Electronic atomization device and heating element for electronic atomization device

Abstract

The present application provides an electronic atomization device and a heating element for the electronic atomization device. The electronic atomization device comprises: a liquid storage cavity for storing a liquid substrate; and a heating element for heating the liquid substrate to generate an aerosol. The heating element comprises conductive pins and a heating portion made of a first metal or alloy; and the conductive pins are conductively connected to the heating position so as to guide current on the heating portion. The conductive pins each comprise: a wire substrate made of a second metal or alloy, wherein the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300°C; and a conductive coating layer surrounding or covering the surface of the wire substrate. The coating layer is made of a third metal or alloy, and the resistivity of the third metal or alloy is less than 10 μΩ·cm. In the electronic atomization device, a better welding connection strength between the conductive pins and the heating element is achieved, thereby preventing metal such as nickel or copper from precipitating from the wire substrates.

Description

Electronic atomization device and heating element for electronic atomization device

[0001] Cross-reference to Related Applications

[0002] This application claims priority to the Chinese patent application No. 202410805744.4, filed on June 20, 2024, and entitled “Electronic atomization device and heating element for electronic atomization device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the technical field of electronic atomization, and in particular to an electronic atomization device and a heating element for the electronic atomization device. BACKGROUND

[0004] Tobacco products, such as cigarettes, cigars, and the like, burn tobacco during use to produce tobacco smoke. Attempts have been made to provide products that release compounds without burning the product.

[0005] Examples of such products are heat-not-burn devices that release compounds by heating, rather than burning, a material. For example, the material can be tobacco or other non-tobacco products, which can or can not contain nicotine. As another example, there are aerosol provision devices, such as so-called electronic atomization devices. These devices typically contain a liquid that is heated to cause it to vaporize, thereby producing an aerosol that can be inhaled. The liquid can contain nicotine and / or flavorants and / or an aerosol generating substance (e.g., glycerol). Known electronic atomization devices heat the liquid by a resistive heating element, and solder conductive pins at both ends of the heating element for providing electrically conductive connection between the heating element and a circuit board. Among them, the conductive pins are made of a low-resistance good conductor lead material such as nickel wire, copper wire, etc.; the conductive pins are insufficiently resistant to corrosion, and are prone to form heavy metal precipitation in contact with the liquid in use. The known solution is to spray or deposit a corrosion-resistant inert protective layer such as an oxide layer, an enamel layer, an organic layer, etc. on the surface of the conductive pin, which is not conducive to the conductive connection between the conductive pin and the heating element by soldering or the like.

[0006] SUMMARY

[0007] One embodiment of the present application provides an electronic atomization device, comprising:

[0008] a liquid storage cavity for storing a liquid substrate;

[0009] a heating element for heating the liquid substrate to generate an aerosol;

[0010] The heating element comprises an electrically conductive pin and a heating portion made of a first metal or alloy; the electrically conductive pin is electrically connected to the heating portion for guiding electric current on the heating portion;

[0011] The electrically conductive pin comprises:

[0012] A wire substrate made of a second metal or alloy, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300℃;

[0013] An electrically conductive cladding layer surrounding or wrapping around the surface of the wire substrate; the cladding layer is made of a third metal or alloy, and the resistivity of the third metal or alloy is less than 10μΩ·cm.

[0014] In some embodiments, the standard electrode potential of the third metal or alloy is +0.7V to +1.5V;

[0015] And / or, the metal activity of the third metal or alloy is lower than that of copper.

[0016] In some embodiments, the third metal or alloy comprises a noble metal or an alloy thereof;

[0017] And / or, the third metal or alloy comprises gold, silver, platinum, palladium, ruthenium, rhodium or an alloy thereof.

[0018] In some embodiments, the third metal or alloy has a resistivity of 1μΩ·cm to 10μΩ·cm at 20℃.

[0019] In some embodiments, the diameter of the wire substrate is 0.2 to 0.5mm;

[0020] And / or, the thickness of the cladding layer is 20nm to 20μm.

[0021] In some embodiments, the second metal or alloy comprises at least one of stainless steel, titanium alloy, zirconium or zirconium alloy, cobalt or cobalt alloy.

[0022] In some embodiments, the electrically conductive pin is welded to the heating element.

[0023] In some embodiments, the cladding layer does not contain nickel and / or copper; or the wire substrate does not contain nickel and / or copper.

[0024] In some embodiments, the heating element is a cylinder wound by a sheet; or the heating element is a sheet;

[0025] And / or, the elastic modulus of the heating element is above 80GPa;

[0026] and / or, the melting point of the first metal or alloy is above 1200℃;

[0027] and / or, the electrical resistivity of the first metal or alloy is at least 50μΩ·cm;

[0028] and / or, the first metal or alloy is stainless steel or titanium alloy.

[0029] In some embodiments, at least part of the electrically conductive pin is in liquid communication with the liquid reservoir.

[0030] and / or, at least part of the electrically conductive pin is immersed or exposed in the liquid reservoir.

[0031] In some embodiments, further comprising:

[0032] a liquid conducting element for delivering the liquid substrate of the liquid reservoir to the heating element;

[0033] at least part of the electrically conductive pin contacts or is bonded to the liquid conducting element.

[0034] Yet another embodiment of the present application further provides a heating element for an electronic atomization device for heating a liquid substrate to generate an aerosol; the heating element comprises:

[0035] a first electrically conductive pin and a second electrically conductive pin arranged at intervals;

[0036] a heating portion electrically connected between the first electrically conductive pin and the second electrically conductive pin; the heating portion is capable of conducting electric current by the first electrically conductive pin and the second electrically conductive pin, thereby generating electric resistance Joule heat for heating; the heating portion is made of a first metal or alloy;

[0037] the first electrically conductive pin and / or the second electrically conductive pin comprises:

[0038] a wire substrate made of a second metal or alloy, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300℃;

[0039] an electrically conductive cladding layer surrounding or wrapping the surface of the wire substrate; the cladding layer is made of a third metal or alloy, the electrical resistivity of the third metal or alloy is less than 10μΩ·cm.

[0040] The above electronic atomization device has better welding connection strength between the electrically conductive pin and the heating element, and can prevent heavy metals such as nickel or copper of the wire substrate from being precipitated. BRIEF DESCRIPTION OF DRAWINGS

[0041] One or more embodiments are illustrated by way of example in the figures that are part of this disclosure and which are illustrative, but not restrictive, of the embodiments, wherein like references numerals designate corresponding, like elements and in which:

[0042] FIG. 1 is a schematic view of an electronic aerosol-generating device according to an embodiment;

[0043] FIG. 2 is a schematic view of an embodiment of an aerosolizer according to an embodiment;

[0044] FIG. 3 is a schematic view of an embodiment of a heating element according to an embodiment;

[0045] FIG. 4 is a schematic view of a cross-section of an electrically conductive pin according to an embodiment. DETAILED DESCRIPTION

[0046] For the purposes of the present application, the following terms and phrases shall have the meanings indicated below:

[0047] One embodiment of the present application provides an electronic aerosol-generating device, which can be seen in FIG. 1, comprising an aerosolizer 100 configured to store a liquid substrate and to aerosolize the liquid substrate, and a power supply mechanism 200 configured to supply power to the aerosolizer 100. In the embodiment shown in FIG. 1, the aerosolizer 100 and the power supply mechanism 200 of the electronic aerosol-generating device are detachable relative to each other; electronic aerosol-generating devices having such aerosolizers 100 and power supply mechanisms 200 that are detachable relative to each other are, for example, so-called "refillable" electronic aerosol-generating devices. Alternatively, in further embodiments, the aerosolizer 100 and the power supply mechanism 200 of the electronic aerosol-generating device are fixedly enclosed and secured by a housing component of the electronic aerosol-generating device, such that the aerosolizer 100 and the power supply mechanism 200 are not detachable relative to each other from inside the housing component. Electronic aerosol-generating devices having such aerosolizers 100 and power supply mechanisms 200 that are not detachable relative to each other are, for example, "unitary" or "disposable" electronic aerosol-generating devices.

[0048] In an alternative embodiment, such as the one shown in FIG. 1, the power supply mechanism 200 comprises a receiving cavity 270 configured to receive and house at least a portion of the aerosolizer 100 at one end along a length of the power supply mechanism 200, and an electric contact 230 at least partially exposed at a surface of the receiving cavity 270, configured to supply power to the aerosolizer 100 when at least a portion of the aerosolizer 100 is received and housed within the power supply mechanism 200.

[0049] A seal 260 is provided in the power supply mechanism 200, and at least a portion of the internal space of the power supply mechanism 200 is divided by the seal 260 to form the above-mentioned receiving cavity 270. In the exemplary embodiment shown in FIG. 1, the seal 260 is configured to extend in the cross-sectional direction of the power supply mechanism 200, and is preferably made of a flexible material, thereby preventing the liquid substrate flowing from the atomizer 100 to the receiving cavity 270 from flowing to the circuit board 220, the airflow sensor 250, and other components inside the power supply mechanism 200.

[0050] In the exemplary embodiment shown in FIG. 1, the power supply mechanism 200 further includes a power cell 210 for supplying power, which is arranged along the length direction away from the receiving cavity 270; and a circuit board 220 arranged between the power cell 210 and the receiving cavity, on which a circuit is arranged or integrated, so that the circuit board 220 is operable to guide the current between the power cell 210 and the electrical contact 230.

[0051] In use, the power supply mechanism 200 includes an airflow sensor 250 for sensing the suction airflow generated when the atomizer 100 is being puffed, and the circuit board 220 controls the power cell 210 to output current to the atomizer 100 according to the detection signal of the airflow sensor 250.

[0052] In the exemplary embodiment shown in FIG. 1, the power supply mechanism 200 is provided with a charging interface 240 at the other end away from the receiving cavity 270, for charging the power cell 210.

[0053] FIG. 2 shows a schematic diagram of an embodiment of the atomizer 100, in which the atomizer 100 includes:

[0054] A housing 10 defining the outer surface of the atomizer 100, which is made of a rigid material such as ceramic, polymer plastic, etc.; in the embodiment shown in FIG. 2, the housing 10 is generally cylindrical; the housing 10 has a proximal end 110 and a distal end 120 opposite in the longitudinal direction; wherein according to the usual use requirements, the proximal end 110 is configured as the end for the user to inhale the aerosol, and an air outlet 113 for the user to puff is provided at the proximal end 110; while the distal end 120 is configured as the end for combining with the power supply mechanism 200, and the distal end 120 of the housing 10 is open, and the open structure is used to install the necessary functional components inside the housing 10.

[0055] According to the embodiment shown in FIG. 2, the inside of the housing 10 defines a liquid storage cavity 112 for storing a liquid substrate, and an atomization assembly for drawing the liquid substrate from the liquid storage cavity 112 and heating and atomizing the liquid substrate. In the embodiment shown in FIG. 2, the housing 10 has a longitudinally extending aerosol outlet tube 111, and the space between the outer surface of the aerosol outlet tube 111 and the inner surface of the housing 10 forms a portion of the liquid storage cavity 112 for storing the liquid substrate. The aerosol outlet tube 111 is in communication with the air outlet 113 at one end of the proximal end 110, so that the generated aerosol is transmitted to the air outlet 113 for inhalation. According to the embodiment shown in FIG. 2, the aerosol outlet tube 111 and the housing 10 are integrally molded from a moldable material, so that the liquid storage cavity 112 formed after the manufacturing process is closed on the side facing the proximal end 110 and open on the side facing the distal end 120.

[0056] Referring to FIG. 2, the atomizer 100 further comprises:

[0057] a tubular element 14 extending in the longitudinal direction of the atomizer 100; the tubular element 14 is at least partially arranged to extend within the liquid storage cavity 112; in the embodiment shown in FIG. 2, the tubular element 14 is at least partially arranged between the aerosol outlet tube 111 and the distal end 120. In the longitudinal direction of the atomizer 100, the tubular element 14 is arranged coaxially with the aerosol outlet tube 111; and the tubular element 14 is in airflow connection with the aerosol outlet tube 111.

[0058] In the embodiment shown in FIG. 2, the tubular element 14 is a separate component, which is preferably made of a relatively thin rigid material; the tubular element 14 is a conductor, for example, the tubular element 14 is made of stainless steel or aluminum alloy, etc. In the embodiment shown in FIG. 2, the upper end of the tubular element 14 is connected to the aerosol outlet tube 111 after assembly. Specifically, a flexible sealing element 15 is arranged between the tubular element 14 and the aerosol outlet tube 111, thereby providing a seal therebetween. In some embodiments, the flexible sealing element 15 is made of flexible silicone, thermoplastic elastomer, etc. Alternatively, in some other embodiments, the rigid tubular element 14 is at least partially bonded to the aerosol outlet tube 111 by crimping or the like, the tubular element 14 surrounds at least a portion of the aerosol outlet tube 111 and forms a seal therebetween; in this variant embodiment, there is no flexible sealing element 15 between the rigid tubular element 14 and the aerosol outlet tube 111.

[0059] In the embodiment shown in FIG. 2, the space between the outer surface of the aerosol outlet tube 111, the outer surface of the tubular element 14 and the inner surface of the housing 10 defines the liquid storage cavity 112 for storing the liquid substrate.

[0060] In the embodiment shown in FIG. 2, the tubular element 11 houses and accommodates an atomization assembly for receiving and atomizing a liquid substrate in the liquid reservoir 112 to generate an aerosol. As shown in FIG. 2, the tubular element 14 has a plurality of perforations 141 arranged on the tubular wall thereof; in some embodiments, the plurality of perforations 141 are arranged along a circumferential direction of the tubular element 11, such that in use, the atomization assembly is in fluid communication with the liquid reservoir 112 through the perforations 141 to receive the liquid substrate.

[0061] As shown in FIG. 2, the atomization assembly is housed and accommodated within the tubular element 14; the atomization assembly includes a liquid guide element 30 and a heating element 40 coupled to the liquid guide element 30. The liquid guide element 30 is configured to draw or receive the liquid substrate from the liquid reservoir 112, and the heating element 40 is configured to heat at least a portion of the liquid substrate in the liquid guide element 30 to generate an aerosol. Alternatively, the liquid guide element 30 is configured to transfer the liquid substrate between the liquid reservoir 112 and the heating element 40.

[0062] In some embodiments, the liquid guide element 30 is flexible; for example, the liquid guide element 30 is made of a flexible fibrous material such as cotton fibers, non-woven fabric, sponge, etc.; the liquid guide element 30 is configured as a ring arranged along a longitudinal direction of the housing 10; the liquid guide element 30 is coaxial with the tubular element 14 and located within the tubular element 14. Specifically, for example, the liquid guide element 30 is a cylindrical fibrous element wound from a sheet-like precursor including multiple layers of flexible fibers. Alternatively, in yet other embodiments, the liquid guide element 30 is rigid; for example, the liquid guide element 30 can include a rigid porous element, etc., such as a porous ceramic or a porous glass, etc.

[0063] In some embodiments, an outer surface of the liquid guide element 30 along a radial direction is occluded or communicates with the perforations 141, such that the outer surface of the liquid guide element 30 is configured as a liquid receiving surface to receive and draw the liquid substrate from the liquid reservoir 112 through the perforations 141, as shown by the arrow R1 in FIG. 2. An inner surface of the liquid guide element 30 along the radial direction is configured as an atomization surface that is coupled to / abuts / abuts against the heating element 40; such that after the liquid substrate is transferred to the atomization surface, the liquid substrate is heated and atomized by the heating element 40 to generate an aerosol and released.

[0064] As shown in FIG. 2, the atomizer 100 further includes:

[0065] The end cap 20 is coupled to the distal end 120 of the housing 10. The end cap 20 at least partially encloses the distal end 120 of the housing 10. The end cap 20 at least partially extends into the housing 10 from the distal end 120 and supports or holds the tubular element 14. The end cap 20 further has an air inlet 22 arranged thereon for allowing external air to enter the atomizer 100 during suction.

[0066] According to the embodiment shown in FIG. 2, the atomizer 100 further comprises:

[0067] An air flow passage for providing an air flow path from the air inlet 22 to the air outlet 113 via the atomization assembly during a puff, thereby outputting the aerosol to the air outlet 113. In some example embodiments, the complete air flow passage is defined by a plurality of components collectively. Specifically, according to the arrow R2 shown in FIG. 2, the complete air flow path during a puff includes: air entering from the air inlet 22 passing through the end cap 20 and flowing across the atomization surface of the atomization assembly / heating element 40, and carrying the aerosol generated by the heating element 40 to be output from the aerosol output tube 111 to the air outlet 113, thereby providing a puff to the user.

[0068] In the embodiment shown in FIG. 2, the heating element 40 is configured to extend along the longitudinal direction of the housing 10 / the liquid guide element 30; the heating element 40 is arranged coaxially with the liquid guide element 30. In some embodiments, the heating element 40 is a resistance heating mesh or a resistance heating coil, etc. In this embodiment, the heating element 40 is a heating element wound by a sheet material in a sheet or mesh shape.

[0069] In some embodiments, the liquid guide element 30 is formed by winding or wrapping the flexible capillary fiber outside the heating element 40. Alternatively, in some embodiments, the liquid guide element 30 is formed by molding around the heating element 40 and then sintering to be bonded to the heating element 40; for example, the liquid guide element 30 is formed by a porous ceramic slurry around the heating element 40 by in-mold injection and then sintering, thereby being bonded to the heating element 40.

[0070] In yet another variant embodiment, the liquid guide element 30 is configured to be arranged perpendicular to the longitudinal direction of the atomizer 100; for example, the liquid guide element 30 is a rod or a bar, etc. arranged perpendicular to the longitudinal direction of the atomizer 100. The liquid guide element 30 is partially penetrated from inside the tubular element 14 to the liquid storage cavity 112 via the perforation 14, and the heating element 40 is wrapped around or wound on the liquid guide element 30.

[0071] In some other variant embodiments, the heating element 40 can be printed, deposited, sintered or physically assembled onto the liquid guide element 30. In some other variant embodiments, the liquid guide element 30 can have a planar or curved surface for supporting the heating element 40, and the heating element 40 is formed on the planar or curved surface of the liquid guide element 30 by means of mounting, printing, deposition or the like. In some other variant embodiments, the heating element 40 is a conductive track formed on the surface of the liquid guide element 30. In some other variant embodiments, the conductive track of the heating element 40 can be in the form of a printed circuit formed by printing. In some other variant embodiments, the heating element 40 is a patterned conductive track. In some other embodiments, the heating element 40 is planar. In some other variant embodiments, the heating element 40 is a conductive track extending in a meandering, serpentine, reciprocating or zigzag manner.

[0072] According to Figs. 2-3, in some embodiments, the heating element 40 is arranged in a cylindrical shape wound from a sheet material; the heating element 40 is non-closed in the circumferential direction and has a side opening 44; the heating element 40 is arranged with a first conductive pin 41 and a second conductive pin 42 located on both sides of the side opening 44. The heating element 40 includes a heating portion 430 extending between the first conductive pin 41 and the second conductive pin 42; in the embodiment shown in Fig. 3, the heating portion 430 is substantially configured in a mesh shape having mesh holes. After assembly, by connecting the first conductive pin 41 and the second conductive pin 42 to the two electrical contacts 21 respectively, and then receiving the atomizer 100 in the receiving cavity 270, the first conductive pin 41 and the second conductive pin 42 are indirectly connected with the circuit board 20 through the contact conduction of the electrical contacts 21 and the electrical contacts 230, thereby guiding the electric current on the heating portion 430 of the heating element 40.

[0073] In some embodiments, the first conductive pin 41 and / or the second conductive pin 42 are at least partially in contact with or bonded to the liquid guide element 30. In some embodiments, at least part of the surface of the first conductive pin 41 and / or the second conductive pin 42 is in liquid communication with the liquid storage cavity 112 through the capillary pores or capillary channels in the liquid guide element 30, so that at least part of the surface of the first conductive pin 41 and / or the second conductive pin 42 is wetted or adhered by the liquid matrix absorbed or transmitted by the liquid guide element 30.

[0074] In some other embodiments, the first conductive pin 41 and / or the second conductive pin 42 at least partially extend in the liquid storage cavity 112; or the first conductive pin 41 and / or the second conductive pin 42 are at least partially immersed or exposed in the liquid storage cavity 112.

[0075] In some embodiments, the mesh holes on the heating portion 430 are generally circular or polygonal in shape; or in yet other embodiments, the mesh holes can also be rectangular, polygonal, or irregular in shape such as elongated slits, etc.

[0076] In the embodiment shown in FIG. 3, the heating element 40 can also include:

[0077] The first and second electrically conductive leads 41 and 42 are connected to the first and second electrically conductive connection portions 410 and 420, respectively, by welding or the like. The welding can include laser welding, ultrasonic welding, friction welding, impact welding, etc.

[0078] In some embodiments, the first and second electrically conductive connection portions 410 and 420 and the heating portion 430 of the heating element 40 are integrally made of an electrically resistive metal or alloy. For example, in some specific embodiments, the heating element 40 is made by etching or stamping a sheet of electrically resistive alloy. The sheet can be made by rolling a cast ingot of the alloy made by metallurgical and smelting processes. In some embodiments, the thickness of the heating element 40 and / or the sheet is in the range of 0.05-0.15 mm.

[0079] In some embodiments, the heating element 40 includes or is made of a first metal or alloy.

[0080] In some embodiments, the first metal or alloy has an electrical resistivity of at least 50 μΩ-cm, which is advantageous for the heating element 40 to be suitable for generating or producing resistive Joule heat.

[0081] In some embodiments, the heating element 40 has an elastic modulus of at least 80 GPa, which is advantageous for the heating element 40 to be suitable for being wound into a cylindrical shape or held around by the flexible liquid guide element 30.

[0082] In some embodiments, the first metal or alloy has a melting point above 1200°C, which is advantageous for providing the heating element 40 with high thermal stability. In some specific embodiments, the first metal or alloy comprises at least one of an iron-chromium-aluminum alloy, a nickel alloy, a stainless steel alloy, or a titanium alloy, etc. having a melting point above 1200°C.

[0083] In some embodiments, the first conductive pin 41 and the second conductive pin 42 have the same length. For example, in some specific embodiments, the first conductive pin 41 and / or the second conductive pin 42 has a length of about 20-50 mm. The first conductive pin 41 and the second conductive pin 42 are bendable, and thus form an electrical circuit by being bent against or connected to the electrical contact 21.

[0084] In some embodiments, the first conductive pin 41 and / or the second conductive pin 42 comprises a conductive wire substrate, and a conductive cladding layer formed on or wrapped around the wire substrate. For example, a schematic view of a cross-section of the first conductive pin 41 and / or the second conductive pin 42 is shown in FIG. 4, according to which the first conductive pin 41 and / or the second conductive pin 42 comprises:

[0085] a conductive wire substrate 411 comprising or made of a second metal or alloy;

[0086] a conductive cladding layer 412 formed on or wrapped around the wire substrate 411 comprising or made of a third metal or alloy.

[0087] In some embodiments, the conductive cladding layer 412 is formed on the wire substrate 411 by electroplating, electroless plating, vapor deposition, spraying, etc.

[0088] In some embodiments, the wire substrate 411 has a diameter of 0.2-0.5 mm; for example, in some specific embodiments, the wire substrate 411 has a diameter of 0.35 mm. In some embodiments, the conductive cladding layer 412 has a thickness of 20 nm-20 μιη; for example, in some more preferred embodiments, the conductive cladding layer 412 has a thickness of 1-10 μιη.

[0089] In some embodiments, the second metal or alloy has a melting point that is less than or equal to 300°C of the first metal or alloy. By having the second metal or alloy have a melting point that is less than 300°C of the first metal or alloy, then upon soldering the first and / or second conductive pins 41, 42 to the heating element 40, the first and / or second conductive pins 41, 42 and the heating element 40 can melt at approximately the same time, and not sequentially, which can result in a flow or spatter, which can be advantageous for ease of soldering preparation and their solder joint strength. In embodiments, the solder joint strength provided by the wire base material 411 to secure the heating element 40. In more preferred embodiments, the second metal or alloy has a melting point that is less than 260°C of the first metal or alloy; more preferably, the second metal or alloy has a melting point that is less than 110°C of the first metal or alloy.

[0090] In some alternative embodiments, the second metal or alloy comprises at least one of a stainless steel of grade 316, a stainless steel of grade 304, a stainless steel of grade 631, a stainless steel of grade 2205, a stainless steel of grade 2507, a stainless steel of grade 904, or a titanium alloy of grade TA1, a titanium alloy of grade TC4, zirconium or a zirconium alloy, cobalt or a cobalt alloy, and the like.

[0091] In some embodiments, the third metal or alloy has an electrical resistivity of less than 10 μΩ-cm. In some embodiments, the third metal or alloy has an electrical resistivity that is less than the electrical resistivity of the second metal or alloy. In embodiments, the cladding layer 412 made or formed of the third metal or alloy provides the first and / or second conductive pins 41, 42 with good electrical conductivity. In some particular embodiments, the third metal or alloy has an electrical resistivity of between 1 μΩ-cm and 10 μΩ-cm at 20°C.

[0092] and in embodiments, the third metal or alloy has a lower metal activity than copper; metal activity is a chemical term referring to the degree of reactivity of a metal in a chemical reaction, and can be referenced by the periodic table of elements. In some embodiments, the third metal or alloy comprises only noble metals or alloys thereof. Noble metals is a chemical term referring to "gold, silver, and platinum group metals" that have a strong chemical stability and do not readily react with other chemicals under normal conditions. In some specific embodiments, the third metal or alloy comprises gold (Au), silver (Ag), platinum (Pt), palladium (Pd), ruthenium (Ru), rhodium (Rh), or alloys thereof. In embodiments, it is advantageous to have a coating of noble metal to significantly reduce the wire resistance of the conductive substrate having the above melting point requirements. In embodiments, the first conductive pin 41 and / or the second conductive pin 42 has an inert surface coating that is advantageous for preventing the release of heavy metals such as nickel or copper from the wire substrate.

[0093] In some embodiments, the third metal or alloy has a standard electrode potential of +0.7 V to +1.5 V. Standard electrode potential is an electrochemical term referring to the electrode potential of an electrode made of a given material when combined with a standard hydrogen electrode as a galvanic cell: standard hydrogen electrode || given material electrode; according to the official definition of IUPAC (International Union of Pure and Applied Chemistry) in 1958, the electrode potential of the standard hydrogen electrode is equal to zero, and the potential of the galvanic cell they form is the standard electrode potential of the given material electrode. For example, in some specific embodiments, the third metal or alloy is silver (Ag) with a standard electrode potential of +0.799 V; for example, in some specific embodiments, the third metal or alloy is platinum (Pt) with a standard electrode potential of +1.200 V; for example, in some specific embodiments, the third metal or alloy is gold (Au) with a standard electrode potential of +1.492 V for the reduction of Au3+to Au.

[0094] In some embodiments, the third metal or alloy does not contain nickel and / or copper.

[0095] In some specific embodiments, the wire substrate 411 of the first conductive pin 41 and / or the second conductive pin 42 is stainless steel, and the coating 412 is silver.

[0096] For example, in one specific embodiment, the resistance value of the wire base material 411 of a 316L stainless steel wire with a length of 40 mm and a diameter of 0.3 mm is 0.4 Ω; after forming a silver (Ag) cladding layer 412 on the surface of the wire base material 411 of the 316L stainless steel wire, the resistance value of the first / second conductive pin 41 / 42 decreases to 0.1 Ω, the overall resistivity of the first / second conductive pin 41 / 42 is 17 μΩcm, and the conductive performance of the first / second conductive pin 41 / 42 with the cladding layer 412 is more excellent. Compared with the theoretical resistivity of pure silver (Ag) of 1.6 μΩcm, it is shown that the conductive performance of the first / second conductive pin 41 / 42 is not only provided by the cladding layer 412, but also jointly defined by the wire base material 411 and the cladding layer 412.

[0097] For example, the following table shows the results of the metal ion precipitation test of the liquid substrate and the welding strength test of the conductive pin of the heating element after the conductive pin and the heating element of the plurality of comparative examples and embodiments were laser welded and then soaked in a 2 ml liquid substrate containing 2.4 wt% nicotine at 50°C for 7 days; then the liquid substrate was separated for the metal ion precipitation test, and the heating element was taken for the welding strength test of the conductive pin. Among them, the welding strength test of the conductive pin is carried out according to the national standard “GB / T2651-2008 Welding Strength Tester Tensile Test” to test the connection strength of the welding part. The diameter of the wire base material is 0.35 mm, and the thickness of the cladding layer is about 7 μm. Among them, the welding strength grade is determined by measuring the pulling force value of the conductive pin and the heating element 40 when they are pulled apart in the tensile tester; if the pulling force value of the conductive pin and the heating element 40 when they are pulled apart is less than 0.6 kgf, it is determined that the welding is not firm, and the welding connection strength is low; if the pulling force value of the conductive pin and the heating element 40 when they are pulled apart is greater than or equal to 0.8 kgf, it is determined that the welding connection strength is high; if the pulling force value of the conductive pin and the heating element 40 when they are pulled apart is between 0.6-0.8 kgf, it is determined that the welding connection strength is medium.

[0098] According to the above comparative test results, it can be seen that when the melting point difference between the wire base material of the conductive pin and the melting point of the heating element 40 in the comparative examples and embodiments is greater than 300°C, for example, 417°C, the welding connection strength is low; when the melting point difference is less than 300°C, for example, within 102°C, the welding connection strength is high. At the same time, when the wire base material of the conductive pin in the comparative examples and embodiments has a silver Ag cladding layer, it can effectively prevent the heavy metals such as Ni or copper in the wire base material from precipitating in the liquid substrate.

[0099] It should be noted that the above-mentioned embodiments illustrate rather than limit the application, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

Claims

1. An electronic atomizing device, characterized by, The application relates to a heating element for generating aerosol from a liquid substrate, comprising: a liquid storage chamber for storing the liquid substrate; a heating element for heating the liquid substrate to generate aerosol; the heating element comprises a heating portion made of a first metal or alloy, and an electrically conductive pin electrically connected to the heating portion for conducting electric current through the heating portion; wherein the electrically conductive pin comprises: a wire substrate made of a second metal or alloy, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300 DEG C; an electrically conductive cladding layer surrounding or covering the surface of the wire substrate; the cladding layer is made of a third metal or alloy, and the third metal or alloy has an electrical resistivity less than 10 mu Omega cm. the standard electrode potential of the third metal or alloy is +0.7 V to +1.5 V; 2. The electronic atomizing device of claim 1, wherein, and / or, the third metal or alloy has a metal activity lower than copper. the third metal or alloy comprises a noble metal or an alloy thereof; 3. The electronic atomizing device of claim 1 or 2, wherein, and / or, the third metal or alloy comprises gold, silver, platinum, palladium, ruthenium, rhodium or an alloy thereof. the third metal or alloy has an electrical resistivity between 1 mu Omega cm and 10 mu Omega cm at 20 DEG C.

4. The electronic atomizing device of claim 1 or 2, wherein, the diameter of the wire substrate is between 0.2 mm and 0.5 mm; 5. The electronic atomizing device of claim 1 or 2, wherein, and / or, the thickness of the cladding layer is between 20 nm and 20 mu m. the second metal or alloy comprises at least one of stainless steel, titanium alloy, zirconium or zirconium alloy, cobalt or cobalt alloy.

6. The electronic atomizing device of claim 1 or 2, wherein, the electrically conductive pin is welded to the heating element.

7. The electronic atomizing device of claim 1 or 2, wherein, the cladding layer does not contain nickel and / or copper; or the wire substrate does not contain nickel and / or copper.

8. The electronic atomizing device of claim 1 or 2, wherein, the heating element is a cylinder wound from a sheet; or the heating element is a sheet; 9. The electronic atomizing device of claim 1 or 2, wherein, and / or, the heating element has an elastic modulus above 80 GPa; and / or, the melting point of the first metal or alloy is above 1200 DEG C; and / or, the electrical resistivity of the first metal or alloy is at least 50 mu Omega cm; and / or, the first metal or alloy is stainless steel or titanium alloy. at least part of the surface of the electrically conductive pin is in liquid communication with the liquid storage chamber; 10. The electronic atomizing device of claim 1 or 2, wherein, and / or, at least part of the electrically conductive pin is immersed or exposed in the liquid storage chamber. Further comprising:

11. The electronic atomizing device of claim 1 or 2, wherein, a liquid guide element for delivering the liquid substrate in the liquid storage chamber to the heating element; at least part of the electrically conductive pin contacts or is combined with the liquid guide element. the heating element comprises:

12. A heating element for an electronic atomisation device for heating a liquid substrate to generate an aerosol; characterised in that, a first electrically conductive pin and a second electrically conductive pin arranged at intervals; a heating portion electrically connected between the first electrically conductive pin and the second electrically conductive pin; the heating portion can be guided by the first electrically conductive pin and the second electrically conductive pin to generate electric resistance Joule heat for heating; the heating portion is made of a first metal or alloy; the first electrically conductive pin and / or the second electrically conductive pin comprises: a wire substrate made of a second metal or alloy, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300 DEG C; an electrically conductive cladding layer surrounding or covering the surface of the wire substrate; the cladding layer is made of a third metal or alloy, and the third metal or alloy has an electrical resistivity less than 10 mu Omega cm. ​

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