post 38-1 and the second conductive post 38-2 have the same structure, they will hereinafter be described simply as conductive posts 38 without any distinction between them.

[0030] The conductive posts 38 are formed to penetrate from the first surface 31a to the second surface 31b of the adapter body 31. The upper surfaces of the conductive posts 38 are exposed on the second surface 31b, and the lower surfaces of the conductive posts 38 are exposed on the first surface 31a. The upper surfaces of the conductive posts 38 function as lands for mounting the second electronic components 20. The lower surfaces of the conductive posts 38 are electrically connected to the circuit pattern of a predetermined substrate.

[0031] In this embodiment, each electrode 22 of the second electronic component 20 is electrically connected to each conductive post 38. The electrodes 22 and the conductive posts 38 may be electrically connected by any means, but in this embodiment, the connection is made by solder, for example.

[0032] The horizontal cross-sectional shape (transverse cross-sectional shape) of the conductive post 38 may be any shape such as a rectangle, polygon, or circle, but in this example it is a rectangle.

[0033] As can be seen from FIG. 2 , the conductive posts 38 are embedded inside the adapter body 31. The conductive posts 38 are not exposed on any of the front surface 31c, the back surface 31d, the first side surface 31e, and the second side surface 31f. Because the conductive posts 38 are not exposed on the side surfaces of the electronic device S100, signals flowing through the conductive posts 38 are unlikely to appear on the side surfaces of the electronic device S100. Therefore, even if another electronic device is placed near the electronic device S100, the current flowing through the conductive posts 38 has little effect on the other electronic device S100. This configuration has the advantage of allowing the size of the device in which the electronic device S100 is mounted to be reduced.

[0034] The cross-sectional area of ​​the conductive post 38 in the horizontal direction, i.e., the direction parallel to the first surface 31a or the second surface 31b (see, for example, FIG. 2B ), is relatively large. The horizontal cross-sectional area of ​​the conductive post 38 is, for example, 5% or more, preferably 10% or more, of the area of ​​the adapter body 31 in a plan view. The front-to-rear dimension of the conductive post 38 is, for example, ¼ or more, preferably ⅓ or more, of the front-to-rear dimension of the adapter body 31. The left-to-right (width) dimension of the conductive post 38 is, for example, 1 / 10 or more of the left-to-right (width) dimension of the adapter body 31. With this configuration, the large cross-sectional area and large current capacity of the conductive post 38 allow the second electronic component 20, through which a large current flows, to be mounted on the adapter 30. Furthermore, because the conductive post 38 has a higher thermal conductivity than the resin material, the conductive post 38 functions as a heat dissipation member, effectively dissipating heat from the electronic device S100. In the configuration of this embodiment, when the electronic device S100 is assembled, the upper surfaces of the conductive posts 38 are partially exposed on the upper surface of the adapter 30, thereby enabling effective heat dissipation. In addition, the heat from the conductive posts 38 can also be dissipated to the outside of the device through the pattern of the substrate on which the electronic device S100 is mounted.

[0035] From the viewpoint of being able to pass a large current through the conductive post 38, it is preferable that the horizontal area of ​​the conductive post 38 is formed large as described above, but the present invention is not limited to this, and the horizontal cross-sectional area of ​​the conductive post 38 may be smaller than the above range.

[0036] (Functions of the Electronic Device S100) In the electronic device S100 configured as described above, the lower surfaces of the conductive posts 38 and the plurality of terminals 11 function as external terminals of the electronic device S100. That is, the lower surfaces of the conductive posts 38 and the plurality of terminals 11 are electrically connected to a circuit pattern of a predetermined substrate, thereby mounting the electronic device S100 on the predetermined substrate.

[0037] (Advantages of the Electronic Device S100) According to the electronic device S100 of this embodiment, the terminals 11 of the first electronic component 10 housed in the housing portion 35 of the adapter body 31 can be used as external terminals of the electronic device S100. Therefore, unlike conventional structures in which electronic components are molded, it is not necessary to create a connection circuit to connect the first electronic component 10 and the external terminals of the electronic device S100. Therefore, for example, since it is possible to use an existing first electronic component 10 as is, the development period for the electronic device S100 can be shortened.

[0038] Furthermore, according to the configuration of this embodiment, the cross-sectional area (meaning the cross-sectional area in the horizontal direction) of the conductive posts 38 is large, so that in a configuration in which the second electronic component 20 is electrically connected to the first conductive post 38-1 and the second conductive post 38-2, it is possible to accommodate the second electronic component 20 with a large current and high withstand voltage. Furthermore, the conductive posts 38 have a higher thermal conductivity than resin materials, and particularly in this embodiment, the upper surfaces of the conductive posts 38 are exposed to the second surface 31b of the adapter 30, so that heat from the electronic device S100 can be efficiently dissipated.

[0039] In the configuration of this embodiment, the accommodation portion 35 is formed to extend from the front surface 31 c to the back surface 31 d. This configuration has the advantage that the accommodation portion 35, which is a recess, can be easily formed by processing with a dicer or the like.

[0040] In the above description, a configuration in which a plurality of terminals 11 are exposed on the bottom surface of the first electronic component 10 is exemplified, but the terminals of the first electronic component 10 do not necessarily have to be exposed on the bottom surface.

[0041] Second Embodiment In the configuration of the first embodiment, it is necessary to appropriately change the width dimension of the accommodation portion 35 depending on the size of the first electronic component 10 to be accommodated in the accommodation portion 35 (specifically, it is necessary to design a device having an accommodation portion with a shape corresponding to each size of the electronic component to be mounted). Therefore, in order to be able to accommodate various sizes of the first electronic component 10, an electronic device of one embodiment of the present invention may be configured as follows.

[0042] Fig. 3 is a diagram showing an electronic device according to a second embodiment, and Fig. 4 is a diagram showing the electronic device of Fig. 3 in an exploded state.

[0043] The electronic device S101 includes a first electronic component 10, a second electronic component 20, and an adapter 130. The electronic device S101 has the same configuration as the electronic device S100 of the first embodiment, except that the adapter 130 has a different structure from the adapter 30 of the first embodiment.

[0044] The adapter 130 includes a first adapter body 131-1, a first conductive post 38-1, a second adapter body 131-2, and a second conductive post 38-2. The adapter 130 is divided into multiple components. Because the first adapter body 131-1 and the second adapter body 131-2 have symmetrical shapes, the following description will use the first adapter body 131-1 as an example.

[0045] The first adaptor body 131-1 is a first member constituting the adaptor body 131, and has a first thick portion 132-1 and a first extending portion 133-1.

[0046] The first thick portion 132-1 is a portion where the first conductive post 38-1 is provided. In terms of the adapter body 31 of the first embodiment, the first thick portion 132-1 corresponds to a portion of the adapter body 31 adjacent to the side of the accommodation portion 35.

[0047] The first extending portion 133-1 corresponds to a part of the portion of the adapter main body 31 above the accommodation portion 35 in the adapter main body 31 of the first embodiment. The first extending portion 133-1 extends horizontally from the upper end of the first thick portion 132-1 toward the second adapter main body 131-2. The first extending portion 133-1 partially covers the upper surface of the first electronic component 10.

[0048] The second adaptor body 131-2 is configured in the same manner as the first adaptor body 131-1. The second adaptor body 131-2 is the second member constituting the adaptor body 131, and has a second thick portion 132-2 and a second extending portion 133-2.

[0049] Similar to the first adaptor body 131-1, the second thick portion 132-2 is a portion where the second conductive post 38-2 is provided. The second extending portion 133-2 extends from the second thick portion 132-2 toward the first adaptor body 131-1.

[0050] 3, the first extending portion 133-1 and the second extending portion 133-2 extend so as to cover the first electronic component 10, and in the assembled state of the electronic device S101, a gap Sa is formed between the first extending portion 133-1 and the second extending portion 133-2. In other words, the tip of the first extending portion 133-1 and the tip of the second extending portion 133-2 are not in contact with each other, and a gap Sa is formed between them.

[0051] As an example, the top surface of the first electronic component 10 is fixed to the first extending portion 133-1 and the second extending portion 133-2. An adhesive may be used for fixing.

[0052] The gap Sa extends from one end face of the adapter body 131 (the front face 31c of the adapter body 31) to the other end face (the back face 31d of the adapter body 31). The gap Sa, in other words, forms a heat dissipation path through which air can flow from one end face of the adapter body 131 to the other end face. The gap Sa extends so as to face a portion of the outer surface (top face) of the first electronic component 10. The gap Sa also extends so as to face a portion of the outer surface (bottom face) of the second electronic component 20. In this embodiment, the gap Sa is provided in this manner, forming a heat dissipation path for dissipating heat from the first electronic component 10 and / or the second electronic component 20, thereby enabling effective dissipation of heat during operation of the electronic device S101.

[0053] The manufacture of the electronic device S101 will be briefly described with reference to FIG. 4. The first adapter body 131-1 and the second adapter body 131-2 can be manufactured, for example, by cutting the thin-walled portion (the portion above the accommodation portion 35) of the adapter body 31 of the first embodiment. As shown in FIG. 4, the first adapter body 131-1 and the second adapter body 131-2 are arranged to sandwich the first electronic component 10 from both sides. With the first electronic component 10 fixed inside the first adapter body 131-1 and the second adapter body 131-2, the second electronic component 20 is placed on the upper surfaces of the first adapter body 131-1 and the second adapter body 131-2. The electrodes 22 of the second electronic component 20 are then electrically connected to the conductive posts 38, thereby manufacturing the electronic device S101.

[0054] In the second embodiment, the first electronic component 10 is fixed to each member by being sandwiched between the first adapter body 131-1 and the second adapter body 131-2, so that first electronic components 10 of various sizes can be easily attached to the adapter 130, and therefore there is no need to prepare multiple adapters 130 with different shapes of the accommodating section 35.

[0055] According to the configuration of this embodiment, when the electronic device S100 is assembled, a gap Sa is formed between the first extension portion 133-1 and the second extension portion 133-2. This gap Sa functions as a heat dissipation path, allowing heat to be efficiently released during operation of the electronic device S101. When the gap Sa is formed to extend from the front to the back of the adapter 130, that is, when the ends of the heat dissipation path are exposed to the front and back of the adapter 130, heat can be particularly efficiently dissipated through the ends of the heat dissipation path. Heat may be efficiently dissipated by flowing air through the gap Sa.

[0056] Furthermore, since air is present in the gap Sa, there is an advantage that heat transfer from one of the first electronic component 10 and the second electronic component 20 to the other can be suppressed compared to a configuration in which the first electronic component 10 and the second electronic component 20 are adjacent to each other via a thin-walled portion of an adapter member made of resin, for example.

[0057] Although the effect of the gap Sa has been described above, the main feature of the second embodiment is that the first electronic component 10 is sandwiched between a pair of adapter bodies 131, and it is not an essential component that the gap Sa be hollow. For example, the gap Sa may be filled with a material such as an adhesive.

[0058] Third Embodiment The adapter in the electronic device of the present invention can mount second electronic components 20 of various sizes. As described above, the conductive posts 38 are formed with a relatively large horizontal cross-sectional area and a long width (the dimension in the left-right direction in FIG. 1 ). Therefore, even with the configurations of the first and second embodiments, it is possible to mount second electronic components 20 of a certain degree of different sizes. However, the electronic device may be configured as follows so that second electronic components 20 of a wider variety of sizes can be mounted.

[0059] 5A and 5B are diagrams showing an electronic device according to a third embodiment, with Fig. 5A being a cross-sectional view and Fig. 5B being a plan view with the second electronic component 20 omitted. The electronic device S102 is similar in basic structure to the electronic device S100 according to the first embodiment, but differs in that a protruding electrode portion 39 is formed.

[0060] In this example, a first protruding electrode 39-1 and a second protruding electrode 39-2 are provided as the protruding electrode portion 39. The first protruding electrode 39-1 is formed so as to protrude from the first conductive post 38-1 toward the second conductive post 38-2. Specifically, the first protruding electrode 39-1 is formed so as to extend to a region above the first electronic component 10. The first protruding electrode 39-1 is exposed on the second surface 31b of the adapter in the mounting portion where the second electronic component 20 is mounted. The second protruding electrode 39-2 similarly protrudes from the second conductive post 38-2 toward the first conductive post 38-1, and its upper surface is exposed on the second surface 31b.

[0061] With this configuration, by forming the protruding electrode portion 39, in addition to the upper surface of the conductive post 38, the upper surface of the protruding electrode portion 39 also becomes a land to which the electrode of the second electronic component can be connected, thereby increasing the area of ​​the land and achieving the effect of making it possible to mount second electronic components of various sizes.

[0062] Furthermore, since the protruding electrode portion 39, which is made of a conductive material, can also function as a shielding member for the first electronic component 10, such a configuration is expected to have the effect of reducing the mutual influence of electronic components due to leakage of electromagnetic waves.

[0063] In the above description, a configuration in which both the first protruding electrode 39-1 and the second protruding electrode 39-2 are provided has been exemplified, but only one of these may be formed.

[0064] Fig. 6 is a diagram showing a modified example of the third embodiment. The above-described configuration may be applied to a configuration similar to that of the second embodiment in which the gap Sa is formed, as shown in Fig. 6.

[0065] Fourth Embodiment An electronic device of the present invention may be mounted with one or more third electronic components in addition to the first electronic component 10 and the second electronic component 20. Fig. 7 is a diagram showing an electronic device of the fourth embodiment. Fig. 8 is a cross-sectional view taken along line BB in Fig. 7 .

[0066] The electronic device S103 includes a first electronic component 10, a second electronic component 20, a third electronic component 50, and an adapter 230. Except for the provision of the third electronic component 50 and the provision of a structural portion electrically connected to the third electronic component 50 in the adapter 230, the basic structure is the same as that of the first embodiment, and therefore a duplicated description will be omitted. Note that, although an example having a basic structure common to the first embodiment will be described here, the configuration in which the third electronic component 50 is provided may be combined with the configuration of the second embodiment, for example.

[0067] In this example, two third electronic components 50 are provided: a third electronic component 50-1 and a third electronic component 50-2. Because the third electronic components 50-1 and 50-2 have the same configuration, only the third electronic component 50-1 will be described below. As an example, the third electronic component 50 is an electronic component that is smaller (meaning that it has a smaller volume or a smaller outer shape in a plan view) than the first electronic component 10 and the second electronic component 20. The third electronic component 50 may be any electronic component, but may be, for example, a chip capacitor. Electrodes are provided on both ends of the third electronic component 50. The distance between the electrodes of the third electronic component 50 is shorter than the distance between the electrodes of the second electronic component 20.

[0068] As shown in Fig. 7A, the adapter 230 has a mounting portion P2 on which the third electronic component 50 is mounted. The mounting portion P2 is provided on the top surface (second surface) of the adapter 230. In the configuration of Fig. 7, one mounting portion P2 is provided on the front side and one on the back side of the adapter 230, but the present invention is not limited to this.

[0069] 7 and 8, the adapter 230 is also formed with a conductive member 240 that is connected to the third electronic component 50. Specifically, the conductive member 240 includes a first conductive member 240-1 and a second conductive member 240-2. Because the first conductive member 240-1 and the second conductive member 240-2 have the same structure, the following description will be given using the first conductive member 240-1 as an example.

[0070] 8, first conductive member 240-1 has a through electrode portion 245 and a protruding electrode portion 246. First conductive member 240-1 is made of copper, for example.

[0071] Similar to the conductive post 38, the through electrode portion 245 is formed to penetrate the adapter 230 in its thickness direction. The upper surface of the through electrode portion 245 is exposed at the upper surface of the adapter 230, and the lower surface of the through electrode portion 245 is exposed at the lower surface of the adapter 230.

[0072] The protruding electrode portion 246 is an electrode that extends from the upper end of the through electrode portion 245 toward the second conductive member 240-2. The upper surface of the protruding electrode portion 246 is exposed on the upper surface of the adapter 230. The protruding electrode portion 246 of the second conductive member 240-2 is configured in a similar manner. The third electronic component 50 is mounted on the pair of protruding electrode portions 246 formed in this manner. The electrodes at the ends of the third electronic component 50 are each electrically connected to the protruding electrode portion 246.

[0073] As described above, the modular configuration of the first electronic component 10, the second electronic component 20, and the third electronic component 50 allows the electronic device S100 to have higher functionality.

[0074] 9A and 9B are diagrams showing modified examples of electronic devices according to the present invention. All of the electrical devices shown in Fig. 9A are examples in which electrodes are provided near the conductive posts 38 of the electronic device S100 shown in Fig. 1. As shown in Fig. 9A, the electronic device according to one embodiment of the present invention may have a connection electrode portion 41.

[0075] The connection electrode portion 41 is an electrode portion provided inside the adapter 30. In the example of Fig. 9, a first connection electrode portion 41-1 and a second connection electrode portion 41-2 are provided as the connection electrode portion 41, but since these have the same structure, the following description will be given using the first connection electrode portion 41-1 as an example.

[0076] The first connection electrode portion 41-1 is provided on the lower side of the conductive post 38, and extends from the first conductive post 38-1 toward the side end face (first side face 31e) of the adapter body 31. The end face of the first connection electrode portion 41-1 is exposed on the first side face 31e.

[0077] Similarly, the second connection electrode portion 41-2 extends from the second conductive post 38-2 toward the second side surface 31f. The end face of the second connection electrode portion 41-2 is exposed at the second side surface 31f.

[0078] With this configuration, the connection electrode portion 41 can be used as an external connection terminal of the electronic device, making it easier to electrically connect the electronic device to other devices or circuit patterns.

[0079] The connection electrode portion 41 may be provided at a position as shown in Fig. 9(b) instead of the position as shown in Fig. 9(a). Specifically, in the electronic device of Fig. 9(b), the connection electrode portion 41 is provided at a midpoint in the height direction of the conductive post 38. The connection electrode portion 41 is exposed on the first side surface 31e, but is not exposed on either the first surface 31a or the second surface 31b. In other words, the resin member of the adapter 30 is present above and below the connection electrode portion 41.

[0080] 9A , burrs may be generated on the connection electrode portion 41 when manufacturing an electronic device (specifically, when cutting the adapter 30 from a predetermined material). Specifically, when attempting to cut the adapter 30 from its top surface to its bottom surface using, for example, a dicer, the connection electrode portion 41, which is made of a material such as copper, may not be cut cleanly, resulting in burrs on the bottom end of the connection electrode portion 41.

[0081] 9(b), in which the connection electrode portion 41 is located at the midpoint in the height direction of the conductive post 38 and the connection electrode portion 41 is sandwiched between molding material on the top and bottom, this configuration is advantageous in that burrs are less likely to occur compared to the configuration in Fig. 9(a). In addition, for example, burrs are less likely to protrude downward from the bottom surface of the device, and problems such as the device floating up from the mounting surface when mounted are less likely to occur.

[0082] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. For example, all or part of the device can be configured by functionally or physically distributing or integrating in any unit. Furthermore, new embodiments resulting from any combination of multiple embodiments are also included in the embodiments of the present invention. The effects of the new embodiments resulting from the combination also have the effects of the original embodiments.

[0083] 10 First electronic component 11 Terminal 20 Second electronic component 21 Main body portion 22 Electrode 30 Adapter 31 Adapter main body 31a First surface 31b Second surface 31c Front surface 31d Rear surface 31e First side surface 31f Second side surface 35 Storage portion 38 Conductive post 38-1 First conductive post 38-2 Second conductive post 39 Protruding electrode portion 39-1 First protruding electrode 39-2 Second protruding electrode 41 Connection electrode portion 41-1 First connection electrode portion 41-2 Second connection electrode portion 50 Third electronic component 130 Adapter 131 Adapter main body 131-1 First adapter main body 131-2 Second adapter main body 132-1 First thick portion 132-2 Second thick portion 133-2 Second extension portion 230 Adapter 240 Conductive member 245: Through electrode portion 246: Protruding electrode portion P1, P2: Mounting portion S100: Electronic device S101: Electronic device S102: Electronic device S103: Electronic device Sa: Air gap

Claims

1. An electronic device comprising: a first electronic component; and an adapter having a housing portion for housing the first electronic component, wherein the adapter has: an adapter body having a first surface and a second surface opposite the first surface in the thickness direction of the adapter; and conductive posts penetrating the adapter body from the first surface to the second surface, wherein the housing portion is formed as a recess on the first surface, and a mounting portion on which a second electronic component is mounted is formed on the second surface.

2. The electronic device according to claim 1, wherein the conductive posts are a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the accommodating section in between, and the second electronic component mounted on the mounting section is electrically connected to the first conductive post and the second conductive post.

3. The electronic device according to claim 1 or 2, wherein the conductive posts include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the accommodating portion therebetween, the adapter body being divided into a plurality of constituent members, the plurality of constituent members including a first member on which the first conductive post is provided and a second member on which the second conductive post is provided, the first member having a first thick portion where the first conductive post is provided and a first extending portion extending from the first thick portion towards the second member, the second member having a second thick portion where the second conductive post is provided and a second extending portion extending from the second thick portion towards the first member, the first extending portion and the second extending portion extending to cover the first electronic component, and a gap being formed between the first extending portion and the second extending portion when the electronic device is in an assembled state.

4. The electronic device according to claim 3, wherein the gap extends from one end face of the adapter body to the other end face, forming a heat dissipation path through which air can flow.

5. The electronic device according to claim 4, wherein the heat dissipation path faces a part of the outer surface of the second electronic component.

6. The electronic device according to claim 5, wherein the heat dissipation path is formed between the first extension portion and the second extension portion.

7. The electronic device according to claim 2, wherein the adapter further has at least one of: a first protruding electrode portion formed to protrude from the first conductive post toward the second conductive post and exposed on the second surface of the mounting portion; and a second protruding electrode portion formed to protrude from the second conductive post toward the first conductive post and exposed on the second surface of the mounting portion.

8. The electronic device according to claim 1 or 2, wherein the adapter further has another mounting portion on the second surface on which a third electronic component is mounted, the third electronic component having electrodes on both ends, the distance between the electrodes being shorter than the distance between the electrodes of the second electronic component.

9. The electronic device according to claim 1 or 2, further comprising a connection electrode portion extending from the conductive post toward a side end surface of the adapter body and exposed at the side end surface.

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