Resin substrate and electronic device

Abstract

The present invention provides: a resin substrate which is capable of improving shape stability of the entire resin substrate; and an electronic device. A resin substrate (1) is provided with a substrate (2) and a conductor pattern part (3). The substrate (2) has a closed loop structure part (20). The substrate (2) contains a resin material. The conductor pattern part (3) is disposed along the inner edge (201) of the closed loop structure part (20). The closed loop structure part (20) has a conductor formation part (21) and a conductor non-formation part (22). The conductor formation part (21) has a bent plastic deformation portion (211). The conductor formation part (21) is provided with the conductor pattern part (3). The conductor non-formation part (22) is adjacent to the conductor formation part (21) in a direction along the inner edge (201), and is connected to the conductor formation part (21). The conductor non-formation part (22) is not provided with the conductor pattern part (3) or a conductor.

Description

Resin substrates and electronic devices

[0001] The present invention generally relates to a resin substrate and an electronic device, and more particularly to a resin substrate having a plastically deformed portion and an electronic device including the resin substrate.

[0002] Patent Document 1 discloses a wiring board and an electronic device.

[0003] The wiring board disclosed in Patent Document 1 includes a substrate and a conductor layer. The substrate has a curved plastically deformed portion. When viewed from above, the substrate has one or more valley fold lines and one or more mountain fold lines that intersect with the conductor layer, and is bent and plastically deformed at the valley fold lines and mountain fold lines.

[0004] Japanese Patent Application Laid-Open No. 2017-123421

[0005] The wiring board disclosed in Patent Document 1 is provided with a curved plastic deformation portion, so that it is difficult to bend in one direction, but there are cases where it is easy to deform in a direction different from the one direction.

[0006] An object of the present invention is to provide a resin substrate and an electronic device that can improve the shape stability of the entire resin substrate.

[0007] A resin substrate according to one aspect of the present invention comprises a substrate and a conductor pattern portion. The substrate has a closed loop structure portion. The substrate includes a resin material. The conductor pattern portion is arranged along the inner edge of the closed loop structure portion. The closed loop structure portion has a conductor-containing portion and a conductor-free portion. The conductor-containing portion has a curved plastically deformed portion. The conductor pattern portion is arranged in the conductor-containing portion. The conductor-free portion is adjacent to the conductor-containing portion in a direction along the inner edge of the closed loop structure portion and is connected to the conductor-containing portion. The conductor-free portion does not have the conductor pattern portion or a conductor arranged therein.

[0008] An electronic device according to one aspect of the present invention includes the resin substrate according to the above aspect and an electronic component disposed on the resin substrate.

[0009] The resin substrate and electronic device according to the above aspects of the present invention can improve the rigidity of the curved plastically deformed portion, thereby improving the shape stability of the entire resin substrate.

[0010] FIG. 1 is a plan view of a resin substrate according to a first embodiment. FIG. 2 is a front view of the resin substrate. FIG. 3 is a plan view for explaining the length of a conductor-free portion in the resin substrate. FIG. 4 is a plan view of a resin substrate according to a first modified example of the first embodiment. FIG. 5 is a front view of the resin substrate. FIG. 6 is a front view of a resin substrate according to a second modified example of the first embodiment. FIG. 7 is a front view of a resin substrate according to a third modified example of the first embodiment. FIG. 8 is a plan view of a resin substrate according to a fourth modified example of the first embodiment. FIG. 9 is a plan view of a resin substrate according to a fifth modified example of the first embodiment. FIG. 10 is a plan view of a resin substrate according to a sixth modified example of the first embodiment. FIG. 11 is a plan view of a resin substrate according to a second embodiment. FIG. 12 is a plan view of a resin substrate according to a third embodiment. FIG. 13 is a front view of the resin substrate according to the second embodiment. FIG. 14 is a cross-sectional view of the resin substrate according to the second embodiment taken along line XIV-XIV in FIG. 12. FIG. 15 is a plan view of an electronic device including a resin substrate according to a fourth embodiment. FIG. 16 is a front view of the resin substrate according to the fourth embodiment. 17 is a side view of the resin substrate of the same. FIG. 18 is a cross-sectional view of the electronic device of the same, taken along line XVIII-XVIII in FIG. 15 . FIG. 19 is a cross-sectional view of the electronic device of the same, taken along line XIX-XIX in FIG. 15 . FIG. 20 is a plan view of an electronic device according to a modification of embodiment 4. FIG. 21 is a plan view of an electronic device according to embodiment 5. FIG. 22 is a rear view of the resin substrate of the same. FIG. 23 is a side view of the resin substrate of the same. FIG. 24 is a cross-sectional view of a main part of an electronic device according to embodiment 6. FIG. 25 is a plan view of a resin substrate according to embodiment 7. FIG. 26 is a cross-sectional view of the resin substrate of the same, taken along line XXVI-XXVI in FIG. 25 . FIG. 27 is a plan view of a resin substrate according to modification 1 of embodiment 7. FIG. 28 is a cross-sectional view of the resin substrate of the same, taken along line XXVIII-XXVIII in FIG. 27 . FIG. 29 is a plan view of a resin substrate according to modification 2 of embodiment 7. FIG. 30 is a cross-sectional view of the resin substrate of the same, taken along line XXX-XXX in FIG. 29 . Fig. 31 is a plan view of a resin substrate according to Modification 3 of Embodiment 7. Fig. 32 is a plan view of a resin substrate according to Embodiment 8. Fig. 33 is a plan view of a resin substrate according to Embodiment 9. Fig. 34 is a cross-sectional view of the resin substrate taken along line XXXIV-XXXIV in Fig. 33 . Fig. 35 is a front view of a main part of a resin substrate according to Modification 1.Fig. 36 is a front view of a main part of a resin substrate according to another modified example 2. Fig. 37 is a plan view of a resin substrate according to another modified example 3. Fig. 38 is a plan view of a resin substrate according to another example.

[0011] Hereinafter, embodiments 1 to 9 will be described with reference to the drawings. The drawings referred to in the following embodiments 1 to 9 are schematic diagrams, and the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensions, and the size and thickness ratios between the components do not necessarily reflect the actual dimensional ratios. Furthermore, each drawing is depicted using a defined Cartesian coordinate system having three mutually orthogonal axes: the X-axis, the Y-axis, and the Z-axis. The X-axis, the Y-axis, and the Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are depicted merely for the purpose of explanation and do not have any physical substance.

[0012] First Embodiment A resin substrate 1 according to a first embodiment will be described with reference to FIGS.

[0013] (1) Configuration As shown in FIG. 1 , the resin substrate 1 includes a substrate 2 and a conductor pattern portion 3. The substrate 2 has a closed loop structure portion 20. The substrate 2 contains a resin material. The conductor pattern portion 3 is arranged along an inner edge 201 of the closed loop structure portion 20. The closed loop structure portion 20 has a conductor-containing portion 21 and a conductor-free portion 22. The conductor-containing portion 21 has a curved plastically deformed portion 211. The conductor pattern portion 3 is arranged in the conductor-containing portion 21. The conductor-free portion 22 is adjacent to and connected to the conductor-containing portion 21 in a direction along the inner edge 201 of the closed loop structure portion 20. The conductor-free portion 22 does not have a conductor pattern portion 3 or a conductor arranged therein. Note that the conductor pattern portion 3 is not shown in FIG. 2 .

[0014] The resin substrate 1 is used in, for example, electronic devices. The electronic devices are, for example, communication devices. The communication devices are, for example, mobile phones (e.g., smartphones), but are not limited to mobile phones and may be, for example, notebook personal computers, wearable devices, etc.

[0015] The outer shape of the resin substrate 1 according to the first embodiment is the same as the outer shape of the substrate 2. In the resin substrate 1 of the present embodiment, the length in the X-axis direction is the same as the length in the Y-axis direction, but the length in the X-axis direction may be different from the length in the Y-axis direction. The resin substrate 1 has a first main surface 11 and a second main surface 12 (see FIG. 2 ). The second main surface 12 of the resin substrate 1 is the main surface opposite to the first main surface 11.

[0016] 2 , the substrate 2 has a first main surface 221 and a second main surface 222. The second main surface 222 of the substrate 2 is the main surface opposite to the first main surface 221. In this embodiment, the conductor pattern portion 3 is arranged on the first main surface 221 of the substrate 2, and the first main surface 221 of the substrate 2 constitutes a part of the first main surface 11 of the resin substrate 1. The second main surface 222 of the substrate 2 constitutes the second main surface 12 of the resin substrate 1. The thickness of the substrate 2 is, for example, not less than 50 μm and not more than 1000 μm.

[0017] The material of the substrate 2 includes, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The thermoplastic resin is not limited to a liquid crystal polymer, and may be, for example, PTFE (polytetrafluoroethylene). The material of the substrate 2 may also be, for example, polyimide (PI) or modified polyimide (modified-PI).

[0018] The closed loop structure 20 of the substrate 2 has an opening 203. An inner edge 201 of the closed loop structure 20 is the opening edge of the opening 203. In this embodiment, an outer edge 202 of the closed loop structure 20 forms the outer edge of the substrate 2.

[0019] The plastically deformed portion 211 has a protruding shape (U-shaped in the example of FIGS. 1 and 2 ) that protrudes toward the first main surface 11 of the resin substrate 1. More specifically, as shown in FIGS. 1 and 2 , the plastically deformed portion 211 has a shape that protrudes toward the first main surface 221 of the substrate 2 further than a portion adjacent to the plastically deformed portion 211 in the closed loop structure 20 of the substrate 2. The plastically deformed portion 211 of the closed loop structure 20 is bent by plastically deforming the thermoplastic resin, and the closed loop structure 20 itself maintains the shape of the plastically deformed portion 211. In order to maintain the shape of the plastically deformed portion 211, it is desirable that the metal conductor included in the plastically deformed portion 211 (in this embodiment, a part of the conductor pattern portion 3) is also deformed.

[0020] In this embodiment, the plastically deformed portion 211 is formed from the outer edge 202 to the inner edge 201 of the closed loop structure 20. In this embodiment, the plastically deformed portion 211 is bent at each of a plurality of (four in the example of FIG. 1 ) ridge lines R11, R12, R13, and R14 that are aligned in a direction along the inner edge 201 of the closed loop structure 20. In the example of FIG. 1 , each of the plurality of ridge lines R11, R12, R13, and R14 is located in the Y-axis direction from the outer edge 202 to the inner edge 201 of the closed loop structure 20, and the plurality of ridge lines R11, R12, R13, and R14 are aligned in the X-axis direction. The plastically deformed portion 211 has a plurality of (two in the example of FIG. 1 ) step portions S11 and S12 that are aligned in a direction along the inner edge 201 of the closed loop structure 20. The step portion S11 is the portion between the ridge line R11 and the ridge line R12. The step portion S12 is the portion between the ridge line R13 and the ridge line R14.

[0021] The conductor pattern portion 3 has electrical conductivity and is made of a material that includes, for example, copper.

[0022] The thickness of the conductive pattern portion 3 is, for example, 3 μm to 40 μm The conductive pattern portion 3 is formed, for example, by patterning copper foil attached to the substrate 2.

[0023] In this embodiment, in a plan view from the Z-axis direction, the conductor pattern portion 3 is located along the inner edge 201 of the closed loop structure portion 20. The conductor pattern portion 3 has a first end 31 and a second end 32 in the direction along the inner edge 201 of the closed loop structure portion 20. Note that in Figures 1 to 3, the axis along the thickness direction of the portion of the conductor containing portion 21 of the substrate 2 other than the plastically deformed portion 211 is depicted as the Z-axis.

[0024] In the substrate 2, the conductor-containing portion 21 and the conductor-non-containing portion 22 are aligned in the direction along the inner edge 201 of the closed loop structural portion 20. As described above, the conductor-non-containing portion 22 is adjacent to and connected to the conductor-containing portion 21 in the direction along the inner edge 201 of the closed loop structural portion 20. In the closed loop structural portion 20, the conductor-containing portion 21 and the conductor-non-containing portion 22 are integral and seamlessly connected.

[0025] In this embodiment, the conductor-containing portion 21 is a portion of the closed loop structure 20 where the conductor pattern portion 3 is present on a normal line perpendicular to the tangent line of the inner edge 201 of the closed loop structure 20 in a plan view from the Z-axis direction. The conductor-free portion 22 is a portion of the closed loop structure 20 where the conductor pattern portion 3 and the conductor are not present on a normal line perpendicular to the tangent line of the inner edge 201 of the closed loop structure 20 in a plan view from the Z-axis direction. Fig. 3 illustrates a normal N1 (hereinafter also referred to as a first normal N1) and a normal N2 (hereinafter also referred to as a second normal N2) among a group of normal lines perpendicular to the tangent line of an arbitrary point of the inner edge 201 of the closed loop structure 20 in a plan view from the Z-axis direction. The first normal N1 is a normal defined to overlap the first end 31 of the conductor pattern portion 3 in a plan view from the Z-axis direction, and is a normal perpendicular to the tangent to the first point P1 at the inner edge 201 of the closed loop structure portion 20. The second normal N2 is a normal defined to overlap the second end 32 of the conductor pattern portion 3 in a plan view from the Z-axis direction, and is a normal perpendicular to the tangent to the second point P2 at the inner edge 201 of the closed loop structure portion 20. In this embodiment, the length L2 of the conductor-free portion 22 at the inner edge 201 of the closed loop structure portion 20 is the length between the first point P1 and the second point P2. In this embodiment, the sum of the length L1 of the conductor-containing portion 21 at the inner edge 201 of the closed loop structure portion 20 and the length L2 of the conductor-free portion 22 is the same as the length of the inner edge 201 of the closed loop structure portion 20.

[0026] The length L2 of the conductor-free portion 22 at the inner edge 201 of the closed loop structure 20 is not more than one-half, and preferably not more than one-fourth, of the length of the inner edge 201 of the closed loop structure 20. In the present embodiment, as an example, the length L2 of the conductor-free portion 22 at the inner edge 201 of the closed loop structure 20 is not more than one-tenth of the length of the inner edge 201 of the closed loop structure 20. The length L2 of the conductor-free portion 22 at the inner edge 201 of the closed loop structure 20 is not less than one-thirtieth, and more preferably not less than one-twentieth, of the length of the inner edge 201 of the closed loop structure 20.

[0027] (2) Effects In the resin substrate 1 according to the first embodiment, the conductor pattern portion 3 is arranged along the inner edge 201 of the closed loop structure portion 20. The phrase "the conductor pattern portion 3 is arranged along the inner edge 201 of the closed loop structure portion 20" is not limited to the case where the conductor pattern portion 3 is parallel to the inner edge 201 of the closed loop structure portion 20, and it is not essential that the conductor pattern portion 3 is parallel to the inner edge 201 of the closed loop structure portion 20. The closed loop structure portion 20 has a conductor-containing portion 21 and a conductor-free portion 22. The conductor-containing portion 21 has a curved plastically deformed portion 211. The conductor pattern portion 3 is arranged in the conductor-containing portion 21. The conductor-free portion 22 is adjacent to and connected to the conductor-containing portion 21 in the direction along the inner edge 201 of the closed loop structure portion 20. The conductor-free portion 22 does not have a conductor pattern portion 3 or a conductor arranged therein.

[0028] The above configuration makes it possible to improve the shape stability of the entire resin substrate 1. More specifically, the above configuration makes it possible to improve the shape stability of the entire resin substrate 1. In more detail, the conductor-free portion 22 is adjacent to and connected to the conductor-containing portion 21 in the direction along the inner edge 201, and therefore the substrate 2 has a closed loop structure portion 20. This makes it possible to improve the rigidity of the curved plastic deformation portion 211 compared to a case where the conductor-free portion 22 is not included, and makes it possible to improve the shape stability of the entire resin substrate 1.

[0029] In the resin substrate 1 according to the first embodiment, the length L2 of the conductor-free portion 22 at the inner edge 201 of the closed loop structure 20 is equal to or less than one-fourth the length of the inner edge 201 of the closed loop structure 20 .

[0030] According to the above configuration, the length L1 of the conductor containing portion 21 at the inner edge 201 of the closed loop structure portion 20 can be made longer, and the area in which the conductor pattern portion 3 can be formed can be made wider.

[0031] In the resin substrate 1 according to the first embodiment, the plastically deformed portion 211 is formed from the outer edge 202 to the inner edge 201 of the closed loop structure portion 20 .

[0032] According to the above configuration, the recess 2113 is formed in the plastically deformed portion 211 of the conductor containing portion 21 from the outer edge 202 to the inner edge 201 of the closed loop structure portion 20 .

[0033] (3) Modifications Modifications of the first embodiment will now be described.

[0034] 4 and 5, in the resin substrate 1 according to the first modification of the first embodiment, the length in the X-axis direction is longer than the length in the Y-axis direction. In addition, in the resin substrate 1 according to the first modification, the step portion S11 and the step portion S12 are parallel to each other.

[0035] In the resin substrate 1 according to the second modification of the first embodiment, as shown in FIG. 6, the plastically deformed portion 211 is bent so as to have eight ridge lines R11 to R18.

[0036] In the resin substrate 1 according to the third modification of the first embodiment, as shown in FIG. 7, the plastically deformed portion 211 has an arc shape when viewed from the Y-axis direction.

[0037] In the resin substrate 1 relating to variant example 4 of embodiment 1, as shown in Figure 8, when viewed in a plane from the Z-axis direction, the outer edge 202 of the closed loop structure portion 20 is rectangular, and the substrate 2 has multiple (two in the example of Figure 8) protrusions 25 protruding in the Y-axis direction from the outer edge 202 of the closed loop structure portion 20.

[0038] In the resin substrate 1 according to the fifth modification of the first embodiment, as shown in FIG. 9, the substrate 2 further has a second opening 204 different from the opening 203 (first opening 203) of the closed loop structure portion 20.

[0039] 10 , in the resin substrate 1 according to the sixth modification of the first embodiment, the shape of the inner edge 201 and the shape of the outer edge 202 of the closed loop structure 20 are different. In the sixth modification, the inner edge 201 of the closed loop structure 20 is rectangular, and the outer edge 202 of the closed loop structure 20 is circular.

[0040] The resin substrate 1 according to each of the above-described modifications also provides the same effects as the resin substrate 1 according to the first embodiment.

[0041] (Embodiment 2) A resin substrate 1A according to embodiment 2 will be described with reference to Fig. 11. Regarding the resin substrate 1A according to embodiment 2, components similar to those of the resin substrate 1 according to embodiment 1 (see Figs. 1 to 3) are denoted by the same reference numerals and description thereof will be omitted.

[0042] (1) Configuration In the resin substrate 1A according to the second embodiment, the closed loop structure 20 further has a second plastically deformed portion 212 that is different from the first plastically deformed portion 211, which is the plastically deformed portion 211. The second plastically deformed portion 212 is located at a position different from the first plastically deformed portion 211 in the direction along the inner edge 201 of the closed loop structure 20. In this embodiment, the shape of the second plastically deformed portion 212 is the same as the shape of the first plastically deformed portion 211, but it may be different from the shape of the first plastically deformed portion 211.

[0043] The first plastically deformed portion 211 is bent at each of a plurality of (four in the example of FIG. 11 ) ridge lines R11, R12, R13, and R14 that are aligned in a direction along the inner edge 201 of the closed loop structural portion 20. The first plastically deformed portion 211 has a plurality of (two in the example of FIG. 11 ) first step portions S11, S12 that are aligned in a direction along the inner edge 201 of the closed loop structural portion 20.

[0044] The second plastically deformed portion 212 is formed from the outer edge 202 to the inner edge 201 of the closed loop structure 20. The second plastically deformed portion 212 is bent at each of a plurality of (four in the example of FIG. 11 ) ridge lines R21, R22, R23, and R24 that are aligned in a direction along the inner edge 201 of the closed loop structure 20. In the example of FIG. 11 , each of the plurality of ridge lines R21, R22, R23, and R24 is located in the X-axis direction from the outer edge 202 to the inner edge 201 of the closed loop structure 20. The plurality of ridge lines R21, R22, R23, and R24 are aligned in the Y-axis direction. The second plastically deformed portion 212 has a plurality of (two in the example of FIG. 1 ) step portions S21 and S22 that are aligned in a direction along the inner edge 201 of the closed loop structure 20. The step portion S21 is the portion between the ridge line R21 and the ridge line R22. The step portion S22 is the portion between the ridge line R23 and the ridge line R24.

[0045] In this embodiment, the direction in which the multiple first step portions S11, S12 are arranged in the first plastically deformed portion 211 is different from the direction in which the multiple second step portions S21, S22 are arranged in the second plastically deformed portion 212. In this embodiment, the direction in which the multiple first step portions S11, S12 are arranged in the first plastically deformed portion 211 is parallel to the X-axis direction. In addition, in this embodiment, the direction in which the multiple second step portions S21, S22 are arranged in the second plastically deformed portion 212 is parallel to the Y-axis direction. In this embodiment, the first plastically deformed portion 211 includes multiple first step portions S11, S12, and the second plastically deformed portion 212 includes two second step portions S21, S22. However, the first plastically deformed portion 211 may include only one first step portion S11, and the second plastically deformed portion 212 may include only one second step portion S22, as long as the orientation of the first step portion S11 and the orientation of the second step portion S22 are different from each other. The orientation of the first step portion S11 is parallel to the ridge line R11 that defines the first step portion S11. Therefore, in the example of FIG. 11 , the orientation of the first step portion S11 is parallel to the Y-axis in a planar view from the Z-axis direction. The orientation of the second step portion S22 is parallel to the ridge line R24 that defines the second step portion S22. Therefore, in the example of FIG. 11, the direction of the second step portion S22 is parallel to the X axis in a plan view from the Z axis direction.

[0046] (2) Effect The resin substrate 1A of embodiment 2, like the resin substrate 1 of embodiment 1, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1A.

[0047] The resin substrate 1A according to the second embodiment further includes a second plastically deformed portion 212 that is different from the first plastically deformed portion 211. The direction of the first step portion S11 included in the first plastically deformed portion 211 and the direction of the second step portion S22 included in the second plastically deformed portion 212 are different from each other.

[0048] According to the above-mentioned configuration, it is possible to further improve the shape stability of the entire resin substrate 1A.

[0049] (Embodiment 3) A resin substrate 1B according to embodiment 3 will be described with reference to Figures 12 to 14. With regard to the resin substrate 1B according to embodiment 3, components similar to those of the resin substrate 1 according to embodiment 1 (see Figures 1 to 3) are denoted by the same reference numerals and description thereof will be omitted.

[0050] (1) Configuration In the resin board 1B according to the third embodiment, the board 2 is a multilayer board 23, as shown in Fig. 14. In the multilayer board 23, a plurality of insulating layers 231 to 234 (four in the example of Fig. 14) are stacked. In the resin board 1B, the conductor pattern portion 3 includes a high-frequency signal line 30 disposed in the board 2.

[0051] As shown in FIG. 14 , the resin substrate 1B further includes a first ground electrode 4 and a second ground electrode 5. The first ground electrode 4 is disposed on the substrate 2. The first ground electrode 4 faces the high-frequency signal line 30 in the stacking direction D23 of the insulating layers 231 to 234. In this embodiment, the second ground electrode 5 is also disposed on the substrate 2. The second ground electrode 5 faces the high-frequency signal line 30 in the stacking direction D23 of the insulating layers 231 to 234. Therefore, the resin substrate 1B forms a strip line with the substrate 2, the high-frequency signal line 30, the first ground electrode 4, and the second ground electrode 5. Note that the first ground electrode 4 and the second ground electrode 5 are not shown in FIGS. 12 and 13 .

[0052] Each of the first ground electrode 4 and the second ground electrode 5 has electrical conductivity and is made of a material that includes, for example, copper.

[0053] The thickness of each of the first ground electrode 4 and the second ground electrode 5 is, for example, not less than 3 μm and not more than 40 μm.

[0054] The first ground electrode 4 and the second ground electrode 5 are disposed only in the conductor-containing portion 21 of the closed loop structure 20 , and are not disposed in the conductor-free portion 22 .

[0055] In the multilayer substrate 23, the insulating layer 231, the insulating layer 232, the insulating layer 233, and the insulating layer 234 are arranged in this order.

[0056] The material of each of the insulating layers 231-234 includes, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The thermoplastic resin is not limited to a liquid crystal polymer, and may be, for example, PTFE. Furthermore, the material of each of the insulating layers 231-234 may be, for example, polyimide (PI) or modified polyimide (Modified-PI).

[0057] The thickness of each of the insulating layers 231-234 is, for example, 10 μm or more and 120 μm or less. Each of the insulating layers 231-234 of the substrate 2 includes a plurality of interlayer connection conductors (not shown) that penetrate the insulating layer in the thickness direction. Each of the interlayer connection conductors includes, for example, copper, a copper-tin alloy, and a resin. The interlayer connection conductors are formed, for example, by filling a plurality of via holes formed in the insulating layer with a conductive paste including copper, a low-melting-point metal (e.g., tin), and a resin, and heating the via holes, each of which is blocked with a portion of copper foil. Each of the interlayer connection conductors may be formed by plating a conductor (e.g., copper).

[0058] (2) Effect The resin substrate 1B of embodiment 3, like the resin substrate 1 of embodiment 1, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1B.

[0059] In the resin board 1B according to the third embodiment, the board 2 is a multilayer board 23, and the conductor pattern portion 3 includes a high-frequency signal line 30 disposed within the board 2. The resin board 1B further includes a first ground electrode 4 and a second ground electrode 5 facing the high-frequency signal line 30.

[0060] According to the above configuration, a strip line is formed by the substrate 2, the high-frequency signal line 30, the first ground electrode 4, and the second ground electrode 5. According to the above configuration, it is possible to reduce changes in the characteristics of the strip line due to changes in the shape of the plastically deformed portion 211.

[0061] A resin substrate 1C and an electronic device 6 according to a fourth embodiment will be described with reference to Figures 15 to 19. With respect to the resin substrate 1C according to the fourth embodiment, the same components as those of the resin substrate 1 according to the first embodiment (see Figures 1 to 3) are denoted by the same reference numerals, and description thereof will be omitted.

[0062] (1) Configuration The electronic device 6 according to the fourth embodiment includes a resin substrate 1C and a plurality of (nine in the example of FIG. 15 ) electronic components 7. The plurality of electronic components 7 are disposed on the resin substrate 1C. The phrase "electronic components 7 are disposed on the resin substrate 1C" includes the electronic components 7 being mounted on (mechanically connected to) the first main surface 11 or the second main surface 12 of the resin substrate 1C and the electronic components 7 being electrically connected to (appropriate conductor portions of) the resin substrate 1C. The plurality of electronic components 7 are mechanically and electrically connected to the first main surface 11 or the second main surface 12 of the resin substrate 1C by a plurality of bonding portions, respectively. The material of the bonding portions corresponding to each of the plurality of electronic components 7 is, for example, solder.

[0063] Similar to the resin substrate 1 according to the first embodiment, the resin substrate 1C of the present embodiment includes a substrate 2 and a conductor pattern portion 3. The substrate 2 has a closed loop structure portion 20. The substrate 2 contains a resin material. The conductor pattern portion 3 is arranged along an inner edge 201 of the closed loop structure portion 20. In the present embodiment, the conductor pattern portion 3 is arranged on a first main surface 221 of the substrate 2.

[0064] The closed loop structure 20 has a conductor-containing portion 21 and a conductor-free portion 22. The conductor-containing portion 21 has a bent, plastically deformed portion 211. A conductor pattern portion 3 is arranged in the conductor-containing portion 21. In this embodiment, the portion of the closed loop structure 20 where the electronic component 7 is arranged is considered to be the conductor-containing portion 21. The conductor-free portion 22 is adjacent to and connected to the conductor-containing portion 21 in the direction along the inner edge 201. The conductor pattern portion 3 and a conductor are not arranged in the conductor-free portion 22. The resin substrate 1C is a multilayer substrate and has, as conductors, a second conductor pattern portion (not shown) different from the conductor pattern portion 3 (hereinafter also referred to as the first conductor pattern portion 3), multiple interlayer connection conductors (not shown), and one or more third conductor pattern portions (not shown) different from the first conductor pattern portion. The second conductor pattern portion is arranged on the second main surface 222 of the substrate 2. One or more third conductor pattern portions are arranged within the substrate 2. In Fig. 15, of the conductor-containing portion 21 and the conductor-non-containing portion 22 of the closed loop structure 20, only the conductor-non-containing portion 22 is hatched with dots. This hatching does not represent a cross section, but is merely added to make it easier to distinguish between the conductor-containing portion 21 and the conductor-non-containing portion 22.

[0065] The resin substrate 1C has a first main surface 11 and a second main surface 12. The plastically deformed portion 211 has a protruding shape (U-shaped in the examples of FIGS. 15 and 16 ) that protrudes toward the first main surface 11 of the resin substrate 1C. In the resin substrate 1C, the closed loop structure 20 further has a second plastically deformed portion 212, a third plastically deformed portion 213, a fourth plastically deformed portion 214, a fifth plastically deformed portion 215, and a sixth plastically deformed portion 216 that are different from the first plastically deformed portion 211 that is the plastically deformed portion 211. In this embodiment, in a direction along the inner edge 201 of the closed loop structural member 20, a first plastically deformed portion 211, a second plastically deformed portion 212, a third plastically deformed portion 213, a fourth plastically deformed portion 214, a fifth plastically deformed portion 215, and a sixth plastically deformed portion 216 are arranged in this order: the first plastically deformed portion 211, the second plastically deformed portion 212, the third plastically deformed portion 213, the fourth plastically deformed portion 214, the fifth plastically deformed portion 215, and the sixth plastically deformed portion 216. The first plastically deformed portion 211 has a plurality of (two in the example of FIG. 15 ) step portions S11, S12 (hereinafter also referred to as first step portions S11, S12) arranged in a direction along the inner edge 201 of the closed loop structural member 20. Similarly, the second plastically deformed portion 212 has a plurality (two in the example of FIG. 15 ) of second step portions S21, S22 aligned in a direction along the inner edge 201 of the closed loop structural portion 20. The third plastically deformed portion 213 has a plurality (two in the example of FIG. 15 ) of third step portions S31, S32 aligned in a direction along the inner edge 201 of the closed loop structural portion 20. The fourth plastically deformed portion 214 has a plurality (two in the example of FIG. 15 ) of fourth step portions S41, S42 aligned in a direction along the inner edge 201 of the closed loop structural portion 20. The fifth plastically deformed portion 215 has a plurality (two in the example of FIG. 15 ) of fifth step portions S51, S52 aligned in a direction along the inner edge 201 of the closed loop structural portion 20. The sixth plastically deformed portion 216 has a plurality of sixth step portions S61, S62 (two in the example of FIG. 15 ) aligned in a direction along the inner edge 201 of the closed loop structure portion 20. In this embodiment, the shapes of the second plastically deformed portion 212, the third plastically deformed portion 213, the fourth plastically deformed portion 214, the fifth plastically deformed portion 215, and the sixth plastically deformed portion 216 are the same as the shape of the first plastically deformed portion 211, but may be different from the shape of the first plastically deformed portion 211.

[0066] The multiple electronic components 7 include a first electronic component 71 and a second electronic component 72. The first electronic component 71 is arranged at a position away from the plastically deformed portion 211 on the first main surface 11 of the resin substrate 1C. The second electronic component 72 is arranged in the plastically deformed portion 211 on the second main surface 12 of the resin substrate 1C. In other words, the second electronic component 72 is arranged in a recess 2113 that is formed in the plastically deformed portion 211 of the conductor containing portion 21, from the outer edge 202 to the inner edge 201 of the closed loop structure portion 20.

[0067] Each of the plurality of electronic components 7 is, for example, a chip capacitor or a connector. In this embodiment, the first electronic component 71 is a chip capacitor. The second electronic component 72 is a connector.

[0068] The electronic device 6 further includes a circuit board 8 and a third electronic component 9. A resin substrate 1C is disposed on the circuit board 8. The third electronic component 9 is disposed on the circuit board 8. The third electronic component 9 is located inside the closed loop structure portion 20 of the resin substrate 1C. The third electronic component 9 is spaced apart from the inner edge 201 of the closed loop structure portion 20. As shown in FIG. 19 , a distance L3 between the circuit board 8 and a top surface 2111 of the plastically deformed portion 211 on the first main surface 11 of the resin substrate 1C is longer than a distance L7 between the top surface 711 of the first electronic component 71 and the circuit board 8, and is longer than a distance L9 between the top surface 91 of the third electronic component 9 and the circuit board 8.

[0069] The third electronic component 9 is, for example, a complementary metal-oxide semiconductor (CMOS) sensor.

[0070] The electronic device 6 further includes a housing 60 (see FIG. 18 ) that houses the resin substrate 1C, the plurality of electronic components 7, the circuit board 8, and the third electronic component 9. In this embodiment, the housing 60 has a light-transmitting member 63 located in front of the light-receiving surface of the CMOS sensor, which is the third electronic component 9. The light-transmitting member 63 is, for example, a plate containing a light-transmitting resin or a glass plate.

[0071] The second electronic component 72 disposed in the plastically deformed portion 211 on the second main surface 12 of the resin substrate 1C is a connector (first connector) and is detachably connected to a second connector 85 (see FIG. 19 ) disposed on the circuit board 8. The circuit board 8 is, for example, a printed wiring board. The printed wiring board constituting the circuit board 8 is a main logic board (also called a motherboard). The electronic device 6 further includes a plurality of solder portions 86 (see FIGS. 18 and 19 ) connecting the resin substrate 1C and the circuit board 8.

[0072] (2) Effect The resin substrate 1C of embodiment 4, like the resin substrate 1 of embodiment 1, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1C.

[0073] Moreover, the electronic device 6 according to the fourth embodiment includes a resin substrate 1C and a plurality of electronic components 7.

[0074] The above configuration makes it possible to improve the shape stability of the entire resin substrate 1C in the electronic device 6. Note that in the electronic device 6, it is not essential that a plurality of electronic components 7 are disposed on the resin substrate 1C, but it is sufficient that at least one electronic component 7 is disposed on the resin substrate 1C.

[0075] The electronic device 6 according to the fourth embodiment further includes a circuit board 8 and a third electronic component 9. A resin substrate 1C is disposed on the circuit board 8. The third electronic component 9 is disposed on the circuit board 8. The third electronic component 9 is located inside the closed loop structure 20 of the resin substrate 1C. The third electronic component 9 is spaced apart from the inner edge 201 of the closed loop structure 20. As shown in FIG. 19 , a distance L3 between the circuit board 8 and a top surface 2111 of the plastically deformed portion 211 on the first main surface 11 of the resin substrate 1C is longer than a distance L7 between the top surface 711 of the first electronic component 71 and the circuit board 8, and is longer than a distance L9 between the top surface 91 of the third electronic component 9 and the circuit board 8.

[0076] According to the above configuration, even if the housing 60 comes into contact with the top surface 2111 of the plastically deformed portion 211, the first electronic component 71 and the third electronic component 9 can be prevented from coming into contact with the housing 60. Therefore, even if a resin layer covering the first electronic component 71 and a resin layer covering the third electronic component 9 are not provided, the first electronic component 71 and the third electronic component 9 can be protected.

[0077] (3) Modification As shown in Fig. 20 , an electronic device 6 according to a modification of the fourth embodiment differs from the electronic device 6 according to the fourth embodiment in that the conductor pattern portion 3 includes a plurality of (four in the example of Fig. 20 ) coil pattern portions 39. The plurality of coil pattern portions 39 are used to form electromagnets for an actuator of a camera, for example.

[0078] The electronic device 6 according to the modification of the fourth embodiment also provides the same effects as the electronic device 6 according to the fourth embodiment.

[0079] Fifth Embodiment A resin board 1D and an electronic device 6D according to a fifth embodiment will be described with reference to Figures 21 to 23. Regarding the resin board 1D according to the fifth embodiment, components similar to those of the resin board 1C according to the fourth embodiment (see Figures 15 to 19) are denoted by the same reference numerals, and descriptions thereof will be omitted.

[0080] (1) Configuration The electronic device 6D according to the fifth embodiment includes a resin substrate 1D, a plurality of (three in the example of FIG. 21 ) electronic components 7, and a plurality of (three in the example of FIG. 21 ) cables 101-103. The plurality of electronic components 7 are disposed on the resin substrate 1D. "The electronic components 7 are disposed on the resin substrate 1D" includes the electronic components 7 being mounted on (mechanically connected to) the first main surface 11 or the second main surface 12 of the resin substrate 1D and the electronic components 7 being electrically connected to (appropriate conductor portions of) the resin substrate 1D. The plurality of electronic components 7 are mechanically and electrically connected to the first main surface 11 or the second main surface 12 of the resin substrate 1D by a plurality of joints, respectively. The material of the plurality of joints corresponding to the plurality of electronic components 7 is, for example, solder.

[0081] Similar to the resin substrate 1C according to the fourth embodiment, the resin substrate 1D according to the present embodiment includes a substrate 2 and a conductor pattern portion 3. The substrate 2 has a closed loop structure portion 20. The substrate 2 contains a resin material. The conductor pattern portion 3 is arranged along an inner edge 201 of the closed loop structure portion 20. In the present embodiment, the conductor pattern portion 3 is arranged on a first main surface 221 of the substrate 2.

[0082] The closed loop structure portion 20 has a conductor-containing portion 21 and a conductor-free portion 22. The conductor-containing portion 21 has a bent plastically deformed portion 211. A conductor pattern portion 3 is arranged in the conductor-containing portion 21. The conductor-free portion 22 is adjacent to and connected to the conductor-containing portion 21 in a direction along the inner edge 201. The conductor pattern portion 3 and a conductor are not arranged in the conductor-free portion 22. The resin substrate 1D is a multilayer substrate and has, as conductors, a second conductor pattern portion (not shown) different from the conductor pattern portion 3 (hereinafter also referred to as the first conductor pattern portion 3), multiple interlayer connection conductors (not shown), and one or more third conductor pattern portions (not shown) different from the first conductor pattern portion 3 and the second conductor pattern portion. The second conductor pattern portion is arranged on the second main surface 222 of the substrate 2. The one or more third conductor pattern portions are arranged within the substrate 2.

[0083] In addition, in the resin substrate 1D, the closed loop structure portion 20 further has a second plastic deformation portion 212, a third plastic deformation portion 213, a fourth plastic deformation portion 214, a fifth plastic deformation portion 215, a sixth plastic deformation portion 216 and a seventh plastic deformation portion 217 which are different from the first plastic deformation portion 211 which is the plastic deformation portion 211. In this embodiment, in the direction along the inner edge 201 of the closed loop structure portion 20, the first plastically deformed portion 211, the second plastically deformed portion 212, the third plastically deformed portion 213, the fourth plastically deformed portion 214, the fifth plastically deformed portion 215, the sixth plastically deformed portion 216 and the seventh plastically deformed portion 217 are arranged in the order of the first plastically deformed portion 211, the second plastically deformed portion 212, the third plastically deformed portion 213, the fourth plastically deformed portion 214, the fifth plastically deformed portion 215, the sixth plastically deformed portion 216 and the seventh plastically deformed portion 217.

[0084] The first plastically deformed portion 211 has two first step portions S11, S12 aligned in a direction along the inner edge 201 of the closed loop structure 20. In a plan view from the Z-axis direction, the two first step portions S11, S12 are curved. In a plan view from the Z-axis direction, the distance between the two first step portions S11, S12 in the X-axis direction gradually increases as the two step portions S11, S12 move away from the outer edge 202 of the closed loop structure 20 and closer to the inner edge 201. The second plastically deformed portion 212 has two second step portions S21, S22 aligned in a direction along the inner edge 201 of the closed loop structure 20. The third plastically deformed portion 213 has two step portions S31, S32 aligned in a direction along the inner edge 201 of the closed loop structure 20. The fourth plastically deformed portion 214 is bent at four ridges R41, R42, R43, and R44 aligned in a direction along the inner edge 201 of the closed-loop structural portion 20, and has two fourth step portions S41 and S42. The fifth plastically deformed portion 215 is bent at four ridges R51, R52, R53, and R54 aligned in a direction along the inner edge 201 of the closed-loop structural portion 20, and has two fifth step portions S51 and S52. The sixth plastically deformed portion 216 has two sixth step portions S61 and S62 aligned in a direction along the inner edge 201 of the closed-loop structural portion 20. The seventh plastically deformed portion 217 has two seventh step portions S71 and S72 aligned in a direction along the inner edge 201 of the closed-loop structural portion 20.

[0085] In this embodiment, one electronic component 7 is disposed on the first main surface 11 of the resin board 1D, and two electronic components 7 are disposed on the second main surface 12 of the resin board 1D. In this embodiment, the electronic component 7 disposed on the first main surface 11 of the resin board 1D is a connector, and each of the two electronic components 7 disposed on the second main surface 12 of the resin board 1D is a chip capacitor.

[0086] In electronic device 6D, cable 101 is positioned at first plastic deformation portion 211 and second plastic deformation portion 212 on second main surface 12 of resin board 1D. Cable 102 is positioned at first plastic deformation portion 211 and seventh plastic deformation portion 217. Cable 103 is positioned at third plastic deformation portion 213 and sixth plastic deformation portion 216.

[0087] In the electronic device 6D of this embodiment, the cable 101 is held by the first plastic deformation portion 211 and the second plastic deformation portion 212, but it is sufficient that the cable 101 is held by at least the first plastic deformation portion 211. In short, in the electronic device 6D of this embodiment, the cable 101 crosses the closed loop structure 20 at two locations in a plan view from the Z-axis direction, but it is sufficient that the cable 101 crosses at least one location. Similarly to the cable 101, the cables 102 and 103 also cross the closed loop structure 20 at two locations in a plan view from the Z-axis direction, but it is sufficient that the cable 101 crosses at least one location.

[0088] (2) Effect The resin substrate 1D of embodiment 5, like the resin substrate 1 of embodiment 1, has a closed loop structure portion 20 formed by having a conductor non-forming portion 22 connected to a conductor forming portion 21 having a plastic deformation portion 211, so that it is possible to improve the shape stability of the entire resin substrate 1D.

[0089] Moreover, an electronic device 6D according to the fifth embodiment includes a resin substrate 1D and a plurality of electronic components 7.

[0090] According to the above configuration, it is possible to improve the shape stability of the entire resin substrate 1D in the electronic device 6D.

[0091] The electronic device 6D according to the fifth embodiment further includes a cable 101. The cable 101 is positioned at the plastically deformed portion 211 on the second main surface 12 of the resin board 1D.

[0092] According to the above configuration, the cable 101 can be positioned at the plastically deformed portion 211 of the closed loop structure 20. Furthermore, since the cable 101 does not need to be positioned to avoid the closed loop structure 20, it is possible to reduce characteristic loss.

[0093] Sixth Embodiment A resin substrate 1E and an electronic device 6E according to a sixth embodiment will be described with reference to Fig. 24. With respect to the resin substrate 1E according to the sixth embodiment, components similar to those of the resin substrate 1C according to the fourth embodiment (see Figs. 15 to 19) are denoted by the same reference numerals, and description thereof will be omitted.

[0094] (1) Configuration An electronic device 6E according to the sixth embodiment includes a resin substrate 1E, a plurality of electronic components 7, and a housing 60.

[0095] Similar to the resin substrate 1C, the resin substrate 1E has a closed loop structure portion 20. The closed loop structure portion 20 has a conductor-containing portion 21 and a conductor-free portion 22.

[0096] The housing 60 has a protrusion 62 into which the plastically deformed portion 211 of the resin board 1E is fitted. In this embodiment, the plastically deformed portion 211 has a step portion S11 and a step portion S12 that are parallel to each other.

[0097] The protrusion 62 of the housing 60 protrudes from the main body 61 of the housing 60 toward the resin board 1E.

[0098] (2) Effect The resin substrate 1E of embodiment 6, like the resin substrate 1C of embodiment 4, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1E.

[0099] Moreover, an electronic device 6E according to the sixth embodiment includes a resin substrate 1E and a plurality of electronic components 7.

[0100] According to the above configuration, it is possible to improve the shape stability of the entire resin substrate 1E in the electronic device 6E.

[0101] In addition, in the electronic device 6E according to the sixth embodiment, the housing 60 has a protrusion 62 into which the plastically deformed portion 211 of the resin board 1E is fitted.

[0102] According to the above configuration, the plastically deformed portion 211 of the resin board 1E can be positioned by the protrusion 62 of the housing 60.

[0103] Seventh Embodiment A resin substrate 1F according to a seventh embodiment will be described with reference to Figures 25 and 26. With respect to the resin substrate 1F according to the seventh embodiment, the same components as those of the resin substrate 1 according to the first embodiment (see Figures 1 to 3) are denoted by the same reference numerals, and description thereof will be omitted.

[0104] (1) Configuration In the resin substrate 1F according to the seventh embodiment, the shape of the plastically deformed portion 211 in the closed loop structure portion 20 is different from the shape of the plastically deformed portion 211 in the first embodiment.

[0105] The plastically deformed portion 211 in the resin substrate 1F of this embodiment is separated from both the outer edge 202 and the inner edge 201 of the closed loop structure portion 20 in a planar view from the Z-axis direction. In other words, the plastically deformed portion 211 in the resin substrate 1F of this embodiment does not reach either the outer edge 202 or the inner edge 201 of the closed loop structure portion 20 in a planar view from the Z-axis direction.

[0106] In this embodiment, the length of the plastically deformed portion 211 in a direction perpendicular to the inner edge 201 of the closed loop structure 20 is shorter than the width of the closed loop structure 20 when viewed from the Z axis direction. In the resin substrate 1F of this embodiment, the length of the plastically deformed portion 211 in the Y axis direction is shorter than the width of the conductor containing portion 21 when viewed from the Z axis direction. The plastically deformed portion 211 has a rectangular shape when viewed from the Z axis direction. The plastically deformed portion 211 has two step portions S11 and S12 aligned in a direction along the inner edge 201 of the closed loop structure 20, and two step portions S13 and S14 aligned in a direction perpendicular to the inner edge 201 of the closed loop structure 20. In the example of FIG. 25 , the two step portions S11 and S12 are aligned in the X axis direction and face each other. The two step portions S13 and S14 are aligned in the Y axis direction and face each other.

[0107] (2) Effect The resin substrate 1F of embodiment 7, like the resin substrate 1 of embodiment 1, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1F.

[0108] In the resin substrate 1F according to the seventh embodiment, the plastically deformed portion 211 is spaced apart from both the outer edge 202 and the inner edge 201 of the closed loop structure portion 20.

[0109] According to the above configuration, it is possible to further improve the rigidity of the plastically deformed portion 211 and further improve the shape stability of the entire resin substrate 1F compared to the resin substrate 1 according to embodiment 1. Furthermore, according to the above configuration, it is also possible to use the recess 2114 formed in the plastically deformed portion 211 as a space for arranging electronic components.

[0110] (3) Modifications Modifications of the seventh embodiment will now be described.

[0111] 27 and 28 , in the resin substrate 1F according to the first modification of the seventh embodiment, the plastically deformed portion 211 has four step portions S111, S121, S131, and S141 inside the four step portions S11, S12, S13, and S14 in a plan view from the Z-axis direction. In the resin substrate 1F according to the first modification, the four step portions S11, S111, S121, and S12 are aligned in the X-axis direction in a plan view from the Z-axis direction, and the four step portions S11, S111, S121, and S12 are parallel to one another in a plan view from the Z-axis direction. In the resin substrate 1F of variant example 1, when viewed in a plane from the Z-axis direction, four step portions S13, S131, S141, and S14 are lined up in the Y-axis direction, and when viewed in a plane from the Z-axis direction, the four step portions S13, S131, S141, and S14 are parallel to each other.

[0112] 29 and 30 , in a resin substrate 1F according to Modification 2 of Embodiment 7, the plastically deformed portion 211 is a convex curved surface (a part of a spherical surface) on the first main surface 11 of the resin substrate 1F. In the resin substrate 1F according to Modification 2, the outer shape of the plastically deformed portion 211 is circular in plan view from the Z-axis direction.

[0113] In the resin substrate 1F relating to variant example 3 of embodiment 7, as shown in Figure 31, the closed loop structure portion 20 further has a second plastic deformation portion 212, a third plastic deformation portion 213 and a fourth plastic deformation portion 214 which are different from the first plastic deformation portion 211 which is the plastic deformation portion 211.

[0114] In variant example 3, in the direction along the inner edge 201 of the closed loop structure portion 20, the first plastic deformation portion 211, the second plastic deformation portion 212, the third plastic deformation portion 213 and the fourth plastic deformation portion 214 are arranged in the order of the first plastic deformation portion 211, the second plastic deformation portion 212, the third plastic deformation portion 213 and the fourth plastic deformation portion 214.

[0115] The first plastically deformed portion 211 has multiple (two in the example of FIG. 31 ) step portions S11, S12 (hereinafter also referred to as first step portions S11, S12) aligned in a direction along the inner edge 201 of the closed loop structure 20. The first plastically deformed portion 211 also has step portions S13, S14, similar to embodiment 7. The second plastically deformed portion 212, like the first plastically deformed portion 211, has a protruding shape that protrudes toward the first main surface 11 of the resin substrate 1F. The second plastically deformed portion 212 has an elliptical shape in a planar view from the Z-axis direction. The third plastically deformed portion 213 has two third step portions S31, S32 aligned in a direction along the inner edge 201 of the closed loop structure 20. The fourth plastically deformed portion 214 has two fourth step portions S41, S42 aligned in a direction along the inner edge 201 of the closed loop structure 20.

[0116] The resin substrate 1F according to each of the above modifications also has the same effects as the resin substrate 1F according to the seventh embodiment.

[0117] Eighth Embodiment A resin substrate 1G according to an eighth embodiment will be described with reference to Fig. 32. With respect to the resin substrate 1G according to the eighth embodiment, the same components as those of the resin substrate 1 according to the first embodiment (see Figs. 1 to 3) are denoted by the same reference numerals and description thereof will be omitted.

[0118] (1) Configuration In the resin substrate 1G according to the eighth embodiment, the shape of the inner edge 201 and the shape of the outer edge 202 of the closed loop structure portion 20 are different. In this embodiment, the inner edge 201 of the closed loop structure portion 20 is rectangular, and the outer edge 202 of the closed loop structure portion 20 is circular. An electronic device to which the resin substrate 1G according to the eighth embodiment is applied is, for example, an earphone.

[0119] In this embodiment, the conductor pattern portion 3 includes an antenna 35. The antenna 35 is, for example, a Bluetooth (registered trademark) antenna. The antenna 35 is not limited to a Bluetooth (registered trademark) antenna, and may be, for example, a dipole antenna or a monopole antenna.

[0120] (2) Effect The resin substrate 1G of embodiment 8, like the resin substrate 1 of embodiment 1, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1G.

[0121] In the resin board 1G according to the eighth embodiment, the conductor pattern portion 3 includes an antenna 35 .

[0122] According to the above configuration, it is possible to reduce changes in characteristics (antenna characteristics) caused by changes in the shape of the plastically deformed portion 211.

[0123] Ninth Embodiment A resin substrate 1H according to a ninth embodiment will be described with reference to Fig. 33 and Fig. 34. With respect to the resin substrate 1H according to the ninth embodiment, the same components as those of the resin substrate 1 according to the first embodiment (see Figs. 1 to 3) are denoted by the same reference numerals, and description thereof will be omitted.

[0124] (1) Configuration In the resin substrate 1H according to the ninth embodiment, the closed loop structure 20 is plastically deformed into a hollow truncated cone. The closed loop structure 20 has an opening 203 in the upper wall of the hollow truncated cone, and the portion other than the upper wall constitutes a plastically deformed portion 211. Therefore, in this embodiment, the closed loop structure 20 has the plastically deformed portion 211 formed across the conductor-containing portion 21 and the conductor-free portion 22. In a planar view from the Z-axis direction, the outer edge 202 of the closed loop structure 20 is circular. Furthermore, in a planar view from the Z-axis direction, the inner edge 201 of the closed loop structure 20 is circular and smaller than the outer edge 202.

[0125] The conductor pattern portion 3 includes an antenna 35. The antenna 35 is, for example, a Bluetooth (registered trademark) antenna. The antenna 35 is not limited to a Bluetooth (registered trademark) antenna, and may be, for example, a dipole antenna or a monopole antenna.

[0126] The conductive pattern portion 3 further includes a feed line 36 connected to the antenna 35. The feed line 36 extends from the conductive pattern portion 3 toward the outer edge 202 of the closed loop structure portion 20.

[0127] (2) Effect The resin substrate 1H of embodiment 9, like the resin substrate 1 of embodiment 1, has a conductor-non-forming portion 22 connected to a conductor-forming portion 21 having a plastically deformed portion 211, thereby forming a closed loop structure portion 20, and therefore it is possible to improve the shape stability of the entire resin substrate 1H.

[0128] In the resin substrate 1H according to the ninth embodiment, the closed loop structure portion 20 is plastically deformed into a hollow truncated cone shape. The conductive pattern portion 3 includes an antenna 35.

[0129] According to the above configuration, it is possible to reduce the change in antenna characteristics caused by the change in shape of the plastically deformed portion 211 .

[0130] (Other Modifications) The above-described first to ninth embodiments are merely examples of various embodiments of the present invention. The above-described first to ninth embodiments can be modified in various ways depending on the design and the like, and may be combined as appropriate, as long as the object of the present invention can be achieved.

[0131] In the resin substrate 1, for example, as shown in FIG. 35, the plastically deformed portion 211 in the closed loop structure 20 may be in the form of a single step.

[0132] Furthermore, as shown in FIG. 36, the plastically deformed portion 211 in the closed loop structure 20 of the resin substrate 1 may have a two-step staircase shape.

[0133] As shown in FIG. 37 , the resin substrate 1 may further include a second conductor-free portion 22b that is different from the first conductor-free portion 22a, which is the conductor-free portion 22 in the closed loop structure portion 20. In the example of FIG. 37 , the substrate 2 is a multilayer substrate, similar to the resin substrate 1B of embodiment 3 (see FIGS. 12 to 14 ). In the example of FIG. 37 , the conductor pattern portion 3 includes a first transmission line 30a and a second transmission line 30b. In a plan view from the Z-axis direction, FIG. 37 illustrates a first normal N1, a second normal N2, a third normal N3, and a fourth normal N4 among a group of normals that are orthogonal to a tangent at an arbitrary point on the inner edge 201 of the closed loop structure portion 20. The first normal N1 is a normal defined to overlap the first end of the first transmission line 30a in a plan view from the Z-axis direction, and is a normal perpendicular to the tangent to the first point P1 at the inner edge 201 of the closed loop structure portion 20. The second normal N2 is a normal defined to overlap the first end of the second transmission line 30b in a plan view from the Z-axis direction, and is a normal perpendicular to the tangent to the second point P2 at the inner edge 201 of the closed loop structure portion 20. The third normal N3 is a normal defined to overlap the second end of the second transmission line 30b in a plan view from the Z-axis direction, and is a normal perpendicular to the tangent to the third point P3 at the inner edge 201 of the closed loop structure portion 20. The fourth normal N4 is a normal defined so as to overlap the second end of the first transmission line 30a in a plan view from the Z-axis direction, and is a normal perpendicular to a tangent to a fourth point P4 on the inner edge 201 of the closed loop structure 20. In the present embodiment, the total length of the first conductor-free portion 22a and the second conductor-free portion 22b on the inner edge 201 of the closed loop structure 20 is the sum of the length L2 between the first point P1 and the second point P2 and the length L22 between the third point P3 and the fourth point P4. The total length of the conductor-free portions on the inner edge 201 of the closed loop structure 20 (the sum of the length L2 of the first conductor-free portion 22a and the length L22 of the second conductor-free portion 22b) is equal to or less than one-half, and preferably equal to or less than one-fourth, of the length of the inner edge 201 of the closed loop structure 20.

[0134] In addition, the resin substrates 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, and 1H may further include a first resist layer arranged on the first main surface 221 of the substrate 2 and a second resist layer arranged on the second main surface 222 of the substrate 2.

[0135] In addition, in the resin substrate 1B, the material of each of the multiple insulating layers 231 to 234 may be polyimide. In this case, each of the multiple interlayer connection conductors may be formed by through-hole plating. The material of the through-hole plating may be, for example, copper.

[0136] In the resin substrate 1, the width of the closed loop structure 20 in the direction along the X axis may be uniform or may vary depending on the position in the direction along the Y axis. In the resin substrate 1, the width of the closed loop structure 20 in the direction along the Y axis may be uniform or may vary depending on the position in the direction along the X axis.

[0137] For example, in the wiring board of Patent Document 1, if there is no plastic deformation portion, the shape stability of the wiring board is reduced.

[0138] To address this issue, for example, as in a resin substrate 1J shown in Fig. 38 , the plastically deformed portion 211 may be formed in the conductor-free portion 22 rather than the conductor-containing portion 21. In Fig. 38 , of the conductor-containing portion 21 and the conductor-free portion 22 of the closed loop structure 20, only the conductor-free portion 22 is hatched with dots. This hatching does not represent a cross section, but is merely added to make it easier to distinguish between the conductor-containing portion 21 and the conductor-free portion 22.

[0139] (Aspects) The present specification discloses the following aspects.

[0140] A resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H) according to a first aspect includes a substrate (2) and a conductor pattern portion (3). The substrate (2) has a closed loop structure portion (20). The substrate (2) contains a resin material. The conductor pattern portion (3) is arranged along an inner edge (201) of the closed loop structure portion (20). The closed loop structure portion (20) has a conductor-containing portion (21) and a conductor-non-containing portion (22). The conductor-containing portion (21) has a curved plastically deformed portion (211). The conductor pattern portion (3) is arranged in the conductor-containing portion (21). The conductor-non-containing portion (22) is adjacent to the conductor-containing portion (21) in a direction along the inner edge (201) of the closed loop structure portion (20) and is connected to the conductor-containing portion (21). The conductor-free portion (22) has no conductor pattern portion (3) or conductor arranged therein.

[0141] According to this embodiment, it is possible to improve the shape stability of the entire resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H).

[0142] In the resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1G) according to the second aspect, in the first aspect, the plastically deformed portion (211) is formed from the outer edge (202) to the inner edge (201) of the closed loop structure portion (20).

[0143] According to this embodiment, a recess (2113) is formed in the plastically deformed portion (211) of the conductor containing portion (21) from the outer edge (202) to the inner edge (201) of the closed loop structure portion (20).

[0144] In the resin substrate (1F) according to the third embodiment, in the first embodiment, the plastically deformed portion (211) is spaced apart from each of the outer edge (202) and the inner edge (201) of the closed loop structure portion (20).

[0145] According to this embodiment, the rigidity of the plastically deformed portion (211) can be further improved, and the shape stability of the entire resin substrate (1F) can be further improved.

[0146] In the resin substrate (1A; 1C; 1D) relating to the fourth aspect, in the second or third aspect, the closed loop structure portion (20) further has a second plastic deformation portion (212) different from the first plastic deformation portion (211), which is the plastic deformation portion (211).

[0147] According to this aspect, it is possible to further improve the shape stability.

[0148] In the resin substrate (1A; 1C; 1D) according to the fifth aspect, in the second aspect, the closed loop structure (20) further has a second plastically deformed portion (212) different from the first plastically deformed portion (211), which is the plastically deformed portion (211). The first plastically deformed portion (211) includes a first step portion (S11) formed from the outer edge (202) to the inner edge (201) of the closed loop structure (20). The second plastically deformed portion (212) includes a second step portion (S22) formed from the outer edge (202) to the inner edge (201) of the closed loop structure (20). The direction of the first step portion (S11) and the direction of the second step portion (S22) are different from each other.

[0149] According to this embodiment, it is possible to further improve the shape stability of the entire resin substrate (1A; 1C; 1D).

[0150] A resin substrate (1) according to a sixth aspect is the resin substrate (1) of any one of the first to fifth aspects, wherein the closed loop structure (20) has a first opening (203). The substrate (2) further has a second opening (204) different from the first opening (203).

[0151] According to this aspect, since the substrate (2) further has the second opening (204), it is possible to reduce the weight of the resin substrate (1).

[0152] In a resin substrate (1B; 1C; 1D) according to a seventh aspect, in any one of the first to sixth aspects, the substrate (2) is a multilayer substrate (23). In the multilayer substrate (23), multiple insulating layers (231-234) are stacked. The conductor pattern portion (3) includes a high-frequency signal line (30) disposed within the substrate (2). The resin substrate (1B; 1C; 1D) further includes a first ground electrode (4) and a second ground electrode (5). The first ground electrode (4) is disposed on the substrate (2). The first ground electrode (4) faces the high-frequency signal line (30) in the stacking direction (D23) of the multiple insulating layers (231-234). The second ground electrode (5) is disposed on the substrate (2). The second ground electrode (5) faces the high-frequency signal line (30) in the stacking direction (D23) of the multiple insulating layers (231-234).

[0153] According to this aspect, the strip line is configured by the substrate (2), the high-frequency signal line (30), the first ground electrode (4), and the second ground electrode (5). With the above configuration, it is possible to reduce changes in the characteristics of the strip line due to changes in the shape of the plastically deformed portion (211).

[0154] In the resin substrate (1) according to the eighth aspect, in any one of the first to sixth aspects, the conductor pattern portion (3) includes a high-frequency signal line (30) or an antenna (35).

[0155] According to this embodiment, it is possible to reduce the change in characteristics due to the change in shape of the plastically deformed portion (211).

[0156] In the resin substrate (1) according to the ninth aspect, in any one of the first to eighth aspects, the length (L2) of the non-conductor forming portion (22) at the inner edge (201) of the closed loop structure portion (20) is half or less of the length of the inner edge (201).

[0157] According to this aspect, the length (L1) of the conductor forming portion (21) at the inner edge (201) of the closed loop structure portion (20) is not shorter than the length of the conductor non-forming portion (22), so that it is possible to prevent the area in which the conductor pattern portion (3) can be formed from becoming narrower.

[0158] In the resin substrate (1) according to the tenth aspect, in any one of the first to eighth aspects, the length (L2) of the non-conductor forming portion (22) at the inner edge (201) of the closed loop structure portion (20) is equal to or less than one-fourth of the length of the inner edge (201).

[0159] According to this aspect, the length (L1) of the conductor forming portion (21) at the inner edge (201) of the closed loop structure portion (20) can be made longer, making it possible to widen the area in which the conductor pattern portion (3) can be formed.

[0160] In a resin substrate (1H) according to an eleventh aspect, in the first aspect, the closed loop structure (20) is plastically deformed into a hollow truncated cone shape. The conductor pattern (3) includes an antenna (35).

[0161] According to this aspect, it is possible to reduce the change in antenna characteristics due to the change in shape of the plastically deformed portion (211).

[0162] In a resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H) according to a twelfth aspect, in any one of the first to eleventh aspects, the resin material is a liquid crystal polymer.

[0163] According to this aspect, loss can be reduced.

[0164] An electronic device (6; 6D; 6E) according to a thirteenth aspect includes a resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H) according to any one of the first to twelfth aspects, and an electronic component (7). The electronic component (7) is disposed on the resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H).

[0165] According to this embodiment, it is possible to improve the shape stability of the entire resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H).

[0166] The electronic device (6; 6E) according to a fourteenth aspect is the thirteenth aspect, further comprising a plurality of electronic components (7). The plurality of electronic components (7) are arranged on a resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H). The electronic component (7) is one of the plurality of electronic components (7). The resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H) has a first main surface (11) and a second main surface (12). The plastically deformed portion (211; 215) has a protruding shape protruding toward the first main surface (11) of the resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H). The plurality of electronic components (7) include a first electronic component (71) and a second electronic component (72). The first electronic component (71) is disposed at a position away from the plastically deformed portion (211; 215) on the first main surface (11) of the resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H). The second electronic component (72) is disposed at the plastically deformed portion (211; 215) on the second main surface (12) of the resin substrate (1; 1A; 1B; 1C; 1D; 1E; 1F; 1G; 1H).

[0167] The electronic device (6) according to a fifteenth aspect is the same as the fourteenth aspect, and further includes a circuit board (8), a third electronic component (9), and a housing (60). A resin substrate (1C) is disposed on the circuit board (8). The third electronic component (9) is disposed on the circuit board (8). The third electronic component (9) is located inside a closed loop structure portion (20) of the resin substrate (1C). The housing (60) houses the resin substrate (1C), the plurality of electronic components (7), the circuit board (8), and the third electronic component (9). The distance (L3) between the top surface (2111) of the plastically deformed portion (211) on the first main surface (11) of the resin substrate (1C) and the circuit board (8) is longer than the distance (L7) between the top surface (711) of the first electronic component (71) and the circuit board (8) and is longer than the distance (L9) between the top surface (91) of the third electronic component (9) and the circuit board (8).

[0168] According to this aspect, even if the housing (60) comes into contact with the top surface (2111) of the plastically deformed portion (211), the first electronic component (7) and the third electronic component (9) can be prevented from coming into contact with the housing (60).

[0169] In the electronic device (6) according to the sixteenth aspect, in the fifteenth aspect, the third electronic component (9) is a CMOS sensor.

[0170] In an electronic device (6D) according to a seventeenth aspect, in the thirteenth aspect, the resin substrate (1D) has a first main surface (11) and a second main surface (12). The plastically deformed portion (211) has a protruding shape that protrudes toward the first main surface (11) of the resin substrate (1D). The electronic device (6D) further includes a cable (101). The cable (101) is positioned at the plastically deformed portion (211) on the second main surface (12) of the resin substrate (1D).

[0171] According to this embodiment, the cable (101) can be positioned in the plastically deformed portion (211) of the closed loop structure (20).

[0172] An electronic device (6E) according to an eighteenth aspect is the thirteenth aspect, further comprising a housing (60). The housing (60) has a protrusion (62) into which the plastically deformed portion (211) of the resin substrate (1E) is fitted.

[0173] According to this embodiment, the plastically deformed portion (211) of the resin substrate (1E) can be positioned by the protrusion (62) of the housing (60).

[0174] A resin substrate (1J) according to a nineteenth aspect includes a substrate (2) and a conductor pattern portion (3). The substrate (2) has a closed loop structure portion (20). The substrate (2) includes a resin material. The conductor pattern portion (3) is arranged along an inner edge (201) of the closed loop structure portion (20). The closed loop structure portion (20) has a conductor-containing portion (21) and a conductor-free portion (22). The conductor-free portion (22) has a curved plastically deformed portion (211). The conductor pattern portion (3) is arranged in the conductor-containing portion (21). The conductor-free portion (22) is adjacent to and connected to the conductor-containing portion (21) in a direction along the inner edge (201) of the closed loop structure portion (20). The conductor-free portion (22) does not have a conductor pattern portion (3) or a conductor arranged therein.

[0175] According to this aspect, it is possible to improve the shape stability of the entire resin substrate (1J).

[0176] REFERENCE SIGNS LIST 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H Resin substrate 11 First main surface 12 Second main surface 2 Substrate 20 Closed loop structure portion 201 Inner edge 202 Outer edge 203 Opening (first opening) 204 Second opening 21 Conductor formed portion 211 Plastically deformed portion (first plastically deformed portion) 212 Second plastically deformed portion 22 Conductor non-formed portion 3 Conductor pattern portion 30 High frequency signal line 31 First end 32 Second end 35 Antenna 4 First ground electrode 5 Second ground electrode 6, 6D, 6E Electronic device 60 Housing 7 Electronic component 71 First electronic component 72 Second electronic component 8 Circuit board 9 Third electronic component 101 Cable D23 Stacking direction N1 First normal N2 Second normal L1 Distance L2 Distance L3 Distance L7 Distance L9 Distance S11, S12 Step portion (first step portion) S21, S22 Second step portion

Claims

1. A resin substrate comprising: a substrate having a closed loop structure portion and containing a resin material; and a conductor pattern portion arranged along an inner edge of the closed loop structure portion, wherein the closed loop structure portion has a curved plastically deformed portion, a conductor formation portion in which the conductor pattern portion is arranged, and a conductor non-formation portion adjacent to and connected to the conductor formation portion in a direction along the inner edge, and in which the conductor pattern portion and conductor are not arranged.

2. The resin substrate according to claim 1, wherein the plastically deformed portion is formed from the outer edge of the closed loop structure to the inner edge thereof.

3. The resin substrate according to claim 1, wherein the plastically deformed portion is spaced apart from both the outer edge and the inner edge of the closed loop structure.

4. The resin substrate according to claim 2 or 3, wherein the closed loop structure further has a second plastic deformation portion different from the first plastic deformation portion, which is the plastic deformation portion.

5. A resin substrate as described in claim 2, wherein the closed loop structure further has a second plastic deformation portion different from the first plastic deformation portion which is the plastic deformation portion, the first plastic deformation portion includes a first step portion formed from the outer edge to the inner edge of the closed loop structure, and the second plastic deformation portion includes a second step portion formed from the outer edge to the inner edge of the closed loop structure, and the direction of the first step portion and the direction of the second step portion are different from each other.

6. The resin substrate according to any one of claims 1 to 5, wherein the closed loop structure has a first opening, and the substrate further has a second opening different from the first opening.

7. A resin substrate according to any one of claims 1 to 6, wherein the substrate is a multilayer substrate in which a plurality of insulating layers are stacked, the conductor pattern portion includes a high-frequency signal line disposed within the substrate, and further comprising: a first ground electrode disposed on the substrate and facing the high-frequency signal line in the stacking direction of the plurality of insulating layers; and a second ground electrode disposed on the substrate and facing the high-frequency signal line in the stacking direction of the plurality of insulating layers.

8. The resin substrate according to any one of claims 1 to 6, wherein the conductor pattern portion includes a high-frequency signal line or an antenna.

9. A resin substrate according to any one of claims 1 to 8, wherein the length of the conductor-free portion at the inner edge of the closed loop structure is half or less of the length of the inner edge.

10. A resin substrate according to any one of claims 1 to 8, wherein the length of the non-conductor portion at the inner edge of the closed loop structure is one-fourth or less of the length of the inner edge.

11. The resin substrate according to claim 1, wherein the closed loop structure portion is plastically deformed into a hollow truncated cone shape, and the conductive pattern portion includes an antenna.

12. The resin substrate according to any one of claims 1 to 11, wherein the resin material is a liquid crystal polymer.

13. An electronic device comprising: a resin substrate according to any one of claims 1 to 12; and an electronic component disposed on the resin substrate.

14. The electronic device according to claim 13, further comprising a plurality of electronic components arranged on the resin substrate, wherein the electronic component is one of the plurality of electronic components, the resin substrate has a first main surface and a second main surface, the plastically deformed portion has a protruding shape that protrudes toward the first main surface of the resin substrate, and the plurality of electronic components include: a first electronic component arranged at a position away from the plastically deformed portion on the first main surface of the resin substrate, and a second electronic component arranged in the plastically deformed portion on the second main surface of the resin substrate.

15. An electronic device as described in claim 14, further comprising: a circuit board on which the resin substrate is disposed; a third electronic component disposed on the circuit board and located inside the closed loop structure portion of the resin substrate; and a housing that houses the resin substrate, the plurality of electronic components, the circuit board, and the third electronic component, wherein the distance between the top surface of the plastically deformed portion on the first main surface of the resin substrate and the circuit board is longer than the distance between the top surface of the first electronic component and the circuit board, and is longer than the distance between the top surface of the third electronic component and the circuit board.

16. The electronic device according to claim 15, wherein the third electronic component is a CMOS sensor.

17. The electronic device according to claim 13, wherein the resin substrate has a first main surface and a second main surface, the plastically deformed portion has a protruding shape that protrudes toward the first main surface of the resin substrate, and the electronic device further comprises a cable positioned at the plastically deformed portion on the second main surface of the resin substrate.

18. The electronic device according to claim 13, further comprising a housing, the housing having a protrusion into which the plastically deformed portion of the resin substrate is fitted.

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