Heat dissipation package structure and electronic device

Abstract

The present application provides a heat dissipation package structure and an electronic device. The heat dissipation package structure comprises a circuit board and a heat sink. A chip is provided on the circuit board, and a surface of the chip is coated with a liquid metal. The heat sink is disposed on the side of the chip away from the circuit board, the heat sink is in contact with the chip by means of the liquid metal, and the liquid metal is used to transfer heat of the chip to the heat sink. An outer periphery of the chip is provided with a first sealing frame, the outer periphery of the first sealing frame is provided with a second sealing frame, the first sealing frame is used to seal the chip and the liquid metal, and the second sealing frame is used to isolate the structure from external air. In the present application, the first sealing frame is an inner ring sealing frame, the second sealing frame is an outer ring sealing frame, and the first sealing frame prevents the liquid metal from flowing out. The second sealing frame can have the function of further protecting and sealing, to isolate the structure from moisture entering and prevent the liquid metal from being in contact with air and oxidizing, so that long-term sealing of the liquid metal is implemented, the structure is isolated from moisture infiltration and corrosion, and liquid leakage is avoided, thereby improving the long-term heat dissipation performance of a system.

Description

A heat dissipation packaging structure and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410822119.0, filed on June 24, 2024, with the State Intellectual Property Office of China, and the Chinese patent application No. 202410822119.0 has the title of “A heat dissipation packaging structure and electronic device”, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of heat dissipation of electronic devices, and more particularly to a heat dissipation packaging structure and electronic device. BACKGROUND

[0003] In order to improve the heat dissipation of the chip of the electronic device, a high-performance heat-conducting material is generally used between the chip and the heat sink to meet the high-density heat dissipation requirements of the electronic device. Therefore, as a thermal interface material with high thermal conductivity and ultra-low application thermal resistance, liquid metal has begun to be gradually applied to electronic devices. The commonly used liquid metal is usually gallium-based liquid metal, which is easy to have an oxidation reaction with oxygen / water vapor and is easy to corrode with metals such as aluminum and copper, ultimately leading to the deterioration of the heat conduction performance. Therefore, in actual application, sealing protection is required to achieve the effects of oxidation resistance and leakage prevention.

[0004] At present, the sealing scheme of the liquid metal has high requirements for the barrier property of the sealing material, large requirements for the structure space, and high requirements for the locking force; and such a sealing scheme is easy to be affected by moisture infiltration, mechanical vibration, and long-term sealing pressure reduction, resulting in long-term sealing failure of the system, liquid leakage, and reduced heat dissipation efficiency. SUMMARY

[0005] The present application provides a heat dissipation packaging structure and electronic device, which can realize long-term sealing of liquid metal, isolate moisture infiltration corrosion and liquid leakage, and improve the long-term heat dissipation performance of the system.

[0006] In a first aspect, a heat dissipation packaging structure is provided, which comprises: a circuit board and a heat sink, the circuit board is provided with a chip, the surface of the chip is coated with liquid metal; the heat sink is arranged on the side of the chip away from the circuit board, the heat sink is in contact with the chip through the liquid metal, and the liquid metal is used to transfer the heat of the chip to the heat sink; wherein the outer periphery of the chip is provided with a first sealing frame, the outer periphery of the first sealing frame is provided with a second sealing frame, the first sealing frame is used to seal the chip and the liquid metal, and the second sealing frame is used to isolate the external air from entering the first sealing frame to prevent the external air from entering the first sealing frame and having an oxidation reaction with the liquid metal inside.

[0007] It should be understood that the heat sink is made of metal (such as copper, aluminum, etc.), which can mainly play a role of heat dissipation. The chip in the embodiments of the present application can be replaced by a heating element, that is, the heat dissipation packaging structure of the present application can be applied to heat dissipation of other heating elements in addition to the chip.

[0008] In the embodiments of the present application, the first sealing frame acts as an inner ring sealing frame, and the second sealing frame acts as an outer ring sealing frame. The first sealing frame plays a role of first protective sealing to prevent the liquid metal inside the first sealing frame from flowing out. The second sealing frame can play a role of re-protective sealing to prevent the liquid metal overflowing out of the first sealing frame from continuing to overflow outwards and thus damaging the surrounding components. In addition, the second sealing frame can also play a role of isolating moisture to prevent the liquid metal overflowing out of the first sealing frame from being in contact with air to cause an oxidation reaction. Ultimately, long-term sealing of the liquid metal can be achieved, moisture infiltration corrosion and leakage of the liquid metal can be isolated, the service life of the liquid metal can be prolonged, and the long-term heat dissipation performance of the chip can also be improved to meet the high-density heat dissipation requirements of the chip.

[0009] In combination with the first aspect, in some implementations of the first aspect, a ratio of the sealed space surrounded by the first sealing frame to the amount of the liquid metal is greater than 2.

[0010] For example, the ratio of the sealed space surrounded by the first sealing frame to the amount of the liquid metal can be between 2.5 and 3. While ensuring the heat dissipation performance of the system, the amount of the liquid metal can also be prevented from being too much to cause leakage.

[0011] In the embodiments of the present application, the amount and cost of the liquid metal are comprehensively considered. The ratio of the sealed space surrounded by the first sealing frame to the amount of the liquid metal can be greater than 2, and further can be between 2.5 and 3.

[0012] In combination with the first aspect, in some implementations of the first aspect, the width of the first sealing frame is greater than 1 mm, and / or the width of the second sealing frame is greater than 1 mm.

[0013] For example, the width of the first sealing frame and / or the second sealing frame can be greater than 2 mm.

[0014] In the embodiments of the present application, by limiting the width of the first sealing frame and / or the second sealing frame to be greater than 1 mm, the effect of sealing can be avoided due to too narrow width, and the appropriate width can play a role of isolating moisture sealing, and at the same time, it will not produce too much pressure, which is helpful to stably improve the heat dissipation performance of the system.

[0015] In combination with the first aspect, in some implementations of the first aspect, the first sealing frame and / or the second sealing frame is sealing glue, a sealing ring, or sealing foam.

[0016] For example, in order to consider the repair requirements of the machine, the first sealing frame and / or the second sealing frame can select a protective sealing foam. The material of the protective sealing foam includes silica gel foam, polyethylene foam, polyester foam, rubber foam, etc.

[0017] For example, in order to consider the aging resistance, resilience and rebound force, the first sealing frame and / or the second sealing frame can select silica gel foam.

[0018] For example, the first sealing frame and / or the second sealing frame can adopt a protective sealing foam material, and the microstructure thereof includes a closed pore structure, an open pore structure, and a semi-open pore structure. Considering the protection sealing requirements and the rebound force requirements, the first sealing frame and / or the second sealing frame can select a protective sealing foam with a semi-open pore structure or a closed pore structure.

[0019] In some implementations of the first aspect, the first sealing frame and / or the second sealing frame has an open pore structure or a semi-open pore structure, and the protective sealing material adopted by the first sealing frame and / or the second sealing frame has a compression rate greater than 20%.

[0020] For example, the compression rate of the protective sealing material adopted by the first sealing frame and / or the second sealing frame can be between 40% and 65%, or between 35% and 60%.

[0021] In the embodiments of the present application, if the first sealing frame and / or the second sealing frame adopts an open pore structure or a semi-open pore structure, the protective material is required to have a certain degree of compression rate, and the pores of the protective material can be closed during compression, thereby preventing water vapor leakage and avoiding oxidation reaction with liquid metal.

[0022] In some implementations of the first aspect, the surface of the position where the heat sink contacts the liquid metal has a phosphorus-nickel plating layer, and the content of phosphorus in the phosphorus-nickel plating layer is greater than or equal to 3wt%. That is, the weight percentage of phosphorus in the phosphorus-nickel plating layer is greater than or equal to 3%.

[0023] For example, the content of phosphorus in the phosphorus-nickel plating layer can be greater than or equal to 9wt%.

[0024] In the embodiments of the present application, in order to prevent metal corrosion phenomenon from occurring when the heat sink directly contacts the liquid metal, the heat sink can be subjected to anti-corrosion plating treatment. For example, a phosphorus-nickel plating layer can be arranged on the surface of the position where the heat sink contacts the liquid metal. That is, by arranging a phosphorus-nickel plating layer on the surface of the position where the heat sink contacts the liquid metal, or by arranging a layer of phosphorus-nickel plating layer on the surface of the heat sink, the metal corrosion phenomenon caused by the direct contact between the heat sink and the liquid metal can be prevented, thereby affecting the heat dissipation efficiency of the chip.

[0025] With reference to the first aspect, in some implementations of the first aspect, the first sealing frame and the second sealing frame are tightly attached between the circuit board and the heat sink.

[0026] In the embodiments of the present application, the first sealing frame and the second sealing frame can be tightly attached between the circuit board and the heat sink, that is, one end of the first sealing frame and the second sealing frame is tightly attached to the circuit board, and the other end of the first sealing frame and the second sealing frame is tightly attached to the heat sink, so that the chip and the liquid metal are in a completely sealed space, moisture infiltration corrosion and leakage of the liquid metal are isolated, and the service life of the liquid metal is prolonged.

[0027] With reference to the first aspect, in some implementations of the first aspect, the heat dissipation package structure further comprises a chip substrate, the chip substrate is arranged on the circuit board, and the chip is arranged on a side of the chip substrate away from the circuit board.

[0028] In the embodiments of the present application, considering that the surface of the circuit board can be uneven, a chip substrate can be arranged on the circuit board, the chip substrate can provide a flat surface, and the chip can be mounted on the chip substrate to facilitate the mounting stability of the chip.

[0029] With reference to the first aspect, in some implementations of the first aspect, the first sealing frame and the second sealing frame are tightly attached between the chip substrate and the heat sink.

[0030] In the embodiments of the present application, when the chip substrate is arranged, the first sealing frame and the second sealing frame can be tightly attached between the chip substrate and the heat sink, that is, one end of the first sealing frame and the second sealing frame is tightly attached to the chip substrate, and the other end of the first sealing frame and the second sealing frame is tightly attached to the heat sink, so that the chip and the liquid metal are in a completely sealed space, moisture infiltration corrosion and leakage of the liquid metal are isolated, and the service life of the liquid metal is prolonged.

[0031] With reference to the first aspect, in some implementations of the first aspect, the first sealing frame is tightly attached between the chip substrate and the heat sink, and the second sealing frame is tightly attached between the circuit board and the heat sink.

[0032] In the embodiments of the present application, when the chip substrate is arranged, the first sealing frame can be tightly attached between the chip substrate and the heat sink, and the second sealing frame is tightly attached between the circuit board and the heat sink. That is, one end of the first sealing frame is tightly attached to the chip substrate, the other end of the first sealing frame is tightly attached to the heat sink, one end of the second sealing frame is tightly attached to the circuit board, and the other end of the second sealing frame is tightly attached to the heat sink, so that the chip and the liquid metal are in a completely sealed space, moisture infiltration corrosion and leakage of the liquid metal are isolated, and the service life of the liquid metal is prolonged.

[0033] With reference to the first aspect, in some implementations of the first aspect, the heat dissipation package structure further includes elastic arms, one end of each of the elastic arms is fixed on a side of the heat sink away from the circuit board, and the other end of each of the elastic arms is used to lock the heat sink on the circuit board.

[0034] In the embodiments of the present application, the structure layout of the elastic arms is adopted, and the height of the entire heat dissipation package structure is reduced to a certain extent, meeting the light and thin development trend of electronic devices. The first sealing frame and the second sealing frame are compressed by the transverse elastic arm structure, improving the sealing reliability of the first sealing frame and the second sealing frame under long-term compression. In addition, the sealing pressure can be changed by adjusting the length and rigidity of the elastic arms, and the system stacking space is reduced.

[0035] For example, the number of elastic arms can be multiple, for example, multiple elastic arms can be arranged at the edge regions of the four sides of the heat sink. By arranging multiple elastic arms, the heat sink can be locked on the circuit board, and the first sealing frame and the second sealing frame located between the circuit board and the heat sink can also be extruded and in a state of extrusion, thereby avoiding the oxidation reaction of water vapor and liquid metal through the pores of the first sealing frame and the second sealing frame.

[0036] It should be understood that through the structure layout of the elastic arms, the length adjustment of the elastic arms can realize the compression sealing of different compression rate sealing materials, and can realize constant compression force under long-term compression of the sealing material, thereby playing a long-term sealing function. By adjusting the arm length, material and rigidity of the elastic arms, the problem of limited system height layout space is solved, and the development needs of light and thin electronic devices are met.

[0037] With reference to the first aspect, in some implementations of the first aspect, the heat dissipation package structure further includes a fastener and a connecting piece, the connecting piece is fixed on the circuit board, and the fastener is used to fix the elastic arm on the connecting piece. For example, the fastener can be a screw, and the connecting piece can be a nut.

[0038] In the embodiments of the present application, the connecting piece (such as a nut) can be arranged on the circuit board, and the fastener (such as a screw) can be fixedly connected with the nut on the circuit board, so as to realize the fixed connection of the heat sink and the circuit board, so that the first sealing frame and the second sealing frame are in a compressed state, thereby avoiding the oxidation reaction of water vapor and liquid metal through the pores of the first sealing frame and the second sealing frame.

[0039] With reference to the first aspect, in some implementations of the first aspect, the heat dissipation package structure further includes a fastener and a connecting piece, the connecting piece is fixed on the circuit board, and the fastener is used to fix the elastic arm on the connecting piece. For example, the fastener can be a screw, and the connecting piece can be a nut.

[0040] In the embodiments of the present application, in order to better realize the heat sink of different structures and to improve the connection stability of the heat sink and the circuit board, when the heat sink includes the extension part, the fastener (such as a screw) can be sequentially threaded through the first through hole of the extension part and the second through hole of the elastic arm to realize the fixed connection with the circuit board.

[0041] In a second aspect, an electronic device is provided, which includes the heat dissipation packaging structure of the first aspect or any implementation manner of the first aspect.

[0042] In the embodiments of the present application, when the electronic device adopts the heat dissipation packaging structure of the first aspect, the electronic device can have good heat dissipation effect, and the high-density heat dissipation requirement of the electronic device can be met. BRIEF DESCRIPTION OF DRAWINGS

[0043] FIG. 1 is a schematic diagram of the overall structure of a heat dissipation packaging structure according to an embodiment of the present application.

[0044] FIG. 2 is a schematic diagram of the local structure of a heat dissipation packaging structure according to an embodiment of the present application.

[0045] FIG. 3 is a schematic diagram of the local structure of a heat dissipation packaging structure according to an embodiment of the present application.

[0046] FIG. 4 is a schematic diagram of the cross section of a heat dissipation packaging structure according to an embodiment of the present application.

[0047] FIG. 5 is a schematic diagram of the cross section of another heat dissipation packaging structure according to an embodiment of the present application.

[0048] FIG. 6 is a schematic diagram of the cross section of another heat dissipation packaging structure according to an embodiment of the present application.

[0049] FIG. 7 is a schematic diagram of the cross section of another heat dissipation packaging structure according to an embodiment of the present application.

[0050] FIG. 8 is a schematic diagram of the cross section of another heat dissipation packaging structure according to an embodiment of the present application.

[0051] FIG. 9 is a schematic diagram of the cross section of another heat dissipation packaging structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] The technical solutions in the present application will be described below with reference to the drawings.

[0053] It should be noted that, in the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; "and / or" in this paper only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone.

[0054] The terms "first", "second", and the like in the description of embodiments of the application do not necessarily imply that the corresponding parts are necessarily in any sequential order, but are used for distinguishing between two independent parts. Further, the terms "comprises", "comprising", "includes", "including" and the like are to be construed open-ended, meaning that they are used to describe only an exclusionary textual scope and not a restrictive textual scope, unless otherwise indicated herein or specifically stated to the contrary. It is intended that the phrase "and / or" where used herein is to represent that there is no intent to limit the construct to only conjunctive combinations, and that disjunctive combinations are to be specifically recognized as within the scope of the claims.

[0055] The description of embodiments of the application using terms such as "one embodiment", "an embodiment", or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in additional embodiments", and the like in various places in the specification are not necessarily all referring to the same embodiment, and the features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. The terms "including", "comprising", "having" and the like are meant to be interpreted open-ended, meaning that they include but are not limited to the listed recitations. The terms "coupled" and "connected" are used broadly and encompass both direct and indirect connections, as well as fixed and removable connections.

[0056] In the description of embodiments of the application, the terms "upper", "lower", "inner", "outer", and the like, are used to indicate relative positions or orientations of the components shown in the drawings, and should be understood as relative concepts, which are used for relative description and clarification, and do not indicate or imply that the device or component must have a specific orientation or be constructed and operated in a specific orientation. The device or component can be changed accordingly according to the orientation of the components shown in the drawings, and therefore should not be construed as a limitation of the application.

[0057] In the description of embodiments of the application, the same reference signs or the same component are used to indicate the same component or the same part. For the same component in the embodiments of the application, only one component or part can be labeled with a reference sign in the drawings, and it should be understood that the reference sign is also applicable to other identical components or parts. In addition, the components in the drawings are not drawn according to the actual proportions, and the size and the size of the components shown in the drawings are only exemplary, and should not be construed as a limitation of the application.

[0058] In electronic devices, in order to improve the heat dissipation of device chips, high-performance heat-conducting materials are generally used between the chips and the heat sinks to meet the high-density heat dissipation requirements of electronic devices. Therefore, liquid metal (i.e., liquid gold) as a high-thermal-conductivity, ultra-low-application-thermal-resistance thermal interface material has begun to be gradually applied to electronic products. The commonly used liquid metal is usually gallium-based liquid metal, which is prone to oxidation reaction with oxygen / water vapor and corrosion with metals such as aluminum and copper, ultimately leading to deterioration of the heat conduction performance. Therefore, in actual application, the periphery needs to be sealed and protected to achieve the effects of oxidation resistance and leakage prevention, and the device contact surface needs to be subjected to corrosion prevention treatment.

[0059] Currently, the nickel plating layer treatment of aluminum / copper heat sinks can only temporarily delay the corrosion of structural parts, and corrosion will still quickly occur in high-temperature heat dissipation scenarios. In the prior art, the sealing scheme of the liquid metal usually forms a sealed space by compressing the protective sealing material with a large-size sealing member and a heat sink screw to prevent leakage and isolation. This scheme has high requirements for the barrier property of the sealing material, requires a large structure space, and requires high locking force. Moreover, this structure scheme is easily affected by moisture infiltration, mechanical vibration, and long-term sealing pressure reduction, resulting in long-term sealing failure of the system, liquid leakage, and reduced heat dissipation efficiency.

[0060] In summary, the sealing member in the prior art cannot protect the liquid metal from the influence of moisture, especially through the penetration of an organic matrix to react with the liquid metal. After high-temperature and high-humidity testing, the flowability of the liquid metal deteriorates, the thermal performance decreases, and it is difficult to support long-term use of 5 years. To maintain the sealing effect, the sealing scheme uses screws and other large pressure fastening to compress the sealing material, which causes permanent deformation of the sealing material due to long-term compression. Sealing failure leads to liquid metal leakage. The current electronic devices are becoming increasingly light and thin, and portable, and the current sealing system scheme occupies too much stacking space, which is not conducive to system evolution design. In high-temperature heat dissipation scenarios, the nickel plating of the contact surface of the structural part temporarily delays the corrosion of the metal, and after the corrosion of the aluminum / copper heat sink interface, the heat dissipation performance deteriorates. Due to the limitations of structure space and locking force, the use of low-stress and low-thickness protective materials easily causes the liquid metal to be more severely oxidized, to overflow and leak, and to deteriorate in heat dissipation.

[0061] Therefore, the present application provides a heat dissipation packaging structure and an electronic device, which can realize long-term sealing of liquid metal, isolate moisture infiltration corrosion and liquid leakage, and improve the long-term heat dissipation performance of the system.

[0062] FIG. 1 is a schematic diagram of the overall structure of a heat dissipation packaging structure according to an embodiment of the present application. FIGS. 2 and 3 are schematic diagrams of two partial structures of the heat dissipation packaging structure according to an embodiment of the present application. FIGS. 4 to 9 are schematic diagrams of cross sections of the heat dissipation packaging structure according to an embodiment of the present application.

[0063] As can be seen from FIGS. 1-5, the heat dissipation packaging structure 100 can include a circuit board 110, a heat sink 120, a chip 130, a first sealing frame 140, a second sealing frame 150, and liquid metal 170.

[0064] The chip 130 is disposed on the circuit board 110, and the surface of the chip 130 is coated with the liquid metal 170. It should be understood that the liquid metal 170 (i.e., liquid gold) generally refers to a metal or alloy that is in a liquid state at room temperature or a lower temperature, and has characteristics such as high electrical conductivity, high thermal conductivity, low viscosity, and a wide liquid temperature range. The liquid metal 170 as a heat-conducting material can be filled between the chip 130 and the heat sink 120, and plays a role in reducing the application thermal resistance and rapidly transferring heat.

[0065] The heat sink 120 is disposed on the side of the chip 130 away from the circuit board 110, and the heat sink 120 is in contact with the chip 130 through the liquid metal 170. The heat generated by the chip 130 can be transferred to the heat sink 120 through the liquid metal 170 for heat dissipation. By providing the liquid metal 170, the heat transfer can be accelerated, and the heat dissipation efficiency can be improved.

[0066] The first sealing frame 140 is disposed on the outer periphery of the chip 130, and the second sealing frame 150 is disposed on the outer periphery of the first sealing frame 140. The first sealing frame 140 is used to seal the chip 130 and the liquid metal 170, and the second sealing frame 150 is used to isolate external air to prevent the external air from entering the first sealing frame 140 and reacting with the liquid metal 170 inside the first sealing frame 140.

[0067] It should be understood that the first sealing frame 140 is an inner ring sealing frame, and the second sealing frame 150 is an outer ring sealing frame. The first sealing frame 140 plays a role of a first layer of protective sealing to prevent the liquid metal 170 inside the first sealing frame 140 from flowing out. The second sealing frame 150 can play a role of a second layer of protective sealing to prevent the liquid metal 170 that has overflowed out of the first sealing frame 140 from continuing to overflow outward and damaging surrounding components.

[0068] It should be noted that the heat sink 120 is fixed on the circuit board 110 by a conventional locking method, and there is still an assembly gap, which cannot effectively hinder the flow and leakage of the liquid metal 170, and cannot block oxygen and water vapor, so as to possibly aggravate the oxidation and thermal resistance degradation of the liquid metal 170, and thus a sealing material needs to be used for protection. In addition, the liquid metal 170, water vapor and oxygen will all have an oxidation reaction, generate fluffy and porous oxides, and have a volume expansion effect, and the unoxidized liquid metal is squeezed out to the edge position, which has a risk of overflow and damages the surrounding components. Therefore, the structure design of protection greatly affects the penetration of water vapor and oxygen, directly affects the leakage risk and the service life of the liquid metal. If a single-layer sealing scheme is used, the long-term compression permanent deformation resistance of the protective material is poor, and the open hole structure of the protective material greatly increases the risk of oxidation and leakage of the liquid metal.

[0069] Therefore, the present application sets a multi-layer protection sealing structure, that is, a double-layer sealing structure of the first sealing frame 140 and the second sealing frame 150, which can isolate moisture, prevent the liquid metal 170 from contacting air to have an oxidation reaction, realize long-term sealing of the liquid metal 170, isolate moisture infiltration corrosion and leakage of the liquid metal 170, prolong the service life of the liquid metal 170, and improve the long-term heat dissipation performance of the chip 130.

[0070] In some examples, considering that the material of the heat sink 120 directly contacting the liquid metal 170 is usually aluminum or copper, the aluminum / copper is easy to form an alloy layer with the gallium element in the liquid metal 170, so that the metal corrosion phenomenon of the heat sink 120 occurs, which finally causes the surrounding components to fail, short circuit or burn out, and thus the direct contact area of the heat sink 120 and the liquid metal 170 needs to be treated for corrosion prevention.

[0071] Optionally, to prevent the metal corrosion phenomenon of the heat sink 120 directly contacting the liquid metal 170, the heat sink 120 can be treated for corrosion prevention plating. For example, the surface of the position of the heat sink 120 contacting the liquid metal 170 can be provided with a corrosion prevention plating layer (such as a phosphorus nickel plating layer), and the content of phosphorus in the phosphorus nickel plating layer is greater than or equal to 3wt%, that is, the weight percentage of the content of phosphorus in the phosphorus nickel plating layer is greater than or equal to 3%.

[0072] Optionally, to effectively slow down the corrosion of the aluminum / copper heat sink 120 at high temperature, the content of phosphorus in the phosphorus nickel plating layer can be greater than or equal to 9wt%, that is, the weight percentage of the content of phosphorus in the phosphorus nickel plating layer is greater than or equal to 9%.

[0073] For example, the surface roughness Ra of the heat sink 120 can be less than 1.6. It should be understood that if the surface roughness of the heat sink 120 is too large, it may affect the coating effect of the liquid metal 170, thereby affecting the heat dissipation performance, and therefore the surface roughness of the heat sink 120 can be limited.

[0074] In some examples, the protective material used by the first sealing frame 140 and / or the second sealing frame 150 can be sealing glue, a sealing ring, or sealing foam.

[0075] For example, in order to take into account the repair requirements of the machine, the first sealing frame 140 and / or the second sealing frame 150 can select a protective sealing foam. The material of the protective sealing foam includes silica gel foam, polyethylene foam (such as PE foam, EVA foam), polyester foam (such as polyether foam, polyurethane foam), rubber foam (such as EPDM, CR, NR, SBR), etc.

[0076] For example, considering aging resistance, resilience, and rebound force, the first sealing frame 140 and / or the second sealing frame 150 can select silica gel foam.

[0077] For example, the first sealing frame 140 and / or the second sealing frame 150 can use a protective sealing foam material, and the microstructure thereof can include a closed cell structure, an open cell structure, and a semi-open cell structure.

[0078] It should be understood that the open cell structure, the semi-open cell structure, and the closed cell structure are three types of internal pore characteristics of porous materials described in material science, which have an important influence on the performance of the material (such as water absorption, thermal insulation, mechanical strength, etc.).

[0079] In open cell structure materials (such as polyurethane foam), the pores are interconnected, forming an open network. This means that if one end of the material is in contact with a liquid, the liquid can penetrate through the pores to other parts of the material. Materials of this structure usually have good moisture absorption, air permeability, and elasticity, but because liquid and gas can flow freely, their waterproofness and thermal insulation performance are poor.

[0080] Semi-open cell structure is an intermediate form between open cell structure and closed cell structure, in which some pores are interconnected, while other pores are closed. This structure provides a certain degree of liquid and gas permeability, while also having certain barrier properties, and can strike a balance between air permeability and waterproofness. Materials with semi-open cell structure are applied in special applications and may appear in some specially treated foams or natural materials.

[0081] Each pore in the closed-cell structure material (such as polyethylene foam, polyisocyanurate foam) is independently closed and does not communicate with other pores, forming many tiny bubbles or cavities. This structure gives the material excellent waterproof, thermal insulation and buoyancy performance, because the gas in the bubble cannot flow freely, and the external liquid is difficult to penetrate. Closed-cell foam is a typical representative, widely used in building insulation, water sports equipment, refrigeration boxes and packaging materials and other fields.

[0082] In consideration of the protection sealing requirement and the rebound force requirement, the first sealing frame 140 and / or the second sealing frame 150 can select a semi-open cell structure or a closed cell structure of the protection sealing foam.

[0083] In some examples, if the first sealing frame 140 and / or the second sealing frame 150 adopts an open cell structure or a semi-open cell structure, the compression rate of the protection sealing material adopted by the first sealing frame 140 and / or the second sealing frame 150 can be greater than 20%. It should be understood that if an open cell structure or a semi-open cell structure is adopted, the protection material is required to have a certain degree of compression rate, and the pores of the protection material can be closed when compressed, so as to prevent water vapor leakage and avoid oxidation reaction with the liquid metal 170 in the first sealing frame 140.

[0084] For example, in consideration of the influence of the material rebound force on the interface crimping effect, the compression rate of the protection sealing material can be selected between 40% and 65%, or between 35% and 60%.

[0085] In some examples, in order to effectively reduce the leakage risk of the liquid metal 170, the ratio of the sealing space surrounded by the first sealing frame 140 to the amount of the liquid metal 170 is greater than 2.

[0086] For example, in consideration of the amount and cost of the liquid metal 170, the ratio of the sealing space surrounded by the first sealing frame 140 to the amount of the liquid metal 170 can be between 2.5 and 3.

[0087] In some examples, the width of the first sealing frame 140 is greater than 1 mm, and / or the width of the second sealing frame 150 is greater than 1 mm. By limiting the width of the first sealing frame 140 and / or the second sealing frame 150 to be greater than 1 mm, the influence of the narrow width on the sealing effect is avoided, and the appropriate width can not only play the effect of isolating water vapor sealing, but also will not produce excessive pressure, which is helpful to stabilize the heat dissipation performance of the system.

[0088] For example, if the surrounding space structure is sufficient or the circuit board 110 space is sufficient, the width of the first sealing frame 140 and / or the second sealing frame 150 can be set to be greater than 2 mm.

[0089] In one example, as shown in FIG. 4, the first sealing frame 140 and the second sealing frame 150 are tightly attached between the circuit board 110 and the heat sink 120. That is, one end of the first sealing frame 140 and the second sealing frame 150 are tightly attached to the circuit board 110, and the other end of the first sealing frame 140 and the second sealing frame 150 are tightly attached to the heat sink 120, so that the chip 130 and the liquid metal 170 are in a completely sealed space, preventing moisture from infiltrating and corroding and preventing leakage of the liquid metal, thereby prolonging the service life of the liquid metal.

[0090] For example, as shown in FIGS. 2, 5-9, the heat dissipation package structure 100 can further include a chip substrate 160, the chip substrate 160 is arranged on the circuit board 110, and the chip 130 is arranged on a side of the chip substrate 160 away from the circuit board 110. That is, the circuit board 110 is provided with the chip substrate 160, and the chip 130 is arranged on the chip substrate 160. Considering that the surface of the circuit board 110 can be uneven, a chip substrate 160 can be arranged on the circuit board 110, which can provide a flat surface, and the chip 130 can be mounted on the chip substrate 160 to facilitate the mounting stability of the chip 130.

[0091] In another example, as shown in FIGS. 5-8, the first sealing frame 140 and the second sealing frame 150 are tightly attached between the chip substrate 160 and the heat sink 120. When the chip substrate 160 is arranged, the first sealing frame 140 and the second sealing frame 150 can be tightly attached between the chip substrate 160 and the heat sink 120, that is, one end of the first sealing frame 140 and the second sealing frame 150 is tightly attached to the chip substrate 160, and the other end of the first sealing frame 140 and the second sealing frame 150 is tightly attached to the heat sink 120, so that the chip 130 and the liquid metal 170 are in a completely sealed space, preventing moisture from infiltrating and corroding and preventing leakage of the liquid metal, thereby prolonging the service life of the liquid metal.

[0092] In yet another example, as shown in FIG. 9, the first sealing frame 140 is tightly attached between the chip substrate 160 and the heat sink 120, and the second sealing frame 150 is tightly attached between the circuit board 110 and the heat sink 120. When the chip substrate 160 is arranged, the first sealing frame 140 can be tightly attached between the chip substrate 160 and the heat sink 120, and the second sealing frame 150 is tightly attached between the circuit board 110 and the heat sink 120. That is, one end of the first sealing frame 140 is tightly attached to the chip substrate 160, the other end of the first sealing frame 140 is tightly attached to the heat sink 120, one end of the second sealing frame 150 is tightly attached to the circuit board 110, and the other end of the second sealing frame 150 is tightly attached to the heat sink 120, so that the chip 130 and the liquid metal 170 are in a completely sealed space, preventing moisture from infiltrating and corroding and preventing leakage of the liquid metal, thereby prolonging the service life of the liquid metal.

[0093] Exemplarily, as shown in FIGS. 6-9, the heat sink 120 can include a copper plate 122 in contact with the liquid metal 170 and a vapor chamber 121 disposed on a side of the copper plate 122 away from the chip 130. The vapor chamber 121 can be a vapor chamber (VC).

[0094] The first sealing frame 140 can be tightly attached between the chip substrate 160 and the copper plate 122 of the heat sink 120; or the first sealing frame 140 can be tightly attached between the circuit board 110 and the copper plate 122 of the heat sink 120; or the first sealing frame 140 can be tightly attached between the circuit board 110 and the vapor chamber 121 of the heat sink 120; or the first sealing frame 140 can be tightly attached between the chip substrate 160 and the vapor chamber 121 of the heat sink 120.

[0095] The second sealing frame 150 can be tightly attached between the chip substrate 160 and the copper plate 122 of the heat sink 120; or the second sealing frame 150 can be tightly attached between the circuit board 110 and the copper plate 122 of the heat sink 120; or the second sealing frame 150 can be tightly attached between the chip substrate 160 and the vapor chamber 121 of the heat sink 120; or the second sealing frame 150 can be tightly attached between the circuit board 110 and the vapor chamber 121 of the heat sink 120.

[0096] Exemplarily, as shown in FIGS. 6 and 7, the first sealing frame 140 can be tightly attached between the chip substrate 160 and the copper plate 122 of the heat sink 120, and the second sealing frame 150 can also be tightly attached between the chip substrate 160 and the copper plate 122 of the heat sink 120.

[0097] Exemplarily, as shown in FIG. 8, the first sealing frame 140 can be tightly attached between the chip substrate 160 and the copper plate 122 of the heat sink 120, and the second sealing frame 150 can be tightly attached between the chip substrate 160 and the vapor chamber 121 of the heat sink 120.

[0098] Exemplarily, as shown in FIG. 9, the first sealing frame 140 can be tightly attached between the chip substrate 160 and the copper plate 122 of the heat sink 120, and the second sealing frame 150 can be tightly attached between the circuit board 110 and the vapor chamber 121 of the heat sink 120.

[0099] In some examples, as shown in FIGS. 1, 4-9, the heat dissipation package structure 100 can further include a resilient arm 101, one end of the resilient arm 101 is fixed on a side of the heat sink 120 away from the circuit board 110, and the other end of the resilient arm 101 is used to lock the heat sink 120 on the circuit board 110. Exemplarily, the material of the resilient arm 101 can be selected from metals with good elasticity, such as elastic stainless steel, spring steel 65Mn, etc.

[0100] Exemplarily, the height of the whole heat dissipation packaging structure 100 can be reduced to about 3.7 mm by using the structural layout of the elastic arm 101 passed by the present application, satisfying the light and thin development trend of electronic devices. The first sealing frame 140 and the second sealing frame 150 are compressed by the transverse elastic arm structure, improving the sealing reliability of the first sealing frame 140 and the second sealing frame 150 under long-term compression. The sealing pressure is changed by adjusting the length and rigidity of the elastic arm, reducing the system stacking space.

[0101] It should be understood that, by the structural layout of the elastic arm 101 and the length adjustment of the elastic arm, the compression sealing of different compression rate sealing materials can be realized, and the compression force can be constant under the long-term compression of the sealing material, playing a long-term sealing function. By adjusting the length of the elastic arm 101 and the material and rigidity of the elastic arm 101, the problem of limited system height layout space is solved, and the development needs of light and thin electronic devices are adapted.

[0102] Exemplarily, by using the transverse elastic arm structure, the length and rigidity of the elastic arm 101 are adjusted to ensure the clamping pressure of the heat sink 120 and the sealing ring pressure, the life attenuation rate is low, the height layout space is limited, and it is suitable for light and thin product application.

[0103] In one example, as shown in FIG. 7, if the heat sink 120 includes a uniform temperature plate 121 and a copper plate 122, the elastic arm 101 can also be arranged on the side of the copper plate 122 away from the circuit board 110, and the uniform temperature plate 121 is arranged above the copper plate 122 and the elastic arm 101. In this case, the first sealing frame 140 and the second sealing frame 150 can be arranged between the chip substrate 160 and the copper plate 122.

[0104] In some examples, as shown in FIGS. 4 to 9, the heat dissipation packaging structure can further include a fastener 103 (such as a screw), which can be fixedly connected with the circuit board 110 through the through hole of the elastic arm 101. That is, the fastener 103 can pass through the through hole of the elastic arm 101 to lock the heat sink 120 on the circuit board 110.

[0105] Exemplarily, the heat dissipation packaging structure can further include a connecting piece 102 (such as a nut), which can be fixed on the circuit board 110, and the fastener 103 (such as a screw) can be fixedly connected with the connecting piece 102 on the circuit board 110 through the through hole of the elastic arm 101.

[0106] It should be understood that the layout position and size of the elastic arm 101 can be designed to be extended correspondingly according to the layout of the heat sink 120 or the chip 130.

[0107] It should be noted that in the present application, the circuit board 110 can be provided with a connecting piece 102 (such as a nut), and the fastener 103 (such as a screw) can be fixedly connected with the nut on the circuit board 110 to realize the fixed connection of the heat sink 120 and the circuit board 110, so that the first sealing frame 140 and the second sealing frame 150 are in a compressed state, thereby avoiding the oxidation reaction of water vapor and liquid metal 170 through the pores of the first sealing frame 140 and the second sealing frame 150.

[0108] Considering that different heat sinks 120 have different structures, in some examples, as shown in FIG. 3, the heat sink 120 can include an extension 123 having a first through hole, the elastic arm 101 has a second through hole, and the fastener 103 can be fixedly connected with the circuit board 110 in sequence through the second through hole and the first through hole.

[0109] It should be understood that in order to better realize the heat sink 120 with different structures and to improve the connection stability of the heat sink 120 and the circuit board 110, when the heat sink 120 is provided with the extension 123, the fastener 103 (such as a screw) can be fixedly connected with the connecting piece 102 (such as a nut) on the circuit board 110 in sequence through the first through hole of the extension 123 and the second through hole of the elastic arm 101.

[0110] The above describes the heat dissipation packaging structure 100 provided by the embodiments of the present application in combination with FIGS. 1 to 9. On this basis, the embodiments of the present application further provide an electronic device, which can include the heat dissipation packaging structure 100 as shown in FIGS. 1 to 9, and can meet the high heat dissipation performance requirement of the electronic device.

[0111] The above describes the heat dissipation packaging structure 100 provided by the embodiments of the present application in combination with FIGS. 1 to 9. On this basis, the embodiments of the present application further provide an electronic device, which can include the heat dissipation packaging structure 100 as shown in FIGS. 1 to 9, and can meet the high heat dissipation performance requirement of the electronic device.

[0111] The above describes the heat dissipation packaging structure 100 provided by the embodiments of the present application in combination with FIGS. 1 to 9. On this basis, the embodiments of the present application further provide an electronic device, which can include the heat dissipation packaging structure 100 as shown in FIGS. 1 to 9, and can meet the high heat dissipation performance requirement of the electronic device.

Claims

1. A heat dissipation packaging structure, characterized in that, include: A circuit board (110) on which a chip (130) is disposed, the surface of which is coated with liquid metal (170); A heat sink (120) is disposed on the side of the chip (130) away from the circuit board (110). The heat sink (120) is in contact with the chip (130) through the liquid metal (170), which is used to transfer the heat of the chip (130) to the heat sink (120). The chip (130) is provided with a first sealing frame (140) on its outer periphery, and a second sealing frame (150) is provided on its outer periphery. The first sealing frame (140) is used to seal the chip (130) and the liquid metal (170), and the second sealing frame (150) is used to prevent external air from entering the first sealing frame (140).

2. The heat dissipation packaging structure according to claim 1, characterized in that, The ratio of the sealed space enclosed by the first sealing frame (140) to the amount of liquid metal (170) is greater than 2.

3. The heat dissipation packaging structure according to claim 1 or 2, characterized in that, The protective sealing material used in the first sealing frame (140) and / or the second sealing frame (150) has a compression ratio greater than 20%.

4. The heat dissipation packaging structure according to any one of claims 1 to 3, characterized in that, The width of the first sealing frame (140) and / or the second sealing frame (150) is greater than 1 mm.

5. The heat dissipation packaging structure according to any one of claims 1 to 4, characterized in that, The surface of the heat sink (120) in contact with the liquid metal (170) has a phosphorus-nickel plating layer, wherein the phosphorus content in the phosphorus-nickel plating layer is greater than or equal to 3 wt%.

6. The heat dissipation packaging structure according to any one of claims 1 to 5, characterized in that, The first sealing frame (140) and the second sealing frame (150) are tightly attached between the circuit board (110) and the heat sink (120).

7. The heat dissipation packaging structure according to any one of claims 1 to 5, characterized in that, The heat dissipation packaging structure further includes a chip substrate (160), which is disposed on the circuit board (110), and the chip (130) is disposed on the side of the chip substrate (160) away from the circuit board (110).

8. The heat dissipation packaging structure according to claim 7, characterized in that, The first sealing frame (140) and the second sealing frame (150) are tightly abutted between the chip substrate (160) and the heat sink (120); or, The first sealing frame (140) is attached between the chip substrate (160) and the heat sink (120), and the second sealing frame (150) is attached between the circuit board (110) and the heat sink (120).

9. The heat dissipation packaging structure according to any one of claims 1 to 7, characterized in that, The heat dissipation encapsulation structure also includes a spring arm (101), one end of which is fixed to the side of the heat sink (120) away from the circuit board (110), and the other end of which is used to lock the heat sink (120) onto the circuit board (110).

10. The heat dissipation packaging structure according to claim 9, characterized in that, The heat dissipation packaging structure also includes a connector (102) and a fastener (103). The connector (102) is fixed on the circuit board (110), and the fastener (103) is used to fix the elastic arm (101) on the connector (102).

11. The heat dissipation packaging structure according to claim 10, characterized in that, The radiator (120) includes an extension (123) having a first through hole, and the elastic arm (101) having a second through hole; The fastener (103) passes through the second through hole and the first through hole in sequence to fix the elastic arm (101) on the connector (102).

12. The heat dissipation packaging structure according to any one of claims 1 to 11, characterized in that, The first sealing frame (140) and / or the second sealing frame (150) are sealant, sealing rings or sealing foam.

13. An electronic device, characterized in that, Includes the heat dissipation packaging structure as described in any one of claims 1 to 12.

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