Voice recognition device

Abstract

A voice recognition device is disclosed. The voice recognition device may comprise a case, a speaker module, a PCB module, and a waveguide, wherein the speaker module, the PCB module, and the waveguide are fastened to a case cover by a same fastening member. Accordingly, as multiple components are fastened to the case by the same fastening member, the number of fastening members can be reduced, and manufacturing costs can be reduced by reducing the number of assembly processes for the voice recognition device. In addition, aesthetic appearance can be enhanced by preventing the fastening member from being exposed to the outside.

Description

voice recognition device

[0001] The present invention relates to a voice recognition device, and more particularly, to a voice recognition device that can effectively inform a user of various information according to a voice recognition processing process.

[0002] A voice recognition device is a device that performs voice recognition functions and is used to remotely control home appliances such as air conditioners, washing machines, and vacuum cleaners used in homes or offices.

[0003] Typically, home appliances are equipped with individual control buttons on their respective units or with separate remote controls. In the former case, users must approach each appliance and press the corresponding control button to operate it. In the latter case, while users can control the appliance remotely, they still have to use the remote control's control keys, which can be inconvenient. This can be particularly problematic in dark environments, requiring separate lighting.

[0004] Recently, research on controlling home appliances using voice recognition technology has been increasing to resolve such inconveniences. For example, Korean Patent Laid-Open Publication No. 10-1999-00069703 discloses a voice recognition device, which is a remote control for an air conditioner equipped with a voice input unit and a signal processing unit, and which generates and transmits an operation signal based on voice recognition. In addition, Korean Patent Laid-Open Publication No. 10-2006-0015092 discloses a voice recognition device that converts an input voice signal into a digital signal and text, then checks for the presence of a matching control command in a database, and controls each device within the air conditioner immediately based on the presence of a control command, or extracts keywords and controls each device within the air conditioner based on the linked control command.

[0005] However, the conventional voice recognition device as described above may increase manufacturing costs due to the large number of fastening members and / or assembly work required as it is a small product and many parts are assembled inside the case.

[0006] In addition, conventional voice recognition devices may have poor reliability due to the lack of solid assembly between parts as they are assembled from a large number of small parts.

[0007] In addition, in conventional voice recognition devices, some fastening members for assembling parts are exposed to the outside of the case, which may reduce the aesthetic appeal.

[0008] The purpose of the present invention is to provide a voice recognition device that is a small product and has a plurality of parts assembled inside the case, while simplifying the assembly work by reducing the number of fasteners and / or assembly work.

[0009] Another object of the present invention is to provide a voice recognition device that can increase the reliability of a product by assembling a large number of small parts while making the assembly between the parts solid.

[0010] Another object of the present invention is to provide a voice recognition device that can improve aesthetics by minimizing fastening members for assembling parts or preventing them from being exposed to the outside of the case.

[0011] To achieve the object of the present invention, a voice recognition device including a case, a speaker module, a PCB module, and a waveguide may be provided. The case may include a case body having at least one open end among both ends, and a case cover covering the open end of the case body. The speaker module may be accommodated in the case body. The PCB module may be provided on one side of the speaker module and accommodated in the case body. The waveguide may be provided between the speaker module and the PCB module and accommodated in the case body. The speaker module, the PCB module, and the waveguide may be fastened to the case cover by the same fastening member. Through this, since a plurality of components are fastened to the case by the same fastening member, the number of fastening members can be reduced, and the assembly work for the voice recognition device can be reduced, thereby reducing manufacturing costs. In addition, the fastening member can be prevented from being exposed to the outside, thereby enhancing aesthetics.

[0012] For example, the case body may be opened at both ends, and the ends of the case body may be covered by a first case cover and a second case cover, respectively. The first case cover may be coupled to the case body by the same fastening member as the speaker module, the PCB module, and the waveguide. This allows for easy assembly of the speaker module, the PCB module, and the waveguide, while reducing the number of fastening members, thereby lowering manufacturing costs and enhancing aesthetics.

[0013] For example, a first fastening protrusion may be formed on the inner surface of the case body to support the head of the fastening member, a second fastening protrusion may be formed on the outer surface of the speaker module to be in axial contact with the first fastening protrusion, and a first fastening boss may be formed on one side of the first case cover to extend toward the speaker module and penetrate the PCB module and the waveguide. The first fastening boss may be formed to be in axial contact with the second fastening protrusion on the opposite side of the first fastening protrusion. Through this, the case body, the first case cover, the speaker module, the waveguide, and the PCB module can be assembled at once, thereby reducing the number of assembly parts and the assembly time.

[0014] Specifically, a first fastening hole may be formed in the first fastening protrusion so that the fastening member passes through it, a second fastening hole may be formed in the second fastening protrusion so that the fastening member passes through it, and a boss receiving hole may be formed in the PCB module and the waveguide so that the first fastening boss passes through it, respectively. The first fastening hole of the case body, the second fastening hole of the speaker module, and the respective boss receiving holes of the PCB module and the waveguide may be formed on the same axis as the fastening groove of the first fastening boss. Through this, the first case cover may be screw-fastened to the case body using the same fastening member while placing the waveguide and the PCB module, which will be described later, between the speaker module.

[0015] Specifically, a boss support rib may be formed on one side of the speaker module facing the waveguide so that the tip of the first fastening boss is inserted and supported. Through this, when the first fastening boss is pressed against the speaker module, the tip of the first fastening boss is inserted into the boss support rib, thereby improving the bonding strength with the speaker module.

[0016] In addition, the boss support rib may be formed in a circular shape or in an arc shape cut lengthwise. This allows for easy manufacturing of the boss support rib while improving the bonding strength to the first fastening boss, or for the boss support rib to be flexibly changed during assembly of the first fastening boss, thereby securing tolerance for processing errors and / or assembly errors.

[0017] For example, a radially extending support protrusion may be formed on the inner surface of the case body. The PCB module and the waveguide may be supported by one side of the first case cover and one side of the support protrusion facing it. Through this, the waveguide and the PCB module may be placed on the support protrusion and supported in the axial direction, thereby securing a wide sound wave output space between the speaker module and the waveguide.

[0018] Specifically, a sealing protrusion that is inserted into the case body may be formed on one side of the first case cover. The front end of the sealing protrusion may be formed to face one side of the support protrusion. Through this, when the case body and the first case cover are assembled, the sealing protrusion is closely attached to the upper inner surface of the case body, thereby improving the sealing force between the case body and the first case cover.

[0019] In addition, the speaker module may include a speaker body and a bracket assembly in which the speaker body is connected at the center and the edge is connected to the case. A first fastening member receiving groove may be formed to be sunken in an outer circumferential surface of the bracket assembly so as to receive the fastening member. The second fastening protrusion may extend to an inner circumferential surface of the first fastening member receiving groove. Through this, both side surfaces of the second fastening protrusion may be in close contact with the first fastening protrusion of the case body and the front end surface of the first fastening boss, respectively, so that the case body and the first case cover may be firmly connected.

[0020] Specifically, the first fastening member receiving groove may extend along both sides of the bracket assembly. The second fastening protrusion may be formed with a step at one end of the first fastening member receiving groove, which faces the waveguide. This allows the speaker module to be firmly assembled to the case while minimizing the length of the first fastening member.

[0021] As another example, the case body may be extended as a single body and sealed at one end, and the other end of the case body may be opened and covered by the case cover. The speaker module, the PCB module, and the waveguide may be connected to the case body by the same fastening member. This reduces the number of parts and / or assembly work on one side of the case body, thereby further reducing assembly costs and further improving aesthetics.

[0022] For example, a first fastening boss extending toward the speaker module may be formed at one end of the case body. The first fastening boss may be fastened to the speaker module by penetrating the PCB module and the waveguide. This allows the case body, speaker module, waveguide, and PCB module to be assembled at once, thereby reducing the number of assembly parts and the assembly time.

[0023] As another example, the case cover may be interlocked with the case body or the speaker module facing it. This reduces the number of parts required to assemble the case cover to the case body, while simplifying the assembly process for the case cover.

[0024] For example, a first hook portion may be formed on the case cover, and a second hook portion may be formed on one side of the speaker module facing the case cover or on the other end of the case body to engage and connect with the first hook portion. This not only makes it easy to assemble the case cover to the case body, but also enhances the aesthetic appeal of the case.

[0025] A voice recognition device according to the present invention comprises a case, a speaker module, a PCB module, and a waveguide, wherein the speaker module, the PCB module, and the waveguide can be fastened to the case cover by the same fastening member. This reduces the number of fastening members by fastening multiple components to the case by the same fastening member, thereby reducing the assembly work for the voice recognition device and thus reducing manufacturing costs. In addition, the fastening members can be prevented from being exposed to the outside, thereby enhancing aesthetic appeal.

[0026] According to the present invention, a voice recognition device has a case body that is open at both ends, and the case body is covered by a first case cover and a second case cover, respectively, and the first case cover can be connected to the case body by the same fastening member as the speaker module, the PCB module, and the waveguide. This allows for easy assembly of the speaker module, the PCB module, and the waveguide, while reducing the number of fastening members, thereby lowering manufacturing costs and enhancing aesthetics.

[0027] In the voice recognition device according to the present invention, one end of the case body is extended as a single body and sealed, the other end of the case body is open and covered by a case cover, and the speaker module, the PCB module, and the waveguide can be joined to the case body by the same fastening member. This reduces the number of parts and / or assembly work on one side of the case body, thereby further reducing assembly costs and further improving aesthetics.

[0028] The voice recognition device according to the present invention can be interlocked with the case cover and connected to the case body or speaker module facing it. This reduces the number of parts required to assemble the case cover to the case body, while simplifying the assembly process for the case cover.

[0029] Fig. 1 is a perspective view of a voice recognition device according to the present embodiment, taken from one side.

[0030] Fig. 2 is a perspective view of the voice recognition device according to the present embodiment, taken from the other side.

[0031] Fig. 3 is a perspective view of a part of a voice recognition device according to the present embodiment, broken and disassembled.

[0032] Figure 4 is an assembly cross-sectional view of Figure 3.

[0033] Figure 5 is a cross-sectional view taken along the line “Ⅴ-Ⅴ” of Figure 4.

[0034] Fig. 6 is a perspective view of the second case cover of the voice recognition device according to the present embodiment, disassembled.

[0035] Figure 7 is an assembly cross-sectional view of Figure 6.

[0036] Fig. 8 is a perspective view showing the waveguide and the PCB module in the voice recognition device according to the present embodiment disassembled from the first case cover.

[0037] Fig. 9 is a plan view showing a voice recognition device according to the present embodiment in a broken state.

[0038] Figure 10 is a cross-sectional view taken along the line “Ⅹ-Ⅹ” of Figure 9.

[0039] Fig. 11 is a cross-sectional view taken along line “XI-XI” of Fig. 9.

[0040] Fig. 12 is an exploded perspective view of another embodiment of a voice recognition device.

[0041] Figure 13 is an assembly cross-sectional view of Figure 12.

[0042] Figure 14 is a cross-sectional view taken along the line “XIV-XIV” of Figure 13.

[0043] Hereinafter, a voice recognition device according to the present invention will be described in detail based on an embodiment illustrated in the attached drawings. In the following description, the longitudinal direction of the case is referred to as the axial direction, and the direction intersecting the axial direction is defined as the radial direction. Furthermore, the direction in which voice is output from the speaker is defined as the front or upper side, and the opposite side is defined as the rear or lower side.

[0044] Typically, a network system is a collection of devices that communicate with each other within a specific space, such as a home or office, forming a network. An example of such a network system is a voice recognition device (Hub) for a communication network with voice output capabilities, but it is not necessarily limited to this. Depending on the perspective, a network system could also be defined as a voice output device.

[0045] For example, a network system may include an accessory, a gateway, an access point, and a voice recognition device (or voice output device).

[0046] Accessories, gateways, access points, and / or voice recognition devices can communicate with each other according to established communication protocols, and such communication can be based on technologies such as Wi-Fi, Ethernet, Zigbee, Z-wave, and Bluetooth.

[0047] Accessories can be installed anywhere the user desires and can be equipped with various sensors, such as temperature sensors, humidity sensors, vibration sensors, proximity sensors, and infrared (IR) sensors. Information acquired by these sensors can be transmitted to a voice recognition device via a network. Conversely, signals for controlling the aforementioned sensors can also be transmitted from the voice recognition device to the accessories.

[0048] Additionally, the accessory may be configured to enable remote control of nearby home appliances. For example, the accessory may include a transmitter that emits an infrared signal in response to a control signal transmitted over a network.

[0049] A gateway is a device that connects networks with different protocols, enabling them to exchange information. For example, accessories and voice recognition devices can communicate directly in the manner described above.

[0050] An access point is a device that relays wireless devices to the network, connecting the home network to the Internet. Appliances, voice recognition devices, accessories, and more can connect to the access point via wired (e.g., Ethernet) or wireless (e.g., Wi-Fi).

[0051] For example, a home network system can connect to the Internet via an access point, which can then connect to a server that provides services via the Internet. The server (or cloud) may be managed by the manufacturer of the accessory and / or voice recognition device, the seller of the accessory, or a service provider contracted with the manufacturer or seller. The server stores software and data, which may be received from the home network. Upon request from the voice recognition device, the server can transmit the stored software or data to the home network via the Internet.

[0052] The server can also exchange information with mobile terminals, such as personal computers (PCs) and smartphones, connected to the Internet. Information transmitted from voice recognition devices or accessories can be stored on the server and then transmitted to mobile terminals connected to the server. Furthermore, information transmitted from mobile terminals can also be transmitted to voice recognition devices or accessories via the server. Therefore, controlling voice recognition devices or accessories via mobile terminals is also possible.

[0053] Communication between voice recognition devices and accessories can occur via gateways and access points. For example, signals (or information) output from an accessory can be transmitted to the voice recognition device via the gateway and access point, respectively. Conversely, information output from the voice recognition device can be transmitted to the accessory via the access point and gateway, respectively.

[0054] In addition to the accessories described above, various other accessories may be provided. For example, accessories may include air quality sensors, smart plugs, CT sensors, nest thermostats, and sleep sensors.

[0055] Accessories can be attached to home appliances. For example, an accessory equipped with a vibration sensor can be attached to a washing machine to detect vibrations generated during operation. Based on the detected vibration, a signal from the vibration sensor can be transmitted to the network.

[0056] Accessories can also be attached to locations other than home appliances. For example, to detect the opening and closing of a door in a home, an accessory equipped with a motion sensor (e.g., an infrared sensor) can be attached to a wall to detect the door opening and closing.

[0057] A voice recognition device may include a microphone. In this case, commands can be extracted from voice input via the microphone and control performed based on the commands, depending on the built-in voice recognition program. The following describes an example of a voice recognition device equipped with a microphone and speaker, but the device is not limited to a microphone and / or speaker.

[0058] Referring to FIGS. 1 and 2, a voice recognition device (or voice hub) according to the present embodiment may include a case (110), a microphone (120), a speaker module (130), a waveguide (140), a PCB module (150), and a lighting module (160). The case (110) is a member forming the exterior of the voice recognition device, the microphone (120) is a member that receives voice input from the outside, the speaker module (130) is a member that outputs sound waves to the outside, the waveguide (140) is a member that radially guides sound waves output from the speaker module (130), the PCB module (150) is a member that processes voice data received through the microphone (120) and controls sound waves to be output through the speaker module (130), and the lighting module (160) is a member that emits light to the outside of the case (110). Among these, since the microphone (120) is integrally mounted to the PCB module (150), from the perspective of assembly between the components, the microphone (120) can be understood as a part of the PCB module (150), and below, the microphone (120) will be described together with the PCB module (150). These speaker module (130), waveguide (140), PCB module (150), and lighting module (160) are all assembled into a case (110) to form a single product.

[0059] Referring to FIGS. 1 and 2, a case (110) according to the present embodiment may include a case body (111), a first case cover (112), and a second case cover (113). The case body (111) is a member that accommodates a speaker module (130), a waveguide (140), and a PCB module (150), the first case cover (112) is a member that covers the upper part of the case body (111), and the second case cover (113) is a member that covers the lower part of the case body (111).

[0060] The case body (111) may be formed in a cylindrical shape with both ends open. For example, the case body (111) may be formed in a cylindrical shape, and a plurality of sound wave output holes (111a) may be formed along the circumferential direction around the upper portion of the case body (111). Accordingly, sound waves generated in the speaker module (130) described later may be radially dispersed through the waveguide (140) described later and evenly output in all directions through the plurality of sound wave output holes (111a).

[0061] In this case, the plurality of sound wave output holes (111a) are covered by a dust-proof cloth (1115) that is fused to cover the case body (111). Accordingly, external foreign substances such as dust can be prevented from entering the interior of the case (110).

[0062] In addition, a supporting projection (1111) may be formed on the inner surface of the case body (111) to axially support the speaker module (more precisely, the bracket assembly to be described later) (130), the waveguide (140), and the PCB module (more precisely, the PCB board) (150), respectively. For example, the supporting projection (1111) may be formed in a ring shape at a position that protrudes radially toward the center from the inner surface of the case body (111), and is spaced apart by a preset interval between both ends of the inner surface of the case body (111). Accordingly, a supporting surface (1111a) is formed stepwise on the upper end of the supporting projection (1111) to axially support the waveguide (140) and the PCB module (150) to be described later together with the first case cover (112).

[0063] Specifically, the inner diameter of the support protrusion (1111) may be formed to be larger than the outer diameter of the bracket assembly (132) to be described later, and smaller than the outer diameter of the waveguide (140) and the PCB module (150). Accordingly, the waveguide (140) and the PCB module (150) to be described later may be placed on the support surface (1111a) of the support protrusion (1111) and supported in the axial direction. Through this, a sound wave output space (S) may be formed between the upper surface of the bracket assembly (132) and the lower surface of the waveguide (140) so that sound waves generated from the speaker module (130) are transmitted to the outside.

[0064] In addition, referring to FIGS. 1 and 2, a plurality of first fastening protrusions (1112) are formed at predetermined intervals along the circumferential direction on the inner surface of the support protrusion (1111), and a first fastening hole (1112a) may be formed in each of the plurality of first fastening protrusions (1112). In other words, a plurality of first fastening protrusions (1112) are formed to extend radially from the inner surface of the supporting protrusion (1111) toward the center of the case body (111) so as to be supported axially downward by being placed on a second fastening protrusion (132b) of a bracket assembly (132) to be described later, and each of the first fastening holes (1112a) can be formed to penetrate axially through the plurality of first fastening protrusions (1112) so as to be positioned on the same axial line as the second fastening hole (132c) of the second fastening protrusion (132b) to be described later. Accordingly, while the head (not shown) of the first fastening member (171) to be described later is supported on the lower surface of each first fastening projection (1112), the screw portion (not shown) of the first fastening member (171) can be screw-fastened to the fastening groove (1121a) of the first fastening boss (1121) to be described later by passing through the first fastening hole (1112a) and the second fastening hole (132c). Through this, the case body (111) can be screw-fastened to the first case cover (112) with the bracket assembly (132), i.e., the speaker module (130) interposed therebetween.

[0065] Referring to FIGS. 2 and 3, the first case cover (112) may be formed in a plate shape to cover the upper opening of the case body (111). For example, the first case cover (112) may be formed in a circular shape to correspond to the case body (111). In other words, the first case cover (112) may be formed in a circular shape whose outer diameter is the same as that of the case body (111). Accordingly, the first case cover (112) may be placed on the upper opening of the case body (111) to tightly seal and cover the upper opening of the case (110).

[0066] Here, the first case cover (112) may be interlocked with the case body (111) without a separate fastening member, or may be fastened using a fastening member. In this embodiment, an example in which the first case cover (112) is fastened to the case body (111) using a fastening member is illustrated.

[0067] For example, on the lower surface of the first case cover (112), that is, on one side of the first case cover (112) facing the upper surface of the speaker module (130), a plurality of first fastening bosses (1121) may be formed at predetermined intervals along the circumferential direction. In other words, the plurality of first fastening bosses (1121) may be formed to correspond one-to-one with the first fastening protrusion (1112) and the second fastening protrusion (132b) described above on the same axis. Accordingly, the first case cover (112) may be firmly fastened to the case body (111) by the plurality of first fastening members (171).

[0068] A plurality of first fastening bosses (1121) can be screw-fastened by each first fastening member (171) penetrating the second fastening protrusion (132b) while being in close contact with the first fastening protrusion (1112) of the bracket assembly (132) to be described later by passing through the PCB module (150) and wave guide (140) to be described later in sequence. Accordingly, the first case cover (112) can be screw-fastened to the case body (111) with the wave guide (140) and PCB module (150) to be described later placed between the speaker module (more precisely, the bracket assembly) (130). Through this, the case body (111), first case cover (112), bracket assembly (132), wave guide (140), and PCB module (150) can be assembled at once, thereby reducing the number of assembly parts and assembly work.

[0069] In this case, in addition to the first fastening boss (1121), a second fastening boss (1122) may be formed on the lower surface of the first case cover (112) to penetrate the PCB module (150) described later and be screw-fastened to the waveguide (140). The second fastening boss (1122) may be formed lower than the first fastening boss (1121) so that its leading edge is in close contact with the lower surface of the waveguide (140). Accordingly, the waveguide (140) and the PCB module (150) are temporarily fastened together to the first case cover (112) by the second fastening member (172), thereby suppressing misalignment between the parts during the assembly process with the case body (111) described above.

[0070] In other words, the second fastening boss (1122) can be formed to be close to both sides of the circumference with respect to the microphone (120) to be described later as the center. Accordingly, the second damper (182) to be described later is closely attached between the waveguide (140) and the PCB module (150) to be described later by the second fastening member (172) fastened to the second fastening boss (1122), thereby more effectively suppressing the resonance transmitted to the microphone (120). The second fastening boss (1122) will be described again later together with the waveguide (140).

[0071] In addition, a sealing protrusion (1123) may be formed on the lower surface of the first case cover (112) to be inserted into the inner surface of the case body (111) and to be in close contact with the inner surface of the case body (111). For example, the sealing protrusion (1123) may be formed in an arc shape on the outer surface of the plurality of first fastening bosses (1121). Accordingly, when the case body (111) and the first case cover (112) are assembled, the sealing protrusion (1123) may be in close contact with the upper inner surface of the case body (111), thereby increasing the sealing force between the case body (111) and the first case cover (112).

[0072] In addition, the first case cover (112) may be formed with at least one voice input hole (1124) penetrating between the upper and lower surfaces. For example, two voice input holes (1124) may be formed on each side with a 180-degree interval in the circumferential direction. Accordingly, the user's voice may pass through each voice input hole (1124) and be quickly and accurately transmitted to the microphone (120) provided inside the case (110).

[0073] In this case, as shown in FIGS. 9 and 10, a damper-receiving rib (1125) is formed around the voice input hole (1124), that is, on the lower surface of the first case cover (112), to surround the voice input hole (1124), and a damper (hereinafter referred to as a second damper) (182) having a first voice transmission hole (1821) can be inserted into the inside of the damper-receiving rib (1125) to correspond to the voice input hole (1124) of the first case cover (112). Accordingly, the second damper (182) absorbs and cancels out the resonance between the PCB module (150) and the first case cover (112), which will be described later, so that the user's voice can be accurately and quickly transmitted to the microphone (120).

[0074] Referring to FIGS. 6 and 7, the second case cover (113) may be formed in a plate shape to cover the lower opening of the case body (111). For example, the second case cover (113) may be formed in a circular shape to correspond to the case body (111), similar to the first case cover (112). In other words, the second case cover (113) may be formed in a circular shape whose outer diameter is the same as that of the case body (111). Accordingly, the second case cover (113) may tightly cover the lower opening of the case body (111).

[0075] Here, the second case cover (113) may be interlocked with the case body (111) without a separate fastening member, or may be coupled using a fastening member. In this embodiment, an example in which the second case cover (113) is interlocked with the case body (111) without a fastening member is illustrated. Accordingly, by eliminating the fastening member exposed to the outside of the case (110), not only can the assembly process of the case (110) be simplified, but also the aesthetic appeal can be enhanced.

[0076] For example, a first hook portion (132a) may be formed on the upper surface of the second case cover (113), that is, the upper side of the second case cover (113) facing the lower surface of the speaker module (130), so as to engage with a second hook portion (1322a) to be described later. A plurality of first hook portions (132a) may be formed at predetermined intervals along the circumferential direction. Accordingly, the second case cover (113) may be hook-connected to the speaker module (130) in a state where the lower end of the case body (111) is covered. This reduces the number of parts required to assemble the second case cover (113) to the case body (111) and simplifies the assembly process for the second case cover (113).

[0077] Referring to FIGS. 1 to 5, a speaker module (130) according to the present embodiment may include a speaker body (131) and a bracket assembly (132). The speaker body (131) is a member that outputs sound waves, and the bracket assembly (132) is a member that accommodates the speaker body (131) and is coupled to a case (110).

[0078] The speaker body (131) may be formed in a convex plate shape with the center thereof facing the bracket assembly (132) to be described later, and may be fastened to the bracket assembly (132). For example, a speaker support portion (1311) may be formed in a flange shape on the outer surface of the speaker body (131), and a speaker mounting portion (1321a) may be formed in the bracket assembly (132) so that the speaker support portion (1311) may be inserted and fastened. Accordingly, the speaker body (131) may be fastened to the bracket assembly (132) with screws, and may be firmly fixed to the case (110) together with the bracket assembly (132).

[0079] The bracket assembly (132) may include a first bracket (1321) and a second bracket (1322). For example, the bracket assembly (132) may be assembled such that the first bracket (1321) and the second bracket (1322) are each formed in an annular shape with an opening and the openings face each other. Accordingly, the bracket assembly (132) is formed in an annular shape with a hollow core, so that the sound quality of sound waves generated from the speaker body (131) may be improved.

[0080] In this case, a first fastening member receiving groove (132a) may be formed on the outer surface of the bracket assembly (132), that is, on the outer surface of the first bracket (1321) and the second bracket (1322), so as to receive the first fastening member (171) described above. Accordingly, even if the first fastening member (171) vertically terminates the bracket assembly (132), interference between the first fastening member (171) and the inner surface of the case (110) can be suppressed since the first fastening member (171) is received within the outer surface of the bracket assembly (132).

[0081] For example, the first fastening member receiving groove (132a) may be formed to be radially recessed on the outer surface of the bracket assembly (132) and extend vertically, and a second fastening protrusion (132b) may be formed in a stepped manner on one end of the first fastening member receiving groove (132a), that is, on one end of the first bracket (1321) among the first fastening member receiving grooves (132a). Accordingly, the lower surface of the second fastening protrusion (132b) may be in close contact with the upper surface of the first fastening protrusion (1112) of the case body (111) described above, and the upper surface of the second fastening protrusion (132b) may be in close contact with the front end surface of the first fastening boss (1121) described above, so that they may be supported in both axial directions by the case body (111) and the first case cover (112).

[0082] In this case, a second fastening hole (132c) may be formed on the same axis as the first fastening hole (1112a) of the first fastening protrusion (1112) described above so that the first fastening member (171) passes through the second fastening protrusion (132b). Accordingly, while the head of the first fastening member (171) is supported by the first fastening protrusion (1112) described above, the screw portion of the first fastening member (171) may pass through the second fastening hole (132c) and be fastened to the first fastening boss (1121) of the first case cover (112). Through this, the bracket assembly (132) forming the speaker module (130) may be firmly assembled to the case (110) while minimizing the length of the first fastening member (171).

[0083] The first bracket (1321) may have a speaker mounting portion (1321a) formed around the inner circumference thereof so that the speaker body (131) described above may be inserted and fastened thereto, and a boss support rib (1321b) may be formed on the outer circumference of the speaker mounting portion (1321a) so that the tip of the first fastening boss (1121) may be inserted and supported therein. In other words, a boss support rib (1321b) may be formed on the upper surface of the first bracket (1321) facing the lower surface of the waveguide (140) described later, extending toward the lower surface of the waveguide (140) by a preset height. Accordingly, when the first fastening boss (1121) is pressed against the first bracket (1321), the front end of the first fastening boss (1121) is inserted into the boss support rib (1321b), thereby improving the bonding strength with the first bracket (1321).

[0084] In this case, the boss support rib (1321b) may be formed in a circular shape or may be formed in an arc shape cut in the longitudinal direction. In the former case, the manufacturing of the boss support rib (1321b) is easy and the bonding strength to the first fastening boss (1121) can be improved. In the latter case, the boss support rib (1321b) can be flexibly changed when assembling the first fastening boss (1121), so that an allowance for processing errors and / or assembly errors can be secured. This embodiment illustrates an example in which the boss support rib (1321b) is formed in an arc shape.

[0085] The second bracket (1322) may be formed with a second hook portion (1322a) that is inserted into and engaged with the first hook portion (132a) of the second case cover (113) described above. A plurality of second hook portions (1322a) may be provided corresponding to the first hook portion (132a) and may be spaced apart from each other by a preset interval in the circumferential direction. Accordingly, the second case cover (113), which forms a part of the case (110), is hook-connected to the second bracket (1322), thereby reducing the number of parts for the second case cover (113) and reducing the assembly time.

[0086] In this case, the second hook portion (1322a) can be formed to correspond to the first hook portion (132a) of the second case cover (113) at the lower edge of the second bracket (1322). Accordingly, the fastening point between the second case cover (113) and the second bracket (1322) is positioned as far as possible from the center of the second bracket (1322), thereby increasing the bonding force between the second case cover (113) and the second bracket (1322). In addition, while forming the thickness of the second case cover (113) thin, the second case cover (113) and the second bracket (1322) can be easily hook-assembled.

[0087] Referring to FIGS. 1 to 5, the waveguide (140) according to the present embodiment may be formed in a plate shape. For example, the waveguide (140) may be formed in a circular plate shape to correspond to the case body (111). In other words, the outer diameter of the waveguide (140) may be formed to be smaller than or equal to the inner diameter of the sealing protrusion (1123) of the first case cover (112) described above. Accordingly, the waveguide (140) may be accommodated in the sound wave output space (S) between the first case cover (112) and the first bracket (1321) to guide sound waves generated from the speaker module (130) to the sound wave output hole (111a) of the case body (111). Through this, even if the sound wave output space (S) is not sufficiently secured in the front side of the speaker module (130), not only can the overlap and interference of the record wave with the sound waves generated from the speaker module (130) be suppressed, but also the sound waves generated from the speaker module (130) are evenly distributed through the waveguide (140), so that the sound distortion phenomenon can be suppressed more effectively.

[0088] Specifically, the waveguide (140) may be formed in a circular shape as described above, but may be formed to be inclined so as to approach the first case cover (112) from the center toward the edge. In other words, the waveguide (140) has a sound wave guide surface (141) formed on the lower surface facing the speaker module (130) and / or the first bracket (1321) to guide sound waves, and the sound wave guide surface (141) may be formed continuously with a first guide surface (1411) facing the speaker module (130) and a second guide surface (1412) facing the first bracket. Accordingly, the sound wave generated from the speaker module (130) travels toward the first sound wave output hole (111a) of the case body (111) along the sound wave guide surface (141) formed of the first guide surface (1411) and the second guide surface (1412).

[0089] In this case, the first guide surface (1411) is formed as a convex curved surface toward the first case cover (112) to correspond to the speaker module (130), and the second guide surface (1412) may be formed to be inclined or curved so as to extend from the outer side of the first guide surface (1411) and approach the lower surface of the first case cover (112) as it goes toward the outer surface of the waveguide (140). In other words, the second guide surface (1412) may be formed so that the gap with the bracket assembly (132) increases as it moves away from the first guide surface (1411). Accordingly, the sound wave guide surface (141) may be formed to be narrow in a portion close to the speaker module (130), which is the sound source, while it may be formed to be wide as it moves away from the speaker module (130). Through this, a wide and smooth sound wave output space (S) is secured in front of the speaker module (130), so that sound wave distortion caused by overlapping and interference of record waves can be minimized.

[0090] In addition, in this case, a sound wave guide protrusion (142) may be formed on the sound wave guide surface (141) of the wave guide (140) to guide sound waves generated from the speaker module (130) toward the first sound wave output hole (111a). For example, the sound wave guide protrusion (142) may be formed on the second guide surface (1412) and may be formed to extend radially from the first guide surface (1411). The sound wave guide protrusions (142) may be formed at equal intervals along the circumferential direction. Accordingly, sound waves generated from the speaker module (130) may be transmitted radially and evenly.

[0091] The sound wave guide protrusion (142) may be formed to protrude from the sound wave guide surface (141) in a direction toward the first bracket (1321), but to be recessed on the opposite side of the sound wave guide surface (141) and raised toward the sound wave guide surface (141). Accordingly, while the sound wave guide protrusion (142) is formed on one side of the wave guide (140), the overall thickness of the wave guide (140) may be formed the same, thereby suppressing an increase in the weight of the wave guide (140).

[0092] In addition, referring to FIGS. 8 to 11, a first boss receiving hole (143) through which a first fastening boss (1121) passes may be formed at the edge of the waveguide (140). Accordingly, the first fastening boss (1121) passing through the second boss receiving hole (1511) of the PCB module (150) to be described later may pass through the first boss receiving hole (143) and be in close contact with the second fastening protrusion (132b) of the speaker module (130). Through this, the waveguide (140) may be radially restrained by the first fastening boss (1121) while being axially supported between the first case cover (112) and the speaker module (130) together with the PCB module (150) to be described later.

[0093] In this case, the first boss receiving hole (143) may be formed on the same axis as the first fastening hole (1112a) of the case body (111) described above, the second fastening hole (132c) of the speaker module (130), and the second boss receiving hole (1511) of the PCB module (150) described later, along with the fastening groove (1121a) of the first fastening boss (1121). Accordingly, the waveguide (140) can be connected in one piece by the first fastening member (171) that passes through the first fastening hole (1112a) of the case body (111), the second fastening hole (132c) of the speaker module (130), the first boss receiving hole (143) of the waveguide (140), and the second boss receiving hole (1511) of the PCB module (150) to be described later, and is fastened to the first fastening boss (1121) of the first case cover (112).

[0094] In addition, referring to FIGS. 8 and 10, at least one microphone (120) may be mounted on the lower surface of the PCB module (150) facing the waveguide (140). For example, two microphones (120) may be mounted on the lower surface of the PCB board (151) at equal intervals in the circumferential direction. In other words, the microphone (120) may be mounted on the lower surface of the PCB board (151) at a position axially overlapping with the sound wave output path (F) defined by the space between the sound wave guide protrusions (142) of the waveguide (140). Accordingly, the damper receiving groove (144) described later is positioned in the relatively wide sound wave output path (F), so that the first damper (181) accommodated in the damper receiving groove (144) can be formed relatively wide.

[0095] Although not shown in the drawing, the microphone (120) may be mounted on the PCB module (150) between the two sound wave output passages (F), that is, at a position axially overlapping with the sound wave guide protrusion (142). In this case, since the second fastening bosses (1122) are formed to correspond to the two sound wave output passages (F), the heads (not shown) of the second fastening members (172) that are relatively smaller than the second dampers (182) can be accommodated in the two sound wave output passages (F). Accordingly, the sound wave movement resistance in the two sound wave output passages (F) is reduced, so that the sound waves output from the speaker body (131) can move smoothly.

[0096] In addition, in this case, the waveguide (140) may have a damper receiving groove (144) formed to be sunken in a direction away from the PCB (151), and a first damper (181) may be inserted into the damper receiving groove (144). For example, the damper receiving groove (144) may be formed to be sunken by a preset depth from the upper surface of the waveguide (140) facing the microphone (120), that is, the back surface of the sound wave guide surface (141) toward the sound wave guide surface (141) facing the first bracket (1321). Accordingly, even if the gap between the waveguide (140) and the PCB module (150) becomes narrow, the microphone (120) may be placed as far as possible on the outermost side of the first case cover (112). Through this, the user's voice can be accurately and quickly transmitted to the microphone (120).

[0097] Specifically, the damper receiving groove (144) is formed on the same axis as the microphone (120), but the cross-sectional area of ​​the damper receiving groove (144) can be formed to be larger than the cross-sectional area of ​​the microphone (120). Accordingly, the microphone (120) is positioned at the center of the damper receiving groove (144), and is accommodated in the center of the first damper (181) described later, thereby more effectively suppressing resonance with neighboring members.

[0098] In this case, the damper receiving groove (144) may be formed by being sunken to a preset depth between the sound wave guide protrusions (142) on both sides of the wave guide (140), that is, in the direction from the sound wave output path (F) toward the speaker module (130). Accordingly, even if a microphone (120) is mounted together with various elements (152) on the lower surface of the PCB (151) to be described later facing the wave guide (140), a second damper (182) having a depth greater than or equal to the damper receiving groove (144) may be inserted between the microphone (120) and the wave guide (140).

[0099] Also, in this case, the damper receiving groove (144) may be formed in an approximately square shape when projected in the axial direction, or may be formed in an elongated rectangle or an elongated shape along the direction of sound wave movement. In the former case, the damper receiving groove (144) is formed in a relatively wide outer part of the sound wave output path (F), so that the sound wave movement resistance can be lowered while securing a relatively large cross-sectional area of ​​the second damper (182). On the other hand, in the latter case, the damper receiving groove (144) is formed long along the sound wave output path (F), so that the cross-sectional area of ​​the second damper (182) can be secured larger while reducing the sound wave movement resistance in the sound wave output path (F). This embodiment illustrates an example in which the damper receiving groove (144) is formed in an approximately square shape. Accordingly, the back surface of the damper receiving home (144) is in close contact with the lower surface of the PCB (151) to be described later, so that the wave guide (140) can be stably supported on the PCB (151).

[0100] Also, in this case, referring to FIGS. 9 and 11, second fastening member receiving grooves (145) into which the heads (not shown) of the second fastening members (172) are respectively inserted may be formed on both sides of the damper receiving groove (144) in the circumferential direction. For example, the second fastening member receiving groove (145) may be formed to be sunken by a preset depth toward the PCB module (150) facing the back surface of the sound wave guide surface (141). Accordingly, the depth of the second fastening member receiving groove (145) is formed sufficiently deep, so that the head of the second fastening member (172) can be smoothly concealed.

[0101] Although not shown in the drawing, the damper receiving groove (144) may be formed into a circular cross-section when projected in the axial direction. In other words, the damper receiving groove (144) protrudes from the middle of the sound wave output passage (F), and the outer surface of the damper receiving groove (144) may be formed into a circular curve. In this case, the outer surface of the damper receiving groove (144) forms a curved surface, thereby minimizing the sound wave movement resistance in the sound wave output passage (F).

[0102] Also, in this case, the damper receiving groove (144) can be formed to be spaced apart in the circumferential direction from at least one of the sound wave guide projections (142) on both sides. Accordingly, a sound wave output path (F) is formed between the outer surface of the damper receiving groove (144) and the outer surface of the sound wave guide projection (142), thereby further reducing the sound wave movement resistance in the sound wave output path (F).

[0103] Referring to FIGS. 9 to 11, the first damper (181) may be formed larger than the microphone (120) so as to surround the microphone (120). For example, the first damper (181) may be formed in a square shape when projected axially, and a microphone receiving groove (1811) may be formed sunken on the surface facing the PCB module (150), and at least one first damping protrusion (1812) may be formed on one side of the first damper (181) so as to protrude toward the PCB module (150) around the microphone receiving groove (1811). Accordingly, when the first damping protrusion (1812) of the first damper (181) is in close contact with the PC module (150), the vibration transmitted through the PC module (150) is absorbed by the first damper (181), thereby preventing the vibration from being transmitted to the microphone (120).

[0104] In addition, a damper fixing protrusion (1813) may protrude toward the waveguide (140) at the center of the other side of the first damper (181). For example, a damper fixing hole (1441) penetrating toward the speaker module (130) may be formed in the damper receiving groove (144) of the waveguide (140), and the damper fixing protrusion (1813) of the first damper (181) described above may be inserted and fixed into the damper fixing hole (1441). Accordingly, when assembling the first damper (181), the first damper (181) is prevented from being removed, and at the same time, the vibration of the waveguide (140) may be quickly transmitted to the first damper (181) through the damper fixing protrusion (1813) and canceled out.

[0105] Referring to FIGS. 1 to 5, a PCB module (150) according to the present embodiment may include a PCB substrate (151) and various components (152). The PCB substrate (151) is disposed between the first case cover (112) and the waveguide (140), and the various components (152) may be mounted on the lower surface of the PCB substrate (151), that is, the lower surface facing the waveguide (140). Accordingly, the PCB substrate (151) may be spaced apart from the waveguide (140) by a preset interval, and the microphone (120) may be disposed on the lower surface of the PCB substrate (151) together with the various components (152).

[0106] The PCB substrate (151) is formed in a circular shape, and may be formed to have approximately the same outer diameter as the waveguide (140) or may be formed to have a slightly smaller outer diameter than the waveguide (140). In the former case, the lower surface of the PCB substrate (151) is in close contact with the upper surface of the waveguide (140) and is radially restrained by the first fastening boss (1121) and the second fastening boss (1122) described above, whereas in the latter case, a PCB support protrusion (not shown) that surrounds the outer surface of the PCB substrate (151) is formed at the edge of the waveguide (140) to support the PCB substrate (151) in the radial direction.

[0107] For example, a second boss receiving hole (1511) through which a first fastening boss (1121) of a first case cover (112) passes and a third boss receiving hole (1512) through which a second fastening boss (1122) passes may be formed at the edge of the PCB board (151). Accordingly, the PCB board (151) may be fastened to the first case cover (112) together with the waveguide (140) by the second fastening member (172) and may be fastened to the first case cover (112) by the waveguide (140) and the bracket assembly (132) by the first fastening member (171). Through this, the assembly position of the PCB board (151) can be maintained during assembly of the PCB board (151), thereby increasing assembly reliability.

[0108] In addition, a second sound wave transmission hole (1513) may be formed in the PCB board (151). The second sound wave transmission hole (1513) may be formed on the same axis as the first sound wave transmission hole (1821) of the second damper (182) to be described later. In this case, the microphone (120) described above may be attached to the lower surface of the PCB board (151), and the microphone (120) may be attached so as to be positioned on the same axis as the second sound wave transmission hole (1513). Accordingly, the user's sound wave may pass through the voice input hole (1124) and the first voice transmission hole (1821) of the first case cover (112) and be transmitted to the second voice transmission hole (1513) of the PCB board (151), and this sound may pass through the second voice transmission hole (1513) and be transmitted to the microphone (120). Through this, the voice recognition rate of the microphone (120) is improved, so that the user's voice can be transmitted to the microphone (120) quickly and accurately.

[0109] In addition, a second damper (182) may be provided between the PCB board (151) and the upper surface of the first case cover (112) facing it. For example, the second damper (182) may be inserted into a damper receiving rib (1125) provided in the first case cover (112) and fixed between the PCB board (151) and the upper surface of the first case cover (112) facing it. Accordingly, as described above, the second damper (182) can absorb and cancel out the resonance between the PCB module (150) and the first case cover (112). Through this, the voice recognition rate of the microphone (120) is improved, so that the user's voice can be accurately and quickly transmitted to the microphone (120).

[0110] In this case, the second damper (182) may be formed in a rectangular shape, and a first sound transmission hole (1821) may be formed through the center thereof. The first sound transmission hole (1821) may be formed on the same axis as the sound input hole (1124) of the first case cover (112) described above and the second sound transmission hole (1513) of the PCB (151). Accordingly, the user's voice may be accurately and quickly transmitted to the microphone (120).

[0111] In addition, in this case, at least one second damping protrusion (1812) may be formed on one side of the second damper (182), for example, on the upper side facing the first case cover (112), and protruding toward the first case cover (112) around the first sound transmission hole (1821). Accordingly, when the second damping protrusion (1812) of the second damper (182) is in close contact with the first case cover (112), the vibration transmitted through the first case cover (112) is absorbed by the second damper (182), thereby preventing the vibration from being transmitted to the microphone (120) through the PCB (151).

[0112] Although not shown in the drawing, the damper receiving groove in the waveguide (140) may be excluded or formed shallowly. For example, the microphone (120) may be placed in a direction facing away from the waveguide (140), that is, on the upper side facing the first case cover (112) among the two sides of the PCB board (151). Accordingly, a damper (e.g., the first damper) (181) that directly surrounds the microphone (120) may be excluded between the waveguide (140) and the PCB module (150).

[0113] As described above, when the microphone (120) is placed on the side facing away from the waveguide (140) among the two sides of the PCB (151), the damper receiving groove (144) disclosed in the above-described embodiment in the waveguide (140) can be excluded. Accordingly, the sound wave guide surface (141) of the waveguide (140) is formed flat, and the sound wave output resistance at the sound wave guide surface (141) is reduced, so that the sound waves generated from the speaker module (130) can be transmitted more effectively toward the sound wave output hole (111a). Through this, the height of the sound wave output space (S) can be formed as low as possible, so that the voice recognition device can be further miniaturized.

[0114] In addition, since the sound wave output resistance on the sound wave guide surface (141) due to the microphone (120) is hardly generated or not generated at all, the number of microphones can be further increased. In other words, although the above-described embodiment shows an example in which only two microphones are provided on each side, three or more microphones may be provided. Accordingly, since multiple microphones (120) are arranged radially, the range in which the user's voice is transmitted can be expanded while also being transmitted accurately.

[0115] In this way, multiple components are fastened to the case using the same fastener, reducing the number of fasteners. This reduces assembly work for voice recognition devices and lowers manufacturing costs.

[0116] In addition, by assembling a large number of small parts with fasteners, the assembly between parts can be strengthened, thereby increasing the reliability of the product.

[0117] In addition, the aesthetic appeal of the voice recognition device can be improved by minimizing the number of fasteners that fasten multiple parts or by preventing the fasteners from being exposed to the outside of the case.

[0118] Meanwhile, there are other embodiments of the voice recognition device as follows.

[0119] That is, in the embodiment described above, the case body is formed in a cylindrical shape with both ends open, but in some cases, the case body may be formed in a cup shape with one end closed.

[0120] Referring to FIGS. 12 to 14, the basic configuration and the resulting operational effects of the voice recognition device according to the present embodiment are similar to those of the above-described embodiment. For example, the voice recognition device according to the present embodiment includes a case (110), a microphone (120), a bracket assembly (132), a wave guide (140), and a PCB module (150). However, the microphone (120), the speaker module (130), the wave guide (140), and the PCB module (150) may be fastened to the inside of the case (110) using the same fastening member (for example, the first fastening member (171).

[0121] For example, the speaker module (130), the waveguide (140), and the PCB module (150) can be fastened to the case (110) using the first fastening member (171) and the second fastening member (172) while being inserted into the first fastening boss (1121) and the second fastening boss (1122) provided in the case (110). Accordingly, the number of parts and / or assembly work required to assemble the case (110), the speaker module (130), the waveguide (140), and the PCB module (150) can be simplified, thereby reducing manufacturing costs. At the same time, the fastening members (171) (172) are not exposed to the outside of the case (110), thereby enhancing aesthetic appeal.

[0122] Also in this case, a first hook portion (113a) is formed on the case body (111), and a second hook portion (1322a) is formed on the second case cover (113), so that the second case cover (113) can be hook-connected to the case body (111). Accordingly, the number of parts and / or assembly work required to assemble the case body (111) and the second case cover (113) forming the case (110) can be simplified, thereby reducing manufacturing costs. At the same time, the fastening member (not shown) for assembling the case body (111) and the second case cover (113) is not exposed to the outside of the case (110), so that the aesthetic appeal can be improved.

[0123] However, the case (110) according to the present embodiment may be composed of a case body (111) and a second case cover (113). In other words, in the case (110) according to the present embodiment, the first case cover (112) may be formed as a single body on the upper part of the case body (111). Accordingly, when the case body (111) and the first case cover (112) are post-assembled, processing errors and / or assembly errors that may occur between the case body (111) and the first case cover (112) can be prevented in advance, thereby simplifying the assembly of the case (110) as a whole and enhancing the aesthetic appeal.

[0124] In this case, the first fastening protrusion (1112) of the above-described embodiment can be excluded from the inner surface of the case body (111). In other words, in the above-described embodiment, the first fastening protrusion (1112) for fastening the case body (111) and the first case cover (112) is formed on the inner surface of the case body (111), but in this embodiment, since the first case cover (112) is formed as a single body with the case body (111), there is no need to form the first fastening protrusion (1112) on the inner surface of the case body (111). Accordingly, even if the upper surface of the case body (111) is blocked, the waveguide (140) and the PCB module (150) can be inserted from the lower surface of the opened case body (111) toward the upper surface, and can be firmly coupled between the upper surface of the case body (111) and the speaker module (130).

[0125] Also, in this case, both sides of the waveguide (140) and the PCB module (150) can be supported by one side of the case body (111) and the speaker module (130). For example, in the present embodiment, as the waveguide (140) and the PCB module (150) are inserted from the open end of the case body (111) toward the closed end, the support protrusion (1111) in the above-described embodiment that supports the waveguide (140) and the PCB module (150) can be excluded from the inner surface of the case body (111).

[0126] Accordingly, in the present embodiment, the speaker module (130) can be used instead of the support protrusion (1111) in the aforementioned embodiment to support the lower surface of the waveguide (140) and the PCB module (150). In other words, in the present embodiment, the height of the boss support rib (1321b) extending from the upper surface of the speaker module (130) toward the waveguide (140) is further extended so that the front end surface of the boss support rib (1321b) can support the waveguide (140) and the PCB module (150) in the axial direction. Accordingly, one side of the waveguide (140) and the PCB module (150) can be stably supported while excluding the support protrusion (1111) from the inner circumferential surface of the case body (111). Through this, the first case cover (112) can be formed as a single body with the case body (111), while the wave guide (140) and the PCB module (150) can be assembled by inserting them into the inside of the case body (111).

[0127] In the case where the upper side of the case body (111) is formed in a blocked shape as described above, the number of parts and / or assembly work for the upper side of the case body (111) forming the first case cover (112) is reduced as described above, so that the assembly cost for the voice recognition device can be further reduced.

[0128] In addition, in this embodiment, since the first fastening protrusion (1112) is excluded from the case body (111), the manufacturing of the case body (111) becomes easier, and the manufacturing cost of the voice recognition device can be further reduced.

[0129] In addition, in this embodiment, since the upper side of the case body (111) is formed as a single body, the aesthetic appeal of the voice recognition device including the case (110) can be further improved.

Claims

1. A case comprising a case body having at least one open end among both ends and a case cover covering the open end of the case body; A speaker module accommodated in the above case body; A PC module provided on one side of the speaker module and accommodated in the case body; and It includes a waveguide provided between the speaker module and the PCB module and accommodated in the case body. In the above case cover, A voice recognition device in which the speaker module, the PCB module, and the waveguide are connected by the same connecting member.

2. In paragraph 1, The case body is opened at both ends, and the two ends of the case body are covered by the first case cover and the second case cover, respectively. The above first case cover, A voice recognition device coupled to the case body by the same fastening member as the speaker module, the PCB module, and the waveguide.

3. In paragraph 2, A first fastening protrusion is formed on the inner surface of the case body to support the head of the fastening member, a second fastening protrusion is formed on the outer surface of the speaker module in axial contact with the first fastening protrusion, and a first fastening boss is formed on one side of the first case cover to extend toward the speaker module and penetrate the PCB module and the waveguide. The above first contract boss is, A voice recognition device formed to axially contact the second fastening protrusion on the opposite side of the first fastening protrusion.

4. In paragraph 3, A first fastening hole is formed in the first fastening protrusion so that the fastening member passes through it, a second fastening hole is formed in the second fastening protrusion so that the fastening member passes through it, and a boss receiving hole is formed in each of the PCB module and the waveguide so that the first fastening boss passes through it. The first fastening hole of the case body, the second fastening hole of the speaker module, and each boss receiving hole of the PCB module and the waveguide are A voice recognition device formed on the same axis as the fastening groove of the first fastening boss.

5. In paragraph 3, On one side of the speaker module facing the waveguide, A voice recognition device in which a boss support rib is formed so that the tip of the first fastening boss is inserted and supported.

6. In paragraph 5, The above boss support rib is, A voice recognition device formed in a circular shape or in a longitudinally cut arc shape.

7. In paragraph 3, A support protrusion extending radially is formed on the inner surface of the case body, The above PCB module and the above waveguide, A voice recognition device supported by one side of the first case cover and one side of the supporting protrusion facing it.

8. In paragraph 7, A sealing protrusion to be inserted into the case body is formed on one side of the first case cover, The cross-section of the above sealing protrusion is A voice recognition device formed to face one side of the above-mentioned support protrusion.

9. In paragraph 3, The above speaker module, It includes a speaker body and a bracket assembly in which the speaker body is connected at the center and the edge is connected to the case, A first fastening member receiving groove is formed sunken on the outer surface of the above bracket assembly to receive the fastening member. The above second fastening protrusion is, A voice recognition device extending to the inner surface of the first fastening member receiving groove.

10. In paragraph 9, The above first fastening member receiving groove extends along both sides of the bracket assembly, The above second fastening protrusion is, A voice recognition device formed in a step at one end of the first fastener receiving groove facing the wave guide.

11. In paragraph 1, The case body is extended as a single body and sealed at one end, and the other end of the case body is opened and covered by the case cover. The above speaker module, the above PCB module and the above waveguide, A voice recognition device connected to the case body by the same fastening member.

12. In paragraph 11, A first fastening boss extending toward the speaker module is formed at one end of the case body, The above first contract boss is, A voice recognition device that is connected to the speaker module by penetrating the above-mentioned PCB module and the above-mentioned waveguide.

13. In any one of paragraphs 1 to 12, At least one of the above case covers, A voice recognition device that is interlocked and connected to the case body or the speaker module facing the case cover.

14. In paragraph 13, A first hook portion is formed on the above case cover, A voice recognition device in which a second hook portion is formed on one side of the speaker module facing the case cover or on the other end of the case body to be engaged with the first hook portion.

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