Display panel and display device

Abstract

A display panel and a display device, which belong to the technical field of display. The display panel comprises: a display substrate (1), the display substrate (1) comprising a plurality of signal lines (11); a functional film layer disposed on one side of the display substrate (1); a support structure (3) disposed on the side of the display substrate (1) facing away from the functional film layer; an adapter component (101); and a connection circuit board (100) disposed on the side of the support structure (3) away from the display substrate (1), wherein the support structure (3) is recessed relative to the display substrate (1) to form a first space, the adapter component (101) is disposed in the first space, and the plurality of signal lines (11) are connected to the connection circuit board (100) by means of the adapter component (101) in the first space.

Description

Display panel and display device TECHNICAL FIELD

[0001] The present disclosure belongs to the technical field of display, and particularly relates to a display panel and a display device. BACKGROUND

[0002] With the development of active matrix organic light emitting diode (AMOLED) display technology, the frame of flexible AMOLED products is gradually reduced, the screen ratio is gradually improved, and the product thickness is gradually reduced. In order to further improve the user experience, how to make the frame of the display product narrower is a technical problem to be solved. SUMMARY

[0003] The present disclosure aims to at least solve one of the technical problems in the prior art, and provides a display panel and a display device.

[0004] The display panel provided by the present disclosure comprises:

[0005] a display substrate comprising a plurality of signal lines;

[0006] a functional film layer arranged on one side of the display substrate;

[0007] a support structure arranged on the side of the display substrate away from the functional film layer;

[0008] an adapter component; and

[0009] a connection circuit board arranged on the side of the support structure away from the display substrate; wherein

[0010] the support structure is recessed relative to the display substrate to form a first space,

[0011] the adapter component is arranged in the first space,

[0012] the plurality of signal lines are connected to the connection circuit board through the adapter component in the first space.

[0013] In some embodiments, the display substrate comprises a display area and a peripheral area arranged on at least one side of the display area, and the display substrate does not comprise a bending area and a pad area.

[0014] In some embodiments, the connection circuit board does not contact the display substrate.

[0015] In some embodiments, the support structure comprises a back film and a support layer arranged in sequence away from the display substrate, and at least one of the back film and the support layer is recessed to form the first space.

[0016] In some embodiments, the back film and the support layer are recessed to form a substantially flush edge.

[0017] In some embodiments, the connection circuit board is directly arranged on the support layer to form a pad area, and the pad area is located on the support layer.

[0018] In some embodiments, the functional film layer comprises a polarizer, and an edge of at least one side of the polarizer is substantially flush with an edge of at least one side of the display substrate.

[0019] In some embodiments, the display substrate comprises a display area and a peripheral area located on at least one side of the display area, and an edge of the support structure is closer to the display area relative to an edge of the polarizer.

[0020] In some embodiments, the adapter component is located in the peripheral area of the display substrate.

[0021] In some embodiments, the first space is filled with a sealing structure; the adapter component is wrapped by the sealing structure, and two ends of the adapter component arranged opposite in the thickness direction of the display substrate are respectively connected to the signal line and the connection circuit board.

[0022] In some embodiments, the connection circuit board comprises at least a first connection pad connected to the adapter component and a second connection pad connected to a driving circuit board; the driving circuit board is configured to provide a driving signal to the signal line.

[0023] In some embodiments, the connection circuit board further comprises a third connection pad, and the third connection pad is connected to a driving chip; the driving chip is configured to provide a driving signal to the signal line under the control of the driving circuit board.

[0024] In some embodiments, the number of the first connection pads is plural, and the plural first connection pads are arranged side by side; the connection circuit board further comprises a first alignment pad and a second alignment pad, and the plural first connection pads are arranged between the first alignment pad and the second alignment pad.

[0025] In some embodiments, the connection circuit board is bonded to a side of the support structure away from the display substrate through a first bonding layer.

[0026] In some embodiments, the display substrate comprises a display area and a peripheral area located on at least one side of the display area; the display panel further comprises:

[0027] a cover plate arranged on a side of the functional film layer away from the display substrate; an edge of the cover plate is farther away from the display area relative to an edge of the display substrate;

[0028] An edge sealing glue is arranged on one side of the cover plate close to the display substrate and at least partially surrounds the display area, and is used at least for sealing the edge of the display substrate.

[0029] In some embodiments, the edge sealing glue comprises a first edge sealing component and a second edge sealing component; wherein,

[0030] The first edge sealing component is arranged on the side of the edge of the display substrate away from the display area;

[0031] The second edge sealing component is connected with the first edge sealing component and arranged on the side of the layer where the connection circuit board is away from the support structure.

[0032] In some embodiments, the first edge sealing component comprises a plurality of layers of auxiliary film layers stacked in sequence away from the cover plate; and the second edge sealing component is an integral structure with one layer of the auxiliary film layer farthest away from the cover plate.

[0033] In some embodiments, the first edge sealing component and the second edge sealing component both adopt acrylate materials.

[0034] In some embodiments, an ink layer is further arranged on the side of the cover plate close to the functional film layer, and the ink layer is located in the peripheral area and surrounds the display area.

[0035] The display device provided by the embodiments of the present disclosure comprises the display panel described above. BRIEF DESCRIPTION OF DRAWINGS

[0036] FIG. 1 is a schematic diagram of an exemplary display panel.

[0037] FIG. 2 is a pixel circuit diagram in a pixel area in FIG. 1.

[0038] FIG. 3 is a cross-sectional view of an exemplary display panel.

[0039] FIG. 4 is a front view of a display panel according to an embodiment of the present disclosure.

[0040] FIG. 5 is a back view of a display panel according to an embodiment of the present disclosure.

[0041] FIG. 6 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0042] FIG. 7 is a partial schematic diagram of an exemplary display panel.

[0043] FIG. 8 is a partial schematic diagram of a display panel according to an embodiment of the present disclosure.

[0044] FIG. 9 is a partial schematic diagram of an exemplary display panel.

[0045] FIG. 10 is a partial schematic view of a display panel according to an embodiment of the present disclosure.

[0046] FIG. 11 is a schematic view of a connection circuit board according to an embodiment of the present disclosure.

[0047] FIG. 12 is a cross-sectional schematic view of a display panel according to an embodiment of the present disclosure.

[0048] FIG. 13 is a partial structure schematic view of a display substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of the present application.

[0050] Unless otherwise defined, technical terms or scientific terms used herein should be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms "first", "second", and similar terms used herein do not imply any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one" or "a" or similar terms do not denote a quantity of one but denote the existence of at least one. The terms "include" or "contain" or similar terms mean that the elements or objects before the "include" or "contain" cover the elements or objects listed after the "include" or "contain" and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "up", "down", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships may also change accordingly.

[0051] In the following description, when an element or layer is referred to as "on" or "connected to" another element or layer, it can be directly on the other element or layer, directly connected to the other element or layer, or there can be an intermediate element or intermediate layer. However, when an element or layer is referred to as "directly on" or "directly connected to" another element or layer, there is no intermediate element or intermediate layer. The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or section from another element, component, region, layer and / or section. Thus, a first element, a first component, a first region, a first layer and / or a first section discussed below could be termed a second element, a second component, a second region, a second layer and / or a second section without departing from the teachings of the present disclosure.

[0053] Spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for descriptive purposes, and, thereby, to describe one element or feature's relationship to another element(s) or feature(s) as depicted in the figures. The spatially relative terms are intended to encompass different orientations of the device in use, operation and / or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0054] FIG. 1 is a schematic diagram of an example display panel; FIG. 2 is a circuit diagram of a pixel in a pixel region in FIG. 1; FIG. 3 is a cross-sectional view of an example display panel; as shown in FIGS. 1-3, the display panel includes a display substrate 1. In some embodiments, the display substrate is a flexible display substrate, and the display panel is a flexible display panel. The display substrate 1 is divided into a display region AA, a peripheral region PA surrounding the display region AA, a pad region WA on a side of the peripheral region PA away from the display region AA, and a bending region BA between the peripheral region PA and the pad region WA, configured to bend along a bending axis BX. For the sake of edge description, a portion of the peripheral region PA between the bending region BA and the display region AA is referred to as a connection region TPA.

[0055] The display substrate 1 includes a substrate, a signal line 11 disposed on the substrate, and a plurality of pixel regions defined by intersections of the signal line 11 and a plurality of data lines DL. Each of the pixel regions includes a pixel P having an organic light-emitting diode OLED. An area in which the pixel regions are located is defined as a display area AA. A peripheral area PA is disposed outside the display area AA and is unable to display an image.

[0056] As shown in FIG. 2, each of the pixels P includes a pixel circuit PC and an organic light-emitting diode OLED connected to the pixel circuit PC. The pixel circuit PC is connected to the gate line GL and the data line DL corresponding to the pixel P. The pixel circuit PC includes a driving thin-film transistor (TFT) Td, a switching TFT Ts, and a storage capacitor Cst. The switching TFT Ts is connected to the gate line GL and the data line DL and configured to transmit a data signal received through the data line DL to the driving TFT Td according to a scan signal received through the gate line GL. The storage capacitor Cst is connected to the switching TFT Ts and a driving voltage line PL and configured to store a voltage corresponding to a difference between a voltage received from the switching TFT Ts and a driving voltage ELVDD supplied to the driving voltage line PL. The driving TFT Td is connected to the driving voltage line PL and the storage capacitor Cst and can be used to control a driving current flowing from the driving voltage line PL to the organic light-emitting diode OLED according to a voltage value stored in the storage capacitor Cst. The organic light-emitting diode OLED can emit light having a desired brightness through the driving current. The organic light-emitting diode OLED can emit, for example, red light, green light, blue light, or white light. Although a case in which the pixel P includes two TFTs and one storage capacitor Cst is shown in FIG. 2, exemplary embodiments of the disclosure can employ different arrangements of transistors and memories. In other embodiments, the pixel circuit PC of the pixel P can include three or more TFTs or two or more storage capacitors.

[0057] Continuing to refer to FIG. 3, the display substrate 1 further includes a plurality of connection pads 4 located in the pad area WA, each of which is configured to electrically connect a signal line 11 extending from the display area AA or the peripheral area PA. The connection pads 4 can be exposed on the surface of the pad area WA, i.e., not covered by any layer, so as to facilitate electrical connection to a flexible printed circuit board FPCB. The flexible printed circuit board FPCB is electrically connected to an external controller and configured to transmit signals or power from the external controller. For example, the connection pads 4 are electrically connected to common signal lines, the connection pads 4 are electrically connected to touch signal lines, the connection pads 4 are electrically connected to driving signal lines, and the connection pads 4 are electrically connected to data connection lines (electrically connected to data lines DL in the display area AA). The connection pads 4 are electrically connected to the respective signal lines 11, so as to enable communication between the signal lines 11 and the flexible printed circuit board FPCB. The number and arrangement of the connection pads 4 are not specifically limited here and can be set as needed.

[0058] Continuing to refer to FIG. 3, the display panel further includes a functional film layer and a cover plate 5 disposed on the light-emitting side of the display substrate 1, and a support structure 3 located on the back light side of the display substrate 1 (the side facing away from the functional film layer). The cover plate 5 is located on the side of the functional film layer facing away from the display substrate 1. The present disclosure takes a polarizer 2 as an example of the functional film layer, which extends from the display area AA to the peripheral area PA. The polarizer 2 can be a circular polarizer, specifically composed of a polarizer and a 1 / 4 wave plate. The polarizer 2 can improve the contrast ratio of the display panel and reduce reflected light. A transparent optical adhesive layer 6 is disposed between the cover plate 5 and the polarizer 2 to bond them together. The support structure 3 is used to provide a certain support force for the display substrate 1. The support structure 3 can include a back film 31 and a support layer 32 disposed in sequence in the direction away from the display substrate 1. The support layer 32 can be made of a metal material and extends from the display area AA of the display substrate 1 to the connection area TPA. In order to facilitate bending, the back film 31 is provided with a slot at a position corresponding to the bending area BA.

[0059] In combination with FIGS. 1 and 3, after the bending area BA of the display substrate 1 is bent along the bending axis BX, the pad area WA of the display substrate 1 is located on the side of the support structure 3 away from the polarizer 2. Since the connection pads 4 of the pad area WA are to be connected with a flexible printed circuit board (or a driving chip), in order to avoid signal interference, an electromagnetic shielding layer 9 is provided on the side of the support layer 32 facing away from the back film 31, which not only prevents electromagnetic interference, but also dissipates heat for the flexible printed circuit board and the display substrate 1.

[0060] Continuing to refer to FIG. 3, the substrate 1 is provided with a protective layer 8, which covers at least the bending area BA, and in some examples, the protective layer 8 can also extend to a position in the connecting area TPA that is not covered by the polarizer 2. The protective layer 8 is made of MCL glue, i.e., Micro Coating Layer glue, which is used to protect the bending area BA and the exposed part of the connecting area TPA from environmental factors such as moisture, oxygen, and temperature changes, so as to prevent damage to the signal line 11.

[0061] Continuing to refer to FIG. 3, the display panel further includes an ink layer 7 located at the peripheral area PA, which is arranged on the surface of the cover plate 5 close to the polarizer 2, and the ink layer 7 has a certain amount of overlap with the polarizer 2, i.e., the ink layer 7 and the polarizer 2 have overlapping projections in the plane of the cover plate 5. The ink layer 7 can play a role in protecting the screen from scratches and wear.

[0062] For the display panel shown in FIG. 3, the frame width is related to the bending radius of the bending area BA, the bending start position of the bending area BA, and other factors. In the process of making the protective layer 8, the glue is first coated on the display substrate 1, and then the glue is cured to form the protective layer 8. Before the glue is cured, the glue will flow to a certain extent, and will climb to a certain extent along the side of the polarizer 2, so that the protective layer 8 formed after the glue is cured is not flat at the position close to the polarizer 2. In order to prevent the signal line on the display substrate 1 from being damaged, the bending start position of the bending area BA close to the polarizer 2 can be set at the flat position of the protective layer 8, such as the w position in FIG. 3, so that the thickness of the protective layer 8 on both sides of the bending start position is the same or substantially the same, thereby making the stress at the bending start position uniform, preventing the signal line 11 on the display substrate 1 from being damaged. In addition, the orthographic projection of the bending start position on the back film 31 falls within the edge of the back film 31 and the edge of the support layer 32, so that the display substrate 1 can be prevented from being dead-folded at the edge of the back film 31 when it is bent, thereby preventing the signal line 11 from being broken. As shown in FIG. 3, the bending start position is the w position, and the frame width T of the display panel = A + B + C + D + E + F + G + H, wherein A is the distance from the side edge VA of the ink layer 7 close to the display area AA to the display area AA, which is related to the lamination accuracy of the vacuum lamination equipment (D-lami), which is the equipment used to attach the cover plate 5 to the display substrate 1; B is the lap width of the polarizer 2 and the ink layer 7; C is the distance between the above-mentioned bending start position (i.e. the w position) and the edge of the polarizer 2; D is the distance between the orthographic projection of the bending start position on the back film 31 to the edge of the back film 31; E is the bending radius of the bending area BA; F is the thickness of the part of the display substrate 1 located in the bending area BA; G is the thickness of the protective layer 8; H is the frame width of the middle frame assembly, i.e. the distance from the vertical section of the bending area BA on the cover plate 5 to the middle frame after the middle frame is assembled around the display panel; that is, the distance between the outer edge of the orthographic projection of the bending area BA on the cover plate 5 and the edge of the cover plate 5. Generally, A ≥ 150 μm, B ≥ 276 μm, C ≥ 200 μm, D ≥ 80 μm, E ≥ 200 μm, F + G ≥ 94 μm, and H ≥ 0.71 mm, then T ≥ 1.71 mm. The inventors have found that for this kind of display panel, since the bending in the bending area BA folds the pad area WA to the back light side of the display substrate 1, the frame width of the display panel is relatively wide.

[0063] To solve the above problems of the display panel, the display panel provided by the embodiments of the present disclosure is as follows. The display panel can be a flexible display panel as described above, or a non-flexible display panel. FIG. 4 is a front view of a display panel according to an embodiment of the present disclosure; FIG. 5 is a back view of the display panel according to an embodiment of the present disclosure; and FIG. 6 is a sectional view of the display panel according to an embodiment of the present disclosure. As shown in FIGS. 4-6, the display panel according to an embodiment of the present disclosure includes a display substrate 1, a functional film layer, and a support structure 3. The display substrate 1 includes a plurality of signal lines 11. The functional film layer is disposed on the light-emitting side of the display substrate 1. For example, the functional film layer is a film layer for adjusting light, and the embodiments of the present disclosure take a polarizer 2 as an example of the functional film layer. The support structure 3 is disposed on the side of the display substrate 1 away from the polarizer 2. The display panel further includes a conversion component 101 and a connection circuit board 100. The support structure 3 is recessed relative to the display substrate 1 to form a first space, and the conversion component 101 is disposed in the first space. The connection circuit board 100 is disposed on the side of the support structure 3 away from the display substrate 1, and the plurality of signal lines 11 are connected to the connection circuit board 100 through the conversion component 101 in the first space.

[0064] It should be noted that the support structure 3 includes a top surface facing the display substrate 1, a bottom surface away from the display substrate 1, and a side surface connecting the top surface and the bottom surface. The support structure 3 is recessed relative to the display substrate 1, which means that the at least part of the side surface of the support structure 3 is projected onto the display substrate 1 and located inside the edge of the display substrate 1. The first space is a space disposed opposite to the side surface of the support structure 3 and does not exceed the edge of the display substrate 1, and L in FIG. 6 is the width of the first space.

[0065] It should be further noted that the connection circuit board 100 is used to connect a driving circuit board (for example, a flexible printed circuit board), a driving chip, and the like, that is, an external driving circuit can provide corresponding driving signals for the signal lines 11 through the connection circuit board 100.

[0066] In the embodiments of the present disclosure, the connection circuit board 100 is disposed on the side of the display substrate 1 away from the polarizer 2, and the support structure 3 is recessed relative to the display substrate 1 to form a first space. The signal lines 11 are connected to the connection circuit board 100 through the conversion component 101 disposed in the first space. Therefore, compared with the display panel in FIG. 3, the embodiments of the present disclosure make full use of the space around the support structure 3, so that the conversion component 11 for transmitting driving signals for the signal lines 11 is closer to the support structure 3, thereby facilitating the reduction of the frame width of the display panel.

[0067] In some examples, referring to FIG. 4, the display substrate 1 includes a display area AA and a peripheral area PA located at least one side of the display area AA, the display area AA is used for displaying images, and a plurality of gate lines GL and a plurality of data lines DL are arranged in the display area AA, the plurality of gate lines GL and the plurality of data lines DL cross to define a plurality of pixel areas, and each pixel area is provided with a pixel P. The structure of the display area AA of the display substrate 1 can be the same as that of the display substrate 1 shown in FIGS. 1 to 3, and thus the structure of the display area AA of the display substrate 1 will not be described here.

[0068] Different from the display panel shown in FIGS. 1 and 3, in the display panel shown in FIGS. 4 to 6, the display substrate 1 does not arrange the above-mentioned bending area BA and the pad area WA, that is, the display substrate 1 does not bend any more, and thus the bending radius does not exist, so that the width of the frame of the display panel can be reduced.

[0069] In addition, due to the cancellation of the bending area BA, the peripheral area PA of the display substrate 1 can also be improved to further reduce the frame, which will be described in detail in combination with specific structures.

[0070] Referring to FIG. 6, the support structure 3 in the embodiment of the present disclosure can also include a back film 31 and a support layer 32 arranged in sequence away from the display substrate 1. At least one of the back film 31 and the support layer 32 is inwardly recessed, thereby forming the above-mentioned first space. For example, as shown in FIG. 6, the back film 31 and the support layer 32 are both inwardly recessed relative to the display substrate 1, so that the adapter component 101 in the first space is connected with the signal line 11 and the connection circuit board 100.

[0071] In some examples, as shown in FIG. 6, the back film 31 and the support layer 32 are inwardly recessed to form edges that are substantially flush. Here, "substantially flush" means that there can be a small misalignment between the edge of the back film 31 and the edge of the support layer 32, for example, the width of the misalignment is less than the thickness of the back film 31, or less than half of the thickness of the back film 31; of course, the edge of the back film 31 and the edge of the support layer 32 can also be completely flush.

[0072] In other examples, the back film 31 and the support layer 32 are both inwardly recessed relative to the display substrate 1, and the edges of the back film 31 and the support layer 32 after being inwardly recessed are not flush.

[0073] The relative position relationship between the edges of the partial film layers in the display panel of the embodiment of the present disclosure is compared with the embodiment shown in FIG. 3. FIG. 7 is a partial schematic view of an exemplary display panel, which shows the state of the display substrate 1 and the back film 31 when they are flattened; as shown in FIG. 7, the pad area WA includes a first pad area WA1 for bonding with the driving chip D-IC and a second pad area WA2 for bonding with the flexible printed circuit board FPCB, since the bending area BA is to be bent so as to turn the pad area WA to the side of the display substrate 1 away from the polarizer 2, a groove Q1 is designed on the back film 31 to release the stress generated by the bending. Meanwhile, in order to protect the bent part of the display substrate 1 after the bending, the protective layer 8 (i.e., the MCL glue coating area shown in FIG. 7) is coated on the part of the display substrate 1 not covered by the polarizer 2; and as described above for the bending starting point, there needs to be a certain distance between the bending starting point and the polarizer 2. FIG. 8 is a partial schematic view of the display panel of the embodiment of the present disclosure; as shown in FIG. 8, the display substrate 1 in the embodiment of the present disclosure cancels the part of the bending area BA and the part of the pad area WA, so there is no need to coat the protective layer 8, and thus the transverse distance between the edge of the display substrate 1 and the edge of the polarizer 2 can be reduced; the transverse distance refers to the distance between the orthogonal projection of the edge of the display substrate 1 on a reference plane and the orthogonal projection of the edge of the polarizer 2 on the reference plane, and the reference plane is a plane perpendicular to the thickness direction of the display substrate 1. In one example, the transverse distance between the edge of at least one side of the polarizer 2 and the edge of at least one side of the display substrate 1 is less than 280 μm, for example, less than 250 μm, or less than 200 μm, or less than 150 μm, or less than 100 μm, or less than 50 μm. In one specific example, the edge of at least one side of the polarizer 2 is substantially flush with the edge of at least one side of the display substrate 1, for example, the transverse distance between the edge of at least one side of the polarizer 2 and the edge of at least one side of the display substrate 1 is less than 50 μm, or less than 20 μm, or the edge of at least one side of the polarizer 2 is completely flush with the edge of at least one side of the display substrate 1.

[0074] In addition, as described above, in the display panel shown in FIG. 3, the bending starting point is located in the area where the back film 31 is located, and is located outside the area where the support layer 32 is located. The support layer 32 is recessed by about 150 μm (as shown in FIG. 9) compared to the back film 31 to prevent dead folding when the display substrate 1 is bent. In an example of the present disclosure, the back film 31 and the support layer 32 are recessed to form a substantially flush edge, and the back film 31 and the support layer 32 are recessed by about 200 μm (as shown in FIG. 10) compared to the display substrate 1, so as to provide a certain space for the adapter component 101 to facilitate the connection of the signal line 11 and the connection circuit board 100. In order to ensure the support strength of the product, the thickness of the back film 31 is not less than 75 μm.

[0075] In addition, in the display panel shown in FIG. 3, the edge of the polarizing sheet 2 is closer to the display area AA than the edge of the support structure 3. In an example of the present disclosure, as shown in FIG. 6, the edge of the support structure 3 is closer to the display area AA than the edge of the polarizing sheet 2, which is advantageous to reduce the distance between the edge of the display area AA and the edge of the display substrate 1, thereby further reducing the frame width of the display panel.

[0076] In some examples of the present disclosure, continuing to refer to FIG. 6, the adapter component 101 is located in the peripheral area PA of the display substrate 1. The adapter component 101 in the example of the present disclosure can be a connection structure with a sharp end, for example, the adapter component 101 is a copper needle, the maximum width of the copper needle is about 125-175 μm, and the height of the copper needle is not less than the sum of the thicknesses of the back film 31 and the support layer 32. In an example, the thickness of the back film 31 is not less than 75 μm, and the thickness of the support layer 32 is not less than 200 μm; when the thickness of the back film 31 is set to 75 μm and the thickness of the support layer 32 is set to 200 μm, the height of the copper needle is not less than 275 μm to ensure that the two ends of the copper needle can be stably connected with the signal line 11 and the connection circuit board 100, respectively. It should be noted that the adapter component 101 is only taken as a copper needle in the example of the present disclosure.

[0077] Further, continuing to refer to FIG. 6, the copper needle is also wrapped with a sealing structure 102 in the first space, so as to protect the copper needle from water and oxygen in the outside world. The sealing structure 102 can be sealing glue, and the material can be epoxy resin with viscosity not less than 2000 cps and hardness not less than 70A after curing. The width of the sealing glue is the width of the support structure 3 compared to the display substrate 1, for example, the width of the sealing glue is about 200 μm. The thickness of the sealing glue is slightly smaller than the height of the copper needle, so as to ensure that the two tips of the copper needle are exposed and stably connected with the signal line 11 and the connection circuit board 100 respectively. For example, the thickness of the sealing glue is about 4 μm smaller than the height of the copper needle. When the sealing glue is UV glue, the curing wavelength is 365 nm.

[0078] In some examples, continuing to refer to FIG. 6, the connection circuit board 100 is a flexible circuit board, and the connection circuit board 100 is not in contact with the display substrate 1.

[0079] In some examples, the connection circuit board 100 can be attached to the side of the support layer 32 away from the display substrate 1 through a first adhesive layer. In other examples, the connection circuit board 100 can also be directly prepared on the side of the support layer 32 away from the display substrate 1, and in this case, the first adhesive layer is not needed. In this case, the connection circuit board 100 is directly arranged on the support layer 32 to form a pad area on the support layer 32.

[0080] FIG. 11 is a schematic view of the connection circuit board 100 according to an embodiment of the present disclosure. As shown in FIG. 11, the connection circuit board 100 includes connection pads, for the convenience of description, the pads for connecting with the copper needle are referred to as first connection pads 41, the pads for connecting with the driving circuit board 40 are referred to as second connection pads 42, and the pads for connecting with the driving chip D-IC are referred to as third connection pads 43. One first connection pad 41 is connected with one copper needle, and the first connection pad 41 can be connected with the third connection pad 43 through a connection line, and the third connection pad 43 can be connected with the second connection pad 42 through a connection line. After the third connection pad 43 is connected with the driving chip D-IC and the second connection pad 42 is connected with the driving circuit board 40, the driving circuit board 40 can control the driving chip D-IC to provide corresponding driving signals for the signal line 11. For example, the driving circuit board 40 is a flexible printed circuit board FPCB. Of course, the third connection pad 43 can not be arranged in the connection circuit board 100, that is, the driving circuit board 40 connected with the second connection pad 42 directly provides driving signals for the signal line 11.

[0081] Further, the number of signal lines 11 is multiple, and the number of corresponding first connection pads 41 is also multiple. In the embodiment of the present disclosure, the first connection pads 41 are arranged side by side, for example, the first connection pads 41 are arranged side by side in the row direction. As shown in FIG. 11, in the embodiment of the present disclosure, the connection circuit board 100 further includes a first alignment pad 45 and a second alignment pad 46, and the plurality of first connection pads 41 are arranged between the first alignment pad 45 and the second alignment pad 46. The first alignment pad 45 and the second alignment pad 46 are only used for alignment and do not carry signals, and are used to ensure the connection accuracy when the copper needle is crimped with the first connection pad 41. In the embodiment of the present disclosure, the connection accuracy of the copper needle is about ±5 μm.

[0082] In some examples, as shown in FIG. 8, the display substrate 1 further includes a substrate 12 and a light-emitting device 13 arranged on the substrate 12, for example, an OLED device. The light-emitting device 13 and the signal line 11 are both located on the side of the substrate 12 away from the back film 31. In order to realize the connection of the signal line 11 and the adapter component 101, as shown in FIG. 8, a via V1 can be formed on the substrate 12, and the signal line 11 is connected with the adapter component 101 through the via V1.

[0083] In some examples, the substrate 12 is made of a flexible material to facilitate the formation of the via V1 on the substrate 12. For example, the flexible material can include polyimide (PI).

[0084] In some examples, continuing to refer to FIG. 6, the display panel in the embodiment of the present disclosure not only includes the above structure, but also includes a cover plate 5 located on the side of the polarizer 2 away from the display substrate 1, and a transparent optical adhesive layer 6 is arranged between the cover plate 5 and the polarizer 2. ， The transparent optical adhesive layer 6 is used to bond the cover plate 5 and the polarizer 2 together. The display panel further includes an ink layer 7 located in the peripheral area PA, and the ink layer 7 is arranged on the surface of the cover plate 5 close to the polarizer 2. The ink layer 7 has a certain overlap amount with the polarizer 2, that is, the ink layer 7 and the polarizer 2 have overlapping projections in the plane of the cover plate 5. The ink layer 7 can protect the screen and prevent the screen from being scratched and worn.

[0085] In some examples, the projections of the adapter component 101 and the sealing structure 102 on the cover plate 5 are both located in the projection range of the ink layer 7 on the cover plate 5. For example, the projection of the ink layer 7 on the cover plate 5 is in contact with the edge of the cover plate 5, and the projections of the adapter component 101 and the sealing structure 102 on the cover plate 5 are both spaced apart from the edge of the cover plate 5.

[0086] In some embodiments, an edge sealing glue is formed on the side of the cover plate 5 close to the support structure 3, which at least partially surrounds the side of the display substrate 1. The edge sealing glue can be located on one or more sides of the display substrate 1. In some embodiments, the edge sealing glue is arranged around the display area AA and at least seals the edges of the display substrate 1. In some embodiments, the edge sealing glue is arranged around the display area AA on the side of the ink layer 7 away from the cover plate 5, and at least seals the edges of the display substrate 1. In the embodiments of the present disclosure, the edge sealing glue can further reduce the width of the middle frame assembly frame and further reduce the width of the whole machine frame. The existence of the middle frame assembly frame width is mainly affected by the product bending tolerance and the middle frame assembly tolerance, and is also to ensure that the middle frame will not cause the circuit to crack in the bending area BA after being pressed. In the embodiments of the present disclosure, since the edge sealing glue is arranged, the edge sealing glue is used to protect the edges of the display panel at the position of the copper needle after the bending area BA is cancelled, which can reduce or eliminate the risk of misplacement, short circuit, etc. when subjected to external force.

[0087] In some examples, the edges of the edge sealing glue do not exceed the edges of the cover plate 5, so that the width of the middle frame assembly frame reaches a smaller value. In some examples, at least one side edge of the edge sealing glue is flush with at least one side edge of the cover plate 5. For example, each edge of the edge sealing glue is flush with the corresponding edge of the cover plate 5. The orthographic projection of the edge sealing glue on the cover plate 5 can be located within the orthographic projection range of the ink layer 7 on the cover plate 5, so as to ensure that the edge sealing glue can be blocked by the ink layer 7.

[0088] In some examples, continuing to refer to FIG. 6, the edge sealing glue specifically includes a first edge sealing component 103 located on the side of the edge of the display substrate 1 away from the display area AA, and a second edge sealing component 104 arranged on the side of the layer where the connecting circuit board 100 is located away from the support structure 3, and the first edge sealing component 103 and the second edge sealing component 104 are connected. As shown in FIG. 12, since the overall thickness of the first edge sealing component 103 is relatively thick, the first edge sealing component 103 is composed of a plurality of stacked auxiliary film layers 1031. Preferably, the second edge sealing component 104 is an integral structure with the layer of auxiliary film layer 1031 farthest away from the cover plate 5. When the first edge sealing component 103 is composed of a plurality of auxiliary film layers 1031, the auxiliary film layer 1031 can be formed by dispensing, and UV glue can be used. This structure can reduce the influence of product bending tolerance and middle frame assembly tolerance on the whole machine frame, and also ensure that the UV glue can absorb pressure according to its high elastic modulus, high hardness and other characteristics when the middle frame is pressed, thereby protecting the stable circuit in the product and not affecting the normal lighting and use of the product, and the UV glue wraps the edges of each film layer of the display panel, thereby improving the water vapor resistance of the product.

[0089] Further, when the first edge sealing component 103 and the second edge sealing component 104 are both UV glue, the main component of the UV glue is acrylate, the viscosity is not less than 10000 cps, the storage modulus is not less than 150 Mpa, the hardness after curing is not less than 60A, and the compression resistance is not less than 70N. The first edge sealing component 103 and the second edge sealing component 104 are formed by dispensing, the dispensing uses an air pressure valve with a diameter of 65um, the dispensing speed is 30mm / s, the dispensing air pressure is 40psi, and the dispensing height is not greater than 0.1mm. The width of the second edge sealing component 104 and the farthest auxiliary film layer 1031 from the cover plate 5 is a, a is about 1200um, the width of the auxiliary film layer 1031 is b, b is not less than 0.3mm; the thickness of the first edge sealing component 103 is d, d is not less than 1200um, the thickness of the single-layer auxiliary film layer 1031 is c, c is 200um, so as to ensure the compression resistance and impact strength of the edge sealing glue.

[0090] As shown in FIG. 6, the first edge sealing component 103 is bonded to the side of the polarizer 2 and the side of the display substrate 1. In order to improve the adhesion between the first edge sealing component 103 and the polarizer 2 and the display substrate 1, in some examples, the edge of the polarizer 2 close to the first edge sealing component 103 and the edge of the display substrate 1 close to the first edge sealing component 103 are not flush, for example, there is a certain misalignment between the two edges, for example, the misalignment width is between 5-50um. A concave-convex structure can also be formed on the side of the polarizer 3 facing the first edge sealing component 103 and / or the side of the display substrate 1 facing the first edge sealing component 103, so as to improve the adhesion between the first edge sealing component 103.

[0091] In one example, as shown in FIG. 6, the width N of the first edge sealing component 103 is not less than 0.3mm, the distance A from the side edge VA of the display area AA close to the ink layer 7 to the display area AA is not less than 150um, and the overlap width B of the polarizer 2 and the ink layer 7 is not less than 276um, so the frame width T of the display panel in the embodiment of the present disclosure is A+B+N≥0.726mm, which is reduced by 0.984mm compared with the frame width T of 1.71mm of the display panel in FIG. 3.

[0092] In the embodiment of the present disclosure, a preparation method of a display panel is also provided, which can be used to prepare the display panel described above, and the preparation method comprises:

[0093] S1, providing a display substrate 1.

[0094] FIG. 13 is a schematic diagram of a partial structure of a display substrate according to an embodiment of the present disclosure. As shown in FIG. 13, the display substrate 1 includes a substrate 12, and structures such as a signal line 11, a pixel driving circuit 14, and a light emitting device 13 formed on the substrate 12. For example, the display substrate 1 is an OLED display substrate, and the light emitting device 13 is an OLED device. For example, the substrate 12 can be a flexible substrate, which can be made of a material such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film.

[0095] Exemplarily, the pixel driving circuit 14 can include a transistor and a storage capacitor, only one transistor and one storage capacitor in each pixel driving circuit 14 are shown in FIG. 13, the transistor includes an active layer 142, a gate electrode 141, a source electrode 143 and a drain electrode 144. In some possible implementation manners, the pixel driving circuit 14 of each sub-pixel can include: a buffer layer BFL disposed on the substrate substrate 12, the active layer 142 disposed on the buffer layer BFL, the first gate insulating layer GI1 covering the active layer 142, the gate electrode 141 and the first capacitor electrode 145 disposed on the first gate insulating layer GI1, the second gate insulating layer GI2 covering the gate electrode 141 and the first capacitor electrode 145, the second capacitor electrode 146 disposed on the second gate insulating layer GI2, the interlayer insulating layer ILD covering the second capacitor electrode 146, the via hole is formed on the interlayer insulating layer ILD, and the via hole exposes the active layer 142. The source electrode 143 and the drain electrode 144 are disposed on the interlayer insulating layer ILD, and the source electrode 143 and the drain electrode 144 are connected with the active layer 142 through the via hole respectively. The planarization layer PLN is located on the side of the source electrode 143 and the drain electrode 144 away from the substrate substrate 12. The first capacitor electrode 145 and the second capacitor electrode 146 constitute the storage capacitor. In some possible implementation manners, the buffer layer BFL, the first gate insulating layer GI1, the second gate insulating layer GI2 and the interlayer insulating layer ILD can adopt any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, a multi-layer or a composite layer. The gate electrode 141, the source electrode 143, the drain electrode 144, the first capacitor electrode 145 and the second capacitor electrode 146 can adopt any one or more of metal materials such as silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy material of the above-mentioned metals such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure or a multi-layer composite structure such as Ti / Al / Ti. The active layer 142 can adopt amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathienyl or polythienyl, etc. That is, the present disclosure is applicable to the transistor manufactured based on oxide technology, silicon technology or organic technology. The active layer 142 based on oxide technology can adopt oxide containing indium and tin, oxide containing tungsten and indium, oxide containing tungsten, indium and zinc, oxide containing titanium and indium, oxide containing titanium, indium and tin, oxide containing indium and zinc, oxide containing silicon, indium and tin, oxide containing indium, gallium and zinc, etc.

[0096] Exemplarily, the light emitting device 13 can include an anode 131, an organic light emitting layer 133 and a cathode 132, the anode 131 is disposed on the planar layer PLN and connected with the drain electrode 144 through the via hole formed on the planar layer PLN, the pixel definition layer PDL is disposed on the anode 131 and the planar layer PLN, and the pixel opening is disposed on the pixel definition layer PDL, the pixel opening exposes the anode 131, the organic light emitting layer 133 is disposed in the pixel opening, and the cathode 132 is disposed on the organic light emitting layer 133. The organic light emitting layer 133 emits light of a corresponding color under the action of the voltage applied by the anode 131 and the cathode 132.

[0097] Exemplarily, the organic light emitting layer 133 can include at least a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) and an electron injection layer (EIL) stacked, the hole injection layer and the hole transport layer can be collectively referred to as a hole layer, and the electron transport layer and the electron injection layer can be collectively referred to as an electron layer.

[0098] Exemplarily, the encapsulation layer 15 can include a first encapsulation layer 151, a second encapsulation layer 152 and a third encapsulation layer 153 stacked, the first encapsulation layer 151 and the third encapsulation layer 153 can be inorganic materials, and the second encapsulation layer 152 can be an organic material. The second encapsulation layer 152 is disposed between the first encapsulation layer 151 and the third encapsulation layer 153, which can prevent external water vapor from entering the light emitting device 13.

[0099] S2, forming a polarizer 2 on the light emitting side of the display substrate 1, and forming a support structure 3 on the side of the display substrate 1 away from the polarizer 2; wherein, referring to FIG. 6, the support structure 3 is recessed relative to the display substrate 1, thereby forming a first space.

[0100] Wherein, the order of forming the polarizer 2 and the support structure 3 in step S2 is not limited, the polarizer 2 can be formed first and then the support structure 3 can be formed; or the support structure 3 can be formed first and then the polarizer 2 can be formed. The support structure 3 can include a back film 31 and a support layer 32, which are the same as the structures in the display panel described above, and therefore will not be described here.

[0101] Wherein, at least one of the back film 31 and the support layer 32 is recessed relative to the display substrate 1. In one example, the back film 31 and the support layer 32 are recessed to form a substantially flush edge.

[0102] S3, in the first space, disposing a switching component 101, so that the switching component 101 is connected with the signal line 11 in the display substrate 1; forming a connection circuit board 100 on the side of the support structure 3 away from the display substrate 1, and connecting the connection circuit board 100 with the switching component 101.

[0103] Referring to FIG. 8, the substrate 12 can be provided with a via V1, and the signal line 11 is connected to the adapter component 101 through the via V1.

[0104] In step S3, the adapter component 101 can be a copper needle, and a sealing structure 102 wrapping the copper needle can be formed in this step. The sealing structure 102 can be formed by curing an epoxy material. The adapter component 101 is located in the peripheral area PA of the display substrate 1.

[0105] In some examples, the display substrate 1 is not provided with a bending area and a pad area, and the connection circuit board 100 is directly arranged on the support layer 32 to form a pad area on the support layer 32.

[0106] In some examples, the preparation method of the embodiment of the present disclosure further includes the steps of sequentially forming a transparent optical adhesive 6 and a cover plate 5 on the side of the polarizer 2 away from the display substrate 1; the cover plate 5 is provided with an ink layer 7 close to the surface of the display substrate 1; the ink layer 7 is located at the edge of the peripheral area PA away from the display area AA, and surrounds the display area AA.

[0107] The edge position of the polarizer 2 can refer to the description of the display panel above, which will not be repeated here.

[0108] Further, the preparation method in the embodiment of the present disclosure further includes: forming an edge sealing adhesive on the side of the cover plate 5 close to the display substrate 1, the edge sealing adhesive surrounds at least part of the display area AA, and the edge sealing adhesive is used at least for sealing the edge of the display substrate 1. Specifically, a first edge sealing assembly 103 can be formed on the side of the display substrate 1 away from the display area AA, and a second edge sealing assembly 104 can be formed on the side of the layer where the connection circuit board 100 is located away from the support structure 3; the second edge sealing assembly 104 is connected to the first edge sealing assembly 103.

[0109] Further, since the overall thickness of the first edge sealing assembly 103 is relatively thick, the first edge sealing assembly 103 is composed of a plurality of stacked auxiliary film layers 1031. Preferably, the second edge sealing assembly 104 is an integral structure with the auxiliary film layer 1031 farthest from the cover plate 5. When the first edge sealing assembly 103 is composed of a plurality of auxiliary film layers 1031, the auxiliary film layers 1031 can be formed by dispensing. In one example, when the first edge sealing assembly 103 and the second edge sealing assembly 104 are both composed of UV adhesive, the main component of the UV adhesive is acrylate, the viscosity is not less than 10000 cps, the storage modulus is not less than 150 Mpa, the hardness after curing is not less than 60A, and the compression resistance is not less than 70N. The first edge sealing assembly 103 and the second edge sealing assembly 104 are formed by dispensing, the dispensing uses an air pressure valve with a diameter of 65um, a dispensing speed of 30mm / s, a dispensing air pressure of 40psi, and a dispensing height of not more than 0.1mm.

[0110] The display device according to the embodiments of the present disclosure can include a display panel, and of course can include a middle frame and the like. Since the display device includes the display panel described above, the display device as a whole has a narrow frame and a high impact resistance.

[0111] The display device can include any device or product having a display function. For example, the display device can be a vehicle-mounted display device, a smart phone, a mobile phone, an e-book reader, a desktop PC, a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (e.g., a head-mounted device, an electronic bracelet, or a smart watch), and the like.

[0112] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display panel, comprising: The display substrate includes multiple signal lines; A functional film layer is disposed on one side of the display substrate; A support structure is disposed on the side of the display substrate opposite to the functional film layer; Adapter components; and A connecting circuit board is disposed on the side of the support structure away from the display substrate; wherein, The support structure is recessed relative to the display substrate to form a first space. The adapter is located in the first space. The plurality of signal lines are connected to the connection circuit board through the adapter component in the first space.

2. The display panel according to claim 1, wherein, The display substrate includes a display area and a peripheral area located on at least one side of the display area. The display substrate does not have a bending area or a pad area.

3. The display panel according to claim 1, wherein, The connecting circuit board does not contact the display substrate.

4. The display panel according to claim 1, wherein, The support structure includes a back film and a support layer disposed sequentially away from the display substrate, wherein at least one of the back film and the support layer is recessed to form the first space.

5. The display panel according to claim 4, wherein, The back membrane and the support layer shrink inward to form substantially flush edges.

6. The display panel according to claim 4, wherein, The connection circuit board is directly mounted on the support layer to form a solder pad area, which is located on the support layer.

7. The display panel according to claim 1, wherein, The functional film layer includes a polarizer, and at least one edge of the polarizer is substantially flush with at least one edge of the display substrate.

8. The display panel according to claim 7, wherein, The display substrate includes a display area and a peripheral area located on at least one side of the display area, and the edge of the support structure is closer to the display area than the edge of the polarizer.

9. The display panel according to claim 8, wherein, The adapter is located in the peripheral area of ​​the display substrate.

10. The display panel according to claim 1, wherein, A sealing structure is filled in the first space; the adapter is wrapped by the sealing structure, and the two ends that are arranged opposite to each other along the thickness direction of the display substrate are respectively connected to the signal line and the connection circuit board.

11. The display panel according to claim 1, wherein, The connection circuit board includes at least a first connection pad connected to the adapter component and a second connection pad bonded to the drive circuit board; the drive circuit board is configured to provide drive signals to the signal lines.

12. The display panel according to claim 11, wherein, The connection circuit board also includes a third connection pad, which is bonded to a driver chip, which is configured to provide a drive signal to the signal line under the control of the driver circuit board.

13. The display panel according to claim 11, wherein, The number of the first connection pads is multiple, and the multiple first connection pads are arranged side by side; the connection circuit board also includes a first alignment pad and a second alignment pad, and the multiple first connection pads are arranged between the first alignment pad and the second alignment pad.

14. The display panel according to claim 1, wherein, The connecting circuit board is bonded to the side of the support structure opposite to the display substrate by a first adhesive layer.

15. The display panel according to any one of claims 1-14, wherein, The display substrate includes a display area and a peripheral area located on at least one side of the display area; the display panel further includes: A cover plate is disposed on the side of the functional film layer opposite to the display substrate; the edge of the cover plate is further away from the display area than the edge of the display substrate; An edge sealing adhesive is disposed on the side of the cover plate near the display substrate and at least partially surrounds the display area. The edge sealing adhesive is used at least to seal the edge of the display substrate.

16. The display panel according to claim 15, wherein, The edge sealing adhesive includes a first edge sealing component and a second edge sealing component; wherein... The first edge sealing component is disposed on the side of the display substrate away from the display area; The second edge sealing component is connected to the first edge sealing component and is disposed on the side of the layer where the connecting circuit board is located, away from the support structure.

17. The display panel according to claim 16, wherein, The first edge sealing assembly includes multiple auxiliary film layers stacked sequentially in a direction away from the cover plate; the second edge sealing assembly and the auxiliary film layer furthest from the cover plate are integrally formed.

18. The display panel according to claim 16, wherein, Both the first edge sealing assembly and the second edge sealing assembly are made of acrylic ester materials.

19. The display panel according to claim 15, wherein, It also includes an ink layer disposed on the side of the cover plate near the functional film layer, the ink layer being located in the peripheral area and surrounding the display area.

20. A display device comprising a display panel according to any one of claims 1-19.

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