Server interconnection system, communication method, server, device, medium and product

Abstract

Provided in the embodiments of the present application are a server interconnection system, a communication method, a server, a device, a medium and a product, which are applied to the technical field of servers. The server interconnection system comprises: a host processor module; a riser card module, which comprises a riser card control board and at least two riser card wire bonding boards; and external plug-in card slots, the number of which is the same as the number of riser card wire bonding boards, wherein the host processor module is directly interconnected with the corresponding external plug-in card slots to transmit a high-speed signal and / or a bypass signal, and the host processor module is connected to the corresponding external plug-in card slots by means of the riser card control board and the corresponding riser card wire bonding boards, so as to transmit a power supply signal and / or a low-speed signal. Optimization of a riser card in the server interconnection system is achieved by splitting the riser card into a riser card module consisting of one riser card control board, a plurality of card wire bonding boards and a plurality of external plug-in card slots, and the interconnection between a host processor module and a riser card no longer uses a fixed-position board-to-board connector.

Description

Server interconnection systems, communication methods, servers, equipment, media and products

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410907506.4, filed on July 8, 2024, entitled "Server Interconnection System, Communication Method, Server, Device, Medium and Product", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of server technology, and in particular to server interconnection systems, communication methods, servers, devices, media and products. Background Technology

[0004] With the rapid development of internet technology and the booming development of cloud services and cloud computing, servers, as key devices supporting various applications on the internet, are becoming increasingly important. To ensure the compatibility and consistency of various server components in data centers and enterprise infrastructures, the modular hardware system specification defines the form factor of the host processor module (HPM), provides standardized interfaces and its form factor, to accommodate the installation of standard rack servers.

[0005] In related technologies, the interconnection methods between the host processor module and the riser card include board-to-board interconnection, wire-to-board interconnection, and hybrid interconnection, with board-to-board interconnection being the most common. In board-to-board interconnection, multiple fixed-position board-to-board connectors are designed on the board side where the host processor module is located to connect riser cards of various shapes, thereby combining them into different rear window configurations for use.

[0006] Because board-to-board connectors have the highest priority and are strongly coupled with the structural dimensions of the chassis, the fixed position of board-to-board connectors means that the layout of other connectors and chips on the host processor module must give way to board-to-board connectors. This poses a great challenge to the routing and component layout in the host processor module, limits the layout of the server's back window, and causes the design of adapter cards to be highly dependent on the position and structure of the adapter card connectors in the server. This results in a wide variety of adapter cards with low reusability. Summary of the Invention

[0007] In view of the above problems, server interconnection systems, communication methods, servers, devices, media, and products are proposed to overcome or at least partially solve the above problems, including:

[0008] A server interconnection system, comprising:

[0009] Host processor module;

[0010] The adapter card module includes an adapter card control board and at least two adapter card bonding boards;

[0011] External card slots, the number of which is the same as the number of adapter card bonding boards. The host processor module is directly interconnected with the corresponding external card slot for transmitting high-speed signals and / or bypass signals. The host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board for transmitting power supply signals and / or low-speed signals.

[0012] Optionally, the external card slot is connected to the external card connector in the host processor module via a high-speed cable to transmit high-speed signals and / or bypass signals between the external card connector and the external card slot;

[0013] The adapter card soldering board connects the adapter card control board and the external card slot;

[0014] The adapter card control board is connected to the host processor module via solder wires or connectors to transmit power supply signals and / or low-speed signals between the host processor module and the external card slot via solder wires or connectors, the adapter card control board, and the adapter card solder wire board.

[0015] Optionally, other components are connected to the host processor module. These other components are connected to the adapter card control board via solder wires or connectors between the host processor module and the adapter card control board, and are connected to the external card slot via the adapter card control board and the adapter card solder wire board, so as to transmit power supply signals and / or low-speed signals between the other components and the external card slot.

[0016] Optionally, other components include a baseboard management controller, and the adapter card control board is equipped with a switching chip;

[0017] The baseboard management controller is connected to the switching chip via a solder wire or connector between the host processor module and the adapter card control board.

[0018] The switching chip has two serial communication buses for each external card slot, and the switching chip connects to the external card slot through the two serial communication buses.

[0019] Optionally, the two serial communication buses include a first serial communication bus and a second serial communication bus; the baseboard management controller and the external card slot transmit communication signals through the first serial communication bus.

[0020] The adapter card control board is also equipped with an expansion chip, which is connected to the switching chip via a second serial communication bus. The expansion chip is used to monitor whether an external card is inserted in the external card slot and to feed back the monitoring signal to the baseboard management controller via the second serial communication bus.

[0021] Optionally, the adapter card control board is also equipped with a field-replaceable unit, which is connected to the switching chip via a second serial communication bus; the field-replaceable unit and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip.

[0022] Optionally, the adapter card control board is also equipped with a temperature sensor, which is connected to the switching chip via a second serial communication bus; the temperature sensor and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip.

[0023] Optionally, other components include a first power conversion chip and a second power conversion chip provided on the adapter card control board;

[0024] The first power conversion chip is connected to the second power conversion chip via a solder wire or connector between the host processor module and the adapter card control board.

[0025] The second power conversion chip is connected to each external card slot and is used to transmit the processed power supply signal to each external card slot.

[0026] Optionally, the adapter card control board is provided with a sideband connector, and the adapter card bonding board is provided with a gold finger connector. The adapter card control board and the adapter card bonding board are connected through the sideband connector and the gold finger connector.

[0027] Optionally, the number of sideband connectors, gold finger connectors, and external card slots are the same.

[0028] Optionally, the host processor module is further provided with a central processing unit and / or logic processing element, which is connected to an external card connector. The high-speed signal and / or bypass signal transmitted between the external card connector and the external card slot is a signal output by the central processing unit and / or logic processing element.

[0029] Optionally, the adapter card module also includes at least two module structure positioning components, which fix the adapter card module to the board where the host processor module is located.

[0030] Optionally, the external card slot is a slot for inserting external cards that conform to the high-speed serial computer expansion bus standard, the high-speed cable is a cable based on the high-speed serial computer expansion bus standard, and the external card connector is a connector for connecting external cards that conform to the high-speed serial computer expansion bus standard.

[0031] A communication method based on a server interconnection system, the server interconnection system including a host processor module, an adapter card module, and external card slots, the adapter card module including an adapter card control board and at least two adapter card bonding boards, the number of external card slots being the same as the number of adapter card bonding boards, the host processor module being directly interconnected with the corresponding external card slot, and the host processor module being connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board, the method including:

[0032] High-speed signals and / or bypass signals are transmitted between the host processor module and the corresponding external card slot through a direct interconnection structure between the host processor module and the corresponding external card slot.

[0033] The power supply signal and / or low-speed signal are transmitted between the host processor module and the corresponding external card slot via the adapter card control board and the corresponding adapter card bonding board.

[0034] Optionally, the external card slot is connected to the external card connector in the host processor module via a high-speed cable, and the adapter card bonding board is connected between the adapter card control board and the external card slot. The adapter card control board is connected to the host processor module via bonding wires or connectors.

[0035] The high-speed signal and / or bypass signal are transmitted between the host processor module and the corresponding external card slot through a direct interconnection structure between the host processor module and the corresponding external card slot, including: transmitting high-speed signals and / or bypass signals between the external card connector and the external card slot through a high-speed cable between the external card connector and the external card slot.

[0036] The power supply signal and / or low-speed signal are transmitted between the host processor module and the corresponding external card slot via the adapter card control board and the corresponding adapter card bonding board, including: transmitting the power supply signal and / or low-speed signal between the host processor module and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board and the adapter card bonding board.

[0037] Optionally, other components are connected to the host processor module. These other components are connected to the adapter card control board via solder wires or connectors between the host processor module and the adapter card control board, and are connected to the external card slot via the adapter card control board and the adapter card solder wire board.

[0038] Power supply signals and / or low-speed signals are transmitted between the host processor module and the external card slot via wire bonding or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board, including:

[0039] Low-speed signals are transmitted between other components and external card slots via the soldered wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card soldering board.

[0040] Optionally, other components include a baseboard management controller, and an adapter card control board equipped with a switching chip; the baseboard management controller is connected to the switching chip via a solder wire or connector between the host processor module and the adapter card control board; the switching chip is equipped with two serial communication buses for each external card slot, and the switching chip is connected to the external card slot via the two serial communication buses.

[0041] Low-speed signals are transmitted between other components and external card slots via wire bonding or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board, including:

[0042] Low-speed signals are transmitted between the baseboard management controller and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip, two serial communication buses and the adapter card bonding board.

[0043] Optionally, the two serial communication buses include a first serial communication bus and a second serial communication bus; the baseboard management controller and the external card slot transmit communication signals through the first serial communication bus.

[0044] The adapter card control board is also equipped with an expansion chip. The expansion chip is connected to the switching chip through the second serial communication bus. It is used to monitor whether an external card is inserted in the external card slot and to feed back the monitoring signal to the baseboard management controller through the second serial communication bus.

[0045] Low-speed signals are transmitted between the baseboard management controller and the external card slot via bonding wires or connectors between the host processor module and the adapter card control board, through a switching chip, two serial communication buses, and the adapter card bonding board. This includes:

[0046] Communication signals are transmitted between the baseboard management controller and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board, through the switching chip, the first serial communication bus and the adapter card bonding board.

[0047] The expansion chip monitors whether an external card is inserted in the card slot via the adapter card bonding board, and obtains a monitoring signal. This monitoring signal is then fed back to the baseboard management controller via the bonding wire or connector between the host processor module and the adapter card control board, through the expansion chip, the second serial communication bus, and the switching chip.

[0048] Optionally, other components include a first power conversion chip and a second power conversion chip on the adapter card control board; the first power conversion chip is connected to the second power conversion chip via a solder wire or connector between the host processor module and the adapter card control board; the second power conversion chip is connected to each external card slot respectively, and the second power conversion chip is used to transmit the processed power supply signal to each external card slot.

[0049] Low-speed signals are transmitted between other components and external card slots via wire bonding or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board, including:

[0050] Low-speed signals are transmitted between the first power conversion chip and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the second power conversion chip and the adapter card bonding board.

[0051] A server, comprising: the server interconnection system described above.

[0052] An electronic device includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein the computer program, when executed by the processor, implements the method described above.

[0053] A computer non-volatile readable storage medium stores a computer program, which, when executed by a processor, implements the method described above.

[0054] A computer program product includes a computer program that, when executed by a processor, implements the method described above.

[0055] The embodiments of this application have the following advantages:

[0056] In this embodiment, the server interconnect system includes a host processor module, an adapter card module, and external card slots. The adapter card module includes an adapter card control board and at least two adapter card bonding boards. The number of external card slots is the same as the number of adapter card bonding boards. The host processor module is directly interconnected with the corresponding external card slot for transmitting high-speed signals and / or bypass signals. The host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding boards for transmitting power supply signals and / or low-speed signals. This optimizes the adapter card in the server interconnect system by splitting the adapter card into an adapter card module consisting of one adapter card control board, multiple card bonding boards, and external card slots. The interconnection between the host processor module and the adapter card no longer uses fixed-position board-to-board connectors, reducing the difficulty of wiring and layout in the host processor module and reducing the restrictions on the rear window layout in the server. Furthermore, the design of the adapter card does not depend on the position and structure of the adapter card connector in the server, improving the reusability of the adapter card. Attached Figure Description

[0057] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 is a schematic diagram of a server in a related technology;

[0059] Figure 2 is a schematic diagram of an external card connection in a related technology;

[0060] Figure 3 is a schematic diagram of a server interconnection system in a related technology;

[0061] Figure 4 is a schematic diagram of a server interconnection system provided in some embodiments of this application;

[0062] Figure 5 is a schematic diagram of a server provided in some embodiments of this application;

[0063] Figure 6 is a schematic diagram of another server provided in some embodiments of this application;

[0064] Figure 7 is a flowchart of the steps of a communication method based on a server interconnection system provided in some embodiments of this application;

[0065] Figure 8 is a structural block diagram of an electronic device provided in some embodiments of this application;

[0066] Figure 9 is a structural block diagram of a non-volatile readable storage medium provided in some embodiments of this application;

[0067] Figure 10 is a structural block diagram of a program product provided in some embodiments of this application. Detailed Implementation

[0068] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0069] In board-to-board interconnects, as shown in Figure 1, multiple fixed-position board-to-board connectors are designed on the side of the host processor module board to connect adapter cards of various shapes, thereby forming different back-window configurations for use. In practical applications, as shown in Figures 2 and 3, the external card is inserted into the adapter card, and the adapter card connects to the board-to-board connector in the host processor module through a gold finger connector. This enables data transmission between the external card and the central processing unit (CPU), complex programmable logic device (CPLD), power conversion chip, and board management controller (BMC) on the host processor module.

[0070] Specifically, to meet the PCIe (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) expansion requirements of the rear window, the host processor module will design multiple board-to-board connectors in fixed positions on the rear window, and various types of adapter cards, one end of which is often installed on the board-to-board connector via gold fingers, and the other end is connected to one or more external cards via an external card slot.

[0071] In addition to the gold fingers that interconnect with the host processor module, the adapter card also includes multiple external card slots for external cards, a power conversion chip for power supply, a switching chip for the baseboard management controller to access via the SMBUS (System Management Bus), such as an I2C (Inter-Integrated Circuit) switching chip, a field replaceable unit (FRU) for the baseboard management controller to access via time-sharing, a temperature sensor, and an IO (Input / Output) expansion chip to monitor whether the external card is in place.

[0072] After the PCIe bus on the host processor module is connected to the gold fingers of the adapter card via the board-to-board connector, it is then interconnected with the external card slot (such as the PCIe card slot) via the metal traces on the board. Some adapter cards also support the PCIe bus on the host processor module being connected to the connector / solder point on the adapter card via the PCIe connector, and then interconnected with the external card slot via the metal traces on the board.

[0073] When using board-to-board interconnects, the location of the board-to-board connector is limited to accommodate the external PCIe expansion card in the rear window chassis. Other components on the host processor module must be relocated as a result, making the layout of the host processor module more difficult. Furthermore, because the board-to-board connector is located far from the CPU, the PCIe bus trace path is longer, and it crosses connectors and metal traces on the adapter card, which can easily lead to impedance design failures and affect the requirements for high-speed PCIe external insertion.

[0074] Moreover, due to structural limitations, adapter cards require various design styles (such as left, center, and right positions of the rear window), making it difficult to achieve reuse across platforms or generations. This results in high design costs. Furthermore, in the topology design of adapter cards, both high-speed and low-speed signals are implemented on a separate board. As PCIe speeds increase, adapter cards need to be continuously iterated and upgraded to meet requirements, leading to poor reusability.

[0075] In some embodiments of this application, instead of using fixed-position board-to-board connectors for interconnection, an adapter card is split into an adapter card module consisting of an adapter card control board and multiple adapter card bonding boards. Power supply and low-speed signals are transmitted to the external card slot via the adapter card control board and the adapter card bonding boards, while high-speed signals and bypass signals are directly interconnected via cables through the external card connector (such as a PCIe connector) on the host processor module to the external card slot (such as a PCIe slot) on the adapter card module.

[0076] As shown in Figures 4, 5, and 6, the host processor module is interconnected with the adapter card module via cables through the external card connector. The external card connector is small and can be placed relatively freely, eliminating the need to design independent board-to-board connectors with fixed positions for the adapter card module. The adapter card module can also be designed with a more uniform shape and size without being restricted by its position, and is ultimately connected to the external card through one or more external card slots.

[0077] The adapter card module is split into two independent parts:

[0078] The first part is the adapter card control board, which is interconnected with the host processor module via soldered wires or connectors to obtain the external card slot and the power required locally. It is also interconnected with the baseboard management controller on the Data Center-ready Secure Control Module (DC-SCM) via the SMBUS bus, allowing the baseboard management controller to access the switching chip. The baseboard management controller accesses the field-replaceable unit, temperature sensor, and IO expansion chip of the adapter card, etc., in a time-sharing manner.

[0079] The second part is a reusable standard form adapter card bonding board, which connects to the sideband connector on the adapter card control board via a gold finger connector. This allows the power supply and I2C bus to be connected to the external card slot on the board. It can also feed back the presence (PRSNT) signal of the external card slot to the IO expansion chip on the adapter card control board to inform the baseboard management controller whether the external card is present.

[0080] In practical applications, depending on the number of external cards required for the rear window, different numbers of adapter card bonding boards can be configured, and the adapter card bonding boards and adapter card control boards can be combined into a whole (as shown in Figure 4, one adapter card control board corresponds to two adapter card bonding boards), i.e., an adapter card module. Since neither the adapter card control board nor the adapter card bonding board has onboard metal traces for the PCIe bus, the board manufacturing process requirements are lower, which can reduce costs, reduce the number of types of adapter card boards, and improve reusability.

[0081] Furthermore, the PCIe bus and necessary bypass low-speed signals on the host processor module are directly soldered to the pins of the external card slot on the adapter card soldering board via a cable, without having to go through the adapter card module. The external card connector can be placed close to the CPU, without having to be near the rear window, reducing the wiring path and meeting the impedance requirements of the high-speed PCIe bus.

[0082] Overall, through some embodiments of this application, the layout difficulty of the host processor module is reduced, the design cost is reduced, the number of types of adapter cards is reduced, and the reusability of the platform and across generations is improved; the overall PCIe routing path is optimized, making it easier to meet the impedance requirements of the high-speed PCIe bus in system design.

[0083] The following provides further description of some embodiments of this application: As shown in Figures 4, 5, and 6, the server interconnection system includes: a host processor module, an adapter card module, and an external card slot.

[0084] The adapter card module includes an adapter card control board and at least two adapter card bonding boards.

[0085] The number of external card slots is the same as the number of adapter card bonding boards. The host processor module is directly interconnected with the corresponding external card slot for transmitting high-speed signals and / or bypass signals. The host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board for transmitting power supply signals and / or low-speed signals.

[0086] In some embodiments of this application, the specific structure is as follows:

[0087] The external card slot is connected to the external card connector in the host processor module via a high-speed cable to transmit high-speed signals and / or bypass signals between the external card connector and the external card slot;

[0088] The adapter card soldering board connects the adapter card control board and the external card slot;

[0089] The adapter card control board is connected to the host processor module via solder wires or connectors to transmit power supply signals and / or low-speed signals between the host processor module and the external card slot via solder wires or connectors, the adapter card control board, and the adapter card solder wire board.

[0090] In some embodiments of this application, other components are connected to the host processor module.

[0091] Other components are connected to the adapter card control board via solder wires or connectors between the host processor module and the adapter card control board, and are connected to the external card slot via the adapter card control board and the adapter card solder wire board to transmit power supply signals and / or low-speed signals between other components and the external card slot.

[0092] As some examples, other components may be a baseboard management controller or a power conversion chip; the baseboard management controller may be deployed on a data center security control module and is connected to a switching chip on the adapter card control board via an SMBUS bus.

[0093] The external card slot is a slot for inserting external cards that conform to the High-Speed ​​Serial Computer Expansion Bus (PCIe) standard. The high-speed cable is a cable based on the High-Speed ​​Serial Computer Expansion Bus standard. The external card connector is a connector that connects to external cards that conform to the High-Speed ​​Serial Computer Expansion Bus standard, i.e., a PCIe connector.

[0094] As examples, an adapter card module can be configured with one or more adapter card bonding boards, each adapter card bonding board corresponding to an external card slot for inserting an external card. One or more adapter card bonding boards can be connected to the same adapter card control board, that is, one adapter card control board can interface with multiple adapter card bonding boards, and thus with multiple external card slots and external cards. For example, one adapter card control board can correspond to two adapter card bonding boards, three adapter card bonding boards, four adapter card bonding boards, etc.

[0095] In practical applications, power supply signals and / or low-speed signals are transmitted between other components and the external card slot via the soldered wires or connectors between the host processor module and the adapter card control board, and then via the adapter card control board and the adapter card soldering board. That is, on the one hand, low-speed signals sent by other components are transmitted to the adapter card control board via the soldered wires or connectors between the host processor module and the adapter card control board. The adapter card control board then transmits the low-speed signals to the adapter card soldering board, which in turn transmits the power supply signals and / or low-speed signals to the external card slot. The external card slot then transmits the low-speed signals to the external card. On the other hand, the external card transmits the power supply signals and / or low-speed signals to the external card slot, which in turn transmits them to the adapter card soldering board. The adapter card soldering board then transmits the power supply signals and / or low-speed signals to the adapter card control board, which then transmits the power supply signals and / or low-speed signals to other components via the soldered wires or connectors between the host processor module and the adapter card control board.

[0096] In practical applications, high-speed signals and / or bypass signals are transmitted between the external card connector and the external card slot via a high-speed cable. That is, on the one hand, the external card connector directly transmits high-speed signals and / or bypass signals to the external card slot via the high-speed cable, and the external card slot then transmits the high-speed signals and / or bypass signals to the external card. On the other hand, the external card transmits high-speed signals and / or bypass signals to the external card slot, and the external card slot transmits the high-speed signals and / or bypass signals to the external card connector via a high-speed cable.

[0097] As some examples, high-speed signals and / or bypass signals may include clock signals (CLK), wake-up signals (WAKE), reset signals (PERST), and other signals.

[0098] In some embodiments of this application, instead of using fixed-position board-to-board connectors for interconnection, an adapter card is split into an adapter card module consisting of an adapter card control board and multiple adapter card bonding boards. Power supply and low-speed signals are transmitted to the external card slot via the adapter card control board and the adapter card bonding boards, while high-speed signals and bypass signals are directly interconnected via cables through the external card connector (such as a PCIe connector) on the host processor module to the external card slot (such as a PCIe slot) on the adapter card module.

[0099] In some embodiments of this application, other components include a baseboard management controller and an adapter card control board with a switching chip; the baseboard management controller is connected to the switching chip via a solder wire or connector between the host processor module and the adapter card control board.

[0100] The switching chip has two serial communication buses for each external card slot, and the switching chip connects to the external card slot through the two serial communication buses.

[0101] As some examples, a switching chip can be an I2C switching chip.

[0102] In practical applications, low-speed signals are transmitted between the baseboard management controller and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip, two serial communication buses and the adapter card bonding board.

[0103] In practical applications, depending on the number of external cards required for the rear window, different numbers of adapter card bonding boards can be configured, and the adapter card bonding boards and adapter card control boards can be combined into a whole (as shown in Figure 4, one adapter card control board corresponds to two adapter card bonding boards), i.e., an adapter card module. Since neither the adapter card control board nor the adapter card bonding board has onboard metal traces for the PCIe bus, the board manufacturing process requirements are lower, which can reduce costs, reduce the number of types of adapter card boards, and improve reusability.

[0104] In some embodiments of this application, the two serial communication buses include a first serial communication bus and a second serial communication bus; the baseboard management controller and the external card slot transmit communication signals through the first serial communication bus.

[0105] In practical applications, communication signals are transmitted between the baseboard management controller and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip, the first serial communication bus, and the adapter card bonding board.

[0106] In some embodiments of this application, the adapter card control board is further provided with an expansion chip. The expansion chip is connected to the switching chip through a second serial communication bus and is used to monitor whether an external card is inserted in the external card slot and to feed back the monitoring signal to the baseboard management controller through the second serial communication bus.

[0107] In practical applications, the expansion chip monitors whether an external card is inserted in the card slot via the adapter card bonding board, obtains a monitoring signal, and feeds the monitoring signal back to the baseboard management controller via the bonding wire or connector between the host processor module and the adapter card control board, through the expansion chip, the second serial communication bus, and the switching chip.

[0108] In other words, the baseboard management controller in the data center security control module is connected to the switching chip via the SMBUS bus through the solder wire or connector between the host processor module and the adapter card control board. The switching chip can convert the data between the SMBUS bus and the two serial communication buses, thereby realizing the communication between the baseboard management controller and the external card in the external card slot.

[0109] The first serial communication bus is used to transmit communication signals between the baseboard management controller and the external card in the external card slot, while the second serial communication bus is used to transmit monitoring signals between the baseboard management controller and the expansion chip, thereby enabling communication with the external card and monitoring whether the external card is inserted.

[0110] In some embodiments of this application, the adapter card control board is further provided with a field-replaceable unit, which is connected to the switching chip via a second serial communication bus; the field-replaceable unit and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip.

[0111] In practical applications, communication signals are transmitted between the field-replaceable unit and the baseboard management controller via the solder wires or connectors between the host processor module and the adapter card control board, through the switching chip and the second serial communication bus.

[0112] In some embodiments of this application, the adapter card control board is also provided with a temperature sensor, which is connected to the switching chip via a second serial communication bus; the temperature sensor and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip.

[0113] In practical applications, communication signals are transmitted between the temperature sensor and the baseboard management controller via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip and the second serial communication bus.

[0114] In some embodiments of this application, other components include a first power conversion chip and a second power conversion chip provided on the adapter card control board; the first power conversion chip is connected to the second power conversion chip through a solder wire or connector between the host processor module and the adapter card control board; the second power conversion chip is connected to each external card slot respectively, and the second power conversion chip is used to transmit the processed power supply signal to each external card slot.

[0115] In practical applications, low-speed signals are transmitted between the first power conversion chip and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the second power conversion chip and the adapter card bonding board.

[0116] In some embodiments of this application, the adapter card control board is interconnected with the host processor module via bonding wires or connectors to obtain the external card slot and the power required locally, and is interconnected with the baseboard management controller on the data center security control module via the SMBUS bus, allowing the baseboard management controller to access the switching chip. The baseboard management controller then ensures the basic functions of the adapter card by time-sharing access to the field-replaceable unit, temperature sensor, and IO expansion chip for monitoring whether the external card is in place.

[0117] In some embodiments of this application, the adapter card control board is provided with a sideband connector, and the adapter card bonding board is provided with a gold finger connector. The adapter card control board and the adapter card bonding board are connected through the sideband connector and the gold finger connector.

[0118] In some embodiments of this application, the number of sideband connectors, gold finger connectors, and external card slots are the same.

[0119] In some examples, other connection methods can be used between the adapter card control board and the adapter card bonding board, such as using wire bonding.

[0120] In some embodiments of this application, the host processor module is further provided with a central processing unit and / or logic processing element, the central processing unit and / or logic processing element being connected to an external card connector, and the high-speed signal transmitted between the external card connector and the external card slot being a signal output by the central processing unit and / or logic processing element.

[0121] In practical applications, a high-speed cable connects the external card connector and the external card slot, transmitting high-speed signals from the central processing unit (CPU) and / or logic processing elements to the external card inserted in the slot. In other words, the CPU and / or logic processing elements output high-speed signals and send them to the external card; alternatively, the external card can also send high-speed signals to the CPU and / or logic processing elements.

[0122] In some embodiments of this application, the PCIe bus and necessary bypass low-speed signals on the host processor module are directly soldered to the pins of the external card slot on the adapter card bonding board via the adapter card connector, without going through the adapter card module. The external card connector can be placed close to the CPU, without having to be near the rear window, reducing the wiring path and meeting the impedance requirements of the high-speed PCIe bus.

[0123] In some embodiments of this application, the server interconnect system includes a host processor module, an adapter card module, and external card slots. The adapter card module includes an adapter card control board and at least two adapter card bonding boards. The number of external card slots is the same as the number of adapter card bonding boards. The host processor module is directly interconnected with the corresponding external card slot for transmitting high-speed signals and / or bypass signals. The host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board for transmitting power supply signals and / or low-speed signals. This optimizes the adapter card in the server interconnect system by splitting the adapter card into an adapter card module consisting of one adapter card control board, multiple card bonding boards, and external card slots. The interconnection between the host processor module and the adapter card no longer uses fixed-position board-to-board connectors, reducing the difficulty of wiring and layout in the host processor module and reducing the restrictions on the rear window layout in the server. Furthermore, the design of the adapter card does not depend on the position and structure of the adapter card connector in the server, improving the reusability of the adapter card.

[0124] The following describes the installation process of the adapter card module:

[0125] 1. After welding the cable to the external slot of the adapter card soldering board, install it on the adapter card soldering board;

[0126] 2. Two identical adapter card bonding boards (labeled 0 and 1) are connected to the adapter card control board (which must support at least 2 adapter card bonding boards) via gold fingers. After being combined with necessary structural components (such as structural positioning components, locking devices, etc.), they form an adapter card module that can support 2 external card slots.

[0127] 3. The host processor module provides power and SMBUS bus connection to the adapter card control board on the adapter card module through the power supply and switching chip;

[0128] 4. The host processor module provides PCIe bus and necessary bypass signal connections to the adapter card bonding board on the adapter card module via a cable through the external card connector;

[0129] After completing the above installation, install the external card on the adapter card module, power on the server, and the external card functionality will be enabled. In some examples, when this configuration requires adapter cards with one external card slot, three external card slots, or multiple external card slots, simply change the number of bonding boards accordingly and match them with suitable adapter card control boards and structural components.

[0130] Referring to Figure 7, a flowchart of a communication method based on a server adapter card module provided in some embodiments of this application is shown. The server interconnection system includes a host processor module, an adapter card module, and external card slots. The adapter card module includes an adapter card control board and at least two adapter card bonding boards. The number of external card slots is the same as the number of adapter card bonding boards. The host processor module is directly interconnected with the corresponding external card slot. The host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board.

[0131] Specifically, it may include the following steps:

[0132] Step 701: Through the direct interconnection structure between the host processor module and the corresponding external card slot, high-speed signals and / or bypass signals are transmitted between the host processor module and the corresponding external card slot.

[0133] Step 702: Power supply signals and / or low-speed signals are transmitted between the host processor module and the corresponding external card slot via the adapter card control board and the corresponding adapter card bonding board.

[0134] In some embodiments of this application, the external card slot is connected to the external card connector in the host processor module via a high-speed cable, and the adapter card bonding board is connected between the adapter card control board and the external card slot. The adapter card control board is connected to the host processor module via bonding wires or connectors. Through the direct interconnection structure between the host processor module and the corresponding external card slot, high-speed signals and / or bypass signals are transmitted between the host processor module and the corresponding external card slot, including: transmitting high-speed signals and / or bypass signals between the external card connector and the external card slot via a high-speed cable between the external card connector and the external card slot.

[0135] The power supply signal and / or low-speed signal are transmitted between the host processor module and the corresponding external card slot via the adapter card control board and the corresponding adapter card bonding board, including: transmitting the power supply signal and / or low-speed signal between the host processor module and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board and the adapter card bonding board.

[0136] In some embodiments of this application, other components are connected to the host processor module. These other components are connected to the adapter card control board via bonding wires or connectors between the host processor module and the adapter card control board, and connected to the external card slot via the adapter card control board and the adapter card bonding board. Power supply signals and / or low-speed signals are transmitted between the host processor module and the external card slot via bonding wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board, including:

[0137] Low-speed signals are transmitted between other components and external card slots via the soldered wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card soldering board.

[0138] In some embodiments of this application, other components include a baseboard management controller and an adapter card control board with a switching chip. The baseboard management controller is connected to the switching chip via a solder wire or connector between the host processor module and the adapter card control board. The switching chip has two serial communication buses for each external card slot and is connected to the external card slot via the two serial communication buses.

[0139] Low-speed signals are transmitted between other components and external card slots via wire bonding or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board, including:

[0140] Low-speed signals are transmitted between the baseboard management controller and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip, two serial communication buses and the adapter card bonding board.

[0141] In some embodiments of this application, the two serial communication buses include a first serial communication bus and a second serial communication bus; the baseboard management controller and the external card slot transmit communication signals through the first serial communication bus;

[0142] The adapter card control board is also equipped with an expansion chip. The expansion chip is connected to the switching chip through the second serial communication bus. It is used to monitor whether an external card is inserted in the external card slot and to feed back the monitoring signal to the baseboard management controller through the second serial communication bus.

[0143] Low-speed signals are transmitted between the baseboard management controller and the external card slot via bonding wires or connectors between the host processor module and the adapter card control board, through a switching chip, two serial communication buses, and the adapter card bonding board. This includes:

[0144] Communication signals are transmitted between the baseboard management controller and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board, through the switching chip, the first serial communication bus and the adapter card bonding board.

[0145] The expansion chip monitors whether an external card is inserted in the card slot via the adapter card bonding board, and obtains a monitoring signal. This monitoring signal is then fed back to the baseboard management controller via the bonding wire or connector between the host processor module and the adapter card control board, through the expansion chip, the second serial communication bus, and the switching chip.

[0146] In some embodiments of this application, the adapter card control board is further provided with a field-replaceable unit, which is connected to the switching chip via a second serial communication bus; the field-replaceable unit and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip, and the method further includes:

[0147] Communication signals are transmitted between the field-replaceable unit and the baseboard management controller via solder wires or connectors between the host processor module and the adapter card control board, through a switching chip and a second serial communication bus.

[0148] In some embodiments of this application, the adapter card control board is further provided with a temperature sensor, which is connected to the switching chip via a second serial communication bus; the temperature sensor and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip, and the method further includes:

[0149] Communication signals are transmitted between the temperature sensor and the baseboard management controller via a bonding wire or connector between the host processor module and the adapter card control board, through a switching chip and a second serial communication bus.

[0150] In some embodiments of this application, other components include a first power conversion chip and a second power conversion chip provided on the adapter card control board; the first power conversion chip is connected to the second power conversion chip through a solder wire or connector between the host processor module and the adapter card control board; the second power conversion chip is connected to each external card slot respectively, and the second power conversion chip is used to transmit the processed power supply signal to each external card slot.

[0151] Low-speed signals are transmitted between other components and external card slots via wire bonding or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board, including:

[0152] Low-speed signals are transmitted between the first power conversion chip and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the second power conversion chip and the adapter card bonding board.

[0153] In some embodiments of this application, the host processor module is further provided with a central processing unit and / or a logic processing element, the central processing unit and / or the logic processing element being connected to an external card connector, and the high-speed signal transmitted between the external card connector and the external card slot being a signal output by the central processing unit and / or the logic processing element.

[0154] High-speed signals are transmitted between the external card connector and the external card slot via a high-speed cable, including:

[0155] High-speed signals from the central processing unit and / or logic processing elements to the external card inserted in the external card slot are transmitted between the external card connector and the external card slot via a high-speed cable.

[0156] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of this application are not limited to the described order of actions, because according to the embodiments of this application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of this application.

[0157] Referring to Figures 5 and 6, another embodiment of the present application shows a server, which includes the server interconnection system described above.

[0158] Referring to FIG8, an electronic device provided by some embodiments of the present application is shown, including a processor 801, a memory 802, and a computer program stored on the memory 802 and capable of running on the processor 801. When the computer program is executed by the processor, it implements the method described above.

[0159] Referring to FIG9, a computer non-volatile readable storage medium 900 is shown in some embodiments of this application. The computer non-volatile readable storage medium 900 stores a computer program, which, when executed by a processor, implements the method described above.

[0160] Referring to FIG10, a computer program product 1000 provided in some embodiments of this application is shown, including a computer program that, when executed by a processor, implements the method described above.

[0161] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0162] The above provides a detailed description of the server interconnection system, communication method, server, device, medium, and product. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A server interconnection system, characterized in that, include: Host processor module; An adapter card module, the adapter card module including an adapter card control board and at least two adapter card bonding boards; External card slots, the number of which is the same as the number of adapter card bonding boards, the host processor module is directly interconnected with the corresponding external card slot and is configured to transmit high-speed signals and / or bypass signals, the host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board and is configured to transmit power supply signals and / or low-speed signals.

2. The server interconnection system according to claim 1, characterized in that, The external card slot is connected to the external card connector in the host processor module via a high-speed cable to transmit high-speed signals and / or bypass signals between the external card connector and the external card slot; The adapter card soldering board is connected between the adapter card control board and the external card slot; The adapter card control board is connected to the host processor module via a solder wire or connector to transmit power supply signals and / or low-speed signals between the host processor module and the external card slot via the solder wire or connector, the adapter card control board, and the adapter card solder wire board.

3. The server interconnection system according to claim 2, characterized in that, Other components are connected to the host processor module. These other components are connected to the adapter card control board via solder wires or connectors between the host processor module and the adapter card control board. They are also connected to the external card slot via the adapter card control board and the adapter card solder wire board to transmit power supply signals and / or low-speed signals between the other components and the external card slot.

4. The server interconnection system according to claim 3, characterized in that, The other components include a baseboard management controller, and the adapter card control board is provided with a switching chip; The baseboard management controller is connected to the switching chip via a solder wire or connector between the host processor module and the adapter card control board. The switching chip is equipped with two serial communication buses for each external card slot, and the switching chip is connected to the external card slot through the two serial communication buses.

5. The server interconnection system according to claim 4, characterized in that, The two serial communication buses include a first serial communication bus and a second serial communication bus; the baseboard management controller and the external card slot transmit communication signals through the first serial communication bus. The adapter card control board is also provided with an expansion chip, which is connected to the switching chip through the second serial communication bus and is configured to monitor whether an external card is inserted in the external card slot and to feed back the monitoring signal to the baseboard management controller through the second serial communication bus.

6. The server interconnection system according to claim 5, characterized in that, The adapter card control board is also equipped with a field-replaceable unit, which is connected to the switching chip via the second serial communication bus; the field-replaceable unit and the baseboard management controller transmit communication signals via the second serial communication bus and the switching chip.

7. The server interconnection system according to claim 5, characterized in that, The adapter card control board is also equipped with a temperature sensor, which is connected to the switching chip via the second serial communication bus; the temperature sensor and the baseboard management controller transmit communication signals through the second serial communication bus and the switching chip.

8. The server interconnection system according to any one of claims 3 to 7, characterized in that, The other components include a first power conversion chip, and the adapter card control board is provided with a second power conversion chip; The first power conversion chip is connected to the second power conversion chip via a solder wire or connector between the host processor module and the adapter card control board; The second power conversion chip is connected to each external card slot, and the second power conversion chip is configured to transmit the processed power supply signal to each external card slot.

9. The server interconnection system according to claim 1, characterized in that, The adapter card control board is provided with a side strip connector, and the adapter card bonding board is provided with a gold finger connector. The adapter card control board and the adapter card bonding board are connected through the side strip connector and the gold finger connector.

10. The server interconnection system according to claim 9, characterized in that, The number of the side strip connectors, the number of the gold finger connectors, and the number of the external card slots are the same.

11. The server interconnection system according to claim 2, characterized in that, The host processor module is further provided with a central processing unit and / or a logic processing element, the central processing unit and / or the logic processing element being connected to the external card connector, and the high-speed signal and / or bypass signal transmitted between the external card connector and the external card slot being the signal output by the central processing unit and / or the logic processing element.

12. The server interconnection system according to claim 1, characterized in that, The adapter card module also includes at least two module structure positioning components, and the adapter card module is fixed to the board where the host processor module is located through the at least two module structure positioning components.

13. The server interconnection system according to claim 2, characterized in that, The external card slot is a slot for inserting external cards that conform to the high-speed serial computer expansion bus standard. The high-speed cable is a cable based on the high-speed serial computer expansion bus standard. The external card connector is a connector that connects to external cards that conform to the high-speed serial computer expansion bus standard.

14. A communication method based on a server interconnection system, characterized in that, The server interconnection system includes a host processor module, an adapter card module, and external card slots. The adapter card module includes an adapter card control board and at least two adapter card bonding boards. The number of external card slots is the same as the number of adapter card bonding boards. The host processor module is directly interconnected with the corresponding external card slot. The host processor module is connected to the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding boards. The method includes: Through the direct interconnection structure between the host processor module and the corresponding external card slot, high-speed signals and / or bypass signals are transmitted between the host processor module and the corresponding external card slot. The power supply signal and / or low-speed signal are transmitted between the host processor module and the corresponding external card slot through the adapter card control board and the corresponding adapter card bonding board.

15. The method according to claim 14, characterized in that, The external card slot is connected to the external card connector in the host processor module via a high-speed cable. The adapter card bonding board is connected between the adapter card control board and the external card slot. The adapter card control board is connected to the host processor module via bonding wires or connectors. The direct interconnection structure between the host processor module and the corresponding external card slot, for transmitting high-speed signals and / or bypass signals between the host processor module and the corresponding external card slot, includes: transmitting high-speed signals and / or bypass signals between the external card connector and the external card slot via a high-speed cable between the external card connector and the external card slot; The transmission of power supply signals and / or low-speed signals between the host processor module and the corresponding external card slot via the adapter card control board and the corresponding adapter card bonding board includes: transmitting power supply signals and / or low-speed signals between the host processor module and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding board.

16. The method according to claim 15, characterized in that, Other components are connected to the host processor module. These other components are connected to the adapter card control board via solder wires or connectors between the host processor module and the adapter card control board, and are connected to the external card slot via the adapter card control board and the adapter card solder wire board. The transmission of power supply signals and / or low-speed signals between the host processor module and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding wire board, includes: Low-speed signals are transmitted between the other components and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding wire board.

17. The method according to claim 16, characterized in that, The other components include a baseboard management controller, and the adapter card control board is provided with a switching chip; the baseboard management controller is connected to the switching chip through a solder wire or connector between the host processor module and the adapter card control board; the switching chip is provided with two serial communication buses for each external card slot, and the switching chip is connected to the external card slot through the two serial communication buses. The transmission of low-speed signals between the other components and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding wire board, includes: Low-speed signals are transmitted between the baseboard management controller and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip, the two serial communication buses, and the adapter card bonding board.

18. The method according to claim 17, characterized in that, The two serial communication buses include a first serial communication bus and a second serial communication bus; the baseboard management controller and the external card slot transmit communication signals through the first serial communication bus. The adapter card control board is also provided with an expansion chip. The expansion chip is connected to the switching chip through the second serial communication bus and is configured to monitor whether an external card is inserted in the external card slot and to feed back the monitoring signal to the baseboard management controller through the second serial communication bus. The transmission of low-speed signals between the baseboard management controller and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the switching chip, the two serial communication buses, and the adapter card bonding board, includes: Communication signals are transmitted between the baseboard management controller and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board, through the switching chip, the first serial communication bus and the adapter card bonding board; The expansion chip monitors whether an external card is inserted in the external card slot via the adapter card bonding board, and obtains a monitoring signal. The monitoring signal is then fed back to the baseboard management controller via the bonding wire or connector between the host processor module and the adapter card control board, through the expansion chip, the second serial communication bus, and the switching chip.

19. The method according to any one of claims 16 to 18, characterized in that, The other components include a first power conversion chip and a second power conversion chip on the adapter card control board. The first power conversion chip is connected to the second power conversion chip via a solder wire or connector between the host processor module and the adapter card control board. The second power conversion chip is connected to each external card slot and is configured to transmit the processed power supply signal to each external card slot. The transmission of low-speed signals between the other components and the external card slot via the bonding wires or connectors between the host processor module and the adapter card control board, through the adapter card control board and the adapter card bonding wire board, includes: Low-speed signals are transmitted between the first power conversion chip and the external card slot via the bonding wire or connector between the host processor module and the adapter card control board, through the second power conversion chip and the adapter card bonding board.

20. A server, characterized in that, The server includes: The server interconnection system as described in any one of claims 1 to 13.

21. An electronic device, characterized in that, It includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein the computer program, when executed by the processor, implements the method as described in any one of claims 14 to 19.

22. A computer non-volatile readable storage medium, characterized in that, A computer program is stored on the computer non-volatile readable storage medium, which, when executed by a processor, implements the method as described in any one of claims 14 to 19.

23. A computer program product, characterized in that, It includes a computer program that, when executed by a processor, implements the method as described in any one of claims 14 to 19.

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