Fluid cold plate

Abstract

A thermal system (100) may be configured to cool a heat-generating device. The thermal system (100) may include a plate (102) configured to be in thermal communication with the heat-generating device. The plate (102) may include a volume (200) defined by an upper wall (116), a lower wall (118), and sides (120) that connect the upper wall (116) to the lower wall (118). The volume (200) may be sealed from an external environment (202). The plate (102) may include conductive members (204) that extend from the upper wall (116) to the lower wall (118). The thermal system (100) may include an inlet (104) and an outlet (106) that are in fluid communication with the volume (200). The thermal system (100) may be monolithically formed as a single unit in an additive manufacturing process.

Description

FLUID COLD PLATERELATED APPLICATIONS

[0001] This application claims priority to and the benefit of U.S. Provisional Patent Application Serial No. 63 / 662,869 filed lune 21, 2024, the entire disclosure of which is hereby incorporated by reference.TECHNICAL FIELD

[0002] The present disclosure relates to thermal management systems and, more particularly to cold plates using fluid, such as a liquid or gas, as a working fluid.BACKGROUND

[0003] Electronic devices often generate heat and may accordingly benefit from heat dissipation (e.g., cooling) systems to maintain operational reliability and performance. Air-based cooling systems that employ air as a heat-transfer medium are often insufficient due to their limited cooling capacity and efficiency. Accordingly, what is needed are improved systems and methods for cooling electronic devices.SUMMARY

[0004] One aspect of this disclosure is a thermal system that is configured to cool a heatgenerating device that may include a plate that is configured to be in thermal communication with the heat-generating device. The plate may include a volume that is defined by an upper wall, a lower wall, and sides connecting the upper wall to the lower wall. The plate may also include conductive members that are spaced apart throughout the volume and that extend into the volume from at least one of the upper wall or the lower wall. At least some of the conductive members may extend from the upper wall to the lower wall. Accordingly, at least some of the conductive members may connect the upper wall to the lower wall.

[0005] The thermal system may include an inlet that is in fluid communication with the volume and an outlet that is also in fluid communication with the volume. The plate may be configured to transfer thermal energy from the heat-generating device to a fluid that travels through the volume from the inlet to the outlet. Furthermore, the conductive members may be configured to induce turbulent flow in at least some of the fluid that travels through the volumefrom the inlet to the outlet. Finally, the plate, the inlet, and the outlet may be monolithically formed from a thermally conductive material (e.g., a material having a thermal conductivity that is sufficiently high).

[0006] In some implementations, the inlet may include a nozzle that is configured to increase a velocity of the fluid as the fluid enters the volume. In some implementations, the nozzle of the inlet and the conductive members may be configured to cooperatively induce turbulent flow in at least some of the fluid that travels through the volume from the inlet to the outlet. In some implementations, at least one of the sides of the plate may include a series of triangular shaped regions, and the nozzle of the inlet, the conductive members, and the triangular shaped regions may be configured to cooperatively induce turbulent flow in at least some of the fluid that travels through the volume from the inlet to the outlet.

[0007] In some implementations, the conductive members may be configured to induce turbulent flow in at least some of the fluid that travels through the volume from the inlet to the outlet by inducing a Reynolds number greater than about 3000 in the fluid. In some implementations, the conductive members may be longitudinally shaped such that a length dimension of each of the conductive members along the upper wall or the lower wall may be greater than a width dimension along the upper wall or the lower wall. In some implementations, each of the conductive members may have a star-shaped cross-section defined by a plane that extends between the upper wall and the lower wall. In some implementations, the plate, the inlet, and the outlet may be monolithically formed by a laser sintering process. In some implementations, the fluid may be deionized water.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG. 1 is an upper perspective view of a first example of a thermal system according to the present disclosure.

[0009] FIG. 2 is an upper exploded view of the thermal system of FIG. 1.

[0010] FIG. 3 is a lower exploded view of the thermal system of FIG. 1.

[0011] FIG. 4 is an cross-sectional view of the thermal system of FIG. 1.

[0012] FIG. 5 is a lower perspective view of a second example of a thermal system according to the present disclosure.

[0013] FIG. 6 is an upper perspective view of the thermal system of FIG. 5.

[0014] FIG. 7 is a side view of the thermal system of FIG. 5.

[0015] FIG. 8 is a cross-sectional view of the thermal system of FIG. 5.

[0016] FIG. 9 is a top view of the thermal system of FIG. 5.

[0017] FIG. 10 is another cross-sectional view of the thermal system of FIG. 5.

[0018] FIG. 11 is an upper perspective view of a third example of a thermal system according to the present disclosure.

[0019] FIG. 12 is a lower perspective view of the thermal system of FIG. 11.

[0020] FIG. 13 is a cross-sectional view of the thermal system of FIG. 11.

[0021] FIG. 14 is a top cross-sectional view of a first volume of the thermal system of FIG.11. For clarity, cross-hatching of the cut surfaces has been omitted.

[0022] FIG. 15 is a top cross-sectional view of a second volume of the thermal system of FIG. 11. For clarity, cross-hatching of the cut surfaces has been omitted.

[0023] FIG. 16 is a top cross-sectional view of a third volume of the thermal system of FIG.11. For clarity, cross-hatching of the cut surfaces has been omitted.

[0024] FIG. 17 is a top cross-sectional view of a fourth volume of the thermal system of FIG.11. For clarity, cross-hatching of the cut surfaces has been omitted.

[0025] FIG. 18 is a lower perspective view of a fourth example of a thermal system according to the present disclosure.

[0026] FIG. 19 is an upper perspective view of the thermal system of FIG. 18.

[0027] FIG. 20 is a cross-sectional view of the thermal system of FIG. 18.

[0028] FIG. 21 is another cross-sectional view of the thermal system of FIG. 18.

[0029] FIG. 22 is a lower perspective view of a fifth example of a thermal system according to the present disclosure.

[0030] FIG. 23 is an upper perspective view of the thermal system of FIG. 22.

[0031] FIG. 24 is a cross-sectional view of the thermal system of FIG. 22.

[0032] FIG. 25 is an example of a method for implementing a thermal system according to the present disclosure.DETAILED DESCRIPTION

[0033] Referring to FIG. 1, a thermal system 100 may be a fluid-based cooling system. The thermal system 100 may employ a working fluid (e g., water, glycol, inert gas, etc.) as a heat-transfer medium. The thermal system 100 and corresponding working fluid may have better heattransfer properties than air-based systems that employ air (e.g., comprising about 80% nitrogen and about 20% oxygen) as the heat-transfer medium. Accordingly, the thermal system 100 may be more effective in dissipating heat generated by heat-generating devices than air-based cooling systems.

[0034] For example, the thermal system 100 may employ water as a heat-transfer medium and an air-based cooling system may employ air as a heat-transfer medium. Because water has a higher heat capacity and thermal conductivity than air, the thermal system 100 may be more effective in dissipating heat. As one example, the thermal system 100 may be able to dissipate heat at a higher rate than the air-based cooling system. As another example, the thermal system 100 may be able to dissipate heat with a lesser volume of water than the volume of air needed to dissipate an equivalent amount of heat.

[0035] The thermal system 100 may be or include a fluid cold plate. Accordingly, the thermal system 100 may circulate a working fluid or inert gas (collectively, “working fluid”) through a plate-like structure formed from a thermally conductive material that is in thermal communication with the heat-generating device. As the device generates heat, the heat may be transferred from the device to the plate-like structure while working fluid is continuously supplied to and circulated through the plate-like structure. The heat may thus be transferred to the working fluid and subsequently removed from the plate-like structure where it may be cooled via heat sinks (e.g., having a surface area larger than that of the plate-like structure), a heatexchanger, or the like. As used herein, fluid cold plates that employ a liquid as a heat-transfer medium may be referred to as “liquid cold plates.” Similarly, fluid cold plates that employ a gas (e.g., an inert gas) as a heat-transfer medium may be referred to as “gas cold plates.”

[0036] In certain implementations, the thermal system 100 may have a relatively small size while being configured to dissipate relatively large amounts of heat. The efficacy of the thermal system 100 dissipating heat from a heat-generating device (e.g., an electronic component such as a central processing unit (CPU) or other processor) is determined in part by the rate at which heat can be transferred to the working fluid from the plate-like structure of the thermal system 100. The rate at which heat can be transferred to the working fluid from the plate-like structure may depend on a variety of factors, such as the contact area of the working fluid with the plate-like structure, the volume of the working fluid that circulates through the plate-like structure, the rateat which the working fluid circulates through the plate-like structure, and whether the flow of the working fluid through the plate-like structure is laminar or turbulent.

[0037] As electronic components become smaller, the thermal system 100 may be a viable heat dissipation solution. For example, the thermal system 100 may compensate for a reduced contact area and volume at least in part by increasing the velocity of the working fluid through the plate-like structure and by inducing turbulent flow in the working fluid that flows therethrough. The thermal system 100 may induce and / or maintain turbulent flow (e.g., highly turbulent flow) of the working fluid by inducing and / or maintaining a Reynolds number of the working fluid above a threshold value.

[0038] Furthermore, in addition to dissipating heat from heat-generating devices, the thermal system 100 may also insulate components by providing a heat-dissipating barrier between close (e g., adjacent) components. For example, as a heat-generating device positioned on one side of the thermal system 100 generates heat, the working fluid may remove that heat before the heat reaches another component positioned on another side of the thermal system 100. In other words, by removing heat generated by a heat-generating device before it reaches another component, the thermal system 100 may provide an insulative barrier between those components.

[0039] In certain implementations, the thermal system 100 may include a plate 102, an inlet 104, and an outlet 106. The thermal system 100 may be characterized as a fluid cold plate as described above. The thermal system 100 may be configured to be in thermal communication with a heat-generating device (not shown) such that the thermal system 100 may cool the heatgenerating device by removing heat from the heat-generating device. The heat-generating device may be any device, component (e.g., electrical component), or object that generates heat or that is thermally coupled to a device, component, or object that generates heat. For example, the heatgenerating device may be an electronic device such as a central processing unit (CPU), a graphics processing unit (GPU), or a printed circuit board (PCB) that includes heat-generating components. As some other examples, the heat-generating device may be some other thermal management system (e.g., heated fluid from another fluid cold plate) or any other heat- conducting or heat-collecting device. The heat-generating device may also include intermediate components that are thermally coupled to any of the above components, such as heat sinks or the like.

[0040] The plate 102 may directly contact the heat-generating device to provide thermal communication therebetween such that heat may be directly conducted from the heat-generating device to plate 102. Alternatively, the plate 102 may be thermally coupled to the heat-generating device via a medium such as a thermal paste or the like, such that heat may be indirectly conducted from the heat-generating device to the plate 102.

[0041] To cool the heat-generating device, a working fluid 108 may enter the plate 102 via the inlet 104, whereby heat may be transferred to the working fluid 108 as the working fluid 108 traverses (e.g., travels through or across) the plate 102. The working fluid 108 may thereafter carry the collected heat out of the plate 102 as the working fluid 108 exits via the outlet 106. After the working fluid 108 exits the plate 102, the temperature of the working fluid 108 may have increased due to the transfer of heat from the plate 102 thereto. The working fluid 108 that exits the volume (e.g., via the outlet 106) may be cooled via any suitable structures before recirculation through the plate 102. Such structures may be, for example, one or more cooling systems 109 comprising or functioning as one or more heat sinks, heat exchangers, other thermal systems or components thereof, or the like. In some implementations, after the working fluid 108 exits the plate 102, the working fluid 108 may be cooled via convection of heat to the environment (e.g., air surrounding the thermal system 100).

[0042] To enable heat to be efficiently transferred from the heat-generating device to the working fluid 108, the plate 102 may be formed of a thermally conductive material (e.g., metal, metal alloy, or other material having a thermal conductivity that is sufficiently high). For example, the plate 102 may be formed of copper, aluminum, or alloys thereof. In some implementations, the plate 102 may be formed of GRCop-42 which is a high conductivity, high- strength dispersion strengthened copper-alloy usable in additive manufacturing. Other thermally conductive materials, composites, mixtures, or alloys may also be used.

[0043] The plate 102 may be generally planar and / or may define a generally rectangular (e.g., square) profile. However, in some implementations, the plate 102 may define a profile having some other shape. Where the plate 102 defines a generally rectangular profile, the plate 102 may have a length 110 of between about 20mm and 50mm, a width 112 of between about 20mm and 50mm, and a thickness 114 between about 1.5mm and 4.0mm. In some implementations, the length 110 of the plate 102 may be about 34mm, the width 112 of the plate 102 may be about 35mm, and the thickness 114 of the plate 102 may be about 2.25mm.

[0044] The plate 102 may include an upper wall 116, a lower wall 118, and sides 120 that connect the upper wall 116 to the lower wall 118. The upper wall 116, lower wall 118, and sides 120 may define or aid in defining a volume within the plate 102. The upper wall 116 and the lower wall 118 may be generally parallel with each other. The upper wall 116 may include protrusions 122 (e.g., four of the protrusions 122) that are configured for locating and positioning the heat-generating device with respect to the thermal system 100 (e.g., to the upper wall 116). As shown, the protrusions 122 may be shaped in the form of comers of a rectangle (e.g., a square). However, the protrusions 122 may have any other suitable geometry that is complementary to the heat-generating device.

[0045] The inlet 104 and the outlet 106 may be tubular members that provide a fluid path for the working fluid 108 to be supplied to and removed from within the plate 102. In other words, the inlet 104 and the outlet 106 may be in fluid communication with the plate 102 (e.g., the volume within the plate 102) and other components (not shown) that form a flow path (e.g., a closed loop flow path) for the working fluid 108. For example, the inlet 104 may be in fluid communication with a pump 123 that pressurizes the working fluid 108 for transfer into the volume with the plate 102 and the outlet 106 may also be in fluid communication (e g., indirect fluid communication) with the pump 123 such that the working fluid 108 that exits the volume via the outlet 106 may be repressurized for recirculation through the volume.

[0046] As shown, the inlet 104 and the outlet 106 may both be connected to the upper wall 116, such that a first portion 124 of each of the inlet 104 and the outlet 106 extends away from the plate in a generally perpendicular direction with respect thereto. Each of the inlet 104 and the outlet 106 may also include a second portion 126 that is connected to the first portion 124 via a bend 128, such that the second portion 126 extends away from the plate 102 in a generally parallel direction with respect thereto. In some implementations, the inlet 104 and the outlet 106 may have some other configuration. For example, one or more instances of the inlet 104 and / or one or more instances of the outlet 106 may be connected to one or more of the upper wall, 116, the lower wall 118, or one of the sides 120. As another example, one or more instances of the inlet 104 and / or one or more instances of the outlet 106 may extend away from the plate 102 in some other direction than shown in FIG. 1. In some implementations, the inlet 104 and / or the outlet 106 may omit the second portion 126 and the bend 128. The inlet 104 and the outlet 106 may be formed from the same material as the plate 102.

[0047] One or more of the plate 102, the inlet 104, or the outlet 106 may be formed monolithically (e.g., as a single unit, without any seams, free from discrete components, or the like), for example, using additive manufacturing methods. By forming the plate 102, the inlet 104, and the outlet 106 monolithically, the volume within the plate 102 (e.g., and respective interior volumes of the inlet 104 and the outlet 106) may be sealed while maintaining a compact (e.g., low profile) package. For example, by forming the plate 102 monolithically, the interior volume therewithin may be sealed without additional components such as O-rings, gaskets, or the like. Furthermore, such monolithic construction may more reliably seal the thermal system 100 than alternative multi -piece constructions in which the risk of gaps or other defects may be present. Where the plate 102, the inlet 104, and the outlet 106 are formed monolithically, each of the plate 102, the inlet 104, and the outlet 106 may be formed from the same materials as described above with respect to the plate 102.

[0048] Additive manufacturing (e.g., 3D printing) is a process by which three-dimensional components may be constructed via a sequential layering process in which layers of a material are deposited on a build platform in successive layers until the component is fully constructed. Although sharing this common principal, different additive manufacturing techniques may be employed for specific materials. For example, direct metal laser sintering (DMLS) is an additive manufacturing technique for the formation of metal components. In some implementations, DMLS may be used to form the thermal system 100 or components thereof. DMLS involves first spreading a thin layer of metal powder over a build platform. A laser then scans the layer and selectively sinters the powder according to the cross-sectional geometry of the component being constructed. After selectively sintering the layer of powder, the build platform is lowered such that a next layer of powder may be deposited. This process is repeated for successive layers of metal powder to form the three-dimensional geometry of the component.

[0049] The plate 102 may include the volume therewithin through which the working fluid 108 travels and which may be sealed from an external environment. To form the volume within the plate 102, the lower wall 118 may first be formed (e.g., sintered). Thereafter, the sides 120 may be formed (e.g., sintered) while leaving un-sintered metal powder within the volume. The upper wall 116 may then be formed (e.g., sintered), in which the un-sintered metal powder within the volume supports the metal powder layers that will be sintered to form the upper wall 116. After formation of the thermal system 100, the un-sintered metal powder within the volume maybe purged therefrom. Other components of the thermal system 100 may also be formed in the same process, such as the conductive members described below.

[0050] Although DMLS has been described, other methods of additive manufacturing may be used to monolithically form the thermal system 100 or components thereof depending on the desired material and properties thereof. These may include, but are not limited to, electron beam melting (EBM) or metal binder jetting for metals, or fused deposition modeling (FDM), stereolithography (SLA), or selective laser sintering (SLS) for polymers and certain composites.

[0051] Referring to FIG. 2, for purposes of explanation, the thermal system 100 is shown with the upper wall 116 of the plate 102 spaced from the lower wall 118 and sides 120. As appreciated, the upper wall 116, the lower wall 118, and the sides 120 of the plate 102 may be monolithically formed as described above such that the upper wall 116 may not be separable from the lower wall 118 and the sides 120.

[0052] As shown, the plate 102 may include the volume 200 (e.g., the interior volume) defined by the upper wall 116, the lower wall 118, and the sides 120 of the plate 102. The inlet 104 and outlet 106 may be in fluid communication with the volume 200. Accordingly, during operation of the thermal system 100, the working fluid 108 may be supplied (e g., continuously supplied) to the volume 200 via the inlet 104. The working fluid 108 may thereafter traverse (e.g., travel through or across) the volume 200 before being removed from the volume 200 via the outlet 106. The working fluid 108 may be supplied to and removed from the volume 200 by pressurizing the working fluid 108 upstream of the inlet 104 (e.g., via a pump 123 or other means) and / or by creating a vacuum downstream of the outlet 106. The volume 200 may be sealed from an environment 202 such that the working fluid 108 is prevented (e.g., blocked, inhibited) from escaping from the volume 200 to the environment 202 while traveling therethrough. As described previously, the volume 200 may be sealed from the environment 202 by monolithically forming the plate 102.

[0053] In certain implementations, due to the relatively small size of the thermal system 100 and the volume 200, the amount of the working fluid 108 that can be circulated through the volume 200 at a given time may be limited. Accordingly, to compensate for the relatively small amount of the working fluid 108 that may be contained within the volume 200 as a given moment in time, the plate 102 may include conductive members 204 that are spaced throughout the volume 200. The conductive members 204 may be monolithically connected to at least one ofthe upper wall 116 or the lower wall 118. By including the conductive members 204 within the volume 200, the conductive members 204 may increase the surface area for contact between the working fluid 108 and the plate 102. For example, as the working fluid 108 travels from the inlet 104 to the outlet 106, the working fluid 108 (e.g., at least some of the working fluid) may travel around and contact the conductive members 204 (e.g., sides of the conductive members 204). Thus, by increasing the surface area for contact between the working fluid 108 and the plate 102, the conductive members 204 may increase the rate at which heat is transferred from the plate 102 to the working fluid 108.

[0054] As shown, the conductive members 204 may extend into the volume 200 from the lower wall 118. In some implementations, at least some of the conductive members 204 may extend into the volume 200 from the upper wall 116. At least some of the conductive members 204 may extend from the lower wall 118 to the upper wall 116 and span a thickness of the volume 200. For example, at least some of the conductive members 204 may be formed in the additive manufacturing process to monolithically extend from the lower wall 118 to the upper wall 116. In some implementations, all of the conductive members 204 may monolithically extend from the lower wall 118 to the upper wall 116.

[0055] As shown, the conductive members 204 may have an elongated shape, such that a length of each of the conductive members 204 is greater than a width (e.g., where the length and width are measured along the upper wall 116 or the lower wall 118). In some implementations, the conductive members 204 may have some other geometry. For example, the conductive members 204 may be star-shaped or have a cross section that has multiple points, surfaces, concavities, or the like.

[0056] In the illustrated example, the plate 102 includes fifty-six of the conductive members 204. However, the plate 102 may include any suitable number of the conductive members 204. For example, the plate 102 may include twenty of the conductive members 204, forty of the conductive members 204, sixty of the conductive members 204, or some other number of the conductive members 204.

[0057] Additionally, to further improve the efficacy of the thermal system 100 with respect to dissipating heat, the conductive members 204 may be configured to induce turbulent flow in the working fluid 108 (e.g., at least some of the working fluid 108, at least a portion of the working fluid 108, etc.) that travels through the volume 200 (e.g., from the inlet 104 to the outlet106). Turbulent flow may significantly increase the rate at which heat is transferred to the working fluid 108 as compared to laminar flow. This may be due to several factors, including disruption of a boundary layer of the working fluid 108 that may be present between a bulk of the working fluid 108 and the plate 102. Interference of a boundary layer may be more severe in the case of laminar flow, and may inhibit the transfer of heat from the plate 102 to the bulk of the working fluid 108 and, accordingly, reduce the overall efficacy of the working fluid 108 as a heat-transfer medium. Disruption of the boundary layer and / or prevention of boundary layer formation may increase or maximize a temperature differential between the plate 102 and the working fluid 108 that contacts the plate 102 and thus may increase the rate at which heat is transferred from the plate 102 to the working fluid 108. Furthermore, turbulent flow may result in mixing of the working fluid 108 such that more of the working fluid 108 contacts the plate 102 and thus may increase the rate at which heat is transferred from the plate 102 to the working fluid 108. This effect may be referred to as increasing the effective surface area of the working fluid 108.

[0058] The Reynolds number is a dimensionless quantity in fluid mechanics that characterizes the ratio of inertial forces to viscous forces of a fluid in a system. The Reynolds number may be helpful in predicting flow patterns in different fluid flow situations and may be particularly useful in determining whether flow of a fluid will be laminar or turbulent. A formula to calculate the Reynolds number of a fluid in a system may be as follows:

[0060] In the above formula, p is the density of the fluid, v is the velocity of the fluid, L is a characteristic linear dimension of the system (e.g., an inner diameter of a tubular system), and p is the kinematic viscosity of the fluid.

[0061] Laminar flow typically occurs when the Reynolds number of a fluid in a system is less than 2000. Turbulent flow typically occurs when the Reynolds number of a fluid in a system is above 4000. In between these values, some of the fluid flow may be turbulent and some of the fluid flow may be laminar. Accordingly, turbulent flow may be induced in a system by increasing the velocity of the fluid. Turbulent flow may also be induced in a system by selecting a fluid that has a high density and / or a low dynamic viscosity (e.g., having a density-dynamic viscosity ration that is favorable for turbulent flow). Furthermore, turbulent flow may be induced in a system by redirecting (e.g., abruptly redirecting) the fluid.

[0062] Therefore, the thermal system 100 may induce turbulent flow of the working fluid 108 by maintaining a high velocity of the working fluid 108 as it travels from the inlet 104 to the outlet 106. For example, a flow rate of the working fluid 108 as it travels through the inlet 1043 immediately prior to entering the volume 200 may be about 1.3 x 10-6— . Where the inlet 104 has an inner diameter of 0.5mm, the cross-sectional area of an interior of the inlet 104 may be about 2.0 X 10-7m2. Accordingly, by dividing the flow rate of the working fluid 108 by the cross-sectional area of the interior of the inlet 104, the velocity of the working fluid 108 may be 772 about 6.6 — In some implementations, the inner diameter of the inlet 104 may be in a range from about 0.4mm to about 0.6mm, resulting in a velocity of the working fluid 108 that is in a range from about 4.6— to about 10.4—. Where the inlet 104 has an inner diameter of 0.5mm, the s sworking fluid 108 may experience a pressure loss of about 1.9 X 106per meter length.

[0063] Furthermore, the thermal system 100 may induce turbulent flow of the working fluid 108 by selecting the working fluid 108 to have a high density and / or a low dynamic viscosity (e.g., having a favorable density-dynamic viscosity ratio). In some implementations, the working fluid 108 may be degassed water, which may be water having a reduced dissolved gas composition than untreated water (e.g., degassed water may comprise negligible dissolved gas). In some implementations, the working fluid 108 may be deionized water.

[0064] Deionized and / or degassed water (collectively, “prepared water”) may be advantageous as the working fluid 108 for several reasons. For example, prepared water may k have a relatively high density (e.g., about 1000—) and low kinematic viscosity (e.g., about1.0 x at 20°C) as compared to other fluids. This may result in prepared water being more susceptible to turbulent flow. Accordingly, where (1) prepared water is selected as the working fluid 108, (2) the flow rate of the working fluid 108 as it travels through the inlet 104 immediately prior to entering the volume 200 is about 1.3 x and (3) the inner diameterof the inlet 104 is about 0.5mm, the resulting Reynolds number may be about 3310.Furthermore, where (1) prepared water is selected as the working fluid 108, (2) the flow rate of the working fluid 108 as it travels through the inlet 104 immediately prior to entering the volume is about 1.3 X and (3) the inner diameter of the inlet 104 is in a range from about0.4mm and 0.6mm, the resulting Reynolds number may be in a range between about 2760 and 4140.

[0065] Prepared water may also have relatively high specific heat capacity (e.g., about 4180 at 20°C) and thermal conductivity (e.g., about 0.6^) as compared to other fluids, which may increase the efficacy of prepared water as a heat transfer medium. Finally, prepared water may have relatively low electrical conductivity (e.g., about 0.055^5) as compared to other fluids, which may reduce the risk of damage to related electrical components (e.g., the heatgenerating device) when prepared water is employed as the working fluid 108. Although prepared water has been described as the working fluid 108, other suitable liquids may be used such as, for example, untreated water, water-glycol mixtures, mineral oils, dielectric fluids, or the like. Alternatively, the working fluid 108 may be or comprise a gas (e.g., an inert gas).

[0066] Turbulent flow may be induced by redirecting the working fluid 108 within the volume 200 (e.g., redirecting the working fluid 108 abruptly within the volume 200). Accordingly, the conductive members 204 may aid in inducing turbulent flow in the working fluid 108 as the working fluid 108 travels from the inlet 104 to the outlet 106 by repeatedly redirecting the working fluid 108 around the conductive members 204. As shown, the conductive members 204 may be spaced in a staggered configuration within the volume 200, thereby inhibiting any straight-line paths for the working fluid 108 to travel from the inlet 104 to the outlet 106. Stated differently, the conductive members 204 may be positioned such that the plate 102 is free from straight-line paths through the volume 200 between the inlet 104 and the inlet 104. Furthermore, some of the conductive members 204 may be oriented differently than others, which may cause the working fluid 108 to be directed in a controlled, albeit turbulent manner as the working fluid 108 travels from the inlet 104 to the outlet 106. For example, some of the conductive members 204 may be oriented forty-five degrees clockwise relative to a fluid flow axis 206 or fluid flow direction that extends between the inlet 104 to the outlet 106, and other of the conductive members 204 may be oriented forty-five degrees counterclockwise relative to the fluid flow axis 206.

[0067] As shown, the sides 120 of the plate 102 may include angular regions 208 within the volume 200 that are configured to further induce turbulent flow in the working fluid 108 through redirection thereof as the working fluid travels through the volume 200. For example, two opposing sides 120 may each include a series or row of angular (e.g., ninety degree) projections,which may also be viewed or characterized as a series or row of angular (e.g., ninety degree) indentations, that are configured to redirect the working fluid 108 that travels there along or that comes into contact therewith. In some implementations, one or more of the conductive members 204 may be positioned within the angular regions 208.

[0068] Referring to FIG. 3, the thermal system 100 is shown with the upper wall 116 of the plate 102 spaced from the lower wall 118 and sides 120. The inlet 104 and the outlet 106 may be fluidly connected to the volume 200 via respective apertures 300, such that the working fluid 108 may enter (e.g., continuously enter) and exit (e.g., continuously exit) the volume 200 therethrough. Because each of the inlet 104 and the outlet 106 may be connected to the upper wall 116 of the plate 102, the apertures 300 may be oriented perpendicular to the upper wall 116 and the lower wall 118 that define the volume 200. This perpendicular orientation therefore may result in the lower wall 118 immediately (e.g., substantially immediately) redirecting the working fluid 108 to change the flow direction thereof upon entering the volume 200. Accordingly, the orientation of the inlet 104 may also contribute to the inducement of turbulent flow in the working fluid 108.

[0069] Referring to FIG. 4, one or more of the inlet 104 or the outlet 106 may include a nozzle 400. The nozzle 400 may have an inner diameter that is smaller than an inner diameter of the remainder of the inlet 104 or the outlet 106 (e.g., the first portion 124 of the inlet 104 and / or the first portion 124 of the outlet 106). For example, the nozzle 400 of the inlet 104 may have an inner diameter that is two, three, or four times smaller than an inner diameter of the first portion 124 of the inlet 104.

[0070] The nozzle 400 may be configured to increase the velocity of the working fluid 108 as the working fluid 108 enters the volume 200. Increasing the velocity of the working fluid 108 may increase the rate at which heat is transferred from the plate 102 to the working fluid 108 by maintaining a high or maximum temperature differential between the working fluid 108 within the volume 200 and the plate 102. Stated differently, by increasing the velocity of the working fluid 108, regions of the working fluid 108 that have been heated by the plate 102 may exit the volume 200 rapidly while unheated regions of the working fluid 108 enter the volume 200 to replace the heated regions and thus a high or maximized temperature differential may be maintained between the working fluid 108 and the plate 102.

[0071] In addition to increasing the velocity of the working fluid 108, the nozzle 400 of the inlet 104 and the outlet 106 may be configured to maintain a constant (e.g., substantially constant) flow of the working fluid 108 through the volume 200. For example, the working fluid 108 may be supplied to the inlet 104 via a pump 123 in which the pump 123 supplies the working fluid 108 at a periodic and / or irregular rate. Due to the nozzle 400 accelerating the working fluid 108, periodic and / or irregular supply of the working fluid 108 to the volume 200 may become negligible as the working fluid 108 is injected into the volume 200 via the nozzle 400 at the inlet 104. Accordingly, the flow of the working fluid 108 through the volume 200 may be independent (e.g., substantially independent) of the rate at which the working fluid 108 is supplied to the inlet 104. Stated differently, the nozzle 400 may be configured to passively regulate the supply of the working fluid 108 to the volume 200 such that a substantially constant flow rate of the working fluid 108 is maintained, even where the supply of the working fluid 108 may not be constant (e.g., may be irregular).

[0072] Furthermore, as mentioned previously, increasing the velocity of the working fluid 108 may increase the Reynolds number thereof and accordingly promote turbulent flow thereof. For example, the nozzle 400 may have an inner diameter that is in range between about 0.4mm and about 0.6mm as described previously with respect to the inlet 104, generally. Finally, by including the nozzle 400 with each of the inlet 104 and the outlet 106, the thermal system 100 may be substantially symmetrical such that the flow direction of the working fluid 108 may be reversed (e.g., such that the working fluid 108 enters the volume 200 at the outlet 106 and exits the volume at the inlet 104) without substantially affecting the performance thereof.

[0073] Through one or more of the previously described features of the thermal system 100, the thermal system 100 may be configured to maintain a Reynolds number that is above a threshold value. For example, the thermal system 100 may be configured to maintain a Reynolds number that is greater than about 3000 such that turbulent flow is induced in at least some of the working fluid 108. As another example, the thermal system 100 may be configured to maintain a Reynolds number that is greater than about 4000 such that turbulent flow is induced in most the working fluid 108. As another example, the thermal system 100 may be configured to maintain a Reynolds number that is greater than about 5000 (e.g., such that turbulent flow is induced in substantially all of the working fluid 108. With turbulent flow associated with a Reynoldsnumber of about 5000, in selected implementations, the working fluid 108 in the interior volume within the thermal system 100 may be capable of absorbing about 2.5 kW to about 2.92 kW at a flow rate (e.g., liquid flow rate) of about 14 mL / sec.

[0074] By increasing the efficacy of the thermal system 100 in dissipating heat through, for example, inducing turbulent flow, selecting the working fluid 108 to have advantageous heattransfer properties, increasing contact area between the working fluid 108 and the plate 102 via the conductive members 204, maintaining a high velocity of the working fluid 108 through the volume 200 of the plate 102, or other previously described features, the thermal system 100 may be effectively sized and shaped such that relatively large amounts of heat may be removed from relatively small heat-generating devices (e.g., small electronic components or devices) while using relatively small amounts of the working fluid 108. As mentioned previously, a thickness 114 of the plate 102 may be about 2.25mm. Accordingly, a thickness 402 of the volume 200 may be between about 0.25mm and 1.00mm. In some implementations, the thickness 402 of the volume 200 may be about 0.25mm. In some implementations, the thickness 402 of the volume 200 may be about 0.75mm. In some implementations, the thickness 402 of the volume 200 may be about 1.00mm.

[0075] Referring to FIGS. 5-10, in some implementations, a thermal system 100 may include multiple volumes 200 (e.g., multiple interior volumes such as a first volume 200a, a second volume 200b, a third volume 200c, and a fourth volume 200d). Each volume 200 may be in fluid communication with at least one respective inlet 104 and at least one respective outlet 106. For example, the first volume 200a may be serviced by a first inlet 104a and a first outlet 106a, the second volume 200b may be serviced by a second inlet 104b and a second outlet 106b, the third volume 200c may be serviced by a third inlet 104c and a third outlet 106c, and the fourth volume 200d may be serviced by a fourth inlet 104d and a fourth outlet 106d. Alternatively, as shown, each of the first volume 200a, second volume 200b, third volume 200c, and fourth volume 200d may be serviced by two outlets 106 (e.g., the first volume 200a may be serviced by two instances of the first outlet 106a, the second volume 200b may be serviced by two instances of the second outlet 106b, and so forth).

[0076] Each volume 200 may function independently. Thus, when operating together, the volumes 200 may combine to form of a thermal system 100 of enhanced or multiplied capacity. Each volume 200 may be defined by the plate 102 as described previously. As shown, thevolumes 200 of the thermal system 100 may be positioned directly adjacent one another, side-by- side, to form a larger profile or tile. That is, the volumes 200 may be substantially coplanar with one another. Although the thermal system 100 shown in FIGS. 5-10 includes four volumes 200, each positioned proximate two adjacent volumes 200 on two sides thereof, the thermal system 100 may include any number of rows or columns of the volumes 200 to form, for example, checkerboard arrangement of the volumes 200 (e.g., having four rows of the volumes 200 and four columns of the volumes 200, etc.).

[0077] The different volumes 200 in the thermal system 100 may be contained within separate plates 102 held in place with respect to one another in any desired or suitable manner. Alternatively, the volumes 200 may be defined within a single monolithic formation (e.g., be monolithically formed in an additive manufacturing process as a single plate 102 or single unit). That is, each volume 200 may be independent of other volumes 200 of the thermal system 100, though the material (e.g., metal or metal alloy) defining the volumes 200 may be a monolithic formation.

[0078] For example, the thermal system 100 may include an upper wall 116, a lower wall 118, sides 120, and internal dividers 800 (see FIG. 8) that define, segregate, or separate the various volumes 200. The internal dividers 800 may be and function substantially similar to the sides 120 of the plate 102 except that the internal dividers 800 may be configured to separate (e g., fluidly separate) each the volume 200 from one or more adj cent volumes 200 rather than an environment 202 around the thermal system 100. Accordingly, adjacent volumes 200 may be defined by different sides of the same internal divider 800.

[0079] Just as multiple volumes 200 may be arranged side-by-side in a planar configuration to cover and remove heat from a larger area, multiple thermal systems 100 may similarly be tiled together to cover a broader surface area or accommodate larger thermal management needs. This modular arrangement allows for scalable deployment, wherein individual thermal systems 100 can be replicated and arranged edge to edge (e.g., side 120 to side 120) in a grid-like or tessellated layout, enabling flexible adaptation to various application sizes and requirements. Furthermore, the sides 120 that define angular regions 208 on the perimeter of each volume 200 may have exterior surfaces with complementary patterns or shapes. These geometric features may be configured to facilitate mechanical interlocking or seamless tiling of multiple thermal systems 100. By aligning the exterior surfaces of adjacent sides 120, multiplesystems can be fitted together more precisely and / or securely, enhancing structural integrity of the resulting array of thermal systems 100.

[0080] Referring to FIGS. 11-17, in some implementations, a thermal system 100 may include multiple volumes 200 (e.g., a first volume 200a, a second volume 200b, a third volume 200c, and a fourth volume 200d) stacked vertically, one on top of the other. This vertical stacking arrangement may be advantageous for conserving horizontal space while still achieving desired thermal performance. In such configurations, fluid communication and thermal transfer may be managed through vertical routing of inlets 104 and outlets 106 to accommodate the stacked geometry. Specifically, the first volume 200a may be serviced by a first inlet 104a and a first outlet 106a, the second volume 200b may be serviced by a second inlet 104b and a second outlet 106b, the third volume 200c may be serviced by a third inlet 104c and a third outlet 106c, and the fourth volume 200d may be serviced by a fourth inlet 104d and a fourth outlet 106d. This routing ensures that each vertically stacked volume 200 can independently receive and expel fluid, facilitating modular and controlled thermal regulation across the stacked configuration. This approach supports compact design implementations where heat loads are high and vertical integration is preferred or necessary due to spatial constraints or system architecture.

[0081] While the thermal system 100 may include four stacked volumes 200 as shown, the vertically stacked configuration may support or enable modular scalability. Accordingly, the design of the thermal system 100 may be adjusted (and a corresponding real world instance of the thermal system 100 or multiples thereof may be additively manufactured) as desired or necessary to expand or reduce the number of volumes 200 depending on application-specific thermal requirements and fluid-delivery capabilities (e.g., abilities of one or more pumps 123, cooling systems 109, conduits, or the like to deliver the working fluid 108 to the various inlets 104 at a desired pressure, temperature, flow rate, or the like).

[0082] In such vertically stacked configurations, the thermal system 100 may include an upper wall 116 and a lower wall 118 that enclose the stack of volumes 200. Between these, various intermediate walls (e.g., a first intermediate wall 1300a, a second intermediate wall 1300b, and a third intermediate wall 1300b) may be included to define and separate individual volumes 200.

[0083] For example, the first intermediate wall 1300a may serve as the upper wall 116 for the first volume 200a and simultaneously function as the bottom wall 118 for the second volume200b. Similarly, the second intermediate wall 1300b may act as the upper wall 116 for the second volume 200b and the bottom wall 118 for the third volume 200c, and the third intermediate wall 1300c may serve as the upper wall 116 for the third volume 200c and the bottom wall 118 for the fourth volume 200d. Thus, an alternating wall structure may continue upward through the stack, with each intermediate wall 1300a, 1300b, and 1300c structurally and functionally (e.g., thermally) bridging adjacent volumes 200. These intermediate walls 1300a, 1300b, and 1300c may contribute not only to containment of different flows of working fluid 108 but also to vertical thermal transfer through the thermal system 100 as desired for the system design, thereby supporting effective thermal management across the vertically aligned volumes 200.

[0084] One or more of the inlets 104 or outlets 106 may include a nozzle 400. The nozzles 400 may correspond to specific inlets 104 and outlets 106. For example, respective first nozzles 400a may be associated with a first inlet 104a and a first outlet 106a, respective second nozzles 400b may be associated with a second inlet 104b and a second outlet 106b, respective third nozzles 400c may be associated with a third inlet 104c and a third outlet 106c, and respective fourth nozzles 400d may be associated with a fourth inlet 104d and a fourth outlet 106d. The nozzles 400a, 400b, 400c, and 400d may each have an inner diameter that is smaller than an inner diameter of the remainder of the inlet 104 or the outlet 106 (e.g., the first portion 124 of the corresponding inlet 104 and / or the first portion 124 of the corresponding outlet 106). For example, the nozzle 400 of the inlet 104 may have an inner diameter that is two, three, or four times smaller than an inner diameter of the first portion 124 of the inlet 104. This reduction in diameter may be configured to increase fluid velocity, promote turbulence, or enhance distribution characteristics of the working fluid 108 as it enters or exits the respective volume 200. Such features may contribute to improved thermal exchange efficiency within the thermal system 100.

[0085] In selected implementations, whether arranged coplanar or in a stacked arrangement, each volume 200 may be supplied with a working fluid 108 at a different inlet temperature, enabling intentional differentiation of thermal conditions across different volumes 200. This may allow the thermal system 100 to be tailored to specific thermal demands such as maintaining separate operating temperatures for distinct functional zones (e.g., power regulation, memory, or signal processing) rather than simply responding to transient hotspots. The modular architecture supports temperature zoning tailored to operational requirements, enabling precise thermalcontrol aligned with the unique needs of each functional zone or region.

[0086] The volumes 200 arranged in a vertical stack may have a similar shape and footprint to promote uniformity and efficient integration within the thermal system 100. One or more of the volume 200 may further include one or more manifolds 1400 configured to manage the distribution and collection of the working fluid 108. For instance, a manifold 1400 may correspond to an inlet 104 to direct incoming fluid into the respective volume 200, and a separate manifold 1400 may correspond to an outlet 106 to collect and guide fluid exiting the volume 200. These manifolds 1400 may help balance flow and optimize fluid dynamics for a corresponding volume 200.

[0087] The manifolds 1400 may include channels that extend from the corresponding inlet 104 (or into the corresponding outlet 106) and form a series or corners and T-junctions. At each corner and T-junction, the flow may encounter a ninety-degree turn before splitting (or converging) and continuing through another corner and / or T-junction, establishing a repeated, tiered flow structure. This geometry may enhance distribution uniformity, promote turbulence, and facilitate controlled, multi-directional fluid routing throughout each volume 200.

[0088] Separate manifolds 1400 may be positioned to interface with the first inlet 104a and first outlet 106a corresponding to the first volume 200a, with the second inlet 104b and second outlet 106b corresponding to the second volume 200b, and with the third inlet 104c and third outlet 106c corresponding to the third volume 200c, thereby serving as fluid routing intermediaries in those volumes 200. However, the fourth volume 200d may not include corresponding manifolds 1400. Instead, the fourth inlet 104d and fourth outlet 106d may be configured to directly reach or engage the fourth volume 200d. This variation in configuration may reflect tailored performance or manufacturing considerations specific to the uppermost volume 200 in the stack.

[0089] Referring to FIGS. 18-21, in certain implementations, the thermal system 100 may be configured to utilize one or more gases (e.g., one or more inert gases, such as nitrogen) as the working fluid 108. This configuration may be particularly optimized for high-temperature, low mass flow conditions. In such cases, the properties of inert gases may offer benefits such as chemical stability, low reactivity with system materials, and efficient thermal transfer at elevated temperatures. These features can enhance system performance and reliability in demanding operational environments.

[0090] In selected implementations where the working fluid a gas or combination of gases, the thermal system 100 may retain the same sealed, monolithic construction and internal turbulence-driven thermal regulation features described for liquid-cooled configurations of the thermal system 100. However, instead of using microchannel flow paths defined or directed by elongated conduction members 204 to induce turbulence, the gas-cooled version may employ a series of shaped internal cavity features - such as patterned voids or projections -configured to generate localized gas-phase impingement and turbulence. Thus, the conduction members 204 in such implementations may not define or direct the flow of the working fluid 108 in continuous microchannels but may form or be discrete features that create internal disruption of flow of the working fluid 108. This geometry may enables effective thermal management in high- temperature environments using inert gas flow, while operating under the same structural and thermodynamic principles.

[0091] The internal layout of the conduction members 204 within the thermal system 100 may be further customized based on the thermal signature or heat map of the target surface or component. This enables precision cooling of localized hotspots through geometry control achieved by additive manufacturing. Such customization may allow the internal passages to be selectively shaped and oriented to maximize thermal performance where it is most critically needed, thereby improving the efficiency and responsiveness of the thermal system 100.

[0092] In selected implementations (e.g., when designed for use with inert gas such as nitrogen), the thermal system 100 may include conductive members 204 having a star-shaped cross section. These conductive members 204 may be characterized by a width 2000 that is multiple times less than their height (e.g., than the thickness 402 of the corresponding volume 200). This aspect ratio may enhance the thermal exchange between the conductive members 204 and the gas passing through the volume 200.

[0093] Referring to FIGS. 22-24, in implementations involving working fluids 108 such as an inert gas (e.g., nitrogen), the thermal system 100 may include multiple volumes 200 to improve performance. Each such volume (e.g., a first volume 200a and a second volume 200b) may be accessed by or in fluid communication with one or more corresponding inlets 104 and one or more corresponding outlets 106 (e.g., a first inlet 104a, a second inlet 104b, two instances of a first outlet 106a, and two instances of a second outlet 106b).

[0094] In certain implementations, the volumes 200 may be divided by one or more internaldividers 800. Alternatively, a single larger volume 200 may not be subdivided into internal chambers or sections (e.g., the one or more internal dividers 800 may be omitted) but may still support the establishment of discrete flow zones. For example, the first outlets 106a may be positioned upstream of the second inlet 104b, such that to a large degree the working fluid 108 exits the first region of the volume 200 before new fluid enters a second region. This arrangement can promote directional flow progression and staged thermal interaction across different areas of the volume 200, effectively creating functional subregions within a continuous volume. Such configurations allow tailored thermal management strategies while maintaining a simplified monolithic volume structure.

[0095] Referring to FIG. 25, a method 2500 for implementing the thermal system 100 may include determining 2502 a thermal output of a device, designing 2504 the thermal system 100 with an estimated heat removal rate selected to approximately meet the thermal output of the device, determining 2506 a thermal regulation of the device with the thermal system 100, and adjusting 2508 the thermal system 100 in an iterative manner to provide the desired thermal regulation of the device. The device may be the heat-generating device as described above. Computer aided design (CAD) and computerized thermal analysis and simulation (e.g., computation fluid dynamics (CFD), etc.) may be used to implement the method 2500 or one or more steps thereof.

[0096] Determining 2502 a thermal output of the device without the thermal system 100 may include creating or obtaining a thermal map. For example, a thermal map of the device may be constructed by observing the device (e.g., infrared radiation output by the device), by computer simulations, or by some other method. Such a thermal map may be used to determine how much heat is generated by the device and at which location of the device the heat is concentrated.

[0097] Designing 2504 the thermal system 100 may include designing based on the principles described above. For example, the thermal system 100 may be designed to include a certain number of the conductive members 204. As another example, the thermal system 100 may be designed to position the conductive members 204 at certain locations and / or orientations. As another example, the thermal system 100 may be designed such the thickness 402 of the volume 200 has a certain value. As another example, the thermal system 100 may be designed to include or exclude the angular regions 208. As another example, the thermal system 100 may bedesigned to employ certain fluids as the working fluid 108. As another example, the thermal system 100 may be designed to maintain a certain Reynolds number in the working fluid 108.

[0098] In selected implementations, the thermal system 100 may be employed for electronics cooling, radar thermal shielding, or aerospace thermal regulation across variable load environments. These use cases may benefit from the modularity, precise flow zoning, and geometry-driven thermal targeting that may be provided by the thermal system 100. By adapting (e.g., designing 2504) the structure and thermal pathways, the thermal system 100 may be tailored to protect sensitive electronic components, manage heat loads from high-power radar emissions, or maintain thermal stability across fluctuating aerospace operational profiles.

[0099] Determining 2506 the thermal regulation of the device with the thermal system 100 applied may involve creating or obtaining a thermal map of the device with the thermal system 100 applied thereto. Such a map may be constructed by observing the device (e g., infrared radiation of the device), by computerized simulations, or by some other method. Such a thermal map may be used to determine how much heat is generated by the device and at which location of the device the heat is concentrated. By including the thermal system 100, the thermal regulation may be different than the thermal output corresponding to the device alone.

[0100] Although the thermal system 100 may be already have a preliminary design, there may be improvements made based on the thermal regulation observed, modeled, or otherwise determined 2506. Accordingly, adjusting 2508 may further improve the efficacy of the thermal system 100 at dissipating the heat generated by the device. The thermal system 100 may be adjusted based on the principles described above. For example, the thermal system 100 may be adjusted to include a different number of the conductive members 204. As another example, the thermal system 100 may be adjusted to change the position of the conductive members 204. As another example, the thermal system 100 may be adjusted to change the thickness 402 of the volume 200. As another example, the thermal system 100 may be adjusted to include or exclude the angular regions 208. As another example, the thermal system 100 may be adjusted to change the working fluid 108. As another example, the thermal system 100 may be adjusted to maintain a different Reynolds number in the working fluid 108.

[0101] After the adjusting 2508, the thermal regulation of the device by the adjusted version of the thermal system 100 may be determined 2506. Thereafter, the thermal system 100 may beagain adjusted as desired or necessary. Thus, the determining 2506 and adjusting 2508 may be performed iteratively until the desired thermal regulation of the device is achieved.

[0102] An example of the foregoing may be a thermal system comprising a plate.

[0103] The example may include one or more functions or structures set forth above combined with the plate being monolithically formed to include an upper wall.

[0104] The example may include one or more functions or structures set forth above combined with the plate being monolithically formed to include a lower wall.

[0105] The example may include one or more functions or structures set forth above combined with sides connecting the upper wall to the lower wall.

[0106] The example may include one or more functions or structures set forth above combined with the sides defining a first interior volume within the plate at a location between the upper wall and the lower wall.

[0107] The example may include one or more functions or structures set forth above combined with conductive members being spaced from one another.

[0108] The example may include one or more functions or structures set forth above combined with the conductive members extending from at least one of the upper wall or the lower wall.

[0109] The example may include one or more functions or structures set forth above combined with the conductive members defining a shape of the first interior volume.

[0110] The example may include one or more functions or structures set forth above combined with a first inlet being monolithically formed with the plate.

[0111] The example may include one or more functions or structures set forth above combined with the first inlet obtaining fluid communication with the first interior volume.

[0112] The example may include one or more functions or structures set forth above combined with a first outlet being monolithically formed with the plate.

[0113] The example may include one or more functions or structures set forth above combined with the first outlet obtaining fluid communication with the first interior volume.

[0114] The example may include one or more functions or structures set forth above combined with the plate, inlet, and outlet comprising a monolithic formation of metal or metal alloy.

[0115] The example may include one or more functions or structures set forth abovecombined with the plate comprising an intermediate wall located between the upper wall and the lower wall.

[0116] The example may include one or more functions or structures set forth above combined with the sides connecting the upper wall to the intermediate wall.

[0117] The example may include one or more functions or structures set forth above combined with the sides connecting the lower wall to the intermediate wall.

[0118] The example may include one or more functions or structures set forth above combined with the sides defining the first interior volume at a location between the lower wall and the intermediate wall.

[0119] The example may include one or more functions or structures set forth above combined with the sides defining a second interior volume at a location between the intermediate wall and the upper wall.

[0120] The example may include one or more functions or structures set forth above combined with a second inlet being monolithically formed with the plate.

[0121] The example may include one or more functions or structures set forth above combined with the second inlet obtaining fluid communication with the second interior volume.

[0122] The example may include one or more functions or structures set forth above combined with a second outlet being monolithically formed with the plate.

[0123] The example may include one or more functions or structures set forth above combined with the second outlet obtaining fluid communication with the second interior volume.

[0124] The example may include one or more functions or structures set forth above combined with the plate being monolithically formed to include a second interior volume located between the upper wall and the lower wall.

[0125] The example may include one or more functions or structures set forth above combined with a second inlet being monolithically formed with the plate.

[0126] The example may include one or more functions or structures set forth above combined with the second inlet obtaining fluid communication with the second interior volume.

[0127] The example may include one or more functions or structures set forth above combined with a second outlet being monolithically formed with the plate.

[0128] The example may include one or more functions or structures set forth above combined with the second outlet obtaining fluid communication with the second interior volume.

[0129] An example of the foregoing may be a thermal system comprising a plate.

[0130] The example may include one or more functions or structures set forth above combined with the plate comprising an upper wall.

[0131] The example may include one or more functions or structures set forth above combined with the plate comprising a lower wall.

[0132] The example may include one or more functions or structures set forth above combined with sides connecting the upper wall to the lower wall to define an interior volume.

[0133] The example may include one or more functions or structures set forth above combined with conductive members spaced apart throughout the interior volume.

[0134] The example may include one or more functions or structures set forth above combined with the conductive members extending from the upper wall to the lower wall.

[0135] The example may include one or more functions or structures set forth above combined with an inlet in fluid communication with the interior volume.

[0136] The example may include one or more functions or structures set forth above combined with an outlet in fluid communication with the interior volume.

[0137] The example may include one or more functions or structures set forth above combined with the outlet being monolithically formed with the plate and the inlet.

[0138] The example may include one or more functions or structures set forth above combined with a pump connected to urge fluid into the inlet.

[0139] The example may include one or more functions or structures set forth above combined with the fluid in the interior volume (e.g., within each interior volume) within the thermal system being capable of absorbing about 2.5 kW to about 2.92 kW at a flow rate (e.g., liquid flow rate) of about 14 mL / sec.

[0140] The example may include one or more functions or structures set forth above combined with the inlet including a nozzle configured to increase a velocity of the fluid as it enters the interior volume.

[0141] The example may include one or more functions or structures set forth above combined with the nozzle of the inlet and the conductive members being configured to cooperatively induce turbulent flow in the fluid.

[0142] The example may include one or more functions or structures set forth above combined with the turbulent flow occurring as the fluid travels through the interior volume fromthe inlet to the outlet.

[0143] The example may include one or more functions or structures set forth above combined with the sides comprising a series of angular regions.

[0144] The example may include one or more functions or structures set forth above combined with the nozzle of the inlet, the conductive members, and the angular regions being configured to cooperatively induce turbulent flow in the fluid.

[0145] The example may include one or more functions or structures set forth above combined with the turbulent flow being induced as the fluid travels through the interior volume from the inlet to the outlet.

[0146] The example may include one or more functions or structures set forth above combined with the pump urging the fluid at a rate corresponding to a Reynolds number greater than about 3000.

[0147] The example may include one or more functions or structures set forth above combined with each of the conductive members having an elongated shape.

[0148] The example may include one or more functions or structures set forth above combined with the elongated shape including a length dimension along the upper wall that is greater than a width dimension along the upper wall.

[0149] The example may include one or more functions or structures set forth above combined with each of the conductive members having a star-shaped cross-section.

[0150] The example may include one or more functions or structures set forth above combined with the star-shaped cross-section being defined with respect to a plane that extends between the upper wall and the lower wall.

[0151] The example may include one or more functions or structures set forth above combined with the plate, the inlet, and the outlet comprising a single unit of material.

[0152] The example may include one or more functions or structures set forth above combined with the single unit of material being monolithically formed in an additive manufacturing process.

[0153] The example may include one or more functions or structures set forth above combined with the fluid used in the thermal system being deionized water.

[0154] While the disclosure has been described in connection with certain implementations, it is to be understood that the disclosure is not to be limited to the disclosed implementations but,on the contrary, is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims, which scope is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures as is permitted under the law.

Claims

What is claimed is:

1. A thermal system comprising: a plate monolithically formed to include an upper wall, a lower wall, sides connecting the upper wall to the lower wall and defining a first interior volume within the plate at a location between the upper wall and the lower wall; and conductive members spaced from one another and extending from at least one of the upper wall or the lower wall to define a shape of the first interior volume; a first inlet monolithically formed with the plate to obtain fluid communication with the first interior volume; and a first outlet monolithically formed with the plate to obtain fluid communication with the first interior volume.

2. The thermal system of claim 1, wherein the plate, inlet, and outlet comprise a monolithic formation of metal or metal alloy.

3. The thermal system of claim 2, wherein: the plate comprises an intermediate wall located between the upper wall and the lower wall; and the sides connect the upper wall to the intermediate wall, connect the lower wall to the intermediate wall, define the first interior volume within the plate at a location between the lower wall and the intermediate wall, and define a second interior volume within the plate at a location between the intermediate wall and the upper wall.

4. The thermal system of claim 3, further comprising: a second inlet monolithically formed with the plate to obtain fluid communication with the second interior volume; and a second outlet monolithically formed with the plate to obtain fluid communication with the second interior volume.

5. The thermal system of claim 2, wherein the plate is monolithically formed to include a second interior volume located between the upper wall and the lower wall.

6. The thermal system of claim 5, further comprising: a second inlet monolithically formed with the plate to obtain fluid communication with the second interior volume; and a second outlet monolithically formed with the plate to obtain fluid communication with the second interior volume.

7. A thermal system comprising: a plate comprising an upper wall, a lower wall, sides connecting the upper wall to the lower wall to define an interior volume therewithin, and conductive members spaced apart throughout the interior volume and extending from the upper wall to the lower wall; an inlet in fluid communication with the interior volume; and an outlet in fluid communication with the interior volume, wherein the outlet is monolithically formed with the plate and the inlet; and a pump connected to urge a fluid into the inlet.

8. The thermal system of claim 7, wherein the inlet includes a nozzle configured to increase a velocity of the fluid as the fluid enters the interior volume.

9. The thermal system of claim 8, wherein the nozzle and the conductive members are configured to cooperatively induce turbulent flow in the fluid as the fluid travels through the interior volume from the inlet to the outlet.

10. The thermal system of claim 9, wherein: the sides comprise a series of angular regions; and the nozzle of the inlet, the conductive members, and the angular regions are configured to cooperatively induce turbulent flow in the fluid as the fluid travels through the interior volume from the inlet to the outlet.

11. The thermal system of claim 7, wherein the pump is configured to urge the fluid into the inlet at a rate corresponding to a Reynolds number greater than about 3000.

12. The thermal system of claim 7, wherein the conductive members each have an elongated shape such that a length dimension along the upper wall is greater than a width dimension along the upper wall.

13. The thermal system of claim 7, wherein each of the conductive members have a starshaped cross-section with respect to a plane that extends between the upper wall and the lower wall.

14. The thermal system of claim 7, wherein the plate, the inlet, and the outlet comprise a single unit of material monolithically formed in an additive manufacturing process.

15. The thermal system of claim 7, wherein the fluid comprises deionized water.

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