Laminated ceramic electronic component

Abstract

Provided is a laminated ceramic electronic component including a plurality of laminated ceramic electronic component bodies and metal terminals, the laminated ceramic electronic component having excellent stability in shape and external dimensions, and being capable of suppressing creeping discharge.　A laminated ceramic capacitor 1 comprises a plurality of laminated ceramic capacitor bodies 10, a first metal terminal 50A, and a second metal terminal 50B. The first metal terminal 50A includes: a first joining section 51A that faces first end surfaces CA and that is connected to first external electrodes 30A; a first holding section 54A that extends from the first joining section 51A toward the center in a second direction and that faces the laminated ceramic capacitor bodies 10 in a third direction; a first falling section 56A that extends outward in the third direction from the second-direction center end part of the first holding section 54A; and a first mounting section 57A that extends outward in the second direction from the third-direction outer end part of the first falling section 56A. The first metal terminal 50A is arranged so as to span first external electrodes 30A of the respective laminated ceramic capacitor bodies 10.

Description

Multilayer ceramic electronic components

[0001] The present invention relates to a multilayer ceramic electronic component.

[0002] 2. Description of the Related Art Conventionally, there exists a ceramic electronic component having a pair of chips and a pair of metal terminal portions provided corresponding to a pair of chip end faces (see, for example, Patent Document 1).

[0003] The ceramic electronic component of Patent Document 1 is said to be able to prevent vibrations generated in the chip component from being transmitted to the mounting substrate via the metal terminals, to protect the chip component from deformation stress and impacts received from the substrate after mounting, and to prevent an increase in the mounting area.

[0004] Japanese Patent Application Laid-Open No. 2021-093542

[0005] However, in the ceramic electronic component of Patent Document 1, the tips of the mating arms of a pair of metal terminals face each other near the laminate. In this case, current flows along the surface of the laminate, which may cause creeping discharge. Furthermore, in a structure in which multiple chip components are held by a pair of metal terminals, it is often difficult to ensure the stability of the overall shape and external dimensions of the ceramic electronic component.

[0006] An object of the present invention is to provide a multilayer ceramic electronic component having a plurality of multilayer ceramic electronic component bodies and metal terminals, which has excellent stability in shape and external dimensions and is capable of suppressing creeping discharge.

[0007] In order to solve the above-mentioned problems, the present invention provides a multilayer ceramic electronic component comprising a plurality of multilayer ceramic elements, each including an inner layer portion including a plurality of alternately stacked ceramic layers and a plurality of internal electrodes, a pair of outer layer portions provided on either side of the inner layer portion in a stacking direction, a laminate having first and second main surfaces opposed to each other in the stacking direction, first and second side surfaces opposed to each other in a width direction perpendicular to the stacking direction, and first and second end surfaces opposed to each other in a length direction perpendicular to the stacking direction and the width direction, and a first external electrode disposed on the first end surface and a second external electrode disposed on the second end surface. a first metal terminal connected to the first external electrode, and a second metal terminal connected to the second external electrode, wherein the laminated ceramic electronic component bodies are arranged side by side in a direction perpendicular to the length direction of each of the laminated ceramic electronic component bodies, with the length directions of the laminated ceramic electronic component bodies oriented parallel to each other, the direction in which the laminated ceramic electronic component bodies are arranged being a first direction, and a direction perpendicular to the first direction that is parallel to the length direction of each of the laminated ceramic electronic component bodies is a second direction, a direction perpendicular to the first direction and the second direction is a third direction, and a direction of the two directions approaching the center of the laminate in the second direction is a second direction center side, a direction of the two directions moving away from the center of the laminate in the second direction is a second direction outer side, a direction of the three directions approaching the center of the laminate in the third direction is a third direction center side, and a direction of the three directions moving away from the center of the laminate in the third direction is a third direction outer side, the first metal terminals face each of the first end faces and are connected to each of the first outer a first joint portion connected to an electrode, a first holding portion extending from the first joint portion toward the center in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, a first falling portion extending outward in the third direction from an end portion of the first holding portion toward the center in the second direction, and a first mounting portion extending outward in the second direction from an end portion of the first falling portion facing outward in the third direction, the second metal terminal being disposed so as to straddle the first external electrodes of each of the multilayer ceramic electronic component bodies, and the second metal terminal facing each of the second end faces and connected to each of the second external electrodes;a second holding portion extending from the second joint portion toward the center in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, a second falling portion extending outward in the third direction from an end of the second holding portion toward the center in the second direction, and a second mounting portion extending outward in the second direction from an end of the second falling portion on the outer side in the third direction, and arranged so as to straddle the second external electrodes of each of the multilayer ceramic electronic component bodies;

[0008] According to the present invention, it is possible to provide a multilayer ceramic electronic component having a plurality of multilayer ceramic electronic component bodies and metal terminals, which has excellent stability in shape and external dimensions and is capable of suppressing creeping discharge.

[0009] 10 is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment. FIG. 11 is a schematic perspective view of a multilayer ceramic capacitor body according to an embodiment. FIG. 12 is a cross-sectional view taken along III-III in FIG. 2. FIG. 13 is a cross-sectional view taken along IV-IV in FIG. 2. FIG. 14 is a schematic perspective view of a pair of metal terminals. FIG. 15 is a plan view of the multilayer ceramic capacitor viewed in a first direction from a first main surface side. FIG. 16 is a plan view of the multilayer ceramic capacitor viewed in a second direction from a first end surface side. FIG. 17 is a plan view of the multilayer ceramic capacitor viewed in a third direction from a first side surface side. FIG. 18 is a schematic perspective view of a multilayer ceramic capacitor body according to a modified example. FIG. 19 is a cross-sectional view taken along X-X in FIG. 9. FIG. 19 is a cross-sectional view taken along XI-XI in FIG.

[0010] A multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 8. The multilayer ceramic capacitor 1 is mounted on a mounting surface of a mounting substrate (not shown) for use. The multilayer ceramic capacitor 1 has a plurality of multilayer ceramic capacitor bodies 10, first metal terminals 50A, and second metal terminals 50B. The multilayer ceramic capacitor corresponds to the multilayer ceramic electronic component. The multilayer ceramic capacitor bodies 10 correspond to the multilayer ceramic electronic component body. The first metal terminals 50A and second metal terminals 50B may be collectively referred to as "metal terminals 50."

[0011] (Multilayer Ceramic Capacitor Body) As shown in FIG. 1 , the multilayer ceramic capacitor body 10 is a multilayer ceramic capacitor with a so-called multiple-layer structure, and more specifically, a multilayer ceramic capacitor with a dual-layer structure. The multilayer ceramic capacitor body 10 includes a laminate 20, a first external electrode 30A, and a second external electrode 30B. The laminate 20 is substantially rectangular and has six outer surfaces. The laminate 20 includes an inner layer portion 11 in which a dielectric layer 14 and an internal electrode 15 are stacked. The first external electrode 30A and the second external electrode 30B may be collectively referred to as the "external electrodes 3."

[0012] In this specification, the direction in which the dielectric layers 14 and the internal electrodes 15 are stacked in the multilayer ceramic capacitor 1 is referred to as the stacking direction T. One of the directions perpendicular to the stacking direction T is referred to as the length direction L. The direction perpendicular to both the length direction L and the stacking direction T is referred to as the width direction W.

[0013] The multilayer ceramic capacitor bodies 10 are arranged side by side in a direction perpendicular to the length direction L of each multilayer ceramic capacitor body, with the length direction L of each multilayer ceramic capacitor body 10 oriented parallel to each other. The direction in which the multilayer ceramic capacitor bodies are arranged is referred to as the "first direction X." Of the directions perpendicular to the first direction X, a direction parallel to the length direction L of each multilayer ceramic capacitor body 10 is referred to as the "second direction Y." The direction perpendicular to the first direction X and the second direction Y is referred to as the "third direction Z."

[0014] In this embodiment, the multilayer ceramic capacitor 1 is mounted on a mounting substrate (not shown) with the first side surface BA of each multilayer ceramic capacitor body 10 facing the mounting surface. Therefore, the first direction X coincides with the stacking direction T. The second direction Y coincides with the length direction L. The third direction Z coincides with the width direction W.

[0015] In the first direction X, the direction approaching the center of the multilayer ceramic capacitor 1 in the first direction X is referred to as the "first direction center side X1." In the first direction X, the direction moving away from the center of the multilayer ceramic capacitor 1 in the first direction X is referred to as the "first direction outer side X2." In the second direction Y, the direction approaching the center of the multilayer ceramic capacitor 1 in the second direction Y is referred to as the "second direction center side Y1." In the second direction Y, the direction moving away from the center of the multilayer ceramic capacitor 1 in the second direction Y is referred to as the "second direction outer side Y2." In the third direction Z, the direction approaching the center of the multilayer ceramic capacitor 1 in the third direction Z is referred to as the "third direction center side Z1." In the third direction Z, the direction moving away from the center of the multilayer ceramic capacitor 1 in the third direction Z is referred to as the "third direction outer side Z2."

[0016] Of the six outer surfaces of the laminate 20, a pair of outer surfaces on both sides in the stacking direction T are referred to as the first main surface AA and the second main surface AB, a pair of outer surfaces on both sides in the width direction W are referred to as the first side surface BA and the second side surface BB, and a pair of outer surfaces on both sides in the length direction L are referred to as the first end surface CA and the second end surface CB. The first main surface AA and the second main surface AB may be collectively referred to as "each main surface A." The first side surface BA and the second side surface BB may be collectively referred to as "each side surface B." The first end surface CA and the second end surface CB may be collectively referred to as "each end surface C."

[0017] A cross section parallel to the stacking direction T and the length direction L is referred to as an "LT cross section." A cross section parallel to the stacking direction T and the width direction W is referred to as a "WT cross section." The cross section in FIG. 3 is an LT cross section passing through the center of the multilayer ceramic capacitor body 10 in the width direction W. The cross section in FIG. 4 is a WT cross section passing through the center of the multilayer ceramic capacitor body 10 in the length direction L.

[0018] (Laminate 20) The laminate 20 has an inner layer portion 11 and a pair of outer layer portions 12 arranged on either side of the inner layer portion 11 in the stacking direction T. A portion where three outer surfaces of the laminate 20 intersect is referred to as a "corner portion." A portion where two outer surfaces of the laminate 20 intersect is referred to as a "ridge portion."

[0019] The outer dimensions of the laminate 20 are, for example, 0.5 mm to 3 mm in the stacking direction T, 2 mm to 6 mm in the length direction L, and 1 mm to 5 mm in the width direction W. The outer dimensions of the multilayer ceramic capacitor body 10 can be measured with a micrometer. The dimension in the stacking direction T is preferably smaller than the dimension in the width direction W. The dimension in the stacking direction T is preferably smaller than the dimension in the length direction L. However, this is not limited to this.

[0020] 2 and 3, the inner layer portion 11 has a plurality of dielectric layers 14 as a plurality of ceramic layers and a plurality of internal electrodes 15. The dielectric layers 14 and the internal electrodes 15 are alternately stacked.

[0021] The dielectric layer 14 is formed of a dielectric ceramic containing, for example, BaTiO as a main component. The dielectric ceramic may contain a Mn compound, an Fe compound, a Cr compound, a Co compound, an Ni compound, or the like as a secondary component.

[0022] The internal electrodes 15 are formed of a metal material such as Ni, Cu, Ag, Pd, an Ag-Pd alloy, Au, etc. The multiple internal electrodes 15 include first internal electrodes 15A that are extended to the first end face CA, second internal electrodes 15B that are extended to the second end face CB, and intermediate electrodes 15C that are not extended to either the first end face CA or the second end face CB.

[0023] The first internal electrode 15A, the second internal electrode 15B, and the intermediate electrode 15C are alternately stacked in the stacking direction T, with the dielectric layer 14 sandwiched between them. The first internal electrode 15A is exposed only at the first end face CA. The second internal electrode 15B is exposed only at the second end face CB. The first internal electrode 15A and the second internal electrode 15B are arranged at an interval in the length direction L. The intermediate electrode 15C is spaced apart from each end face C and each side face B. One end side of the intermediate electrode 15C in the length direction L faces the first internal electrode 15A in the stacking direction T. The other end side of the intermediate electrode 15C in the length direction L faces the second internal electrode 15B in the stacking direction T.

[0024] (Outer Layer Portion 12) The outer layer portion 12 is formed of the same material as the dielectric layer 14 of the inner layer portion 11. Note that no inner electrode 15 is disposed in the outer layer portion 12.

[0025] (External electrode 3) The first external electrode 30A is provided on the first end face CA. The first external electrode 30A covers not only the first end face CA but also part of the principal face A and part of the side face B. The first external electrode 30A is connected to the first internal electrode 15A.

[0026] The second external electrode 30B is provided on the second end face CB. The second external electrode 30B covers not only the second end face CB but also a part of the main face A and a part of the side face B. The second external electrode 30B is connected to the second internal electrode 15B.

[0027] The external electrodes 3 each include a base electrode layer 31 disposed on the surface of the laminate 20 and a plating layer 32 disposed on the base electrode layer 31 .

[0028] The base electrode layer 31 is a baked layer containing, for example, a conductive metal and glass. The conductive metal is, for example, nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), gold (Au), an Ag—Pd alloy, or the like, and is preferably Cu.

[0029] The plating layer 32 is made of, for example, one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing such a metal. The plating layer 32 includes, for example, a first plating layer 321 disposed on the base electrode layer 31 and a second plating layer 322 disposed on the first plating layer 321.

[0030] The first plating layer 321 is, for example, a Ni plating layer. The second plating layer 322 is, for example, a Sn (tin) plating layer. The plating layer 322 may have a single layer structure.

[0031] Each external electrode 30 may have an electrode protrusion (not shown) that protrudes in the length direction L. The electrode protrusion is formed, for example, in a mountain shape with its apex located at the center of each external electrode 30 in the stacking direction T and width direction W.

[0032] The multiple multilayer ceramic capacitor bodies 10 are arranged side by side in a direction perpendicular to the length direction L of each multilayer ceramic capacitor body, with the length direction L of each multilayer ceramic capacitor body 10 oriented parallel to one another; more specifically, they are arranged side by side in the stacking direction T of each multilayer ceramic capacitor body 10. The multilayer ceramic capacitor bodies 10 are arranged such that, of adjacent multilayer ceramic capacitor bodies 10, the second main surface AB of one multilayer ceramic capacitor body 10 faces the first main surface AA of the other multilayer ceramic capacitor body 10. In adjacent multilayer ceramic capacitor bodies 10, the first external electrode 30A of one multilayer ceramic capacitor body 10 faces the first external electrode 30A of the other multilayer ceramic capacitor body 10, and the second external electrode 30B of one multilayer ceramic capacitor body 10 faces the second external electrode 30B of the other multilayer ceramic capacitor body 10.

[0033] A bonding material H1 such as solder may or may not be disposed between adjacent first external electrodes 30A. A plurality of ceramic capacitor bodies 10 arranged side by side in the stacking direction T form an assembly of multilayer ceramic capacitor bodies (sometimes referred to as a "capacitor assembly G").

[0034] (Metal Terminal 50) Next, the metal terminal 50 will be described with reference to FIGS. 5 to 8. The metal terminal 50 is a terminal that is mounted on the mounting surface of a mounting substrate on which the multilayer ceramic capacitor 1 is to be mounted. The first metal terminal 50A is connected to the first external electrode 30A. The second metal terminal 50B is connected to the second external electrode 30B. The metal terminal 50 is, for example, a plate-shaped lead frame. The metal terminal 50 has a terminal body and a plating film disposed on the surface of the terminal body.

[0035] The terminal body is preferably made of Ni, Fe, Cu, Ag, Cr, or an alloy containing one or more of these metals as a primary component. For example, the base metal of the terminal body can be an Fe-42Ni alloy, an Fe-18Cr alloy, or a Cu-8Sn alloy. Furthermore, from the perspective of heat dissipation, the base metal of the terminal body can be oxygen-free copper or a Cu-based alloy, which have high thermal conductivity. By using a copper-based material for the terminal body with good thermal conductivity, low ESR and low thermal resistance can be achieved. Furthermore, in this embodiment, the base metal of the terminal body can be stainless steel or aluminum, which have low solder wettability. At least the surface of the base metal of the terminal body has a lower solder wettability than the plating film on the outermost surface. The thickness of the terminal body is preferably approximately 0.05 mm or more and 0.5 mm or less.

[0036] The plating film preferably has an upper-layer plating film disposed on the outermost surface of the plating film and a lower-layer plating film disposed below the upper-layer plating film. For example, the plating film may have a two-layer structure in which the upper-layer plating film is formed on the lower-layer plating film.

[0037] The lower layer plating film is preferably made of Ni, Fe, Cu, Ag, Cr, or an alloy containing one or more of these metals as a main component. More preferably, the lower layer plating film is made of Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component. By forming the lower layer plating film from high-melting-point Ni, Fe, Cr, or an alloy containing one or more of these metals as a main component, the heat resistance of the metal terminal 50 can be improved. The thickness of the lower layer plating film is preferably approximately 0.2 μm or more and 5.0 μm or less.

[0038] The upper layer plating film is preferably made of Sn, Ag, Au, or an alloy containing one or more of these metals as a main component. More preferably, the upper layer plating film is made of Sn or an alloy containing Sn as a main component. By forming the upper layer plating film from Sn or an alloy containing Sn as a main component, the solderability between the external electrode 30 and the metal terminal 50 can be improved. The thickness of the upper layer plating film is preferably approximately 1.0 μm or more and 5.0 μm or less.

[0039] The upper layer plating film disposed on the outermost surface of the plating film has a surface that is more solder wettable than the surface of the base metal of the terminal body. The upper layer plating film disposed on the outermost surface of the plating film also has a surface that is more solder wettable than the surface of the lower layer plating film. For example, the lower layer plating film is preferably a Ni plating film. The upper layer plating film is preferably a Sn plating film.

[0040] (First Metal Terminal) Here, the first metal terminal 50A is arranged so as to straddle the first external electrodes 30A of the multiple multilayer ceramic capacitor bodies 10. The first metal terminal 50A has a first joint portion 51A facing each first end face CA and connected to each first external electrode 30A, a first holding portion 54A extending from the first joint portion 51A toward the second direction center side Y1 and facing the first external electrode 30A of each multilayer ceramic capacitor body 10 in the third direction Z, a first falling portion 56A extending from an end of the first holding portion 54A on the second direction center side Y1 to the outside in the third direction Z2, and a first mounting portion 57A extending from an end of the first falling portion 56A on the third direction outside Z2 to the outside in the second direction Y2.

[0041] The first joint portion 51A extends in the first direction X and the third direction Z. The first joint portion 51A has, for example, a rectangular plate shape overall. The dimension of the first joint portion 51A in the third direction Z may be approximately the same as or greater than the dimension of each multilayer ceramic capacitor body 10 (first external electrode 30A) in the third direction Z. The dimension of the first joint portion 51A in the third direction Z is, for example, greater than the dimension of each multilayer ceramic capacitor body 10 (first external electrode 30A) in the third direction Z. Of each end of the first joint portion 51A in the third direction Z, the end not connected to the first holding portion 54A (sometimes referred to as the "tip of the first joint portion 51A") is located further outward in the third direction Z2 than the multilayer ceramic capacitor body 10 (first external electrode 30A). Each end of the first joint portion 51A in the first direction X is located further outward in the first direction X2 than the multilayer ceramic capacitor body 10 (first external electrode 30A). This makes it possible to further improve the stability of the shape and outer dimensions of the multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10 .

[0042] The first joint portion 51A is provided at a position overlapping the first external electrode 30A in the second direction Y, and has a plurality of first slit portions 52A extending in the third direction Z.

[0043] The number of first slit portions 52A is, for example, the same as the number of multilayer ceramic capacitor bodies 10. The multiple first slit portions 52A are provided at intervals in the first direction X. Each first slit portion 52A is provided at a position overlapping with the center of each first external electrode 30A in the first direction X. Each first slit portion 52A is open at the tip end of the first joint portion 51A. The internal space of each first slit portion 52A has, for example, a rectangular shape when viewed in the second direction Y, with the longitudinal direction extending in the third direction Z.

[0044] The maximum dimension in the first direction X between adjacent first slit portions 52A, i.e., the maximum plate width, which is the dimension in the first direction X of one upright plate separated by adjacent first slit portions 52A, is preferably larger than the minimum slit width, which is the minimum dimension in the first direction X of the first slit portions 52A. This maintains the strength of the metal terminal and further improves the stability of the shape and external dimensions of the multilayer ceramic capacitor 1. For example, the minimum slit width is preferably 20% to 65% of the dimension in the first direction X of the first external electrode 30A of one multilayer ceramic capacitor body 10. The maximum plate width is preferably 70% to 140% of the dimension in the first direction X of the first external electrode 30A of one multilayer ceramic capacitor body 10.

[0045] The dimension of the first slit portion 52A in the third direction Z is preferably longer than half the dimension of the first external electrode 30A in the third direction Z. The dimension of the first slit portion 52A in the third direction Z is preferably shorter than the dimension of the first external electrode 30A in the third direction Z.

[0046] More specifically, the mounting portion side end of the first slit portion 52A is preferably located closer to the mounting portion than the center in the third direction Z of the first external electrode 30A of the multilayer ceramic capacitor body 10. The mounting portion side end of the first slit portion 52A is preferably located closer to the center in the third direction Z of the first external electrode 30A than the mounting portion side end of the first external electrode 30A of the multilayer ceramic capacitor body 10. This makes it possible to maintain the strength of the metal terminal while avoiding interference with the electrode protrusion, thereby further improving the stability of the shape and external dimensions of the multilayer ceramic capacitor 1.

[0047] The first metal terminal 50A and the first external electrode 30A are joined together by a joining material H2 such as solder. The joining material H2 is disposed between the first external electrode 30A and a portion of the first joint portion 51A where the first slit portions 52A are not provided. The joining material H2 is preferably disposed biased toward the tip of the first joint portion 51A. This prevents the joining material H2 from flowing between the first holding portion 54A and the first external electrode 30A of the multilayer ceramic capacitor body 10. This prevents the joining material H2 from flowing into this portion, causing the multilayer ceramic capacitor body 10 to excessively protrude beyond the tip of the first joint portion 51A. Therefore, in a multilayer ceramic capacitor 1 having multiple multilayer ceramic capacitor bodies 10, the stability of the shape and overall dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0048] The first holding portion 54A, the first falling portion 56A, and the first mounting portion 57A are disposed between the first external electrode 30A of the multilayer ceramic capacitor body 10 and the mounting substrate.

[0049] The first holding portion 54A extends in the first direction X and the second direction Y. The first holding portion 54A has, for example, a rectangular plate shape with a flat surface. The first holding portion 54A abuts or is adjacent to each first external electrode 30A. Specifically, the first holding portion 54A is adjacent to each first external electrode 30A. The first holding portion 54A does not necessarily abut each external electrode 30A. The end of the first holding portion 54A on the second direction center side Y1 is located further outward in the second direction Y2 (closer to the first end face CA) than the end of the first external electrode 30A on the second direction center side Y1. This further suppresses the occurrence of creeping discharge, in which current flows along the surface of the multilayer ceramic capacitor body 10. The end of the first holding portion 54A on the second direction center side Y1 is located further outward in the second direction Y2 (closer to the first end face CA) than the end of the first internal electrode 15A on the second end face CB side.

[0050] Note that a bonding material H2 such as solder does not have to be disposed between the first holding portion 54A and the first external electrode 30A of the multilayer ceramic capacitor body 10. That is, a space may be disposed between the first holding portion 54A and the first external electrode 30A of the multilayer ceramic capacitor body 10, or the first holding portion 54A and the first external electrode 30A of the multilayer ceramic capacitor body 10 may be in direct contact with each other. This prevents the multilayer ceramic capacitor body 10 from excessively protruding beyond the tip of the first bonding portion 51A due to the influence of the thickness of the bonding material H2 such as solder sandwiched in this portion. Therefore, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, the stability of the shape and external dimensions of the multilayer ceramic capacitor 1 can be further improved.

[0051] The first falling portion 56A extends in the first direction X and the third direction Z. The first falling portion 56A has, for example, a rectangular plate shape with a flat surface. The end of the first falling portion 56A on the third direction center side Z1 is located further outward in the second direction Y2 (closer to the first end face CA) than the end of the first external electrode 30A on the second direction center side Y1. More specifically, the entire first falling portion 56A is located further outward in the second direction Y2 (closer to the first end face CA) than the end of the second direction center side Y1 of the first external electrode 30A. This further suppresses the occurrence of creeping discharge, which is current flowing along the surface of the multilayer ceramic capacitor body 10. The end of the first falling portion 56A on the third direction center side Z1 is located further outward in the second direction Y2 (toward the first end face CA) than the end of the first internal electrode 15A on the second end face CB side; more specifically, the entire first falling portion 56A is located further outward in the second direction Y2 (toward the first end face CA) than the end of the first internal electrode 15A on the second end face CB side.

[0052] The end portion of the first external electrode 30A on the center side Y1 in the second direction is located further outward in the second direction Y2 than the end portion of the first internal electrode 15A on the second end face CB side.

[0053] In the first metal terminal 50A, a first connection portion 58A, which is a connection portion between the first holding portion 54A and the first falling portion 56A, has a curved shape when viewed in the first direction X.

[0054] The first mounting portion 57A is a portion connected to the mounting surface. The first mounting portion 57A is connected to the mounting surface, for example, by soldering. The first mounting portion 57A extends in the first direction X and the second direction Y. For example, when viewed in the first direction X, the first mounting portion 57A extends along the second direction outer side Y2 and extends so as to be slightly tilted toward the third direction outer side Z2 as it moves toward the second direction outer side Y2. The angle formed between the mounting surface and the first mounting portion 57A may be, for example, between 1° and 10°. The first mounting portion 57A has, for example, a flat rectangular plate shape. For example, the end of the first mounting portion 57A on the second direction outer side Y2 and the end of the first joint portion 51A on the second direction outer side Y2 are positioned approximately in the second direction Y.

[0055] (Second Metal Terminal) The second metal terminal 50B is arranged so as to straddle the second external electrodes 30B of the multiple multilayer ceramic capacitor bodies 10. The second metal terminal 50B has a second joint portion 51B facing each second end face CB and connected to each second external electrode 30B, a second holding portion 54B extending from the second joint portion 51B toward the second direction center side Y1 and facing the second external electrode 30B of each multilayer ceramic capacitor body 10 in the third direction Z, a second falling portion 56B extending from an end of the second holding portion 54B on the second direction center side Y1 to the outside in the third direction Z2, and a second mounting portion 57B extending from an end of the second falling portion 56B on the third direction outside Z2 to the outside in the second direction Y2.

[0056] The second joint portion 51B is provided at a position overlapping the second external electrode 30B in the second direction Y and has a plurality of second slit portions 52B extending in the third direction Z. The maximum dimension in the first direction X between adjacent second slit portions 52B is preferably larger than the minimum dimension in the first direction X of the second slit portions 52B. The dimension in the third direction Z of the second slit portions 52B is preferably longer than half the dimension in the third direction Z of the second external electrode 30B. The dimension in the third direction Z of the second slit portions 52B is preferably shorter than the dimension in the third direction Z of the second external electrode 30B. More specifically, the end of the second slit portion 52B on the mounting portion side is preferably located closer to the mounting portion than the center in the third direction Z of the second external electrode 30B of the multilayer ceramic capacitor body 10. The mounting portion side end of the second slit portion 52B is preferably located closer to the center in the third direction Z of the second external electrode 30B than the mounting portion side end of the second external electrode 30B of the multilayer ceramic capacitor body 10. This makes it possible to maintain the strength of the metal terminal while avoiding interference with the electrode protrusion, thereby further improving the stability of the shape and external dimensions of the multilayer ceramic capacitor 1.

[0057] The second falling portion 56B is preferably disposed further outward in the second direction Y than the end of the second internal electrode 15B that is closer to the center in the second direction Y. In the second metal terminal 50B, a second connection portion 58B that is a connection portion between the second holding portion 54B and the second falling portion 56B has a curved shape when viewed in the first direction X.

[0058] The configuration of the multilayer ceramic capacitor 1 is generally symmetrical in the second direction Y. The configuration of the second metal terminal 50B and its surrounding configuration generally correspond to the configuration of the first metal terminal 50A and its surrounding configuration. The configuration of the second joint portion 51B corresponds to the configuration of the first joint portion 51A. The configuration of the second holding portion 54B corresponds to the configuration of the second holding portion 54B. The configuration of the first falling portion 56A corresponds to the configuration of the second falling portion 56B. The configuration of the second mounting portion 57B corresponds to the configuration of the second mounting portion 57B. The configuration of the second slit portion 52B corresponds to the configuration of the first slit portion 52A. Therefore, a detailed description of the configuration of the second metal terminal 50B and its surrounding configuration will be omitted.

[0059] (Method for manufacturing the multilayer ceramic capacitor 1) Next, a method for manufacturing the multilayer ceramic capacitor 1 of this embodiment will be described. The multilayer ceramic capacitor 1 of this embodiment can be manufactured by any method as long as it satisfies the above-mentioned requirements. However, a suitable manufacturing method includes the following steps. Each step will be described in detail below.

[0060] (Process for manufacturing each multilayer ceramic capacitor body) A dielectric sheet for the dielectric layer 14 and a conductive paste for the internal electrode 15 are prepared. The dielectric sheet and the conductive paste for the internal electrode contain a binder and a solvent. The binder and the solvent may be known.

[0061] A conductive paste for the internal electrodes 15 is printed in a predetermined pattern on the dielectric sheets by, for example, screen printing, gravure printing, etc. In this way, a dielectric sheet on which the patterns of the first internal electrodes 15A and the second internal electrodes 15B are formed, and a dielectric sheet on which the pattern of the intermediate electrode 15C is formed are prepared.

[0062] A predetermined number of dielectric sheets without printed internal electrode patterns are stacked to form the portion that will become the outer layer portion 12 on the first main surface AA side. Dielectric sheets with patterns of the first internal electrode 15A and the second internal electrode 15B formed thereon and dielectric sheets with patterns of the intermediate electrode 15C formed thereon are alternately stacked to form the portion that will become the inner layer portion 11. A predetermined number of dielectric sheets without printed internal electrode patterns are stacked on top of this portion that will become the inner layer portion 11 to form the portion that will become the outer layer portion 12 on the second main surface AB side. A laminated sheet is thus produced. The laminated sheet is pressed in the stacking direction T by means of an isostatic press or the like to produce a laminated block.

[0063] Next, the laminated block is cut in the length direction L and the width direction W. By cutting the laminated block to a predetermined size, laminated chips are cut out. At this time, the corners and ridges of the laminated chips may be rounded by barrel polishing or the like.

[0064] The laminated chip is fired to produce the laminate 20. The firing temperature depends on the materials of the dielectric layers 14 and the internal electrodes 15, but is preferably 900°C or higher and 1400°C or lower.

[0065] A conductive paste that will become the base electrode layer 31 is applied to both end surfaces of the laminate 20. In this embodiment, the base electrode layer 31 is a baked layer. The conductive paste containing a glass component and a metal is applied to the laminate 20 by a method such as dipping.

[0066] Dipping is performed so that the base electrode layer 31 on the first end face CA side extends from the first end face CA to portions of the first principal face AA and the second principal face AB. Dipping is also performed so that the base electrode layer 31 on the second end face CB side extends from the second end face CB to portions of the first principal face AA and the second principal face AB. Simultaneously, dipping is also performed so that the base electrode layer on the first end face CA side extends to portions of the first side face BA and the second side face BB. Dipping is also performed so that the base electrode layer 31 on the second end face CB side extends to portions of the first side face BA and the second side face BB.

[0067] Thereafter, a baking process is performed to form the base electrode layer 31. The baking temperature at this time is preferably 700°C or higher and 950°C or lower. The laminated chip before firing and the conductive paste applied to the laminated chip may be simultaneously fired. In this case, the baked layer is preferably formed by baking a material to which a ceramic material is added instead of a glass component. In this case, it is particularly preferable to use the same type of ceramic material as the dielectric layer 14 as the ceramic material to be added. In this case, a conductive paste is applied to the laminated chip before firing, and the laminated chip and the conductive paste applied to the laminated chip are simultaneously baked to form the laminate 20 with a baked layer formed thereon.

[0068] Thereafter, a plating layer is formed on the surface of the base electrode layer 31. In this embodiment, a Ni plating layer and a Sn plating layer are formed on the base electrode layer. The Ni plating layer and the Sn plating layer are formed sequentially using an electrolytic plating method. As the plating method, for example, barrel plating is preferably used. In this manner, the multilayer ceramic capacitor body 10 is obtained.

[0069] (Process for manufacturing metal terminal) First, a metal plate material that will become the first metal terminal 50A is prepared. Next, the plate material is cut to the desired n using a punching die or the like. At this time, a first slit portion 52A is formed in the plate material. Next, the plate material is bent into the desired shape using a bending die or the like. At this time, the region of the first metal terminal 50A from the first holding portion 54A to the first falling portion 56A, i.e., the connection portion between the first holding portion 54A and the first falling portion 56A, is bent so as to be rounded. Next, a plating film is formed on the surface of the plate material. This results in the first metal terminal 50A. Second metal terminals are manufactured in a similar manner.

[0070] (Process for Obtaining Capacitor Assembly G) A plurality of multilayer ceramic capacitor bodies 10 are arranged in a predetermined direction, thereby obtaining a capacitor assembly G. A bonding material H1 may or may not be disposed between adjacent external electrodes 30.

[0071] (Step of joining each multilayer ceramic capacitor body and metal terminal) A portion on the first end face CA of the first external electrode 30A and the first joint portion 51A of the first metal terminal 50A are placed face to face. The first metal terminal 50A is positioned so that each first slit portion 52A and the center portion of each first external electrode 30A in the first direction X overlap in the second direction Y. If each first external electrode 30A has an electrode protrusion, the first metal terminal 50A is placed in a position so that the electrode protrusion of each first external electrode 30A fits within each first slit portion 52A.

[0072] A bonding material H2 is disposed between the first external electrode 30A and a portion of the first joint portion 51A where the first slit portions 52A are not formed. This bonds the first external electrode 30A to the first metal terminal 50A. Similarly, the second external electrode 30B is bonded to the second metal terminal 50B.

[0073] As a result of the above, the multilayer ceramic capacitor 1 shown in FIG. 1 is obtained.

[0074] (Effects of the Embodiment) According to the present embodiment, the following effects can be obtained.

[0075] According to this embodiment, the multilayer ceramic capacitor 1 includes an inner layer portion 11 including a plurality of dielectric layers 14 and a plurality of internal electrodes 15 stacked alternately, a pair of outer layer portions 12 sandwiching the inner layer portion 11 in a stacking direction T, a laminate 20 having a first main surface AA and a second main surface AB facing the stacking direction T, a first side surface BA and a second side surface BB facing a width direction W perpendicular to the stacking direction T, and a first end surface CA and a second end surface CB facing a length direction L perpendicular to the stacking direction T and the width direction W, a plurality of multilayer ceramic capacitor bodies 10 each having a first external electrode 30A arranged on the first end surface CA and a second external electrode 30B arranged on the second end surface CB, a first metal terminal 50A connected to the first external electrode 30A, and a second metal terminal 50B connected to the second external electrode 30B.The multilayer ceramic capacitor bodies 10 are arranged in a direction perpendicular to the length direction L of each multilayer ceramic capacitor body 10, with the length direction L of each multilayer ceramic electronic component body being parallel to each other. The direction in which the multilayer ceramic capacitor bodies 10 are arranged is defined as a first direction X, a direction perpendicular to the first direction X that is parallel to the length direction L of each multilayer ceramic capacitor body 10 is defined as a second direction Y, a direction perpendicular to the first direction X and the second direction Y is defined as a third direction Z, and a direction perpendicular to the first direction X and the second direction Y that is parallel to the length direction L of each multilayer ceramic capacitor body 10 is defined as a third direction Z. The direction approaching the center of the laminate 20 in the second direction Y is defined as the second direction center side Y1, the direction in the second direction Y away from the center of the laminate 20 in the second direction Y is defined as the second direction outer side Y2, the direction in the third direction Z approaching the center of the laminate 20 in the third direction Z is defined as the third direction center side Z1, and the direction in the third direction Z away from the center of the laminate 20 in the third direction Z is defined as the third direction outer side Z2. The first metal terminal 50A has first joint portions 51A that face each first end face CA and are connected to each first external electrode 30A, and The second metal terminal 50B has a first holding portion 54A extending from the second end face CB to the center side Y1 in the second direction and facing each multilayer ceramic capacitor body 10 in the third direction Z, a first falling portion 56A extending from an end of the first holding portion 54A on the center side Y1 in the second direction to the outside in the third direction Z2, and a first mounting portion 57A extending from an end of the first falling portion 56A on the outside in the third direction Z2 to the outside in the second direction Y2. The second metal terminal 50B is disposed so as to straddle the first external electrodes 30A of each multilayer ceramic capacitor body 10, and faces each second end face CB and is connected to each second external electrode 30A. 0B, a second holding portion 54B extending from the second joining portion 51B toward the second direction center side Y1 and facing each multilayer ceramic capacitor body 10 in the third direction Z, a second falling portion 56B extending from the end of the second holding portion 54B on the second direction center side Y1 to the outside in the third direction Z2, and a second mounting portion 57B extending from the end of the second falling portion 56B on the third direction outside Z2 to the outside in the second direction Y2, and is arranged so as to straddle each second external electrode 30B of each multilayer ceramic capacitor body 10.

[0076] According to this configuration, the first joint portions 51A are joined to the plurality of first external electrodes 30A, and the second joint portions 51B are joined to the plurality of second external electrodes 30B, thereby allowing the plurality of multilayer ceramic capacitor bodies 10 to be aligned and their relative positions to be fixed. Furthermore, the first holding portions 54A face the multilayer ceramic capacitor bodies 10 in the third direction Z, and the second holding portions 54B face the multilayer ceramic capacitor bodies 10 in the third direction Z, thereby preventing the multilayer ceramic capacitor bodies 10 from shifting in position in the third direction Z. For example, even if the solder joining the first metal terminals 50A and the first external electrodes 30A remelts when mounting the multilayer ceramic capacitor 1 on a substrate, the first holding portions 54A hold the multilayer ceramic capacitor bodies 10 to prevent the multilayer ceramic capacitor bodies 10 from falling off. The first holding portions 54A serve as a stopper that prevents the multilayer ceramic capacitor bodies 10 from falling off. As a result, in a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10, fluctuations in the external dimensions of the multilayer ceramic capacitor 1 can be suppressed, and a multilayer ceramic capacitor 1 with excellent stability in shape and external dimensions can be provided.

[0077] Furthermore, the end of the first mounting portion 57A on the outer side Y2 in the second direction (in other words, the tip of the first metal terminal 50A) can be prevented from facing the second metal terminal 50B. This prevents creeping discharge from occurring between the tip of the first metal terminal 50A and the second metal terminal 50B. Therefore, a multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10 can be provided that is excellent in stability of shape and external dimensions and can prevent creeping discharge from occurring. The number of the plurality of multilayer ceramic capacitor bodies 10 may be two, or, as exemplified in this embodiment, may be three. For example, even in a multilayer ceramic capacitor 1 having three or more multilayer ceramic capacitor bodies 10, where it is difficult to ensure stability of shape and external dimensions, this embodiment can provide a multilayer ceramic capacitor 1 that is excellent in stability of shape and external dimensions and can prevent creeping discharge from occurring.

[0078] According to this embodiment, the first joint portion 51A has a plurality of first slit portions 52A that are arranged at a position overlapping with the first external electrode 30A in the second direction Y and extend in the third direction Z, and the second joint portion 51B has a plurality of second slit portions 52B that are arranged at a position overlapping with the second external electrode 30B in the second direction Y and extend in the third direction Z.

[0079] An electrode protrusion that protrudes in the length direction L may be formed on a portion of the first end surface of the first external electrode 30A. The protruding dimension of the electrode protrusion is considered to vary depending on the multilayer ceramic capacitor body 10. Therefore, when the first metal terminal 50A is attached to a plurality of multilayer ceramic capacitor bodies 10, if the first joint portion 51A comes into contact with an electrode protrusion with a relatively large protruding dimension, the first metal terminal 50A may tilt, which may cause the shape and outer dimensions of the multilayer ceramic capacitor body 10 to become unstable.

[0080] However, with this configuration, interference between the electrode protrusions and the first bonding portions 51A can be suppressed. Furthermore, a similar effect can be achieved in the region of the multilayer ceramic capacitor 1 on the second metal terminal 50B side. This further improves the stability of the shape and overall dimensions of the multilayer ceramic capacitor 1 having multiple multilayer ceramic capacitor bodies 10. Furthermore, because the first slit portions 52A and the second slit portions 52B are configured as slits that open at the tip ends of the first bonding portions 51A and the second bonding portions 51B, interference between the first bonding portions 51A and the second bonding portions 51B and the electrode protrusions is less likely to occur during manufacturing, making manufacturing easier.

[0081] Furthermore, with this configuration, the electrode protrusions are inserted into the first slits 52A, thereby suppressing displacement of the first metal terminals 50A in the first direction X. The same effect can also be achieved in the region of the multilayer ceramic capacitor 1 on the side of the second metal terminals 50B. This further improves the stability of the shape and external dimensions of the multilayer ceramic capacitor 1 having a plurality of multilayer ceramic capacitor bodies 10.

[0082] According to this embodiment, the multiple internal electrodes 15 include a first internal electrode 15A that is extended to the first end face CA, a second internal electrode 15B that is extended to the second end face CB, and an intermediate electrode 15C that is not extended to either the first end face CA or the second end face CB, and the first falling portion 56A is positioned further outward in the second direction Y2 than the end of the first internal electrode 15A on the second direction center side Y1, and the second falling portion 56B is positioned further outward in the second direction Y2 than the end of the second internal electrode 15B on the second direction center side Y1.

[0083] In a multilayer ceramic capacitor with a so-called multiple structure, a leakage electric field may be generated between the end of the first internal electrode 15A on the second direction center side Y1 and the first metal terminal 50A, which may easily cause creeping discharge. Also, a leakage electric field may be generated between the end of the second internal electrode 15B on the second direction center side Y1 and the second metal terminal 50B, which may easily cause creeping discharge.

[0084] However, by arranging the first falling portion 56A on the outer side Y2 in the second direction than the end of the first internal electrode 15A on the center side Y1 in the second direction, and ensuring a distance between the end of the first internal electrode 15A on the center side Y1 in the second direction and the first metal terminal 50A, it is possible to suppress the occurrence of creeping discharge. Also, by arranging the second falling portion 56B on the outer side Y2 in the second direction than the end of the second internal electrode 15B on the center side Y1 in the second direction, and ensuring a distance between the end of the second internal electrode 15B on the center side Y1 in the second direction and the second metal terminal 50B, it is possible to suppress the occurrence of creeping discharge.

[0085] According to this embodiment, of the first metal terminal 50A, the first connection portion 58A, which is the connection portion between the first holding portion 54A and the first falling portion 56A, is curved when viewed in the first direction X, and of the second metal terminal 50B, the second connection portion 58B, which is the connection portion between the second holding portion 54B and the second falling portion 56B, is curved when viewed in the first direction X.

[0086] The first connection portion 58A of the first metal terminal 50A and the second connection portion 58B of the second metal terminal 50B are each relatively close to the outer surface of the laminate 20. However, with this configuration, the sharpness of the first metal terminal 50A and the sharpness of the second metal terminal 50B can be reduced near the outer surface of the laminate 20, thereby reducing the occurrence of creeping discharge, in which current flows along the surface of the multilayer ceramic capacitor body 10.

[0087] (Modifications of the Embodiment) Although the embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various changes and modifications are possible.

[0088] For example, in the above embodiment, the multilayer ceramic capacitor body 10 is a multilayer ceramic capacitor having a double structure, but the multilayer ceramic capacitor body 10 may be a multilayer ceramic capacitor having a triple structure, or a multilayer ceramic capacitor having a quadruple or more multilayer structure.

[0089] Furthermore, the multilayer ceramic electronic component body is not limited to a multilayer ceramic capacitor having a multi-layer structure. For example, the multilayer ceramic capacitor body 100 shown in FIGS. 9 to 11 is a multilayer ceramic capacitor that does not have a multilayer structure. The configuration of the multilayer ceramic capacitor body 100 will be described below. Note that differences from the multilayer ceramic capacitor body 10 according to the embodiment will be mainly described, and the same components as those in the multilayer ceramic capacitor body 10 according to the embodiment will be assigned the same reference numerals and description thereof will be omitted.

[0090] 9 to 11, the internal electrodes 115 of the multilayer ceramic capacitor body 100 include a plurality of first internal electrodes 115A and a plurality of second internal electrodes 115B. The first internal electrodes 115A are exposed only at the first end face CA. The second internal electrodes 115B are exposed only at the second end face CB. The first internal electrodes 115A and the second internal electrodes 115B are arranged alternately. Note that the laminate 120 does not include an intermediate electrode 15C.

[0091] The first internal electrode 115A has a first opposing portion 115Aa and a first lead portion 115Ab. The first opposing portion 115Aa is a portion of the first internal electrode 115A that faces the second internal electrode 115B adjacent to it in the stacking direction T. The first opposing portion 115Aa is located in the center between the end faces C. The first lead portion 115Ab is a portion of the first internal electrode 115A that extends from the first opposing portion 115Aa toward the first end face CA. The first lead portion 115Ab is exposed at the first end face CA. The first lead portion 115Ab is connected to the first external electrode 3A.

[0092] The second internal electrode 115B has a second opposing portion 115Ba and a second lead portion 115Bb. The second opposing portion 115Ba is a portion of the second internal electrode 115B that faces the adjacent first internal electrode 115A (first opposing portion 115Aa). The second opposing portion 115Ba is located in the center between the end faces C. The second lead portion 115Bb is a portion of the second internal electrode 115B that extends from the second opposing portion 115Ba toward the second end face CB. The second lead portion 115Bb is exposed at the second end face CB. The second lead portion 115Bb is connected to the second external electrode 3B.

[0093] In the above embodiment, the capacitor assembly G is formed by a plurality of multilayer ceramic capacitor bodies 10 arranged side by side in the stacking direction T, but the capacitor assembly G may also be formed by a plurality of multilayer ceramic capacitor bodies 10 arranged side by side in the width direction W. In other words, the multilayer ceramic capacitor 1 does not have to be mounted on the mounting board with the side surface B of each multilayer ceramic capacitor body 10 facing the mounting surface, and may be mounted on the mounting board with the main surface A of each multilayer ceramic capacitor body 10 facing the mounting surface.

[0094] In the above embodiment, a multilayer ceramic capacitor in which the dielectric layers 14 made of a dielectric ceramic are used as ceramic layers has been described as an example of the multilayer ceramic electronic component. However, the multilayer ceramic electronic component of the present disclosure is not limited to this. For example, the ceramic electronic component of the present disclosure can also be applied to various other multilayer ceramic electronic components, such as piezoelectric components using piezoelectric ceramics as ceramic layers, thermistors using semiconductor ceramics as ceramic layers, and inductors using magnetic ceramics as ceramic layers. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, examples of semiconductor ceramics include spinel ceramics, and examples of magnetic ceramics include ceramics such as ferrite.

[0095] The present invention also includes the following combinations:

[0096] <1> A laminate having an inner layer portion including a plurality of alternately stacked ceramic layers and a plurality of internal electrodes, a pair of outer layer portions provided on either side of the inner layer portion in the stacking direction, first and second main surfaces opposing each other in the stacking direction, first and second side surfaces opposing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces opposing each other in a length direction perpendicular to the stacking direction and the width direction, a plurality of multilayer ceramic electronic component bodies each having a first external electrode disposed on the first end surface and a second external electrode disposed on the second end surface, a first metal terminal connected to the first external electrode and a second metal terminal connected to the second external electrode, wherein the laminated ceramic electronic component bodies are arranged side by side in a direction perpendicular to the length direction of each of the laminated ceramic electronic component bodies, with the length directions of the laminated ceramic electronic component bodies oriented parallel to each other, the direction in which the laminated ceramic electronic component bodies are arranged is defined as a first direction, and a direction perpendicular to the first direction that is parallel to the length direction of each of the laminated ceramic electronic component bodies is defined as a second direction, and a direction perpendicular to the second direction is defined as a third direction, and the direction of the two directions approaching the center of the laminate in the second direction is defined as the center side in the second direction, the direction of the two directions moving away from the center of the laminate in the second direction is defined as the outer side in the second direction, the direction of the three directions approaching the center of the laminate in the third direction is defined as the center side in the third direction, and the direction of the three directions moving away from the center of the laminate in the third direction is defined as the outer side in the third direction, the first metal terminals face each of the first end faces and are connected to each of the first external electrodes. a first joint portion extending from the first joint portion toward the center in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, a first holding portion extending from an end of the first holding portion toward the center in the second direction toward the outside in the third direction, and a first mounting portion extending from an end of the first holding portion facing the center in the second direction toward the outside in the second direction toward the outside in the second direction, the second metal terminal being disposed so as to straddle the first external electrodes of each of the multilayer ceramic electronic component bodies, and the second metal terminal facing each of the second end faces and connected to each of the second external electrodes;a second holding portion extending from the second joint portion toward the center in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, a second falling portion extending outward in the third direction from an end of the second holding portion toward the center in the second direction, and a second mounting portion extending outward in the second direction from an end of the second falling portion on the outer side in the third direction, and the multilayer ceramic electronic component is disposed so as to straddle the second external electrodes of each of the multilayer ceramic electronic component bodies.

[0097] <2> The multilayer ceramic electronic component described in <1>, wherein the first joint portion has a plurality of first slit portions that are provided at positions overlapping the first external electrode in the second direction and extend in the third direction, and the second joint portion has a plurality of second slit portions that are provided at positions overlapping the second external electrode in the second direction and extend in the third direction.

[0098] <3> A multilayer ceramic electronic component according to <2>, wherein the maximum dimension in the first direction between adjacent first slit portions is greater than the minimum dimension in the first direction of the first slit portions, and the maximum dimension in the first direction between adjacent second slit portions is greater than the minimum dimension in the first direction of the second slit portions.

[0099] <4> A multilayer ceramic electronic component according to <2> or <3>, wherein the dimension in the third direction of the first slit portion is longer than half the dimension in the third direction of the first external electrode and shorter than the dimension in the third direction of the first external electrode, and the dimension in the third direction of the second slit portion is longer than half the dimension in the third direction of the second external electrode and shorter than the dimension in the third direction of the second external electrode.

[0100] <5> The multilayer ceramic electronic component according to any one of <1> to <4>, wherein the plurality of internal electrodes include first internal electrodes drawn to the first end face, second internal electrodes drawn to the second end face, and intermediate electrodes that are not drawn to either the first end face or the second end face, and the first falling portions are arranged further outward in the second direction than end portions of the first internal electrodes that are closer to the center in the second direction, and the second falling portions are arranged further outward in the second direction than end portions of the second internal electrodes that are closer to the center in the second direction.

[0101] 1 Multilayer ceramic capacitor (multilayer ceramic electronic component) 10 Multilayer ceramic capacitor body (multilayer ceramic electronic component body) 11 Inner layer portion 12 Outer layer portion 14 Dielectric layer (ceramic layer) 15, 115 Internal electrode 15A, 115A First internal electrode 15B, 115B Second internal electrode 15C Intermediate electrode 20 Laminate 30A First external electrode 30B Second external electrode 50A First metal terminal 50B Second metal terminal 51A First joint portion 51B Second joint portion 52A First slit portion 52B Second slit portion 54A First holding portion 54B Second holding portion 56A First falling portion 56B Second falling portion 57A First mounting portion 57B Second mounting portion AA First main surface AB Second main surface BA First side surface BB Second side surface CA First end face CB Second end face

Claims

1. A multilayer ceramic electronic component comprising: an inner layer portion including a plurality of alternately stacked ceramic layers and a plurality of internal electrodes; a pair of outer layer portions sandwiching the inner layer portion in the stacking direction; a laminate having first and second main surfaces opposing each other in the stacking direction, first and second side surfaces opposing each other in a width direction perpendicular to the stacking direction, and first and second end surfaces opposing each other in a length direction perpendicular to the stacking direction and the width direction; a plurality of multilayer ceramic electronic component bodies each having a first external electrode disposed on the first end surface and a second external electrode disposed on the second end surface; first metal terminals connected to the first external electrodes; and second metal terminals connected to the second external electrodes, wherein the length directions of the multilayer ceramic electronic component bodies are oriented parallel to each other and the multilayer ceramic electronic component bodies are arranged side by side in a direction perpendicular to the length direction of the multilayer ceramic electronic component body; The direction in which the laminated ceramic electronic component bodies are arranged is defined as a first direction, a direction orthogonal to the first direction that is parallel to the length direction of each of the laminated ceramic electronic component bodies is defined as a second direction, a direction orthogonal to the first direction and the second direction is defined as a third direction, and the direction approaching the center of the laminate in the second direction of the two directions is defined as the second direction center side, the direction moving away from the center of the laminate in the second direction of the two directions is defined as the second direction outer side, the direction approaching the center of the laminate in the third direction of the three directions is defined as the third direction center side, and the direction moving away from the center of the laminate in the third direction of the three directions is defined as the third direction outer side, the first metal terminals each include a first joint portion facing the first end faces and connected to the first external electrodes, a first holding portion extending from the first joint portion toward the center in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction, a first falling portion extending outward in the third direction from an end of the first holding portion facing the center in the second direction, and a first mounting portion extending outward in the second direction from an end of the first falling portion facing the outside in the third direction, and are arranged to straddle the first external electrodes of each of the multilayer ceramic electronic component bodies;the second metal terminal has: a second joint portion facing the second end face and connected to the second external electrode; a second holding portion extending from the second joint portion toward the center in the second direction and facing each of the multilayer ceramic electronic component bodies in the third direction; a second falling portion extending outward in the third direction from an end of the second holding portion facing the center in the second direction; and a second mounting portion extending outward in the second direction from an end of the second falling portion facing outward in the third direction, and is arranged so as to straddle the second external electrodes of each of the multilayer ceramic electronic component bodies.

2. The multilayer ceramic electronic component according to claim 1, wherein the first joint portion has a plurality of first slit portions that are provided at positions overlapping the first external electrode in the second direction and extend in the third direction, and the second joint portion has a plurality of second slit portions that are provided at positions overlapping the second external electrode in the second direction and extend in the third direction.

3. A multilayer ceramic electronic component according to claim 2, wherein the maximum dimension in the first direction between adjacent first slit portions is greater than the minimum dimension in the first direction of the first slit portions, and the maximum dimension in the first direction between adjacent second slit portions is greater than the minimum dimension in the first direction of the second slit portions.

4. A multilayer ceramic electronic component according to claim 2 or 3, wherein the dimension in the third direction of the first slit portion is longer than half the dimension in the third direction of the first external electrode and shorter than the dimension in the third direction of the first external electrode, and the dimension in the third direction of the second slit portion is longer than half the dimension in the third direction of the second external electrode and shorter than the dimension in the third direction of the second external electrode.

5. A multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the plurality of internal electrodes include first internal electrodes drawn to the first end face, second internal electrodes drawn to the second end face, and intermediate electrodes that are not drawn to either the first end face or the second end face, wherein the first falling portions are arranged further outward in the second direction than the ends of the first internal electrodes that are closer to the center in the second direction, and wherein the second falling portions are arranged further outward in the second direction than the ends of the second internal electrodes that are closer to the center in the second direction.

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