Electronic device comprising antenna using hinge structure

Abstract

A foldable electronic device according to one embodiment may comprise: a foldable housing including a first housing part and a second housing part; a hinge assembly for rotatably coupling the first housing part and the second housing part; a hinge housing, which surrounds the hinge assembly, includes a plurality of slots, and is at least partially exposed to the outside of the foldable housing in a folded state of the foldable electronic device; a substrate seated on the hinge housing toward the plurality of slots; a wireless communication circuit; and conductive patches which are formed on the substrate and which are aligned with each of the plurality of slots of the hinge housing. At least some of the conductive patches can be used to radiate signals from the wireless communication circuit through the plurality of slots.

Description

Electronic device including an antenna using a hinge structure

[0001] The present disclosure relates to an electronic device including an antenna using a hinge structure.

[0002] Electronic devices may include multiple antennas. As the bandwidth of RF (radio frequency) signals covered by electronic devices expands, the number of antennas incorporated into electronic devices is increasing. As demand for highly portable electronic devices increases, electronic devices may include flexible, deformable displays. Electronic devices may include, for example, a hinge structure configured to deform the flexible display. As the bandwidth of RF signals covered by electronic devices expands, antennas utilizing hinge structures may be required.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] A foldable electronic device is disclosed. The foldable electronic device may include a foldable housing including a first housing part and a second housing part. The foldable electronic device may include a hinge assembly rotatably connecting the first housing part and the second housing part. The foldable electronic device may include a hinge housing surrounding the hinge assembly, including a plurality of slots, and at least partially exposed to the outside of the foldable housing when the foldable electronic device is in a folded state. The foldable electronic device may include a substrate mounted on the hinge housing toward the plurality of slots, a wireless communication circuit, and conductive patches formed on the substrate and arranged to be aligned with the plurality of slots of the hinge housing, respectively. At least some of the conductive patches may be used to radiate signals from the wireless communication circuit through the plurality of slots.

[0005] A foldable electronic device is disclosed. The foldable electronic device may include a foldable housing including a first housing part and a second housing part. The foldable electronic device may include a hinge assembly rotatably connecting the first housing part and the second housing part. The foldable electronic device may include a hinge housing surrounding the hinge assembly, including a plurality of slots, and configured to be at least partially exposed to the outside of the foldable housing or surrounded by the foldable housing. The foldable electronic device may include a substrate mounted on the hinge housing toward the plurality of slots, a flexible display accommodated in the first housing part and the second housing part across the hinge assembly and configured to be partially bent by the hinge assembly, and a wireless communication circuit. The foldable electronic device may include a conductive portion disposed below the flexible display and used as a first antenna radiator for signals from the wireless communication circuit. The foldable electronic device may include a plurality of conductive patches formed on the substrate and aligned toward the plurality of slots of the hinge housing, the plurality of conductive patches being used as second antenna radiators for signals from the wireless communication circuit.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] Figure 2a illustrates an unfolded state of an exemplary electronic device.

[0008] Figure 2b illustrates a folded state of an exemplary electronic device.

[0009] Figure 2c is an exploded perspective view of an exemplary electronic device.

[0010] Figure 2d illustrates an unfolded state of an exemplary electronic device.

[0011] Figure 2e illustrates a folded state of an exemplary electronic device.

[0012] Figure 3 is a block diagram of an exemplary electronic device.

[0013] Figure 4 illustrates antennas of an exemplary electronic device under various conditions.

[0014] Figure 5a illustrates a power supply structure of an exemplary electronic device.

[0015] FIG. 5b illustrates a hinge housing of an exemplary electronic device.

[0016] FIG. 5c illustrates a second antenna of an exemplary electronic device.

[0017] Figures 6a and 6b illustrate radiation patterns formed by a second antenna of an exemplary electronic device.

[0018] Figure 7 illustrates a portion of an exemplary electronic device.

[0019] Fig. 8 is a flow chart of an exemplary electronic device for controlling antennas according to various states.

[0020] FIG. 9A is a graph showing the antenna gain of the first antenna of an exemplary electronic device according to various states.

[0021] FIG. 9b is a graph showing the antenna gain of the second antenna of an exemplary electronic device according to various states.

[0022] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0023] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0024] In the following description, terms referring to parts of electronic devices (e.g., substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device, housing, assembly), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member), terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, divider, coupler, combiner), etc. are examples for convenience of description. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... thing', '... body' used below may mean at least one shape structure or a unit that processes a function.

[0025] In addition, in the present disclosure, expressions such as "more than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled, but this is merely a description for expressing an example and does not exclude descriptions such as "more than" or "less than." A condition described as "more than" may be replaced with "more than," a condition described as "less than" may be replaced with "less than," and a condition described as "more than and less than" may be replaced with "more than and less than." In addition, hereinafter, "A" to "B" mean at least one of the elements from A (including A) to B (including B). hereinafter, "C" and / or "D" mean at least one of "C" or "D," that is, including {"C", "D", "C" and "D"}. hereinafter, the meaning of "about E" may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0026] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0028] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0029] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0030] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0035] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0036] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0040] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0045] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] Figure 2a illustrates an unfolded state of an exemplary electronic device. Figure 2b illustrates a folded state of an exemplary electronic device. Figure 2c is an exploded perspective view of an exemplary electronic device.

[0050] Referring to FIGS. 2A, 2B, and 2C, the electronic device (101) may include a housing (200), a flexible display (230) (e.g., the display module (160) of FIG. 1), or one or more cameras (240). The electronic device (101) exemplarily illustrated in FIGS. 2A to 2C may be referred to as a foldable electronic device in that it includes a foldable housing (200) and / or a flexible display (230), but embodiments supported by the present disclosure are not limited thereto.

[0051] The housing (200) may define the exterior surface of the electronic device (101). For example, the housing (200) may be a physical exterior surface of the electronic device (101) that is exposed to the outside and may accommodate components disposed inside the electronic device (101). At least some of the components for implementing the functions of the electronic device (101) may be disposed inside the housing (200). The housing (200) may include a first housing part (210), a second housing part (220), and a hinge assembly (250).

[0052] The first housing part (210) may include a first front surface (211), a first rear surface (212) opposite the first front surface (211), and a first side surface (213) (side exterior surface) that at least partially surrounds an edge of the first front surface (211) and an edge of the first rear surface (212). For example, the first front surface (211) may be referred to as a front exterior surface of the first housing part (210), and the first rear surface (212) may be referred to as a rear exterior surface of the first housing part (210). The first side surface (213) may be connected to a periphery of the first front surface (211) and an edge of the first rear surface (212). The first front surface (211), the first rear surface (212), and the first side surface (213) may form an interior space of the first housing part (210). For example, at least one component may be placed within a space surrounded by the first front (211), the first back (212), and the first side (213).

[0053] For example, the second housing part (220) may include a second front side (221), a second rear side (222) opposite the second front side (221), and a second side side (223) that at least partially surrounds an edge of the second front side (221) and an edge of the second rear side (222). For example, the second front side (221) may be referred to as the front side of the second housing part (220), and the second rear side (222) may be referred to as the rear side of the second housing part (220). The second side side (223) may be connected to an edge of the second front side (221) and an edge of the second rear side (222). The second front side (221), the second rear side (222), and the second side side (223) may form an interior space of the second housing part (220). For example, at least one component may be placed within a space surrounded by the second front (221), the second rear (222), and the second side (223).

[0054] The flexible display (230) may be configured to display visual information. For example, the flexible display (230) may include a display area including a plurality of pixels. For example, the active area may be referred to as an active area that displays visual information. For example, the flexible display (230) may define at least a portion of the front surface of the housing (200). For example, the flexible display (230) may at least partially form the first front surface (211) and the second front surface (221).

[0055] The flexible display (230) may include a first display portion (231), a second display portion (232), and a third display portion (233) disposed between the first display portion (231) and the second display portion (232). The electronic device (101) may further include a sub-display (235) distinct from the flexible display (230). The sub-display (235) may at least partially form the second rear surface (222) of the second housing part (220). The sub-display (235) may be referred to as a cover display.

[0056] One or more cameras (240) may be configured to acquire an image based on receiving light from a subject outside the electronic device (101). For example, the one or more cameras (240) may include first cameras (241), second cameras (242), and / or third cameras (243). For example, the first cameras (241) may be disposed within the first housing part (210). For example, the first housing part (210) may include at least one opening (241a) that overlaps the first cameras (241) when the electronic device (101) is viewed from above. The first cameras (241) may acquire an image based on receiving light from outside the electronic device (101) through the at least one opening (241a).

[0057] The second camera (242) may be positioned within the second housing part (220). The second housing part (220) may include at least one opening (242a) that overlaps the second camera (242) when the electronic device (101) is viewed from above. The second camera (242) may acquire an image based on receiving light from the outside of the electronic device (101) through the at least one opening (242a).

[0058] The third camera (243) may be positioned within the first housing part (210). For example, the first display portion (231) of the flexible display (230) may include at least one opening that overlaps the third camera (243) when the flexible display (230) is viewed from above. The third camera (243) may acquire an image based on receiving light from the outside of the flexible display (230) through the at least one opening.

[0059] The second camera (242) and the third camera (243) may be positioned below (e.g., in the -z direction) the flexible display (230) or the sub-display (235). For example, the second camera (242) and / or the third camera (243) may include an under-display camera (UDC) and / or a punch-hole camera.

[0060] The first housing part (210) and the second housing part (220) can be rotatably coupled. For example, the second housing part (220) can be rotatably coupled to the first housing part (210) via a hinge assembly (250).

[0061] The hinge assembly (250) can rotatably connect the first housing part (210) and the second housing part (220). The hinge assembly (250) can be positioned between the first housing part (210) and the second housing part (220) of the electronic device (101) so that the electronic device (101) can be folded. The hinge assembly (250) can change the electronic device (101) from an unfolded state to a folded state. The hinge assembly (250) can change the electronic device (101) from a folded state to an unfolded state. For example, the hinge assembly (250) can maintain the electronic device (101) in an intermediate state between the unfolded state and the folded state.

[0062] The unfolded state of the electronic device (101) may be referred to as a state in which the first direction in which the first display portion (231) faces and the second direction in which the second display portion (232) faces are substantially the same. The folded state of the electronic device (101) may be referred to as a state in which the first direction is substantially opposite to the second direction. When the electronic device (101) is in the folded state, the first housing part (210) and the second housing part (220) may be covered or overlapped.

[0063] When the electronic device (101) is in a folded state and an intermediate state, the first direction and the second direction may be different from each other. For example, when the electronic device (101) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the electronic device (101) is in an intermediate state, the first direction may form an angle (e.g., an angle greater than 0 degrees and less than 180 degrees) with respect to the second direction.

[0064] For example, the electronic device (101) may include at least one conductive portion (214a, 224a) and at least one non-conductive portion (214bb, 224b) included within the first side (213) and / or the third side (223). For example, the at least one conductive portion (214a, 224a) may be separated from other conductive portions within the first side (213) and / or the third side (223) by contacting the at least one non-conductive portion (214b, 224b). In one embodiment, the at least one conductive portion (214a, 224a) may operate as an antenna radiator to be used for communication with an external electronic device.

[0065] Referring to FIG. 2C, the hinge assembly (250) may include a hinge cover (251), a first hinge plate (252), a second hinge plate (253), and a plurality of hinge modules (254). The hinge cover (251) may at least partially surround the components of the hinge assembly (250) and form an outer surface of the hinge assembly (250). The hinge cover (251) may be at least partially exposed to the outside of the electronic device (101) through a space between the first housing part (210) and the second housing part (220) when the electronic device (101) is in a folded state. When the electronic device (101) is in an unfolded state, the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220) and may not be exposed to the outside of the electronic device (101).

[0066] The first hinge plate (252) and the second hinge plate (253) are operatively coupled to the first housing part (210) and the second housing part (220), respectively, thereby rotatably connecting the first housing part (210) and the second housing part (220). For example, the first hinge plate (252) may be operatively coupled to the first bracket (215) of the first housing part (210), and the second hinge plate (253) may be operatively coupled to the second bracket (227) of the second housing part (220). As the first hinge plate (252) and the second hinge plate (253) are operatively coupled to the first bracket (215) and the second bracket (227), respectively, the first housing part (210) and the second housing part (220) can be rotated according to the rotation of the first hinge plate (252) and the second hinge plate (253).

[0067] A plurality of hinge modules (254) can rotate the first hinge plate (252) and the second hinge plate (253). For example, the plurality of hinge modules (254) may include gears that are interlocked with each other and can rotate. The first hinge plate (252) and the second hinge plate (253) can rotate based on the rotational motion of the gears of the plurality of hinge modules (254).

[0068] The first housing part (210) may include a first bracket (215) and a rear cover (216). The first bracket (215) may be disposed inside the first housing part (210) and may support at least one component disposed inside the first housing part (210). The rear cover (216) may at least partially form the second rear surface (222) of the first housing part (210). For example, the second housing part (220) may include a second bracket (227). The second bracket (227) may be disposed inside the second housing part (220) and may support at least one component disposed inside the second housing part (220). For example, the sub-display (235) may be disposed below (e.g., in the -z direction) the second bracket (227).

[0069] In addition to the one or more cameras (240) described above, the electronic device (101) may include a plurality of electronic components for implementing various functions. For example, the electronic device (101) may include a first printed circuit board (261), a second printed circuit board (262), a flexible printed circuit board (263), and / or a battery (189). The electronic components described above are merely exemplary and are not limited thereto.

[0070] For example, the first printed circuit board (261) and the second printed circuit board (262) may each provide electrical connections between components within the electronic device (101). For example, the first printed circuit board (261) may be disposed within the first housing part (210), and the second printed circuit board (262) may be disposed within the second housing part (220). The first printed circuit board (261) may provide electrical connections between electronic components disposed within the first housing part (210). The second printed circuit board (262) may provide electrical connections between electronic components disposed within the second housing part (220). The flexible printed circuit board (263) may electrically connect the first printed circuit board (261) and the second printed circuit board (262). For example, a flexible printed circuit board (263) may extend from a first printed circuit board (261) across the hinge assembly (250) to a second printed circuit board (262). For example, the flexible printed circuit board (263) may at least partially overlap the hinge assembly (250).

[0071] The battery (189) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0072] The electronic device (101) may include a plurality of antennas (ANT1, ANT2, ANT3, or ANT4) to be used for communication with an external electronic device. For example, the electronic device (101) may include a main antenna (ANT1), a sub antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna for short-range wireless communication (ANT4). However, the present invention is not limited thereto.

[0073] Fig. 2d illustrates an unfolded state of an exemplary electronic device. Fig. 2e illustrates a folded state of an exemplary electronic device.

[0074] The electronic device (101) exemplarily illustrated and described in FIGS. 2d and 2e may include a housing (200) including a first housing part (210) and a second housing part (220) rotatable with respect to the first housing part (210), like the electronic device (101) exemplarily illustrated and described in FIGS. 2a to 2c. The electronic device (101) exemplarily illustrated and described in FIGS. 2d and 2e may be referred to as a foldable electronic device in that it includes a flexible display (230) including a third display portion (233) deformable by a hinge assembly (250) configured to rotate the second housing part (220) with respect to the first housing part (210), like the electronic device (101) exemplarily illustrated and described in FIGS. 2a to 2c. For example, the folding axis (f) of the electronic device (101) exemplarily illustrated and described in FIGS. 2d and 2e may be parallel to the x-axis, as illustrated. The folding axis (f) of the electronic device (101) exemplarily illustrated and described in FIGS. 2a to 2c may be parallel to the y-axis, which is orthogonal to the x-axis, unlike the electronic device (101) exemplarily illustrated and described in FIGS. 2d and 2e. However, the electronic device (101) exemplarily illustrated and described in FIGS. 2a to 2e is exemplary, and the electronic device (101) may have various foldable form factors (e.g., a multi-foldable electronic device). Hereinafter, the electronic device (101) exemplarily illustrated in FIGS. 2d and 2e will be described with reference to the description of the components having the same reference numerals in FIGS. 2a to 2c.

[0075] An electronic device (101) may include a housing (200) including a first housing part (210) and a second housing part (220), and a hinge structure (or hinge assembly) (250). The first housing part (210) may be rotatably connected to the hinge assembly (250). The first housing part (210) may be rotatable relative to the second housing part (220) via the hinge assembly (250). The second housing part (220) may be rotatably connected to the hinge assembly (250). The second housing part (220) may be rotatable relative to the first housing part (210) via the hinge assembly (250).

[0076] The first housing part (210) may include a first front surface (211), a first rear surface (212) facing away from the first front surface (211), and a first side surface (213) surrounding at least a portion of the first front surface (211) and the first rear surface (212). The first housing part (210) may provide a space for arranging components of the electronic device (101). The first housing part (210) may include a conductive material, a non-conductive material, or a combination thereof.

[0077] The second housing part (220) may include a second front side (221), a second rear side (222) facing and spaced from the second front side (221), and a second side side (223) surrounding at least a portion of the second front side (221) and the second rear side (222). The second housing part (220) may provide a space for arranging components of the electronic device (101).

[0078] The hinge assembly (250) may be connected to the first housing part (210) and the second housing part (220), respectively. For example, the hinge assembly (250) may include a first hinge plate (e.g., the first hinge plate (252) of FIG. 2C) and a second hinge plate (e.g., the second hinge plate (253) of FIG. 2C) configured to be rotatable. The first hinge plate may be connected to the first housing part (210), and the first housing part (210) may be rotated by the first hinge plate. The second hinge plate may be connected to the second housing part (220), and the second housing part (220) may be rotated by the second hinge plate.

[0079] The electronic device (101) can be folded or unfolded about a folding axis (f) passing through the hinge assembly (250) according to the rotation of the first housing part (210) and the second housing part (220). The hinge assembly (250) can be positioned between the first housing part (210) and the second housing part (220) so that the electronic device (101) can be folded about the folding axis (f).

[0080] The hinge assembly (250) may include a hinge cover (251) for covering an internal structure constituting the mechanism of the hinge structure. The hinge cover (251) may be exposed to the outside or covered by the first housing part (210) and the second housing part (220) depending on the degree to which the electronic device (101) is folded. For example, while the electronic device (101) is in a folded state (e.g., FIG. 2e), the hinge cover (251) may be at least partially exposed between the first housing part (210) and the second housing part (220). For example, while the electronic device (101) is in an unfolded state (e.g., FIG. 2d), the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220).

[0081] The electronic device (101) may include a flexible display (230) (e.g., the display module (160) of FIG. 1) arranged within a space provided by the first housing part (210) and the second housing part (220). For example, the flexible display (230) may be at least partially accommodated within a recess formed in a first front surface (211) of the first housing part (210) and a second front surface (221) of the second housing part (220). The flexible display (230) may include a first display portion (231) aligned with respect to the first housing part (210), a second display portion (232) spaced from the first display portion (231) and aligned with respect to the second housing part (220), and a third display portion (233) aligned with respect to the hinge assembly (250) and extending from the first display portion (231) to the second display portion (232). The first display portion (231), the second display portion (232), and the third display portion (233) may form a surface of the flexible display (230). The surface of the flexible display (230) may at least partially form a first front surface (211) of the first housing part (210) and a second front surface (221) of the second housing part (220). The first display portion (231), the second display portion (232), and the third display portion (233) may define a first display area, a second display area, and a third display area of ​​the flexible display (230), respectively, in which initial information may be displayed.

[0082] The electronic device (101) may include a sub-display (235) (e.g., the display module (160) of FIG. 1) disposed within the first housing part (210). The sub-display (235) may be visible through the second rear surface (222) of the first housing part (210).

[0083] The electronic device (101) may include a plurality of cameras (e.g., the camera module (180) of FIG. 1). For example, the electronic device (101) may include cameras (234, 236). The camera (234) may be positioned within the first housing part (210) so as to obtain an image through a portion of the first rear surface (212). The camera (236) may be positioned below the first display portion (231) of the flexible display (230). The camera (236) may be aligned with an opening that at least partially penetrates the first display portion (231) and obtain an image through the hole. The camera (236) may be positioned within a screen display area of ​​the flexible display (230), but is not limited thereto.

[0084] Hereinafter, the states of the electronic device (101) will be described. The electronic device (101) may include a plurality of states, including an unfolded state (e.g., FIG. 2d) and a folded state (e.g., FIG. 2e). The electronic device (101) may transform or change in the unfolded state and the folded state. In addition, the electronic device (101) may include a plurality of intermediate states between the unfolded state and the folded state. Depending on the state of the electronic device (101), the angle between the first housing part (210) and the second housing part (220) may vary.

[0085] Referring to FIG. 2D, in the unfolded state, the first housing part (210) and the second housing part (220) can form a first angle. For example, the first angle can be about 180 degrees. The first display part (231), the second display part (232), and the third display part (233) of the flexible display (230) can form a substantially flat surface. The direction in which the first front surface (211) of the first housing part (210) (or the first display part (231)) faces (e.g., the +z direction) and the direction in which the second front surface (221) of the second housing part (220) (or the second display part (232)) faces (e.g., the +z direction) can be substantially the same.

[0086] Referring to FIG. 2E, in the unfolded state of the electronic device (101), the first housing part (210) and the second housing part (220) can be folded to face each other by rotating around the folding axis (f). The first housing part (210) and the second housing part (220) can be overlapped to form a second angle smaller than the first angle. For example, the second angle can be about 0 degrees. The third display portion (233) of the flexible display (230) can be bent to correspond to the second angle. The first front surface (211) of the first housing part (210) can face the second front surface (221) of the second housing part (220) or overlap with the second front surface (221). The first housing part (210) and the second housing part (220) can be in at least partial contact, but are not limited thereto. The direction in which the first front surface (211) of the first housing part (210) faces (e.g., +z direction) and the direction in which the second front surface (221) of the second housing part (220) faces (e.g., -z direction) may be opposite to each other. In the unfolded state, at least a portion of the flexible display (230) may not be visible from the outside of the electronic device (101), and the sub-display (235) may be visible from the outside of the electronic device (101).

[0087] Hereinafter, one or more components to be described with reference to the drawings may be implemented together with components of the electronic device (101) described with reference to FIGS. 2A to 2E. The same reference numerals are assigned to components identical to those described above, and redundant descriptions may be omitted.

[0088] In this disclosure, relative terms such as "above" and "below" may be used to describe relative positions between components. For example, if the electronic device (101) depicted in the drawing is flipped over, "above" and "below" may be interchanged.

[0089] Figure 3 is a block diagram of an exemplary electronic device.

[0090] Referring to FIG. 3, an exemplary electronic device may include at least one processor (310), a wireless communication circuit (320) (e.g., the wireless communication module (192) of FIG. 1), at least one antenna (330), at least one sensor (340), and / or a switch (350). For example, the wireless communication circuit (320) may include a radio frequency integrated circuit (RFIC) (321) and an RF front end (RFFE) circuit (322).

[0091] At least one processor (310) may include at least one of an application processor (AP) or a communication processor (CP). For example, at least one processor (310) may generate a baseband signal. At least one processor (310) may control an RFIC (321) to process the generated baseband signal. At least one processor (310) may control an RFIC (321) to transmit a transmission signal through at least one antenna (330). At least one processor (310) may control an RFIC (321) to transmit the transmission signal in a frequency band capable of communicating with an external electronic device.

[0092] According to an exemplary embodiment, the RFIC (321) may be implemented as a single chip or as part of a single package. The RFIC (321) may include a digital to analog converter (DAC) (321a) for converting a digital signal to an analog signal. The RFIC (321) may include a mixer (321b) and an oscillator (e.g., a local oscillator (LO)) (321c) for up-conversion. The RFIC (321) may convert a baseband signal generated by at least one processor (310) into an RF signal. The RFIC (321) may include an analog to digital converter (ADC) (321d) for converting an analog signal to a digital signal. The RFIC (321) may include a mixer (321e) and an oscillator (321f) for down-conversion. The RFIC (321) can convert an RF signal received from at least one antenna (330) into a baseband signal so that it can be processed by at least one processor (310).

[0093] The RFFE circuit (322) may include a plurality of components electrically connected between the RFIC (321) and each of the antennas. For example, the RFFE circuit (322) may include, but is not limited to, components such as a coupler, a power amplifier (PA), a low noise amplifier (LNA), a switch circuit, and / or a duplexer.

[0094] The wireless communication circuit (320) may be configured to communicate with an external electronic device (e.g., electronic device (102) of FIG. 1) using a signal on a designated frequency band. For example, at least one antenna (330) may be used to transmit and / or receive a signal on a designated frequency band. For example, at least one antenna (330) may include a feed point to which a feed signal provided from an RFIC (321) is provided and a ground point electrically connected to the ground. At least one antenna (330) may include an antenna radiator, which is a physical component for radiating or receiving electromagnetic waves. The shape and characteristics of the antenna (e.g., frequency characteristics of the antenna) may be determined by the antenna radiator.

[0095] The electronic device (101) may utilize at least one antenna (330). For example, the at least one antenna (330) may have various operating frequencies. The at least one antenna (330) may transmit and / or receive a signal corresponding to the operating frequency. As the frequency band covered by the electronic device (101) increases, the number of at least one antenna (330) included in the electronic device (101) may increase. For example, the at least one antenna (330) may include a first antenna (331) or a second antenna (332). The electronic device (101) may perform a multiple-input and multiple-output (MIMO) operation, for example, using the first antenna (331) and the second antenna (332).

[0096] For example, referring also to FIG. 2C, the first antenna (331) may be implemented as a part of the housing (200) disposed under the flexible display (230) (or as a part of the flexible display (230)). For example, the first antenna (331) may be implemented by having a conductive portion (e.g., conductive portion (450) of FIG. 4) disposed under the flexible display (230) for radiating RF signals through the flexible display (230), such as the antennas (ANT1, ANT2, ANT3, ANT4) of FIG. 2C. However, the embodiments supported by the present disclosure are not limited thereto.

[0097] For example, as exemplarily illustrated and described in FIGS. 2A to 2E, the electronic device (101) may include a hinge assembly (250) that rotatably couples the first housing part (210) and the second housing part (220), and a flexible display (230) configured to be partially bent by the hinge assembly. As exemplarily illustrated and described in FIGS. 2B and 2E, since the display portions (231, 232) of the flexible display (230) are arranged to face each other within the folded state of the electronic device (101), the performance of the first antenna (331) for radiating RF signals through the flexible display (230) may be degraded. In addition, since the electronic device (101) has a plurality of hinge modules (254) disposed between the first housing part (210) and the second housing part (220), it may be difficult to use a portion of the edge of the first housing part (210) and a portion of the edge of the second housing part (220) adjacent to the plurality of hinge modules (254) as an antenna radiator. In order to make it easy for a user to carry the electronic device (101), the size of the first housing part (210) and the size of the second housing part (220) may each be relatively small. Since the first housing part (210) and the second housing part (220) having relatively small sizes have limited space for mounting electronic components, there may be insufficient space for arranging at least one antenna (330).

[0098] The electronic device (101) may implement a second antenna (332) through a hinge housing (e.g., hinge cover (251) of FIG. 2B, hinge housing (410) of FIG. 4) for protecting a hinge assembly (250) that rotatably connects a first housing part (210) and a second housing part (220). For example, a feeding structure (e.g., feeding structure (401) of FIG. 4) for feeding an RF signal may be mounted on the hinge housing (410) in which no electronic components are arranged within the housing (200). The feeding structure (401) may include, for example, antenna radiators (e.g., a plurality of conductive patches (440) of FIG. 4) for radiating an RF signal through the hinge housing (410). Through the exemplary city of FIG. 4, the structure of the hinge housing (410) for providing the second antenna (332) and the power supply structure (401) mounted within the hinge housing (410) are exemplarily explained.

[0099] At least one sensor (340) may be operatively coupled to at least one processor (310). Referring to FIGS. 2A-2E together, the at least one sensor (340) may be configured to detect an angle between the first housing part (210) and the second housing part (220). For example, the at least one sensor (340) may be positioned within the first housing part (210). The second housing part (220) may include at least one magnet configured to interact with the at least one sensor (340). While the second housing part (220) is rotated relative to the first housing part (210) by the hinge assembly (250), the at least one sensor (340) may be configured to detect the angle between the first housing part (210) and the second housing part (220) by detecting a change in a magnetic field formed from the at least one magnet. The at least one sensor may include a hall sensor, but embodiments supported by the present disclosure are not limited thereto.

[0100] The switch (350) may be configured to selectively connect the wireless communication circuit (320) to at least one of the antennas (331, 332) or to all of the antennas (331, 332). The switch (350) may be used to select and / or switch signals in various frequency bands from the wireless communication circuit (320) or to select and / or switch which of the antennas (331, 332) to use depending on the state of the electronic device (101) (e.g., the unfolded state (101a) and the folded state (101b) of FIG. 4). For example, the switch (350) may connect the wireless communication circuit (320) and the first antenna (331) so as to transmit and receive signals from the wireless communication circuit (320) via the first antenna (331) using the flexible display (230) in the unfolded state of the electronic device (101). For example, the switch (350) may connect the wireless communication circuit (320) and the second antenna (332) to transmit and receive signals from the wireless communication circuit (320) via the second antenna (332) using the hinge housing (410) within the folded state of the electronic device (101). The switch (350) may be referred to as a single pole double throw (SPDT) switch in that it is capable of connecting one common input terminal (e.g., the wireless communication circuit (320)) to one of two output terminals (e.g., the antennas (331, 332)), but embodiments supported by the present disclosure are not limited thereto.

[0101] For example, at least one processor (310) may be configured to identify an angle between the first housing part (210) and the second housing part (220) through at least one sensor (340). The at least one processor (310) may control the wireless communication circuit (320) to transmit and receive a signal through one of the antennas (331, 332) or to transmit and receive a signal through both of the antennas (331, 332) based on the angle identified through the at least one sensor (340) depending on the state of the electronic device (101). Control operations of the at least one processor (310) depending on the state of the electronic device (101) are described through the exemplary illustration of FIG. 8.

[0102] Figure 4 illustrates antennas of an exemplary electronic device under various conditions.

[0103] Referring to FIG. 4, the electronic device (101) may include a housing (200) including a first housing part (210) and a second housing part (220). The electronic device (101) may include a hinge assembly (250) that rotatably couples the first housing part (210) and the second housing part (220). The electronic device (101) may include a hinge housing (410) (e.g., a hinge cover (251) of FIG. 2B) and a feeding structure (401) mounted on the hinge housing (410). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIG. 4 may include structures and / or configurations exemplarily illustrated and described in FIGS. 2A to 3. Additionally, in the following description, redundant descriptions of structures and / or configurations having the same reference numerals as exemplarily described in FIGS. 2A to 3 may be omitted.

[0104] The electronic device (101) may include a flexible display (230) that is accommodated in a first housing part (210) and a second housing part (220) across a hinge assembly (250) and configured to be partially bent by the hinge assembly (250). For example, the flexible display (230) may include a first display portion (231), a second display portion (232) spaced apart from the first display portion (231), and a third display portion (233) that connects the first display portion (231) and the second display portion (232) and is configured to be folded by the hinge assembly (250).

[0105] The unfolded state (101a) of the electronic device (101) may be a state in which the first display portion (231) and the second display portion (232) of the flexible display (230) face the same direction (e.g., +z direction). For example, the housing (200) may include a first front surface (e.g., the first front surface (211) of FIG. 2A) on which the first display portion (231) is disposed, and a second front surface (e.g., the second front surface (221) of FIG. 2A) on which the second display portion (232) is disposed. The unfolded state (101a) may be a state in which the first front surface (211) and the second front surface (221) are disposed in substantially the same direction. For example, the unfolded state (101a) may be a state in which the flexible display (230) is unfolded. The above unfolded state (101a) may be a state in which the first display portion (231), the second display portion (232), and the third display portion (233) of the flexible display (230) form a substantially flat surface.

[0106] The folded state (101b) of the electronic device (101) may be a state in which the first display portion (231) and the second display portion (232) of the flexible display (230) face each other. For example, the folded state (101b) may be a state in which the direction in which the first display portion (231) faces (e.g., -x direction) is opposite to the direction in which the second display portion (232) faces (e.g., +x direction). For example, the folded state (101b) may be a state in which the direction in which the first front surface (211) on which the first display portion (231) is disposed is opposite to the direction in which the second front surface (221) on which the second display portion (232) is disposed is opposite. For example, the folded state (101b) may be a state in which the first display portion (231) and the second display portion (232) are in contact by folding the third display portion (233).

[0107] For example, in the unfolded state (101a) of the electronic device (101), the first display portion (231) may face substantially the same direction (e.g., +z direction) as the second display portion (232). For example, in the folded state (101b) of the electronic device (101), the first display portion (231) may face the second display portion (232). For example, the first display portion (231) may contact the second display portion (232) in the folded state (101b). For example, the first display portion (231) and the second display portion (232) may form substantially a plane in the unfolded state (101a) of the electronic device (101) and the folded state (101b) of the electronic device (101). For example, the first display portion (231) and the second display portion (232) may be non-deformable portions of the flexible display (230).

[0108] For example, the third display portion (233) may extend from the first display portion (231) to the second display portion (232). For example, the third display portion (233) may be positioned between the first display portion (231) and the second display portion (232). For example, the third display portion (233) may be configured to rotate the second display portion (232) relative to the first display portion (231) by being deformed.

[0109] The hinge housing (410) can surround the hinge assembly (250). The hinge housing (410) can include a plurality of slots (420). The hinge housing (410) can be at least partially exposed to the outside of the housing (200) within the folded state (101b) of the electronic device (101). For example, the hinge assembly (250) can be covered by the hinge housing (410) within the folded state (101b) of the electronic device (101) by being seated in the hinge housing (410). For example, the hinge housing (410) can be positioned within the housing (200) by being surrounded by the first housing part (210) and the second housing part (220) within the unfolded state (101a) of the electronic device (101). The hinge housing (410) may be at least partially exposed to the outside of the housing (200) by the first housing part (410) and the second housing part (220) sliding relative to the hinge housing (410) while the electronic device (101) changes from the unfolded state (101a) to the folded state (101b). However, the embodiments supported in the present disclosure are not limited thereto.

[0110] For example, a plurality of slots (420) may penetrate the hinge housing (410). The plurality of slots (420) may be formed in the hinge housing (410) so as to be at least partially exposed to the outside of the housing (200) within the folded state (101b) of the electronic device (101). For example, the plurality of slots (420) may be arranged in the longitudinal direction of the hinge housing (410) (e.g., +x direction or -x direction) of the hinge housing (410). For example, the plurality of slots (420) may be used to radiate signals from a wireless communication circuit (e.g., the wireless communication circuit (320) of FIG. 3). The length and / or position of the plurality of slots (420) may determine the frequency characteristics of the signals radiated through the plurality of slots (420).

[0111] The power supply structure (401) may include a substrate (430) that is mounted on a hinge housing (410) toward a plurality of slots (420). The electronic device (101) may include conductive patches (440) formed on the substrate (430) and arranged to be aligned with each of the plurality of slots (420).

[0112] For example, the feed structure (401) may be mounted in the hinge housing (410) within the housing (200). The feed structure (401) may be configured to transmit signals to at least some of the plurality of conductive patches (440) that function as antenna radiators through a feed system (e.g., the plurality of feed lines (520) of FIG. 5A) within the feed structure (401). For example, the feed structure (401) may be positioned toward the plurality of slots (420) such that signals from the plurality of conductive patches (440) are radiated through the plurality of slots (420). For example, the feed structure (401) may be mounted in the hinge housing (410) so as to face the plurality of slots (420) of the hinge housing (410). However, the embodiments supported in the present disclosure are not limited thereto.

[0113] For example, the substrate (430) can provide mounting surfaces for components of the power supply structure (401) (e.g., a plurality of conductive patches (440), a plurality of conductive vias (510) of FIG. 5A, a plurality of power supply lines (520), a connector (550)). For example, the substrate (430) can be formed from a dielectric material. By being formed from the dielectric material, the substrate (430) can support the propagation of electromagnetic waves formed from the plurality of conductive patches (440). For example, the substrate (430) can be formed into a structure in which a plurality of layers (e.g., a plurality of layers (530) of FIG. 5A) are laminated through a low temperature co-fired ceramic (LTCC) process, but embodiments supported by the present disclosure are not limited thereto. For example, the substrate (430) may be mounted on the hinge housing (410) such that the plurality of conductive patches (440) on the substrate (430) are arranged toward the plurality of slots (420) of the hinge housing (410). For example, the substrate (410) may be coupled or attached to the hinge housing (410) such that the plurality of slots (420) are oriented within the housing (200). However, the embodiments supported by the present disclosure are not limited thereto.

[0114] For example, the plurality of conductive patches (440) may be configured to radiate signals supplied from the wireless communication circuit (320) to the plurality of conductive patches (440) through the feeding structure (401). For example, the plurality of conductive patches (440) may be configured to radiate electromagnetic waves corresponding to signals supplied to the plurality of conductive patches (440) through the edges of each of the plurality of conductive patches (440) based on power supplied to the plurality of conductive patches (440) through the feeding structure (401). The signal characteristics of the signals radiated from the plurality of conductive patches (440) may be determined by the size (e.g., length, width, and / or height) of the plurality of conductive patches (440). For example, the shape of each of the plurality of conductive patches (440) may have a rectangular shape, but the embodiments supported in the present disclosure are not limited thereto.

[0115] For example, a plurality of conductive patches (440) may be formed on the substrate (430) so as to be aligned below the plurality of slots (420) so as to radiate signals applied to the plurality of conductive patches (440) through the plurality of slots (420). For example, the plurality of conductive patches (440) may be arranged toward the plurality of slots (420) corresponding to each of the plurality of conductive patches (440). For example, the plurality of conductive patches (440) may be arranged on the substrate (430) in substantially the same direction as the direction in which the plurality of slots (420) are arranged (e.g., the +x direction or the -x direction). For example, the plurality of conductive patches (440) may be formed on or attached to a portion of the substrate (430) facing the plurality of slots (420). However, the embodiments supported in the present disclosure are not limited thereto.

[0116] At least some of the plurality of conductive patches (440) may be used to radiate signals from the wireless communication circuit (320) of the electronic device (101) through the plurality of slots (420). For example, referring also to FIG. 3, at least some of the plurality of conductive patches (440) may function as an antenna radiator of a second antenna (332) that utilizes the hinge housing (410) (or the plurality of slots (420)). For example, the plurality of conductive patches (440) may radiate electromagnetic waves based on power supplied to the plurality of conductive patches (440) through the power supply structure (401). The plurality of slots (420) respectively aligned on the plurality of conductive patches (440) may be configured to receive or re-radiate the electromagnetic waves from the plurality of conductive patches (440). For example, the feeding structure (401) (or the plurality of conductive patches (440)) and the plurality of slots (420) (or the hinge housing (410)) may be configured to radiate signals from the wireless communication circuit (320) via coupling feeding. However, the embodiments supported in the present disclosure are not limited thereto.

[0117] The electronic device (101) may include a conductive portion (450) positioned under the flexible display (230). The conductive portion (450) may be used to radiate signals from a wireless communication circuit (320) of the electronic device (101) through the flexible display (230).

[0118] For example, the flexible display (230) may be referred to as a display stack or display structure in which a plurality of layers are combined. The conductive portion (450) may be a portion formed in one of the plurality of layers of the flexible display (230). For example, the conductive portion (450) may be a portion of a housing (200) disposed under the flexible display (230). However, the embodiments supported in the present disclosure are not limited thereto.

[0119] For example, the conductive portion (450) may be configured to radiate signals supplied to the conductive portion (450) from the wireless communication circuit (320) through the flexible display (230). For example, the conductive portion (450) may be configured to radiate electromagnetic waves corresponding to signals applied to the conductive portion (450) based on the power supplied to the conductive portion (450). The signal characteristics of the signals radiated from the conductive portion (450) may be determined by the size of the conductive portion (450). For example, referring also to FIG. 3, the conductive portion (450) may function as an antenna radiator of a first antenna (331) using the flexible display (230). However, the embodiments supported in the present disclosure are not limited thereto.

[0120] For example, in the unfolded state (101a) of the electronic device (101), the hinge housing (410) may be covered by the housing parts (210, 220). By utilizing the large area of ​​the unfolded flexible display (230) in the unfolded state (101a), the first antenna (331) implemented as the conductive portion (450) may have improved antenna gain for radiating signals from the wireless communication circuit (320). For example, in the folded state (101b) of the electronic device (101), the hinge housing (410) may be at least partially exposed to the outside of the housing (200). The second antenna (332) implemented with a plurality of slots (420) of the hinge housing (410) exposed to the outside within the folded state (101b) and / or a plurality of conductive patches (440) respectively aligned below the plurality of slots (420) can have improved antenna gain for radiating signals from the wireless communication circuit (320).

[0121] For example, although not shown, the electronic device (101) may be in a plurality of intermediate states between the unfolded state (101a) and the folded state (101b). Within the plurality of intermediate states, the electronic device (101) may be configured to utilize a first antenna (331) implemented as a conductive portion (450) and a second antenna (332) implemented as a plurality of slots (420) and a plurality of conductive patches (440) together, thereby improving the antenna gain of the electronic device (101).

[0122] Figure 5a illustrates a power supply structure of an exemplary electronic device. Figure 5b illustrates a hinged housing of an exemplary electronic device. Figure 5c illustrates a second antenna of an exemplary electronic device.

[0123] Referring to FIGS. 5A, 5B, and 5C, the electronic device (101) may include a housing (e.g., housing (200) of FIG. 2A) including a first housing part (e.g., first housing part (210) of FIG. 2A) and a second housing part (e.g., second housing part (220) of FIG. 2A). The electronic device (101) may include a hinge assembly (e.g., hinge assembly (250) of FIG. 2C) that rotatably couples the first housing part (210) and the second housing part (220). The electronic device (101) may include a hinge housing (410) (e.g., a hinge cover (251) of FIG. 2b) that surrounds the hinge assembly (250), includes a plurality of slots (420), and is at least partially exposed to the outside of the housing (200) in a folded state of the electronic device (101) (e.g., a folded state (101b) of FIG. 4). The electronic device (101) may include a feeding structure (401) mounted on the hinge housing (410). The feeding structure (401) may include a substrate (430) mounted on the hinge housing (410) toward the plurality of slots (420), and a plurality of conductive patches (440) formed on the substrate (430) and arranged to be aligned toward the plurality of slots (420), respectively. The electronic device (101) may include a wireless communication circuit (e.g., the wireless communication circuit (320) of FIG. 3). At least some of the plurality of conductive patches (440) may be used to radiate signals from the wireless communication circuit (320) through the plurality of slots (420). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIGS. 5A, 5B, and 5C may include structures and / or configurations exemplarily illustrated and described in FIGS. 2A to 4.Additionally, in the following description, redundant descriptions of structures and / or configurations having the same reference numerals as those exemplarily described in FIGS. 2A to 4 may be omitted.

[0124] Referring to FIG. 5a, a power supply structure (401) for radiating signals from a wireless communication circuit (320) using a hinge housing (410) is exemplarily illustrated.

[0125] The substrate (430) may include a plurality of layers (530), including a first layer (431) defining a first side (430a) of the substrate (430) facing the plurality of slots (420), and a second layer (432) defining a second side (430b) of the substrate (430) opposite the first side (430a) and providing a ground for the substrate (430). A plurality of conductive patches (440) may be disposed on one layer between the first layer (431) and the second layer (432) of the plurality of layers (530). For example, the plurality of layers (530) may each be formed from a dielectric material. Conductive structures (e.g., a plurality of conductive patches (440), a plurality of conductive vias (510)) may be formed or disposed on at least some of the plurality of layers (530). For example, a stack structure of multiple layers (530) may be referred to as a substrate integrated waveguide (SIW) structure in that it is a structure in which multiple feed lines (520) are arranged for feeding power to at least some of the multiple conductive patches (440), but the embodiments supported in the present disclosure are not limited thereto.

[0126] For example, the first layer (431) may face the plurality of slots (420) of the hinge housing (410). For example, the first layer (431) may be an upper-most layer of the substrate (430). For example, the first surface (431a) of the substrate (430) defined by the first layer (431) may be in contact with the first metal portion (411) of the hinge housing (410). For example, the first layer (431) may be formed from a dielectric material. The first layer (431) may be provided as a dielectric substrate for supporting electromagnetic waves from the plurality of conductive patches (440) to the plurality of slots (420) by being disposed between the plurality of slots (420) and the plurality of conductive patches (440). However, the embodiments supported in the present disclosure are not limited thereto.

[0127] For example, the second layer (432) can be connected to the ground of the electronic device (101) to radiate noise generated from conductive structures (e.g., a plurality of conductive patches (440), a plurality of conductive vias (510), a plurality of power supply lines (520)) disposed on the substrate (430) to the ground. For example, the second layer (432) can be a bottom-most layer of the substrate (430). For example, the second surface (430b) of the substrate (430) defined by the second layer (432) can be in contact with the third metal portion (413) of the hinge housing (410). For example, the second layer (432) can be formed from a metal material. The second layer (432) can emit noise generated from the power supply structure (401) through the third metal portion (413) by coming into contact with the third metal portion (413) of the hinge housing (410) that functions as a ground. However, the embodiments supported in the present disclosure are not limited thereto.

[0128] For example, a plurality of conductive patches (440) may be disposed on a third layer (433) between a first layer (431) and a second layer (432). The third layer (433) may be, for example, a layer attached directly below the first layer (431). For example, the plurality of conductive patches (440) may be arranged on one side of the third layer (433) facing the plurality of slots (420). However, the embodiments supported in the present disclosure are not limited thereto.

[0129] The plurality of conductive patches (440) may include dummy patches (441) and signal patches (442) shielded by the dummy patches (441). For example, the dummy patches (441) may include a first dummy patch (441a) and a second dummy patch (441b) spaced apart from the first dummy patch (441a). The signal patches (442) may be arranged between the first dummy patch (441a) and the second dummy patch (441b). The signal patches (442) may be used to radiate signals from the wireless communication circuit (320).

[0130] For example, dummy patches (441) may be arranged at both ends of an array structure of a plurality of conductive patches (440). For example, the dummy patches (441) may be patches among the plurality of conductive patches (440) that do not function as antenna radiators. The dummy patches (441) may not be connected to the plurality of feed lines (520). For example, the signal patches (442) may be positioned between the first dummy patch (441a) and the second dummy patch (441b). For example, referring to FIG. 5c together, the dummy patches (441a, 441b) may be aligned below the slots (425, 426) corresponding to the dummy patches (441a, 441b), respectively. The plurality of conductive patches (440) can reduce lobe tilting of signals radiated from signal patches (442) and provide isotropic beam forming from the signals by including dummy patches (441) arranged at both ends of the array structure of the plurality of conductive patches (440).

[0131] The signal patches (442) may be arranged along a plurality of slots (420) between the dummy patches (441). The signal patches (442) may each be connected to a plurality of feed lines (520). For example, the signal patches (442) may each function as an antenna radiator that radiates electromagnetic waves based on power provided from the plurality of feed lines (520). For example, referring also to FIG. 5c, the signal patches (442a, 442b, 442c, 442d) may be aligned below the slots (421, 422, 423, 424) corresponding to the signal patches (442a, 442b, 442c, 442d), respectively. For example, signal patches (442a, 442b, 442c, 442d) can be used to radiate signals from the wireless communication circuit (320) through slots (421, 422, 423, 424) corresponding to each of the signal patches (442a, 442b, 442c, 442d), thereby providing a relatively wide bandwidth of the signals (e.g., 700 MHz to 28 GHz or 500 MHz to 37 GHz). However, the embodiments supported by the present disclosure are not limited thereto.

[0132] The power supply structure (401) may include a plurality of conductive vias (510) that each penetrate at least a portion of a plurality of layers (530) of the substrate (430) and surround each of the plurality of conductive patches (440) to shield each of the plurality of conductive patches (440) from each other. For example, at least some of the plurality of conductive vias (510) may surround each of the plurality of conductive patches (440) by penetrating a third layer (433) on which the plurality of conductive patches (440) are arranged. For example, the plurality of conductive vias (510) may form a via wall (515) that shields each of the plurality of conductive patches (440) from each other. The via wall (515) can reduce interference between signal patches (442) and noise of signals from the signal patches (442), for example, by isolating the signal patches (442) used as antenna radiators from each other. For example, the via wall (515) can be referred to as a via fence or a picket fence.

[0133] For example, although not shown, the plurality of conductive vias (510) may shield the plurality of feed lines (520) that are connected to the signal patches (442) and penetrate at least some of the plurality of layers (530) of the substrate (430) from each other. For example, at least some of the plurality of conductive vias (510) may form a via wall that shields each of the feed lines (521, 522, 523, 524) that extend from the signal patches (442a, 442b, 442c, 442d). The plurality of conductive vias (510) may shield the plurality of feed lines (520) from each other within the feed structure (401), thereby reducing electromagnetic interference and / or noise to RF signals transmitted through the plurality of feed lines (520). However, the embodiments supported by the present disclosure are not limited thereto.

[0134] The power supply structure (401) may include a connector (550) that is arranged on a first surface (430a) facing the plurality of slots (420) of the substrate (430) and is configured to electrically connect the substrate (430) (or the power supply structure (401)) and the wireless communication circuit (320). For example, the connector (550) may be electrically connected to the wireless communication circuit (320) through a flexible printed circuit board (or a CTC (connector to connector) structure) that connects the connector (550) to a connector on a printed circuit board (e.g., the first printed circuit board (261) of FIG. 2C) on which the wireless communication circuit (320) is arranged. However, the embodiments supported in the present disclosure are not limited thereto. For example, although not shown, instead of the connector (550), a wireless communication circuit (320) or a part of the wireless communication circuit (320) (e.g., RFIC (321) and / or RFFE circuit (322) of FIG. 3) may be disposed on the substrate (430). By disposing the wireless communication circuit (320) and / or a part of the wireless communication circuit (320) on the substrate (430), the power supply structure (401) may be provided as an antenna module. However, the embodiments supported in the present disclosure are not limited thereto.

[0135] The feeding structure (401) may include a plurality of feeding lines (520) that are shielded from each other by a plurality of conductive vias (510) and extend from each of the plurality of conductive patches (440) to the connector (550) by penetrating at least some of the plurality of layers (530) of the substrate (430). For example, the plurality of feeding lines (520) may connect the signal patches (442) and the connector (550) by penetrating at least some of the plurality of layers (530) of the substrate (430). The plurality of feeding lines (520) may be surrounded by a plurality of conductive vias (510) penetrating at least some of the plurality of layers (530). For example, the feed lines (521, 522, 523, 524) can transmit signals transmitted from the wireless communication circuit (320) via the connector (550) to signal patches (442a, 442b, 442c, 442d) connected to each of the feed lines (521, 522, 523, 524). For example, the plurality of feed lines (520) can be referred to as strip transmission lines and / or microstrip transmission lines, but the embodiments supported in the present disclosure are not limited thereto.

[0136] Referring to FIG. 5B, an exemplary hinge housing (410) is illustrated. The hinge housing (410) may include a first metal portion (411) having a flat shape and disposed on a plurality of conductive patches (440), a second metal portion (412) extending from the first metal portion (411) and at least partially curved, and a third metal portion (413) extending from the second metal portion (412) toward the interior of the housing (200). A power supply structure (401) (or substrate (430)) may be disposed between the first metal portion (411) and the third metal portion (413).

[0137] The first metal portion (411) may be a portion that receives current radiated from a plurality of conductive patches (440). The first metal portion (411) may be disposed on or in contact with a first surface (430a) facing a plurality of slots (420) of the substrate (430). For example, some of the plurality of slots (420) may be formed on the first metal portion (411). Some of the plurality of slots (420) may be respectively aligned on the plurality of conductive patches (440). For example, the first metal portion (411) may support the radiating of an RF signal from the plurality of conductive patches (440) through the plurality of slots (420) by coupling the current radiated from the plurality of conductive patches (440). The above first metal portion (411) may be referred to as a coupling metal in terms of coupling the current radiated from the plurality of conductive patches (440), but the embodiments supported in the present disclosure are not limited thereto.

[0138] The second metal portion (412) may be connected to the first metal portion (411) or formed as an integral part thereof. For example, some of the plurality of slots (420) may be formed in the first metal portion (411). Some of the remaining plurality of slots (420) may be formed in the second metal portion (412) extending from the first metal portion (411). For example, the second metal portion (412) may be a portion from which signals transmitted from the plurality of conductive patches (440) to the first metal portion (411) are radiated.

[0139] For example, the plurality of slots (420) may include first portions (420a) that are aligned over the plurality of conductive patches (440) and formed on the first metal portion (411) and thus have a flat shape, and second portions (420b) that extend from the first portions (420a) and are formed on the second metal portion (412) and thus have a curved shape. The second portions (420b) may be used to radiate signals supplied from the plurality of conductive patches (440) to the first portions (420a).

[0140] For example, the first portions (420a) may be respectively aligned on a plurality of conductive patches (440) to couple currents radiated from the plurality of conductive patches (440) or to concentrate the currents onto the first portions (420a). For example, the second portions (420b) may be configured to receive the currents concentrated onto the first portions (420a) from the first portions (420a) and to radiate signals by the currents. For example, the second portions (420b) may be formed on a portion of the second metal portion (412) that extends and bends from the first metal portion (411) and has a curved shape, thereby having a longer length than the first portions (420a). The above second portions (420b) have a curved shape, thereby providing a relatively wide side radiation range of signals through the curved portion of the hinge housing (410).

[0141] For example, the plurality of slots (420) may include third portions (420c) extending from the second portions (420b) and having a flat shape. The third portions (420c) may be formed on the second metal portion (412) of the hinge housing (410). The third portions (420c) may be arranged at both ends of the second portions (420b) and have a flat shape together with the first portions (420a), thereby determining the resonance of signals radiated from the second portions (420b) or using them for impedance matching of the signals. However, the embodiments supported in the present disclosure are not limited thereto. The profile of the plurality of slots (420) arranged in the first metal portion (411) and the second metal portion (412) can be changed according to the characteristics of signals radiated through the plurality of slots (420).

[0142] The third metal portion (413) can support the substrate (430). The third metal portion (413) can provide a ground to the substrate (430) by making contact with the power supply structure (401) (or the substrate (430)). For example, the third metal portion (413) can provide a path through which a current transmitted from the first metal portion (411) to the second metal portion (412) is discharged. The third metal portion (413) can discharge the current to the ground of the electronic device (101), thereby providing a stable current flow from the power supply structure (401) to the hinge housing (410). For example, the third metal portion (413) can make contact with the second layer (432) of the substrate (430), thereby discharging noise of the power supply structure (401) that is discharged from the second layer (432) to the ground. For example, the third metal portion (413) may secure the substrate (430) to the hinge housing (410) together with the first metal portion (411). The third metal portion (413) may be referred to as a ground metal in that it provides a ground for the power supply structure (401) or the hinge housing (410), but the embodiments supported in the present disclosure are not limited thereto.

[0143] Referring to FIG. 5c, a plurality of slots (420) of the hinge housing (410) may be arranged to be aligned with a plurality of conductive patches (440) of the feed structure (401), respectively. The plurality of slots (420) may be located, for example, at a portion where the current distribution of the LTCC patch antenna using the hinge housing (410) and the plurality of conductive patches (440) is strongest. However, the embodiments supported in the present disclosure are not limited thereto.

[0144] The second metal portion (412) of the hinge housing (410) may be positioned perpendicular to each of the plurality of conductive patches (440) of the feed structure (401) or positioned at a 90 degree difference from the plurality of conductive patches (440) to couple the electric field and magnetic field of the antenna to the plurality of slots (420), thereby allowing a relatively wide lateral radiation of the antenna on the curved surface of the second metal portion (412).

[0145] The plurality of conductive patches (440) may each have a first width (w1). The plurality of slots (420) may have a second width (w2) smaller than the first width (w1). The plurality of conductive patches (440) may have substantially the same first width (w1) as each other, thereby providing stability and / or isotropy of signals radiated from signal patches (442) among the plurality of conductive patches (440). The plurality of slots (420) may have substantially the same second width (w2) as each other, thereby providing stability and / or isotropy of signals transmitted from the plurality of conductive patches (440). For example, since the second width (w2) of each of the plurality of slots (420) is smaller than the first width (w1) of each of the plurality of conductive patches (440), each of the plurality of slots (420) may be aligned to overlap a central portion of each of the plurality of conductive patches (440). However, the embodiments supported by the present disclosure are not limited thereto.

[0146] The plurality of conductive patches (440) may be spaced apart from each other by a first gap width (g1). The plurality of slots (420) may be spaced apart from each other by a second gap width (g2) that is larger than the first gap width (g1). For example, the plurality of conductive patches (440) may be spaced apart from each other by the same first gap width (g1), thereby reducing interference of signals radiated from the plurality of conductive patches (440) and providing isotropy of the signals. For example, the plurality of slots (420) may be spaced apart from each other by the same second gap width (g2), thereby providing stability of signals radiated from the plurality of conductive patches (440) through the plurality of slots (420). The second gap width (g2) at which the plurality of slots (420) are spaced apart from each other may be determined, for example, by the wavelength of signals radiated from the plurality of conductive patches (440) through the plurality of slots (420). The second gap width (g2) may have a length corresponding to half of the wavelength, but the embodiments supported by the present disclosure are not limited thereto.

[0147] Figures 6a and 6b illustrate radiation patterns formed by a second antenna of an exemplary electronic device.

[0148] Referring to FIGS. 6A and 6B , the electronic device (101) may include a housing (e.g., the housing (200) of FIG. 2A) that includes a first housing part (e.g., the first housing part (210) of FIG. 2A) and a second housing part (e.g., the second housing part (220) of FIG. 2A). The electronic device (101) may include a hinge assembly (e.g., the hinge assembly (250) of FIG. 2C) that rotatably couples the first housing part (210) and the second housing part (220). The electronic device (101) may include a hinge housing (410) (e.g., a hinge cover (251) of FIG. 2b) that surrounds the hinge assembly (250), includes a plurality of slots (420), and is at least partially exposed to the outside of the housing (200) in a folded state of the electronic device (101) (e.g., a folded state (101b) of FIG. 4). The electronic device (101) may include a power supply structure (401) mounted on the hinge housing (410). The power supply structure (401) may include a substrate (430) mounted on the hinge housing (410) toward the plurality of slots (420), and a plurality of conductive patches (440) formed on the substrate (430) and arranged to be aligned toward the plurality of slots (420), respectively. The electronic device (101) may include a wireless communication circuit (e.g., the wireless communication circuit (320) of FIG. 3). At least some of the plurality of conductive patches (440) may be used to radiate signals from the wireless communication circuit (320) through the plurality of slots (420). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIGS. 6A and 6B may include structures and / or configurations exemplarily illustrated and described in FIGS. 2A to 5C.Additionally, in the following description, redundant descriptions of structures and / or configurations having the same reference numerals as those exemplarily described in FIGS. 2A to 5C may be omitted.

[0149] Referring to FIGS. 6A and 6B, the electric fields of signals radiated from signal patches (442) among a plurality of conductive patches (440) through a plurality of slots (420) are exemplarily illustrated.

[0150] The hinge housing (410) may be disposed on a plurality of conductive patches (440) and may include a first metal portion (411) having a flat shape, a second metal portion (412) extending from the first metal portion (411) and being at least partially bent, and a third metal portion (413) extending from the second metal portion (412) toward the inside of the foldable housing (200). A power supply structure (401) (or substrate (430)) may be disposed between the first metal portion (411) and the third metal portion (413). The third metal portion (413) may be in contact with the substrate (430) to provide a ground to the substrate (430). The hinge housing (410) can form a current path (L) that allows the current transmitted from the conductive patches (440) of the power supply structure (401) to the first metal portion (411) to flow through the second metal portion (412) to the third metal portion (413).

[0151] For example, a current radiated from the conductive patches (440) through the first layer (431) of the substrate (430) to the first metal portion (411) can be transmitted to the first portions (420a) of the plurality of slots (420) formed in the first metal portion (411). The current transmitted to the first portions (420a) can flow through the second portions (420b) of the second metal portion (412) that are connected to the first portions (420a) and have a curved shape, thereby radiating RF signals. The current transmitted to the second metal portion (412) can be transmitted to the third metal portion (413) that extends from the second metal portion (412) toward the inside of the housing (200), thereby being discharged to the ground of the electronic device (101). The metal parts (411, 412, 413) of the hinge housing (410) can provide a stable current radiation structure from the plurality of conductive patches (440) to the hinge housing (410) by forming a current path (L) for radiation of RF signals and discharge of current. However, the embodiments supported in the present disclosure are not limited thereto.

[0152] For example, the third metal portion (413) may be in electrical contact with the second layer (432) of the substrate (430) by being in contact with the second layer (432). Noise emitted from the plurality of conductive patches (440) and / or the plurality of feed lines (520) may be transmitted to the second layer (432) through the plurality of conductive vias (e.g., the plurality of conductive vias (510) of FIG. 5A). The noise transmitted to the second layer (432) may be emitted to the ground of the electronic device (101) through the third metal portion (413). However, the embodiments supported in the present disclosure are not limited thereto.

[0153] Figure 7 illustrates a portion of an exemplary electronic device.

[0154] Referring to FIG. 7, the electronic device (101) may include a housing (200) including a first housing part (210) and a second housing part (220). The electronic device (101) may include a hinge assembly (e.g., the hinge assembly (250) of FIG. 2c) that rotatably connects the first housing part (210) and the second housing part (220). The electronic device (101) may include a hinge housing (410) (e.g., the hinge cover (251) of FIG. 2b) that surrounds the hinge assembly (250), includes a plurality of slots (420), and is at least partially exposed to the outside of the housing (200) in a folded state of the electronic device (101) (e.g., the folded state (101b) of FIG. 4). The electronic device (101) may include a power supply structure (401) mounted on the hinge housing (410). The power supply structure (401) may include a substrate (430) mounted on the hinge housing (410) toward the plurality of slots (420), and a plurality of conductive patches (e.g., the plurality of conductive patches (440) of FIG. 4) formed on the substrate (430) and arranged to be aligned toward the plurality of slots (420). The electronic device (101) may include a wireless communication circuit (e.g., the wireless communication circuit (320) of FIG. 3). At least some of the plurality of conductive patches (440) may be used to radiate signals from the wireless communication circuit (320) through the plurality of slots (420). However, the embodiments supported by the present disclosure are not limited thereto, and for example, the electronic device (101) exemplarily illustrated and described in FIG. 7 may include structures and / or configurations exemplarily illustrated and described in FIGS. 2A to 6B. In addition, in the following description, redundant descriptions of structures and / or configurations having the same reference numerals as exemplarily illustrated in FIGS. 2A to 6B may be omitted.

[0155] The electronic device (101) may include a flexible printed circuit board (750) that connects a substrate (430) (or a power supply structure (401)) and a conductive portion (450), and has a plurality of signal lines (700) arranged thereon that are connected to a wireless communication circuit (320). For example, the conductive portion (450) may be arranged within the first housing part (210) among the first housing part (210) and the second housing part (220). The flexible printed circuit board (750) may extend from the conductive portion (450) across the hinge assembly (250) to the power supply structure (401) that is seated in the hinge housing (410). For example, the flexible printed circuit board (750) may be configured to be at least partially deformed while the state of the electronic device (101) changes. For example, the flexible printed circuit board (750) may include a connector (730) configured to be connected to a connector of the power supply structure (401) (e.g., connector (550) of FIG. 5A). The connectors (550, 730) configured to be connected to each other may be referred to as a board-to-board (BtoB) connector structure, but the embodiments supported by the present disclosure are not limited thereto.

[0156] For example, the plurality of signal lines (700) may include first signal lines (710) that electrically connect the plurality of conductive patches (440) and the wireless communication circuit (320), and second signal lines (720) that electrically connect the conductive portion (450) and the wireless communication circuit (320). For example, the first signal lines (710) may be configured to be electrically connected to the plurality of conductive patches (440) of the feed structure (401) (e.g., via the plurality of feed lines (520) of FIG. 5A). For example, the signal lines (711, 712, 713, 714) may be configured to transmit signals from the wireless communication circuit (320) to the feed lines (521, 522, 523, 524) of FIG. 5A, respectively. For example, the second signal lines (720) may be configured to be electrically connected to the conductive portion (450). For example, the signal lines (721, 722, 723, 724) may be configured to transmit signals from the wireless communication circuit (320) to the conductive portion (450), respectively.

[0157] For example, the flexible printed circuit board (750) may include a first section (751) in which first signal lines (710) are arranged, and a second section (752) in which second signal lines (720) are arranged. For example, a portion of the first section (751) (e.g., a connector (730)) may be configured to be connected to a power supply structure (401) accommodated in a hinge housing (410). A portion of the second section (752) may be configured to be connected to a conductive portion (450). For example, the flexible printed circuit board (750) may include an area (750A) for connecting the flexible printed circuit board (750) to a printed circuit board (e.g., the first printed circuit board (261) of FIG. 2C) in which a wireless communication circuit (320) is arranged. In the above region (750A), one end of each of a plurality of signal lines (700) may be arranged. The region (700A) may be used to connect another flexible printed circuit board (or connector) for electrical connection with the wireless communication circuit (320), but the embodiments supported by the present disclosure are not limited thereto. The electronic device (101) includes a flexible printed circuit board (750) on which first signal lines (710) and second signal lines (720) for radiating signals through a plurality of conductive patches (440) are integrally arranged, thereby reducing transmission loss of RF signals through the plurality of signal lines (700).

[0158] For example, the first signal lines (710) may each have a first length (l1). The second signal lines (720) may each have a second length (l2) greater than the first length (l1). For example, the signal lines (711, 712, 713, 714) may each have a first length (l1) that is substantially the same as each other. The second signal lines (721, 722, 723, 724) may each have a second length (l2) that is substantially the same as each other. However, the embodiments supported in the present disclosure are not limited thereto. The first signal lines (710) may provide stability of signals radiated through the plurality of conductive patches (440) by having the first length (l1) that is substantially the same as each other. The second signal lines (720) can provide stability of signals radiated through the conductive portion (450) by having a second length (l2) that is substantially the same as each other.

[0159] Fig. 8 is a flow chart of an exemplary electronic device for controlling antennas according to various states.

[0160] The operations exemplarily illustrated and described in FIG. 8 may be performed by an electronic device (e.g., the electronic device (101) of FIG. 1) and / or at least one processor (e.g., the processor (120) of FIG. 1, at least one processor (310) of FIG. 3) including a processing circuit of the electronic device (101). The electronic device (101) may include at least one sensor (e.g., at least one sensor (340) of FIG. 3) and a memory (e.g., the memory (130) of FIG. 1) that stores instructions. In addition, the instructions stored in the memory (130), when individually or collectively executed by the at least one processor (310), may cause the electronic device (101) to perform the operations exemplarily illustrated and described in FIG. 8, which are merely exemplary and it should be noted that the embodiments supported by the present disclosure are not limited to the order illustrated in FIG. 8.

[0161] In operation (801), at least one processor (310) can identify an angle between a first housing part (e.g., the first housing part (210) of FIG. 2A) and a second housing part (e.g., the second housing part (220) of FIG. 2A) through at least one sensor (340). For example, at least one of the housing parts (210, 220) of the electronic device (101) can include at least one magnet. At least one processor (310) can identify the angle between the first housing part (210) and the second housing part (220) based on information about a magnetic field provided from the at least one magnet, which is obtained through at least one sensor (340).

[0162] In operation (803), at least one processor (310) can identify whether an angle between the first housing part (210) and the second housing part (220) is within a first reference range. For example, the angle within the first reference range can be obtained from a folded state of the electronic device (101) in which the first housing part (210) and the second housing part (220) are folded with respect to each other (e.g., the folded state (101b) of FIG. 4). For example, within the angle between the first housing part (210) and the second housing part (220) within the first reference range, a plurality of slots (e.g., a plurality of slots (420) of FIG. 4) of a hinge housing (e.g., a hinge housing (410) of FIG. 4) can be at least partially exposed.

[0163] In operation (805), at least one processor (310) may control a wireless communication circuit (e.g., the wireless communication circuit (320) of FIG. 3) to radiate the signals using the plurality of conductive patches (e.g., the plurality of conductive patches (440) of FIG. 4) and the conductive portion (e.g., the conductive portion (450) of FIG. 4) among the plurality of conductive patches (440) based on an angle between the first housing part (210) and the second housing part (220) within a first reference range. For example, the at least one processor (310) may be configured to determine a folded state (101b) of the electronic device (101) based on an angle between the first housing part (201) and the second housing part (220) within a first reference range. The at least one processor (310) may control the wireless communication circuit (320) to radiate signals from the wireless communication circuit (320) through a plurality of conductive patches (440) and / or a plurality of slots (420) formed in the hinge housing (410) based on the determined folding state (101b).

[0164] In operation (807), at least one processor (310) can identify whether the angle between the first housing part (210) and the second housing part (220) is within a second reference range that is greater than the first reference range. For example, the angle within the second reference range can be obtained from an unfolded state of the electronic device (101) in which the first housing part (210) and the second housing part (220) are unfolded with respect to each other (e.g., the unfolded state (101a) of FIG. 4). For example, within the angle between the first housing part (210) and the second housing part (220) within the second reference range, the hinge housing (410) can be covered by the first housing part (210) and the second housing part (220).

[0165] In operation (809), at least one processor (310) may control the wireless communication circuit (320) to radiate the signals using the conductive portion (450) among the plurality of conductive patches (440) and the conductive portion (450) based on an angle between the first housing part (210) and the second housing part (220) within a second reference range greater than the first reference range. For example, the at least one processor (310) may be configured to determine an unfolded state (101a) of the electronic device (101) based on an angle between the first housing part (210) and the second housing part (220) within the second reference range. The at least one processor (310) may control the wireless communication circuit (320) to radiate signals from the wireless communication circuit (320) through a conductive portion (450) disposed under the flexible display (e.g., the flexible display (230) of FIG. 2A) based on the determined unfolding state (101a).

[0166] In operation (811), at least one processor (310) may control the wireless communication circuit (320) to radiate the signals using the plurality of conductive patches (440) and the conductive portion (450) together based on an angle between the first housing part (210) and the second housing part (220) within a third reference range between the first reference range and the second reference range. For example, the at least one processor (310) may be configured to determine intermediate states between an unfolded state (101a) and a folded state (101b) of the electronic device (101) based on an angle between the first housing part (210) and the second housing part (220) within the third reference range. The at least one processor (310) may control the wireless communication circuit (320) to radiate signals corresponding to each of the plurality of intermediate states through the plurality of conductive patches (440) and conductive portions (450), based on the determined plurality of intermediate states.

[0167] Fig. 9a is a graph showing the antenna gain of the first antenna of an exemplary electronic device under various conditions. Fig. 9b is a graph showing the antenna gain of the second antenna of the exemplary electronic device under various conditions.

[0168] Referring to FIG. 9A, the horizontal axis of the graph (910) represents an angle (unit: degree) between housing parts (e.g., housing parts (210, 220) of FIG. 2A) of an electronic device (e.g., electronic device (101) of FIG. 1). The vertical axis of the graph (910) represents an antenna gain (unit: dBi (decibel isotropic)) of a first antenna (e.g., the first antenna (331) of FIG. 3) using a conductive part (e.g., the conductive part (450) of FIG. 4) disposed under a flexible display (e.g., the flexible display (230) of FIG. 2A). The graph (911) represents the antenna gain of the first antenna (331) according to the first polarization characteristic in the first signal band. Graph (911) represents the antenna gain of the first antenna (331) according to the second polarization characteristic in the first signal band.

[0169] Referring to FIG. 9B, the horizontal axis of the graph (920) represents an angle (unit: degree) between the housing parts (210, 220) of the electronic device (101). The vertical axis of the graph (920) represents an antenna gain (unit: dBi (decibel isotropic)) of a second antenna (e.g., the second antenna (332) of FIG. 3) using a feed structure (e.g., the feed structure (401) of FIG. 4) (or a plurality of conductive patches (440)) disposed in a hinge housing (e.g., the hinge cover (251) of FIG. 2B, the hinge housing (410) of FIG. 4). The graph (921) represents the antenna gain of the second antenna (332) according to the first polarization characteristic in the first signal band. Graph (922) represents the antenna gain of the second antenna (332) according to the second polarization characteristic in the first signal band. Graph (923) represents the antenna gain of the second antenna (332) according to the first polarization characteristic in the second signal band which is larger than the first signal band. Graph (924) represents the antenna gain of the second antenna (332) according to the second polarization characteristic in the second signal band.

[0170] Referring to graphs (911, 912) and graphs (921, 922), within a range between a first angle (a1) and a second angle (a2), an antenna gain obtained by using the first antenna (331) and the second antenna (332) together in a first signal band may be greater than an antenna gain obtained by using the first antenna (331) and the second antenna (332) alternatively. For example, referring to graphs (923, 924) of FIG. 9B, a second antenna (332) using a hinge housing (410) (or a plurality of slots (420)) may be used in a second signal band that is different from the first signal band. However, embodiments supported within the present disclosure are not limited thereto.

[0171] According to the above, a foldable electronic device (e.g., electronic device (101) of FIG. 1) may include a foldable housing (e.g., housing (200) of FIG. 2A) including a first housing part (e.g., first housing part (210) of FIG. 2A) and a second housing part (e.g., second housing part (220) of FIG. 2A). The foldable electronic device may include a hinge assembly (e.g., hinge assembly (250) of FIG. 2C) that rotatably connects the first housing part and the second housing part. The foldable electronic device may include a hinge housing (e.g., the hinge cover (251) of FIG. 2b, the hinge housing (410) of FIG. 4)) that surrounds the hinge assembly and includes a plurality of slots (e.g., the plurality of slots (420) of FIG. 4) and is at least partially exposed to the outside of the foldable housing in a folded state of the foldable electronic device (e.g., the folded state (101b) of FIG. 4). The foldable electronic device may include a substrate (e.g., the substrate (430) of FIG. 4) mounted on the hinge housing toward the plurality of slots, a wireless communication circuit (e.g., the wireless communication circuit (320) of FIG. 3), and a plurality of conductive patches (e.g., the plurality of conductive patches (440) of FIG. 4) formed on the substrate and arranged to be aligned with the plurality of slots of the hinge housing, respectively. At least some of the plurality of conductive patches may be used to radiate signals from the wireless communication circuit through the plurality of slots.

[0172] For example, the foldable electronic device may further include a flexible display (e.g., the flexible display (230) of FIG. 2A) configured to be accommodated in the first housing part and the second housing part across the hinge assembly and partially bendable by the hinge assembly, and a conductive portion (e.g., the conductive portion (450) of FIG. 4) disposed under the flexible display. The conductive portion may be used to radiate signals from the wireless communication circuitry through the flexible display.

[0173] For example, the foldable electronic device may further include at least one sensor (e.g., at least one sensor (340) of FIG. 3), a memory (e.g., the memory (130) of FIG. 1) for storing instructions, and at least one processor (e.g., the processor (120) of FIG. 1, at least one processor (310) of FIG. 3) including a processing circuit. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to identify an angle between the first housing part and the second housing part via the at least one sensor. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to control the wireless communication circuit to emit the signals using the plurality of conductive patches and the conductive portions based on the angle within a first reference range. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to control the wireless communication circuitry to radiate the signals using the conductive portion among the conductive patches and the conductive portion, based on the angle within a second reference range greater than the first reference range. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to control the wireless communication circuitry to radiate the signals using the conductive patches and the conductive portion together, based on the angle within a third reference range between the first reference range and the second reference range.

[0174] For example, the plurality of challenging patches may each have a first width (e.g., w1 in FIG. 5c). The plurality of slots may have a second width (e.g., w2 in FIG. 5c) that is smaller than the first width.

[0175] For example, the substrate may include a plurality of layers, including a first layer (e.g., the first layer (431) of FIG. 5A) defining a first side of the substrate facing the plurality of slots (e.g., the first side (430a) of FIG. 5A), and a second layer (e.g., the second layer (432) of FIG. 5A) defining a second side of the substrate opposite the first side (e.g., the second side (430b) of FIG. 5A) and providing a ground for the substrate. The plurality of conductive patches may be disposed on one layer (e.g., the third layer (433) of FIG. 5A) between the first layer and the second layer among the plurality of layers.

[0176] For example, the foldable electronic device may include a plurality of conductive vias (e.g., the plurality of conductive vias (510) of FIG. 5A) that each penetrate at least a portion of the plurality of layers and surround each of the plurality of conductive patches to shield the plurality of conductive patches from each other.

[0177] For example, the foldable electronic device may further include a connector (e.g., connector (550) of FIG. 5A) disposed on the first surface and configured to electrically connect the substrate and the wireless communication circuit. The foldable electronic device may further include a plurality of feeding lines (e.g., a plurality of feeding lines (520) of FIG. 5A) that are shielded from each other by the plurality of conductive vias and extend from each of the plurality of conductive patches to the connector by penetrating at least some of the plurality of layers.

[0178] For example, the hinge housing may include a first metal portion (e.g., the first metal portion (411) of FIG. 5B) disposed on the plurality of conductive patches and having a flat shape, a second metal portion (e.g., the second metal portion (412) of FIG. 5B) extending from the first metal portion and being at least partially curved, and a third metal portion (e.g., the third metal portion (413) of FIG. 5B) extending from the second metal portion toward the inside of the foldable housing. The substrate may be disposed between the first metal portion and the third metal portion. The third metal portion may be in contact with the substrate to provide a ground to the substrate.

[0179] For example, the plurality of slots may include first portions (e.g., first portions (420a) of FIG. 5B) formed on the first metal portion and having a flat shape aligned over the plurality of conductive patches, and second portions (e.g., second portions (420b) of FIG. 5B) extending from the first portions and formed on the second metal portion and having a curved shape. The second portions may be configured to radiate the signals supplied to the first portions from the plurality of conductive patches.

[0180] For example, the hinge housing may form a current path (e.g., current path (L) in FIG. 6b) that allows current transmitted from the conductive patches to the first metal portion to flow through the second metal portion to the third metal portion.

[0181] For example, the plurality of conductive patches may be spaced apart from each other by a first gap width (e.g., the first gap width (g1) in FIG. 5c). The plurality of slots may be spaced apart from each other by a second gap width (e.g., the second gap width (g2) in FIG. 5c) that is greater than the first gap width.

[0182] For example, the plurality of conductive patches may include a first dummy patch (e.g., a first dummy patch (441a) of FIG. 5A), a second dummy patch spaced apart from the first dummy patch (e.g., a second dummy patch (441b) of FIG. 5A), and signal patches arranged between the first dummy patch and the second dummy patch and used to radiate the signals (e.g., signal patches (442) of FIG. 5A).

[0183] For example, the foldable electronic device may further include a flexible display configured to be accommodated in the first housing part and the second housing part across the hinge assembly and partially bendable by the hinge assembly, a conductive portion disposed under the flexible display, and a flexible printed circuit board (e.g., the flexible printed circuit board (750) of FIG. 7) connecting the substrate and the conductive portion and having a plurality of signal lines (e.g., a plurality of signal lines (700) of FIG. 7) connected to the wireless communication circuit. The conductive portion may be used to radiate signals from the wireless communication circuit through the flexible display.

[0184] For example, the plurality of signal lines may include first signal lines (e.g., first signal lines (710) of FIG. 7) that electrically connect the plurality of conductive patches and the wireless communication circuit, and second signal lines (e.g., second signal lines (720) of FIG. 7) that electrically connect the conductive portion and the wireless communication circuit. The first signal lines may each have a first length (e.g., first length (l1) of FIG. 7). The second signal lines may have a second length (e.g., second length (l2) of FIG. 7) that is greater than the first length.

[0185] For example, the longitudinal direction of each of the plurality of challenging patches may be perpendicular to the longitudinal direction of each of the plurality of slots.

[0186] According to the above, a foldable electronic device may include a foldable housing including a first housing part and a second housing part. The foldable electronic device may include a hinge assembly rotatably connecting the first housing part and the second housing part. The foldable electronic device may include a hinge housing surrounding the hinge assembly, including a plurality of slots, and configured to be at least partially exposed to the outside of the foldable housing or surrounded by the foldable housing. The foldable electronic device may include a substrate mounted on the hinge housing toward the plurality of slots, a flexible display accommodated in the first housing part and the second housing part across the hinge assembly and configured to be partially bent by the hinge assembly, and a wireless communication circuit. The foldable electronic device may include a conductive portion disposed under the flexible display and used as a first antenna radiator for signals from the wireless communication circuit. The foldable electronic device may include a plurality of conductive patches formed on the substrate and aligned toward the plurality of slots of the hinge housing, the plurality of conductive patches being used as second antenna radiators for signals from the wireless communication circuit.

[0187] For example, the foldable electronic device may further include at least one sensor, a memory storing instructions, and at least one processor including a processing circuit. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to identify an angle between the first housing part and the second housing part via the at least one sensor. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to control the wireless communication circuit to radiate signals from the wireless communication circuit using the plurality of conductive patches and the conductive portion, based on the angle within a first reference range. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to control the wireless communication circuitry to radiate the signals using the conductive portion among the conductive patches and the conductive portion, based on the angle within a second reference range greater than the first reference range. The instructions, when individually or collectively executed by the at least one processor, may cause the foldable electronic device to control the wireless communication circuitry to radiate the signals using the conductive patches and the conductive portion together, based on the angle within a third reference range between the first reference range and the second reference range.

[0188] For example, the hinge housing may include a first metal portion having a flat shape and disposed on the plurality of conductive patches, a second metal portion extending from the first metal portion and being at least partially curved, and a third metal portion extending from the second portion toward the interior of the foldable housing. The substrate may be disposed between the first metal portion and the third metal portion. The third metal portion may be configured to provide a ground to the substrate by contacting the substrate.

[0189] For example, the plurality of slots may include first portions formed on the first metal portion and having a flat shape aligned on the plurality of conductive patches, and second portions extending from the first portions and formed on the second metal portion and having a curved shape. The second portions may be configured to radiate the signals supplied from the plurality of conductive patches to the first portions.

[0190] For example, the foldable electronic device may further include a flexible printed circuit board that connects the substrate and the conductive portion and has a plurality of signal lines arranged thereon that are connected to the wireless communication circuit. The plurality of signal lines may include first signal lines that electrically connect the plurality of conductive patches and the wireless communication circuit, and second signal lines that electrically connect the conductive portion and the wireless communication circuit. The first signal lines may each have a first length, and the second signal lines may have a second length that is greater than the first length.

[0191] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0192] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0193] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0194] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0195] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0196] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device (101), A foldable housing (200) including a first housing part (210) and a second housing part (220); A hinge assembly (250) that rotatably connects the first housing part (210) and the second housing part (220); A hinge housing (251; 410) surrounding the hinge assembly (250), including a plurality of slots (420), and at least partially exposed to the outside of the foldable housing (200) within the folded state of the foldable electronic device (101); A substrate (430) mounted on the hinge housing (251; 410) toward the plurality of slots (420); wireless communication circuit (320); and It includes a plurality of conductive patches (440) formed on the substrate (430) and arranged to be aligned with each of the plurality of slots (420), At least some of the above plurality of challenge patches (440), Used to radiate signals from the wireless communication circuit (320) through the plurality of slots (420), Foldable electronic device (101).

2. In paragraph 1, A flexible display (230) accommodated in the first housing part (210) and the second housing part (220) across the hinge assembly (250) and configured to be partially bent by the hinge assembly (250); and It further includes a conductive portion (450) placed under the flexible display (230), The above-mentioned challenging portion (450) is Used to radiate signals from the wireless communication circuit (320) through the flexible display (230), Foldable electronic device (101).

3. In paragraph 2, At least one sensor (340); Memory (130) for storing instructions; and further comprising at least one processor (120; 310) comprising a processing circuit, The above instructions, when individually or collectively executed by the at least one processor (120; 310), cause the foldable electronic device (101) to: Identifying the angle between the first housing part (210) and the second housing part (220) through at least one sensor (340); Based on the angle within the first reference range, the wireless communication circuit (320) is controlled to radiate the signals using the plurality of conductive patches (440) among the plurality of conductive patches (440) and the conductive portion (450); Controlling the wireless communication circuit (320) to radiate the signals using the conductive portion (450) among the plurality of conductive patches (440) and the conductive portion (450) based on the angle within the second reference range greater than the first reference range; and Causing the wireless communication circuit (320) to control the plurality of conductive patches (440) and the conductive portion (450) to radiate the signals together based on the angle within the third reference range between the first reference range and the second reference range. Foldable electronic device (101).

4. In any one of paragraphs 1 to 3, The above plurality of challenge patches (440) are, Each has a first width (w1), The above plurality of slots (420) are, Having a second width (w2) smaller than the first width (w1), Foldable electronic device (101).

5. In any one of paragraphs 1 to 4, The above substrate (430) is A plurality of layers (530) including a first layer (431) defining a first side (430a) of the substrate (430) facing the plurality of slots (420), and a second layer (432) defining a second side (430b) of the substrate (430) opposite to the first side (430a) and providing a ground of the substrate (430), The above plurality of challenge patches (440) are, Placed on one layer between the first layer (431) and the second layer (432) among the plurality of layers (530), Foldable electronic device (101).

6. In paragraph 5, A plurality of conductive vias (510) each penetrating at least a portion of the plurality of layers (530) and surrounding each of the plurality of conductive patches (440) to shield the plurality of conductive patches (440) from each other, Foldable electronic device (101).

7. In paragraph 6, A connector (550) arranged on the first surface (430a) and configured to electrically connect the substrate (430) and the wireless communication circuit (320); and A plurality of feeding lines (520) are shielded from each other by the plurality of conductive vias (510) and extend from each of the plurality of conductive patches (440) to the connector (550) through at least some of the plurality of layers (530). Foldable electronic device (101).

8. In any one of paragraphs 1 to 7, The above hinge housing (251; 410) A first metal portion (411) having a flat shape and disposed on the plurality of challenge patches (440); A second metal portion (412) extending from the first metal portion (411) and at least partially bent; and Including a third metal portion (413) extending from the second metal portion (412) toward the inside of the foldable housing (200), The above substrate (430) is It is placed between the first metal part (411) and the third metal part (413), The above third metal part (413) is By coming into contact with the substrate (430), a ground is provided to the substrate (430). Foldable electronic device (101).

9. In paragraph 8, The above plurality of slots (420) are, First portions (420a) having a flat shape by being aligned on the plurality of conductive patches (440) and formed on the first metal portion (411); and Extending from the first portions (420a) and including second portions (420b) having a curved shape by being formed on the second metal portion (412), The above second parts (420b) are, configured to radiate the signals supplied from the plurality of challenge patches (440) to the first portions (420a), Foldable electronic device (101).

10. In paragraph 8, The above hinge housing (251; 410) The current transmitted from the conductive patches (440) to the first metal portion (411) forms a current path (L) that allows the current to flow to the third metal portion (413) through the second metal portion (412). Foldable electronic device (101).

11. In any one of paragraphs 1 to 10, The above plurality of challenge patches (440) are, Each is spaced apart from the other by the first gap width (g1), The above plurality of slots (420) are, Each of which is spaced apart from the other by a second gap width (g2) greater than the first gap width (g1), Foldable electronic device (101).

12. In any one of paragraphs 1 to 11, The above plurality of challenge patches (440) are, First dummy patch (441a); A second dummy patch (441b) spaced apart from the first dummy patch (441a); and It includes signal patches (442) arranged between the first dummy patch (441a) and the second dummy patch (441b) and used to radiate the signals. Foldable electronic device (101).

13. In any one of paragraphs 1 to 12, A flexible display (230) accommodated in the first housing part (210) and the second housing part (220) across the hinge assembly (250) and configured to be partially bent by the hinge assembly (250); A conductive portion (450) placed under the flexible display (230); and It further includes a flexible printed circuit board (750) that connects the substrate (430) and the conductive portion (450) and has a plurality of signal lines (700) arranged to be connected to the wireless communication circuit (320). The above-mentioned challenging portion (450) is Used to radiate signals from the wireless communication circuit (320) through the flexible display (230), Foldable electronic device (101).

14. In paragraph 13, The above plurality of signal lines (700) are First signal lines (710) electrically connecting the plurality of conductive patches (440) and the wireless communication circuit (320); and It includes second signal lines (720) that electrically connect the conductive portion (450) and the wireless communication circuit (320), The above first signal lines (710) are, Each has a first length (l1), The above second signal lines (720) are, Having a second length (l2) greater than the first length (l1), Foldable electronic device (101).

15. In any one of paragraphs 1 to 14, The longitudinal direction of each of the above plurality of challenging patches (440) is Perpendicular to the longitudinal direction of each of the above plurality of slots (420), Foldable electronic device (101).

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