Brush plating apparatus and brush plating method using same

Abstract

A brush plating apparatus is provided. The present invention enables automatically performing the brush plating operation regardless of the shape of an object to be plated or a plating area to be selectively processed, thereby improving operator convenience and enabling mass production while providing excellent plating uniformity to obtain good-quality plated products.

Description

Brush plating device and brush plating method using the same

[0001] The present invention relates to a brush plating device and a brush plating method using the same.

[0002] In general, plating is a technology that creates a film using a foreign metal on a metal or non-metal surface. Depending on the treatment method, it can be divided into electroplating, chemical plating, hot dip plating, vacuum plating, penetration plating, ion plating, etc., and depending on the purpose of plating, it is divided into decorative plating, corrosion plating, decorative / corrosion plating, industrial plating, etc.

[0003] Double electroplating is a surface treatment method that uses the principle of electrolysis to reduce and deposit metal ions on the surface to form a thin film. The object to be plated is connected to the cathode in a plating solution made up of an aqueous solution mainly composed of salts of the metal to be plated, and the anode is connected to another metal with direct current to pass electricity through, so that the metal ions in the electrolytic solution are deposited as a metal film on the surface of the product.

[0004] Meanwhile, there are various types of electroplating methods. Brush plating is a plating technique that uses a brush to selectively plate specific areas. Brush plating offers the advantage of being able to plate even objects with complex shapes and being economical even when small amounts are required.

[0005] However, conventional brush plating often required manual labor, as it was a technique for selectively plating only specific areas. Furthermore, manual plating can result in poor plating uniformity, lowering plating quality. Furthermore, manual plating can lead to worker fatigue and the risk of injury. Therefore, a solution to these issues is urgently needed.

[0006] The present invention has been devised in consideration of the above points, and the purpose of the present invention is to provide a brush plating device and a brush plating method using the same, which can increase the convenience of workers and enable mass production by automating the brush plating process, which was inevitably performed manually, as plating is performed according to the shape of the plated body or selectively at a specific location, while increasing the uniformity of plating to obtain a high-quality plated body.

[0007] In addition, another purpose of the present invention is to provide a brush plating device and a brush plating method using the same that can minimize damage to the device caused by a plating solution that may occur when brush plating is performed automatically.

[0008] In order to solve the above-described problem, the present invention provides a brush plating device for selectively plating a desired area in a plated body, comprising: a plating bath; a first support section including a flat first support section for fixing the plated body; a brush plating section including a plating brush electrically connected to an anode, a cathode, and a plating solution supply section for supplying a plating solution to the plating brush;

[0009] A brush plating device is provided, comprising: a second support member including a pair of vertical supports each supporting the plating brush and the cathode, and a horizontal support member connecting the pair of vertical supports; and a moving device member connected to the pair of vertical supports to vertically and horizontally move the plating brush and the cathode respectively to a desired area on a plated body.

[0010] According to one embodiment of the present invention, the plating solution supply unit may include a plating solution storage unit, a pressurizing means for pressurizingly transporting the plating solution stored in the plating solution storage unit toward a plating brush, and a flow path unit connecting the plating solution storage unit and a plating solution inlet in the plating brush.

[0011] In addition, the plating solution supply unit may be a circulating plating solution supply unit in which the remaining plating solution that has flowed down from the first support among the plating solution supplied to the plating brush is drained from the plating tank, stored in the plating solution storage unit, and then supplied to the plating brush again.

[0012] In addition, the first surface of the first support on which the plated body is placed is parallel to the ground, but the inner lower surface of the plating tank is inclined to one side with respect to the ground in order to collect the remaining plating solution that has flowed downward from the first surface of the first support among the supplied plating solution, and a plating solution drain may be provided on one side of the inner lower surface of the inclined plating tank.

[0013] In addition, the first support member further includes a second support member that supports the first support member so that it is spaced upward from the bottom of the plating tank and functions as a rotational axis for rotating the first support member, and the brush plating device may further include a rotation member connected to the second support member to rotate the first support member at a predetermined speed profile.

[0014] In addition, on the edge side of the second surface, which is the opposite surface of the first surface on which the plating body is mounted on the first support, a step may be provided whose width becomes narrower as it goes from the second surface toward the first surface in order to block the plating liquid flowing down from the first surface from moving along the second support toward the rotating part.

[0015] Additionally, the step may have a depth of 8 mm or more and a width on the second surface of 8 mm or more.

[0016] In addition, a step member may be provided that surrounds the second support at a predetermined height from the inner lower surface of the plating tank to prevent the remaining plating solution that has flowed down from the first support to the inner lower surface of the plating tank from moving along the second support to the rotating section.

[0017] Additionally, the brush plating unit may further include a load cell to control the load with which the plating brush presses the plated body.

[0018] Additionally, the moving device unit may include a pair of LM guides and a linear motor capable of automatically controlling the positions of the plating brush and the cathode.

[0019]

[0020] In addition, the present invention provides a brush plating method for selectively plating a target area in a plated body using a brush plating device according to the present invention, comprising the steps of: (1) fixing the plated body on a flat first support provided on a first support located in a plating bath; and (2) positioning a plating brush and a cathode electrically connected to an anode so as to be in contact with the plated body, supplying a plating solution from a plating solution supply unit to the plating brush, and applying power to the anode and the cathode to perform brush plating on a target area.

[0021] According to one embodiment of the present invention, step (2) performs brush plating while rotating a plated body through a first support that rotates at a predetermined speed profile, and the plating brush and cathode can be independently moved up, down, left, and right to selectively plate a desired area.

[0022] The brush plating apparatus and method of the present invention are suitable for automating the brush plating process regardless of the shape of the plated body or the selectively performed plating area, thereby enhancing the convenience of the operator, enabling mass production, and at the same time, obtaining a plated body of good quality with excellent plating uniformity. In addition, since the brush plating is performed in an automated manner, damage to the device due to the plating solution that may occur is minimized, thereby reducing device maintenance costs and minimizing or preventing process interruptions due to device damage and failure, and thus can be widely applied to brush plating work.

[0023] Figure 1 is a perspective view of a brush plating device according to one embodiment of the present invention.

[0024] Fig. 2 is a cross-sectional schematic diagram of the brush plating device of Fig. 1.

[0025] Figure 3 is a schematic plan view of the brush plating device of Figure 1.

[0026] Fig. 4 is a cross-sectional schematic diagram of a first support member employed in a brush plating device according to one embodiment of the present invention.

[0027] Fig. 5 is a perspective view of a brush plating device according to one embodiment of the present invention.

[0028] Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein.

[0029]

[0030] Referring to FIGS. 1 to 3, a brush plating device (1000) according to one embodiment of the present invention is a brush plating device that selectively plates a desired area in a plated body (10), including a plating bath (100), a first support part (200) including a flat first support (210) that fixes the plated body (10), a brush plating part (300) including a plating brush (310) electrically connected to an anode, a cathode (320), and a plating solution supply part (330) that supplies a plating solution to the plating brush (310), a pair of vertical supports (410) that each support the plating brush (310) and the cathode (320), a horizontal support (420) that connects the pair of vertical supports (410), and a lower support (430) to which one end of the pair of vertical supports (410) is fixed and which supports the plating bath (100). It includes a second support member (400) and a moving device unit connected to the pair of vertical supports (410) to vertically and horizontally move each of the plating brush (310) and the cathode (320) to a desired area on the plated body (10).

[0031]

[0032] First, the plating bath (100) is a space where a brush plating process is performed on the plated body. Any plating bath known in the art can be used without limitation. In addition, the size of the plating bath (100) can be appropriately changed in consideration of the size of the plated body, and thus the present invention is not particularly limited thereto. For example, the shape of the plating bath may be circular or octagonal as illustrated in FIG. 5, but is not limited thereto.

[0033] One side of the plating tank (100) may further include a drain (110) for discharging the remaining plating solution (340a) that was not plated after being supplied to the plating brush (310) through the plating solution supply unit (330) to the outside of the plating tank.

[0034] In addition, the inner lower surface of the plating tank (100) may be inclined toward the drain with respect to the ground so that the remaining plating solution (340a) that has not been plated can be collected toward the drain (110) and smoothly drained. At this time, there is no limitation on the method by which the inner lower surface of the plating tank (100) has an incline with respect to the ground, and for example, an incline-providing member (130) may be provided on the lower side of one side opposite to the side where the inner drain (110) of the plating tank (100) is formed, or a plating tank manufactured such that the lower outer surface of the plating tank (100) is parallel to the ground but the inner surface is inclined toward the drain (110) may be used, and the present invention is not particularly limited thereto.

[0035] Next, the first support member (200) placed inside the plating tank (100) described above will be described.

[0036] The above first support member (200) includes a flat first support member (210) that fixes the plated body (10), and may further include a second support member (220) for supporting the first support member (210) so that it is spaced upward from the lower portion of the plating tank (100).

[0037] The first support (210) is flat in shape to facilitate the fixing of the plated body (10), and the material thereof may be a known material that is not damaged by a known plating solution used in brush plating, and may have an appropriate size considering the size of the plated body (10), and the present invention is not particularly limited thereto.

[0038] The first support (210) has a first surface (211) on which a plated body (10) is mounted and fixed, and a second surface (212) opposite to the first surface (211). The plated body (10) positioned on the first surface (211) is a target object on which a plating layer is to be formed on a selective portion of the surface, and there are no restrictions on the shape, material, or size as long as it has a known material capable of electrolytic plating.

[0039] In addition, a second support (220) may be fixed to the second surface (212). The second support (220) may perform a function of supporting the first support (210) so as to be positioned apart from the lower portion of the plating tank (100). In addition, according to a preferred embodiment of the present invention, the second support (220) may function as a rotational axis for transmitting the rotational force of the additional rotation part (600) to the first support (210) and the plated body (10) fixed thereto. In addition, the material of the second support (220) may be a known material that is not affected by the electrolytic plating solution, and the size may also be appropriately changed according to the purpose, and the present invention is not particularly limited thereto.

[0040] In addition, the first support (210) and the second support (220) may be formed integrally or manufactured individually and then joined together using a known joining member, and the present invention is not particularly limited thereto.

[0041]

[0042] Next, the brush plating part (300) will be described.

[0043] The above brush plating part (300) includes a plating brush (310) and a cathode (320) that are electrically connected to the anode. The plating brush (310) and the cathode (320) may be any known plating brush or cathode used in brush plating, and therefore the present invention is not particularly limited thereto.

[0044] In addition, it includes a plating solution supply unit (330) for supplying plating solution toward the plating brush (310). The plating solution supply unit (330) may include a plating solution storage unit (331), a pressurizing means (332) for pressurizing and transferring the plating solution stored in the plating solution storage unit (331) toward the plating brush (310), and a flow path unit (333) for connecting the plating solution storage unit (331) and a plating solution inlet (not shown) in the plating brush. At this time, when performing the brush plating process, the plating solution is continuously supplied to the plating brush (310), and thus, the remaining plating solution (340a) that has not been plated among the supplied plating solution flows from the plated body (10) through the first support (210) and moves to the lower surface of the plating tank (100). The remaining plating solution (340a) that has not been plated is drained through the drain (110) of the plating tank (100), stored in the plating solution storage unit (331), and then supplied to the plating brush (310) again using the pressurizing means (332), which can be implemented in a circulating manner.

[0045] The plating solution stored in the plating solution storage unit (331) may contain metal ions for the target metal to be plated, and for example, the target metal may be nickel.

[0046] In addition, the pressurizing means (332) may be a known means capable of transporting the stored plating solution to the plating brush (310), and may be, for example, a pump.

[0047] In addition, the brush plating unit (300) may further include a load cell to control the load with which the plating brush (310) presses the plated body. The load cell may be a known device collectively referred to as a load sensor, a load converter, etc., and the present invention is not specifically limited thereto. The load applied to the plating brush (310) through the load cell may be controlled to a preset value, which is advantageous in uniformly forming the plating layer to have a desired thickness.

[0048]

[0049] Next, the second support part (400) will be described.

[0050] The second support member (400) includes a pair of vertical supports (410) that support the plating brush (310) and the cathode (320), and that function as guide rails that can independently move vertically and / or horizontally, and a horizontal support (420) that connects the pair of vertical supports (410). The pair of vertical supports (410) and the horizontal support (420) that connects them may be made of materials such as support frames and guide rails used in a plating brush process or a known plating process, and the present invention is not particularly limited thereto.

[0051]

[0052] In addition, the second LM guide (520) for moving a pair of vertical supports (410) in the second support member (400) described above, specifically, a second vertical support member (412) for supporting and fixing a plating brush (310) or a cathode (320), in the horizontal direction left and right along the horizontal support member (420) is included, and a moving device unit for vertically moving the plating brush (310) and the cathode (320) is included. The moving device unit may include an LM guide (500) formed of a first LM guide (510), and may further include a known power providing unit such as a linear motor (not shown) that provides power to automatically control the position of the LM guide (500) to a desired position, and the present invention is not particularly limited thereto.

[0053]

[0054] According to one embodiment of the present invention, in order to selectively plate a target area in a body to be plated (10), a plating brush (310) and a cathode (320) independently move their positions up, down, left, and right, while the body to be plated (10) is also rotated, so that the brush process is performed more smoothly, plating uniformity is increased, and brush plating can be performed while rotating the body to be plated through a first support that is rotated at a predetermined speed profile to prevent unnecessary contamination due to the plating solution of the device, such as the residual plating solution (340a) that was not plated after being supplied flowing along the first support (210) or the second support (220). To this end, a rotation unit (600) for rotating the first support (210) and the body to be plated (10) fixed to the first support (210) may be further included.

[0055] The above-mentioned rotating member (600) may include a known means capable of rotating the first support member (210) at a desired speed, and may include, for example, a motor, for example, a servo motor. In addition, in order to smoothly supply rotational power to the second support member (220) that serves as a rotation axis, a known bearing, gear, etc. may be further included between the second support member (220) and the rotating member (600), and the present invention is not particularly limited thereto.

[0056] In addition, the rotation speed of the first support (210) through the rotation unit (600) affects the plating uniformity, and if the rotation speed is excessively fast or slow, there is a concern that the plating quality may deteriorate. Preferably, the rotation speed of the first support (210) may be 10 to 60 rpm, which may be advantageous in achieving uniform plating quality.

[0057] Meanwhile, the remaining plating solution applied during the brush plating process may move to the rotating part (600) and damage or injure the rotating part (600). In this case, there is a concern that work delays due to process interruption and increased costs due to maintenance of the rotating part may occur. Accordingly, the present invention may have a step (A) machined so that the width becomes narrower from the second surface (212) toward the first surface (211) in order to block the plating solution flowing down from the first surface (211) from moving along the second support (220) toward the rotation unit (600) on the edge side of the second surface (212) opposite the first surface (211) on which the plated body (10) is fixed on the first support (210). More preferably, the step (A) may have a depth (d) of 8 mm or more and a width (w) on the second surface of 8 mm or more, which may be advantageous in further preventing the plating solution from moving along the second surface (212) toward the second support (220). Meanwhile, the upper limit of each of the width and depth of the step (A) may vary depending on the thickness and diameter of the first support within a range that does not damage the original function of the first support, and therefore the present invention is not particularly limited thereto.

[0058] In addition, the second surface (212) of the first support (210) can be formed to be concavely inclined from the edge side toward the second support (220), and this can be advantageous in further preventing the plating solution from moving along the second surface (212) toward the second support (220).

[0059] In addition, the lower surface of the plating tank (100) may further include a step member (120) that surrounds the second support (220) at a predetermined height from the inner lower surface of the second support (220) plating tank in order to prevent the remaining plating solution (340a) from moving and reaching the second support (220). The step member (120) may have a cylindrical shape having a hole in the center through which the second support (220) passes. The step member (120) may include, for example, an oil seal or an oil seal coupled to the second support within the cylindrical structure.

[0060]

[0061] The present invention includes a brush plating process performed using a brush plating device (1000) according to one embodiment of the present invention described above. The brush plating method is a brush plating method for selectively plating a target area in a plated body (10), and may include (1) a step of fixing the plated body (10) on a flat first support (210) provided on a first support (200) positioned in a plating bath (100), and (2) a step of positioning a plating brush (310) and a cathode (320) electrically connected to an anode so as to be in contact with the plated body (10), supplying a plating solution from a plating solution supply unit (330) to the plating brush (310), and applying power to the anode and the cathode to perform brush plating on a target area.

[0062] In addition, in order to obtain a good product in which plating is performed uniformly regardless of the size and shape of the plated body (10) in the brush plating performed in step (2), the plating brush (310) and the cathode (320) independently move their positions up, down, left, and right, while the plated body (10) is rotated by a first support (210) that rotates at a predetermined speed profile, and brush plating can be performed. Meanwhile, specific plating conditions such as the strength of the power applied in step (2) can be appropriately changed in consideration of the type of the plated body (10), the type of the plating solution, the thickness of the desired plating layer, and the like, and the present invention is not particularly limited thereto.

[0063]

[0064] Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiment presented in this specification, and a person skilled in the art who understands the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

Claims

1. A brush plating device that selectively plates a desired area within a plated body. plating bath; A first support member including a flat first support member for fixing a plated body; A brush plating unit including a plating brush electrically connected to an anode, a cathode, and a plating solution supply unit for supplying a plating solution to the plating brush; A second support member including a pair of vertical supports each supporting the plating brush and the cathode, and a horizontal support connecting the pair of vertical supports; and A brush plating device comprising a moving device unit connected to each of the pair of vertical supports and moving each of the plating brush and the cathode vertically and horizontally to a desired area on the plated body.

2. In paragraph 1, A brush plating device comprising a plating solution supply unit, a plating solution storage unit, a pressurizing means for pressurizingly transporting the plating solution stored in the plating solution storage unit toward a plating brush, and a flow path unit connecting the plating solution storage unit and a plating solution inlet in the plating brush.

3. In paragraph 2, The above plating solution supply unit is a brush plating device that is a circulating plating solution supply unit in which the remaining plating solution that has flowed down from the first support among the plating solution supplied to the plating brush is drained from the plating tank and stored in the plating solution storage unit, and then supplied to the plating brush again.

4. In paragraph 1, The first surface of the first support on which the plated body is to be placed is parallel to the ground. A brush plating device in which the inner lower surface of the plating tank is inclined to one side with respect to the ground to collect the remaining plating solution that has flowed downward from the first surface of the first support among the supplied plating solution, and a plating solution drain is provided on one side of the inner lower surface of the inclined plating tank.

5. In paragraph 1, The first support part further includes a second support part that supports the first support part so that it is spaced upward from the bottom of the plating tank and functions as a rotational axis for rotating the first support part. A brush plating device further comprising a rotating part connected to the second support to rotate the first support at a predetermined speed profile.

6. In paragraph 5, A brush plating device having a step machined so that the width becomes narrower from the second surface toward the first surface on the edge side of the second surface, which is the opposite side of the first surface on which the plating body is mounted on the first support, to block the plating liquid flowing down from the first surface from moving toward the rotating part along the second support.

7. In paragraph 6, A brush plating device having a step having a depth of 8 mm or more and a width on the second surface of 8 mm or more.

8. In paragraph 5, A brush plating device having a step member that surrounds a second support member at a predetermined height from the inner lower surface of the plating tank to prevent residual plating liquid flowing down from the first support member to the inner lower surface of the plating tank from moving to the rotating section along the second support member.

9. In paragraph 1, A brush plating device, wherein the brush plating unit further includes a load cell to control the load applied by the plating brush to the plated body.

10. In paragraph 1, A brush plating device including a pair of LM guides and a linear motor capable of automatically controlling the positions of the plating brush and the cathode, wherein the above moving device unit is a brush plating device.

11. A brush plating method for selectively plating a target area within a plated body using a brush plating device according to any one of claims 1 to 10, (1) A step of fixing a plated body on a first support body having a flat shape provided on a first support part located in a plating tank; and (2) A brush plating method comprising the steps of: positioning a plating brush and a cathode electrically connected to an anode so as to be in contact with the plated body, supplying a plating solution from a plating solution supply unit to the plating brush, and applying power to the anode and cathode to perform brush plating on a target area.

12. In paragraph 11, (2) In the step, the plating brush and the cathode independently move up, down, left, and right to selectively plate the target area. A brush plating method that performs brush plating while rotating a plated body through a first support that rotates at a predetermined speed profile.

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