Non-contact voltage sensing

Abstract

A non-contact voltage sensor is provided comprising a flexible substrate. The flexible substrate allows the non-contact voltage sensor to be positioned, in use, around a conductor. The non-contact voltage sensor comprises a conductive sense component and a conductive shield component formed on the substrate, with the shield component arranged to at least partially shield the sense component from coupling to external noise sources or conductors.

Description

[0001] NON-CONTACT VOLTAGE SENSING

[0002] This application claims priority from US provisional application 63 / 660,935 filed on 17 June 2024, and US provisional application 63 / 698,436 filed on 24 September 2025, both of which are incorporated herewith in their entirety.

[0003] Technical field

[0004] The present disclosure relates to sensors for non-contact voltage sensing and methods of assembly of sensors for non-contact voltage sensing.

[0005] Sensing voltages may take many different forms, including simply sensing whether or not a voltage is present, characterising the phase of the voltage (for example relative to other sensed voltages), and / or characterising the magnitude of the voltage (such as determining the peak voltage, the average voltage, the RMS voltage, etc).

[0006] Detecting whether or not a voltage is present may be used for a number of purposes. In one example, it may be used for safety monitoring, before releasing a function like turning on a device or circuit breaker. In another example it may be used for diagnostics to determine whether a lack of detected current is because of a broken / detached power cable, or because the driven device has been turned off. In another example, if there is a circuit breaker, it may be used to determine whether a lack of detected current is because the circuit breaker has tripped or because the driven device has been turned off.

[0007] Voltage measurement techniques often require a direct electrical connection to the current carrying conductor (i.e., a galvanic connection). However, in some situations this is not possible, or is inconvenient. For example, access for a galvanic connection may not be available, or the voltages may be very high (for example, in the 100s or 1000s of volts), requiring costly isolation between high and low voltage sides of the measurement circuit. In such circumstances, non-contact voltage sensing systems are useful. In a non-contact voltage sensing system, there is no direct electrical connection (i.e., no galvanic contact) between the conductor carrying the signal being sensed and the voltage sensor performing the sensing. However, it should be understood that in some cases a reference voltage may be connected to the non-contact voltage sensor. Instead of a galvanic contact, a conductive sensing component may be positioned in non-contacting proximity to the conductor carrying the signal to be sensed (e.g., positioned on, or near, an insulator that encases the conductor carrying the signal to be sensed), to form a capacitive coupling with the conductor carrying the signal to be sensed. Any changes in the signal being carried by the conductor should induce a signal in the conductive sensing component, as a result of the capacitive coupling, which can then be sensed by circuitry connected to the conductive sensing component. Non-contact voltage sensors may be fixed components provided in proximity to the conductor.

[0008] According to a first aspect of the disclosure, there is provided a sensor for non-contact AC voltage sensing, the sensor comprising: a flexible substrate; a first conductive sense component comprising a first area of conductive material formed on the flexible substrate; a first conductive shield component comprising a second area of conductive material formed on the flexible substrate; wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use when the flexible substrate is positioned around a first conductor: the first conductive sense component is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and the first conductive shield component is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0009] According to a second aspect of the disclosure a method of assembling a non-contact AC voltage sensor, the method comprising: positioning a flexible substrate around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the flexible substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0010] According to a third aspect of the disclosure a method of assembling a non-contact AC voltage sensor, the method comprising: positioning a flexible substrate around a forming member such that the flexible substrate takes a shape corresponding to that of the forming member; removing the flexible substrate from the substantially forming member; positioning the flexible substrate around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the flexible substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0011] According to a fourth aspect of the disclosure, there is provided a sensor for non-contact AC voltage sensing, the sensor comprising: a first conductive sense component comprising a first area of conductive material; a first conductive shield component comprising a second area of conductive material; a second conductive sense component comprising a third area of conductive material; a second conductive shield component comprising a fourth area of conductive material; wherein the conductive sense components and the conductive shield components are arranged such that, in use when the sensor is positioned around a first conductor: the first conductive sense component and the second conductive sense component are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and the first conductive shield component and the second conductive shield component are positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

[0012] According to a fifth aspect of the disclosure, there is provided a method of assembling a non-contact AC voltage sensor, the method comprising: positioning a first substrate comprising one or more flexible regions around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors; and positioning a second substrate comprising one or more flexible regions around the first conductor, such that: a second conductive sense component comprising a first area of conductive material formed on the substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a second conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0013] According to a sixth aspect of the disclosure, there is provided a method of assembling a noncontact AC voltage sensor, the method comprising: positioning a first substrate comprising one or more flexible regions around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the first substrate and a second conductive sense component comprising a second area of conductive material formed on the first substrate are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a third area of conductive material formed on the first substrate and a second conductive shield component comprising a fourth area of conductive material formed on the first substrate is positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors. Drawings

[0014] Aspects of the disclosure are described with reference to the drawings, in which :

[0015] Figure 1A is a top profile view of a non-contact voltage sensor;

[0016] Figure IB is a side profile view of the non-contact voltage sensor of Figure 1A;

[0017] Figure 2A is a side profile view of the non-contact voltage sensor adjacent to one or more interfering conductors;

[0018] Figure 2B is a top profile view of the non-contact voltage sensor adjacent to one or more interfering conductors;

[0019] Figure 3 is a top profile view of a non-contact voltage sensor comprising a shield plate;

[0020] Figure 4A is a top profile view of a flexible substrate single layer implemented non-contact voltage sensor;

[0021] Figure 4B is a first side profile view of a flexible substrate single layer implemented noncontact voltage sensor;

[0022] Figure 4C is a second side profile view of a flexible substrate single layer implemented noncontact voltage sensor;

[0023] Figure 4D is a view of the flexible substrate single layer implemented non-contact voltage sensor provided around a conductor;

[0024] Figure 4E is a second view of the flexible substrate single implemented non-contact voltage sensor provided around a conductor;

[0025] Figure 4F is a non-contact voltage sensor comprising a projecting region extending beyond the wound substrate;

[0026] Figure 4G is a second view of the non-contact voltage sensor comprising a projecting region extending beyond the wound substrate;

[0027] Figure 5A is a top profile view of a flexible substrate two layer implemented non-contact voltage sensor;

[0028] Figure 5B is a first side profile view of a flexible substrate two layer implemented non-contact voltage sensor;

[0029] Figure 50 is a second side profile view of a flexible substrate two layer implemented noncontact voltage sensor;

[0030] Figure 6A is a flexible substrate two layer implemented non-contact voltage sensor comprising a further projection;

[0031] Figure 6B is an alternative view of the flexible substrate two layer implemented non-contact voltage sensor comprising a further projection positioned around a conductor;

[0032] Figure 60 is an alternative view of the flexible substrate two layer implemented non-contact voltage sensor comprising a further projection positioned around a conductor, with the projection creating a shielded area;

[0033] Figure 7A is a view of a flexible substrate two layer implemented non-contact voltage sensor comprising a flap region; Figure 7B is a view of the flexible substrate two layer implemented non-contact voltage sensor comprising a flap region provided around a conductor;

[0034] Figure 8A is a view of a flexible substrate non-contact voltage sensor comprising a plurality of interfaces;

[0035] Figure 8B is a drawing of a forming tube or mount comprising a plurality of interfaces;

[0036] Figure 9 is a view of a flexible substrate non-contact voltage sensor comprising a plurality of apertures and projections;

[0037] Figure 10 is a view of a flexible substrate non-contact voltage sensor comprising a rigid portion;

[0038] Figure 11A is a view of a substrate implemented non-contact voltage sensor comprising one or more flexible regions;

[0039] Figure 11B is a view of a busbar;

[0040] Figure 11C is a view of the substrate of Figure 11A being manipulated into a different shape;

[0041] Figure 11D is a view of the substrate of Figure 11A provide around the busbar;

[0042] Figure HE is a view of a strain-relieving portion that may be provided on the substrate of

[0043] Figure 11A:

[0044] Figure 12A is a view of a semi-flexible substrate implemented non-contact voltage sensor;

[0045] Figure 12B is a view of the semi-flexible substrate implemented non-contact voltage sensor of Figure 12A adjacent to a conductor;

[0046] Figure 12C is a view of the semi-flexible substrate implemented non-contact voltage sensor of Figure 12A provided around the conductor;

[0047] Figure 13A is a view of a first substrate of a flexible substrate implemented non-contact voltage sensor;

[0048] Figure 13B is a view of a manipulated version of the first substrate of the flexible substrate implemented non-contact voltage sensor of Figure 13A;

[0049] Figure 13C is a view of a second substrate of the flexible substrate implemented non-contact voltage sensor;

[0050] Figure 13D is a view of a manipulated version of the second substrate of the flexible substrate implemented non-contact voltage sensor of Figure 13C;

[0051] Figure 13E is a view of a busbar;

[0052] Figure 13F is a view of the first substrate of Figure 13A and the second substrate of Figure 13C provided around the busbar;

[0053] Figure 14A is a view of a first substrate of a flexible substrate implemented non-contact voltage sensor;

[0054] Figure 14B is a view of a manipulated version of the first substrate of the flexible substrate implemented non-contact voltage sensor of Figure 14A;

[0055] Figure 14C is a view of a second substrate of the flexible substrate implemented non-contact voltage sensor;

[0056] Figure 14D is a view of a manipulated version of the second substrate of the flexible substrate implemented non-contact voltage sensor of Figure 14C; Figure 14E is a view of a conductor;

[0057] Figure 14F is a view of the first substrate of Figure 14A and the second substrate of Figure 14C provided around the conductor;

[0058] Figure 15A is a view of a flexible substrate implemented non-contact voltage sensor provided on a single substrate;

[0059] Figure 15B is a view of a manipulated version of the flexible substrate implemented noncontact voltage sensor of Figure 15A.

[0060] Detailed Description

[0061] Energy measurement systems may monitor, measure or determine the current and / or voltage in a conductor or between multiple conductors of a system, for example for metering in Electric Vehicle Supply Equipment (EVSE) or motor drive, or for power distribution units, etc.

[0062] Current transducers, for example a current transformer or a rate of change of current sensor (di / dt current sensor) such as a Rogowski coil may be used to measure the current passing through one or more conductors. In this example, the current transducers are non-contact current sensors, which has the benefit of more straightforward installation on each of the branches and may reduce cost / complexity if the voltages on each branch are likely to be high enough to require isolation mechanisms between a galvanic contact and the current measurement circuitry.

[0063] Voltage sensors may be used to measure the voltage between multiple conductors or between one or more conductors and a ground or reference voltage. Voltage sensors may comprise, for example potential dividers arranged to form a galvanic connection to each conductor and divide the voltage down. A voltage measurement circuit may be configured to measure the divided down voltage and output digital signals to an energy measurement unit alongside the current measurement from the current transducers. The voltage measurement circuit may require isolation functionality to isolate the relatively high voltage, hot side, which is coupled to the potential dividers, from the relatively low voltage digital interface. Such circuitry may be practical for measuring voltages of the three-phase supply, but not practical or cost efficient for measuring voltage of all the branches from each phase, particularly where there are a very large number of branches from each phase.

[0064] The inventors have recognised that it may be beneficial for such energy measurement systems to have a non-contact voltage sensing capability. Sensing the voltage on a branch or conductor of a system may be helpful for determining the status of the branch, for example whether a circuit breaker is open, or if a circuit breaker is closed and a load is being driven, or if the circuit breaker is closed and the load is disconnected / off. Furthermore, it may be desirable to sense voltage characteristics such as magnitude and / or phase on some or all of the branches for various different purposes. For example, a load may be connected to a branch at any time, or a load may turn on at any time. Prior to that, it may be helpful to understand the magnitude and / phase of the voltage to which the load will be connected, for example for load balancing and / or phase synchronisation between the branch and the load being connected. As a result, it can be seen there are a wide variety of different reasons, including safety monitoring, diagnostics, load balancing, load synchronisation, energy measurement, etc, why it may be helpful to sense the voltage on some or all of the branches.

[0065] As explained in the 'background' section, in many situations, non-contact voltage sensing has advantages over galvanic contact voltage measurement. The inventors have recognised that in arrangements where there is already a current transducer in place, particularly a PCB implemented current transducer such as a PCB implemented Rogowski coil, non-contact voltage sensing capabilities may be added relatively easily.

[0066] As the skilled person will understand, a di / dt current transducer such as a Rogowski coil may be implemented on a PCB by at least partially surrounding an opening / hole in the PCB with a coil formed by PCB conductive traces and vias. A conductor (e.g., a conductive wire or rod) carrying the current to be sensed may be passed through the opening / hole in the PCB and any changes in the current carried by the conductor may be sensed by the di / dt transducer. The inventors have recognised that in this case, the PCB presents a convenient surface on which to position a conductive sense component for use in non-contact sensing the voltage of the conductor.

[0067] Figure 1A shows an example top-down view of a PCB 140 with a central opening through which a conductor 120 passes. The conductor 120 is coated with an insulator 125. The PCB or substrate 140 may be separated from the conductor 125 by an airgap 145. The airgap 145 may be provided so that the PCB 140 can be easily located around the conductor 125.

[0068] Figure IB shows the same arrangement, but from a side-on view.

[0069] A ring-shaped conductive sense component 110 is positioned on the surface of a PCB 140 so as to completely surround the conductor 120 and capacitively 130 couple with the conductor 120. The capacitors 130 represented in Figure 1A are not capacitor components but instead represent the capacitive coupling formed between the conductor 120 and the conductive sense component 110, where the conductor 120 forms one plate of the "capacitor", the conductive sense component 110 the other plate of the "capacitor", and the insulating material therebetween (in this example, air and the insulator 125) form the dielectric of the "capacitor". As a result, an AC voltage of the conductor 120 will generate an AC sensing signal in the conductive sense component 110. Changes in the phase and / or magnitude of AC voltage will cause a corresponding change in the AC sensing signal. As such, the AC sensing signal can be used to sense the AC voltage.

[0070] The PCB 140 may further comprise a di / dt current transducer if current measurement is also desired in the same location as the voltage measurement. However, it should be understood that the non-contact voltage sensor may be provided separately or independently of the current transducer.

[0071] Figures 1A and IB show the conductive sense component 110 as a substantially circular ring, positioned on a PCB and fully surrounding the conductor 120. This shape may have a benefit of causing the coupling capacitance between the conductive sense component 110 and the conductor 120 to be relatively constant regardless of the position of the conductor 120 within the circle. However, this is merely one example. In an alternative, the conductive sense component 110 may only partially surround the conductor 120, for example being a split ring, or may be of a completely different shape, such as a rectangular plate that is simply positioned in proximity to a part of the conductor 120. Alternatively, it could be a series of plates arranged around the conductor 120, or a planar structure like a ruff / collar, formed as a separate piece or built into the PCB 140. In some examples it could be part of the internal edge of the PCB 140 (for example, plating the edge of the hole through which the conductor 120 passes, or formed as a series of conductive vias surrounding the hole through which the conductor 120 passes). Furthermore, regardless of the shape of the conductive sense component 110, it could be held in non-contacting proximity to the conductor 120 in any other suitable way. For example, conductive foam wrapped around or sandwiched around the conductor may be used in place of the substrate. Furthermore, any insulating material may be present between the conductive sense component 110 and the conductor 120, including (but not limited to) air and / or an insulating material coating the conductor 120. For example, the conductive sense component 119 may be configured to be attached directly to the outer surface of the insulator 120. The non-contact voltage sensor is provided such that the conductive sense component 110 is suitable for positioning in non-contacting proximity to the conductor 120 so as to capacitively couple with the conductor 120.

[0072] In busy measurement environments, such as in a multi-phase electrical network, multiple conductors may be collocated or located in the vicinity of one another.

[0073] Figure 2A shows a second conductor 250 and a third conductor 255 located in the vicinity of the conductor 120. Where the system is a three-phase electrical network, each of the conductors 120, 250 and 255 may carry a different phase current. The conductors 250 and 255 may alternatively correspond to different electrical networks. Conductors may be collocated in the vicinity of one another, as shown in Figure 2A, near to measurement circuits, allowing the measurement circuit or system to easily measure the voltages or currents of multiple conductors. However, this may lead to crosstalk, where the voltage measured by the conductive sense component 130 is based on the voltage of the conductor under test 120 and the other nearby conductors 250, 255.

[0074] Figure 2B shows the presence of parasitic capacitances in the system. As well as the desired capacitive coupling 130 between the conductor under test 120 and the conductive sense component 110, there may be a number of parasitic capacitances that couple to the conductive sense component 110. For example, a first parasitic capacitance 260 may couple between the second conductor 250 and the conductive sense component 110 and a second parasitic capacitance 265 may couple between the third conductor 255 and the conductive sense component 110. Whilst two parasitic capacitances are shown, it should be understood that this is an example only, and any number of parasitic capacitances may be present between any number of external conductors and the conductive sense component 110.

[0075] The parasitic capacitances 260, 265 result in a voltage coupled between the external conductors 250, 255 and the conductive sense component 110. These parasitic capacitances may reduce the accuracy of the non-contact voltage measurement, as the AC sensing signal in the conductive sense component 110 is dependent on the voltage of both the conductor 120 under test and external conductors 250, 255. Changes in the phase and / or magnitude of external conductors will cause a corresponding change in the AC sensing signal. As such, the AC sensing signal of the conductive sense component may not represent, solely, the voltage of the conductor 120 under test. This reduces the accuracy of the measured voltage, increasing the noise in the measured signal and thus reducing the signal to noise ratio (SNR).

[0076] Figure 3 shows the use of a conductive shield component 370. So as to prevent or reduce the capacitive coupling 260, 265 between external or interfering conductors 250, 255 and the conductive sense component 110, a conductive shield component 370 may be provided. The conductive shield component 370 may comprise a second area of conductive material formed on the substrate or PCB 140. The conductive shield component 370 is positioned to at least partially shield the first conductive sense component 110 from capacitively coupling to one or more interfering or external conductors 250, 255. The conductive shield component 370 may be coupled to a ground or reference voltage, and act as a ground plane that surrounds the conductive sense component 110. The parasitic capacitances 260, 265 therefore couple to the conductive shield component 370 instead of the conductive sense component 110.

[0077] The PCB 140 shown in Figures 1A-3 is a flat or rigid substrate. The conductive sense component 110 and conductive shield component 370 may be printed on this substrate 140. However, in place of a rigid substrate, a flexible substrate may be used. A flexible substrate may be substrate that can be bent, twisted, flexed or otherwise controlled such that its shape changes. A rigid substrate, as shown in Figure 3 may comprise an opening, hole or aperture that allows it to be slid onto or over the conductor 120. In contrast, a flexible substrate may be wrapped or wound around a conductor, such as the conductor 120. This allows flexibility in installation, as the conductor does not need to be disconnected from a supply during the fitting of the non-contact voltage sensor. A flexible substrate may comprise flexible dielectric layers between the layers of conductive material. For example, this may comprise polyimide (PI), polyester (PET) amongst any other suitable material.

[0078] It should be understood that, where a flexible substrate non-contact voltage sensor is described below, all of the concepts explained with reference to Figures 1A-3 also apply to a situation where a flexible substrate is used. In particular, the operation of the conductive sense component 110 and the conductive shield component 370 may be the same.

[0079] Figure 4A shows a non-contact voltage sensor 400 implemented using a flexible substrate. The non-contact voltage sensor comprises a flexible substrate 140 and a first conductive sense component 110 comprising a first area of conductive material formed on the flexible substrate 140. The non-contact voltage sensor 400 further comprises a first conductive shield component 370 comprising a second area of conductive material formed on the flexible substrate 140. The first conductive sense component 110 and first conductive shield component 370 may be formed or printed on the flexible substrate 140 in any suitable manner.

[0080] The non-contact voltage sensor 400 of Figure 4 may be considered to be a one-layer noncontact voltage sensor, in that it comprises a single conductive layer of material upon a flexible substrate 140. As the flexible substrate 140 is a single-layer substrate, the first conductive sense component 110 is formed on a first layer of the flexible substrate 140 and the first conductive shield 370 component is formed on the same first layer of the substrate 140. This can be seen in Figure 4B. Figure 4A shows a first perspective of the non-contact voltage sensor 400. Figure 4B shows a second perspective of the non-contact voltage sensor 400, looking through a cut-away of the non-contact voltage sensor 400 in the direction of arrow or view 491. Figure 4C shows a third perspective of the non-contact voltage sensor 400, looking through a cut-away of the non-contact voltage sensor 400 in the direction of arrow or view 492.

[0081] Figure 4B shows the second perspective of the of the non-contact voltage sensor 400, looking through a cut-away of the non-contact voltage sensor 400 in the direction of arrow or view 491. The non-contact voltage sensor 400 comprises a layer of conductive material formed upon the substrate 140. The layer of conductive material is used to form the first conductive shield component 370 and the first conductive sense component 110. As the first conductive shield component 370 covers, substantially, a full width of the substrate, only the first conductive shield component 370 can be seen from the perspective of Figure 4B. An insulating layer 475 may be optionally provided over the conductive layer. In use, the insulating layer may isolate the first conductive shield component 370 and first conductive sense component 110 from the conductor under test or one or more external conductors, depending on the orientation in which the flexible substrate is wrapped or wound.

[0082] Figure 4C shows the third perspective of the of the non-contact voltage sensor 400, looking through a cut-away of the non-contact voltage sensor 400 in the direction of arrow or view 492. In this perspective, both the first conductive shield component 370 and the first conductive sense component 110 can be seen. Whilst the first conductive shield component 370 and the first conductive sense component 110 are shown touching or in direct contact in these figures, it should be understood that they may be separated by a layer of insulating material. This has been omitted for clarity of the figures.

[0083] In use, the flexible substrate 140 is positioned around or about the first conductor 120 (also referred to as the conductor under test) so that the first conductive sense component 110 is positioned in non-contacting proximity to the first conductor 120 so as to capacitively couple with the first conductor. Positioning the flexible substrate 140 may comprise wrapping or winding the flexible substrate 140 around the conductor 120. This provides a non-contact voltage sensing output in dependence on the voltage of the conductor 120 under test. In this position, the first conductive shield component 370 acts to, at least partially, shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0084] Figure 4D shows the flexible substrate 140 positioned around the conductor 120. Figure 4E shows a second perspective of the flexible substrate 140 wrapped or wound around the conductor 120.

[0085] As the substrate 140 is a single-layer substrate 140, the flexible substrate 140 may be wrapped or wound around the conductor 120 at least twice. The first conductive sense component 110 and the first conductive shield component 370 are positioned on the flexible substrate 140 such that, in use, when the flexible substrate 140 is wrapped around the first conductor 120 at least twice, the first conductive sense component 110 acts to at least partially surround an axis of the first conductor 120, and the first conductive shield component 370 acts to at least partially surround an axis of the first conductive sense component 370. When wrapped around the conductor, the first conductive sense component 110 and the first conductive shield component 370 each form substantially concentric shapes around an axis of the first conductor 120. As the substrate is wrapped, it should be understood that the shapes are not perfectly concentric, as shown in Figure 4E, at least because they may form a helix-like or wound shape. However, as substrates are typically thin, on the order of millimetres, the sense and shield components are substantially circular when wound about the conductor. The shapes may be circular where the conductor 120 is circular, or any other suitable shape, for example to match that of the conductor 120.

[0086] When wrapping the flexible substrate around or about a conductor, a first side 493 of the flexible substrate 140 may be positioned to run along an axis of the conductor 120 or be parallel to the conductor 120. A second side 494 of the flexible substrate 140 may then wind or wrap around the conductor 120.

[0087] Figure 4A shows the first conductive sense component 110 having a first dimension or width 481 and a second dimension or length 484. When the flexible substrate 140 is wrapped around the conductor, this second dimension 484 may run parallel to the axis of the conductor. These dimensions may be sized such that the first conductive sense component acts to surround the conductor under test. In particular, the first dimension or width may be substantially equal to or greater than an outer perimeter of the first conductor 120, such that, in use when the flexible substrate 140 is positioned around the first conductor 120, the first conductive sense component 110 acts to surround at least part of an axis of the conductor 120. In this way, as shown in Figure 4E, the first conductive sense component 110 substantially surround the axis of the conductor 120. Where the conductor is a tubular form, the perimeter may be a circumference of the conductor 120. The outer perimeter may be a perimeter of the conductor 120 itself, or the outer perimeter of the conductor 120 and any insulating material 125 that may be present around the conductor 120. If the first dimension is equal to or greater than the outer perimeter of the conductor 120, the first conductive sense component 110 substantially surround the axis of the conductor 120. However, it should be understood that providing a first conductive sense component 110 that mostly or substantially surrounds the conductor is also beneficial. As such, substantially the same dimension may herein refer to a width 481 that is 75%, 80%, 85%, 90%, 95% or anywhere between 75%-100% of the outer perimeter of the first conductor 120.

[0088] The second dimension or length 484 of the sense component 110 may be chosen depending on the required capacitive coupling. The greater the second dimension 484 of the sense component 110, the greater the area of the sense component 110 and thus the greater the capacitive coupling between the conductor 120 and the sense component 110.

[0089] The conductive shield component 370 (which may be made up of a single or multiple separate or disparate conductive areas on the substrate 140), may have a first dimension or width 482 which is substantially equal to or greater than a circumference of the first conductor 120, such that, in use when the flexible substrate 140 is wrapped around the first conductor 120, the first conductive shield component 370 acts to surround at least part of an axis of the conductor 120 and the conductive sense component 110. Further, the second dimension or length 485 of the shield component 370 may be greater than the second dimension 484 of the sense component. As such, in all dimensions the first conductive shield component 370 is equal to or larger than the first conductive sense component 110, ensuring that the shield component 370 acts to shield the sense component from external parasitic capacitances. Substantially the same dimension may herein refer to a first dimension of width 482 that is 75%, 80%, 85%, 90%, 95% or anywhere between 75%-100% of the outer perimeter of the first conductor 120.

[0090] The use of a flexible substrate 140 allows the non-contact voltage sensor 400 to provide an accurate determination of a voltage of the conductor (for example between the conductor 120 and a reference voltage) whilst minimising parasitic capacitances that may reduce the accuracy of the measurement. The flexible substrate 140 may be wrapped or wound around the conductor in place, allowing installation at brown-field sites where the conductor 120 cannot be disconnected. Further, the flexible substrate 140 may be wrapped around conductors 120 of different diameters and is not limited by a predetermined aperture or opening size in a rigid PCB implementation.

[0091] The non-contact voltage sensor 400 may further comprise a connection conductor 495 formed on the flexible substrate 140, wherein the connection conductor 495 is coupled to the first conductive sense component 110. The connection conductor 495 may couple to a connection region 496 on the substrate. The connection conductor 495 may be sized or have a width that is minimised so as to reduce a parasitic capacitance between the connection conductor and external conductors. As well as surrounding the sense component 110, the shield component 370 may also act to shield the connection conductor 495 and the connection region 496. As such, the shield component may have a width or second dimension that extends a further distance 483 to shield the connection region. In particular, the connection region 496 may not wrap around the conductor, instead protruding from the wrapped arrangement. The shield component 370 may act to shield this region 496.

[0092] Figure 4F shows the protrusion of the connection region and length of shield 483 from the wound portion of the flexible substrate 140. It should be understood that this additional connection region and shield portion 483 is optional.

[0093] Both the shield component 370 and the sense component 110 may be coupled to the connection region 496. As such, the connection region provides a position or area for connection to external measurement circuits, the circuit being for use in sensing a first AC voltage of the first conductor in dependence on an output of the first conductive sense component. The measurement circuit may be positioned on the flexible substrate if desired or on a rigid region formed as part of the overall substrate. Figure 4G shows a simplified version of the non-contact voltage sensor 400 of Figure 4F, which does not show the different layers of the flexible substrate. In particular, the protrusion 483 of the material of the non-contact voltage sensor 400 can be seen.

[0094] Whilst the flexible substrate 140 based non-contact voltage sensor 400 may be implemented or provided on or using a one-layer substrate 140, it should be understood that it may instead be provided on a substrate having more than one layer. For example, a two-layer flexible substrate may comprise two or more conductive layers of material.

[0095] Figure 5A shows a non-contact voltage sensor 500 comprising a flexible substrate 140 having two or more layers. The non-contact voltage sensor comprises a flexible substrate 140 and a first conductive sense component 110 comprising a first area of conductive material formed on the flexible substrate 140. The non-contact voltage sensor 500 further comprises a first conductive shield component 370 comprising a second area of conductive material formed on the flexible substrate 140. The first conductive sense component 110 and first conductive shield component 370 may be formed or printed on the flexible substrate 140 in any suitable manner and are formed or printed on different layers of the flexible substrate 140.

[0096] The non-contact voltage sensor 500 of Figure 5A may be considered to be a two-layer noncontact voltage sensor, in that it comprises two or more conductive layers of material upon a flexible substrate 140. As the flexible substrate 140 is a two-layer substrate, the first conductive sense component 110 is formed on a first layer of the flexible substrate 140 and the first conductive shield 370 component is formed on a second layer of the substrate 140. This can be seen in Figure 5B and 5C. Figure 5A shows a first perspective of the non-contact voltage sensor 500. Figure 5B shows a second perspective of the non-contact voltage sensor 500, looking through a cut-away of the non-contact voltage sensor 500 in the direction of arrow or view 591. Figure 5C shows a third perspective of the non-contact voltage sensor 500, looking through a cut-away of the non-contact voltage sensor 400 in the direction of arrow or view 592.

[0097] Whilst Figure 5A shows both the sense component 110 and the shield component 370, it should be understood that this is for ease of understanding. In practice, as the components are on different layers of the substrate, only one of the components may be visible.

[0098] Figure 5B shows the second perspective of the of the non-contact voltage sensor 500, looking through a cut-away of the non-contact voltage sensor 500 in the direction of arrow or view 591. The non-contact voltage sensor 500 comprises a first layer 110 of conductive material formed upon the first layer of the substrate 140. The first layer of conductive material is used to form the first conductive sense component 110. The remainder of the first layer of the noncontact voltage sensor 500 is shown as insulating material 575. However, it should be understood that the insulating material provided on the first layer may be replaced with a conductive shield component 370. As such, the conductive shield component 370 may be formed on both layers of the substrate wherever the conductive sense component 110 is not provided. A gap or portion of insulating material 575 may be provided to separate the shield 370 and sense 110 components. The conductive shield component 370 on the first layer and the second layer of the flexible substrate 140 may be linked, coupled or connected using one or more vias between the layers.

[0099] The non-contact voltage sensor comprises a second layer 370 of conductive material formed upon the second layer of the substrate 140. The second layer 370 of conductive material is used to form the first conductive shield component 370. Whilst first and second layers are referred to here, it should be understood that the layer naming or ordering may be reversed.

[0100] An insulating layer 575 may be optionally provided. In use, the insulating layer may isolate the first conductive shield component 370 and first conductive sense component 110 from the conductor under test, from one or more external conductors and from one another, depending on the orientation in which the flexible substrate is wrapped or wound.

[0101] Figure 5C shows the third perspective of the of the non-contact voltage sensor 500, looking through a cut-away of the non-contact voltage sensor 500 in the direction of arrow or view 592. Both the first conductive shield component 370 and the first conductive sense component 110 can be seen.

[0102] In use, the flexible substrate 140 is positioned around or about the first conductor 120 (also referred to as the conductor under test) in a similar manner to that described with respect to non-contact voltage sensor 400 so that the first conductive sense component 110 is positioned in non-contacting proximity to the first conductor 120 so as to capacitively couple with the first conductor. This provides a non-contact voltage sensing output in dependence on the voltage of the conductor 120 under test. In this position, the first conductive shield component 370 acts to, at least partially, shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0103] As the substrate 140 is a two-layer substrate 140, the flexible substrate 140 may be positioned around the conductor 120 one time (or more) to achieve shielding. For example, this may comprise wrapping or winding the flexible substrate 140 once around the conductor 120. The first conductive sense component 110 and the first conductive shield component 370 are positioned on the flexible substrate 140 such that, in use, when the flexible substrate 140 is wrapped around the first conductor 120 once, the first conductive sense component 110 acts to at least partially surround an axis of the first conductor 120, and the first conductive shield component 370 acts to at least partially surround an axis of the first conductive sense component 110. When wrapped around the conductor, the first conductive sense component 110 and the first conductive shield component 370 each form substantially concentric shapes or circles around an axis of the first conductor 120. It should be understood that when the two-layer non-contact voltage sensor 500 is wrapped around the conductor, it looks substantially similar to those shown in Figures 4D, 4E and 4F, however the substrate only needs to be wrapped or wound around the conductor once.

[0104] When wrapping the flexible substrate around or about a conductor, a first side 593 of the flexible substrate 140 may be positioned to run along an axis of the conductor 120 or be parallel to the conductor 120. A second side 594 of the flexible substrate 140 may then wind or wrap around the conductor 120.

[0105] Figure 5A shows the first conductive sense component 110 having a first dimension or width 581 and a second dimension or length 584. When the flexible substrate 140 is wrapped around the conductor, this second dimension 584 may run parallel to the axis of the conductor. These dimensions may be sized such that the first conductive sense component acts to surround the conductor under test. In particular, the first dimension or width may be substantially equal to or greater than an outer perimeter of the first conductor 120, such that, in use when the flexible substrate 140 is wrapped around the first conductor 120, the first conductive sense component 110 acts to surround at least part of an axis of the conductor 120. In this way, the first conductive sense component 110 substantially surround the axis of the conductor 120. Where the conductor is a tubular form, the perimeter may be a circumference of the conductor 120. The outer perimeter may be a perimeter of the conductor 120 itself, or the outer perimeter of the conductor 120 and any insulating material 125 that may be present around the conductor 120. If the first dimension 581 is equal to or greater than the outer perimeter of the conductor 120, the first conductive sense component 110 surrounds the axis of the conductor 120. However, it should be understood that providing a first conductive sense component 110 that mostly or substantially surrounds the conductor is also beneficial. As such, substantially the same dimension may herein refer to a width 581 that is 75%, 80%, 85%, 90%, 95% or anywhere between 75%-100% of the outer perimeter of the first conductor 120.

[0106] The second dimension or length 584 of the sense component 110 may be chosen depending on the required capacitive coupling. The greater the second dimension 584 of the sense component 110, the greater the area of the sense component 110 and thus the greater the capacitive coupling between the conductor 120 and the sense component 110.

[0107] As shown in Figures 5B and 5C, as the shield component 370 and sense component 110 are formed on different layers of the flexible substrate 140, the shield component may be provided over the entire (or over substantially all of the) second layer of the substrate 140. The conductive shield component 370, may have a first dimension or width which is equal to the dimension 581 and 583. which is substantially equal to or greater than a circumference of the first conductor 120, such that, in use when the flexible substrate 140 is wrapped around the first conductor 120, the first conductive shield component 370 acts to surround at least part of an axis of the conductor 120 and the conductive sense component 110. Further, the second dimension or length 585 of the shield component 370 may be equal to or greater than the second dimension 584 of the sense component. As such, in all dimensions the first conductive shield component 370 may be equal to or greater than those of the first conductive sense component 110, ensuring that the shield component 370 acts to shield the sense component from external parasitic capacitances. As such, substantially the same dimension may herein refer to a width 583 that is 75%, 80%, 85%, 90%, 95% or anywhere between 75%-100% of the outer perimeter of the first conductor 120.

[0108] The use of a two-layer substrate allows simpler assembly of the non-contact voltage sensor 500 around the conductor under test, as the substrate 140 only has to be positioned or around the conductor once to provide substantial shielding.

[0109] Similar to the single layer non-contact voltage sensor 400, the non-contact voltage sensor 500 may further comprise a connection conductor 595 formed on the flexible substrate 140, wherein the connection conductor 595 is coupled to the first conductive sense component 110. The connection conductor 595 may couple to a connection region 596 on the substrate. As well as surrounding the sense component 110, the shield component 370 may also act to shield the connection conductor 595 and the connection region 596. As such, the shield component may have a width or second dimension that extends a further distance 583 to shield the connection region. In particular, the connection region 596 may not wrap around the conductor, instead protruding from the wrapped arrangement, as shown in Figure 4G. The shield component 370 may act to shield this region 596.

[0110] In addition to the previously discussed implementations, the flexible substrate 140 may comprise one or more flaps, hinged portions, or skirts arranged or configured to be folded over an adjacent portion of the flexible substrate. This acts to shield portions of the connection conductor 595 or connection region 596 that are not shielded on multiple sides.

[0111] For example, as shown in figure 6A, the flexible substrate may further comprise a flap portion extending a length 597. The first conductive shield component 370 is formed on the flap portion of the flexible substrate 140. The flap portion may have a dimension 597 that is substantially equal to dimension 583 of the adjacent portion of the flexible substrate. In this way, in use, when the flap portion is folded over, the conductive shield component 370 on the flap portion 597 acts to shield the adjacent portion of the flexible substrate. In particular the conductive shield component 370 on the flap portion 597 acts to shield connection conductor 595 on the flexible substrate. This may be particularly beneficial where the flexible substrate is a single layer substrate. As noted previously, substantially equal to may result in a length that is 75%, 80%, 85%, 90%, 95% or anywhere between 75%-100% of the outer perimeter of the first conductor. The flap portion 597 are shown as being continuous extensions of the flexible substrate 140, however it should be understood that the flap portions 597 (and the further flap portions described later on) may comprise slits which extend at least partially through the flap. These slits may allow the flap portion to bend of fold more easily. The slit may be an area where the flexible substrate has been cut or removed selectively.

[0112] Figure 6B shows the non-contact voltage sensor 600 wound around the conductor 120, with the adjacent portion 583 and the flap portion 597 folded over one another.

[0113] Further flap or skirt portions may be provided on the flexible substrate. The flap or skirt portions may be flexible and enclose a second area adjacent to the conductor 120.

[0114] Figure 6c shows a non-contact voltage sensor 600 in which the flap portion extends a distance 597, enclosing an area 670. The flap portion acts to extend from the flexible substrate 140 that surrounds the conductor 120. As the conductive shield component 370 is formed on the flap portion 597, the enclosed area 670 is shielded. A rigid substrate may be coupled below the flexible substrate 140, perpendicular to the flexible substrate 130. At least part of the rigid substrate may be located within the area 670. Sensitive electronics or measurement circuits may be provided in the enclosed area 670 on the rigid substrate, shielded by the conductive shield component 370. Further, the shield component 370 may extend onto the area 670, such that shielding is also provided directly below the sensitive components on the area 670. This reduces interference.

[0115] Figure 7A shows an output skirt or flap portion 798 of the flexible substrate 594 which protrudes or extends from the major portion of the flexible substrate 140. The output skirt or flap region 798 may take the same shape or size as the connection region 596. The connection region 596 may provide one or more terminals or connection points for connection to a measurement circuit or other outside circuitry, for example for connecting the conductive shield component 370 and the conductive sense component 110 to a measurement or processing circuit to determine a voltage under test or supply a ground or reference voltage. The connection region 596 may protrude from the flexible substrate 140 and thus be unshielded by the conductive shield component 370 on the major portion of the flexible substrate 110. The conductive shield component 370 may extend onto the output skirt or flap portion 798 and, in use, the output skirt or flap portion 798 may be folded or configured to be folded over the connection region 596. Figure 7B shows the non-contact voltage sensor 700 wound around the conductor 120, with the connection region 596 and the output skirt or flap portion 798 folded over one another. As such, the conductive shield component 370 on the output skirt or flap portion 798 acts to shield the connection region 596.

[0116] Following the winding or wrapping of the flexible substrate 140 around the conductor, the flexible substrate may be fixed or locked in place.

[0117] When assembling the non-contact voltage sensor directly around a conductor, the method may comprise positioning the flexible substrate about the conductor. Positioning the flexible substrate may comprise wrapping, winding, bending or deforming the flexible substrate around a first conductor.

[0118] Alternatively to forming the non-contact voltage sensor directly around the conductor, the non-contact voltage sensor may be assembled on a forming member, when assembling the non-contact voltage sensor, a forming member, such as a tube, oblong or other suitable shape may be used. The method may comprise positioning the flexible substrate around a forming such that the flexible substrate takes a shape corresponding to that of the forming member. This may comprise wrapping or winding the flexible substrate around the forming member. The flexible substrate may then be removed from the forming member and positioned around a first conductor. Alternatively, the forming member may be hollow and used to support the flexible substrate in use. In this case, the forming member may be slipped or slid onto or positioned over the conductor. The forming member may have an outer perimeter greater than the outer perimeter of the conductor 120. This may result in the inner perimeter of the non-contact voltage sensor being the same size as or greater than that of the conductor 120.

[0119] Figure 8A shows a non-contact voltage sensor 800 comprising a plurality of mechanical interfaces 899, the mechanical interfaces arranged, in use, when the flexible substrate 140 is wrapped around the first conductor 120, to hold the flexible substrate 140 in position. The plurality of mechanical interfaces 899 may comprise a plurality of apertures and / or a corresponding plurality of projections, wherein the plurality of apertures are configured to engage with the plurality of projections when the flexible substrate 140 is wound in position.

[0120] Figure 8B shows a forming member, such as a tube or jig 8100. The forming member may optionally have a number of mechanical interfaces. During installation, the flexible substrate may be positioned around the forming member 8100. The forming member 8100 may comprise a corresponding plurality of mechanical interfaces 8199 that are complementary to those on the flexible substrate 140. As such, the mechanical interface 8199 on the forming member 8100 may engage with those on the substrate 140, locking, joining or securing the flexible substrate 140 in a wound position about the forming tube. The forming tube may be then positioned on or over the cable under test.

[0121] The system of Figure 8 secures the substrate to a forming member 8100, which then may be positioned around a conductor 120. However, the mechanical interfaces on the substrate may instead be provided such that the flexible substrate is secured to itself. Figure 9 shows a noncontact voltage sensor 800 comprising a plurality of mechanical interfaces 9110, 9112, the mechanical interfaces arranged such that, in use, when the flexible substrate 140 is positioned around the first conductor 120, the mechanical interfaces engage with one another to hold the flexible substrate 140 in position. For example, projections 9110 may lock into apertures or openings 9112 when the substrate is wound. This may be a bump and notch interface, or any other suitable interface.

[0122] Any suitable fixture may be provided to hold the flexible substrate in a wound position around the conductor under test. For example, tape, glue, bump and hook fixings, hook and loop fasteners (e.g. Velcro (TM)) may be provided. Further, during assembly the flexible substrate may be wrapped directly around a conductor or wrapped around a forming tube (such as one made of plastic).

[0123] As mentioned previously, the connection region 596 may comprise one or more terminals for coupling the conductive sense component 110 and conductive shield component 370 to an external circuit or system. To ease installation, the connection region may be coupled or connected directly into a fitting or socket on an external circuit or system. As the substate 140 is flexible, it may not be possible to directly insert the connection region.

[0124] Figure 10 shows a non-contact voltage sensor 1100 with a stiffening component 1120 coupled to the flexible substrate 140. The stiffening component 1120 may be any rigid or semi-rigid component arranged to support or reinforce a portion of the flexible substrate 140. For example, the stiffening component may be a section of plastic or FR4 (which is commonly used to make non-flexible substrates). The stiffening component 1120 may be located so as to extend adjacent to the connection region 596, reinforcing the connection region 596 and allowing it to be slotted or positioned into a socket of an external circuit or system. Stiffening components may be additionally or alternatively provided in other regions of the flexible substrate. For example, a measurement circuit or other processing circuitry may be provided on the flexible substrate 140 and a stiffening component provided adjacent to the circuitry so as to support it. The use of a stiffening component allows a portion of the flexible substrate to be made rigid. Alternatively to the use of a stiffening component, a portion of the substrate 140 may be rigid substrate, such as a substrate made of FR4. Whilst this disclosure is presented in the context of energy measurement systems, and particularly energy measurement in multi-phase systems, it will be appreciated that the disclosed non-contact voltage sensors are more broadly relevant and may be used in any other context where voltage measurement (for example determining an accurate voltage measurement) or voltage detection (for example determining the presence or change in a voltage) are required.

[0125] The voltage sensor may be provided in the same system as a current sensor. For example, a di / dt current sensor (such as a Rogowski coil) may be provided on the flexible substrate 140 or on a component adjacent to the flexible substrate 140. The flexible substrate 140 may comprise a further extension, skirt or flap region onto which the conductive shield 370 extends so that, in use, the further extension region acts to shield the di / dt current sensor from external noise.

[0126] The preceding description and figures describe and show the flexible substrate positioned, wrapped or wound around a cylindrical or tubular conductor 120. However, it should be understood that the conductor 120 may be any shape or have any suitable cross section. For example, the conductor 120 may have a rectangular or square cross section. In some cases, the conductor may be a busbar. The conductor 120 may comprise one or more bundles or groups of multi-strand conductor. The flexible substrate may be positioned around the conductor 120 in any suitable manner, taking advantage of the ability of the flexible substrate to flex, bend, or deform. For example, the flexible substrate may flex or bend throughout its length to achieve this, allowing the flexible substrate 140 to be wound in a substantially circular or coiled cross section. The flexible substrate 140 may additionally or alternatively bend or flex at a number of points along the flexible substrate 140. This may result in, for example, the flexible substrate 140 having a square or rectangular cross section when positioned around the conductor 120, with the deformation of the substrate occurring at a number of distinct locations along the substrate 140.

[0127] When the non-contact voltage sensor is provided around a curved, cylindrical or oblong conductor, it may curve throughout its length or over a substantial portion of the substrate (for example, more than 50%, 60%, 70%, 80%, or 90%, or anywhere between 50-100%). This allows the sensor to fit closely to the conductor. Where the conductor has a non-circular cross section, it is still possible to use a non-contact voltage sensor that flexes in this manner, however, it may be desirable to provide a non-contact voltage sensor that fits closely to the shape of the conductor. This may be achieved by using a number of flexible regions separated by rigid regions that allow the substrate to bend at a sharper angle.

[0128] Figure 11A shows a non-contact voltage sensor 1100 comprising a substrate 140, a conductive sense component 110 and a conductive shield component 370. The non-contact voltage sensor shown in Figure 11A is shown using a simplified diagram for ease of understanding and it should be understood that the previous description and details are also relevant to the system of Figure 11A. The substrate 140 of the non-contact voltage sensor 1100 may be a flexible substrate. A flexible substrate may be flexible across its complete area, a substantial portion of its area, or in one or more flexible regions 1140. The flexible regions 1140 are regions where the substrate is configured to be or is capable of being bent or deformed.

[0129] The regions 1140 are locations where it is desirable for the substrate 140 to be bent to form a shape that substantially surrounds a conductor whose voltage is to be measured. There may or may not be features in these regions 1140, for example adjacent to, above or around the regions, to help the bending of the flexible substrate 140, such as removal of layers or stiffening material or reduction of the thickness of the conductive sense component 110 or shield 370 components to help the substrate to bend along the flexible region 1140. The substrate 140 may bend along the flexible regions 1140 by 10 degrees, 30 degrees, 45 degrees, 60 degrees, 90 degrees or more without being significantly damaged. The flexible regions 1140 may span from one edge or side of the substrate 140 to an opposite edge or side of the substrate and may be wide enough to make a smooth shape when bent. This allows the substrate to be folded or bent in certain directions. Whilst substrate 140 includes four flexible regions 1140, more or less than four flexible regions 1140 may be included depending on how the substrate 140 is configured to be provided around a busbar or conductor.

[0130] The flexible regions 1140 may be separated by rigid or stiffened regions of the substrate 140. However, in some situations, the substrate 140 may be substantially rigid, with one or more flexible regions 1140. As described previously, rigid regions may comprise rigid substrate such as FR4 or stiffening portions that act to make a flexible substrate rigid in certain regions.

[0131] Figure 11B shows a conductor 120 with a rectangular cross section. The conductor may be, for example, a busbar. As noted previously, the shape and type of conductor 120 is for illustrative purposes, and any other suitable shape or type of conductor may be used.

[0132] Figure 11C shows part of the assembly of the non-contact voltage sensor, with the substrate 140 deformed, twisted, angled, or curved at a number of the flexible locations 1140.

[0133] Figure 11D shows the substrate 140 positioned around the conductor 120. The flexible locations 1140 allow the substrate 140 to be shaped so as to surround the conductor 120. Whilst the substrate 140 is shown to completely surround the conductor 120, it may instead be arranged to surround or be adjacent to two or more edges of the conductor 120. The substrate 140 may be positioned around the busbar such that the layer of the substrate that comprises the conductive sense component 110 is closer to or adjacent to the conductor 120 when compared to the conductive shield component 370. Further, when the substrate is formed or positioned around the busbar 120, the sense component may substantially surround the conductor 120. This ensures that the parasitic capacitor formed by the conductive sense component 110 and the conductor 120 will have a near constant capacitance irrespective of the position of the conductor within the non-contact voltage sensor 1100.

[0134] As the substrate 140 may be formed or wrapped around the conductor 120, without needing to be passed over the end of the conductor 120, the substrate may be located around pre-existing busbars or conductors 120. This removes the need to decouple the conductor from another system, allowing easy connection of the contactless voltage sensor in brown-field industrial sites and other established systems, without the need for taking down the system or for a trained expert to install. However, it should be understood that the non-contact voltage sensor may be assembled around a jig or forming mould and then provided over the conductor 120 as previously discussed.

[0135] Strain relief may be added to the flexible regions 1140. Strain relief members may comprise any suitable material that prevents the substrate 140 from bending at flexible regions 1140 past a certain angle. This prevents undue strain damaging the substrate 140 or limiting system life. Strain relief may take the form of extra material, so that in order to bend by, for example, 90 degrees, a loop of additional material is added so that bend radius at any point is less than 90 degrees, an example of this is shown in Fig HE.

[0136] In the previous description, the flexible substrate 140 may be wrapped, wound or positioned around a conductor.

[0137] Figure 12A shows a non-contact voltage sensor 1200 comprising a substrate 140. Noncontact voltage sensor 1200 may be formed in the same way as non-contact voltage sensor 400 or 500. Substrate 140 may comprise a flexible substrate printed circuit board (PCB). The substrate 140 comprises a conductive sense component 110 and a conductive shield component 370. The non-contact voltage sensor 1200 and the arrangement of the shield component 370 and sense component 110 may be substantially the same as described previously and as such this will not be repeated in detail here.

[0138] The substrate 140 may be a flexible substrate, semi-flexible substrate or partially flexible substrate 140. As shown in Figure 12B, the substrate 140 may be provided adjacent to a substantially round conductor or busbar 120. As shown in Figure 12C, the substrate 140 may wrap or wind around the conductor 120. As the substrate 140 is flexible, semi-flexible or partially- flexible, no specific flexible region is required, instead the entire length or a substantial part of the length of the substrate 140 is flexible.

[0139] The substrate 140 may have a length that is substantially the same length or longer than a circumference of the conductor 120. This allows the substrate 140 to substantially surround the conductor 120, and in some cases allows a second edge of the substrate 140 to overlap a first edge of the substrate 140. This ensures that the conductive sense component 110 substantially surrounds the conductor 120.

[0140] An inner surface of the substrate 140 (arranged to be positioned closer to the conductor 120 compared to an outer surface) may be provided with a cushioning surface, for example a sponge or rubber surface. The cushioning surface may prevent direct contact between the substrate 140 and the conductor 120, preventing damage to either element when the substrate 140 is positioned around the conductor 120. Such a cushioning surface may be provided on any of the non-contact voltage sensors described herein.

[0141] The substrate 140 may be semi-flexible, such that without action it provides a substantially planar surface. When force is applied to the substrate 140, for example hitting, slapping, snapping or contacting the substrate 140 with a conductor 120 or other object, the substrate may coil into a circle, wrapping or winding around the conductor 120. This may also be referred to as a bistable spring (the semi-flexible substrate acts as or is configured as a bistable spring). This provides an easy mechanism for wrapping the substrate around the conductor or busbar 120. The substrate 140 may curl more than once around the busbar, and this might allow shielding from structures on the same layer as the sense plate when they wrap around behind the sense plate.

[0142] The substrate 140 may further contain a rigid non wrapping part.

[0143] The conductive sense component 110 may be a planar structure like a ruff / collar as a separate piece or formed on or constructed as part of a substrate or printed circuit board (PCB). To make the substrate 140 form a substantially planer form before being pressed onto the busbar or conductor 140 under test, it may be mounted on a housing that has a concave surface along the short edge that provides sufficient force to prevent the total assembly, which is designed to have a propensity to curl up, winding up when held straight. When the substrate assembly 140 is slapped onto the cable, the concave structure weakens, and the substrate 140 curls up. The preceding non-contact voltage sensors comprise a single substrate that is positioned or is wrapped substantially around a conductor 120. However, it should be understood that flexible substrate non-contact voltage sensors may comprise one or more substrates positioned in proximity to one another. This may allow the non-contact voltage sensor to take the form of a clamp-on voltage sensor, which can be opened or closed, for example using a hinge of moveable join, to allow it to be positioned around an existing conductor.

[0144] Figures 13A-13F show a non-contact voltage sensor comprising two pieces or two substrates. A number of the components of the non-contact voltage sensor of Figures 13A- 13F correspond to those of the preceding figures, and the preceding description should therefore also be considered relevant to the system of Figures 13A-13F. As such, a number of the techniques applied to the preceding systems may also be applied to the system of Figures 13A-13F.

[0145] Figure 13A shows a first portion 1300-1 of a non-contact voltage sensor 1300 comprising a first substrate 140-1. Substrate 140-1 may comprise a flexible substrate or semi-flexible substrate or printed circuit board (FlexPCB). The substrate 140-1 comprises a conductive sense component 110 comprising an area of conductive material provided on a layer of the substrate 140-1. The conductive sense component 110 may be provided on a first or top layer of the substrate 140-1, or on an internal layer of the substrate 140-1. The substrate 140-1 is a planar surface that may be deformed along one or more flexible regions 1340 to change the shape of the substrate. A shield plate 370 is located on the substrate 140.

[0146] The substrate 140-1 comprises a number of flexible regions 1340. The flexible regions 1340 allow the substrate 140-1 to bend, deform or be angled along the flexible region 1340. The flexible regions 1340 may span from one edge or side of the substrate 140-1 to an opposite edge or side of the substrate 140-1. This allows the substrate 140-1 to be folded or bent in certain directions. The substrate 140-1 is a planar surface that may be deformed along the flexible regions 1340 to change the shape of the substrate 140-1. The flexible regions may be strain relieved as described previously. Whilst substrate 140-1 includes three flexible regions 1340, more or less than three flexible regions 1340 may be included. The flexible regions 1340 may be separated by substantially rigid, rigid or stiff regions of the substrate 140-1, such that the substrate 140-1 predominantly or substantially bends at the flexible regions 1340 and not the rigid regions.

[0147] Figure 13B shows the substrate 140-1, with the substrate 140-1 twisted, angled, bent, deformed or curved at the flexible locations 1340. The flexible locations 204 are positioned on the substrate 140-1, such that when the substrate 140-1 is deformed at the flexible locations 1340 it forms a substantially "U" shaped substrate. This may alternatively be described as a shape capable of or configured to partially surround a conductor 120, for example on two or more sides of the conductor 120 or more than 180 degrees around the conductor.

[0148] Figure 13C shows a second portion 1300-2 of the non-contact voltage sensor 1300 comprising a second substrate 140-2. The second substrate 140-2 may be substantially the same as, identical to, a mirror image of or a flipped version of the first substrate 140-1 of the first portion 1300-1 of the non-contact voltage sensor 1300.

[0149] Figure 13D shows the second substrate 140-2 of the second portion 1300-2 of the noncontact voltage sensor 1300, with the substrate 140 twisted, angled, bent, deformed or curved at the flexible locations 1340. The flexible locations 1340 are positioned on the substrate 140-2, such that when the substrate 140-2 is deformed at the flexible locations 1340 it forms a substantially "U" shaped substrate. This may alternatively be described as a shape that partially surrounds a conductor, for example on two or more sides of the conductor. The substrate 140-2 may progress more than 180 degrees around the conductor.

[0150] Figure 13E shows a conductor or busbar 120 and Figure 13F shows the first substrate 140-2 and the second substrate 140-2 formed around the conductor or busbar 120. The substrates may be arranged such that the first substrate 140-1 and second substrate 140-2 in combination substantially surround the conductor 120. For example, the combination of the first 140-1 and second substrates 140-2 may surround or substantially surround an axis of the conductor 120.

[0151] The flexible regions 1340 are positioned on the first substrate 140-1 and the second substrate 140-2 such that, in use, when the substrates are deformed along the flexible regions and positioned around a first conductor, the first substrate 140-1 and the second substrate 140- 2 act to substantially surround the first conductor 120.

[0152] The first conductive sense component 110 is positioned on the first substrate 140-1 and the second conductive sense component 110 is positioned on the second substrate 140-2 such that, in use, when the first substrate 140-1 and the second substrate 140-2 are positioned around a first conductor 120 the first conductive sense component 110 and the second conductive sense component 110 are positioned in non-contacting proximity to the first conductor 120 so as to capacitively couple with the first conductor 120.

[0153] The first conductive shield component 370 is positioned on the first substrate 140-1 and the second conductive shield component 370 is positioned on the second substrate 140-2 such that, in use, when the first substrate 140-1 and the second substrate 140-2 are positioned around the first conductor, the first conductive shield component 370 and the second conductive shield component 370 are positioned to at least partially shield the first conductive sense component 110 and the second conductive sense component 110 from capacitively coupling to one or more further conductors.

[0154] The first and second portions 1300-1, 1300-2 of the non-contact voltage sensor 1300 may be positioned, formed or wrapped around the conductor 120 such that the conductive sense components 110 substantially surround the conductor 120. The substrates may be formed in place around the conductor 120. The substrates 140 may be formed elsewhere such as on a forming member, mould or on a housing as described previously. The forming member may act to rigidise or adds rigidity to the non-contact voltage sensor 1300 in that shape. The substrates may be brought together when placed substantially around the conductor 120.

[0155] Forming the first and second portions 1300-1, 1300-2 of the non-contact voltage sensor 1300 in the manner described results in two substrates 140-1 and 140-2 that may be easily provided around the conductor 120. The first and second portions 1300-1, 1300-2 of the non-contact voltage sensor 1300 or the substrates 140-1, 140-2 of these portions may be coupled together along one edge using a moveable connector, joint, hinge or hinging mechanism. For example, a hinge may be located so as to couple a first edge of the first substrate 140-1 and a first edge of the second substrate 140-2, allowing the substrates to be hinged around the busbar 120 or conductor to be easily removed or decoupled from the conductor 120. The hinge may be located within or coupled to the region 1342 of the first substrate 140-1 and the second substrate 140-2.

[0156] Whilst the first and second portions 1300-1, 1300-2 of the non-contact voltage sensor 1300 are shown as being the same or forming a mirrored arrangement, the two substrates 140-1, 140-2 of the first and second portions 1300-1, 1300-2 of the non-contact voltage sensor 1300 may alternatively form different shapes when twisted at the flexible regions 1340. The substrates may be different such when twisted or bent along the flexible regions 1340, and coupled to one another around a conductor 120, the substrates together substantially surround the conductor. For example, the first substrate 140-1 may be a substantially planar shape and the second substrate 140-2, when formed, may comprise a semi-circular or "U" shape. Alternatively, the substrates may both form "L" shapes. Any combination of shapes that allows the substrates to surround the conductor 120 is suitable.

[0157] The substrates may be shaped such that they overlap at least partially in regions, removing any possible gaps in how they surround the conductor 120. Further, they may comprise a region 1342 that allows the substrates to be coupled to an external circuit or system. The first and second portions 1300-1, 1300-2 of the non-contact voltage sensor 1300 or the first 140-1 and second 140-2 substrates may be constructed of a self-supporting material. If a substantially durable substrate is used, the substrates may support the formed shape without substantial movement along the flexible regions 204, 210 following assembly.

[0158] A housing or support structure may be provided, such as a clamp on voltage sensor housing. The substrates may be mounted on the housing, with the housing providing additional rigidity. The housing could be made of one or more materials. The housing may provide not just rigidity but electrical isolation and environmental shielding. The housing could have a conductive layer such as copper or aluminium and form part of the overall shielding of the system, in addition or as an alternative to the conductive shield component formed on the substrate.

[0159] The substrates 140 may be provided within the housing. The substrates may be provided within the housing, which may then latch, couple or close around the substrates 140. So as to close, the housing may comprise a self-closing mechanism, such as a spring, motor or other suitable mechanism. The housing may include a seal arranged to prevent ingress of contaminants or fluids. Further, the housing may comprise a centring mechanism, arranged to centre the substrates and / or conductor within the housing. The housing or substrates 140 may be coated in a membrane of fluid, such as an epoxy or resin, to seal or attach the housing and / or substrates 140 to the busbar or conductor 120. The housing may be constructed of a polymer or plastic.

[0160] The housing may incorporate interchangeable, compressible inserts of varying sizes. These inserts may conform to different cable diameters, ensuring that when the housing is closed, the internal pressure secures it firmly in place. This prevents the non-contact voltage sensor from slipping down the cable or busbar under test.

[0161] Figures 14A-14F show a non-contact voltage sensor 1400 formed in a similar manner to the substrate of Figures 13A-13F. However, instead of bending or deforming at a number of flexible regions, the substrate is a flexible substrate that deforms gradually over an entire region.

[0162] Figure 14A shows a first portion 1400-1 of the non-contact voltage sensor 1400 comprising a first substrate 140-1. The first substrate is a flexible substrate or flexible printed circuit board. The substrate 140-1 comprises a conductive sense component 110 comprising an area of conductive material provided on a layer of the substrate 140-1. The conductive sense component 110 may be provided on a first or top layer of the substrate 140-1, or on an internal layer of the substrate 140-1. The substrate 140-1 is a planar surface that may be deformed throughout a first region 1441 to change the shape of the substrate. A shield plate 370 is located on the substrate 140-1.

[0163] The substrate 140 comprises a first region 1441 and a second region 1442. The first region 1441 is a flexible region. The second region 1442 may be a rigid region (or a flexible region that is rigidised or stiffened using a stiffening component as described previously). The system of Figures 13A-13F comprises multiple flexible regions 1340. In contrast, the substrate 140-1 of the non-contact voltage sensor 1400 of Figures 14A-14F comprises at least one flexible region 1441 that spans a much greater width along the substrate 140-1. The flexible region 1441 allows the substrate to bend along the flexible region 1441. The flexible region may span from one edge or side of the substrate 140-1 to an opposite edge or side of the substrate. For example, the flexible region may span across the entire area of the substrate 140-1 (with the second region 1442 stiffened using a stiffening component). This allows the substrate to be folded or bent in certain directions. The substrate 140 is a planar surface that may be deformed along the flexible region 1441 to change the shape of the substrate. The flexible region may be strain relieved to allow it to bend gradually along substantially the entire width of the flexible region 1441.

[0164] The use of a first flexible region 1441 allows the substrate to bend gradually to form, for example, a semi-circle. This is particularly advantageous where the conductor 120 under test, shown in Figure 14E, is a cylindrical wire (or has a substantially round or circular cross section), as the substrate 140-1 may be in close contact and follow the curve or shape of the conductor 120.

[0165] As shown in Figure 14B, the substrate 140 may be formed or bent so as to partially surround a conductor 120 as shown in Figure 3e. The flexible region 1441 is positioned on the substrate 140-1, such that when the substrate is deformed at the flexible region, the substrate 140-1 forms a substantially "U" shaped substrate. This may alternatively be described as a shape that partially surrounds a conductor, for example on two or more sides of the conductor or more than 180 degrees around the conductor. A single flexible region allows the substrate to be gradually bent throughout the width of the flexible region, providing a gradual or smooth bend.

[0166] Figures 14C and 14D show a second portion 1400-2 of the non-contact voltage sensor 1400 comprising a second substrate 140-2 that substantially corresponds to the substrate 140-1 of Figures 14A and 14B. The second substrate 140-2 may be the same or substantially the same as the first substrate 140-1 or a mirror image of substrate 140-1 or a flipped version of the first substrate 140-1. As such, the second substrate 140-2 will not be discussed further here in the interests of brevity. Figure 14E shows a conductor 120 with a circular cross-section. Figure 14F shows the first portion 1400-1 and the second portion 1400-2 of the non-contact voltage sensor 1400 and in particular the first substrate 140-1 and the second substrate 140-2 formed around a conductor 120. The substrates may be arranged such that the first substrate and second substrate in combination substantially surround the conductor 120. For example, the combination of substrates may substantially surround an axis of the conductor 120.

[0167] The first portion 1400-1 and the second portion 1400-2 of the non-contact voltage sensor 1400 and in particular the first substrate 140-1 and second substrate 140-2 may be coupled to one another such that the first conductive sense component is coupled to the second conductive sense component. For example, the sense plates may be coupled to one another using conductive terminals in the second regions 1442 formed on a surface of the substrate. These conductive areas may be rigidised areas to hold connectors and / or electronics to sense the voltage and can be largely shielded by the shield on the other substrate when brought together.

[0168] As noted previously, the single flexible region 1441 on each substrate allows the substrate to closely fit the circular shape of the conductor 120. The substrates may be coupled together in a similar manner as the methods described with respect to Figure 14, for example a hinge mechanism coupled to the second regions 1442, however this will not be described here in the interests of brevity. The second region 1442 (on either or both of the first substrate 140- 1 and the second substrate 140-2 may comprise a circuit coupled to the first conductive sense component and the second conductive sense component, the circuit being for use in sensing a first AC voltage of the first conductor 120 in dependence on an output of the first conductive sense component and an output of the second conductive sense component. The first substrate 140-1 and the second substrate 140-2 are configured to be coupled to one another, such that the first conductive sense component 110 is coupled to the second conductive sense component 110 and the first conductive shield component 370 is coupled to the second conductive shield component 370.

[0169] The non-contact voltage sensors 1300 and 1400 may be referred to as clamp-on current sensors, in that they may be clamped onto an existing conductor. Whilst these voltage sensors comprise two substrates, it is also possible to provide a clamp-on non-contact voltage sensor using a single substrate.

[0170] Figure 15A shows a non-contact voltage sensor 1500 comprising a single first substrate 140. The substrate 140 comprises a first conductive sense component 110-1 comprising a first area of conductive material, a second conductive sense component 110-2 comprising a second area of conductive material. The substrate 140 further comprises a first conductive shield component 370-1 comprising a third area of conductive material and a second conductive shield component 370-2 comprising a fourth area of conductive material. Whilst two separate conductive shield components are shown, it should be understood that the shield components may be connected. For example, the shield components may extend substantially between the two shield components shown, and as such a single sense component may be provided. The conductive sense 110 and shield components 370 may be provided or positioned on the first substrate 140 in a similar manner to those described previously, such that in use when the first substrate 140 is positioned around a first conductor the first conductive sense component 110-1 and the second conductive sense component 110-2 are positioned in noncontacting proximity to the first conductor so as to capacitively couple with the first conductor. The first conductive shield component 370-1 is positioned on the substrate to at least partially shield the first conductive sense component and the second conductive shield component 370-2 is positioned on the substrate to at least partially shield the second conductive sense component 11-2 from capacitively coupling to one or more further conductors.

[0171] The first substrate 140 comprises a first flexible region 1541, a second flexible region 1543 and a connection region 1545 acting to couple the first flexible region 1541 and the second flexible region 1543. The first substrate 140 further comprises a first rigid region 1542 and a second rigid region 1544. The first rigid region 1542 and the second rigid region 1544 may be optional and provided where electronic components or additional circuits are to be fixed to the substrate. The portion of the first substrate 140 comprising the first flexible region 1541 and the first rigid region 1542 may be considered as substantially the same as the first region 1441 and the second region 1442 shown in the non-contact voltage sensor 1400 of Figure 14. The same is true for the second flexible region 1543 and second rigid region 1544.

[0172] The rigid regions may be substantially rigid, as described previously, and the flexible regions may be substantially flexible, such that they are capable of being deformed, moulded, twisted or bent to surround a conductor under test. Whilst the first substrate 140-1 and the second substrate 140-2 may be connected using a moveable joint or hinge, in the non-contact voltage sensor 1400 of Figure 14, the non-contact voltage sensor 1500 of Figure 15 replaces this with a single substrate comprising a connection region 1545. The connection region 1545 acts to replace the hinge or connector, allowing a single substrate to be used. This provides a noncontact voltage sensor that requires a single component (the first substrate 140- and can still act to clamp-on to or surround a conductor under test.

[0173] The first flexible region 1541 and the second flexible region 1543 are positioned on the first substrate 140 such that, in use, when the first substrate 140 is deformed along the first flexible region 1541 and the second flexible region 1542 and positioned around a first conductor, the first flexible region and the second flexible region act to substantially surround the first conductor. This is shown in Figure 15B, with the first flexible region 1541 and the second flexible region 1543 acting to surround a conductor under test (which may be passed through or between the flexible regions).

[0174] The connection region 1545 is a third flexible region positioned on the first substrate 140 such that, in use, when the first substrate is deformed along the connection region, the first flexible region 1541 and the second flexible region 1543 act to substantially surround the first conductor and the connection region 1545 connects the flexible regions. The connection region 1545 acts as a moveable or flexible joint or hinge. The connection region 1545 may bend 180 degrees to couple the flexible regions 1541 and 1542 of the first substrate 140. However, it should be understood that the connection region 1545 may be strain relieved to prevent the connection region bending at a sharp angle. As such, the connection region 1545 may be deformed into a substantially circular shape, as shown in Figure 15B.

[0175] The non-contact voltage sensor 1500 may be provided on or coupled to a further substrate 1599. The further substrate 1599 may comprise one or more connection components, circuits or further sensors. For example, the further substrate 1599 may comprise a di / dt current sensor such as a Rogowski coil, providing a compact system for voltage and current measurement.

[0176] The first conductive sense component 110-1 and the second conductive sense component 110-2 are coupled to one another using a connection conductor 1595. Whilst two separate conductive sense components are shown, it should be understood that the sense components may be connected. For example, the sense component may extend substantially between the two sense components shown, and as such a single sense component may be provided The connection conductor 1595 is a conductive trace provided on the substrate 140, passing over or on the first rigid region 1542, the connection region 1545 and the second rigid region 1544. As the first rigid region 1542 and the second rigid region 1544 are rigid, a circuit may be provided on either the first or second rigid regions 1542, 1544 of the first substrate 140 coupled to the first conductive sense component 110-1 and the second conductive sense component 110-2, the circuit being configured for use in sensing a first AC voltage of the first conductor in dependence on an output of the first conductive sense component 110-1 and an output of the second conductive sense component 110-2.

[0177] The first substrate may further comprise a first flap region 1556, similar to the flap regions described previously. The first flap region 1556 extends from a major region or the main part of the first substrate 140 and is configured to be folded, deformed or bent such that it folds over part of the first rigid region 1542, the second rigid region 1544 and the connection region 1545. The first flap region 1556 may be a flexible region of the substrate 140. The first flap region 1556 may comprise a third conductive shield component (not shown). As such, when the first flap region 1556 is deformed or folded over the substrate, the third conductive shield component is provided over and acts to shield the connection conductor 1595 and / or the circuit provided on one or more of the rigid regions 1542, 1544.

[0178] The substrate 140 may further comprise a third rigid region 1596 and a fourth rigid region 1557 connected to the first flexible region 1541 and the second flexible region 1543. During manufacture of the non-contact voltage sensor 1500. The third rigid region 1596 and the fourth rigid region 1557 may be used during manufacture to provide a stable or firm holding or gripping point. In addition, a fifth rigid region (not shown) may be provided opposite the second rigid region 1556. This would allow four rigid regions to be provided (one on each side of the substrate 140), further improving the holding position during manufacture of the substrate. The third rigid region 1596 and the fourth rigid region 1557 may be detachable from the first substrate 140 following manufacture, for example by cutting, snapping or otherwise detaching the rigid regions from the substrate 140.

[0179] The entire substrate 140 may be a flexible substrate. Where the substrate is flexible, connection regions (for example, as described previously with respect to connection region 496) may be provided. These connection regions may be stiffened and allow connection into a separate circuit or connector. Some regions of the substrate may be stiffened using stiffening members. Regions 1542 and 1544 may be rigid regions. As such, components or measurement circuits may be provided on these regions.

[0180] The substrate may be located in the same housing as a current sensor such as a split core current transformer or Rogowski coil. This allows contactless voltage and current measurement to be provided using a single component or in a small area.

[0181] The substrate may further comprise processing or control circuity, coupled to the conductive sense component and configured to determine the voltage across the parasitic capacitor formed by the conductive sense component and the conductor. Alternatively, the substrate may comprise one or more terminals suitable for coupling to an external processing or control circuit. The voltage sensor may form part of a circuit breaker or electrical safety system.

[0182] The terminology "coupled" used above encompasses both a direct electrical connection between two components, and an indirect electrical connection where the two components are electrically connected to each other via one or more intermediate components.

[0183] The skilled person will readily appreciate that various alterations or modifications may be made to the above-described aspects of the disclosure without departing from the scope of the disclosure. Aspects

[0184] Provided below are a first set of numbered aspects of the disclosure:

[0185] 1. A sensor for non-contact AC voltage sensing, the sensor comprising: a first conductive sense component comprising a first area of conductive material; a first conductive shield component comprising a second area of conductive material; a second conductive sense component comprising a third area of conductive material; a second conductive shield component comprising a fourth area of conductive material; wherein the conductive sense components and the conductive shield components are arranged such that, in use when the sensor is positioned around a first conductor: the first conductive sense component and the second conductive sense component are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and the first conductive shield component and the second conductive shield component are positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

[0186] 2. The sensor according to aspect 1, further comprising: a first substrate comprising one or more flexible regions; a second substrate comprising one or more flexible regions, wherein : the first conductive sense component is formed on the first substrate; the first conductive shield component is formed on the first substrate; the second conductive sense component is formed on the second substrate; the second conductive shield component is formed on the second substrate.

[0187] 3. The sensor according to aspect 2, wherein the first substrate and the second substrate are configured such that, in use, when the first substrate and the second substrate are positioned around the first conductor, the first substrate and the second substrate substantially surround the first conductor.

[0188] 4. The sensor according to any of aspects 2-3, wherein the flexible regions are positioned on the first substrate and the second substrate such that, in use, when the substrates are deformed along the flexible regions and positioned around the first conductor, the first substrate and the second substrate act to substantially surround the first conductor.

[0189] 5. The sensor according to any of aspects 2-4, wherein the first conductive sense component is positioned on the first substrate and the second conductive sense component is positioned on the second substrate such that, in use, when the first substrate and the second substrate are positioned around the first conductor: the first conductive sense component and the second conductive sense component are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor. 6. The sensor according to aspect 5, wherein the first conductive shield component is positioned on the first substrate and the second conductive shield component is positioned on the second substrate such that, in use, when the first substrate and the second substrate are positioned around the first conductor: the first conductive shield component and the second conductive shield component are positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

[0190] 7. The sensor according to any of aspects 2-6, wherein the first substrate and the second substrate are substantially the same.

[0191] 8. The sensor according to any of aspects 2-7, wherein the one or more flexible regions span from a first edge of the respective substrate to a second edge of the substrate, the second edge of the substrate being opposite to the first edge of the substrate.

[0192] 9. The sensor according to any of aspects 2-8, wherein the one or more flexible regions are configured such that the respective substrate may be folded or bent along the flexible regions.

[0193] 10. The sensor according to any of aspects 2-9, wherein the one or more flexible regions span across substantially all of the first substrate and the second substrate.

[0194] 12. The sensor according to aspects 11, wherein the one or more flexible regions of the first substrate comprise a first plurality of flexible regions and the one or more flexible regions of the second substrate comprise a second plurality of flexible regions.

[0195] 13. The sensor according to aspect 12, wherein the first plurality of flexible regions are separated from one another by a first plurality of rigid regions and the second plurality of flexible regions are separated from one another by a second plurality of rigid regions.

[0196] 14. The sensor according to any of aspects 2-13, wherein : the first substrate comprises a first region and a second region, wherein the one or more flexible regions are located on the first region of the first substrate, and wherein the second region of the first substrate is a substantially rigid.

[0197] 15. The sensor according to aspect 14, further comprising a circuit on the second region of the first substrate coupled to the first conductive sense component and the second conductive sense component, the circuit being for use in sensing a first AC voltage of the first conductor in dependence on an output of the first conductive sense component and an output of the second conductive sense component.

[0198] 16. The sensor according to any of aspects 2-15, wherein the first substrate and the second substrate are configured to be coupled to one another, such that the first conductive sense component is coupled to the second conductive sense component and the first conductive shield component is coupled to the second conductive shield component.

[0199] 17. The sensor according to any of aspects 2-16, wherein the first substrate is coupled to the second substrate using a moveable joint or hinge.

[0200] 18. The sensor according to aspect 1, further comprising: a first substrate comprising one or more flexible regions, and wherein: the first conductive sense component is formed on the first substrate; the first conductive shield component is formed on the first substrate; the second conductive sense component is formed on the first substrate; the second conductive shield component is formed on the first substrate.

[0201] 19. The sensor according to aspect 18, wherein the first substrate comprises a first flexible region, a second flexible region, and a connection region, wherein the connection region is provided between the first flexible region and the second flexible region.

[0202] 20. The sensor according to aspect 19, wherein the first substrate comprises a first rigid region and a second rigid region, wherein the first rigid region is provided between the first flexible region and the connection region, and the second rigid region is provided between the second flexible region and the connection region.

[0203] 21. The sensor according to aspect 20, wherein : the first conductive sense component and the first conductive shield component are formed on the first flexible region of the first substrate; and the second conductive sense component and the second conductive shield component are formed on the second flexible region of the first substrate.

[0204] 22. The sensor according to aspect 21, wherein the first flexible region and the second flexible region are positioned on the first substrate such that, in use, when the first substrate is deformed along the first flexible region and the second flexible region and positioned around a first conductor, the first flexible region and the second flexible region act to substantially surround the first conductor.

[0205] 23. The sensor according to any of aspects 20-22, wherein the connection region is a third flexible region positioned on the first substrate such that, in use, when the first substrate is deformed along the connection region, the first flexible region and the second flexible region act to substantially surround the first conductor and the connection region connects the flexible regions.

[0206] 24. The sensor according to any of aspect 20-23, further comprising a connection conductor coupling the first conductive sense component and the second conductive sense component, the connection conductor provided on the first rigid region, the connection region and the second rigid region.

[0207] 25. The sensor according to any of aspects 20-24, further comprising a circuit on the first rigid region of the first substrate coupled to the first conductive sense component and the second conductive sense component, the circuit being for use in sensing a first AC voltage of the first conductor in dependence on an output of the first conductive sense component and an output of the second conductive sense component.

[0208] 26. The sensor according to any of aspects 20-25, wherein the first substrate comprises one or more flap regions comprising at least a first flap region projecting from the connection region.

[0209] 27. The sensor according to aspect 26, further comprising a third conductive shield component formed on the first flap region. 28. The sensor according to aspect 26 or aspect 27, wherein the first flap region is positioned on the first substrate such that, in use, when the first flap region is deformed, the first flap region folds over at least part of the connection region.

[0210] 29. The sensor according to any of aspects 26-28, wherein the first flap region is positioned on the first substrate such that, in use, when the first flap region is deformed, the first flap region folds over at least part of the first rigid region and the second rigid region.

[0211] 30. The sensor according to aspect 29, wherein the first flap region acts to shield one or more components on the first rigid region and the second rigid region.

[0212] 31. The sensor according to any of aspects 20-30, wherein the first substrate comprises: a third rigid region, the third rigid region coupled to the first flexible region; a fourth rigid region, the fourth rigid region coupled to the second flexible region; wherein the third rigid region and the fourth rigid region are configured to provide a stable holding point during a manufacture of the sensor.

[0213] 32. The sensor according to any of aspects 20-30, wherein the substrate comprises a plurality of rigid regions, with at least one rigid region coupled to each edge of the substrate.

[0214] 33. The sensor according to aspect 31, wherein the third rigid region and the fourth rigid region are detachable from the first connection region and the second rigid region.

[0215] 33. A clamp-on non-contact voltage sensor comprising the sensor according to any preceding claim.

[0216] 34. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a first substrate comprising one or more flexible regions around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors; and positioning a second substrate comprising one or more flexible regions around the first conductor, such that: a second conductive sense component comprising a first area of conductive material formed on the substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a second conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0217] 35. The method according to aspect 34, further comprising coupling the first substrate to the second substrate. 36. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a first substrate comprising one or more flexible regions around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the first substrate and a second conductive sense component comprising a second area of conductive material formed on the first substrate are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a third area of conductive material formed on the first substrate and a second conductive shield component comprising a fourth area of conductive material formed on the first substrate is positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

[0218] Provided below are a second set of numbered aspects:

[0219] 1. A sensor for non-contact AC voltage sensing, the sensor comprising: a flexible substrate; a first conductive sense component comprising a first area of conductive material formed on the flexible substrate; a first conductive shield component comprising a second area of conductive material formed on the flexible substrate; wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use when the flexible substrate is positioned around a first conductor: the first conductive sense component is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and the first conductive shield component is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0220] 2. The sensor according to aspect 1, wherein the one or more further conductors are adjacent to the first conductor.

[0221] 3. The sensor according to any preceding aspect, wherein the first conductive shield component is for coupling to a reference or ground voltage.

[0222] 4. The sensor according to any preceding aspect, wherein at least one dimension of the first conductive sense component is substantially equal to or greater than an outer perimeter of the first conductor, such that, in use when the flexible substrate is positioned around the first conductor, the first conductive sense component acts to surround at least part of an axis of the conductor

[0223] 5. The sensor according to any preceding aspect, wherein_at least one dimension of the first conductive shield component is substantially equal to or greater than an outer perimeter of the conductor, such that, in use when the flexible substrate is positioned around the first conductor, the first conductive sense component acts to surround at least part of an axis of the conductor.

[0224] 6. The sensor according to any preceding aspect, wherein, in use when the flexible substrate is positioned around the first conductor, one or more of the following applies: the first conductive sense component is closer to the first conductor than the first conductive shield component; the first conductive shield component acts to surround the first conductive sense component; the first conductive sense component and the first conductive shield component each form substantially concentric shapes around an axis of the first conductor.

[0225] 7. The sensor according to any preceding aspect, wherein the first conductive shield component has a width greater than or equal to a width of the first conductive sense component and a length greater than or equal to a length of the first conductive sense component.

[0226] 8. The sensor according to any preceding aspect, wherein a dimension of the first conductive shield component is greater than a dimension of the first conductive sense component such that, in use when the flexible substrate is positioned around the first conductor, the first conductive shield component extends a greater distance in a direction parallel to the axis of the first conductor than the first conductive sense component.

[0227] 9. The sensor according to any preceding aspect, wherein the first conductive sense component is formed on a first layer of the flexible substrate and the first conductive shield component is formed on the first layer of the substrate.

[0228] 10. The sensor according to aspect 9, wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use, when the flexible substrate is positioned around the first conductor at least twice, the first conductive sense component acts to at least partially surround an axis of the first conductor, and the first conductive shield component acts to at least partially surround an axis of the first conductive shield component.

[0229] 11. The sensor according to any of aspects 1-8, wherein the first conductive sense component is formed on a first layer of the flexible substrate and the first conductive shield component is formed on a second layer of the substrate.

[0230] 12. The sensor according to aspect 11, wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use when the flexible substrate is positioned around the first conductor, the first conductive sense component acts to at least partially surround an axis of the first conductor, and the first conductive shield component acts to at least partially surround an axis of the first conductive sense component. 13. The sensor according to any preceding aspect, wherein the flexible substrate comprises one or more insulating layers arranged to isolate the first conductive shield component and first conductive sense component from one or more of the following: one another; the first conductor; one or more external conductors.

[0231] 14. The sensor according to any preceding aspect, further comprising a connection conductor formed on the flexible substrate, wherein the connection conductor is coupled to the first conductive sense component.

[0232] 15. The sensor according to any preceding aspect, further comprising a circuit coupled to the first conductive sense component via the connection conductor, the circuit being for use in sensing a first AC voltage of the first conductor in dependence on an output of the first conductive sense component.

[0233] 16. The sensor according to any preceding aspect, wherein the first conductive shield component is coupled to a ground or reference terminal.

[0234] 17. The sensor according to any preceding aspect, further comprising a rigid substrate coupled to the flexible substrate, the rigid substrate configured for insertion into a connection means of a separate system.

[0235] 18. The sensor according to any preceding aspect, wherein the flexible substrate comprises one or more flaps such that, in use, the flap portions are configured to be folded over an adjacent portion of the flexible substrate.

[0236] 19. The sensor according to aspect 18, wherein the first conductive shield component is formed on the one or more flaps such that, in use, when the flap portion is folded over, the adjacent portion of the flexible substrate is shielded by the first conductive shield component on the flap portion.

[0237] 20. The sensor according to any preceding aspect, wherein the flexible substrate further comprises a plurality of mechanical interfaces, the mechanical interfaces arranged such that, in use, when the flexible substrate is positioned around the first conductor, the mechanical interfaces engage with one another to hold the flexible substrate in position.

[0238] 21. The sensor according to aspect 20, wherein the plurality of mechanical interfaces comprise a plurality of apertures and a corresponding plurality of projections, wherein the plurality of apertures are configured to engage with the plurality of projections.

[0239] 22. The sensor according to any preceding aspect, wherein the flexible substrate configured to coil into a substantially circular shape when force is applied.

[0240] 23. The sensor according to any preceding aspect, further comprising a cushioning surface provided on a first surface of the flexible substrate.

[0241] 24. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a flexible substrate around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the flexible substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

[0242] 25. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a flexible substrate around a forming member such that the flexible substrate takes a shape corresponding to that of the forming member; removing the flexible substrate from the substantially forming member; positioning the flexible substrate around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the flexible substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

Claims

Claims1. A sensor for non-contact AC voltage sensing, the sensor comprising: a flexible substrate; a first conductive sense component comprising a first area of conductive material formed on the flexible substrate; a first conductive shield component comprising a second area of conductive material formed on the flexible substrate; wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use when the flexible substrate is positioned around a first conductor: the first conductive sense component is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and the first conductive shield component is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

2. The sensor according to claim 1, wherein the one or more further conductors are adjacent to the first conductor.

3. The sensor according to any preceding claim, wherein the first conductive shield component is for coupling to a reference or ground voltage.

4. The sensor according to any preceding claim, wherein at least one dimension of the first conductive sense component is substantially equal to or greater than an outer perimeter of the first conductor, such that, in use when the flexible substrate is positioned around the first conductor, the first conductive sense component acts to surround at least part of an axis of the conductor.

5. The sensor according to any preceding claim, wherein_at least one dimension of the first conductive shield component is substantially equal to or greater than an outer perimeter of the conductor, such that, in use when the flexible substrate is positioned around the first conductor, the first conductive sense component acts to surround at least part of an axis of the conductor.

6. The sensor according to any preceding claim, wherein, in use when the flexible substrate is positioned around the first conductor, one or more of the following applies: the first conductive sense component is closer to the first conductor than the first conductive shield component;the first conductive shield component acts to surround the first conductive sense component; the first conductive sense component and the first conductive shield component each form substantially concentric shapes around an axis of the first conductor.

7. The sensor according to any preceding claim, wherein the first conductive shield component has a width greater than or equal to a width of the first conductive sense component and a length greater than or equal to a length of the first conductive sense component.

8. The sensor according to any preceding claim, wherein a dimension of the first conductive shield component is greater than a dimension of the first conductive sense component such that, in use when the flexible substrate is positioned around the first conductor, the first conductive shield component extends a greater distance in a direction parallel to the axis of the first conductor than the first conductive sense component.

9. The sensor according to any preceding claim, wherein the first conductive sense component is formed on a first layer of the flexible substrate and the first conductive shield component is formed on the first layer of the substrate.

10. The sensor according to claim 9, wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use, when the flexible substrate is positioned around the first conductor at least twice, the first conductive sense component acts to at least partially surround an axis of the first conductor, and the first conductive shield component acts to at least partially surround an axis of the first conductive shield component.

11. The sensor according to any of claims 1-8, wherein the first conductive sense component is formed on a first layer of the flexible substrate and the first conductive shield component is formed on a second layer of the substrate.

12. The sensor according to claim 11, wherein the first conductive sense component and the first conductive shield component are positioned on the flexible substrate such that, in use when the flexible substrate is positioned around the first conductor, the first conductive sense component acts to at least partially surround an axis of the first conductor, and the first conductive shield component acts to at least partially surround an axis of the first conductive sense component.

13. The sensor according to any preceding claim, further comprising a connection conductor formed on the flexible substrate, wherein the connection conductor is coupled to the first conductive sense component.

14. The sensor according to any preceding claim, further comprising a circuit coupled to the first conductive sense component via the connection conductor, the circuit being for use in sensing a first AC voltage of the first conductor in dependence on an output of the first conductive sense component.

15. The sensor according to any preceding claim, further comprising a rigid substrate coupled to the flexible substrate, the rigid substrate configured for insertion into a connection means of a separate system.

16. The sensor according to any preceding claim, wherein the flexible substrate comprises one or more flaps such that, in use, the flap portions are configured to be folded over an adjacent portion of the flexible substrate.

17. The sensor according to any preceding claim, wherein the flexible substrate further comprises a plurality of mechanical interfaces, the mechanical interfaces arranged such that, in use, when the flexible substrate is positioned around the first conductor, the mechanical interfaces engage with one another to hold the flexible substrate in position.

18. The sensor according to any preceding claim, wherein the flexible substrate configured to coil into a substantially circular shape when force is applied.

19. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a flexible substrate around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the flexible substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

20. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a flexible substrate around a forming member such that the flexible substrate takes a shape corresponding to that of the forming member; removing the flexible substrate from the substantially forming member; positioning the flexible substrate around a first conductor, such that:a first conductive sense component comprising a first area of conductive material formed on the flexible substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

21. A sensor for non-contact AC voltage sensing, the sensor comprising: a first conductive sense component comprising a first area of conductive material; a first conductive shield component comprising a second area of conductive material; a second conductive sense component comprising a third area of conductive material; a second conductive shield component comprising a fourth area of conductive material; wherein the conductive sense components and the conductive shield components are arranged such that, in use when the sensor is positioned around a first conductor: the first conductive sense component and the second conductive sense component are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and the first conductive shield component and the second conductive shield component are positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

22. The sensor according to claim 21, further comprising: a first substrate comprising one or more flexible regions; a second substrate comprising one or more flexible regions, wherein : the first conductive sense component is formed on the first substrate; the first conductive shield component is formed on the first substrate; the second conductive sense component is formed on the second substrate; the second conductive shield component is formed on the second substrate.

23. The sensor according to claim 22, wherein the first substrate and the second substrate are configured such that, in use, when the first substrate and the second substrate are positioned around the first conductor, the first substrate and the second substrate substantially surround the first conductor.

24. The sensor according to any of claims 22-23, wherein the flexible regions are positioned on the first substrate and the second substrate such that, in use, when thesubstrates are deformed along the flexible regions and positioned around the first conductor, the first substrate and the second substrate act to substantially surround the first conductor.

25. The sensor according to any of claims 22-24, wherein the first conductive sense component is positioned on the first substrate and the second conductive sense component is positioned on the second substrate such that, in use, when the first substrate and the second substrate are positioned around the first conductor: the first conductive sense component and the second conductive sense component are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor.

26. The sensor according to claim 25, wherein the first conductive shield component is positioned on the first substrate and the second conductive shield component is positioned on the second substrate such that, in use, when the first substrate and the second substrate are positioned around the first conductor: the first conductive shield component and the second conductive shield component are positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

27. The sensor according to any of claims 22-26, wherein the one or more flexible regions span from a first edge of the respective substrate to a second edge of the substrate, the second edge of the substrate being opposite to the first edge of the substrate.

28. The sensor according to any of claims 22-27, wherein the one or more flexible regions span across substantially all of the first substrate and the second substrate.

29. The sensor according to any of claims 22-28, wherein: the first substrate comprises a first region and a second region, wherein the one or more flexible regions are located on the first region of the first substrate, and wherein the second region of the first substrate is substantially rigid.

30. The sensor according to any of claims 22-29, wherein the first substrate is coupled to the second substrate using a moveable joint or hinge.

31. The sensor according to claim 21, further comprising: a first substrate comprising one or more flexible regions, and wherein: the first conductive sense component is formed on the first substrate; the first conductive shield component is formed on the first substrate; the second conductive sense component is formed on the first substrate; the second conductive shield component is formed on the first substrate.

32. The sensor according to claim 31, wherein the first substrate comprises a first flexible region, a second flexible region, and a connection region, wherein the connection region is provided between the first flexible region and the second flexible region.

33. The sensor according to claim 32, wherein the first substrate comprises a first rigid region and a second rigid region, wherein the first rigid region is provided between the first flexible region and the connection region, and the second rigid region is provided between the second flexible region and the connection region.

34. The sensor according to claim 33, wherein: the first conductive sense component and the first conductive shield component are formed on the first flexible region of the first substrate; and the second conductive sense component and the second conductive shield component are formed on the second flexible region of the first substrate.

35. The sensor according to claim 34, wherein the first flexible region and the second flexible region are positioned on the first substrate such that, in use, when the first substrate is deformed along the first flexible region and the second flexible region and positioned around a first conductor, the first flexible region and the second flexible region act to substantially surround the first conductor.

36. The sensor according to any of claim 33-35, wherein the connection region is a third flexible region positioned on the first substrate such that, in use, when the first substrate is deformed along the connection region, the first flexible region and the second flexible region act to substantially surround the first conductor and the connection region connects the flexible regions.

37. The sensor according to any of claims 33-36, wherein the first substrate comprises one or more flap regions comprising at least a first flap region projecting from the connection region.

38. The sensor according to any of claims 33-37, wherein the first substrate comprises: a third rigid region, the third rigid region coupled to the first flexible region; a fourth rigid region, the fourth rigid region coupled to the second flexible region; wherein the third rigid region and the fourth rigid region are configured to provide a stable holding point during a manufacture of the sensor.

39. A method of assembling a non-contact AC voltage sensor, the method comprising:positioning a first substrate comprising one or more flexible regions around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors; and positioning a second substrate comprising one or more flexible regions around the first conductor, such that: a second conductive sense component comprising a first area of conductive material formed on the substrate is positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a second conductive shield component comprising a second area of conductive material formed on the flexible substrate is positioned to at least partially shield the first conductive sense component from capacitively coupling to one or more further conductors.

40. A method of assembling a non-contact AC voltage sensor, the method comprising: positioning a first substrate comprising one or more flexible regions around a first conductor, such that: a first conductive sense component comprising a first area of conductive material formed on the first substrate and a second conductive sense component comprising a second area of conductive material formed on the first substrate are positioned in non-contacting proximity to the first conductor so as to capacitively couple with the first conductor; and a first conductive shield component comprising a third area of conductive material formed on the first substrate and a second conductive shield component comprising a fourth area of conductive material formed on the first substrate is positioned to at least partially shield the first conductive sense component and the second conductive sense component from capacitively coupling to one or more further conductors.

Images