Mounting device, mounting method, and mounting control program

Abstract

The objective of the present invention is to provide: a mounting device capable of easily observing an observation target such as damage and foreign matter on an object being observed, by performing imaging using specularly reflected light reflected at the surface of the object being observed; a mounting method; and a mounting control program. The present disclosure relates to a mounting device comprising: a mounting tool for mounting an object being mounted onto a mounting target object disposed on a stage; an imaging unit in which an optical system and an imaging element are disposed so as to satisfy the Scheimpflug condition, such that a plane parallel to a stage surface of the stage is the focal point plane, and which images at least one of the object being mounted and the mounting target object, as an object being observed, from the same side of the stage surface as the mounting tool; and an illuminating unit which is disposed such that emitted illuminating light is specularly reflected at the surface of the object being observed and reaches the imaging element.

Description

Mounting device, mounting method, and mounting control program

[0001] The present invention relates to a mounting apparatus, a mounting method, and a mounting control program.

[0002] In a bonding machine, which is an example of a conventional mounting machine, a camera first captures an image of a workpiece, such as a die pad, from directly above to confirm its position. Then, the camera is retracted and the head unit supporting the mounting tool is moved directly above the workpiece to perform the bonding operation. Bonding machines employing this type of configuration not only require a long operation time, but also suffer from the problem of accumulated movement errors relative to the target work position. Therefore, the use of an imaging unit employing a Scheimpflug optical system that can capture an image of the workpiece from an oblique direction has been considered (see, for example, Patent Document 1).

[0003] International Publication No. 2022 / 053518

[0004] Bonding equipment that uses an imaging unit that employs a Scheimpflug optical system typically captures images by capturing scattered light reflected from the surface of the object being observed, such as a semiconductor chip or die pad. However, it can be difficult to observe damage or foreign matter on the surface of the object being observed using scattered light.

[0005] The present invention has been made in consideration of these problems, and provides a mounting device, a mounting method, and a mounting control program that can easily observe observation targets such as damage and foreign matter on an observation object by capturing an image using specularly reflected light reflected on the surface of the observation object.

[0006] A mounting device in a first aspect of the present invention includes a mounting tool that mounts a mounting object on a mounted object placed on a stage, an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes a focal plane, and which images at least one of the mounting object and the mounted object as an observation object from the same side of the stage surface as the mounting tool, and an irradiation unit arranged so that emitted irradiation light is specularly reflected on the surface of the observation object and reaches the imaging element.

[0007] Furthermore, a mounting method in a second aspect of the present invention is a mounting method for a mounting object using a mounting device including: a mounting tool that mounts a mounting object on a mounted object placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes a focal plane; and an illumination unit arranged so that emitted illumination light is specularly reflected on a surface of at least one of the mounting object and the mounted object, which are objects to be observed, and reaches the imaging element, the method comprising: an illumination step in which the illumination unit illuminates the observation object with illumination light; and an imaging step in which the imaging unit images the observation object by receiving the illumination light specularly reflected on the surface of the observation object with the imaging element.

[0008] Furthermore, a mounting control program in a third aspect of the present invention is a mounting control program for controlling a mounting device including: a mounting tool that mounts a mounting target on a mounted target placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes a focal plane; and an illumination unit arranged so that emitted illumination light is specularly reflected on a surface of at least one of the mounting target and the mounted target, which are objects to be observed, and reaches the imaging element, and causes a computer to execute an illumination step in which the illumination unit illuminates the observed target with illumination light; and an imaging step in which the imaging unit images the observed target by receiving the illumination light specularly reflected on the surface of the observed target with the imaging element.

[0009] The present invention provides a mounting device, a mounting method, and a mounting control program that can easily observe observation targets such as damage and foreign matter on an observation object by capturing an image using specularly reflected light reflected on the surface of the observation object.

[0010] FIG. 1 is a perspective view schematically showing a main part of a mounting device according to an embodiment of the present invention; FIG. 2 is a system configuration diagram of the mounting device; FIG. 3 is an explanatory diagram for explaining a Scheimpflug optical system; FIG. 4 is an explanatory diagram for explaining the arrangement of an irradiation unit; FIG. 5 is an explanatory diagram for explaining the principle of calculating three-dimensional coordinates; FIG. 6 is a flow diagram for explaining the processing procedure of an arithmetic processing unit in a modified example of the mounting device; FIG. 7 is an explanatory diagram for explaining a modified example of the mounting device; FIG. 8 is a flow diagram for explaining the processing procedure of an arithmetic processing unit in a modified example of the mounting device.

[0011] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems. In each drawing, when there are multiple structures with the same or similar configurations, some may be given reference numerals and other identical reference numerals may be omitted to avoid complication.

[0012] FIG. 1 is a perspective view schematically illustrating a main part of a mounting apparatus 100 according to this embodiment. The mounting apparatus 100 is a flip-chip bonding apparatus that places and bonds a semiconductor chip 610 to a bonding area 620 of a substrate 630. The substrate 630 is an example of an object to be mounted that is placed on a stage 520. The bonding area 620 is an area corresponding to the bonding surface of the semiconductor chip 610 and has, for example, electrodes that bond to bumps formed on the bonding surface and provide electrical continuity. The indicator 621 is an indicator that is referenced to place the semiconductor chip 610 at a target position on the bonding area 620. The semiconductor chip 610 is an example of an object to be mounted. The substrate 630 is, for example, a lead frame. The bonding area 620 is, for example, a die pad. The semiconductor chip 610 and the substrate 630 are also examples of objects to be observed.

[0013] The mounting apparatus 100 mainly includes a head unit 110, a mounting tool 120, a first imaging unit 130, a second imaging unit 140, a first irradiation unit 170, and a second irradiation unit 180. The head unit 110 supports the mounting tool 120, the first imaging unit 130, the second imaging unit 140, the first irradiation unit 170, and the second irradiation unit 180, and is movable in a planar direction by a head drive motor 150. As shown in the figure, the planar direction is the horizontal direction defined by the X-axis direction and the Y-axis direction, and is also the direction of movement of a stage 520 mounted on a stand 510.

[0014] The mounting tool 120 adsorbs the semiconductor chip 610 to its tip, places it on the bonding area 620 of the substrate 630 placed on the stage 520, and bonds it by applying pressure and heat. The mounting tool 120 can be moved in the height direction relative to the head unit 110 by a tool drive motor 160. As shown in the figure, the height direction is the Z-axis direction, which is perpendicular to the planar direction.

[0015] The first imaging unit 130 is an imaging unit for capturing an image of the substrate 630 located below the mounting tool 120, and includes a first optical system 131, a first imaging element 132, and a second half mirror 183. As will be described in detail later, the first imaging unit 130 is obliquely mounted on the head unit 110 with its optical axis directed downward toward the mounting tool 120. The first optical system 131 and the first imaging element 132 are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage 520 serves as the focal plane. The second half mirror 183 reflects the irradiation light emitted from the second irradiation unit 180. The second half mirror 183 also transmits the irradiation light emitted from the first irradiation unit 170, which is specularly reflected by the surface of the substrate 630, including the region where the index 621 is present, and reaches the first imaging element 132. The beam of illumination light emitted from the first irradiation unit 170, specularly reflected by the surface of the substrate 630, and guided to the first image sensor 132 is also referred to as a "first subject beam." In this case, the optical path of the first subject beam partially overlaps, within the first image sensor 130, with the optical path of the beam of illumination light emitted from the second irradiation unit 180 (hereinafter also referred to as a "second illumination beam").

[0016] The first irradiation unit 170 is disposed so that the emitted irradiation light is specularly reflected by the surface of the substrate 630 including the region where the index 621 is present, and reaches the first imaging element 132. That is, the first irradiation unit 170 and the first imaging unit 130 are disposed in a specular reflection arrangement with the normal to the stage surface of the stage 520 as a reference. Specifically, the optical axis of the first imaging unit 130 coincides with the light ray obtained by specularly reflecting, by the stage 520, a light ray passing through the central axis of the light beam of the irradiation light from the first irradiation unit 170.

[0017] The second imaging unit 140 is an imaging unit for capturing an image of the substrate 630 located below the mounting tool 120, and includes a second optical system 141, a second imaging element 142, and a first half mirror 173. As will be described in detail later, the second imaging unit 140 is obliquely mounted on the head unit 110 with its optical axis directed downward toward the mounting tool 120. The second optical system 141 and the second imaging element 142 are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage 520 serves as the focal plane. The first half mirror 173 reflects the irradiation light emitted from the first irradiation unit 170. The first half mirror 173 also transmits the irradiation light emitted from the second irradiation unit 180 that is specularly reflected by the surface of the substrate 630, including the region where the index 621 is present, and reaches the second imaging element 142. The beam of illumination light emitted from the second irradiation unit 180, specularly reflected by the surface of the substrate 630, and guided to the second image sensor 142 is also referred to as a "second subject beam." In this case, the optical path of the second subject beam partially overlaps, within the second image sensor 140, with the optical path of the beam of illumination light emitted from the first irradiation unit 170 (hereinafter also referred to as a "first illumination beam").

[0018] The second irradiation unit 180 is disposed so that the emitted irradiation light is specularly reflected by the surface of the substrate 630 including the region where the index 621 is present, and reaches the second imaging element 142. That is, the second irradiation unit 180 and the second imaging unit 140 are disposed in a specular reflection arrangement with the normal to the stage surface of the stage 520 as a reference. Specifically, the optical axis of the second imaging unit 140 coincides with the light ray obtained by specularly reflecting, by the stage 520, a light ray passing through the central axis of the light beam of the irradiation light from the second irradiation unit 180.

[0019] In the following description, when there is no need to distinguish between the first irradiation unit 170 and the second irradiation unit 180, they are also simply referred to as irradiation units. Furthermore, when there is no need to distinguish between the first imaging unit 130 and the second imaging unit 140, they are also simply referred to as imaging units.

[0020] The focal plane of the first imaging unit 130 and the focal plane of the second imaging unit 140 are coincident. Furthermore, the size of the angle formed by the optical axis of the first imaging unit 130 and the normal to the stage surface of the stage 520 is coincident with the size of the angle formed by the optical axis of the second imaging unit 140 and the normal. Specifically, the optical axis of the first imaging unit 130 is coincident with an axis obtained by moving the optical axis of the second imaging unit 140 linearly symmetrically with respect to the normal to the stage surface of the stage 520.

[0021] The insides of the first imaging unit 130, the second imaging unit 140, the first irradiation unit 170, and the second irradiation unit 180 may be subjected to stray light prevention treatment. Examples of the stray light prevention treatment include a treatment of applying a stray light prevention agent such as black anodized aluminum to the inside surfaces, and a treatment of providing grooves in the inside surfaces.

[0022] The first imaging unit 130 and the second imaging unit 140 are obliquely mounted on the head 110 with their optical axes directed downward toward the mounting tool 120. Therefore, the first imaging unit 130 and the second imaging unit 140 can capture images while the mounting tool 120 remains in close proximity to the bonding region 620. The first imaging unit 130 outputs a first image by focusing, on the imaging element 132 of the first imaging unit 130, the light emitted from the first irradiation unit 170 that is specularly reflected by the surface of the region where the index 621 is present. The second imaging unit 140 outputs a second image by focusing, on the imaging element 142 of the second imaging unit 140, the light emitted from the second irradiation unit 180 that is specularly reflected by the surface of the region where the index 621 is present. By capturing an image of the index 621 using specularly reflected light in this manner, the contour of the index 621 is more emphasized and clearer in the resulting first or second image. That is, the index 621 appears more clearly in the first image or the second image. As a result, when calculating the coordinates of the index 621 based on the image of the index 621 appearing in the first image or the second image, the coordinates can be calculated more accurately, and the semiconductor chip 610 can be placed at the target position with high accuracy.

[0023] The mounting device 100 is equipped with two imaging units, a first imaging unit 130 and a second imaging unit 140. This makes it possible to acquire a first image of the index 621 from the first imaging unit 130, and a second image of the index 621 from the second imaging unit 140. Here, based on the principle of calculating three-dimensional coordinates, which will be described later, the three-dimensional coordinates of the index 621 can be calculated from the first image and the second image. This enables high-precision mounting, including information on the height (Z-direction) position.

[0024] In the mounting device 100, the first subject light beam and the second irradiation light beam partially overlap within the first imaging unit 130. Furthermore, the second subject light beam and the first irradiation light beam partially overlap within the second imaging unit 140. That is, the first irradiation unit 170 and the second irradiation unit 180 can use the interiors of the second imaging unit 140 and the first imaging unit 130 as optical paths, respectively, so that the two irradiation units do not need to have separate, independent optical paths. This creates spatial room for arranging units other than the imaging unit and the irradiation unit within the mounting device 100. That is, the degree of freedom in the configuration of the mounting device 100 is improved. Depending on the arrangement of the second irradiation unit 180, the first subject light beam and the second irradiation light beam may entirely overlap within the first imaging unit 130. Depending on the arrangement of the first irradiation unit 170, the second subject light beam and the first irradiation light beam may entirely overlap within the second imaging unit 140.

[0025] The XYZ coordinate system is a spatial coordinate system with the reference position of the head unit 110 as the origin. The mounting device 100 captures images of the index 621 provided on the substrate 630 using the first imaging unit 130 and the second imaging unit 140, and obtains the three-dimensional coordinates (X, Y, Z) of the index 621 from these images. Ｒ , Y Ｒ , Z Ｒ The indicator 621 is a reference indicator as a reference mark. The reference indicator may be a dedicated reference mark, or may be any object whose three-dimensional coordinates can be stably calculated, such as a wiring pattern, a groove, or an edge that can be observed on the work object.

[0026] The first imaging unit 130 and the second imaging unit 140 receive specularly reflected light of the irradiation light emitted from the first irradiation unit 170 and the second irradiation unit 180, respectively. Here, if the indicators 621 are provided by scribing grooves or are printed with ink and have a rough surface, light is more likely to scatter on these indicators 621. Therefore, the indicators 621 appear more clearly as black images in the first image or the second image. Furthermore, to increase the degree of freedom in circuit pattern design, it is preferable that the dedicated indicators 621 be as small as possible on the substrate 630. In this regard, in this embodiment, imaging is performed by the imaging units receiving specularly reflected light of the irradiation light emitted from the irradiation units. Therefore, even if the indicators 621 are small and provided as thin, short grooves or thin, short printed lines, the indicators 621 appear clearly in the obtained image. In other words, the size of the indicators 621 provided on the substrate 630 can be conveniently reduced. If the index 621 is drawn in the shape of a cross, its coordinates are calculated as the intersection of two straight lines. As described above, by capturing an image using specular reflection light, even a thin, short straight line can be clearly captured in the resulting image. Therefore, even if the index 621 is provided very finely, its coordinates can be calculated with high accuracy.

[0027] The relative position of the bonding area 620 with respect to the indicator 621 on the surface of the substrate 630 is known. Therefore, the mounting apparatus 100 calculates the three-dimensional coordinates (X Ｒ , Y Ｒ , Z Ｒ ) to the center coordinates (X Ｔ , Y Ｔ , Z Ｔ In this embodiment, it is assumed that the bonding region 620 and the indicator 621 are provided on the same plane of the substrate 630. Ｒ =Z Ｔ The mounting apparatus 100 calculates the center coordinates (X Ｔ , Y Ｔ , Z Ｔ ) as an approach target, the head unit 110 and the mounting tool 120 are driven to transport the semiconductor chip 610 to that coordinate.

[0028] 2 is a system configuration diagram of the mounting apparatus. The control system of the mounting apparatus is mainly composed of an arithmetic processing unit 200, a storage unit 300, an input / output device 400, a first imaging unit 130, a second imaging unit 140, a head drive motor 150, a tool drive motor 160, a first irradiation unit 170, and a second irradiation unit 180. The arithmetic processing unit 200 is a processor (CPU: Central Processing Unit) that controls the mounting apparatus 100 and executes programs. The processor may be configured to work in conjunction with an arithmetic processing chip such as an ASIC (Application Specific Integrated Circuit) or a GPU (Graphics Processing Unit). The arithmetic processing unit 200 reads a position control program stored in the storage unit 300 and executes various processes related to position control.

[0029] The storage unit 300 is a non-volatile storage medium, and is configured by, for example, an HDD (Hard Disk Drive). The storage unit 300 can store various parameter values, functions, lookup tables, etc. used for control and calculation, in addition to programs for controlling and executing processes of the mounting device 100. The storage unit 300 particularly stores a conversion table 310. The conversion table 310 will be described in detail later, but when the coordinate values ​​of the index 621 shown in the first image and the index 621 shown in the second image are input, the three-dimensional coordinates (X １ , Y １ , Z １ ) is a lookup table that converts

[0030] The input / output device 400 includes, for example, a keyboard, a mouse, and a display monitor, and is a device that accepts menu operations by a user and presents information to the user. For example, the arithmetic processing unit 200 may display the first image and the second image side by side on a display monitor that is one of the input / output devices 400.

[0031] The first imaging unit 130 receives an imaging request signal from the arithmetic processing unit 200, performs imaging, and transmits the first image output by the first imaging element 132 as an image signal to the arithmetic processing unit 200. Similarly, the second imaging unit 140 receives an imaging request signal from the arithmetic processing unit 200, performs imaging, and transmits the second image output by the second imaging element 142 as an image signal to the arithmetic processing unit 200.

[0032] The head drive motor 150 receives a drive signal from the arithmetic processing unit 200 to move the head unit 110 in the X and Y directions. The tool drive motor 160 receives a drive signal from the arithmetic processing unit 200 to move the mounting tool 120 in the Z direction.

[0033] When the first imaging unit 130 and the second imaging unit 140 respectively perform imaging, the first illumination unit 170 and the second illumination unit 180 emit illumination light so that the imaging target appears in the first image and the second image output by both imaging units.

[0034] The arithmetic processing unit 200 also serves as a functional calculation unit that executes various calculations in accordance with the processing instructed by the position control program. The arithmetic processing unit 200 can function as an image acquisition unit 210, a detection unit 220, a calculation unit 230, an implementation control unit 240, and an irradiation control unit 250. The image acquisition unit 210 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140, and acquires an image signal of the first image and an image signal of the second image.

[0035] The detection unit 220 refers to the semiconductor chip 610 and the bonding area 620 shown in the first image and the second image, respectively, and detects whether or not there is any damage or foreign matter on the semiconductor chip 610 and the bonding area 620 .

[0036] The calculation unit 230 calculates the three-dimensional coordinates (X Ｒ , Y Ｒ , Z Ｒ Specifically, the three-dimensional coordinates (X Ｒ , Y Ｒ , Z ＲThe mounting control unit 240 generates a drive signal for driving the head drive motor 150 and a drive signal for driving the tool drive motor 160, and transmits them to the respective motors. For example, the calculation unit 230 obtains the three-dimensional coordinates (X Ｒ , Y Ｒ , Z Ｒ ) to the center coordinates (X Ｔ , Y Ｔ , Z Ｔ ), the mounting tool 120 is Ｔ , Y Ｔ , Z Ｔ ) and transmits it to the tool drive motor 160.

[0037] The mounting control unit 240 generates a drive signal for driving the head drive motor 150 and a drive signal for driving the tool drive motor 160, and transmits these signals to the respective motors to perform mounting control. For example, the calculation unit 230 calculates the three-dimensional coordinates (X １ , Y １ , Z １ ) is calculated, a drive signal for moving the semiconductor chip 610 toward the bonding area 620 is generated based on the calculated coordinates so as to move the semiconductor chip 610 toward the three-dimensional coordinates of the index 621, and the drive signal is transmitted to the tool drive motor 160. When the semiconductor chip 610 is moved toward the bonding area 620, for example, the center of the semiconductor chip 610 is aligned with the center coordinates (X Ｔ , Y Ｔ , Z Ｔ Alternatively, an index whose position is known in advance is provided on the semiconductor chip 610, and the index is brought close to the central coordinates of the bonding region 620.

[0038] The irradiation control unit 250 controls the emission of irradiation light by generating an ON signal to cause the first irradiation unit 170 and the second irradiation unit 180 to start emitting irradiation light and an OFF signal to cause the second irradiation unit 180 to stop emitting irradiation light, and transmitting these signals to both irradiation units. For example, when the mounting apparatus 100 is started up, the irradiation control unit 250 generates an ON signal to cause the first irradiation unit 170 and the second irradiation unit 180 to start emitting irradiation light and transmits this signal to both irradiation units. When the mounting apparatus 100 is shut down, the irradiation control unit 250 generates an OFF signal to cause the first irradiation unit 170 and the second irradiation unit 180 to stop emitting irradiation light and transmits this signal to both irradiation units.

[0039] 3 is an explanatory diagram for explaining the Scheimpflug optical system. The Scheimpflug optical system explained in FIG. 3 is adopted in the first imaging unit 130 and the second imaging unit 140, but here, the Scheimpflug optical system of the first imaging unit 130 will be explained as a representative.

[0040] In FIG. 3, the plane S １ is a planned focal plane including the bonding area 620 arranged parallel to the stage surface of the stage 520. ２ is a plane including the principal plane of the first optical system 131, which is made up of the object-side lens group 131a and the image-side lens group 131b. ３ is a plane including the light receiving surface of the first image sensor 132. In this embodiment, the Scheimpflug optical system includes the first optical system 131 and the first image sensor 132, which are arranged so as to satisfy the Scheimpflug condition. The arrangement that satisfies the Scheimpflug condition is the plane S １ , virtual surface S ２ , virtual surface S ３ are arranged to intersect with each other on a common straight line P.

[0041] 3 shows the object-side lens group 131a and the bonding region 620 close to each other to clearly explain the Scheimpflug condition, but in reality they are spaced apart as shown in FIG. 1. Also, to clearly explain the Scheimpflug condition, the second half mirror 183 and the second irradiation unit 180 are omitted from the illustration. The mounting tool 120 can move in the Z-axis direction in the space above the bonding region 620 without interfering with the first imaging unit 130.

[0042] The aperture 133 is disposed between the object-side lens group 131a and the image-side lens group 131b, and limits the light beam passing through. The diameter of the aperture 133 determines the depth of field D Ｐ Therefore, for example, when the tip of the mounting tool 120 holding the semiconductor chip 610 is positioned within the depth of field D Ｐ When the first imaging unit 130 approaches the inside, it can capture images of both the semiconductor chip 610 and the surface of the substrate 630 in a focused state.

[0043] As described above, the first imaging unit 130 satisfies the Scheimpflug condition, and therefore, the index 621 provided on the substrate 630 can be imaged in a focused state as long as the index 621 is within the field of view of the first imaging unit 130. In addition, both the index 621 and the bonding region 620 can be imaged in a focused state in a single image.

[0044] In this embodiment, a double-sided telecentric system is realized by the object-side lens group 131a and the image-side lens group 131b. This allows the object to be imaged on the image sensor at a constant magnification, which is convenient for calculating three-dimensional coordinates. In particular, in a Scheimpflug optical system, it is desirable to have an object-side telecentric system in which the object on the side of line P and the object farther from line P have the same magnification on the imaging plane. Note that in double-sided telecentric systems and object-side telecentric systems, only light beams parallel to the optical axis of the imaging unit are imaged on the image sensor.

[0045] The second imaging unit 140 has a configuration similar to that of the first imaging unit 130, and is disposed on the head portion 110 symmetrically with respect to the YZ plane including the central axis of the mounting tool 120. Therefore, like the first imaging unit 130, the second imaging unit 140 can also image the index 621 provided on the substrate 630 in a focused state as long as the index 621 is within the field of view of the second imaging unit 140. It can also image both the index 621 and the bonding region 620 in a focused state in a single image. Also, like the first imaging unit, the second imaging unit 140 achieves double telecentricity using an object-side lens group and an image-side lens group, not shown.

[0046] FIG. 4 is an explanatory diagram for explaining the arrangement of the illumination unit and the imaging unit. First, the arrangement of the illumination unit and the imaging unit will be explained using the luminous flux of illumination light emitted from the second illumination unit 180. The second illumination unit 180 has a light source 181 and a lens 182. The luminous flux of illumination light emitted from the light source 181 and passing through the lens 182 is reflected by the second half mirror 183. The luminous flux reflected by the second half mirror 183 passes through the object-side lens group 131a. After passing through, the luminous flux is made parallel to the optical axis of the first imaging unit 130. The parallelized luminous flux is then reflected by the substrate 630. Of the luminous flux reflected by the substrate 630, the luminous flux specularly reflected by the smooth surface of the substrate 630 becomes parallel to the optical axis of the second imaging unit 140. The luminous flux then passes through the object-side lens group 141a, the aperture 143, and the image-side lens group 141b of the second imaging unit 140, and reaches the second imaging element 142. On the other hand, of the light beam reflected on the substrate 630, the light beam reflected by a local inclined surface or scattering surface on the substrate 630 does not reach the second imaging unit 140, or even if it does reach the second imaging unit 140, the amount of light is small. Therefore, in the image output from the second imaging unit 140, the smooth surface on the substrate 630 appears white, and the local inclined surface or scattering surface appears black. The local inclined surface or scattering surface is formed by, for example, the index 621, or damage or foreign matter attached to the substrate 630.

[0047] In this case, the first imaging unit 130 and the second irradiation unit 180 are positioned so that the light ray passing through the central axis of the light beam of irradiation light emitted from the second irradiation unit 180 coincides with the optical axis of the first imaging unit 130 after being reflected by the second half mirror 183.

[0048] Next, the arrangement of the illumination unit and the imaging unit will be described using the luminous flux of illumination light emitted from the first illumination unit 170. The first illumination unit 170 has a light source 171 and a lens 172. The luminous flux of illumination light emitted from the light source 171 and passing through the lens 172 is reflected by a first half mirror 173. The luminous flux reflected by the first half mirror 173 passes through the object-side lens group 141a. After passing through, the luminous flux is made parallel to the optical axis of the second imaging unit 140. The parallelized luminous flux is then reflected by the substrate 630. Of the luminous flux reflected by the substrate 630, the luminous flux specularly reflected by a smooth surface on the substrate 630 becomes parallel to the optical axis of the first imaging unit 130. The luminous flux then passes through the object-side lens group 131a, the aperture 133, and the image-side lens group 131b of the first imaging unit 130, and reaches the first imaging element 132. On the other hand, of the light beam reflected on the substrate 630, the light beam reflected by local inclined surfaces or scattering surfaces on the substrate 630 does not reach the first imaging unit 130, or even if it does reach the first imaging unit 130, the amount of light is small. Therefore, in the image output from the first imaging unit 130, the smooth surface on the substrate 630 appears white, and the local inclined surfaces or scattering surfaces appear black.

[0049] In this case, the second imaging unit 140 and the first irradiation unit 170 are positioned so that the light ray passing through the central axis of the light beam of irradiation light emitted from the first irradiation unit 170 coincides with the optical axis of the second imaging unit 140 after being reflected by the first half mirror 173.

[0050] As described above, the illumination light emitted from the second illumination unit 180 passes through the object-side lens group 131a of the first imaging unit 130. That is, the second illumination unit 180 is configured integrally with the first imaging unit 130, and the illumination light emitted from the second illumination unit 180 passes through the interior of the first imaging unit 130. As a result, even when the second imaging unit 140 receives specularly reflected light of the illumination light emitted from the second illumination unit 180 to perform imaging, the imaging can be performed without moving the first imaging unit 130. Similarly, even when the second imaging unit 140 receives specularly reflected light of the illumination light emitted from the first illumination unit 170 to perform imaging, the imaging can be performed without moving the second imaging unit 140. Furthermore, the positions of the lens 172 and light source 171 of the first illumination unit 170 and the positions of the lens 182 and light source 181 of the second illumination unit 180 can be adjusted so that the illumination light illuminates the entire imaging area of ​​the imaging unit.

[0051] 5 is an explanatory diagram for explaining the principle of calculating the three-dimensional coordinates of the index 621. In particular, it is a diagram for explaining the procedure for generating the conversion table 310. The conversion table 310 is generated by placing a chart 700 having the same thickness as the board 630 on the stage 520 directly below the mounting tool 120, and using a first image captured by the first imaging unit 130 and a second image captured by the second imaging unit 140.

[0052] A plurality of dots 710 are printed in a matrix at set intervals on the surface of the chart 700. The height of the head unit 110 is set to Z=h １ , h ２ , h ３ ...and capture images at each height to obtain a pair of first and second images. The dots 710 are provided so as to have a rough surface, so that the amount of light emitted from the illumination unit that is reflected by the dots 710 and received by the imaging unit is reduced. Therefore, the dots 710 appear black in the first and second images.

[0053] Since the first imaging unit 130 and the second imaging unit 140 use a Scheimpflug optical system, the resulting chart image 700' is completely in focus, but each image is distorted into a trapezoid with opposite orientations. In the image coordinate system, the horizontal axis is the x-axis and the vertical axis is the y-axis, and the coordinates of the corresponding dot images 710' in the first image and the second image are expressed as follows: (x １ｋ , y １ｋ ), (x ２ｋ , y ２ｋ ) is calculated as follows:

[0054] The coordinates (X ｋ , Y ｋ ) is known, and the height h ｋ =Z Ｋ is adjusted during imaging, so the three-dimensional coordinates (X ｋ , Y ｋ , Z Ｋ ) is determined at the time of shooting. ｋ The coordinates (x １ｋ , y １ｋ ), (x ２ｋ , y ２ｋ ) is calculated, it is possible to obtain the correspondence of coordinates between each dot 710 and its image, that is, the dot image 710'. That is, for each height at which imaging is performed, three-dimensional coordinates (X ｋ , Y ｋ , Z Ｋ ) and two-dimensional coordinates (x １ｋ , y １ｋ ), (x ２ｋ , y ２ｋ Such correspondences are described in the conversion table 310.

[0055] The conversion table 310 thus written and generated is a three-dimensional coordinate (X ｋ , Y ｋ , Z Ｋ ) and two-dimensional coordinates (x １ｋ , y １ｋ ), (x ２ｋ , y ２ｋ) and can be used as a lookup table. １Ｒ , y １Ｒ ) and the coordinate value of the second target image (x ２Ｒ , y ２Ｒ ) to the three-dimensional coordinates (X Ｒ , Y Ｒ , Z Ｒ ) can be converted into the calculated (x １Ｒ , y １Ｒ ) and (x ２Ｒ , y ２Ｒ ) does not exist in the conversion table 310, interpolation processing can be performed using the surrounding coordinates that exist in the conversion table 310.

[0056] Furthermore, the coordinate value (x １Ｒ , y １Ｒ ) and the coordinate value of the second target image (x ２Ｒ , y ２Ｒ ) to the three-dimensional coordinates (X Ｒ , Y Ｒ , Z Ｒ For example, the three-dimensional coordinates (X ｋ , Y ｋ , Z Ｋ ) and two-dimensional coordinates (x １ｋ , y １ｋ ), (x ２ｋ , y ２ｋ ) and calculate the polynomial approximation function from the correspondence relationship of (x １Ｒ , y １Ｒ ) and (x ２Ｒ , y ２Ｒ ) to (X Ｒ , Y Ｒ , Z Ｒ In this way, when a lookup table or a polynomial approximation function generated based on actual measurement data is used, error factors resulting from components such as lens aberration and imaging unit installation error are absorbed in the actual measurement data, and therefore calculation of three-dimensional coordinates with higher accuracy can be expected.

[0057] Alternatively, a conversion formula may be calculated arithmetically using Scheimpflug geometric conditions, a baseline length defined between two image sensors, or the like, without relying on actual measurement data. For example, a transformation matrix for converting a trapezoidal image into a rectangular image is defined, using physical quantities such as the tilt angle of the optical system and image sensors as parameters, and keystone correction is performed on the first and second images using this transformation matrix. The two images that have undergone keystone correction are then treated as stereo images, and the three-dimensional coordinates of the object to be observed are calculated from the amount of positional deviation between the images. This method is advantageous in that it eliminates the need to obtain actual measurement data in advance using charts, etc.

[0058] Next, a series of mounting processes performed by the mounting apparatus 100 will be described. Fig. 6 is a flow chart illustrating the processing procedure of the arithmetic processing unit. Here, the process will be described from the state in which the first irradiation unit 170 and the second irradiation unit 180 start emitting irradiation light, to the state in which the semiconductor chip 610 is bonded to the bonding region 620 and then withdrawn, and then the process until inspection is performed.

[0059] In step s101, the irradiation control unit 250 transmits a signal to start emitting irradiation light to the first irradiation unit 170 and the second irradiation unit 180. As a result, the first irradiation unit 170 and the second irradiation unit 180 start emitting irradiation light.

[0060] In step s102, the mounting control unit 240 transmits drive signals to the head drive motor 150 and the tool drive motor 160 to move the head unit 110 and the mounting tool 120 to a reference position. Here, the reference position is an initial position where the mounting tool 120 is assumed to be located directly above the bonding area 620 on which the semiconductor chip 610 will be placed.

[0061] When the head section 110 reaches the reference position, in step s103, the image acquisition section 210 transmits an image acquisition request signal to the first imaging unit 130 and the second imaging unit 140. Then, the image acquisition section 210 acquires the first image data from the first imaging unit 130 and the second image data from the second imaging unit 140. The image acquisition section 210 passes the acquired image data to the calculation section 230.

[0062] In step s104, the calculation unit 230 calculates the coordinates (x １Ｒ , y １Ｒ ) from the second image of the second image data to the coordinates (x ２Ｒ , y ２Ｒ Then, in step s105, the calculation unit 230 refers to the conversion table 310 based on the extraction result of the calculation unit 230 to extract (x １Ｒ , y １Ｒ ) and (x ２Ｒ , y ２Ｒ ) pair of three-dimensional coordinates (X Ｒ , Y Ｒ , Z Ｒ Furthermore, in step s106, the calculation unit 230 uses the information on the relative position of the bonding area 620 with respect to the index 621 to calculate the center coordinates (X Ｔ , Y Ｔ , Z Ｔ ) is calculated.

[0063] Once the approach target is determined, the mounting control unit 240 sends a drive signal to the head drive motor 150 in step s107 to adjust the horizontal position error. As a result, the center of the mounting tool 120 is adjusted to a position (X Ｔ , Y Ｔ Next, in step s108, the mounting control unit 240 calculates Z=Z Ｔ The mounting tool 120 is moved closer to the bonding area 620 until the semiconductor chip 610 held by the mounting tool 120 is placed on the bonding area 620 based on the calculated Z Ｔ Therefore, the amount of descent of the mounting tool 120 is accurately grasped, and therefore the mounting control unit 240 may lower the mounting tool 120 at high speed until just before the semiconductor chip 610 comes into contact with the bonding area 620. After the semiconductor chip 610 is placed on the bonding area 620, the arithmetic processing unit 200 executes a mounting process to bond the semiconductor chip 610 to the bonding area 620. After the mounting process is completed, in step s109, the mounting control unit 240 raises the mounting tool 120 and moves it away from the bonded semiconductor chip 610.

[0064] Next, in step s110, the image acquisition unit 210 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140. Then, the image acquisition unit 210 acquires the first inspection image data from the first imaging unit 130 and the second inspection image data from the second imaging unit 140. The image acquisition unit 210 passes the acquired image data to the detection unit 220. The semiconductor chip 610 and the substrate 630 are imaged in the first inspection image data and the second inspection image data.

[0065] Next, in step s111, the detection unit 220 detects and determines whether or not there is damage or foreign matter on the semiconductor chip 610 or the substrate 630 from the first inspection image and the second inspection image. If no damage or foreign matter is present, in step s113, the irradiation control unit 250 sends a signal to the first irradiation unit 170 and the second irradiation unit 180 to stop emitting irradiation light. This causes the first irradiation unit 170 and the second irradiation unit 180 to stop emitting irradiation light. This then ends the series of processes. If damage or foreign matter is present, in step s112, the arithmetic processing unit 200 causes the mounting apparatus 100 to discard the semiconductor chip 610 and the substrate 630. Then, in step s113, the irradiation control unit 250 sends a signal to the first irradiation unit 170 and the second irradiation unit 180 to stop emitting irradiation light. This causes the first irradiation unit 170 and the second irradiation unit 180 to stop emitting irradiation light. This then ends the series of processes.

[0066] Steps s102 to s109 are repeated when multiple semiconductor chips 610 are mounted on different bonding areas 620 on the substrate 630. After all of the semiconductor chips 610 have been mounted on their respective predetermined bonding areas 620, step s110 and subsequent steps are executed.

[0067] In the above description, step s101 is performed before step s102, but it may be performed at any time before step s103. For example, step s101 may be performed after step s102 and before step s103.

[0068] The first and second inspection images are captured using specular reflection light. In this regard, damage and foreign matter tend to be clearly visible in images captured using specular reflection light, so damage and foreign matter are clearly visible in the first and second inspection images, enabling more accurate inspection.

[0069] In the above description, an example has been described in which the first irradiation unit 170 and the second irradiation unit 180 are activated before the head unit 110 and the mounting tool 120 move to the reference position. On the other hand, when the image acquisition unit 210 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140, the irradiation control unit 250 may transmit an ON signal to the first irradiation unit 170 and the second irradiation unit 180. Furthermore, when the image acquisition unit 210 acquires the image signal of the first image and the image signal of the second image, the irradiation control unit 250 may transmit an OFF signal to the first irradiation unit 170 and the second irradiation unit 180. This prevents irradiation light from being emitted from the irradiation units while imaging is not being performed, which is advantageous from the perspective of energy conservation.

[0070] In the above description, an example has been described in which an imaging request signal is transmitted simultaneously to the first imaging unit 130 and the second imaging unit 140, but simultaneous transmission is not required. For example, the image acquisition unit 210 transmits an imaging request signal to the first imaging unit 130, acquires first image data from the first imaging unit 130, and passes the data to the calculation unit 230. Next, the image acquisition unit 210 transmits an imaging request signal to the second imaging unit 140, acquires second image data from the second imaging unit 140, and passes the data to the calculation unit 230. In addition, the irradiation control unit 250 transmits an ON signal to the first irradiation unit 170 when an imaging request signal is transmitted to the first imaging unit 130, and transmits an OFF signal to the first irradiation unit 170 when the image acquisition unit 210 acquires an image signal of the first image. Furthermore, the illumination control unit 250 may transmit an ON signal to the second illumination unit 180 when an imaging request signal is transmitted to the second imaging unit 140, and may transmit an OFF signal to the second illumination unit 180 when the image acquisition unit 210 acquires an image signal of the second image. In this case, the second illumination unit 180 is OFF when the first imaging unit 130 performs imaging, and the first illumination unit 170 is OFF when the second imaging unit 140 performs imaging. This makes it possible to suppress the occurrence of flare and ghosting due to the illumination light emitted from the second illumination unit 180 when the first imaging unit 130 performs imaging. Similarly, it is possible to suppress the occurrence of flare and ghosting due to the illumination light emitted from the first illumination unit 170 when the second imaging unit 140 performs imaging.

[0071] After step s101 and before step s102, the arithmetic processing unit 200 detects and determines whether or not there is damage or foreign matter on the substrate 630. If it determines that there is damage or foreign matter, the arithmetic processing unit 200 may cause the mounting device 100 to discard the substrate. Specifically, first, the image acquisition unit 210 transmits an imaging request signal to the first imaging unit 130 and the second imaging unit 140. Then, the image acquisition unit 210 acquires first pre-inspection image data from the first imaging unit 130 and second pre-inspection image data from the second imaging unit 140. The image acquisition unit 210 passes the acquired image data to the detection unit 220. Next, the presence or absence of damage or foreign matter on the semiconductor chip 610 or the substrate 630 is detected and determined from the first pre-inspection image and the second pre-inspection image. If there is no damage or foreign matter, the process proceeds to step s102. If damage or foreign matter is found, the arithmetic processing unit 200 causes the mounting device 100 to discard the semiconductor chip 610 and the substrate 630. Then, the series of processes ends.

[0072] If the detection unit 220 detects damage or foreign matter in step s111, it may determine the extent of the damage or foreign matter, and if the extent is significant, the arithmetic processing unit 200 may cause the mounting device 100 to discard the semiconductor chip 610 and the substrate 630 in step s112. The extent of the damage or foreign matter may be determined by a user checking the first inspection image and the second inspection image and inputting the confirmation result. Alternatively, the arithmetic processing unit 200 may be made to learn in advance the extent of damage or foreign matter when the semiconductor chip 610 and the substrate 630 are to be discarded, and the detection unit 220 may determine the extent of the damage or foreign matter based on the learning result.

[0073] If the detection unit 220 detects dust in step s111, the calculation processing unit 200 may cause the mounting device 100 to remove the dust. In this case, the mounting device 100 may include, for example, a blower, and the calculation processing unit 200 may send a drive signal to the blower. Then, after the blower has been driven, step s110 is executed again.

[0074] After step s110, the detection unit 220 may detect and determine whether the semiconductor chip 610 is placed at the target position on the substrate 630. For example, a user may set in advance an allowable range for deviation of the semiconductor chip 610 from the target position. The detection unit 220 then detects and determines whether the deviation from the target position is within the allowable range from the first inspection image and the second inspection image. If the deviation is within the allowable range, the next step is executed. If the deviation is outside the allowable range, the calculation processing unit 200 causes the mounting device 100 to discard the semiconductor chip 610 and the substrate 630.

[0075] The above description has been given of a mounting device 100 having two pairs of imaging units and illumination units, in which the optical axis of the first imaging unit 130 coincides with the axis obtained by moving the optical axis of the second imaging unit 140 linearly symmetrically with respect to the normal to the stage surface of the stage 520. However, the optical axis of the first imaging unit 130 does not have to coincide with the axis obtained by moving the optical axis of the second imaging unit 140 linearly symmetrically with respect to the normal. For example, the imaging units and illumination units do not have to be integrally configured. In this case, the second illumination unit 180 is provided at a location separate from the first imaging unit 130. That is, the optical path of the second illumination light beam emitted from the second illumination unit 180 does not pass through the interior of the first imaging unit 130 and does not overlap with the optical path of the first subject light beam. Furthermore, the first illumination unit 170 is provided at a location separate from the second imaging unit 140. That is, the optical path of the first irradiation light beam emitted from the first irradiation unit 170 does not pass through the inside of the second imaging unit 140 and does not overlap with the optical path of the second subject light beam.

[0076] In the above description, the mounting device 100 has been described as having two pairs of combinations of imaging units and irradiation units, but the combination of imaging units and irradiation units may also be one pair. Below, a series of mounting processes by the mounting device 100 when the combination of imaging units and irradiation units is one pair will be described. Note that elements that are the same as elements already described will be assigned the same numbers unless otherwise specified, and their description will be omitted. Furthermore, unless otherwise specified, the imaging units and irradiation units satisfy the positional relationship and configuration conditions of the first imaging unit 130 and the first irradiation unit 170, respectively.

[0077] 7 is a flow diagram for explaining the processing procedure of the arithmetic processing unit 200 in the mounting device 100 when the combination of the imaging unit and the irradiation unit is one pair. In step s201, the irradiation control unit 250 transmits a signal to the irradiation unit to start emitting irradiation light. As a result, the irradiation unit starts emitting irradiation light.

[0078] In step s202, the mounting control unit 240 transmits drive signals to the head drive motor 150 and the tool drive motor 160 to move the head unit 110 and the mounting tool 120 to a reference position. Here, the reference position is a position where the semiconductor chip 610 is close to the bonding area 620.

[0079] When the head unit 110 reaches the reference position, the image acquisition unit 210 transmits an image acquisition request signal to the imaging unit in step s203. The image acquisition unit 210 then acquires image data from the imaging unit. The image acquisition unit 210 passes the acquired image data to the calculation unit 230.

[0080] The image of the image data received by the calculation unit 230 includes an index 621, a bonding area 620, and a semiconductor chip 610. In step s204, the calculation unit 230 extracts the positional relationship between the index 621, the bonding area 620, and the semiconductor chip 610 from the image of the image data received from the image acquisition unit 210. Here, the relative position of the index 621 and the bonding area 620 is known. The calculation unit 230 extracts the relationship between the positional relationship between the index 621 and the bonding area 620 in the image and the relative positions of the index 621 and the bonding area 620. Based on this relationship, the calculation unit 230 calculates the relative position of the bonding area 620 and the semiconductor chip 610.

[0081] Based on the relative positions of the bonding area 620 and the semiconductor chip 610, the mounting control unit 240 sends a drive signal to the head drive motor 150 in step s205 so that the semiconductor chip 610 is positioned at a target position directly above the bonding area 620. As a result, the semiconductor chip 610 is positioned at the target position directly above the bonding area 620. Next, in step s206, the mounting control unit 240 moves the mounting tool 120 closer to the bonding area 620 until the semiconductor chip 610, which is sucked onto the mounting tool 120, is placed on the bonding area 620. Once the semiconductor chip 610 has been placed on the bonding area 620, the arithmetic processing unit 200 executes a mounting process to bond the semiconductor chip 610 to the bonding area 620. Once the mounting process is complete, the mounting control unit 240 raises the mounting tool 120 and moves it away from the bonded semiconductor chip 610 in step s207.

[0082] Next, in step s208, the image acquisition unit 210 transmits an imaging request signal to the imaging unit. Then, the image acquisition unit 210 acquires inspection image data from the imaging unit. The image acquisition unit 210 passes the acquired inspection image data to the detection unit 220. The inspection image data includes an image of the semiconductor chip 610 and the substrate 630.

[0083] Next, in step s209, the detection unit 220 detects and determines whether or not there is damage or foreign matter on the semiconductor chip 610 or the substrate 630 from the inspection image. If no damage or foreign matter is present, the irradiation control unit 250 sends a signal to the irradiation unit to stop emitting irradiation light in step s211. This causes the irradiation unit to stop emitting irradiation light. This then ends the series of processes. If damage or foreign matter is present, the arithmetic processing unit 200 instructs the mounting device 100 to discard the semiconductor chip 610 and the substrate 630 in step s210. Thereafter, the irradiation control unit 250 sends a signal to the irradiation unit to stop emitting irradiation light in step s211. This causes the irradiation unit to stop emitting irradiation light. This then ends the series of processes.

[0084] Steps s202 to s207 are repeated when multiple semiconductor chips 610 are mounted on different bonding areas 620 on the substrate 630. After all of the semiconductor chips 610 have been mounted on their respective predetermined bonding areas 620, step s208 and subsequent steps are executed.

[0085] In the above description, the mounting apparatus 100 has been described as a flip-chip bonding apparatus, but the mounting apparatus 100 may also be a wire bonding apparatus. In this case, the mounting apparatus 100 electrically connects the substrate 630 and the semiconductor chip 610 mounted on the substrate 630 with wires. The mounting tool 120 is a capillary for forming the wires. The indicators 621 are marks that exist on the semiconductor chip 610 and the substrate 630, respectively, and are used to determine the positions where the wires are to be mounted. Hereinafter, the indicators on the semiconductor chip 610 will be referred to as indicators 621a, and the indicators on the substrate 630 will be referred to as indicators 621b. The positions where the wires are to be mounted are the electrodes on the semiconductor chip 610 and the substrate 630.

[0086] The indicators 621 may be electrodes on the semiconductor chip 610 and the substrate 630, or may be marks separately provided on the semiconductor chip 610 and the substrate 630. When the separately provided marks are used as the indicators 621, the positional relationships between the indicators 621 and the electrodes on the semiconductor chip 610 and the substrate 630 are known. Therefore, the coordinates of the electrodes can be calculated from the three-dimensional coordinates of the indicators 621.

[0087] Although the semiconductor chip 610 and the substrate 630 have different coordinates in the height direction, if both are present within the depth of field of the first imaging unit 130 and the second imaging unit 140, an image in which both are in focus can be output. From this image, the three-dimensional coordinates of the index 621 a and the index 621 b can be calculated. If both the semiconductor chip 610 and the substrate 630 cannot be positioned within the depth of field of the first imaging unit 130 and the second imaging unit 140, an image in which the semiconductor chip 610 is in focus and an image in which the substrate 630 is in focus can be output, and the three-dimensional coordinates of the index 621 a and the index 621 b can be calculated from these images.

[0088] In the above explanation, the mounting device 100 has been described as having two irradiation units, the first irradiation unit 170 and the second irradiation unit 180, but the mounting device 100 may also have a third irradiation unit 190 in addition to the first irradiation unit 170 and the second irradiation unit 180.

[0089] Fig. 8 is an explanatory diagram for explaining a modified example of the mounting apparatus 100. Based on Fig. 8, a case will be described in which the mounting apparatus 100 includes a third irradiation unit 190 in addition to the first irradiation unit 170 and the second irradiation unit 180. Note that elements that are the same as elements already described will be assigned the same numbers and their description will be omitted unless otherwise specified.

[0090] 8 , the mounting device 100 includes a third irradiation unit 190, which is a ring-shaped irradiation unit, installed on the surface of the head part 110 facing the substrate 630 so as to surround the area where the mounting tool 120 is present. The third irradiation unit 190 is arranged so that the emitted irradiation light is scattered on the surface of the substrate 630 and reaches the imaging elements of the first imaging unit 130 and the second imaging unit 140.

[0091] If the surface of the index 621 on the substrate 630 is highly smooth, the index 621 may appear clearer in the image obtained using the third irradiation unit 190 than in the image obtained using the first irradiation unit 170 and the second irradiation unit 180.

[0092] Although the third irradiation unit 190 has been described as a ring-shaped irradiation unit in FIG. 8 , the third irradiation unit 190 is not limited to a ring-shaped irradiation unit and may be another irradiation unit, such as a bulb-shaped irradiation unit. Furthermore, although the third irradiation unit 190 has been described as being installed on the surface of the head unit 110 facing the substrate 630 so as to surround the area where the mounting tool 120 is located in FIG. 8 , the third irradiation unit 190 may be installed in another location. For example, the third irradiation unit 190 may be provided on the substrate 630 side of the mounting apparatus 100. Specifically, the third irradiation unit 190 may be a low-angle irradiation unit provided on the substrate stand 510 side of the mounting apparatus 100.

[0093] Fig. 9 is a flow diagram for explaining the processing procedure of the arithmetic processing unit 200 in the mounting device 100 explained in Fig. 8. Elements that are the same as elements that have already been explained are given the same numbers and their explanations will be omitted unless otherwise specified.

[0094] In step s301, the irradiation control unit 250 transmits a signal to start emitting irradiation light to the third irradiation unit 190. In response to this, the third irradiation unit 190 starts emitting irradiation light.

[0095] In step s302, the irradiation control unit 250 transmits a signal to the third irradiation unit 190 to stop emitting irradiation light, and a signal to the first irradiation unit 170 and the second irradiation unit 180 to start emitting irradiation light. As a result, the third irradiation unit 190 stops emitting irradiation light, and the first irradiation unit 170 and the second irradiation unit 180 start emitting irradiation light. Furthermore, in step s303, the irradiation control unit 250 transmits a signal to the first irradiation unit 170 and the second irradiation unit 180 to stop emitting irradiation light. As a result, the first irradiation unit 170 and the second irradiation unit 180 stop emitting irradiation light.

[0096] The first and second images obtained in step s103 are captured using irradiation light emitted from third irradiation unit 190. On the other hand, the first and second inspection images obtained in step s110 are captured using irradiation light emitted from first irradiation unit 170 and second irradiation unit 180. In this way, by switching between the irradiation unit used when mounting semiconductor chip 610 and the irradiation unit used when inspecting semiconductor chip 610 and substrate 630 after mounting semiconductor chip 610, it is possible to obtain an image in which the object to be imaged is more clearly visible.

[0097] <Additional Notes> Embodiments of the present disclosure include the following aspects. [1] A mounting device comprising: a mounting tool that mounts a mounting target on a mounted target that is placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to a stage surface of the stage is a focal plane, and which images at least one of the mounting target and the mounted target as an observation target from the same side of the stage surface as the mounting tool; and an illumination unit arranged so that emitted illumination light is specularly reflected by a surface of the observation target and reaches the imaging element. [2] The mounting device described in [1], wherein the imaging unit has a first imaging unit and a second imaging unit adjusted so that their respective focal planes coincide, and the illumination unit has a first illumination unit arranged so that emitted illumination light reaches the imaging element of the first imaging unit, and a second illumination unit arranged so that emitted illumination light reaches the imaging element of the second imaging unit. [3] The mounting device according to [2], wherein the target object has an index for determining a position at which the target object is to be mounted, and the mounting device further comprises a calculation unit that calculates three-dimensional coordinates of the index from a first image output by forming, on the image sensor of the first imaging unit, an image of the illumination light from the first illumination unit that has been specularly reflected by the surface of the target object, and a second image output by forming, on the image sensor of the second imaging unit, an image of the illumination light from the second illumination unit that has been specularly reflected by the surface of the target object. [4] The mounting device according to [2] or [3], further comprises a detection unit that detects an observation target of the target object from a first inspection image that is output from the first imaging unit and shows the target object mounted on the target object, and a second inspection image that is output from the second imaging unit and shows the target object mounted on the target object. [5] The mounting device according to [4], wherein the observation target is damage or a foreign object on the target object, or the target object.[6] The mounting device according to any one of [2] to [5], wherein an optical path of a first subject light beam guided to the imaging element of the first imaging unit at least partially overlaps with an optical path of a second illumination light beam emitted from the second illumination unit inside the first imaging unit, and an optical path of a second subject light beam guided to the imaging element of the second imaging unit at least partially overlaps with an optical path of the first illumination light beam emitted from the first illumination unit inside the second imaging unit. [7] The mounting device according to any one of [2] to [6], further comprising a third illumination unit arranged so that emitted illumination light is scattered on a surface of the observation target and reaches the imaging element. [8] The mounting device according to [7], further comprising an illumination control unit that emits illumination light from the third illumination unit when the first imaging unit and the second imaging unit image the observation target to determine a position of the observation target, and that emits illumination light from the first illumination unit and the second illumination unit when the first imaging unit and the second imaging unit image the observation target to inspect the observation target. [9] A mounting method for an object to be mounted using a mounting device including: a mounting tool that mounts an object to be mounted on an object to be mounted that is placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes a focal plane; and an illumination unit that is arranged so that emitted illumination light is specularly reflected on a surface of at least one of the object to be mounted and the object to be mounted that is an observation object, and reaches the imaging element, the mounting method comprising: an illumination step in which the illumination unit illuminates the observation object with illumination light; and an imaging step in which the imaging unit images the observation object by receiving the illumination light specularly reflected on the surface of the observation object with the imaging element.

[10] A mounting control program for controlling a mounting device including: a mounting tool that mounts a mounting target on a target placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes a focal plane; and an illumination unit arranged so that emitted illumination light is specularly reflected on a surface of at least one of the target and the target, which are observation targets, and reaches the imaging element, the mounting control program causing a computer to execute an illumination step in which the illumination unit illuminates the observation target with illumination light; and an imaging step in which the imaging unit images the observation target by receiving the illumination light specularly reflected on the surface of the observation target with the imaging element.

[0098] 100...mounting device, 110...head unit, 120...mounting tool, 130...first imaging unit, 131...first optical system, 131a...object-side lens group, 131b...image-side lens group, 132...first imaging element, 133...aperture, 140...second imaging unit, 141...second optical system, 141a...object-side lens group, 141b...image-side lens group, 142...second imaging element, 143...aperture, 150...head drive motor, 160...tool drive motor, 170...first irradiation unit, 171...light source, 172...lens, 173...first half mirror, 1 80...second irradiation unit, 181...light source, 182...lens, 183...second half mirror, 190...third irradiation unit, 200...arithmetic processing unit, 210...image acquisition unit, 220...detection unit, 230...calculation unit, 240...mounting control unit, 250...irradiation control unit, 300...storage unit, 310...conversion table, 400...input / output device, 510...frame, 520...stage, 610...semiconductor chip, 620...bonding area, 621...index, 630...substrate, 700...chart, 700'...chart image, 710...dot, 710'...dot image

Claims

1. A mounting device comprising: a mounting tool that mounts a mounting target on a mounted target placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of said stage becomes the focal plane, and which images at least one of said mounting target and said mounted target as an observation target from the same side of said stage surface as said mounting tool; and an illumination unit arranged so that emitted illumination light is specularly reflected on the surface of said observation target and reaches said imaging element.

2. The mounting device according to claim 1, wherein the imaging unit has a first imaging unit and a second imaging unit adjusted so that their respective focal planes coincide, and the illumination unit has a first illumination unit arranged so that the emitted illumination light reaches the imaging element of the first imaging unit, and a second illumination unit arranged so that the emitted illumination light reaches the imaging element of the second imaging unit.

3. The mounting device according to claim 2, wherein the object to be mounted has an index for determining a position at which the mounting object is to be mounted, and the mounting device further comprises a calculation unit that calculates three-dimensional coordinates of the index from a first image output by forming an image on the image sensor of the first imaging unit of the illumination light from the first illumination unit that has been specularly reflected by the surface of the object to be observed, and a second image output by forming an image on the image sensor of the second imaging unit of the illumination light from the second illumination unit that has been specularly reflected by the surface of the object to be observed.

4. The mounting device according to claim 2, further comprising a detection unit that detects an observation target of the observation object from a first inspection image that is output from the first imaging unit and shows the mounting object mounted on the mounting target, and a second inspection image that is output from the second imaging unit and shows the mounting object mounted on the mounting target.

5. The mounting device according to claim 4, wherein the observation target is damage or foreign matter on the object to be observed or the object to be mounted.

6. The mounting device described in claim 2, wherein the optical path of the first subject light beam guided to the imaging element of the first imaging unit at least partially overlaps with the optical path of the second illumination light beam emitted from the second illumination unit inside the first imaging unit, and the optical path of the second subject light beam guided to the imaging element of the second imaging unit at least partially overlaps with the optical path of the first illumination light beam emitted from the first illumination unit inside the second imaging unit.

7. The mounting device according to claim 2, further comprising a third illumination unit arranged so that emitted illumination light is scattered on the surface of the object to be observed and reaches the imaging element.

8. The mounting device according to claim 7, further comprising an illumination control unit that emits illumination light from the third illumination unit when the first imaging unit and the second imaging unit image the object to be observed in order to determine the position of the object to be observed, and that emits illumination light from the first illumination unit and the second illumination unit when the first imaging unit and the second imaging unit image the object to be observed in order to inspect the object to be observed.

9. A mounting method for an object to be mounted using a mounting device comprising: a mounting tool that mounts an object to be mounted on an object to be mounted that is placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes the focal plane; and an illumination unit arranged so that emitted illumination light is specularly reflected on the surface of at least one of the object to be mounted and the object to be mounted that is an observation object, and reaches the imaging element, the mounting method comprising: an illumination step in which the illumination unit illuminates the observation object with illumination light; and an imaging step in which the imaging unit captures an image of the observation object by receiving the illumination light specularly reflected on the surface of the observation object with the imaging element.

10. A mounting control program for controlling a mounting device comprising: a mounting tool that mounts a mounting target on a target placed on a stage; an imaging unit in which an optical system and an imaging element are arranged to satisfy the Scheimpflug condition so that a plane parallel to the stage surface of the stage becomes the focal plane; and an illumination unit arranged so that emitted illumination light is specularly reflected on the surface of at least one of the target and the target, which are objects to be observed, and reaches the imaging element, the mounting control program causing a computer to execute an illumination step in which the illumination unit illuminates the object to be observed with illumination light; and an imaging step in which the imaging unit captures an image of the object to be observed by receiving the illumination light specularly reflected on the surface of the object to be observed with the imaging element.

Images