Electronic device including flexible circuit board

Abstract

The present invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a first housing in which a first support member is disposed; a second housing in which a second support member is disposed; a hinge assembly which is connected to the first housing and the second housing, and couples the first housing and the second housing so as to be rotatable about a folding axis; and a flexible circuit board which is disposed in the first housing and the second housing and includes a first fixed part fixed to the first support member. The first support member includes a first seating groove which is recessed, from a surface facing in a first thickness direction of the first support member, in a second thickness direction opposite to the first thickness direction, and the first fixed part may be seated in the first seating groove.

Description

Electronic devices including flexible circuit boards

[0001] Various embodiments of the present disclosure relate to electronic devices including flexible circuit boards, for example, electronic devices capable of improving the morphological structure of flexible circuit boards.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0004] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0005] An electronic device according to one embodiment of the present disclosure includes a flexible circuit board including a first housing in which a first support member is disposed; a second housing in which a second support member is disposed; a hinge assembly connected to the first housing and the second housing and rotatably coupling the first housing and the second housing about a folding axis; and a first fixing portion disposed in the first housing and the second housing and fixed to the first support member, wherein the first support member includes a first fixing groove that is recessed toward a second thickness direction opposite to the first thickness direction on a surface of the first support member facing a first thickness direction, and the first fixing portion can be fixed in the first fixing groove.

[0006] An electronic device according to one embodiment of the present disclosure includes a first housing in which a first support member is disposed; a second housing in which a second support member is disposed; a hinge assembly connected to the first housing and the second housing and rotatably connecting the first housing and the second housing about a folding axis; and a flexible circuit board disposed in the first housing and the second housing, wherein the flexible circuit board may include a first fixing portion fixed to the first support member, a first inner curved portion connected to a first end of the first fixing portion facing the folding axis and formed to be convex in a first thickness direction when the electronic device is in an unfolded state, and a first outer curved portion connected to a second end opposite the first end of the first fixing portion and formed to be convex in the first thickness direction.

[0007] The above-described aspects or other aspects, configurations and / or advantages of various embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0009] FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a front view, a side view, and a rear view of a folded state of an electronic device according to an embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0012] FIG. 5 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 6 is an enlarged cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure.

[0014] FIG. 7 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 8 is a perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 9 is a perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 10 is a perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 11 illustrates a side view of a portion of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 12 illustrates a side view of a part of an electronic device according to one embodiment of the present disclosure.

[0020] Figure 13 is a drawing of Figures 11 and 12 superimposed on each other.

[0021] FIG. 14 is a plan view of a part of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 15 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0023] FIGS. 16 to 22 illustrate an assembly process of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 23 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0025] FIGS. 24 to 26 illustrate an assembly process of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 27 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 28 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 29 is a cross-sectional view illustrating one embodiment of a configuration of an electronic device according to one embodiment of the present disclosure.

[0029] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0030] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0032] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment of the present disclosure.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 illustrates a front view, a side view, and a rear view of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 illustrates a front view, a side view, and a rear view of an electronic device (101) in a folded state according to one embodiment of the present disclosure.

[0063] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a first housing (210), a second housing (220), a flexible or foldable display (230) (hereinafter, abbreviated as “the first display (230)”) disposed in the first housing (210) and the second housing (220) (e.g., the display module (160) of FIG. 1), and a hinge cover (260).

[0064] According to one embodiment, a surface on which the first display (230) is disposed may be defined as a front surface of the electronic device (101). The front surface of the electronic device (101) may be formed by a front plate (e.g., a glass plate or a polymer plate including various coating layers) having at least a portion that is substantially transparent. In addition, a surface opposite to the front surface may be defined as a rear surface of the electronic device (101). The rear surface of the electronic device (101) may be formed by a substantially opaque rear plate (hereinafter referred to as a “rear cover”). The rear cover may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device (101). The side surface may be formed by a side bezel structure (or “side member”) that is coupled to the front plate and the rear cover and includes a metal and / or a polymer. In some embodiments, the rear cover and side bezel structures may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0065] According to one embodiment, the electronic device (101) may include at least one of a first display (230), an audio module (241, 243, 245), a sensor module (255), a camera device (251, 253), a key input device (211, 212, 213), and a connector hole (214). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (211, 212, 213)) or additionally include another component (e.g., a light-emitting element).

[0066] According to one embodiment, the first display (230) may be a display in which at least a portion of the display can be transformed into a flat or curved surface. According to one embodiment, the first display (230) may include a folding area (231c), a first area (231a) disposed on one side (e.g., the upper side of the folding area (231c) illustrated in FIG. 2) with respect to the folding area (231c), and a second area (231b) disposed on the other side (e.g., the lower side of the folding area (231c) illustrated in FIG. 2). However, the division of the areas of the first display (230) illustrated in FIG. 2 is exemplary, and the first display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the areas of the first display (230) may be divided by the folding area (231c) or the folding axis (A), but in one embodiment, the areas of the first display (230) may also be divided by another folding area (231c) or another folding axis (e.g., a folding axis perpendicular to the folding axis (A)).

[0067] According to one embodiment, a microphone hole (241) may have a microphone placed inside to acquire external sound, and in some embodiments, multiple microphones may be placed to detect the direction of the sound.

[0068] According to one embodiment, the speaker holes (243, 245) may include an external speaker hole (243) and a call receiver hole (245). In some embodiments, the speaker holes (243, 245) and the microphone hole (241) may be implemented as a single hole, or a speaker may be included without the speaker hole (243, 245) (e.g., a piezo speaker). The positions and numbers of the microphone hole (241) and the speaker holes (243, 245) may vary depending on the embodiment.

[0069] According to one embodiment, the electronic device (101) may include a first camera device (251) disposed on a first surface (210a) of a first housing (210) of the electronic device (101), and a second camera device (253) disposed on a second surface (210b). In addition, the electronic device (101) may further include a flash (not shown). The camera devices (251, 253) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp.

[0070] According to one embodiment, the sensor module (255) may generate an electric signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. Although not illustrated in the drawing, the electronic device (101) may additionally or alternatively include another sensor module (e.g., the sensor module (176) of FIG. 1) in addition to the sensor module (255) provided on the second surface (210b) of the first housing (210). The electronic device (101) may include, as a sensor module, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, for example.

[0071] According to one embodiment, the key input devices (211, 212, 213) may be disposed on a side of the foldable housing (e.g., the hinge cover (260), the first housing (210), and / or the second housing (220)). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (211, 212, 213), and the key input devices that are not included may be implemented in another form, such as a soft key, on the first display (230). In some embodiments, the key input devices may be configured such that key input is implemented by a sensor module (e.g., a gesture sensor).

[0072] According to one embodiment, the connector hole (214) may be configured to accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, or, additionally or alternatively, a connector for transmitting and receiving audio signals to and from an external electronic device.

[0073] According to one embodiment, a foldable housing may be implemented by combining a first housing (210), a second housing (220), a first back cover (240, back cover), a second back cover (250, back cover) and / or a hinge module (e.g., a hinge structure (270) of FIG. 4 described below). The foldable housing of the electronic device (101) is not limited to the shape and combination illustrated in FIG. 2, and may be implemented by combining and / or combining other shapes or parts. For example, in one embodiment, the first housing (210) and the first back cover (240) may be formed integrally, and the second housing (220) and the second back cover (250) may be formed integrally. According to one embodiment of the present disclosure disclosed in this document, the term 'housing' may mean a combination and / or combined configuration of various other parts that are not mentioned. For example, the first area (231a) of the first display (230) may be described as forming one side of the first housing (210), and in one embodiment, the first area (231a) of the first display (230) may be described as being arranged or attached to one side of the first housing (210).

[0074] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and may include a first side (210a) facing a first direction and a second side (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and includes a third side (220a) facing a third direction and a fourth side (220b) facing a fourth direction opposite to the third direction, and may rotate or pivot with respect to the first housing (210) about the hinge structure (or folding axis (A)).

[0075] According to one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides (or upper / lower sides) with respect to the folding axis (A). The angle or distance at which the first housing (210) and the second housing (220) intersect each other may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state.

[0076] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the first display (230). At least a portion formed of the metallic material may serve as a ground plane or a radiating conductor of the electronic device (101), and when served as a ground plane, may be electrically connected to a ground line formed on a printed circuit board (e.g., printed circuit boards (216, 226) of FIG. 4).

[0077] According to one embodiment, the first rear cover (240) is disposed on one side (e.g., the upper side in FIG. 2) of the folding axis (A) on the rear of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing (210) (and / or the side bezel structure). Similarly, the second rear cover (250) is disposed on the other side (e.g., the lower side in FIG. 2) of the folding axis (A) on the rear of the electronic device (101) and may have its periphery wrapped by the second housing (220) (and / or the side bezel structure).

[0078] According to one embodiment, the first rear cover (240) and the second rear cover (250) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (240) and the second rear cover (250) do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device (101) may include the first rear cover (240) and the second rear cover (250) of various shapes. In one embodiment, the first rear cover (240) may be formed integrally with the first housing (210), and the second rear cover (250) may be formed integrally with the second housing (220).

[0079] According to one embodiment, the first rear cover (240), the second rear cover (250), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (101) (e.g., the printed circuit boards (216, 226) or the batteries (215, 225) of FIG. 4) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the second display (239) may be visually exposed through the first rear cover (240). In one embodiment, one or more components or sensors may be visually exposed through the first rear cover (240). In various embodiments, the components or sensors may include a proximity sensor, a rear camera, and / or a flash. In addition, although not shown separately in the drawing, one or more components or sensors may be visually exposed through the second rear cover (250).

[0080] According to one embodiment, the first rear cover (240) may include a notch (244). The notch (244) may be formed at an edge of the first rear cover (240). For example, the notch (244) may be positioned around the perimeter of the second display (239). For example, the notch (244) may extend along an edge of the second display (239). The notch (244) will be described in detail below.

[0081] According to one embodiment, a front camera device (251) exposed on the front side of the electronic device (101) through one or more openings or a rear camera device (253) exposed through the first rear cover (240) may include one or more lenses, an image sensor, and / or an image signal processor. A flash (not shown) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0082] According to one embodiment, the foldable housing (210, 220, 260) may include a hinge cover (260), a first housing (210), and a second housing (220). The first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270). When the electronic device (101) is changed from an unfolded state to a folded state, the first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270) to bring them closer to each other. When the electronic device (101) is changed from a folded state to an unfolded state, a portion of the first housing (210) and a portion of the second housing (220) may be rotated with respect to the hinge cover (260) to move them away from each other. According to one embodiment of the present disclosure, the folding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and / or the second housing (220) transitions from an unfolded state to a folded state. The unfolding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and / or the second housing (220) transitions from a folded state to an unfolded state.

[0083] According to one embodiment, the electronic device (101) can be configured to have a folded state of the first display (230) or an unfolded state of the first display (230). For example, the first housing (210) and the second housing (220) can rotate about the folding axis (A) between a folded state in which the first region (231a) and the second region (231b) of the first display (230) face each other, and a state in which the first display (230) is unfolded by a specified angle from the folded state (e.g., the unfolded state of the electronic device (101) illustrated in FIG. 2).

[0084] According to one embodiment, as the first housing (210) and the second housing (220) rotate about the folding axis (A), the electronic device (101) may include a folded state and an unfolded state. The folded state may be a state in which the first housing (210) and the second housing (220) face each other, and an angle formed by the first housing (210) and the second housing (220) may be less than a predetermined angle (e.g., 10 degrees). The unfolded state may be a state in which the electronic device (101) is fully unfolded or partially unfolded, and an angle formed by the first housing (210) and the second housing (220) may be greater than or equal to the predetermined angle.

[0085] Fig. 2 illustrates an unfolded state of the electronic device (101) in which the first housing (210) and the second housing (220) form an angle of approximately 180°. Fig. 2 and Fig. 3 illustrate a folded state of the electronic device (101) in which the first housing (210) and the second housing (220) are parallel and facing each other. In the folded state, the first region (231a) and the second region (231b) of the first display (230) can be positioned to face each other, and the folding region (231c) can be bent.

[0086] According to one embodiment, the folding of the electronic device (101) can be implemented in two ways: 'in-folding', in which the first region (231a) and the second region (231b) are folded to face each other, and 'out-folding', in which the first region (231a) and the second region (231b) are folded to face opposite directions. For example, in a folded state in the in-folding manner, the first region (231a) and the second region (231b) can be substantially concealed, and in a fully unfolded state, the first region (231a) and the second region (231b) can be arranged to face substantially the same direction. For example, in the folded state in the out-folding manner, the first region (231a) and the second region (231b) may be arranged facing in opposite directions and exposed to the outside, and in the fully unfolded state, the first region (231a) and the second region (231b) may be arranged facing in substantially the same direction.

[0087] According to one embodiment, the first display (230) may include a display panel (not shown) and a window member (not shown), at least a portion of which may be formed to be flexible. Although not separately illustrated, it will be readily understood by those skilled in the art that the first display (230) or the display panel includes various layers, such as a light-emitting layer, a substrate(s) encapsulating the light-emitting layer, an electrode or wiring layer, and / or an adhesive layer(s) bonding adjacent different layers. When the first display (230) (e.g., the folding area (231c)) is deformed into a flat shape and a curved shape, a relative displacement may occur between the layers forming the first display (230). The relative displacement due to the deformation of the first display (230) may increase as the point is further from the folding axis (A) and / or as the thickness of the first display (230) increases.

[0088] In one embodiment, the window member, for example, a thin film plate, may function as a protective film for protecting the display panel. As a protective film, the thin film plate may be made of a material that protects the display panel from external impact, is scratch-resistant, and reduces wrinkles in the folding area (231c) even during repeated folding and unfolding operations of the housings (210, 220). For example, the material of the thin film plate may include a transparent polyimide film (CPI) or an ultra-thin glass (UTG).

[0089] According to one embodiment, the electronic device (101) may further include a protective member (206)(s) or a decorative cover (218, 228)(s) disposed on at least a portion of an edge of the first display (230) on the front surface (e.g., the first side (210a) or the third side (220a)). As an example, the protective member (206) and the decorative cover (218, 228) may be connected to each other to surround an edge of the first display (230). The protective member (206) or the decorative cover (218, 228) may prevent at least a portion of an edge of the first display (230) from contacting a mechanical structure (e.g., the first housing (210) or the second housing (220)). The protective member (206) or the decorative cover (218, 228) may be visually exposed to the outside of the electronic device (101).

[0090] According to one embodiment, the decorative covers (218, 228) and the protective member (206) may be connected to each other. As an example, the decorative covers (218, 228) and the protective member (206) may be formed integrally. The decorative covers (218, 228) may extend along the folding axis (A). The decorative covers (218, 228) may include a first decorative cover (218) disposed between a portion of an edge of a first area (231a) of the first display (230) and an inner wall of the first housing (210). The decorative covers (218, 228) may include a second decorative cover (228) disposed between a portion of an edge of a second area (231b) of the first display (230) and an inner wall of the second housing (220). As an example, the first decorative cover (218) and the second decorative cover (228) can extend substantially parallel along the folding axis (A).

[0091] According to one embodiment, the speaker hole (245) may be formed in a decorative cover (218) or protective member (206) interposed between the edge of the first area (231a) of the first display (230) and the inner wall of the first housing (210). As an example, the speaker hole (245) may be formed in the first decorative cover (218).

[0092] FIG. 4 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0093] Referring to FIG. 4, according to one embodiment of the present disclosure, the first display (230) may be visually exposed through a significant portion of the front surface of the electronic device (101). In some embodiments, the shape of the first display (230) may be formed to be substantially identical to the outer shape of the front surface of the electronic device (101).

[0094] In FIG. 4, 'Y' may mean the longitudinal direction of the electronic device (101) in the second state. In addition, in one embodiment of the present invention, '+Y' may mean the upward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101), and '-Y' may mean the downward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101).

[0095] According to one embodiment, the foldable housing of the electronic device (101) may include a first housing (210, 310) and a second housing (220, 320). According to one embodiment, the first housing (210) may include a first surface (210a) and a second surface (210b) facing in an opposite direction to the first surface (210a), and the second housing (220) may include a third surface (220a) and a fourth surface (220b) facing in an opposite direction to the third surface (220a). The electronic device (101) or the foldable housing (210, 220, 260) may additionally or alternatively include a bracket assembly (217, 227). The bracket assembly (217, 227) may include a first bracket assembly (217) disposed in a first housing (210) and a second bracket assembly (227) disposed in a second housing (220). At least a portion of the bracket assembly (217, 227), for example, at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227), may serve as a plate for supporting the hinge structure (270).

[0096] According to one embodiment, various electrical components may be arranged on the printed circuit board (216, 226). For example, the printed circuit board (216, 226) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0097] According to one embodiment, the printed circuit boards (216, 226) may include a first printed circuit board (216) disposed on the side of the first bracket assembly (217) and a second printed circuit board (226) disposed on the side of the second bracket assembly (227). The first printed circuit board (216) and the second printed circuit board (226) may be disposed inside a space formed by the foldable housing (210, 220, 260), the bracket assembly (217, 227), the first rear cover (240) and / or the second rear cover (250). Components for implementing various functions of the electronic device (101) may be separately disposed on the first printed circuit board (216) and the second printed circuit board (226). For example, a processor may be disposed on the first printed circuit board (216), and an audio interface may be disposed on the second printed circuit board (226).

[0098] In one embodiment, a battery (215, 225) for powering the electronic device (101) may be disposed adjacent to the printed circuit board (216, 226). At least a portion of the battery (215, 225) may be disposed, for example, substantially coplanar with the printed circuit board (216, 226). In one embodiment, a first battery (215) may be disposed adjacent to the first printed circuit board (216), and a second battery (225) may be disposed adjacent to the second printed circuit board (226). The battery (215, 225) may be a device for powering at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (215, 225) may be integrally placed inside the foldable housing (210, 220, 260), or may be detachably placed in the foldable housing (210, 220, 260).

[0099] In one embodiment, the hinge structure (270) provides a folding axis (e.g., the folding axis (A) of FIG. 2) and may be configured to rotatably connect or couple the foldable housing (210, 220, 260) and / or the bracket assembly (217, 227). The hinge structure (270) may include a first hinge structure (271) disposed on the first printed circuit board (216) side and a second hinge structure (272) disposed on the second printed circuit board (226) side. The hinge structure (270) may be disposed between the first printed circuit board (216) and the second printed circuit board (226). In one embodiment, the hinge structure (270) may be substantially integrally formed with at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227).

[0100] According to one embodiment, a 'housing structure' may refer to a foldable housing (210, 220, 260) and at least one component disposed inside the foldable housing (210, 220, 260) assembled and / or coupled. The housing structure may include a first housing structure and a second housing structure. For example, an assembled configuration including at least one of a first housing (210), a first bracket assembly (217) disposed inside the first housing (210), a first printed circuit board (216), and a first battery (215) may be referred to as a 'first housing structure'. In another example, an assembled configuration including at least one of a second housing (220), a second bracket assembly (227) disposed inside the second housing (220), a second printed circuit board (226), and a second battery (225) may be referred to as a 'second housing structure'. However, it should be noted that the 'first housing structure and second housing structure' here are not limited to the addition of the above-described components, and may additionally include or omit various other components.

[0101] According to one embodiment, the flexible connecting member (280) may be, for example, a flexible printed circuit board (FPCB). The flexible connecting member (280) may connect various electrical components arranged on the first printed circuit board (216) and the second printed circuit board (226). To this end, the flexible connecting member (280) may be arranged to cross the 'first housing structure' and the 'second housing structure'. According to one embodiment, the flexible connecting member (280) may be arranged to cross at least a portion of the hinge structure (270). According to one embodiment, the flexible connecting member (280) may be configured to connect the first printed circuit board (216) and the second printed circuit board (226) across the hinge structure (270) along a direction parallel to the y-axis of FIG. 4, for example. For another example, the flexible connecting member (280) may be extended or arranged through an opening (273, 274) formed in the hinge structure (270). At this time, a part (281) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the first hinge structure (271), and another part (282) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the second hinge structure (272). In addition, another part (283) of the flexible connecting member (280) may be arranged on the other side (e.g., the lower side) of the first hinge structure (271) and the second hinge structure (272). A space (hereinafter referred to as a “wiring space”) surrounded by at least a portion of the first hinge structure (271), at least a portion of the second hinge structure (272), and at least a portion of the hinge cover (260) may be formed adjacent to the first hinge structure (271) and the second hinge structure (272). According to one embodiment, at least a portion (283) of the flexible connecting member (280) may be disposed within the wiring space.

[0102] In one embodiment, the hinge cover (260) may be configured to accommodate or enclose at least a portion of the hinge structure (270) or the wiring space. In some embodiments, the hinge cover (260) may form a wiring space together with the hinge structure (270) and protect a component (e.g., at least a portion (283) of the flexible connecting member (280)) disposed within the wiring space from external impact. In one embodiment, the hinge cover (260) may be disposed between the first housing (210) and the second housing (220). In the in-folding type electronic device (101), the hinge cover (260) may be at least partially concealed by the foldable housing (210, 220, 260). For example, in the folded state, the hinge cover (260) may be visually exposed to the external space between the rear surface of the first housing (210) (e.g., the first rear cover (240)) and the rear surface of the second housing (220) (e.g., the second rear cover (250)), and in the unfolded state, it may be substantially accommodated within the interior of the first housing (210) or the second housing (220) and visually concealed.

[0103] According to one embodiment, the antenna module (219, 229) (e.g., antenna module (197) of FIG. 1) may be disposed between the rear cover (240, 250) and the battery (215, 225). According to one embodiment, the antenna module (219, 229) may include a first antenna module (219) disposed on the first housing (210) side and a second antenna module (229) disposed on the second housing (220) side. The antenna module (219, 229) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna, thereby enabling short-range communication with an external device or wirelessly transmitting and receiving power required for charging. In one embodiment, the antenna structure may be formed by a portion or combination of the side bezel structure and / or the bracket assembly of the foldable housing (210, 220, 260).

[0104] According to one embodiment, the rear cover (240, 250) may include a first rear cover (240) and a second rear cover (250). The rear cover (240, 250) may be combined with the foldable housing (210, 220, 260) to protect the above-described components (e.g., a printed circuit board (216, 226), a battery (215, 225), a flexible connecting member (280), or an antenna module (219, 229)) disposed within the foldable housing (210, 220, 260). As described above, the rear cover (240, 250) may be formed substantially integrally with the foldable housing (210, 220, 260).

[0105] In one embodiment, the protective member (206) and / or the decorative cover (218, 228) can protect at least a portion of an edge of the first display (230). The protective member (206) can be positioned between an edge of a first area (231a, see FIG. 2) of the first display (230) and an inner wall of the first housing (210) and / or between an edge of a second area (231b, see FIG. 2) of the first display (230) and an inner wall of the second housing (220) to prevent the edge of the first display (230) from directly contacting the inner walls of the housings (210, 220).

[0106] FIG. 5 is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 6 is an enlarged cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 7 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 8 is a perspective view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 9 is a perspective view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 10 is a perspective view of a portion of an electronic device according to an embodiment of the present disclosure.

[0107] Specifically, FIG. 5 is an enlarged cross-sectional view of a hinge portion of an electronic device (301). FIG. 6 is an enlarged cross-sectional view of a structure near a first fixing portion (341-1) of a flexible circuit board (340). FIG. 7 is an exploded perspective view of a hinge portion of an electronic device and a flexible circuit board (340). FIG. 8 is an enlarged perspective view of a central portion (344) of a flexible circuit board (340). FIG. 9 is a perspective view of a front portion of a first plate assembly (PA1). FIG. 10 is a perspective view of a rear portion of the first plate assembly (PA1).

[0108] The detailed configuration of an electronic device (301) according to an embodiment of the present disclosure, which is not described below, may be the same as the detailed configuration of an electronic device (101) according to an embodiment of the present disclosure described with reference to FIGS. 1 to 4.

[0109] Hereinafter, the electronic device (301) may include a first housing (311), a second housing (312), a first support member (321), a second support member (322), a hinge assembly (330), a flexible circuit board (340), a first holder (351), a second holder (352), a first front plate (353), a second front plate (354), a first sealing member (355), and a second sealing member (356), but some of these may be omitted and implemented, and additional configurations are not excluded.

[0110] Hereinafter, the 'unfolded state of the electronic device (301)' may mean an unfolded state of the foldable electronic device (301) (e.g., the unfolded state of FIG. 2), and the 'folded state of the electronic device (301)' may mean a folded state of the foldable electronic device (301) (e.g., the folded state of FIG. 3).

[0111] Hereinafter, the 'first direction (+X direction)' may mean a direction toward the folding axis (F) with respect to the first housing (311) when the electronic device (301) is in an unfolded state, or a direction toward the opposite side of the folding axis (F) with respect to the second housing (312) (e.g., a rightward direction with respect to FIG. 5). In addition, the 'second direction (-X direction)' may mean a direction opposite to the first direction (+X direction), a direction toward the opposite side of the folding axis (F) with respect to the first housing (311) when the electronic device (301) is in an unfolded state, or a direction toward the folding axis (F) with respect to the second housing (312) (e.g., a leftward direction with respect to FIG. 5). Additionally, the first thickness direction (+Z direction) may mean a direction in which the electronic device (301) is folded (e.g., an upward direction in FIG. 5) based on the thickness direction of the electronic device (301), the first support member (321), and / or the second support member (322). Additionally, the second thickness direction (-Z direction) may mean a direction opposite to the first thickness direction (+Z direction), an opposite direction to the direction in which the electronic device (301) is folded (e.g., a downward direction in FIG. 5) based on the thickness direction of the electronic device (301), the first support member (321), and / or the second support member (322).

[0112] Hereinafter, the specific structure not described in relation to the second housing (312) area can be understood as a symmetrical structure of the specific structure described in relation to the first housing (311) area with respect to the folding axis (F).

[0113] According to one embodiment, the electronic device (301) may include a first housing (311) (e.g., the first housing (210) of FIGS. 2 to 4). For example, a first support member (321), a portion of a flexible circuit board (340), a first holder (351), a first front plate (353), and / or a first sealing member (355) may be disposed inside the first housing (311). The first housing (311) may be referred to as a 'housing'.

[0114] According to one embodiment, the electronic device (301) may include a first support member (321) (e.g., the first bracket assembly (217) of FIG. 4). The first support member (321) may be disposed in the first housing (311). For example, the first support member (321) may be disposed in an inner space of the first housing (311). The first support member (321) may serve as a structural member for components disposed in the first housing (311). The first support member (321) may be referred to as a 'support member'.

[0115] According to one embodiment, the first support member (321) may include a first mounting groove (3211). The first mounting groove (3211) may be recessed toward a second thickness direction (-Z direction) from a surface of the first support member (321) facing a first thickness direction (+Z direction). The first mounting groove (3211) may be formed in an inner space (S) region of the hinge assembly (330) in the first support member (321). For example, the first mounting groove (3211) may be formed in a region adjacent to the folding axis (F). For example, the first mounting groove (3211) may be formed on a second direction (-X direction) side of the hinge cover (332) when the electronic device (301) is in an unfolded state. A first fixing portion (341-1) of a flexible circuit board (340) can be fixed in the first fixing groove (3211). The first fixing groove (3211) may be referred to as a 'fixing groove'.

[0116] According to one embodiment, the first support member (321) may include a first through hole (3212). The first through hole (3212) may be formed on an opposite side of the folding axis (F) with respect to the first mounting groove (3211). For example, the first through hole (3212) may be formed on a second direction (-X direction) side of the first mounting groove (3211). The first through hole (3212) may be formed by penetrating the first support member (321) in a first thickness direction (+Z direction) and / or a second thickness direction (-Z direction). The flexible circuit board (340) may pass through the first through hole (3212). For example, a portion (e.g., a first outer bending portion (343-1)) disposed on the first thickness direction (+Z direction) side of the first support member (321) among the flexible circuit board (340) may extend to the second thickness direction (-Z direction) side of the first support member (321) by penetrating the first through hole (3212). The first through hole (3212) may be referred to as a 'through hole'.

[0117] According to one embodiment, the first support member (321) may include a first rib (3213). The first rib (3213) may be disposed between the first mounting groove (3211) and the first through hole (3212). The first rib (3213) may protrude in the first thickness direction (+Z direction) from the bottom surface (3211a) of the first mounting groove (3211). For example, the first rib (3213) may form a wall facing the folding axis (F) of the first through hole (3212) and a wall opposite the folding axis (F) of the first mounting groove (3211). For example, the first rib (3213) may be understood as a portion formed when the first fixing groove (3211) of the first support member (321) is sunken in the second thickness direction (-Z direction) from the surface of the first support member (321) facing the first thickness direction (+Z direction). The first rib (3213) may be referred to as a 'rib'.

[0118] According to one embodiment, the first support member (321) may include a first inner wall (3214). The first inner wall (3214) may protrude in a first thickness direction (+Z direction) from a bottom surface (3211a) of the first seating groove (3211). The first inner wall (3214) may form a folding axis (F)-side wall of the first seating groove (3211). For example, the first inner wall (3214) may be understood as a first direction (+X direction)-side wall of the first seating groove (3211) formed as the first seating groove (3211) is sunken. The first inner wall (3214) may be referred to as an 'inner wall'.

[0119] According to one embodiment, the electronic device (301) may include a second housing (312) (e.g., the second housing (220) of FIGS. 2 to 4). For example, a second support member (322), a portion of a flexible circuit board (340), a second holder (352), a second front plate (354), and / or a second sealing member (356) may be disposed inside the second housing (312). The second housing (312) may be referred to as a 'housing'.

[0120] According to one embodiment, the electronic device (301) may include a second support member (322) (e.g., the second bracket assembly (227) of FIG. 4). The second support member (322) may be disposed in the second housing (312). For example, the second support member (322) may be disposed in an inner space of the second housing (312). The second support member (322) may serve as a structural member for components disposed in the second housing (312). The second support member (322) may be referred to as a 'support member'.

[0121] According to one embodiment, the second support member (322) may include a second mounting groove (3221). The second mounting groove (3221) may be recessed toward the second thickness direction (-Z direction) from a surface of the second support member (322) facing the first thickness direction (+Z direction). The second mounting groove (3221) may be formed in an area of ​​the inner space (S) of the hinge assembly (330) in the second support member (322). For example, the second mounting groove (3221) may be formed in an area adjacent to the folding axis (F). For example, the second mounting groove (3221) may be formed on the first direction (+X direction) side of the hinge cover (332) when the electronic device (301) is in an unfolded state. A second fixing portion (341-2) of a flexible circuit board (340) can be fixed in the second fixing groove (3221). The second fixing groove (3221) may be referred to as a 'fixing groove'.

[0122] According to one embodiment, the second support member (322) may include a second through hole (3222). The second through hole (3222) may be formed on an opposite side of the folding axis (F) with respect to the second mounting groove (3221). For example, the second through hole (3222) may be formed on a first direction (+X direction) side of the second mounting groove (3221). The second through hole (3222) may be formed by penetrating the second support member (322) in a first thickness direction (+Z direction) and / or a second thickness direction (-Z direction). The flexible circuit board (340) may pass through the second through hole (3222). For example, a portion (e.g., a second outer curved portion (343-2)) disposed on the first thickness direction (+Z direction) side of the second support member (322) among the flexible circuit board (340) may extend to the second thickness direction (-Z direction) side of the second support member (322) by penetrating the second through hole (3222). The second through hole (3222) may be referred to as a 'through hole'.

[0123] According to one embodiment, the second support member (322) may include a second rib (3223). The second rib (3223) may be disposed between the second mounting groove (3221) and the second through hole (3222). The second rib (3223) may protrude in the first thickness direction (+Z direction) from the bottom surface of the second mounting groove (3221). For example, the second rib (3223) may form a wall facing the folding axis (F) of the second through hole (3222) and a wall opposite the folding axis (F) of the second mounting groove (3221). For example, the second rib (3223) may be understood as a portion formed when the second fixing groove (3221) of the second support member (322) is sunken in the second thickness direction (-Z direction) from the surface of the second support member (322) facing the first thickness direction (+Z direction). The second rib (3223) may be referred to as a 'rib'.

[0124] According to one embodiment, the second support member (322) may include a second inner wall (3224). The second inner wall (3224) may protrude in the first thickness direction (+Z direction) from the bottom surface of the second seating groove (3221). The second inner wall (3224) may form a folding axis (F)-side wall of the second seating groove (3221). For example, the second inner wall (3224) may be understood as a second direction (-X direction)-side wall of the second seating groove (3221) formed as the second seating groove (3221) is sunken. The second inner wall (3224) may be referred to as an 'inner wall'.

[0125] According to one embodiment, the electronic device (301) may include a flexible circuit board (340) (e.g., the flexible connecting member (280) of FIG. 4). The flexible circuit board (340) may be disposed in the internal space (S) of the first housing, the second housing (312), and the hinge assembly (330). For example, the flexible circuit board (340) may extend from the first housing (311) through the internal space (S) of the hinge assembly (330) to the second housing (312).

[0126] According to one embodiment, the flexible circuit board (340) can pass through the first through hole (3212). For example, the first outer bending portion (343-1) disposed on the first thickness direction (+Z direction) side of the first support member (321) (e.g., the first rib (3213)) and the first extension portion (345-1) disposed on the second thickness direction (-Z direction) side of the first support member (321) can be connected to each other by the flexible circuit board (340) passing through the first through hole (3212).

[0127] According to one embodiment, the flexible circuit board (340) can pass through the second through hole (3222). For example, the second outer bending portion (343-2) disposed in the first thickness direction (+Z direction) of the second support member (322) (e.g., the second rib (3223)) and the second extension portion (345-2) disposed in the second thickness direction (-Z direction) of the second support member (322) can be connected to each other as the flexible circuit board (340) passes through the second through hole (3222).

[0128] According to one embodiment, the flexible circuit board (340) may be disposed between the first sealing member (355) and the first rib (3213). For example, the flexible circuit board (340) may be disposed on the first direction (+X direction) side of the first sealing member (355) and the second direction (-X direction) side of the first rib (3213). The flexible circuit board (340) may be in close contact with and extend to the first rib (3213). For example, the flexible circuit board (340) may be in close contact with the first rib (3213) by the first sealing member (355) being fitted into the first through hole (3212). Through this, even though the flexible circuit board (340) passes through the first through hole (3212), waterproofing and / or dustproofing in the first through hole (3212) may be realized.

[0129] According to one embodiment, the flexible circuit board (340) may be disposed between the second sealing member (356) and the second rib (3223). For example, the flexible circuit board (340) may be disposed on the second direction (-X direction) side of the second sealing member (356) and the first direction (+X direction) side of the second rib (3223). The flexible circuit board (340) may be in close contact with and extend to the second rib (3223). For example, the flexible circuit board (340) may be in close contact with the second rib (3223) by the second sealing member (356) being fitted into the first through hole (3212). Through this, even though the flexible circuit board (340) passes through the second through hole (3222), waterproofing and / or dustproofing in the second through hole (3222) may be realized.

[0130] According to one embodiment, the flexible circuit board (340) may include a portion capable of being flexibly deformed. For example, when the electronic device (301) is in a folded state, the length of the space in which the flexible circuit board (340) can be placed between the first through hole (3212) and the second through hole (3222) may be greater than the length of the space in which the flexible circuit board (340) can be placed between the first through hole (3212) and the second through hole (3222) when the electronic device (301) is in an unfolded state. In order to cope with the length of the space in which the flexible circuit board (340) can be placed between the first through hole (3212) and the second through hole (3222) increasing as the electronic device (301) changes from an unfolded state to a folded state, the flexible circuit board (340) may be provided in a curved shape and include a portion capable of being flexibly deformed. For example, the flexible circuit board (340) may include a first inner bend (342-1) and a second inner bend (342-2). This will be described in detail later.

[0131] According to one embodiment, the flexible circuit board (340) may include a first fixing portion (341-1). The first fixing portion (341-1) may be disposed on the first thickness direction (+Z direction) side of the first support member (321). For example, the first fixing portion (341-1) may be disposed in the internal space (S) of the hinge assembly (330). The first fixing portion (341-1) may be referred to as a 'fixing portion'.

[0132] According to one embodiment, the first fixing part (341-1) can be fixed to the first support member (321) of the first housing (311). The first fixing part (341-1) can be fixed in the first mounting groove (3211). For example, the first fixing part (341-1) can be inserted into and fixed in the first mounting groove (3211). For example, the first fixing part (341-1) can be attached to the bottom surface (3211a) of the first mounting groove (3211). For example, the first fixing part (341-1) can be attached to the bottom surface (3211a) of the first mounting groove (3211) by an attachment member (A). However, the present invention is not limited thereto, and the first fixing portion (341-1) may also be coupled to the bottom surface (3211a) of the first fixing groove (3211) through a separate mechanical coupling structure. By the first fixing portion (341-1) being fixed (or inserted) into the first fixing groove (3211), the flexible circuit board (340) may extend in the first thickness direction (+Z direction) from both ends of the first fixing portion (341-1) (e.g., the first end (341-11) and the second end (341-12) of FIG. 6).

[0133] According to one embodiment, since the first fixing portion (341-1) is fixed in the first fixing groove (3211), a sufficient space can be secured between the portion where the flexible circuit board (340) is attached to the first support member (321) and the first hinge plate (333-1). For example, since the first fixing groove (3211) is formed by being recessed in the second thickness direction (-Z direction) and the first fixing portion (341-1) is attached to the bottom surface (3211a) of the first fixing groove (3211), a sufficient space can be secured between the first fixing portion (341-1) and the first hinge plate (333-1). Through this, since a sufficient space can be secured in the internal space (S) of the hinge assembly (330) (e.g., the space between the first support member (321) and the hinge cover (332) and the first hinge plate (333-1)) in which the first inner bending portion (342-1) can be placed, the phenomenon in which the flexible circuit board (340) (e.g., the first inner bending portion (342-1)) is deformed due to pressure from the first hinge plate (333-1) can be reduced, and the defect rate of the flexible circuit board (340) can be reduced. In addition, since a sufficient space in which the first inner bending portion (342-1) can be placed is secured, the radius of curvature (R) of the first inner bending portion (342-1) can be sufficiently secured. For example, the actual value of the radius of curvature (R) of the first inner bend (342-1) may be the same as, or similar to, or greater than the design value of the radius of curvature (R) of the first inner bend (342-1). Through this, excessive bending of the first inner bend (342-1) can be reduced, and the defect rate of the flexible circuit board (340) can be reduced. In addition, since a sufficient space in which the first inner bend (342-1) can be placed is secured, the extension length of the first inner bend (342-1) can also be secured sufficiently, so that when the electronic device (301) is converted to a folded state, damage to the flexible circuit board (340) due to tension applied to the flexible circuit board (340) can be prevented or reduced.

[0134] According to one embodiment, the flexible circuit board (340) may include a first inner bend portion (342-1). The first inner bend portion (342-1) may be connected to a first end portion (341-11) facing the folding axis (F) of the first fixing portion (341-1). For example, the first inner bend portion (342-1) may extend from the first end portion (341-11) facing the first direction (+X direction) of the first fixing portion (341-1). At least a portion of the first inner bend portion (342-1) may be disposed on a first thickness direction (+Z direction) side of the first support member (321). At least a portion of the first inner bend portion (342-1) may be disposed on a first thickness direction (+Z direction) side of the hinge cover (332). The first inner bend (342-1) may be placed in the inner space (S) of the hinge assembly (330). The first inner bend (342-1) may be referred to as an 'inner bend'.

[0135] According to one embodiment, the first inner curved portion (342-1) may be formed to be convex in the first thickness direction (+Z direction) when the electronic device (301) is in an unfolded state. For example, the first inner curved portion (342-1) may be a portion that protrudes in the first thickness direction (+Z direction) by the first inner wall (3214) when the first fixing portion (341-1) is inserted into the first fixing groove (3211) and is seated when the electronic device (301) is in an unfolded state. For example, at least a portion of the first inner curved portion (342-1) (e.g., a portion of the first inner curved portion (342-1) adjacent to the first fixing portion (341-1)) may be in close contact with the first inner wall (3214). For example, the first inner bending portion (342-1) can be understood as a portion that is supported by the first inner wall (3214) and protrudes in the first thickness direction (+Z direction) from the first fixing portion (341-1).

[0136] According to one embodiment, the cover end (3321) of the hinge cover (332) may be arranged inside the curved shape of the first inner curved portion (342-1). For example, the first inner curved portion (342-1) may be a portion that wraps around the periphery of the cover end (3321) when the electronic device (301) is in an unfolded state. Since the protruding height of the first inner curved portion (342-1) is increased through the structure in which the first fixing portion (341-1) is inserted into the first mounting groove (3211), the space in which the cover end (3321) can be arranged inside the curved shape of the first inner curved portion (342-1) can be expanded, and thus the design freedom of the hinge cover (332) can be improved.

[0137] According to one embodiment, the first inner curved portion (342-1) may be a portion that is deformed when the electronic device (301) is converted from an unfolded state to a folded state. For example, the curvature of the first inner curved portion (342-1) when the electronic device (301) is in an unfolded state may be different from the curvature of the first inner curved portion (342-1) when the electronic device (301) is in a folded state. For example, the first inner curved portion (342-1) may be unfolded compared to the state illustrated in FIG. 5 as the electronic device (301) is converted from an unfolded state to a folded state.

[0138] In one embodiment, the flexible circuit board (340) may be unpressurized from the first hinge plate (333-1). For example, the first inner bend (342-1), which is the portion of the flexible circuit board (340) closest to the first hinge plate (333-1), may be unpressurized from the first hinge plate (333-1). For example, the first inner bend (342-1) may only slightly contact the first hinge plate (333-1) or may be spaced apart from the first hinge plate (333-1). Specifically, by inserting the first fixing portion (341-1) into the first fixing groove (3211) formed in the first support member (321), sufficient space for the first inner bending portion (342-1) can be secured in the internal space (S), and accordingly, it can be understood that the first inner bending portion (342-1) has a structure in which it is not pressed by the first hinge plate. Through this, it is possible to reduce defects in the flexible circuit board (340) that occur when stress is applied to the flexible circuit board (340) by the first hinge plate (333-1).

[0139] According to one embodiment, the first inner bending portion (342-1) may include a first portion (342-11) and a second portion (342-12) disposed on both sides of a peak portion of the first inner bending portion (342-1) and parallel to the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction). The first portion (342-11) may be disposed on the opposite side of the folding axis (F) (e.g., the second direction (-X direction) side) with respect to the peak of the first inner bending portion (342-1). The second portion (342-12) may be disposed on the side of the folding axis (F) (e.g., the first direction (+X direction) side) with respect to the peak of the first inner bending portion (342-1). The first part (342-11) and the second part (342-12) may be parts that can be formed by inserting the first fixing part (341-1) into the first fixing groove (3211) so that the gap between the first fixing part (341-1) and the first hinge plate (333-1) increases.

[0140] According to one embodiment, the first inner curved portion (342-1) may include a third portion (342-13). The third portion (342-13) may be a portion positioned between the first portion (342-11) and the second portion (342-12). The third portion (342-13) may be a curved portion. For example, the third portion (342-13) may be a portion that is convexly curved toward the first thickness direction (+Z direction).

[0141] According to one embodiment, the first inner curved portion (342-1) may include two portions that are arranged on both sides based on the peak portion of the first inner curved portion (342-1) and are parallel to the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) or that become further apart from each other as they go in the first thickness direction (+Z direction). For example, referring to FIG. 6, an extension line E1 of the first portion (342-11) and an extension line E2 of the second portion (342-12) may be parallel to the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction). Through this structure, the curvature design of the third portion (342-13) may be facilitated. For example, the first part (342-11) and the second part (342-12) can serve as a margin for the radius of curvature (R) of the third part (342-13). For example, if the distance between the first part (342-11) and the second part (342-12) increases, and the part where the third part (342-13) starts from the first part (342-11) and the second part (342-12) is lowered in the second thickness direction (-Z direction), the radius of curvature of the third part (342-13) can increase. For example, in some cases, as the radius of curvature of the third part (342-13) increases, the first part (342-11) and / or the second part (342-12) may not be formed.

[0142] According to one embodiment, the second inner bend (342-2) may have a shape that is symmetrical with respect to the shape of the first inner bend (342-1) with respect to the folding axis (F). However, the present invention is not limited thereto, and the shape of the second inner bend (342-2) may have a shape different from the shape of the first inner bend (342-1) that is symmetrical with respect to the folding axis (F).

[0143] According to one embodiment, the flexible circuit board (340) may include a first outer bend (343-1). The first outer bend (343-1) may be connected to a second end (341-12) of the first fixing portion (341-1). The second end (341-12) may be an opposite end of the first end (341-11). For example, the first outer bend (343-1) may extend from the second end (341-12) of the first fixing portion (341-1) toward the second direction (-X direction). For example, the first outer bend (343-1) may be disposed in the inner space (S) of the hinge assembly (330). The first outer bend (343-1) may be referred to as an 'outer bend'.

[0144] According to one embodiment, the first outer curved portion (343-1) may be formed to be convex in the first thickness direction (+Z direction). The first outer curved portion (343-1) may be formed in close contact with the first rib (3213). For example, the first outer curved portion (343-1) may be understood as a portion that protrudes in the first thickness direction (+Z direction) by the first rib (3213) when the first fixing portion (341-1) is inserted and seated in the first seating groove (3211). However, the present invention is not limited thereto, and when the first rib (3213) is not provided in the first support member (321), the first outer curved portion (343-1) may not be formed.

[0145] According to one embodiment, a portion of the first outer bend (343-1) may be disposed on the inner side of the first through hole (3212). For example, a portion of the first outer bend (343-1) disposed on the second direction (-X direction) side of the first rib (3213) may be disposed on the inner side of the first through hole (3212) and may be disposed between the first sealing member (355) and the first rib (3213).

[0146] According to one embodiment, the flexible circuit board (340) may include a second fixing portion (341-2). The second fixing portion (341-2) may be fixed to a second support member (322) of the second housing (312). The second fixing portion (341-2) may be disposed on the first thickness direction (+Z direction) side of the second support member (322). For example, the second fixing portion (341-2) may be disposed in the internal space (S) of the hinge assembly (330). The second fixing portion (341-2) may be referred to as a 'fixing portion'.

[0147] According to one embodiment, the second fixing part (341-2) can be fixed in the second fixing groove (3221). For example, the second fixing part (341-2) can be fixed by being inserted into the second fixing groove (3221). For example, the second fixing part (341-2) can be attached to the bottom surface of the second fixing groove (3221). For example, the second fixing part (341-2) can be attached to the bottom surface of the second fixing groove (3221) by an attachment member (A). However, the present invention is not limited thereto, and the second fixing part (341-2) can also be coupled to the bottom surface of the second fixing groove (3221) through a separate mechanical coupling structure. By the second fixing portion (341-2) being fixed (or inserted) into the second fixing groove (3221), the flexible circuit board (340) can extend in the first thickness direction (+Z direction) from both ends of the second fixing portion (341-2).

[0148] According to one embodiment, since the second fixing portion (341-2) is fixed in the second fixing groove (3221), a sufficient space can be secured between the portion where the flexible circuit board (340) is attached to the second support member (322) and the second hinge plate (333-2). For example, since the second fixing groove (3221) is formed by being recessed in the second thickness direction (-Z direction) and the second fixing portion (341-2) is attached to the bottom surface of the second fixing groove (3221), a sufficient space can be secured between the second fixing portion (341-2) and the second hinge plate (333-2). Through this, since a sufficient space can be secured in the internal space (S) of the hinge assembly (330) (e.g., the space between the second support member (322) and the hinge cover (332) and the second hinge plate (333-2)) in which the second inner bending portion (342-2) can be placed, the phenomenon in which the flexible circuit board (340) (e.g., the second inner bending portion (342-2)) is deformed due to pressure from the second hinge plate (333-2) can be reduced, and the defect rate of the flexible circuit board (340) can be reduced. In addition, since a sufficient space in which the second inner bending portion (342-2) can be placed is secured, the radius of curvature (R) of the second inner bending portion (342-2) can be sufficiently secured. For example, the actual value of the radius of curvature (R) of the second inner bend (342-2) may be the same as, or almost similar to, or greater than the design value of the radius of curvature (R) of the second inner bend (342-2). Through this, excessive bending of the second inner bend (342-2) can be reduced, and the defect rate of the flexible circuit board (340) can be reduced. In addition, since a sufficient space in which the second inner bend (342-2) can be placed is secured, the extension length of the second inner bend (342-2) can also be secured sufficiently, so that when the electronic device (301) is converted to a folded state, damage to the flexible circuit board (340) due to tension applied to the flexible circuit board (340) can be prevented or reduced.

[0149] According to one embodiment, the flexible circuit board (340) may include a second inner bend portion (342-2). The second inner bend portion (342-2) may be connected to an end of the second fixing portion (341-2) facing the folding axis (F). For example, the second inner bend portion (342-2) may extend from an end of the second fixing portion (341-2) facing the second direction (-X direction). At least a portion of the second inner bend portion (342-2) may be disposed on the first thickness direction (+Z direction) side of the second support member (322). At least a portion of the second inner bend portion (342-2) may be disposed on the first thickness direction (+Z direction) side of the hinge cover (332). The second inner bend portion (342-2) may be disposed in the internal space (S) of the hinge assembly (330). The second inner bend (342-2) may be referred to as an ‘inner bend’.

[0150] According to one embodiment, the second inner curved portion (342-2) may be formed to be convex in the first thickness direction (+Z direction) when the electronic device (301) is in an unfolded state. For example, the second inner curved portion (342-2) may be a portion that protrudes in the first thickness direction (+Z direction) by the second inner wall (3224) as the second fixing portion (341-2) is inserted and fixed into the second fixing groove (3221) when the electronic device (301) is in an unfolded state. For example, at least a portion of the second inner curved portion (342-2) (e.g., a portion of the second inner curved portion (342-2) adjacent to the second fixing portion (341-2)) may be in close contact with the second inner wall (3224). For example, the second inner bending portion (342-2) can be understood as a portion that is supported by the second inner wall (3224) and protrudes in the first thickness direction (+Z direction) from the second fixing portion (341-2).

[0151] According to one embodiment, the cover end (3321) of the hinge cover (332) may be arranged inside the curved shape of the second inner curved portion (342-2). For example, the second inner curved portion (342-2) may be a portion that wraps around the periphery of the cover end (3321) when the electronic device (301) is in an unfolded state. Since the protruding height of the first inner curved portion (342-1) is increased through the structure in which the second fixing portion (341-2) is inserted into the first fixing groove (3211), the space in which the cover end (3321) can be arranged inside the curved shape of the second inner curved portion (342-2) can be expanded, thereby improving the design freedom of the hinge cover (332).

[0152] According to one embodiment, the second inner curved portion (342-2) may be a portion that is deformed when the electronic device (301) is converted from an unfolded state to a folded state. For example, the curvature of the second inner curved portion (342-2) when the electronic device (301) is in an unfolded state may be different from the curvature of the first inner curved portion (342-1) when the electronic device (301) is in a folded state. For example, the second inner curved portion (342-2) may be unfolded compared to the state illustrated in FIG. 5 as the electronic device (301) is converted from an unfolded state to a folded state.

[0153] In one embodiment, the flexible circuit board (340) may be unpressurized from the second hinge plate (333-2). For example, the second inner curved portion (342-2), which is the portion of the flexible circuit board (340) closest to the second hinge plate (333-2), may be unpressurized from the second hinge plate (333-2). For example, the second inner curved portion (342-2) may only slightly contact the second hinge plate (333-2) or may be spaced apart from the second hinge plate (333-2). Specifically, by inserting the second fixing portion (341-2) into the second fixing groove (3221) formed in the second support member (322), sufficient space for the second inner curved portion (342-2) can be secured in the internal space (S), and accordingly, it can be understood that the second inner curved portion (342-2) has a structure in which it is not pressed by the second hinge plate. Through this, it is possible to reduce defects in the flexible circuit board (340) that occur when stress due to the second hinge plate (333-2) acts on the flexible circuit board (340).

[0154] According to one embodiment, the flexible circuit board (340) may include a second outer bend (343-2). The second outer bend (343-2) may extend from a second end (341-12) facing the second direction (-X direction) of the first fixing portion (341-1). For example, the second outer bend (343-2) may be disposed in the inner space (S) of the hinge assembly (330). The second outer bend (343-2) may be referred to as an 'outer bend'.

[0155] According to one embodiment, the second outer curved portion (343-2) may be formed to be convex in the first thickness direction (+Z direction). The second outer curved portion (343-2) may be formed in close contact with the second rib (3223). For example, the second outer curved portion (343-2) may be understood as a portion that protrudes in the first thickness direction (+Z direction) due to the shape of the second rib (3223) when the second fixing portion (341-2) is inserted and seated in the second seating groove (3221). However, the present invention is not limited thereto, and when the second rib (3223) is not provided in the second support member (322), the second outer curved portion (343-2) may not be formed.

[0156] According to one embodiment, a portion of the second outer bend (343-2) may be disposed on the inner side of the second through hole (3222). For example, a portion of the second outer bend (343-2) disposed on the second direction (-X direction) side of the second rib (3223) may be disposed on the inner side of the second through hole (3222) and may be disposed between the second sealing member (356) and the second rib (3223).

[0157] According to one embodiment, the flexible circuit board (340) may include a central portion (344). The central portion (344) may be disposed on the hinge cover (332). The central portion (344) may be disposed in the internal space (S) of the hinge assembly (330). For example, the central portion (344) may be a portion that is in close contact with the hinge cover (332) when the electronic device (301) is in an unfolded state. The first inner curved portion (342-1) and the second inner curved portion (342-2) may be connected by the central portion 1.

[0158] According to one embodiment, the flexible circuit board (340) may include a first extension portion (345-1). The first extension portion (345-1) may be disposed on the second thickness direction (-Z direction) side of the first support member (321). For example, the first extension portion (345-1) may be a portion that extends in the opposite direction of the folding axis (F) (e.g., the second direction (-X direction)) after passing through the first through hole (3212) in the first outer bend portion (343-1) of the flexible circuit board (340).

[0159] According to one embodiment, the flexible circuit board (340) may include a second extension portion (345-2). The second extension portion (345-2) may be disposed on the second thickness direction (-Z direction) side of the second support member (322). For example, the second extension portion (345-2) may be a portion that passes through the second through hole (3222) in the second outer bend portion (343-2) of the flexible circuit board (340) and then extends in the opposite direction of the folding axis (F) (e.g., the first direction (+X direction)).

[0160] According to one embodiment, the flexible circuit board (340) may include a first connector portion (346) and a second connector portion (347). The first connector portion (346) and the second connector portion (347) may be portions that protrude laterally from the second extension portion (345-2). The first connector portion (346) and the second connector portion (347) may be arranged on the second thickness direction (-Z direction) side of the second support member (322) when the flexible circuit board (340) is assembled to the second support member (322). The first connector portion (346) and the second connector portion (347) may be connected to terminals provided on a surface of the second support member (322) facing the second thickness direction (-Z direction).

[0161] According to one embodiment, the electronic device (301) may include a hinge assembly (330). The hinge assembly (330) may be connected to a first housing (311) and a second housing (312). The hinge assembly (330) may be disposed between the first housing (311) and the second housing (312). The hinge assembly (330) may rotatably couple the first housing (311) and the second housing (312) about a folding axis (F).

[0162] According to one embodiment, the hinge assembly (330) may include an internal space (S). The internal space (S) may be defined by a hinge cover (332), a first hinge plate (333-1), and a second hinge plate (333-2). The internal space (S) may refer to a space between the hinge cover (332) and the first hinge plate (333-1) and a space between the hinge cover (332) and the second hinge plate (333-2). The internal space (S) may include a space between a portion of the first support member (321) and the first hinge plate (333-1). The internal space (S) may include a space between a portion of the second support member (322) and the first hinge plate (333-1).

[0163] According to one embodiment, the internal space (S) can accommodate at least a portion of the flexible circuit board (340). For example, the first fixing portion (341-1), the first inner bending portion (342-1), the first outer bending portion (343-1), the second fixing portion (341-2), the second inner bending portion (342-2), and / or the second outer bending portion (343-2) of the flexible circuit board (340) can be accommodated in the internal space (S).

[0164] According to one embodiment, the hinge assembly (330) may include a hinge module (331). The hinge module (331) may be disposed in an internal space (S) of the hinge assembly (330). The hinge module (331) may be disposed on a first thickness direction (+Z direction) side of the first support member (321), the second support member (322), and the hinge cover (332). The hinge module (331) may be coupled to the first support member (321) and the second support member (322). The hinge module (331) may provide a mechanical mechanism that allows the first support member (321) and the second support member (322) to rotate relative to each other.

[0165] According to one embodiment, the hinge assembly (330) may include a first hinge plate (333-1). The first hinge plate (333-1) may be disposed on a first thickness direction (+Z direction) side of the first support member (321). The first hinge plate (333-1) may be disposed on a first thickness direction (+Z direction) side of the flexible circuit board (340). The first hinge plate (333-1) may be disposed on a first thickness direction (+Z direction) side of the hinge module (331). The first hinge plate (333-1) may be fixed to the first support member (321). The first hinge plate (333-1) may cover at least a portion of the flexible circuit board (340), the first holder (351), the first front plate (353), the first sealing member (355), and the hinge module (331). The first hinge plate (333-1) may be referred to as a 'hinge plate'.

[0166] According to one embodiment, the hinge assembly (330) may include a second hinge plate (333-2). The second hinge plate (333-2) may be disposed on a first thickness direction (+Z direction) side of the second support member (322). The second hinge plate (333-2) may be disposed on a first thickness direction (+Z direction) side of the flexible circuit board (340). The second hinge plate (333-2) may be disposed on a first thickness direction (+Z direction) side of the hinge module (331). The second hinge plate (333-2) may be fixed to the second support member (322). The second hinge plate (333-2) may cover at least a portion of the flexible circuit board (340), the second holder (352), the second front plate (354), the second sealing member (356), and the hinge module (331). The second hinge plate (333-2) may be referred to as a 'hinge plate'.

[0167] According to one embodiment, the electronic device (301) may include a first holder (351). The first holder (351) may be disposed on the first thickness direction (+Z direction) side of the first fixing portion (341-1). The first holder (351) may be disposed between the first inner curved portion (342-1) and the first outer curved portion (343-1). At least a portion of the first holder (351) may be disposed in the first fixing groove (3211). The first holder (351) may fix the first fixing portion (341-1) to the first fixing groove (3211). For example, the first fixing member (341-1) may have a force to detach from the first fixing groove (3211) due to the elastic restoring force of the flexible circuit board (340), and the first holder (351) may press the first fixing member (341-1) to prevent the first fixing member (341-1) from detaching from the first fixing groove (3211). The first holder (351) may be referred to as a 'holder'.

[0168] According to one embodiment, the first holder (351) may include a first main holder (3511). The first main holder (3511) may be disposed on the first thickness direction (+Z direction) side of the first sub-holder (3512). At least a portion of the first main holder (3511) may be disposed in the first mounting groove (3211). However, the present invention is not limited thereto, and when the depth of the first mounting groove (3211) is shallow, the first main holder (3511) may not be disposed on the inner side of the first mounting groove (3211). The first main holder (3511) may support the first sub-holder (3512) in the second thickness direction (-Z direction). The first main holder (3511) may be referred to as a 'main holder'.

[0169] According to one embodiment, the first main holder (3511) may be fixed to the first front plate (353). For example, the first main holder (3511) may be attached to the first front plate (353). For example, the first main holder (3511) may be attached to a surface of the first front plate (353) facing the second thickness direction (-Z direction) via an attachment member (A). However, the present invention is not limited thereto, and the first main holder (3511) may also be coupled to the first front plate (353) via a separate mechanical coupling structure. The first main holder (3511) may be a component of a 'first plate assembly (PA1)' together with the first front plate (353) and the first sealing member (355).

[0170] According to one embodiment, the first main holder (3511) may include a first guide protrusion (3511b). Referring to FIG. 9, the first guide protrusion (3511b) may protrude in a first thickness direction (+Z direction) from the first body portion (3511a) of the first main holder (3511). The first guide protrusion (3511b) may be inserted into a first guide hole (353a) formed in the first front plate (353). By inserting the first guide protrusion (3511b) into the first guide hole (353a), a coupling position between the first front plate (353) and the first main holder (3511) may be guided.

[0171] According to one embodiment, the first holder (351) may include a first sub-holder (3512). The first sub-holder (3512) may be disposed in the first thickness direction (+Z direction) of the first fixing portion (341-1). The first sub-holder (3512) may be adjacent to the first fixing portion (341-1). At least a portion of the first sub-holder (3512) may be disposed in the first mounting groove (3211). However, the present invention is not limited thereto, and when the depth of the first mounting groove (3211) is shallow, the first sub-holder (3512) may not be disposed inside the first mounting groove (3211). The first sub-holder (3512) may support the first fixing portion (341-1) in the second thickness direction (-Z direction). The first sub-holder (3512) may be referred to as a 'sub-holder'.

[0172] According to one embodiment, the first sub-holder (3512) may be fixed to the first fixing portion (341-1). For example, the first sub-holder (3512) may be attached to the first fixing portion (341-1). For example, the first sub-holder (3512) may be attached to a surface of the first fixing portion (341-1) facing the first thickness direction (+Z direction) via an attachment member (A). The first sub-holder (3512) may be supplied together with the flexible circuit board (340) in a state of being attached to the first fixing portion (341-1) of the flexible circuit board (340) during the assembly process of the electronic device (301).

[0173] According to one embodiment, the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) length of the first sub-holder (3512) may be smaller than the first direction (+X direction) and / or the second direction (-X direction) length of the first through-hole (3212) and / or the second through-hole (3222). According to one embodiment, the sum of the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) length of the first sub-holder (3512) and the first fixing portion (341-1) may be smaller than the first direction (+X direction) and / or the second direction (-X direction) length of the first through-hole (3212) and / or the second through-hole (3222). Through this, during the assembly process of the electronic device (301), the first fixing part (341-1) and the first sub-holder (3512) can pass through the first through hole (3212) while being attached to each other.

[0174] According to one embodiment, the assembling property of the flexible circuit board (340) can be improved through the first sub-holder (3512). For example, since the first sub-holder (3512) is pre-attached to the first fixing portion (341-1), the position of the first fixing portion (341-1) in the continuous-shaped flexible circuit board (340) can be easily guided. In addition, even if the width of the first fixing groove (3211) is formed small, a worker can easily attach the first fixing portion (341-1) to the bottom surface (3211a) of the first fixing groove (3211) without a separate jig. For example, in the process of attaching the first fixing part (341-1) to the bottom surface (3211a) of the first settling groove (3211), the first fixing part (341-1) may be attached to the bottom surface (3211a) of the first settling groove (3211) by positioning the first sub-holder (3512) inside the first settling groove (3211) and pressing the first sub-holder (3512) without directly pushing the first fixing part (341-1) into the first settling groove (3211).

[0175] According to one embodiment, as the first holder (351) is separated into the first main holder (3511) and the first sub-holder (3512), the assembling property of the electronic device (301) can be improved. For example, the flexible circuit board (340) can have a wider width than the second through hole (3222) at the portion where the first connector portion (346) and the second connector portion (347) are formed. Therefore, during the assembling process of the electronic device (301), the flexible circuit board (340) can be placed on the first support member (321) and the second support member (322) by approaching the second thickness direction (-Z direction) side of the second support member (322), passing through the second through hole (3222), and then passing through the first through hole (3212) (e.g., see the flexible circuit board (340) assembling process of FIG. 16). At this time, if the combined thickness of the first holder (351) and the first fixing portion (341-1) is greater than the length of the second through hole (3222) in the first direction (+X direction) and / or the second direction (-X direction), the flexible circuit board (340) may not be able to pass through the second through hole (3222) while the first holder (351) is attached to the flexible circuit board (340). According to one embodiment, since the first holder (351) may be divided into a first main holder (3511) and a first sub-holder (3512), the flexible circuit board (340) may pass through the second through hole (3222) while the first sub-holder (3512) is attached to the first fixing portion (341-1). Accordingly, during the assembly process of the electronic device (301), the flexible circuit board (340) can be supplied onto the first support member (321) and the second support member (322) in a state where the first sub-holder (3512) is attached to the first fixing member (341-1). Through this, the process of attaching the first holder (351) to the narrow first fixing member (341-1) while the flexible circuit board (340) is placed on the first support member (321) and the second support member (322) can be omitted, and thus the assembling performance of the electronic device (301) can be improved.

[0176] According to one embodiment, the electronic device (301) may include a first front plate (353). The first front plate (353) may be disposed on a first thickness direction (+Z direction) side of the first support member (321). The first front plate (353) may be disposed on a first thickness direction (+Z direction) side of the first holder (351). The first front plate (353) may be disposed on a first thickness direction (+Z direction) side of the first sealing member (355). The first front plate (353) may support the first holder (351) in a second thickness direction (-Z direction). The first front plate (353) may support the first sealing member (355) in a second thickness direction (-Z direction). The first front plate (353) may be referred to as a 'front plate'.

[0177] According to one embodiment, the first front plate (353) can be fixed to a surface facing the first thickness direction (+Z direction) of the first support member (321). For example, a fixing member (e.g., a screw) passes through a first front plate hole (353h) formed in the first front plate (353) and is fixed to a front fixing hole (FH) formed in the first thickness direction (+Z direction) surface of the first support member (321), whereby the first front plate (353) can be fixed to the first support member (321).

[0178] According to one embodiment, the electronic device (301) may include a first sealing member (355). The first sealing member (355) may be disposed inside the first through hole (3212). For example, the first sealing member (355) may be inserted into the first through hole (3212). The first sealing member (355) may be disposed on the second direction (-X direction) side of the first outer bending portion (343-1) of the flexible circuit board (340). The first sealing member (355) may be referred to as a 'sealing member'.

[0179] According to one embodiment, the first sealing member (355) can be fitted into the first through hole (3212). The shape and size of the cross-section of the first sealing member (355) can correspond to the shape and size of the cross-section of the first through hole (3212). The first sealing member (355) can include a flexible material. The first sealing member (355) can seal the first through hole (3212). Through the first sealing member (355), waterproofing and / or dustproofing can be realized in the first through hole (3212).

[0180] According to one embodiment, the first sealing member (355) may be fixed to the first front plate (353). For example, the first sealing member (355) may be attached to the first front plate (353). For example, the first sealing member (355) may be attached to a surface of the first front plate (353) facing the second thickness direction (-Z direction) via an attachment member (A). However, the present invention is not limited thereto, and the first sealing member (355) may also be coupled to the first front plate (353) via a separate mechanical coupling structure. The first sealing member (355) may be a component of a 'first plate assembly (PA1)' together with the first front plate (353) and the first main holder (3511). The first plate assembly (PA1) may be provided in an assembled state during the manufacturing process of the electronic device (301).

[0181] According to one embodiment, the first sealing member (355) may include a second guide protrusion (355b). Referring to FIG. 9, the second guide protrusion (355b) may protrude in the first thickness direction (+Z direction) from the second body portion (355a) of the first sealing member (355). The second guide protrusion (355b) may be inserted into a second guide hole (353b) formed in the first front plate (353). By inserting the second guide protrusion (355b) into the second guide hole (353b), the coupling position between the first front plate (353) and the first sealing member (355) may be guided.

[0182] According to one embodiment, the electronic device (301) may include a second holder (352). The second holder (352) may be disposed on the first thickness direction (+Z direction) side of the second fixing portion (341-2). The second holder (352) may be disposed between the second inner curved portion (342-2) and the second outer curved portion (343-2). At least a portion of the second holder (352) may be disposed in the second fixing groove (3221). The second holder (352) may fix the second fixing portion (341-2) to the second fixing groove (3221). For example, the second fixing member (341-2) may have a force to detach from the second fixing groove (3221) due to the elastic restoring force of the flexible circuit board (340), and the second holder (352) may press the second fixing member (341-2) to prevent the second fixing member (341-2) from detaching from the second fixing groove. The second holder (352) may be referred to as a 'holder'.

[0183] According to one embodiment, the second holder (352) may include a second main holder (3521). The second main holder (3521) may be disposed on the first thickness direction (+Z direction) side of the second sub-holder (3522). At least a portion of the second main holder (3521) may be disposed in the second mounting groove (3221). However, the present invention is not limited thereto, and when the depth of the second mounting groove (3221) is shallow, the second main holder (3521) may not be disposed on the inner side of the second mounting groove (3221). The second main holder (3521) may support the second sub-holder (3522) in the second thickness direction (-Z direction). The second main holder (3521) may be referred to as a 'main holder'.

[0184] According to one embodiment, the second main holder (3521) may be fixed to the second front plate (354). For example, the second main holder (3521) may be attached to the second front plate (354). For example, the second main holder (3521) may be attached to a surface of the second front plate (354) facing the second thickness direction (-Z direction) via an attachment member (A). However, the present invention is not limited thereto, and the second main holder (3521) may also be coupled to the second front plate (354) via a separate mechanical coupling structure. The second main holder (3521) may be a component of a 'second plate assembly (PA2)' together with the second front plate (354) and the second sealing member (356). The second plate assembly (PA2) may be provided in an assembled state during the manufacturing process of the electronic device (301).

[0185] According to one embodiment, the third guide protrusion (not shown) of the second main holder (3521) may be inserted into a third guide hole (not shown) formed in the second front plate (354), thereby guiding the fixing position of the second main holder (3521) with respect to the second front plate (354). The third guide protrusion and the third guide hole may have a structure that is symmetrical with respect to the structure of the first guide protrusion (3511b) and the first guide hole (353a) illustrated in FIGS. 9 and 10 with respect to the folding axis (F).

[0186] According to one embodiment, the second holder (352) may include a second sub-holder (3522). The second sub-holder (3522) may be disposed on the first thickness direction (+Z direction) side of the second fixing portion (341-2). The second sub-holder (3522) may be adjacent to the second fixing portion (341-2). At least a portion of the second sub-holder (3522) may be disposed in the second mounting groove (3221). However, the present invention is not limited thereto, and when the depth of the second mounting groove (3221) is shallow, the second sub-holder (3522) may not be disposed on the inner side of the second mounting groove (3221). The second sub-holder (3522) may support the second fixing portion (341-2) in the second thickness direction (-Z direction). The second sub-holder (3522) may be referred to as a 'sub-holder'.

[0187] According to one embodiment, the second sub-holder (3522) may be fixed to the second fixing portion (341-2). For example, the second sub-holder (3522) may be attached to the second fixing portion (341-2). For example, the second sub-holder (3522) may be attached to a surface of the second fixing portion (341-2) facing the first thickness direction (+Z direction) via an attachment member (A). The second sub-holder (3522) may be supplied together with the flexible circuit board (340) in a state of being attached to the second fixing portion (341-2) of the flexible circuit board (340) during the assembly process of the electronic device (301).

[0188] According to one embodiment, the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) length of the second sub-holder (3522) may be smaller than the first direction (+X direction) and / or the second direction (-X direction) length of the first through-hole (3212) and / or the second through-hole (3222). According to one embodiment, the sum of the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) length of the second sub-holder (3522) and the first fixing portion (341-1) may be smaller than the first direction (+X direction) and / or the second direction (-X direction) length of the first through-hole (3212) and / or the second through-hole (3222). Through this, during the assembly process of the electronic device (301), the first fixing part (341-1) and the first sub-holder (3512) can pass through the first through hole (3212) while being attached to each other.

[0189] According to one embodiment, the assembling property of the flexible circuit board (340) can be improved through the second sub-holder (3522). For example, since the second sub-holder (3522) is pre-attached to the second fixing portion (341-2), the position of the second fixing portion (341-2) in the continuous-shaped flexible circuit board (340) can be easily guided. In addition, even if the width of the second fixing groove (3221) is formed small, a worker can easily attach the second fixing portion (341-2) to the bottom surface of the second fixing groove (3221) without a separate jig. For example, in the process of attaching the second fixing part (341-2) to the bottom surface of the second settling groove (3221), instead of directly pushing the second fixing part (341-2) into the second settling groove (3221), the second sub-holder (3522) is positioned inside the second settling groove (3221) and the second sub-holder (3522) is pressed, thereby allowing the second fixing part (341-2) to be attached to the bottom surface of the second settling groove (3221).

[0190] According to one embodiment, as the second holder (352) is separated into the second main holder (3521) and the second sub-holder (3522), the assembling property of the electronic device (301) can be improved. For example, the flexible circuit board (340) can have a wider width than the second through hole (3222) at the portion where the first connector portion (346) and the second connector portion (347) are formed. Therefore, during the assembling process of the electronic device (301), the flexible circuit board (340) can be placed on the first support member (321) and the second support member (322) by approaching the second thickness direction (-Z direction) side of the second support member (322), passing through the second through hole (3222), and then passing through the first through hole (3212) (e.g., see the flexible circuit board (340) assembling process of FIG. 16). At this time, if the combined thickness of the second holder (352) and the second fixing portion (341-2) is greater than the length of the second through hole (3222) in the first direction (+X direction) and / or the second direction (-X direction), the flexible circuit board (340) may not be able to pass through the second through hole (3222) while the second holder (352) is attached to the flexible circuit board (340). According to one embodiment, since the second holder (352) may be divided into a second main holder (3521) and a second sub-holder (3522), the flexible circuit board (340) may pass through the second through hole (3222) while the second sub-holder (3522) is attached to the second fixing portion (341-2). Accordingly, during the assembly process of the electronic device (301), the flexible circuit board (340) can be supplied onto the first support member (321) and the second support member (322) in a state where the second sub-holder (3522) is attached to the second fixing member (341-2). Through this, the process of attaching the second holder (352) to the narrow second fixing member (341-2) while the flexible circuit board (340) is placed on the first support member (321) and the second support member (322) can be omitted, and thus the assembling performance of the electronic device (301) can be improved.

[0191] According to one embodiment, the electronic device (301) may include a second front plate (354). The second front plate (354) may be disposed on a first thickness direction (+Z direction) side of the second support member (322). The second front plate (354) may be disposed on a first thickness direction (+Z direction) side of the second holder (352). The second front plate (354) may be disposed on a first thickness direction (+Z direction) side of the second sealing member (356). The second front plate (354) may support the second holder (352) in the second thickness direction (-Z direction). The second front plate (354) may support the second sealing member (356) in the second thickness direction (-Z direction). The second front plate (354) may be referred to as a 'front plate'.

[0192] According to one embodiment, the second front plate (354) can be fixed to the first thickness direction (+Z direction) side of the second support member (322). For example, the second front plate (354) can be fixed to the second support member (322) by a fixing member (e.g., a screw) passing through a second front plate hole (e.g., the first front plate hole (354h) of FIG. 11) formed in the second front plate (354) and being fixed to a front fixing hole (e.g., the front fixing hole (FH) of FIG. 11) formed on the first thickness direction (+Z direction) side of the second support member (322).

[0193] According to one embodiment, the electronic device (301) may include a second sealing member (356). The second sealing member (356) may be disposed inside the second through hole (3222). For example, the second sealing member (356) may be inserted into the second through hole (3222). The second sealing member (356) may be disposed on the first direction (+X direction) side of the second outer bending portion (343-2) of the flexible circuit board (340). The second sealing member (356) may be referred to as a 'sealing member'.

[0194] According to one embodiment, the second sealing member (356) can be fitted into the second through hole (3222). The shape and size of the cross-section of the second sealing member (356) can correspond to the shape and size of the cross-section of the second through hole (3222). The second sealing member (356) can include a flexible material. The second sealing member (356) can seal the second through hole (3222). Through the second sealing member (356), waterproofing and / or dustproofing can be realized in the second through hole (3222).

[0195] According to one embodiment, the second sealing member (356) may be fixed to the second front plate (354). For example, the second sealing member (356) may be attached to the second front plate (354). For example, the second sealing member (356) may be attached to a surface of the second front plate (354) facing the second thickness direction (-Z direction) through an attachment member (not shown). However, the present invention is not limited thereto, and the second sealing member (356) may also be coupled to the second front plate (354) through a separate mechanical coupling structure. The second sealing member (356) may be a component of a 'second plate assembly (PA2)' together with the second front plate (354) and the second main holder (3521).

[0196] According to one embodiment, the fourth guide protrusion (not shown) of the second main holder (3521) may be inserted into the fourth guide hole (not shown) formed in the second front plate (354), thereby guiding the fixing position of the second main holder (3521) with respect to the second front plate (354). The fourth guide protrusion and the fourth guide hole may have a structure that is symmetrical about the folding axis (F) with respect to the structure of the second guide protrusion (355b) and the second guide hole (353b) illustrated in FIGS. 9 and 10.

[0197] FIG. 11 illustrates a partial configuration of an electronic device according to an embodiment of the present disclosure, viewed from one side. FIG. 12 illustrates a partial configuration of an electronic device according to an embodiment of the present disclosure, viewed from the other side. FIG. 13 illustrates FIGS. 11 and 12 superimposed on each other.

[0198] Specifically, Fig. 11 is a plan view illustrating a peripheral area of ​​the second front plate (354) as viewed in the first thickness direction (+Z direction). Fig. 12 is a rear view illustrating the area of ​​Fig. 11 as viewed in the second thickness direction (-Z direction). Fig. 13 is a plan view illustrating Figs. 11 and 12 superimposed.

[0199] Hereinafter, FIGS. 11 to 13 illustrate an area around the second through hole (3222) of the second support member (322) as an example, but the contents described in relation to FIGS. 11 to 13 can be equally applied to the first support member (321).

[0200] According to one embodiment, the first support member (the first support member (321) of FIGS. 20 and 21) may include a front fixing hole (e.g., a front fixing hole (FH) of the first support member (321) of FIGS. 20 and 21). For example, the front fixing hole (e.g., a front fixing hole (FH) of the first support member (321) of FIGS. 20 and 21) may be formed on a surface of the first support member (321) facing the first thickness direction (+Z direction). The second support member (322) may include a front fixing hole (FH). For example, the front fixing hole (FH) of the second support member (322) may be formed on a surface of the second support member (322) facing the first thickness direction (+Z direction).

[0201] According to one embodiment, a fixing member (not shown) may be coupled to the front fixing hole (FH). For example, the fixing member may pass through the first front plate hole formed in the first front plate and be coupled to the front fixing hole formed in the first support member, through which the first front plate may be fixed to a surface facing the first thickness direction (+Z direction) of the first support member (321). In addition, the fixing member may pass through the second front plate hole (354h) formed in the second front plate (354) and be coupled to the front fixing hole (FH) formed in the second support member (322), through which the second front plate (354) may be fixed to a surface facing the first thickness direction (+Z direction) of the second support member (322).

[0202] According to one embodiment, the front fixing hole of the first support member may be non-overlapping with the first mounting groove in the first thickness direction and / or the second thickness direction. For example, the front fixing hole of the first support member may be formed at a position that does not overlap with the first mounting groove in the first thickness direction and / or the second thickness direction. According to one embodiment, the front fixing hole (FH) of the second support member (322) may be non-overlapping with the second mounting groove (3221) in the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction). For example, the front fixing hole (FH) of the second support member (322) may be formed at a position that does not overlap with the second mounting groove (3221). For example, referring to FIG. 13, the front fixing hole (FH) of the second support member (322) may be formed on both sides of the second mounting groove (3221).

[0203] According to one embodiment, the electronic device (301) may include a first back plate (not shown). The first back plate may be disposed on the second thickness direction side of the first support member. The first back plate may secure at least a portion of a portion of the flexible circuit board disposed on the second thickness direction side of the first support member to the first support member. For example, if the flexible circuit board includes a connector that protrudes laterally and is connected to a surface of the first support member facing the second thickness direction, the first back plate may be disposed to overlap the connector in the first thickness direction and / or the second thickness direction, and may be secured to the first support member, thereby securing the connector to the first support member. The first back plate may be referred to as a 'back plate'.

[0204] In one embodiment, the first back plate may be secured to the second thickness direction side of the first support member. For example, the first back plate may be secured to the first support member by a securing member (e.g., a screw) passing through a first back plate hole formed in the first back plate and being secured to the back fixing hole of the first support member.

[0205] According to one embodiment, the electronic device (301) may include a second back plate (362). The second back plate (362) may be disposed on a second thickness direction (-Z direction) side of the second support member (322). The second back plate (362) may secure at least a portion of a portion of the flexible circuit board (340) disposed on the second thickness direction (-Z direction) side of the second support member (322) to the second support member (322). For example, the second back plate (362) may be arranged to overlap the first connector portion (346) and / or the second connector portion (347) in the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) connected to the surface of the second support member (322) facing the second thickness direction (-Z direction), and may be fixed to the second support member (322), thereby fixing the first connector portion (346) and / or the second connector portion (347) to the second support member (322). The second back plate (362) may be referred to as a 'back plate'.

[0206] According to one embodiment, the second back plate (362) can be fixed to the second thickness direction (-Z direction) side of the second support member (322). For example, the second back plate (362) can be fixed to the first support member (321) by a fixing member (e.g., a screw) passing through a second back plate hole (362h) formed in the second back plate (362) and being fixed to the back fixing hole (RH) of the second support member (322).

[0207] According to one embodiment, the first support member may include a rear fixing hole. The second support member (322) may include a rear fixing hole (RH). The rear fixing hole of the first support member may be formed on a surface facing the second thickness direction of the first support member. The rear fixing hole (RH) of the second support member (322) may be formed on a surface facing the second thickness direction (-Z direction) of the second support member (322).

[0208] According to one embodiment, a fixing member (not shown) may be coupled to the back fixing hole (RH). For example, the fixing member may pass through the first back plate hole formed in the first back plate and be coupled to the back fixing hole formed in the first support member, through which the first back plate may be fixed to a surface facing the second thickness direction of the first support member. In addition, the fixing member may pass through the second back plate hole (362h) formed in the second back plate (362) and be coupled to the back fixing hole (RH) formed in the second support member (322), through which the second back plate (362) may be fixed to a surface facing the second thickness direction (-Z direction) of the second support member (322).

[0209] According to one embodiment, the rear fixing hole of the first support member may be non-overlapping with the first mounting groove in the first thickness direction and / or the second thickness direction. For example, the rear fixing hole of the first support member may be formed at a position that does not overlap with the first mounting groove in the first thickness direction and / or the second thickness direction. According to one embodiment, the rear fixing hole (RH) of the second support member (322) may be non-overlapping with the second mounting groove (3221) in the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction). For example, the rear fixing hole (RH) of the second support member (322) may be formed at a position that does not overlap with the second mounting groove (3221). For example, referring to FIG. 13, the rear fixing holes (RH) may be formed on both sides of the second mounting groove (3221). According to one embodiment, the fixing groove (3211, 3221) is formed by being sunken in the second thickness direction (-Z direction) from the surface of the support member (321, 322) facing the first thickness direction (+Z direction), so that the thickness of the support member (321, 322) constituting the bottom of the fixing groove (3211, 3221) can be thinned. In one embodiment, when the rear fixing hole (RH) is formed at a position that does not overlap the fixing groove (3211, 3221) in the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction), a sufficient depth of the rear fixing hole (RH) can be secured.

[0210] Unlike the above, the first back plate or the second back plate (362) may not be provided. Unlike the above, the first support member or the second support member (322) may not have a back fixing hole (RH) formed therein. For example, as illustrated in FIG. 8, when the first connector portion (346) and / or the second connector portion (347) are formed only in the second extension portion (345-2) disposed in the area of ​​the second support member (322), the back fixing hole (RH) for fixing the first back plate and / or the first back plate to the first support member (321) may not be provided.

[0211] FIG. 14 is a plan view of a portion of a configuration of an electronic device according to an embodiment of the present disclosure. FIG. 15 is a cross-sectional view of a portion of a configuration of an electronic device according to an embodiment of the present disclosure.

[0212] According to one embodiment, the flexible circuit board (340) may include at least one of a portion comprising a rigid material and a portion comprising a flexible material.

[0213] In one embodiment, the central portion (344) may include a rigid material. For example, the P0 region, which is the region where the central portion (344) is formed in the flexible circuit board (340), may include a rigid material. For example, at least a portion of the central portion (344) may be formed of a rigid material. For example, the central portion (344) may have stronger structural rigidity compared to the first inner curved portion (342-1) (e.g., the P1-1 region) and / or the second inner curved portion (342-2) (e.g., the P1-2 region). The central portion (344) is a portion positioned between the first inner curved portion (342-1) and the second inner curved portion (342-2). Since the central portion (344) includes a rigid material, it can support the opposing ends of the first inner curved portion (342-1) and / or the second inner curved portion (342-2). Through this, the first inner curved portion (342-1) and the second inner curved portion (342-2) can have a curved shape according to the designed shape.

[0214] According to one embodiment, the first inner bend (342-1) may include a flexible material. For example, the P1-1 region, which is the region where the first inner bend (342-1) is formed in the flexible circuit board (340), may include a flexible material. For example, at least a portion of the first inner bend (342-1) may be formed of a flexible material. For example, the first inner bend (342-1) may have a weaker structural rigidity compared to the central portion (344) (e.g., the P0 region) and / or the first fixed portion (341-1) (e.g., the P2-1 region). The first inner bending portion (342-1) is a portion that protrudes and bends in the first thickness direction (+Z direction) from the central portion (344) and / or the first fixing portion (341-1). When the first inner bending portion (342-1) includes a flexible material, the shaping of the first inner bending portion (342-1) can be easily performed. In addition, the first inner bending portion (342-1) is a portion that is deformed when the electronic device (301) is converted from an unfolded state to a folded state. When the first inner bending portion (342-1) includes a flexible material, the shape of the first inner bending portion (342-1) can be easily deformed, thereby preventing or reducing damage to the flexible circuit board (340).

[0215] According to one embodiment, the second inner bend (342-2) may include a flexible material. For example, the P1-2 region, which is the region where the second inner bend (342-2) is formed in the flexible circuit board (340), may include a flexible material. For example, at least a portion of the second inner bend (342-2) may be formed of a flexible material. For example, the second inner bend (342-2) may have a weaker structural rigidity compared to the central portion (344) (e.g., the P0 region) and / or the second fixed portion (341-2) (e.g., the P2-2 region). The second inner bending portion (342-2) is a portion that protrudes and bends in the first thickness direction (+Z direction) from the central portion (344) and / or the second fixing portion (341-2). When the second inner bending portion (342-2) includes a flexible material, the shaping of the second inner bending portion (342-2) can be easily performed. In addition, the second inner bending portion (342-2) is a portion that is deformed when the electronic device (301) is converted from an unfolded state to a folded state. When the second inner bending portion (342-2) includes a flexible material, the shape of the second inner bending portion (342-2) can be easily deformed, thereby preventing or reducing damage to the flexible circuit board (340).

[0216] According to one embodiment, the first fixing portion (341-1) may include a rigid material. For example, the P2-1 region, which is the region where the first fixing portion (341-1) is formed in the flexible circuit board (340), may include a rigid material. For example, at least a portion of the first fixing portion (341-1) may be formed of a rigid material. For example, the first fixing portion (341-1) may have stronger structural rigidity compared to the first inner bending portion (342-1) (e.g., the P1-1 region) and / or the first outer bending portion (343-1) (e.g., the P3-1 region). The first fixing portion (341-1) is a portion that is fixed to the first mounting groove (3211). When the first fixing portion (341-1) includes a rigid material, the first fixing portion (341-1) can be firmly fixed (or attached) to the first mounting groove (3211). According to one embodiment, the first fixing portion (341-1) can be formed to be thicker at least in a portion compared to the first inner curved portion (342-1) (e.g., P1-1 region) and / or the first outer curved portion (343-1) (e.g., P3-1 region). According to one embodiment, the first fixing portion (341-1) can be formed to be wider at least in a portion compared to the first inner curved portion (342-1) (e.g., P1-1 region) and / or the first outer curved portion (343-1) (e.g., P3-1 region).

[0217] According to one embodiment, the second fixing portion (341-2) may include a rigid material. For example, the P2-2 region, which is the region where the second fixing portion (341-2) is formed in the flexible circuit board (340), may include a rigid material. For example, at least a portion of the second fixing portion (341-2) may be formed of a rigid material. For example, the second fixing portion (341-2) may have stronger structural rigidity compared to the second inner curved portion (342-2) (e.g., the P1-2 region) and / or the second outer curved portion (343-2) (e.g., the P3-2 region). The second fixing portion (341-2) is a portion that is fixed to the second mounting groove (3221). When the second fixing portion (341-2) includes a rigid material, the second fixing portion (341-2) can be firmly fixed (or attached) to the second mounting groove (3221). According to one embodiment, the second fixing portion (341-2) may be formed to be thicker at least in part than the second inner curved portion (342-2) (e.g., region P1-2) and / or the second outer curved portion (343-2) (e.g., region P3-2). According to one embodiment, the second fixing portion (341-2) may be formed to be wider at least in part than the second inner curved portion (342-2) (e.g., region P1-2) and / or the second outer curved portion (343-2) (e.g., region P3-2).

[0218] According to one embodiment, the first outer bend (343-1) may include a flexible material. For example, the region P3-1, which is the region where the first outer bend (343-1) is formed in the flexible circuit board (340), may include a flexible material. For example, at least a portion of the first outer bend (343-1) may be formed of a flexible material. For example, the first outer bend (343-1) may have a weaker structural rigidity compared to the first extension (345-1) (e.g., region P4-1) and / or the first fixing portion (341-1) (e.g., region P2-1). The first outer bending portion (343-1) is a portion where the first rib (3213) is bent in close contact. If the first outer bending portion (343-1) includes a flexible material, the first outer bending portion (343-1) can be more easily adhered to the first rib (3213). However, the present invention is not limited thereto. If the first outer bending portion (343-1) is provided with a shape corresponding to the shape of the first rib (3213) from the manufacturing stage, the first outer bending portion (343-1) may be composed of a rigid material.

[0219] According to one embodiment, the second outer bend (343-2) may include a flexible material. For example, the P3-2 region, which is the region where the second outer bend (343-2) is formed in the flexible circuit board (340), may include a flexible material. For example, at least a portion of the second outer bend (343-2) may be formed of a flexible material. For example, the second outer bend (343-2) may have a weaker structural rigidity compared to the second extension (345-2) (e.g., the P4-2 region) and / or the second fixing portion (341-2) (the P2-2 region). The second outer bending portion (343-2) is a portion where the second rib (3223) is bent in close contact. If the second outer bending portion (343-2) includes a flexible material, the second outer bending portion (343-2) can be more easily adhered to the second rib (3223). However, the present invention is not limited thereto. If the second outer bending portion (343-2) is provided with a shape corresponding to the shape of the first rib (3213) from the manufacturing stage, the second outer bending portion (343-2) may be composed of a rigid material.

[0220] According to one embodiment, in the P3-2 region, the first connector portion (346) and / or the second connector portion (347) may include a flexible material. For example, at least a portion of the first connector portion (346) and / or the second connector portion (347) that is connected to the second extension portion (345-2) may be made of a flexible material.

[0221] According to one embodiment, the electronic device (301) may additionally include a support sheet (not shown). The support sheet may be attached to the first inner curved portion (342-1) and / or the second inner curved portion (342-2). The support sheet may be disposed on at least one of a surface facing the first thickness direction (+Z direction) or a surface facing the second thickness direction (-Z direction) of the first inner curved portion (342-1) and / or the second inner curved portion (342-2). The support sheet may be provided in a shape corresponding to the curved shape of the first inner curved portion (342-1) and / or the second inner curved portion (342-2). The support sheet may reinforce the structural rigidity of the first inner curved portion (342-1) and / or the second inner curved portion (342-2). For example, the support sheet can help the first inner bend (342-1) and / or the second inner bend (342-2) maintain the designed bend shape.

[0222] FIGS. 16 to 22 illustrate an assembly process of an electronic device according to one embodiment of the present disclosure.

[0223] Referring to FIG. 16, a method for manufacturing an electronic device (301) according to one embodiment may include providing a flexible circuit board (340), a first sub-holder (3512), and a second sub-holder (3522) to a first support member (321) and a second support member (322). The first sub-holder (3512) may be provided together with the flexible circuit board (340) in a state attached to the first fixing portion (341-1) of the flexible circuit board (340). The second sub-holder (3522) may be provided together with the flexible circuit board (340) in a state attached to the second fixing portion (341-2) of the flexible circuit board (340). However, the present invention is not limited thereto, and the first sub-holder (3512) and the second sub-holder (3522) may be provided separately from the flexible circuit board (340). For example, the first sub-holder (3512) and the second sub-holder (3522) can be attached to the first fixing member (341-1) and the second fixing member (341-2), respectively, after the flexible circuit board (340) is provided to the first support member (321) and the second support member (322).

[0224] Referring to FIG. 16, since the first connector portion (346) and the second connector portion (347) of the electronic device (301) according to one embodiment have difficulty passing through the second through hole (3222), the flexible circuit board (340) may pass through the second through hole (3222) on the second thickness direction (-Z direction) side of the second support member (322) and then pass through the first through hole (3212) to be placed on the first support member (321) and the second support member (322). For example, the flexible circuit board (340) may be provided along the flexible circuit board (340) providing path (I) illustrated in FIG. 16.

[0225] Referring to FIGS. 17 to 19, a method for manufacturing an electronic device (301) according to one embodiment may include a step of placing a first fixing portion (341-1) and a first sub-holder (3512) of a flexible circuit board (340) in a first mounting groove (3211) of a first support member (321). According to one embodiment, a method for manufacturing an electronic device (301) may include a step of placing a second fixing portion (341-2) and a second sub-holder (3522) of a flexible circuit board (340) in a second mounting groove (3221) of a second support member (322).

[0226] Referring to FIGS. 18 and 19, a method for manufacturing an electronic device (301) according to one embodiment may include a step of attaching a first fixing part (341-1) to a bottom surface of a first mounting groove (3211). The first fixing part (341-1) may be attached to the bottom surface of the first mounting groove (3211) by pressing a first sub-holder (3512). A method for manufacturing an electronic device (301) according to one embodiment may include a step of attaching a second fixing part (341-2) to a bottom surface of a second mounting groove (3221). The second fixing part (341-2) may be attached to the bottom surface of the second mounting groove (3221) by pressing a second sub-holder (3522). The worker can attach the first fixing part (341-1) and the second fixing part (341-2) to the bottom surface of the first fixing groove (3211) and the second fixing groove (3221), respectively, by manually pressing the first sub-holder (3512) and / or the second sub-holder (3522) without a separate jig.

[0227] Referring to FIGS. 20 and 21, a method for manufacturing an electronic device (301) according to one embodiment may include a step of coupling a first plate assembly (PA1) onto a first support member (321). A method for manufacturing an electronic device (301) according to one embodiment may include a step of coupling a second plate assembly (PA2) onto a second support member (322).

[0228] According to one embodiment, the first plate assembly (PA1) may include a first front plate (353), a first main holder (3511), and a first sealing member (355). The second plate assembly (PA2) may include a second front plate (354), a second main holder (3521), and a first sealing member (355). When the first plate assembly (PA1) is placed on the first support member (321), the first main holder (3511) may be placed on the first sub-holder (3512), and the first sealing member (355) may be inserted into the first through hole (3212). When the second plate assembly (PA2) is placed on the second support member (322), the second main holder (3521) can be placed on the first sub holder (3512), and the second sealing member (356) can be inserted into the second through hole (3222). The first plate assembly (PA1) can be coupled to the first support member (321) by having a fixing member (not shown) pass through the first front plate hole (353h) and be coupled to the front fixing hole (FH) of the first support member (321). The second plate assembly (PA2) can be coupled to the second support member (322) by having a fixing member (not shown) pass through the second front plate hole (354h) and be coupled to the front fixing hole (FH) of the second support member (322).

[0229] Unlike the above, during the manufacturing process of the electronic device (301), at least one of the first front plate (353), the first main holder (3511), or the first sealing member (355) may be provided separately. For example, the first front plate (353), the first main holder (3511), and the first sealing member (355) may each be provided separately. For example, after the first main holder (3511) is placed on the first sub-holder (3512) and the first sealing member (355) is placed in the first through hole (3212), the first front plate (353) may be placed on the first main holder (3511) and the first sealing member (355).

[0230] According to one embodiment, during the manufacturing process of the electronic device (301), at least one of the second front plate (354), the second main holder (3521), or the second sealing member (356) may be provided separately. For example, the second front plate (354), the second main holder (3521), and the second sealing member (356) may each be provided separately. For example, after the second main holder (3521) is placed on the second sub-holder (3522) and the second sealing member (356) is placed in the second through hole (3222), the second front plate (354) may be placed on the second main holder (3521) and the second sealing member (356).

[0231] Referring to FIG. 22, a method for manufacturing an electronic device (301) according to one embodiment may include a step of coupling a first hinge plate (333-1) to a first support member (321). According to one embodiment, a method for manufacturing an electronic device (301) may include a step of coupling a second hinge plate (333-2) to a second support member (322).

[0232] FIG. 23 is a cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure. FIGS. 24 to 26 illustrate an assembly process of an electronic device according to an embodiment of the present disclosure.

[0233] The detailed configuration of the electronic device (401) according to an embodiment of the present disclosure not described below may be the same as the detailed configuration of the electronic device (101) according to an embodiment of the present disclosure described with reference to FIGS. 1 to 4 and / or the detailed configuration of the electronic device (301) according to an embodiment of the present disclosure described with reference to FIGS. 5 to 22.

[0234] According to one embodiment, the electronic device (401) may include a first holder (451). The first holder (451) may be provided as an integral part. The first holder (451) may fix the first fixing part (441-1) to the first mounting groove (4211). For example, the first fixing part (441-1) may have a force to detach from the first mounting groove (4211) due to the elastic restoring force of the flexible circuit board (440), and the first holder (451) may press the first fixing part (441-1) to prevent the first fixing part (441-1) from detaching from the first mounting groove (4211). The first holder (451) may be referred to as a 'holder'.

[0235] According to one embodiment, at least a portion of the first holder (451) may be seated in the first seating groove (4211). However, the present invention is not limited thereto, and if the depth of the first seating groove (4211) is shallow, the first holder (451) may not be positioned inside the first seating groove (4211).

[0236] According to one embodiment, the first holder (451) may be arranged on the first thickness direction (+Z direction) side of the first fixing portion (441-1). The first holder (451) may be adjacent to the first fixing portion (441-1). The first holder (451) may support the first fixing portion (441-1) in the second thickness direction (-Z direction).

[0237] According to one embodiment, the first holder (451) may be fixed to the first fixing portion (441-1). For example, the first holder (451) may be attached to the first fixing portion (441-1). For example, the first holder (451) may be attached to a surface of the first fixing portion (441-1) facing the first thickness direction (+Z direction) via an attachment member (A). However, the present invention is not limited thereto, and the first holder (451) may also be coupled to the first fixing portion (441-1) via a separate mechanical coupling structure.

[0238] According to one embodiment, the electronic device (401) may include a second holder (452). The second holder (452) may be provided integrally. The second holder (452) may secure the second fixing portion (441-2) to the second mounting groove (4221). For example, the second fixing portion (441-2) may have a force to detach from the second mounting groove (4221) due to the elastic restoring force of the flexible circuit board (440), and the second holder (452) may press the second fixing portion (441-2) to prevent the second fixing portion (441-2) from detaching from the second mounting groove (4221). The second holder (452) may be referred to as a 'holder'.

[0239] According to one embodiment, at least a portion of the second holder (452) may be seated in the second mounting groove (4221). However, the present invention is not limited thereto, and if the depth of the second mounting groove (4221) is shallow, the second holder (452) may not be positioned inside the second mounting groove (4221).

[0240] According to one embodiment, the second holder (452) may be arranged on the first thickness direction (+Z direction) side of the second fixing portion (441-2). The second holder (452) may be adjacent to the second fixing portion (441-2). The second holder (452) may support the second fixing portion (441-2) in the second thickness direction (-Z direction).

[0241] According to one embodiment, the second holder (452) can be fixed to the second fixing portion (441-2). For example, the second holder (452) can be attached to the second fixing portion (441-2). For example, the second holder (452) can be attached to the surface of the second fixing portion (441-2) facing the first thickness direction (+Z direction) through an attachment member (A). However, the present invention is not limited thereto, and the second holder (452) can be coupled to the second fixing portion (441-2) through a separate mechanical coupling structure.

[0242] According to one embodiment, the electronic device (401) may include a first plate assembly (PA1). The first plate assembly (PA1) may include a first front plate (453) and a first sealing member (455). The first plate assembly (PA1) may be provided in an assembled state during the manufacturing process of the electronic device (401). The first plate assembly (PA1) may be referred to as a 'plate assembly'.

[0243] According to one embodiment, the first front plate (453) can be in close contact with the first holder (451). For example, a surface of the first front plate (453) facing the second thickness direction (-Z direction) can be in close contact with a surface of the first holder (451) facing the first thickness direction (+Z direction). The first front plate (453) can support the first holder (451) in the second thickness direction (-Z direction). For example, the first front plate (453) can simply contact the first holder (451). For example, it can be attached to the first holder (451) by an attachment member (not shown). For example, it can be coupled to the first holder (451) through a separate mechanical coupling structure.

[0244] Unlike the above, the first holder (451) may also be attached to the first front plate (453). For example, the first plate assembly (PA1) may include the first front plate (453), the first holder (451), and the first sealing member (455). In this case, the first holder (451) may be seated (or attached) on the first fixing member (441-1) as the first plate assembly (PA1) is coupled on the first support member (421).

[0245] According to one embodiment, the electronic device (401) may include a second plate assembly (PA2). The second plate assembly (PA2) may include a second front plate (454) and a second sealing member (456). The second plate assembly (PA2) may be provided in an assembled state during the manufacturing process of the electronic device (401). The second plate assembly (PA2) may be referred to as a 'plate assembly'.

[0246] According to one embodiment, the second front plate (454) can be in close contact with the second holder (452). For example, a surface of the second front plate (454) facing the second thickness direction (-Z direction) can be in close contact with a surface of the second holder (452) facing the first thickness direction (+Z direction). The second front plate (454) can support the second holder (452) in the second thickness direction (-Z direction). For example, the second front plate (454) can simply contact the second holder (452). For example, it can be attached to the second holder (452) by an attachment member (not shown). For example, it can be coupled to the second holder (452) through a separate mechanical coupling structure.

[0247] Unlike the above, the second holder (452) may also be attached to the second front plate (454). For example, the second plate assembly (PA2) may include the second front plate (454), the second holder (452), and the second sealing member (456). In this case, the second holder (452) may be seated (or attached) on the second fixing member (441-2) as the second plate assembly (PA2) is coupled on the second support member (422).

[0248] Hereinafter, a manufacturing process of an electronic device (401) according to an embodiment of the present disclosure will be described with reference to FIGS. 24 to 26. A detailed manufacturing process of an electronic device (401) according to an embodiment of the present disclosure, which is not described below, may be identical to the detailed manufacturing process of an electronic device (301) according to an embodiment of the present disclosure, which is described with reference to FIGS. 16 to 22.

[0249] Referring to FIG. 24, a method for manufacturing an electronic device (401) according to one embodiment may include a step of attaching a first fixing part (441-1) to a bottom surface of a first mounting groove (4211). The first fixing part (441-1) may be attached to a bottom surface of the first mounting groove (4211) when a worker presses the first fixing part (441-1) toward the bottom surface of the first mounting groove (4211). A method for manufacturing an electronic device (401) according to one embodiment may include a step of attaching a second fixing part (441-2) to a bottom surface of a second mounting groove (4221). The second fixing part (441-2) may be attached to a bottom surface of the second mounting groove (4221) when a worker presses the second fixing part (441-2) toward the bottom surface of the second mounting groove (4221). For example, the process of a worker pressing the first fixing part (441-1) and the second fixing part (441-2) can be performed using a separate jig. However, the present invention is not limited thereto, and if the depth of the first fixing groove (4211) and the second fixing groove (4221) is shallow, the worker can press the first fixing part (441-1) and the second fixing part (441-2) by hand without a separate jig.

[0250] Referring to FIG. 25, a method for manufacturing an electronic device (401) according to one embodiment may include a step of mounting a first holder (451) in a first mounting groove (4211). For example, the method for manufacturing an electronic device (401) may include a step of arranging the first holder (451) on a first thickness direction (+Z direction) side of a first fixing part (441-1). A method for manufacturing an electronic device (401) according to one embodiment may include a step of mounting a second holder (452) in a second mounting groove (4221). For example, the method for manufacturing an electronic device (401) may include a step of arranging the second holder (452) on a first thickness direction (+Z direction) side of a second fixing part (441-2).

[0251] Unlike the above, the first holder (451) may be fixed to the first fixing member (441-1) before providing the flexible circuit board (440) to the first support member (421) and the second support member (422). The second holder (452) may be fixed to the second fixing member (441-2) before providing the flexible circuit board (440) to the first support member (421) and the second support member (422).

[0252] Unlike the above, the first holder (451) may be fixed to the first fixing member (441-1) after the flexible circuit board (440) is provided to the first support member (421) and the second support member (422). The second holder (452) may be fixed to the second fixing member (441-2) after the flexible circuit board (440) is provided to the first support member (421) and the second support member (422).

[0253] Referring to FIG. 26, a method for manufacturing an electronic device (401) according to one embodiment may include a step of bonding a first plate assembly (PA1) onto a first support member (421). A method for manufacturing an electronic device (301) according to one embodiment may include a step of bonding a second plate assembly (PA2) onto a second support member (422).

[0254] FIG. 27 is a cross-sectional view of a part of a configuration of an electronic device according to an embodiment of the present disclosure. FIG. 28 is a cross-sectional view of a part of a configuration of an electronic device according to an embodiment of the present disclosure.

[0255] The detailed configuration of the electronic device (501) according to an embodiment of the present disclosure not described below may be the same as the detailed configuration of the electronic device (101) according to an embodiment of the present disclosure described with reference to FIGS. 1 to 4, the detailed configuration of the electronic device (301) according to an embodiment of the present disclosure described with reference to FIGS. 5 to 22, and / or the detailed configuration of the electronic device (401) according to an embodiment of the present disclosure described with reference to FIGS. 23 to 26.

[0256] According to one embodiment, the first fixing portion (541-1) may be disposed on the inner side of the first fixing groove (5211). The first fixing portion (541-1) may be disposed on the first inclined member (571). The first fixing portion (541-1) may be fixed to the first inclined member (571). For example, the first fixing portion (541-1) may be attached to the first inclined member (571) by an attachment member (A). However, the present invention is not limited thereto, and the first fixing portion (541-1) may also be fixed to the first inclined member (571) through a separate mechanical coupling structure.

[0257] According to one embodiment, the first fixing portion (541-1) may include a portion that is inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F). For example, the first fixing portion (541-1) may include a portion that is inclined in the second thickness direction (-Z direction) as it goes toward the first direction (+X direction). For example, the first fixing portion (541-1) may be inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F). For example, the first fixing portion (541-1) may be fixed to a surface that is inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F) of the first inclined member (571). Through this structure, a sufficient space may be secured between the end (e.g., the first end (541-11)) of the first fixing portion (541-1) facing the folding axis (F) and the first hinge plate (533-1). Through this, a sufficient space can be secured for the second inner bending portion (542-1) to be placed, a sufficient radius of curvature of the first inner bending portion (542-1) can be secured, and a sufficient extension length of the first inner bending portion (542-1) can be secured. As described above, through these advantages, damage to the flexible circuit board (540) can be reduced, and the defect rate of the flexible circuit board (540) can be reduced.

[0258] According to one embodiment, the second fixing portion (541-2) may be disposed on the inner side of the second mounting groove (5221). The second fixing portion (541-2) may be disposed on the second inclined member (572). The second fixing portion (541-2) may be fixed to the second inclined member (572). For example, the second fixing portion (541-2) may be attached to the second inclined member (572) by an attachment member (A). However, the present invention is not limited thereto, and the second fixing portion (541-2) may also be fixed to the second inclined member (572) through a separate mechanical coupling structure.

[0259] According to one embodiment, the second fixing portion (541-2) may include a portion that is inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F). For example, the second fixing portion (541-2) may include a portion that is inclined in the second thickness direction (-Z direction) as it goes toward the second direction (-X direction). For example, the second fixing portion (541-2) may be inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F). Through this structure, a sufficient space can be secured between the end portion (e.g., the third end portion (541-21)) of the second fixing portion (541-2) facing the folding axis (F) and the second hinge plate (533-2). Through this, a sufficient space can be secured in which the second inner bending portion (542-1) can be placed, a sufficient radius of curvature of the second inner bending portion (542-1) can be secured, and a sufficient extension length of the second inner bending portion (542-1) can be secured. As described above, through these advantages, damage to the flexible circuit board (540) can be reduced, and the defect rate of the flexible circuit board (540) can be reduced.

[0260] According to one embodiment, the electronic device (501) may include a first inclined member (571). The first inclined member (571) may be seated in the first mounting groove (5211). The first inclined member (571) may be positioned on the second thickness direction (-Z direction) side of the first fixing portion (541-1). The first inclined member (571) may be referred to as an 'inclined member'.

[0261] According to one embodiment, the first inclined member (571) may include a surface that faces the first fixing portion (541-1) and is inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F). For example, the first inclined member (571) may include a surface that faces the first fixing portion (541-1) and is inclined in the first direction (+X direction) as it goes toward the bottom surface of the first mounting groove (5211).

[0262] In one embodiment, the first inclined member (571) may be provided separately from the first support member (521). For example, referring to FIG. 27, the first inclined member (571) may be attached to the first seating groove (5211) by an attachment member (A). For example, the first inclined member (571) may be attached to the bottom surface of the first seating groove (5211) and / or the surface of the first rib (5213) facing the first seating groove (5211) by the attachment member (A). Alternatively, the first inclined member (571) may be coupled to the first seating groove (5211) by a separate mechanical coupling structure.

[0263] According to one embodiment, the first inclined member (571) may be formed integrally with the first support member (521). For example, referring to FIG. 28, the first inclined member (571) may be a portion of the first support member (521).

[0264] In one embodiment, the first inclined member (571) can reinforce the first support member (521). For example, the first inclined member (571) can be in close contact with the bottom surface of the first seating groove (5211) and / or the first rib (5213) (e.g., see FIG. 27), or can extend from the bottom surface of the first seating groove (5211) and / or the first rib (5213) (e.g., see FIG. 28). As the first seating groove (5211) is formed by being sunken, the bottom portion of the first rib (5213) and / or the first seating groove (5211) can become thinner, and in this case, the first inclined member (571) can reinforce the thickness of the bottom portion of the first rib (5213) and / or the first seating groove (5211), thereby reinforcing the structural rigidity of the first support member (521).

[0265] According to one embodiment, the electronic device (501) may include a second inclined member (572). The second inclined member (572) may be seated in the second mounting groove (5221). The second inclined member (572) may be positioned on the second thickness direction (-Z direction) side of the second fixing portion (541-2). The second inclined member (572) may be referred to as an 'inclined member'.

[0266] According to one embodiment, the second inclined member (572) may include a surface that faces the second fixing portion (541-2) and is inclined in the second thickness direction (-Z direction) as it goes toward the folding axis (F). For example, the second inclined member (572) may include a surface that faces the second fixing portion (541-2) and is inclined in the second direction (-X direction) toward the bottom surface of the first mounting groove (5211).

[0267] In one embodiment, the second inclined member (572) may be provided separately from the second support member (522). For example, referring to FIG. 27, the second inclined member (572) may be attached to the second seating groove (5221) by an attachment member (A). For example, the second inclined member (572) may be attached to the bottom surface of the second seating groove (5221) and / or the surface of the second rib (5223) facing the second seating groove (5221) by the attachment member (A). Alternatively, the second inclined member (572) may be coupled to the second seating groove (5221) by a separate mechanical coupling structure.

[0268] According to one embodiment, the second inclined member (572) may be formed integrally with the second support member (522). For example, referring to FIG. 28, the second inclined member (572) may be a portion of the second support member (522).

[0269] In one embodiment, the second inclined member (572) can reinforce the second support member (522). For example, the second inclined member (572) can be in close contact with the bottom surface of the second seating groove (5221) and / or the second rib (5223) (e.g., see FIG. 27), or can extend from the bottom surface of the second seating groove (5221) and / or the second rib (5223) (e.g., see FIG. 28). As the second seating groove (5221) is formed by being sunken, the bottom portion of the second rib (5223) and / or the second seating groove (5221) can become thinner, and in this case, the second inclined member (572) can reinforce the thickness of the bottom portion of the second rib (5223) and / or the second seating groove (5221), thereby reinforcing the structural rigidity of the second support member (522).

[0270] In one embodiment, the first inclined member (571) can reinforce the first support member (521). For example, the first inclined member (571) can be in close contact with the bottom surface of the first seating groove (5211) and the first rib (5213). As the first seating groove (5211) is formed by being sunken, the bottom portion of the first rib (5213) and / or the first seating groove (5211) can become thinner. In this case, the first inclined member (571) can reinforce the thickness of the bottom portion of the first rib (5213) and / or the first seating groove (5211), thereby reinforcing the structural rigidity of the first support member (521).

[0271] According to one embodiment, the electronic device (501) may include a first holder (551). The first holder (551) may include a surface that faces the first fixing portion (541-1) and is inclined in a second thickness direction (-Z direction) toward the folding axis (F). For example, the first holder (551) may face the first fixing portion (541-1) and be inclined in a second thickness direction (-Z direction) toward the first direction (+X direction). The first fixing portion (541-1) may be in close contact with the inclined surface of the first holder (551). The first holder (551) may be referred to as a 'holder'.

[0272] According to one embodiment, the electronic device (501) may include a second holder (552). The second holder (552) may include a surface that faces the second fixing portion (541-2) and is inclined in a second thickness direction (-Z direction) toward the folding axis (F). For example, the second holder (552) may face the second fixing portion (541-2) and be inclined in a second thickness direction (-Z direction) toward the second direction (-X direction). The second fixing portion (541-2) may be in close contact with the inclined surface of the second holder (552). The second holder (552) may be referred to as a 'holder'.

[0273] FIG. 29 is a cross-sectional view illustrating one embodiment of a configuration of an electronic device according to one embodiment of the present disclosure.

[0274] The detailed configuration of the electronic device (601) according to an embodiment of the present disclosure not described below may be the same as the detailed configuration of the electronic device (101) according to an embodiment of the present disclosure described with reference to FIGS. 1 to 4, the detailed configuration of the electronic device (301) according to an embodiment of the present disclosure described with reference to FIGS. 5 to 22, the detailed configuration of the electronic device (401) according to an embodiment of the present disclosure described with reference to FIGS. 23 to 26, and / or the detailed configuration of the electronic device (501) according to an embodiment of the present disclosure described with reference to FIGS. 27 and 28.

[0275] According to one embodiment, the surface (6224s) facing the folding axis (F) of the first settling groove (6211) may include a portion that is inclined toward the opposite side of the folding axis (F) as it goes in the first thickness direction (+Z direction). For example, the surface (6224s) of the first inner wall (6224) facing the first settling groove (6211) may be inclined toward the second direction (-X direction) as it goes in the first thickness direction (+Z direction). Hereinafter, the surface (6224s) of the first settling groove (6211) facing the folding axis (F) may be referred to as a first inclined surface (6224s).

[0276] In one embodiment, the first inner bend (642-1) may be in close contact with the first inclined surface (6224s). For example, the first portion (642-11) of the first inner bend (642-1) may be in close contact with the first inclined surface (6224s) of the first inner wall (6224).

[0277] According to one embodiment, the extension direction of the first portion (642-11) may correspond to the extension direction of the first inclined surface (6224s). For example, the inclination of the portion of the first inner curved portion (642-1) that is in close contact with the first inclined surface (6224s) may correspond to the inclination of the first inclined surface (6224s).

[0278] According to one embodiment, the first inner curved portion (642-1) may include two portions that are disposed on both sides of the ridge portion of the first inner curved portion (642-1) and are parallel to the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction) or that become further apart from each other as they go in the first thickness direction (+Z direction). For example, the extension line E1 of the first portion (642-11) and the extension line E2 of the second portion (642-12) may become further apart from each other as they go in the first thickness direction (+Z direction). For example, as illustrated in FIG. 29, the extension line E2 of the second portion (642-12) may extend in the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction), and the extension line E1 of the first portion (642-11) may become further away from the folding axis (F) as they go in the first thickness direction (+Z direction). Through this structure, the distance between one end and the other end of the third portion (642-13) can be increased, so that the radius of curvature (R) of the third portion (642-13) can be increased. Through this, it is possible to prevent or reduce damage to the flexible circuit board (640) due to excessive bending of the first inner bend portion (642-1). In addition, since the protrusion height of the first inner bend portion (642-1) can be lowered as the radius of curvature of the third portion (642-13) increases, it is possible to prevent or reduce damage to the flexible circuit board (640) due to the first inner bend portion (642-1) being pressed by the first hinge plate (633-1).

[0279] The second inner bending portion may have a structure that is symmetrical with respect to the structure of the first inner bending portion (642-1) with respect to the folding axis (F).

[0280] In foldable electronic devices including flexible displays, reducing and / or preventing wrinkles in the display is considered an important task. In order to solve the above task, the design of a hinge assembly for implementing a "folding motion (folding motion) and / or unfolding motion (unfolding motion)" (hereinafter, abbreviated as "folding motion") of the foldable electronic device may be important. As a structure of the hinge assembly, a U-shaped (or wedge-shaped) hinge structure in which components included in the hinge assembly are spread out in a U shape and face each other when folded, and a water drop-shaped (or dumbbell-shaped) hinge structure in which components included in the hinge assembly form a negative angle (e.g., -5 degrees) when folded have been disclosed.

[0281] A hinge assembly having a water drop-shaped hinge structure can increase the bending radius of a flexible display compared to a hinge assembly having a U-shaped hinge structure. Therefore, among the hinge assembly having a U-shaped hinge structure and the hinge assembly having a water drop-shaped hinge structure, the hinge assembly having a water drop-shaped hinge structure is known to be effective in reducing wrinkles in a flexible display and advantageous in reducing lifting of the flexible display.

[0282] In this way, a hinge assembly having a water drop-shaped hinge structure is advantageous in improving the quality of the screen of a flexible display, but may shorten the service life of a flexible printed circuit board (FPCB) (hereinafter, referred to as a 'flexible circuit board') compared to a hinge assembly having a U-shaped hinge structure.

[0283] For example, to implement a water drop-shaped hinge structure, a bend may be formed in a flexible circuit board when the electronic device is in an unfolded state. The bend portion of the flexible circuit board can unfold when the electronic device is converted to a folded state, thereby implementing a water drop-shaped hinge structure. However, in conventional electronic devices, when the electronic device is in an unfolded state, the space in which the bend portion of the flexible circuit board can be placed within the hinge assembly is narrow, so that the flexible circuit board may be pressed by the hinge plate forming the front surface of the hinge assembly and deformed. The pressurization by the hinge plate continuously damages the flexible circuit board, which causes defects in the flexible circuit board.

[0284] Additionally, as the curved portion of the flexible circuit board was pressed by the hinge plate, the radius of curvature of the curved portion of the flexible circuit board could become smaller than the designed radius of curvature. In other words, the excessive bending of the flexible circuit board caused continuous damage to the flexible circuit board, which resulted in the failure of the flexible circuit board.

[0285] In addition, when the length of the curved portion of the flexible circuit board was reduced to reduce the pressure exerted by the hinge plate of the flexible circuit board, the length of the flexible circuit board fell short of the length required for the teardrop-shaped hinge structure during the process of changing the electronic device into a folded state, and tension was applied to the flexible circuit board, which caused a defect in the flexible circuit board.

[0286] The problem to be solved in the present disclosure is to secure sufficient space in which a curved portion of a flexible circuit board can be placed when an electronic device is in an unfolded state, thereby reducing excessive pressure on the curved portion of the flexible circuit board by a hinge plate, thereby reducing damage applied to the flexible circuit board, and thus lowering the failure rate of the flexible circuit board.

[0287] The problem to be solved in the present disclosure is to secure sufficient space for arranging a curved portion of a flexible circuit board when the electronic device is in an unfolded state, thereby reducing excessive pressure on the curved portion of the flexible circuit board by a hinge plate, thereby reducing excessive bending of the curved portion of the flexible circuit board beyond its designed structure, thereby reducing the failure rate of the flexible circuit board.

[0288] The problem to be solved in the present disclosure is to secure sufficient space in which a curved portion of a flexible circuit board can be placed when the electronic device is in an unfolded state, thereby securing sufficient length of the curved portion of the flexible circuit board, thereby reducing tension applied to the flexible circuit board when the electronic device is converted to a folded state, thereby lowering the failure rate of the flexible circuit board.

[0289] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0290] An electronic device according to various embodiments of the present disclosure can reduce excessive pressure on a curved portion of a flexible circuit board by a hinge plate, thereby reducing damage to the flexible circuit board and lowering the failure rate of the flexible circuit board.

[0291] An electronic device according to various embodiments of the present disclosure can reduce excessive pressure on a curved portion of a flexible circuit board by a hinge plate, thereby reducing excessive bending of the curved portion of the flexible circuit board beyond a designed structure, thereby reducing a failure rate of the flexible circuit board.

[0292] An electronic device according to various embodiments of the present disclosure can secure a sufficient length of a curved portion of a flexible circuit board, thereby reducing tension applied to the flexible circuit board when the electronic device is converted to a folded state, thereby reducing a failure rate of the flexible circuit board.

[0293] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0294] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first housing (311) in which a first support member (321; 421; 521) is arranged.

[0295] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a second housing (312) in which a second support member (322; 422; 522) is arranged.

[0296] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a hinge assembly (330) connected to the first housing (311) and the second housing (312), and rotatably connecting the first housing (311) and the second housing (312) about a folding axis (F).

[0297] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a flexible circuit board (340; 440; 540; 640) disposed in the first housing (311) and the second housing (312) and including a first fixing portion (341-1; 441-1; 541-1) fixed to the first support member (321; 421; 521).

[0298] The first support member (321; 421; 521) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first mounting groove (3211; 4211; 5211; 6211) that is recessed toward a second thickness direction opposite to the first thickness direction on a surface of the first support member (321; 421; 521) facing the first thickness direction.

[0299] The first fixing part (341-1; 441-1; 541-1) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure can be mounted in the first mounting groove (3211; 4211; 5211; 6211).

[0300] The flexible circuit board (340; 440; 540; 640) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure is connected to a first end (341-11; 541-11) facing the folding axis (F) of the first fixing part (341-1; 441-1; 541-1) and has a first inner curved part (342-1; 442-1; 542-1; 642-1) formed convexly in the first thickness direction when the electronic device (301; 401; 501; 601) is in an unfolded state, and a second end (340; 440; 540; 640) opposite the first end (541-11) of the first fixing part (341-1; 441-1; 541-1) It may include a first outer curved portion (343-1) connected to the end portion (341-12) and formed convexly in the first thickness direction.

[0301] The first fixing portion (341-1; 441-1; 541-1) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a rigid material.

[0302] According to one embodiment of the present disclosure, the first inner bending portion (342-1; 442-1; 542-1; 642-1) and the first outer bending portion (343-1) of the electronic device (301; 401; 501; 601) may include a flexible material.

[0303] The first inner curved portion (342-1; 442-1; 542-1; 642-1) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first portion (342-11; 642-11) and a second portion (342-12; 642-12) disposed on both sides of a peak portion of the first inner curved portion (342-1; 442-1; 542-1; 642-1).

[0304] The first part (342-11; 642-11) and the second part (342-12; 642-12) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may be parallel to the first thickness direction or may become further apart from each other as they go in the first thickness direction.

[0305] The hinge assembly (330) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first hinge plate (333-1; 533-1; 633-1) disposed on the first thickness direction side of the flexible circuit board (340; 440; 540; 640).

[0306] According to one embodiment of the present disclosure, the flexible circuit board (340; 440; 540; 640) of the electronic device (301; 401; 501; 601) may be in a non-pressurized state from the first hinge plate (333-1; 533-1; 633-1).

[0307] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may further include a first holder (351; 451; 551) disposed on the first thickness direction side of the first fixing part (341-1; 441-1; 541-1).

[0308] The first holder (351) of the electronic device (301) according to one embodiment of the present disclosure may include a first sub-holder (3512) adjacent to the first fixing portion (341-1) and a first main holder (3511) disposed on the first thickness direction side of the first sub-holder (3512).

[0309] An electronic device (301) according to one embodiment of the present disclosure may further include a first front plate (353) fixed to a surface of the first support member (321) facing the first thickness direction.

[0310] The first sub-holder (3512) of the electronic device (301) according to one embodiment of the present disclosure can be fixed to the first fixing part (341-1).

[0311] The first main holder (3511) of the electronic device (301) according to one embodiment of the present disclosure can be fixed to the first front plate (353).

[0312] The first fixing portion (541-1) of the electronic device (501) according to one embodiment of the present disclosure may include a portion that is inclined in the second thickness direction as it goes toward the folding axis (F).

[0313] An electronic device (501) according to one embodiment of the present disclosure may further include a first inclined member (571) disposed on the second thickness direction side of the first fixing member (541-1).

[0314] The first inclined member (571) of the electronic device (501) according to one embodiment of the present disclosure may include a surface that faces the first fixing portion (541-1) and is inclined in the second thickness direction toward the folding axis (F).

[0315] The first support member (321; 421; 521) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure is formed by penetrating the first support member (321; 421; 521) in the first thickness direction on the opposite side of the folding axis (F) with respect to the first mounting groove (3211; 4211; 5211; 6211) and a first through hole (3212) through which the flexible circuit board (340; 440; 540; 640) passes, and a first through hole (3212) formed between the first mounting groove (3211; 4211; 5211; 6211) and the first through hole (3212) from the bottom surface of the first mounting groove (3211; 4211; 5211; 6211). It may include a first rib (3213; 5213) protruding in the first thickness direction.

[0316] According to one embodiment of the present disclosure, the flexible circuit board (340; 440; 540; 640) of the electronic device (301; 401; 501; 601) is extended in close contact with the first rib (3213; 5213) and can pass through the first through hole (3212).

[0317] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may further include a first sealing member (355; 455) inserted into the first through hole (3212).

[0318] The flexible circuit board (340; 440; 540; 640) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may be disposed between the first sealing member (355; 455) and the first rib (3213; 5213).

[0319] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may further include a first front plate (353; 453) fixed to the first thickness direction side of the first support member (321; 421; 521).

[0320] The first sealing member (355; 455) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure can be attached to the first front plate (353; 453).

[0321] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may further include a second back plate (362) fixed to the second thickness direction side of the second support member (322; 422; 522).

[0322] The second support member (322; 422; 522) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a second mounting groove (3221; 4221; 5221) that is recessed toward the second thickness direction on a surface of the second support member (322; 422; 522) facing the first thickness direction.

[0323] The second back plate (362) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure can be fixed to a back fixing hole (RH) formed on a surface facing the second thickness direction of the second support member (322; 422; 522).

[0324] The rear fixing hole (RH) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may be in a non-overlapping state with the second fixing groove (3221; 4221; 5221) in the first thickness direction.

[0325] According to one embodiment of the present disclosure, the surface of the first mounting groove (6211) of the electronic device (601) facing the folding axis (F) may include a portion that is inclined toward the opposite side of the folding axis (F) as it goes in the first thickness direction.

[0326] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first housing (311) in which a first support member (321; 421; 521) is arranged.

[0327] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a second housing (312) in which a second support member (322; 422; 522) is arranged.

[0328] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a hinge assembly (330) connected to the first housing (311) and the second housing (312), and rotatably connecting the first housing (311) and the second housing (312) about a folding axis (F).

[0329] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a flexible circuit board (340; 440; 540; 640) disposed in the first housing (311) and the second housing (312).

[0330] The flexible circuit board (340; 440; 540; 640) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure comprises a first fixing portion (341-1; 441-1; 541-1) fixed to the first support member (321; 421; 521), a first end (541-11) of the first fixing portion (341-1; 441-1; 541-1) facing the folding axis (F), a first inner curved portion (342-1; 442-1; 542-1; 642-1) formed convexly in the first thickness direction when the electronic device (301; 401; 501; 601) is in an unfolded state, and the first It may include a first outer curved portion (343-1) that is connected to a second end (341-12) opposite to the first end (541-11) of the fixed portion (341-1; 441-1; 541-1) and is formed convexly in the first thickness direction.

[0331] The hinge assembly (330) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first hinge plate (333-1; 533-1; 633-1) disposed in the first thickness direction of the flexible circuit board (340; 440; 540; 640).

[0332] According to one embodiment of the present disclosure, the first inner bending portion (342-1; 442-1; 542-1; 642-1) of the electronic device (301; 401; 501; 601) may be in a non-pressurized state from the first hinge plate (333-1; 533-1; 633-1).

[0333] The first support member (321; 421; 521) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may include a first mounting groove (3211; 4211; 5211; 6211) that is recessed toward the second thickness direction on a surface of the first support member (321; 421; 521) facing the first thickness direction.

[0334] The first fixing part (341-1; 441-1; 541-1) of the electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure can be mounted in the first mounting groove (3211; 4211; 5211; 6211).

[0335] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may further include a first holder (351; 451; 551) disposed between the first thickness direction of the first fixing portion (341-1; 441-1; 541-1) and the first inner curved portion (342-1; 442-1; 542-1; 642-1) and the first outer curved portion (343-1).

[0336] An electronic device (301; 401; 501; 601) according to one embodiment of the present disclosure may further include a support sheet attached to the first inner bending portion (342-1; 442-1; 542-1; 642-1).

[0337] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0338] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In electronic devices (301; 401; 501; 601), A first housing (311) in which a first support member (321; 421; 521) is arranged; A second housing (312) in which a second support member (322; 422; 522) is arranged; A hinge assembly (330) connected to the first housing (311) and the second housing (312) and rotatably connecting the first housing (311) and the second housing (312) about a folding axis (F); and A flexible circuit board (340; 440; 540; 640) is disposed in the first housing (311) and the second housing (312) and includes a first fixing part (341-1; 441-1; 541-1) fixed to the first support member (321; 421; 521). The first support member (321; 421; 521) includes a first settling groove (3211; 4211; 5211; 6211) that is sunken in a second thickness direction opposite to the first thickness direction on a surface of the first support member (321; 421; 521) facing the first thickness direction, The first fixing part (341-1; 441-1; 541-1) is an electronic device (301; 401; 501; 601) that is mounted in the first mounting groove (3211; 4211; 5211; 6211).

2. In paragraph 1, The flexible circuit board (340; 440; 540; 640) is connected to the first end (341-11; 541-11) of the first fixing portion (341-1; 441-1; 541-1) facing the folding axis (F) and has a first inner curved portion (342-1; 442-1; 542-1; 642-1) formed convexly in the first thickness direction when the electronic device (301; 401; 501; 601) is in an unfolded state, and a second end (341-12) of the first fixing portion (341-1; 441-1; 541-1) opposite the first end (541-11) and formed convexly in the first thickness direction. An electronic device (301; 401; 501; 601) comprising a bending portion (343-1).

3. In paragraph 2, The above first fixed part (341-1; 441-1; 541-1) includes a rigid material, The first inner bending portion (342-1; 442-1; 542-1; 642-1) and the first outer bending portion (343-1) are electronic devices (301; 401; 501; 601) comprising a flexible material.

4. In paragraph 2 or 3, The first inner bending portion (342-1; 442-1; 542-1; 642-1) includes a first portion (342-11; 642-11) and a second portion (342-12; 642-12) arranged on both sides of the peak portion of the first inner bending portion (342-1; 442-1; 542-1; 642-1). The electronic device (301; 401; 501; 601) in which the first part (342-11; 642-11) and the second part (342-12; 642-12) are parallel to the first thickness direction or move away from each other as they go in the first thickness direction.

5. In any one of paragraphs 1 to 4, The above hinge assembly (330) includes a first hinge plate (333-1; 533-1; 633-1) arranged on the first thickness direction side of the flexible circuit board (340; 440; 540; 640), The above flexible circuit board (340; 440; 540; 640) is an electronic device (301; 401; 501; 601) in a non-pressurized state from the first hinge plate (333-1; 533-1; 633-1).

6. In any one of paragraphs 1 to 5, An electronic device (301; 401; 501; 601) further comprising a first holder (351; 451; 551) disposed on the first thickness direction side of the first fixing portion (341-1; 441-1; 541-1).

7. In paragraph 6, An electronic device (301) including a first sub-holder (3512) adjacent to the first fixing portion (341-1) and a first main holder (3511) disposed on the first thickness direction side of the first sub-holder (3512).

8. In paragraph 7, Further comprising a first front plate (353) fixed to a surface facing the first thickness direction of the first support member (321), The above first sub-holder (3512) is fixed to the first fixing part (341-1), The first main holder (3511) is an electronic device (301) fixed to the first front plate (353).

9. In any one of paragraphs 1 to 8, An electronic device (501) in which the first fixed portion (541-1) includes a portion that is inclined in the second thickness direction as it goes toward the folding axis (F).

10. In any one of paragraphs 1 to 9, It further includes a first inclined member (571) arranged on the second thickness direction side of the first fixed part (541-1), An electronic device (501) in which the first inclined member (571) includes a surface that faces the first fixed part (541-1) and is inclined in the second thickness direction toward the folding axis (F).

11. In any one of paragraphs 1 to 10, The first support member (321; 421; 521) includes a first through hole (3212) formed by penetrating the first support member (321; 421; 521) in the first thickness direction on the opposite side of the folding axis (F) with respect to the first mounting groove (3211; 4211; 5211; 6211) and through which the flexible circuit board (340; 440; 540; 640) passes, and a first rib (3213; 5213) protruding in the first thickness direction from the bottom surface of the first mounting groove (3211; 4211; 5211; 6211) between the first mounting groove (3211; 4211; 5211; 6211) and the first through hole (3212). The above flexible circuit board (340; 440; 540; 640) is extended in close contact with the first rib (3213; 5213) and passes through the first through hole (3212) and an electronic device (301; 401; 501; 601).

12. In paragraph 11, It further includes a first sealing member (355; 455) inserted into the first through hole (3212), The above flexible circuit board (340; 440; 540; 640) is an electronic device (301; 401; 501; 601) disposed between the first sealing member (355; 455) and the first rib (3213; 5213).

13. In paragraph 12, Further comprising a first front plate (353; 453) fixed to the first thickness direction side of the first support member (321; 421; 521), The first sealing member (355; 455) is an electronic device (301; 401; 501; 601) attached to the first front plate (353; 453).

14. In any one of paragraphs 1 to 13, Further comprising a second back plate (362) fixed to the second thickness direction side of the second support member (322; 422; 522), The second support member (322; 422; 522) includes a second settling groove (3221; 4221; 5221) that is sunken toward the second thickness direction on the surface of the second support member (322; 422; 522) facing the first thickness direction, The second back plate (362) is fixed to the back fixing hole (RH) formed on the surface facing the second thickness direction of the second support member (322; 422; 522). The above rear fixing hole (RH) is an electronic device (301; 401; 501; 601) that is non-overlapping with the second fixing groove (3221; 4221; 5221) in the first thickness direction.

15. In any one of paragraphs 1 to 14, An electronic device (601) in which the surface of the first fixing groove (6211) facing the folding axis (F) includes a portion that is inclined toward the opposite side of the folding axis (F) as it goes in the first thickness direction.

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