Substrate, backlight plate, display device and electronic device

Abstract

The present disclosure relates to the technical field of display. Provided are a substrate, a backlight plate, a display device and an electronic device. A bonding pad and a solder mask layer are provided on a surface of the substrate; the bonding pad comprises a first region and a second region, the first region having a first edge and a second edge, the first edge being opposite the second edge in a first direction, at least part of the second region being located on the side of the first edge away from the second edge; and part of the solder mask layer is located on the side of the first edge away from the first region. A lamp bead is less prone to deviating from a preset position, thereby improving the positional accuracy of the lamp bead.

Description

Substrate, back light plate, display device and electronic device

[0001] Cross Reference to Related Applications

[0002] The present disclosure claims priority to the Chinese patent application No. 202410832304.8, filed on June 25, 2024, and entitled “Substrate, back light plate, display device and electronic device”, the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of display, and in particular to a substrate, a back light plate, a display device and an electronic device. BACKGROUND

[0004] The back light plate includes lamp beads welded thereon. In the prior art, the lamp beads of the back light plate are prone to tilting and deviation. SUMMARY

[0005] Embodiments of the present disclosure provide a substrate, a back light plate, a display device and an electronic device.

[0006] Embodiments of the present disclosure adopt the following technical solutions:

[0007] In one aspect, a substrate is provided, the surface of the substrate is provided with a solder pad and a solder resist layer, the solder pad includes a first area and a second area, the first area has a first edge and a second edge, the first edge and the second edge are opposite along a first direction, at least part of the second area is located on a side of the first edge away from the second edge; part of the solder resist layer is located on a side of the first edge away from the first area.

[0008] In some embodiments, the first area and the second area are connected as an integral structure.

[0009] In some embodiments, the first edge includes opposite first and second ends, the second area includes a first sub-area and a second sub-area, the first sub-area is located at the first end, and the second sub-area is located at the second end.

[0010] In some embodiments, the first sub-area and the second sub-area are disconnected on a side away from the first area.

[0011] In some embodiments, the first sub-area and the second sub-area are connected on a side away from the first area.

[0012] In some embodiments, the first edge comprises a plurality of sub-edges arranged along a second direction, the second direction being perpendicular to the first direction.

[0013] In some embodiments, the pad further comprises a connecting region between the second region and the first region, the connecting region being located between two adjacent sub-edges, the second region being connected to the first region through the connecting region.

[0014] In some embodiments, the first region is disconnected from the second region.

[0015] In some embodiments, the length of the first edge is less than or equal to the length of the second edge.

[0016] In some embodiments, the first region and the second region have a width along the second direction, the width of the second region being greater than the width of the first region, the second direction being perpendicular to the first direction.

[0017] In some embodiments, the width of the pad region gradually increases along a direction towards the second region.

[0018] In some embodiments, the periphery of the pad is provided with a solder resist layer, the solder resist layer being arranged in the same layer as the pad.

[0019] In some embodiments, the pad comprises a first pad and a second pad, the first pad and the second pad being arranged along the first direction, and the first region of the first pad and the second pad being arranged opposite to each other.

[0020] In another aspect, a backlight panel is provided, the backlight panel comprising a substrate, a solder, and a lamp bead, the surface of the substrate being provided with a pad and a solder resist layer, the pad comprising a first region and a second region, the first region having a first edge and a second edge, the first edge and the second edge being opposite to each other along a first direction, at least part of the second region being located on the side of the first edge away from the second edge, part of the solder resist layer being located on the side of the first edge away from the first region; the solder being located on the surface of the first region and the second region; the lamp bead being provided with a pin, the pin being connected to the solder within the first region, and the pin being located between the first edge and the second edge.

[0021] In yet another aspect, an electronic device is provided, which includes a substrate, solder, and an electronic component. The substrate has a surface provided with a pad and a solder resist layer. The pad includes a first region and a second region. The first region has a first edge and a second edge, and the first edge is opposite to the second edge along a first direction. At least a part of the second region is located on a side of the first edge away from the second edge. A part of the solder resist layer is located on a side of the first edge away from the first region. The solder is located on the surface of the first region and the second region. The electronic component is provided with a pin, which is connected with the solder in the first region and is located between the first edge and the second edge.

[0022] In the substrate, the backlight plate, and the electronic device provided by the embodiments of the present disclosure, during the soldering process of the pin and the pad, the liquid solder is limited within the range of the surface of the pad, i.e., the liquid solder is limited within the range surrounded by the edge of the pad. When the pin is placed on the pad, the pin can only float within the range of the liquid solder, i.e., the pin can only be within the range surrounded by the edge of the pad. The pin is placed in the soldering area, i.e., the pin is located between the first edge and the second edge. The pin is limited between the first edge and the second edge and cannot enter the second region beyond the first edge, which reduces the floating range of the pin, so that the lamp bead is not easy to deviate from the preset position, and the position accuracy of the lamp bead is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative effort based on these drawings.

[0024] FIG. 1 is a front view structure of a display device provided by an embodiment of the present disclosure;

[0025] FIG. 2 is a cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure;

[0026] FIG. 3 is a cross-sectional structure diagram of a lamp bead;

[0027] FIG. 4 exemplarily shows a process diagram of pre-coating solder paste;

[0028] FIG. 5 exemplarily shows a diagram after the substrate is pre-coated with solder paste;

[0029] FIG. 6 exemplarily shows a diagram after the lamp bead is attached to the substrate;

[0030] FIG. 7 exemplarily shows a diagram after the lamp bead is soldered to the substrate;

[0031] FIG. 8 is a diagram of a lamp bead and a substrate in an inclined state after welding in the related art;

[0032] FIG. 9 is a diagram of a lamp bead and a substrate after welding in the related art;

[0033] FIG. 10 is another diagram of a lamp bead and a substrate after welding in the related art;

[0034] FIG. 11 is a diagram of a partial structure of a substrate according to an embodiment of the present disclosure;

[0035] FIG. 12 is a cross-sectional view of FIG. 11 taken along line B-B;

[0036] FIG. 13 is a diagram of a pad according to an embodiment of the present disclosure;

[0037] FIG. 14 is a diagram of relative positions of a pin and a pad according to an embodiment of the present disclosure;

[0038] FIG. 15 is a cross-sectional view of FIG. 14 taken along line C-C;

[0039] FIG. 16 is a diagram of a lamp bead and a pad after welding according to an embodiment of the present disclosure;

[0040] FIG. 17 is a diagram of another pad according to an embodiment of the present disclosure;

[0041] FIG. 18 is a diagram of another pad according to an embodiment of the present disclosure;

[0042] FIG. 19 is a diagram of another pad according to an embodiment of the present disclosure;

[0043] FIG. 20 is a diagram of another pad according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present disclosure.

[0045] In the embodiments of the present disclosure, the same items or similar items with basically the same functions and effects are regionally divided by using "first", "second", "third", "fourth", etc. only for clearly describing the technical solutions in the embodiments of the present disclosure, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0046] In embodiments of the present disclosure, the meaning of "multiple" is two or more, and the meaning of "at least one" is one or more, unless otherwise explicitly and specifically limited.

[0047] In embodiments of the present disclosure, the orientation or position relationship indicated by the terms "upper", "lower", and the like is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0048] FIG. 1 is a front view structure of a display device according to an embodiment of the present disclosure. As shown in FIG. 1, some embodiments of the present disclosure provide a display device 1000, which can be any device having a display function. For example, the display device 1000 can be a mobile phone, a wireless device, a personal data assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, an automobile display (e.g., a speedometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rear view camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, a building structure, a packaging and aesthetic structure (e.g., a display of an image of a piece of jewelry), etc. In FIG. 1, the display device 1000 is taken as an example of a computer display.

[0049] The display device 1000 includes a display module 100, which displays an image through the display module 100. FIG. 2 is a sectional structure diagram of a display module according to an embodiment of the present disclosure. As shown in FIG. 2, the display module 100 includes a display panel 110 and a backlight panel 120. The display panel 110 can be a liquid crystal display panel (LCD), and the backlight panel 120 is used to provide backlight for the display panel 110.

[0050] When the display panel 110 is a liquid crystal display panel, the display panel 110 can be a horizontal electric field type liquid crystal display panel or a vertical electric field type liquid crystal display panel. When the display panel 110 is a horizontal electric field type liquid crystal display panel, the display panel 100 can be an in-plane switching (IPS) liquid crystal display panel or an advanced super dimension switching (ADS) liquid crystal display panel.

[0051] Continuing to refer to FIG. 2, the backlight plate 120 includes a substrate 121 and a plurality of lamp beads 122 disposed on the substrate 121. For example, the backlight plate 120 includes the plurality of lamp beads 122 disposed on a surface of the substrate 121 facing the display panel 110, and the plurality of lamp beads 122 are arranged in an array.

[0052] The lamp bead 122 can be a light emitting diode (LED) or a mini LED. Hereinafter, the lamp bead 122 is exemplarily introduced as a mini LED.

[0053] FIG. 3 is a schematic diagram of a cross-sectional structure of a lamp bead 122. As shown in FIG. 3, the lamp bead 122 includes a pin 10, and the pin 10 is electrically connected to a driving circuit. For example, the lamp bead 122 includes an anode pin 10 and a cathode pin 10, and the anode pin 10 and the cathode pin 10 are respectively electrically connected to the driving circuit. A driving current flows from the anode pin 10 to the cathode pin 10, so that the lamp bead 122 emits light under the driving of the driving current.

[0054] A surface of the substrate 121 is provided with a solder pad 23, and the pin 10 of the lamp bead 122 is soldered on the solder pad 23, so as to fix the lamp bead 122 and electrically connect the lamp bead 122 to the driving circuit. That is, one end of the lamp bead 122 provided with the pin 10 faces the surface of the substrate 121.

[0055] Hereinafter, a process of soldering the lamp bead 122 on the surface of the substrate 121 is exemplarily introduced by taking a reflow process as an example. The reflow process can include multiple steps such as pre-tinning, patching, and reflow soldering.

[0056] FIG. 4 exemplarily shows a schematic diagram of a pre-tinning process, and FIG. 5 exemplarily shows a schematic diagram of the substrate 121 after pre-tinning. As shown in FIGS. 4 and 5, a surface of the substrate 121 provided with the solder pad 23 is a soldering surface. In the pre-tinning process, a template (for example, a steel mesh) is disposed above the soldering surface, an area of the template opposite to the solder pad 23 is provided with an opening, a surface of the template away from the substrate 121 is pre-tinned with a tin paste, and a doctor blade moves along a direction from left to right as shown in the figure. Under the action of the doctor blade, the tin paste adheres to the surface of the solder pad 23 through the opening, so as to obtain the substrate 121 with the tin paste adhered as shown in FIG. 5.

[0057] FIG. 6 exemplarily shows a schematic diagram of the substrate 121 after patching the lamp bead 122. As shown in FIG. 6, in the patching process, one end of the lamp bead 122 provided with the pin 10 faces the soldering surface of the substrate 121, and the pin 10 of the lamp bead 122 is in contact with the tin paste.

[0058] FIG. 7 illustrates a simplified diagram of the lamp bead 122 after being welded with the substrate 121. As shown in FIG. 7, during the reflow welding process, the solder in the solder paste melts under high temperature and uniformly covers the surface of the pad 23 by flowing, and solidifies after the solder cools down to achieve the fixation and electrical connection of the solder with the pin 10 and the pad 23.

[0059] However, it is found in actual application that after the lamp bead 122 is welded with the substrate 121, the lamp bead 122 is prone to be inclined at a certain angle relative to the substrate 121. FIG. 8 is a simplified diagram of the lamp bead 122 and the substrate 121 after being welded in the related art, which is, for example, a view A of FIG. 7. As shown in FIG. 8, when the volume of the solder is large, after the solder melts, the liquid solder has a large thickness along the vertical direction shown in the figure, and the lamp bead 122 is in a floating state on the liquid solder, thereby easily making the lamp bead 122 be in an inclined state, and after the liquid solder solidifies, the lamp bead 122 is inclined at a certain angle relative to the substrate 121.

[0060] In order to prevent the lamp bead 122 from being inclined relative to the substrate 121 after being welded, one method proposed in the related art is to reduce the volume of the solder paste pre-coated on the pad 23. In the case that the area of the pad 23 is constant, reducing the volume of the solder paste can reduce the volume of the solder in the solder paste, thereby reducing the size of the liquid solder along the vertical direction shown in FIG. 7. For example, the size of the opening in the stencil is reduced, thereby reducing the volume of the solder paste passing through the opening. However, the size of the opening in the stencil needs to meet certain requirements, and when the size of the opening is too small, the solder paste is not easy to pass through the opening and adhere to the surface of the pad 23, resulting in that the lamp bead 122 and the pad 23 cannot be welded.

[0061] For example, continuing to refer to FIG. 4, the width of the opening is w, the thickness of the opening is t, the ratio of the width to the thickness of the opening w / t needs to be greater than 1.5, and the ratio of the area of the opening to the area of the side wall of the opening needs to be greater than 0.66, and when the size of the opening cannot meet the above requirements, the solder paste is not easy to pass through the opening and adhere to the surface of the pad 23. In actual application, the area of the opening needs to be adapted to the area of the pad 23, for example, the area of the opening needs to be smaller than the area of the pad 23, so as to avoid the solder paste being pre-coated on the area outside the pad 23 as much as possible and reduce the volume of the solder paste. When the lamp bead 122 is a Mini LED lamp bead 122, since the size of the lamp bead 122 is small (for example, 50 μm-200 μm), the size of the pin 10 of the lamp bead 122 is also small (for example, 25 μm-100 μm), and accordingly the area of the pad 23 is also small. However, in order to meet the requirements of the ratio of the width to the thickness of the opening, the ratio of the area of the opening to the area of the side wall of the opening, etc., the size of the opening cannot be further reduced.

[0062] In order to prevent the lamp bead 122 from being inclined relative to the substrate 121 after soldering, another method proposed by the related art is to increase the area of the solder pad 23. In the case of a certain volume of solder, increasing the area of the solder pad 23 can reduce the thickness of the solder along the vertical direction shown in FIG. 7. However, after increasing the area of the solder pad 23, the position accuracy of the lamp bead 122 after soldering is poor.

[0063] Specifically, the solder melts to form a liquid solder and covers the surface of the soldering machine. Since the liquid solder has good fluidity, the lamp bead 122 can move in the range covered by the liquid solder along a direction parallel to the substrate 121. After increasing the area of the solder pad 23, the moving range of the lamp bead 122 on the solder pad 23 increases, and the lamp bead 122 is easily deviated from the predetermined position, which reduces the light uniformity of the backlight plate 120 and even causes some lamp beads 122 to fail to emit light normally. FIG. 9 is a schematic view of the lamp bead 122 and the substrate 121 after soldering in the related art, and FIG. 10 is another schematic view of the lamp bead 122 and the substrate 121 after soldering in the related art. As shown in FIG. 9, the lamp bead 122 deviates from the center of the solder pad 23 along the left-right direction shown in the figure and is soldered at a position deviated to the right of the solder pad 23, which reduces the light uniformity of the backlight plate 120. As shown in FIG. 10, the lamp bead 122 is soldered only with one solder pad 23 and is not soldered with the other solder pad 23, which causes the lamp bead 122 to fail to emit light.

[0064] In view of this, the substrate 121 provided by the embodiments of the present disclosure adopts a new type of solder pad 23, which can improve the inclination of the lamp bead 122 relative to the substrate 121 and prevent the lamp bead 122 from deviating from the predetermined position. The substrate 121 provided by the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0065] FIG. 11 is a schematic view of part of a substrate 121 provided by an embodiment of the present disclosure, and FIG. 12 is a sectional view of FIG. 11 along line B-B. As shown in FIG. 11 and FIG. 12, the surface of the substrate 121 is provided with a solder pad 23. The surface of the solder pad 23 can be exposed to facilitate soldering of the solder pad 23 and the lamp bead 122.

[0066] With reference to FIG. 12, the substrate 121 can further include a substrate 21 and a conductive wire 22. The conductive wire 22 is arranged on the surface of the substrate 21. The solder pad 23 is located on the side of the conductive wire 22 away from the substrate 21, and the solder pad 23 is electrically connected to the conductive wire 22.

[0067] The substrate 21 can be a glass substrate 21. In this case, the substrate 121 can be prepared by a glass-based semiconductor process, for example, the conductive wire 22 and the solder pad 23 can be prepared by a glass-based semiconductor process. Of course, the substrate 21 can also be made of other materials, and the embodiments of the present disclosure do not limit the material of the substrate 21.

[0068] The material of the conductive wire 22 can be metal, for example, copper. For example, a copper conductive layer is formed on the surface of the substrate 21, and then the conductive wire 22 is formed in the copper conductive layer through a patterning process.

[0069] The pad 23 is formed on the side of the conductive wire 22 away from the substrate 21. For example, the pad 23 is electroless nickel / immersion gold (ENIG), also known as nickel gold, nickel gold, or electroless nickel gold. Palladium is replaced on the surface of the conductive wire 22 through a chemical reaction, and then a layer of nickel-phosphorus alloy is chemically plated on the basis of the palladium core. Then, a layer of gold is plated on the surface of the nickel through a displacement reaction. When the pad 23 is electroless nickel / immersion gold, the pad 23 has better welding performance. Of course, the material and preparation process of the pad 23 are not limited in the embodiments of the present disclosure.

[0070] With reference to FIGS. 11 and 12, the substrate 121 can further include a solder resist layer 24, which is disposed around and surrounds the pad 23. The solder resist layer 24 is not easily adsorbed by the solder, so that the solder is as much as possible to be limited to the area where the pad 23 is located.

[0071] For example, along the thickness direction of the pad 23, the surface of the solder resist layer 24 away from the substrate 21 is flush with the surface of the pad 23 away from the substrate 21.

[0072] For example, the main material of the solder resist layer 24 is acrylic copolymer.

[0073] It should be noted that in the embodiments of the present disclosure, only the structure in which the substrate 121 includes a glass substrate 21 is taken as an example. In actual application, the substrate 121 can also be a printed circuit board (PCB). The pad 23 is located on the surface of the printed circuit board. The printed circuit board further includes a conductive layer inside. The conductive wire 22 is arranged in the conductive layer, and the conductive wire 22 is electrically connected to the pad 23. At this time, the pad 23 can be electroless nickel / immersion gold, or can be metal such as copper or aluminum.

[0074] FIG. 13 is a schematic view of a pad 23 in the embodiments of the present disclosure. The area in the dashed box in FIG. 13 is a first area 231, and the area outside the dashed box is a second area 232. As shown in FIG. 13, the pad 23 includes the first area 231 and the second area 232. After the pad 23 is welded to the lamp bead 122, the surfaces of the first area 231 and the second area 232 are covered with solder, and the pin 10 of the lamp bead 122 is welded to the first area 231.

[0075] The second area 232 is arranged in the pad 23 in addition to the first area 231, so as to increase the area of the pad 23. In the case that the volume of the solder is constant, increasing the area of the pad 23 can thin the thickness of the molten solder, so as to prevent the lamp bead 122 from tilting on the liquid solder, and improve the problem that the lamp bead 122 tilts relative to the substrate 121 after the lamp bead 122 is welded.

[0076] The sum of the areas of the first area 231 and the second area 232 can be calculated according to the volume of the tin paste and the expected thickness of the liquid solder. For example, the volume of the tin paste is V, the expected thickness of the liquid solder is t1, and the volume proportion of the solder in the tin paste is 50%, so the sum of the areas of the first area 231 and the second area 232 is 50%*V / t1.

[0077] With reference to FIG. 13, the first area 231 has a first edge 1 and a second edge 2, the first edge 1 is opposite to the second edge 2 along the first direction X, and at least part of the second area 232 is located on the side of the first edge 1 away from the second edge 2. That is, along the first direction X, the first edge 1 is located between the first area 231 and the second area 232.

[0078] The first edge 1 and the second edge 2 are both physical edges of the pad 23, rather than virtual edges divided on the pad 23. For example, the first edge 1 and the second edge 2 are the side edges of the chemical nickel gold.

[0079] The part of the solder resist layer 24 is located on the side of the first edge 1 away from the first area 231, and the part of the solder resist layer 24 is located on the side of the second edge 2 away from the first area 231. Of course, the pad 23 also includes other edges, and the side of each edge away from the pad 23 can be provided with the solder resist layer 24. For example, the solder resist layer 24 is close to the first edge 1, the second edge 2 and other edges of the pad, so that the liquid solder is limited within the range of each edge of the pad 23.

[0080] Because the solder resist layer 24 is arranged around the pad 23, the liquid solder is limited within the range where the surface of the pad 23 is located during the welding process, that is, the liquid solder is limited within the range surrounded by the edges of the pad 23. When the pin 10 is placed on the pad 23, the pin 10 can only float within the range where the liquid solder is located, that is, the pin 10 can only be within the range surrounded by the edges of the pad 23.

[0081] FIG. 14 is a schematic view of the relative position of the pin 10 and the pad 23 in an embodiment of the present disclosure. As shown in FIG. 14, the pin 10 of the lamp bead 122 is placed in the soldering area, i.e., the pin 10 of the lamp bead 122 is located between the first edge 1 and the second edge 2. As described above, the pin 10 of the lamp bead 122 is limited between the first edge 1 and the second edge 2 and cannot pass the first edge 1 into the second area 232, which reduces the floating range of the pin 10, so that the lamp bead 122 is not easy to deviate from the preset position, and the position accuracy of the lamp bead 122 is improved.

[0082] FIG. 15 is a sectional view of FIG. 14 along C-C. As shown in FIGS. 14 and 15, when the pin 10 moves along the first direction X towards the second area 232 and passes the first edge 1, the pin 10 will move along the direction of the arrow shown in FIG. 15 under the action of the surface tension of the liquid solder, and finally be limited between the first edge 1 and the second edge 2.

[0083] In actual application, the distance between the first edge 1 and the second edge 2 can be determined according to the size of the pin 10 along the first direction X and the position accuracy of the pin 10 soldering. For example, when the position accuracy requirement of the pin 10 along the first direction X is ±30 μm, the size of the pin 10 along the first direction X plus 60 μm is equal to the distance between the first edge 1 and the second edge 2.

[0084] With continued reference to FIG. 11, the surface of the substrate 121 can be provided with a plurality of pads 23. Exemplarily, two adjacent pads 23 are a pad 23 group, one pad 23 group is used for soldering with one lamp bead 122, and the surface of the substrate 121 is provided with a plurality of pad 23 groups. The pad 23 group includes a first pad 23 and a second pad 23, the first pad 23 is soldered with the anode pin 10 of the lamp bead 122, and the second pad 23 is soldered with the cathode pin 10 of the lamp bead 122.

[0085] With continued reference to FIG. 11, the first pad 23 and the second pad 23 are arranged at intervals along the first direction X, and the first area 231 of the first pad 23 and the first area 231 of the second pad 23 are oppositely arranged.

[0086] FIG. 16 is a schematic view of the soldering of the lamp bead 122 and the pad 23 in an embodiment of the present disclosure. As shown in FIG. 16, one pin 10 of the lamp bead 122 is limited in the soldering area of the first pad 23, and the other pin 10 of the lamp bead 122 is limited in the soldering area of the second pad 23, and the soldering area of the first pad 23 and the soldering area of the second pad 23 cooperate to jointly limit the position of the lamp bead 122.

[0087] When the lamp bead 122 moves towards the first pad 23, the first edge 1 and the second edge 2 of the first pad 23 play a traction role on the pin 10 located on the first pad 23, the first edge 1 and the second edge 2 of the second pad 23 play a traction role on the pin 10 located on the second pad 23, which prevents the lamp bead 122 from moving towards the first pad 23, and can prevent the lamp bead 122 from being separated from the second pad 23. Similarly, when the lamp bead 122 moves towards the second pad 23, the first edge 1 and the second edge 2 of the first pad 23 play a traction role on the pin 10 located on the first pad 23, the first edge 1 and the second edge 2 of the second pad 23 play a traction role on the pin 10 located on the second pad 23, which prevents the lamp bead 122 from moving towards the second pad 23, and can prevent the lamp bead 122 from being separated from the first pad 23.

[0088] Compared with the pad 23 shown in FIG. 10, the first pad 23 and the second pad 23 are both provided with the first edge 1, and when the lamp bead 122 moves along the first direction X, the first edge 1 of the first pad 23 and the first edge 1 of the second pad 23 can both play a traction role on the pin 10, which increases the limiting effect on the position of the pin 10, so that the lamp bead 122 is not easy to deviate to one side of the first pad 23 or one side of the second pad 23.

[0089] Continuing to refer to FIG. 13, in some embodiments, the first region 231 and the second region 232 are connected as an integral structure, that is, the first region 231 and the second region 232 are in communication, so that the first region 231 and the second region 232 have a channel for the liquid solder to flow, and the liquid solder can flow from the first region 231 to the second region 232, thereby reducing the thickness of the liquid solder in the first region 231 and preventing the lamp bead 122 from tilting.

[0090] The thickness of the first region 231 and the second region 232 can be the same or different. When the thickness of the first region 231 and the second region 232 is the same, the first region 231 and the second region 232 can be prepared in the same process, which reduces the difficulty of preparing the pad 23; when the thickness of the first region 231 is greater than that of the second region 232, the liquid solder is more likely to flow from the first region 231 to the second region 232, thereby reducing the thickness of the liquid solder in the first region 231.

[0091] Continuing to refer to FIG. 13, in some embodiments, the first edge 1 includes opposite first and second ends 11 and 12. For example, in FIG. 13, the left end of the first edge 1 is the first end 11, and the right end of the first edge 1 is the second end 12.

[0092] Part of the second area 232 is located at the first end 11, and part of the second area 232 is located at the second end 12, that is, the first edge 1 divides the second area 232 into two parts, one of which is located on the left side of the first edge 1 shown in FIG. 13, and the other of which is located on the right side of the first edge 1 shown in FIG. 13. Among them, the two parts of the second area 232 can be connected or disconnected with each other.

[0093] Along the second direction Y, the first edge 1 is located at a position close to the center of the second area 232, so that the pin 10 is not easy to enter the second area 232 beyond the first edge 1, so that the first edge 1 has a better limiting effect on the pin 10.

[0094] Exemplarily, the first area 231 and the second area 232 have a channel for the flow of liquid solder therebetween, and along the second direction Y, the first edge 1 is located at a position close to the center of the channel.

[0095] Continuing to refer to FIG. 13, in some embodiments, the second area 232 includes a first sub-area 232a and a second sub-area 232b, the first sub-area 232a is located at the first end 11, and the second sub-area 232b is located at the second end 12. For example, the first sub-area 232a can be in communication with the left end of the first area 231, and the second sub-area 232b can be in communication with the right end of the first area 231, and the liquid solder in the first area 231 can flow into the first sub-area 232a from the left end, and the liquid solder in the first area 231 can flow into the second sub-area 232b from the right end.

[0096] The first sub-area 232a and the second sub-area 232b are disconnected on the side away from the first area 231, which can make the shape of the pad 23 simpler, thereby facilitating the preparation of the pad 23. Moreover, the first area 231 has a flow channel between the first sub-area 232a and the second sub-area 232b, respectively, which increases the number of flow channels between the first area 231 and the second area 232, so that the liquid solder can flow from the first area 231 to the second area 232 more quickly.

[0097] Exemplarily, the shape and area of the first sub-area 232a can be equal to the shape and area of the second sub-area 232b. That is, the pad 23 is symmetrically arranged along the center line of the first direction X.

[0098] Continuing to refer to FIG. 13, in some embodiments, the length of the first edge 1 is less than or equal to the length of the second edge 2. Since the second area 232 is located on the side of the first edge 1 away from the first area 231, the length of the first edge 1 is less than the length of the second edge 2, which can form a channel for the flow of liquid solder between the first area 231 and the second area 232.

[0099] With reference back to FIG. 13, in some embodiments, the first region 231 and the second region 232 have a width along the second direction Y, the width of the first region 231 is w1, and the width of the second region 232 is w2, and the width of the second region 232 is greater than the width of the first region 231, i.e., w1 < w2.

[0100] For example, the first region 231 has a third edge 3 and a fourth edge 4, and the third edge 3 and the fourth edge 4 are oppositely arranged along the second direction Y. The third edge 3 can be recessed from an edge of the second region 232 by a distance, the fourth edge 4 can be recessed from an edge of the second region 232 by a distance, or both the third edge 3 and the fourth edge 4 can be recessed from edges of the second region 232 by distances.

[0101] During the soldering process, when the pin 10 is placed in the first region 231, the pin 10 is located between the third edge 3 and the fourth edge 4. Since the distance between the third edge 3 and the fourth edge 4 is less than the width of the second region 232, the area of the solder pad 23 is increased while the active range of the pin 10 is reduced, thereby improving the position accuracy of the pin 10.

[0102] With reference back to FIG. 13, when the third edge 3 is recessed from an edge of the second region 232 by a distance, the left side of the third edge 3 is a blank area, and the blank area is filled with the solder resist 24 instead of the solder pad 23. During the pre-soldering process, due to the process accuracy of the pre-soldering, part of the solder paste can be coated in the blank area. When the solder paste in the blank area melts, the solder in the solder paste is not easily absorbed onto the solder pad 23, but forms a solder ball under the surface tension of the liquid solder.

[0103] Similarly, when the fourth edge 4 is recessed from an edge of the second region 232 by a distance, the left side of the fourth edge 4 is a blank area, and the blank area is filled with the solder resist 24 instead of the solder pad 23. During the pre-soldering process, due to the process accuracy of the pre-soldering, part of the solder paste can be coated in the blank area. When the solder paste in the blank area melts, the solder in the solder paste is not easily absorbed onto the solder pad 23, but forms a solder ball under the surface tension of the liquid solder.

[0104] FIG. 16 is a schematic view of another solder pad 23 in an embodiment of the present disclosure. As shown in FIG. 16, the width of the solder pad 23 area can gradually increase along the direction towards the second region 232. In this way, the area of the blank area on both sides of the first region 231 can be reduced. When part of the solder paste is coated in the blank area, the solder in the solder paste in the blank area is more easily absorbed onto the solder pad 23, thereby improving the solder ball problem.

[0105] Exemplarily, the third edge 3 and / or the fourth edge 4 is inclined at an angle relative to the second edge 2. For example, the first region 231 is in the shape of an inverted trapezoid.

[0106] It should be noted that in FIG. 16, the third edge 3 and the fourth edge 4 are both inclined straight edges. In actual applications, the shapes of the third edge 3 and the fourth edge 4 are not limited thereto, and the third edge 3 and the fourth edge 4 can also be arc edges, polyline edges, or other irregular edges. For example, the third edge 3 and / or the fourth edge 4 is provided with a sharp corner protruding towards the blank region, and the liquid solder in the blank region is more likely to be adsorbed to the surface of the solder pad 23 through the sharp corner, so that it is less likely to appear on the substrate 121.

[0107] FIG. 17 is a schematic view of another solder pad 23 in an embodiment of the present disclosure. As shown in FIG. 17, in some embodiments, the solder pad 23 is provided with a hollow region 233, the hollow region 233 is located within the range surrounded by the edge of the second region 232, and the edge of the hollow region 233 facing the first region 231 is the first edge 1.

[0108] Compared with the solder pad 23 shown in FIG. 13 and FIG. 16, by forming the first edge 1 through the hollow region 233, the area of the second region 232 can be larger, thereby reducing the thickness of the liquid solder in the first region 231 and preventing the lamp bead 122 from being inclined. In addition, under the condition that the surface area of the solder pad 23 is constant, by forming the first edge 1 through the hollow region 233, the size of the solder pad 23 can be reduced, and the arrangement of the lamp beads 122 in the backlight plate 120 can be more compact. Moreover, the liquid solder in the second region 232 can flow to each other, thereby making the distribution of the solder more uniform.

[0109] Continuing to refer to FIG. 17, the hollow region 233 divides the second region 232 into a first sub-region 232a and a second sub-region 232b, the first sub-region 232a is located at the first end 11, and the second sub-region 232b is located at the second end 12. For example, the first sub-region 232a can be in communication with the left end of the first region 231, and the second sub-region 232b can be in communication with the right end of the first region 231, and the liquid solder in the first region 231 can flow into the first sub-region 232a from the left end, and the liquid solder in the first region 231 can flow into the second sub-region 232b from the right end.

[0110] The first sub-region 232a and the second sub-region 232b are connected at a side away from the first region 231, which can make the area of the second region 232 larger, thereby reducing the thickness of the liquid solder in the first region 231 and preventing the lamp bead 122 from being inclined.

[0111] With reference back to FIG. 17, in some embodiments, the length of the first edge 1 is less than or equal to the length of the second edge 2. Since the second region 232 is located on the side of the first edge 1 away from the first region 231, the length of the first edge 1 being less than the length of the second edge 2 can form a channel between the first region 231 and the second region 232 for the liquid solder to flow.

[0112] With reference back to FIG. 17, in some embodiments, the first region 231 and the second region 232 have a width along the second direction Y, the width of the first region 231 is w1, and the width of the second region 232 is w2, and the width of the second region 232 is greater than the width of the first region 231, i.e., w1 < w2.

[0113] Exemplarily, the first region 231 has a third edge 3 and a fourth edge 4, and the third edge 3 and the fourth edge 4 are oppositely arranged along the second direction Y. The third edge 3 can be recessed from the edge of the second region 232 by a distance, the fourth edge 4 can be recessed from the edge of the second region 232 by a distance, or both the third edge 3 and the fourth edge 4 can be recessed from the edge of the second region 232 by a distance.

[0114] FIG. 18 is a schematic view of another type of solder pad 23 in an embodiment of the present disclosure. As shown in FIG. 18, the width of the solder pad 23 region can gradually increase in the direction towards the second region 232. This can reduce the area of the blank region on both sides of the first region 231. When part of the solder paste is coated on the blank region, the solder in the solder paste located in the blank region is more likely to be adsorbed onto the solder pad 23, thereby improving the problem of solder balls.

[0115] Exemplarily, the third edge 3 and / or the fourth edge 4 is inclined at an angle relative to the second edge 2. For example, the first region 231 is in the shape of an inverted trapezoid.

[0116] FIG. 19 is a schematic view of another type of solder pad 23 in an embodiment of the present disclosure. As shown in FIG. 19, in some embodiments, the first edge 1 includes multiple sub-edges arranged at intervals along the second direction Y. By arranging multiple first edges 1 along the second direction Y, the pin 10 is less likely to enter the second region 232 beyond the first edge 1.

[0117] Exemplarily, the first edge 1 includes a first sub-edge 1a and a second sub-edge 1b, the first sub-edge 1a is located on the left side of the first region 231, and the second sub-edge 1b is located on the right side of the first region 231. The first sub-edge 1a on the left side can limit the left end of the pin 10 from entering the second region 232, and the second sub-edge 1b on the right side can limit the right end of the pin 10 from entering the second region 232.

[0118] And, relative to the solder pad 23 described above, the first edge 1 includes a first sub-edge 1a and a second sub-edge 1b, and the first sub-edge 1a is located on the left side of the first area 231 and the second sub-edge 1b is located on the right side of the first area 231, which can better limit the rotation of the pin 10 in the first area 231 and make the position accuracy of the pin 10 better.

[0119] With continued reference to FIG. 19, in some embodiments, the solder pad 23 further includes a connecting area 234 between the second area 232 and the first area 231, and the connecting area 234 is located between two adjacent sub-edges, and the second area 232 is connected to the first area 231 through the connecting area 234. During the process of the solder pad 23, the solder in the first area 231 flows into the second area 232 through the connecting area 234.

[0120] The second area 232 is connected to the first area 231 through the connecting area 234, so that the first area 231 and the second area 232 are spaced apart by a distance and form a gap, and there is no liquid solder in the gap during soldering, so that the pin 10 is not easy to cross the gap between the second area 232 and the connecting area 234 and enter the second area 232.

[0121] FIG. 20 is a schematic view of another solder pad 23 in an embodiment of the present disclosure. As shown in FIG. 20, in some embodiments, the first area 231 and the second area 232 are disconnected, i.e., the first area 231 and the second area 232 are not connected.

[0122] During pre-coating of the solder paste, part of the solder paste is located in the first area 231 and part of the solder paste is located in the second area 232. After the solder in the first area 231 melts, it is located in the first area 231, and after the solder in the second area 232 melts, it covers the second area 232. In actual application, part of the solder paste can also be located between the second area 232 and the first area 231, and the solder in this part of the solder paste can be absorbed into the second area 232 or the first area 231 after melting.

[0123] The disconnection between the first area 231 and the second area 232 makes the first area 231 and the second area 232 spaced apart by a distance, and the pin 10 located in the first area 231 is not easy to enter the second area 232 from the first area 231. And, because the first area 231 and the second area 232 are disconnected, the shape and area of the first area 231 can match the shape and area of the pin 10, so that the position accuracy of the pin 10 in the first area 231 is better.

[0124] The electronic device provided by the embodiment of the present disclosure includes a substrate 121, solder, and an electronic component. The surface of the substrate 121 is provided with a pad 23, the pad 23 includes a first area 231 and a second area 232, the surface of the first area 231 and the second area 232 is used for connecting the solder, and an external component is welded to the first area 231. The first area 231 has a first edge 1 and a second edge 2, the first edge 1 is opposite to the second edge 2 along a first direction X, and at least a part of the second area 232 is located on a side of the first edge 1 away from the second edge 2. The solder is located on the surface of the first area 231 and the second area 232. The electronic component is provided with a pin 10, the pin 10 is connected with the solder in the first area 231, and the pin 10 is located between the first edge 1 and the second edge 2. The type of the electronic device is not limited in the embodiment of the present disclosure.

[0125] The electronic component of the electronic device is connected with the substrate 121 by a surface mounting technology (SMT). The electronic component has a pin 10, and the pin 10 is welded to the pad 23.

[0126] In the process of welding the pin 10 to the pad 23, the liquid solder is limited in the range of the surface of the pad 23, that is, the liquid solder is limited in the range surrounded by the edges of the pad 23. When the pin 10 is placed on the pad 23, the pin 10 can only float in the range of the liquid solder, that is, the pin 10 can only be in the range surrounded by the edges of the pad 23. The pin 10 is placed in the welding area, that is, the pin 10 is located between the first edge 1 and the second edge 2. The pin 10 is limited between the first edge 1 and the second edge 2, and cannot pass the first edge 1 to enter the second area 232, which reduces the floating range of the pin 10, so that the lamp bead 122 is not easy to deviate from the preset position, and the position accuracy of the lamp bead 122 is improved.

[0127] The above merely describes the specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A substrate, characterized by, The surface of the substrate is provided with: a pad, the pad comprising a first region and a second region, the first region having a first edge and a second edge, the first edge opposite to the second edge along a first direction, at least part of the second region being located on a side of the first edge away from the second edge; a solder resist layer, part of the solder resist layer being located on a side of the first edge away from the first region.

2. The substrate of claim 1, wherein The first region and the second region are connected as an integral structure.

3. The substrate of claim 2, wherein, The first edge comprises opposite first and second ends, the second region comprises a first sub-region and a second sub-region, the first sub-region being located at the first end, and the second sub-region being located at the second end.

4. The substrate of claim 3, wherein, The first sub-region and the second sub-region are disconnected on a side away from the first region.

5. The substrate of claim 3, wherein The first sub-region and the second sub-region are connected on a side away from the first region.

6. The substrate of claim 1, wherein The first edge comprises a plurality of sub-edges, the plurality of sub-edges being arranged at intervals along a second direction; the second direction being perpendicular to the first direction.

7. The substrate of claim 6, wherein The pad further comprises a connecting region between the second region and the first region, the connecting region being located between adjacent two sub-edges, and the second region being connected to the first region through the connecting region.

8. The substrate of claim 1, wherein The first region and the second region are disconnected.

9. The substrate of any one of claims 1 to 8, wherein, The length of the first edge is less than or equal to the length of the second edge.

10. The substrate of any one of claims 1 to 8, wherein, The first region and the second region have a width along the second direction, the width of the second region being greater than the width of the first region; the second direction being perpendicular to the first direction.

11. The substrate of claim 10, wherein Along a direction towards the second region, the width of the pad region gradually increases.

12. The substrate of any one of claims 1 to 8, wherein, The periphery of the pad is provided with a solder resist layer, the solder resist layer being provided in the same layer as the pad.

13. The substrate of claim 1, wherein The pad comprises a first pad and a second pad, the first pad and the second pad being arranged at intervals along the first direction, and the first region of the first pad being opposite to the first region of the second pad.

14. A backlight panel, characterized in that, Comprise: a substrate, a surface of the substrate being provided with a pad and a solder resist layer, the pad comprising a first region and a second region, the first region having a first edge and a second edge, the first edge opposite to the second edge along a first direction, at least part of the second region being located on a side of the first edge away from the second edge, part of the solder resist layer being located on a side of the first edge away from the first region; solder, the solder being located on the surface of the first region and the second region; a lamp bead, the lamp bead being provided with a pin, the pin being connected to the solder within the range of the first region, and the pin being located between the first edge and the second edge.

15. An electronic device, comprising: Comprise: a substrate, a surface of the substrate being provided with a pad and a solder resist layer, the pad comprising a first region and a second region, the first region having a first edge and a second edge, the first edge opposite to the second edge along a first direction, at least part of the second region being located on a side of the first edge away from the second edge, part of the solder resist layer being located on a side of the first edge away from the first region; solder, the solder being located on the surface of the first region and the second region; an electronic device, the electronic device being provided with a pin, the pin being connected with the solder within the range of the first region, and the pin being located between the first edge and the second edge.

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