Cassette device and wafer inserting machine

Abstract

Disclosed in the present disclosure are a cassette device and a wafer inserting machine. The cassette device has a first direction, a second direction and a third direction intersecting each other, and comprises two side plates, a back plate, a bottom plate and a support rod; the two side plates are spaced apart from each other in the first direction; the back plate is arranged between the two side plates and is separately connected to the two side plates; the bottom plate is arranged on the same side of the two side plates and the back plate in the second direction, and the bottom plate is separately connected to the two side plates; the bottom plate, the back plate, and the two side plates jointly define an accommodating space; the side of the bottom plate away from the accommodating space is provided with slide grooves, and the slide grooves are configured to work in conjunction with a slide rail so as to enable the cassette device to move in the third direction; and the support rod is separately connected to the two side plates, and the support rod is located on the side of the back plate away from the accommodating space, so that the end of the back plate away from the bottom plate is inclined relative to the second direction. The cassette device of the present application drives silicon wafers to move forward as a whole, thereby preventing the silicon wafers from tilting, and reducing the possibility of fragmentation of the silicon wafers while ensuring wafer loading.

Description

Magazine mechanism and inserter

[0001] This application claims priority to Chinese Patent Application No. 202421658214.3, filed on July 12, 2024, entitled “Magazine Clip Device and Insertion Machine”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to, but is not limited to, the field of silicon wafer manufacturing technology, specifically to a clip device and a wafer insertion machine. Background Technology

[0003] In the manufacturing process of photovoltaic silicon wafers, wafer cleaning is a crucial and vital step. After debonding, the wafers are transferred to the wafer insertion machine via a clip device. The insertion machine then separates the wafers one by one and places them into baskets for cleaning. During the wafer insertion process, the clip device can easily cause changes in the wafer's tilt angle or even direction, leading to problems with proper insertion or even wafer breakage. Technical issues

[0004] This application provides a magazine device aimed at solving the problem of abnormal wafer insertion or even wafer breakage during wafer insertion. Technical solutions

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] The first aspect of this application provides a magazine device having intersecting first and second directions, including:

[0007] Two side plates are spaced apart along the first direction;

[0008] A back plate is disposed between the two side plates and is rotatably connected to each of the two side plates;

[0009] A base plate is disposed on the same side of the two side plates and the back plate along the second direction, and the base plate is connected to the two side plates respectively; the base plate, the back plate and the two side plates form an accommodating space; a sliding groove is provided on the side of the base plate away from the accommodating space, and the sliding groove is used to cooperate with a slide rail to allow the magazine device to move along the third direction;

[0010] A support rod is connected to each of the two side plates. The support rod is located on the side of the back plate away from the accommodating space, so that the end of the back plate away from the bottom plate is inclined relative to the second direction.

[0011] Optionally, the side plate is provided with a first through hole, and the back plate is provided with a fixing buckle on the side facing the side plate. The fixing buckle is connected to the side plate and is rotatably inserted through the first through hole.

[0012] Optionally, the side plate is provided with a limiting adjustment groove on the side opposite to the back plate. The limiting adjustment groove has a bottom wall, and the first through hole penetrates the bottom wall and communicates with the limiting adjustment groove. The fixing buckle includes a connecting part and a limiting part. The connecting part is connected to the limiting part, and the end of the connecting part away from the limiting part is connected to the back plate. The connecting part is rotatably inserted through the first through hole, and the limiting part is rotatably disposed in the limiting adjustment groove.

[0013] Optionally, the limiting adjustment groove is an elongated oval groove extending along the third direction, the dimension of the limiting adjustment groove along the second direction is greater than the width dimension of the limiting portion, and the dimension of the limiting adjustment groove along the second direction is less than the length dimension of the limiting portion.

[0014] Optionally, along the second direction, the support rod has a first orthographic projection on the base plate, and the fixing buckle has a second orthographic projection on the base plate, with the first orthographic projection located on the side of the second orthographic projection away from the accommodating space.

[0015] Optionally, along the second direction, the support rod is located on the side of the first through hole away from the base plate, and the end of the back plate away from the base plate is inclined relative to the second direction toward the side away from the receiving space.

[0016] Optionally, the angle at which the end of the back plate away from the bottom plate is inclined relative to the second direction toward the direction away from the accommodating space is α°, and the range of α satisfies: 0 < α ≤ 15.

[0017] Optionally, the side panel has a first window that extends through the side panel along the first direction and communicates with the accommodating space; along the first direction, the orthographic projection of the back panel onto the side panel is at least partially located within the first window.

[0018] Optionally, the magazine device further includes a plurality of lifting parts, which are connected to the side of the side plate away from the accommodating space, and the lifting parts are located on the side of the first opening away from the bottom plate, with each side plate connected to at least two of the lifting parts.

[0019] Optionally, the lifting part has a positioning notch, the opening of which faces the base plate.

[0020] Optionally, the side plate is provided with a second through hole, and the support rod is detachably inserted through the second through holes of the two side plates.

[0021] Optionally, the base plate is provided with a second window, which extends through the base plate along the second direction and communicates with the accommodating space.

[0022] Optionally, the bottom plate is provided with two sliding grooves on the side opposite to the accommodating space, and the two sliding grooves are spaced apart on both sides of the second window along the first direction.

[0023] Optionally, a support portion is provided between the side plate and the bottom plate. The support portion is connected to the bottom plate and the side plate respectively. An inclined surface is provided on the side of the support portion away from the bottom plate. The inclined surface is inclined towards the bottom plate along the direction of the side plate away from the accommodating space. The support portions connecting the two side plates are spaced apart on both sides of the second window along the first direction.

[0024] A second aspect of this application provides a chip inserter, including the magazine device as described above. Beneficial effects

[0025] This application provides a magazine device with intersecting first and second directions, including two side plates, a back plate, a bottom plate, and a support rod. The two side plates are spaced apart along the first direction. The back plate is disposed between the two side plates and connected to each of the two side plates. The bottom plate is disposed along the second direction on the same side of the two side plates and the back plate, and is connected to each of the two side plates. The bottom plate, the back plate, and the two side plates form an accommodating space. A groove is provided on the side of the bottom plate away from the accommodating space, allowing the magazine device to slide on an external slide rail along the direction of the back plate toward the accommodating space using the groove. The support rod is connected to each of the two side plates and is located on the side of the back plate away from the accommodating space, so that the end of the back plate away from the bottom plate is inclined relative to the second direction. By rotatably connecting the back plate to the two side plates, this application enables the back plate to tilt away from the accommodating space. The support rod then supports the back plate, maintaining its tilt angle, thus using the tilted back plate to support stacked silicon wafers. The base plate of this application is provided with a sliding groove, which slides on the external slide rail. At this time, the entire clip device is moved to transport the silicon wafer forward. This can keep the relative position of the silicon wafer fixed in the accommodating space, effectively prevent the silicon wafer from moving or tilting, and thus effectively ensure the wafer insertion effect and reduce the possibility of silicon wafer breakage. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 is a schematic diagram of the overall structure of a magazine device according to an embodiment of this application;

[0028] Figure 2 is a schematic diagram of the overall structure of a magazine device according to an embodiment of this application from another angle;

[0029] Figure 3 is a front view of a magazine device according to an embodiment of this application;

[0030] Figure 4 is an enlarged view of part A in Figure 3;

[0031] Figure 5 is a top view of a magazine device according to an embodiment of this application;

[0032] Figure 6 is a right view of a magazine device according to an embodiment of this application;

[0033] Figure 7 is a schematic diagram of the overall structure of a magazine device according to an embodiment of this application from another angle;

[0034] Figure 8 is a bottom view of a magazine device according to an embodiment of this application.

[0035] Reference numerals: 1. Side plate; 11. First through hole; 12. Limiting adjustment groove; 121. Bottom wall; 13. First opening; 14. Second through hole; 2. Back plate; 3. Bottom plate; 32. Second opening; 33. Slide groove; 4. Support rod; 5. Fixing buckle; 51. Connecting part; 52. Limiting part; 6. Lifting part; 61. Positioning notch; 7. Support part; 71. Inclined surface; 8. Accommodation space; 9. Loading opening; X, First direction; Y, Second direction; Z, Third direction.

[0036] Implementation methods of this application

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0038] The following disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure of this application, the components and arrangements of specific examples are described below. Of course, these are merely examples and are not intended to limit this application. Furthermore, various embodiments of this application can be combined with each other, but will not be described in detail here.

[0039] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, and "at least one" can mean one, two, or more, unless otherwise explicitly specified. It should also be noted that in the accompanying drawings of this application, arrows labeled X indicate the first direction X, arrows labeled Y indicate the second direction Y, and arrows labeled Z indicate the third direction Z. In the embodiments of this application, the first direction X is the direction in which the two side plates 1 are arranged at intervals, the second direction Y is the direction from the bottom plate 3 towards the side plate 1, and the third direction Z is the direction from the back plate 2 towards the accommodating space 8. The introduction of the first direction X, the second direction Y, and the third direction Z is to facilitate the description of the structural positional relationship of the components of the magazine device, thereby facilitating understanding of its structure.

[0040] In related technologies, the backplate inside the magazine is made movable. External force is used to move the backplate, pushing the silicon wafer forward to the wafer insertion position, thus enabling wafer insertion. However, due to the high degree of freedom of the backplate, extreme situations can easily occur, such as changes in the backplate's tilt angle or even the backplate tipping over, when it is pushed forward. This can easily lead to wafer insertion failure and silicon wafer breakage.

[0041] In view of this, embodiments of this application provide a magazine device aimed at solving the above-mentioned problems.

[0042] Referring to Figures 1 and 2, an embodiment of this application describes a magazine device having intersecting first direction X, second direction Y, and third direction Z. It includes two side plates 1, a back plate 2, a bottom plate 3, and a support rod 4. The two side plates 1 are spaced apart along the first direction X. The back plate 2 is disposed between the two side plates 1 and connected to each side plate 1. The bottom plate 3 is disposed along the second direction Y on the same side of the two side plates 1 and the back plate 2, and is connected to each side plate 1. The bottom plate 3, the back plate 2, and the two side plates 1 form an accommodating space 8. A groove 33 is provided on the side of the bottom plate 3 facing away from the accommodating space 8. The groove 33 is used to cooperate with a slide rail to allow the magazine device to move along the third direction Z. The support rod 4 is connected to each of the two side plates 1. The support rod 4 is located on the side of the back plate 2 facing away from the accommodating space 8, so that the end of the back plate 2 away from the bottom plate 3 is inclined relative to the second direction Y.

[0043] In this embodiment, by rotatably connecting the back plate 2 to the two side plates 1, the back plate 2 can be tilted away from the accommodating space 8. The support rod 4 further supports the back plate 2, maintaining its tilt angle. This tilted back plate 2 supports the stacked silicon wafers. The base plate 3 has a sliding groove 33, which slides on an external slide rail. This propels the entire clip device forward, maintaining the relative position of the silicon wafers within the accommodating space 8, effectively preventing wafer movement and tilting, thus ensuring proper wafer insertion and reducing the possibility of wafer breakage.

[0044] Specifically, in this embodiment, two side plates 1 are spaced apart along a first direction X, and the two side plates 1 are connected to a bottom plate 3 along a second direction Y. A back plate 2 is also connected between the two side plates 1. Thus, the back plate 2, the two side plates 1, and the bottom plate 3 form an accommodating space 8 to accommodate the silicon wafer. The two side plates 1 are used to limit the silicon wafer from both sides. The silicon wafer is placed between the two side plates along the first direction X, and the distance between the two side plates 1 along the first direction X is slightly larger than the size of the silicon wafer. This not only limits the silicon wafer, preventing it from tilting, but also avoids squeezing the silicon wafer and causing it to break. The back plate 2 is used to support the silicon wafer from one side. The bottom plate 3 is used to support the side plates 1 and keep the positions of the two side plates 1 fixed. Meanwhile, the slide groove 33 provided on the side of the base plate 3 away from the accommodating space 8 can match the external slide rail (which can be the slide rail of the loading trough). The external pushing device pushes the magazine device from the rear of the magazine device along the third direction Z to move the magazine device on the slide rail, so as to realize that the magazine device drives the silicon wafer to move.

[0045] It should be noted that the clip device has a loading opening 9, which is positioned opposite to the back plate 2 along the third direction Z. During wafer insertion, the corresponding wafer insertion mechanism of the wafer insertion machine enters the receiving space 8 through the loading opening 9 and picks up the corresponding wafer. Since the wafer insertion mechanism is fixed in position, this application pushes the clip device toward the wafer insertion mechanism to bring the wafer in the receiving space 8 closer to the wafer insertion mechanism and allow it to be picked up by the wafer insertion mechanism. The clip device cooperates with the loading position slide rail via the slide groove 33, and can slide along the slide rail under external force, thus pushing the wafer onto the wafer insertion mechanism.

[0046] In a specific application, the clip device of this embodiment can be used to sequentially stack silicon wafers in the accommodating space 8 of the clip device, then transfer the clips to a water tank. An automated transfer trolley transports the water tank containing the clip device to the docking position of the clip device's loading module. The water tank is then loaded to the clip water tank loading position. The clip device, through the gantry-type gantry robot structure of the loading module, places the clip device from the water tank into the wafer loading position. An external pushing mechanism moves the clip device forward, causing the silicon wafers within it to move forward until the wafer loading mechanism can smoothly pick up the wafers. After the silicon wafers are loaded into the clip device, the clip device is first moved back away from the wafer loading mechanism position, and then the robot arm grabs the clip device and moves it into the water tank.

[0047] It should be noted that, along the first direction X, the size of the upper plate mechanism needs to be smaller than the distance between the two side plates 1, so as to ensure that the upper plate mechanism can smoothly enter the accommodating space 8 while the magazine device moves forward.

[0048] In addition, in this embodiment, the back plate 2 can also be tilted relative to the second direction Y towards the side closer to the receiving space 8. In this case, when the silicon wafers are stacked in the receiving space 8, the silicon wafers can have a smaller contact area with the back plate 2, making it easier to clean the last silicon wafer and improving the cleanliness of the silicon wafers. It should be noted that when the back plate 2 is tilted relative to the second direction Y towards the receiving space 8, the support rod 4 is located at the end of the back plate 2 near the bottom plate 3. That is, along the second direction Y, the distance between the support rod 4 and the bottom plate 3 is less than the distance between the connection point of the back plate 2 and the side plate 1 and the bottom plate 3. At this time, the back plate 2 can be pressed down from its bottom end, achieving the tilting of the back plate 2 towards the direction closer to the receiving space 8.

[0049] Referring to Figures 3 and 4, in some embodiments, the side plate 1 is provided with a first through hole 11, and the back plate 2 is provided with a fixing buckle 5 on the side facing the side plate 1. The fixing buckle 5 is connected to the side plate 1 and is rotatably inserted through the first through hole 11.

[0050] In this embodiment, the side plate 1 and the back plate 2 are rotatably connected by the first through hole 11 and the fixing buckle 5, facilitating the rotation and tilting of the back plate 2 at a certain angle. Simultaneously, the fixing buckle 5, inserted through the first through hole 11, allows the back plate 2 to be positioned between the two side plates 1 by mutual restraint between the fixing buckle 5 and the wall of the first through hole 11, and it can rotate about the central axis of the fixing buckle 5. Furthermore, this embodiment incorporates a support rod 4, which supports the back plate 2 on the side away from the accommodating space 8, providing restraint and support for the back plate 2, preventing excessive rotation and tilting, thus maintaining a relatively fixed tilt angle for easy silicon wafer stacking and subsequent wafer loading.

[0051] It should be noted that, in this embodiment, the first through hole 11 penetrates the side plate 1 along the first direction X. The fixing buckle 5 can be cylindrical, facilitating its rotation within the first through hole 11. The fixing buckle 5 can be partially inserted into the first through hole 11 and partially pass through the first through hole 11 on the side of the side plate 1 opposite to the back plate 2. When the fixing buckle 5 protrudes outside the first through hole 11, it facilitates connection with a nut or other fixing structure to directly lock the fixing buckle 5, ensuring that the back plate 2 maintains its tilt angle at this time without change.

[0052] Referring to Figures 1 to 4, in some embodiments, the side plate 1 is provided with a limiting adjustment groove 12 on the side opposite to the back plate 2. The limiting adjustment groove 12 has a bottom wall 121, and a first through hole 11 penetrates the bottom wall 121 and communicates with the limiting adjustment groove 12. The fixing buckle 5 includes a connecting part 51 and a limiting part 52. The connecting part 51 is connected to the limiting part 52, and the end of the connecting part 51 away from the limiting part 52 is connected to the back plate 2. The connecting part 51 is rotatably inserted through the first through hole 11, and the limiting part 52 is rotatably disposed in the limiting adjustment groove 12.

[0053] In this embodiment, the connecting part 51 can be cylindrical and passes through the first through hole 11, allowing it to rotate within the first through hole 11. The limiting adjustment groove 12 is located on the side of the side plate 1 opposite to the back plate 2 and communicates with the first through hole 11. The limiting adjustment groove 12 accommodates the limiting part 52 and limits the limiting part 52. Thus, through the interaction between the limiting part 52 and the limiting adjustment groove 12, the rotation angle of the back plate 2 is limited.

[0054] It should be noted that, in this embodiment, the outer diameter of the limiting adjustment groove 12 is larger than the outer diameter of the first through hole 11, so that the limiting adjustment groove 12 and the first through hole 11 cooperate to form a stepped groove. At the same time, the length of the limiting part 52 is larger than the maximum size of the connecting part 51, so that the fixing buckle 5 forms a T-shaped structure. In this way, the fixing buckle 5 cooperates with the first through hole 11 and the limiting adjustment groove 12. After the fixing buckle 5 rotates with the back plate 2, the position of the back plate 2 along the first direction X can be fixed by the cooperation of the fixing buckle 5 and the side plate 1, so as to prevent the back plate 2 from moving in the first direction X.

[0055] As shown in Figure 4, in some embodiments, the limiting adjustment groove 12 is an elongated oval groove extending along the back plate 2 toward the accommodating space 8. The dimension of the limiting adjustment groove 12 along the second direction Y is greater than the width dimension of the limiting part 52, and the width dimension of the limiting adjustment groove 12 along the second direction Y is less than the length dimension of the limiting part 52.

[0056] In this embodiment, the limiting adjustment groove 12 is an elongated oval groove, where the length of the limiting adjustment groove 12 is greater than its width. The width of the limiting adjustment groove 12 is greater than the width of the limiting part 52, thus enabling the limiting part 52 to rotate within the limiting adjustment groove 12. The width of the limiting adjustment groove 12 is less than the length of the limiting part 52, thus enabling the limiting part 52 to be braked by the groove wall of the limiting adjustment groove 12 after rotating a certain angle, thereby preventing the limiting part 52 from continuing to rotate and thus limiting the rotation angle of the back plate 2.

[0057] This application achieves positioning and limiting of the back plate 2 by means of the cooperation between the limiting part 52 and the limiting adjustment groove 12, thus preventing the back plate 2 from tilting excessively. In the event that the support rod 4 accidentally falls off, the tilt angle of the back plate 2 can still be positioned by means of the cooperation between the limiting part 52 and the limiting adjustment groove 12.

[0058] It should be noted that the first through hole 11 in this embodiment can be an elongated hole, and the length extension direction of the first through hole 11 is the same as the length extension direction of the limiting adjustment groove 12. The limiting part 52 can be elongated, and the length of the limiting part 52 is less than the length of the first through hole 11. When the back plate 2 is connected to the side plate 1, the limiting part 52 can pass directly through the first through hole 11. Since the fixing buckle 5 is fixedly connected to the back plate 2, the rotation of the back plate 2 drives the fixing buckle 5 to rotate, and then the limiting part 52 also rotates. In this way, an angle difference can be achieved between the limiting part 52 and the first through hole 11, that is, the limiting part 52 rotates away from the first through hole 11, so that the orthographic projection of the second limiting part along the first direction X on the side plate 1 is located on the bottom wall 121. At this time, the bottom wall 121 limits the limiting part 52, which can prevent the back plate 2 from moving in the first direction X. The specific relative positional relationship between the limiting part 52, the first through hole 11 and the bottom wall 121 is shown in Figure 4.

[0059] Please refer to Figure 3. In some embodiments, along the second direction Y, the support rod 4 has a first orthographic projection on the base plate 3, and the fixing buckle 5 has a second orthographic projection on the base plate 3. The first orthographic projection is located on the side of the second orthographic projection away from the accommodating space 8.

[0060] In this embodiment, since the first orthographic projection is located on the side of the second orthographic projection away from the accommodating space 8, it can be determined that the line connecting the first through hole 11 and the fixing point of the support rod 4 on the side plate 1 is inclined in the direction away from the accommodating space 8. Therefore, when the back plate 2 contacts the support rod 4, the back plate 2 is also inclined in the direction away from the accommodating space 8, which ensures that the back plate 2 has a certain tilt angle.

[0061] It should be noted that when the support rod 4 is fixed in a fixed position, the larger the outer diameter of the support rod 4, the smaller the tilt angle of the support rod 4 will be. Therefore, the tilt angle of the back plate 2 can be adjusted by adjusting the support rods 4 with different outer diameters.

[0062] Referring to Figures 1 to 3, in some embodiments, the side panel 1 has a first window 13, which extends through the side panel 1 along a first direction X and communicates with the accommodating space 8; along the first direction X, the orthographic projection of the back panel 2 on the side panel 1 is at least partially located within the first window 13.

[0063] In this embodiment, by providing a first window 13, cleaning water can smoothly enter the receiving space 8 and contact the silicon wafers. Simultaneously, when the clip device enters the loading position, the first window 13 provides a water spraying space for the nozzles at that position. The water flow continuously sprayed from the first window 13 is used to separate multiple silicon wafers stacked along the third direction Z, facilitating the loading mechanism to pick up each silicon wafer.

[0064] It should be noted that the orthographic projection of the back plate 2 on the side plate 1 is at least partially located within the first window 13. This ensures that as the magazine device moves, the nozzle can be positioned relative to each silicon wafer in sequence along the first direction X. Thus, the water sprayed from the first window 13 can clean and separate each silicon wafer in the accommodating space 8, enabling the smooth loading of all silicon wafers.

[0065] Referring to Figures 1 to 3 and Figures 5 to 7, in some embodiments, the magazine device further includes multiple lifting parts 6. The lifting parts 6 are connected to the side of the side plate 1 away from the receiving space 8, and the lifting parts 6 are located on the side of the first opening 13 away from the bottom plate 3. Each side plate 1 is connected to at least two lifting parts 6.

[0066] In this embodiment, by providing a lifting part 6 on the side of the side plate 1 away from the accommodating space 8, an external robotic arm can be used to grasp the magazine device, realizing automated transfer of the magazine device, reducing manual operation, and effectively improving the wafer insertion efficiency. Simultaneously, since each side plate 1 is connected to at least two lifting parts 6, each magazine device has at least four gripping points for the robotic arm to grasp, ensuring stable gripping and preventing the silicon wafer from accidentally tilting and breaking.

[0067] Referring to Figures 1 to 3 and Figure 7, in some embodiments, the lifting part 6 has a positioning notch 61, the opening of which faces the bottom plate 3.

[0068] In this embodiment, the positioning notch 61 is designed to facilitate the gripping and positioning of the robotic arm, avoiding relative displacement and sliding between the gripper and the lifting part 6, thus effectively ensuring the gripping effect and gripping stability.

[0069] Referring to Figures 1 to 3, in some embodiments, the side plate 1 is provided with a second through hole 14, and the support rod 4 is detachably inserted through the second through hole 14 of the two side plates 1.

[0070] In this embodiment, the support rod 4 is detachably inserted through the second through hole 14. In some optional embodiments, the inner diameter of the second through hole 14 can be set to be larger than the outer diameter of the support rod 4, which facilitates the quick assembly and disassembly of the support rod 4 and allows the support rod 4 with different outer diameters to be replaced according to the tilt angle requirements of the back plate 2. Alternatively, a sleeve can be detachably fitted in the middle of the support rod 4, which can also increase the maximum outer diameter of the support rod 4 and thereby adjust the tilt angle of the back plate 2.

[0071] It should be noted that there can be multiple second through holes 14 in this embodiment. Depending on the tilt angle of the back plate 2, different positions of the second through holes 14 can be provided. In this case, the tilt angle of the back plate 2 can be adjusted by adjusting the fixed position of the support rod 4. Specifically, when the back plate 2 is tilted relative to the second direction Y in a direction away from the accommodating space 8, the support rod 4 is located on the side of the back plate 2 away from the bottom plate 3 and away from the accommodating space 8; when the back plate 2 is tilted relative to the second direction Y in a direction closer to the accommodating space 8, the support rod 4 is located on the side of the back plate 2 closer to the bottom plate 3 and away from the accommodating space 8.

[0072] Please refer to Figures 1, 5, 7 and 8. In some embodiments, the base plate 3 is provided with a second window 32, which penetrates the base plate 3 along the second direction Y and communicates with the accommodating space 8.

[0073] In this embodiment, a second window 32 is provided on the base plate 3, which enables cleaning water to enter the accommodating space 8 through the second window 32 to clean the bottom of the silicon wafer, facilitates wafer separation, and also facilitates the rapid outflow of water from the accommodating space 8 when the clip device is picked up.

[0074] Please refer to Figures 1, 5, 7 and 8. In some embodiments, the bottom plate 3 is provided with two sliding grooves 33 on the side opposite to the accommodating space 8. The two sliding grooves 33 are spaced apart along the first direction X on both sides of the second window 32.

[0075] In this embodiment, the magazine device is supported on the slide rail by two sliding grooves 33 cooperating with the slide rail, and the second window 32 is suspended in the air, which makes it easier for water to flow through the second window 32.

[0076] Referring to Figures 1 to 3, 6 and 7, in some embodiments, a support portion 7 is provided between the side plate 1 and the bottom plate 3. The support portion 7 is connected to the bottom plate 3 and the side plate 1 respectively. An inclined surface 71 is provided on the side of the support portion 7 away from the bottom plate 3. The inclined surface 71 is inclined towards the bottom plate 3 along the direction of the side plate 1 away from the accommodating space 8. The support portions 7 connecting the two side plates 1 are arranged at intervals on both sides of the second window 32 along the first direction X.

[0077] In this embodiment, by providing a support 7 connected between the side plate 1 and the bottom plate 3, the side plate 1 can be supported, thereby increasing the height of the accommodating space 8 along the second direction Y. At the same time, the support 7 is partially located within the accommodating space 8 and can be used to support the silicon wafer, thereby achieving a spacing between the bottom of the silicon wafer and the bottom plate 3, so that there is a larger distance and space between the bottom of the silicon wafer and the first opening 13. This allows more cleaning water to flow through the bottom of the silicon wafer, achieving better cleaning of the bottom of the silicon wafer.

[0078] In some optional embodiments of this application, an inclined surface 71 is provided in the support portion 7. This inclined surface 71 can, on the one hand, avoid the nozzle, providing space for the nozzle to spray water into the first opening 13; on the other hand, it allows the nozzle to be tilted by means of the inclined surface 71, so that water can be blown upwards from the bottom wall 121 of the silicon wafer, which can achieve better cleaning and dicing effect of the silicon wafer. In addition, it also facilitates the smooth outward flow of water located in the accommodating space 8 by means of the inclined surface 71.

[0079] In some embodiments, the angle at which the end of the back plate 2 away from the bottom plate 3 is tilted relative to the second direction Y toward the direction away from the accommodating space 8 is α°, and the range of α is: greater than 0 and less than or equal to 15°.

[0080] In this embodiment, the tilt angle of the backplate 2 is controlled within the range of greater than 0° and less than or equal to 15°, which can ensure a high wafer integrity rate when the silicon wafer is slicing and mounting by blowing water through the nozzle, and reduce the possibility of silicon wafer breakage.

[0081] It should be noted that, in this embodiment, the numerical range of α can be any one value or a range between any two values ​​from 0.1, 0.2, 0.3, 0.4, 0.5, 1, 1.5, 1.8, 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, and 15. The angle can be measured using conventional angle measuring tools such as a protractor to measure the angle between the base plate 3 and the back plate 2, thereby obtaining the angle α of the back plate 2's inclination relative to the second direction Y.

[0082] The following description refers to specific embodiments.

[0083]

[0084] As can be seen from the above embodiments, when α is greater than 0 and less than or equal to 15, the nozzle blowing water can separate the silicon wafers and tilt them onto the wafer mounting structure, facilitating wafer mounting. In this case, the wafer success rate during wafer mounting remains above 98%, effectively ensuring the success rate and reducing the probability of wafer breakage and waste. When α is greater than 15, the tilt angle of the silicon wafer increases during water blowing, which can lead to wafer fragmentation as the mounting mechanism cannot contact the wafer, resulting in a decrease in the wafer success rate during wafer mounting. When α is less than or equal to 0, the contact area between the silicon wafer and the backplate 2 is smaller. While water blowing can improve the cleanliness of the silicon wafer, it also increases the likelihood of wafer fragmentation, further reducing the wafer success rate during wafer mounting. Therefore, the tilt angle α of the backplate 2 in this application is controlled within the range of greater than 0 and less than or equal to 15.

[0085] A second aspect of this application provides a chip inserter, including a magazine device as described in the foregoing embodiments.

[0086] It is understood that the inserter in this application includes all the technical features and effects of the aforementioned magazine device, and will not be repeated here.

[0087] In this embodiment of the application, the loading position of the wafer inserter is provided with a slide rail and a wafer loading mechanism. The slide rail is used to cooperate with the slide groove 33 of the clip device to realize the clip device sliding on the slide rail, so that the clip device drives the silicon wafer inside to move to the wafer loading mechanism.

[0088] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0089] The foregoing has provided a detailed description of a magazine device and inserter provided in the embodiments of this application, and specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A magazine device, wherein, Having intersecting first direction (X), second direction (Y), and third direction (Z), including: Two side panels (1) are spaced apart along the first direction (X); A back plate (2) is disposed between the two side plates (1) and is rotatably connected to the two side plates (1) respectively; A base plate (3) is disposed on the same side of the two side plates (1) and the back plate (2) along the second direction (Y), and the base plate (3) is connected to the two side plates (1) respectively; the base plate (3), the back plate (2) and the two side plates (1) form an accommodating space (8); a sliding groove (33) is provided on the side of the base plate (3) away from the accommodating space (8), and the sliding groove (33) is used to cooperate with the slide rail to make the magazine device move along the third direction (Z); Support rod (4) is connected to the two side plates (1) respectively. The support rod (4) is located on the side of the back plate (2) away from the accommodating space (8) so that the end of the back plate (2) away from the bottom plate (3) is inclined relative to the second direction (Y).

2. The magazine device according to claim 1, wherein, The side plate (1) is provided with a first through hole (11), and the back plate (2) is provided with a fixing buckle (5) on the side facing the side plate (1). The fixing buckle (5) is connected to the side plate (1) and is rotatably inserted through the first through hole (11).

3. The magazine device according to claim 2, wherein, The side plate (1) is provided with a limiting adjustment groove (12) on the side away from the back plate (2). The limiting adjustment groove (12) has a bottom wall (121). The first through hole (11) penetrates the bottom wall (121) and communicates with the limiting adjustment groove (12). The fixing buckle (5) includes a connecting part (51) and a limiting part (52). The connecting part (51) is connected to the limiting part (52), and one end of the connecting part (51) away from the limiting part (52) is connected to the back plate (2). The connecting part (51) is rotatably inserted through the first through hole (11), and the limiting part (52) is rotatably disposed in the limiting adjustment groove (12).

4. The magazine device according to claim 3, wherein, The limiting adjustment groove (12) is an elongated oval groove extending along the third direction (Z). The dimension of the limiting adjustment groove (12) along the second direction (Y) is greater than the width dimension of the limiting part (52), and the dimension of the limiting adjustment groove (12) along the second direction (Y) is less than the length dimension of the limiting part (52).

5. The magazine device according to claim 2, wherein, Along the second direction (Y), the support rod (4) has a first orthographic projection on the base plate (3), and the fixing buckle (5) has a second orthographic projection on the base plate (3). The first orthographic projection is located on the side of the second orthographic projection away from the accommodating space (8).

6. The magazine device according to claim 5, wherein, Along the second direction (Y), the support rod (4) is located on the side of the first through hole (11) away from the bottom plate, and the end of the back plate (2) away from the bottom plate (3) is inclined relative to the second direction (Y) toward the side away from the accommodating space (8).

7. The magazine device according to claim 6, wherein, The back plate (2) is tilted at an angle of α° relative to the second direction (Y) toward the direction away from the accommodating space (8), and the range of α is: greater than 0 and less than or equal to 15.

8. The magazine device according to claim 1, wherein, The side panel (1) has a first window (13) that extends through the side panel (1) along the first direction (X) and communicates with the accommodating space (8); along the first direction (X), the orthographic projection of the back panel (2) on the side panel (1) is at least partially located within the first window (13).

9. The magazine device according to claim 8, wherein, The magazine device also includes a plurality of lifting parts (6), which are connected to the side of the side plate (1) away from the accommodating space (8) and are located on the side of the first opening (13) away from the bottom plate (3). Each side plate (1) is connected to at least two of the lifting parts (6).

10. The magazine device according to claim 9, wherein, The lifting part (6) has a positioning notch (61) with the opening direction of the positioning notch (61) facing the base plate (3).

11. The magazine device according to claim 2, characterized in that, The side plate (1) is provided with a second through hole (14), and the support rod (4) is detachably inserted through the second through holes (14) of the two side plates (1).

12. The magazine device according to claim 1, wherein, The base plate (3) is provided with a second window (32), which penetrates the base plate (3) along the second direction (Y) and communicates with the accommodating space (8).

13. The magazine device according to claim 12, characterized in that, The base plate (3) has two sliding grooves (33) on the side away from the accommodating space (8), and the two sliding grooves (33) are arranged on both sides of the second window (32) along the first direction (X).

14. The magazine device according to claim 12, wherein, A support portion (7) is provided between the side plate (1) and the bottom plate (3). The support portion (7) is connected to the bottom plate (3) and the side plate (1) respectively. An inclined surface (71) is provided on the side of the support portion (7) away from the bottom plate (3). The inclined surface (71) is inclined towards the bottom plate (3) along the direction of the side plate (1) away from the accommodating space (8). The support portions (7) connecting the two side plates (1) are spaced apart on both sides of the second window (32) along the first direction (X).

15. A chip inserter, wherein, Includes the magazine device as described in any one of claims 1 to 14.

Images