Card-type medium

Abstract

A card-type medium according to the present invention comprises an antenna substrate. The antenna substrate has an antenna resonant circuit including a coil antenna and a capacitor connected to the coil antenna. The capacitor is positioned so as to avoid the center part of an inner region of the coil antenna when viewed in the thickness direction of the antenna substrate.

Description

Card-type media

[0001] The present invention relates to a card-type medium. This application claims priority to Japanese Patent Application No. 2024-090132 filed in Japan on June 3, 2024, and Japanese Patent Application No. 2024-094371 filed in Japan on June 11, 2024, the contents of which are incorporated herein by reference.

[0002] Conventionally, there have been various types of card-type media, such as credit cards and cash cards. Some of these card-type media have an antenna resonant circuit built into them. Card-type media with an antenna resonant circuit can communicate with external devices (contactless communication) through electromagnetic coupling without contacting the external device. On the other hand, some card-type media use a metal layer (e.g., a metal plate). Such card-type media have the heavy feel and appearance unique to metal, which can give users of the card-type media a sense of luxury and exclusivity.

[0003] Patent Document 1 discloses a card-type medium (smart card) including an antenna resonant circuit (antenna unit) and a metal layer (card body). In the card-type medium of Patent Document 1, the metal layer has an opening penetrating through its thickness and a slot extending from the opening to the edge of the metal layer. Furthermore, in Patent Document 1, an antenna resonant circuit including a main coil antenna (card reader coupling antenna) and a capacitor (chip capacitor module) is located inside the opening in the metal layer. This prevents electromagnetic waves from the main coil antenna from being blocked by the metal layer, i.e., prevents contactless communication via the main coil antenna from being impeded by the metal layer. Furthermore, in Patent Document 1, the main coil antenna is formed of a conductive wire (electrical cable), and the capacitor is formed of a capacitor module joined to both ends of the wire. The capacitor module is located in the center inside the main coil antenna.

[0004] Japanese Patent No. 7349170

[0005] However, when the capacitor is placed in the center inside the main coil antenna, the magnetic flux passing through the inside of the main coil antenna is reduced, resulting in a problem of reduced communication performance in contactless communication.

[0006] In view of the above-mentioned problems, an object of the present invention is to provide a card-type medium that can suppress a decrease in communication performance of contactless communication.

[0007] One aspect of the present invention is a card-type medium including an antenna substrate, the antenna substrate having an antenna resonant circuit including a coil antenna and a capacitor connected to the coil antenna, the capacitor being positioned, when viewed in the thickness direction of the antenna substrate, so as to avoid the center of the region inside the main coil antenna.

[0008] According to the present invention, it is possible to provide a card-type medium that can suppress a decrease in communication performance of contactless communication.

[0009] 1 is a plan view schematically showing a card-type medium according to a first embodiment of the present invention. It is a plan view showing an antenna resonant circuit, an IC module, and a metal layer of the card-type medium according to the first embodiment of the present invention. It is a cross-sectional view schematically showing the card-type medium of FIG. 2. It is a plan view showing an antenna resonant circuit, an IC module, and a metal layer of the card-type medium according to a second embodiment of the present invention. It is a cross-sectional view schematically showing the card-type medium of FIG. 4. It is a plan view showing an antenna resonant circuit, an IC module, and a metal layer of the card-type medium according to a third embodiment of the present invention. It is a plan view showing an antenna resonant circuit, an IC module, and a metal layer of the card-type medium according to a fourth embodiment of the present invention. It is a cross-sectional view schematically showing the card-type medium of FIG. 7. It is a plan view showing a modification of the card-type medium of FIG. 7. It is a cross-sectional view schematically showing a card-type medium according to another embodiment of the present invention. It is a plan view schematically showing a card-type medium according to a fifth embodiment of the present invention. It is a perspective view showing a main part of the card-type medium of FIG. 11. It is a cross-sectional view schematically showing the card-type medium of FIGS. 11 and 12. It is a plan view showing only the antenna resonant circuit and the metal plate of the card-type medium of FIGS. 11 to 13. 23 and 24. FIG. 24 is a perspective view showing a main portion of a first modified example of the card-type medium of the fifth embodiment. FIG. 25 is a cross-sectional view schematically showing the card-type medium of FIG. 15. FIG. 26 is a cross-sectional view schematically showing a main portion of a second modified example of the card-type medium of the fifth embodiment. FIG. 27 is a plan view showing only the antenna resonant circuit and the metal plate of the card-type medium of FIG. 17. FIG. 28 is a perspective view showing a main portion of a card-type medium according to a sixth embodiment of the present invention. FIG. 29 is a cross-sectional view schematically showing the card-type medium of FIG. 18. FIG. 29 is a plan view showing only the antenna resonant circuit and the metal plate of the card-type medium of FIGS. 19 and 20. FIG. 29 is a cross-sectional view schematically showing a modified example of the card-type medium of the sixth embodiment. FIG. 30 is a perspective view showing a main portion of a card-type medium according to a seventh embodiment of the present invention. FIG. 31 is a cross-sectional view schematically showing the card-type medium of FIG. 32. FIG. 32 is a plan view showing only the antenna resonant circuit and the metal plate of the card-type medium of FIGS. 23 and 24. FIG. 33 is a cross-sectional view schematically showing a card-type medium according to an eighth embodiment of the present invention. FIG. 34 is a cross-sectional view schematically showing a modified example of the card-type medium of the eighth embodiment. FIG. 35 is a plan view showing the antenna resonant circuit and the metal layer of a card-type medium according to a ninth embodiment of the present invention.35 is a plan view showing an antenna resonant circuit, an IC module, and a metal layer in a card-type medium according to a tenth embodiment of the present invention. FIG. 36 is a plan view showing an antenna resonant circuit and a metal layer in a card-type medium according to an eleventh embodiment of the present invention. FIG. 37 is a cross-sectional view schematically showing the card medium of FIG. 30. FIG. 38 is a plan view showing a first modified example of a card-type medium according to an eleventh embodiment of the present invention. FIG. 39 is a cross-sectional view schematically showing a second modified example of a card-type medium according to an eleventh embodiment of the present invention. FIG. 39 is a cross-sectional view schematically showing a third modified example of a card-type medium according to the eleventh embodiment of the present invention. FIG. 39 is a plan view showing an antenna resonant circuit and a metal layer in a card-type medium according to a twelfth embodiment of the present invention. FIG. 39 is an enlarged plan view showing a main part of FIG. 35. FIG. 39 is a plan view showing an antenna resonant circuit, an IC module, and a metal layer in a card-type medium according to a first example of a thirteenth embodiment of the present invention. FIG. 39 is a plan view showing an antenna resonant circuit, an IC module, and a metal layer in a card-type medium according to a second example of a thirteenth embodiment of the present invention. FIG. 39 is a plan view showing an antenna resonant circuit, an IC module, and a metal layer in a card-type medium according to a third example of a thirteenth embodiment of the present invention. FIG. 39 is a plan view showing an antenna resonant circuit, an IC module, and a metal layer in a first modified example of a card-type medium according to the thirteenth embodiment of the present invention. A second variant of the card-type medium according to the thirteenth embodiment of the present invention, a plan view showing the antenna resonant circuit, IC module, and metal layer.

[0010] Hereinafter, embodiments of the present invention will be described with reference to Figures 1 to 41. In the following description, mutually corresponding components will be assigned the same reference numerals, and descriptions of overlapping parts may be omitted. Furthermore, in the following description, expressions indicating relative or absolute arrangements, such as "parallel," "orthogonal," and "center," not only refer to such arrangements in a strict sense, but also to a state in which there is a relative displacement with a tolerance or an angle or distance that provides the same function.

[0011] In the drawings of this embodiment, the direction indicated by the symbol Z corresponds to the thickness direction of the card-type medium described below. In the following description, this will be referred to as the thickness direction Z. The side toward which the arrow in the thickness direction Z points (the +Z side) may be referred to as the "upper side." The opposite side to the side toward which the arrow in the thickness direction Z points (the -Z side) may be referred to as the "lower side." The outer surfaces of the components constituting the card-type medium that face upward may be referred to as the "front surface," and the surfaces facing downward may be referred to as the "rear surface." Note that the terms "upper side" and "lower side" are simply names used to describe the relative positional relationships of the various components, and the actual positional relationships may be other than those indicated by these names.

[0012] Additionally, each figure appropriately shows a first linear direction X. The first linear direction X is a linear direction perpendicular to the thickness direction Z, that is, a linear direction along the front and back surfaces of the card-type medium. In the following description, the side toward which the arrow of the first linear direction X points (+X side) will be referred to as "one side of the first linear direction X," and the side opposite to the side toward which the arrow of the first linear direction X points (-X side) will be referred to as "the other side of the first linear direction X."

[0013] Additionally, each figure appropriately shows a second linear direction Y. The second linear direction Y is a linear direction perpendicular to both the thickness direction Z and the first linear direction X, that is, a linear direction that runs along the front and back surfaces of the card-type medium, similar to the first linear direction X. In the following description, the side toward which the arrow of the second linear direction Y points (+Y side) will be referred to as "one side of the second linear direction Y," and the side opposite to the side toward which the arrow of the second linear direction Y points (-Y side) will be referred to as "the other side of the second linear direction Y."

[0014] First Embodiment A first embodiment of the present invention will be described with reference to FIGS. 1 to 3. The card-type medium 1 shown in FIG. 1 is a card capable of contactless communication with an external device. The card-type medium 1 of this embodiment is also a card capable of contact communication with an external device. Specifically, the card-type medium 1 includes an IC module 3 for contact communication with an external device. The IC module 3 has contact terminals 31 for contacting the external device. The card-type medium 1 illustrated in FIG. 1 is formed in a plate shape and, when viewed in the thickness direction Z of the card-type medium 1, is formed in a rectangular shape with its long sides extending in the first linear direction X.

[0015] As shown in Fig. 3, the card-type medium 1 includes an antenna substrate 2 in addition to the IC module 3 described above. The card-type medium 1 of this embodiment also includes a metal layer 4 made of metal and a first insulating substrate 5 that is electrically insulating. In Fig. 3, the first insulating substrate 5 and the metal layer 4 are stacked in this order on the underside (-Z side) of the antenna substrate 2. The card-type medium 1 of this embodiment also includes two second insulating substrates 6 that are electrically insulating and two oversheets 7. The second insulating substrates 6 and the oversheets 7 are stacked in this order in the thickness direction Z on the front surface of the antenna substrate 2 and the back surface of the metal layer 4, respectively.

[0016] As shown in FIGS. 2 and 3 , the metal layer 4 has an opening 41 penetrating in the thickness direction Z and a slot 42 that opens the opening 41 to the edge of the metal layer 4 in a plan view as shown in FIG. 2 . The shape and size of the opening 41 in the metal layer 4 may be appropriately determined so that an antenna resonant circuit 21 provided on the antenna substrate 2 (described later) is positioned inside the opening 41 when viewed in the thickness direction Z. In FIG. 2 , the slot 42 is formed on the edge of the metal layer 4 located on the other side (−X side) of the first linear direction X, but this is not limited thereto. Specific metal materials constituting the metal layer 4 may be, for example, stainless steel, iron, titanium, aluminum, etc. The opening 41 in the metal layer 4 is preferably filled with an electrically insulating material such as resin. Filling the opening 41 in the metal layer 4 with an insulating material such as resin prevents the portions of the first insulating substrate 5 and the second insulating substrate 6 that overlap the opening 41 in the metal layer 4 from intruding into the opening 41. This makes it possible to prevent the portions of the metal layer 4 that are the first insulating substrate 5, the antenna substrate 2, and the second insulating substrate 6 that are arranged over the opening 41 from being displaced in the thickness direction Z. In other words, the first insulating substrate 5, the antenna substrate 2, the second insulating substrate 6, and the like that are arranged over the metal layer 4 can be stably supported by the metal layer 4 and the filled insulating material.

[0017] 3, the first insulating substrate 5 is disposed between the metal layer 4 and the antenna substrate 2, and electrically insulates the metal layer 4 from the antenna substrate 2. For example, the first insulating substrate 5 may be bonded to the metal layer 4 and the antenna substrate 2 by adhesive provided on the front and back surfaces of the first insulating substrate 5. The material constituting the first insulating substrate 5 may be, for example, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate copolymer (PET-G), or the like.

[0018] The antenna substrate 2 includes an antenna sheet 20 and an antenna resonant circuit 21 including a main coil antenna 22 (coil antenna 22), a coupled coil antenna 23 (coil antenna 23), and a capacitor 24. The antenna sheet 20 is electrically insulating. The material constituting the antenna sheet 20 may be, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), polyester (PEs), glass epoxy, or the like. In this embodiment, the thickness of the antenna sheet 20 is 35 μm or less.

[0019] The main coil antenna 22 is an antenna for electromagnetically coupling with an external device to perform contactless communication with the external device. The coupled coil antenna 23 is connected to the main coil antenna 22 and is an antenna for electromagnetically coupling with the IC module 3. For this reason, the coupled coil antenna 23 is positioned so as to overlap the IC module 3 in the thickness direction Z. As shown in Fig. 2 , the main coil antenna 22 and the coupled coil antenna 23 are both configured by connecting multiple C-shaped turn portions in a spiral shape when viewed from the thickness direction Z. The turn portions of the main coil antenna 22 and the coupled coil antenna 23 refer to the portions of one circumference of the main coil antenna 22 and the coupled coil antenna 23 that are formed in a spiral shape.

[0020] The main coil antenna 22 and the coupling coil antenna 23 are aligned in a direction perpendicular to the thickness direction Z. In Fig. 2, the main coil antenna 22 and the coupling coil antenna 23 are aligned in order on the other side (-X side) of the first linear direction X.

[0021] The capacitor 24 is connected to the main coil antenna 22 and the coupling coil antenna 23. In this embodiment, the capacitor 24 is formed in a rectangular shape when viewed in the thickness direction Z.

[0022] As shown in Fig. 3, the main coil antenna 22, the coupling coil antenna 23, and the capacitor 24 are configured by conductor patterns formed on the front and back surfaces (main surfaces) of the antenna sheet 20. The conductor patterns are formed by etching conductor foils formed on the front and back surfaces of the antenna sheet 20. The conductor patterns (conductor foils) may be made of, for example, copper or aluminum. In Fig. 2, the conductor patterns formed on the front surface of the antenna sheet 20 are indicated by solid lines, and the conductor patterns formed on the back surface of the antenna sheet 20 are indicated by dashed lines.

[0023] 2 and 3 , the conductor patterns include a first conductor pattern 91 that constitutes the main coil antenna 22 and the coupled coil antenna 23. In this embodiment, the first conductor pattern 91 that constitutes the main coil antenna 22 is formed only on the front surface (one of the main surfaces) of the antenna sheet 20. On the other hand, the first conductor pattern 91 that constitutes the coupled coil antenna 23 is formed on both the front and rear surfaces (both main surfaces) of the antenna sheet 20. Note that the first conductor pattern 91 that constitutes the main coil antenna 22 may be formed, for example, only on the rear surface of the antenna sheet 20, or on both the front and rear surfaces of the antenna sheet 20. Furthermore, the first conductor pattern 91 that constitutes the coupled coil antenna 23 may be formed, for example, only on the front surface or the rear surface of the antenna sheet 20.

[0024] As shown in Fig. 2, the main coil antenna 22 formed only on the surface of the antenna sheet 20 is formed in a ring-shaped shape with a portion of the circumferential direction extending outward when viewed in the thickness direction Z. In Fig. 2, the main coil antenna 22 is formed in a ring shape having a C-shaped arc portion 221 and protruding portions 222 connected to both ends of the arc portion 221 and extending outward from the arc portion 221. In Fig. 2, the protruding portions 222 of the main coil antenna 22 are formed in a rectangular shape. The arc portion 221 of the main coil antenna 22 is the main portion for electromagnetic coupling with an external device. In the main coil antenna 22, the protruding portions 222 protrude toward the coupling coil antenna 23 (the -X side in Fig. 2) relative to the arc portion 221.

[0025] A portion of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 and a portion of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 are connected by a through electrode 231 that penetrates the antenna sheet 20 in the thickness direction Z. Specifically, the outer circumferential end of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 is connected to the inner circumferential end of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 by the through electrode 231. The through electrode 231 may be, for example, a crimp or a through hole. In FIG. 2 , the through electrode 231 is disposed between the portion of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 and the main coil antenna 22. Note that the position of the through electrode 231 as viewed from the thickness direction Z may be arbitrary. The through electrode 231 may be disposed such that the portion of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 is located between the main coil antenna 22, for example.

[0026] The spiral portion of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 is formed in a simple ring shape, specifically, an annular shape, when viewed from the thickness direction Z. On the other hand, the spiral portion of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 is formed in a shape having a first arc portion 232 corresponding to the annular portion of the coupled coil antenna 23 formed on the surface of the antenna sheet 20, and a second arc portion 233 formed continuous with the first arc portion 232 and surrounding the through electrode 231, when viewed from the thickness direction Z. In FIG. 2 , the diameter of the first arc portion 232 is larger than the diameter of the second arc portion 233.

[0027] In this embodiment, the turn portions of the main coil antenna 22 located on the outer periphery and some of the turn portions of the coupled coil antenna 23 are integrally formed. Specifically, the turn portions of the main coil antenna 22 located on the outer periphery formed on the surface of the antenna sheet 20 are integrally formed with all of the turn portions of the coupled coil antenna 23 formed on the surface of the antenna sheet 20. The integrally formed turn portions of the main coil antenna 22 and the coupled coil antenna 23 are formed as a large turn portion (integral turn portion) that surrounds both the main coil antenna 22 and the coupled coil antenna 23. As described above, the outer peripheral end of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 is joined to the through electrode 231. Therefore, the outer peripheral end of the main coil antenna 22, which is integral with the coupled coil antenna 23 formed on the surface of the antenna sheet 20, is substantially joined to the through electrode 231.

[0028] 2 and 3 , the conductor pattern includes, in addition to the above-described first conductor pattern 91, two second conductor patterns 92 that constitute the capacitor 24. In this embodiment, the two second conductor patterns 92 are formed on the front and back surfaces (both main surfaces) of the antenna sheet 20 and are arranged so as to sandwich the antenna sheet 20. In other words, the capacitor 24 in this embodiment is a parallel plate capacitor that sandwiches the antenna sheet 20. In FIG. 2 , the size of the second conductor pattern 92 formed on the front surface of the antenna sheet 20 is larger than the second conductor pattern 92 formed on the back surface of the antenna sheet 20, but it may be the same size as the second conductor pattern 92 formed on the back surface of the antenna sheet 20, for example.

[0029] 2 , the capacitor 24 in this embodiment is disposed inside the main coil antenna 22 when viewed from the thickness direction Z. However, the capacitor 24 is positioned so as to avoid the center of the inner region of the main coil antenna 22. Specifically, when viewed from the thickness direction Z, a part of the capacitor 24 is disposed inside the arc portion 221 of the main coil antenna 22, and the remaining part of the capacitor 24 is disposed inside the protruding portion 222 of the main coil antenna 22. As a result, the capacitor 24 is positioned so as to avoid the center of the arc portion 221 of the main coil antenna 22. The center of the arc portion 221 of the main coil antenna 22 includes the central axis 223 of the arc portion 221 and the region nearby.

[0030] In this embodiment, some of the turn portions of the main coil antenna 22 and some of the turn portions of the coupled coil antenna 23 are integrally formed, thereby electrically connecting the main coil antenna 22 and the coupled coil antenna 23. Therefore, there is no need to provide a separate connection wire for electrically connecting the main coil antenna 22 and the coupled coil antenna 23.

[0031] The inner peripheral end of the main coil antenna 22 is joined to a second conductor pattern 92 of the capacitor 24 that is formed on the surface of the antenna sheet 20. This electrically connects the main coil antenna 22 and one of the second conductor patterns 92 of the capacitor 24.

[0032] The outer peripheral end of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 is electrically connected to the other second conductor pattern 92 of the capacitor 24 formed on the back surface of the antenna sheet 20 via a connection wiring 27 formed on the back surface of the antenna sheet 20. The connection wiring 27 is composed only of the conductor pattern formed on the back surface of the antenna sheet 20, and extends from the inner peripheral side to the outer peripheral side of the main coil antenna 22.

[0033] Furthermore, in this embodiment, the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20 is formed integrally with a portion of the innermost turn portion of the main coil antenna 22, or is formed adjacent to at least a portion of the innermost turn portion of the main coil antenna 22. This point will be explained below. In Fig. 2, part of the periphery of the second conductor pattern 92 of the capacitor 24, which is rectangular in plan view, is adjacent to and parallel to the innermost periphery of the protruding portion 222 of the main coil antenna 22. As a result, it can be said that part of the periphery of the second conductor pattern 92 is formed integrally with part of the innermost periphery of the protruding portion 222 of the main coil antenna 22.

[0034] Specifically, a portion of a first side 92-1 of the second conductor pattern 92 of the capacitor 24, which is rectangular in plan view, extending in the first linear direction X on one side (+Y side) of the second linear direction Y, is adjacent to and parallel to a side extending in the first linear direction X inside the protruding portion 222 of the main coil antenna 22, which is rectangular in plan view. Therefore, it can be said that the portion of the first side 92-1 of the second conductor pattern 92 is formed integrally with a part of the innermost periphery of the protruding portion 222 of the main coil antenna 22. Furthermore, the entirety of a second side 92-2 of the second conductor pattern 92 of the capacitor 24, which is rectangular in plan view, extending in the second linear direction Y on the other side (-X side) of the first linear direction X, is adjacent to and parallel to a side extending in the second linear direction Y inside the protruding portion 222 of the main coil antenna 22, which is rectangular in plan view. Therefore, it can be said that the entire second side 92 - 2 of the second conductor pattern 92 is formed integrally with a part of the innermost periphery of the protruding portion 222 of the main coil antenna 22 .

[0035] 3 may be made of the same material as that of the first insulating substrate 5. An adhesive may be provided on the front and back surfaces of the second insulating substrate 6, as with the first insulating substrate 5. The second insulating substrate 6 overlaps the front surface of the antenna substrate 2, thereby preventing the antenna resonant circuit 21 provided on the antenna substrate 2 from being unintentionally electrically connected to the outside. Furthermore, the second insulating substrate 6 overlaps the back surface of the metal layer 4, thereby preventing the metal layer 4 from being unintentionally electrically connected to the outside.

[0036] 3, the oversheet 7 forms the front and back surfaces of the card-type medium 1. The oversheet 7 may be, for example, a sheet on which printing can be performed (printed sheet). The material forming the oversheet 7 may be, for example, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate copolymer (PET-G), or the like.

[0037] Although not shown, the IC module 3 includes a connection coil antenna and an IC chip in addition to the contact terminals 31 (see FIG. 1). The connection coil antenna is an antenna for electromagnetic coupling with the coupling coil antenna 23. The IC chip is connected to the contact terminals 31 and the connection coil antenna and has contactless communication and contact communication functions. As shown in FIGS. 1 and 3, the IC module 3 is provided on an over-sheet 7U (top-most over-sheet 7U) that is located at the top in the thickness direction Z and forms the surface of the card-type medium 1. Specifically, the IC module 3 is disposed in a recess 71 recessed from the surface of the top-most over-sheet 7U. In this state, the contact terminals 31 of the IC module 3 are exposed to the outside of the card-type medium 1.

[0038] 3, the top surface over-sheet 7U has a through-hole 72 formed therein, which penetrates from the bottom surface of the recess 71 to the back surface of the top surface over-sheet 7U. The second insulating substrate 6 located below the top surface over-sheet 7U has a through-hole 62 formed therein, which penetrates in the thickness direction Z and is connected to the through-hole 72 in the top surface over-sheet 7U. Therefore, the IC module 3 arranged in the recess 71 is exposed to the antenna substrate 2 side through the through-holes 72, 62 in the top surface over-sheet 7U and the second insulating substrate 6.

[0039] As described above, in the card-type medium 1 of this embodiment, the main coil antenna 22, the coupling coil antenna 23, and the capacitor 24 of the antenna resonant circuit 21 are configured by conductor patterns formed on the front and back (main surfaces) of the antenna sheet 20. Therefore, the main coil antenna 22, the coupling coil antenna 23, and the capacitor 24 can be formed by etching technology, which reduces the manufacturing cost of the card-type medium 1. Furthermore, by positioning the capacitor 24 to avoid the center portion of the inside of the main coil antenna 22, it is possible to suppress a decrease in magnetic flux passing inside the main coil antenna 22 and suppress a deterioration in communication performance of contactless communication.

[0040] Furthermore, in the card-type medium 1 of this embodiment, the turn portion located on the outer periphery of the main coil antenna 22 and a portion of the turn portion of the coupling coil antenna 23 are integrally formed. This effectively widens the area inside the turn portion of the main coil antenna 22 that is integrated with the coupling coil antenna 23. This makes it possible to improve the electromagnetic coupling between the main coil antenna 22 and external devices.

[0041] Furthermore, in the card-type medium 1 of this embodiment, the outer peripheral end of the main coil antenna 22 is joined to a through electrode 231 that penetrates the antenna sheet 20. Furthermore, the inner peripheral end of the main coil antenna 22 is joined to one of the second conductor patterns 92 of the capacitor 24. This allows the capacitor 24 to be disposed inside the main coil antenna 22, thereby increasing the degree of freedom in antenna design.

[0042] Furthermore, in the card-type medium 1 of this embodiment, the capacitor 24 that constitutes the antenna resonant circuit 21 is formed integrally with or adjacent to the innermost turn portion of the main coil antenna 22. This allows the capacitor 24 to be positioned so as to avoid the center portion of the inside of the main coil antenna 22.

[0043] Furthermore, by including the metal layer 4, the card-type medium 1 of this embodiment has a solid feel and appearance unique to metal. This improves the design of the card-type medium 1 and also increases the added value (luxury and special feel) of the card-type medium 1. Furthermore, by arranging the antenna resonant circuit 21 inside the opening 41 of the metal layer 4, it is possible to prevent electromagnetic waves related to the main coil antenna 22 and the coupling coil antenna 23 from being blocked by the metal layer 4. Therefore, even if the card-type medium 1 includes the metal layer 4, it is possible to prevent a decrease in the communication performance of the card-type medium 1.

[0044] Furthermore, in the card-type medium 1 of this embodiment, the thickness of the antenna sheet 20 sandwiched between the two second conductor patterns 92 that make up the capacitor 24 is 35 μm or less. Therefore, compared to when a typical antenna sheet 20 with a thickness of 38 μm is used, when forming a capacitor 24 of the same capacitance, it is possible to set a smaller area for the second conductor pattern 92 that is the electrode of the capacitor 24. Furthermore, the degree of freedom in designing the antenna resonant circuit 21 can be increased by the amount that the formation area of ​​the capacitor 24 can be reduced.

[0045] In the first embodiment, it is sufficient that at least the turn portion located on the outer periphery of the main coil antenna 22 and at least some of the turn portions of the coupled coil antenna 23 are formed integrally. Therefore, for example, the turn portion located on the outer periphery of the main coil antenna 22 and all of the turn portions of the coupled coil antenna 23 may be formed integrally. Furthermore, for example, all of the turn portions of the main coil antenna 22 and all of the turn portions of the coupled coil antenna 23 may be formed integrally.

[0046] Second Embodiment A second embodiment of the present invention will be described with reference to Figures 4 and 5. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted.

[0047] 4 and 5 , the card-type medium 1C of the second embodiment, like the first embodiment, includes an antenna substrate 2, an IC module 3, a metal layer 4, a first insulating substrate 5, two second insulating substrates 6, and two oversheets 7. The antenna substrate 2 also includes an antenna sheet 20 and an antenna resonant circuit 21 including a main coil antenna 22, a coupling coil antenna 23, and a capacitor 24. However, the card-type medium 1C of the second embodiment differs from the first embodiment in the specific aspects of the main coil antenna 22, the coupling coil antenna 23, and the capacitor 24.

[0048] 4 and 5, the main coil antenna 22 is formed only on the surface (one of the main surfaces) of the antenna sheet 20, as in the first embodiment. However, the main coil antenna 22 in the second embodiment is formed in a simple ring shape without a protruding portion 222 (see FIG. 2) when viewed from the thickness direction Z, specifically, in a circular ring shape.

[0049] As in the first embodiment, the coupled coil antenna 23 is formed on the front and back surfaces of the antenna sheet 20. A portion of the coupled coil antenna 23 formed on the front surface of the antenna sheet 20 and a portion of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 are connected by a first through electrode 231 that penetrates the antenna sheet 20 in the thickness direction Z. However, in the coupled coil antenna 23 of the second embodiment, both of the portions formed on the front and back surfaces of the antenna sheet 20 are formed in a shape having a first arc portion 232 and a second arc portion 233 that is formed continuous with the first arc portion 232 and surrounds the first through electrode 231. An inner peripheral end of the coupled coil antenna 23 formed on the front surface of the antenna sheet 20 is connected to an inner peripheral end of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 by the first through electrode 231.

[0050] As in the first embodiment, the capacitor 24 is configured by two second conductor patterns 92 that are formed on the front and back surfaces (both main surfaces) of the antenna sheet 20 and sandwich the antenna sheet 20. However, the capacitor 24 in the second embodiment is located outside the main coil antenna 22 when viewed from the thickness direction Z. Specifically, the capacitor 24 is located between the main coil antenna 22 and the coupled coil antenna 23 when viewed from the thickness direction Z. In Fig. 4, the size of the second conductor pattern 92 formed on the front surface of the antenna sheet 20 is smaller than the second conductor pattern 92 formed on the back surface of the antenna sheet 20, but may be the same as the size of the second conductor pattern 92 formed on the back surface of the antenna sheet 20, for example.

[0051] As shown in Figure 4, in the second embodiment, the outer peripheral end of the main coil antenna 22 formed on the surface of the antenna sheet 20 is electrically connected to the outer peripheral end of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 via a first connecting wiring 25 consisting of a conductor pattern formed on the surface of the antenna sheet 20.

[0052] Furthermore, the inner peripheral end of the main coil antenna 22 is electrically connected to a second conductor pattern 92 of the capacitor 24 formed on the back surface (the other main surface) of the antenna sheet 20 via a second through electrode 28 and a second connection wiring 26. The second through electrode 28 penetrates the antenna sheet 20 and is joined to the inner peripheral end of the main coil antenna 22. The second connection wiring 26 is made of a conductor pattern formed on the back surface of the antenna sheet 20, and electrically connects the second through electrode 28 to the second conductor pattern 92 of the capacitor 24 formed on the back surface of the antenna sheet 20.

[0053] Furthermore, the outer peripheral edge of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 is electrically connected to a second conductor pattern 92 of the capacitor 24 formed on the front surface of the antenna sheet 20 via a third through electrode 29 and a third connection wiring 27. The third through electrode 29 penetrates the antenna sheet 20 and is joined to the outer peripheral edge of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20. The third connection wiring 27 is made of a conductor pattern formed on the front surface of the antenna sheet 20 and electrically connects the third through electrode 29 to the second conductor pattern 92 of the capacitor 24 formed on the front surface of the antenna sheet 20.

[0054] Furthermore, in the second embodiment, the second conductor pattern 92 of the capacitor 24 formed on the back surface of the antenna sheet 20 is formed integrally with a portion of the outermost turn portion of the main coil antenna 22, or is formed adjacent to a portion of the outermost turn portion of the main coil antenna 22. This point will be described below. In FIG. 4 , the second conductor pattern 92 of the capacitor 24 formed on the back surface of the antenna sheet 20 is electrically connected to the main coil antenna 22 via the second connection wiring 26 and the second through electrode 28. A portion of the periphery of the second conductor pattern 92, indicated by reference numeral 92-3, is formed in an arc shape adjacent to and parallel to the outermost periphery of the main coil antenna 22, which is formed in an annular shape, when viewed from the thickness direction Z. As a result, it can be said that the portion of the periphery of the second conductor pattern 92 (the portion indicated by reference numeral 92-3) is formed integrally with a portion of the outermost periphery of the main coil antenna 22.

[0055] Furthermore, in the second embodiment, the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20 is formed integrally with a portion of the outermost turn portion of the coupled coil antenna 23, or is formed adjacent to a portion of the outermost turn portion of the coupled coil antenna 23. This point will be described below. In FIG. 4 , the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20 is electrically connected to the coupled coil antenna 23 via a third through electrode 29 and a third connection wiring 27. A portion of the periphery of the second conductor pattern 92, indicated by reference numeral 92-4, is formed in an arc shape adjacent to and parallel to the outermost periphery of the first arc portion 232 of the coupled coil antenna 23, which is formed in an arc shape, when viewed from the thickness direction Z. As a result, it can be said that the portion of the periphery of the second conductor pattern 92 (the portion indicated by reference numeral 92-4) is formed integrally with a portion of the outermost periphery of the coupled coil antenna 23.

[0056] In the second embodiment, a portion of the second conductor pattern 92 of the capacitor 24 formed integrally with or adjacent to a portion of the outermost turn portion of the coupled coil antenna 23 (portion indicated by reference symbol 92-4) corresponds to a quarter of the circumference of the outermost turn portion of the coupled coil antenna 23 in the circumferential direction of the coupled coil antenna 23. It is sufficient that the portion of the second conductor pattern 92 of the capacitor 24 formed integrally with or adjacent to a portion of the outermost turn portion of the coupled coil antenna 23 corresponds to at least a quarter of the circumference of the outermost turn portion of the coupled coil antenna 23.

[0057] The card-type medium 1C of the second embodiment has the same effects as the first embodiment. Furthermore, in the card-type medium 1C of the second embodiment, the capacitor 24 is located outside the main coil antenna 22 when viewed from the thickness direction Z. This reliably prevents a decrease in the magnetic flux passing inside the main coil antenna 22, even if the capacitor 24 is a parallel plate capacitor. Therefore, a decrease in the communication performance of contactless communication due to the capacitor 24 can be prevented.

[0058] Furthermore, in the card-type medium 1C of the second embodiment, the main coil antenna 22 is formed on the front surface (one of the main surfaces) of the antenna sheet 20. Furthermore, a second through electrode 28 is formed inside the main coil antenna 22, penetrating the antenna sheet 20 to electrically connect the inner circumferential end of the main coil antenna 22 to a second conductor pattern 92 of the capacitor 24 formed on the back surface (the other main surface) of the antenna sheet 20. This allows the capacitor 24 to be reliably disposed outside the main coil antenna 22, thereby increasing the degree of freedom in antenna design. Furthermore, compared to the first embodiment, it is possible to reduce eddy currents generated in the second conductor pattern 92 of the capacitor 24 inside the main coil antenna 22, thereby improving electromagnetic coupling between the main coil antenna 22 and external devices.

[0059] Furthermore, in the card-type medium 1C of the second embodiment, the capacitor 24 constituting the antenna resonant circuit 21 is formed integrally with or adjacent to the outermost periphery of the coupled coil antenna 23. This makes it possible to reduce the area occupied by the antenna resonant circuit 21 on the antenna substrate 2. Furthermore, the magnetic flux of the external device can be concentrated inside the coupled coil antenna 23, which results in improved performance of the antenna resonant circuit 21.

[0060] Furthermore, in the card-type medium 1C of the second embodiment, the capacitor 24 constituting the antenna resonant circuit 21 is formed integrally with or adjacent to the outermost periphery of the main coil antenna 22. This allows the area of ​​the antenna substrate 2 occupied by the antenna resonant circuit 21 to be kept small.

[0061] Third Embodiment A third embodiment of the present invention will be described with reference to Fig. 6. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted.

[0062] As shown in Figure 6, the card-type medium 1D of the third embodiment differs from the card-type medium 1C of the second embodiment only in the specific shape and arrangement of the capacitor 24 when viewed from the thickness direction Z, and the connection mode between the capacitor 24 and the third through electrode 29.

[0063] As in the second embodiment, the capacitor 24 is located outside the main coil antenna 22 when viewed from the thickness direction Z. However, in the third embodiment, the capacitor 24 is not only located between the main coil antenna 22 and the coupled coil antenna 23 when viewed from the thickness direction Z, but is also formed so as to surround the coupled coil antenna 23. In Fig. 6, the capacitor 24 is formed so as to surround only three-quarters of the circumference of the coupled coil antenna 23 in the circumferential direction.

[0064] In the third embodiment, a third through electrode 29 joined to the outer peripheral edge of the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 is directly joined to a second conductor pattern 92 of the capacitor 24 formed on the front surface of the antenna sheet 20. In other words, the coupled coil antenna 23 formed on the back surface of the antenna sheet 20 is electrically connected to the second conductor pattern 92 of the capacitor 24 formed on the front surface of the antenna sheet 20 only via the third through electrode 29. For this reason, the card-type medium 1D of the third embodiment does not include the third connection wiring 27 (see FIG. 4 ) of the second embodiment.

[0065] In the third embodiment, as in the second embodiment, the second conductor pattern 92 of the capacitor 24 formed on the back surface of the antenna sheet 20 is formed integrally with a part of the outermost turn portion of the main coil antenna 22, or is formed adjacent to a part of the outermost turn portion of the main coil antenna 22.

[0066] Furthermore, in the third embodiment, similarly to the second embodiment, the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20 is formed integrally with a portion of the outermost turn portion of the coupled coil antenna 23, or is formed adjacent to a portion of the outermost turn portion of the coupled coil antenna 23. However, in the third embodiment, the portion of the second conductor pattern 92 of the capacitor 24 formed integrally with or adjacent to a portion of the outermost turn portion of the coupled coil antenna 23 corresponds to three-quarters of the circumference of the outermost turn portion of the coupled coil antenna 23 in the circumferential direction of the coupled coil antenna 23.

[0067] The card-type medium 1D of the third embodiment has the same effects as the first and second embodiments.

[0068] <Fourth embodiment> A fourth embodiment of the present invention will be described with reference to Figures 7 and 8. In the following description, components common to those already described will be assigned the same reference numerals and duplicated description will be omitted.

[0069] As shown in FIGS. 7 and 8, the card-type medium 1E of the fourth embodiment differs from the first embodiment mainly in the specific configuration of the coupling coil antenna 23 and the specific shape and arrangement of the capacitor 24.

[0070] In the fourth embodiment, the coupled coil antenna 23, like the main coil antenna 22, is formed only on the front surface of the antenna sheet 20. Therefore, unlike the first to third embodiments, the coupled coil antenna 23 does not have a through electrode connecting the front surface and back surface of the coupled coil antenna 23. Furthermore, when viewed from the thickness direction Z, a through electrode that penetrates the antenna sheet 20 and forms the antenna resonant circuit 21 is not arranged inside each turn portion of the coupled coil antenna 23. Furthermore, when viewed from the thickness direction Z, a capacitor 24 is not arranged inside each turn portion of the coupled coil antenna 23. The coupled coil antenna 23 of the fourth embodiment is formed in a simple ring shape without a second arc portion 233 (see FIG. 4 , etc.), specifically, in a circular ring shape, when viewed from the thickness direction Z.

[0071] 7 , in the fourth embodiment, all of the turn portions of the main coil antenna 22 formed on the surface of the antenna sheet 20 are integrally formed with all of the turn portions of the coupled coil antenna 23. Therefore, the number of turn portions of the coupled coil antenna 23 is the same as the number of turn portions of the main coil antenna 22. Note that the turn portions located on the outer periphery of the main coil antenna 22 formed on the surface of the antenna sheet 20 may also be integrally formed with all of the turn portions of the coupled coil antenna 23. In this case, the number of turn portions of the coupled coil antenna 23 will be smaller than the number of turn portions of the main coil antenna 22.

[0072] In the fourth embodiment, similarly to the second and third embodiments, the capacitor 24 is located outside the main coil antenna 22 when viewed from the thickness direction Z. Specifically, the capacitor 24 is arranged such that the coupling coil antenna 23 is located between the capacitor 24 and the main coil antenna 22 when viewed from the thickness direction Z.

[0073] In the fourth embodiment, at least some of the turn portions of the main coil antenna 22 and all of the turn portions of the coupled coil antenna 23 are integrally formed, so that the main coil antenna 22 and the coupled coil antenna 23 are electrically connected to each other.

[0074] As in the second embodiment, the inner peripheral end of the main coil antenna 22 is electrically connected to a second conductor pattern 92 of the capacitor 24 formed on the back surface (the other main surface) of the antenna sheet 20 via a second through electrode 28 and a second connection wiring 26. The second through electrode 28 penetrates the antenna sheet 20 and is joined to the inner peripheral end of the main coil antenna 22. In FIG. 7 , the second through electrode 28 is located inside the protruding portion 222 of the main coil antenna 22. The second connection wiring 26 is made of a conductor pattern formed on the back surface of the antenna sheet 20 and electrically connects the second through electrode 28 to the second conductor pattern 92 of the capacitor 24 formed on the back surface of the antenna sheet 20. In addition, the second connection wiring 26 is formed to bypass the inner region of the coupled coil antenna 23 so as not to enter the inner region of the coupled coil antenna 23 when viewed in the thickness direction Z.

[0075] The outer peripheral end of the coupled coil antenna 23 formed on the surface of the antenna sheet 20 is joined to a second conductor pattern 92 of the capacitor 24 formed on the surface (one of the main surfaces) of the antenna sheet 20. This electrically connects the coupled coil antenna 23 formed on the surface of the antenna sheet 20 to the second conductor pattern 92. Here, as described above, the outermost turn portion of the main coil antenna 22 is formed integrally with the outermost turn portion of the coupled coil antenna 23. Therefore, the outer peripheral end of the main coil antenna 22, which is integral with the coupled coil antenna 23, is essentially joined to the second conductor pattern 92 formed on the surface (one of the main surfaces) of the antenna sheet 20.

[0076] Furthermore, in the fourth embodiment, similarly to the second embodiment, the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20 is formed integrally with a portion of the outermost turn portion of the coupled coil antenna 23, or is formed adjacent to a portion of the outermost turn portion of the coupled coil antenna 23. In Fig. 7, the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20 is joined to the coupled coil antenna 23. A portion of the periphery of the second conductor pattern 92, indicated by reference numeral 92-4, is formed in an arc shape adjacent to and parallel to the outermost periphery of the annular coupled coil antenna 23, as viewed from the thickness direction Z. As a result, it can be said that the portion of the periphery of the second conductor pattern 92 (the portion indicated by reference numeral 92-4) is formed integrally with a portion of the outermost periphery of the coupled coil antenna 23.

[0077] In the fourth embodiment, a portion of the second conductor pattern 92 of the capacitor 24 (portion indicated by reference numeral 92-4) formed integrally with or adjacent to a part of the outermost turn portion of the coupled coil antenna 23 corresponds to one-quarter of the circumference of the outermost turn portion of the coupled coil antenna 23 in the circumferential direction of the coupled coil antenna 23.

[0078] The card-type medium 1E of the fourth embodiment has the same effects as the first and second embodiments. Furthermore, in the card-type medium 1E of the fourth embodiment, the number of turn portions of the coupled coil antenna 23 is equal to or less than the number of turn portions of the main coil antenna 22. This makes it possible to set the number of turns of the coupled coil antenna 23 and the main coil antenna 22 separately, improving the degree of freedom in designing the antenna resonant circuit 21.

[0079] Furthermore, in the card-type medium 1E of the fourth embodiment, when viewed from the thickness direction Z, the capacitor 24 and the through electrodes that constitute the antenna resonant circuit 21 are not disposed inside each turn of the coupled coil antenna 23. This eliminates the need to form the coupled coil antenna 23 around the capacitor 24 or through electrodes. This makes it possible to design the shape of the coupled coil antenna 23 so as to optimize the electromagnetic coupling between the coupled coil antenna 23 and the IC module 3 (particularly the connecting coil antenna). This improves the communication performance of the card-type medium 1E.

[0080] Furthermore, in the card-type medium 1E of the fourth embodiment, the outer peripheral edge of the main coil antenna 22 formed on the surface of the antenna sheet 20 is joined to the second conductor pattern 92 of the capacitor 24 formed on the surface of the antenna sheet 20. This allows the capacitor 24 to be reliably positioned outside the main coil, thereby increasing the degree of freedom in antenna design. It also makes it possible to reduce eddy currents generated in the second conductor pattern 92 of the capacitor 24 inside the main coil antenna 22, thereby improving electromagnetic coupling between the main coil antenna 22 and external devices.

[0081] In the fourth embodiment, the capacitor 24 may be formed to surround the coupled coil antenna 23, as in the card-type medium 1F shown in Fig. 9. In Fig. 9, the capacitor 24 surrounds almost the entire coupled coil antenna 23. Therefore, a portion of the second conductor pattern 92 of the capacitor 24 (portion indicated by reference numeral 92-4) formed integrally with or adjacent to a part of the outermost turn portion of the coupled coil antenna 23 corresponds to approximately one turn of the outermost turn portion of the coupled coil antenna 23 in the circumferential direction of the coupled coil antenna 23.

[0082] 9, the capacitor 24 is also located between the main coil antenna 22 and the coupling coil antenna 23. Therefore, the second connection wiring 26 only spans the main coil antenna 22 from its inner periphery to its outer periphery, and does not pass through the coupling coil antenna 23. This allows the second connection wiring 26 to be formed shorter than in the configuration illustrated in FIG.

[0083] 10 , for example, the antenna substrate 2 including the antenna sheet 20 and the antenna resonant circuit 21 may be fitted inside the opening 41 of the metal layer 4. In this case, insulating substrates 15 and 16 having electrical insulation properties and covering the front and back surfaces of the antenna substrate 2, respectively, may also be fitted inside the opening 41 of the metal layer 4. Then, an oversheet 7 may be laminated over the entire front and back surfaces of the metal layer 4, including the opening 41.

[0084] In the first to fourth embodiments, the metal layer 4 having the openings 41 and slots 42 may be configured, for example, by the conductor pattern of the antenna substrate 2. In other words, the metal layer 4 may be formed integrally with the antenna substrate 2. In this case, the card-type medium does not need to include the first insulating substrate 5.

[0085] Fifth Embodiment A fifth embodiment of the present invention will be described with reference to FIGS. 11 to 14. The card-type medium 1G shown in FIG. 11 is a card capable of contactless communication with an external device. The card-type medium 1G of this embodiment is also a card capable of contact-type communication with an external device. Specifically, the card-type medium 1G includes an IC module 7A for contact-type communication with an external device. The IC module 7A has contact terminals 71A for contacting the external device. The card-type medium 1G illustrated in FIG. 11 is formed in a plate shape and, when viewed in the thickness direction Z of the card-type medium 1G, is formed in a rectangular shape with its long sides extending in the first linear direction X.

[0086] As shown in Figures 12 and 13, the card-type medium 1G includes a metal plate 2A (metal layer), an electrically insulating first insulating substrate 3A, and an antenna substrate 4A. The metal plate 2A, first insulating substrate 3A, and antenna substrate 4A are stacked in this order in the thickness direction Z. The card-type medium 1G of this embodiment also includes two electrically insulating second insulating substrates 5A and two over-sheets 6A. The second insulating substrates 5A and over-sheets 6A are stacked in this order in the thickness direction Z on the front surface of the antenna substrate 4A and the back surface of the metal plate 2A, respectively. Figure 12 shows only the metal plate 2A, first insulating substrate 3A, and antenna substrate 4A; the second insulating substrate 5A and over-sheet 6A are not shown.

[0087] As shown in FIGS. 12 to 14 , the metal plate 2A has an opening 21A penetrating in the thickness direction Z and a slot 22A opening the opening 21A to the edge of the metal plate 2A in a plan view as shown in FIG. 14 . The shape and size of the opening 21A in the metal plate 2A may be appropriately determined so that, when viewed from the thickness direction Z, the coil antennas 42A and 43A provided on the antenna substrate 4A (described later) are positioned inside the opening 21A. In FIGS. 12 and 14 , the slot 22A is formed on the edge of the metal plate 2A located on the other side (−X side) of the first linear direction X, but this is not limited thereto. Specific metal materials constituting the metal plate 2A may include, for example, stainless steel, iron, titanium, and aluminum. Although not shown, the opening 21A in the metal plate 2A is preferably filled with an electrically insulating material, such as resin. Filling the opening 21A of the metal plate 2A with an insulating material such as resin can prevent the first insulating substrate 3A and the second insulating substrate 5A that overlap the opening 21A of the metal plate 2A from entering inside the opening 21A. This prevents the portions of the metal plate 2A, including the first insulating substrate 3A, the antenna substrate 4A, and the second insulating substrate 5A, that are arranged overlapping the opening 21A from being displaced in the thickness direction Z. In other words, the first insulating substrate 3A, the antenna substrate 4A, the second insulating substrate 5A, and the like that are arranged overlapping the metal plate 2A can be stably supported by the metal plate 2A and the filled insulating material.

[0088] The first insulating substrate 3A is disposed between the metal plate 2A and the antenna substrate 4A and electrically insulates the metal plate 2A from the antenna substrate 4A. The first insulating substrate 3A may be bonded to the metal plate 2A and the antenna substrate 4A by, for example, providing an adhesive on the front and back surfaces of the first insulating substrate 3A. The material constituting the first insulating substrate 3A may be, for example, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate copolymer (PET-G), or the like.

[0089] The antenna substrate 4A includes an antenna sheet 40A and an antenna resonant circuit 41A including coil antennas 42A and 43A and a capacitor 44A connected to the coil antennas 42A and 43A. The antenna sheet 40A is electrically insulating. The material constituting the antenna sheet 40A may be, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), polyester (PEs), glass epoxy, or the like.

[0090] The coil antennas 42A, 43A include a main coil antenna 42A and a coupling coil antenna 43A. The main coil antenna 42A is an antenna for performing contactless communication with an external device by electromagnetically coupling with the external device. The main coil antenna 42A is formed in a spiral shape having an inner peripheral end and an outer peripheral end in a plan view seen in the thickness direction Z. The main coil antenna 42A of this embodiment is formed in a circular shape seen in the thickness direction Z.

[0091] The coupling coil antenna 43A is connected to the main coil antenna 42A and is an antenna for electromagnetically coupling with the IC module 7A. Therefore, the coupling coil antenna 43A is preferably positioned so as to overlap the IC module 7A in the thickness direction Z. Like the main coil antenna 42A, the coupling coil antenna 43A is formed in a spiral shape having an inner peripheral end and an outer peripheral end in a plan view from the thickness direction Z. The coupled coil antenna 43A of this embodiment is formed in a rectangular shape from the thickness direction Z. The size of the coupling coil antenna 43A in a plan view is smaller than the size of the main coil antenna 42A. In FIGS. 12 and 14 , the coupling coil antenna 43A is positioned on the other side (−X side) of the main coil antenna 42A in the first linear direction X, but this is not limiting. The main coil antenna 42A and the coupling coil antenna 43A may be aligned in any direction perpendicular to the thickness direction Z.

[0092] As shown in FIGS. 12 and 14 , the main coil antenna 42A and the coupling coil antenna 43A are located inside the opening 21A of the metal plate 2A when viewed from the thickness direction Z. This prevents the magnetic fields of the main coil antenna 42A and the coupling coil antenna 43A from being blocked by the metal plate 2A. Note that, in a plan view from the thickness direction Z, part of the edge of the opening 21A of the metal plate 2A is formed in a shape that follows the outer shapes of the main coil antenna 42A and the coupling coil antenna 43A. Specifically, part of the edge of the opening 21A of the metal plate 2A is formed in an arc shape that follows the outer shape of the circular main coil antenna 42A. Furthermore, part of the edge of the opening 21A of the metal plate 2A is formed in a straight line that follows one side of the rectangular coupling coil antenna 43A. This minimizes the size of the opening 21A of the metal plate 2A in a plan view so that the magnetic fields of the main coil antenna 42A and the coupling coil antenna 43A are not blocked by the metal plate 2A.

[0093] The capacitor 44A overlaps the metal plate 2A so as to be located outside the opening 21A of the metal plate 2A when viewed from the thickness direction Z. In Figures 12 and 14, the capacitor 44A is located on one side in the second linear direction Y (+Y side) with respect to the main coil antenna 42A, the coupling coil antenna 43A, and the opening 21A of the metal plate 2A, but this is not limitative. The capacitor 44A may be located, for example, on the other side in the second linear direction Y (-Y side) or on one side in the first linear direction X (+X side) with respect to the main coil antenna 42A, the coupling coil antenna 43A, and the opening 21A of the metal plate 2A.

[0094] The antenna resonant circuit 41A has first to third connection wirings 45A to 47A in addition to the main coil antenna 42A, coupling coil antenna 43A, and capacitor 44A described above. The first connection wiring 45A connects the main coil antenna 42A and the coupling coil antenna 43A. The second connection wiring 46A connects the main coil antenna 42A and the capacitor 44A. The third connection wiring 47A connects the coupling coil antenna 43A and the capacitor 44A.

[0095] In this embodiment, the main coil antenna 42A, the coupling coil antenna 43A, the capacitor 44A, and the first to third connection wirings 45A to 47A that make up the antenna resonant circuit 41A are configured by conductor patterns formed on the front and back surfaces (both main surfaces) of the antenna sheet 40A. The conductor patterns are formed by etching conductor foils formed on the front and back surfaces of the antenna sheet 40A. The conductor patterns (conductor foils) may be made of, for example, copper or aluminum.

[0096] The conductor patterns include a first conductor pattern 91A that constitutes the main coil antenna 42A and the coupled coil antenna 43A. In this embodiment, the first conductor pattern 91A is formed only on the front surface (one of the main surfaces) of the antenna sheet 40A. Note that the first conductor pattern 91A may be formed on both the front and back surfaces of the antenna sheet 40A, for example. The conductor patterns include two second conductor patterns 92A that constitute the capacitor 44A. In this embodiment, the two second conductor patterns 92A are formed on the front and back surfaces (both main surfaces) of the antenna sheet 40A and are arranged to sandwich the antenna sheet 40A. That is, the capacitor 44A in this embodiment is a parallel-plate capacitor that sandwiches the antenna sheet 40A.

[0097] In this embodiment, the first connection wiring 45A extends from the outer peripheral edge of the main coil antenna 42A formed only on the surface of the antenna sheet 40A to the outer peripheral edge of the coupling coil antenna 43A. Therefore, the first connection wiring 45A is constituted only by the conductor pattern formed on the surface of the antenna sheet 40A.

[0098] The second connection wiring 46A extends from the inner circumferential end of the main coil antenna 42A to the second conductor pattern 92A of the capacitor 44A that is formed on the back surface of the antenna sheet 40A. Therefore, the second connection wiring 46A is composed of a through electrode 461A that is connected to the inner circumferential end of the main coil antenna 42A and that penetrates from the front surface to the back surface of the antenna sheet 40A, and a conductor pattern that extends on the back surface of the antenna sheet 40A from the through electrode 461A to the second conductor pattern 92A that is formed on the back surface of the antenna sheet 40A.

[0099] The third connection wiring 47A extends from the inner circumferential end of the coupled coil antenna 43A to a second conductor pattern 92A of the capacitor 44A that is formed on the front surface of the antenna sheet 40A. Therefore, the third connection wiring 47A is composed of a through electrode 471A that is connected to the inner circumferential end of the coupled coil antenna 43A and that penetrates from the front surface to the back surface of the antenna sheet 40A, a conductor pattern that extends from the through electrode 471A to the outside of the coupled coil antenna 43A on the back surface of the antenna sheet 40A, a through electrode 472A that is connected to the tip of the conductor pattern and that penetrates from the back surface to the front surface of the antenna sheet 40A, and a conductor pattern that extends on the front surface of the antenna sheet 40A from the through electrode 472A to the second conductor pattern 92A that is formed on the front surface of the antenna sheet 40A.

[0100] The through electrodes 461A, 471A, and 472A may be, for example, rivets or through holes. In Fig. 14, among the first to third connection wirings 45A to 47A, the conductor patterns formed on the front surface of the antenna sheet 40A are indicated by solid lines, and the conductor patterns formed on the back surface of the antenna sheet 40A are indicated by dashed lines.

[0101] The material constituting the second insulating substrate 5A shown in FIG. 13 may be, for example, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate copolymer (PET-G), or the like. Furthermore, an adhesive may be provided on the front and back surfaces of the second insulating substrate 5A, similar to the first insulating substrate 3A. The second insulating substrate 5A overlaps the front surface of the antenna substrate 4A, thereby preventing the antenna resonant circuit 41A provided on the antenna substrate 4A from being unintentionally electrically connected to the outside. The second insulating substrate 5A overlaps the back surface of the metal plate 2A, thereby preventing the metal plate 2A from being unintentionally electrically connected to the outside.

[0102] 13, the oversheet 6A forms the front and back surfaces of the card-type medium 1G. The oversheet 6A may be, for example, a sheet on which printing can be performed (a printing sheet). The material that forms the oversheet 6A may be, for example, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyurethane (PU), polyethylene terephthalate copolymer (PET-G), or the like.

[0103] Although not shown, the IC module 7A includes a connection coil antenna and an IC chip in addition to the aforementioned contact terminal 71A. The connection coil antenna is an antenna for electromagnetic coupling with the coupling coil antenna 43A. The IC chip is connected to the contact terminal 71A and the connection coil antenna and has both contactless and contact communication functions. As shown in Figures 11 and 13, the IC module 7A is provided on the oversheet 6UA (top oversheet 6UA), which is located at the top in the thickness direction Z and forms the surface of the card-type medium 1G. Specifically, the IC module 7A is disposed in a recess 61A recessed from the surface of the top oversheet 6UA. In this state, the contact terminal 71A of the IC module 7A is exposed to the outside of the card-type medium 1G.

[0104] 13, the top over-sheet 6UA has a through-hole 62A that penetrates from the bottom of the recess 61A to the back surface of the top over-sheet 6UA. The second insulating substrate 5A located below the top over-sheet 6UA has a through-hole 52A that penetrates in the thickness direction Z and connects to the through-hole 62A in the top over-sheet 6UA. Therefore, the IC module 7A placed in the recess 61A is exposed to the antenna substrate 4A through the through-holes 62A, 52A in the top over-sheet 6UA and the second insulating substrate 5A.

[0105] As described above, in the card-type medium 1G of this embodiment, the capacitor 44A overlaps the metal plate 2A so as to be located outside the opening 21A of the metal plate 2A when viewed from the thickness direction Z. This allows the area of ​​the opening 21A of the metal plate 2A to be smaller than when the capacitor 44A is located inside the opening 21A of the metal plate 2A. This increases the weight of the metal plate 2A, ensuring a sense of solidity. Furthermore, because the capacitor 44A is located outside the coil antennas 42A, 43A (particularly the main coil antenna 42A), it is possible to prevent the capacitor 44A from interfering with the magnetic flux passing through the inside of the coil antennas 42A, 43A. This ensures communication performance via the coil antennas 42A, 43A.

[0106] In the fifth embodiment, the main coil antenna 42A and the coupling coil antenna 43A may be formed on the front surface of the antenna sheet 40A, but may also be formed on the rear surface of the antenna sheet 40A. However, in order to reduce the distance between the IC module 7A and the coupling coil antenna 43A, it is more preferable to form the coupling coil antenna 43A on the front surface of the antenna sheet 40A.

[0107] In the fifth embodiment, the antenna substrate 4A is not limited to being disposed on the front surface (upper side) of the metal plate 2A. For example, as in the card-type medium 1H shown in Figures 15 and 16, the antenna substrate 4A may be disposed on the rear surface (lower side) of the metal plate 2A. In this case, the main coil antenna 42A and the coupling coil antenna 43A may be formed on the front surface of the antenna sheet 40A as in the illustrated example, but they may also be formed on the rear surface of the antenna sheet 40A, for example. However, it is more preferable that the coupling coil antenna 43A be formed on the front surface of the antenna sheet 40A.

[0108] In the fifth embodiment, the shape of the main coil antenna 42A as viewed in the thickness direction Z is not limited to being circular and may be any shape. For example, as in the card-type medium 1I shown in Figures 17 and 18, the shape of the main coil antenna 42A as viewed in the thickness direction Z may be rectangular. In this case, it is preferable that part of the edge of the opening 21A in the metal plate 2A be formed into a square shape that follows the outline of the rectangular main coil antenna 42A. In the fifth embodiment, the shape of the coupled coil antenna 43A as viewed in the thickness direction Z is not limited to being rectangular and may be any shape, such as circular.

[0109] Sixth Embodiment A sixth embodiment of the present invention will be described with reference to Figures 19 to 21. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted.

[0110] 19 to 21 , the card-type medium 1J of the sixth embodiment includes a metal plate 2A, a first insulating substrate 3A, an antenna substrate 4A, two second insulating substrates 5A, two oversheets 6A, and an IC module 7A, similar to the fifth embodiment. The antenna substrate 4A also includes an antenna sheet 40A and an antenna resonant circuit 41A including a main coil antenna 42A, a coupling coil antenna 43A, a capacitor 44A, and first to third connecting wirings 45A to 47A. However, the card-type medium 1J of the sixth embodiment differs from the fifth embodiment in the specific aspects of the main coil antenna 42A, the coupling coil antenna 43A, the capacitor 44A, and the first to third connecting wirings 45A to 47A.

[0111] In the sixth embodiment, the main coil antenna 42A, the coupling coil antenna 43A, the capacitor 44A, and the first to third connection wirings 45A to 47A are configured by a coated electrical wiring 93A installed on the back surface (one of the main surfaces) of the antenna sheet 40A. Although not shown, the coated electrical wiring 93A has a conductive wiring portion and an electrically insulating coating portion that coats the wiring portion. The wiring portion may be configured from, for example, copper or aluminum.

[0112] As shown in Figures 19 and 21, the main coil antenna 42A and the coupling coil antenna 43A are each configured by arranging a coated electrical wire 93A in a spiral shape having an inner peripheral end and an outer peripheral end. In Figures 19 and 21, the main coil antenna 42A and the coupling coil antenna 43A are formed in a rectangular shape when viewed in the thickness direction Z, but they may be formed in other shapes, such as a circle. The capacitor 44A is configured by two coated electrical wires 93A extending parallel to each other with a gap between them. In the illustrated example, the two coated electrical wires 93A that make up the capacitor 44A are arranged in a spiral shape.

[0113] The second connection wiring 46A extending from the inner circumferential end of the main coil antenna 42A to the capacitor 44A is arranged so as to intersect with the main coil antenna 42A. The third connection wiring 47A extending from the inner circumferential end of the coupled coil antenna 43A to the capacitor 44A is arranged so as to intersect with the coupled coil antenna 43A. Here, as described above, because the coated electrical wiring 93A has a coated portion, even if the second and third connection wirings 46A, 47A intersect with the main coil antenna 42A and the coupled coil antenna 43A, the antenna resonant circuit 41A will not be short-circuited.

[0114] The card-type medium 1J of the sixth embodiment has the same effects as the fifth embodiment. Furthermore, in the card-type medium 1J of the sixth embodiment, the main coil antenna 42A, the coupling coil antenna 43A, and the capacitor 44A are configured by coated electrical wiring 93A installed on the back surface (one of the main surfaces) of the antenna sheet 40A. In this case, the antenna substrate 4A can be manufactured more easily than in the fifth embodiment, in which the main coil antenna 42A, the coupling coil antenna 43A, and the capacitor 44A are configured by conductor patterns.

[0115] To explain this point, in the fifth embodiment, which employs a conductor pattern, it is necessary to form through-electrodes that penetrate the antenna sheet 40A in the thickness direction Z in order to connect the inner circumferential ends of the main coil antenna 42A and the coupling coil antenna 43A to the capacitor 44A located outside of these antenna sheets 42A and 43A so as to prevent the antenna resonant circuit 41A from shorting out. In contrast, the coated electrical wiring 93A employed in the sixth embodiment does not short out even if it crosses. For this reason, in the sixth embodiment, the antenna resonant circuit 41A can be easily configured by simply arranging the coated electrical wiring 93A only on the back surface of the antenna sheet 40A.

[0116] Furthermore, because the capacitor 44A is formed from the coated electrical wiring 93A, the antenna substrate 4A can be manufactured more easily than in the fifth embodiment. In this regard, in the fifth embodiment, which employs a conductor pattern, two conductor patterns must be formed at corresponding positions on both sides of the antenna sheet 40A. In contrast, when the capacitor 44A is formed from the coated electrical wiring 93A, the capacitor 44A can be easily constructed by simply arranging the coated electrical wiring 93A only on the back surface of the antenna sheet 40A.

[0117] In the sixth embodiment, the main coil antenna 42A, the coupling coil antenna 43A, the capacitor 44A, and the coated electrical wiring 93A that constitutes the first to third connection wirings 45A to 47A may be disposed on the surface of the antenna sheet 40A, for example.

[0118] In the sixth embodiment, the antenna substrate 4A is not limited to being disposed on the front surface (upper side) of the metal plate 2A. For example, as in the card-type medium 1K shown in Fig. 22, the antenna substrate 4A may be disposed on the rear surface (lower side) of the metal plate 2A. In this case, the main coil antenna 42A, the coupling coil antenna 43A, and the capacitor 44A may be formed on the front surface of the antenna sheet 40A as in the illustrated example, but may also be formed on the rear surface of the antenna sheet 40A, for example.

[0119] Seventh Embodiment A seventh embodiment of the present invention will be described with reference to Figures 23 to 25. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted.

[0120] 23 to 25, the card-type medium 1L of the seventh embodiment, like the fifth and sixth embodiments, includes a metal plate 2A, a first insulating substrate 3A, an antenna substrate 4A, two second insulating substrates 5A, two oversheets 6A, and an IC module 7A. The antenna substrate 4A includes an antenna sheet 40A and an antenna resonant circuit 41A including a main coil antenna 42A, a coupling coil antenna 43A, a capacitor 44A, and first to third connection wiring 45A to 47A. The main coil antenna 42A and the coupling coil antenna 43A are formed of coated electrical wiring 93A, like the sixth embodiment.

[0121] However, the card-type medium 1L of the seventh embodiment differs from the fifth and sixth embodiments in that the capacitor 44A is a capacitive element. The capacitive element may be, for example, a film capacitor or a ceramic capacitor. The capacitor 44A is installed on the back surface of the antenna sheet 40A together with the coated electrical wiring 93A.

[0122] The card-type medium 1L of the seventh embodiment has the same effects as the fifth and sixth embodiments.

[0123] In the seventh embodiment, the capacitor 44A, which is a capacitive element, may be placed on the surface of the antenna sheet 40A together with the coated electrical wiring 93A that constitutes the main coil antenna 42A and the coupling coil antenna 43A, for example.

[0124] In the seventh embodiment, the main coil antenna 42A and the coupling coil antenna 43A may be configured with the same conductor patterns as those in the fifth embodiment, for example.

[0125] In the seventh embodiment, the antenna substrate 4A is not limited to being disposed on the front surface (upper side) of the metal plate 2A, but may be disposed on the rear surface (lower side) of the metal plate 2A, for example.

[0126] Eighth Embodiment An eighth embodiment of the present invention will be described with reference to Fig. 26. In the following description, components common to those already described will be assigned the same reference numerals and redundant description will be omitted.

[0127] 26 , the card-type medium 1M of the eighth embodiment includes a metal plate 2A, a first insulating substrate 3A, an antenna substrate 4A, two second insulating substrates 5A, two oversheets 6A, and an IC module 7A, similar to the fifth and sixth embodiments. The antenna substrate 4A includes an antenna sheet 40A and an antenna resonant circuit 41A including a main coil antenna 42A, a coupling coil antenna 43A, and a capacitor 44A. The main coil antenna 42A, the coupling coil antenna 43A, and the capacitor 44A are configured using conductor patterns, similar to the fifth embodiment.

[0128] However, in the card-type medium 1M of the eighth embodiment, a first insulating substrate 3A and a metal plate 2A are stacked in order on the front and back surfaces (both main surfaces) of the antenna substrate 4A. That is, metal plates 2A are disposed on both the upper and lower sides of the antenna substrate 4A. The openings 21A formed in the two metal plates 2A are formed to have the same shape and size as viewed from the thickness direction Z, and are positioned so as to overlap in the thickness direction Z. As viewed from the thickness direction Z, the main coil antenna 42A and the coupling coil antenna 43A are positioned inside the openings 21A of the two metal plates 2A. Furthermore, the capacitor 44A is positioned outside the openings 21A of the two metal plates 2A.

[0129] In the card-type medium 1M of the eighth embodiment, a second insulating substrate 5A and an oversheet 6A are laminated in this order on the front surface of the metal plate 2A located above the antenna substrate 4A, and a second insulating substrate 5A and an oversheet 6A are laminated in this order on the back surface of the metal plate 2A located below the antenna substrate 4A.

[0130] The card-type medium 1M of the eighth embodiment has the same effects as the fifth embodiment. In addition, since the card-type medium 1M of the eighth embodiment includes two metal plates 2A, the card-type medium 1M can further enhance its sense of solidity.

[0131] The card-type medium 1M of the eighth embodiment, in which metal plates 2A are disposed on both the upper and lower sides of the antenna substrate 4A, may employ the configurations described in the fifth to seventh embodiments, for example. For example, the main coil antenna 42A and the coupling coil antenna 43A may have any shape, such as a circle or a rectangle, when viewed in the thickness direction Z. Furthermore, as in the card-type medium 1N shown in FIG. 27, the main coil antenna 42A, the coupling coil antenna 43A, and the capacitor 44A may be configured with a coated electrical wiring 93A similar to that of the sixth embodiment. Furthermore, for example, the capacitor 44A may be configured with a capacitive element similar to that of the seventh embodiment.

[0132] The fifth to eighth embodiments described above are also applicable to the first to fourth embodiments.

[0133] Ninth Embodiment A ninth embodiment of the present invention will be described with reference to Fig. 28. As shown in Fig. 28, a card-type medium 1O of the ninth embodiment has, similar to the fifth embodiment, a metal layer 2B (metal plate 2B), a main coil antenna 42B (coil antenna 42B), a coupling coil antenna 43B (coil antenna 43B), a capacitor 44B, and an antenna resonant circuit 41B including first to third connection wirings 45B to 47B.

[0134] As in the fifth embodiment, the metal layer 2B has an opening 21B and a slot 22B. The main coil antenna 42B and the coupling coil antenna 43B are located inside the aforementioned opening 21B of the metal layer 2B when viewed from the thickness direction Z. The capacitor 44B overlaps with the metal layer 2B so as to be located outside the opening 21B of the metal layer 2B when viewed from the thickness direction Z. The first connection wiring 45B connects the main coil antenna 42B and the coupling coil antenna 43B. The second connection wiring 46B connects the main coil antenna 42B and the capacitor 44B. The third connection wiring 47B connects the coupling coil antenna 43B and the capacitor 44B.

[0135] Although not shown, the card-type medium 1O of the ninth embodiment has an antenna sheet that constitutes an antenna substrate together with the antenna resonant circuit 41B, similar to the fifth embodiment (FIGS. 12 to 18), etc. The card-type medium 1O of the ninth embodiment may also have an IC module, a first insulating substrate, a second insulating substrate, an oversheet, etc., similar to the fifth embodiment, etc.

[0136] In the ninth embodiment, as in the fifth embodiment, the main coil antenna 42B, the coupling coil antenna 43B, the capacitor 44B, and the first to third connection wirings 45B to 47B are configured by conductor patterns formed on the front and back surfaces (both main surfaces) of the antenna sheet. The conductor patterns in the ninth embodiment include a first conductor pattern 91B that configures the main coil antenna 42B and the coupling coil antenna 43B, and two second conductor patterns 92B that configure the capacitor 44B. The capacitor 44B in this embodiment is a parallel plate capacitor that sandwiches the antenna sheet. The second connection wiring 46B in this embodiment includes a through electrode 461B that penetrates the antenna sheet in its thickness direction. The third connection wiring 47B in this embodiment includes through electrodes 471B and 472B that penetrate the antenna sheet in its thickness direction.

[0137] The card-type medium 1O of the ninth embodiment has a plurality of capacitors 44B. The plurality of capacitors are electrically connected in parallel. The card-type medium 1O illustrated in FIG. 28 has two capacitors 44B. Therefore, the second connection wiring 46B extends from the main coil antenna 42B to one electrode of each of the two capacitors 44B (the second conductor pattern 92B). Similarly, the third connection wiring 47B extends from the coupling coil antenna 43B to the other electrode of each of the two capacitors 44B (the second conductor pattern 92B).

[0138] In the illustrated example, the second connection wiring 46B branches into two on its way from a through electrode 461B located at the inner circumferential end of the main coil antenna 42B to the two capacitors 44B, but may alternatively extend separately from the through electrode 461B to each of the two capacitors 44B. In the illustrated example, the third connection wiring 47B branches into two on its way from a through electrode 471B located at the inner circumferential end of the coupled coil antenna 43B to the two capacitors 44B, but may alternatively extend separately from the through electrode 471B to each of the two capacitors 44B. In the illustrated example, the two capacitors 44B are located on both sides of the main coil antenna 42B, the coupled coil antenna 43B, and the opening 21B in the metal layer 2B in the second linear direction Y when viewed from the thickness direction Z, but this is not limiting.

[0139] The card-type medium 1O of the ninth embodiment has the same effects as the fifth embodiment. Furthermore, the card-type medium 1O of the ninth embodiment has a plurality of capacitors 44B, which are electrically connected in parallel. That is, the capacitors 44B are distributed and arranged in a plurality of locations. This allows for greater design freedom in the placement of the capacitors 44B compared to when there is only one capacitor 44B.

[0140] Tenth Embodiment A tenth embodiment of the present invention will be described with reference to Fig. 29. In the following description, components common to those already described will be assigned the same reference numerals and duplicated description will be omitted.

[0141] As shown in Figure 29, the card-type medium 1P of the tenth embodiment, like the ninth embodiment, has a metal layer 2B and an antenna resonant circuit 41B including a main coil antenna 42B, a coupling coil antenna 43B, and a capacitor 44B. The card-type medium 1P also has an IC module 7B similar to the fifth embodiment. Although not shown, the card-type medium 1P of the tenth embodiment has an antenna sheet that, together with the antenna resonant circuit 41B, forms an antenna substrate similar to the fifth embodiment. The card-type medium 1P of the tenth embodiment may also have a first insulating substrate, a second insulating substrate, an oversheet, etc. similar to the fifth embodiment.

[0142] In the tenth embodiment, similar to the fourth embodiment (FIGS. 7 and 9), the main coil antenna 42B and the coupled coil antenna 43B are formed only on the surface of the antenna sheet. Furthermore, the main coil antenna 42B and the coupled coil antenna 43B are each formed by connecting a plurality of C-shaped turn portions in a spiral shape when viewed from the thickness direction Z. Furthermore, some turn portions of the main coil antenna 42B and the turn portions of the coupled coil antenna 43B are integrally formed. The shapes of the main coil antenna 42B and the coupled coil antenna 43B illustrated in FIG. 29 are the same as those of the main coil antenna 22 and the coupled coil antenna 23 shown in FIG. 9.

[0143] The card-type medium 1P of the tenth embodiment has two capacitors 44B. Similar to the ninth embodiment, the two capacitors 44B are electrically connected in parallel. Both of the two capacitors 44B are parallel plate capacitors that sandwich an antenna sheet. The two capacitors 44B include a first capacitor 44B-1 and a second capacitor 44B-2.

[0144] The first capacitor 44B-1 is located inside the opening 21B of the metal layer 2B when viewed from the thickness direction Z. The first capacitor 44B-1 illustrated in FIG. 29 is formed to surround the coupled coil antenna 43B, similar to the capacitor 24 illustrated in FIG. 9. Also, similar to the capacitor 24 illustrated in FIG. 9, one electrode of the first capacitor 44B-1 (second conductor pattern 92B) is connected to the inner circumferential end of the main coil antenna 42B via a connection wiring 46B including a through electrode 461B. The other electrode of the first capacitor 44B-1 (second conductor pattern 92B) is connected to the outer circumferential end of the main coil antenna 42B, or is formed adjacent to at least a portion of the outermost turn portion of the coupled coil antenna 43B.

[0145] The second capacitor 44B-2 is located outside the opening 21B of the metal layer 2B when viewed from the thickness direction Z. The second capacitor 44B-2 illustrated in FIG. 29 is formed so as to surround the opening 21B of the metal layer 2B when viewed from the thickness direction Z. The second capacitor 44B-2 only needs to be arranged so as to overlap at least an area of ​​the metal layer 2B excluding the portions where the opening 21B and the slot 22B are formed when viewed from the thickness direction Z. The size and shape of the second capacitor 44B-2 that overlaps with the metal layer 2B when viewed from the thickness direction Z may be arbitrary.

[0146] 29, one electrode of the second capacitor 44B-2 is connected to the inner circumferential edge of the main coil antenna 42B via a connection wiring 46B that includes a through electrode 461B. The connection wiring 46B branches and extends from the through electrode 461B toward the first and second capacitors 44B-1 and 44B-2. The other electrode of the second capacitor 44B-2 is connected to the outer circumferential edge of the main coil antenna 42B via another connection wiring 48B.

[0147] In the tenth embodiment, the specific wiring configuration for electrically connecting the first capacitor 44B-1 and the second capacitor 44B-2 in parallel is not limited to the example shown in FIG. 29, and may be any configuration.

[0148] The card-type medium 1P of the tenth embodiment has the same effects as the fourth, fifth, and ninth embodiments. Furthermore, in the card-type medium 1P of the tenth embodiment, the capacitor 44B is disposed both inside and outside the opening 21B of the metal layer 2B. Therefore, a larger capacitance can be ensured for the capacitor 44B compared to when the capacitor 44B is disposed only inside the opening 21B of the metal layer 2B or only outside the opening 21B.

[0149] In the tenth embodiment, the first capacitor 44B-1 is not limited to being disposed outside the main coil antenna 42B, but may be located at least in a position avoiding the center of the inner region of the main coil antenna 42B.

[0150] Eleventh Embodiment An eleventh embodiment of the present invention will be described with reference to Figures 30 and 31. In the following description, components common to those already described will be assigned the same reference numerals and duplicated description will be omitted.

[0151] 30 and 31 , the card-type medium 1Q of the eleventh embodiment, like the fifth embodiment (FIGS. 12 to 15) and the ninth embodiment, includes a metal layer 2B, a first insulating substrate 3B, an antenna substrate 4B, two second insulating substrates 5B, two oversheets 6B, and an IC module 7B. The antenna substrate 4B also includes an antenna sheet 40B and an antenna resonant circuit 41B including a main coil antenna 42B, a coupling coil antenna 43B, a capacitor 44B, and first to third connecting wirings 45B to 47B.

[0152] In the card-type medium 1Q illustrated in Figures 30 and 31, a first insulating substrate 3B and a metal layer 2B are stacked in this order in the thickness direction Z on the surface of the antenna substrate 4B. The reference numeral "6UB" in Figure 31 denotes the top over-sheet 6B that constitutes the surface of the card-type medium 1Q. The reference numerals "61B" and "62B" in Figure 31 respectively denote a recess recessed from the surface of the top over-sheet 6UB and a through-hole that penetrates from the bottom of the recess 61B to the back surface of the top over-sheet 6UB. The reference numeral "52B" in Figure 31 denotes a through-hole that penetrates the second insulating substrate 5B located below the top over-sheet 6UB in the thickness direction Z and connects to the through-hole 62B in the top over-sheet 6UB.

[0153] The card-type medium 1Q of the eleventh embodiment differs from the fifth embodiment mainly in the specific configuration of the capacitor 44B. The capacitor 44B of the eleventh embodiment is a parallel-plate capacitor, and includes two second conductor patterns 92B connected to the main coil antenna 42B and the coupling coil antenna 43B, respectively, and opposing portions 23B of the metal layer 2B that face the two second conductor patterns 92B in the thickness direction Z.

[0154] In this embodiment, the two second conductor patterns 92B that make up the capacitor 44B are both located on the back surface of the antenna sheet 40B. Meanwhile, the main coil antenna 42B and the coupled coil antenna 43B are both located on the front surface of the antenna sheet 40B. Therefore, one second conductor pattern 92B of the capacitor 44B is connected to the inner peripheral end of the main coil antenna 42B via a second connection wiring 46B that includes one through electrode 461B. Furthermore, the other second conductor pattern 92B of the capacitor 44B is connected to the inner peripheral end of the coupled coil antenna 43B via a third connection wiring 47B that includes one through electrode 471B. These two second conductor patterns 92B are located at a distance from each other in the direction along the back surface of the antenna sheet 40B and are electrically insulated from each other.

[0155] The facing portion 23B of the capacitor 44B is made of the metal layer 2B and is located on the front surface side of the antenna sheet 40B. Therefore, the first insulating substrate 3B and the antenna sheet 40B are interposed between the facing portion 23B and the two second conductor patterns 92B. The capacitor 44B of the eleventh embodiment is configured by electrically connecting in series a capacitor portion consisting of one second conductor pattern 92B and the facing portion 23B, and a capacitor portion consisting of the other second conductor pattern 92B and the facing portion 23B.

[0156] The eleventh embodiment may have a plurality of capacitors 44B, similarly to the ninth embodiment, for example.

[0157] The card-type medium 1Q of the eleventh embodiment achieves the same effects as the fifth embodiment. Furthermore, in the card-type medium 1Q of the eleventh embodiment, the size (area) of the metal layer 2B facing each second conductor pattern 92B when viewed in the thickness direction Z is sufficiently larger than the area of ​​each second conductor pattern 92B. The facing portion 23B of the metal layer 2B facing the second conductor pattern 92B automatically functions as a component of the capacitor 44B. This allows the desired capacitance of the capacitor 44B to be easily achieved simply by adjusting the area of ​​each second conductor pattern 92B.

[0158] Furthermore, in the capacitor 44B of the eleventh embodiment, the amount of fluctuation in the resonant frequency in the antenna resonant circuit 41B can be reduced when the areas of the two second conductor patterns 92B are changed, making it possible to easily fine-tune the resonant frequency.

[0159] Furthermore, in the capacitor 44B of the eleventh embodiment, two second conductor patterns 92B can be arranged on the same plane (e.g., the back surface of the antenna sheet 40B). This allows for a simple configuration of the second connection wiring 46B and the third connection wiring 47B, which connect each second conductor pattern 92B to the main coil antenna 42B and the coupling coil antenna 43B, respectively. For example, the third connection wiring 47B of the eleventh embodiment can reduce the number of through electrodes by one compared to the third connection wiring 47A of the fifth embodiment (FIGS. 12 to 14). Reducing the number of through electrodes reduces the possibility of electrical connection failures due to improper processing of the through electrodes. In other words, it reduces the number of defective formations of the antenna resonant circuits 41B. This improves the yield of the card-type medium 1Q.

[0160] In the eleventh embodiment, as shown in FIG. 32 , for example, the second conductor pattern 92B constituting the capacitor 44B may be divided into multiple segments 92B1, and these multiple segments 92B1 may be electrically connected in parallel. In this case, the connection wiring (second connection wiring 46B, third connection wiring 47B) connecting each second conductor pattern 92B to the main coil antenna 42B and the coupling coil antenna 43B may branch so as to connect to each of the multiple segments 92B1. In FIG. 32 , each second conductor pattern 92B is divided into two segments, but it may also be divided into three or more segments. In FIG. 32 , both of the two second conductor patterns 92B constituting the capacitor 44B are divided into multiple segments, but, for example, only one of the second conductor patterns 92B may be divided into multiple segments. In the card-type medium 1Q-1 illustrated in FIG. 32 , the area of ​​the second conductor pattern 92B functioning as an electrode of the capacitor 44B can be easily changed by simply cutting the branched portions of the connection wiring (second connection wiring 46B, third connection wiring 47B). That is, the capacitance of the capacitor 44B can be easily adjusted.

[0161] In the eleventh embodiment, as shown in Figures 33 and 34, for example, two second conductor patterns 92B constituting a capacitor 44B may be located on the surface of the antenna sheet 40B. In this case, only the first insulating substrate 3B is interposed between the two second conductor patterns 92B constituting the capacitor 44B and the facing portion 23B. Therefore, in the card-type media 1Q-2 and 1Q-3 illustrated in Figures 33 and 34, the distance between the two second conductor patterns 92B and the facing portion 23B is smaller than in the card-type media 1Q illustrated in Figure 31, making it possible to ensure a larger capacitance in the capacitor 44B.

[0162] In the card-type medium 1Q-2 of Fig. 33, the main coil antenna 42B and the coupling coil antenna 43B are located on the back surface of the antenna sheet 40B. That is, similar to the card-type medium 1Q of Fig. 31, the main coil antenna 42B and the coupling coil antenna 43B are located on the surface of the antenna sheet 40B opposite to the two second conductor patterns 92B that form the capacitor 44B. Therefore, similar to the card-type medium 1Q of Fig. 31, it is possible to simply configure the second connection wiring 46B and the third connection wiring 47B (see Fig. 30) that connect each second conductor pattern 92B to the main coil antenna 42B and the coupling coil antenna 43B, respectively.

[0163] In the card-type medium 1Q-3 of FIG. 34, the main coil antenna 42B and the coupling coil antenna 43B are located on the surface of the antenna sheet 40B. That is, the main coil antenna 42B and the coupling coil antenna 43B are located on the same side of the antenna sheet 40B as the two second conductor patterns 92B that make up the capacitor 44B. In this configuration, the second connection wiring 46B and the third connection wiring 47B (see FIG. 30) that connect each second conductor pattern 92B to the main coil antenna 42B and the coupling coil antenna 43B, respectively, only need to have two through electrodes. This prevents the second connection wiring 46B and the third connection wiring 47B from interfering with the main coil antenna 42B and the coupling coil antenna 43B.

[0164] The configuration of the eleventh embodiment illustrated in Figures 30 to 33 may be applied to a card-type medium in which a first insulating substrate 3B and a metal layer 2B are stacked in this order in the thickness direction Z on the back surface of an antenna substrate 4B, similar to the fifth embodiment (Figure 13). Also, the configuration of the eleventh embodiment illustrated in Figures 30 to 33 may be applied to a card-type medium in which a first insulating substrate 3B and a metal layer 2B are stacked in this order in the thickness direction Z on both the front and back surfaces of an antenna substrate 4B, similar to the eighth embodiment (Figures 26 and 27).

[0165] <Twelfth Embodiment> A twelfth embodiment of the present invention will be described with reference to Figures 35 and 36. In the following description, components common to those already described will be assigned the same reference numerals and duplicated description will be omitted.

[0166] 35 , the card-type medium 1R of the twelfth embodiment has a metal layer 2B and an antenna resonant circuit 41B including a main coil antenna 42B, a coupling coil antenna 43B, and a capacitor 44B, similar to the tenth embodiment. Although not shown, the card-type medium 1R of the twelfth embodiment also has an antenna sheet that, together with the antenna resonant circuit 41B, constitutes an antenna substrate, similar to the fifth embodiment. The card-type medium 1R of the twelfth embodiment may also have an IC module, a first insulating substrate, a second insulating substrate, an oversheet, and the like, similar to the fifth embodiment.

[0167] In the twelfth embodiment, similarly to the fourth embodiment (FIGS. 7 and 9) and the tenth embodiment (FIG. 29), the main coil antenna 42B and the coupled coil antenna 43B are formed only on the surface of the antenna sheet. Furthermore, the main coil antenna 42B and the coupled coil antenna 43B are each formed by connecting multiple C-shaped turn portions in a spiral shape when viewed from the thickness direction Z. Furthermore, some turn portions of the main coil antenna 42B and the turn portions of the coupled coil antenna 43B are integrally formed. Some turn portions of the main coil antenna 42B and the turn portions of the coupled coil antenna 43B are connected by coil connection wiring 49B consisting of a conductor pattern formed on the surface of the antenna sheet. Multiple coil connection wiring 49B are present between the main coil antenna 42B and the coupled coil antenna 43B.

[0168] In the twelfth embodiment, the multiple coil connection wirings 49B are located close to one end of the coupled coil antenna 43B in the second linear direction Y. In Fig. 35 , the multiple coil connection wirings 49B are located close to one end (+Y side) of the coupled coil antenna 43B in the second linear direction Y. Note that in the fourth and tenth embodiments (Figs. 7, 9, and 29), the multiple coil connection wirings are located midway between the coupled coil antennas 23 and 43B in the second linear direction Y.

[0169] The capacitor 44B in the twelfth embodiment is a parallel plate capacitor sandwiching an antenna sheet. In the twelfth embodiment, one electrode of the capacitor 44B (second conductor pattern 92B) is connected to the inner peripheral end of the main coil antenna 42B via a connection wiring 46B including a through electrode 461B, similar to the capacitors 24 and 44B shown in Figures 9 and 29. The other electrode of the capacitor 44B (second conductor pattern 92B) is connected to the outer peripheral end of the main coil antenna 42B, or is formed adjacent to at least a part of the outermost turn portion of the coupling coil antenna 43B.

[0170] The capacitor 44B of the twelfth embodiment is formed inside the opening 21B of the metal layer 2B so as to surround the coupled coil antenna 43B when viewed from the thickness direction Z, similar to the capacitors 24 and 44B shown in FIGS. 9 and 29. However, in the twelfth embodiment, due to the positions of the multiple coil connection wirings 49B described above, the number of regions of the capacitors 44B arranged around the coupled coil antenna 43B when viewed from the thickness direction Z can be reduced compared to the capacitors 24 and 44B illustrated in FIGS. 9 and 29. Furthermore, the individual regions of the capacitors 44B arranged around the coupled coil antenna 43B can be enlarged. This point will be described below.

[0171] In both of the configurations illustrated in Figures 9 and 29, the multiple coil connection wirings are located midway between the coupled coil antennas 23, 43B in the second linear direction Y. Therefore, in the configurations illustrated in Figures 9 and 29, the number of regions of the capacitors 24, 44B arranged around the coupled coil antennas 23, 43B is three. The three regions of the capacitors 24, 44B include a first region adjacent to the other side (-X side) of the coupled coil antennas 23, 43B in the first linear direction X, and a second region and a third region adjacent to both sides of the multiple coil connection wirings in the second linear direction Y on one side (+X side) of the coupled coil antennas 23, 43B in the first linear direction X. In the configurations illustrated in Figures 9 and 29, the areas of the second and third regions of the capacitors 24, 44B as viewed in the thickness direction Z are small.

[0172] On the other hand, in the card-type medium 1R of the twelfth embodiment, the multiple coil connection wirings 49B are positioned close to one end of the coupling coil antenna 43B in the second linear direction Y. Therefore, in this card-type medium 1R, the number of regions of the capacitor 44B arranged around the coupling coil antenna 43B is two. The two regions of the capacitor 44B include a first region 441B adjacent to the other side (-X side) of the coupling coil antenna 43B in the first linear direction X, and a second region 442B adjacent to one side (+X side) of the coupling coil antenna 43B in the first linear direction X. When viewed from the thickness direction Z, the area of ​​the second region 442B of the capacitor 44B in the card-type medium 1R of the twelfth embodiment is larger than the areas of the second and third regions of the capacitors 24 and 44B in the configurations of FIGS. 9 and 29 .

[0173] The card-type medium 1R of the twelfth embodiment achieves the same effects as the fourth embodiment. Furthermore, in the card-type medium 1R of the twelfth embodiment, the multiple coil connection wirings 49B are positioned closer to one end of the coupled coil antenna 43B in the second linear direction Y. This reduces the number of capacitor 44B regions arranged around the coupled coil antenna 43B when viewed from the thickness direction Z of the card-type medium 1R. Furthermore, the area of ​​each capacitor 44B region arranged around the coupled coil antenna 43B can be increased. This improves the design freedom for the shape of the capacitors 44B located around the coupled coil antenna 43B, thereby enabling flexible adjustment of the step size of the fluctuation amount of the resonant frequency of the antenna resonant circuit 41B. This point will be described below.

[0174] As shown in Figures 35 and 36, when viewed from the thickness direction Z, the first region 441B and the second region 442B of the capacitor 44B are connected to each other via the third region 443B located on the other side (-Y side) of the coupled coil antenna 43B in the second linear direction Y. In the other electrode (second conductor pattern 92B) of the capacitor 44B, the first to third regions 441B to 443B are connected together. Meanwhile, in one electrode (second conductor pattern 92B) of the capacitor 44B, the first region 441B and the third region 443B are connected together, but the second region 442B is connected to the third region 443B via a bridge wiring 446B. Furthermore, in one electrode of the capacitor 44B, the second region 442B is divided into multiple segments 445B (two in the illustrated example). The multiple segments 445B of the second region 442B are connected to each other by the bridge wiring 446B. The bridge wiring 446B is a portion that does not overlap the other electrode of the capacitor 44B in the thickness direction Z and does not contribute to the capacitance of the capacitor 44B.

[0175] In the twelfth embodiment, as described above, a large area can be ensured for the second region 442B of the capacitor 44B, and therefore the area of ​​each divided body 445B of the second region 442B on one electrode of the capacitor 44B can also be set to be large. Alternatively, it is possible to set a larger number of divided bodies 445B of the second region 442B on one electrode of the capacitor 44B.

[0176] As a result, by appropriately setting the area of ​​each of the segments 445B on one electrode of the capacitor 44B and the number of segments 445B, the area of ​​one electrode of the capacitor 44B facing the other electrode of the capacitor 44B can be flexibly adjusted in accordance with the appropriate cutting of the bridge wiring 446B. The ability to flexibly adjust the area of ​​one electrode of the capacitor 44B makes it possible to flexibly adjust the step size of the amount of fluctuation in the resonant frequency of the antenna resonant circuit 41B.

[0177] In the card-type medium 1R of the twelfth embodiment, in one electrode (second conductor pattern 92B) of the capacitor 44B, the first region 441B may be divided into a plurality of segments, similar to the second region 442B, and these segments may be connected to each other by bridge wiring. In this configuration, it becomes possible to more flexibly adjust the step size of the amount of fluctuation of the resonant frequency in the antenna resonant circuit 41B.

[0178] <Thirteenth embodiment> A thirteenth embodiment of the present invention will be described with reference to Figures 37 to 39. In the following description, components common to those already described will be assigned the same reference numerals and duplicated description will be omitted.

[0179] As shown in Figures 37 to 39, the card-type medium 1S (1S-1, 1S-2, 1S-3) of the thirteenth embodiment has a metal layer 2B, an antenna resonant circuit 41B including a main coil antenna 42B, a coupling coil antenna 43B, and a capacitor 44B, and an IC module 7B, similar to the tenth embodiment (Figure 29). Although not shown, the card-type medium 1S of the thirteenth embodiment also has an antenna sheet that, together with the antenna resonant circuit 41B, constitutes an antenna substrate, similar to the fifth embodiment. The card-type medium 1S of the thirteenth embodiment may also have a first insulating substrate, a second insulating substrate, an oversheet, and the like, similar to the fifth embodiment.

[0180] In the card-type medium 1S of the thirteenth embodiment, the main coil antenna 42B, the coupling coil antenna 43B, and the capacitor 44B are configured by coated electrical wiring 93B installed only on the front or back surface (one of the main surfaces) of the antenna sheet. The coated electrical wiring 93B has a conductive wiring portion and an electrically insulating covering portion that covers the wiring portion. The wiring portion may be configured of, for example, copper or aluminum.

[0181] In the thirteenth embodiment, similarly to the fourth embodiment (FIGS. 7 and 9), the main coil antenna 42B and the coupled coil antenna 43B are each configured by connecting a plurality of C-shaped turn portions in a spiral shape when viewed from the thickness direction Z. Furthermore, some turn portions of the main coil antenna 42B and turn portions of the coupled coil antenna 43B are integrally formed. When viewed from the thickness direction Z, the shapes of the main coil antenna 42B and the coupled coil antenna 43B illustrated in FIGS. 37 to 39 are all the same as the shapes of the main coil antennas 22, 42B and the coupled coil antennas 23, 43B shown in FIGS. 9 and 29.

[0182] 37 to 39 are positioned so as to surround the coupling coil antenna 43 B. Note that the capacitor 44 B in the thirteenth embodiment may be positioned so as to avoid at least the center of the region inside the main coil antenna 42 B when viewed from the thickness direction Z.

[0183] The capacitor 44B in the card-type medium 1S-1 of the first example shown in FIG. 37 is composed of two coated electrical wires 93B. These two coated electrical wires 93B are each formed in a meandering shape and are positioned at a distance from each other. As a result, the two coated electrical wires 93B function as the capacitor 44B. Specifically, the two coated electrical wires 93B that make up the capacitor 44B each advance in the first linear direction X while meandering in the second linear direction Y. Furthermore, these two coated electrical wires 93B are positioned at a distance from each other in the second linear direction Y. The coupling coil antenna 43B and the coil connection wiring 49B are positioned between these two coated electrical wires 93B.

[0184] Furthermore, in the first example card-type medium 1S-1, the antenna resonant circuit 41B, which includes the main coil antenna 42B, the coupling coil antenna 43B, and the capacitor 44B, is configured using a single sheathed electrical wiring 93B. Both ends 93B1, 93B2 of the single sheathed electrical wiring 93B correspond to the tips of the two sheathed electrical wirings 93B that make up the capacitor 44B. Of the single sheathed electrical wiring 93B that makes up the antenna resonant circuit 41B, a portion that serves as a connection wiring 46B extending from the inner peripheral end of the main coil antenna 42B to the capacitor 44B intersects with the main coil antenna 42B. Because the main coil antenna 42B and the connection wiring 46B are configured using the sheathed electrical wiring 93B that has a sheathed portion, even if the connection wiring 46B intersects with the main coil antenna 42B, the antenna resonant circuit 41B is not short-circuited.

[0185] The capacitor 44B in the card-type medium 1S-2 of the second example shown in FIG. 38 is composed of one coated electrical wiring 93B. The coated electrical wiring 93B constituting the capacitor 44B is formed in a meander shape. As a result, the coated electrical wiring 93B functions as the capacitor 44B. Specifically, the coated electrical wiring 93B constituting the capacitor 44B forms two meander portions 44B1 that snake in the second linear direction Y and advance in the first linear direction X. These two meander portions 44B1 are positioned with a gap between them in the second linear direction Y. The coupling coil antenna 43B and the coil connection wiring 49B are positioned between these two meander portions 44B1. The first ends of the two meander portions 44B1 are connected to each other.

[0186] In the card-type medium 1S-2 of the second example, similar to the card-type medium 1S-1 of the first example, the antenna resonant circuit 41B, which includes the main coil antenna 42B, the coupling coil antenna 43B, and the capacitor 44B, is configured by a single sheathed electrical wire 93B. A first end 93B1 of the single sheathed electrical wire 93B corresponds to the tip of the single sheathed electrical wire 93B that constitutes the capacitor 44B. Furthermore, a second end 93B2 of the single sheathed electrical wire 93B corresponds to the inner peripheral end of the main coil antenna 42B. Therefore, the sheathed electrical wires 93B that constitute the antenna resonant circuit 41B do not cross each other.

[0187] 39, the capacitor 44B in the card-type medium 1S-3 of the third example is composed of two coated electrical wirings 93B, similar to the capacitor 44B in the card-type medium 1S-1 of the first example. Each coated electrical wiring 93B comprises a meander portion 44B2 formed in a meander shape and a spiral portion 44B3 formed in a spiral shape and connected to the meander portion 44B2.

[0188] The meander portions 44B2 of the two coated electrical wirings 93B are positioned with a gap in the second linear direction Y. The coupling coil antenna 43B and the coil connection wiring 49B are positioned between these two meander portions 44B2. The spiral portions 44B3 of the two coated electrical wirings 93B are arranged parallel to each other with a gap in between. The shape of each spiral portion 44B3 when viewed from the thickness direction Z is triangular, but may be any shape, such as rectangular or circular.

[0189] In the card-type medium 1S-3 of the third example, similar to the card-type medium 1S-1 of the first example, the antenna resonant circuit 41B is configured with a single coated electrical wiring 93B. Also, similar to the card-type medium 1S-1 of the first example, both ends 93B1, 93B2 of the single coated electrical wiring 93B correspond to the tips of the two coated electrical wirings 93B that make up the capacitor 44B. Furthermore, similar to the card-type medium 1S-1 of the first example, the portion of the single coated electrical wiring 93B that serves as the connection wiring 46B extending from the inner peripheral end of the main coil antenna 42B to the capacitor 44B intersects with the main coil antenna 42B.

[0190] The card-type medium 1S of the thirteenth embodiment achieves the same effects as the sixth embodiment. That is, even in the card-type medium 1S of the thirteenth embodiment in which the capacitor 44B is located inside the opening 21B of the metal layer 2B, the main coil antenna 42B, the coupling coil antenna 43B, and the capacitor 44B are configured with coated electrical wiring 93B installed on the front or back surface (one of the main surfaces) of the antenna sheet. This makes it easier to manufacture the antenna substrate 4B compared to the first to fourth embodiments in which the main coil antenna 42B, the coupling coil antenna 43B, and the capacitor 44B located only inside the opening 21B are configured with conductor patterns.

[0191] Configuring the main coil antenna 42B, the coupling coil antenna 43B, and the capacitor 44B using coated electrical wiring 93B in this manner is also effective in the ninth and tenth embodiments in which a plurality of capacitors 44B are electrically connected in parallel, and in the tenth embodiment in which the capacitor 44B is located both inside and outside the opening 21B.

[0192] In the thirteenth embodiment, the capacitor 44B is not limited to being configured by the coated electrical wiring 93B, and may be, for example, a capacitive element (such as a film capacitor or a ceramic capacitor) as in the seventh embodiment. Similarly, in the ninth and tenth embodiments in which the main coil antenna 42B and the coupling coil antenna 43B are configured by the coated electrical wiring 93B, the capacitor 44B may also be a capacitive element.

[0193] In the thirteenth embodiment, a capacitor 44B formed by coated electrical wiring 93B may be located outside the opening 21B of the metal layer 2B in a plan view seen from the thickness direction Z, as shown in FIG. 40 , for example. In FIG. 40 , the capacitor 44B includes two coated electrical wirings 93B (93B-1, 93B-2). Similar to the eleventh embodiment ( FIGS. 30 to 34 ), these two coated electrical wirings 93B are each located outside the opening 21B of the metal layer 2B in a plan view seen from the thickness direction Z, and are spaced apart from the metal layer 2B in the thickness direction Z. In FIG. 40 , the two coated electrical wirings 93B forming the capacitor 44B are each formed in a meander shape in a plan view seen from the thickness direction Z, but may also be formed in a spiral shape, for example.

[0194] As in the eleventh embodiment, the capacitor 44B in the card-type medium 1S-4 illustrated in FIG. 40 is configured by electrically connecting two capacitor portions 44B4, 44B5 (first capacitor portion 44B4 and second capacitor portion 44B5) in series. The first capacitor portion 44B4 consists of one coated electrical wiring 93B-1 and a first opposing portion 23B1 of the metal layer 2B that faces the coated electrical wiring 93B-1. The second capacitor portion 44B5 consists of the other coated electrical wiring 93B-2 and a second opposing portion 23B2 of the metal layer 2B that faces the other coated electrical wiring 93B-2. The capacitor 44B in the card-type medium 1S-4 in FIG. 40 is configured by electrically connecting the first capacitor portion 44B4 and the second capacitor portion 44B5 in series at the other portion of the metal layer 2B excluding the first and second opposing portions 23B1, 23B2. That is, the capacitor 44B in FIG. 40 is configured in the same manner as in the eleventh embodiment.

[0195] In the card-type medium 1S-4 illustrated in FIG. 40 , similar to the card-type medium 1S-1 of the first example, the antenna resonant circuit 41B is configured with a single coated electrical wiring 93B. Furthermore, both ends 93B1, 93B2 of the single coated electrical wiring 93B correspond to the tips of the two coated electrical wirings 93B (93B-1, 93B-2) that configure the first and second capacitor portions 44B4, 44B5. Furthermore, of the single coated electrical wiring 93B, a portion serving as a connection wiring 46B extending from the inner peripheral end of the main coil antenna 42B to the first capacitor portion 44B4 intersects with the main coil antenna 42B. Meanwhile, a portion serving as another connection wiring 47B extending from the outer peripheral end of the main coil antenna 42B to the second capacitor portion 44B5 does not intersect with the main coil antenna 42B, the coupling coil antenna 43B, or the coil connection wiring 49B.

[0196] In the thirteenth embodiment, the coated electrical wiring 93B constituting the capacitor 44B may be formed in a spiral shape so as to follow the coated electrical wiring 93B constituting the spirally formed main coil antenna 42B in a plan view seen in the thickness direction Z, as shown in Fig. 41 . In Fig. 41 , the coated electrical wiring 93B constituting the capacitor 44B is indicated by a black line, and the coated electrical wiring 93B constituting the main coil antenna 42B is indicated by a white line. As shown in the example of Fig. 41 , at least a portion of the coated electrical wiring 93B constituting the capacitor 44B may extend between the wires of the coated electrical wiring 93B constituting the spirally formed main coil antenna 42B.

[0197] More specifically, the coated electrical wiring 93B constituting the capacitor 44B includes a first turn portion 931B, a second turn portion 932B, and a connection wiring 933B. The first turn portion 931B of the capacitor 44B extends along the innermost turn portion of the main coil antenna 42B, inside the innermost turn portion of the main coil antenna 42B. The second turn portion 932B of the capacitor 44B extends along the two turn portions spaced apart in the radial direction on the inner periphery of the main coil antenna 42B, between the two turn portions. The connection wiring 933B of the capacitor 44B connects the end of the first turn portion 931B and the end of the second turn portion 932B. This forms the coated electrical wiring 93B constituting the capacitor 44B in a spiral shape. Note that although the connection wiring 933B of the capacitor 44B intersects with some of the turn portions of the main coil antenna 42B, it is not electrically short-circuited because it is formed by the coated electrical wiring 93B.

[0198] A plurality of sheathed electrical wires 93B formed in a spiral shape and constituting the capacitor 44B are arranged at intervals in the radial direction of the main coil antenna 42B. In Fig. 41 , a first turn portion 931B and a second turn portion 932B of the capacitor 44B made of the sheathed electrical wire 93B are arranged at intervals in the radial direction. As a result, the sheathed electrical wire 93B constituting the capacitor 44B functions as the capacitor 44B.

[0199] In the card-type medium 1S-5 illustrated in Figure 41, an antenna resonant circuit 41B including a main coil antenna 42B, a coupling coil antenna 43B, and a capacitor 44B is configured with a single coated electrical wiring 93B. A first end 93B1 of the coated electrical wiring 93B corresponds to the inner peripheral end of the main coil antenna 42B. A second end 93B2 of the coated electrical wiring 93B corresponds to the inner peripheral end of the spirally formed capacitor 44B. Of the coated electrical wiring 93B constituting the antenna resonant circuit 41B, a portion serving as a connecting wiring 46B extending from the outer peripheral end of the main coil antenna 42B to the outer peripheral end of the capacitor 44B intersects with the main coil antenna 42B.

[0200] In the card-type medium 1S-5 shown in FIG. 41, a capacitor 44B is located inside an opening 21B in a metal layer 2B, similar to the first to third examples described above.

[0201] In the card-type medium 1S-5 shown in Figure 41, the coated electrical wiring 93B that constitutes the capacitor 44B is formed in a spiral shape so as to follow the spirally formed main coil antenna 42B. Therefore, there is no need to secure an area for installing the capacitor 44B in an area separate from the main coil antenna 42B, etc. This allows the card-type medium 1S-5 to be made smaller.

[0202] The above-described ninth to thirteenth embodiments are also applicable to the first to eighth embodiments.

[0203] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments and can be modified as appropriate within the scope of the invention.

[0204] According to the present invention, it is possible to provide a card-type medium that can suppress a decrease in communication performance of contactless communication.

[0205] DESCRIPTION OF SYMBOLS 1, 1C, 1D, 1E, 1F, 1G, 1H, 1I, 1J, 1K, 1L, 1M, 1N, 1O, 1P, 1Q, 1Q-1, 1Q-2, 1Q-3, 1R, 1S, 1S-1, 1S-2, 1S-3, 1S-4, 1S-5 Card-type medium 2 Antenna substrate 3 IC module 4 Metal layer 5 First insulating substrate 20 Antenna sheet 21 Antenna resonant circuit 22 Main coil antenna (coil antenna) 23 Coupling coil antenna (coil antenna) 24 Capacitor 28 Second through electrode (through electrode) 31 Contact terminal 41 Opening 42 Slot 91 First conductor pattern 92 Second conductor pattern 92-1 First side of second conductor pattern 92 92-2 Second side of second conductor pattern 92 223 Central axis 231 First through electrode (through electrode) 2A Metal plate (metal layer) 3A First insulating substrate (insulating substrate) 4A Antenna substrate 7A IC module 21A Opening 22A Slot 40A Antenna sheet 41A Antenna resonant circuit 42A Main coil antenna (coil antenna) 43A Coupled coil antenna (coil antenna) 44A Capacitor 71A Contact terminal 91A First conductor pattern 92A Second conductor pattern 93A Covered electrical wiring 2B Metal layer (metal plate) 3B First insulating substrate (insulating substrate) 4B Antenna substrate 7B IC module 21B Opening 22B Slot 40B Antenna sheet 41B Antenna resonant circuit 42B Main coil antenna (coil antenna) 43B Coupled coil antenna (coil antenna) 44B Capacitor 91B First conductor pattern 92B Second conductor pattern 93B Covered electrical wiring X First linear direction Y Second linear direction Z thickness direction

Claims

1. A card-type medium comprising an antenna substrate, the antenna substrate having an antenna resonant circuit including a coil antenna and a capacitor connected to the coil antenna, the capacitor being positioned away from the center of the inner region of the coil antenna when viewed in the thickness direction of the antenna substrate.

2. A card-type medium as described in claim 1, comprising an IC module having contact terminals for contacting an external device, wherein the antenna substrate has an antenna sheet having electrical insulation, wherein the coil antenna includes a main coil antenna for contactless communication with the external device and a coupled coil antenna connected to the main coil antenna for electromagnetic coupling with the IC module, wherein the capacitor is connected to the main coil antenna and the coupled coil antenna, wherein the main coil antenna and the coupled coil antenna are made of a first conductor pattern formed on at least one main surface of the antenna sheet, and wherein the capacitor is made of two second conductor patterns formed on both main surfaces of the antenna sheet and sandwiching the antenna sheet, and wherein the capacitor is located away from the center of the inner area of ​​the main coil antenna when viewed in the thickness direction of the antenna substrate.

3. The card-type medium according to claim 2, wherein the capacitor is located outside the main coil antenna when viewed in the thickness direction.

4. The card-type medium according to claim 2 or claim 3, wherein the main coil antenna and the coupled coil antenna are each formed by connecting a plurality of C-shaped turn portions made of the first conductor pattern in a spiral shape, and at least the turn portions located on the outer periphery of the main coil antenna and at least some of the turn portions of the coupled coil antenna are integrally formed.

5. A card-type medium according to claim 2 or claim 3, wherein the main coil antenna and the coupled coil antenna are each formed by connecting a plurality of C-shaped turn portions made of the first conductor pattern in a spiral shape, and the number of turn portions of the coupled coil antenna is equal to or less than the number of turn portions of the main coil antenna.

6. A card-type medium according to claim 2 or claim 3, wherein the coupled coil antenna is formed by connecting a plurality of C-shaped turn portions made of the first conductor pattern in a spiral shape, and when viewed from the thickness direction, the capacitor and the through electrode that penetrates the antenna sheet to form the antenna resonant circuit are not arranged inside each turn portion of the coupled coil antenna.

7. A card-type medium as described in claim 3, wherein the main coil antenna is formed on one main surface of the antenna sheet, and a through electrode is formed inside the main coil antenna, penetrating the antenna sheet to electrically connect the inner circumferential end of the main coil antenna to the second conductor pattern of the capacitor formed on the other main surface of the antenna sheet.

8. The card-type medium according to claim 7, wherein the outer peripheral edge of the main coil antenna is joined to the second conductor pattern formed on the one main surface of the capacitor.

9. A card-type medium as described in claim 2, wherein the outer peripheral end of the main coil antenna is joined to a through electrode that penetrates the antenna sheet, and the inner peripheral end of the main coil antenna is joined to one of the second conductor patterns of the capacitor.

10. A card-type medium as described in claim 2 or claim 3, wherein the second conductor pattern of one of the capacitors is formed integrally with at least a portion of the outermost turn portion of the coupled coil antenna, or is formed adjacent to at least a portion of the outermost turn portion of the coupled coil antenna.

11. A card-type medium as described in claim 10, wherein the portion of the second conductor pattern of one of the capacitors formed integrally with or adjacent to a portion of the outermost turn portion of the coupled coil antenna corresponds to at least 1 / 4 of the circumference of the outermost turn portion of the coupled coil antenna in the circumferential direction of the coupled coil antenna.

12. A card-type medium as described in claim 2 or claim 3, wherein the second conductor pattern on one side of the capacitor is formed integrally with at least a portion of the outermost turn portion of the main coil antenna, or is formed adjacent to at least a portion of the outermost turn portion of the main coil antenna.

13. A card-type medium as described in claim 2 or claim 3, wherein the second conductor pattern of one of the capacitors is formed integrally with at least a portion of the innermost turn portion of the main coil antenna, or is formed adjacent to at least a portion of the innermost turn portion of the main coil antenna.

14. A card-type medium as described in claim 2 or claim 3, further comprising a metal layer having an opening penetrating in the thickness direction, the metal layer having a slot that opens the opening to an edge of the metal layer, and the antenna resonant circuit being located inside the opening when viewed in the thickness direction.

15. A card-type medium according to claim 2 or 3, wherein the thickness of the antenna sheet is 35 μm or less.

16. A card-type medium as described in claim 1, which is constructed by stacking a metal plate made of metal, an insulating substrate having electrical insulation properties, and the antenna substrate in that order, wherein the metal plate has an opening penetrating through it in the thickness direction and a slot that opens the opening to the edge of the metal plate, and in a plan view seen from the thickness direction, the coil antenna is located inside the opening and the capacitor overlaps with the metal plate so as to be located outside the opening.

17. A card-type medium as described in claim 16, wherein the antenna substrate has an antenna sheet having electrical insulation properties, the coil antenna is composed of a first conductor pattern formed on at least one main surface of the antenna sheet, and the capacitor is composed of two second conductor patterns formed on both main surfaces of the antenna sheet and sandwiching the antenna sheet.

18. A card-type medium as described in claim 16, wherein the antenna substrate has an antenna sheet having electrical insulation properties, and the coil antenna is made of coated electrical wiring installed on one main surface of the antenna sheet.

19. The card-type medium according to claim 18, wherein the capacitor is made of the coated electrical wiring.

20. A card-type medium according to any one of claims 16 to 19, wherein the insulating substrate and the metal plate are laminated in this order on both main surfaces of the antenna substrate.

21. A card-type medium as described in any one of claims 16 to 19, further comprising an IC module having a contact terminal for contacting an external device, wherein the coil antenna includes a main coil antenna for contactless communication with the external device and a coupling coil antenna connected to the main coil antenna for electromagnetically coupling with the IC module.

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