Electronic device comprising antenna

Abstract

Disclosed in the present document is an electronic device comprising: a side member including an outer surface and an inner surface, the side member partially including a conductive portion; at least one flexible substrate that is electrically connected to a display arranged in an inner space provided by the side member and includes at least one bending portion that bends toward the inner surface; and at least one conductive member that is attached on the inner surface between the inner surface of the side member and the bending portion and arranged closer to the conductive portion of the outer surface than the bending portion.

Description

Electronic device including an antenna

[0001] One embodiment of the present document relates to an electronic device including an antenna.

[0002] Portable electronic devices such as smartphones can offer a variety of functions, including calling, based on various applications. During this process, the device can display a screen corresponding to each function. Users may desire a wider screen to utilize these various functions.

[0003] To achieve wider screens, the bezel area surrounding the display screen is gradually decreasing. This continued reduction in bezel area may result in a closer distance between the antenna formed within the bezel area for communication functions and various structures placed within electronic devices. Various structures placed within electronic devices, placed in close proximity to the antenna, can affect the antenna's communication characteristics.

[0004] An electronic device (or portable electronic device, portable communication device, or portable electronic device having a communication function) according to at least one embodiment of the present invention comprises: a side member (630) comprising a plurality of side walls (632, 633, 634) including an outer side (703) facing the outside of the electronic device and an inner side (702) facing the outer side; a display (530, 1130) arranged in an internal space (750) provided by the side member; at least one flexible substrate (540, 1040) electrically connected to the display and including at least one bending portion (541) bent toward the side member; And it may include at least one conductive member (550, 850, 1050, 1350, 1650, 1850) disposed between the inner surface (702) of the side member and the banding portion (541, 1041), one side facing the inner surface and the other side facing the banding portion (541, 1041).

[0005] An electronic device (or a portable electronic device, a portable communication device, or a portable electronic device having a communication function) according to at least one embodiment of the present invention comprises: a side member (630) comprising a plurality of side walls (632, 633, 634) including an outer side (703) facing the outside of the electronic device and an inner side (702) facing the outer side; a display (530, 1130) arranged in an inner space (750) provided by the side member; at least one flexible substrate (540, 1040) electrically connected to the display and including at least one bending portion (541) bent toward the inner side; And at least one conductive member (550, 850, 1050, 1350, 1650, 1850) is attached to the inner surface between the inner surface (702) of the side member and the banding portion (541, 1041) and is arranged to face the banding portion (541, 1041), and a conductive antenna formed as a conductive part (620) on the outer surface can be arranged closer to the conductive member (550, 850, 1050, 1350, 1650, 1850) than to the banding portion (541, 1041).

[0006] An electronic device (or a portable electronic device, a portable communication device, or a portable electronic device having a communication function) according to at least one embodiment of the present invention comprises: a side member forming a side surface surrounding an internal space of the electronic device and having a plurality of side walls including a conductive portion and a non-conductive portion; a flexible member including a bending portion disposed in the internal space and having at least a portion bent, and a plurality of signal lines passing through the bending portion; and at least one conductive member disposed on the inner surface, at least a portion of which is formed of the non-conductive portion, between the side member and the bending portion, wherein when the side surface of the electronic device is viewed, the side member, the support member, the conductive member, the internal space, and the bending portion may be sequentially arranged.

[0007] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described herein.

[0008] FIG. 2 is a drawing showing an example of the front surface of an electronic device according to one embodiment.

[0009] FIG. 3 is a drawing showing an example of the rear surface of an electronic device according to one embodiment.

[0010] FIG. 4 is a drawing showing an example of an exploded perspective view of an electronic device according to one embodiment.

[0011] FIG. 5 is a top view of a portion of an electronic device with the front plate of the electronic device omitted according to one embodiment.

[0012] FIG. 6 is a top view of a portion of an electronic device, with the front plate and display of the electronic device omitted, according to one embodiment.

[0013] Fig. 7 is a cross-sectional view showing an electronic device taken along line A-A' in Fig. 5.

[0014] FIG. 8 is a drawing of an electronic device viewed from one direction, with the front plate of the electronic device omitted according to one embodiment.

[0015] FIG. 9 is a drawing of an electronic device viewed from one direction, with the front plate and display of the electronic device omitted according to one embodiment.

[0016] FIG. 10 is a drawing of an electronic device viewed from one direction, with the front plate of the electronic device omitted according to one embodiment.

[0017] FIG. 11 is a diagram illustrating an exploded view of an electronic device according to one embodiment.

[0018] Figure 12 is a cross-sectional view of the electronic device illustrated in Figure 10.

[0019] FIG. 13 is a drawing showing an electronic device according to one embodiment.

[0020] FIG. 14 is a diagram showing an electronic device according to an embodiment.

[0021] FIG. 15 is a diagram showing an electronic device according to one embodiment.

[0022] FIG. 16 is a drawing showing an electronic device according to one embodiment.

[0023] FIG. 17 is a drawing showing a laminated member included in an electronic device according to one embodiment.

[0024] Figure 18 is a cross-sectional view showing an electronic device according to one embodiment.

[0025] Figure 19 is a cross-sectional view showing an electronic device according to a comparative example.

[0026] FIG. 20 is a diagram showing the radiation efficiency of an electronic device according to a comparative example and the radiation efficiency of an electronic device according to an embodiment.

[0027] FIG. 21a is a graph showing the radiation efficiency of an electronic device according to a comparative example without a conductive member, FIG. 21b is a graph showing the radiation efficiency of an electronic device according to an embodiment, and FIG. 21c is a graph showing the radiation efficiency of an electronic device according to an embodiment to which frequency adjustment is applied.

[0028] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0029] One embodiment of the present invention described below provides an electronic device including a flexible display, a side member that provides an internal space for accommodating the flexible display, a flexible substrate including a bending portion that is electrically connected to the flexible display and bends toward the side member, and a conductive member disposed between the side member and the flexible substrate.

[0030] Other intended purposes according to various embodiments of the present invention will be mentioned as needed in the process of describing each embodiment.

[0031] An electronic device according to one embodiment includes a conductive member disposed between a side member including a conductive portion used as an antenna and a flexible substrate including a bending portion, so that the conductive member can be disposed closer to the antenna than the flexible substrate.

[0032] An electronic device according to one embodiment has a distance deviation between a side member and a flexible substrate due to a deviation in the attachment of the flexible substrate, while a conductive member that is placed relatively close to the side member can maintain a constant distance from the side member.

[0033] In an electronic device according to one embodiment, even if a distance deviation occurs between the side member and the flexible substrate due to a deviation in the attachment of the flexible substrate, a conductive member that maintains a constant distance from the side member can uniformly affect the communication characteristics of the side member.

[0034] An electronic device according to one embodiment can secure stable radiation performance by reducing or preventing fluctuations in resonant frequency due to distance deviation since there is no distance deviation between the side member and the conductive member.

[0035] In addition, various purposes and effects provided by electronic devices according to various embodiments may be mentioned according to the embodiments of the detailed description.

[0036] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0037] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), a wearable-type device (193), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0038] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0039] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0040] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components.

[0041] For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., the memory controller (116)) may be included within other components (e.g., at least a portion of the memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0042] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0043] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0044] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0045] FIG. 2 is a drawing showing an example of the front side of an electronic device according to one embodiment. FIG. 3 is a drawing showing an example of the rear side of an electronic device according to one embodiment.

[0046] Referring to FIGS. 2 and 3, an electronic device (200) (or portable electronic device, portable communication device) according to one embodiment may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing may refer to a structure forming a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2. According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the back plate (211) and comprises a metal and / or polymer. In some embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0047] In the illustrated embodiment, the front plate (202) may include two first regions (210D) that extend seamlessly from the first side (210A) toward the back plate (211) on either side of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 2), the back plate (211) may include two second regions (110E) that extend seamlessly from the second side (210B) toward the front plate (202) on either side of a long edge. In some embodiments, the front plate (202) (or the back plate (211)) may include only one of the first regions (210D) (or the second regions (110E)). In one embodiment, some of the first regions (210D) or some of the second regions (110E) may not be included. In an embodiment, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first regions (210D) or the second regions (110E) as described above, and may have a second thickness that is thinner than the first thickness on the side that includes the first regions (210D) or the second regions (110E).

[0048] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0049] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first areas (210D) of the side surfaces (210C). In one embodiment, the edges of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical to expand the area over which the display (201) is exposed.

[0050] In one embodiment, the display (201) may include at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) that are formed in a recess or opening in a portion of a screen display area and aligned with the recess or opening. In one embodiment, the display (201) may include at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor, and a light-emitting element (206) on a rear surface of the screen display area. In one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be disposed in the first areas (210D) and / or the second areas (110E).

[0051] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sounds, and in some embodiments, multiple microphones may be disposed to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0052] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first side (210A) of the housing (210) (e.g., the display (201) as well as the second side (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0054] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0055] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0056] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0057] FIG. 4 is a drawing showing an example of an exploded perspective view of an electronic device according to one embodiment.

[0058] Referring to FIG. 4, the electronic device (300) may include a side member (310) (e.g., the side bezel structure (218) of FIG. 2), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display module (160) of FIG. 1, the display (201) of FIG. 3), a printed circuit board (340), a battery (350) (e.g., the battery (189) of FIG. 1), a first support member (311) (or a bracket, a support structure), a second support member (360) (or a rear case), an antenna (370), and a rear plate (380) (e.g., the rear plate (211) of FIG. 3). In one embodiment, the electronic device (300) may omit at least one of the components or additionally include another component. At least one of the components of the electronic device (300) may be the electronic device (101) of FIG. 1, or It may be identical to or similar to at least one of the components of the electronic device (200) of FIGS. 2 and 3, and any overlapping descriptions are omitted below.

[0059] According to one embodiment, the side member (310) may include a first side (3101) having a first length, a second side (3102) extending in a direction perpendicular to the first side (3101) (e.g., in the y-axis direction) and having a second length longer than the first length, a third side (3103) extending from the second side (3102) in a direction parallel to the first side (3101) and having the first length, and a fourth side (3104) extending from the third side (3103) in a direction parallel to the second sidewall (3102) and having the second length.

[0060] According to one embodiment, the first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). For example, the first support member (311) may extend from a portion of at least one of the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104), or may be structurally coupled to at least one of the first side wall (3101), the second side wall (3102), the third side wall (3103), and the fourth side wall (3104). The first support member (311) may have a display (330) disposed on one surface and a printed circuit board (340) disposed on the other surface. The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. For example, the first support member (311) may be formed by processing at least a portion of a metal plate and adding an injection-molded structure at least partially through an injection molding process.

[0061] According to one embodiment, the printed circuit board (340) may be equipped with a processor (e.g., the processor (110) of FIG. 1), a memory (e.g., the memory (120) of FIG. 1), and / or an interface. The processor may include, for example, one or more of a central processing unit (e.g., the central processing unit (111) of FIG. 1), an application processor, a graphics processing unit, an image signal processor (e.g., the image signal processor (114) of FIG. 1), a sensor hub processor, or a communication processor (e.g., the communication processor (118) of FIG. 1). The memory may include, for example, a volatile memory (e.g., the volatile memory (121) of FIG. 1) or a nonvolatile memory (e.g., the nonvolatile memory (122) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0062] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be disposed integrally within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0063] According to one embodiment, the antenna (370) may be positioned between the back plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion of the side member (310) or a combination thereof.

[0064] FIG. 5 is a top view of a portion of an electronic device with the front plate of the electronic device omitted according to one embodiment, FIG. 6 is a top view of a portion of an electronic device with the front plate and display of the electronic device omitted according to one embodiment, and FIG. 7 is a cross-sectional view showing the electronic device taken along line A-A' in FIG. 5.

[0065] Referring to FIGS. 5, 6 and 7, an electronic device (500) according to one embodiment may include a housing (510), a display (530), at least one first flexible substrate (540) and a conductive member (550).

[0066] The housing (510) may form an exterior of the electronic device (500). The housing (510) may include a front plate (e.g., the front plate (202) of FIG. 2 or the front plate (320) of FIG. 4) (e.g., a first plate, a front cover, or a first cover), a rear plate (e.g., the rear plate (211) of FIG. 2 or the rear plate (380) of FIG. 4) facing in the opposite direction to the front plate (e.g., a second plate, a rear cover, or a second cover), and a side member (630) (e.g., the side bezel structure (218) of FIG. 2 or the side member (310) of FIG. 3) surrounding an internal space (750) between the front plate and the rear plate.

[0067] According to one embodiment, the side member (630) may form an exterior of a side of the electronic device (500). The side member (630) may include a first side wall having a first length (e.g., the first side wall (3101) of FIG. 2), a second side wall (632) extending in a direction perpendicular to the first side wall and having a second length longer than the first length (e.g., the second side wall (3102) of FIG. 2), a third side wall (633) extending in a direction parallel to the first side from the second side wall (632) and having a first length (e.g., the third side wall (3103) of FIG. 2), and a fourth side wall (634) extending in a direction parallel to the second side wall from the third side wall (633) and having a second length (e.g., the fourth side wall (3104) of FIG. 2).

[0068] According to one embodiment, at least a portion of one of the first side wall, the second side wall (632), the third side wall (633), and the fourth side wall (634) included in the side member (630) may include a plurality of conductive portions (620) (or, metal antennas, antenna radiators, housing antennas, internal conductors, inner conductors) segmented through at least one slit (or, segment, hole, gap) (501, 502). Each of the plurality of conductive portions (620) may be electrically isolated from an adjacent conductive portion (620). Each of the plurality of conductive portions (620) may be spaced apart from the adjacent conductive portion (620) with a slit (501, 502) therebetween. The slits (501, 502) may be filled with non-conductive portions (610). At least a portion of the side member (630) may have a plurality of conductive portions (620) and at least one non-conductive portion (610) alternately arranged. For example, at least a portion of the side member (630) (e.g., the third side wall (633)) may include a first conductive portion (621), a second conductive portion (622) spaced apart from the first conductive portion (621) with a first slit (501) therebetween, and a third conductive portion (623) spaced apart from the first conductive portion (621) with a second slit (502) therebetween. The first slit (501) may be filled with the first non-conductive portion (611), and the second slit (502) may be filled with the second non-conductive portion (612).

[0069] According to one embodiment, the conductive portion (620) may be formed of a conductive metal material, and the non-conductive portion (610) may be formed of a polymer material, an insulating material, an adhesive material, and / or an injection-molded material. According to one embodiment, the side member (630) may be formed by injection-molding the non-conductive portion (610) into the conductive portion (620). According to one embodiment, the conductive portion (620) may be structurally connected to the non-conductive portion (610). According to one embodiment, the non-conductive portion (610) may be arranged so as to be at least partially visible from the outside along the edge of the side member (630). According to one embodiment, a portion of the conductive portion (620) may not be visible from the outside. According to one embodiment, at least a portion of the conductive portion (620) may be arranged so as to be exposed to the internal space of the electronic device. According to one embodiment, at least a portion of the conductive portion (620) may be positioned so as to be exposed and visible from the outside.

[0070] According to one embodiment, the conductive portion (620) is electrically connected to a processor (e.g., the processor (110) of FIG. 1) and / or a communication circuit (e.g., the communication circuit (160) of FIG. 1) and may operate as an antenna. At least a portion of the conductive portion (620) operating as an antenna may operate in a frequency band of a low band (e.g., about 600 MHz to 1200 MHz), a mid band (e.g., about 1500 MHz to 2200 MHz) and / or a high band (e.g., about 2300 MHz to 2700 MHz). The frequency band of the antenna is not limited to the above-described examples, and signals of other frequency bands may be transmitted and received.

[0071] According to one embodiment, the side member (630) may include a support member (710) (e.g., the first support member (311) of FIG. 3) extending into the interior space (750) from at least a portion of one of the first side wall (632), the second side wall (632), the third side wall (633), and the fourth side wall (634). According to one embodiment, at least a portion of the support member (710) may be formed of the same material as the conductive portion (620) and / or the non-conductive portion (610). According to one embodiment, the support member (710) may be arranged to extend from the side member (630) or be structurally connected to the side member (630).

[0072] According to one embodiment, the support member (710) may include a first support surface (711) facing a first direction (e.g., +z-axis direction) and a second support surface (712) facing a second direction (e.g., -z-axis direction) opposite to the first support surface (711). As an example, a display (530) may be disposed on the first support surface (711), and a printed circuit board (e.g., printed circuit board (340) of FIG. 4) may be disposed on the second support surface (712).

[0073] According to one embodiment, the display (530) may be disposed on the first support surface (711) of the support member (710). The display (530) may visually provide various information to a user of the electronic device (500). The display (530) may be electrically connected to a printed circuit board. For example, the display (530) may include a display panel (740) to provide various information, and a display circuit unit (730) for driving and controlling the display (530). For example, the display (530) may include a touch sensor for performing an input function, a display panel (740) for performing a display function, and a display circuit unit (730) for driving and controlling the display (530).

[0074] The display circuitry (730) may be disposed on the lower portion (e.g., in the -x-axis direction) of the display panel (740). The display circuitry (730) may include a display driver IC (DDI) and / or a touch display driver IC (TDDI). The display circuitry (730) may be disposed on at least one flexible substrate including a first flexible substrate (540) having an electrical wiring structure. For example, the display circuitry (730) may have a COP (chip on plastic or chip on panel) structure and may be disposed on the first flexible substrate (540), which is a part of a plastic substrate included in the display panel (740). For example, the display circuitry (730) may have a COF (chip on film) structure and may be disposed on the first flexible substrate (540), which is a separate film (e.g., a flexible printed circuit board) attached to a glass substrate and / or plastic included in the display panel (740). The first flexible substrate (540) can be folded based on a bending axis that is parallel to the x-axis. At least a portion of the first flexible substrate (540) can include a first bending portion (541) that bends from each of one side (e.g., a side facing the +z-axis) of the display panel (740) and the other side (e.g., a side facing the -z-axis) of the display panel (740) toward the side member (630). At least a portion of the first bending portion (541) can be arranged to face the side member (630) in the y-axis direction. At least one of the plurality of side walls included in the side member (630) can include an outer side surface (703), an inner side surface (702), and an upper side surface (701). The outer side surface (703) can be formed to face the outside of the electronic device (500) to form a side appearance of the electronic device (500). The inner side (702) may be formed to face the outer side (703) and face the inner space (750) of the electronic device (500).The upper side (701) (e.g., the side facing the +z axis) may be formed to face the front plate (720) between the outer side (703) and the inner side (702). The first bending portion (541) may be formed to protrude more than one side (e.g., the side facing the -y axis) of the display panel (740) toward the side member (630). For example, the first bending portion (541) may be formed to be curved toward a side wall (e.g., a third side wall (633)) in which a connector hole (e.g., a connector hole (208, 209) of FIGS. 2 and 3) of the side member (630) is arranged.

[0075] According to one embodiment, a conductive member (or, conductive strip, metal strip, inner conductor, internal conductor, conductive bar) (550) may be disposed on a portion of the side member (630). The conductive member (550) may be disposed on an inner surface (702) made of a non-conductive material included in the side member (630). The conductive member (550) may be electrically insulated from a conductive portion (620) of the side member (630) that operates as an antenna through a non-conductive portion (610) of the side member (630). The conductive member (550) may be disposed on the inner surface (702) of the side member (630) so as to face a first bending portion (541) of a first flexible substrate (540) that is electrically connected to a display panel (740). For example, the apex (or, extreme point, curved point) portion (542) of the first banding portion (541) may be formed convexly toward the conductive member (550).

[0076] According to one embodiment, when looking at the side of the electronic device (500), the side walls (632, 633, 634) of the side member (630), the conductive member (550), the internal space (750), and the first banding portion (541) may be sequentially arranged. For example, at least a portion of the internal space (750) may be filled with a fluid (e.g., gas, air) and / or a solid material (e.g., molding). For example, at least a portion of the internal space (750) may be filled with a material of the same type and / or a different type of material (e.g., air) as the non-conductive portion (610) of the side member (630). The conductive member (550) may be formed such that one side (or the side facing the internal space (750) of the electronic device (500)) faces the inner side (702), and the other side (or the side facing the outside of the electronic device (500)) faces the first bending portion (541). One side of the conductive member (550) may be in contact with the inner side (702) extending from the non-conductive portion (610). One side of the conductive member (550) may be in contact with the inner side (702) made of the same material as the non-conductive portion (610). The other side of the conductive member (550) may not be in contact with the inner side (702) made of the same material as the non-conductive portion (610). The surface of the conductive member (550) can be spaced apart from the first banding portion (541) with the internal space (750) of the electronic device (500) interposed therebetween.

[0077] According to one embodiment, the conductive member (550) may be formed long along the inner side (702) of the side member (630) facing the banding portion (541) of the first flexible substrate (540). The conductive member (550) can be formed continuously without a break between the second side wall (632) and the fourth side wall (634) so ​​as to be parallel to the third side wall (633). The conductive member (550) can be formed continuously without a break between the first conductive part (621) formed between the first non-conductive part (611) and the second non-conductive part (612). The conductive member (550) can have a longer length than the first conductive part (621). The conductive member (550) can be formed in a strip shape along the inner surface (702) of the third side wall (633) of the side member (630). The conductive member (550) can be formed in a line along the x-axis by a second conductive part (622), a first non-conductive part (611), a first conductive part (621), and a second It can be formed in a strip shape along the non-conductive portion (612) and the third conductive portion (623). The conductive member (550) can be formed using a conductive material. For example, the conductive member (550) can be formed using a conductive tape or a metal (e.g., copper) tape. For example, the conductive member (550) can be formed by thinly laminating a metal material on the inner surface (702) of the side member (630) through a deposition process (e.g., PVD (physical vapor deposition)).

[0078] According to one embodiment, the conductive member (550) may have a length (e.g., a length parallel to the x-axis direction) that is the same as or different from a length (e.g., a length parallel to the x-axis direction) at which the conductive portion (620) used as the antenna and the first flexible substrate (540) overlap. For example, the conductive member (550) may have a length that is the same as the length of the first flexible substrate (540) (e.g., a length parallel to the x-axis direction), or may have a length that is smaller than or greater than the length of the first flexible substrate (540) (e.g., a length parallel to the x-axis direction).

[0079] According to one embodiment, the conductive member (550) may be arranged to overlap at least a portion of at least one of the conductive portion (620) that acts as an antenna of the side member and the non-conductive portion (610) that fills the slits (501, 502). For example, the conductive member (550) may be arranged to overlap at least a portion of the first conductive portion (621), at least a portion of the second conductive portion (622), at least a portion of the third conductive portion (623), the first non-conductive portion (611), and the second non-conductive portion (612).

[0080] According to one embodiment, the conductive member (550) may be disposed closer to the conductive portion (620) used as an antenna than the first flexible substrate (540) that is electrically connected to the display panel (740). Since the conductive member (550) is disposed on the inner surface (702) of the side member (630), the conductive member (550) may be disposed to be spaced apart from the conductive portion (620) of the side member (630) by a designated first distance (D1). The conductive member (550) may be disposed to be spaced apart from the conductive portion (620) by a first distance (D1) corresponding to the thickness (e.g., length in the y-axis direction) of the non-conductive portion (610). The conductive portion (620) of the side member (630) may be spaced apart from the bending portion (541) of the first flexible substrate (540) by a second distance (D2) that is greater than the first distance (D1). The second distance (D2) between the conductive portion (620) of the side member (630) and the bending portion (541) of the first flexible substrate (540) may vary depending on various deviation factors (e.g., attachment deviation of the first flexible substrate (540), lamination tolerance for attaching the display panel (740) and the front plate (720), mechanical component tolerance, and bonding tolerance). The conductive member (550) is arranged on the non-conductive portion (610) of the side member (630) for which tolerance management is easy, so that the conductive member (620) and the designated first distance (D1) can be constantly maintained regardless of the position of the first flexible substrate (540) (e.g., the bending portion (541)). Even if deviation and / or tolerance caused by the first flexible substrate (540) occur independently or in combination, the conductive member (550) can constantly maintain (or fix) the designated first distance (D1) with the side member (630) including the conductive member (620) that operates as an antenna. Since no distance deviation occurs between the side member and the conductive member, the capacitance (or parasitic capacitance, parasitic resonance) between the conductive member (550) and the conductive portion (620) can be constantly maintained.An electronic device according to one embodiment can reduce or prevent the occurrence of fluctuations in resonant frequency due to distance deviation, thereby ensuring stable radiation performance.

[0081] FIG. 8 is a drawing of an electronic device viewed from one direction with the front plate of the electronic device omitted according to an embodiment, and FIG. 9 is a drawing of an electronic device viewed from one direction with the front plate and display of the electronic device omitted according to an embodiment. The electronic device (800) of FIGS. 8 and 9 may include embodiments that are at least partially similar to or different from at least one of the preceding embodiments of FIGS. 1 to 7. The electronic device (800) of FIGS. 8 and 9 is the same as or omitted from the preceding embodiments of at least one of FIGS. 1 to 7 for components that are the same as or can be easily understood through the preceding embodiments, and a detailed description thereof will also be omitted.

[0082] Referring to FIGS. 8 and 9, an electronic device (800) according to one embodiment may include a side member (630), a display (530), at least one flexible substrate (e.g., a first flexible substrate (540)), and a conductive member (850).

[0083] According to one embodiment, the conductive member (850) may include a plurality of conductive members (851, 852) spaced apart from each other. The conductive member (850) may be formed to correspond to a plurality of slits (501, 502) and / or a plurality of non-conductive portions (611, 612) of the side member (630). For example, the conductive member (850) may include a first conductive member (851) corresponding to the first slit (501) and / or the first non-conductive portion (611), and a second conductive member (852) corresponding to the second slit (502) and / or the second non-conductive portion (612). The first conductive member (851) and the second conductive member (852) may be spaced apart from each other in an area corresponding to the first conductive portion (621).

[0084] The first conductive member (851) may be formed in the first slit (501) and / or the first non-conductive portion (611) and an adjacent area thereof. The first conductive member (851) may be formed to have a longer length (e.g., a length in the x-axis direction) than the first non-conductive portion (611). The first conductive member (851) may be formed on the inner surface (702) of the side member (630) along the inner surface (702) made of a non-conductive material of the side member (630).

[0085] The second conductive member (852) may be formed in the second slit (502) and / or the second non-conductive portion (612) and an adjacent area thereof. The second conductive member (852) may be formed to have a longer length (e.g., a length in the x-axis direction) than the second non-conductive portion (612).

[0086] The first non-conductive portion (611) and the second non-conductive portion (612) may overlap with the conductive member (850) in a direction from the outer surface (703) to the inner surface (702) (e.g., in the +y-axis direction). A portion of the first conductive portion (621) may overlap with the conductive member (850) in a direction from the outer surface (703) to the inner surface (702). Another portion of the first conductive portion (621) may not overlap with the conductive member (850) in a direction from the outer surface (703) to the inner surface (702).

[0087] According to one embodiment, the separation distance between the plurality of conductive members (850) may be arranged closer than the separation distance between the plurality of non-conductive parts (611, 612). For example, the separation distance (e.g., the distance parallel to the x-axis) between the first conductive member (851) and the second conductive member (852) may be arranged closer than the separation distance (e.g., the distance parallel to the x-axis) between the first non-conductive part (611) and the second non-conductive part (612).

[0088] In an electronic device according to an embodiment, even if a deviation in the attachment of the first flexible substrate (540) occurs, the first conductive member (851) and / or the second conductive member (852) can be arranged closer to the side member (630) than the first flexible substrate (540) and maintain a constant distance from the side member (630). Since a distance deviation between the first conductive member (851) and / or the second conductive member (852) and the side member (630) does not occur, the capacitance (or parasitic capacitance, parasitic resonance) between the conductive member (850) and the conductive portion (620) can be maintained constant. The electronic device according to an embodiment can reduce or prevent a change in the resonant frequency due to a distance deviation, thereby ensuring stable radiation performance.

[0089] An electronic device according to an embodiment can minimize capacitance (or parasitic capacitance, parasitic resonance) between the conductive member (850) and the first conductive portion (621) by non-overlapping each of the first conductive member (851) and / or the second conductive member (852) with at least a portion of the first conductive portion (621). The electronic device according to an embodiment can reduce the amount of change in resonance frequency due to the conductive member (850), thereby ensuring stable radiation performance.

[0090] FIG. 10 is a drawing of an electronic device viewed from one direction with the front plate of the electronic device omitted according to one embodiment, FIG. 11 is a drawing showing an exploded view of the electronic device according to one embodiment, and FIG. 12 are cross-sectional views of the electronic device illustrated in FIG. 10.

[0091] In Fig. 11 <1101> is a drawing of an electronic device viewed from another direction, with the side members, support members and rear plates of the electronic device according to an embodiment omitted; <1102> is a drawing of an electronic device viewed from one side, with the front plate and display of the electronic device omitted. In Fig. 12 <1201> is a cross-sectional view taken along the line "B-B'" of the electronic device illustrated in FIG. 10. <1202> is a cross-sectional view taken along the line "C-C'" of the electronic device illustrated in FIG. 10.

[0092] The electronic device (1000) of FIGS. 10, 11, and 12 may include embodiments that are at least partially similar to or different from at least one of the preceding embodiments of FIGS. 1 to 9. The electronic device (1000) of FIGS. 10, 11, and 12 is identical to at least one of the preceding embodiments of FIGS. 1 to 9, or its configurations that can be easily understood through the preceding embodiments are given the same reference numbers in the drawings or are omitted, and detailed descriptions thereof are also omitted.

[0093] Referring to FIGS. 10, 11 and 12, an electronic device (1000) according to one embodiment may include a side member (630), a display (1130), a plurality of flexible substrates (540, 1040) and a conductive member (1050).

[0094] According to one embodiment, the display (1130) may include a touch panel (1240) for performing an input function, a display panel (740) for performing a display function, a touch circuit (1030) for driving and controlling the touch panel (1240), and a display circuit (730) for driving and controlling the display panel (740).

[0095] The display circuit unit (730) may be disposed at the bottom of the display panel (740). The display circuit unit (730) may include a display driver IC (DDI). The display circuit unit (730) may be disposed on a first flexible substrate (540) having an electrical wiring structure. For example, the display circuit unit (730) may have a COP (chip on plastic or chip on panel) structure and may be disposed on the first flexible substrate (540), which is a part of a plastic substrate included in the display panel (740). For example, the display circuit unit (730) may have a COF (chip on film) structure and may be disposed on the first flexible substrate (540), which is a separate film attached to a substrate included in the display panel (740).

[0096] According to one embodiment, the first flexible substrate (540) can be folded based on a bending axis that is parallel to the x-axis. At least a portion of the first flexible substrate (540) can include a first bending portion (541) that bends from one side of the display panel (740) (e.g., a side facing the +z-axis) to the other side of the display panel (740) (e.g., a side facing the -z-axis). The first bending portion (541) can be arranged to face the inner side (702) of the side member (630). The first bending portion (541) can be formed to protrude more than one side of the display panel (740) (e.g., a side facing the -y-axis) toward the side member (630).

[0097] The touch circuit unit (1030) may be disposed at the bottom of the display panel (740). The touch circuit unit (1030) may include a touch driver IC (TDI). The touch circuit unit (1030) may be disposed on a second flexible substrate (1040) having an electrical wiring structure. For example, the touch circuit unit (1030) may have a COP (chip on plastic or chip on panel) structure and may be disposed on the second flexible substrate (1040), which is a part of a plastic substrate included in the touch panel (1240). For example, the touch circuit unit (1030) may have a COF (chip on film) structure and may be disposed on the second flexible substrate (1040), which is a separate film attached to a glass substrate and / or a plastic substrate included in the touch panel (1240). Electromagnetic waves generated from a printed circuit board (1170) (e.g., printed circuit board (340) of FIG. 4) electrically connected to the first flexible substrate (540) and the second flexible substrate (1040) can be shielded by a shielding member (1150). The shielding member (1150) can prevent noise generated from the display circuit unit (730), the touch circuit unit (1030), and / or the printed circuit board (1170) from spreading into the interior of the electronic device (1000). The shielding member (1150) can shield electromagnetic waves generated from the display (1130) (e.g., the display circuit unit (730), the touch circuit unit (1030), and / or the printed circuit board (1170)). The shielding member (1150) can shield electromagnetic interference between the display (1130) and the printed circuit board (1170). The shielding member (1150) may include a conductive material. For example, the shielding member (1150) may include a thin film sheet or plate made of copper (Cu) or graphite, or a shield can. In one embodiment, the shielding member (1150) may be electrically connected to at least a portion of the conductive portion (620) and / or the display (1130).The shielding member (1150) may also perform a grounding function for the conductive portion (620) and / or the display (1130).

[0098] According to one embodiment, a laminated member (1160) may be placed between the support member (710) and the shielding member (1150). The laminated member (1160) may be attached to the support member (710) to shield ambient noise. As an example, the laminated member (1160) may include an insulating tape (or an insulating sheet, an insulating film) and a conductive tape (or a conductive sheet, a conductive film) laminated on one surface of the insulating tape.

[0099] According to one embodiment, the second flexible substrate (1040) can be folded based on a bending axis that is parallel to the bending axis of the first flexible substrate (540). At least a portion of the second flexible substrate (1040) can overlap the first flexible substrate (540). The second flexible substrate (1040) can be folded to surround a portion of the first flexible substrate (540). At least a portion of the second flexible substrate (1040) can include a second bending portion (1041) that bends from one surface of the touch panel (1240) (e.g., a surface facing the +z axis) to the other surface of the display panel (740) (e.g., a surface facing the -z axis). The second bending portion (1041) can be folded to have a smaller curvature than the first bending portion (541). The second banding portion (1041) may be positioned to face the inner surface (702) of the side member (630). The second banding portion (1041) may be formed to protrude more than one side (e.g., the side facing the -y axis) of the display panel (740) toward the side member (630).

[0100] According to one embodiment, the conductive member (1050) may be formed to correspond to an area where the first flexible substrate (540) and the second flexible substrate (1040) overlap. The conductive member (1050) may be formed to extend along the inner surface (702) of the side member (630) facing the second bending portion (1041) of the second flexible substrate (1040). The conductive member (1050) may be formed in the shape of a strip of a metal material along a portion of the third side wall (633) of the side member (630). For example, the conductive member (1050) may be formed by attaching a conductive tape or a copper tape to the inner surface (702) of the side member (630). For example, the conductive member (1050) can be formed by thinly depositing a metal material on the inner surface (702) of the side member (630) through a deposition process (e.g., physical vapor deposition (PVD)).

[0101] According to one embodiment, the conductive member (1050) may have a length (e.g., a length parallel to the x-axis direction) that is the same as or different from a length (e.g., a length parallel to the x-axis direction) at which the first flexible substrate (540) and the second flexible substrate (1040) overlap. For example, the conductive member (1050) may have a length that is the same as a length (e.g., a length parallel to the x-axis direction) of the second flexible substrate (1040), or may have a length that is smaller than or greater than a length (e.g., a length parallel to the x-axis direction) of the second flexible substrate (1040).

[0102] According to one embodiment, the conductive member (1050) may be arranged to overlap at least a portion of at least one of the conductive portion (620) and the non-conductive portion (610) that act as an antenna of the side member (630). For example, the conductive member (1050) may be arranged to overlap at least a portion of the first conductive portion (621), the second conductive portion (622), and the first non-conductive portion (611) in a direction from the inner side (702) to the outer side (703) (e.g., in the -y-axis direction).

[0103] According to one embodiment, the conductive member (1050) may be disposed closer to the conductive portion (620) used as an antenna than the first flexible substrate (540) and the second flexible substrate (1040). Since the conductive member (1050) is disposed on the inner surface (702) of the side member (630), the conductive member (1050) may be disposed to be spaced apart from a portion of the conductive portion (620) of the side member (630) by a designated first distance (D1). The conductive member (1050) may be disposed to be spaced apart from the conductive portion (620) by a first distance (D1) corresponding to a thickness (e.g., a length in the y-axis direction) of a portion of the non-conductive portion (610). The conductive portion (620) of the side member (630) may be arranged to be spaced apart from the bending portion (1041) of the second flexible substrate (1040) by a second distance (D2) that is greater than the first distance (D1). The conductive portion (620) of the side member (630) may be arranged to be spaced apart from the bending portion (541) of the first flexible substrate (540) by a third distance (D3) that is greater than the second distance (D2). At least one of the second distance (D2) and the third distance (D3) may vary depending on various deviation factors (e.g., attachment deviation of the first flexible substrate (540), lamination tolerance for attaching the display panel (740) and the front plate (720), mechanical component tolerance, bonding tolerance).

[0104] The conductive member (1050) is placed in a non-conductive portion (610) that is easy to manage tolerances, so that a designated first distance (D1) can be maintained constant with respect to the conductive portion (620) regardless of the position of at least one of the first flexible substrate (540) and the second flexible substrate (1040).

[0105] In an electronic device according to an embodiment, even if a deviation occurs in the attachment of the second flexible substrate (1040), the conductive member (1050) can be arranged closer to the side member (630) than the second flexible substrate (1040) and maintain a constant distance from the side member (630). Since a distance deviation does not occur between the conductive member (1050) and the side member (630), the capacitance (or parasitic capacitance, parasitic resonance) between the conductive member (1050) and the conductive portion (620) can be maintained constant. The electronic device according to an embodiment can reduce or prevent a change in resonant frequency due to a distance deviation, thereby ensuring stable radiation performance.

[0106] In an embodiment, an electronic device may have a first conductive portion (621) and a third conductive portion (623) and a conductive member (1050) that may be non-overlapping. The capacitance (or parasitic capacitance, parasitic resonance) between the conductive member (850) and a side member (630) used as an antenna may be minimized. The electronic device according to an embodiment may reduce the amount of change in resonant frequency due to the conductive member (1050), thereby ensuring stable radiation performance.

[0107] FIG. 13 is a drawing showing an electronic device according to an embodiment, and FIG. 14 are drawings showing an electronic device according to an embodiment. The electronic device (1300) of FIGS. 13 and 14 may include at least some similar or different embodiments from at least one of the preceding embodiments of FIGS. 1 to 12. The electronic device (1300) of FIGS. 13 and 14 is the same as or omitted from the drawings reference numerals for components that are the same as or can be easily understood through the preceding embodiments of at least one of FIGS. 1 to 12, and a detailed description thereof will also be omitted. In FIG. 14 <1401> is a drawing showing the front side of a laminated member of an electronic device according to an embodiment of the present invention; <1402> is a drawing showing the back side of a laminated member of an electronic device according to one embodiment; <1403> is a cross-sectional view taken along line D-D' of the electronic device of FIG. 13 to which a laminated member according to an embodiment of the present invention is applied.

[0108] Referring to FIGS. 13 and 14, an electronic device (1300) according to one embodiment may include a side member (630), at least one flexible substrate (540, 1040), a conductive member (1350), and a laminated member (1410) (e.g., the laminated member (1160) of FIG. 11).

[0109] In one embodiment, the laminated member (1410) can be attached on the support member (710) to shield ambient noise. For example, the laminated member (1410) can reduce or prevent electromagnetic influences (e.g., electromagnetic interference (EMI)) on electrical components, including a display circuitry (730) including a DDI, a printed circuit board (e.g., a printed circuit board (340) of FIG. 3), and / or a battery (e.g., a battery (350) of FIG. 3).

[0110] According to one embodiment, the laminated member (1410) may include an insulating tape (1420) (or an insulating sheet, an insulating film) and a conductive tape (1430) (or a conductive sheet, a conductive film) formed on one surface of the insulating tape (1420).

[0111] The insulating tape (1420) may include a first insulating region (1421) corresponding to the conductive tape (1430) and a second insulating region (1422) corresponding to the conductive member (1350). At least a portion of the first insulating region (1421) and at least a portion of the second insulating region (1422) may be formed to be connected to each other and formed into an integral part. The second insulating region (1422) may be formed to have a shape and position corresponding to the conductive member (1350). For example, when the conductive member (1350) includes a first conductive member (1351) (e.g., the first conductive member (851) of FIG. 8) and a second conductive member (1352) (e.g., the second conductive member (852) of FIG. 8), a plurality of second insulating regions (1422) may be provided. Each of the plurality of second insulating regions (1422) may be formed to correspond in shape and / or position to each of the first conductive member (1351) and the second conductive member (1352). Each of the plurality of second insulating regions (1422) may be arranged to be spaced apart from each other in the x-axis direction so as to correspond to the first conductive member (1351) and the second conductive member (1352) that are arranged to be spaced apart from each other in the x-axis direction.

[0112] The conductive tape (1430) may be placed between the first support surface (711) of the support member (710) and the first insulating region (1421) of the insulating tape (1420). The conductive tape (1430) may be formed on the first insulating region (1421) of the insulating tape (1420) and attached to the first support surface (711) of the support member (710).

[0113] The conductive member (1350) may be disposed between the inner surface (702) of the side member (630) and the second insulating region (1422) of the insulating tape (1420). The conductive member (1350) may be formed on the second insulating region (1422) of the insulating tape (1420) and attached to the inner surface (702) of the side member (630).

[0114] The conductive member (1350) may be formed of a conductive material that is the same as or different from the conductive tape (1430). For example, the conductive member (1350) may be laminated together with the conductive tape (1430) on the insulating tape (1420) through a lamination process using the same material as the conductive tape (1430).

[0115] The conductive member (1350) may be formed on the insulating tape (1420) to be spaced apart from the conductive tape (1430) by a designated gap (1510). The conductive member (1350) may be positioned to be spaced apart from the conductive tape (1430) by a designated gap (1510) near a corner where the inner surface (702) of the side member (630) and the first support surface (711) of the support member (710) meet. The conductive member (1350) may be electrically separated from the conductive tape (1430). The conductive member (1350) may be in a floating state to be electrically insulated from the conductive tape (1430). The conductive tape (1430) may be electrically connected to ground. For example, the conductive tape (1430) may be electrically connected to a ground terminal included in a printed circuit board (e.g., printed circuit board (340) of FIG. 4).

[0116] FIG. 15 is a diagram illustrating an electronic device according to an embodiment. The electronic device (1300) of FIG. 15 may include at least some similar or different embodiments from at least one of the preceding embodiments of FIGS. 1 to 14. The electronic device (1300) of FIG. 15 is identical to at least one of the preceding embodiments of FIGS. 1 to 14 or may be easily understood through the preceding embodiments, and the same reference numbers in the drawings are assigned or omitted, and detailed descriptions thereof are also omitted. In FIG. 15 <1501> is a drawing showing the front side of a laminated member of an electronic device according to an embodiment of the present invention; <1502> is a drawing showing the back side of a laminated member of an electronic device according to one embodiment; <1503> is a cross-sectional view taken along line D-D' of the electronic device of FIG. 13 to which a laminated member according to an embodiment of the present invention is applied.

[0117] Referring to FIG. 15, an electronic device (1300) according to one embodiment may include a side member (630), a display (740), at least one flexible substrate (540, 1040), a conductive member (1350), and a laminated member (1410).

[0118] According to one embodiment, the conductive member (1350) may be formed on the insulating tape (1420) to be electrically connected to the conductive tape (1430). The conductive member (1350) may be positioned to be in contact with the conductive tape (1430) without a separate gap. For example, the conductive member (1350) may be formed to be integrally formed with the same material as the conductive tape (1430). The conductive member (1350) may be laminated to be integrally formed with the conductive tape (1430) on the insulating tape (1420) through a lamination process using the same material as the conductive tape (1430). The conductive member (1350) may be electrically connected to ground together with the conductive tape (1430). For example, the conductive member (1350) and the conductive tape (1430) may be electrically connected to a ground terminal included in a printed circuit board (e.g., the printed circuit board (340) of FIG. 4).

[0119] FIG. 16 is a drawing showing an electronic device according to an embodiment, and FIG. 17 is a drawing showing a laminated member included in the electronic device according to an embodiment. The electronic device (1600) of FIGS. 16 and 17 may include at least some similar or different embodiments from at least one of the preceding embodiments of FIGS. 1 to 15. The electronic device (1600) of FIGS. 16 and 17 is the same as or omitted from the drawings reference numerals for components that are the same as or can be easily understood through the preceding embodiments of at least one of the preceding embodiments of FIGS. 1 to 15, and a detailed description thereof will also be omitted. In FIG. 17 <1701> is a drawing showing the front side of a laminated member of an electronic device according to an embodiment of the present invention; <1702> is a drawing showing the rear surface of a laminated member of an electronic device according to one embodiment.

[0120] Referring to FIGS. 16 and 17, an electronic device (1600) according to one embodiment may include a side member (630), a conductive member (1650) (e.g., the conductive member (550) of FIG. 5), and a laminated member (1610) (e.g., the laminated member (1410) of FIG. 13).

[0121] According to one embodiment, the laminated member (1610) may include an insulating tape (1620) and a conductive tape (1630) formed on one surface of the insulating tape (1620).

[0122] The insulating tape (1620) may include a first insulating region (1621) corresponding to the conductive tape (1630) and a second insulating region (1622) corresponding to the conductive member (1650). At least a portion of the first insulating region (1621) and at least a portion of the second insulating region (1622) may be formed to be connected to each other and integrated. The second insulating region (1622) may be formed to have a shape and position corresponding to the conductive member (1650). For example, when the conductive member (1650) is formed in a long line shape in the x-axis direction, the second insulating region (1622) may be formed in a long line shape in the x-axis direction to correspond to the conductive member (1650).

[0123] According to one embodiment, the conductive member (1650) may be formed on the insulating tape (1620) and spaced apart from the conductive tape (1630) by a designated gap (1710). The conductive member (1650) may be in a floating state so as to be electrically insulated from the conductive tape (1630). The conductive tape (1630) may be electrically connected to ground. For example, the conductive tape (1630) may be electrically connected to a ground terminal included in a printed circuit board (e.g., a printed circuit board (340) of FIG. 4).

[0124] According to one embodiment, the conductive member (1650) may be formed on the insulating tape (1620) to be electrically connected to the conductive tape (1630). The conductive member (1650) may be positioned to contact the conductive tape (1630) without a separate gap. The conductive member (1650) may be electrically connected to ground together with the conductive tape (1630). For example, the conductive member (1650) and the conductive tape (1630) may be electrically connected to a ground terminal included in a printed circuit board.

[0125] Fig. 18 is a cross-sectional view showing an electronic device according to an embodiment. In Fig. 18 <1801> is a cross-sectional view showing a state before a conductive member of an electronic device according to an embodiment is attached; <1802> is a cross-sectional view showing a state after a conductive member of an electronic device is attached according to an embodiment. The electronic device (1800) of FIG. 18 may include at least some similar or different embodiments from at least one of the preceding embodiments of FIGS. 1 to 17. The electronic device (1800) of FIG. 18 is identical to or can be easily understood through the preceding embodiments of at least one of the preceding embodiments of FIGS. 1 to 17, and reference numbers in the drawings are given the same or omitted, and detailed descriptions thereof are also omitted.

[0126] Referring to FIG. 18, an electronic device (1800) according to one embodiment may include a side member (630), a display, at least one flexible substrate (540, 1040), and a conductive member (1850).

[0127] The side member (630) may include at least one opening (1810) formed in the shape of a hole, a groove, or an engraving. The opening (1810) may guide an attachment position of a conductive member (1850). The opening (1810) may be formed by removing a portion of a non-conductive portion (610) of the side member (630). The opening (1810) may include a first opening (1811) formed by removing a portion of an inner surface (702) of the side member (630), and a second opening (1812) formed by removing a portion of an upper surface (701) of the side member (630). The first opening (1811) and the second opening (1812) may be formed to be connected to each other. For example, the opening (1810) may be formed in an inverted “L” shape.

[0128] The conductive member (1850) can be attached to the side member (630) aligned with the opening (1810). Since the opening (1810) guides the attachment location of the conductive member (1850), the conductive member (1850) can be precisely attached on at least a portion of the upper surface (701) and the inner surface (702) of the side member (630). The conductive member (1850) can include a first conductive member (1851) and a second conductive member (1852) that are connected or separated from each other. The first conductive member (1851) can be attached on at least a portion of the inner surface (702) of the side member (630) through the first opening (1811). The first conductive member (1851) can be filled within the first opening (1811). The second conductive member (1852) can be attached to a portion of the upper surface (701) of the side member (630) through the second opening (1812). The second conductive member (1852) can be filled within the second opening (1812). The length of the second conductive member (1852) (e.g., the length in the z-axis direction) can be formed shorter than the length of the first conductive member (1851) (e.g., the length in the x-axis direction), thereby minimizing an increase in the total area of ​​the conductive member (1850). The resonant frequency variation due to the conductive member (1850) can be minimized or reduced.

[0129] FIG. 19 is a cross-sectional view showing an electronic device according to a comparative example, and FIG. 20 is a diagram showing the radiation efficiency of an electronic device according to a comparative example and the radiation efficiency of an electronic device according to an embodiment.

[0130] Referring to Fig. 19, <1901> is a cross-sectional view showing a first comparative example including a conductive member having a first area larger than the area of ​​a conductive member of an electronic device according to an embodiment of the present invention; <1902> is a cross-sectional view showing a second comparative example including a conductive member having a second area that is larger than the area of ​​the conductive member of the electronic device according to one embodiment and smaller than the first area.

[0131] The conductive member (1950) of the first comparative example and the conductive member (1960) of the second comparative example can be formed to have a larger surface area than the conductive member according to any one of the preceding embodiments of FIGS. 5 to 18 (e.g., the conductive member (550) of FIGS. 5, 6, and 7, the conductive member (850) of FIGS. 8 and 9, the conductive member (1050) of FIGS. 10, 11, and 12, the conductive member (1350) of FIGS. 13, 14, and 15, the conductive member (1650) of FIGS. 16 and 17, and the conductive member (1850) of FIG. 18). For example, the first length (e.g., length in the x-direction) of the conductive member (1950) of the first comparative example and the conductive member (1960) of the second comparative example may be equal to the first length of the conductive member according to any one of the preceding embodiments of FIGS. 5 to 18, and the second length (e.g., length in the y-axis direction) of the conductive member (1950) of the first comparative example and the conductive member (1960) of the second comparative example may be formed to be longer than the second length of the conductive member according to any one of the preceding embodiments of FIGS. 5 to 18.

[0132] The conductive member (1950) of the first comparative example may include a first conductive region (1951) formed on the inner surface (702) of the side member (630), a second conductive region (1952) formed on the upper surface (701) of the side member (630), and a third conductive region (1953) formed on the first support surface (711) of the support member (710). The conductive member (1960) of the second comparative example may include a first conductive region (1961) formed on the inner surface (702) of the side member (630) and a second conductive region (1962) formed on the upper surface (701) of the side member (630).

[0133] Referring to FIG. 20, graph (2001) represents the radiation efficiency in the case where no conductive member is provided, graph (2002) represents the radiation efficiency of the first comparative example of FIG. 19, graph (2003) represents the radiation efficiency of the second comparative example of FIG. 19, and graph (2004) represents the radiation efficiency of any one of the preceding examples of FIGS. 5 to 18.

[0134] The resonance frequency of the first comparative example of Fig. 19 (see graph (2002)) may be low shifted compared to the resonance frequency of the case without the conductive member (see graph (2001)). For example, the resonance frequency band of the first comparative example of Fig. 19 may be shifted by approximately 100 MHz from the frequency band of the case without the conductive member.

[0135] The resonance frequency of the second comparative example of Fig. 19 (see graph (2003)) may be low shifted compared to the resonance frequency of the case without the conductive member (see graph (2001)). For example, the resonance frequency band of the second comparative example of Fig. 19 may be shifted by approximately 62 MHz from the frequency band of the case without the conductive member.

[0136] The resonant frequency (see graph (2004)) of any of the preceding embodiments of FIGS. 5 to 18 may be low shifted compared to the resonant frequency (see graph (2001)) when no conductive member is provided. For example, the resonant frequency band of any of the preceding embodiments of FIGS. 5 to 18 may be shifted by approximately 23 MHz from the frequency band when no conductive member is provided.

[0137] It can be confirmed that the electronic device according to any one of the preceding embodiments of FIGS. 5 to 18 has the smallest amount of change in resonant frequency compared to the electronic device according to the first comparative example of FIG. 19 and the electronic device according to the second comparative example of FIG. 20.

[0138] FIG. 21a is a graph showing the radiation efficiency of an electronic device according to a comparative example without a conductive member, FIG. 21b is a graph showing the radiation efficiency of an electronic device according to an embodiment, and FIG. 21c is a graph showing the radiation efficiency of an electronic device according to an embodiment to which tuning is applied.

[0139] Referring to Fig. 21a, in the comparative example, a conductive member may not be formed on the inner wall of the side member. As the separation distance between the conductive portion of the side member used as the antenna of the comparative example and the bending portion of the flexible substrate changes, the resonant frequency of the comparative example may change (e.g., low shift) and the radiation performance may deteriorate. For example, when the separation distance between the conductive region of the side member of the comparative example and the bending portion of the flexible substrate is a first distance (2101), the radiation performance of the antenna in the first band (B1) (e.g., 830 MHz to 862 MHz) may be -6.7 dB. When the separation distance between the conductive region of the side member and the bending portion of the flexible substrate is a second distance shorter than the first distance (2102), the radiation performance of the antenna in the first band (B1) may be -7.5 dB. When the separation distance between the conductive region of the side member and the bending portion of the flexible substrate is a third distance shorter than the second distance (2103), the radiation performance of the antenna in the first band (B1) may be It may be -8.5 dB. When the separation distance between the conductive area of ​​the side member and the bending portion of the flexible substrate is a fourth distance shorter than the third distance (2104), the radiation performance of the antenna in the first band (B1) is -9.4 dB, and the radiation performance deviation may be large at 2.3 dB compared to when the separation distance is the first distance.

[0140] Referring to FIG. 21b, one embodiment may include a conductive member formed on an inner surface of a side member. By including the conductive member, the electronic device of one embodiment may change (e.g., low shift) the resonant frequency band of the conductive region used as the antenna radiator. For example, the second band (B2) (e.g., 770 MHz to 800 MHz) of the resonant frequency of the conductive region used as the antenna radiator may be lowered by about 600 MHz compared to the first band (e.g., 830 MHz to 862 MHz) of the resonant frequency of the comparative example of FIG. 21a.

[0141] In one embodiment, the electronic device may be arranged such that the bending portion of the flexible substrate and the conductive portion and / or the non-conductive portion of the side portion are spaced apart from each other with a conductive member therebetween. Even if the distance between the conductive portion of the side portion used as the antenna of one embodiment and the bending portion of the flexible substrate is different, the deviation in radiation efficiency may be reduced compared to the comparative example of FIG. 21A. For example, when the distance between the conductive portion of the side portion of the embodiment and the bending portion of the flexible substrate is a first distance (2201), the radiation performance of the antenna may be -7.7 dB in a second band (e.g., 770 MHz to 800 MHz). When the distance between the conductive portion of the side portion and the bending portion of the flexible substrate is a second distance shorter than the first distance (2202), the radiation performance of the antenna may be -7.8 dB in the second band (B2). When the separation distance between the conductive portion of the side member and the bending portion of the flexible substrate is a third distance shorter than the second distance (2203), the radiation performance of the antenna in the second band (B2) may be -8.3 dB. When the separation distance between the conductive portion of the side member and the bending portion of the flexible substrate is a fourth distance shorter than the third distance (2204), the radiation performance of the antenna in the second band (B2) may be -9.2 dB. In the embodiment, the radiation performance deviation of the antenna in the second band (B2) is 1.2 dB, which can significantly reduce the radiation performance deviation compared to the comparative example of FIG. 21a.

[0142] Referring to FIG. 21C, an electronic device according to an embodiment may be arranged such that a bending portion of a flexible substrate and a conductive portion of the side member are spaced apart from each other with a conductive member formed on an inner surface of the side member therebetween. An electronic device according to an embodiment including a conductive member formed on an inner surface of the side member may adjust (or tune) a resonant frequency of a conductive portion of the side member used as an antenna. A processor of the electronic device according to an embodiment may shift the resonant frequency of the conductive portion of the side member used as an antenna to a specified frequency or shift it by a specified amount. For example, the processor of the electronic device may adjust the resonant frequency of the conductive portion of the side member from a second band (B2) to a first band (B1). For example, when the separation distance between the conductive portion of the side member according to the embodiment and the bending portion of the flexible substrate is the first distance (2211), the radiation performance of the antenna in the first band (B1) changed through frequency adjustment may be -7.5 dB. When the separation distance between the conductive portion of the side member and the bending portion of the flexible substrate is a second distance shorter than the first distance (2212), the radiation performance of the antenna in the first band (B1) changed through frequency adjustment may be -7.3 dB. When the separation distance between the conductive portion of the side member and the bending portion of the flexible substrate is a third distance shorter than the second distance (2213), the radiation performance of the antenna in the first band (B1) changed through frequency adjustment may be -7.2 dB. When the separation distance between the conductive portion of the side member and the bending portion of the flexible substrate is a fourth distance shorter than the third distance (2214), the radiation performance of the antenna in the first band (B1) changed through frequency adjustment may be -7.1 dB. In the embodiment, the radiation performance deviation of the antenna in the first band (B1) is 0.4 dB, which can significantly reduce the antenna radiation performance deviation compared to the comparative example of FIG. 21a.

[0143] Meanwhile, the electronic device described above is not limited to the embodiments described in each drawing, and the electronic device described in each drawing may be applied in a complex manner. For example, the embodiment of FIG. 18 may be applied in a complex manner to at least one of the various embodiments of FIGS. 5 to 17. In addition, the position, number, and shape of the conductive member described in each drawing (e.g., the conductive member (550) of FIGS. 5, 6, and 7, the conductive member (850) of FIGS. 8 and 9, the conductive member (1050) of FIGS. 10, 11, and 12, the conductive member (1350) of FIGS. 13, 14, and 15, the conductive member (1650) of FIGS. 16 and 17, and the conductive member (1850) of FIG. 18) are not limited to the above-described examples and may be variously changed. In addition, the number and shape of at least one of the conductive portions and non-conductive portions described in each drawing are not limited to the examples described above and may be varied in various ways.

[0144] As described above, an electronic device according to at least one embodiment among various embodiments includes a side member (630) having a plurality of side walls (632, 633, 634) including an outer side (703) facing the outside of the electronic device and an inner side (702) facing the outer side; a display (530, 1130) arranged in an internal space (750) provided by the side member; at least one flexible substrate (540, 1040) electrically connected to the display and including at least one bending portion (541) bent toward the side member; And it may include at least one conductive member (550, 850, 1050, 1350, 1650, 1850) disposed between the inner surface (702) of the side member and the banding portion (541, 1041), one side facing the inner surface and the other side facing the banding portion (541, 1041).

[0145] An electronic device according to at least one embodiment among various embodiments comprises: a side member (630) comprising a plurality of side walls (632, 633, 634) including an outer side (703) facing the outside of the electronic device and an inner side (702) facing the outer side; a display (530, 1130) arranged in an inner space (750) provided by the side member; at least one flexible substrate (540, 1040) electrically connected to the display and including at least one bending portion (541) bent toward the inner side; And at least one conductive member (550, 850, 1050, 1350, 1650, 1850) is attached to the inner surface between the inner surface (702) of the side member and the banding portion (541, 1041) and is arranged to face the banding portion (541, 1041), and a conductive antenna formed as a conductive part (620) on the outer surface can be arranged closer to the conductive member (550, 850, 1050, 1350, 1650, 1850) than to the banding portion (541, 1041).

[0146] According to at least one embodiment of the present invention, an electronic device includes: a side member forming a side surface surrounding an internal space of the electronic device and including a plurality of side walls including a conductive portion and a non-conductive portion; a flexible member including a bending portion disposed in the internal space and having at least a portion of a bending portion, and a plurality of signal lines passing through the bending portion; and at least one conductive member disposed on the inner surface, at least a portion of which is formed of the non-conductive portion, between the side member and the bending portion, wherein when the side surface of the electronic device is viewed, the side member, the support member, the conductive member, the internal space, and the bending portion may be sequentially arranged.

[0147] In one embodiment, at least one of the plurality of side walls may include a conductive portion (620) forming a portion of the outer surface; and a non-conductive portion (611, 612) forming another portion of the outer surface.

[0148] According to one embodiment, the at least one conductive member (550, 850, 1050, 1350, 1650, 1850) may be formed to contact the inner surface (702) of at least one side wall facing the banding portion (541, 1041) among the plurality of side walls.

[0149] According to one embodiment, the at least one conductive member (550, 850, 1050, 1350, 1650, 1850) may be formed in a strip shape along the inner surface of at least one side wall facing the banding portion (541) among the plurality of side walls.

[0150] According to one embodiment, the non-conductive portions (611, 612) are provided in multiple numbers and are spaced apart from each other.

[0151] According to one embodiment, the at least one conductive member (550, 1650) may be formed continuously and without interruption in parallel with the conductive portion (621) formed between the plurality of non-conductive portions (611, 612).

[0152] According to one embodiment, the at least one conductive member (850, 1350) may be provided in multiple numbers to correspond to each of the plurality of non-conductive portions (611, 612) and may be spaced apart from each other.

[0153] According to one embodiment, the spacing between the plurality of conductive members (850, 1350) may be arranged closer than the spacing between the plurality of non-conductive parts (611, 612).

[0154] According to one embodiment, the at least one conductive member (550, 850, 1050, 1350, 1650, 1850) may be positioned closer to the conductive portion (620) of the side member than to the banding portion (541, 1041).

[0155] According to one embodiment, the at least one flexible substrate may include a first flexible substrate (540) including a first bending portion (541); and a second flexible substrate (1040) including a second bending portion (1041) that surrounds at least a portion of the first bending portion (541).

[0156] According to one embodiment, the conductive member (1050) may be positioned so as to contact the inner surface (702) of the side member (603) between the second banding portion (1041) and the side member (630).

[0157] According to one embodiment, the second banding portion (1041) may overlap a portion of the first banding portion (541) in an area corresponding to the non-conductive portion.

[0158] According to one embodiment, the display (1130) may include a display panel (740) electrically connected to the first flexible substrate; and / or a touch panel (1240) disposed on the display panel and electrically connected to the second flexible substrate.

[0159] According to one embodiment, the second banding portion (1041) may have a smaller curvature than the first banding portion (541).

[0160] According to one embodiment, the second banding portion (1041) may be positioned closer to the conductive member (1050) than the first banding portion (541).

[0161] According to one embodiment, the device may further include a support member (710) extending from the side member to the interior space and including a first support surface facing the display; and / or a laminated member (1410) disposed between the support member and the display.

[0162] According to one embodiment, the laminated member (1410) may include an insulating tape (1420) disposed on the inner surface and the first support surface; and a conductive tape (1430) disposed between the insulating tape and the first support surface.

[0163] According to one embodiment, the conductive member (1350) may be placed between the insulating tape and the inner surface.

[0164] According to one embodiment, the conductive tape (1430) and the conductive member (1350) may be formed as an integral body.

[0165] According to one embodiment, the conductive tape (1430) and the conductive member (1350) can be electrically connected to a ground plane.

[0166] According to one embodiment, the conductive tape (1430) and the conductive member (1350) can be electrically isolated.

[0167] According to one embodiment, the conductive member (1350) is electrically floating, and the conductive tape (1430) can be electrically connected to a ground plane.

[0168] According to one embodiment, at least one of the plurality of side walls may further include an opening (1810) formed in at least a portion of each of the upper side and the inner side, which are disposed between the inner side and the outer side.

[0169] According to one embodiment, the opening may further include a first opening (1811) formed on the upper surface; and a second opening (1812) formed on the inner surface, communicating with the first opening, and having a larger area than the first opening.

[0170] According to one embodiment, the conductive member (1850) can be filled within the first opening and the second opening.

[0171] According to one embodiment, the conductive portion (620) may include a first conductive portion (621), a second conductive portion (622), and a third conductive portion (623) that are spaced apart from each other.

[0172] The non-conductive portion (610) may include a first non-conductive portion (611) disposed between the first conductive portion and the second conductive portion; and a second non-conductive portion (612) disposed between the first conductive portion and the third conductive portion.

[0173] According to one embodiment, the conductive member (1850) may be formed in a strip shape along the second conductive portion, the first non-conductive portion, the first conductive portion, the second non-conductive portion, and the third conductive portion, which are arranged in a row.

[0174] According to one embodiment, the conductive member (550) may overlap each of the first non-conductive portion, the second non-conductive portion, and the first conductive portion in a first direction from the inner surface toward the outer surface.

[0175] According to one embodiment, the conductive member (850) may include a first conductive member (851) corresponding to the first non-conductive portion (611); and a second conductive member (852) corresponding to the second non-conductive portion (612) and spaced apart from the first conductive member.

[0176] According to one embodiment, the first non-conductive portion (611) and the second non-conductive portion (612) may overlap the conductive member (850) in a second direction from the outer surface toward the inner surface.

[0177] According to one embodiment, a portion of the first conductive portion (621) may overlap the conductive member (850) in the second direction.

[0178] According to one embodiment, another part of the first conductive portion (621) may be non-overlapping with the conductive member (850) in the second direction.

[0179] The embodiments of this document and the terminology used herein are not intended to limit the technology described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, and / or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar components. The singular expression may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B," "at least one of A and / or B," "A, B, or C," or "at least one of A, B, and / or C" may include all possible combinations of the items listed together. Expressions such as "first," "second," "first," or "second," may modify the corresponding components regardless of order or importance, and are only used to distinguish one component from another, but do not limit the corresponding components. When it is said that a component (e.g., a first component) is “(functionally or communicatively) connected” or “connected” to another component (e.g., a second component), the component may be directly connected to the other component, or may be connected via another component (e.g., a third component).

[0180] In this document, "adapted to or configured to" may be used interchangeably with, for example, "suitable for," "capable of," "modified to," "made to," "capable of," or "designed to," for example, hardware-wise or software-wise. In some contexts, the phrase "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a processor configured (or adapted) to perform A, B, and C" may mean a dedicated processor (e.g., an embedded processor) for performing those operations, or a general-purpose processor (e.g., a CPU or AP) that can perform those operations by executing one or more programs stored in a memory device (e.g., a memory).

[0181] The term "module" as used in this document includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A "module" may be an integral component or a minimum unit or part thereof that performs one or more functions. A "module" may be implemented mechanically or electronically, and may include, for example, an application-specific integrated circuit (ASIC) chip, field-programmable gate array (FPGA), or programmable logic device, known or to be developed in the future, that performs certain operations.

[0182] At least a part of a device (e.g., modules or functions thereof) or a method (e.g., operations) according to various embodiments may be implemented as instructions stored in a computer-readable storage medium (e.g., memory) in the form of a program module. When the instructions are executed by a processor (e.g., a processor), the processor may perform a function corresponding to the instructions. The computer-readable recording medium may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical recording medium (e.g., a CD-ROM, a DVD, a magneto-optical medium (e.g., a floptical disk), an internal memory, etc. The instructions may include a code generated by a compiler or a code executable by an interpreter.

[0183] Each component (e.g., a module or a program module) according to various embodiments may be composed of one or more entities, and some of the aforementioned sub-components may be omitted, or other sub-components may be further included. Alternatively or additionally, some components (e.g., a module or a program module) may be integrated into a single entity, which may perform the same or similar functions as those performed by each of the respective components prior to integration. Operations performed by modules, program modules, or other components according to various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

Claims

1. In electronic devices, A side member (630) comprising a plurality of side walls (632, 633, 634) including an outer side (703) facing the outside of the electronic device and an inner side (702) facing the outer side; A display (530, 1130) placed in the internal space (750) provided by the above side member; At least one flexible substrate (540, 1040) electrically connected to the display and including at least one bending portion (541) that bends toward the side member; and An electronic device comprising at least one conductive member (550, 850, 1050, 1350, 1650, 1850) disposed between the inner surface (702) of the side member and the banding portion (541, 1041), one side facing the inner surface and the other side facing the banding portion (541, 1041).

2. In paragraph 1, At least one of the above plurality of side walls a conductive portion (620) forming a part of the outer surface; and Includes a non-conductive portion (611, 612) forming another part of the outer surface, At least one of the above conductive elements (550, 850, 1050, 1350, 1650, 1850) is An electronic device formed to contact the inner surface (702) of at least one side wall facing the banding portion (541, 1041) among the plurality of side walls.

3. In paragraph 2, At least one of the above conductive elements (550, 850, 1050, 1350, 1650, 1850) is An electronic device formed in a strip shape along the inner surface of at least one side wall facing the banding portion (541) among the plurality of side walls.

4. In paragraph 2 or paragraph 3, The above non-conductive portions (611, 612) are provided in multiple numbers and are spaced apart from each other. An electronic device in which at least one conductive member (550, 1650) is formed continuously and without interruption in parallel with the conductive portion (621) formed between the plurality of non-conductive portions (611, 612).

5. In paragraph 2 or paragraph 3, The above non-conductive portions (611, 612) are provided in multiple numbers and are spaced apart from each other. At least one conductive member (850, 1350) is An electronic device provided in multiple numbers to correspond to each of the above-mentioned multiple non-conductive portions (611, 612) and spaced apart from each other.

6. In paragraph 5, An electronic device in which the separation distance between the plurality of conductive members (850, 1350) is closer than the separation distance between the plurality of non-conductive parts (611, 612).

7. In paragraph 1, At least one of the above conductive elements (550, 850, 1050, 1350, 1650, 1850) An electronic device arranged closer to the conductive portion (620) of the side member than the above banding portion (541, 1041).

8. In paragraph 2 or paragraph 3, At least one flexible substrate is, A first flexible substrate (540) including a first banding portion (541); and A second flexible substrate (1040) comprising a second banding portion (1041) that surrounds at least a portion of the first banding portion (541), The above conductive member (1050) An electronic device arranged so as to be in contact with the inner surface (702) of the side member (603) between the second banding portion (1041) and the side member (630).

9. In paragraph 8, The above second banding portion (1041) An electronic device overlapping a portion of the first banding portion (541) in an area corresponding to the non-conductive portion.

10. In paragraph 8, The above display (1130) A display panel (740) electrically connected to the first flexible substrate; A touch panel (1240) disposed on the display panel and electrically connected to the second flexible substrate, The second banding portion (1041) has a smaller curvature than the first banding portion (541), An electronic device in which the second banding portion (1041) is positioned closer to the conductive member (1050) than the first banding portion (541).

11. In paragraph 1, paragraph 2 or paragraph 3, A support member (710) extending from the side member to the internal space and including a first support surface facing the display; and It further includes a laminated member (1410) disposed between the support member and the display, The above laminated member (1410) is Insulating tape (1420) placed on the inner surface and the first support surface; and It includes a conductive tape (1430) placed between the above insulating tape and the first support surface, An electronic device in which the conductive member (1350) is placed between the insulating tape and the inner surface.

12. In paragraph 11, The above-mentioned conductive tape (1430) and the above-mentioned conductive member (1350) are formed as an integral body, An electronic device in which the above-mentioned conductive tape (1430) and the above-mentioned conductive member (1350) are electrically connected to a ground plane.

13. In paragraph 11, The above-mentioned conductive tape (1430) and the above-mentioned conductive member (1350) are electrically separated, An electronic device in which the conductive member (1350) is electrically floating and the conductive tape (1430) is electrically connected to a ground plane.

14. In paragraph 1, paragraph 2 or paragraph 3, At least one of the above plurality of side walls, An electronic device further comprising an opening (1810) formed in at least a portion of each of the upper side and the inner side, which are disposed between the inner side and the outer side.

15. In paragraph 14, The above opening is A first opening (1811) formed on the upper surface; and It further includes a second opening (1812) formed on the inner surface, communicating with the first opening, and having a larger area than the first opening. An electronic device in which the conductive member (1850) is filled within the first opening and the second opening.

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