Adsorption filter and drying furnace

Abstract

An adsorption filter (40) is provided with: a columnar carrier (CS) that supports an adsorbent capable of adsorbing a specific substance; and a heat insulating material (IM) that covers the outer peripheral surface of the carrier (CS). The heat insulating material (IM) has a plurality of voids therein.

Description

Adsorption filter and drying oven

[0001] The present disclosure relates to an adsorption filter and a drying oven.

[0002] The adsorption filter described in Patent Document 1 includes a substantially cylindrical carrier. This carrier supports an adsorbent on its surface. The carrier also has multiple gaps that penetrate from one end face to the other end face. Air that flows in from one end face of the carrier passes through the gaps and flows out to the other end face. At this time, specific adsorbable substances contained in the flowing air are adsorbed onto the adsorbent. Next, warm air flows into the carrier. When the adsorption filter is heated to a high temperature, the organic solvents adsorbed to the adsorbent are desorbed.

[0003] JP 2012-179582 A

[0004] In an adsorption filter such as that described in Patent Document 1, the temperature of the carrier may drop excessively due to heat dissipation from the carrier, making it difficult for the adsorbed substance to be desorbed from the adsorbent.

[0005] In order to solve the above problems, the present disclosure provides an adsorption filter including a cylindrical support carrying an adsorbent capable of adsorbing a specific substance, and a heat insulating material covering the outer surface of the support, the heat insulating material having a plurality of voids therein. The present disclosure also provides a drying furnace including the above adsorption filter, a drying chamber, and a duct for circulating gas exhausted from the drying chamber toward the adsorption filter.

[0006] This can prevent the temperature of the carrier from dropping excessively.

[0007] Fig. 1 is a perspective view of an adsorption device. Fig. 2 is a block diagram of a drying furnace. Fig. 3 is a front view of a first frame. Fig. 4 is a front view of an adsorption filter. Fig. 5 is a side view of an adsorption filter. Fig. 6 is a front view of an adsorption filter in a modified example. Fig. 7 is a side view of an adsorption filter in a modified example.

[0008] <One embodiment of the adsorption filter> An embodiment of the adsorption filter will be described below. Note that the drawings are schematic diagrams for ease of understanding, and components may be enlarged or omitted. Therefore, the dimensional ratios of the components may differ from those of the actual components.

[0009] (Overall Configuration of the Adsorption Device) As shown in Figure 1, the adsorption device 10 includes a first frame 20, a second frame 30, and an adsorption filter 40. The overall outer shape of the adsorption device 10 is generally cylindrical. That is, the first frame 20, the second frame 30, and the adsorption filter 40 all have generally cylindrical outer shapes with approximately the same diameter. Note that, hereinafter, a specific direction parallel to the central axis CA of the carrier CS is referred to as the positive direction PD. Of the directions parallel to the central axis CA, the direction opposite to the positive direction PD is referred to as the negative direction ND.

[0010] As shown in FIG. 1 , the first frame 20 is located on the negative direction ND side with respect to the adsorption filter 40. The first frame 20 is substantially cylindrical. The central axis of the first frame 20 coincides with the central axis CA of the carrier CS. The first frame 20 has a through-hole that penetrates from the end on the negative direction ND side to the end on the positive direction PD side. That is, the first frame 20 has a circular opening edge OP centered on the central axis CA of the carrier CS. The opening edge OP on the positive direction PD side of the through-hole faces the end face of the adsorption filter 40 on the negative direction ND side with a gap therebetween.

[0011] As shown in Fig. 3, in more detail, the first frame 20 has a cylindrical body 21 and three partition walls 22. The cylindrical body 21 is cylindrical. The central axis of the cylindrical body 21 coincides with the central axis CA of the carrier CS. The outer diameter of the cylindrical body 21 is smaller than the outer diameter of the adsorption filter 40. The opening edge OP of the cylindrical body 21 is the opening edge OP of the first frame 20 described above.

[0012] The three partition walls 22 extend from the inner surface of the cylindrical body 21 toward the central axis CA. The ends of each partition wall 22 on the central axis CA side are connected to each other. The partition walls 22 are arranged at predetermined angular intervals in the circumferential direction around the central axis CA. This allows the cylindrical body 21 and the three partition walls 22 to define multiple flow passages. That is, the first frame 20 has a first flow passage P1, a second flow passage P2, and a third flow passage P3 as multiple through holes. When viewed in a direction along the central axis CA of the first frame 20, the opening of each flow passage has a substantially fan-shaped shape.

[0013] The first flow passage P1 is a through hole with the largest spatial volume among the three flow passages. The central angle of the fan shape of the first flow passage P1 is greater than 180 degrees. The second flow passage P2 is a through hole adjacent to the first flow passage P1 in the counterclockwise direction when viewed in the negative direction ND. The third flow passage P3 is a through hole adjacent to the second flow passage P2 in the counterclockwise direction and adjacent to the first flow passage P1 in the clockwise direction when viewed in the negative direction ND. In other words, the third flow passage P3 is located between the first flow passage P1 and the second flow passage P2. The central angle of the fan shape of the third flow passage P3 is approximately the same as the central angle of the fan shape of the second flow passage P2.

[0014] As shown in FIG. 1 , the second frame 30 is located on the positive direction PD side relative to the adsorption filter 40. Although not shown, the shape of the second frame 30 is similar to that of the first frame 20. That is, the second frame 30 is substantially cylindrical. The central axis of the second frame 30 coincides with the central axis CA of the carrier CS. The second frame 30 has a through-hole that penetrates from the end on the negative direction ND side to the end on the positive direction PD side. That is, the second frame 30 has a circular opening edge centered on the central axis CA of the carrier CS. The opening edge on the negative direction ND side of the through-hole faces the end face of the carrier CS on the positive direction PD side with a gap therebetween. As shown in FIG. 2 , the second frame 30 has a plurality of through-holes, namely, a fourth flow passage P4, a fifth flow passage P5, and a sixth flow passage P6.

[0015] The size and shape of the opening of the fourth flow passage P4 on the negative direction ND side are the same as the size and shape of the opening of the first flow passage P1 on the positive direction PD side. The opening of the fourth flow passage P4 faces the opening of the first flow passage P1 via the adsorption filter 40. That is, the first flow passage P1 and the fourth flow passage P4 are aligned in a direction parallel to the central axis CA with the adsorption filter 40 interposed therebetween.

[0016] The size and shape of the opening of the fifth flow passage P5 on the negative direction ND side are the same as the size and shape of the opening of the second flow passage P2 on the positive direction PD side. The opening of the fifth flow passage P5 faces the opening of the second flow passage P2 via the adsorption filter 40. That is, the second flow passage P2 and the fifth flow passage P5 are aligned in a direction parallel to the central axis CA with the adsorption filter 40 interposed therebetween.

[0017] The size and shape of the opening of the sixth flow passage P6 on the negative direction ND side are the same as the size and shape of the opening of the third flow passage P3 on the positive direction PD side. The opening of the sixth flow passage P6 faces the opening of the third flow passage P3 via the adsorption filter 40. That is, the third flow passage P3 and the sixth flow passage P6 are aligned in a direction parallel to the central axis CA with the adsorption filter 40 interposed therebetween.

[0018] 1, the adsorption filter 40 is located approximately in the center of the adsorption device 10. That is, the adsorption filter 40 is located between the first frame 20 and the second frame 30. The overall external shape of the adsorption filter 40 is approximately cylindrical.

[0019] As shown in FIG. 4 , the adsorption filter 40 includes a carrier CS. The carrier CS carries an adsorbent capable of adsorbing a specific substance. In this embodiment, the specific substance is a vaporized organic solvent. The carrier CS has a cylindrical outer shape. The outer diameter of the carrier CS is the same as the outer diameter of the first frame 20. Hereinafter, the end face of the carrier CS on the negative direction ND side will be referred to as a first end face 41. The end face of the carrier CS on the positive direction PD side will be referred to as a second end face 42.

[0020] The carrier CS has a so-called honeycomb structure. That is, the carrier CS has a plurality of gaps 43 therein. The plurality of gaps 43 are connected from the first end face 41 to the second end face 42. Therefore, air passing through each flow passage of the first frame 20 and the second frame 30 can pass between the first end face 41 side and the second end face 42 side of the carrier CS. Note that in FIG. 4, the honeycomb structure of the first end face 41 is partially omitted. Furthermore, the honeycomb structure referred to here is not limited to a structure in which a plurality of hexagonal prism-shaped three-dimensional structures are arranged, but also includes a structure in which a plurality of one or more types of three-dimensional structures are arranged.

[0021] Although not shown, the adsorption filter 40 is connected to a drive source such as an electric motor via a power transmission mechanism such as a gear mechanism. Based on the power from the drive source, the adsorption filter 40 can rotate about the central axis CA at a speed of 5 to 15 revolutions per minute relative to the first frame 20 and the second frame 30. The direction of rotation is clockwise when viewed facing the forward direction PD.

[0022] (Connection with Drying Oven) As shown in Fig. 2, the adsorption device 10 is used as one component of a drying oven 100. The drying oven 100 is an apparatus for drying a coating material, for example, after applying the coating material to electronic components. At this time, the gas discharged from the drying chamber R of the drying oven 100 contains vaporized organic solvents and the like.

[0023] Specifically, as shown in FIGS. 1 and 2 , the drying oven 100 has a first duct D1 to a sixth duct D6. The first duct D1 is connected to an end of the first flow passage P1 on the negative direction (ND) side in the first frame 20. The second duct D2 is connected to an end of the second flow passage P2 on the negative direction (ND) side in the first frame 20. The third duct D3 is connected to an end of the third flow passage P3 on the negative direction (ND) side in the first frame 20. The fourth duct D4 is connected to an end of the fourth flow passage P4 on the positive direction (PD) side in the second frame 30. The fifth duct D5 is connected to an end of the fifth flow passage P5 on the positive direction (PD) side in the second frame 30. The sixth duct D6 is connected to an end of the sixth flow passage P6 on the positive direction (PD) side in the second frame 30.

[0024] 1 and 2 show the connection relationship between each frame and each duct. In reality, the first duct D1 is connected to the negative-direction (ND) opening of the first flow passage P1 via a cover, an adapter, a seal, and the like. Therefore, there is no gap between the first duct D1 and the negative-direction (ND) opening of the first flow passage P1. In other words, when gas flows from the first duct D1 to the first flow passage P1, gas leakage is prevented between them. This also applies to the connection relationship between the other ducts and flow passages. Furthermore, seals and the like are also interposed between the first frame 20 and the carrier CS, and between the second frame 30 and the carrier CS. Therefore, gas leakage between each frame and the carrier CS is prevented. Known connection configurations can be used as appropriate for these connections.

[0025] The drying furnace 100 includes a first fan B1, a second fan B2, and a heater HE. The first fan B1 blows gas containing an organic solvent exhausted from the drying chamber R into a first duct D1. The gas blown into the first duct D1 flows through the first duct D1 toward the forward direction PD. The gas then passes through the first flow passage P1 from the reverse direction ND side of the first duct D1 and through the carrier CS of the adsorption filter 40. The organic solvent components contained in the gas are adsorbed by the adsorbent as they pass through the carrier CS. The gas from which the organic solvent components have been removed is then exhausted to the fourth duct D4 through a fourth flow passage P4 of the second frame 30.

[0026] The second blower B2 blows air that does not contain organic solvents into the second duct D2. The gas supplied to the second duct D2 flows through the second duct D2 toward the forward direction PD. Therefore, the air passes from the negative direction ND side of the second duct D2 through the second flow passage P2, the carrier CS, the fifth flow passage P5, and the fifth duct D5, in this order. Note that the air absorbs heat from the carrier CS as it passes through the gap 43 of the carrier CS. Therefore, the temperature of the air flowing through the fifth flow passage P5 and the fifth duct D5 rises to approximately 60°C.

[0027] The heater HE is supplied with air circulating through the fifth duct D5. The heater HE heats the supplied gas, turning it into hot air at approximately 200 degrees Celsius. This hot air is then supplied from the heater HE to the sixth duct D6. The hot air then passes through the sixth duct D6, the sixth flow path P6 of the second frame 30, and then passes through the interior of the carrier CS. At this time, the portion of the carrier CS facing the sixth flow path P6 of the second frame 30 is exposed to the hot air flowing through the sixth flow path P6. The carrier CS is also rotating relative to the second frame 30. Therefore, the portion of the carrier CS facing the sixth flow path P6 of the second frame 30 has adsorbed the organic solvent contained in the gas from the first duct D1. Therefore, the hot air desorbs the organic solvent adsorbed in the adsorbent from the adsorbent. The hot air containing the desorbed organic solvent passes through the third flow passage P3 and the third duct D3 and is supplied to a predetermined recovery device 110. In this way, the adsorption device 10 can concentrate and recover the organic solvent from the gas exhausted from the drying chamber R.

[0028] (Regarding the Insulating Material) As shown in FIG. 4, the adsorption filter 40 includes an insulating material IM that covers the outer surface of the carrier CS. The insulating material IM is cylindrical. The central axis of the insulating material IM coincides with the central axis CA of the carrier CS. The diameter of the opening edge of the insulating material IM is approximately the same as the diameter of the carrier CS. In other words, the insulating material IM directly covers the entire outer surface of the carrier CS. Note that "cylindrical" means that even if the insulating material IM is partially interrupted in the circumferential direction, it is sufficient as long as the overall outer shape is cylindrical. Furthermore, the material of the insulating material IM is an alloy primarily composed of aluminum. "Mainly composed of aluminum" means that the atomic ratio of aluminum among the metal elements contained in the alloy is greater than 50%.

[0029] The thermal insulation material IM is composed of a plurality of plates 44. Each plate 44 is a rectangular, corrugated, and generally rectangular plate rolled into a cylindrical shape. The plurality of cylindrically shaped plates 44 are stacked in layers from the central axis CA side outward. As a result, the thermal insulation material IM has a structure in which a larger-diameter cylinder is stacked on the outside of a smaller-diameter cylinder.

[0030] The insulating material IM has multiple holes 45 formed by stacking plate materials 44 bent in a rectangular wave shape. That is, the holes 45 are gaps between the multiple plate materials 44. Therefore, the holes 45 open on the outer surface of the insulating material IM. The edge of the opening of the hole 45 is roughly rectangular in plan view. The opening is covered with a plate material (not shown). Specifically, the outer peripheral surface of the insulating material IM and the inner peripheral surface that contacts the carrier CS are covered with a plate material (SUS material). Therefore, air is retained within the holes 45. The "outer surface of the insulating material IM" refers to the surface that is exposed to the outside when viewed as the adsorption filter 40. In this embodiment, the "outer surface of the insulating material IM" refers to the end surface on the negative direction ND side, the end surface on the positive direction PD side, and the outer peripheral surface of the insulating material IM.

[0031] More specifically, as shown in Fig. 5, the holes 45 are through-holes that penetrate the thermal insulator IM from the end face on the negative direction ND side to the end face on the positive direction PD side. That is, the holes 45 are open at both end faces of the thermal insulator IM. As a result, the thermal insulator IM has multiple voids 46 therein. In other words, the thermal insulator IM has multiple holes 45 as the multiple voids 46.

[0032] In this embodiment, the average diameter of the carrier CS is 400 mm or more and 1200 mm or less. In contrast, the thickness of each plate 44 is 20 μm or more and 5 mm or less. The average thickness of the heat insulating material IM formed by each plate 44 is 5 mm or more and 30 mm or less. The average opening area of ​​the holes 45 on the outer surface of the heat insulating material IM is 50 mm. ２ More than 500 mm ２ The "average value" refers to the average value of the dimensions of the above-mentioned measurement object at 10 or more locations. Therefore, the dimensions of each measurement object may be partially outside the above-mentioned numerical range. "Thickness of the insulation material IM" refers to the shortest distance from the outer peripheral surface to the inner peripheral surface of the insulation material IM.

[0033] (Effects of this embodiment) (1) In the above embodiment, the adsorption filter 40 has a heat insulating material IM that covers the outer peripheral surface of the carrier CS. The heat insulating material IM has a plurality of voids 46 therein. A gas such as air is present in the voids 46. Because gas has a relatively low thermal conductivity, the heat insulating material IM suppresses heat radiation from the outer surface of the carrier CS. Therefore, it is possible to suppress an excessive decrease in the temperature of the carrier CS, i.e., to suppress the difficulty of desorbing the adsorbed substance from the adsorbent.

[0034] (2) In the above embodiment, the insulating material IM has a plurality of holes 45 opening on the outer surface of the insulating material IM as the voids 46. As described above, the carrier CS rotates, repeatedly performing a process in which the organic solvent is desorbed from the adsorbent by warm air and a process in which the adsorbent adsorbs the organic solvent from air that is cooler than the warm air. According to this configuration, the holes 45 open on the outer surface of the insulating material IM. Therefore, the gas heated in the voids 46 is prevented from remaining in the voids 46 for a long period of time. In other words, the carrier CS is prevented from being maintained at a high temperature for a long period of time by the gas. As a result, the carrier CS dissipates heat to a certain extent during the process of adsorbing the organic solvent to the adsorbent, thereby preventing the organic solvent from becoming difficult to adsorb to the adsorbent.

[0035] (3) In the above embodiment, the average diameter of the carrier CS is 400 mm or more and 1200 mm or less. On the other hand, the average thickness of the heat insulating material IM is 5 mm or more and 30 mm or less. The average opening area of ​​the holes 45 on the outer surface of the heat insulating material IM is 50 mm or less. ２ More than 500 mm ２ The thickness and opening area of ​​the heat insulating material IM relative to the size of the carrier CS are preferably within these numerical ranges. That is, within these ranges, heat is easily dissipated during the process of adsorbing the organic solvent, and the temperature is less likely to drop during the process of desorbing the organic solvent.

[0036] (4) In the above embodiment, the heat insulating material IM is a cylindrical shape made by stacking a plurality of plate materials 44. This makes it easy to adjust the size of the heat insulating material IM to match the size of the carrier CS. In addition, by changing the number of stacked plate materials 44, the heat insulating performance of the heat insulating material IM can be easily adjusted.

[0037] (5) In the above embodiment, the material of the heat insulating material IM is an alloy mainly composed of aluminum. Because aluminum has high thermal conductivity, its temperature tends to drop during the process of adsorbing the organic solvent onto the adsorbent. Therefore, the heat insulation can prevent the carrier CS from becoming excessively hot.

[0038] (6) In the above embodiment, the opening of the hole 45 is covered with a plate material, and air is retained within the hole 45. Therefore, this air ensures thermal insulation. If the carrier CS were not insulated by the insulating material IM, the portion of the carrier CS near the outer periphery would dissipate heat, making it difficult to control heat. In other words, it would be difficult for the carrier CS to adsorb and desorb substances. In contrast, with this configuration, heat can be easily controlled over the entire area of ​​the carrier CS, allowing the entire area of ​​the carrier CS to be used as an adsorption filter.

[0039] (7) In the above embodiment, the heat insulating material IM is a collection of radially expanding cylinders. This increases the strength of the heat insulating material IM, allowing it to support the carrier CS. <Modifications> The above embodiment can be modified as follows. The above embodiment and the following modifications can be combined and implemented within the scope of technical compatibility.

[0040] The shape of the adsorption filter 40 is not limited to a cylindrical shape. For example, it may be a square prism shape. The adsorption filter 40 only needs to have at least a cylindrical carrier CS and a heat insulating material IM that covers the outer peripheral surface of the carrier CS.

[0041] The type of adsorbent contained in the carrier CS is not limited to that described in the above embodiment. That is, the adsorbed substance is not limited to an organic solvent. For example, the type of adsorbent may be changed in order to use the carrier CS as a deodorizing filter.

[0042] The carrier CS is not limited to one having a honeycomb structure. For example, the carrier CS may be a sponge-like porous material. The first frame 20 does not have to have a plurality of through holes and partition walls 22. For example, the first frame 20 may consist of only the cylindrical body 21. This also applies to the second frame 30. In this case, the process of supplying a gas containing the adsorbed substance to the carrier CS and the process of desorbing the adsorbed substance from the carrier CS may be separated.

[0043] The shape of the opening of the hole 45 is not limited to a rectangular shape. For example, if the plate material 44 has a triangular wave-like wavy shape, the opening of the hole 45 will have a roughly triangular shape. Furthermore, for example, the plate material 44 may have an arc-shaped wave shape or a wavy wavy shape with multiple corners.

[0044] The holes 45 do not have to be through-holes. It is sufficient that the insulating material IM has at least a plurality of voids 46 inside. For example, the insulating material IM may be a porous material having a plurality of independent bubbles that are not open to the outside. Furthermore, the insulating material IM does not necessarily have to be layered, and may be composed of a single cylinder.

[0045] As shown in Figures 6 and 7, the holes 45 are not limited to those opening at the end surfaces of the insulating material IM. That is, the holes 45 may open at the outer peripheral surface of the insulating material IM. In this example, the insulating material IM also includes multiple plate materials 44. Specifically, in the example shown in Figure 6, each plate material 44 is annular. The main surface of each plate material 44 is curved in a rectangular, wavy manner. Multiple plate materials 44 of approximately the same shape are stacked in multiple layers in a direction along the central axis CA. Because multiple curved plate materials 44 are stacked, the insulating material IM includes multiple holes 45. That is, the holes 45 are gaps between the multiple plate materials 44. The holes 45 open at the outer peripheral surface of the insulating material IM. The holes 45 are through-holes that penetrate the insulating material IM from the outer peripheral surface to the inner peripheral surface. In other words, the holes 45 extend in the radial direction of the carrier CS. The holes 45 extend in the radial direction of the carrier CS, thereby increasing the structural strength of the heat insulating material IM against the radial force.

[0046] The heat insulating material IM does not have to cover the entire outer peripheral surface of the carrier CS. For example, the heat insulating material IM may be bonded to the carrier CS so as to cover a portion of the carrier CS. The material of the heat insulating material IM does not have to be an alloy whose main component is aluminum. For example, the material of the heat insulating material IM may be stainless steel or the like. The material of the heat insulating material IM may also be ceramic. In other words, the heat insulating material IM may be what is called ceramic foam.

[0047] The dimensions of the adsorption filter 40 are not limited to those of the above embodiment. That is, the diameter of the carrier CS may be less than 400 mm or greater than 1200 mm. The thickness of the heat insulating material IM may be less than 5 mm or greater than 30 mm. The opening area of ​​the hole 45 on the outer surface of the heat insulating material IM is 50 mm. ２ It may be less than 500 mm ２ The size may be changed as appropriate depending on the application of the adsorption filter 40.

[0048] In the above embodiment, the recovery device 110 is treated as a separate component from the drying furnace 100, but the recovery device 110 may be included in the drying furnace 100. The connection relationship between the adsorption device 10 and each flow path can be changed as appropriate. As long as the gas containing the organic solvent exhausted from the drying chamber R flows toward the adsorption filter 40 of the adsorption device 10, the frame structure of the adsorption device 10, the number of flow paths, the connection relationship, and other configurations are not important.

[0049] <Supplementary Notes> The technical ideas that can be understood from the above-described embodiments and modifications are described below. [1] An adsorption filter comprising a columnar carrier carrying an adsorbent capable of adsorbing a specific substance, and a heat insulating material covering the outer peripheral surface of the carrier, the heat insulating material having a plurality of voids therein.

[0050] [2] The adsorption filter according to [1], wherein the heat insulating material has a plurality of holes opening on the outer surface of the heat insulating material as the voids. [3] The adsorption filter according to [2], wherein the heat insulating material is cylindrical and the plurality of holes opening on the outer peripheral surface of the heat insulating material.

[0051] [4] The outer shape of the carrier is cylindrical, the diameter of the carrier is 400 mm or more and 1200 mm or less, the thickness of the heat insulating material is 5 mm or more and 30 mm or less, and the opening area of ​​the hole on the outer surface of the heat insulating material is 50 mm ２ More than 500 mm ２ The adsorption filter according to [2] or [3] below.

[0052] [5] The adsorption filter according to any one of [2] to [4], wherein the heat insulating material is a cylindrical shape made of a plurality of overlapping plates, and the holes are gaps between the plurality of plates. [6] The adsorption filter according to any one of [1] to [5], wherein the heat insulating material is an alloy mainly composed of aluminum.

[0053] REFERENCE SIGNS LIST 10...adsorption device CA...central axis PD...positive direction ND...negative direction 20...first frame 30...second frame 40...adsorption filter CS...carrier IM...insulating material 41...first end surface 42...second end surface 43...gap 44...plate material 45...hole 46...void

Claims

1. An adsorption filter comprising: a columnar carrier carrying an adsorbent capable of adsorbing a specific substance; and a heat insulating material covering the outer surface of the carrier, the heat insulating material having a plurality of voids therein.

2. The adsorption filter according to claim 1, wherein the heat insulating material has a plurality of holes opening on the outer surface of the heat insulating material as the voids.

3. The adsorption filter according to claim 2, wherein the heat insulating material is cylindrical, and the plurality of holes are opened on the outer peripheral surface of the heat insulating material.

4. The outer shape of the carrier is cylindrical, the diameter of the carrier is 400 mm or more and 1200 mm or less, the thickness of the heat insulating material is 5 mm or more and 30 mm or less, and the opening area of ​​the hole on the outer surface of the heat insulating material is 50 mm ２ More than 500 mm ２ The adsorption filter according to claim 2 or 3, wherein:

5. An adsorption filter according to any one of claims 2 to 4, wherein the heat insulating material is a tube made of a plurality of overlapping plate materials, and the holes are gaps between the plurality of plate materials.

6. An adsorption filter according to any one of claims 1 to 5, wherein the heat insulating material is an alloy containing aluminum as a main component.

7. A drying furnace comprising: an adsorption filter according to any one of claims 1 to 6; a drying chamber; and a duct for circulating gas exhausted from said drying chamber toward said adsorption filter.

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