Display device and electronic device comprising same

Abstract

A flash device according to various embodiments may comprise: an LED element for emitting light; a light-receiving unit; and a lens cover including one or more lenses through which light passes. The one or more lenses may cover the LED element and the light-receiving unit. At least one of the one or more lenses may include a pattern. Of the one or more lenses, the lens disposed closest to the LED element may include an organosilicon compound.

Description

Flash devices and electronic devices containing the same

[0001] The present disclosure relates to a flash device and an electronic device including the same.

[0002] Due to their high luminous efficiency and long lifespan, LED devices can be used in a variety of industrial fields. For example, LED devices can be incorporated into flash units that enable camera devices to take pictures in dark environments. Electronic devices such as mobile phones can include a camera and a flash unit that includes a light-receiving unit for camera functions.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] A flash device according to one embodiment may include an LED element that emits light. The flash device may include a light-receiving portion. The flash device may include a lens cover including one or more lenses through which light passes. The one or more lenses may cover the LED element and the light-receiving portion. At least one of the one or more lenses may include a pattern. The lens of the one or more lenses that is positioned closest to the LED element may include an organic silicon compound.

[0005] A flash device according to one embodiment may include an LED element that emits light. The flash device may include a light-receiving portion. The flash device may include one or more first lenses through which light passes and which cover the LED element and the light-receiving portion. The flash device may include one or more second lenses through which light passes and which are positioned between the LED element and the one or more first lenses. At least one of the one or more first lenses or the one or more second lenses may include a pattern. The second lens of the one or more second lenses, which is positioned closest to the LED element, may include an organic silicon compound.

[0006] FIG. 1 is a perspective view illustrating a flash device according to one embodiment.

[0007] Figure 2 is a cross-sectional view of a flash device according to one embodiment.

[0008] Figure 3 is a plan view of a flash device according to one embodiment.

[0009] FIG. 4 is a drawing for explaining a gap between an LED element and a lens according to one embodiment.

[0010] FIG. 5 is a drawing for explaining a lens in contact with an LED element according to one embodiment.

[0011] FIG. 6 is a drawing for explaining a pattern formed on a lens according to one embodiment.

[0012] FIG. 7 is a drawing for explaining the light-emitting area and pattern of an LED element according to one embodiment.

[0013] FIG. 8 is a cross-sectional view of a flash device including a first lens and a second lens according to one embodiment.

[0014] FIG. 9 is a drawing for explaining an LED element including a light emitting unit and a light receiving unit according to one embodiment.

[0015] FIG. 10 is a plan view of an electronic device including a flash device and a plurality of camera devices according to one embodiment.

[0016] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments.

[0017] FIG. 12 is a block diagram illustrating a camera module according to various embodiments.

[0018] Hereinafter, embodiments are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present disclosure. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0019] An electronic device according to various embodiments of the present document may include, for example, at least one of a smartphone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, a desktop personal computer (PC), a laptop personal computer (PC), a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device. According to various embodiments, the wearable device may include at least one of an accessory type (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, contact lenses, or a head-mounted device (HMD)), a fabric or clothing-integrated type (e.g., an electronic garment), a body-attached type (e.g., a skin pad or a tattoo), or a bio-implantable type (e.g., an implantable circuit).

[0020] In one embodiment, the electronic device may be a home appliance. The home appliance may include, for example, at least one of a television, a digital video disk (DVD) player, an audio device, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.

[0021] In one embodiment, the electronic device may be any of various medical devices (e.g., various portable medical measuring devices (e.g., blood glucose meter, heart rate meter, blood pressure meter, or body temperature meter), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computer tomography (CT), camera, or ultrasound), navigation device, global navigation satellite system (GNSS), event data recorder (EDR), flight data recorder (FDR), automobile infotainment device, electronic equipment for ships (e.g., marine navigation device or gyrocompass), avionics, security device, head unit for vehicles, industrial or home robot, automatic teller's machine (ATM) of financial institution, point of sales (POS) of store, or internet of things device (e.g., light bulb, various sensors, electric or gas meter, sprinkler device, fire alarm, thermostat, It may include at least one of the following: a streetlight, a toaster, exercise equipment, a hot water tank, a heater, or a boiler.

[0022] According to one embodiment, the electronic device may include at least one of a piece of furniture or a building / structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., a water, electricity, gas, or radio wave measuring device). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. According to one embodiment, the electronic device may be a flexible electronic device.

[0023] According to one embodiment, the electronic device of the present disclosure may include various electronic devices including a flash device. Furthermore, the electronic device according to the embodiment of the present document is not limited to the aforementioned devices and may include new electronic devices according to technological advancements.

[0024] A flash device and an electronic device including the same according to one embodiment may be configured to prevent a lens from being discolored by heat emitted from an LED element and / or light emitted from the LED element.

[0025] A flash device and an electronic device including the same according to one embodiment may be configured to reduce the thickness of the electronic device by reducing the thickness of the flash device.

[0026] A flash device according to one embodiment may be configured to provide flash illumination to an electronic device in a dark environment. For example, the flash device may be configured to provide flash illumination to an electronic device during operation of a camera device.

[0027] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present disclosure pertains.

[0028] FIG. 1 is a perspective view illustrating a flash device according to one embodiment. FIG. 2 is a cross-sectional view of a flash device according to one embodiment.

[0029] Figure 2 is a cross-sectional view of the flash device (100) of Figure 1 taken along line A-A'.

[0030] The flash device (100) of FIGS. 1 and 2 may be referenced by flash devices of other drawings. The same terminology and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings.

[0031] Referring to FIGS. 1 and 2, a flash device (100) according to an embodiment may include an LED element (120), a light sensor (not shown), and one or more lenses (150). However, the configuration of the flash device (100) is not limited thereto. For example, the flash device (100) may omit at least one of the above-described configurations, or may further include at least one other configuration. For example, the flash device (100) may further include a lens cover (140) including one or more lenses (150), and a substrate (110) on which the LED element (120) and the light sensor (e.g., a light receiving unit) are placed.

[0032] According to one embodiment, the LED element (120) can emit light. For example, the LED element (120) can include a light emitting portion. For example, the LED element (120) can include one or more LED chips and a wavelength conversion material. For example, the LED element (120) can emit light of various colors through the one or more LED chips and the wavelength conversion material. For example, the wavelength conversion material can convert the wavelength of light emitted from the one or more LED chips. For example, the wavelength conversion material can include at least one of a phosphor or a quantum dot.

[0033] According to one embodiment, the LED element (120) can emit light in a direction toward the lens cover (140). For example, the LED element (120) can emit light in a direction (e.g., +z direction) toward the first side (or front or top side) (141) of the lens cover (140). For example, the LED element (120) can emit light in a direction toward one or more lenses (150).

[0034] According to one embodiment, light emitted from the LED element (120) may be incident on the lens cover (140). For example, light emitted from the LED element (120) may be incident on one or more lenses (150) and may pass through one or more lenses (150).

[0035] According to one embodiment, the LED element (120) may have a light output of approximately 300 lumens (lm) or more and 800 lm or less to implement the brightness of the flash device (100), but is not limited thereto.

[0036] According to one embodiment, the substrate (110) may include at least one of a printed circuit board (PCB), a metal core PCB (MCPCB), a metal PCB (MPCB), or a flexible PCB (FPCB), but is not limited thereto.

[0037] In one embodiment, the LED element (120) may be disposed on the substrate (110). For example, the LED element (120) may be placed on the substrate (110). In one embodiment, the LED element (120) and the light receiving unit may be electrically connected to a circuit of the substrate (110). For example, the light sensor (130) may be electrically connected to the circuit of the substrate (110). In one embodiment, an additional device, such as a Zener diode, may be disposed on the substrate (110).

[0038] According to one embodiment, the electronic device may include a light receiving unit (not shown). The light receiving unit may receive ambient light of the flash device (100) and provide information for correcting an image acquired from the camera device. For example, the electronic device may correct a camera image acquired through the camera device (e.g., the camera module (880) of FIG. 12) based on at least one of flicker information, color information, or brightness information obtained by receiving ambient light through the light receiving unit, or may control a light source of the electronic device, such as an LED element (120).

[0039] According to one embodiment, the light receiving unit can receive light incident from the lens cover (140). For example, the light receiving unit can receive light incident from one or more lenses (150). The flash device (100) can emit flash light of the LED element (120) to the outside of the flash device (100) through one or more lenses (150) while simultaneously receiving ambient light of the flash device (100) through the light receiving unit.

[0040] According to one embodiment, the light sensor (130) may include the light receiving unit. For example, the light receiving unit of the flash device (100) may include the light receiving unit of the light sensor (130). For example, the light receiving unit of the flash device (100) may include the light receiving unit disposed on the light sensor (130). However, the present invention is not limited thereto. For example, the light receiving unit may be formed as a photodiode separate from the light receiving unit of the light sensor (130). For example, the light receiving unit may be included in the LED element (120). For example, the light receiving unit may be disposed on the LED element (120).

[0041] According to one embodiment, the light sensor (130) can convert ambient light information into an electronic signal. According to one embodiment, the light sensor (130) can be disposed on the substrate (110). For example, the light sensor (130) can be placed on the substrate (110). According to one embodiment, the electronic device can correct a camera image acquired through the camera device based on at least one of flicker information, color information, or brightness information obtained by receiving ambient light through the light sensor (130), or control a light source of the electronic device, such as an LED element (120).

[0042] According to one embodiment, the light sensor (130) may include at least one of an ambient light sensor (ALS) or a proximity sensor (PS), but is not limited thereto.

[0043] According to one embodiment, the lens cover (140) may include one or more lenses (150). For example, one or more lenses (150) may be disposed on the lens cover (140). For example, one or more lenses (150) may be disposed on the lens portion of the lens cover (140). For example, one or more lenses (150) may be coupled to the lens cover (140). However, the present disclosure is not limited thereto. For example, the lens cover (140) may be formed integrally with at least one of the one or more lenses (150). Although the drawings of the present disclosure illustrate that the lens cover (140) and one or more lenses (150) are formed integrally, the present disclosure is not limited thereto.

[0044] According to one embodiment, referring to FIG. 2, the lens cover (140) may include one lens (150). However, the present invention is not limited thereto. For example, the lens cover (140) may include a plurality of lenses. For example, the plurality of lenses (150) may be stacked in a direction in which light is emitted from the LED element (120) (e.g., +z direction).

[0045] According to one embodiment, the lens cover (140) may cover the LED element (120) and the light receiving unit. For example, one or more lenses (150) of the lens cover (140) may cover the LED element (120) and the light receiving unit. For example, one or more lenses (150) may cover the light emitting unit and the light receiving unit of the LED element (120).

[0046] According to one embodiment, the LED element (120) and the light receiving unit may be disposed between the substrate (110) and the lens cover (140). For example, the LED element (120) and the light receiving unit may be disposed between the substrate (110) and one or more lenses (150). For example, when looking down at the flash device (100), one or more lenses (150) may overlap the LED element (120) and the light receiving unit.

[0047] According to one embodiment, the lens cover (140) can at least partially surround the LED element (120) and the light receiving unit. For example, the lens cover (140) can include a first side (141) that covers the LED element (120) and the light receiving unit. The lens cover (140) can include a side (142) that at least partially surrounds the LED element (120) and the light receiving unit. For example, the lens cover (140) can include a plate that includes the first side (141) and a sidewall that includes the side (142).

[0048] According to one embodiment, the side wall may be placed on the substrate (110). The side wall may support a plate on the substrate (110). For example, the plate and the side wall of the lens cover (140) may form a space. An LED element (120) and a light receiving unit may be disposed within the space. For example, at least a portion of the LED element (120) and the light sensor (130) may be disposed within the space. The structure and shape of the lens cover (140) are not limited to those illustrated in FIGS. 1 and 2 and may be variously modified. In one example, the lens cover (140) may be formed to at least partially surround the substrate (110). For example, the lens cover (140) may be formed to at least partially surround a side of the substrate (110). In one example, the lens cover (140) may include a fixing member that fixes the lens cover (140) to the substrate (110). For example, the fixing member may include at least one of a hook, a protruding structure, or a hooking structure. In one example, the lens cover (140) may include a groove that receives at least a portion of the substrate (110). For example, at least a portion of a side of the substrate (110) may be received in the groove. In one example, the lens cover (140) may slide relative to the substrate (110) while at least a portion of the substrate (110) is received in the groove.

[0049] According to one embodiment, at least one of the one or more lenses (150) may include a pattern (160). For example, the pattern (160) may include at least one Fresnel pattern. For example, at least one lens of the one or more lenses (150) may include a Fresnel lens. For example, the lens including the pattern (160) may include a Fresnel lens. However, the present invention is not limited thereto. For example, the pattern (160) may include various patterns.

[0050] According to one embodiment, one side of the lens cover (140) may include the pattern (160). For example, the pattern (160) may be included in the first side (141) of the lens cover (140). For example, the lens forming the first side (141) of the lens cover (140) may include the pattern (160). For example, among one or more lenses (150), the lens that is arranged farthest from the LED element (120) may include the pattern (160). However, the present invention is not limited thereto. For example, the pattern (160) may be included in the second side, which is the opposite side of the first side (141) of the lens cover (140). For example, the lens forming the second side of the lens cover (140) may include the pattern (160). For example, the lens (150) that is positioned closest to the LED element (120) may include a pattern (160).

[0051] According to one embodiment, the pattern (160) may be formed on one surface of the lens cover (140). For example, the pattern (160) may be formed on the first surface (141) of the lens cover (140). For example, the pattern (160) may be formed on the lens forming the first surface (141) of the lens cover (140). For example, the pattern (160) may be formed on the lens that is arranged farthest from the LED element (120) among one or more lenses (150). However, the present invention is not limited thereto. For example, the pattern (160) may be formed on the second surface, which is the opposite surface of the first surface (141) of the lens cover (140). For example, the pattern (160) may be formed on the lens forming the second surface of the lens cover (140). For example, a pattern (160) may be formed on one or more lenses (150) that is positioned closest to the LED element (120).

[0052] Referring to FIG. 1, according to one embodiment, one or more lenses (150) may have a circular shape. For example, the entrance and exit surfaces of one or more lenses (150) may have a circular shape. However, the present invention is not limited thereto.

[0053] According to one embodiment, the planar shape of the pattern (160) may be a shape in which a plurality of concentric circles are regularly arranged. For example, the planar shape of the pattern (160) may be a shape in which a plurality of circles are arranged while growing at a constant ratio from the center of one or more lenses (150). However, the present invention is not limited thereto.

[0054] Referring to FIG. 2, according to one embodiment, the pattern (160) may be formed by repeating a plurality of basic shapes. For example, the cross-sectional shape of the pattern (160) may be a right triangle shape such as a prism, but is not limited thereto. For example, the cross-sectional shape of the basic shape forming the pattern (160) may be at least one of a polygon such as an equilateral triangle and a square, a semicircle, or a sine wave shape. In one example, the cross-section of the pattern (160) may include an inclined surface. In one example, the inclined surface may form an inclined angle with respect to the upper surface of the LED element (120). In one example, the inclined surface may include a curved surface, unlike as illustrated in FIG. 2.

[0055] According to one embodiment, the pattern (160) may be formed of a plurality of basic shapes of the same size. For example, the cross-sectional shape of the pattern (160) may be a shape in which a plurality of triangles of the same size are regularly arranged.

[0056] According to one embodiment, the lens cover (140) (e.g., at least one of the one or more lenses (150)) may include a material that is resistant to heat emitted from the LED element (120) and / or light emitted from the LED element (120). For example, the lens cover (140) may include an organosilicon compound. For example, the one or more lenses (150) may include an organosilicon compound. For example, at least one of the one or more lenses (150) may include an organosilicon compound. For example, the lens that is positioned closest to the LED element (120) among the one or more lenses (150) may include an organosilicon compound. For example, the lens forming the second side of the lens cover (140) may include an organosilicon compound.

[0057] In one embodiment, the organosilicon compound may include, but is not limited to, silicone.

[0058] According to one embodiment, the lens (150) may include an organic silicon compound, thereby improving the moldability, heat resistance, and light efficiency of the lens (150). In one example, the heat resistance range of the organic silicon compound included in the lens (150) may be about 130° C. or more and about 200° C. or less. However, the present invention is not limited thereto.

[0059] According to one embodiment, the lens (150) closest to the LED element (120) among the one or more lenses (150) may include an organic silicon compound, thereby preventing the one or more lenses (150) from being discolored by heat emitted from the LED element (120) and / or light emitted from the LED element (120).

[0060] According to one embodiment, the lens (150) positioned closest to the LED element (120) may include an organic silicon compound, thereby reducing the distance between the lens and the LED element (120). Accordingly, the thickness of the flash device (100) may be reduced, and the thickness of the electronic device may be reduced.

[0061] In one embodiment, the transmittance of the organosilicon compound may be about 80% or greater. For example, the transmittance of a lens including the organosilicon compound may be about 80% or greater. For example, the transmittance of a lens cover (140) including the organosilicon compound may be about 80% or greater. However, the present invention is not limited thereto.

[0062] Figure 3 is a plan view of a flash device according to one embodiment.

[0063] The flash device (100) of FIG. 3 may be referenced by the flash device (100) of other drawings. The same terminology and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings.

[0064] In one embodiment, the lens cover (140) may at least partially cover the substrate (110). For example, in a direction from one or more lenses (150) toward the LED element (120), the lens cover (140) may overlap at least a portion of the substrate (110).

[0065] According to one embodiment, the light receiving unit (131) may be included in the light sensor (130). For example, the light receiving unit (131) may be placed on the light sensor (130). For example, the light receiving unit (131) may be placed on the light sensor (130).

[0066] According to one embodiment, the light receiving unit (131) may include a plurality of photodiodes. For example, the light receiving unit (131) may include a photodiode array.

[0067] According to one embodiment, the light sensor (130) may include a plurality of photodiodes. For example, the light sensor (130) may include a photodiode array. For example, the plurality of photodiodes may be arranged on the light sensor (130). For example, the plurality of photodiodes may be arranged on the light sensor (130).

[0068] According to one embodiment, the light receiving unit (131) can receive light incident from the lens cover (140). For example, the light receiving unit (131) can receive light incident from one or more lenses (150). The flash device (100) can emit flash light from the LED element (120) to the outside of the flash device (100) through one or more lenses (150) while simultaneously receiving ambient light through the light receiving unit (131).

[0069] According to one embodiment, the light sensor (130) may be positioned adjacent to the LED element (120) such that the light receiving portion (131) overlaps one or more lenses (150). For example, the light sensor (130) may be positioned adjacent to the side of the LED element (120). For example, in a direction from one or more lenses (150) toward the LED element (120), the LED element (120) and the light receiving portion (131) may overlap one or more lenses (150). For example, in a direction from one or more lenses (150) toward the LED element (120), the LED element (120) and a plurality of photodiodes may overlap one or more lenses (150).

[0070] According to one embodiment, the center of one or more lenses (150) may correspond to the center of the LED element (120) device. For example, in the direction from one or more lenses (150) toward the LED element (120), the center of one or more lenses (150) may overlap with the center of the LED element (120) device. However, the present invention is not limited thereto.

[0071] FIG. 4 is a drawing for explaining a gap between an LED element and a lens according to one embodiment.

[0072] The flash device (200) of FIG. 4 may be referenced by flash devices of other drawings. The same terms and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings, and redundant descriptions are omitted.

[0073] According to one embodiment, the LED element (220) and the light sensor (230) may be disposed on the substrate (210). For example, the LED element (220) and the light sensor (230) may be disposed side by side on the substrate (210). For example, the LED element (220) and the light sensor (230) may be placed on the substrate (210). For example, the LED element (220) and the light sensor (230) may be in contact with the substrate (210).

[0074] According to one embodiment, the lens cover (240) may be disposed spaced apart from the LED element (220) by a first length (D1). For example, a second side (e.g., a side of the lens cover (240) that is opposite the first side (241) of the lens cover (240) (e.g., a side facing the LED element (220) of the lens cover (240)) may be disposed spaced apart from the LED element (220) by a first length (D1). For example, the lens forming the second side of the lens cover (240) may be disposed spaced apart from the LED element (220) by a first length (D1). For example, among one or more lenses (250), the lens disposed closest to the LED element (220) may be disposed spaced apart from the LED element (220) by a first length (D1). For example, the difference between the height of the side (242) of the lens cover (240) and the height of the LED element (220) may be a first length (D1).

[0075] According to one embodiment, a gap (G) may be formed between the lens cover (240) and the LED element (220). For example, a gap (G) spaced apart by a first length (D1) may be formed between the lens cover (240) and the LED element (220). For example, a gap (G) spaced apart by a first length (D1) may be formed between the second surface of the lens cover (240) and the first surface (221) of the LED element (220).

[0076] According to one embodiment, the first length (D1) may be about 0.3 mm or less, but is not limited thereto.

[0077] According to one embodiment, the lens cover (240) may be disposed spaced apart from the light sensor (230). For example, the second side of the lens cover (240) may be disposed spaced apart from the first side (232) of the light sensor (230).

[0078] According to one embodiment, the lens cover (240) may be disposed spaced apart from the light receiving unit (231). For example, the second surface of the lens cover (240) may be disposed spaced apart from the light receiving unit (231). For example, the lens forming the second surface of the lens cover (240) may be disposed spaced apart from the light receiving unit (231). For example, among one or more lenses (250), the lens disposed closest to the LED element (220) may be disposed spaced apart from the light receiving unit (231).

[0079] According to one embodiment, the lens (250) closest to the LED element (220) may include an organic silicon compound, thereby reducing the first length (D1) and reducing the thickness (D2) of the flash device (200). For example, the second length (D2) from the second surface (211) of the substrate (210) to the first surface (241) of the lens cover (240) may be reduced. In one example, the second length (D2) may be about 1.2 mm or less. However, the present invention is not limited thereto.

[0080] FIG. 5 is a drawing for explaining a lens in contact with an LED element according to one embodiment.

[0081] The flash device (300) of FIG. 5 may be referenced by flash devices of other drawings. The same terminology and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings.

[0082] According to one embodiment, the lens cover (340) may be in contact with the LED element (320). For example, a gap (e.g., gap (G) in FIG. 4) may not be formed between the lens cover (340) and the LED element (320). For example, a second surface (e.g., a surface of the lens cover (340) facing the LED element (220)) opposite to a first surface (e.g., first surface (241) in FIG. 4) of the lens cover (340) may be in contact with the LED element (320). For example, a lens forming the second surface of the lens cover (340) may be in contact with the LED element (320). For example, a lens forming the second surface of the lens cover (340) may be in at least partial contact with a first surface (321) of the LED element (320). In one example, the lens that is positioned closest to the LED element (320) among the one or more lenses (350) may be in contact with the LED element (320). For example, the lens that is positioned closest to the LED element (320) among the one or more lenses (350) may be in at least partial contact with the first side (321) of the LED element (320). For example, the height of the side of the lens cover (340) (e.g., the side (242) of FIG. 4) and the height of the LED element (320) may be substantially the same.

[0083] According to one embodiment, the lens cover (340) may be positioned to surround the LED element (320). For example, among one or more lenses (350), the lens positioned closest to the LED element (320) may be positioned to surround the LED element (320).

[0084] According to one embodiment, the lens cover (340) may be applied to the LED element (320). For example, among one or more lenses (350), the lens that is positioned closest to the LED element (320) may be applied to the LED element (320).

[0085] According to one embodiment, the lens cover (340) may be in contact with the light receiving portion (331). For example, a gap may not be formed between the lens cover (340) and the light receiving portion (331). For example, a second surface (e.g., a surface facing the LED element (320) of the lens cover (340)) opposite to a first surface (e.g., the first surface (241) of FIG. 4) of the lens cover (340) may be in contact with the light receiving portion (331). For example, a lens forming the second surface of the lens cover (340) may be in contact with the light receiving portion (331). For example, a lens that is arranged closest to the LED element (320) among one or more lenses (350) may be in contact with the light receiving portion (331).

[0086] According to one embodiment, the lens cover (340) may be arranged to surround the light receiving unit (331). For example, among one or more lenses (350), the lens that is arranged closest to the LED element (320) may be arranged to surround the light receiving unit (331).

[0087] According to one embodiment, a lens cover (340) may be applied to the light receiving portion (331). For example, among one or more lenses (350), the lens that is positioned closest to the LED element (320) may be applied to the light receiving portion (331).

[0088] According to one embodiment, the lens cover (340) may be in contact with the light sensor (330). For example, a gap may not be formed between the lens cover (340) and the light sensor (330). For example, a second surface (e.g., a surface facing the LED element (320) of the lens cover (340)) opposite to a first surface (e.g., the first surface (241) of FIG. 4) of the lens cover (340) may be in contact with the light sensor (330). For example, a lens forming the second surface of the lens cover (340) may be in contact with the light sensor (330). For example, a lens that is arranged closest to the LED element (320) among one or more lenses (350) may be in contact with the light sensor (330). For example, the height of the side of the lens cover (340) (e.g., the side (242) of FIG. 4) and the height of the light sensor (330) may be substantially the same.

[0089] According to one embodiment, the lens cover (340) may be positioned to surround at least a portion of the light sensor (330). For example, the lens positioned closest to the LED element (320) among the one or more lenses (350) may be positioned to surround at least a portion of the light sensor (330).

[0090] According to one embodiment, the lens cover (340) may be applied to the light sensor (330). For example, among one or more lenses (350), the lens that is positioned closest to the LED element (320) may be applied to the light sensor (330).

[0091] FIG. 6 is a drawing for explaining a pattern formed on a lens according to one embodiment.

[0092] The flash device (400) of FIG. 6 may be referenced by flash devices of other drawings. The same terminology and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings.

[0093] According to one embodiment, the lens cover (440) may include various patterns (460). For example, at least one of the one or more lenses (450) may include various patterns (460). For example, the pattern (460) may include at least one Fresnel pattern. For example, at least one of the one or more lenses (450) may include a Fresnel lens. However, the present invention is not limited thereto.

[0094] According to one embodiment, light emitted from an LED element (420) may pass through one or more lenses (450). The one or more lenses (450) may refract the light. For example, a pattern (460) formed on at least one of the one or more lenses (450) may refract the light.

[0095] According to one embodiment, the pattern (460) may include a first Fresnel pattern (461) and a second Fresnel pattern (462). The first Fresnel pattern (461) may have a different shape from the second Fresnel pattern (462). For example, a cross-section of the first Fresnel pattern (461) may include a plurality of inclined planes facing a first direction. For example, a cross-section of the second Fresnel pattern (462) may include a plurality of inclined planes facing a second direction different from the first direction. However, the present invention is not limited thereto. For example, the pattern (460) may further include at least one Fresnel pattern.

[0096] FIG. 7 is a drawing for explaining the light-emitting area and pattern of an LED element according to one embodiment.

[0097] The configuration of FIG. 7 may be referenced by the configuration of other drawings. The same terminology and / or the same reference numerals are used for configurations that are identical or substantially identical to those of other drawings.

[0098] According to one embodiment, the LED element (420) may include a plurality of light-emitting units (421, 422). The plurality of light-emitting units (421, 422) may form at least one light-emitting area. For example, referring to (a) of FIG. 7, a plurality of light-emitting units (421) arranged in a first area may form a first light-emitting area. For example, referring to (c) of FIG. 7, a plurality of light-emitting units (422) arranged in a second area different from the first area may form a second light-emitting area. The first area may be an area surrounded by the second area. However, the present invention is not limited thereto. For example, referring to (b) of FIG. 7, some of the plurality of light-emitting units (422) arranged in the second area may form a plurality of third light-emitting areas included in the second light-emitting area. At least one light-emitting area formed by a plurality of light-emitting parts (421, 422) is not limited to that shown in FIG. 7, and at least one light-emitting area having various sizes and shapes can be formed.

[0099] According to one embodiment, at least one of the one or more lenses (450) may include a first Fresnel pattern (461) and a second Fresnel pattern (462).

[0100] In one example, the first Fresnel pattern (461) may be formed at a location where light emitted from the first light-emitting area of ​​the LED element (420) passes. For example, light emitted from the first light-emitting area may pass through one or more lenses (450). Light emitted from the first light-emitting area may be refracted by at least one of the one or more lenses (450). For example, light emitted from the first light-emitting area may be refracted by the first Fresnel pattern (461).

[0101] In one example, the second Fresnel pattern (462) may be formed at a location through which light emitted from the second light-emitting region of the LED element (420) passes. For example, light emitted from the second light-emitting region may pass through one or more lenses (450). Light emitted from the second light-emitting region may be refracted by at least one of the one or more lenses (450). For example, light emitted from the second light-emitting region may be refracted by the second Fresnel pattern (462).

[0102] According to one embodiment, the direction in which light refracted by the first Fresnel pattern (461) is directed may be different from the direction in which light refracted by the second Fresnel pattern (462) is directed. For example, a first angle between the direction of the central axis of one or more lenses (450) and the direction in which light refracted by the first Fresnel pattern (461) is directed may be different from a second angle between the direction of the central axis of one or more lenses (450) and the direction in which light refracted by the second Fresnel pattern (462) is directed. In one example, the second angle may be greater than the first angle. However, the present invention is not limited thereto.

[0103] FIG. 8 is a cross-sectional view of a flash device including a first lens and a second lens according to one embodiment.

[0104] The flash unit (500) of FIG. 8 may be referenced by flash units of other drawings. The same terminology and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings. For example, at least one of the first lenses (580) or the second lenses (550) of FIG. 8 may be referenced by one or more lenses (150) of FIG. 1. For example, the first lens cover (570) and the second lens cover (540) of FIG. 8 may be referenced by the lens cover (140) of FIG. 1.

[0105] Referring to FIG. 8, a flash device (500) according to an embodiment may include an LED element (520), a light receiving unit (e.g., a light receiving unit of a light sensor (530)), one or more first lenses (580) and one or more second lenses (550). However, the configuration of the flash device (500) is not limited thereto. For example, the flash device (500) may omit at least one of the above-described configurations or may further include at least one other configuration. For example, the flash device (500) may further include at least one of a first lens cover (570) including one or more first lenses (580) or a second lens cover (540) including one or more second lenses (550). For example, the flash device (500) may further include a film member (590) disposed on the light sensor (530).

[0106] According to one embodiment, the first lens cover (570) may cover the LED element (520) and the light receiving unit (e.g., the light receiving unit of the light sensor (530)). For example, one or more first lenses (580) may cover the LED element (520) and the light receiving unit.

[0107] According to one embodiment, the second lens cover (540) may cover the LED element (520). For example, one or more second lenses (550) may cover the LED element (520). However, the present invention is not limited thereto. For example, the second lens cover (540) may cover the LED element (520) and the light receiving unit (e.g., the light receiving unit of the light sensor (530)). For example, one or more second lenses (550) may cover the LED element (520) and the light receiving unit.

[0108] According to one embodiment, one or more second lenses (550) may be positioned between one or more first lenses (580) and the LED elements (520). Light emitted from the LED elements (520) may pass through the first lens cover (570). For example, light emitted from the LED elements (520) may be incident on one or more second lenses (550) and may pass through one or more second lenses (550). Light passing through one or more second lenses (550) may pass through the first lens cover (570). For example, light passing through one or more second lenses (550) may be incident on one or more first lenses (580) and may pass through one or more first lenses (580).

[0109] According to one embodiment, at least one of the one or more first lenses (580) or the one or more second lenses (550) may include a pattern (560). For example, referring to FIG. 8, at least one of the one or more second lenses (550) may include a pattern (560). However, the present invention is not limited thereto.

[0110] According to one embodiment, the second lens cover (540) may include an organic silicon compound. For example, the second lens among the one or more second lenses (550) that is positioned closest to the LED element (520) may include an organic silicon compound.

[0111] According to one embodiment, the first lens cover (570) may include an organosilicon compound. For example, one or more of the first lenses (580) may include an organosilicon compound.

[0112] According to one embodiment, the second lens cover (540) may be disposed on the substrate (510). For example, the second lens cover (540) may be disposed on the substrate (510) to at least partially surround the LED element (520). For example, the second lens cover (540) may at least partially surround the LED element (520). For example, the LED element (520) may be disposed within a space formed by the second lens cover (540).

[0113] According to one embodiment, the second lens cover (540) may be positioned spaced apart from the LED element (520) by a predetermined distance. For example, the second lens that is positioned closest to the LED element (520) among one or more second lenses (550) may be positioned spaced apart from the LED element (520) by a predetermined distance. In one example, the predetermined distance may be about 0.3 mm or less. However, the present invention is not limited thereto. For example, the second lens cover (540) may be in contact with the LED element (520). For example, the second lens that is positioned closest to the LED element (520) among one or more second lenses (550) may be in contact with the LED element (520).

[0114] FIG. 9 is a drawing for explaining an LED element including a light emitting unit and a light receiving unit according to one embodiment.

[0115] The flash device (600) of FIG. 9 may be referenced by flash devices of other drawings. The same terminology and / or the same reference numerals are used for components that are identical or substantially identical to those of other drawings.

[0116] Referring to FIG. 9, an LED element (620) according to one embodiment may include a light emitting unit (621) and a light receiving unit (622). For example, the light emitting unit (621) and the light receiving unit (622) may be arranged in the LED element (620). In one example, the LED element (620) may include a plurality of light emitting units (621). The plurality of light emitting units (621) may be arranged in the LED element (620). In one example, the light receiving unit (622) may include a plurality of photodiodes. For example, the light receiving unit (622) may include a photodiode array. For example, the plurality of photodiodes may be arranged in the LED element (620).

[0117] According to one embodiment, the lens cover (640) may cover the light emitting portion (621) and the light receiving portion (622) disposed on the LED element (620). For example, one or more lenses (650) may cover the light emitting portion (621) and the light receiving portion (622) disposed on the LED element (620). For example, when looking down at the flash device (600), the light emitting portion (621) and the light receiving portion (622) disposed on the LED element (620) may overlap with one or more lenses (650).

[0118] According to one embodiment, light emitted from the light emitting unit (621) may be incident on one or more lenses (650) and may pass through one or more lenses (650). According to one embodiment, the light receiving unit (622) may receive ambient light.

[0119] FIG. 10 is a plan view of an electronic device including a flash device and a plurality of camera devices according to one embodiment.

[0120] The electronic device and its configuration in FIG. 10 may be referenced by the electronic device and its configuration in other drawings. The same terminology and / or the same reference numerals are used for configurations that are identical or substantially identical to those in other drawings.

[0121] According to one embodiment, the electronic device (700) may include at least one processor (e.g., the processor (820) of FIG. 11), a memory (e.g., the memory (830) of FIG. 11), a housing (720), a plurality of camera devices (e.g., a first camera device (731) and a second camera device (732)), or at least one flash device (740). However, the configuration of the electronic device (700) is not limited thereto. For example, the electronic device (700) may omit at least one of the above-described configurations, or may further include at least one other configuration. For example, the electronic device (700) may further include a display (710).

[0122] According to one embodiment, at least one processor may execute at least one camera device among a plurality of camera devices and set and support a designated shooting mode so that at least one camera device can perform an operation intended by a user. An application associated with at least one camera device among the plurality of camera devices may be stored in the memory. The camera device may acquire an image corresponding to a subject using at least one camera lens and at least one image sensor (e.g., the image sensor (930) of FIG. 12). For example, the plurality of camera devices may include a first camera device (731), a second camera device (732), and a third camera device (733). However, the present invention is not limited thereto. For example, the plurality of camera devices may omit at least one of the above-described camera devices, or may further include at least one camera device.

[0123] According to one embodiment, a display (710) may be disposed on a first surface (e.g., a front surface or a first side) of an electronic device (700). In one embodiment, the display (710) may occupy most of the front surface of the electronic device (700). Components performing optical functions (e.g., a camera device (e.g., a third camera device (733)), a proximity sensor, and / or a distance sensor) may be disposed on the first surface of the electronic device (700). For example, the components performing the optical functions may be disposed within an area where the display (710) is disposed.

[0124] According to one embodiment, a third camera device (733) may be arranged on the first side of the electronic device (700). In one embodiment, the third camera device (733) may be visually exposed through a camera hole of the display (710). In one embodiment, the third camera device (733) may include an under display camera (UDC) that is exposed through at least one micro-hole of the display (710). For example, if the third camera device (733) is a UDC, the third camera device (733) may not be visually exposed by the display (710). In the embodiment of FIG. 10, the third camera device (733) is illustrated as being exposed through at least a portion within an area where the display (710) is arranged, but is not limited thereto.

[0125] According to one embodiment, the electronic device (700) may include a plurality of third camera devices (733) on the front. In one embodiment, the plurality of third camera devices (733) may be cameras of the same type with equivalent specifications (e.g., pixels or field of view (FOV)), but may also be implemented as cameras with different specifications. For example, the electronic device (700) may support functions related to a dual camera (e.g., depth measurement, auto focus (AF), face recognition, 3D selfie) through two third camera devices (733).

[0126] According to one embodiment, a first camera device (731) and a second camera device (732) may be arranged on a second side (e.g., a rear side or a second side) of the electronic device (700). However, the present invention is not limited thereto. For example, one of the above-described camera devices may be omitted, or at least one additional camera device may be arranged on the second side of the electronic device (700).

[0127] According to one embodiment, the first camera device (731) and the second camera device (732) may be visually exposed through at least one area (e.g., the camera area (730)) of the cover (750). In one embodiment, the camera devices disposed on the second side of the electronic device (700) may have different specifications. For example, at least some of the angle of view (FOV), pixels, sensing wavelength band, aperture, whether optical zoom / digital zoom is supported, whether image shake correction function (e.g., optical image stabilization (OIS), digital image stabilization (DIS), electrical image stabilization (EIS)) of the camera devices disposed on the second side of the electronic device (700) may be different from each other, and the type and arrangement of the lens assembly (or lens group) included in each camera device may be different from each other. For example, the first camera device (731) may be a general camera (e.g., a camera with a narrower angle of view than the second camera device (732), and the second camera device (732) may be at least one of a camera for wide shooting or a camera for telephoto shooting. In one example, the electronic device (700) may include a first camera device (731) which is a general camera, a second camera device (732) for wide shooting, and a fourth camera device (not shown) for telephoto shooting. According to one embodiment, at least two of the plurality of camera devices arranged on the second side of the electronic device (700) may have the same specifications. In the present disclosure, a description of the function or characteristic of the first camera device (731) may be applied to the second camera device (732), and vice versa.

[0128] According to one embodiment, various hardware or sensors (e.g., sensor module (876) of FIG. 11) that assist in shooting, such as a flash device (740) (e.g., flash device (100) of FIG. 1), may be placed in the electronic device (700). For example, a distance sensor (e.g., time of flight (TOF) sensor) for detecting the distance between a subject and the electronic device (700) may be further included in the camera area (730).

[0129] According to one embodiment, the flash device (740) may be positioned to face substantially the same direction as at least one of the plurality of camera devices. For example, the flash device (740) may be positioned on the second side of the electronic device (700) together with the first camera device (731) and / or the second camera device (732). The flash device (740) may be positioned to face substantially the same direction as the direction in which the first camera device (731) and / or the second camera device (732) face (e.g., the direction in which the second side faces).

[0130] According to one embodiment, at least one of the one or more lenses included in the flash device (740) (e.g., one or more lenses (150) of FIG. 1) may include a pattern. For example, the pattern may include at least one Fresnel pattern.

[0131] In one embodiment, at least one Fresnel pattern (or at least one Fresnel lens) may be formed such that the flash device (740) has a wider field of view than at least one of the plurality of camera devices (e.g., the first camera device (731) and / or the second camera device (732)).

[0132] Referring to FIGS. 7 and 10, according to one embodiment, at least one processor may cause light to be emitted from a first light-emitting area of ​​an LED element (e.g., the LED element (420) of FIG. 7) based on a first mode in which a first camera device (731) among a plurality of camera devices operates. For example, referring to FIG. 7 (a), at least one processor may cause light to be emitted only from the first light-emitting area of ​​the LED element based on the first mode. For example, at least one processor may cause light to be emitted from the first light-emitting area of ​​the LED element and not to be emitted from a light-emitting area (e.g., a second light-emitting area) other than the first light-emitting area among the light-emitting areas of the LED element based on the first mode.

[0133] In one embodiment, light emitted from the first light-emitting region can pass through one or more lenses (450). For example, at least one of the one or more lenses (450) can refract light emitted from the first light-emitting region. For example, the first Fresnel pattern (461) can refract light emitted from the first light-emitting region. In one example, in the first mode, the flash device (740) can have a first angle of view.

[0134] According to one embodiment, at least one processor may cause light to be emitted from a second light-emitting area of ​​an LED element (e.g., the LED element (420) of FIG. 7) based on a second mode in which a first camera device (731) among the plurality of camera devices operates. For example, referring to FIG. 7 (c), at least one processor may cause light to be emitted only from the second light-emitting area of ​​the LED element based on the second mode. For example, at least one processor may cause light to be emitted from the second light-emitting area of ​​the LED element and not to be emitted from a light-emitting area (e.g., a first light-emitting area) of the LED element other than the second light-emitting area, based on the second mode.

[0135] In one embodiment, light emitted from the second light-emitting region can pass through one or more lenses (450). For example, at least one of the one or more lenses (450) can refract light emitted from the second light-emitting region. For example, the second Fresnel pattern (462) can refract light emitted from the second light-emitting region. In one example, in the second mode, the flash device (740) can have a second angle of view.

[0136] In one example, the first angle of view may be different from the second angle of view. For example, the second angle of view may be larger than the first angle of view. However, this is not limited thereto.

[0137] As described above, a flash device according to an embodiment (e.g., flash device (100) of FIG. 1) may include an LED element that emits light (e.g., LED element (120) of FIG. 1). The flash device may include a light-receiving unit (e.g., light-receiving unit (131) of FIG. 3). The flash device may include a lens cover (e.g., lens cover (140) of FIG. 1) that includes one or more lenses (e.g., lens (150) of FIG. 1) that cover the LED element and the light-receiving unit to allow the light to pass therethrough. At least one of the one or more lenses may include a pattern (e.g., pattern (160) of FIG. 1). A lens of the one or more lenses that is arranged closest to the LED element may include an organic silicon compound.

[0138] In one embodiment, the organic silicon compound may have a transmittance of about 80% or greater.

[0139] According to one embodiment, the LED element may have a light output of 300 lm or more and 800 lm or less to implement the brightness of the flash device.

[0140] In one embodiment, the LED element may include one or more LED chips. The LED element may include a phosphor that converts the wavelength of light emitted from the one or more LED chips.

[0141] In one embodiment, the lens positioned closest to the LED element may be positioned a first length apart from the LED element. The first length may be about 0.3 mm or less.

[0142] According to one embodiment, the lens positioned closest to the LED element may be positioned so as to be in contact with the LED element.

[0143] According to one embodiment, the light receiving unit may include a plurality of photodiodes. The one or more lenses may cover the plurality of photodiodes.

[0144] In one embodiment, the flash device may include a substrate (e.g., substrate (110) of FIG. 1). The flash device may further include an optical sensor (e.g., optical sensor (130) of FIG. 1) disposed on the substrate. The LED element may be disposed on the substrate. The optical sensor may include the light receiving portion. The optical sensor may be disposed adjacent to the LED element such that the light receiving portion overlaps the one or more lenses.

[0145] According to one embodiment, the LED element may include one or more light-emitting units (e.g., light-emitting units (621) of FIG. 9). The LED element may include a light-receiving unit (e.g., light-receiving unit (622) of FIG. 9). The light-receiving unit may include a plurality of photodiodes.

[0146] In one embodiment, the pattern may include at least one Fresnel pattern. The flash device may be included in an electronic device including a plurality of camera devices (e.g., the electronic device (700) of FIG. 10). The flash device may be positioned to face substantially the same direction as at least one of the plurality of camera devices. The at least one Fresnel pattern may be formed such that the flash device has a wider angle of view than one of the plurality of camera devices.

[0147] According to one embodiment, the pattern may include a first Fresnel pattern (e.g., the first Fresnel pattern (461) of FIG. 6) and a second Fresnel pattern (e.g., the second Fresnel pattern (462) of FIG. 6). The first Fresnel pattern may be formed at a location through which light emitted from a first light-emitting region of the LED element passes. The second Fresnel pattern may be formed at a location through which light emitted from a second light-emitting region of the LED element, which is different from the first light-emitting region of the LED element, passes.

[0148] According to one embodiment, the electronic device may include a plurality of camera devices. The electronic device may include at least one processor. The electronic device may include a memory that stores instructions that are executed by the at least one processor, such that the electronic device causes light to be emitted from the first light-emitting area of ​​the LED element based on a first mode in which a first camera device among the plurality of camera devices operates, and causes light to be emitted from the second light-emitting area of ​​the LED element based on a second mode in which a second camera device among the plurality of camera devices operates. In the first mode, the flash device may have a first angle of view. In the second mode, the flash device may have a second angle of view different from the first angle of view.

[0149] According to one embodiment, at least one of the one or more lenses and the lens cover may be formed integrally. The lens cover may include an organic silicon compound.

[0150] In one embodiment, the lens cover may include a side formed to at least partially surround the LED element.

[0151] As described above, a flash device according to an embodiment (e.g., flash device (500) of FIG. 8) may include an LED element that emits light. The flash device may include a light-receiving portion. The flash device may include a lens cover including one or more first lenses that cover the LED element and the light-receiving portion to allow the light to pass therethrough. The flash device may include one or more second lenses arranged between the LED element and the one or more first lenses to allow the light to pass therethrough. At least one of the one or more first lenses or the one or more second lenses may include a pattern. A second lens of the one or more second lenses that is arranged closest to the LED element may include an organic silicon compound.

[0152] In one embodiment, the organic silicon compound may have a transmittance of about 80% or greater.

[0153] According to one embodiment, the LED element may have a light output of 300 lm or more and 800 lm or less to implement the brightness of the flash device.

[0154] In one embodiment, the LED element may include one or more LED chips. The LED element may include a phosphor that converts the wavelength of light emitted from the one or more LED chips.

[0155] According to one embodiment, the second lens positioned closest to the LED element may be positioned at a predetermined distance from the LED element. The predetermined distance may be about 0.3 mm or less.

[0156] According to one embodiment, the second lens positioned closest to the LED element may be positioned to be in contact with the LED element.

[0157] Below, with reference to FIGS. 11 and 12, we specify and expand upon devices to which various embodiments disclosed in this document can be applied or expanded.

[0158] FIG. 11 is a block diagram of an electronic device within a network environment according to various embodiments. Referring to FIG. 11, in a network environment (800), an electronic device (801) (e.g., the electronic device (700) of FIG. 10) may communicate with an electronic device (802) via a first network (898) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (804) or a server (808) via a second network (899) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (801) may communicate with the electronic device (804) via the server (808). According to one embodiment, the electronic device (801) may include a processor (820), a memory (830), an input module (850), an audio output module (855), a display module (860), an audio module (870), a sensor module (876), an interface (877), a connection terminal (878), a haptic module (879), a camera module (880), a power management module (888), a battery (889), a communication module (890), a subscriber identification module (896), or an antenna module (897). In some embodiments, the electronic device (801) may omit at least one of these components (e.g., the connection terminal (878)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (876), the camera module (880), or the antenna module (897)) may be integrated into one component (e.g., the display module (860)).

[0159] The processor (820) may, for example, execute software (e.g., a program (840)) to control at least one other component (e.g., a hardware or software component) of the electronic device (801) connected to the processor (820) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (820) may store commands or data received from other components (e.g., a sensor module (876) or a communication module (890)) in a volatile memory (832), process the commands or data stored in the volatile memory (832), and store result data in a non-volatile memory (834). According to one embodiment, the processor (820) may include a main processor (821) (e.g., a central processing unit or an application processor) or an auxiliary processor (823) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (821). For example, when the electronic device (801) includes the main processor (821) and the auxiliary processor (823), the auxiliary processor (823) may be configured to use less power than the main processor (821) or to be specialized for a given function. The auxiliary processor (823) may be implemented separately from the main processor (821) or as a part thereof.

[0160] The auxiliary processor (823) may control at least a portion of functions or states associated with at least one component (e.g., a display module (860), a sensor module (876), or a communication module (890)) of the electronic device (801), for example, on behalf of the main processor (821) while the main processor (821) is in an inactive (e.g., sleep) state, or together with the main processor (821) while the main processor (821) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (823) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (880) or a communication module (890)). In one embodiment, the auxiliary processor (823) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (801) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (808)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0161] The memory (830) can store various data used by at least one component (e.g., the processor (820) or the sensor module (876)) of the electronic device (801). The data can include, for example, software (e.g., the program (840)) and input data or output data for commands related thereto. The memory (830) can include a volatile memory (832) or a non-volatile memory (834).

[0162] The program (840) may be stored as software in the memory (830) and may include, for example, an operating system (842), middleware (844), or an application (846).

[0163] The input module (850) can receive commands or data to be used in a component of the electronic device (801) (e.g., a processor (820)) from an external source (e.g., a user) of the electronic device (801). The input module (850) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0164] The audio output module (855) can output audio signals to the outside of the electronic device (801). The audio output module (855) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0165] The display module (860) can visually provide information to an external party (e.g., a user) of the electronic device (801). The display module (860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0166] The audio module (870) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (870) can acquire sound through the input module (850), output sound through the sound output module (855), or an external electronic device (e.g., electronic device (802)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (801).

[0167] The sensor module (876) can detect the operating status (e.g., power or temperature) of the electronic device (801) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (876) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0168] The interface (877) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (801) with an external electronic device (e.g., the electronic device (802)). In one embodiment, the interface (877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0169] The connection terminal (878) may include a connector through which the electronic device (801) may be physically connected to an external electronic device (e.g., the electronic device (802)). In one embodiment, the connection terminal (878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0170] The haptic module (879) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (879) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0171] The camera module (880) can capture still images and moving images. According to one embodiment, the camera module (880) may include one or more camera lenses, image sensors, image signal processors, or flashes (e.g., the flash device (100) of FIG. 1).

[0172] The power management module (888) can manage the power supplied to the electronic device (801). According to one embodiment, the power management module (888) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0173] A battery (889) may power at least one component of the electronic device (801). In one embodiment, the battery (889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0174] The communication module (890) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (801) and an external electronic device (e.g., electronic device (802), electronic device (804), or server (808)), and the performance of communication through the established communication channel. The communication module (890) may operate independently from the processor (820) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (890) may include a wireless communication module (892) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (894) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (804) via a first network (898) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (899) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (892) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (896) to verify or authenticate the electronic device (801) within a communication network such as the first network (898) or the second network (899).

[0175] The wireless communication module (892) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (892) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (892) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (892) may support various requirements specified in the electronic device (801), an external electronic device (e.g., the electronic device (804)), or a network system (e.g., the second network (899)). According to one embodiment, the wireless communication module (892) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0176] The antenna module (897) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (897) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (898) or the second network (899), may be selected from the plurality of antennas by, for example, the communication module (890). A signal or power may be transmitted or received between the communication module (890) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (897).

[0177] According to various embodiments, the antenna module (897) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0178] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0179] According to one embodiment, commands or data may be transmitted or received between the electronic device (801) and an external electronic device (804) via a server (808) connected to a second network (899). Each of the external electronic devices (802 or 104) may be the same or a different type of device as the electronic device (801). According to one embodiment, all or part of the operations executed in the electronic device (801) may be executed in one or more of the external electronic devices (802, 104, or 108). For example, when the electronic device (801) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (801) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (801). The electronic device (801) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (801) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (804) may include an Internet of Things (IoT) device. The server (808) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (804) or the server (808) may be included in the second network (899).The electronic device (801) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0180] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0181] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0182] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0183] Various embodiments of the present document may be implemented as software (e.g., a program (840)) including one or more instructions stored in a storage medium (e.g., an internal memory (836) or an external memory (838)) readable by a machine (e.g., an electronic device (801)). For example, a processor (e.g., a processor (820)) of the machine (e.g., an electronic device (801)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0184] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0185] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0186] FIG. 12 is a block diagram (900) illustrating a camera module (880) (e.g., the first camera device (731) of FIG. 10 and / or the second camera device (732) of FIG. 10) according to various embodiments. Referring to FIG. 12, the camera module (880) may include a lens assembly (910), a flash (920) (e.g., the flash device (100) of FIG. 1), an image sensor (930), an image stabilizer (940), a memory (950) (e.g., a buffer memory), or an image signal processor (960). The lens assembly (910) may collect light emitted from a subject that is a target of image capturing. The lens assembly (910) may include one or more camera lenses. According to one embodiment, the camera module (880) may include a plurality of lens assemblies (910). In this case, the camera module (880) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (910) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. The lens assembly (910) may include, for example, a wide-angle lens or a telephoto lens.

[0187] The flash (920) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (920) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (930) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (910) into an electrical signal. According to one embodiment, the image sensor (930) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (930) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0188] The image stabilizer (940) can move at least one camera lens or image sensor (930) included in the lens assembly (910) in a specific direction or control the operating characteristics of the image sensor (930) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (880) or the electronic device (801) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. In one embodiment, the image stabilizer (940) can detect such movement of the camera module (880) or the electronic device (801) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (880). In one embodiment, the image stabilizer (940) can be implemented as, for example, an optical image stabilizer. The memory (950) can temporarily store at least a portion of the image acquired through the image sensor (930) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (950), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (860). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (950) can be acquired and processed, for example, by the image signal processor (960). According to one embodiment, the memory (950) can be configured as at least a portion of the memory (830) or as a separate memory that operates independently therefrom.

[0189] The image signal processor (960) can perform one or more image processing operations on an image acquired through an image sensor (930) or an image stored in a memory (950). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (960) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (880) (e.g., the image sensor (930)). The image processed by the image signal processor (960) may be stored back in the memory (950) for further processing or provided to an external component of the camera module (880) (e.g., the memory (830), the display module (860), the electronic device (802), the electronic device (804), or the server (808)). In one embodiment, the image signal processor (960) may include at least one of the processors (820). It may be configured as a separate processor that operates independently of the processor (820) or may be configured as a separate processor from the processor (820). If the image signal processor (960) is configured as a separate processor from the processor (820), at least one image processed by the image signal processor (960) may be displayed through the display module (860) as is or after undergoing additional image processing by the processor (820).

[0190] According to one embodiment, the electronic device (801) may include a plurality of camera modules (880), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules (880) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (880) may be a front camera, and at least another may be a rear camera.

[0191] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0192] The methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0193] When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. The one or more programs include instructions that cause the electronic device to execute methods according to the embodiments described in the claims or specification of the present disclosure.

[0194] In the present disclosure, the functions or operations performed by the electronic device may be performed by one or more processors executing one or more instructions stored in a memory. The functions or operations of the electronic device mentioned in the present disclosure may be performed by one processor executing one or more instructions, or may be performed by a combination of multiple processors executing one or more instructions. The processor mentioned in the present disclosure may be understood to include circuitry for performing calculations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a microprocessor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on a chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operations of the electronic device described above.

[0195] In the present disclosure, a program (software module, software) may be stored in a non-volatile memory including a random access memory (RAM), a flash memory, a read only memory (ROM), an electrically erasable programmable read only memory (EEPROM), a magnetic disc storage device, a compact disc ROM (CD-ROM), digital versatile discs (DVDs) or other forms of optical storage devices, a magnetic cassette. Or, it may be stored in a memory formed by a combination of some or all of these. The memory may be formed by a single storage medium, or may be formed by a combination of a plurality of storage media. The one or more commands may be stored in a single storage medium, or may be distributed and stored in a plurality of storage media.

[0196] Additionally, the program may be stored on an attachable storage device that is accessible via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure via an external port. Additionally, a separate storage device on the communication network may be connected to a device performing an embodiment of the present disclosure.

[0197] In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural form, depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components. Components expressed in the plural form may be composed of singular elements, or components expressed in the singular form may be composed of plural elements.

[0198] Additionally, in the present disclosure, terms such as “part”, “module”, etc. may refer to a hardware component such as a processor or circuit, and / or a software component executed by a hardware component such as a processor.

[0199] A "component" or "module" may be implemented by a program stored in an addressable storage medium and executed by a processor. For example, a "component" or "module" may be implemented by components such as software components, object-oriented software components, class components, and task components, processes, functions, properties, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables.

[0200] The specific implementations described in this disclosure are merely exemplary and do not limit the scope of the present disclosure in any way. For the sake of brevity, descriptions of conventional electronic components, control systems, software, and other functional aspects of the systems may be omitted.

[0201] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, including only b, including only c, or including a combination of two or more (including a and b, including b and c, including a and c, or including all of a, b, and c).

[0202] While the detailed description of this disclosure has described specific embodiments, it should be understood that various modifications are possible without departing from the scope of this disclosure. Therefore, the scope of this disclosure should not be limited to the described embodiments, but should be defined not only by the scope of the claims described below, but also by equivalents thereof.

Claims

1. In flash devices, A light emitting diode (LED) device that emits light; photoreceptor; and A lens cover including one or more lenses through which the light passes; The one or more lenses cover the LED element and the light receiving portion, At least one of said one or more lenses comprises a pattern, Among the one or more lenses, the lens closest to the LED element comprises an organic silicon compound. Flash device.

2. In claim 1, The above organic silicon compound has a transmittance of about 80% or more. Flash device.

3. In claim 1, The above LED element has a light output of 300 lm or more and 800 lm or less to implement the brightness of the flash device. Flash device.

4. In claim 1, The LED element comprises one or more LED chips and a phosphor that converts the wavelength of light emitted from the one or more LED chips. Flash device.

5. In claim 1, The lens that is positioned closest to the LED element is positioned at a first distance from the LED element, The above first length is about 0.3 mm or less, Flash device.

6. In claim 1, The lens positioned closest to the LED element is positioned so as to be in contact with the LED element. Flash device.

7. In claim 1, The above light-receiving unit includes a plurality of photodiodes, The one or more lenses cover the plurality of photodiodes, Flash device.

8. In claim 1, The flash device further comprises a substrate and a light sensor disposed on the substrate, The above LED element is arranged on the substrate, The above light sensor includes the light receiving portion, and the light receiving portion is positioned adjacent to the LED element so as to overlap with the one or more lenses. Flash device.

9. In claim 1, The above LED element includes a light emitting portion and a light receiving portion, The above light-receiving unit includes a plurality of photodiodes, Flash device.

10. In claim 1, The above pattern comprises at least one Fresnel pattern, The flash device is included in an electronic device including a plurality of camera devices, and is positioned to face substantially the same direction as at least one of the plurality of camera devices, wherein said at least one Fresnel pattern is formed such that said flash device has a wider angle of view than one of said plurality of camera devices; Flash device.

11. In claim 10, The above pattern includes a first Fresnel pattern and a second Fresnel pattern, The first Fresnel pattern is formed at a location through which light emitted from the first light-emitting region of the LED element passes, The second Fresnel pattern is formed at a location where light emitted from the second light-emitting area of ​​the LED element, which is different from the first light-emitting area of ​​the LED element, passes through. Flash device.

12. In claim 11, The above electronic device, Multiple camera devices; at least one processor; and Executed by said at least one processor, said electronic device: Based on the first mode in which the first camera device among the plurality of camera devices operates, light is emitted from the first light-emitting area of ​​the LED element, A memory storing instructions for causing light to be emitted from the second light-emitting area of ​​the LED element based on a second mode in which a second camera device among the plurality of camera devices operates; In the first mode, the flash device has a first angle of view, In the second mode, the flash device has a second angle of view different from the first angle of view, Flash device.

13. In claim 1, At least one of the above lenses and the lens cover are formed integrally, The above lens cover comprises an organic silicon compound, Flash device.

14. In claim 1, The lens cover includes a side formed to at least partially surround the LED element, Flash device.

Images