Electronic device comprising antenna

Abstract

An electronic device according to various embodiments comprises: a housing; a first substrate which is disposed in the housing, and which includes a first surface, a second surface facing the direction opposite to the first surface, and a first conductive layer disposed between the first surface and the second surface; a second substrate which is disposed on the first surface, and which includes a third surface facing the same direction as the first surface and a fourth surface facing the direction opposite to the third surface and facing the first surface; at least one antenna element disposed between the third surface and the fourth surface, or on the third surface; and a wireless communication circuit which is disposed on the first substrate, and which transmits and / or receives a wireless signal in at least one frequency band through the at least one antenna element, wherein the first substrate includes a non-conductive area overlapping at least a portion of the edge of the second substrate when the first surface is viewed from above, and the at least one frequency band can be determined through a configuration of the at least one non-conductive area.

Description

Electronic device including an antenna

[0001] Embodiments of the present disclosure relate to an electronic device including an antenna.

[0002] Electronic devices can communicate with external electronic devices using various wireless communication technologies. For example, the wireless communication technologies may include at least one of ultra-wideband (UWB) communication, wireless fidelity (Wi-Fi) communication, long-term evolution (LTE) communication, 5G communication (or new radio (NR) communication), or Bluetooth communication. For example, an electronic device supporting ultra-wideband (UWB) communication can measure the location of at least one external electronic device or the distance to at least one external electronic device using a UWB antenna including at least one antenna element (e.g., a conductive patch).

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] The electronic device may include at least one antenna (e.g., an antenna structure or an antenna module). The at least one antenna may include a legacy antenna operating in a frequency band ranging from about 600 MHz to 6000 MHz, a 5G antenna operating in a frequency band ranging from about 3 GHz to 300 GHz, or an antenna for measuring the location of an external electronic device located in close proximity. For example, the antenna for measuring the location of an external electronic device located in close proximity may include an ultra wide band (UWB) antenna comprising at least two antenna elements operating in a frequency band ranging from about 6 GHz to 8.5 GHz.

[0005] The UWB antenna can be operated in different frequency bands through at least three conductive patches arranged on a flexible dielectric substrate (e.g., FPCB, flexible printed circuit board), and an angle off arrival (AOA) service can be provided to detect the position and / or distance of an external electronic device using this.

[0006] However, as electronic devices become increasingly slimmer, UWB antennas formed with FPCBs can become increasingly difficult to deploy due to their relatively high price and size. To address these issues, chip antennas (e.g., low-temperature co-fired ceramic (LTCC) antennas) are increasingly being used, which are placed on printed circuit boards (PCBs), offer relatively high placement flexibility, and are inexpensive.

[0007] However, when chip antennas set to the same frequency band are applied to different devices by model, the same radiation performance should be exhibited, but the radiation performance may deteriorate due to changes in antenna characteristics depending on the density of electrical components or the arrangement conditions of surrounding components (e.g., conductive electrical components such as shielding cans or connectors). In addition, setting the operating frequency band (e.g., tuning) may be difficult due to the characteristics of already manufactured chip antennas.

[0008] According to an exemplary embodiment of the present disclosure, an electronic device including an antenna configured to enable common use by each device through easy frequency setting can be provided.

[0009] Various embodiments may provide an electronic device including an antenna whose frequency can be set relatively freely from the arrangement of surrounding electrical components.

[0010] Various embodiments may provide an electronic device including an antenna that may help slim down the electronic device by reducing the placement space.

[0011] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0012] According to various embodiments, an electronic device includes a housing, a first substrate disposed in the housing, the first substrate including a first side and a second side facing in an opposite direction from the first side and a first conductive layer disposed between the first side and the second side, a second substrate disposed on the first side and including a third side facing in the same direction as the first side and a fourth side facing in an opposite direction from the third side and facing the first side, at least one antenna element disposed between the third side and the fourth side or on the third side, and wireless communication circuitry disposed on the first substrate and configured to transmit and / or receive a wireless signal in at least one frequency band via the at least one antenna element, wherein the first substrate includes a non-conductive region disposed to overlap at least a portion of an edge of the second substrate when the first side is viewed from above, wherein the at least one frequency band can be determined through a configuration of the at least one non-conductive region.

[0013] According to exemplary embodiments of the present disclosure, by easily setting the operating frequency band of the chip antenna through various configuration changes of a non-conductive region arranged on a substrate to overlap with the edge (e.g., edge or border) of the chip antenna, it is possible to help commonize the chip antenna for each device, and to help secure improved design freedom from the arrangement of peripheral electrical components.

[0014] In addition, various effects may be provided, either directly or indirectly, through this document.

[0015] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0016] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0017] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0018] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0019] FIG. 2b is a perspective view of the rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0020] FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0021] FIG. 4A is an exploded perspective view of a first substrate and a chip antenna according to various embodiments of the present disclosure.

[0022] FIG. 4b is a perspective view showing the rear side of a chip antenna according to various embodiments of the present disclosure.

[0023] FIG. 5 is a plan view of a portion of a first substrate equipped with a chip antenna according to various embodiments of the present disclosure.

[0024] FIG. 6 is a cross-sectional view of a portion of a first substrate taken along line 6-6 of FIG. 5 according to various embodiments of the present disclosure.

[0025] FIG. 7 is a graph comparing the radiation performance of a chip antenna with or without a non-conductive region according to various embodiments of the present disclosure.

[0026] FIG. 8A is a graph comparing the radiation performance of a chip antenna according to a change in the width of a non-conductive region according to various embodiments of the present disclosure.

[0027] FIG. 8b is a graph comparing the radiation performance of a chip antenna according to a change in the dielectric constant of a second substrate according to various embodiments of the present disclosure.

[0028] FIG. 9 is a cross-sectional view of a portion of a first substrate including a chip antenna according to various embodiments of the present disclosure.

[0029] FIG. 10 is an exploded perspective view of a first substrate and a chip antenna according to various embodiments of the present disclosure.

[0030] FIG. 11a is a diagram illustrating a field distribution when the chip antenna of FIG. 10 according to various embodiments of the present disclosure is operated in the first polarization.

[0031] FIG. 11b is a diagram illustrating a field distribution when the chip antenna of FIG. 10 according to various embodiments of the present disclosure is operated in a second polarization.

[0032] FIG. 12 is a graph comparing the polarization-specific radiation performance of a chip antenna according to the arrangement of a non-conductive region of a first substrate according to various embodiments of the present disclosure.

[0033] FIG. 13 is a plan view of a first substrate including a non-conductive region according to various embodiments of the present disclosure.

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0035] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0036] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0037] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0038] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0039] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0040] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0041] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0042] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0043] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0044] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0045] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), the sound output module (155), or the electronic device (101) and 450.

[0046] Sound can be output through an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) connected directly or wirelessly.

[0047] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0048] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0049] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0050] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0051] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0052] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0053] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0054] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0055] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0056] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0057] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0058] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0059] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0060] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0061] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include other embodiments of the electronic device.

[0062] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0063] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0064] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0065] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0066] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may also include a tray member arranged through at least a portion of the side bezel structure (218).

[0067] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0068] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0069] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0070] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0071] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0072] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). In one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0073] According to various embodiments, the electronic device (200) may include a chip antenna (300) disposed in an internal space and forming a radiating signal generally in a direction facing the rear. In one embodiment, the chip antenna (300) may include a single conductive patch and may be mounted on an internal substrate (e.g., the first substrate (240) of FIG. 3). In one embodiment, the chip antenna (300) may include a UWB antenna including a single conductive patch as an antenna element. In one embodiment, the electronic device (200) may use the chip antenna (300) including a single conductive patch to apply a multivariate surveying method used for positioning, such as GPS, for direction detection, to estimate the direction of an opposing electronic device using distance information measured while the electronic device (200) moves. In some embodiments, the chip antenna (300) may include a UWB antenna including at least three conductive patches as antenna elements. In this case, the electronic device (200) can support an AoA service that predicts the direction of the relative electronic device by detecting the relative phase using three conductive patches.

[0074] FIG. 3 is an exploded perspective view of the electronic device of FIGS. 2A and 2B according to various embodiments of the present disclosure.

[0075] Referring to FIG. 3, the electronic device (200) may include a side member (218) (e.g., the side bezel structure (218) of FIGS. 2A and 2B), an extension member (2181) (e.g., a bracket or a support member), a front plate (202) (e.g., a front cover), a display (201), a first substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or a support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the extension member (2181) or the support bracket (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and any overlapping description will be omitted below.

[0076] According to various embodiments, the extension member (2181) may be disposed within the electronic device (200) and structurally coupled to the side member (218) or formed integrally with the side member (218). The extension member (2181) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The extension member (2181) may have a display (201) coupled to one surface and a first substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the first substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the display (201) may be disposed to be supported by the extension member (2181).

[0077] The memory may include, for example, volatile memory or non-volatile memory.

[0078] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0079] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (250) may be integrally disposed within the electronic device (200). In another embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0080] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side member (218) and / or the extension member (2181).

[0081] According to various embodiments, the electronic device (200) may include a chip antenna (300) mounted on a first substrate (240). In one embodiment, the chip antenna (300) may be electrically connected to the first substrate (240) and may be positioned such that a radiated signal is formed generally in a direction in which the rear plate (211) faces (e.g., in the -Z-axis direction). In one embodiment, the chip antenna (300) may be electrically connected to the first substrate (240) by being soldered. In one embodiment, the chip antenna (300) may be configured to operate in at least one designated frequency band. In one embodiment, the chip antenna (300) may be positioned such that at least a portion of an edge (e.g., an edge or a border) overlaps a non-conductive region (e.g., a non-conductive region (240a) of FIG. 4A) formed on the first substrate (240). In one embodiment, the operating frequency band of the chip antenna (300) can be easily changed through the shape of the non-conductive region (240a) formed on the first substrate (240) without changing the design of the chip antenna (300) itself. Therefore, the operating frequency band of the chip antenna (300) can be easily set, which can help in the commonization of the chip antenna for each device, and can enable a design that is relatively free from the arrangement of peripheral electrical components.

[0082] FIG. 4A is an exploded perspective view of a first substrate and a chip antenna according to various embodiments of the present disclosure. FIG. 4B is a perspective view showing the rear surface of a chip antenna according to various embodiments of the present disclosure.

[0083] Referring to FIGS. 4A and 4B, an electronic device (e.g., the electronic device (200) of FIG. 3) may include a chip antenna (300) as a first substrate (240) disposed in an internal space and a second substrate (310) mounted on the first substrate (240). In one embodiment, the first substrate (240) may include a first surface (2401), a second surface (2402) facing in an opposite direction to the first surface (2401), and a side surface (2403) surrounding a space between the first surface (2401) and the second surface (2402). In one embodiment, the second substrate (310) may include a third surface (3101) facing in the same direction as the first surface (2401), and a fourth surface (3102) facing in an opposite direction to the third surface (3101) and facing the first surface (2401). Accordingly, when the second substrate (310) is mounted on the first substrate (240), the fourth surface (3102) of the second substrate (310) may be in contact with the first surface (2401) of the first substrate (240). In one embodiment, the second substrate (310) may include a conductive patch (311) as an antenna element. In one embodiment, the conductive patch (311) may be exposed on the third surface (3101) or may be disposed in a space between the third surface (3101) and the fourth surface (3102). In some embodiments, the conductive patch (311) may be replaced with two or more conductive patches.

[0084] According to various embodiments, the first substrate (240) may include a non-conductive region (240a) (e.g., a fill-cut region) disposed at a position overlapping an edge (E) of the second substrate (310) when the first surface (2401) is viewed from above. In one embodiment, the non-conductive region (240a) may be formed in a loop shape along the edge (E) of the second substrate (310). In some embodiments, the edge (E) of the second substrate (310) may be formed in a closed loop shape or a loop shape in which at least one portion is open. In one embodiment, the first substrate (240) may include a first conductive region (240b) disposed to surround the edge (E) of the second substrate (310) with respect to the non-conductive region (240a) when the first surface (2401) is viewed from above while the second substrate (310) is mounted. In one embodiment, the first substrate (240) can include a second conductive region (240c) disposed in an area overlapping the second substrate (310) when the first side (2401) is viewed from above. In one embodiment, the first conductive region (240b) and the second conductive region (240c) can be separated by a non-conductive region (240a) having a specific width when the first side (2401) is viewed from above. In some embodiments, the non-conductive region (240a) can include an area in which at least one conductive layer disposed in at least one insulating layer among a plurality of insulating layers of the first substrate (240) (e.g., the insulating layers (2404) of FIG. 6) is removed at a position overlapping at least an edge (E) of the second substrate (310) when the first side (2401) is viewed from above. In some embodiments, the first conductive region (240b) and the second conductive region (240c) may be formed in a form that is connected to each other, at least in a portion of the non-conductive region (240a).

[0085] According to various embodiments, the first substrate (240) can include at least one first conductive pad (CP1) disposed on the first surface (2401) in an area overlapping the second substrate (310) when the first surface (2401) is viewed from above. In one embodiment, the at least one first conductive pad (CP1) can be exposed on the first surface (2401). In one embodiment, the second substrate (310) can include at least one second conductive pad (CP2) positioned to correspond with the at least one first conductive pad (CP1) disposed to be exposed on the fourth surface (3102). In one embodiment, when the second substrate (310) is mounted on the first substrate (240), at least one first conductive pad (CP1) faces at least one second conductive pad (CP2) and can be electrically connected to each other through a process such as soldering or conductive bonding (e.g., surface mounting device (SMD)). In one embodiment, the conductive patch (311) can be electrically connected to a wireless communication circuit (e.g., a wireless communication circuit (192) of FIG. 6) disposed on the first substrate (240) through an electrical connection (e.g., power supply) between the at least one first conductive pad (CP1) and the at least one second conductive pad (CP2). In one embodiment, when the first surface (2401) is viewed from above, a second conductive region (240c) disposed in an area overlapping the second substrate (310) can act as a ground (e.g., a ground plane) for the conductive patch (311) through electrical connection of at least one first conductive pad (CP1) and at least one second conductive pad (CP2).

[0086] According to various embodiments, the first substrate (240) may be formed of a material (e.g., FR4) having a first permittivity (e.g., a permittivity of about 4 to 10). In one embodiment, the second substrate (310) may be formed of a material (e.g., ceramic) having a second permittivity (e.g., a permittivity of about 30 to 40) higher than the first permittivity. For example, the second substrate (310) including the conductive patch (311) as an antenna element may be designed to be a high-k dielectric material, thereby helping to miniaturize the chip antenna (300).

[0087] According to various embodiments, it may be difficult to set the operating frequency band of a chip antenna (300) that has already been manufactured. For example, when a chip antenna (300) manufactured to operate in a specific frequency band is applied to different electronic devices, the operating frequency band of the chip antenna may be unintentionally shifted for each electronic device due to the density or arrangement structure of surrounding electrical components (e.g., electrical elements, shield cans, and / or connectors), thereby reducing radiation performance.

[0088] According to an exemplary embodiment of the present disclosure, the first substrate (240) may include a non-conductive region (240a) arranged to overlap with an edge (E) of the second substrate (310), and a frequency shift may be induced only by changing the shape of the non-conductive region (240a), thereby enabling commonization for each electronic device without redesigning the chip antenna (300).

[0089] FIG. 5 is a plan view of a portion of a first substrate equipped with a chip antenna according to various embodiments of the present disclosure. FIG. 6 is a cross-sectional view of a portion of the first substrate taken along line 6-6 of FIG. 5 according to various embodiments of the present disclosure.

[0090] Referring to FIGS. 5 and 6, the first substrate (240) may include a plurality of insulating layers. In one embodiment, the first substrate (240) may include a first conductive layer (241) disposed on at least one of the plurality of insulating layers. In one embodiment, the first conductive layer (241) may be disposed in a space between a first surface (2401) and a second surface (2402) of the first substrate (240). In one embodiment, the non-conductive region (240a) formed on the first substrate (240) may be formed by removing or omitting the first conductive layer (241). In one embodiment, when the second substrate (310) is mounted on the first substrate (240), an edge (E) of the second substrate (240) may overlap at least a portion of the non-conductive region (240a) when the first surface (2401) is viewed from above. In one embodiment, the first conductive region (240b) formed through the first conductive layer (241) may be arranged to surround the second substrate (310) when the first surface (2401) is viewed from above, but may be arranged at a position that does not overlap the second substrate (310) due to the non-conductive region (240a). In one embodiment, the second conductive region (240c) formed through the first conductive layer (241) may be arranged at a position that overlaps the second substrate (310) when the first surface (2401) is viewed from above. In one embodiment, the first conductive layer (241) may be used as a ground layer of the first substrate (240). In some embodiments, the first conductive layer (241) may be disposed separately from the ground layer of the first substrate (240) and may be used to define a non-conductive region (240a) and conductive regions (240b, 240c).

[0091] According to various embodiments, the first substrate (240) may include a first feed line (CV1) connected to at least one first conductive pad (CP1) and arranged to vertically penetrate a plurality of insulating layers. In one embodiment, the first feed line (CV1) may be electrically connected to a wireless communication circuit (192) arranged on the second surface (2402) via a wiring (1921). In some embodiments, the at least one first conductive pad (CP1) may also be electrically connected to the wireless communication circuit (192) via the first feed line (CV1) or the wiring (1921). In one embodiment, the second substrate (240) may include a second feed line (CV2) electrically connecting the conductive patch (311) and at least one second conductive pad (CP2). Accordingly, the conductive patch (311) can be electrically connected to the wireless communication circuit (192) through the second feed line (CV2), the second conductive pad (CP2), the first conductive pad (CP1), the first feed line (CV1), and the wiring (1921) when the second substrate (310) is mounted on the first substrate (240) through soldering. In one embodiment, the first feed line (CV1) or the second feed line (CV2) can include a conductive via. In some embodiments, the wireless communication circuit (192) can be disposed on the first surface (2401) of the first substrate (240), or can be disposed on another substrate (e.g., a third substrate laminated via an interposer) that is spaced apart from the first substrate (240) and electrically connected to the first substrate (240).

[0092] According to various embodiments, the wireless communication circuit (192) may be configured to transmit and / or receive a wireless signal in at least one frequency band via the conductive patch (311). In one embodiment, the chip antenna (300) may be used as a UWB antenna. Accordingly, at least one frequency band formed via the chip antenna (300) may include a frequency band (e.g., Ch 9) in a range of about 7.75 GHz to 8.25 GHz. In one embodiment, the at least one frequency band may include a frequency band (e.g., Ch 5) in a range of about 6.25 GHz to 6.75 GHz.

[0093] According to various embodiments, the operating frequency band of the chip antenna (300) may be determined according to the shape of the non-conductive region (240a) overlapping the edge (E) of the second substrate (240). In one embodiment, the operating frequency band of the chip antenna (300) may be determined according to the width (W) of the non-conductive region (240a). For example, a part of the (antenna) field generated inside the second substrate (310) may also be generated in the non-conductive region (240a) (e.g., a part of the field may be generated by passing through the non-conductive region (240a) between the conductive regions (240b, 240c), thereby changing the effective permittivity of the second substrate (310) and enabling a shift in the operating frequency band of the chip antenna (300). In one embodiment, the operating frequency band of the chip antenna (300) may be shifted higher as the effective permittivity of the second substrate (310) decreases. In one embodiment, the effective permittivity of the second substrate (310) may be shifted lower as the amount of passage of the antenna field through the non-conductive region (240a) increases. Accordingly, the operating frequency band of the chip antenna (300) may be shifted higher as the width (W) of the non-conductive region (240a) increases. In some embodiments, when the width of the non-conductive region (240a) is determined and the first surface (2401) is viewed from above, the operating frequency band of the chip antenna (300) may be shifted higher as the amount of overlap between the second substrate (310) and the non-conductive region (240a) increases.

[0094] According to an exemplary embodiment of the present disclosure, a shift in the operating frequency band of the chip antenna (300) is induced only by changing the shape of the non-conductive region (240a) of the first substrate without redesigning the chip antenna (300), thereby being advantageous for commonization among electronic devices.

[0095] FIG. 7 is a graph comparing the radiation performance of a chip antenna with or without a non-conductive region according to various embodiments of the present disclosure.

[0096] Referring to FIG. 7, it can be confirmed that the chip antenna (300) determines an operating frequency of about 8.016 GHz in the first frequency band (e.g., CH9) when there is no non-conductive region (240a) disposed on the first substrate (240) (e.g., graph 701), whereas, when there is a non-conductive region (240a) (e.g., graph 702), an operating frequency of about 8.063 GHz is determined in the second frequency band (e.g., CH5), thereby high-shifting a frequency of about 47 MHz.

[0097] In addition, it can be confirmed that the chip antenna (300) determines an operating frequency of about 6.484 GHz in the second frequency band (e.g., CH5) when the non-conductive region (240a) disposed on the first substrate (240) does not exist (e.g., graph 701), whereas the operating frequency of about 6.528 GHz is determined in the second frequency band (e.g., CH5) when the non-conductive region (240a) exists (e.g., graph 702), thereby high-shifting the frequency by about 44 MHz. That is, the operating frequency band of the chip antenna (300) can be high-shifted by reducing the effective permittivity of the second substrate (310) as a part of the antenna field passes through the non-conductive region (240a) of the first substrate (240). This may mean that the operating frequency band of the chip antenna (300) can be easily adjusted by changing the non-conductive area (240a) of the first substrate (240) without redesigning the chip antenna (300).

[0098] FIG. 8A is a graph comparing the radiation performance of a chip antenna according to a change in the width of a non-conductive region according to various embodiments of the present disclosure.

[0099] Referring to FIG. 8a, it can be confirmed that when the non-conductive region (240a) disposed on the first substrate (240) does not exist (e.g., graph 801), the chip antenna (300) determines an operating frequency of about 8.021 GHz in the first frequency band (e.g., CH9), whereas when the width (W) of the non-conductive region (240a) is 0.2 mm (e.g., graph 802), the operating frequency is determined to be about 8.041 GHz, which is relatively high-shifted by about 20 MHz in frequency, and when the width (W) of the non-conductive region (240a) is 0.4 mm (e.g., graph 803), the operating frequency is determined to be about 8.066 GHz, which is relatively high-shifted by about 25 MHz in frequency compared to when the width (W) is 0.2 mm.

[0100] In addition, it can be confirmed that the chip antenna (300) determines an operating frequency of about 6.483 GHz in the second frequency band (e.g., CH5) when the non-conductive region (240a) disposed on the first substrate (240) does not exist (e.g., graph 801), whereas when the width (W) of the non-conductive region (240a) is 0.2 mm (e.g., graph 802), an operating frequency of about 6.507 GHz, which is relatively high-shifted by about 24 MHz, is determined, and when the width (W) of the non-conductive region (240a) is 0.4 mm (e.g., graph 803), an operating frequency of about 6.528 GHz, which is relatively high-shifted by about 21 MHz, is determined compared to when the width (W) is 0.2 mm.

[0101] This may mean that the operating frequency band of the chip antenna (300) can be easily adjusted by changing the width (W) of the non-conductive region (240a) of the first substrate (240) without redesigning the chip antenna (300).

[0102] FIG. 8b is a graph comparing the radiation performance of a chip antenna according to a change in the dielectric constant of a second substrate according to various embodiments of the present disclosure.

[0103] Referring to FIG. 8b, it can be confirmed that the chip antenna is shifted higher when the effective permittivity of the second substrate (e.g., the second substrate (310) of FIG. 6) is relatively low, about 40 (e.g., graph 805), than when the effective permittivity of the second substrate (e.g., the second substrate (310) of FIG. 6) is relatively low, about 45 (e.g., graph 804), and is shifted higher still when the effective permittivity is relatively low, about 35 (e.g., graph 806). This may mean that the operating frequency band of the chip antenna (300) may be shifted higher as the effective permittivity of the second substrate (310) decreases, as a portion of the antenna field passes through the non-conductive region (240a) of the first substrate (240).

[0104] FIG. 9 is a cross-sectional view of a portion of a first substrate including a chip antenna according to various embodiments of the present disclosure.

[0105] In explaining the chip antenna arrangement structure of Fig. 9, the same symbols are given to components that are substantially the same as the arrangement structure of the chip antenna of Fig. 6, and a detailed description thereof may be omitted.

[0106] Referring to FIG. 9, the first substrate (240) may include a second conductive layer (242) disposed in a space between the first conductive layer (241) and the second surface (2402) among the plurality of insulating layers (2404). In one embodiment, the second conductive layer (242) may act as a ground plane for the first substrate (240). In one embodiment, the second conductive layer (242) may be disposed to have a specific separation distance (H) (e.g., a vertical distance) in the z-axis direction from the first surface (2401) of the first substrate (240). In one embodiment, the second conductive layer (242) may be electrically connected to the first conductive layer (241) through at least one conductive via (CV3) disposed to penetrate the plurality of insulating layers (2404) of the first substrate (240).

[0107] According to various embodiments, the first substrate (240) may include a first conductive region (240b) arranged to surround the second substrate (310) of the chip antenna (300) through a portion of the first conductive layer (241) when the first side (2401) is viewed from above, and a second conductive region (240c) arranged to overlap the second substrate (310) of the chip antenna (300) through another portion of the first conductive layer (241). In one embodiment, the first substrate (240) may include a non-conductive region (240a) arranged between the first conductive region (240b) and the second conductive region (240c) when the first side (2401) is viewed from above. In one embodiment, the non-conductive region (240a) may be positioned to overlap the edge (E) of the second substrate (310) when the first surface (2401) is viewed from above. In one embodiment, the operating frequency band of the chip antenna (300) may be determined by the size of the space volume between the first surface (2401) of the first substrate (240) and the second conductive layer (242) in the non-conductive region (240a). For example, the operating frequency band of the chip antenna (300) may be determined by the separation distance (H) between the first surface (2401) and the second conductive layer (242) in a state where the non-conductive region (240a) is determined to have a specific width (e.g., the width (W) of FIG. 6). For example, as the separation distance (H) increases, the spatial volume increases, which increases the amount of passage of the antenna field formed from the chip antenna (300), and decreases the effective permittivity of the second substrate (310), so that the operating frequency band of the chip antenna (300) may be high-shifted. In some embodiments, the operating frequency band of the chip antenna (300) may be determined according to the vertical distance from the first conductive layer (241) to the second conductive layer (242). In some embodiments, the first substrate (240) may further include at least one additional conductive layer (e.g., a ground layer) disposed in the space between the second conductive layer (242) and the second surface (2402) among the plurality of insulating layers (2404).In some embodiments, some layers of the second conductive layer (242) may be configured to operate as additional antenna elements (e.g., additional conductive patches) by being electrically connected to the wireless communication circuitry (192) via conductive vias and / or wiring while being electrically isolated from the surroundings.

[0108] FIG. 10 is an exploded perspective view of a first substrate and a chip antenna according to various embodiments of the present disclosure.

[0109] In describing the antenna arrangement structure of Fig. 10, the same symbols are given to components that are substantially the same as the antenna arrangement structure of Fig. 4a, and a detailed description thereof may be omitted.

[0110] Referring to FIG. 10, the chip antenna (300) may include a feeding portion (F) that is fed at a position spaced a specified distance from the center (C) of the conductive patch (311). For example, the chip antenna (300) may include a dual polarization antenna that operates in different frequency bands through the feeding portion (F). For example, the chip antenna (300) may be configured to transmit and / or receive a wireless signal in a first frequency band through a first polarization (e.g., vertical polarization) by forming an antenna field in a first direction (e.g., ±y-axis direction). In one embodiment, the chip antenna (300) may be configured to transmit and / or receive a wireless signal in a second frequency band different from the first frequency band through a second polarization (e.g., horizontal polarization) different from the first polarization by forming an antenna field in a second direction (e.g., ±x-axis direction) perpendicular to the first direction. In one embodiment, the first frequency band may include a frequency band in the range of about 7.75 GHz to 8.25 GHz (e.g., Ch 9). In one embodiment, the second frequency band may include a frequency band in the range of about 6.25 GHz to 6.75 GHz (e.g., Ch 5).

[0111] According to various embodiments, the non-conductive region (240a) disposed on the first substrate (240) may include a first non-conductive region (240a-1) disposed at a position through which an antenna field according to a first polarization may pass, and a second non-conductive region (240a-2) disposed at a position opposite to the first non-conductive region (240a-1). For example, the first and second non-conductive regions (240a-1, 240a-2) may be disposed in a region overlapping with an antenna field formed in the first direction. In one embodiment, the non-conductive region (240a) disposed on the first substrate (240) may include a third non-conductive region (240a-3) disposed at a position through which an antenna field according to a second polarization may pass, and a fourth non-conductive region (240a-4) disposed at a position opposite to the third non-conductive region (240a-3). For example, the third and fourth non-conductive regions (240a-3, 240a-4) may be disposed in a region overlapping with an antenna field formed in the second direction.

[0112] According to various embodiments, when the chip antenna (300) is set to transmit and / or receive a wireless signal through either a first frequency band or a second frequency band, a non-conductive region may be formed only at a corresponding position of the first substrate (240) through which the antenna field of the corresponding frequency band passes. This arrangement structure of the non-conductive region (240a) according to the formation position of the antenna field can help reinforce the rigidity of the first substrate (240) and expand the ground by arranging a conductive layer (e.g., the first conductive layer (241)) at a position where the non-conductive region (240a) is unnecessary.

[0113] FIG. 11a is a diagram illustrating a field distribution when the chip antenna of FIG. 10 according to various embodiments of the present disclosure is operated in a first polarization. FIG. 11b is a diagram illustrating a field distribution when the chip antenna of FIG. 10 according to various embodiments of the present disclosure is operated in a second polarization.

[0114] Referring to FIG. 11a, when the chip antenna (300) is operated in a first frequency band (e.g., CH 9), it can be seen that an antenna field (e.g., current distribution) is formed through a first polarization (e.g., vertical polarization) in a first direction (e.g., ±y-axis direction), and no antenna field is formed in a second direction (e.g., ±-axis direction) that is different (e.g., perpendicular) from the first direction.

[0115] Referring to FIG. 11b, when the chip antenna (300) is operated in a second frequency band (e.g., CH 5), it can be seen that an antenna field (e.g., current distribution) is formed through a second polarization (e.g., horizontal polarization) in a second direction (e.g., ±-axis direction), and no antenna field is formed in a first direction (e.g., ±-axis direction) that is different from the second direction (e.g., vertical).

[0116] This means that when the chip antenna (300) is set to transmit and / or receive a wireless signal through either the first frequency band or the second frequency band, a non-conductive region is formed only at a corresponding position of the first substrate (240) through which the antenna field of the corresponding frequency band passes, thereby reducing the arrangement of unnecessary non-conductive regions.

[0117] FIG. 12 is a graph comparing the polarization-specific radiation performance of a chip antenna according to the arrangement of a non-conductive region of a first substrate according to various embodiments of the present disclosure.

[0118] Referring to FIG. 12, it can be seen that the chip antenna (300) having the arrangement structure of FIG. 10 has a high shift in the operating frequency band in the first frequency band (FB1) when non-conductive regions (240a-1, 240a-2) formed along the first direction (e.g., ±y-axis direction of FIG. 10) are arranged (e.g., 1202 graph) or when non-conductive regions (240a-1, 240a-2, 240a-3, 240a-4) are all arranged along the first direction and the second direction (e.g., ±x-axis direction of FIG. 10) (e.g., 1204 graph) compared to when no non-conductive region (240a) exists (e.g., 1201 graph). On the other hand, when the non-conductive regions (240a-3, 240a-4) are arranged in the second direction (e.g., graph 1203), it can be seen that substantially the same operating frequency band is expressed as when the non-conductive region does not exist (e.g., graph 1201).

[0119] According to various embodiments, it can be seen that the chip antenna (300) having the arrangement structure of FIG. 10 has a high shift in the operating frequency band in the second frequency band (FB2) when non-conductive regions (240a-3, 240a-4) formed along the second direction (e.g., ±x-axis direction of FIG. 10) are arranged (e.g., 1203 graph) or when non-conductive regions (240a-1, 240a-2, 240a-3, 240a-4) are all arranged along the first direction (e.g., ±y-axis direction of FIG. 10) and the second direction (e.g., ±x-axis direction of FIG. 10) (e.g., 1204 graph) compared to when the non-conductive region (240a) does not exist (e.g., 1201 graph). On the other hand, when the semi-conductive regions (240a-1, 240a-2) are arranged in the first direction (e.g., graph 1201), it can be seen that substantially the same operating frequency band is expressed as when the non-conductive region does not exist (e.g., graph 1201).

[0120] This may mean that when the chip antenna (300) is set to transmit and / or receive a wireless signal through either the first frequency band or the second frequency band, a non-conductive region is formed only at a corresponding position of the first substrate (240) through which the antenna field of the corresponding frequency band passes, thereby reducing the arrangement of unnecessary non-conductive regions and helping to reinforce the rigidity of the first substrate (240) and / or expand the ground.

[0121] FIG. 13 is a plan view of a first substrate including a non-conductive region according to various embodiments of the present disclosure.

[0122] In describing the first substrate (240) of FIG. 13, the same symbols are given to components that are substantially the same as the first substrate (240) of FIG. 4a, and a detailed description thereof may be omitted.

[0123] Referring to FIG. 13, the first substrate (240) may be disposed in a non-conductive region (240a) and may include at least one conductive connection portion (2411) electrically connecting the first conductive region (240b) and the second conductive region (240c). In one embodiment, the at least one conductive connection portion (2411) may include a plurality of conductive connection portions (2411) spaced apart at a specific interval in the non-conductive region (240a). In this case, the space between the conductive connection portions (2411) may be applied as a non-connection portion (2412) as a part of the non-conductive region (240a). For example, the arrangement configuration of these conductive connecting portions (2411) can induce easy change of the operating frequency band of the chip antenna (300) in a state where the width of the non-conductive region (240a) (e.g., width (W) in FIG. 6) and / or the separation distance (e.g., separation distance (H) in FIG. 9) between the first surface (2401) and the second conductive layer (e.g., second conductive layer (242) in FIG. 9) are determined.

[0124] According to various embodiments, in the non-conductive region (240a), a non-connected portion (2412) where a conductive connection portion (2411) is not arranged may be arranged at a position that overlaps at least a portion of at least one first conductive pad (CP1) in a direction perpendicular to a side surface (e.g., side surface (2403) of FIG. 4a) of the first substrate (240). For example, the arrangement structure of the non-connected portion (2412) of the non-conductive region (230a) arranged to correspond to the first conductive pad (CP1) can reduce the phenomenon of solder overflowing to the first conductive region (230b) during a soldering process between at least one first conductive pad (CP1) and at least one second conductive pad (e.g., the second conductive pad (CP2) of FIG. 4b) arranged on a second substrate (e.g., the second substrate (310) of FIG. 4b).

[0125] According to various embodiments, an electronic device includes a housing (e.g., a housing (210) of FIG. 2A), a first substrate (e.g., a first substrate (240) of FIG. 4A) disposed in the housing and including a first surface (e.g., a first surface (2401) of FIG. 4A) and a second surface (e.g., a second surface (2402) of FIG. 4A) facing in an opposite direction to the first surface and a first conductive layer (e.g., a first conductive layer (241) of FIG. 6) disposed between the first surface and the second surface, a second substrate (e.g., a second substrate (310) of FIG. 4A) disposed on the first surface and including a third surface (e.g., a third surface (3101) of FIG. 4A) facing in the same direction as the first surface and a fourth surface (e.g., a fourth surface (3102) of FIG. 4A) facing in an opposite direction to the third surface and facing the first surface, and a third At least one antenna element (e.g., a conductive patch (311) of FIG. 4a) disposed between the first side and the fourth side, or on the third side, and a wireless communication circuit (e.g., a wireless communication circuit (192) of FIG. 6 of FIG. 4a) disposed on the first substrate and configured to transmit and / or receive a wireless signal in at least one frequency band through the at least one antenna element, wherein the first substrate includes a non-conductive region (e.g., a non-conductive region (240a) of FIG. 4a) disposed so as to overlap at least a portion of an edge (e.g., an edge (E) of FIG. 4a) of the second substrate when the first side is viewed from above, and the at least one frequency band can be determined through a configuration of the at least one non-conductive region.

[0126] According to various embodiments, the first conductive layer includes a first conductive region (e.g., the first conductive region (240b) of FIG. 4A) disposed through the first conductive layer so as to surround at least a portion of the second substrate when the first side is viewed from above, and a second conductive region (e.g., the second conductive region (240c) of FIG. 4A) disposed through the first conductive layer so as to overlap at least a portion of the second substrate when the first side is viewed from above, and the non-conductive region can be disposed between the first conductive region and the second conductive region.

[0127] According to various embodiments, the at least one frequency band may be set to be shifted higher the larger the area in which the second substrate overlaps the non-conductive region when the first surface is viewed from above.

[0128] According to various embodiments, the at least one frequency band may be set to be shifted higher as the width (W) of the non-conductive region increases.

[0129] According to various embodiments, a second conductive layer (e.g., the second conductive layer (242) of FIG. 9) disposed between the first conductive layer and the second surface is included, and the second conductive layer is disposed in the non-conductive region to have a separation distance (e.g., the separation distance (H) of FIG. 9) from the first surface, and the at least one frequency band may be set to be shifted higher as the separation distance increases.

[0130] According to various embodiments, the second conductive layer may include a ground layer, and the first conductive region and the second conductive region may be configured to be electrically connected to the second conductive layer.

[0131] According to various embodiments, the at least one antenna element may include a conductive patch.

[0132] According to various embodiments, the second substrate may be formed of a material having a dielectric constant greater than that of the first substrate.

[0133] According to various embodiments, the second substrate may comprise a ceramic substrate.

[0134] According to various embodiments, the non-conductive region may include at least one conductive connector (e.g., conductive connector (2411) of FIG. 13) that is disposed therein and electrically connects the first conductive region and the second conductive region.

[0135] According to various embodiments, the at least one conductive connector may include a plurality of conductive connectors spaced apart at a specified interval.

[0136] According to various embodiments, the first substrate includes at least one first conductive pad (e.g., the first conductive pad (CP1) of FIG. 4a) disposed on the first surface in an area overlapping the second substrate, and at least one second conductive pad (e.g., the second conductive pad (CP2) of FIG. 4b) disposed on the fourth surface and positioned corresponding to the at least one first conductive pad, wherein the at least one first conductive pad can be electrically connected to the at least one second conductive pad.

[0137] According to various embodiments, the first substrate includes a side surface (e.g., side surface (2403) of FIG. 4A) surrounding the first surface and the second surface, and a non-connected portion (e.g., non-connected portion (2412) of FIG. 13) of the non-conductive region, where the conductive connection portion is not arranged, may be arranged at a position that overlaps at least a portion of the at least one first conductive pad in a direction perpendicular to the side surface.

[0138] According to various embodiments, the at least one first conductive pad can be positioned to be electrically isolated from the first conductive region.

[0139] According to various embodiments, the antenna element may include a conductive patch configured to have a first polarization in which a first field is formed in a first direction in a first frequency band and / or a second polarization in which a second field is formed in a second frequency band different from the first frequency band, in a direction perpendicular to the first direction.

[0140] According to various embodiments, the non-conductive region may be positioned at a position overlapping the first field and / or the second field of the conductive patch.

[0141] According to various embodiments, the first frequency band may include a frequency band in the range of 7.75 GHz to 8.25 GHz.

[0142] According to various embodiments, the second frequency band may include a frequency band in the range of 6.25 GHz to 6.75 GHz.

[0143] According to various embodiments, the housing includes a front cover (e.g., front cover (202) of FIG. 3), a rear cover (e.g., rear cover (211) of FIG. 3) spaced apart from the front cover, and a side member (e.g., side member (218) of FIG. 3) surrounding a space between the front cover and the rear cover, wherein the first substrate is disposed in the space, and the second substrate may be disposed such that the third surface faces the rear cover.

[0144] According to various embodiments, the electronic device may include a display (e.g., display (201) of FIG. 3) arranged in the space and visible from the outside of the electronic device through at least a portion of the front cover.

[0145] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples presented to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, Housing (210); A first substrate (240) disposed in the housing, comprising a first surface (2401) and a second surface (2402) facing in an opposite direction to the first surface, and a first conductive layer (241) disposed between the first surface and the second surface; A second substrate (310) disposed on the first surface and including a third surface (3101) facing the same direction as the first surface and a fourth surface (3102) facing the opposite direction to the third surface and facing the first surface; At least one antenna element (311) disposed between the third side and the fourth side, or on the third side; and A wireless communication circuit (192) is disposed on the first substrate and is configured to transmit and / or receive a wireless signal in at least one frequency band through the at least one antenna element, The first substrate includes a non-conductive region (240a) arranged to overlap at least a portion of an edge (E) of the second substrate when the first surface is viewed from above, An electronic device wherein said at least one frequency band is determined through the configuration of said at least one non-conductive region.

2. In paragraph 1, The above first challenge layer is, When the first surface is viewed from above, a first conductive region (240b) arranged through the first conductive layer to surround at least a portion of the second substrate; and When the first surface is viewed from above, it includes a second conductive region (240c) arranged through the first conductive layer so as to overlap at least a portion of the second substrate, An electronic device wherein the non-conductive region is disposed between the first conductive region and the second conductive region.

3. In paragraph 1, An electronic device wherein at least one frequency band is set to be shifted higher the larger the area in which the second substrate overlaps the non-conductive area when the first surface is viewed from above.

4. In paragraph 1, An electronic device in which at least one frequency band is set to be shifted higher as the width (W) of the non-conductive region increases.

5. In paragraph 1, Including a second conductive layer (242) disposed between the first conductive layer and the second surface, The second conductive layer is arranged in the non-conductive region to have a distance (H) from the first surface, An electronic device in which at least one frequency band is set to be shifted higher as the separation distance increases.

6. In paragraph 5, The second conductive layer includes a ground layer, An electronic device wherein the first conductive region and the second conductive region are configured to be electrically connected to the second conductive layer.

7. In paragraph 1, An electronic device wherein at least one antenna element comprises a conductive patch.

8. In paragraph 1, An electronic device in which the second substrate is formed of a material having a dielectric constant greater than that of the first substrate.

9. In paragraph 8, The second substrate is an electronic device including a ceramic substrate.

10. In paragraph 1, An electronic device comprising at least one conductive connection (2411) disposed in the non-conductive region and electrically connecting the first conductive region and the second conductive region.

11. In paragraph 10, An electronic device wherein at least one conductive connector comprises a plurality of conductive connectors spaced apart at a specified interval.

12. In paragraph 11, At least one first conductive pad (CP1) disposed on the first surface in an area of ​​the first substrate overlapping the second substrate; and At least one second conductive pad (CP2) disposed on the fourth surface and positioned corresponding to the at least one first conductive pad, An electronic device wherein at least one first conductive pad is electrically connected to at least one second conductive pad.

13. In paragraph 12, The first substrate includes a side surface (2403) surrounding the first surface and the second surface, An electronic device in which a non-connected portion (2412) in which a conductive connection portion is not arranged in the non-conductive region is arranged at a position that overlaps at least a portion of the at least one first conductive pad in a direction perpendicular to the side surface.

14. In paragraph 12, An electronic device wherein at least one of the first conductive pads is positioned to be electrically isolated from the first conductive region.

15. In paragraph 1, An electronic device comprising a conductive patch, wherein the antenna element is configured to have a first polarization in which a first field is formed in a first direction in a first frequency band and / or a second polarization in which a second field is formed in a second frequency band different from the first frequency band in a direction perpendicular to the first direction.

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