Board type configuration apparatus, board type identification method, and related apparatus

Abstract

A board type configuration apparatus, a board type identification method, and a related apparatus, relating to the technical field of electronic circuits. The board type configuration apparatus comprises a first printed circuit board assembly (PCBA) and a first board type signal generation circuit. The first PCBA is provided with a first mounting position, the first mounting position is connected to the first board type signal generation circuit, an output of the first board type signal generation circuit is related to a mounting condition of a structural member at the first mounting position, and an output of the first board type signal generation circuit is used for indicating a board type of a board where the first PCBA is located. The present board type configuration apparatus, distinguishes board types by means of differentiation of structural members, so that platform normalization can be implemented on a board at a PCBA level, improving board manufacturing efficiency.

Description

Single board type configuration device, single board type identification method and related device

[0001] The present application claims priority to the Chinese patent application No. 202410881761.6, filed on July 2, 2024, and entitled "Single board type configuration device, single board type identification method and related device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic circuits, and in particular to a single board type configuration device, a single board type identification method and related devices. BACKGROUND

[0003] Generally, a device in which part of electronic components are soldered on a printed circuit board (PCB) (which can also be referred to as a bare board) without soldering electronic components can be referred to as a printed circuit board assembly (PCBA), and a device in which some structural components are assembled on the PCBA can be referred to as a single board. In a vehicle-mounted system, a single board is generally placed in a whole vehicle as a basic function implementation physical unit, and a combination of multiple single boards as subsystems collectively implements the function of the whole vehicle-mounted service. When the vehicle-mounted system is working, each single board itself implements processing of service information, and there is also interaction of data, communication and management between single boards. The above must be based on the known single board type. Different single board types correspond to different implemented functions, and therefore, identifying the type of the single board is crucial.

[0004] At present, different single board types are mainly distinguished by configuring the resistance values of pull-up resistors and pull-down resistors at the PCBA level in the single board, and the resistance values of the pull-up resistors and the pull-down resistors in different single boards are different.

[0005] However, since the single board type needs to be distinguished by the resistance values of the pull-up resistors and the pull-down resistors at the PCBA level in the single board, only the circuit board to which the pull-up resistors and the pull-down resistors are soldered can be guaranteed to be the same PCB, and therefore, the current single board can only be platformized and unified at the PCB level, resulting in low single board manufacturing efficiency. SUMMARY

[0006] The embodiments of the present application provide a single board type configuration device, a single board type identification method and related devices, which distinguish single board types by differentiating structural components, so that the single board can be platformized and unified at the PCBA level, and the single board manufacturing efficiency is improved.

[0007] In a first aspect, the embodiments of the present application provide a single board type configuration device applied to a single board, the single board type configuration device comprising:

[0008] a first printed circuit board assembly (PCBA), a first single-board type signal generation circuit;

[0009] The first PCBA is provided with a first mounting position, the first mounting position is connected with the first single-board type signal generation circuit, the output of the first single-board type signal generation circuit is related to the mounting condition of the structural member of the first mounting position, and the output of the first single-board type signal generation circuit is used to indicate the single-board type of the single board where the first PCBA is located.

[0010] In the embodiments of the present application, a single-board type configuration device is provided, the first mounting position designed on the first PCBA in the single-board type configuration device can be mounted with a structural member or not, and the first single-board type signal generation circuit connected with the first mounting position outputs different signals in the case of whether the first mounting position is mounted with the structural member, and indicates different single-board types of the single board where the first PCBA is located. It can be understood that the first single-board type signal generation circuit can correspondingly output two different signals according to whether the first mounting position is mounted with the structural member, and is used to distinguish two different single-board types.

[0011] Compared with the current method of distinguishing the single-board type by the resistance values of the pull-up resistor and the pull-down resistor in the PCBA layer of the single board, the mounting position is designed on the PCBA in the embodiments of the present application, the single-board type of the single board where the PCBA is located is identified by whether the mounting position is mounted with the corresponding structural member, and the resistance values of the pull-up resistor and the pull-down resistor in the single board do not need to be adapted to be different for different single-board types, so that the platformization and unification of the single board in the PCBA layer can be realized, and the single-board manufacturing efficiency is improved. Moreover, the failure rate of the mounting position and the corresponding structural member is much lower than that of the pull-up resistor and the pull-down resistor in the single board, the stability and reliability are higher, the single-board type of the single board where the PCBA is located is identified by whether the mounting position is mounted with the corresponding structural member, and the identification accuracy of the single-board type can also be improved.

[0012] It should be understood that the single-board type in the present application can also be understood as an identity document (ID) of the single board, which is not limited in the present application.

[0013] In a possible implementation, in the case that the first structure is mounted on the first mounting position, the first single-board type signal generation circuit outputs a first voltage level; or,

[0014] In the case that the first structure is not mounted on the first mounting position, the first single-board type signal generation circuit outputs a second voltage level, and the single-board type corresponding to the first voltage level is different from the single-board type corresponding to the second voltage level.

[0015] In the embodiment, the first installation position can be installed with the first structural member, or can not be installed with the first structural member. In the above two cases, the level output by the first single-board type signal generation circuit is different, and corresponds to different single-board types respectively. Correspondingly, the first single-board type signal generation circuit is connected with the processor, and the processor is configured to acquire the level signal output by the first single-board type signal generation circuit, identify the corresponding single-board type, and perform subsequent single-board function adaptation. Optionally, the first structural member can be a conventional structural member, and the embodiment of the application does not limit this.

[0016] Optionally, the difference between the first level and the second level is large, which can be more than 70% of the maximum voltage, or the difference between the low level “0” and the high level “1”. The embodiment of the application does not limit this. It should be understood that the maximum voltage here can be understood as the power supply voltage that the power supply providing voltage for the first single-board type signal generation circuit can provide.

[0017] In a possible implementation, in the case where the first installation position is installed with the first structural member, the first installation position is grounded, and the first level is a low level; or,

[0018] In the case where the first installation position is not installed with the first structural member, the first installation position is suspended, and the second level is a high level.

[0019] In the embodiment, the first installation position is installed with the first structural member, so that the first installation position is grounded. At this time, the first level output by the first single-board type signal generation circuit connected with the first installation position is a low level. The first installation position is not installed with the first structural member, so that the first installation position is suspended. At this time, the first level output by the first single-board type signal generation circuit connected with the first installation position is a high level. The single-board type corresponding to the low level is different from the single-board type corresponding to the high level. Therefore, the corresponding single-board type can be identified based on the level signal output by the first single-board type signal generation circuit, and subsequent single-board function adaptation is performed.

[0020] In a possible implementation, the first installation position includes a screw hole position, and the structural member installed in the first installation position includes a screw; or the first installation position includes a positioning hole position, and the structural member installed in the first installation position includes a positioning pin.

[0021] In the embodiment, the structural member installed in the first installation position can be a screw or a positioning pin. Correspondingly, the first installation position can be a screw hole position or a positioning hole position. It can be understood that the failure rate of the structural member such as a screw or a positioning pin is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher. By determining whether the first installation position is installed with the structural member such as a screw or a positioning pin, the identification accuracy of the single-board type of the single board on which the PCBA is located can be improved.

[0022] Optionally, the structure installed in the first mounting position can further include, but is not limited to, a test hole of a vehicle component, a radiator, etc., and the embodiments of the present application do not limit this.

[0023] In a possible implementation, the first mounting position includes a redundant hole or a working hole on the first PCBA.

[0024] In a possible implementation, the distance between the first mounting position and the circuit on the first PCBA is greater than a first threshold.

[0025] In the embodiment, the distance between the first mounting position and the circuit on the first PCBA is greater than a first threshold. It can be understood that the first threshold is not a fixed value, and can be adjusted according to the arrangement of the electronic elements on the first PCBA, so that the circuit is away from the first mounting position, and stress damage of the structure installed in the first mounting position to the circuit is prevented.

[0026] In a possible implementation, the first single-board type signal generation circuit includes:

[0027] a first switch tube, a second switch tube, a first power supply, a second power supply, a first resistor, and a second resistor;

[0028] The first end of the first switch tube is connected with the first mounting position, the second end of the first switch tube is connected with the first end of the first resistor, the second end of the first resistor is connected with the first power supply, and the third end of the first switch tube is connected with the first end of the second switch tube. The second end of the second switch tube is connected with the first end of the second resistor, the second end of the second resistor is connected with the second power supply, and the third end of the second switch tube is grounded.

[0029] The second end of the second switch tube is used to output the first level or the second level.

[0030] In the embodiment, a possible implementation of the first single-board type signal generation circuit is provided, specifically, the first single-board type signal generation circuit includes a plurality of electronic elements such as switching tubes, power supplies, resistors, etc., the level signal of the first mounting position is taken as the input of the first single-board type signal generation circuit, and the first single-board type signal generation circuit is formed by the electronic elements such as switching tubes, power supplies, resistors, etc., a corresponding relationship between the level signal of the first mounting position and the level signal output by the first single-board type signal generation circuit is constructed, so that the level signal of the first mounting position can be determined based on the level signal output by the first single-board type signal generation circuit, and then whether the first mounting position is installed with a structural member is determined, and the single-board type of the single board where the first PCBA is located is identified. Through the embodiment of the application, the identification of the single-board type of the single board where the PCBA is located can be realized by whether the mounting position is installed with a corresponding structural member, so that the platformization of the single board at the PCBA level can be realized, the single board manufacturing efficiency is improved, and the identification accuracy of the single-board type is improved.

[0031] Optionally, the first level and the second level can not be an exact value, due to factors such as manufacturing process and environmental interference, the first level and the second level may fluctuate within a reasonable interval range, which should not constitute a limitation on the application. Correspondingly, the corresponding relationship between the level signal of the first mounting position and the level signal output by the first single-board type signal generation circuit can also not be a corresponding relationship between two exact values, due to factors such as manufacturing process and environmental interference, the two sides of the corresponding relationship may fluctuate within a reasonable interval range, which should not constitute a limitation on the application.

[0032] Optionally, the first single-board type signal generation circuit in the embodiment of the application can also include more or less electronic elements such as switching tubes, power supplies, resistors, etc., which can meet the requirement of constructing the corresponding relationship between the level signal of the first mounting position and the level signal output by the first single-board type signal generation circuit, which should not constitute a limitation on the embodiment of the application.

[0033] In a second aspect, the embodiment of the application provides a single-board type configuration device, applied to a single board, the single-board type configuration device includes:

[0034] A second printed circuit board assembly (PCBA);

[0035] The second PCBA is provided with a second mounting position, the second PCBA includes a voltage division module, a first end of the voltage division module is connected with a power supply, a second end of the voltage division module is grounded, the voltage division module includes a voltage division resistor and the second mounting position, a first point is arranged between the voltage division resistor and the second mounting position, the output of the first point is related to the impedance of the structural member installed in the second mounting position, and the output of the first point is used to indicate the single-board type of the single board where the second PCBA is located.

[0036] In the embodiment of the present application, a single board type configuration device is provided. A second mounting position designed on a second PCBA in the single board type configuration device can be mounted with structural members of different impedances. A first point between the second mounting position and a voltage dividing resistor outputs different signals when the second mounting position is mounted with structural members of different impedances, respectively indicating different single board types of the single board where the second PCBA is located. It can be understood that the first point can output N different signals according to N different impedances of the structural members mounted on the second mounting position, for distinguishing N different single board types.

[0037] Compared with the current method of distinguishing single board types by the resistance values of pull-up resistors and pull-down resistors at the PCBA level in the single board, the embodiment of the present application designs a mounting position on the PCBA. The mounting position can be the position of the pull-up resistor or the pull-down resistor, for replacing the pull-up resistor or the pull-down resistor. The single board type of the single board where the PCBA is located is identified by mounting structural members of different impedances on the mounting position. Different single board types can not need to be adapted to different resistance values of the pull-up resistors and the pull-down resistors in the single board, so that the single board can be platformized and unified at the PCBA level, and the manufacturing efficiency of the single board is improved. Moreover, the failure rate of the mounting position and the corresponding structural member is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher. The identification accuracy of the single board type is also improved by identifying the single board type of the single board where the PCBA is located by mounting structural members of different impedances on the mounting position.

[0038] In a possible implementation, in the case where the second mounting position is mounted with a second structural member, the first point outputs a first gear level; or,

[0039] In the case where the second mounting position is mounted with a third structural member, the first point outputs a second gear level, the impedance of the second structural member is different from the impedance of the third structural member, and the single board type corresponding to the first gear level is different from the single board type corresponding to the second gear level.

[0040] In the embodiment, the second mounting position can be mounted with the second structural member, and the second mounting position can also be mounted with the third structural member. In the above two cases, the first gear level and the second gear level output by the first point are different due to the different impedances of the second structural member and the third structural member, and correspond to different single board types, respectively. Correspondingly, the first point is connected with a processor, and the processor is configured to acquire the level signal output by the first point, identify the corresponding single board type, and perform subsequent single board function adaptation.

[0041] Optionally, the first gear level can be an electric level interval or an electric level value, and the present application does not limit this.

[0042] Optionally, there is a certain accuracy range between the difference of the first gear level and the second gear level, which can be adjusted according to different application scenarios. For example, the accuracy range can be 5 millivolts (mV) for one gear. For example, 0-5 millivolts is the first gear level, and 5-10 millivolts is the second gear level.

[0043] In a possible implementation, when the voltage dividing resistor is a pull-up resistor, a first end of the pull-up resistor is connected with a power supply, a second end of the pull-up resistor is connected with a first end of the second mounting position, and a second end of the second mounting position is grounded.

[0044] When the voltage dividing resistor is a pull-down resistor, a first end of the second mounting position is connected with a power supply, a second end of the second mounting position is connected with a first end of the pull-down resistor, and a second end of the pull-down resistor is grounded.

[0045] In the embodiment, a possible specific implementation of the position of the second mounting position is provided. Specifically, the second mounting position can be arranged at the position of the pull-down resistor to replace the pull-down resistor, in which case the voltage dividing resistor is a pull-up resistor. Alternatively, the second mounting position can also be arranged at the position of the pull-up resistor to replace the pull-up resistor, in which case the voltage dividing resistor is a pull-down resistor. It can be understood that no matter whether the second mounting position is arranged at the position of the pull-up resistor or the pull-down resistor, different impedance structural members can be installed on the second mounting position to make the first point output different signals for distinguishing different single board types.

[0046] In a possible implementation, the second mounting position includes a screw hole position, and the structural member installed on the second mounting position includes a screw. Alternatively, the second mounting position includes a positioning hole position, and the structural member installed on the second mounting position includes a positioning pin.

[0047] In the embodiment, the structural member installed on the second mounting position can be a screw or a positioning pin. Correspondingly, the second mounting position can be a screw hole position or a positioning hole position. It can be understood that the failure rate of the structural member such as a screw or a positioning pin is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher. By installing structural members with different impedances such as screws or positioning pins on the second mounting position to identify the single board type of the PCBA, the identification accuracy of the single board type can be improved.

[0048] Optionally, the structural member installed on the second mounting position can also include, but is not limited to, a test hole position of a vehicle-mounted component, a heat sink, etc., which is not limited in the embodiment of the application.

[0049] In a possible implementation, the second mounting position is greater than a second threshold value from the circuit on the second PCBA.

[0050] In the embodiment, the second mounting position is greater than a second threshold value from the circuit on the second PCBA. It can be understood that the second threshold value is not a fixed value, and can be adjusted according to the arrangement of the electronic elements on the second PCBA, so that the circuit is away from the second mounting position, and stress damage of the structural member installed on the second mounting position to the circuit is prevented.

[0051] In a possible implementation, the second structural member and the third structural member are different in at least one of the following:

[0052] Coating material, processing time of the coating, deposition condition of the coating, electroplating method of the coating.

[0053] In the embodiment, the second structural member and the third structural member are different in impedance. The difference in impedance can be caused by the difference in coating of the structural member, such as the difference in coating material, the difference in processing time of the coating, the difference in deposition condition of the coating, the difference in electroplating method of the coating, and the like. The difference in impedance can also be caused by the difference in material of the structural member itself, the difference in processing time, and the like. The present application does not limit this.

[0054] It can be understood that, since electroplating is a relatively mature process, the difference in impedance of the structural member caused by the difference in coating can reduce the manufacturing cost of the structural member.

[0055] In a third aspect, the present application provides a single-board type identification method, applied to the single-board type configuration device as described in the first aspect and any possible implementation, and the single-board type configuration device comprises: a first PCBA, a first single-board type signal generation circuit, and the first PCBA is provided with a first mounting position. The single-board type identification method comprises:

[0056] Obtaining a level signal output by the first single-board type signal generation circuit, and the output of the first single-board type signal generation circuit is related to the installation of the structural member of the first mounting position;

[0057] Determining the single-board type corresponding to the level signal output by the first single-board type signal generation circuit based on the correspondence between the level signal and the single-board type.

[0058] In the embodiments of the present application, a single board type identification method is provided, which is applied to the single board type configuration device of the first aspect and any possible implementation manner. Since the first single board type signal generation circuit in the single board type configuration device can output two different signals according to whether the first mounting position is installed with the corresponding structure, which is used to distinguish two different single board types, in the single board type identification method, the single board type identification device can obtain the level signal output by the first single board type signal generation circuit, and identify the single board type corresponding to the level signal output by the first single board type signal generation circuit based on the corresponding relationship between the level signal and the single board type, so as to perform subsequent single board function adaptation.

[0059] Optionally, the corresponding relationship between the level signal and the single board type can be preconfigured or adjusted according to different application scenarios, which is not limited in the embodiments of the present application.

[0060] Compared with the current method of distinguishing the single board type by obtaining the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level in the single board, the embodiments of the present application identify the single board type of the single board where the PCBA is located by obtaining the different level signals output by the mounting position whether the structure is installed or not. Since the failure rate of the mounting position and the corresponding structure is much lower than that of the pull-up resistor and the pull-down resistor in the single board, the stability and reliability are higher, so the identification accuracy of the single board type identification method in the embodiments of the present application can be greatly improved.

[0061] In a possible implementation manner, in the case that the first structure is installed at the first mounting position, the level signal output by the first single board type signal generation circuit is a first level;

[0062] Based on the corresponding relationship between the level signal and the single board type, it is determined that the single board type corresponding to the first level is a first single board type; or,

[0063] In the case that the first structure is not installed at the first mounting position, the level signal output by the first single board type signal generation circuit is a second level;

[0064] Based on the corresponding relationship between the level signal and the single board type, it is determined that the single board type corresponding to the second level is a second single board type, and the first single board type is different from the second single board type.

[0065] In the embodiment, the first mounting position can mount the first structural member, and the first mounting position can also not mount the first structural member. In the above two cases, the level output by the first single board type signal generation circuit is different, and corresponds to different single board types respectively. Correspondingly, the single board type identification device obtains the level signal output by the first single board type signal generation circuit, and identifies the corresponding single board type as the first single board type or the second single board type based on the correspondence between the level signal and the single board type, so as to perform subsequent single board function adaptation, which can greatly improve the accuracy of single board type identification.

[0066] In a fourth aspect, the embodiments of the present application provide a single board type identification method, applied to the single board type configuration device as described in the second aspect and any possible implementation manner, the single board type configuration device comprising: a second PCBA, the second PCBA being provided with a second mounting position, the second PCBA comprising a voltage division module, the voltage division module comprising a voltage division resistor and the second mounting position, and a first point being provided between the voltage division resistor and the second mounting position; the single board type identification method comprising:

[0067] obtaining a level signal output by the first point, the output of the first point being related to the impedance of the structural member mounted in the second mounting position;

[0068] determining the single board type corresponding to the level signal output by the first point based on the correspondence between the level signal and the single board type.

[0069] In the embodiments of the present application, a single board type identification method is provided, which is applied to the single board type configuration device as described in the second aspect and any possible implementation manner. Since the first point in the single board type configuration device can output N different signals corresponding to N different impedance structural members mounted in the second mounting position, the N different signals are used to distinguish N different single board types. Therefore, in the single board type identification method, the single board type identification device can obtain the level signal output by the first point, and identify the single board type corresponding to the level signal output by the first point based on the correspondence between the level signal and the single board type, so as to perform subsequent single board function adaptation.

[0070] Optionally, the correspondence between the level signal and the single board type can be preconfigured, or can be adjusted according to different application scenarios, and the embodiments of the present application do not limit this.

[0071] Compared with the current method of distinguishing the single board type by acquiring the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level in the single board, the embodiment of the application distinguishes the single board type of the single board where the PCBA is located by acquiring different level signals output by the installation of different impedance structural members on the PCBA. Since the failure rate of the installation position and the corresponding structural member is much lower than that of the pull-up resistor and the pull-down resistor in the single board, the stability and reliability are higher, and therefore the recognition accuracy of the single board type recognition method in the embodiment of the application can be greatly improved.

[0072] In a possible implementation, when the second structural member is installed at the second installation position, the level signal output by the first point position is a first gear level;

[0073] Based on the correspondence between the level signal and the single board type, it is determined that the single board type corresponding to the first gear level is a third single board type; or,

[0074] When the third structural member is installed at the second installation position, the level signal output by the first point position is a second gear level, and the impedance of the second structural member and the impedance of the third structural member are different.

[0075] Based on the correspondence between the level signal and the single board type, it is determined that the single board type corresponding to the second gear level is a fourth single board type, and the third single board type is different from the fourth single board type.

[0076] In the embodiment, the second installation position can install the second structural member, and the second installation position can also install the third structural member. In the above two cases, since the impedance of the second structural member and the impedance of the third structural member are different, the first gear level and the second gear level corresponding to the output of the first point position are also different, and correspond to different single board types. Accordingly, the single board type recognition device acquires the level signal output by the first point position, recognizes the corresponding single board type as the third single board type or the fourth single board type, and performs subsequent single board function adaptation, which can greatly improve the accuracy of single board type recognition.

[0077] In a fifth aspect, the embodiment of the application provides a single board type recognition device, which comprises units for executing the method of any one of the third aspect.

[0078] In a possible design, the device comprises:

[0079] The communication unit is configured to acquire the level signal output by the first single board type signal generation circuit, and the output of the first single board type signal generation circuit is related to the installation of the structural member at the first installation position.

[0080] The processing unit is configured to determine the single board type corresponding to the level signal output by the first single board type signal generation circuit based on a correspondence between the level signal and the single board type and the level signal output by the first single board type signal generation circuit.

[0081] The processing unit and the communication unit described with respect to the fifth aspect and any possible implementation can perform the steps as described with respect to the third aspect and the corresponding implementation.

[0082] The technical effects brought by the fifth aspect and any possible implementation can be referred to the introduction of the technical effects of the third aspect and the corresponding implementation.

[0083] In a sixth aspect, the embodiments of the present application provide a single board type identification apparatus, which comprises units for performing the method according to any one of the fourth aspect.

[0084] In a possible design, the apparatus comprises:

[0085] The communication unit is configured to acquire a level signal output by a first point, wherein the output of the first point is related to the impedance of a structural member installed at a second installation point;

[0086] The processing unit is configured to determine the single board type corresponding to the level signal output by the first point based on a correspondence between the level signal and the single board type and the level signal output by the first point.

[0087] The processing unit and the communication unit described with respect to the sixth aspect and any possible implementation can perform the steps as described with respect to the fourth aspect and the corresponding implementation.

[0088] The technical effects brought by the sixth aspect and any possible implementation can be referred to the introduction of the technical effects of the fourth aspect and the corresponding implementation.

[0089] Optionally, in the single board type identification apparatus described in any one of the fifth aspect to the sixth aspect and any possible implementation, the apparatus comprises:

[0090] In an implementation, the single board type identification apparatus is a single board type identification device. When the single board type identification apparatus is a single board type identification device, the communication unit can be a transceiver, or an input / output interface; and the processing unit can be at least one processor. Optionally, the transceiver can be a transceiver circuit. Optionally, the input / output interface can be an input / output circuit.

[0091] In another implementation, the single-board type identification apparatus is a chip (system) or circuit in a single-board type identification device. When the single-board type identification apparatus is a chip (system) or circuit in a single-board type identification device, the communication unit can be a communication interface (input / output interface), interface circuit, output circuit, input circuit, pin, or related circuit on the chip (system) or circuit; and the processing unit can be at least one processor, processing circuit, or logic circuit.

[0092] Optionally, the single-board type identification apparatus can be a microcontroller unit (MCU), central processing unit (CPU), system on chip (SOC), complex programmable logic device (CPLD), or the like chip with a latch function. When the single board is powered on, the chip can latch the level information of the single-board type in the chip by acquiring the level information of the single-board type, and then read the information in the chip by software (it should be noted that the software cannot directly read the external resistance voltage division or the single-board type level information generated by the circuit).

[0093] In a seventh aspect, an embodiment of the present application provides a single-board type identification apparatus, which includes a processor. The processor is coupled with a memory and can be used to execute instructions in the memory to implement the method of any one of the third aspect to the fourth aspect and any possible implementation. Optionally, the single-board type identification apparatus further includes the memory. Optionally, the single-board type identification apparatus further includes a communication interface, and the processor is coupled with the communication interface.

[0094] In an eighth aspect, an embodiment of the present application provides a chip, which includes a logic circuit and a communication interface. The communication interface is used to receive information or send information; and the logic circuit is used to receive information or send information through the communication interface, so that the chip executes the method of any one of the third aspect to the fourth aspect and any possible implementation.

[0095] In a ninth aspect, an embodiment of the present application provides a computer readable storage medium, which is used to store a computer program (also referred to as code or instructions); when the computer program runs on a computer, the method of any one of the third aspect to the fourth aspect and any possible implementation is implemented.

[0096] In a tenth aspect, an embodiment of the present application provides a computer program product, which comprises a computer program (which can also be referred to as code or instructions), and when the computer program is run, causes a computer to execute the method in any one of the third aspect to the fourth aspect and any possible implementation thereof.

[0097] In an eleventh aspect, an embodiment of the present application provides a single board type identification system, which comprises the single board type configuration apparatus in any one of the first aspect to the second aspect and any possible implementation thereof, and the single board type identification apparatus in any one of the fifth aspect to the seventh aspect and any possible implementation thereof.

[0098] In a twelfth aspect, an embodiment of the present application provides a movable terminal, which comprises the single board type configuration apparatus in any one of the first aspect to the second aspect and any possible implementation thereof, or the single board type identification apparatus in any one of the fifth aspect to the seventh aspect and any possible implementation thereof, or the chip in the eighth aspect, or the single board type identification system in the eleventh aspect.

[0099] Optionally, the movable terminal can be a vehicle, such as a vehicle used in any possible scenario, for example, a car, a truck, an aircraft, a drone, a slow transport vehicle, a space vehicle, or a ship, and the like, and the present application is not limited thereto.

[0100] In addition, in the process of executing the method in any one of the third aspect to the fourth aspect and any possible implementation thereof, the process of sending information and / or receiving information in the above method can be understood as the process of outputting information by the processor, and / or the process of receiving input information by the processor. When outputting information, the processor can output the information to the transceiver (or communication interface or sending module) for transmission by the transceiver. After the information is output by the processor, it can also need to be processed further before reaching the transceiver. Similarly, when the processor receives input information, the transceiver (or communication interface or sending module) receives the information and inputs it to the processor. Furthermore, after the transceiver receives the information, the information can need to be processed further before being input to the processor.

[0101] Based on the above principle, for example, the sending of information mentioned in the foregoing method can be understood as the output of information by the processor. For another example, the receiving of information can be understood as the receiving of input information by the processor.

[0102] Optionally, for the transmission, sending, receiving and other operations involved by the processor, if no special description is made, or if it is not contrary to the actual role or inherent logic in the related description, it can be more generally understood as the processor output and receiving, input and other operations.

[0103] Optionally, in the process of executing the method of any one of the third aspect to the fourth aspect and any possible implementation manner, the processor can be a processor specially used for executing the method, or a processor executing the method by executing computer instructions in the memory, such as a general-purpose processor. The memory can be a non-transitory memory, such as a read only memory (ROM), which can be integrated on the same chip as the processor, or can be separately arranged on different chips. The type of the memory and the arrangement manner of the memory and the processor are not limited in the embodiments of the present application.

[0104] In a possible implementation manner, the at least one memory is located outside the device.

[0105] In another possible implementation manner, the at least one memory is located inside the device.

[0106] In another possible implementation manner, part of the at least one memory is located inside the device, and the other part of the at least one memory is located outside the device.

[0107] In the present application, the processor and the memory can also be integrated into one device, that is, the processor and the memory can also be integrated together. BRIEF DESCRIPTION OF DRAWINGS

[0108] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0109] FIG. 1A is a structural schematic diagram of a PCBA;

[0110] FIG. 1B is a structural schematic diagram of another PCBA;

[0111] FIG. 1C is a structural schematic diagram of another PCBA;

[0112] FIG. 2 is a flowchart of service processing of a single board;

[0113] FIG. 3 is a schematic diagram of a voltage dividing circuit in a single board;

[0114] FIG. 4 is a flowchart of a single board manufacturing process according to an embodiment of the present application;

[0115] FIG. 5 is a structural diagram of a single board type configuration device according to an embodiment of the present application;

[0116] FIG. 6 is a structural diagram of another single board type configuration device according to an embodiment of the present application;

[0117] FIG. 7 is a structural diagram of still another single board type configuration device according to an embodiment of the present application;

[0118] FIG. 8 is a flowchart of a single board type identification method according to an embodiment of the present application;

[0119] FIG. 9 is a flowchart of a single board manufacturing process according to an embodiment of the present application;

[0120] FIG. 10 is a structural diagram of a single board type configuration device according to an embodiment of the present application;

[0121] FIG. 11 is a structural diagram of another single board type configuration device according to an embodiment of the present application;

[0122] FIG. 12 is a structural diagram of still another single board type configuration device according to an embodiment of the present application;

[0123] FIG. 13 is a flowchart of a single board type identification method according to an embodiment of the present application;

[0124] FIG. 14 is a flowchart of a single board service processing according to an embodiment of the present application;

[0125] FIG. 15 is a structural diagram of a single board type identification device according to an embodiment of the present application;

[0126] FIG. 16 is a structural diagram of an electronic device according to an embodiment of the present application;

[0127] FIG. 17 is a structural diagram of a chip according to an embodiment of the present application. DETAILED DESCRIPTION

[0128] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described below with reference to the accompanying drawings.

[0129] The terms "first" and "second," etc., used in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0130] The term "embodiment" as used herein means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that, unless otherwise specified or logically conflicting, the terminology and / or descriptions between the various embodiments of this application are consistent and can be mutually referenced, and technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0131] It should be understood that in this application, "at least one (item)" means one or more, "more than one" means two or more, "at least two (items)" means two or three or more, and "and / or" is used to describe the relationship between related objects, indicating that there can be three relationships. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the related objects before and after are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0132] In the description of the present application, the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", "left", "side" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. It should be understood that the Z direction, Y direction and the like mentioned in some embodiments of the present application are with reference to the XYZ rectangular coordinate system to facilitate the description of the features in the present application, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation.

[0133] In the embodiments of the present application, the "end" appearing in the words "one end", "the other end", "end", "free end", "upper end", "lower end", "connecting end" and the like is not limited to the end, end point or end face, but also includes the part extending an axial distance and / or radial distance from the end, end point or end face on the device or element to which the end, end point or end face belongs.

[0134] It should be noted that in the present application, "indication" can include direct indication, indirect indication, display indication, implicit indication. When describing that certain indication information is used to indicate A, it can be understood that the indication information carries A, directly indicates A, or indirectly indicates A.

[0135] In the present application, the information indicated by the indication information is referred to as the to-be-indicated information. In the specific implementation process, there are many ways to indicate the to-be-indicated information, for example but not limited to, the to-be-indicated information can be directly indicated, such as the to-be-indicated information itself or the index of the to-be-indicated information. The to-be-indicated information can also be indirectly indicated by indicating other information, where the other information and the to-be-indicated information have an association relationship. The to-be-indicated information can also be indicated only by a part, and the other part of the to-be-indicated information is known or agreed in advance. For example, the indication of a specific information can also be achieved by means of the arrangement order of each information agreed in advance (for example, specified by a protocol), thereby reducing the indication overhead to a certain extent. The to-be-indicated information can be sent as a whole, or can be sent separately in multiple sub-information, and the sending period and / or sending opportunity of these sub-information can be the same or different. The specific sending method is not limited by the present application. Among them, the sending period and / or sending opportunity of these sub-information can be pre-defined, for example, pre-defined according to the protocol, or can be configured by the transmitting end device by sending configuration information to the receiving end device.

[0136] It should be noted that in the present application, "sending" can be understood as "output", and "receiving" can be understood as "input". "Sending information to A" means that A is the destination of the information transmission, and A is not limited to direct sending on the air interface. "Sending information to A" includes directly sending information to A, and also includes indirectly sending information to A through a transmitter. Therefore, "sending information to A" can also be understood as "outputting information to A". Similarly, "receiving information from A" means that the source of the information is A, which includes directly receiving information from A, and also includes indirectly receiving information from A through a receiver. Therefore, "receiving information from A" can also be understood as "inputting information from A".

[0137] The present application provides a single board type configuration device, a single board type identification method and related devices, which are applied to the technical field of electronic circuits, such as single board type configuration and single board type identification in the service processing scene of a single board. In order to better understand the technical solutions of the present application, the related terms and concepts that may be involved in the embodiments of the present application will be introduced first.

[0138] Generally, a device in which part of electronic components are welded on a printed circuit board (PCB) (which can also be referred to as a blank board) without welding electronic components can be referred to as a printed circuit board assembly (PCBA), and a device in which some structural components are assembled on the PCBA can be referred to as a single board.

[0139] Specifically, refer to FIGS. 1A to 1C, which are structural schematic diagrams of a PCBA.

[0140] It can be understood that FIG. 1A is a structural schematic diagram of a PCBA, the schematic diagram shown in FIG. 1B is an exploded view of the PCBA shown in FIG. 1A, and the schematic diagram shown in FIG. 1C is an enlarged view of the dashed area in the exploded view shown in FIG. 1B.

[0141] Among them, 101 is a PCB, 102 is part of electronic components (the specific circuit is not shown in the figure) welded on the PCB, 101 and 102 jointly constitute a PCBA, 103 is a mounting hole 103a on the PCBA and its corresponding structural component 103b, and 103 and the structural component, shell and other devices jointly constitute a single board.

[0142] In a vehicle-mounted system, a single board is generally placed in a whole vehicle as a basic function implementation physical unit, and a combination of multiple single boards as subsystems collectively implements the function of the whole vehicle-mounted service. When the vehicle-mounted system is working, each single board itself implements the processing of service information, and there is also interaction of data, communication and management between single boards. The above must be based on the known single board type. Different single board types correspond to different implemented functions, and therefore, identifying the type of single board is crucial.

[0143] Referring to FIG. 2, FIG. 2 is a flowchart of service processing of a single board.

[0144] As shown in FIG. 2, the main flow of service processing of a single board includes, but is not limited to, the following steps in sequence: hardware defines the type of single board, the single board is powered on, the driving software identifies the single board information, the driving software makes corresponding configuration, the service software identifies the single board information, the service software makes corresponding configuration, the application software makes corresponding configuration, and the single board enters a normal working state.

[0145] At present, the differentiation of different single board types is mainly realized by configuring the resistance values of pull-up resistors and pull-down resistors at the PCBA level in the single board, and the resistance values of pull-up resistors and pull-down resistors in different single boards are different.

[0146] Referring to FIG. 3, FIG. 3 is a schematic diagram of a voltage dividing circuit in a single board.

[0147] As shown in FIG. 3, the voltage dividing circuit in the single board includes a pull-up resistor (Rp) and a pull-down resistor (Rd), and a point between the pull-up resistor and the pull-down resistor is connected to a processor or chip such as MCU / CPU / SOC / CPLD. The resistance values of the pull-up resistor and the pull-down resistor are obtained by identifying the voltage information of the point between the pull-up resistor and the pull-down resistor, and then different single board types are differentiated. This means that the resistance values of the pull-up resistor and the pull-down resistor in the voltage dividing circuit in different single boards must be different and unique, otherwise it will be identified as other single boards, resulting in confusion in subsequent function configuration of the single board.

[0148] However, since the single board type needs to be differentiated by the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level in the single board, the current single board can only realize platformization and unification at the PCB level, and cannot realize platformization and unification at the PCBA level.

[0149] Referring to FIG. 4, FIG. 4 is a flowchart of single board manufacturing.

[0150] As shown in FIG. 4, if a single board needs to collect both customized single board A and customized single board B, the software functions of the two customers are different, although other hardware parts are the same, but still need to be differentiated by the single board type.

[0151] In this case, for the same piece of platformized PCB, the resistance values of the pull-up resistor and the pull-down resistor in the voltage division circuit are different and unique at the PCBA level, obtaining PCBA1 (board type 1) and PCBA2 (board type 2), which respectively correspond to the single board types of the customized single board A and the customized single board B. Then, software adaptation is made based on PCBA1 (board type 1) and PCBA2 (board type 2) respectively, and single board shells and structural parts and other devices are assembled, obtaining the customized single board A and the customized single board B.

[0152] As can be seen, although the PCB is the same piece, at the PCBA level, some codes that look similar but actually have some bill of materials (BOM) differences are split out, and platformization and unification cannot be achieved at the PCBA level, resulting in low single board manufacturing efficiency.

[0153] In addition, since the pull-up resistor and the pull-down resistor have high failure rates and low stability and reliability, the accuracy of identifying the single board type through the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level of the single board is also low.

[0154] In view of this, the embodiments of the present application provide a single board type configuration device, and based on the single board type configuration device, a new single board type identification method is proposed, which is applied to the field of electronic circuit technology, such as single board type configuration and single board type identification in the business processing scene of the single board. The single board type is distinguished by the differentiation of the structural parts, which can make the single board achieve platformization and unification at the PCBA level, improve the single board manufacturing efficiency, and improve the single board type identification accuracy.

[0155] Please refer to FIG. 5, which is a structural schematic diagram of a single board type configuration device provided by the embodiments of the present application.

[0156] As shown in FIG. 5, the single board type configuration device is applied to a single board, and the single board type configuration device specifically includes but is not limited to:

[0157] a first PCBA (501) and a first single board type signal generation circuit 502.

[0158] The first PCBA (501) is provided with a first mounting position 501a, the first mounting position 501a is connected with the first single board type signal generation circuit 502, the output of the first single board type signal generation circuit 502 is related to the installation condition of a structural part 501b of the first mounting position 501a, and the output of the first single board type signal generation circuit 502 is used to indicate the single board type of the single board where the first PCBA (501) is located.

[0159] It can be understood that the first mounting position 501a on the first PCBA (501) in the single board type configuration device can be mounted with a structural member 501b, or can not be mounted with a structural member 501b. The first single board type signal generating circuit 502 connected to the first mounting position 501a outputs different signals in the case of whether the first mounting position 501a is mounted with a structural member 501b, which respectively indicates different single board types of the single board where the first PCBA (501) is located.

[0160] In addition, the first single board type signal generating circuit 502 can correspondingly output two different signals according to whether the first mounting position 501a is mounted with a structural member 501b, for distinguishing two different single board types.

[0161] Compared with the current single board type distinguished by the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level in the single board, the mounting position is designed on the PCBA in the embodiment of the application, and the single board type of the single board where the PCBA is located is identified by whether the mounting position is mounted with a corresponding structural member. Different single board types can not need to adapt to different resistance values of the pull-up resistor and the pull-down resistor in the single board, so that the single board can be platformized and unified at the PCBA level, and the single board manufacturing efficiency can be improved.

[0162] In addition, the failure rate of the mounting position and the corresponding structural member is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher. The single board type of the single board where the PCBA is located is identified by whether the mounting position is mounted with a corresponding structural member, which can also improve the identification accuracy of the single board type.

[0163] It should be understood that the single board type in the application can also be understood as the ID of the single board, which is not limited in the application.

[0164] In a possible embodiment, the specific conditions of the signals output by the first single board type signal generating circuit 502 in the case of whether the first mounting position 501a is mounted with a structural member 501b are as follows:

[0165] Case one:

[0166] In the case that the first mounting position 501a is mounted with the first structural member 501b, the first single board type signal generating circuit 502 outputs a first voltage level.

[0167] Case two:

[0168] In the case that the first mounting position 501a is not mounted with the first structural member 501b, the first single board type signal generating circuit 502 outputs a second voltage level.

[0169] Among them, the single board type corresponding to the first voltage level output in the above two cases is different from the single board type corresponding to the second voltage level output.

[0170] It can be understood that the first installation site 501a can be installed with the first structural member 501b, and the first installation site 501a can also be installed without the first structural member 501b.

[0171] In the above two cases, the levels output by the first single board type signal generating circuit 502 are different, and correspond to different single board types.

[0172] Optionally, the first single board type signal generating circuit 502 is connected with a processor, and the processor is configured to acquire the level signal output by the first single board type signal generating circuit 502, identify the corresponding single board type, and perform subsequent single board function adaptation.

[0173] Optionally, the first structural member 501b can be a conventional structural member, and the embodiments of the present application do not limit this.

[0174] Optionally, the difference between the first level and the second level is large, which can be more than 70% of the maximum voltage, or the difference between the low level "0" and the high level "1", and the embodiments of the present application do not limit this. It should be understood that the maximum voltage here can be understood as the power supply voltage that the power supply providing voltage for the first single board type signal generating circuit can provide. Exemplarily, the maximum voltage here can refer to the power supply voltage that the second power supply Vcc2 in FIG. 6 can provide.

[0175] Optionally, the first level and the second level can not be an exact value. Due to factors such as manufacturing process and environmental interference, the first level and the second level may fluctuate within a reasonable interval range, and this should not be limited to the present application.

[0176] In one possible embodiment, the specific conditions of the signals output by the first single board type signal generating circuit 502 in the case of whether the first installation site 501a is installed with the structural member 501b are as follows:

[0177] Case one:

[0178] In the case that the first installation site 501a is installed with the first structural member 501b, the first installation site 501a is grounded, and the first level is a low level.

[0179] Case two:

[0180] In the case that the first installation site 501a is not installed with the first structural member 501b, the first installation site 501a is suspended, and the second level is a high level.

[0181] Among them, the single board type corresponding to the first level output in the above two cases is different from the single board type corresponding to the second level output.

[0182] It can be understood that the first mounting position 501a installs the first structural part 501b, realizes the ground of the first mounting position 501a, and at this time, the first level output by the first single-board type signal generating circuit 502 connected with the first mounting position 501a is low. The first mounting position 501a does not install the first structural part 501b, and the first mounting position 501a is suspended, and at this time, the first level output by the first single-board type signal generating circuit 502 connected with the first mounting position 501a is high.

[0183] And the single-board type corresponding to the low level and the single-board type corresponding to the high level are different, so the corresponding single-board type can be identified based on the level signal output by the first single-board type signal generating circuit 502, and subsequent single-board function adaptation is carried out.

[0184] In a possible embodiment, a plurality of mounting positions can also be provided on the first PCBA (501), and each mounting position is connected with a single-board type signal generating circuit. By obtaining the level signals output by a plurality of single-board type signal generating circuits, more different single-board types can be distinguished.

[0185] Exemplarily, two mounting positions are provided on the first PCBA (501), which are mounting position a and mounting position b. The mounting position a is connected with the single-board type signal generating circuit a, and the mounting position b is connected with the single-board type signal generating circuit b. Then, whether the corresponding structural parts are installed in the mounting position a and the mounting position b realizes the identification result of the single-board type of the single board where the first PCBA (501) is located. Specifically, the following cases can occur.

[0186] Case one:

[0187] The mounting position a and the mounting position b both install the structural parts, and then the single-board type signal generating circuit a outputs the level signal "0", the single-board type signal generating circuit b outputs the level signal "0", and it corresponds to the single-board type 1.

[0188] Case two:

[0189] The mounting position a installs the structural part, and the mounting position b does not install the structural part, then the single-board type signal generating circuit a outputs the level signal "0", the single-board type signal generating circuit b outputs the level signal "1", and it corresponds to the single-board type 2.

[0190] Case three:

[0191] The mounting position a does not install the structural part, and the mounting position b installs the structural part, then the single-board type signal generating circuit a outputs the level signal "1", the single-board type signal generating circuit b outputs the level signal "0", and it corresponds to the single-board type 3.

[0192] Case four:

[0193] When neither mounting position a nor mounting position b is mounted with a structure, the single-board type signal generating circuit a outputs a level signal "1", the single-board type signal generating circuit b outputs a level signal "1", and the single-board type 4 is corresponded.

[0194] As can be seen from the above four cases, by arranging two mounting positions on the first PCBA (501), the four single-board types of the single board on which the first PCBA (501) is located can be identified.

[0195] It can be understood that if N mounting positions (N is a positive integer) are arranged on the first PCBA (501), and each of the N mounting positions is connected with a single-board type signal generating circuit, according to the level signals output by the N single-board type signal generating circuits, at most 2 N single-board types of the single board on which the first PCBA (501) is located can be identified.

[0196] Optionally, the first mounting position 501a includes a screw hole position, and the structure 501b arranged on the first mounting position 501a includes a screw.

[0197] Optionally, the first mounting position 501a includes a positioning hole position, and the structure 501b arranged on the first mounting position 501a includes a positioning pin.

[0198] Optionally, the structure 501b arranged on the first mounting position 501a can further include, but is not limited to, a test hole position of a vehicle-mounted component, a heat sink, etc., which is not limited in the embodiments of the present application.

[0199] It can be understood that the failure rate of the structure such as a screw and a positioning pin is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher. By arranging a screw or a positioning pin on the first mounting position 501a to identify the single-board type of the single board on which the PCBA is located, the identification accuracy of the single-board type can be improved.

[0200] Optionally, the first mounting position 501a includes a redundant hole position or a working hole position on the first PCBA (501), which is not limited in the embodiments of the present application.

[0201] Optionally, the distance between the first mounting position 501a and the circuit on the first PCBA (501) is greater than a first threshold value.

[0202] It can be understood that the first threshold value is not a fixed value, and can be adjusted according to the arrangement of the electronic elements on the first PCBA (501), so that the circuit is away from the first mounting position 501a, and the stress damage of the structure 501b arranged on the first mounting position 501a to the circuit is prevented.

[0203] In a possible embodiment, the first single-board type signal generation circuit 502 includes:

[0204] The first switch tube K1, the second switch tube K2, the first power supply Vcc1, the second power supply Vcc2, the first resistor R1, and the second resistor R2.

[0205] Referring to FIG. 6, FIG. 6 is a structural schematic diagram of another single-board type configuration device provided by the embodiment of the present application.

[0206] As shown in FIG. 6, the first end of the first switch tube K1 is connected with the first mounting position 501a, the second end of the first switch tube K1 is connected with the first end of the first resistor R1, the second end of the first resistor R1 is connected with the first power supply Vcc1, the third end of the first switch tube K1 is connected with the first end of the second switch tube K2; the second end of the second switch tube K2 is connected with the first end of the second resistor R2, the second end of the second resistor R2 is connected with the second power supply Vcc2, and the third end of the second switch tube K2 is grounded.

[0207] The second end of the second switch tube K2 is configured to output a level signal (the first level or the second level).

[0208] It can be understood that the first single-board type signal generation circuit 502 includes a plurality of electronic elements such as switch tubes, power supplies, and resistors, takes the level signal of the first mounting position 501a as the input of the first single-board type signal generation circuit 502, and constructs a corresponding relationship between the level signal of the first mounting position 501a and the level signal output by the first single-board type signal generation circuit 502, so as to determine the level signal of the first mounting position 501a based on the level signal output by the first single-board type signal generation circuit 502, and further determine whether the first mounting position 501a is provided with the structural member 501b, and identify the single-board type of the single board on which the first PCBA (501) is located.

[0209] Optionally, the corresponding relationship between the level signal of the first mounting position and the level signal output by the first single-board type signal generation circuit can not be a corresponding relationship between two exact values. Due to factors such as manufacturing process and environmental interference, the two sides of the corresponding relationship may fluctuate within a reasonable interval range, and this should not be construed as a limitation on the present application.

[0210] According to the embodiment of the present application, the single-board type of the single board on which the PCBA is located can be identified by whether the mounting position is provided with the corresponding structural member, so that the platformization and unification of the single board at the PCBA level can be realized, the single board manufacturing efficiency is improved, and the identification accuracy of the single-board type is improved.

[0211] Optionally, the first single-board type signal generation circuit 502 in the embodiment of the present application can further include more or less switching tubes, power supplies, resistors and other electronic components, and the embodiment of the present application does not limit this.

[0212] Specifically, refer to FIG. 7, which is a structural schematic diagram of another single-board type configuration device provided by the embodiment of the present application.

[0213] As shown in FIG. 7, it can be understood that the third power supply Vcc3, the third resistor R3, the fourth resistor R4, the fifth resistor R5 and the sixth resistor R6 are added on the basis of the first single-board type signal generation circuit 502 shown in FIG. 6, and the circuit connection principle is similar to that of FIG. 6, which will not be described here.

[0214] It should be understood that the first single-board type signal generation circuit 502 in FIG. 6 and FIG. 7 is only shown as two possible examples, and as long as the level signal of the first mounting position 501a can be constructed to have a corresponding relationship with the level signal output by the first single-board type signal generation circuit 502, the embodiment of the present application should not be limited thereto. The new circuit obtained by reasonable deformation or supplement or combination of the first single-board type signal generation circuit 502 in FIG. 6 and FIG. 7 belongs to the protection scope of the embodiment of the present application.

[0215] It should be understood that the single-board type configuration device shown in FIG. 5 to FIG. 7 is only shown as several possible examples, and the embodiment of the present application should not be limited thereto. The new embodiment obtained by reasonable deformation or supplement or combination of the single-board type configuration device shown in FIG. 5 to FIG. 7 belongs to the protection scope of the present application.

[0216] Correspondingly, based on the single-board type configuration device shown in FIG. 5 to FIG. 7, the present application further provides a new single-board type identification method.

[0217] Please refer to FIG. 8, which is a flowchart of a single-board type identification method provided by the embodiment of the present application. The single-board type identification method is applied to the single-board type configuration device shown in FIG. 5 to FIG. 7, and the description of the single-board type configuration device can be referred to the above, which will not be described here.

[0218] Specifically, the single-board type identification method includes but is not limited to the following steps:

[0219] S801: The single-board type identification device acquires the level signal output by the first single-board type signal generation circuit.

[0220] The output of the first single-board type signal generation circuit is related to the installation of the structural member of the first mounting position.

[0221] S802: The single-board type identification apparatus determines the single-board type corresponding to the level signal output by the first single-board type signal generation circuit based on the correspondence between the level signal and the single-board type and the level signal output by the first single-board type signal generation circuit.

[0222] It can be understood that the single-board type identification apparatus in the embodiments of the present application can be a device carrying a processor / chip that can be used to execute computer-executed instructions, or can be a processor / chip that can be used to execute computer-executed instructions. Alternatively, the single-board type identification apparatus can be an electronic device or a processor / chip in an electronic device. Alternatively, the single-board type identification apparatus can be a chip such as an MCU, a CPU, a SOC, a CPLD, etc., which has a latching function and can latch the level information of the single-board type into the chip when the single-board is powered on, and then read the information in the chip by software (it should be noted that the software cannot directly read the level information of the single-board type generated by the external resistance voltage division or circuit). The single-board type identification apparatus is used to execute the single-board type identification method in the embodiments of the present application to improve the accuracy of single-board type identification.

[0223] It can be understood that, since the first single-board type signal generation circuit in the single-board type configuration apparatus can output two different signals according to whether the first mounting position is installed with a structural member, for distinguishing two different single-board types, in the single-board type identification method in the embodiments of the present application, the single-board type identification apparatus can obtain the level signal output by the first single-board type signal generation circuit, and identify the single-board type corresponding to the level signal based on the correspondence between the level signal and the single-board type, to perform subsequent single-board function adaptation.

[0224] Alternatively, the correspondence between the level signal and the single-board type can be preconfigured or adjusted according to different application scenarios, which is not limited in the embodiments of the present application.

[0225] Alternatively, the interaction between the single-board type identification apparatus and the single-board type configuration apparatus can be performed in the following manner: when the single-board is powered on, the single-board type information generated by the single-board type configuration apparatus is sent to the single-board type identification apparatus for latching, and then the register information in the single-board type identification apparatus (such as a chip) is read by software during the startup process to obtain the single-board type information, and then corresponding function adaptation is performed.

[0226] Compared with the current method of distinguishing the single board type by acquiring the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level in the single board, the embodiment of the application distinguishes the single board type of the single board where the PCBA is located by acquiring different level signals output by whether the mounting position on the PCBA is equipped with a corresponding structural member. Since the failure rate of the mounting position and the corresponding structural member is much lower than that of the pull-up resistor and the pull-down resistor in the single board, the stability and reliability are higher, and therefore the recognition accuracy of the single board type recognition method in the embodiment of the application can be greatly improved.

[0227] In a possible embodiment, the specific case of the single board type corresponding to the level signal output by the first single board type signal generation circuit can be as follows:

[0228] Case one:

[0229] In the case where the first mounting position is equipped with the first structural member, the level signal output by the first single board type signal generation circuit is the first level; and based on the correspondence between the level signal and the single board type and the first level, it is determined that the single board type corresponding to the first level is the first single board type.

[0230] Case two:

[0231] In the case where the first mounting position is not equipped with the first structural member, the level signal output by the first single board type signal generation circuit is the second level; and based on the correspondence between the level signal and the single board type and the second level, it is determined that the single board type corresponding to the second level is the second single board type.

[0232] Wherein, the first single board type and the second single board type determined in the above two cases are different.

[0233] It can be understood that the first mounting position can be equipped with the first structural member, and the first mounting position can also not be equipped with the first structural member. In the above two cases, the level output by the first single board type signal generation circuit is different, and corresponds to different single board types.

[0234] Correspondingly, the single board type recognition device acquires the level signal output by the first single board type signal generation circuit, and based on the correspondence between the level signal and the single board type, recognizes the corresponding single board type as the first single board type or the second single board type, so as to perform subsequent single board function adaptation, which can greatly improve the accuracy of single board type recognition.

[0235] Please refer to FIG. 9, which is a flowchart of single board manufacturing provided by an embodiment of the application.

[0236] As shown in FIG. 9, if a single board needs to collect both customized single board A and customized single board B, the software functions of the two customers are different, although other hardware parts are the same, but still need to be distinguished by single board type.

[0237] Through the single-board type configuration device shown in FIGS. 5-7 and the single-board type identification method shown in FIG. 8, the PCB and PCBA can be platformized, the single-board shells are the same, and whether to select the corresponding mounting position and select the specific structural part are triggered by the customer demand or the processing flow, such as triggering no installation of the structural part for the A customer demand, triggering installation of the structural part for the B customer demand, to produce different single-board types, which correspond to the single-board types of the customized single-board A and the customized single-board B, and then different customized demand single-boards (the customized single-board A and the customized single-board B) are formed after software adaptation.

[0238] It can be seen that the single-board types are distinguished by the differentiation of the structural parts, which can make the single-boards platformized and unified at the PCBA level, and improve the single-board manufacturing efficiency.

[0239] Please refer to FIG. 10, which is a structural schematic diagram of a single-board type configuration device provided by an embodiment of the present application.

[0240] As shown in FIG. 10, the single-board type configuration device is applied to a single-board, and the single-board type configuration device specifically includes but is not limited to:

[0241] a second PCBA (1001).

[0242] The second PCBA (1001) is provided with a second mounting position 1001a, and the second PCBA (1001) includes a voltage division module, a first end of the voltage division module is connected with a power supply, a second end of the voltage division module is grounded, the voltage division module includes a voltage division resistor 1001c and the second mounting position 1001a, a first point 1001d is arranged between the voltage division resistor 1001c and the second mounting position 1001a, an output of the first point 1001d is related to an impedance of a structural part 1001b arranged at the second mounting position 1001a, and the output of the first point 1001d is used to indicate a single-board type of a single-board where the second PCBA (1001) is located.

[0243] It can be understood that the second mounting position 1001a on the second PCBA (1001) in the single-board type configuration device can be installed with structural parts 1001b of different impedances, and the first point 1001d between the second mounting position 1001a and the voltage division resistor 1001c outputs different signals when the second mounting position 1001a is installed with structural parts 1001b of different impedances, respectively indicating different single-board types of the single-board where the second PCBA (1001) is located.

[0244] In addition, the first point 1001d can correspondingly output N different signals according to N structural parts 1001b of different impedances installed on the second mounting position 1001a, for distinguishing N different single-board types.

[0245] Compared with the current single board type distinguished by the resistance values of the pull-up resistor (Rp) and the pull-down resistor (Rd) at the PCBA level in the single board, the embodiments of the application design a mounting position on the PCBA, which can be the position of the pull-up resistor or the pull-down resistor, for replacing the pull-up resistor or the pull-down resistor, and realize the identification of the single board type of the single board where the PCBA is located by installing structural members with different impedances on the mounting position, and different resistance values of the pull-up resistor and the pull-down resistor in the single board can not be required for different single board types, so that the platformization and unification of the single board at the PCBA level can be realized, and the single board manufacturing efficiency can be improved.

[0246] In addition, the failure rate of the mounting position and the corresponding structural member is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher, and the identification accuracy of the single board type can be improved by installing structural members with different impedances on the mounting position to realize the identification of the single board type of the single board where the PCBA is located.

[0247] In a possible embodiment, the specific case of the signal output by the first point 1001d when the second mounting position 1001a is installed with the structural member 1001b with different impedance is as follows:

[0248] Case one:

[0249] In the case that the second mounting position 1001a is installed with the second structural member, the first point 1001d outputs the first gear level.

[0250] Case two:

[0251] In the case that the second mounting position 1001a is installed with the third structural member, the first point 1001d outputs the second gear level.

[0252] Among them, in the above two cases, the impedance of the second structural member is different from that of the third structural member, and the single board type corresponding to the first gear level output by the first point 1001d is different from that corresponding to the second gear level.

[0253] It can be understood that the second mounting position 1001a can be installed with the second structural member, and the second mounting position 1001a can also be installed with the third structural member.

[0254] In the above two cases, since the impedance of the second structural member is different from that of the third structural member, the first gear level and the second gear level output by the first point 1001d are also different, and correspond to different single board types respectively.

[0255] Optionally, the first point 1001d is connected with a processor, and the processor is configured to acquire the level signal output by the first point 1001d, identify the corresponding single board type, and perform subsequent single board function adaptation.

[0256] Optionally, the first gear level can be a level range or a level value, and the embodiments of the present application do not limit this.

[0257] Optionally, the difference between the first gear level and the second gear level has a certain accuracy range, which can be adjusted according to different application scenarios. For example, the first point 1001d is connected to the MCU, and the accuracy range can be 5 millivolts (mV) for one gear, for example, 0-5 millivolts for the first gear level and 5-10 millivolts for the second gear level.

[0258] In a possible embodiment, the specific case of the position of the above-mentioned voltage dividing resistor 1001c and the second mounting position 1001a is as follows:

[0259] Case one:

[0260] As shown in FIG. 10, in the case of a pull-down resistor (Rd) for the voltage dividing resistor 1001c, the first end of the second mounting position 1001a is connected to the power supply, the second end of the second mounting position 1001a is connected to the first end of the pull-down resistor, and the second end of the pull-down resistor is grounded.

[0261] Case two:

[0262] For details, please refer to FIG. 11, which is a structural schematic diagram of another single board type configuration device provided by the embodiments of the present application. In the case of a pull-up resistor (Rp) for the voltage dividing resistor 1001c, the first end of the pull-up resistor is connected to the power supply, the second end of the pull-up resistor is connected to the first end of the second mounting position 1001a, and the second end of the second mounting position 1001a is grounded.

[0263] It can be understood that the second mounting position 1001a can be arranged at the position of the pull-down resistor (Rd) to replace the pull-down resistor, in which case the voltage dividing resistor 1001c is a pull-up resistor (Rp). Alternatively, the second mounting position 1001a can also be arranged at the position of the pull-up resistor (Rp) to replace the pull-up resistor, in which case the voltage dividing resistor 1001c is a pull-down resistor (Rd).

[0264] It can be understood that no matter whether the second mounting position 1001a is arranged at the position of the pull-up resistor (Rp) or the pull-down resistor (Rd), the first point 1001d can output different signals by arranging different impedance structure pieces 1001b on the second mounting position 1001a, so as to distinguish different single board types.

[0265] In a possible embodiment, a plurality of mounting positions can also be arranged on the second PCBA (1001) to replace both the pull-up resistor (Rp) and the pull-down resistor (Rd) in the voltage dividing module.

[0266] Specifically, refer to FIG. 12, which is a structural schematic diagram of another single-board type configuration device provided by the embodiment of the application.

[0267] As shown in FIG. 12, the first end of the mounting site 1001e is connected with the power supply, the second end of the mounting site 1001e is connected with the first end of the mounting site 1001a, and the second end of the mounting site 1001a is grounded.

[0268] It can be understood that the mounting site 1001a can be mounted with the structural member 1001b of different impedance, the mounting site 1001e can be mounted with the structural member 1001f of different impedance, and the first point 1001d between the mounting site 1001a and the mounting site 1001e outputs different signals when the mounting site 1001a is mounted with the structural member 1001b of different impedance and the mounting site 1001e is mounted with the structural member 1001f of different impedance, respectively indicating different single-board types of the single board on which the second PCBA (1001) is located.

[0269] Optionally, the second mounting site 1001a includes a screw hole site, and the structural member 1001b mounted on the second mounting site 1001a includes a screw.

[0270] Optionally, the second mounting site 1001a includes a positioning hole site, and the structural member 1001b mounted on the second mounting site 1001a includes a positioning pin.

[0271] Optionally, the structural member 1001b mounted on the second mounting site 1001a can further include, but is not limited to, a test hole site of a vehicle-mounted component, a radiator, etc., which is not limited in the embodiment of the application.

[0272] It can be understood that the failure rate of the structural members such as screws and positioning pins is much lower than that of the pull-up resistor and the pull-down resistor in the single board, and the stability and reliability are higher. The identification of the single-board type of the single board on which the PCBA is located is realized by mounting the structural members such as screws and positioning pins of different impedance on the second mounting site 1001a, which can improve the identification accuracy of the single-board type.

[0273] Optionally, the distance between the second mounting site 1001a and the circuit on the second PCBA (1001) is greater than a second threshold value.

[0274] It can be understood that the second threshold value is not a fixed value, which can be adjusted according to the arrangement of the electronic elements on the second PCBA (1001) so that the circuit is away from the second mounting site 1001a, preventing the stress damage of the circuit caused by the structural member 1001b mounted on the second mounting site 1001a.

[0275] Optionally, the structural member 1001b installed at the second installation site 1001a can include N structural members with different impedances (for example, a second structural member and a third structural member with different impedances), and correspondingly output N different signals for distinguishing N different single board types.

[0276] The second structural member and the third structural member are different in at least one of the following:

[0277] The plating layer material, the processing time of the plating layer, the deposition condition of the plating layer, and the electroplating method of the plating layer.

[0278] It can be understood that the impedances of the second structural member and the third structural member are different, which can be reflected in the impedance difference caused by the difference in the plating layer of the structural member, such as the difference in the plating layer material, the difference in the processing time of the plating layer, the difference in the deposition condition of the plating layer, the difference in the electroplating method of the plating layer, etc. It can also be reflected in the impedance difference caused by the difference in the material and the processing time of the structural member itself, which is not limited by the embodiments of the application.

[0279] It can be understood that, since electroplating is a relatively mature process, the difference in the plating layer can reduce the manufacturing cost of the structural member.

[0280] Exemplarily, a screw (structural member) is taken as an example for illustration:

[0281] As an essential structural member, the screw is widely used in vehicle-mounted whole machine structures. Surface electroplating is a necessary link in the processing of the screw. Common screw plating layer materials include zinc, nickel, chromium and other metals, and the impedance characteristics of the oxides or other compounds of these metals have obvious differences.

[0282] The impedance of the screw plating layer depends on the material and thickness of the plating layer. In addition, the deposition condition and the electroplating method of the plating layer also affect the impedance of the plating layer, so different impedance screws can be processed by controlling the above factors.

[0283] Specifically, the processing of screws with different impedances can be stably realized by including but not limited to the following four schemes:

[0284] Scheme 1: By adjusting the ion concentration of x element and the additive composition in the plating solution, a plating layer with different x element content can be obtained, so as to change the impedance of the plating layer.

[0285] Scheme 2: By adjusting the processing time of the plating layer, the thickness of the plating layer is changed within the order of hundreds of microns, so as to change the impedance of the plating layer.

[0286] Scheme 3: Adjust the deposition condition of the plating layer, such as temperature, current density, etc., change the crystal structure of the plating layer, so as to change the impedance of the plating layer.

[0287] Scheme 4: Changing the electroplating method, such as using pulse electrodeposition, direct current electrodeposition, can also change the crystalline structure of the plating layer, thereby changing the impedance of the plating layer.

[0288] It should be understood that the single-board type configuration devices shown in FIGS. 10-12 above are only shown as several possible examples, and should not be construed as limiting the embodiments of the present application. New embodiments obtained based on reasonable modifications or supplements or combinations of the single-board type configuration devices shown in FIGS. 10-12 above all belong to the scope of protection of the present application.

[0289] Correspondingly, based on the single-board type configuration devices shown in FIGS. 10-12 above, the present application further provides a new single-board type identification method.

[0290] Referring to FIG. 13, FIG. 13 is a flowchart of a single-board type identification method provided by an embodiment of the present application. The single-board type identification method is applied to the single-board type configuration device shown in FIGS. 10-12 above, and the description of the single-board type configuration device can be referred to the above, which will not be repeated here. Specifically, the single-board type identification method includes but is not limited to the following steps:

[0291] S1301: The single-board type identification device obtains a level signal output by a first point.

[0292] The output of the first point is related to the impedance of the structural member installed in the second installation position.

[0293] S1302: The single-board type identification device determines the single-board type corresponding to the level signal output by the first point based on the correspondence between the level signal and the single-board type and the level signal output by the first point.

[0294] It can be understood that the single-board type identification device in the embodiments of the present application can be a device carrying a processor / chip that can be used to execute computer execution instructions, or a processor / chip that can be used to execute computer execution instructions. Alternatively, the single-board type identification device can be an electronic device, or a processor / chip in an electronic device. Alternatively, the single-board type identification device can be an MCU, CPU, SOC, CPLD, etc. The chip has a latching function, which can latch the level information of the single-board type to the inside of the chip when the single-board is powered on, and then read the information in the chip through software (it should be noted that the software cannot directly read the single-board type level information generated by the external resistance voltage division or circuit). The single-board type identification device is used to execute the single-board type identification method in the embodiments of the present application to improve the accuracy of single-board type identification.

[0295] It can be understood that, since the first point in the single board type configuration device can output N different signals corresponding to N different impedance structures installed in the second mounting position, which are used to distinguish N different single board types, in the single board type identification method, the single board type identification device can obtain the level signal output by the first point, and identify the single board type corresponding to the level signal output by the first point based on the correspondence between the level signal and the single board type, to perform subsequent single board function adaptation.

[0296] Optionally, the correspondence between the level signal and the single board type can be preconfigured or adjusted according to different application scenarios, and the embodiments of the present application do not limit this.

[0297] Optionally, the interaction between the single board type identification device and the single board type configuration device can be performed in the following manner: when the single board is powered on, the single board type information generated by the single board type configuration device is sent to the single board type identification device for latching, and then the register information in the single board type identification device (such as a chip) is read to obtain the single board type information during the software startup process, and then corresponding function adaptation is performed.

[0298] Compared with the current method of distinguishing single board types by obtaining the resistance values of the pull-up resistor and the pull-down resistor at the PCBA level in the single board, the embodiments of the present application identify the single board type of the single board where the PCBA is located by obtaining different level signals corresponding to different impedance structures installed in the mounting position on the PCBA. Since the failure rate of the mounting position and the corresponding structure is much lower than that of the pull-up resistor and the pull-down resistor in the single board, the stability and reliability are higher, and therefore the identification accuracy of the single board type identification method in the embodiments of the present application can be greatly improved.

[0299] In a possible embodiment, the specific case of determining the single board type corresponding to the level signal output by the first point can be as follows:

[0300] Case one:

[0301] In the case where the second structure is installed in the second mounting position, the level signal output by the first point is the first gear level; based on the correspondence between the level signal and the single board type and the first gear level, it is determined that the single board type corresponding to the first gear level is the third single board type.

[0302] Case two:

[0303] In the case where the third structure is installed in the second mounting position, the level signal output by the first point is the second gear level, and the impedance of the second structure is different from that of the third structure; based on the correspondence between the level signal and the single board type and the second gear level, it is determined that the single board type corresponding to the second gear level is the fourth single board type.

[0304] The third single board type and the fourth single board type are different.

[0305] It can be understood that the second installation position can be installed with the second structural member, and the second installation position can also be installed with the third structural member. In the above two cases, the first gear level and the second gear level corresponding to the first point position are different due to the different impedances of the second structural member and the third structural member, and correspond to different single board types.

[0306] Correspondingly, the single board type identification device obtains the level signal output by the first point position, and identifies the corresponding single board type as the third single board type or the fourth single board type based on the correspondence between the level signal and the single board type, so as to perform subsequent single board function adaptation, which can greatly improve the accuracy of single board type identification.

[0307] Please refer to FIG. 14, which is a flowchart of service processing of a single board according to an embodiment of the present application.

[0308] As shown in FIG. 14, the main flow of service processing of the single board includes but is not limited to the following steps: single board PDB processing, single board PCBA processing, assembling different structural members according to requirements, different single board impedances, different single board types, obtaining single board type after single board power-on, driving software identifying single board information, driving software making corresponding configuration, service software identifying single board information, service software making corresponding configuration, application software making corresponding configuration, and single board entering normal working state.

[0309] Through the single board type configuration device shown in FIGS. 10-12 and the single board type identification method shown in FIG. 13, the PCB and PCBA can be platformized, the single board shells are the same, and whether to select the corresponding installation position and the specific structural member adaptation are triggered by customer requirements or processing flow, such as triggering the installation of structural member a for customer A and triggering the installation of structural member b for customer B, to generate different single board types, which correspond to the single board types of customerized single board A and customerized single board B, and then form different customerized requirement single boards (customerized single board A and customerized single board B) through software adaptation.

[0310] It can be seen that the difference of the structural members can be used to distinguish the single board types, which can make the single board platformized and unified at the PCBA level and improve the single board manufacturing efficiency.

[0311] The above describes the method of the embodiment of the present application in detail, and the following provides a device for implementing any one of the methods of the embodiment of the present application, for example, a device including units (or means) for implementing each step performed by the device in any one of the above methods.

[0312] Please refer to FIG. 15, which is a structural diagram of a single board type identification device according to an embodiment of the present application.

[0313] As shown in FIG. 15, the single board type identification apparatus 150 can include a communication unit 1501 and a processing unit 1502. The communication unit 1501 and the processing unit 1502 can be software, can be hardware, or can be a combination of software and hardware.

[0314] The communication unit 1501 can implement a sending function and / or a receiving function, and the communication unit 1501 can also be described as a transceiving unit. The communication unit 1501 can also be a unit that integrates an acquisition unit and a sending unit, where the acquisition unit is configured to implement a receiving function, and the sending unit is configured to implement a sending function. Alternatively, the communication unit 1501 can be configured to receive information sent by another apparatus, and can also be configured to send information to another apparatus.

[0315] In a possible design, the single board type identification apparatus 150 can correspond to the single board type identification apparatus in the method embodiments shown in FIG. 8 and FIG. 13, and the single board type identification apparatus 150 can be an electronic device or a chip in an electronic device. The single board type identification apparatus 150 can include units configured to perform operations performed by the single board type identification apparatus in the method embodiments shown in FIG. 8 and FIG. 13, and each unit in the single board type identification apparatus 150 is configured to implement the operations performed by the single board type identification apparatus in the method embodiments shown in FIG. 8 and FIG. 13. Descriptions of the units are as follows:

[0316] The communication unit 1501 is configured to acquire a level signal output by a first single board type signal generation circuit, where the output of the first single board type signal generation circuit is related to a mounting condition of a structural member of a first mounting position.

[0317] The processing unit 1502 is configured to determine a single board type corresponding to the level signal output by the first single board type signal generation circuit, based on a correspondence between a level signal and a single board type and the level signal output by the first single board type signal generation circuit.

[0318] In a possible implementation, the communication unit 1501 is further configured to acquire, in a case where the first structural member is mounted at the first mounting position, the level signal output by the first single board type signal generation circuit as a first level.

[0319] The processing unit 1502 is further configured to determine, based on the correspondence between the level signal and the single board type and the first level, that a single board type corresponding to the first level is a first single board type; or

[0320] The communication unit 1501 is further configured to acquire, in a case where the first installation position does not install the first structural member, a level signal output by the first single-board type signal generation circuit as a second level;

[0321] The processing unit 1502 is further configured to determine, based on the correspondence between the level signal and the single-board type and the second level, that the single-board type corresponding to the second level is a second single-board type, the first single-board type being different from the second single-board type.

[0322] On the other hand, the descriptions of various units are as follows:

[0323] The communication unit 1501 is configured to acquire a level signal output by the first point position, the output of the first point position being related to the impedance of the structural member installed at the second installation position;

[0324] The processing unit 1502 is configured to determine, based on the correspondence between the level signal and the single-board type and the level signal output by the first point position, the single-board type corresponding to the level signal output by the first point position.

[0325] In a possible implementation, the communication unit 1501 is further configured to acquire, in a case where the second installation position installs a second structural member, the level signal output by the first point position as a first gear level;

[0326] The processing unit 1502 is further configured to determine, based on the correspondence between the level signal and the single-board type and the first gear level, that the single-board type corresponding to the first gear level is a third single-board type; or,

[0327] The communication unit 1501 is further configured to acquire, in a case where the second installation position installs a third structural member, the level signal output by the first point position as a second gear level, the impedance of the second structural member being different from the impedance of the third structural member;

[0328] The processing unit 1502 is further configured to determine, based on the correspondence between the level signal and the single-board type and the second gear level, that the single-board type corresponding to the second gear level is a fourth single-board type, the third single-board type being different from the fourth single-board type.

[0329] As to the communication unit 1501 and the processing unit 1502 of the design, the steps performed by the communication unit 1501 and the processing unit 1502 can refer to the corresponding implementation of the single-board type identification device in the method embodiments shown in FIG. 8 and FIG. 13.

[0330] The technical effects brought by the embodiments performed by the communication unit 1501 and the processing unit 1502 described in the design can refer to the introduction of the technical effects of the method embodiments shown in FIG. 8 and FIG. 13.

[0331] According to the embodiments of the present application, each unit in the device shown in FIG. 15 can be combined into one or several other units respectively or all, or some of the units can be further split into a plurality of units with smaller functions to constitute, which can achieve the same operation without affecting the implementation of the technical effects of the embodiments of the present application. The above-mentioned units are divided based on logical functions. In actual application, the function of one unit can also be implemented by multiple units, or the functions of multiple units can be implemented by one unit. In other embodiments of the present application, the electronic device can also include other units. In actual application, these functions can also be assisted by other units, and can be implemented by multiple units.

[0332] It should be noted that the implementation of each unit can also correspond to the description of the corresponding method embodiments shown in FIG. 8 and FIG. 13.

[0333] In the single board type identification device 150 described in FIG. 15, the single board types are distinguished by the differentiation of the structural parts, which can make the single board platformized and unified at the PCBA level, and improve the manufacturing efficiency of the single board.

[0334] For the case that the single board type identification device 150 is an electronic device, refer to the structural schematic diagram of the electronic device shown in FIG. 16.

[0335] It should be understood that the electronic device 160 shown in FIG. 16 is only an example. The electronic device of the embodiments of the present application can also include other components, or include components similar in function to the components in FIG. 16, or not include all the components in FIG. 16.

[0336] The electronic device 160 includes a transceiver interface 1601 and at least one processor 1602.

[0337] The electronic device 160 can correspond to the single board type identification device. The transceiver interface 1601 is used for transceiving signals, and the at least one processor 1602 executes program instructions, so that the electronic device 160 implements the corresponding processes of the method performed by the corresponding device in the above-mentioned method embodiments.

[0338] In a possible design, the electronic device 160 can correspond to the single-board type identification apparatus in the method embodiments shown in FIG.8 and FIG.13, and can be a single-board type identification apparatus or a chip in the single-board type identification apparatus. The electronic device 160 can include components for performing the operations performed by the single-board type identification apparatus in the method embodiments, and each component in the electronic device 160 is respectively configured to implement the operations performed by the single-board type identification apparatus in the method embodiments. The specific steps can be as follows:

[0339] obtaining a level signal output by the first single-board type signal generation circuit, the output of the first single-board type signal generation circuit being related to the installation of the structural member of the first mounting position;

[0340] determining the single-board type corresponding to the level signal output by the first single-board type signal generation circuit based on the correspondence between the level signal and the single-board type and the level signal output by the first single-board type signal generation circuit.

[0341] On the other hand, the specific steps can be as follows:

[0342] obtaining a level signal output by the first point position, the output of the first point position being related to the impedance of the structural member installed in the second mounting position;

[0343] determining the single-board type corresponding to the level signal output by the first point position based on the correspondence between the level signal and the single-board type and the level signal output by the first point position.

[0344] The transceiver interface 1601 and the at least one processor 1602 described in the design perform the steps corresponding to the single-board type identification apparatus in the method embodiments shown in FIG.8 and FIG.13.

[0345] The technical effects brought by the implementation of the transceiver interface 1601 and the at least one processor 1602 described in the design can be referred to the introduction of the technical effects of the method embodiments shown in FIG.8 and FIG.13.

[0346] In the electronic device 160 described in FIG.16, the single-board type can be distinguished by the difference of the structural member, which can make the single board realize platformization and unification at the PCBA level, and improve the manufacturing efficiency of the single board.

[0347] For the case that the single-board type identification apparatus 150 is a chip or a chip system, refer to the structural schematic diagram of the chip shown in FIG.17.

[0348] As shown in FIG. 17, the chip 170 includes a processor 1701 and an interface 1702. Among them, the number of the processor 1701 can be one or more, and the number of the interface 1702 can be multiple. It should be noted that the functions of the processor 1701 and the interface 1702 respectively can be realized by hardware design, or realized by software design, or realized by a combination of software and hardware, which is not limited here.

[0349] Optionally, the chip 170 can further include a memory 1703, and the memory 1703 is used to store necessary program instructions and data.

[0350] In the present application, the processor 1701 can be used to call the implementation program of the single-board type identification method provided by one or more embodiments of the present application in the single-board type identification device from the memory 1703, and execute the instructions included in the program. The interface 1702 can be used to output the execution result of the processor 1701. In the present application, the interface 1702 can be specifically used to output various messages or information of the processor 1701.

[0351] The single-board type identification method provided by one or more embodiments of the present application can refer to the foregoing embodiments shown in FIG. 8 and FIG. 13, which will not be repeated here.

[0352] The processor in the embodiments of the present application can be a central processing unit (CPU), and the processor can also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0353] The memory in the embodiments of the present application is used to provide a storage space, and the storage space can store data such as operating systems and computer programs. The memory includes but is not limited to random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), or compact disc read-only memory (CD-ROM).

[0354] According to the method provided in the embodiments of this application, the embodiments of this application also provide a computer-readable storage medium storing a computer program. When the computer program is run on one or more processors, it can implement the methods shown in Figures 8 and 13.

[0355] According to the method provided in the embodiments of this application, the embodiments of this application also provide a computer program product, which includes a computer program. When the computer program runs on a processor, it can implement the methods shown in Figures 8 and 13.

[0356] This application embodiment also provides a single-board type identification system, which includes the single-board type configuration device shown in Figures 5 to 7 or Figures 10 to 12 above, and the single-board type identification device shown in Figure 15 above.

[0357] This application embodiment also provides an intelligent driving vehicle, the intelligent driving vehicle including at least one single-board type configuration device shown in Figures 5 to 7 or Figures 10 to 12 above, or a single-board type identification device 150, or an electronic device 160, or a chip 170, or the single-board type identification system shown above.

[0358] This application also provides a processing apparatus, including a processor and an interface; the processor is used to execute the method in any of the above method embodiments.

[0359] It should be understood that the above-described processing device can be a chip. The units in the various device embodiments and the electronic devices in the method embodiments correspond completely, with corresponding modules or units executing corresponding steps. For example, the communication unit (transceiver) executes the receiving or sending steps in the method embodiments, while other steps besides sending and receiving can be executed by the processing unit (processor). The specific functions of each unit can be found in the corresponding method embodiments. There can be one or more processors.

[0360] It is understood that in the embodiments of this application, the electronic device may perform some or all of the steps in the embodiments of this application. These steps or operations are merely examples, and the embodiments of this application may also perform other operations or variations thereof. Furthermore, the steps may be performed in different orders as presented in the embodiments of this application, and it is not necessarily necessary to perform all the operations in the embodiments of this application.

[0361] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other manners. For example, the described device embodiments are merely schematic. For example, the division of the units is only a logical function division. There can be another division manner for the actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between the units can be indirect couplings or communication connections through some interfaces, devices or units, and can be electrical, mechanical or in other forms.

[0362] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0363] In addition, each functional unit in the various embodiments of the present application can be integrated into a processing unit, or each unit can be a physically independent unit, or two or more units can be integrated into a unit.

[0364] If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application can be embodied in the form of a software product, and the computer software product is stored in a storage medium, and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program codes that can be stored in the medium.

[0365] The above is merely specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application.

Claims

1. A single board type configuration device, characterized by, The single board type configuration device is applied to a single board, and the single board type configuration device comprises: a first printed circuit board assembly (PCBA), a first single board type signal generation circuit; a first mounting position is arranged on the first PCBA, the first mounting position is connected with the first single board type signal generation circuit, the output of the first single board type signal generation circuit is related to the mounting condition of a structural member of the first mounting position, and the output of the first single board type signal generation circuit is used to indicate the single board type of the single board where the first PCBA is located.

2. The single board type configuration device according to claim 1, wherein in the case that the first structural member is mounted on the first mounting position, the first single board type signal generation circuit outputs a first voltage level; or in the case that the first structural member is not mounted on the first mounting position, the first single board type signal generation circuit outputs a second voltage level, and the single board type corresponding to the first voltage level is different from the single board type corresponding to the second voltage level.

3. The single board type configuration device according to claim 2, wherein in the case that the first structural member is mounted on the first mounting position, the first mounting position is grounded, and the first voltage level is a low voltage level; or in the case that the first structural member is not mounted on the first mounting position, the first mounting position is suspended, and the second voltage level is a high voltage level.

4. The single board type configuration apparatus according to any one of claims 1 to 3, wherein The first mounting position comprises a screw hole position, and the structural member mounted on the first mounting position comprises a screw; or the first mounting position comprises a positioning hole position, and the structural member mounted on the first mounting position comprises a positioning pin.

5. The single board type configuration apparatus according to any one of claims 1 to 4, wherein The first mounting position comprises a redundant hole position or a working hole position on the first PCBA.

6. The single board type configuration apparatus according to any one of claims 1 to 5, wherein The distance between the first mounting position and a circuit on the first PCBA is greater than a first threshold value.

7. The single board type configuration apparatus according to any one of claims 2 to 6, wherein The first single board type signal generation circuit comprises: a first switch tube, a second switch tube, a first power supply, a second power supply, a first resistor, and a second resistor; a first end of the first switch tube is connected with the first mounting position, a second end of the first switch tube is connected with a first end of the first resistor, a second end of the first resistor is connected with the first power supply, and a third end of the first switch tube is connected with a first end of the second switch tube; a second end of the second switch tube is connected with a first end of the second resistor, a second end of the second resistor is connected with the second power supply, and a third end of the second switch tube is grounded; wherein the second end of the second switch tube is used to output the first voltage level or the second voltage level.

8. A single board type configuration device, characterized by The single board type configuration device is applied to a single board, and the single board type configuration device comprises: a second printed circuit board assembly (PCBA); a second mounting position is arranged on the second PCBA, the second PCBA comprises a voltage division module, a first end of the voltage division module is connected with a power supply, and a second end of the voltage division module is grounded, the voltage division module comprises a voltage division resistor and the second mounting position, a first point position is arranged between the voltage division resistor and the second mounting position, the output of the first point position is related to the impedance of a structural member mounted on the second mounting position, and the output of the first point position is used to indicate the single board type of the single board where the second PCBA is located.

9. The single-board type configuration device of claim 8, wherein, when the second structure is installed in the second mounting position, the first point outputs a first gear level; or, when a third structure is installed in the second mounting position, the first point outputs a second gear level, the impedance of the second structure and the impedance of the third structure are different, and the single-board type corresponding to the first gear level is different from the single-board type corresponding to the second gear level.

10. The single-board type configuration device of claim 8 or 9, wherein, when the voltage dividing resistor is a pull-up resistor, a first end of the pull-up resistor is connected to a power supply, a second end of the pull-up resistor is connected to a first end of the second mounting position, and a second end of the second mounting position is grounded; or, when the voltage dividing resistor is a pull-down resistor, a first end of the second mounting position is connected to a power supply, a second end of the second mounting position is connected to a first end of the pull-down resistor, and a second end of the pull-down resistor is grounded. The second mounting position includes a screw hole position, and the structure installed in the second mounting position includes a screw; or, the second mounting position includes a positioning hole position, and the structure installed in the second mounting position includes a positioning pin. The distance between the second mounting position and the circuit on the second PCBA is greater than a second threshold value. The second structure and the third structure are different in at least one of the following: plating layer material, plating layer processing time, plating layer deposition condition, and plating method.

11. The single board type configuration apparatus according to any one of claims 8 to 10, wherein The single-board type configuration device of any one of claims 1 to 7 includes a first PCBA, a first single-board type signal generation circuit, and a first mounting position provided on the first PCBA; and the single-board type identification method includes:

12. The single board type configuration apparatus according to any one of claims 8 to 11, wherein obtaining a level signal output by the first single-board type signal generation circuit, the output of the first single-board type signal generation circuit being related to the installation of a structure in the first mounting position; 13. The single board type configuration apparatus according to claim 9, wherein determining the single-board type corresponding to the level signal output by the first single-board type signal generation circuit based on a correspondence between a level signal and a single-board type.

15. The method of claim 14, wherein, when a first structure is installed in the first mounting position, the level signal output by the first single-board type signal generation circuit is a first level; 14. A single board type identification method, characterized by, determining that the single-board type corresponding to the first level is a first single-board type based on a correspondence between a level signal and a single-board type; or, when the first structure is not installed in the first mounting position, the level signal output by the first single-board type signal generation circuit is a second level; determining that the single-board type corresponding to the second level is a second single-board type based on a correspondence between a level signal and a single-board type, the first single-board type being different from the second single-board type. ​ ​ ​ ​ ​ ​ 16. A single board type identification method, characterized by, The application is applied to the single-board type configuration device as claimed in any one of claims 8 to 13, and the single-board type configuration device comprises a second PCBA, the second PCBA is provided with a second mounting position, the second PCBA comprises a voltage division module, the voltage division module comprises a voltage division resistor and the second mounting position, and a first point is arranged between the voltage division resistor and the second mounting position; and the single-board type identification method comprises: obtaining a level signal output by the first point, the output of the first point being related to impedance of a structural member arranged in the second mounting position; determining a single-board type corresponding to the level signal output by the first point based on a corresponding relationship between a level signal and a single-board type.

17. The method of claim 16, wherein, in a case where a second structural member is mounted in the second mounting position, the level signal output by the first point is a first gear level; based on a corresponding relationship between a level signal and a single-board type, it is determined that a single-board type corresponding to the first gear level is a third single-board type; or in a case where a third structural member is mounted in the second mounting position, the level signal output by the first point is a second gear level, and impedance of the second structural member and impedance of the third structural member are different; based on a corresponding relationship between a level signal and a single-board type, it is determined that a single-board type corresponding to the second gear level is a fourth single-board type, and the third single-board type is different from the fourth single-board type.

18. A single board type identification apparatus, characterized by, The application comprises units for executing the method as claimed in any one of claims 14 to 17.

19. A single board type identification apparatus, characterized by, The application comprises a processor for executing the method as claimed in any one of claims 14 to 17.

20. A single board type identification system characterized by, The application comprises the single-board type configuration device as claimed in any one of claims 1 to 13, and the single-board type identification device as claimed in any one of claims 18 to 19.

21. A mobile terminal, characterized by The application comprises the single-board type configuration device as claimed in any one of claims 1 to 13, or the single-board type identification device as claimed in any one of claims 18 to 19, or the single-board type identification system as claimed in claim 20.

22. A computer-readable storage medium, characterized in that, The computer readable storage medium is used for storing a computer program, and the computer program is executed to execute the method as claimed in any one of claims 14 to 17.

23. A computer program product, characterised in that, The computer program product comprises a computer program, and the computer program is executed to execute the method as claimed in any one of claims 14 to 17.

Images