Counter-flow micro-fluidic cooler

Abstract

A heat transfer component for transferring heat between a heat source and a heat sink using a heat transfer fluid is provided. The heat transfer component includes a counter-flow medium containing passageways formed in thermally conductive material and configured to flow heat transfer fluid through the passageways in a first direction and to flow the heat via the thermally conductive material in a second direction substantially opposite to a bulk flow line of the heat transfer fluid through the passageways. The heat transfer component includes a thermal coupling structure configured to be in fluidic communication with the counter-flow medium and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source or the heat sink. The heat transfer component includes flow manipulation features to contribute to a more uniform mass flux of heat transfer fluid across the counter-flow medium.

Description

Counter-Flow Micro-Fluidic CoolerCross-reference to Related Applications

[0001] This application claims priority to U.S. Provisional Application No. 63 / 655,993, filed June 4, 2024, entitled “Counter-Flow Micro-Fluidic Cooler,” which is incorporated herein by reference.Background

[0002] Data centers house a number of computer systems and associated components, such as telecommunication systems and data storage systems. Information Technology services and business services use data centers as outsourced centers for computing and data storage.

[0003] Computer systems and associated components in a data center generate a significant amount of heat while they are operating. However, these computer systems and components can generate so much heat that their performance degrades, potentially resulting in permanent damage. Accordingly, data center personnel work to keep their computer systems and components consistently cool.Summary

[0004] In some aspects, the techniques described herein relate to a heat transfer component for transferring heat between a heat source and a heat sink using a heat transfer fluid, the heat transfer component including: a counter-flow medium containing passageways formed in thermally conductive material and configured to flow the heat transfer fluid through the passageways in a first direction and to flow the heat via the thermally conductive material in a second direction substantially opposite to a bulk flow line of the heat transfer fluid through the passageways.

[0005] In some aspects, the techniques described herein relate to a heat transfer component, wherein the counter-flow medium has a thickness measured along the first direction and a width measured along a third direction perpendicular to the first direction, and wherein a ratio of the thickness to the width is less than 1 : 10.

[0006] In some aspects, the techniques described herein relate to a heat transfer component, wherein a mass flux of heat transfer fluid across the counter-flow medium is substantially uniform.

[0007] In some aspects, the techniques described herein relate to a heat transfer component, wherein one or more of the passageways include a microfluidic passageway.

[0008] In some aspects, the techniques described herein relate to a heat transfer component, wherein the bulk flow line of the heat transfer fluid is the average direction of flow of heat transferfluid through the counter-flow medium, and wherein substantially opposite to the bulk flow line includes within a two-degree angle of a direction opposite the bulk flow line of the heat transfer fluid.

[0009] In some aspects, the techniques described herein relate to a heat transfer component, wherein the angle between the bulk flow line of the heat transfer fluid and the bulk heat flow line to a heat sink or from a heat source is less than ten, five, or even two degrees.

[0010] In some aspects, the techniques described herein relate to a heat transfer component, wherein the heat transfer component includes a counter-flow medium, wherein a substantially uniform mass flux of heat transfer fluid is configured to flow through the counter-flow medium. The counterflow medium may further include a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the heat transfer fluid on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source or the heat sink, the low thermal resistance heat flow path being configured to conduct heat between the counter-flow medium and the heat source or the heat sink. The thermal coupling structure may contribute to a more or substantially uniform temperature distribution across the thermal coupling structure. The thermal coupling structure may further operate in concert with the counter-flow medium and the heat transfer fluid to contribute to a more or substantially uniform temperature distribution across the thermal coupling structure.

[0011] In some aspects, the techniques described herein relate to a heat transfer component, wherein the heat transfer component further includes flow manipulation features on one or both of the inlet and outlet of the counter-flow medium. The flow manipulation features may contribute to a more uniform mass flux (e.g., mass flow per unit area) of heat transfer fluid across the counter-flow medium. The flow manipulation features may include, but are not limited to, an inlet flow shaping insert, an outlet flow shaping insert, a perforated screen, and other flow features.

[0012] In some aspects, the techniques described herein relate to a heat transfer component, further including a thermal coupling structure configured to be in fluidic communication with the counterflow medium using the heat transfer fluid on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source or the heat sink, the low thermal resistance heat flow path being configured to conduct heat between the counter-flow medium and the heat source or the heat sink, wherein the thermal coupling structure contributes to a more uniform temperature distribution across the thermal coupling structure, wherein the counter-flow medium further includes one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal close-pack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, and wherein substantially uniform microfluidic passageways are present between the aggregate media particles.

[0013] In some aspects, the techniques described herein relate to a heat transfer component, wherein the thermal coupling structure further includes protrusions configured to be in thermal contact with the counter-flow medium, wherein at least one protrusion has a first volume, wherein at least one aggregate media particle has a second volume, and wherein the ratio of the first volume to the second volume is between 1 : 1 and 10: 1. In another aspect, the ratio of the first volume to the second volume is between 2: 1 and 10: 1.

[0014] In some aspects, the techniques described herein relate to a heat transfer component, wherein the thermal coupling structure includes a thermal coupling structure hydraulic diameter and the counter-flow medium includes a counter-flow medium hydraulic diameter. The hydraulic diameter may be the average cross-sectional area of the fluid passageway when traversing through the volume of interests, divided by the average perimeter of the average cross-sectional area. The thermal coupling structure hydraulic diameter may be at least as large as the counter-flow medium hydraulic diameter. The thermal coupling structure hydraulic diameter may be twice or more times as large as the counterflow medium hydraulic diameter, or even three or more times as large as the counter-flow medium hydraulic diameter. In one implementation, the thermal coupling structure hydraulic diameter is at least five times as large as the counter-flow medium hydraulic diameter. In another implementation, the thermal coupling structure hydraulic diameter is at least ten times as large as the counter-flow medium hydraulic diameter.

[0015] In some aspects, the techniques described herein relate to a heat transfer component, wherein the counter-flow medium has a thickness measured along the first direction and a width measured along a third direction perpendicular to the first direction, and wherein a ratio of the thickness to the width is less than 1 : 10.

[0016] In some aspects, the techniques described herein relate to a cooler component for extracting heat from a heat source using a coolant, the cooler component including: a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material, counter to the bulk flow line of the coolant through the microfluidic passageways.

[0017] In some aspects, the techniques described herein relate to a cooler component, wherein the flow of the coolant through the counter-flow medium is configured to be substantially uniform and the counter-flow medium includes bonded aggregate media particles.

[0018] In some aspects, the techniques described herein relate to a cooler component for extracting heat from a heat source using a coolant, the cooler component including: a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flowthe coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways; a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source; a coolant inlet configured to guide the coolant into the cooler component and direct it to the counter-flow medium; and a coolant outlet configured to guide the coolant out of the cooler component from the counter-flow medium.

[0019] In some aspects, the techniques described herein relate to a cooler component, wherein the counter-flow medium further includes: one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal close-pack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, wherein substantially uniform microfluidic passageways are present between the aggregate media particles. In one implementation, the aggregate media particles are configured to take on a substantially cubic closepack formation.

[0020] In some aspects, the techniques described herein relate to a cooler component, wherein the coolant inlet further includes: an inlet port on an external section of the cooler component configured to receive the coolant from a source outside the cooler component; and an inlet channel within the cooler component configured to transport the coolant from the inlet port to the counter-flow medium.

[0021] In some aspects, the techniques described herein relate to a cooler component, wherein the coolant outlet further includes: an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; and an outlet channel within the cooler component configured to transport the coolant from the counter-flow medium to the outlet port.

[0022] In some aspects, the techniques described herein relate to a counter-flow medium, wherein the counter-flow medium further includes a stack of one or more screens. The screens may be bonded or partially bonded together. In one implementation, the screens are sinter bonded together with the application of heat and / or applied pressure. The sintering process may occur in an inert atmosphere, a reducing atmosphere, or an atmosphere less than atmospheric pressure to promote bonding. In one implementation, the stacked screens may have holes that are aligned. In one implementation, the holes in the screens are circular. The holes in the screens may be other shapes (e.g., hexagonal, triangular, rectangular, oblong). Increasing the tortuosity of the path the coolant takes through the counter-flow medium may enhance heat transfer at some cost to pressure loss. In one implementation, the adjacent screens in a screen stack may have partially obstructed holes to enhance heat transfer into the coolant.In one implementation, the stacked screens may be partially misaligned to enhance heat transfer into the coolant. In one implementation, the screens are produced from thin films of materials that are drilled or etched to produce an array of holes. In one implementation, the screens are material films that have been chemically etched or laser drilled to produce an array of holes. In another implementation, the screens are manufactured from woven meshes of wire. In one implementation, the screens may be manufactured from metals including, but not limited to, aluminum or aluminum alloys, copper or copper alloys, nickel or nickel alloys, zinc or zinc alloys, and / or ferrous metal alloys. In one implementation, the screens may be manufactured from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite).

[0023] In some aspects, the techniques described herein relate to a cooler component for extracting heat from a heat source using a coolant, the cooler component including: a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways, the counter-flow medium including: one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal closepack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, wherein substantially uniform microfluidic passageways are present between the aggregate media particles; and a microfluidic flow barrier positioned on an external section of the counter-flow medium, the microfluidic flow barrier being configured to direct the coolant towards the heat source before the coolant exits the counter-flow medium; a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source, the thermal coupling structure including: one or more pressure distribution control structures modifying the form of the thermal coupling structure and configured to influence the flow of the coolant across the thermal coupling structure such that mass flux (e.g., mass flow per unit area) of coolant is more uniform across the thermal coupling structure and / or the distribution of the pressure gradient across the counter-flow medium is substantially uniform; a coolant inlet positioned on an opposite side of the counter-flow medium from the heat source, the coolant inlet being configured to guide the coolant into the cooler component and direct it to the counter-flow medium, the coolant inlet including: an inlet port on an external section of the cooler component configured to receive the coolant from a source outside the cooler component; and an inlet channelwithin the cooler component configured to transport the coolant from the inlet port to the counter-flow medium; a coolant outlet configured to guide the coolant out of the cooler component from the counterflow medium, the coolant outlet including: an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; and an outlet channel within the cooler component and positioned at least partially between the counter-flow medium and the heat source, the outlet channel being configured to transport the coolant from the counter-flow medium to the outlet port; and a cover plate assembly substantially positioned on the opposite side of the counter-flow medium from the heat source, the cover plate assembly being configured to house the coolant inlet and at least part of the coolant outlet, the cover plate assembly including: a cover positioned on an external side of the cooler component opposite the heat source, the cover housing the outlet port, the cover including: a coolant inlet cover access configured to provide an opening for the inlet port to reside in; an inlet outlet flow barrier plate positioned between the cover and the counterflow medium, the inlet outlet flow barrier plate configured to house the inlet port, a space between the inlet outlet flow barrier plate and the cover forming at least part of the outlet channel, the inlet outlet flow barrier plate further including: a cover seal joint surface substantially taking the form of a surface of the inlet outlet flow barrier plate opposite the counter-flow medium; an outlet flow shaping insert positioned between the outlet port and the cover seal joint surface, the outlet flow shaping insert being configured to direct the flow of the coolant to the outlet port from the outlet channel; and a flowresistant gap setter positioned between the cover seal joint surface and the cover, the flow-resistant gap setter being configured to abut the cover and to shape the flow of the coolant through the outlet channel such that the pressure distribution of the coolant is substantially uniform across the cover seal joint surface, the surface of the flow-resistant gap setter abutting the cover substantially taking on a teardrop shape; an inlet flow shaping insert positioned between the inlet port and the counter-flow medium, the inlet flow shaping insert configured to direct the flow of the coolant into the counter-flow medium such that a mass flux (e.g., mass flow per unit area) of the coolant is substantially uniform across the counter-flow medium; and a coupling gasket positioned between the counter-flow medium and the inlet outlet flow barrier plate, the coupling gasket configured to abut the counter-flow medium and the inlet outlet flow barrier plate, a space between the counter-flow medium and the inlet outlet flow barrier plate forming at least part of the inlet channel.

[0024] In some aspects, the techniques described herein relate to a cooler component wherein the inlet flow shaping insert is substantially conical shaped, the inlet flow shaping insert further including: one or more inlet flow shaping insert ports configured to allow the coolant to pass through the inlet flow shaping insert.

[0025] In some aspects, the techniques described herein relate to a cooler component wherein the inlet flow shaping insert substantially takes the form of a perforated screen, the inlet flow shaping insert further including: one or more inlet flow shaping insert ports configured to allow the coolant to pass through the inlet flow shaping insert.

[0026] This summary is provided to introduce a selection of concepts in a simplified form. The concepts are further described below in the Detailed Description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0027] Other implementations are also described and recited herein.Brief Description of the Figures

[0028] FIG. 1 illustrates an example cooler component within a computing rack in a data center.

[0029] FIG. 2 illustrates a side view of an example cooler component in thermal contact with a heat source.

[0030] FIG. 3 illustrates a cross-sectional view of an example cooler component with a heat source.

[0031] FIG. 4 illustrates a top view of an example portion of a counter-flow medium.

[0032] FIG. 5 illustrates a perspective view of an example cooler component from a bottom angle.

[0033] FIG. 6 illustrates a perspective view of an example cooler component from a top angle.

[0034] FIG. 7 illustrates an exploded view of an example cooler component from a top angle.

[0035] FIG. 8 illustrates a perspective view of an example counter-flow medium container.

[0036] FIG. 9 illustrates a cross-sectional view of an example counter-flow medium container.

[0037] FIG. 10 illustrates a cross-sectional view of an example portion of a counter-flow medium container.

[0038] FIG. 11 illustrates a perspective view of an example counter-flow medium with an example thermal coupling structure isolated from the rest of the cooler component.

[0039] FIG. 12 illustrates a perspective view of an example counter-flow medium with an example thermal coupling structure.

[0040] FIG. 13 illustrates an exploded view of an example cover plate assembly.

[0041] FIG. 14 illustrates a cross-sectional view of an example cooler component with an inlet flow shaping insert taking a substantially conical form.

[0042] FIG. 15 illustrates a partially exploded view of an example cooler component from a bottom angle with an inlet flow shaping insert substantially taking the form of a perforated screen.

[0043] FIG. 16 illustrates a cross-sectional view of an example cooler component with an inlet flow shaping insert substantially taking the form of a perforated screen.

[0044] FIG. 17 illustrates a top view of an example inlet flow shaping insert substantially taking the form of a perforated screen.

[0045] FIG. 18 illustrates a cross-sectional view of an example cooler component with coolant flow lines.

[0046] FIG. 19 illustrates a top view of an example inlet flow shaping insert with coolant flow lines and pressure distribution.

[0047] FIG. 20 illustrates a perspective view of example coolant flow lines.

[0048] FIG. 21 illustrates a perspective view of example coolant flow lines with pressure contours.

[0049] FIG. 22 illustrates a top view of an example temperature distribution across a heat source cooled by a cooler component without an inlet flow shaping insert.

[0050] FIG. 23 illustrates a top view of an example temperature distribution across a heat source cooled by a cooler component with an inlet flow shaping insert substantially taking the form of a perforated screen, the screen projected onto the view.

[0051] FIG. 24 illustrates a top view of an example temperature distribution across a heat source cooled by a cooler component with an inlet flow shaping insert taking the form of a substantially conical structure.

[0052] FIG. 25 illustrates a cross-sectional view of an example cooler component sectioned along the centerline of the inlet and outlet port.

[0053] FIG. 26 illustrates a cross-sectional view of an example cooler component and outlet port with coolant flow lines.

[0054] FIG. 27 shows example operations for using a cooler component.

[0055] FIG. 28 shows example operations for manufacturing a cooler component.

[0056] FIG. 29 shows example operations for a method of using a cooler component to recover waste heat.Detailed Description

[0057] Data center personnel are incentivized to find more efficient ways of cooling their computers due to the costs associated with operating cooling systems. Furthermore, more entities than just data centers are interested in managing heat emissions. Desktop computers, high performance and supercomputer systems, industrial systems, automobile, and aerospace manufacturers are a few examples of other entities that manage waste heat in their systems. Demand for supercomputing datacenters has also grown substantially with the advent of artificial intelligence which places a high demand for supercomputing resources.

[0058] Data centers typically have a demand for highly distributed cooling systems in order to adequately cool the many thousands to many tens to hundreds of thousands of components in the data centers. Cost effective methods for addressing the highly distributed cooling needs in these data centers are typically desirable.

[0059] As data center computer components (e.g., processors and graphics processing units) are designed to operate at progressively higher temperatures and data centers progressively become a more significant consumer of total available electric power, there is an opportunity for recovering waste heat from data centers and utilizing this higher temperature heat for other applications as long as the temperature of this waste heat is not significantly degraded (e.g., lowered) by the heat recovery systems.

[0060] Low cost, compact methods for efficient heat rejection as described herein may also find use in other systems that would benefit from the reduced cost and / or size of heat rejection systems that may affect other system performance parameters (e.g., vehicle drag and associated power loss, weight). Examples of these other applications may include, but are not limited to, aircraft, ground vehicles, laser systems, combustion engines, powerplants, and other combustion systems. Lower temperature examples of such applications may include, but are not limited to, detectors for instruments and other sensitive measuring devices, miniature refrigeration systems for components, refrigeration systems, low temperature waste heat recovering systems.

[0061] While some heat sources are relatively large and large-scale solutions may work well for them, other heat sources, such as the microprocessors in computer systems are relatively small. These heat sources require a small solution in order to achieve consistent cooling. Some large-scale cooling systems do not work effectively for small-scale heat sources. Unfortunately, manufacturing coolers of such small scales can be difficult and / or costly.

[0062] Cooler manufacturers consider what direction coolant moves relative to the heat being emitted from the heat source. In one method of cooling, called crossflow, the coolant moves across the surface of the heat source, perpendicular to the direction of heat emission. While a device with this method of cooling can be easier to manufacture, crossflow can result in uneven cooling due to the coolant being colder when it first thermally contacts the heat source than when it finishes thermally contacting the heat source. This is because of heat transfer to the coolant as it travels. Uneven cooling may risk hot spots unless the temperature of the coolant is lowered further before it enters the cooler, leading to increased costs. It can also require higher flow rates of coolant that degrades the quality (e.g., temperature) of waste heat. This degradation in quality of waste heat limits the secondaryapplications that may use this waste heat for other useful purposes (e.g., drying, chemical processing where heat may speed up rates of reactions, low temperature power generation, water remediation, adsorption refrigeration that operates from heat instead of electricity, heat rejection without requiring water evaporation). Given the large quantities of waste heat generated from server farms as they become more dominant in global power consumption, these secondary use cases become important because of the large quantities of waste heat that are available and otherwise wasted.

[0063] In another method of cooling, called counter-flow, the coolant moves towards the heat source, opposite from the direction of heat emission. This method of cooling may be advantageous as the coolant can be evenly distributed from the source, leading to more consistent cooling, further lowering operating costs or better protecting computer systems from hot spots. This method of cooling may also be advantageous in minimizing the degradation of temperature of the waste heat or lowering coolant flow rates. However, counter-flow systems can be difficult or costly to manufacture, particularly at small scales for heat sources such as small computer parts like those used in data centers.

[0064] The described technology utilizes a counter-flow architecture in order to achieve more efficient heat extraction. The described technology extracts heat from a heat source using coolant. The described technology includes a counter-flow medium configured to conduct heat away from the heat source and flow the coolant through the counter-flow medium toward the heat source. This described technology also overcomes one of the shortfalls of miniature counterflow heat exchangers: the cost to manufacture.

[0065] In one implementation, before pumping coolant through the cooler component, a device filters out contaminants to reduce the number of contaminants remaining in the coolant that may not readily pass through the microfluidic passageways, to promote the operation of the cooler component without obstructing the microfluidic passageways.

[0066] The coolant may be a variety of fluids (e.g., water, water mixtures with additives to prevent corrosion and / or biological growth, oils, electrically insulating dielectric oils to prevent catastrophic electrical failures in the advent of leaks, liquid nitrogen or other cryogenic fluids, thermally conductive gases, highly thermally conductive liquid metals). In one implementation, the coolant is water. In one implementation, the coolant is a water mixture with dissolved additives. In one implementation, the coolant is a dielectric oil. In one implementation, the coolant is a cryogenic fluid.

[0067] FIG. 1 illustrates an example cooler component 100 within a computing rack 102 in a data center 104. In one implementation, the data center 104 houses computing racks (e.g., computing rack 102) which are configured to house hardware (e.g., a motherboard 106) which are themselves used in computer systems. These computer systems are used for computing and data storage.

[0068] In one implementation, a data center 104 is an example environment in which the cooler component 100 may be found. The computing racks house hardware that contains heat sources (e.g., heat source 108), such as a central processing unit (CPU), graphics processing unit (GPU), microprocessor, computer processor, storage controller, or power supply, to which the cooler component 100 is attached and from which the cooler component 100 is configured to extract heat. Other example environments for hardware may include a home office with a desktop computer, an aircraft, an automobile or vehicle that generates waste heat, or other environments that contain computer chips or components that may require inexpensive, compact cooling. Additional examples may include, but are not limited to, laser systems, combustion engines, powerplants, other combustion systems that burn a fuel to operate, detectors, instruments and other sensitive measuring devices, combustion systems, miniature refrigeration systems for components, refrigeration systems, and low temperature waste heat recovering systems.

[0069] FIG. 2 illustrates a side view of an example cooler component 200 in thermal contact with a heat source 202. The cooler component 200 is configured to extract heat from the heat source 202. In one implementation, a conducting medium 204 is positioned between the heat source 202 and the cooler component 200 and configured to enhance thermal conduction between them. In one implementation, the conducting medium 204 is designed to help fill in microscopic air pockets that can increase thermal resistance to heat flow between the cooler component 200 and the heat source 202. In one implementation, the conducting medium 204 is a thermal paste. In one implementation, the conducting medium 204 is a thermally conductive pad. In one implementation, the conducting medium 204 is a thermally conductive pad made substantially out of silicone. In one implementation, the conducting medium 204 is a thermally conductive pad made substantially out of carbon. In another implementation, the conducting medium 204 is a liquid metal. In one implementation, the conducting medium 204 is a liquid metal that remains liquid over the temperature range the cooler is configured to operate. The footprint of the cooler component 200 may be substantially the same as the footprint of the heat source 202, or the footprints may not be substantially the same.

[0070] The cooler component 200 includes a counter-flow medium container 212 configured to house a counter-flow medium and a cover plate assembly 214. The counter-flow medium container 212 is positioned between the cover plate assembly 214 and the heat source 202. The cover plate assembly 214 further includes a coolant outlet 208 and a coolant inlet 206.

[0071] FIG. 3 illustrates a cross-sectional view of an example cooler component 300 with a heat source 302. In one implementation, a conducting medium 304 is positioned between the heat source 302 and the cooler component 300 in order to reduce thermal resistance between the two. This conducting medium 304 may conform to help fill microscopic air pockets due to surface imperfectionson the mating surfaces of the cooler component 300 and the heat source 302 to help reduce the thermal resistance between the two. The cooler component 300 further includes a counter-flow medium 310 containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways substantially towards the heat source 302 and to flow the heat substantially away from the heat source 302 via the thermally conductive material counter to the bulk flow line of the coolant through the microfluidic passageways. In FIG. 3, the coolant flow lines 322 show the path of the coolant through the cooler component 300. In FIG. 3, the heat flow lines 324 show the path of heat through the cooler component 300. In one implementation, the counter-flow medium 310 includes a microfluidic flow barrier (not shown, see: microfluidic flow barrier 1012 of FIG. 10) positioned on an external section of the counter-flow medium 310, the microfluidic flow barrier being configured to restrict flow and direct coolant towards the heat source 302 before the coolant exits the counter-flow medium 310.

[0072] The counter-flow medium 310 may have a width that is greater than its height. In one implementation, the height of the counter-flow medium 310 is measured along an axis pointing away from, or perpendicular to the surface of, the heat source 302. In one implementation. The width of the counter-flow medium 310 is measured perpendicular to the axis of the height of the counter-flow medium 310, or parallel to the surface of the heat source 302. If the counter-flow medium 310 is a rectangular prism, the width may be measured from one comer of the rectangular prism to another corner substantially the same distance away from the heat source. If the counter-flow medium 310 is a cylinder, the width may be measured as a diameter of the cylinder. In one implementation, the ratio of the height of the counter-flow medium 310 to the width of the counter-flow medium 310 may be 1 or less. In one implementation, the ratio of the height of the counter-flow medium 310 to the width of the counter-flow medium 310 may be less than 0.5. In one implementation, the ratio of the height of the counter-flow medium 310 to the width of the counter-flow medium 310 may be less than 0.1.

[0073] In one implementation, the cooler component 300 includes a coolant inlet 306 positioned on the opposite side of the counter-flow medium 310 from the heat source 302, the coolant inlet 306 being configured to guide coolant into the cooler component 300 and direct it to the counter-flow medium 310. The coolant inlet 306 includes an inlet port 346 and an inlet channel 326. The inlet port 346 is positioned on an external section of the cooler component 300 and configured to receive coolant from a source outside the cooler component 300. The inlet channel 326 is positioned within the cooler component 300 and configured to transport coolant from the inlet port 346 to the counter-flow medium 310. In one implementation, the inlet port 346 includes a reliable means for coupling to external fluid lines in order to reduce the risk that the fluid connections leak.

[0074] In one implementation, a coolant outlet 308 is configured to guide coolant out of the cooler component 300 from the counter-flow medium 310. The coolant outlet 308 includes an outlet port 344 and an outlet channel 328. The outlet port 344 is positioned on an external section of the cooler component 300 and is configured to discharge coolant from the cooler component 300. The outlet channel 328 is positioned within the cooler component 300 and is further positioned at least partially between the counter-flow medium 310 and the heat source 302. The outlet channel 328 is configured to transport coolant from the counter-flow medium 310 to the outlet port 344. In one implementation, the outlet port 344 includes a reliable means for coupling to external fluid lines in order to reduce the risk that the fluid connections leak.

[0075] In one implementation, the cooler component 300 further includes a thermal coupling structure 330 configured to be in fluidic communication with the counter-flow medium 310 using the coolant on one side of the thermal coupling structure 330. The thermal coupling structure 330 may be configured to be a low thermal resistance, conductive heat flow path with minimal thermal resistance between heat source 302 and counter-flow medium 310. The thermal coupling structure 330 is further configured to form a low thermal resistance heat flow path between the counter-flow medium 310 and the heat source 302 to conduct heat between the counter-flow medium 310 and the heat source 302. The thermal coupling structure 330 may further form the outlet channel 328 that allows coolant exiting the counter-flow medium 310 to propagate away from the counter-flow medium 310 and later to the outlet port 344. In one implementation, the thermal coupling structure 330 is configured to reduce thermal resistance between the heat source 302 and the counter-flow medium 310. In one implementation, the thermal coupling structure 330 is further configured to help provide a uniform temperature distribution across the heat source 302 without hot spots. In one implementation, the thermal coupling structure 330 is further configured to help maintain a more uniform fluid pressure distribution across the exit of the counter-flow medium 310 in order to help achieve a more uniform coolant mass flux (e.g., mass flow per unit area) through the counter-flow medium 310. In one implementation, the thermal coupling structure 330 is further configured to reduce heat flow from the heat source 302 that propagates into the coolant when the coolant is flowing through the outlet channel 328 as compared to the heat flow that propagates into the coolant when the coolant is flowing through the counter-flow medium 310. In one implementation, the thermal coupling structure 330 includes dome-shaped protrusions that contact the counter-flow medium 310 while allowing space for coolant to flow through. In one implementation, the thermal coupling structure 330 includes other shaped protrusions that contact the counter-flow medium 310 while allowing space for coolant to flow through. Multiple thermal coupling structures 330 may be used where each thermal coupling structure 330 may contribute to a more uniform fluid pressure and / or temperature distribution.

[0076] In one implementation, the cooler component 300 further includes an inlet flow shaping insert 352 positioned between the inlet port 346 and the counter-flow medium 310. The inlet flow shaping insert 352 is configured to direct the flow of the coolant into the counter-flow medium 310 such that the mass flux of the coolant is substantially uniform across the counter-flow medium 310. The various components of the cooler component 300 may best function together to achieve desired results such as a substantially uniform mass flux of coolant across the counter-flow medium 310. In one implementation, the inlet flow shaping insert 352 is a conical structure. In one implementation, the inlet flow shaping insert 352 works with the thermal coupling structure 330 and the outlet channel 328 to achieve a more uniform coolant mass flux (e.g., coolant mass flow per unit area) across the counter-flow medium 310. In another implementation, the inlet flow shaping insert 352 works with the thermal coupling structure 330 and the outlet channel 328 as well as the microfluidic flow barrier (e.g., microfluidic flow barrier 1012 of FIG. 10) to achieve a more uniform mass flux of coolant across the counter-flow medium 310.

[0077] In one implementation, the cooler component 300 further includes an outlet flow shaping insert 348 positioned within the outlet channel 328. The outlet flow shaping insert 348 is configured to direct the flow of the coolant to the outlet port 344 from the outlet channel 328. In one implementation, the outlet flow shaping insert 348 is a conical structure.

[0078] FIG. 4 illustrates a top view of an example portion of a counter-flow medium 400. In one implementation, the counter-flow medium 400 includes one or more layers of substantially uniform aggregate media particles (e.g., aggregate media particle 402) that may be bonded together to reduce thermal resistance between particles. In one implementation, the aggregate media particles are configured to take on a substantially hexagonal close-pack formation. In one implementation, the aggregate media particles are configured to take on a substantially cubic close-pack formation. In one implementation, two or more layers of aggregate media particles are used in order to achieve a longer fluid path length through the counter-flow medium 400 to achieve more efficient thermal energy transfer where 100% efficient means the coolant temperature exiting the counter-flow medium 400 achieves the heat source temperature.

[0079] The aggregate media particles are configured to be in thermal contact with neighboring aggregate media particles, wherein substantially uniform microfluidic passageways (e.g., microfluidic passageway 404) are present between the aggregate media particles. The aggregate media particles may be configured such that when coolant flows through the microfluidic passageways, the coolant impacts substantially the center of the aggregate media particle residing below the microfluidic passageway, allowing for more effective transfer of thermal energy from the aggregate media particle into the coolant. The aggregate media particles may be made of a variety of substantially thermallyconductive materials. In some implementations, the aggregate media particles are made of a material that is compatible with (e.g., does not substantially quickly corrode or otherwise degrade in the presence of) the coolant. In one implementation, the aggregate media particles may be made of one or more materials including but not limited to copper, brass, aluminum, zinc, iron, nickel, carbon, stainless steel, additional alloys of copper, aluminum, zinc, steel, nickel, carbon, as well as ceramics with high relatively high thermal conductivities (e.g., aluminum nitride, silicon carbide, beryllium oxide, silicon nitride, boron nitride, magnesium oxide, aluminum oxide, composite mixtures of ceramic powders, other ceramics). In one implementation, individual aggregate media particles may be made of materials different to those of the other individual aggregate media particles. In one implementation, the aggregate media particles may be produced by using a sintering of a mixture of material powders. In one implementation, the counter-flow medium 400 is made of aggregate media particles that are sinter bonded together at a temperature greater than 20 degrees Celsius. In one implementation, external pressure may be applied to promote bonding. In one implementation, the bonding of the aggregate media particles may be conducted in an inert gas atmosphere (e.g., N2, CO2, Ar, He) to attempt to inhibit oxides from forming during the bonding process. In one implementation, the bonding of the aggregate media particles may utilize a reducing gas atmosphere (e.g., H2) to attempt to inhibit or remove formations of oxides on the surfaces of the aggregate media particles that are bonded together. In one implementation, the bonding of the aggregate media particles may utilize a low-pressure vacuum atmosphere. In one implementation, the aggregate media particles may be non- permanently bonded together. In one implementation, the aggregate media particles may be bonded with an agent (e.g., wicking adhesive) that does not substantially fill the microfluidic passageways. In one implementation, the aggregate media particles are substantially spherical in shape. In one implementation, the aggregate media particles are approximately spheres with a diameter from 0.5 to 3mm. In one implementation, the counter-flow medium 400 is made up of a mixture of aggregate media particles of different shapes and sizes. In one implementation, the counter-flow medium 400 is comprised of a mixture of aggregate media particles that are made of different materials. In one implementation, the counter-flow medium 400 has an effective thermal conductivity of 1 to 500 Watts per meter Kelvin. The thermal conductivity of the counter-flow medium 400 may not be uniform.

[0080] The bonding characteristics of the aggregate media particles may be enhanced before bonding. In some implementations, the corrosion resistance of the aggregate media particles is enhanced. In some implementations, metal plating and / or applied coatings may be applied to the aggregate media particles to enhance bonding and / or corrosion resistance. In one implementation, the aggregate media particles may be metal plated with one or more plating layers prior to a subsequent bonding process. In one implementation, the aggregate media particles may be metal plated with oneor more plating layers following the bonding process. Plating materials may include, but are not limited to, plating metals such as nickel and / or a nickel alloy, tin and / or a tin alloy, copper and / or a copper alloy, zinc and / or a zinc alloy, chrome, or other plating alloys. A thin coating including a polymeric compound that cures or dries after application may be applied to the aggregate media particles. In one implementation, a coating to provide additional corrosion resistance or enhance bonding is applied to the aggregate media particles prior to the bonding process. In one implementation, a coating to provide additional corrosion resistance may be applied to the individual aggregate media particles that are not subsequently bonded. In one implementation, a coating to provide additional corrosion resistance may be applied after the aggregate media particles are bonded.

[0081] In one implementation, the counter-flow medium 400 is comprised of a stack of one or more screens. The screens may be bonded or partially bonded together. In one implementation, the screens are sinter bonded together with the application of heat and / or applied pressure. The sintering process may occur in an inert atmosphere, a reducing atmosphere, or an atmosphere less than atmospheric pressure to promote bonding. In one implementation, the stacked screens may have holes that are aligned. In one implementation, the holes in the screens are circular. The holes in the screens may be other shapes (e.g., hexagonal, triangular, rectangular, oblong). Increasing the tortuosity of the path the coolant takes through the counter-flow medium 400 may enhance heat transfer at some cost to pressure loss. In one implementation, the adjacent screens in a screen stack may have partially obstructed holes to enhance heat transfer into the coolant. In one implementation, the screens are produced from thin films of materials that are drilled or etched to produce an array of holes. In one implementation, the screens are material films that have been chemically etched or laser drilled to produce an array of holes. In another implementation, the screens are manufactured from woven meshes of wire. In one implementation, the screens may be manufactured from metals including, but not limited to, aluminum or aluminum alloys, copper or copper alloys, nickel or nickel alloys, zinc or zinc alloys, and ferrous metal alloys. In one implementation, the screens may be manufactured from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite).

[0082] The counter-flow medium hydraulic diameter may be the average cross-sectional area of all the fluid passageways when traversing through the counter-flow medium, divided by the average perimeters of these average fluid cross-sectional areas. In one implementation, the counter-flow medium hydraulic diameter is less than 0.1mm. In one implementation, the counter-flow medium hydraulic diameter is less than 0.5mm. In one implementation, the counter-flow medium hydraulic diameter is less than 1mm. The counter-flow medium hydraulic diameter may also be less than 10mmor even 3mm. In one implementation, the counter-flow medium hydraulic diameter is greater than 1 mm.

[0083] FIG. 5 illustrates a perspective view of an example cooler component 500 from a bottom angle. In FIG. 5, a counter-flow medium container 502 is adjoined to a cover plate assembly 504. The counter-flow medium container 502 contains the counter-flow medium along with additional internal fluid management features and may be bonded to a cover plate assembly 504 which may include other fluid management features.

[0084] FIG. 6 illustrates a perspective view of an example cooler component 600 from a top angle. In FIG. 6, a counter-flow medium container 606 is adjoined to a cover plate assembly 608. The cover plate assembly 608 includes a coolant inlet 602 and a coolant outlet 604.

[0085] FIG. 7 illustrates an exploded view of an example cooler component 700 from a top angle. In FIG. 7, a cover plate assembly 714 includes a coolant inlet 706 and a coolant outlet 708. In FIG. 7, a counter-flow medium container 712 includes a counter-flow medium 710, which may further include aggregate media particles (e.g., aggregate media particle 716). In some implementations, the counterflow medium 710 may be constructed by other means than aggregate media particles. In one implementation, the counter-flow medium 710 may be constructed of stacked screens or stacked meshes. In one implementation, when joined, the counter-flow medium container 712 and the cover plate assembly 714 provide a hermetic seal to prevent coolant flow leakage. In one implementation, the only flow of coolant into the cooler component 700 is configured to be through the coolant inlet 706 and the only flow of coolant out of the cooler component 700 is configured to be out the coolant outlet 708.

[0086] FIG. 8 illustrates a perspective view of an example counter-flow medium container 800. In FIG. 8, the counter-flow medium container 800 includes a counter-flow medium 802, which may further include aggregate media particles (e.g., aggregate media particle 804). In some implementations, the counter-flow medium 802 may be constructed by other means than aggregate media particles. In one implementation, the counter-flow medium 802 may be constructed of stacked screens or stacked meshes. An outlet channel 806 is positioned at least partially within the counterflow medium container 800. In one implementation, the outlet channel 806 flows coolant between two walls of the counter-flow medium container 800. One of the walls forms the outside of the counterflow medium container 800 and the other wall, residing inside the counter-flow medium container, forms a barrier between the counter-flow medium 802 and the portion of the outlet channel 806.

[0087] FIG. 9 illustrates a cross-sectional view of an example counter-flow medium container 900. The counter-flow medium container 900 may include a counter-flow medium container housing 914. The counter-flow medium container 900 further includes a counter-flow medium 904 containingmicrofluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material counter to the bulk flow line of the coolant through the microfluidic passageways. The counter-flow medium 904 may further include aggregate media particles (e.g., aggregate media particle 906). In some implementations, the counter-flow medium 904 may be constructed by other means than aggregate media particles. In one implementation, the counterflow medium 904 may be constructed of stacked screens or stacked meshes. In one implementation, the counter-flow medium 904 includes a microfluidic flow barrier (e.g., microfluidic flow barrier 912) positioned on an external section of the counter-flow medium 904, the microfluidic flow barrier being configured to direct coolant towards the heat source before the coolant exits the counter-flow medium 904.

[0088] In one implementation, a coolant outlet 902 is configured to guide coolant out of the cooler component from the counter-flow medium 904. In one implementation, the coolant is later guided out of the counter-flow medium container 900. The coolant outlet 902 includes an outlet channel 908. The outlet channel 908 is positioned within the counter-flow medium container 900 and is further positioned at least partially between the counter-flow medium 904 and the heat source. The outlet channel 908 is configured to transport coolant from the counter-flow medium 904 out of the counterflow medium container 900.

[0089] The counter-flow medium container housing 914 may provide a hermetic seal with a cover plate assembly for defining the external boundaries of the flow of the coolant. The footprint of the counter-flow medium container housing 914 may be similar to the footprint of the heat source (e.g., heat source 202 of FIG. 2). In one implementation, the counter-flow medium container housing 914 functions as a conductive heat flow path from the heat source to the counter-flow medium 904 through at least one wall of the counter-flow medium container housing 914.

[0090] In one implementation, the counter-flow medium container 900 further includes a thermal coupling structure 910 configured to be in fluidic communication with the counter-flow medium 904 using the coolant on one side of the thermal coupling structure 910. In one implementation, the thermal coupling structure 910 resides between the counter-flow medium 904 and the counter-flow medium container housing 914. The thermal coupling structure 910 is configured to form a low thermal resistance heat flow path between the counter-flow medium 904 and the heat source to conduct heat between the heat source and the counter-flow medium 904. In one implementation, the thermal coupling structure 910 is configured to form a low thermal resistance heat flow path between the counter-flow medium 904 and the counter-flow medium container housing 914. A low thermal resistance heat flow path may allow heat to more easily conduct. In one implementation, the thermalcoupling structure 910 is configured to conduct the heat from the heat source into the counter-flow medium container housing 914 and / or an external heat source. Additionally, the thermal coupling structure 910 may also function as the outlet channel 908 that may allow coolant to exit the counterflow medium 904 and to the coolant outlet 902. In one implementation, the thermal coupling structure 910 includes protrusions on the counter-flow medium container housing 914 that may contact the counter-flow medium 904. These protrusions may take the form of domes, cylinders, cones, spheres, other geometric shapes and / or a combination of these shapes. In one implementation, the thermal coupling structure 910 is part of the counter-flow medium container housing 914. In another implementation, the thermal coupling structure 910 is part of the counter-flow medium 904. In another implementation, the thermal coupling structure 910 is a separate, independent structure that is a part of the counter-flow medium container 900.

[0091] In one implementation, the counter-flow medium container housing 914 is made of a metal alloy (e.g., copper alloy, aluminum alloy, ferrous metal alloy, zinc alloy). In one implementation, the counter-flow medium container housing 914 is made of an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). In one implementation, the counter-flow medium container housing 914 is a single die cast metal part manufactured out of a metal alloy. In one implementation, the counter-flow medium container housing 914 and the thermal coupling structure 910 are a single die cast metal part manufactured out of a metal alloy. In one implementation, the counter-flow medium container housing 914 and the thermal coupling structure 910 are die cast parts made from an alloy of a metal that may include, but is not limited to, copper, aluminum, zinc, and ferrous metal. In one implementation, the counter-flow medium container housing 914 and the thermal coupling structure 910 may be stamped or forged made from an alloy of a metal that may include, but is not limited to, copper, aluminum, zinc, and ferrous metal. In one implementation, the counter-flow medium container housing 914 and the thermal coupling structure 910 are die-cast metal parts that are not manufactured from the same metal alloy. In one implementation, the thermal coupling structure 910 is bonded to the counter-flow medium container housing 914 after the counter-flow medium container housing 914 is manufactured. In one implementation, the thermal coupling structure 910 is bonded to the counter-flow medium 904 during or after the counter-flow medium 904 is formed. In one implementation, the thermal coupling structure 910 is part of and manufactured with the counter-flow medium 904. In one implementation, one or more of the counter-flow medium container housing 914 and counter-flow medium 904 are not bonded to the thermal coupling structure 910. In one implementation, the counter-flow medium container housing 914 and thermal coupling structure 910 are manufactured using a 3D metal printing manufacturing method. In one implementation, the thermal coupling structure is 3D printed onto thecounter-flow medium container housing 914 after the counter-flow medium container housing 914 is manufactured. In one implementation, one or more components of the counter-flow medium container 900 may be manufactured from plastics (e.g., injection molded plastics, thermoplastics, preformed plastics, 3D printed plastics).

[0092] After fabrication of the individual components of the counter-flow medium container 900 and prior to final assembly, the corrosion resistance of the individual components may be enhanced. This may protect the individual components when they are exposed to coolant, external atmosphere, and / or external thermal coupling substrates. The surfaces of the individual components of the counterflow medium container 900 may more easily bond with the other individual components after modification to facilitate bonding. In one implementation, in order to facilitate bonding, after forming, but prior to final assembly, one or more components of the counter-flow medium container 900 may be plated with single or multiple plating layers. The plating layers may consist of materials that are compatible with the component substrate materials. The plating materials may include, but are not limited to, plating metals (e.g., nickel and / or a nickel alloy, tin and / or a tin alloy, copper and / or a copper alloy, zinc and / or a zinc alloy, chrome, or other plating alloys). In one implementation with multiple plating layers, the same or different plating materials may be used for each layer. The process of plating the components may include, but is not limited to, an electroplating process or an electroless plating process. In one implementation, the metal plating process may be substituted with a coating process (e.g., polymeric coating process) in order to provide enhanced corrosion resistance and / or enhanced component bonding.

[0093] FIG. 10 illustrates a cross-sectional view of an example portion of a counter-flow medium container 1000. The counter-flow medium container 1000 further includes a counter-flow medium 1010 containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material counter to the bulk flow line of the coolant through the microfluidic passageways. The counter-flow medium 1010 may further include aggregate media particles (e.g., aggregate media particle 1002). In some implementations, the counterflow medium 1010 may be constructed by other means than aggregate media particles. In one implementation, the counter-flow medium 1010 may be constructed of stacked screens or stacked meshes. In one implementation, the counter-flow medium 1010 includes a microfluidic flow barrier (e.g., microfluidic flow barrier 1012 of FIG. 10) positioned on an external section of the counter-flow medium 1010, the microfluidic flow barrier being configured to direct coolant towards the heat source before the coolant exits the counter-flow medium 1010. In one implementation, the microfluidic flow barrier forms at least a portion of the boundary for the coolant outlet 1008. In one implementation, themicrofluidic flow barrier is a separate structure from the counter-flow medium 1010. In one implementation, the microfluidic flow barrier is a separate die cast part made from an alloy of a metal that may include, but is not limited to, copper, aluminum, zinc, or iron. In one implementation, the microfluidic flow barrier may include a coating or plating to provide corrosion resistance from the coolant. In one implementation, the microfluidic flow barrier is an injection molded and / or 3D printed plastic part that can be made of one or more plastics including, but not limited to, nylon or polyamide (PA), acrylic, polycarbonate (PC), polyoxymethylene (POM), polystyrene (PS), acrylonitrile butadiene styrene (ABS), polypropylene (PP), polyethylene (PE), thermoplastic polyurethane (TPU), thermoplastic rubber (TPR), PEEK, PEI, PPA, PAI, or PPS. In other implementations, the microfluidic flow barrier may be manufactured from different materials.

[0094] In one implementation, a coolant outlet 1008 is configured to guide coolant out of the cooler component from the counter-flow medium 1010. The coolant outlet 1008 includes an outlet channel 1004. The outlet channel 1004 is positioned within the counter-flow medium container 1000 and is further positioned at least partially between the counter-flow medium 1010 and the heat source. The outlet channel 1004 is configured to transport coolant from the counter-flow medium 1010 out of the counter-flow medium container 1000.

[0095] In one implementation, the outlet channel 1004 is positioned between the counter-flow medium 1010 and at least one wall of the counter-flow medium container housing 1014. In one implementation, the outlet channel 1004 is manufactured by machining or etching coolant flow paths into the counter-flow medium 1010. In one implementation, the outlet channel 1004 is defined by another structure (e.g. a thermal coupling structure).

[0096] In one implementation, the counter-flow medium container 1000 further includes a thermal coupling structure 1006 configured to be in fluidic communication with the counter-flow medium 1010 using the coolant on one side of the thermal coupling structure 1006. In one implementation, the thermal coupling structure 1006 is positioned between the counter-flow medium 1010 and the counterflow medium container housing 1014. The thermal coupling structure 1006 is configured to form a low thermal resistance heat flow path between the counter-flow medium 1010 and the heat source to conduct heat between the counter-flow medium 1010 and the heat source. In one implementation, the thermal coupling structure 1006 is configured to form a low thermal resistance heat flow path between the counter-flow medium 1010 and the counter-flow medium container housing 1014. A low thermal resistance heat flow path may allow heat to more easily conduct between two media. In one implementation, the thermal coupling structure 1006 functions as a low thermal resistance, conductive heat flow path between the counter-flow medium 1010 and the counter-flow medium container housing 1014 and / or an external heat source. The thermal coupling structure 1006 may form the outletchannel 1004. In one implementation, the thermal coupling structure 1006 is comprised of protrusions on the counter-flow medium container housing 1014 that may contact the counter-flow medium 1010. The protrusions may take the form of domes, cylinders, cones, spheres, other geometric shapes and / or combinations of these shapes. In one implementation, the thermal coupling structure 1006 is part of the counter-flow medium container housing 1014. In another implementation, the thermal coupling structure 1006 is part of the counter-flow medium 1010. In another implementation, the thermal coupling structure 1006 is an independent structure. In one implementation, the thermal coupling structure 1006 is made from a different material than one or more of the counter-flow medium container housing 1014 or the counter-flow medium 1010.

[0097] FIG. 11 illustrates a perspective view of an example counter-flow medium 1104 with an example thermal coupling structure 1102 isolated from the rest of the cooler component. In one implementation, the thermal coupling structure 1102 comprises of an array of inverted domes bonded to the bottom of a counter-flow medium 1104. In another implementation, the thermal coupling structure 1102 may comprise of an array of any other shapes (e.g., cubes, triangular prisms, bumps). In one implementation, the thermal coupling structure 1102 may be bonded to a counter-flow medium container housing.

[0098] FIG. 12 illustrates a perspective view 1200 of an example counter-flow medium 1206 with an example thermal coupling structure 1202. In one implementation, the thermal coupling structure 1202 comprises inverted domes bonded to the counter-flow medium 1206. In one implementation, the thermal coupling structure 1202 incorporates additional coolant channels (e.g., pressure distribution control structure 1204) by selectively removing some of the domes. The additional coolant channels in the thermal coupling structure 1202 may contribute to a more uniform pressure distribution across the thermal coupling structure 1202 by reducing the path length to the coolant outlet and the flow resistance for coolant exiting the counter-flow medium 1206 closer to the center of the thermal coupling structure 1202. Although removing portions of the thermal coupling structure 1202 may help to relieve pressure gradients across the thermal coupling structure 1202, the thermal resistance may be increased between the heat source and the counter-flow medium 1206 and hotspots may be created. In one implementation, the pressure distribution control structure (e.g., pressure distribution control structure 1204) may be created by selectively removing domes of the thermal coupling structure 1202. In one implementation, the pressure distribution control structure may be created by selectively removing other shaped protrusions that define the thermal coupling structure 1202. In one implementation, machining or fabrication processes are used to cut or etch channel features into a thermal coupling structure 1202 to create the pressure distribution control structure.

[0099] In one implementation, the pressure distribution control structures modify the form of the thermal coupling structure 1202 and are configured to influence the flow of the coolant across the thermal coupling structure 1202 such that the pressure distribution of the coolant is more uniform across the thermal coupling structure 1202.

[0100] FIG. 13 illustrates an exploded view of an example cover plate assembly 1300. The cover plate assembly 1300 is substantially positioned on the opposite side of the counter-flow medium from the heat source. The cover plate assembly 1300 is configured to house the coolant inlet 1302 and at least part of the coolant outlet 1304. The cover plate assembly 1300 further includes a cover 1340, an inlet outlet flow barrier plate 1356, an inlet flow shaping insert 1352, and a coupling gasket 1358.

[0101] The cover 1340 may be positioned on an external side of the cooler component opposite the heat source. In one implementation, the cover 1340 houses the outlet port 1344. In one implementation, the cover 1340 further includes a coolant inlet cover access 1342 configured to form an opening for the inlet port 1346 to reside in. In one implementation, the coolant inlet cover access 1342 is configured to create a coolant-proof seal with the inlet port 1346 in order to prevent coolant from escaping the cooler component. The outlet port 1344 may reside on a variety of locations on the cover 1340. In one implementation, the cover 1340 is made of an injection molded plastic (e.g., nylon or polyamide (PA), acrylic, polycarbonate (PC), polyoxymethylene (POM), polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polypropylene (PP), Polyethylene (PE), Thermoplastic Polyurethane (TPU), Thermoplastic Rubber (TPR), PEEK, PEI, PPA, PAI, PPS) that, over its operational temperature environment, may be dimensionally stable and / or not susceptible to swelling due to exposure to the coolant. In one implementation, the cover 1340 material may also be able to tolerate thermal cycling. In one implementation, the cover 1340 is made from a metal (e.g., aluminum alloy, copper alloy, zinc alloy, ferrous metal alloy) that has been machined. In one implementation, the cover 1340 is made from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). In one implementation, the cover 1340 is made of a die cast metal alloy (e.g., die-cast aluminum alloy, diecast copper alloy, die-cast zinc alloy). In one implementation, the cover 1340 is made of a cast iron alloy. In one implementation, the cover 1340 is made of multiple different materials. In one implementation, the fluid connections are made of a higher strength material (e.g., copper alloy, aluminum alloy, iron alloy, zinc alloy, ceramic, higher strength plastic, composite) that may be bonded in or inserted into the cover 1340. In one implementation, the cover 1340 is made of multiple materials. In one implementation, the material of the cover 1340 in contact with the coolant is metal and the material of the portion of the cover 1340 exposed to the air or external environment is plastic or another low thermal conductivity material (e.g., ceramic, foam, aerogel, other insulating material). In oneimplementation, after the cover 1340 is manufactured, it is plated with a single or multiple plating layers. The plating layers may consist of materials that are compatible with the component substrate materials. The plating materials may include, but are not limited to, plating metals (e.g., nickel and / or a nickel alloy, tin and / or a tin alloy, copper and / or a copper alloy, zinc and / or a zinc alloy, chrome, or other plating alloys). In one implementation, when multiple plating layers are used, the same or different plating materials may be used for each layer. The plating process may include, but is not necessarily limited to, an electroplating process or an electroless plating process. In one implementation, the metal plating process is substituted for a different coating process (e.g., polymeric coating process, ceramic coating process).

[0102] The inlet outlet flow barrier plate 1356 may be positioned between the cover 1340 and the counter-flow medium. The inlet outlet flow barrier plate 1356 is configured to house the inlet port 1346. The inlet port 1346 may reside on a variety of locations on the cover 1340. The space between the inlet outlet flow barrier plate 1356 and the cover 1340 is configured to form at least part of the outlet channel. The height of the coolant outlet (e.g., coolant outlet 1408 of FIG. 14) may be set by a flow-resistant gap setter 1350. In one implementation, the inlet outlet flow barrier plate 1356 further includes a cover seal joint surface 1354, an outlet flow shaping insert 1348, and a flow-resistant gap setter 1350. In one implementation, the inlet outlet flow barrier plate 1356 is made from a low thermal conductivity material in order to reduce heat transfer between the coolant inlet and coolant outlet fluid streams. The heat transfer between the coolant inlet and coolant outlet fluids streams may be undesirable as it may degrade the quality of heat in the exit coolant stream. In one implementation, the inlet outlet flow barrier plate 1356 is made from a material that has a lower thermal conductivity than the counter-flow medium (e.g., counter-flow medium 1410 of FIG. 14). In one implementation, the inlet outlet flow barrier plate 1356 is made of an injection-molded plastic (e.g., nylon or polyamide (PA), acrylic, polycarbonate (PC), polyoxymethylene (POM), polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polypropylene (PP), Polyethylene (PE), Thermoplastic Polyurethane (TPU), Thermoplastic Rubber (TPR), PEEK, PEI, PPA, PAI, PPS). In one implementation, the inlet outlet flow barrier plate 1356 is made from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). The inlet outlet flow barrier plate 1356 may be initially manufactured as separate components and subsequently bonded into a single assembly. In one implementation, components of the inlet outlet flow barrier plate 1356 are manufactured out of different materials.

[0103] The cover seal joint surface 1354 may substantially take the form of a surface of the inlet outlet flow barrier plate 1356 opposite the counter-flow medium. In one implementation, the cover seal joint surface 1354 is tapered or takes on other non-flat profiles.

[0104] The outlet flow shaping insert 1348 may be positioned between the outlet port 1344 and the cover seal joint surface 1354. The outlet flow shaping insert 1348 is configured to direct the flow of the coolant to the outlet port 1344 from the outlet channel. In one implementation, the outlet flow shaping insert 1348 takes the form of a conical structure with the tip pointing towards the outlet port 1344.

[0105] The flow-resistant gap setter 1350 may be positioned between the cover seal joint surface 1354 and the cover 1340. The flow-resistant gap setter 1350 is configured to abut the cover 1340. The flow-resistant gap setter 1350 may serve other functions such as shaping the flow of coolant through the coolant outlet (See: FIG. 19) in order to contribute to a more uniform coolant pressure distribution and / or a more uniform coolant mass flux across the porous media. In one implementation, the flowresistant gap setter 1350 is configured to shape the flow of the coolant through the outlet channel such that the pressure distribution of the coolant is substantially uniform across the cover seal joint surface 1354. In one implementation, the surface of the flow-resistant gap setter 1350 abutting the cover substantially takes on a teardrop shape. In one implementation, the flow-resistant gap setter 1350 includes a structure that modifies or narrows portions of the outlet channel in order to shape the flow of coolant through the outlet channel. In one implementation, the flow-resistant gap setter 1350 includes a combination of features that take on various shapes.

[0106] The outlet flow shaping insert 1348 may be positioned between the outlet port 1344 and the cover seal joint surface 1354. In one implementation, the outlet flow shaping insert 1348 is configured to direct the flow of the coolant to the outlet port 1344 from the outlet channel in order to reduce the turbulence of the coolant near the outlet port 1344. Without the outlet flow shaping insert 1348, the coolant may converge from a large surface area to the relatively smaller outlet port 1344, possibly producing vortices and / or other flow instabilities. In one implementation, the outlet flow shaping insert 1348 takes the form of a conical structure with the tip of the cone pointing towards the outlet port 1344.

[0107] The inlet flow shaping insert 1352 may be positioned between the inlet port 1346 and the counter-flow medium. The inlet flow shaping insert 1352 is configured to direct the flow of the coolant into the counter-flow medium such that the mass flux of the coolant is substantially uniform across the counter-flow medium. The inlet flow shaping insert 1352 may direct the flow of the coolant from the inlet port 1346 such that the pressure distribution and / or the mass flux of the coolant is substantially uniform across the counter-flow medium. The inlet flow shaping insert 1352 may be configured to influence other flow manipulation upstream and downstream of the counter-flow medium. In one implementation, the inlet flow shaping insert 1352 takes the form of a conical structure. In one implementation, the inlet flow shaping insert 1352 takes the form of a structure better suited to shapeor modify the flow of the coolant for the desired pressure distribution and / or more uniform mass flux of coolant across the counter-flow medium. The inlet flow shaping insert 1352 may partially obstruct coolant flow into the counter-flow medium. In one implementation, the inlet flow shaping insert 1352 includes one or more inlet flow shaping insert ports 1360 taking the form of openings on the inlet flow shaping insert 1352 and configured to allow coolant to pass substantially through the conical structure of the inlet flow shaping insert 1352. In one implementation, the inlet flow shaping insert 1352 includes one or more inlet flow shaping insert vanes 1362 taking the form of vertical barriers on the inlet flow shaping insert 1352 and configured to direct coolant along the lengths of the inlet flow shaping insert 1352 structure.

[0108] The coupling gasket 1358 may be positioned between the counter-flow medium and the inlet outlet flow barrier plate 1356. The coupling gasket 1358 is configured to abut the counter-flow medium and the inlet outlet flow barrier plate 1356. The space between the counter-flow medium and the inlet outlet flow barrier plate 1356 may form at least part of the inlet channel. The coupling gasket 1358 may prevent coolant from leaking into the coolant outlet before the coolant has passed through the counter-flow medium. In one implementation, the coupling gasket 1358 is made from a different material than one or more of the counter-flow medium and the inlet outlet flow barrier plate 1356. In one implementation, the coupling gasket is made of a material that is less thermally conductive than the material of the counter-flow medium and is compatible with the coolant (e.g., silicone, flourosilicone, neoprene, nitrile, EPDM, flouroelastomer, Butyl, silicone foam, polyurethane foam, filter foams, polyolefin, combinations of these materials). In one implementation, the coupling gasket 1358 is bonded to the inlet outlet flow barrier plate 1356. In one implementation, the inlet outlet flow barrier plate 1356 is configured to bond or retain the coupling gasket 1358. In one implementation, the coupling gasket 1358 is the same material and a part of the inlet outlet flow barrier plate 1356.

[0109] FIG. 14 illustrates a cross-sectional view of an example cooler component 1400 with an inlet flow shaping insert 1452 taking a substantially conical form. The cooler component 1400 includes a counter-flow medium 1410 containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material counter to the bulk flow line of the coolant through the microfluidic passageways. In one implementation, the counter-flow medium 1410 includes aggregate media particles (e.g., aggregate media particle 1416). In one implementation, the counter-flow medium 1410 includes a microfluidic flow barrier (e.g., microfluidic flow barrier 1438) positioned on an external section of the counter-flow medium 1410, the microfluidic flow barrier being configured to direct coolant towards the heat source before the coolant exits the counter-flow medium 1410.

[0110] In one implementation, the cooler component 1400 includes a coolant inlet 1406 positioned on the opposite side of the counter-flow medium 1410 from the heat source, the coolant inlet 1406 being configured to guide coolant into the cooler component 1400 and direct it to the counter-flow medium 1410. The coolant inlet 1406 includes an inlet port 1446 and an inlet channel 1426. The inlet port 1446 is positioned on an external section of the cooler component 1400 and configured to receive coolant from a source outside the cooler component 1400. The inlet channel 1426 is positioned within the cooler component 1400 and configured to transport coolant from the inlet port 1446 to the counterflow medium 1410. In one implementation, the inlet port 1446 includes a reliable means for coupling to fluid lines in order to reduce the risk that the fluid connections leak.

[0111] In one implementation, a coolant outlet 1408 is configured to guide coolant out of the cooler component 1400 from the counter-flow medium 1410. The coolant outlet 1408 includes an outlet channel 1428. The outlet channel 1428 is positioned within the cooler component 1400 and is further positioned at least partially between the counter-flow medium 1410 and the heat source. The outlet channel 1428 is configured to transport coolant from the counter-flow medium 1410 to the outlet port (not shown, see: outlet port 344 of FIG. 3).

[0112] In one implementation, the cooler component 1400 further includes a thermal coupling structure 1430 configured to be in fluidic communication with the counter-flow medium 1410 using the coolant on one side of the thermal coupling structure 1430. The thermal coupling structure 1430 is further configured to form a low thermal resistance heat flow path between the counter-flow medium 1410 and the heat source to conduct heat between the counter-flow medium 1410 and the heat source. In one implementation, the thermal coupling structure 1430 is configured to form a low thermal resistance heat flow path between the counter-flow medium 1410 and the counter-flow medium container housing. A low thermal resistance heat flow path may allow heat to more easily conduct between the counter-flow medium 1410 and the counter-flow medium container housing. In one implementation, the thermal coupling structure 1430 includes dome-shaped protrusions that contact the counter-flow medium 1410 while allowing space for coolant to flow through. In one implementation, the thermal coupling structure 1430 includes protrusions of other shapes and / or sizes (e.g., cube, triangular prism) that contact the counter-flow medium 1410 while allowing space for coolant to flow through.

[0113] In one implementation, the cooler component 1400 further includes an inlet flow shaping insert 1452 positioned between the inlet port 1446 and the counter-flow medium 1410. The inlet flow shaping insert 1452 is configured to direct the flow of the coolant into the counter-flow medium 1410 such that the mass flux of the coolant is substantially uniform across the counter-flow medium 1410. In one implementation, the inlet flow shaping insert 1452 is configured to direct the flow of the coolantinto the counter-flow medium 1410 such that the pressure distribution of the coolant is substantially uniform across the counter-flow medium 1410. In one implementation, the inlet flow shaping insert 1452 is a conical structure. In one implementation, the inlet flow shaping insert 1452 is a modified conical structure.

[0114] The cooler component 1400 may further include a cover plate assembly 1414. The cover plate assembly 1414 is substantially positioned on the opposite side of the counter-flow medium from the heat source. The cover plate assembly 1414 is configured to house the coolant inlet 1406. The cover plate assembly 1414 may further include a coolant outlet 1408. The cover plate assembly 1414 further includes a cover 1440, an inlet outlet flow barrier plate 1456, and a coupling gasket 1458. In one implementation, the inlet outlet flow barrier plate 1456 includes additional features to contribute to a more uniform mass flux through the counter-flow medium 1410 and / or reduce the overall pressure drop between the inlet port 1446 and the outlet port (not shown, see: outlet port 344 of FIG. 3).

[0115] The cover 1440 may be positioned on an external side of the cooler component opposite the heat source. In one implementation, the cover 1440 further includes a coolant inlet cover access 1442 configured to form an opening for the inlet port 1446 to reside in. In one implementation, the coolant inlet cover access 1442 is configured to create a coolant-proof seal with the inlet port 1446 in order to prevent coolant from escaping the cooler component. In one implementation, the cover 1440 is made of an injection molded plastic (e.g., nylon or polyamide (PA), acrylic, polycarbonate (PC), polyoxymethylene (POM), polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polypropylene (PP), Polyethylene (PE), Thermoplastic Polyurethane (TPU), Thermoplastic Rubber (TPR), PEEK, PEI, PPA, PAI, PPS) that, over its operational temperature environment, may be dimensionally stable and / or not susceptible to swelling due to exposure to the coolant. In one implementation, the cover 1440 is made from a metal (e.g., aluminum alloy, copper alloy, zinc alloy, ferrous metal alloy) that has been machined. In one implementation, the cover 1440 is made from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). In one implementation, the cover 1440 is made of a die cast metal alloy (e.g., die-cast aluminum alloy, die-cast copper alloy, die-cast zinc alloy). In one implementation, the cover 1440 is made of a cast iron alloy. In one implementation, the cover 1440 is formed with a stamping or forging operation. In one implementation, the cover 1440 is made of multiple different materials. In one implementation, the fluid connections are made of a higher strength material (e.g., copper alloy, aluminum alloy, iron alloy, zinc alloy, ceramic, higher strength plastic, composite) that may be bonded in or inserted into the cover 1440. In one implementation, the material of the portion of the cover 1440 in contact with the coolant is metal and the material of the portion of the cover 1440 exposed to the air or the external environment is plastic or another low thermal conductivity material(e.g., ceramic, foam, aerogel, or other insulating material). In one implementation, after the cover 1440 is formed, it is plated with a single or multiple plating layers. The plating layers may consist of materials that are compatible with the component substrate materials. The plating materials may include, but are not limited to, plating metals (e.g., nickel and / or a nickel alloy, tin and / or a tin alloy, copper and / or a copper alloy, zinc and / or a zinc alloy, chrome, or other plating alloys). In one implementation with multiple plating layers, the same or different plating materials may be used. The plating process may include, but is not necessarily limited to, an electroplating process or an electroless plating process. In one implementation, the metal plating process may be substituted for a different coating process (e.g., polymeric coating process, ceramic coating process).

[0116] The inlet outlet flow barrier plate 1456 may be positioned between the cover 1440 and the counter-flow medium 1410. The inlet outlet flow barrier plate 1456 is configured to house the inlet port 1446. The inlet port 1446 may reside on a variety of locations on the cover 1440. The space between the inlet outlet flow barrier plate 1456 and the cover 1440 is configured to form at least part of the outlet channel 1428. The height of the outlet channel 1428 may be determined by a flow-resistant gap setter 1450. In one implementation, the inlet outlet flow barrier plate 1456 further comprises a flow-resistant gap setter 1450.

[0117] In one implementation, the inlet surface 1462 is substantially parallel to the top of the counter-flow medium 1410. In one implementation, the inlet surface 1462 inclined at an angle relative to the top of the counter-flow medium 1410 in order to contribute to a more uniform pressure distribution and / or mass flux of coolant across the counter-flow medium 1410. In one implementation, the inlet outlet flow barrier plate 1456 is made of a different material with lower thermal conductivity than the counter-flow medium 1410. In one implementation, the inlet outlet flow barrier plate 1456 is made of an injection-molded plastic (e.g., nylon or polyamide (PA), acrylic, polycarbonate (PC), polyoxymethylene (POM), polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polypropylene (PP), Polyethylene (PE), Thermoplastic Polyurethane (TPU), Thermoplastic Rubber (TPR), PEEK, PEI, PPA, PAI, PPS). In one implementation, the inlet outlet flow barrier plate 1456 is made from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). In one implementation, the inlet outlet flow barrier plate 1456 and one or more of its component parts are manufactured separately and then bonded into a single assembly. In one implementation, different component parts of the inlet outlet flow barrier plate 1456 are manufactured from different materials and then bonded together into a single inlet outlet flow barrier plate 1456.

[0118] The inlet flow shaping insert 1452 may be positioned between the inlet port 1446 and the counter-flow medium 1410. The inlet flow shaping insert 1452 is configured to direct the flow of thecoolant into the counter-flow medium such that the mass flux of the coolant is substantially uniform across the counter-flow medium. In one implementation, the inlet flow shaping insert 1452 is configured to direct the flow of the coolant into the counter-flow medium 1410 such that the pressure distribution and / or mass flux of the coolant is substantially uniform across the counter-flow medium 1410. The inlet flow shaping insert 1452 may direct the flow of the coolant from the inlet port 1446 such that the pressure distribution and / or the mass flux of the coolant is substantially uniform across the counter-flow medium. The inlet flow shaping insert 1452 may configured to influence other flow manipulation upstream and downstream of the counter-flow medium. In one implementation, the inlet flow shaping insert 1452 takes the form of a conical structure. In one implementation, the inlet flow shaping insert 1452 takes the form of a structure better suited to shape the flow of the coolant for the desired pressure distribution and / or more uniform mass flux of coolant across the counter-flow medium. The inlet flow shaping insert 1452 may partially obstruct coolant flow into the counter-flow medium. In one implementation, the inlet flow shaping insert 1452 includes one or more inlet flow shaping insert ports 1460 taking the form of openings on the inlet flow shaping insert 1452 and configured to allow coolant to pass substantially through the conical structure of the inlet flow shaping insert 1452.

[0119] The coupling gasket 1458 may be positioned between the counter-flow medium and the inlet outlet flow barrier plate 1456. The coupling gasket 1458 is configured to abut the counter-flow medium and the inlet outlet flow barrier plate 1456. The space between the counter-flow medium and the inlet outlet flow barrier plate 1456 may form at least part of the inlet channel. The coupling gasket 1458 may prevent coolant from leaking into the coolant outlet before the coolant has passed through the counter-flow medium. In one implementation, the coupling gasket 1458 is made from a different material than one or more of the counter-flow medium and the inlet outlet flow barrier plate 1456. In one implementation, the coupling gasket is made of a material that is less thermally conductive than the material of the counter-flow medium and. is compatible with the coolant (e.g., silicone, flourosilicone, neoprene, nitrile, EPDM, flouroelastomer, Butyl, silicone foam, polyurethane foam, filter foams, polyolefin, combinations of these materials). In one implementation, the coupling gasket 1458 is bonded to the inlet outlet flow barrier plate 1456. In one implementation, the inlet outlet flow barrier plate 1456 is configured to bond or retain the coupling gasket 1458. In one implementation, the coupling gasket 1458 is the same material and a part of the inlet outlet flow barrier plate 1456.

[0120] FIG. 15 illustrates a partially exploded view of an example cooler component 1500 from a bottom angle. The cooler component includes a counter-flow medium container 1502 and a cover plate assembly 1504. The cover plate assembly 1504 further includes an inlet flow shaping insert 1506. In one implementation, the inlet flow shaping insert 1506 substantially takes the form of a perforatedscreen 1508. In one implementation, the inlet flow shaping insert 1506 is bonded to the cover plate assembly 1504. In one implementation, the coupling gasket 1510 is bonded to the cover plate assembly 1504.

[0121] FIG. 16 illustrates a cross-sectional view of an example cooler component 1600 with an inlet flow shaping insert 1652 substantially taking the form of a perforated screen 1664. The cooler component 1600 includes a counter-flow medium 1610 containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material counter to the bulk flow line of the coolant through the microfluidic passageways. In one implementation, the counter-flow medium 1610 includes aggregate media particles (e.g., aggregate media particle 1616). In some implementations, the counter-flow medium 1610 may be constructed by other means than aggregate media particles. In one implementation, the counter-flow medium 1610 may be constructed of stacked screens or stacked meshes. In one implementation, the counter-flow medium 1610 includes a microfluidic flow barrier (e.g., microfluidic flow barrier 1638) positioned on an external section of the counter-flow medium 1610, the microfluidic flow barrier being configured to direct coolant towards the heat source before the coolant exits the counter-flow medium 1610.

[0122] In one implementation, the cooler component 1600 includes a coolant inlet 1606 positioned on the opposite side of the counter-flow medium 1610 from the heat source, the coolant inlet 1606 being configured to guide coolant into the cooler component 1600 and direct it to the counter-flow medium 1610. The coolant inlet 1606 includes an inlet port 1646 and an inlet channel 1626. The inlet port 1646 is positioned on an external section of the cooler component 1600 and configured to receive coolant from a source outside the cooler component 1600. The inlet channel 1626 is positioned within the cooler component 1600 and configured to transport coolant from the inlet port 1646 to the counterflow medium 1610. In one implementation, the inlet port 1646 includes a reliable means for coupling to fluid lines in order to reduce the risk that the fluid connections leak.

[0123] In one implementation, a coolant outlet 1608 is configured to guide coolant out of the cooler component 1600 from the counter-flow medium 1610. The coolant outlet 1608 includes an outlet channel 1628. The outlet channel 1628 is positioned within the cooler component 1600 and is further positioned at least partially between the counter-flow medium 1610 and the heat source. The outlet channel 1628 is configured to transport coolant from the counter-flow medium 1610 to the outlet port (not shown, see: outlet port 344 of FIG. 3).

[0124] In one implementation, the cooler component 1600 further includes a thermal coupling structure 1630 positioned between the counter-flow medium 1610 and the counter-flow mediumcontainer housing 1666. The thermal coupling structure 1630 may be configured to form a low thermal resistance, conductive heat flow path between the counter-flow medium 1610 and the counter-flow medium container housing 1666 and / or an external heat source. The thermal coupling structure 1630 may also form the outlet channel 1628 which allows coolant to exit the counter-flow medium 1610 and propagate to the coolant outlet 1608. In one implementation, the thermal coupling structure 1630 is comprised of protrusions on the counter-flow medium container housing 1666 that contact the counter-flow medium 1610. The protrusions may take the form of domes, inverted domes, cylinders, cones, spheres, other geometric shapes and / or combinations of these shapes. In one implementation, the thermal coupling structure 1630 is part of the counter-flow medium container housing 1666. In one implementation, the thermal coupling structure 1630 is part of the counter-flow medium 1610. In one implementation, the thermal coupling structure 1630 is made of a different material than one or more of the counter-flow medium container housing 1666 or the counter-flow medium 1010.

[0125] In one implementation, the cooler component 1600 further includes an inlet flow shaping insert 1652 positioned between the inlet port 1646 and the counter-flow medium 1610. The inlet flow shaping insert 1652 is configured to direct the flow of the coolant into the counter-flow medium 1610 such that the mass flux of the coolant is substantially uniform across the counter-flow medium 1610. In one implementation, the inlet flow shaping insert 1652 is configured to direct the flow of the coolant into the counter-flow medium 1610 such that the pressure distribution and / or mass flux distribution of the coolant is substantially uniform across the counter-flow medium 1610. In one implementation, the inlet flow shaping insert works in concert with the other flow manipulation elements in the cooler component 1600 to achieve a near uniform mass flux of coolant through the counter-flow medium 1610. In one implementation, the inlet flow shaping insert 1652 substantially takes the form of a perforated screen 1664.

[0126] The cooler component 1600 further includes a cover plate assembly 1614. The cover plate assembly 1614 is substantially positioned on the opposite side of the counter-flow medium from the heat source. The cover plate assembly 1614 is configured to house the coolant inlet 1606. The cover plate assembly 1614 further includes a cover 1640, an inlet outlet flow barrier plate 1656, and a coupling gasket 1658.

[0127] The cover 1640 may be positioned on an external side of the cooler component opposite the heat source. In one implementation, the cover 1640 further includes a coolant inlet cover access 1642 configured to form an opening for the inlet port 1646 to reside in. In one implementation, the coolant inlet cover access 1642 is configured to create a coolant-proof seal with the inlet port 1646 in order to prevent coolant from escaping the cooler component. In one implementation, the cover 1640 is made of an injection molded plastic (e.g., nylon or polyamide (PA), acrylic, polycarbonate (PC),polyoxymethylene (POM), polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polypropylene (PP), Polyethylene (PE), Thermoplastic Polyurethane (TPU), Thermoplastic Rubber (TPR), PEEK, PEI, PPA, PAI, PPS) that, over its operational temperature environment, may be dimensionally stable and / or not susceptible to swelling due to exposure to the coolant. In one implementation, the cover 1640 material may also be able to tolerate thermal cycling. In one implementation, the cover 1640 is made from a metal (e.g., aluminum alloy, copper alloy, zinc alloy, ferrous metal alloy) that has been machined, cast, stamped, or forged. In one implementation, the cover 1640 is made from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). In one implementation, the cover 1640 is made of a die cast metal alloy (e.g., die-cast aluminum alloy, die-cast copper alloy, die-cast zinc alloy). In one implementation, the cover 1640 is made of a cast iron alloy. In one implementation, the cover 1640 is made of multiple different materials. In one implementation, the fluid connections are made of a higher strength material (e.g., copper alloy, aluminum alloy, iron alloy, zinc alloy, ceramic, higher strength plastic, composite) that may be bonded in or inserted into the cover 1640. In one implementation, the material of the cover 1640 in contact with the coolant is metal and the material of the portion of the cover 1640 exposed to the air or external environment is plastic or another low thermal conductivity material (e.g., ceramic, foam, aerogel, or other insulating material). In one implementation, after the cover 1640 is formed, the cover 1640 is plated with a single or multiple plating layers. The plating layers may consist of materials that are compatible with the component substrate materials. The plating materials may include, but are not limited to, plating metals (e.g., nickel and / or a nickel alloy, tin and / or a tin alloy, copper and / or a copper alloy, zinc and / or a zinc alloy, chrome, or other plating alloys). In one implementation with multiple plating layers, the same or different plating materials may be used. The plating process may include, but is not necessarily limited to, an electroplating process or an electroless plating process. In one implementation, the metal plating process may be substituted for a different coating process (e.g., polymeric coating process, ceramic coating process).

[0128] The inlet outlet flow barrier plate 1656 may be positioned between the cover 1640 and the counter-flow medium 1610. The inlet outlet flow barrier plate 1656 is configured to house the inlet port 1646. The inlet port 1646 may reside on a variety of locations on the cover 1640. The space between the inlet outlet flow barrier plate 1656 and the cover 1640 is configured to form at least part of the outlet channel 1628. In one implementation, the inlet outlet flow barrier plate 1656 further comprises a flow-resistant gap setter 1650. The height of the outlet channel may be determined by the flow-resistant gap setter 1650. In one implementation, the inlet outlet flow barrier plate 1656 is made from a different material than the counter-flow medium 1610, the material being less thermallyconductive than the material of the counter-flow medium 1610. In one implementation, the inlet outlet flow barrier plate 1656 is made of an injection-molded plastic (e.g., nylon or polyamide (PA), acrylic, polycarbonate (PC), polyoxymethylene (POM), polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), Polypropylene (PP), Polyethylene (PE), Thermoplastic Polyurethane (TPU), Thermoplastic Rubber (TPR), PEEK, PEI, PPA, PAI, PPS). In one implementation, the inlet outlet flow barrier plate 1656 is made from a material that has a lower thermal conductivity than the counter-flow medium 1610. In one implementation, the inlet outlet flow barrier plate 1656 is made from a metal (e.g., aluminum alloy, copper alloy, zinc alloy, ferrous metal alloy) that has been machined, cast, stamped, or forged. In one implementation, the inlet outlet flow barrier plate 1656 is made from an engineering ceramic (e.g., a metal oxide, a metal nitride, a metal carbide, aluminum oxide, magnesium oxide, zirconium oxide, a ceramic matrix composite). In one implementation, the inlet outlet flow barrier plate 1656 may be manufactured as separate components and subsequently bonded into a single assembly. In one implementation, different components of the inlet outlet flow barrier plate 1656 may be manufactured out of different materials.

[0129] The inlet flow shaping insert 1652 may be positioned between the inlet port 1646 and the counter-flow medium 1610. The inlet flow shaping insert 1652 is configured to direct the flow of the coolant into the counter-flow medium 1610 such that the mass flux of the coolant is substantially uniform across the counter-flow medium 1610. In one implementation, the inlet flow shaping insert 1652 is configured to direct the flow of the coolant into the counter-flow medium 1610 such that the pressure distribution of the coolant is substantially uniform across the counter-flow medium 1610. The inlet flow shaping insert 1652 may be configured to influence the flow of coolant upstream and downstream of the counter-flow medium 1610. In one implementation, the inlet flow shaping insert works in concert with other flow manipulation elements of the cooler component 1600 to achieve a near uniform mass flux across the counter-flow medium 1610. In one implementation, the inlet flow shaping insert 1652 includes one or more inlet flow shaping insert ports (not shown, see: inlet flow shaping insert ports 1704 of FIG. 17) taking the form of openings on the inlet flow shaping insert 1652 and configured to allow coolant to pass substantially through the structure of the inlet flow shaping insert 1652. In one implementation, a combination of a perforated screen 1664 and a conical inlet flow shaping insert (not shown, see: inlet flow shaping insert 1352 of FIG. 13) is configured to direct the flow of the coolant into the counter-flow medium 1610 such that the mass flux of the coolant is more uniform across the counter-flow medium 1610. In one implementation, the inlet flow shaping insert 1652 is configured to direct the flow of the coolant into the counter-flow medium 1610 such that the pressure distribution and / or mass flux of the coolant is substantially uniform across the counter-flow medium 1610.

[0130] The coupling gasket 1658 may be positioned between the counter-flow medium 1610 and the inlet outlet flow barrier plate 1656. The coupling gasket 1658 is configured to abut the counterflow medium 1610 and the inlet outlet flow barrier plate 1656. The space between the counter-flow medium 1610 and the inlet outlet flow barrier plate 1656 may form at least part of the inlet channel 1626. The coupling gasket 1658 may be configured to mitigate coolant leaking into the coolant outlet flow before the coolant has passed through the counter-flow medium 1610. In one implementation, the coupling gasket 1658 is made from a different material than the counter-flow medium 1610, the material being less thermally conductive than the material of the counter-flow medium 1610 and compatible with the coolant (e.g., silicone, flourosilicone, neoprene, nitrile, EPDM, flouroelastomer, Butyl, silicone foam, polyurethane foam, filter foams, polyolefin, combinations of these materials). In one implementation, the coupling gasket 1658 is bonded to the inlet outlet flow barrier plate 1656. In one implementation, the inlet outlet flow barrier plate 1656 includes a feature configured to bond or retain the coupling gasket 1658. In one implementation, the coupling gasket 1658 is the same material as and part of the inlet outlet flow barrier plate 1656.

[0131] FIG. 17 illustrates a top view of an example inlet flow shaping insert 1700. In one implementation, the inlet flow shaping insert 1700 substantially takes the form of a perforated screen 1702. The perforated screen 1702 may include a number of inlet flow shaping insert ports 1704 in order to distribute the coolant across the surface of the counter-flow medium opposite the heat source. In one implementation, the distribution of inlet flow shaping insert ports 1704 in the perforated screen 1702 is not uniform.

[0132] FIG. 18 illustrates a cross-sectional view of an example cooler component 1800 with coolant flow lines 1802. As shown in FIG. 18, coolant flow lines 1802 show the direction of the flow of coolant through the cooler component 1800. To flow through the cooler component 1800, the coolant enters at the coolant inlet 1804 and exits at the coolant outlet 1806. In one implementation, inlet eddy 1808 and inlet flow shaping insert eddy 1810 illustrate examples of eddies that may form during operation of the cooler component 1800. In one implementation, over the operational range of coolant flow rates, the eddies do not substantially impact the performance of the cooler. In one implementation, additional flow manipulation features are configured to reduce the formation of eddies are incorporated into the cover plate assembly.

[0133] FIG. 19 illustrates a top view of an example inlet flow shaping insert 1900 with coolant flow lines 1902 and pressure distribution. In one implementation, the inlet flow shaping insert 1900 substantially takes the form of a perforated screen 1904. As shown in FIG. 19, coolant flow lines 1902 show the direction of the flow of coolant through the inlet flow shaping insert 1900, as seen from the opposite side of the cooler component from the heat source. To flow through the cooler component,the coolant enters at the coolant inlet 1906 and exits at the coolant outlet 1908. In one implementation, outlet channel gap-setter 1910 may take the form of a teardrop or another profile to mitigate the formation of eddies in the outlet channel.

[0134] FIG. 20 illustrates a perspective view of example coolant flow lines 2000. The coolant flow lines 2000 show the direction of the flow of coolant through the cooler component. In FIG. 20, the cooler component structure is not shown in order to better show the coolant flow lines 2000. To flow through the cooler component, the coolant enters at the coolant inlet 2002 and exits at the coolant outlet 2004.

[0135] FIG. 21 illustrates a perspective view of example pressure contours 2100 through the cooler component. In FIG. 21, the cooler component structure is not shown in order to better show the pressure contours 2100. To flow through the cooler component, the coolant enters at the coolant inlet 2102 and exits at the coolant outlet 2104. In one implementation, flow features inside the cooler component are implemented to reduce pressure gradients across the inlet and outlet side of the counterflow medium.

[0136] FIG. 22 illustrates a top view of an example temperature distribution across a heat source cooled by a cooler component 2200 without an inlet flow shaping insert. As shown in FIG. 22, there is a substantial variation in temperature across the surface of the heat source.

[0137] FIG. 23 illustrates a top view of an example temperature distribution across a heat source cooled by a cooler component 2300 with an inlet flow shaping insert substantially taking the form of a perforated screen (not shown, see perforated screen 1702 of FIG. 17). As shown in FIG. 23, there is a less substantial variation in temperature across the surface of the heat source than there would be without any inlet flow shaping insert. In one implementation, features inside the cooler component are implemented to reduce the variation in temperature across the heat source to less than 10°C of variation. In one implementation, features inside the cooler component are implemented to reduce the variation in temperature across the heat source to less than 5°C of variation. In one implementation, features inside the cooler component are implemented to reduce the variation in temperature across the heat source to less than 3 °C of variation.

[0138] FIG. 24 illustrates a top view of an example temperature distribution across a heat source cooled by a cooler component 2400 with an inlet flow shaping insert taking the form of a substantially conical structure (not shown, see inlet flow shaping insert 1352 of FIG. 13). As shown in FIG. 24, there is a less substantial variation in temperature across the surface of the heat source than there would be without any inlet flow shaping insert or an inlet flow shaping insert substantially taking the form of a perforated screen. In one implementation, features inside the cooler component are implemented to reduce the variation in temperature across the heat source to less than 2°C of variation. In oneimplementation, features inside the cooler component are implemented to reduce the variation in temperature across the heat source to less than 1°C of variation.

[0139] FIG. 25 illustrates a cross-sectional view of an example cooler component 2500 sectioned along the centerline of the inlet port and the outlet port 2502. The cooler component 2500 is similar to the cooler component 1600 in FIG. 16, however FIG. 25 illustrates a different view in order to show an outlet port 2502 and an outlet flow shaping insert 2504. In one implementation, an outlet flow shaping insert 2504 is configured to mitigate eddies near the outlet port 2502.

[0140] FIG. 26 illustrates a cross-sectional view of an example cooler component 2600 and outlet port with coolant flow lines 2602. As shown in FIG. 26, coolant flow lines 2602 show the direction of the flow of coolant through the cooler component 2600. In one implementation, additional features in the cooler component 2600 are configured to mitigate the formation of eddies.

[0141] FIG. 27 shows example operations 2700 for a method of using a cooler component. An attachment operation 2702 attaches the cooler component to the heat source. The cooler component is placed such that it abuts the heat source, wherein the thermal coupling structure is in thermal contact with the heat source. The thermal coupling structure may or may not be in direct contact with the heat source. In one implementation, a conducting medium is placed between the cooler component and the heat source. In one implementation, the cooler component is secured using a clamping mechanism that holds the cooler component in the desired configuration. In one implementation, the cooler component comprises additional features that allow the cooler component to be attached in the desired configuration with fasteners (e.g., bolts, screws, rivets). In one implementation, the cooler component is bonded to the heat source in the desired configuration. The clamping mechanism may then be attached such that the clamping mechanism substantially prevents the cooler component from moving. In one implementation, the cooler component is secured using screws.

[0142] An inlet connection operation 2704 connects the inlet port to the supply of coolant to configure a functional fluid connection. In one implementation, the supply of coolant is a tube that carries fluid. The supply is positioned such that the outlet of the supply of coolant abuts the inlet port and the direction of the flow of coolant within the supply is pointed towards the inlet port. The inlet port and the supply are then functionally connected with a substantially fluid-tight seal such that fluid is configured to not leak out of the connection.

[0143] An outlet connection operation 2706 connects the outlet port to the drain of coolant to configure a functional fluid connection. In one implementation, the drain of coolant is a tube that carries fluid. The drain is positioned such that the inlet of the drain of coolant abuts the outlet port and the direction of the flow of coolant within the drain is pointed away from the outlet port. The outletport and the drain are then functionally connected with a substantially fluid-tight seal such that fluid is configured to not leak out of the connection.

[0144] A configuration operation 2708 configures the coolant system to supply coolant to the cooler component. In one implementation, this is accomplished by switching on the coolant system such that coolant is provided by the supply of coolant and coolant is able to drain into the drain of coolant. Coolant will flow from the supply of coolant through the cooler component and into the drain of coolant.

[0145] In one implementation, the drain of coolant flows through another heat dissipation heat exchanger that extracts heat before returning the coolant back to the supply of coolant or the cooler component. In one implementation, the extracted heat from the heat dissipation heat exchanger is rejected to the atmosphere as waste heat. In one implementation, the extracted heat from the heat dissipation heat exchanger is transferred to another fluid. In one implementation, the extracted heat from the heat dissipation heat exchanger is utilized in another application.

[0146] FIG. 28 shows example operations 2800 for a method of manufacturing a cooler component. A populate operation 2802 may be included or may be skipped. In one implementation, the populate operation 2802 is skipped because the user is manufacturing a cooler component with screens instead of aggregate media particles. The populate operation 2802 populates the aggregate media particles or screens into a holder. In one implementation, the aggregate media particles or screens are arranged into substantially the configuration the manufacturer is attempting to produce. In one implementation, aggregate media particles are inserted into the holder until two or more layers of aggregate media particles are in a substantially hexagonal close-pack formation. In one implementation, aggregate media particles are inserted into the holder until two or more layers of aggregate media particles are in a substantially cubic close-pack formation. In one implementation, screens are inserted into the holder until there are at least three layers of screens. The aggregate media particles or screens may be a variety of thermally conductive metal materials (e.g., aluminum alloys, copper alloys, zinc alloys, ferrous alloys). The aggregate media particles or screens may be a variety of thermally conductive ceramic materials (e.g., metal nitrides, metal carbides, metal oxides).

[0147] In one implementation, a formation operation 2804 forms the counter-flow medium from the aggregate media particles. In one implementation, the aggregate media particles are prepared by removing contamination. In one implementation, the aggregate media particles are further prepared by removing any metal oxide layer on the outside of the aggregate media particles prior to formation. In one implementation, the metal oxide layer is removed by placing the aggregate media particlse in a bath (e.g., weak acid, reducing agent) that dissolves the oxide layer. In one implementation, the aggregate media particles are compressed in order to increase the surface area of the aggregate mediaparticles in contact with one another and / or to promote bonding. In one implementation, the aggregate media particles are coated with an adhesive glue in order to facilitate formation of the counter-flow medium. In one implementation, the aggregate media particles are sintered by heating the aggregate media particles to a temperature below the melting point of the material of the aggregate media particles. In one implementation, in order to prevent oxidation of the materials during formation of the counter-flow medium, an inert fluid (e.g., nitrogen gas, argon) or reducing gas (e.g., H2) is flowed between the aggregate media particles. This may prevent the oxidized material from hindering the binding of the aggregate media particles and from increasing the thermal resistance between the aggregate media particles. In one implementation, the aggregate media particles are sintered at the same time that they are pressed together in order to reduce the number of manufacturing steps. In one implementation, the aggregate media particles are bonded with adhesive glue at the same time that they are pressed together in order to reduce the number of manufacturing steps. In one implementation, the adhesive can be incorporated into a solvent which is either pre-applied or flowed through the aggregate media particles, allowing for the solvent to be evaporated away through any combination of time, heat, or low pressure to substantially leave the condensed adhesive on the surface of the aggregate media particles. In one implementation, the aggregate media particles are pre-pressed before an adhesive is applied in order to facilitate less adhesive being present between the contacting surfaces of the aggregate media particles. In one implementation, a metal plating layer is applied by chemically building up thin layers of metal (e.g., copper and / or copper alloy, nickel and / or nickel alloy, tin and / or tin alloy, zinc and / or zinc alloy) on the aggregate media particles in order to adjoin the aggregate media particles. In one implementation, the plating is an electroless plating process. In one implementation, the aggregate media particles are populated into a cavity within a portion of the cooler component configured to house the counter-flow medium. After the formation operation 2804, the counter-flow medium will be formed.

[0148] In one implementation, a formation operation 2804 forms the counter-flow medium from screens. In one implementation, the screens are precut to shape and size prior to additional preparation steps. The screens may be precut by masking and etching, laser cutting, waterjet cutting, stamping, or by a combination of these steps. In one implementation, the screens are prepared by removing contamination. In one implementation, the screens are further prepared by removing any metal oxide layer on the outside of the screens prior to formation. In one implementation, the metal oxide layer is removed by placing the screens in a bath (e.g., weak acid, reducing agent) that dissolves the oxide layer. In one implementation, the screens are compressed in order to promote bonding and / or to increase the surface area of the screens in contact with one another. In one implementation, the screens are coated with an adhesive glue in order to facilitate formation of the counter-flow medium. In oneimplementation, the screens are sintered by heating the screens to a temperature below the melting point of the material of the screens. In one implementation, in order to prevent oxidation of the materials during formation of the counter-flow medium, an inert fluid (e.g., nitrogen gas, argon) or reducing gas (e.g., H2) is flowed between the screens to prevent the oxidized material from hindering the binding of the screens and to decrease the thermal resistance between the screens. In one implementation, the screens are sintered at the same time that they are pressed together in order to reduce the total number of manufacturing steps. In one implementation, the screens are bonded with adhesive glue at the same time that they are pressed together in order to reduce the total number of manufacturing steps. In one implementation, the adhesive is incorporated into a solvent which is either pre-applied or flowed through the screens, allowing for the solvent to be evaporated away through any combination of time, heat, or low pressure to substantially leave the condensed adhesive on the surface of the screens. In one implementation, the screens are pre-pressed before an adhesive is applied in order to facilitate less adhesive being present between the contacting surfaces of the screens. In one implementation, a metal plating layer is applied by chemically building up thin layers of metal (e.g., copper and / or copper alloy, nickel and / or nickel alloy, tin and / or tin alloy, zinc and / or zinc alloy) on the screens in order to adjoin the screens. In one implementation, the plating is an electroless plating process. In one implementation, the screens are populated into a cavity within a portion of the cooler component configured to house the counter-flow medium. After the formation operation 2804, the counter-flow medium will be formed.

[0149] A placement operation 2806 places the counter-flow medium into the counter-flow medium container. In one implementation, the formed counter-flow medium is taken from a holder and positioned within a cavity of the counter-flow medium container. In one implementation, the counterflow medium is secured into the counter-flow medium container. In one implementation, where the counter-flow medium is formed within the counter-flow medium container, the placement operation is completed by placing the aggregate media particles or screens within the counter-flow medium container.

[0150] An attachment operation 2808 attaches the cover plate assembly to the counter-flow medium container. In one implementation, the inlet flow shaping insert is placed on the counter-flow medium before the cover plate assembly is attached. In one implementation, the cover plate assembly is positioned such that the coupling gasket abuts the counter-flow medium container and the edges of the cover plate assembly, and the counter-flow medium container substantially align. The cover plate assembly and the counter-flow medium container are then attached to one another. In one implementation, they are attached with fasteners (e.g., bolts, screws) and an additional gasket at thejoining surface may be included. In one implementation, they are attached with an adhesive. In one implementation, they are attached by being bonded to one another.

[0151] FIG. 29 shows example operations 2900 for a method of using a cooler component to recover waste heat. In one implementation, an attachment operation 2902 attaches a cooler component to a heat source. The cooler component is placed such that it abuts the heat source, wherein the thermal coupling structure is in contact with the heat source. In one implementation, a conducting medium is placed between the cooler component and the heat source. In one implementation, the cooler component is secured using a clamping mechanism that holds the cooler component in the desired configuration. In one implementation, the cooler component comprises additional features that allow the cooler component to be attached in the desired configuration with fasteners (e.g., bolts, screws, rivets). In one implementation, the cooler component is bonded to the heat source in the desired configuration. The clamping mechanism may then be attached such that the clamping mechanism substantially prevents the cooler component from moving. In one implementation, the cooler component is secured using screws.

[0152] In one implementation, a connection operation 2904 fluidly connects an outlet port of the cooler component to a recovery inlet of a secondary system to configure a functional fluid connection. The secondary system may be configured to utilize the heat of heated fluid for a secondary application. In one implementation, a fluid line configured to transport fluid connects the outlet port of the cooler component to the recovery inlet of the secondary system. The fluid line may be a tube. The fluid line is positioned such that one end of the fluid line abuts the outlet port and the direction of the flow of the coolant within the fluid line is pointed towards the recovery inlet. The recovery inlet and the outlet port are then functionally connected with a substantially fluid-tight seal such that fluid is configured to not leak out of the connection.

[0153] In one implementation, an adjustment operation 2906 adjusts the rate of flow of coolant through the cooler component in order to achieve temperatures of coolant through the coolant outlet port that are substantially similar to the heat source. In one implementation, the rate of flow of coolant is adjusted by at least partially implementing or removing a barrier that at least partially blocks the flow of the coolant. The temperature of the coolant and / or the heat source may be monitored with a thermometer. In one implementation, the rate of flow of coolant is lowered in order to increase the temperature of the coolant to a temperature closer to the temperature of the heat source by increasing the amount of time the coolant spends in thermal contact with the heat source. In one implementation, the rate of flow of coolant is raised in order to decrease the temperature of the coolant relative to the temperature of the heat source.

[0154] In one implementation, the temperature of the coolant is adjusted to be within 10°C of the temperature of the heat source. In one implementation, the temperature of the coolant is adjusted to be within 5°C of the temperature of the heat source. In one implementation, the temperature of the coolant is adjusted to be within 3°C of the temperature of the heat source. In one implementation, the temperature of the coolant is adjusted to be within 2°C of the temperature of the heat source. In one implementation, the temperature of the coolant is adjusted to be within approximately 1°C of the temperature of the heat source.

[0155] In one implementation, a recovery operation 2908 recovers the energy of the heat of the coolant for a secondary application in the secondary system. In one implementation, the heat of the coolant is recovered by sending the coolant through a system which can utilize the heat of the coolant. In one implementation, the energy of the heat of the coolant is transferred to another medium (e.g., fluid, conductor).

[0156] In one implementation, a recycling operation 2910 recycles the coolant back into the cooler component. A separate functional fluid connection may be established between an outlet of the secondary system and an inlet port of the cooler component. After having its heat utilized, the coolant may be sent back to the cooler component in order to go through the cooler component again, acquiring more heat. The recycling operation 2910 may be optional in some systems.

[0157] In one implementation, a utilization operation 2912 utilizes the recovered heat of the coolant from the recovery operation 2908 for the secondary application. The heat of the coolant may be utilized for processes that require fluids of a certain temperature. In one implementation, the coolant and its heat are used in chemical processing where high-temperature fluids can be utilized to speed up reaction rates. In one implementation, the coolant and its heat are used for power generation.

[0158] In some implementations, the function of the cooler component can be modified such that the cooler component becomes a heating component for providing a heat that is close to the temperature of the heating fluid. In this implementation, the coolant would be a heating fluid. The inlet and outlet ports as discussed for the cooling application would be swapped. In this implementation, the inlet port for the heating fluid would be the exit port for the coolant. Similarly, the exit port for the heating fluid would be the inlet port for the coolant. This heating component may incorporate modifications of the internal flow manipulation features to achieve a substantially uniform mass flux across the counter-flow medium when running the heating fluid in an opposite direction to the original coolant. In this implementation, the heating component would be configured to transfer heat to the heat source. The heat source would become a heat sink.

[0159] In one implementation, a heat transfer component transfers heat between a heat source and a heat sink using a heat transfer fluid. The heat transfer component comprises a counter-flow mediumcontaining passageways formed in thermally conductive material and configured to flow the heat transfer fluid through the passageways in a first direction and to flow the heat via the thermally conductive material in a second direction substantially opposite to a bulk flow line of the heat transfer fluid through the passageways.

[0160] In one implementation, the counter-flow medium has a thickness measured along the first direction and a width measured along a third direction perpendicular to the first direction, and wherein a ratio of the thickness to the width may be less than 1 : 10. In one implementation, the first direction points towards the heat source. In one implementation, the first direction points towards the heat sink. In one implementation, the second direction is substantially opposite the first direction. In one implementation, the first direction and the second direction are parallel.

[0161] The ratio of the thickness to the width may be less than 1 :5, or preferably less than 1 : 10, or even less than 1 :20. In one implementation, the ratio of the thickness to the width is less than 1 : 1. In one implementation, the ratio of the thickness to the width is less than 1 :2. The ratio of the thickness to the width may be greater than 1 :40. In one implementation, the thickness is less than 2cm. The thickness may be less than 1cm, or even less than 0.5cm. The thickness may be greater than 0.1cm, or even greater than 1cm. In some implementations, the thickness of the cooler may be greater than 5cm or even 10cm.

[0162] In one implementation, a mass flux of heat transfer fluid across the counter-flow medium is substantially uniform. In one implementation, one or more of the passageways includes a microfluidic passageway.

[0163] In one implementation, the bulk flow line of the heat transfer fluid is the average direction of flow of heat transfer fluid through the counter-flow medium, and wherein substantially opposite to the bulk flow line may include within a two-degree angle of a direction opposite the bulk flow line of the heat transfer fluid. The bulk flow line of the heat transfer fluid may be the first direction. Substantially opposite to the bulk flow line may include within a five-degree angle of a direction opposite the bulk flow line of the heat transfer fluid, or even with a one-degree angle. In one implementation, substantially opposite to the bulk flow line may include within a ten-degree angle of a direction opposite the bulk flow line of the heat transfer fluid.

[0164] In one implementation, substantially opposite to the bulk flow line may include within an angle of a direction parallel to the direction of bulk heat flow line through the counter-flow medium. The bulk flow line of the heat through the counter-flow medium may be the second direction. Substantially opposite to the bulk flow line may include within a five-degree angle of a direction parallel to the direction of bulk heat flow line through the counter-flow medium, or even with a one- degree angle. In one implementation, substantially opposite to the bulk flow line may include withina ten-degree angle of a direction parallel to the direction of bulk heat flow line through the counterflow medium.

[0165] In one implementation, the bulk flow line of the heat transfer fluid is the average direction of flow of heat transfer fluid through the counter-flow medium and substantially opposite of the direction of bulk heat flow line from the heat source. In one implementation, the bulk flow line of the heat transfer fluid is the average direction of flow of heat transfer fluid through the counter-flow medium and substantially opposite of the direction of bulk heat flow line to a heat sink. In one implementation, the angle between the bulk flow line of the heat transfer fluid and the bulk heat flow line from / to a heat source / heat sink is less than two degrees. In one implementation, the angle between the bulk flow line of the heat transfer fluid and the bulk heat flow line from / to a heat source / heat sink is less than five degrees. In one implementation, the angle between the bulk flow line of the heat transfer fluid and the bulk heat flow line from / to a heat source / heat sink is less than ten degrees. In one implementation, the angle between the bulk flow line of the heat transfer fluid and the bulk heat flow line from / to a heat source / heat sink is less than about twenty degrees. The angle between the bulk flow line of the heat transfer fluid and the bulk heat flow line to a heat sink or from a heat source may be less than ten, five, or even two degrees.

[0166] In one implementation, the heat transfer component further comprises a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the heat transfer fluid on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source or the heat sink, the low thermal resistance heat flow path being configured to conduct heat between the counter-flow medium and the heat source or the heat sink, wherein the thermal coupling structure contributes to a more uniform temperature distribution across the thermal coupling structure, wherein the counter-flow medium further comprises one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal close-pack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, and wherein substantially uniform microfluidic passageways are present between the aggregate media particles.

[0167] In one implementation, the thermal coupling structure further comprises protrusions configured to be in thermal contact with the counter-flow medium. In one implementation, at least one protrusion has a first volume, wherein at least one aggregate media particles has a second volume, and wherein the ratio of the first volume to the second volume may be between 1 : 1 and 10: 1. In another aspect, the ratio of the first volume to the second volume may be between 2: 1 and 10: 1.

[0168] In one implementation, the ratio of the first volume to the second volume may be not less than 0.1 : 1, with any of the following endpoints provided that the upper limit is larger than the smallerlimit. The ratio of the first volume to the second volume may be not less than 1 : 1, not less than 5: 1, or even not less than 10: 1. The ratio of the first volume to the second volume may be not greater than 2: 1, not greater than 5: 1, not greater than 10: 1, not greater than 20 : 1 , or even not greater than 100: 1.

[0169] The thermal coupling structure may further include a thermal coupling structure hydraulic diameter and the counter-flow medium includes a counter-flow medium hydraulic diameter. The thermal coupling structure hydraulic diameter may be the average cross-sectional area of the fluid passageway when traversing through the thermal coupling structure volume, divided by the average perimeter of the average cross-sectional area of the fluid passageway. The thermal coupling structure hydraulic diameter may be at least as large as the counter-flow medium hydraulic diameter. The thermal coupling structure hydraulic diameter may be twice or more times as large as the counter-flow medium hydraulic diameter, or even three or more times as large as the counter-flow medium hydraulic diameter. In one implementation, the thermal coupling structure hydraulic diameter is at least five times as large as the counter-flow medium hydraulic diameter. In another implementation, the thermal coupling structure hydraulic diameter is at least ten times as large as the counter-flow medium hydraulic diameter.

[0170] The thermal coupling structure hydraulic diameter may be larger than the counter-flow medium hydraulic diameter in order to reduce the heat transfer between the heat transfer fluid and the thermal coupling structure. This may be due to the decreased surface area of the thermal coupling structure in contact with the heat transfer fluid. In one implementation, the proportion of the heat transfer to or from the heat transfer fluid that occurs in the counter-flow medium is configured to be increased.

Claims

ClaimsWHAT IS CLAIMED IS:

1. A heat transfer component for transferring heat between a heat source and a heat sink using a heat transfer fluid, the heat transfer component comprising: a counter-flow medium containing passageways formed in thermally conductive material and configured to flow the heat transfer fluid through the passageways in a first direction and to flow the heat via the thermally conductive material in a second direction substantially opposite to a bulk flow line of the heat transfer fluid through the passageways.

2. The heat transfer component of claim 1, wherein the counter-flow medium has a thickness measured along the first direction and a width measured along a third direction perpendicular to the first direction, and wherein a ratio of the thickness to the width is less than 1 : 10.

3. The heat transfer component of claim 1, wherein the counter-flow medium has a thickness measured along the first direction and a width measured along a third direction perpendicular to the first direction, and wherein a ratio of the thickness to the width is less than 1 :5.

4. The heat transfer component of claim 1, wherein a mass flux of the heat transfer fluid across the counter-flow medium is substantially uniform.

5. The heat transfer component of claim 1, wherein one or more of the passageways includes a microfluidic passageway.

6. The heat transfer component of claim 1, wherein the bulk flow line of the heat transfer fluid is an average direction of flow of the heat transfer fluid through the counter-flow medium, and wherein substantially opposite to the bulk flow line includes within a ten-degree angle of a direction opposite the bulk flow line of the heat transfer fluid.

7. The heat transfer component of claim 1, wherein the angle between the bulk flow line of the heat transfer fluid and a bulk heat flow line to the heat sink or from the heat source is less than ten degrees.

8. The heat transfer component of claim 1, wherein the angle between the bulk flow line of the heat transfer fluid and a bulk heat flow line to the heat sink or from the heat source is less than five degrees.

9. The heat transfer component of claim 1, wherein the angle between the bulk flow line of the heat transfer fluid and a bulk heat flow line to the heat sink or from the heat source is less than two degrees.

10. The heat transfer component of claim 1, wherein substantially opposite to the bulk flow line includes within a ten-degree angle of a direction parallel to the direction of bulk heat flow line through the counter-flow medium.

11. The heat transfer component of claim 1, further comprising a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the heat transfer fluid on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source or the heat sink, the low thermal resistance heat flow path being configured to conduct heat between the counter-flow medium and the heat source or the heat sink, wherein the thermal coupling structure contributes to a more uniform temperature distribution across the thermal coupling structure.

12. The heat transfer component of claim 10, wherein the counter-flow medium further comprises one or more stacked screens.

13. The heat transfer component of claim 10, wherein the counter-flow medium further comprises one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal close-pack formation or a substantially cubic close-pack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, and wherein substantially uniform microfluidic passageways are present between the aggregate media particles.

14. The heat transfer component of claim 12, wherein the thermal coupling structure further comprises protrusions configured to be in thermal contact with the counter-flow medium, wherein at least one protrusion has a first volume, wherein at least one aggregate media particle has a second volume, and wherein a ratio of the first volume to the second volume is between 1 : 1 and 10: 1.

15. The heat transfer component of claim 13, wherein the counter-flow medium has a thickness measured along the first direction and a width measured along a third direction perpendicular to the first direction, and wherein a ratio of the thickness to the width is less than 1 : 10.

16. The heat transfer component of claim 12, wherein the thermal coupling structure further comprises a thermal coupling structure hydraulic diameter and the counter-flow medium further comprises a counter-flow medium hydraulic diameter, and wherein the thermal coupling structure hydraulic diameter is at least as large as the counter-flow medium hydraulic diameter.

17. The heat transfer component of claim 15, wherein the counter-flow medium hydraulic diameter is less than 1mm.

18. The heat transfer component of claim 15, wherein the counter-flow medium hydraulic diameter is less than 0.5mm.

19. The heat transfer component of claim 15, wherein the counter-flow medium hydraulic diameter is less than 0.1mm.

20. The heat transfer component of claim 15, wherein the counter-flow medium hydraulic diameter is less than 3mm.

21. The heat transfer component of claim 15, wherein the counter-flow medium hydraulic diameter is less than 10mm.

22. A cooler component for extracting heat from a heat source using a coolant, the cooler component comprising: a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways.

23. The cooler component of claim 21, wherein the mass flow per unit area of the coolant through the counter-flow medium is configured to be substantially uniform and the counter-flow medium includes bonded aggregate media particles.

24. A cooler component for extracting heat from a heat source using a coolant, the cooler component comprising: a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways; a thermal coupling structure configured to be in fluidic communication with the counterflow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source; a coolant inlet configured to guide the coolant into the cooler component and direct it to the counter-flow medium; and a coolant outlet configured to guide the coolant out of the cooler component from the counter-flow medium.

25. The cooler component of claim 23, wherein the counter-flow medium further comprises: one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal close-pack formation or a substantially cubic close-pack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, wherein substantially uniform microfluidic passageways are present between the aggregate media particles.

26. The cooler component of claim 23, wherein the coolant inlet further comprises: an inlet port on an external section of the cooler component configured to receive the coolant from a source outside the cooler component; and an inlet channel within the cooler component configured to transport the coolant from the inlet port to the counter-flow medium.

27. The cooler component of claim 23, wherein the coolant outlet further comprises: an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; and an outlet channel within the cooler component configured to transport the coolant from the counter-flow medium to the outlet port.

28. A cooler component for extracting heat from a heat source using a coolant, the cooler component comprising: a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow the coolant through the microfluidic passageways toward the heat source and to flow the heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways, the counter-flow medium comprising: one or more layers of substantially uniform aggregate media particles configured to take on a substantially hexagonal close-pack formation or a substantially cubic closepack formation, the aggregate media particles configured to be in thermal contact with neighboring aggregate media particles, wherein substantially uniform microfluidic passageways are present between the aggregate media particles; and a microfluidic flow barrier positioned on an external section of the counter-flow medium, the microfluidic flow barrier being configured to direct the coolant towards the heat source before the coolant exits the counter-flow medium; a thermal coupling structure configured to be in fluidic communication with the counterflow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source, the thermal coupling structure comprising: one or more pressure distribution control structures modifying the form of the thermal coupling structure and configured to influence the flow of the coolant across the thermal coupling structure such that a pressure distribution of the coolant is more uniform across the thermal coupling structure; a coolant inlet positioned on an opposite side of the counter-flow medium from the heat source, the coolant inlet being configured to guide the coolant into the cooler component and direct it to the counter-flow medium, the coolant inlet comprising: an inlet port on the external section of the cooler component configured to receive the coolant from a source outside the cooler component; and an inlet channel within the cooler component configured to transport the coolant from the inlet port to the counter-flow medium; a coolant outlet configured to guide the coolant out of the cooler component from the counter-flow medium, the coolant outlet comprising:an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; and an outlet channel within the cooler component and positioned at least partially between the counter-flow medium and the heat source, the outlet channel being configured to transport the coolant from the counter-flow medium to the outlet port; and a cover plate assembly substantially positioned on the opposite side of the counter-flow medium from the heat source, the cover plate assembly being configured to house the coolant inlet and at least part of the coolant outlet, the cover plate assembly comprising: a cover positioned on an external side of the cooler component opposite the heat source, the cover housing the outlet port, the cover comprising: a coolant inlet cover access configured to provide an opening for the inlet port to reside in; an inlet outlet flow barrier plate positioned between the cover and the counterflow medium, the inlet outlet flow barrier plate configured to house the inlet port, a first space between the inlet outlet flow barrier plate and the cover forming at least part of the outlet channel, the inlet outlet flow barrier plate further comprising: a cover seal joint surface substantially taking the form of a surface of the inlet outlet flow barrier plate opposite the counter-flow medium; an outlet flow shaping insert positioned between the outlet port and the cover seal joint surface, the outlet flow shaping insert being configured to direct the flow of the coolant to the outlet port from the outlet channel; and a flow-resistant gap setter positioned between the cover seal joint surface and the cover, the flow-resistant gap setter being configured to abut the cover and to shape the flow of the coolant through the outlet channel such that the pressure distribution of the coolant is substantially uniform across the cover seal joint surface, the surface of the flow-resistant gap setter abutting the cover substantially taking on a teardrop shape; an inlet flow shaping insert positioned between the inlet port and the counter-flow medium, the inlet flow shaping insert configured to direct the flow of the coolant into the counter-flow medium such that a mass flux of the coolant is substantially uniform across the counter-flow medium; and a coupling gasket positioned between the counter-flow medium and the inlet outlet flow barrier plate, the coupling gasket configured to abut the counter-flow mediumand the inlet outlet flow barrier plate, a second space between the counter-flow medium and the inlet outlet flow barrier plate forming at least part of the inlet channel.

29. The cooler component of claim 27 wherein the inlet flow shaping insert is substantially conical shaped, the inlet flow shaping insert further comprising: one or more inlet flow shaping insert ports configured to allow the coolant to pass through the inlet flow shaping insert.

30. The cooler component of claim 27 wherein the inlet flow shaping insert substantially takes the form of a perforated screen, the inlet flow shaping insert further comprising: one or more inlet flow shaping insert ports configured to allow the coolant to pass through the inlet flow shaping insert.

30. A method of operating a cooler component, the method comprising: attaching the cooler component to a heat source such that a thermal coupling structure abuts the heat source, wherein the cooler component includes a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow a coolant through the microfluidic passageways toward a heat source and to flow heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways, a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source, an inlet port on an external section of the cooler component configured to receive the coolant from a source outside the cooler component, and an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; connecting a source of the coolant of the cooler component to the inlet port of the cooler component, configuring a functional fluid connection; connecting a drain of the coolant of the cooler component to the outlet port of the cooler component, configuring a functional fluid connection; and configuring the cooler component to receive the coolant via the inlet port.

31. A method of manufacturing a cooler component, the method comprising: populating aggregate media particles into a cavity within a portion of the cooler component configured to house a counter-flow medium, wherein the cooler component includes a counter-flow medium containing microfluidic passageways formed in thermally conductivematerial and configured to flow a coolant through the microfluidic passageways toward a heat source and to flow heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways, a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source, an inlet port on an external section of the cooler component configured to receive the coolant from a source outside the cooler component, and an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; and attaching a cover plate assembly.

32. The method of claim 31 further comprising: compressing the aggregate media particles.

33. The method of claim 31 further comprising: binding the aggregate media particles.

34. A method of manufacturing a cooler component, the method comprising: populating aggregate media particles into a container, wherein the cooler component includes a counter-flow medium containing microfluidic passageways formed in thermally conductive material and configured to flow a coolant through the microfluidic passageways toward a heat source and to flow heat away from the heat source via the thermally conductive material, counter to bulk flow line of the coolant through the microfluidic passageways, a thermal coupling structure configured to be in fluidic communication with the counter-flow medium using the coolant on one side of the thermal coupling structure and to form a low thermal resistance heat flow path between the counter-flow medium and the heat source to conduct heat between the counter-flow medium and the heat source, an inlet port on an external section of the cooler component configured to receive the coolant from a source outside the cooler component, and an outlet port on an external section of the cooler component configured to discharge the coolant from the cooler component; forming the counter-flow medium, including compressing the aggregate media particles and binding the aggregate media particles; placing the formed counter-flow medium into a cavity within a portion of the cooler component configured to house it; and attaching a cover plate assembly.

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