Slot die device

The slot die device addresses slurry leakage and flow rate control issues by using guide and buffer grooves in the shim plates to separate and manage multiple slurry types, enhancing coating quality.

WO2026005417A1PCT designated stage Publication Date: 2026-01-02LG ENERGY SOLUTION LTD
View PDF 6 Cites 0 Cited by

Patent Information

Application Number
PCT/KR2025/008738
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-06-26
Filing Date
2025-06-24
Publication Date
2026-01-02

AI Technical Summary

Technical Problem

Conventional slot die devices experience slurry leakage through microscopic gaps between shim plates and lack effective control over the flow rate of multiple slurry types during simultaneous discharge.

Method used

A slot die device design featuring a core section with a main shim plate and a sub shim plate that includes guide grooves and buffer grooves to guide and discharge different slurry types separately, preventing leakage and adjusting flow rates.

Benefits of technology

The design effectively prevents slurry leakage and enhances the quality of coating by controlling the flow rates of multiple slurry types, improving the overall coating process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure KR2025008738_02012026_PF_FP_ABST
    Figure KR2025008738_02012026_PF_FP_ABST
Patent Text Reader

Abstract

The present invention relates to a slot die device for simultaneously discharging main slurry and sub-slurry, the device comprising: a die part comprising a first die including a manifold to which the main slurry is supplied and a second die coupled to the first die; and a shim part interposed between the first die and the second die and forming a gap through which slurry is discharged between the first die and the second die, wherein the shim part comprises: a main shim plate for guiding movement of the main slurry; and at least one sub-shim plate for guiding movement of the sub-slurry, and the sub-shim plate is provided to cover a portion of the manifold.
Need to check novelty before this filing date? Find Prior Art

Description

slot die device

[0001] The present invention relates to a slot die device, and more particularly, to a slot die device capable of simultaneously discharging two or more different types of slurry.

[0002] This disclosure claims the benefit of priority to Republic of Korea Patent Application No. 10-2024-0083654, filed June 26, 2024, the entire contents of which are incorporated by reference herein.

[0003] Secondary batteries that can be recharged are attracting attention as power sources for devices that require high output and large capacity, including electric vehicles, hybrid electric vehicles, and plug-in hybrid electric vehicles, which are being proposed as a solution to air pollution caused by existing gasoline and diesel vehicles that use fossil fuels.

[0004] In terms of battery shape, there is a high demand for square secondary batteries and pouch-type secondary batteries that can be applied to products such as mobile phones due to their thin thickness. In terms of materials, there is a high demand for lithium secondary batteries such as lithium-ion batteries and lithium-ion polymer batteries that have advantages such as high energy density, discharge voltage, and output stability.

[0005] Secondary batteries have a structure in which an electrode assembly consisting of electrodes and a separator and an electrolyte are housed together in a battery case.

[0006] In general, electrodes are manufactured by applying a slurry containing an active material onto a sheet-shaped current collector, and a slot die device is most commonly used for applying the slurry.

[0007] Meanwhile, there is an increasing trend in the use of slot die devices having a structure capable of simultaneously discharging an insulating liquid together with a slurry containing an active material for loading and partial insulation of an active material coated on a current collector.

[0008] Fig. 1 is a perspective view of a conventional slot die device that simultaneously discharges an active material slurry and an insulating liquid, and Fig. 2 is an exploded perspective view of the slot die device of Fig. 1.

[0009] A conventional slot die device basically discharges an active material slurry through a gap between an upper die (10) and a lower die (20). A main shim plate (30) and a sub shim plate (40) are interposed between the upper die (10) and the lower die (20). The active material slurry is discharged through a main discharge port (50) formed by the main shim plate (30), and the insulating liquid is discharged through a sub discharge port (60) formed by the sub shim plate (40).

[0010] Specifically, the active material slurry is introduced through a manifold (70) included in the lower die (20) as illustrated in FIG. 2, guided by the main shim plate (30) to move to the main discharge port (50) at the front, and then discharged to the outside. In addition, the insulating liquid is introduced through a separate inflow path (not illustrated), guided by the sub shim plate (40), and then moves to the sub discharge port (60) at the front, and then discharged to the outside.

[0011] In this way, different types of slurries can be discharged simultaneously from one slot die device.

[0012] A slot die device having the above structure requires a process of adjusting the end positions of the main shim plate (30) and the sub shim plate (40).

[0013] Fig. 3 is a side view of the slot die device of Fig. 1, in which the main shim plate (30) and the sub shim plate (40) are moved back and forth based on the end positions of the upper die (10) and the lower die (20) to adjust the optimal position.

[0014] In the case of the above sub-shim plate (40), it is coupled to either the upper die (10) or the lower die (20) through a separate coupling member (90). At this time, the sub-shim plate (40) is formed such that the coupling hole (80) to which the coupling member (90) is coupled extends in one direction so that the end position can be adjusted.

[0015] Fig. 4 is a plan view of a sub-shim plate (40) included in Fig. 1, wherein the sub-shim plate (40) includes a linearly formed coupling hole (80), and a coupling member (90) is coupled to the coupling hole (80). The coupling member (90) penetrates the coupling hole (80) and is coupled to the upper die (10) or the lower die (20) to fix the sub-shim plate (40).

[0016] The above sub-shim plate (40) slides back and forth around the connecting member (90) as shown in FIG. 4.

[0017] However, the slot die device having the above structure had no way to solve the problem of active material slurry leakage through the microscopic gap between the main shim plate (30) and the sub shim plate (40).

[0018] Accordingly, the present invention was created to solve the above problems, and the purpose of the present invention is to provide a slot die device having a structure with little slurry leakage and capable of simultaneously discharging two or more different types of slurry.

[0019] In addition, it is an object of the present invention to provide a slot die device designed to advantageously control the flow rate of slurry.

[0020] Other objects and advantages of the present invention can be understood through the following description and will be more clearly understood through the embodiments of the present invention. Furthermore, it will be readily apparent that the objects and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims.

[0021] According to the present invention, a slot die device for simultaneously discharging main slurry and sub slurry is provided.

[0022] The slot die device comprises a die section including a first die including a manifold to which main slurry is supplied and a second die coupled to the first die; and a core section interposed between the first die and the second die and forming a gap through which slurry is discharged between the first die and the second die; wherein the core section comprises a main shim plate guiding movement of the main slurry; and at least one sub shim plate guiding movement of the sub slurry; wherein the sub shim plate is provided to cover a portion of the manifold.

[0023] The above sub-shim plate includes a guide groove, and the sub-slurry can move through the guide groove.

[0024] The above sub-shim plate further includes a buffer groove on one side facing the manifold, and one side of the buffer groove can be opened.

[0025] The above buffer home may be formed on a portion of the surface of the sub-shim plate facing the manifold that covers the manifold.

[0026] The above buffer home can be formed by step-processing a portion of the sub-shim plate corresponding to the manifold.

[0027] The above sub-shim plate may include a buffer groove on the other side opposite to the side on which the guide groove is formed.

[0028] The above buffer home includes a front step surface formed at a position corresponding to the front end of the die portion, and a rear step surface opposite to the front step surface, and the front step surface can be inclined in a horizontal direction.

[0029] The gap between the front step surface and the rear step surface may become wider as it goes toward the open side.

[0030] The main shim plate includes a support portion corresponding to the rear end of the die portion; a first guide portion corresponding to one side of the die portion and extending from one end of the support portion; and a second guide portion corresponding to the other side of the die portion and extending from the other end of the support portion; and the sub shim plate can be positioned between the first guide portion and the second guide portion.

[0031] The above sub-shim plate can be joined to the first die by contacting the main shim plate.

[0032] According to the present invention, when coating two or more different types of slurries, the quality of the coating can be improved.

[0033] Figure 1 is a perspective view of a conventional slot die device.

[0034] Fig. 2 is an exploded perspective view of the slot die device of Fig. 1.

[0035] Figure 3 is a side view of the slot die device of Figure 1.

[0036] Figure 4 is a plan view of the sub-shim plate included in Figure 1.

[0037] FIG. 5 is an example of an exploded perspective view of a slot die device according to the first embodiment of the present invention.

[0038] Fig. 6 is another example of an exploded perspective view of a slot die device according to the first embodiment of the present invention.

[0039] FIG. 7 is another example of an exploded perspective view of a slot die device according to the first embodiment of the present invention.

[0040] Figure 8 is a plan view of the core and first die of Figure 7.

[0041] FIG. 9 is a perspective view of a sub-shim plate included in a slot die device according to the first embodiment of the present invention.

[0042] Figure 10 is a schematic diagram simply showing the combination of the sub-shim plate and the first die.

[0043] Fig. 11 is an example of an exploded perspective view of a slot die device according to a second embodiment of the present invention.

[0044] Fig. 12 is another example of an exploded perspective view of a slot die device according to a second embodiment of the present invention.

[0045] Fig. 13 is another example of an exploded perspective view of a slot die device according to a second embodiment of the present invention.

[0046] Fig. 14 is a cross-sectional view taken in the width direction of a slot die device according to a second embodiment of the present invention.

[0047] FIG. 15 is a perspective view and a bottom perspective view of a sub-shim plate included in a slot die device according to a second embodiment of the present invention.

[0048] Fig. 16 is a plan view of the sub-shim plate of Fig. 15.

[0049] Fig. 17 is a bottom perspective view of a sub-shim plate included in a slot die device according to a third embodiment of the present invention.

[0050] Fig. 18 is a plan view of the sub-shim plate of Fig. 17.

[0051] Fig. 19 is a plan view of the first die and the core in a slot die device according to the third embodiment of the present invention.

[0052] FIG. 20 is a plan view of the first die and the core in a slot die device according to the fourth embodiment of the present invention.

[0053] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, it should be noted that the terms and words used in this specification and claims should not be construed as limited to their conventional or dictionary meanings. Based on the principle that the inventor can appropriately define the concept of a term to best explain his or her invention, they should be construed as meanings and concepts consistent with the technical spirit of the present invention.

[0054] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings are only the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, and it should be understood that there may be various equivalents and modified examples that can replace them at the time of filing this application.

[0055] In addition, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description is omitted.

[0056] Since the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, the shapes and sizes of components in the drawings may be exaggerated, omitted, or schematically illustrated for clearer explanation. Accordingly, the sizes and proportions of each component do not fully reflect the actual sizes or proportions.

[0057] In the present invention, “slit” refers to a general term for a through hole having a long axis in one direction and a short axis in a direction perpendicular to the long axis, and includes cases where the shape is rectangular, oval, or bead-shaped.

[0058]

[0059] The present invention relates to a slot die device, and more particularly, to a slot die device that discharges a main slurry and a sub slurry simultaneously.

[0060] FIGS. 5 to 10 relate to a slot die device according to a first embodiment of the present invention, FIGS. 11 to 16 relate to a slot die device according to a second embodiment of the present invention, FIGS. 17 to 19 relate to a slot die device according to a third embodiment of the present invention, and FIG. 20 relates to a slot die device according to a fourth embodiment of the present invention.

[0061] Hereinafter, specific embodiments of the slot die device of the present invention will be described in detail with reference to the attached drawings. Note that the directions of front, back, up, down, left, and right used to designate relative positions in the following description are intended to aid understanding of the invention, and unless otherwise specified, the directions depicted in the drawings are taken as a reference.

[0062] In addition, the longitudinal direction of a configuration is defined as the direction corresponding to the plane having the longest length of the configuration depicted in the drawing based on the horizontal direction, and the width direction of a configuration is defined as the direction orthogonal to the longitudinal direction based on the horizontal direction.

[0063] In the present invention, the width direction of the slot die device is defined as corresponding to the direction in which the slurry is discharged, and the length direction of the slot die device is defined as referring to the direction orthogonal to the width direction of the slot die device.

[0064]

[0065] (First embodiment)

[0066] FIG. 5 is an example of an exploded perspective view of a slot die device according to a first embodiment of the present invention, FIG. 6 is another example of an exploded perspective view of a slot die device according to a first embodiment of the present invention, and FIG. 7 is another example of an exploded perspective view of a slot die device according to a first embodiment of the present invention.

[0067] The slot die device of the present invention includes a die section including a first die (110) and a second die (120), as shown in FIGS. 5 to 7, and a core section interposed between the first die (110) and the second die (120).

[0068] The above first die (110) includes a manifold (111) through which the main slurry is supplied.

[0069] The second die (120) is formed corresponding to the first die (110) and is combined with the first die (110) to cover the manifold (111) of the first die (110).

[0070] The main slurry is introduced through the manifold (111), filled, and then moves into the gap between the first die (110) and the second die (120).

[0071] The above-mentioned deep part forms a gap through which slurry is discharged between the first die (110) and the second die (120).

[0072] The above-mentioned core specifically includes a main core plate (210) that guides the movement of the main slurry and at least one sub core plate (220) that guides the movement of the sub slurry.

[0073]

[0074] The above main shim plate (210) is interposed between the first die (110) and the second die (120) to form a gap and serves to guide the movement of the main slurry through the manifold (111).

[0075] The above main shim plate (210) includes a support portion (211), a first guide portion (212), and a second guide portion (213).

[0076] The above support member (211) is formed corresponding to the rear end of the die part and prevents the main slurry moving through the manifold (111) of the first die (110) from flowing out to the rear end of the die part.

[0077] The above first guide portion (212) corresponds to one side of the die portion and is formed to extend from one end of the support portion (211).

[0078] The first guide portion (212) serves to prevent the main slurry from flowing out to one side of the die portion. In addition, the first guide portion (212) guides the main slurry between the first die (110) and the second die (120) so that it can move toward the front end of the die portion. Therefore, preferably, the first guide portion (212) extends from one end of the support portion (211) so as to be perpendicular to the support portion (211).

[0079] The second guide portion (213) corresponds to the other side of the die portion and is formed to extend from the other end of the support portion (211). That is, the second guide portion (213) is formed to face the first guide portion (212).

[0080] The second guide portion (213), like the first guide portion (212), guides the main slurry to move toward the front end of the die portion. Therefore, preferably, the second guide portion (213) extends from the other end of the support portion (211) so as to be perpendicular to the support portion (211) and parallel to the first guide portion (212).

[0081] As a result, the main slurry supplied through the manifold (111) is guided by the support (211), the first guide part (212) and the second guide part (213) and moves to the front end of the die part and is discharged.

[0082]

[0083] The above sub-shim plate (220) guides the movement of the sub-slurry and discharges it by separating it from the main slurry.

[0084] The sub-shim plate (220) of the present invention is provided to cover a portion of the manifold (111) in a state in contact with the main shim plate (210) as shown in FIG. 6.

[0085] The sub-shim plate (220) of the present invention is located between the first guide portion (212) and the second guide portion (213).

[0086] Specifically, the sub-shim plate (220) is coupled to the die portion by contacting the first guide portion (212) and the second guide portion (213) of the main shim plate (210), and covers a portion of the manifold (111) through the lower surface.

[0087] Fig. 8 is a plan view of the core and first die (110) of Fig. 7, and the covered portion of the manifold (111) is indicated by a dotted line.

[0088] According to the above drawing 8, both ends of the manifold (111) are covered with the sub-shim plate (220) based on the longitudinal direction of the slot die device.

[0089] Due to the combination of the sub-shim plate (220) and the first die (110), the main slurry does not flow out to the combination portion of the sub-shim plate (220) and the first die (110). Therefore, the main slurry cannot leak through the microscopic gap between the sub-shim plate (220) and the main shim plate (210) in contact.

[0090] The above sub-shim plate (220) includes a guide groove (221) through which the sub-slurry can move.

[0091] The above guide groove (221) is formed on one side of the sub-shim plate (220) that does not face the manifold (111), as shown in FIGS. 5 to 7. That is, the guide groove (221) is formed in a portion that does not overlap the manifold (111) so that the main slurry and the sub slurry do not mix with each other.

[0092] FIG. 9 is a perspective view of a sub-shim plate (220) included in a slot die device according to the first embodiment of the present invention.

[0093] The guide groove (221) included in the above sub-shim plate (220) is composed of an inlet portion (221a), a moving portion (221b), and a discharge portion (221c) as shown in FIG. 9.

[0094] The above inlet (221a) serves as a manifold (111) of the die section and is an area into which sub-slurry is introduced.

[0095] Although not shown, the sub-slurry supplied from outside is introduced through the first die (110) or the second die (120) at a position corresponding to the inlet (221a).

[0096] The above moving part (221b) is a part that is directly connected to the inlet part (221a) and guides the movement of the sub-slurry. The sub-slurry introduced into the inlet part (221a) moves to the moving part (221b).

[0097] The above discharge portion (221c) is a region included in the end of the moving portion (221b) and through which the sub-slurry is discharged to the outside. The sub-slurry moved through the moving portion (221b) is discharged through the discharge portion (221c) included in the end of the moving portion (221b).

[0098]

[0099] Figure 10 is a schematic diagram simply showing the combination of the sub-shim plate (220) and the first die (110).

[0100] The above sub-shim plate (220) includes a joining hole (223) at an end opposite to the guide groove (221) position as shown in FIG. 10.

[0101] The above sub-shim plate (220) is fixed to the die section through a joining member (B) that penetrates the joining hole (223) and is joined to the first die (110).

[0102] The above-mentioned connecting member (B) may be, for example, a bolt or the like.

[0103] It is preferable that the above-mentioned joining hole (223) has a shape that extends in one direction so that it can be guided and slid along the joining member (B). More preferably, the joining hole (223) has a shape that extends along the width direction of the slot die device. Accordingly, the sub-shim plate (220) can be guided by the joining hole (223) and its position can be adjusted forward and backward.

[0104]

[0105] Even while sliding to adjust the position of the sub-shim plate (220), the sub-shim plate (220) remains in a state of covering the end of the manifold (111). Therefore, the slot die device of the present invention does not allow the main slurry to leak through the joint portion of the sub-shim plate (220) and the main shim plate (210).

[0106]

[0107] In the slot die device of the present invention, the main slurry is guided and discharged by the first guide portion (212) and the second guide portion (213) of the main shim plate (210), and at the same time, the sub slurry is guided and discharged through the guide groove (221) of the sub shim plate (220).

[0108]

[0109] (Second embodiment)

[0110] FIG. 11 is an example of an exploded perspective view of a slot die device according to a second embodiment of the present invention, FIG. 12 is another example of an exploded perspective view of a slot die device according to a second embodiment of the present invention, FIG. 13 is another example of an exploded perspective view of a slot die device according to a second embodiment of the present invention, FIG. 14 is a cross-sectional view taken in the width direction of a slot die device according to a second embodiment of the present invention, FIG. 15 is a perspective view and a bottom perspective view of a sub-shim plate (220) included in a slot die device according to a second embodiment of the present invention, and FIG. 16 is a plan view of the sub-shim plate (220) of FIG. 15.

[0111] The slot die device according to the second embodiment of the present invention further includes a buffer groove (222) that supplements the flow rate of the main slurry on one surface of the sub-shim plate (220).

[0112] The above sub-shim plate (220) includes a buffer groove (222) on one side facing the manifold (111), as illustrated in FIGS. 11 to 15. That is, the sub-shim plate (220) includes the buffer groove (222) on the other side opposite to the one side on which the guide groove (221) is formed.

[0113] The above buffer home (222) is formed by step machining a portion of the sub-shim plate (220) corresponding to the manifold (111). Therefore, the buffer home (222) has a step surface formed by the step machining.

[0114] Specifically, the buffer home (222) includes a front step surface (222a) formed at a position corresponding to the front end of the die, a rear step surface (222b) opposite to the front step surface (222a), and a side step surface (222c) connecting the front step surface (222a) and the rear step surface (222b).

[0115]

[0116] The above buffer home (222) is formed in a square shape corresponding to the shape of the manifold (111) as shown in Fig. 15.

[0117] Fig. 14 is a cross-sectional view showing a slot die device according to a second embodiment cut in the width direction. Specifically, Fig. 14 is a cross-sectional view showing the slot die device cut so that the cutting line passes through the buffer groove (222) of the sub-shim plate (220).

[0118] The buffer groove (222) is formed on a portion of the surface of the sub-shim plate (220) facing the manifold (111) that covers the manifold (111). Therefore, the buffer groove (222) supplements the upper space of the manifold (111) that may be covered and disappear by the sub-shim plate (220).

[0119] According to Fig. 14, the buffer home (222) complements the upper space of the manifold (111).

[0120]

[0121] The above buffer home (222) has a shape in which one side is open, as shown in Fig. 15. That is, the above buffer home (222) has three step surfaces excluding the open side.

[0122] Specifically, one side of the buffer home (222) facing the center of the manifold (111) is open.

[0123] Accordingly, the main slurry introduced into the buffer home (222) through the manifold (111) can move to the front end of the die unit through one side of the open buffer home (222).

[0124]

[0125] (Embodiment 3)

[0126] In a slot die device according to a third embodiment of the present invention, the shape of the buffer groove (222) included in the sub-shim plate (220) of the slot die device of the second embodiment is modified.

[0127] FIG. 17 is a bottom perspective view of a sub-shim plate (220) included in a slot die device according to a third embodiment of the present invention, and FIG. 18 is a plan view of the sub-shim plate (220) of FIG. 17.

[0128] The above buffer home (222) includes three stepped surfaces excluding one open side. In particular, it is characterized in that one of the three stepped surfaces is inclined in the horizontal direction.

[0129] The above buffer home (222) includes a front step surface (222a) formed at a position corresponding to the front end of the die, a rear step surface (222b) opposite to the front step surface (222a), and a side step surface (222c) connecting the front step surface (222a) and the rear step surface (222b).

[0130] The front step surface (222a) is inclined in the horizontal direction as shown in FIGS. 17 and 18. That is, the front step surface (222a) is inclined so that the gap between the front step surface (222a) and the rear step surface (222b) increases toward the open side.

[0131] FIG. 19 is a plan view of the first die (110) and the core in a slot die device according to the third embodiment of the present invention.

[0132] The width of the buffer home (222) based on the width direction of the slot die device may be less than or equal to the width of the manifold (111).

[0133] The main slurry supplied from the manifold (111) fills the step surface of the buffer groove (222) at the edge of the manifold (111). Thereafter, it can move forward of the die section along the incline of the front step surface (222a) of the buffer groove (222). At this time, the incline of the front step surface (222a) supplements the flow of the main slurry, the movement of which is restricted by the sub-shim plate (220), and makes the flow rate of the main slurry more favorable.

[0134]

[0135] (Embodiment 4)

[0136] The slot die device according to the fourth embodiment is characterized in that the width of the buffer home (222) is increased compared to the width of the buffer home (222) included in the slot die device of the third embodiment.

[0137] FIG. 20 is a plan view of the first die (110) and the core in a slot die device according to the fourth embodiment of the present invention.

[0138] The width of the buffer home (222) exceeds the width of the manifold (111) based on the width direction of the slot die device as shown in FIG. 20.

[0139] The main slurry supplied from the manifold (111) begins to fill the buffer groove (222) at the edge of the manifold (111). Thereafter, the main slurry moves toward the front step surface (222a) of the buffer groove (222) and can move forward of the die section along the incline of the front step surface (222a). At this time, the incline of the front step surface (222a) supplements the flow of the main slurry, the movement of which is restricted by the sub-shim plate (220), and makes the flow of the main slurry more advantageous.

[0140] Since the front step surface (222a) of the buffer groove (222) of the slot die device of the fourth embodiment is located in front of the slot die device of the third embodiment, it can be seen that the slot die device of the fourth embodiment is more advantageous than the slot die device of the third embodiment in terms of the flow rate of the main slurry.

[0141]

[0142] The present invention has been described in more detail through the drawings and examples. However, the configurations described in the drawings or examples described in this specification are merely embodiments of the present invention and do not represent all of the technical ideas of the present invention. Therefore, it should be understood that various equivalents and modified examples may exist as of the time of this application.

[0143]

[0144] [Explanation of symbols]

[0145] 10: (Prior art) Upper die

[0146] 20: (Prior art) Lower die

[0147] 30: (Prior art) Main shim plate

[0148] 40: (Prior art) Sub-shim plate

[0149] 50: (Prior art) Main outlet

[0150] 60: (Prior art) Sub-outlet

[0151] 70: (Prior art) Manifold

[0152] 80: (Prior art) Combination hole

[0153] 90: (Prior art) Joint member

[0154] 110: First die

[0155] 111: Manifold

[0156] 120: Second die

[0157] 210: Main shim plate

[0158] 211: Support

[0159] 212: 1st Guide Department

[0160] 213: 2nd Guide Department

[0161] 220: Sub-Sim Plate

[0162] 221: Guide Home

[0163] 221a: Inlet

[0164] 221b: Moving part

[0165] 221c: Discharge part

[0166] 222: Buffer Home

[0167] 222a: Front step surface

[0168] 222b: Rear step surface

[0169] 222c: Side step

[0170] 223: Combination hole

[0171] B: Joining member

[0172] S1: Main slurry

Claims

1. A slot die device that discharges main slurry and sub slurry simultaneously, A die section including a first die including a manifold to which main slurry is supplied and a second die coupled to the first die; and A core formed between the first die and the second die and forming a gap through which slurry is discharged between the first die and the second die; The above-mentioned deep part, A main shim plate guiding the movement of the main slurry; and At least one sub-shim plate guiding the movement of the sub-slurry; A slot die device characterized in that the sub-shim plate is provided to cover a portion of the manifold.

2. In paragraph 1, The above sub-shim plate is, A slot die device comprising a guide groove, wherein the sub-slurry moves through the guide groove.

3. In paragraph 2, The above sub-shim plate further includes a buffer groove on one side facing the manifold, The above buffer home is a slot die device with one side open.

4. In paragraph 3, A slot die device in which the buffer home is formed on a portion of one side of the sub-shim plate facing the manifold and covering the manifold.

5. In paragraph 3, The above buffer home is a slot die device formed by step processing a portion of the sub-shim plate corresponding to the manifold.

6. In paragraph 3, The above sub-shim plate is a slot die device including a buffer groove on one side opposite to the side on which the guide groove is formed.

7. In paragraph 3, The above buffer home includes a front step surface formed at a position corresponding to the front end of the die portion, and a rear step surface opposite to the front step surface, The above front step surface is a slot die device inclined in the horizontal direction.

8. In paragraph 7, A slot die device in which the gap between the front step surface and the rear step surface becomes wider as it goes toward the open side.

9. In paragraph 1, The above main shim plate, A support corresponding to the rear end of the above die; A first guide portion corresponding to one side of the die portion and extended from one end of the support portion; and A second guide portion corresponding to the other side of the die portion and extending from the other end of the support portion; The above sub-shim plate is a slot die device located between the first guide portion and the second guide portion.

10. In paragraph 1, A slot die device in which the sub-shim plate is in contact with the main shim plate and is coupled to the first die.

Citation Information

Patent Citations

  • Slot die device

    KR1020260000839A

  • Coating gasket and coating die head

    CN114887829A

  • Slot Die for Coating of Electrode Mix Comprising Shim for Controlling Flux of Electrode Mix

    KR1020170067362A

  • Producing method of postbiotics with increased exosome content and use thereof

    KR1020240155578A

  • Multi-row simultaneous coating slot die

    KR102035826B1