Power module and power conversion device

Abstract

Provided in the present application are a power module and a power conversion device. The power module comprises power units and a heat sink. The heat sink comprises a housing; in the direction of thickness of the heat sink, the housing is arranged on one side of the power units. The housing comprises liquid cavities, a liquid inlet and a liquid outlet, wherein the liquid cavities include liquid distribution cavities, liquid collection cavities and heat exchange cavities; in the direction of length of the heat sink, the liquid collection cavities are located on one side of the liquid distribution cavities, and the heat exchange cavities are located on one side of the liquid collection cavities and are close to the liquid distribution cavities. In the direction of thickness of the heat sink, the heat exchange cavities are located on one side of the liquid distribution cavities and are close to the power units. The liquid inlet is in communication with a liquid distribution cavity, and the liquid outlet is in communication with a liquid collection cavity. The housing is provided with jet holes and flow-through holes, wherein the jet holes extend in the direction of thickness of the heat sink, the jet holes are in communication with the liquid distribution cavities and the heat exchange cavities, and the flow-through holes are in communication with the heat exchange cavities and the liquid collection cavities. The present application ensures that a cooling medium in the heat exchange cavities can provide overall heat dissipation for the power units, thereby facilitating a miniaturized design.

Description

Power modules and power conversion equipment

[0001] This application claims priority to Chinese Patent Application No. 202410926779.3, filed on July 10, 2024, entitled "Power Module and Power Conversion Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to a power module and a power conversion device. Background Technology

[0003] In existing power modules, the heat generated by the power unit during operation is transferred along the thickness of the power module through a heat sink to the cooling medium flowing through the heat sink. The cooling medium then flows along the length of the power module through the heat sink to transfer the heat generated by the power unit to the external environment, thus achieving heat dissipation for the power unit. However, when the heat source distribution in the power unit is uneven, especially when the local heat flux density is very high, the overall flow utilization efficiency of the cooling medium flowing along the length of the power module through the heat sink is low, resulting in a weak heat transfer capacity per unit pressure drop and a low overall heat dissipation efficiency for the power unit. Summary of the Invention

[0004] This application provides a power module and a power conversion device, which aims to solve the problem of low overall heat dissipation efficiency of power units.

[0005] In a first aspect, embodiments of this application provide a power module. The power module includes multiple power units and a heat sink. The heat sink includes a first plate, an intermediate structure, a second plate, a liquid inlet, and a liquid outlet. The intermediate structure is disposed between the first plate and the second plate. Each power unit is disposed on the side of the second plate away from the intermediate structure. Multiple liquid flow chambers are formed between the first plate and the intermediate structure. The multiple liquid flow chambers are arranged sequentially along the length of the heat sink. Each liquid flow chamber includes a distribution chamber and a collection chamber spaced apart from each other. In two adjacent liquid flow chambers, the collection chamber of one liquid flow chamber is connected to the distribution chamber of the other liquid flow chamber. The liquid inlet is connected to the distribution chamber of one of the multiple liquid flow chambers. The liquid outlet is connected to the collection chamber of another of the multiple liquid flow chambers. Multiple heat exchange cavities are formed between the intermediate structure and the second plate. Each heat exchange cavity corresponds to a liquid flow cavity. The projection of the heat exchange cavity onto the thickness direction of the radiator overlaps with the projection of the liquid distribution cavity onto the thickness direction of the radiator. The intermediate structure is provided with jet holes and flow holes. The liquid distribution cavity and the heat exchange cavity are connected through the jet holes, and the liquid collection cavity and the heat exchange cavity are connected through the flow holes. The projections of multiple power units onto the thickness direction of the radiator overlap one-to-one with the projections of multiple heat exchange cavities onto the thickness direction of the radiator.

[0006] In the power module provided in this application embodiment, the cooling medium flows into the radiator from the inlet and then flows out of the radiator from the outlet. Specifically, the cooling medium flows from the inlet into a distribution chamber of a flow chamber, from the distribution chamber through a jet hole into a corresponding heat exchange chamber, from the heat exchange chamber through a flow hole into a collection chamber, then into a distribution chamber of another flow chamber, from the distribution chamber through a jet hole into a corresponding heat exchange chamber, from the heat exchange chamber through a flow hole into a collection chamber, and finally out of the collection chamber from the outlet. Since the projections of multiple power units along the thickness direction of the radiator overlap one-to-one with the projections of multiple heat exchange chambers along the thickness direction of the radiator, the heat generated by the multiple power units during operation is transferred one-to-one along the thickness direction of the radiator to the cooling medium in the multiple heat exchange chambers. The cooling medium flowing out of the radiator from the heat exchange chambers can transfer the heat generated by the multiple power units during operation to the external environment, achieving rapid heat dissipation for the multiple power units.

[0007] Compared to existing power modules, the power module provided in this application embodiment, because the projection of the heat exchange cavity in the thickness direction of the heat sink overlaps with the projection of the liquid distribution cavity in the thickness direction of the heat sink, and the heat exchange cavity is connected to the liquid distribution cavity through the jet hole, the cooling medium can flow from the liquid distribution cavity of each liquid flow cavity into the corresponding heat exchange cavity along the thickness direction of the heat sink through the jet hole. The cooling medium in multiple heat exchange cavities can provide overall heat dissipation to multiple power units one by one, which is beneficial to improving the heat dissipation efficiency of each power unit. Moreover, it is beneficial to increase the flow rate of the cooling medium from the liquid distribution cavity of each liquid flow cavity into the corresponding heat exchange cavity, which is beneficial to improving the heat exchange capacity of the cooling medium in each heat exchange cavity, and is beneficial to improving the heat dissipation efficiency of multiple power units. Since multiple liquid flow cavities are arranged sequentially along the length direction of the heat sink, the power module can avoid occupying too large a size in the thickness direction of the heat sink, which is beneficial to reducing the size of the heat sink in the thickness direction of the heat sink, which is beneficial to the miniaturization design of the heat sink and the power module.

[0008] In one possible implementation, the size of the liquid collection chamber in the thickness direction of the radiator is larger than the size of the liquid distribution chamber in the thickness direction of the radiator.

[0009] The design of having a larger liquid collection chamber in the thickness direction of the radiator than that of the liquid distribution chamber ensures that the volume of the liquid collection chamber can be larger than that of the liquid distribution chamber. This helps to reduce the flow resistance of the cooling medium in the liquid collection chamber, improve the heat exchange efficiency per unit flow resistance, and reduce the cost of driving the flow of the cooling medium.

[0010] In one possible implementation, a mating cavity is provided between two adjacent flow chambers. The mating cavity is located between the liquid collection cavity of one flow chamber and the liquid distribution cavity of another flow chamber. From the liquid collection cavity adjacent to the mating cavity toward the liquid distribution cavity adjacent to the mating cavity, the size of the mating cavity in the thickness direction of the radiator gradually decreases.

[0011] The design of gradually decreasing dimensions of the radiator along its thickness, from the liquid collecting chamber adjacent to the matching chamber towards the liquid distributing chamber adjacent to the matching chamber, helps to reduce the pressure difference resistance of the cooling medium flowing from the liquid collecting chamber adjacent to the matching chamber into the liquid distributing chamber adjacent to the matching chamber. This helps to reduce the flow resistance of the cooling medium in the liquid collecting chamber, improves the heat exchange efficiency per unit flow resistance, and reduces the cost of driving the flow of the cooling medium.

[0012] In one possible implementation, the flow hole includes a first flow hole and a second flow hole. In the width direction of the radiator, the first flow hole and the second flow hole are located on both sides of the heat exchange cavity. The middle structure is provided with a partition, which is housed in the liquid collection cavity. In the width direction of the radiator, the partition is located between the first flow hole and the second flow hole.

[0013] The design of the first and second flow holes ensures that the cooling medium can flow from the heat exchange cavity to the liquid collection cavity through the first and second flow holes respectively. This is beneficial to increasing the flow rate of the cooling medium flowing from the heat exchange cavity into the liquid collection cavity, reducing the flow resistance of the cooling medium in the heat exchange cavity, improving the heat exchange efficiency per unit flow resistance, and reducing the cost of driving the flow of the cooling medium.

[0014] The design of the baffle can prevent the cooling medium flowing into the liquid collection chamber from the first flow hole and the cooling medium flowing into the liquid collection chamber from the second flow hole from flowing into the liquid collection chamber. This helps to reduce the flow resistance of the cooling medium flowing into the liquid collection chamber from the first flow hole, the flow resistance of the cooling medium flowing into the liquid collection chamber from the second flow hole, and the flow resistance of the cooling medium in the liquid collection chamber. This helps to improve the heat exchange efficiency per unit flow resistance and reduce the cost of driving the flow of the cooling medium.

[0015] In one possible implementation, the middle structure has at least one heat dissipation tooth on the side facing the second plate. Each heat dissipation tooth is housed in a heat exchange cavity, located outside the jet hole, and extends along the thickness direction of the radiator and abuts against the second plate.

[0016] The design of the heat dissipation teeth ensures that the heat generated by the power unit during operation can be transferred not only to the cooling medium in the heat exchange cavity through the second plate, but also through the second plate and the heat dissipation teeth. This is beneficial to improving the efficiency of heat transfer from the power unit to the cooling medium in the heat exchange cavity and thus improving the heat dissipation efficiency of the power unit.

[0017] In one possible implementation, in the width direction of the radiator, a plurality of heat dissipation teeth are located on both sides of the jet hole, and a flow channel is formed between the heat dissipation teeth on one side of the jet hole and the heat dissipation teeth on the other side of the jet hole, and the flow channel is connected to the jet hole and the flow hole.

[0018] The design of the flow channel connecting with the jet orifice and the flow port ensures that the cooling medium flowing into the heat exchange cavity from the jet orifice can flow stably and quickly to the flow port along the flow channel. The heat dissipation teeth located on both sides of the jet orifice guide the flow of the cooling medium, which helps to increase the flow velocity of the cooling medium in the heat exchange cavity as it flows out of the heat exchange cavity through the flow port, thus improving the heat exchange capacity of the cooling medium in the heat exchange cavity and improving the heat dissipation efficiency of the power unit.

[0019] In one possible implementation, there are multiple heat dissipation teeth located on one side of the jet hole, and these multiple heat dissipation teeth are spaced apart along the length of the radiator.

[0020] The flow channel is connected to multiple heat dissipation teeth located on one side of the jet orifice. This design ensures that the multiple heat dissipation teeth on both sides of the jet orifice can strongly disturb the flow of the cooling medium, which helps to increase the turbulence of the cooling medium flowing into the heat exchange cavity from the jet orifice, thereby improving the heat transfer efficiency of the cooling medium in the heat exchange cavity and the heat dissipation efficiency of the power unit.

[0021] In one possible implementation, the plurality of heat dissipation teeth located on one side of the jet hole include needle teeth and strip teeth. The size of the strip teeth in the length direction of the heat sink is greater than or equal to twice the size of the needle teeth in the length direction of the heat sink. In the length direction of the heat sink, the strip teeth are located on one side of the needle teeth and away from the jet hole. The strip teeth and needle teeth are spaced apart.

[0022] It is understood that the flow channel is connected to the gap between the needle teeth and strip teeth on one side of the jet orifice. The cooling medium flowing into the flow channel can partially flow out of the flow channel from the gap between the needle teeth and strip teeth on one side of the jet orifice and the gap between the needle teeth and strip teeth on the other side of the jet orifice, and partially flow into the gap between the strip teeth on one side of the jet orifice and the strip teeth on the other side of the jet orifice, and then flow out of the flow channel.

[0023] The spacing between the pin teeth and the strip teeth strongly disturbs the flow of the cooling medium, increasing the turbulence of the cooling medium flowing into the heat exchange cavity from the jet orifice. This improves the heat transfer efficiency of the cooling medium in the heat exchange cavity and enhances the heat dissipation efficiency of the power unit. Furthermore, the design that the dimension of the strip teeth along the length of the radiator is greater than or equal to twice the dimension of the pin teeth along the length of the radiator increases the flow velocity of the cooling medium flowing into the strip teeth on one side of the jet orifice and between the strip teeth on the other side. This also increases the flow velocity of the cooling medium flowing out of the heat exchange cavity through the flow holes, further enhancing the heat transfer capacity of the cooling medium in the heat exchange cavity and improving the heat dissipation efficiency of the power unit.

[0024] In one possible implementation, the jet orifice includes a first jet orifice and a second jet orifice. In the length direction of the radiator, the first jet orifice is located on one side of the flow hole and away from the liquid collection chamber, and the second jet orifice is located on one side of the flow hole and away from the first jet orifice.

[0025] The design of the first and second jet holes ensures that the cooling medium can flow from the liquid distribution chamber to the heat exchange chamber through the first and second jet holes respectively. The cooling medium flowing into the heat exchange chamber from the first and second jet holes can dissipate heat to different heat sources of the power unit respectively, which is beneficial to improving the overall heat dissipation efficiency of the power unit.

[0026] In one possible implementation, the intermediate structure is provided with a first partition, which is housed in the heat exchange cavity. The first partition is located between the first jet hole and the second jet hole and extends in the width direction of the radiator. The first partition abuts against the second plate.

[0027] The design of the first partition can prevent the cooling medium flowing into the heat exchange cavity from the first jet hole and the cooling medium flowing into the heat exchange cavity from the second jet hole from flowing into the heat exchange cavity. This helps to reduce the flow resistance of the cooling medium flowing into the heat exchange cavity from the first jet hole, the flow resistance of the cooling medium flowing into the heat exchange cavity from the second jet hole, and the flow resistance of the cooling medium in the heat exchange cavity. This helps to improve the heat exchange efficiency per unit flow resistance and reduce the cost of driving the flow of the cooling medium.

[0028] In one possible implementation, both ends of the first partition are bent toward the second jet hole along the length of the radiator.

[0029] The design of the two ends of the first partition bending towards the second jet hole along the length of the radiator ensures that the first partition can guide the cooling medium flowing into the heat exchange cavity from the first jet hole. This facilitates the rapid and smooth flow of the cooling medium into the flow hole, which helps to reduce the flow resistance of the cooling medium flowing into the heat exchange cavity from the first jet hole, thus reducing the flow resistance of the cooling medium in the heat exchange cavity, improving the heat exchange efficiency per unit flow resistance, and reducing the cost of driving the flow of the cooling medium.

[0030] In one possible implementation, the flow hole includes a mating hole wall. In the length direction of the radiator, the mating hole wall faces the first jet hole. The mating hole wall is provided with a mating arc portion, which is received in the flow hole. The mating arc portion is opposite to the liquid collection chamber in the width direction of the radiator relative to the mating hole wall.

[0031] The design of the arc portion relative to the wall of the matching hole along the width direction of the radiator away from the liquid collection cavity is conducive to enhancing the mixing of hot and cold flow of the cooling medium flowing into the heat exchange cavity from the second jet hole, which is conducive to improving the heat exchange capacity of the cooling medium in the heat exchange cavity and improving the heat dissipation efficiency of the power unit.

[0032] In one possible implementation, there are multiple first jet holes, which are spaced apart in the width direction of the radiator. The middle structure is provided with a second partition, which is housed in the heat exchange cavity. In the width direction of the radiator, the second partition is located between two adjacent first jet holes and abuts against the second plate.

[0033] The design of the second partition can prevent the multiple cooling media flowing into the heat exchange cavity from the multiple first jet holes from flowing into the heat exchange cavity from fluid collision. This helps to reduce the flow resistance of the cooling media flowing into the heat exchange cavity from the first jet holes, which in turn helps to reduce the flow resistance of the cooling media in the heat exchange cavity, which helps to improve the heat exchange efficiency per unit flow resistance, and which helps to reduce the cost of driving the flow of the cooling media.

[0034] In one possible implementation, the radiator includes a first radiator and a second radiator. In the thickness direction of the radiator, the power unit is disposed between the second plate of the first radiator and the second plate of the second radiator. The liquid inlet of the second radiator is connected to the liquid inlet of the first radiator, and the liquid outlet of the second radiator is connected to the liquid inlet of the first radiator.

[0035] The design of placing the power unit between the second plate of the first heat sink and the second plate of the second heat sink in the thickness direction of the heat sink ensures that the heat generated by the power unit during operation can be transferred to the first heat sink and the second heat sink respectively along the thickness direction of the heat sink, and then transferred to the external environment through the first heat sink and the second heat sink, thereby achieving double-sided heat dissipation of the power unit and improving the heat dissipation efficiency of the power unit.

[0036] Secondly, embodiments of this application also provide a power module. The power module includes multiple first power units, multiple second power units, and a heat sink. The heat sink includes a first plate, an intermediate structure, a second plate, a liquid inlet, and a liquid outlet. The intermediate structure is disposed between the first plate and the second plate. The multiple first power units are disposed on the side of the first plate away from the intermediate structure, and the multiple second power units are disposed on the side of the second plate away from the intermediate structure. The intermediate structure has multiple liquid flow chambers arranged sequentially along the length of the heat sink. Each liquid flow chamber includes a distribution chamber and a collection chamber spaced apart from each other. In two adjacent liquid flow chambers, the collection chamber of one liquid flow chamber is connected to the distribution chamber of another liquid flow chamber; the liquid inlet is connected to the distribution chamber of one of the multiple liquid flow chambers; and the liquid outlet is connected to the collection chamber of another of the multiple liquid flow chambers.

[0037] Multiple first heat exchange cavities are formed between the first plate and the intermediate structure, and multiple second heat exchange cavities are formed between the second plate and the intermediate structure. The multiple first heat exchange cavities, multiple liquid flow cavities, and multiple second heat exchange cavities correspond one-to-one. The projection of the liquid distribution cavity in the thickness direction of the radiator overlaps with the projection of the first heat exchange cavity in the thickness direction of the radiator, and also overlaps with the projection of the second heat exchange cavity in the thickness direction of the radiator. The intermediate structure is provided with jet holes and flow holes. The liquid distribution cavity communicates with the first and second heat exchange cavities respectively through the jet holes, and the liquid collection cavity communicates with the first and second heat exchange cavities respectively through the flow holes. The projections of multiple first power units in the thickness direction of the radiator correspond one-to-one with the projections of the multiple first heat exchange cavities in the thickness direction of the radiator, and the projections of multiple second power units in the thickness direction of the radiator correspond one-to-one with the projections of the multiple second heat exchange cavities in the thickness direction of the radiator.

[0038] In the power module provided in this application embodiment, the cooling medium flows into the radiator from the inlet and then flows out of the radiator from the outlet. Specifically, the cooling medium flows from the inlet into a distribution chamber of a flow chamber, and from the distribution chamber through a jet hole into a first heat exchange chamber and a second heat exchange chamber corresponding to the flow chamber. The cooling medium in the first heat exchange chamber and the second heat exchange chamber flows into a collection chamber through a flow hole, and then into a distribution chamber of another flow chamber. From the distribution chamber, it flows through a jet hole into the first heat exchange chamber and the second heat exchange chamber corresponding to the flow chamber. The cooling medium in the first heat exchange chamber and the second heat exchange chamber flows into a collection chamber through a flow hole, and then flows out of the collection chamber from the outlet.

[0039] Since the projections of multiple first power units on the thickness direction of the radiator overlap one-to-one with the projections of multiple first heat exchange cavities on the thickness direction of the radiator, the heat generated by the multiple first power units during operation is transferred one-to-one along the thickness direction of the radiator to the cooling medium in the multiple first heat exchange cavities. The cooling medium flowing out of the radiator from the first heat exchange cavities can transfer the heat generated by the multiple first power units during operation to the external environment, thereby achieving rapid heat dissipation of the multiple first power units.

[0040] Since the projections of multiple second power units on the thickness direction of the radiator overlap one-to-one with the projections of multiple second heat exchange cavities on the thickness direction of the radiator, the heat generated by the multiple second power units during operation is transferred one-to-one along the thickness direction of the radiator to the cooling medium in the multiple second heat exchange cavities. The cooling medium flowing out of the radiator from the second heat exchange cavities can transfer the heat generated by the multiple second power units during operation to the external environment, thereby achieving rapid heat dissipation of the multiple second power units.

[0041] Compared to existing power modules, the power module provided in this application embodiment, because the projection of the heat exchange cavity in the thickness direction of the heat sink overlaps with the projection of the liquid distribution cavity in the thickness direction of the heat sink, the cooling medium can flow from the liquid distribution cavity of each liquid flow cavity into the corresponding heat exchange cavity along the thickness direction of the heat sink. The cooling medium in the multiple first heat exchange cavities can heat the multiple first power units as a whole, and the cooling medium in the multiple second heat exchange cavities can heat the multiple second power units as a whole, which is beneficial to improving the heat dissipation efficiency of each first power unit and each second power unit. Moreover, it is beneficial to increase the flow rate of the cooling medium from the liquid distribution cavity of each liquid flow cavity into the corresponding first and second heat exchange cavities, which is beneficial to increase the heat exchange capacity of the cooling medium in each first heat exchange cavity, which is beneficial to increase the heat exchange capacity of the cooling medium in each second heat exchange cavity, which is beneficial to increase the heat dissipation efficiency of the first and second power units. Since multiple fluid flow chambers are arranged sequentially along the length of the heat sink, the power module can avoid occupying too large a size in the thickness direction of the heat sink. This helps to reduce the size of the heat sink in the thickness direction, which is beneficial for the miniaturization design of the heat sink and the power module.

[0042] The design of having multiple first power units located on the side of the first plate away from the central structure, and multiple second power units located on the side of the second plate away from the central structure, ensures that the heat generated by both the first and second power units during operation can be transferred along the thickness of the heat sink to the heat sink, and then transferred to the external environment, achieving rapid heat dissipation for both units. The heat sink can be understood as capable of bi-directional heat dissipation, which improves its heat dissipation capacity. Furthermore, a single heat sink can dissipate heat from both the first and second power units, eliminating the need for separate heat sinks for each unit, thus reducing manufacturing costs and facilitating miniaturization of the power module.

[0043] Thirdly, embodiments of this application also provide a power conversion device. The power conversion device includes a control circuit board and a power module according to any one of the first aspects, the power module being mounted on the control circuit board. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0045] Figure 1 is a structural block diagram of a power conversion device and its cooperation with an external power supply and load device according to an embodiment of this application;

[0046] Figure 2 is a three-dimensional structural diagram of the power module of the power conversion device shown in Figure 1;

[0047] Figure 3 is a three-dimensional structural diagram of the power module shown in Figure 2 cut along line AA;

[0048] Figure 4 is a schematic diagram of the partial three-dimensional structure of the power module shown in Figure 2, cut along the BB line.

[0049] Figure 5 is an exploded three-dimensional structural diagram of the heat sink of the power module shown in Figure 2;

[0050] Figure 6 is a partial structural diagram of the first plate, first connector and second connector of the radiator shown in Figure 5, cut along the CC line.

[0051] Figure 7 is a schematic diagram of the middle structure of the radiator shown in Figure 5 from another angle;

[0052] Figure 8 is a structural schematic diagram of the intermediate structure shown in Figure 7 from another angle;

[0053] Figure 9 is a schematic diagram of a portion of the intermediate structure shown in Figure 7 cut along line DD.

[0054] Figure 10 is a schematic diagram of a portion of the intermediate structure shown in Figure 7, cut along line EE.

[0055] Figure 11 is a schematic diagram of a portion of the intermediate structure shown in Figure 7 cut along line FF;

[0056] Figure 12 is a partial structural diagram of the intermediate structure shown in Figure 7 from another angle;

[0057] Figure 13 is a schematic diagram of the intermediate structure shown in Figure 12 in another embodiment;

[0058] Figure 14 is a schematic diagram of the intermediate structure shown in Figure 7 in another embodiment;

[0059] Figure 15 is a schematic diagram of the intermediate structure shown in Figure 14 from another angle;

[0060] Figure 16 is a schematic diagram of the power module shown in Figure 2 cut along line AA in another embodiment;

[0061] Figure 17 is a schematic diagram of the power module shown in Figure 16 cut along the GG line;

[0062] Figure 18 is a structural schematic diagram of the power module shown in Figure 2 cut along line AA in another embodiment;

[0063] Figure 19 is an exploded three-dimensional structural diagram of the power module shown in Figure 18. Detailed Implementation

[0064] This application provides a power module and a power conversion device. The power module is applied to the power conversion device. The power conversion device is an electronic device that can convert one type of current into another type of current. This application can dissipate heat from the entire power unit, greatly improving the heat dissipation efficiency of the power unit.

[0065] The embodiments of this application are described below with reference to the accompanying drawings.

[0066] Please refer to Figure 1. Figure 1 is a structural block diagram of a power conversion device 1000 cooperating with an external power supply 2000 and a load device 3000 according to an embodiment of this application.

[0067] A power conversion device 1000 converts the direct current (DC) output from an external power source 2000 into alternating current (AC), and supplies the AC power to a load device 3000. For example, the power conversion device 1000 may be a motor controller, the external power source 2000 may be a DC power source including but not limited to a battery, and the load device 3000 may be a motor. In other embodiments, the power conversion device 1000 may also be a photovoltaic inverter, converting the DC output from the external power source 2000 into AC power and supplying the AC power to the power grid. Alternatively, the power conversion device 1000 may be a rectifier, with the external power source 2000 being an AC power source. The power conversion device 1000 can also be a transformer or converter or other devices used for power conversion.

[0068] In some embodiments, the power conversion device 1000 includes a control circuit board 100, a power module 200, and a control module 300. Both the power module 200 and the control module 300 are mounted on the control circuit board 100. The control circuit board 100 receives direct current (DC) output from an external power supply 2000 and transmits the DC to the power module 200. The power module 200 converts the DC to alternating current (AC) and transmits the AC to the load device 3000 to supply power to the load device 3000. The control module 300 controls the operation of the power module 200 to control the efficiency of the DC-AC conversion, thereby controlling the operation of the load device 3000.

[0069] Please refer to Figures 2, 3, and 4, and in conjunction with Figure 1. Figure 2 is a three-dimensional structural diagram of the power module 200 of the power conversion device 1000 shown in Figure 1. Figure 3 is a three-dimensional structural diagram of the power module 200 shown in Figure 2 cut along line AA. Figure 4 is a partial three-dimensional structural diagram of the power module 200 shown in Figure 2 cut along line BB.

[0070] As shown in Figures 2, 3, and 4, in some embodiments, the power module 200 includes a power unit 10 and a heat sink 20. The heat sink 20 is disposed on the power unit 10. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the heat sink 20 is disposed on one side of the power unit 10. Specifically, in the Z-axis direction, the heat sink 20 is fixedly stacked on one side of the power unit 10. The heat sink 20 enables rapid heat dissipation from the power unit 10. There are multiple power units 10. In other words, the power module 200 includes multiple power units 10. Specifically, there are three power units 10. In other embodiments, the number of power units 10 may also be two, four, or more. In the X-axis direction, the multiple power units 10 are arranged sequentially at intervals. In the Z-axis direction, the heat sink 20 is disposed on one side of the multiple power units 10, and the heat sink 20 is fixedly stacked on one side of the multiple power units 10. In this embodiment, the Z-axis direction is the thickness direction of the heat sink 20, the X-axis direction is the length direction of the heat sink 20, and the Y-axis direction is the width direction of the heat sink 20.

[0071] As shown in Figures 1 and 2, in the Z-axis direction, the control circuit board 100 is mounted on one side of the multiple power units 10 and faces away from the heat sink 20. Specifically, the control circuit board 100 is fixedly stacked on one side of the multiple power units 10 and faces away from the heat sink 20. That is to say, in the Z-axis direction, the control circuit board 100 is mounted on one side of the power unit 10 and faces away from the heat sink 20, the control circuit board 100 is mounted on one side of the power module 200, and the power module 200 is mounted on one side of the control circuit board 100. The DC power output from the external power supply 2000 is delivered to the multiple power units 10 via the control circuit board 100. The multiple power units 10 are used to convert the DC power into AC power and deliver the AC power to the load device 3000 to supply power to the load device 3000.

[0072] In some other embodiments, the control circuit board 100 may also be mounted on one side of the power unit 10 in the Y-axis direction, and the control circuit board 100 may also be mounted on one side of the heat sink 20. In other words, in the Y-axis direction, the control circuit board 100 is mounted on one side of the power module 200, and the power module 200 is mounted on one side of the control circuit board 100.

[0073] As shown in Figures 2, 3, and 4, in some embodiments, the power unit 10 includes a substrate 11 and a power device 12. Exemplarily, the substrate 11 can be, but is not limited to, AMB (Active Metal Bonding), DBC (Direct Bond Copper), or other substrate devices. The power device 12 is a chip. In other embodiments, the power device 12 can also be a diode, transistor, or other electronic device for power conversion. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the power device 12 is disposed on one side of the substrate 11. Specifically, the power device 12 is fixedly stacked on one side of the substrate 11. Exemplarily, there are multiple power devices 12. In other embodiments, there may be only one power device 12. The power device 12 includes a first power device 12a and a second power device 12b. In the X-axis direction, the second power device 12b is located on one side of the first power device 12a and is spaced apart from the first power device 12a.

[0074] For example, there are multiple first power devices 12a, specifically, there are six first power devices 12a. In some other embodiments, the number of first power devices 12a may also be one, two, or more. The multiple first power devices 12a are spaced apart in the Y-axis direction. There are multiple second power devices 12b, specifically, there are six second power devices 12b. In some other embodiments, the number of second power devices 12b may also be one, two, or more. The multiple second power devices 12b are spaced apart in the Y-axis direction. The projections of the multiple second power devices 12b in the X-axis direction overlap one-to-one with the projections of the multiple first power devices 12a in the X-axis direction. In some other embodiments, they may not overlap.

[0075] Please refer to Figures 5 and 6, and in conjunction with Figures 2 and 3. Figure 5 is an exploded three-dimensional structural diagram of the heat sink 20 of the power module 200 shown in Figure 2. Figure 6 is a partial structural diagram of the first plate 30, the first connector 2, and the second connector 3 of the heat sink 20 shown in Figure 5, cut along the CC line.

[0076] As shown in Figures 2, 3, and 5, in some embodiments, the heat sink 20 includes a housing 1, a first connector 2, and a second connector 3. In the Z-axis direction, the first connector 2 and the second connector 3 are disposed on one side of the housing 1. The housing 1 includes a first plate 30, a second plate 40, and an intermediate structure 50. In other words, the heat sink 20 includes a first plate 30, a second plate 40, and an intermediate structure 50. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the first plate 30 and the second plate 40 are opposite to each other and spaced apart. In the Z-axis direction, the intermediate structure 50 is disposed between the first plate 30 and the second plate 40. In the Z-axis direction, multiple power units 10 are disposed on one side of the second plate 40 and facing away from the first plate 30, and the multiple power units 10 are fixedly stacked on one side of the second plate 40 and facing away from the first plate 30. In other words, in the Z-axis direction (i.e., the thickness direction of the heat sink 20), each power unit 10 is disposed on the side of the second plate 40 away from the intermediate structure 50, and each power unit 10 is fixedly stacked on the side of the second plate 40 away from the intermediate structure 50. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the housing 1 is disposed on one side of the power unit 10, and the housing 1 is fixedly stacked on one side of the power unit 10.

[0077] In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the substrate 11 of each power unit 10 is fixedly stacked on one side of the first plate 30 and faces away from the second plate 40. The substrate 11 is disposed on one side of the housing 1. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the power device 12 of each power unit 10 faces away from the housing 1. The heat generated by the power device 12 during operation is transferred to the heat sink 20 via the substrate 11.

[0078] As shown in Figures 2, 5, and 6, in some embodiments, the first plate 30 includes a first surface 31 and a second surface 32. The first surface 31 and the second surface 32 are disposed opposite to each other in the Z-axis direction. The first plate 30 is provided with a liquid inlet 60. In other words, the housing 1 includes a liquid inlet 60, the radiator 20 includes a liquid inlet 60, and the liquid inlet 60 is disposed on the first plate 30. The liquid inlet 60 extends from the first surface 31 along the Z-axis direction to the second surface 32, and the liquid inlet 60 penetrates the first plate 30 along the Z-axis direction.

[0079] In some embodiments, the first plate 30 is provided with a liquid outlet 70. In other words, the housing 1 includes a liquid outlet 70, and the radiator 20 includes a liquid outlet 70. The liquid outlet 70 is disposed on the first plate 30. The liquid outlet 70 extends from the first surface 31 along the Z-axis direction to the second surface 32, and the liquid outlet 70 penetrates the first plate 30 along the Z-axis direction. In the X-axis direction, the liquid outlet 70 is located on one side of the liquid inlet 60 and is spaced apart from the liquid inlet 60.

[0080] In some embodiments, a portion of the first connector 2 is inserted into the liquid inlet 60; another portion is located outside the liquid inlet 60, on one side of the first surface 31 and facing away from the second surface 32. The first connector 2 is provided with a liquid inlet channel 201. The liquid inlet channel 201 extends through the first connector 2 along the Z-axis direction.

[0081] A portion of the second connector 3 is inserted into the outlet 70; the other portion is located outside the outlet 70, on one side of the first surface 31 and facing away from the second surface 32. In the X-axis direction, the second connector 3 is located on one side of the first connector 2 and faces the outlet 70, and the second connector 3 and the first connector 2 are spaced apart. The second connector 3 is provided with an outlet channel 301. The outlet channel 301 extends through the second connector 3 along the Z-axis direction.

[0082] In some embodiments, in the Z-axis direction, the second plate 40 is located on one side of the second surface 32 of the first plate 30 and faces away from the first surface 31, with the second plate 40 and the second surface 32 spaced apart. The second plate 40 is provided with mounting holes 41. The mounting holes 41 penetrate the second plate 40 along the Z-axis direction. Exemplarily, there are multiple mounting holes 41. Specifically, there are eight mounting holes 41. In other embodiments, the number of mounting holes 41 may be one, two, or more.

[0083] The four mounting holes 41 are arranged at intervals along the X-axis, forming one row of mounting holes 41, and the two rows of mounting holes 41 are arranged at intervals along the Y-axis. In the Y-axis direction, the two rows of mounting holes 41 are located on both sides of the first connector 2 and are spaced apart from it, and the two rows of mounting holes 41 are located on both sides of the second connector 3 and are spaced apart from it. Similarly, in the Y-axis direction, the two rows of mounting holes 41 are located on both sides of the liquid inlet 60 and are spaced apart from it, and the two rows of mounting holes 41 are located on both sides of the liquid outlet 70 and are spaced apart from it.

[0084] Please refer to Figures 7, 8, 9, 10, and 11, and in conjunction with Figures 3, 4, 5, and 6. Figure 7 is a structural schematic diagram of the intermediate structure 50 of the heat sink 20 shown in Figure 5 from another angle. Figure 8 is a structural schematic diagram of the intermediate structure 50 shown in Figure 7 from another angle. Figure 9 is a partial structural schematic diagram of the intermediate structure 50 shown in Figure 7 cut along line DD. Figure 10 is a partial structural schematic diagram of the intermediate structure 50 shown in Figure 7 cut along line EE. Figure 11 is a partial structural schematic diagram of the intermediate structure 50 shown in Figure 7 cut along line FF.

[0085] As shown in Figures 4 and 5, in some embodiments, an intermediate structure 50 is fixedly stacked between the first plate 30 and the second plate 40 in the Z-axis direction (i.e., the thickness direction of the heat sink 20). The intermediate structure 50 includes a first mounting surface 51 and a second mounting surface 52. In the Z-axis direction, the first mounting surface 51 and the second mounting surface 52 are arranged opposite to each other. Specifically, the first mounting surface 51 faces the first plate 30, and the first mounting surface 51 is opposite to and fixedly stacked with the second surface 32 of the first plate 30. The second mounting surface 52 faces the second plate 40 and is fixedly stacked with the second plate 40.

[0086] For example, the intermediate structure 50 and the first plate 30 are fixedly stacked together by welding, and the first mounting surface 51 is fixedly stacked together with the first plate 30. In other embodiments, the fixed stacking of the intermediate structure 50 and the first plate 30, and the fixed stacking of the first mounting surface 51 with the first plate 30, can also be achieved by means including but not limited to adhesive bonding or threaded connection.

[0087] The intermediate structure 50 and the second plate 40 are fixedly stacked together using fasteners, and the second mounting surface 52 is also fixedly stacked together with the second plate 40. In this embodiment, the intermediate structure 50 is provided with corresponding mounting holes 53. The corresponding mounting holes 53 penetrate the intermediate structure 50 from the second mounting surface 52 along the Z-axis direction. There are multiple corresponding mounting holes 53. Specifically, there are 8 corresponding mounting holes 53. In some other embodiments, the number of corresponding mounting holes 53 may be 1, 2, or more. The number of corresponding mounting holes 53 is equal to the number of mounting holes 41. The projections of the multiple corresponding mounting holes 53 in the Z-axis direction overlap with the projections of the multiple mounting holes 41 in the Z-axis direction, and the multiple corresponding mounting holes 53 communicate one-to-one with the multiple mounting holes 41.

[0088] Multiple fasteners are inserted one-to-one into multiple corresponding mounting holes 53 and multiple mounting holes 41. Through these fasteners, the intermediate structure 50 and the second plate 40 are fixedly stacked, and the second mounting surface 52 and the second plate 40 are fixedly stacked. In other embodiments, the intermediate structure 50 and the second plate 40 can also be fixedly stacked, and the second mounting surface 52 and the second plate 40 can be fixedly stacked, by means including but not limited to welding or gluing.

[0089] As shown in Figures 7, 8, and 9, in some embodiments, the intermediate structure 50 is provided with a liquid cavity 54. In other words, the housing 1 (as shown in Figure 5) includes a liquid cavity 54, which is disposed in the intermediate structure 50. In the Y-axis direction, the liquid cavity 54 is located between two rows of corresponding mounting holes 53, and the liquid cavity 54 is spaced apart from the two rows of corresponding mounting holes 53. Exemplarily, there are multiple liquid cavities 54. In the X-axis direction (i.e., the length direction of the heat sink 20), multiple liquid cavities 54 are arranged sequentially. Specifically, there are three liquid cavities 54. The three liquid cavities 54 are a first liquid cavity 54a, a second liquid cavity 54b, and a third liquid cavity 54c. That is to say, the liquid cavity 54 includes a first liquid cavity 54a, a second liquid cavity 54b, and a third liquid cavity 54c. In the X-axis direction, the first liquid cavity 54a, the second liquid cavity 54b, and the third liquid cavity 54c are arranged sequentially. That is to say, in the X-axis direction (i.e., the length direction of the heat sink 20), the first liquid chamber 54a and the second liquid chamber 54b are arranged adjacent to each other, and the second liquid chamber 54b and the third liquid chamber 54c are arranged adjacent to each other. In some other embodiments, the number of liquid chambers 54 may be one, two, or more.

[0090] In some embodiments, each liquid chamber 54 includes a flow chamber 540 and a heat exchange chamber 543. The flow chamber 540 includes a distribution chamber 541 and a collection chamber 542. The distribution chamber 541 extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and has a mounting opening 5410 located on a first mounting surface 51. In the X-axis direction (i.e., the length direction of the radiator 20), the collection chamber 542 is located on one side of the distribution chamber 541 and spaced apart from it. The collection chamber 542 extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and has a mounting opening 5420 located on the first mounting surface 51. It can be understood that the intermediate structure 50 has multiple flow chambers 540. The multiple flow chambers 540 are arranged sequentially along the X-axis direction (i.e., the length direction of the radiator 20). Each flow chamber 540 includes a dispensing chamber 541 and a collecting chamber 542 that are spaced apart from each other.

[0091] In the X-axis direction (i.e., the length direction of the radiator 20), the heat exchange cavity 543 is located on one side of the liquid collection cavity 542 and close to the liquid distribution cavity 541, with the heat exchange cavity 543 and the liquid collection cavity 542 spaced apart. In the Z-axis direction (i.e., the thickness direction of the radiator 20), the heat exchange cavity 543 is located on one side of the liquid distribution cavity 541 and spaced apart from the liquid distribution cavity 541. The heat exchange cavity 543 extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and has a mounting opening 5430, which is located on the second mounting surface 52. The projection of the heat exchange cavity 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlaps with the projection of the liquid distribution cavity 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20). It can be understood that the intermediate structure 50 is provided with multiple heat exchange cavities 543, which are arranged sequentially along the X-axis direction. Each heat exchange chamber 543 corresponds to a flow chamber 540.

[0092] It is understood that in each liquid chamber 54, the liquid distribution chamber 541, the liquid collection chamber 542, and the heat exchange chamber 543 all extend along the Z-axis direction (i.e., the thickness direction of the radiator 20) and have mounting openings. The orientation of the mounting opening 5430 of the heat exchange chamber 543 is opposite to the orientation of the mounting opening 5410 of the liquid distribution chamber 541 and the orientation of the mounting opening 5420 of the liquid collection chamber 542.

[0093] The liquid collection chamber 542 includes a first segment 5421 and a second segment 5422. In the X-axis direction (i.e., the length direction of the radiator 20), the second segment 5422 is located to one side of the first segment 5421 and communicates with it. The first segment 5421 is located to one side of the liquid distribution chamber 541 and the heat exchange chamber 543, and is spaced apart from both. The second segment 5422 is close to both the liquid distribution chamber 541 and the heat exchange chamber 543. In the Y-axis direction (i.e., the width direction of the radiator 20), the second segment 5422 is located to one side of the heat exchange chamber 543 and the liquid distribution chamber 541, and is spaced apart from both. The first segment 5421 extends from the first mounting surface 51 along the Z-axis toward the second mounting surface 52, and the second segment 5422 extends from the first mounting surface 51 along the Z-axis to the second mounting surface 52, and the second segment 5422 penetrates the intermediate structure 50 along the Z-axis. In some other embodiments, the second segment 5422 may not extend to the second mounting surface 52, and the second segment 5422 may not penetrate the intermediate structure 50 along the Z-axis.

[0094] For example, there are multiple second segments 5422. Specifically, there are two second segments 5422, each divided into a first sub-segment 5422a and a second sub-segment 5422b. In other words, the second segment 5422 includes the first sub-segment 5422a and the second sub-segment 5422b. In the Y-axis direction (i.e., the width direction of the radiator 20), the first sub-segment 5422a and the second sub-segment 5422b are located on both sides of the liquid distribution chamber 541, and are spaced apart from the liquid distribution chamber 541. Also in the Y-axis direction (i.e., the width direction of the radiator 20), the first sub-segment 5422a and the second sub-segment 5422b are located on both sides of the heat exchange chamber 543, and are spaced apart from the heat exchange chamber 543.

[0095] The sum of the dimensions of the liquid distribution chamber 541 and the heat exchange chamber 543 in the Z-axis direction is equal to the dimension of the liquid collection chamber 542 in the Z-axis direction. That is, the dimension of the liquid collection chamber 542 in the Z-axis direction (i.e., the thickness direction of the radiator 20) is greater than the dimension of the liquid distribution chamber 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20). In some other embodiments, the sum of the dimensions of the liquid distribution chamber 541 and the heat exchange chamber 543 in the Z-axis direction may also be greater than or less than the dimension of the liquid collection chamber 542 in the Z-axis direction. The ratio of the dimension of the liquid distribution chamber 541 in the Z-axis direction to the dimension of the heat exchange chamber 543 in the Z-axis direction is greater than or equal to 0.5. In some other embodiments, the ratio of the dimension of the liquid distribution chamber 541 in the Z-axis direction to the dimension of the heat exchange chamber 543 in the Z-axis direction may also be less than 0.5.

[0096] The liquid distribution chamber 541 includes a liquid distribution chamber wall 5411, which faces away from the second mounting surface 52 and away from the heat exchange chamber 543 in the Z-axis direction. The first segment 5421 of the liquid collection chamber 542 includes a liquid collection chamber wall 5423. In other words, the liquid collection chamber 542 includes a liquid collection chamber wall 5423. In the Z-axis direction, the liquid collection chamber wall 5423 faces away from the second mounting surface 52. In the Z-axis direction, the liquid collection chamber wall 5423 is located between the liquid distribution chamber wall 5411 and the second mounting surface 52. The heat exchange chamber 543 includes a first wall 5431, a second wall 5432, and a third wall 5433. In the X-axis direction, the second wall 5432 and the third wall 5433 are connected to both sides of the first wall 5431. In the Z-axis direction, the first wall surface 5431 faces away from the liquid distribution chamber wall surface 5411.

[0097] In the X-axis direction, a connecting sub-wall 544 is provided between the liquid distribution chamber 541 and the first segment 5421 of the liquid collection chamber 542. The liquid distribution chamber 541 and the first segment 5421 are spaced apart by the connecting sub-wall 544. The connecting sub-wall 544 is located between the heat exchange chamber 543 and the first segment 5421, and the heat exchange chamber 543 is spaced apart from the first segment 5421 by the connecting sub-wall 544. The surface of the connecting sub-wall 544 facing the heat exchange chamber 543 is a third wall surface 5433.

[0098] In the Y-axis direction, a partition wall 545 is provided between the liquid distribution chamber 541 and the second segment 5422 of the liquid collection chamber 542. In the X-axis direction, the partition wall 545 is disposed on one side of the connecting wall 544 and faces away from the first segment 5421, and the partition wall 545 is fixedly stacked on one side of the connecting wall 544 and faces away from the first segment 5421. The liquid distribution chamber 541 and the second segment 5422 are spaced apart by the partition wall 545. In addition, in the Y-axis direction, the partition wall 545 is located between the heat exchange chamber 543 and the second segment 5422, and the heat exchange chamber 543 is spaced apart from the second segment 5422 by the partition wall 545. That is to say, in the Y-axis direction (i.e., the width direction of the radiator 20), a partition wall 545 is provided between the liquid collection chamber 542 and the heat exchange chamber 543, and the partition wall 545 is located between the liquid collection chamber 542 and the liquid distribution chamber 541.

[0099] The partition wall 545 includes a first partition wall 545a and a second partition wall 545b. In the Y-axis direction, the first partition wall 545a is located between the heat exchange chamber 543 and the first sub-segment 5422a, and the first partition wall 545a is located between the liquid distribution chamber 541 and the first sub-segment 5422a. In the Y-axis direction, the second partition wall 545b is located between the heat exchange chamber 543 and the second sub-segment 5422b, and the second partition wall 545b is located between the liquid distribution chamber 541 and the second sub-segment 5422b.

[0100] In the Z-axis direction (i.e., the thickness direction of the radiator 20), a partition wall 546 is provided between the liquid distribution chamber 541 and the heat exchange chamber 543. In the X-axis direction, the partition wall 546 is disposed on one side of the connecting sub-wall 544 and faces the partition sub-wall 545, and the partition wall 546 is fixedly stacked on one side of the connecting sub-wall 544 and faces the partition sub-wall 545. In the Y-axis direction, the partition wall 546 is disposed between the first partition sub-wall 545a and the second partition sub-wall 545b, and the partition wall 546 is fixedly stacked between the first partition sub-wall 545a and the second partition sub-wall 545b. That is to say, in the Y-axis direction (i.e., the width direction of the radiator 20), the partition sub-wall 545 is disposed on one side of the partition wall 546. Among them, the surface of the partition wall 546 facing the liquid distribution chamber 541 is the liquid distribution chamber wall surface 5411, and the surface of the partition wall 546 facing the heat exchange chamber 543 is the first wall surface 5431.

[0101] As shown in Figures 7, 8, and 10, in some embodiments, the intermediate structure 50 is provided with jet holes 547. That is, the housing 1 (as shown in Figure 5) is provided with jet holes 547, and the jet holes 547 are disposed in the intermediate structure 50. Specifically, the isolation wall 546 is provided with jet holes 547. The jet holes 547 extend along the Z-axis direction (i.e., the thickness direction of the radiator 20). Specifically, the jet holes 547 extend from the liquid distribution chamber wall surface 5411 along the Z-axis direction to the first wall surface 5431. The jet holes 547 penetrate the isolation wall 546 along the Z-axis direction (i.e., the thickness direction of the radiator 20). The jet holes 547 communicate with the liquid distribution chamber 541 and the heat exchange chamber 543. The liquid distribution chamber 541 and the heat exchange chamber 543 are connected through the jet holes. Exemplarily, the jet holes 547 include a first jet hole 547a and a second jet hole 547b. There are multiple first jet holes 547a. Specifically, there are six first jet holes 547a. In some other embodiments, the number of first jet holes 547a may be one, two, or more. Multiple first jet holes 547a are spaced apart in the Y-axis direction (i.e., the width direction of the heat sink 20).

[0102] The number of second jet holes 547b is multiple. Specifically, there are six second jet holes 547b. In some other embodiments, the number of second jet holes 547b may also be one, two, or more. In the Y-axis direction (i.e., the width direction of the heat sink 20), the multiple second jet holes 547b are spaced apart. In the X-axis direction, the multiple second jet holes 547b are located on one side of the multiple first jet holes 547a and face the liquid collection chamber 542, and the multiple second jet holes 547b are spaced apart from the multiple first jet holes 547a. The projections of the multiple second jet holes 547b in the X-axis direction overlap one-to-one with the projections of the multiple first jet holes 547a in the X-axis direction. It can be understood that the number of jet holes 547 is multiple. In some other embodiments, the number of jet holes 547 may also be one.

[0103] As shown in Figures 7, 8, and 11, the intermediate structure 50 is provided with a flow hole 548. In other words, the shell 1 (as shown in Figure 5) is provided with a flow hole 548, which is located in the intermediate structure 50. Specifically, the partition wall 545 is provided with a flow hole 548. That is to say, the flow hole 548 is located in the intermediate structure 50. The flow hole 548 extends along the Y-axis direction (i.e., the width direction of the radiator 20) and penetrates the partition wall 545 along the Y-axis direction (i.e., the width direction of the radiator 20). The flow hole 548 communicates with the heat exchange chamber 543 and the second section 5422, and also communicates with the liquid collection chamber 542 and the heat exchange chamber 543. The liquid collection chamber 542 and the heat exchange chamber 543 are connected through the flow hole 548. In the Y-axis direction, the flow hole 548 is located on one side of the first jet hole 547a and the second jet hole 547b. In the X-axis direction, the flow hole 548 is located between the first jet hole 547a and the second jet hole 547b. In other words, in the Y-axis direction (i.e., the width direction of the radiator 20), the first jet hole 547a and the second jet hole 547b are located on one side of the flow hole 548. In the X-axis direction (i.e., the length direction of the radiator 20), the first jet hole 547a is located on one side of the flow hole 548 and faces away from the liquid collection chamber 542, and the second jet hole 547b is located on one side of the flow hole 548 and faces away from the first jet hole 547a.

[0104] In the Y-axis direction (i.e., the width direction of the radiator 20), the second segment 5422 is located on one side of the heat exchange chamber 543 and the liquid distribution chamber 541. The second segment 5422 is spaced apart from the heat exchange chamber 543 and the liquid distribution chamber 541. The flow hole 548 extends along the Y-axis direction (i.e., the width direction of the radiator 20). The design of the flow hole 548 communicating with the heat exchange chamber 543 and the second segment 5422, while ensuring that the liquid collection chamber 542 and the heat exchange chamber 543 can be communicated through the flow hole 548, is conducive to reducing the size of the liquid chamber 54 in the X-axis direction (i.e., the length direction of the radiator 20), which is conducive to reducing the size of the power module 200 in the X-axis direction (i.e., the length direction of the radiator 20), and is conducive to the miniaturization design of the power module 200.

[0105] For example, the flow hole 548 includes a first flow hole 548a and a second flow hole 548b. The first flow hole 548a extends through the first partition wall 545a along the Y-axis direction. The first flow hole 548a extends along the Y-axis direction and communicates with the heat exchange cavity 543 and the first sub-segment 5422a. The second flow hole 548b extends through the second partition wall 545b along the Y-axis direction. The second flow hole 548b extends along the Y-axis direction and communicates with the heat exchange cavity 543 and the second sub-segment 5422b. It can be understood that in the Y-axis direction (i.e., the width direction of the radiator 20), the first flow hole 548a and the second flow hole 548b are located on both sides of the heat exchange cavity 543.

[0106] It is understood that the number of flow holes 548 is two. In some other embodiments, the flow holes 548 may also include only a first flow hole 548a or a second flow hole 548b, that is, the number of flow holes 548 may also be one. The number of first flow holes 548a and the number of second flow holes 548b may also be two, three, or more, with multiple first flow holes 548a spaced apart along the X-axis and multiple second flow holes 548b spaced apart along the X-axis. That is to say, the number of flow holes 548 may also be three, four, or more.

[0107] As shown in Figures 7, 8, and 9, in the X-axis direction, the collecting chamber 542 of the first liquid chamber 54a is connected to the distributing chamber 541 of the second liquid chamber 54b, and the collecting chamber 542 of the second liquid chamber 54b is connected to the collecting chamber 542 of the third liquid chamber 54c. In the X-axis direction, the heat exchange chambers 543 of the first liquid chamber 54a and the second liquid chamber 54b are spaced apart, and the heat exchange chambers 543 of the second liquid chamber 54b and the third liquid chamber 54c are spaced apart. That is, in two adjacent liquid chambers 54, the collecting chamber 542 of one liquid chamber 54 is connected to the distributing chamber 541 of the other liquid chamber 54, and the heat exchange chambers 543 of one liquid chamber 54 are spaced apart. In other words, in two adjacent flow chambers 540, the collection chamber 542 of one flow chamber 540 is connected to the distribution chamber 541 of the other flow chamber 540. Two adjacent heat exchange chambers 543 are arranged at intervals.

[0108] In some embodiments, the intermediate structure 50 is provided with a mating cavity 55, which is located between two adjacent liquid cavities 54. In other words, a mating cavity 55 is provided between two adjacent liquid cavities 54, and the mating cavity 55 communicates with the two adjacent liquid cavities 54. Specifically, in two adjacent liquid cavities 54, the collecting cavity 542 of one liquid cavity 54 communicates with the mating cavity 55. Specifically, the first segment 5421 of the collecting cavity 542 of one liquid cavity 54 communicates with the mating cavity 55. The distributing cavity 541 of the other liquid cavity 54 communicates with the mating cavity 55. That is to say, a mating cavity 55 is provided between two adjacent flow cavities 540, and the mating cavity 55 is located between the collecting cavity 542 of one flow cavity 540 and the distributing cavity 541 of the other flow cavity 540. The mating cavity 55 is connected to the collecting cavity 542 adjacent to the mating cavity 55. The mating cavity 55 is connected to the distributing cavity 541 adjacent to the mating cavity 55.

[0109] In the Y-axis direction, the mating cavity 55 is located between and spaced apart from the two rows of corresponding mounting holes 53. The mating cavity 55 extends along the Z-axis direction and has a mating opening 550 located on the first mounting surface 51. Exemplarily, there are multiple mating cavities 55, specifically, there are two mating cavities 55. In some other embodiments, the number of mating cavities 55 may also be one, three, or more.

[0110] In the X-axis direction, a mating cavity 55 is disposed between the first segment 5421 of the collecting cavity 542 of the first liquid cavity 54a and the distributing cavity 541 of the second liquid cavity 54b. The mating cavity 55 communicates with the first segment 5421 of the first liquid cavity 54a and the distributing cavity 541 of the second liquid cavity 54b. In other words, in the X-axis direction, a mating cavity 55 is provided between the collecting cavity 542 of the first liquid cavity 54a and the distributing cavity 541 of the second liquid cavity 54b, and the mating cavity 55 communicates with the collecting cavity 542 of the first liquid cavity 54a and the distributing cavity 541 of the second liquid cavity 54b. In the X-axis direction, another mating cavity 55 is disposed between the collecting cavity 542 of the second liquid cavity 54b and the distributing cavity 541 of the third liquid cavity 54c. In other words, in the X-axis direction, a mating cavity 55 is provided between the liquid collecting cavity 542 of the second liquid cavity 54b and the liquid distributing cavity 541 of the third liquid cavity 54c, and the mating cavity 55 is connected to the liquid collecting cavity 542 of the second liquid cavity 54b and the liquid distributing cavity 541 of the third liquid cavity 54c.

[0111] From the liquid collecting chamber 542 of the first liquid chamber 54a toward the liquid distributing chamber 541 of the second liquid chamber 54b, the dimension of the mating cavity 55 in the Z-axis direction gradually decreases. From the second liquid chamber 54b toward the third liquid chamber 54c, the dimension of the mating cavity 55 in the Z-axis direction gradually decreases. That is to say, from the liquid collecting chamber 542 adjacent to the mating cavity 55 toward the liquid distributing chamber 541 adjacent to the mating cavity 55, the dimension of the mating cavity 55 in the Z-axis direction (i.e., the thickness direction of the radiator 20) gradually decreases.

[0112] Specifically, each mating cavity 55 includes a mating wall surface 551, which faces away from the second mounting surface 52 in the Z-axis direction. In two liquid cavities 54 adjacent to the mating cavity 55, the mating wall surface 551 connects the collecting cavity wall surface 5423 of the collecting cavity 542 of one liquid cavity 54 with the distributing cavity wall surface 5411 of the distributing cavity 541 of the other liquid cavity 54. The mating wall surface 551 is inclined relative to the collecting cavity wall surface 5423 towards the distributing cavity wall surface 5411 in the X-axis direction, and the length direction of the mating wall surface 551 is inclined to the length direction (i.e., the X-axis direction) of the collecting cavity wall surface 5423. The ratio of the length of the mating wall surface 551 to the length of the collecting cavity wall surface 5423 is greater than or equal to 0.5. In some other embodiments, the ratio of the length of the mating wall surface 551 to the length of the collecting cavity wall surface 5423 may be less than 0.5. The mating cavity 55 may also be omitted.

[0113] In some embodiments, the intermediate structure 50 is provided with a liquid inlet cavity 56. In the X-axis direction, the liquid inlet cavity 56 is located on one side of the distributing cavity 541 of the first liquid cavity 54a (i.e., liquid cavity 54) and faces away from the collecting cavity 542. The liquid inlet cavity 56 communicates with the distributing cavity 541 and is spaced apart from the heat exchange cavity 543. In the Y-axis direction, the liquid inlet cavity 56 is located between two rows of corresponding mounting holes 53 and spaced apart from them. The liquid inlet cavity 56 extends along the Z-axis direction and has a liquid inlet opening 560, which is located on the first mounting surface 51. The dimension of the liquid inlet cavity 56 in the Z-axis direction is equal to the sum of the dimensions of the distributing cavity 541 and the heat exchange cavity 543 in the Z-axis direction. That is, the dimension of the liquid inlet cavity 56 in the Z-axis direction is greater than the dimension of the distributing cavity 541 in the Z-axis direction. In some other embodiments, the dimension of the liquid inlet chamber 56 in the Z-axis direction may be greater than or less than the sum of the dimensions of the liquid distribution chamber 541 in the Z-axis direction and the dimensions of the heat exchange chamber 543 in the Z-axis direction.

[0114] In some embodiments, the intermediate structure 50 is provided with a corresponding mating cavity 57, which is located between the liquid inlet cavity 56 and the liquid distribution cavity 541 of the first liquid cavity 54a. In other words, a corresponding mating cavity 57 is provided between the liquid inlet cavity 56 and the liquid distribution cavity 541 of the first liquid cavity 54a (i.e., liquid cavity 54), and the corresponding mating cavity 57 communicates with both the liquid inlet cavity 56 and the liquid distribution cavity 541. The liquid inlet cavity 56 and the liquid distribution cavity 541 are connected through the corresponding mating cavity 57. In the Y-axis direction, the liquid inlet cavity 56 is located between two rows of corresponding mounting holes 53 and is spaced apart from the two rows of corresponding mounting holes 53. The corresponding mating cavity 57 extends along the Z-axis direction and has a corresponding mating opening 570, which is located on the first mounting surface 51. Among them, from the liquid inlet cavity 56 toward the liquid distribution cavity 541 of the first liquid cavity 54a, the size of the corresponding mating cavity 57 in the Z-axis direction gradually decreases. That is, in the adjacent liquid inlet chamber 56 and liquid chamber 54, the dimension of the corresponding mating chamber 57 gradually decreases in the Z-axis direction from the liquid inlet chamber 56 toward the liquid chamber 54 towards the liquid chamber 54. For details, please refer to the relevant description of the mating chamber 55, which will not be repeated here.

[0115] In some embodiments, the intermediate structure 50 is provided with a first mating hole 58 and a second mating hole 59. Specifically, the first mating hole 58 penetrates the intermediate structure 50 along the Z-axis. The projection of the first mating hole 58 in the Z-axis direction overlaps with the projection of the liquid inlet cavity 56 in the Z-axis direction. The first mating hole 58 communicates with the liquid inlet cavity 56. That is, the first mating hole 58 communicates with the liquid distribution cavity 541 of the first liquid cavity 54 (i.e., liquid cavity 54). The second mating hole 59 penetrates the intermediate structure 50 along the Z-axis direction. The projection of the second mating hole 59 in the Z-axis direction overlaps with the projection of the liquid collection cavity 542 of the third liquid cavity 54c in the Z-axis direction. The second mating hole 59 communicates with the liquid collection cavity 542 of the third liquid cavity 54c (i.e., liquid cavity 54). In other embodiments, the first mating hole 58 and the second mating hole 59 may be omitted.

[0116] As shown in Figures 3, 4, and 5, the inlet 560 of the inlet chamber 56, the corresponding mating opening 570 of the mating chamber 57, the mounting opening 5410 of the dispensing chamber 541 of each liquid chamber 54, the mounting opening 5420 of the collecting chamber 542 of each liquid chamber 54, and the mating opening 550 of each mating chamber 55 all face the first plate 30. That is, the mounting opening 5410 of the dispensing chamber 541 and the mounting opening 5420 of the collecting chamber 542 face the first plate 30. The inlet 560 of the inlet chamber 56, the corresponding mating opening 570 of the mating chamber 57, the mounting opening 5410 of the dispensing chamber 541 of each liquid chamber 54, the mounting opening 5420 of the collecting chamber 542 of each liquid chamber 54, and the mating opening 550 of each mating chamber 55 are covered by the first plate 30. In other words, the first plate 30 covers the inlet 560 of the liquid inlet cavity 56. The first plate 30 covers the corresponding mating opening 570 of the mating cavity 57. The first plate 30 covers the mounting opening 5410 of the liquid distribution cavity 541. The first plate 30 covers the mounting opening 5420 of the liquid collection cavity 542. The first plate 30 covers the mating opening 550 of the mating cavity 55. The first plate 30 abuts against the connecting sub-wall 544 and the separating sub-wall 545. That is to say, multiple liquid flow cavities 540 are formed between the first plate 30 and the intermediate structure 50.

[0117] The mounting opening 5430 of the heat exchange chamber 543 of each liquid chamber 54 faces the second plate 40. That is, the mounting opening 5430 of the heat exchange chamber 543 faces the second plate 40. The mounting opening 5430 of the heat exchange chamber 543 of each liquid chamber 54, the second section 5422 of the liquid collection chamber 542 of each liquid chamber 54, the first mating hole 58, and the second mating hole 59 are all covered by the second plate 40. In other words, the second plate 40 covers the first mating hole 58 and the second mating hole 59. The second plate 40 covers the mounting opening 5430 of the heat exchange chamber 543. The second plate 40 covers the second section 5422 of the liquid collection chamber 542. The second plate 40 abuts against the connecting sub-wall 544 and the separating sub-wall 545. In other words, multiple heat exchange chambers 543 are formed between the intermediate structure 50 and the second plate 40.

[0118] It can be understood that, in the Z-axis direction, multiple power units 10 are fixedly stacked on one side of the second plate 40 and away from the heat exchange cavity 543. Each power unit 10 is located on one side of the second plate 40 and away from the heat exchange cavity 543. In the Z-axis direction (the thickness direction of the heat sink 20), the substrate 11 of the power unit 10 is located on one side of the heat exchange cavity 543 and away from the liquid distribution cavity 541, and the power device 12 faces away from the housing 1. Each power unit 10 corresponds to one liquid cavity 54. Each power unit 10 corresponds to one liquid flow cavity 540 and one heat exchange cavity 543.

[0119] In this configuration, the projections of multiple power units 10 in the Z-axis direction overlap one-to-one with the projections of the heat exchange chambers 543 of the multiple liquid chambers 54 in the Z-axis direction. That is, the projections of multiple power units 10 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlap one-to-one with the projections of the multiple heat exchange chambers 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20). In the corresponding power units 10 and liquid chambers 54, the projections of multiple first power devices 12a of the power unit 10 in the Z-axis direction overlap one-to-one with the projections of multiple first jet holes 547a of the liquid chamber 54 in the Z-axis direction, and the projections of multiple second power devices 12b of the power unit 10 in the Z-axis direction overlap one-to-one with the projections of multiple second jet holes 547b of the liquid chamber 54 in the Z-axis direction.

[0120] In other words, the projections of multiple first power devices 12a in the Z-axis direction overlap one-to-one with the projections of multiple first jet holes 547a in the Z-axis direction, and the projections of the first power devices 12a in the Z-axis direction overlap with the projections of the first jet holes 547a in the Z-axis direction. Similarly, the projections of multiple second power devices 12b in the Z-axis direction overlap one-to-one with the projections of multiple second jet holes 547b in the Z-axis direction, and the projections of the second power devices 12b in the Z-axis direction overlap with the projections of the second jet holes 547b in the Z-axis direction. Furthermore, the projection of the power device 12 in the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​overlaps with the projection of the jet hole 547 in the Z-axis direction (i.e., the thickness direction of the heat sink 20).

[0121] As shown in Figures 3, 5, and 6, in the X-axis direction, the first connector 2 and the second connector 3 are located on both sides of the plurality of liquid chambers 54. The first connector 2 is located on one side of the first liquid chamber 54a and away from the second liquid chamber 54b. Specifically, the first connector 2 is located on one side of the liquid distribution chamber 541 of the first liquid chamber 54a and away from the liquid collection chamber 542. The liquid inlet channel 201 of the first connector 2 is connected to the liquid inlet chamber 56. The projection of the liquid inlet channel 201 in the Z-axis direction overlaps with the projection of the first mating hole 58 in the Z-axis direction. It can be understood that in the X-axis direction (i.e., the length direction of the radiator 20), the liquid inlet 60 is located on one side of the liquid distribution chamber 541 of the first liquid chamber 54a and away from the liquid collection chamber 542. The liquid inlet 60 is connected to the liquid inlet chamber 56. The liquid inlet 60 is connected to the liquid distribution chamber 541 of the first liquid chamber 54a via the liquid inlet chamber 56 and the corresponding mating chamber 57. In other words, the liquid inlet 60 extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and is connected to the liquid distribution chamber 541. The projection of the liquid inlet 60 in the Z-axis direction overlaps with the projection of the first mating hole 58 in the Z-axis direction.

[0122] The second connector 3 is located on one side of the third liquid chamber 54c and away from the second liquid chamber 54b. Specifically, the second connector 3 is located on one side of the distribution chamber 541 of the third liquid chamber 54c and away from the second liquid chamber 54b. The outlet channel 301 of the second connector 3 is connected to the collection chamber 542 of the third liquid chamber 54c. The projection of the outlet channel 301 in the Z-axis direction overlaps with the projection of the second mating hole 59 in the Z-axis direction. It can be understood that in the X-axis direction (i.e., the length direction of the radiator 20), the outlet 70 is located on one side of the distribution chamber 541 of the third liquid chamber 54c and close to the collection chamber 542 of the third liquid chamber 54c. The outlet 70 is connected to the collection chamber 542 of the third liquid chamber 54c. In other words, the liquid outlet 70 extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and communicates with the liquid collection chamber 542. The projection of the liquid outlet 70 in the Z-axis direction overlaps with the projection of the second mating hole 59 in the Z-axis direction.

[0123] It can be understood that, along the X-axis (i.e., the length direction of the radiator 20), the liquid inlet 60, multiple liquid chambers 54, and the liquid outlet 70 are sequentially arranged. In adjacent liquid chambers 54 (i.e., the first liquid chamber 54a) and the liquid inlet 60, the liquid inlet 60 is connected to the distribution chamber 541 of the liquid chamber 54. In adjacent liquid chambers 54 (i.e., the third liquid chamber 54c) and the liquid outlet 70, the liquid outlet 70 is connected to the collection chamber 542 of the liquid chamber 54. The liquid inlet 60 is connected to the distribution chamber 541 of one of the multiple liquid chambers 540. The liquid outlet 70 is connected to the collection chamber 542 of another liquid chamber 540 among the multiple liquid chambers 540.

[0124] In this embodiment, the liquid inlet 60 is disposed on the first plate 30 and communicates with the liquid distribution chamber 541 of the first liquid chamber 54a (i.e., liquid chamber 54). In some other embodiments, the liquid inlet 60 may also be disposed on the second plate 40 and communicate with the liquid distribution chamber 541 of the first liquid chamber 54a (i.e., liquid chamber 54). Specifically, the liquid inlet 60 disposed on the second plate 40 communicates with the first mating hole 58. Through the first mating hole 58, the liquid inlet 60 communicates with the liquid distribution chamber 541 of the first liquid chamber 54a. The liquid outlet 70 is disposed on the first plate 30 and communicates with the liquid collection chamber 542 of the third liquid chamber 54c (i.e., liquid chamber 54). In some other embodiments, the liquid outlet 70 may also be disposed on the second plate 40 and communicate with the liquid collection chamber 542 of the third liquid chamber 54c (i.e., liquid chamber 54). Specifically, the liquid outlet 70 disposed on the second plate 40 communicates with the second mating hole 59. The liquid outlet 70 is connected to the liquid collection chamber 542 of the third liquid chamber 54c through the second mating hole 59.

[0125] The first connector 2 receives the cooling medium through the liquid inlet channel 201. The cooling medium flows into the liquid inlet chamber 56 from the liquid inlet channel 201, and then into the radiator 20 from the liquid inlet port 60. The cooling medium flows out of the radiator 20 from the liquid collection chamber 542 of the third liquid chamber 54c through the liquid outlet channel 301, and then out of the radiator 20 from the liquid collection chamber 542 of the third liquid chamber 54c through the liquid outlet port 70. In some other embodiments, the first connector 2 and the second connector 3 may be omitted, and the cooling medium flows directly into the radiator 20 from the liquid inlet port 60 and directly out of the radiator 20 from the liquid outlet port 70. The cooling medium may be, but is not limited to, water, alcohol, or other fluids with good thermal conductivity.

[0126] As shown in Figures 4, 5, and 11, the cooling medium flows into the inlet chamber 56 from the inlet channel 201. The cooling medium also flows into the inlet chamber 56 from the inlet port 60 (as shown in Figure 6). From the inlet chamber 56, the cooling medium flows into the first liquid chamber 54a via the corresponding mating chamber 57. From the first liquid chamber 54a, the cooling medium flows into the second liquid chamber 54b via the mating chamber 55. Specifically, the cooling medium flows from the corresponding mating cavity 57 into the distribution cavity 541 of the first liquid cavity 54. From the distribution cavity 541, the cooling medium flows from the distribution cavity 541 into the heat exchange cavity 543 through multiple first jet holes 547a and multiple second jet holes 547b. From the heat exchange cavity 543, the cooling medium flows from the heat exchange cavity 543 into the first sub-section 5422a of the collection cavity 542 through the first flow hole 548a. From the heat exchange cavity 543, the cooling medium flows from the heat exchange cavity 543 into the second sub-section 5422b of the collection cavity 542. The cooling medium then flows from the first sub-section 5422a and the second sub-section 5422b into the first section 5421 of the collection cavity 542. That is, the cooling medium flows from the heat exchange cavity 543 into the second section 5422 of the collection cavity 542, and then from the second section 5422 into the first section 5421. The cooling medium flows from the first section 5421 of the collecting chamber 542 of the first liquid chamber 54a into the distributing chamber 541 of the second liquid chamber 54b via the mating chamber 55. That is, the cooling medium flows from the collecting chamber 542 of the first liquid chamber 54a into the distributing chamber 541 of the second liquid chamber 54b via the mating chamber 55.

[0127] The cooling medium flows from the second liquid chamber 54b into the third liquid chamber 54c via the mating chamber 55, and then flows from the third liquid chamber 54c out of the radiator 20 via the outlet channel 301. Specifically, the cooling medium flows from the collection chamber 542 of the third liquid chamber 54c out of the radiator 20 via the outlet channel 301. The cooling medium then flows from the collection chamber 542 of the third liquid chamber 54c out of the radiator 20 via the outlet 70 (as shown in Figure 6). For details, please refer to the explanations regarding the flow of the cooling medium into the first liquid chamber 54a and from the first liquid chamber 54a into the second liquid chamber 54b; these will not be repeated here. It can be understood that the cooling medium flows from the inlet 60 (as shown in Figure 6), the distribution chamber 541, the jet orifice 547, the heat exchange chamber 543, the flow orifice 548, and the collection chamber 542 to the outlet 70 (as shown in Figure 6).

[0128] As shown in Figures 3, 4 and 5, in the power module 200 provided in this application embodiment, the cooling working fluid can flow into the radiator 20 from the liquid inlet 60 (as shown in Figure 6) and then flow out of the radiator 20 from the liquid outlet 70. The cooling medium flows from the inlet 60 into the distribution chamber 541 of a flow chamber 540 (i.e., the flow chamber 540 of the first liquid chamber 54a), from the distribution chamber 541 into the heat exchange chamber 543 corresponding to the flow chamber 540 via the jet hole 547, from the heat exchange chamber 543 into the collection chamber 542 via the flow hole 548, and then into the distribution chamber 541 of another flow chamber 540 (i.e., the flow chamber 540 of the third liquid chamber 54c), from the distribution chamber 541 into the heat exchange chamber 543 corresponding to the flow chamber 540 via the jet hole 547, from the heat exchange chamber 543 into the collection chamber 542 via the flow hole 548, and then out of the collection chamber 542 from the outlet 70.

[0129] Since the projections of multiple power units 10 on the Z-axis direction (i.e., the thickness direction of the radiator 20) overlap one-to-one with the projections of multiple heat exchange chambers 543 on the Z-axis direction (i.e., the thickness direction of the radiator 20), the heat generated by the multiple power units 10 during operation is transferred one-to-one to the cooling medium in the multiple heat exchange chambers 543 along the Z-axis direction (i.e., the thickness direction of the radiator 20). The cooling medium flowing out of the radiator 20 from the heat exchange chambers 543 can transfer the heat generated by the multiple power units 10 during operation to the external environment, thereby achieving rapid heat dissipation of the multiple power units 10. Specifically, most of the heat generated by the power device 12 of each power unit 10 during operation is transferred along the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​through the substrate 11 and the second plate 40 to the cooling medium in the heat exchange cavity 543. That is, the heat generated by the power unit 10 during operation is transferred along the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​through the second plate 40 to the cooling medium in the heat exchange cavity 543. The cooling medium flowing out of the heat sink 20 from the heat exchange cavity 543 carries the heat generated by the power unit 10 during operation out of the heat sink 20, thereby achieving rapid heat dissipation of the power unit 10.

[0130] Compared to the existing power module 200, in the power module 200 provided in this application embodiment, since the projection of the heat exchange cavity 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlaps with the projection of the liquid distribution cavity 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20), and the heat exchange cavity 543 is connected to the liquid distribution cavity 541 through the jet hole 547, the cooling medium can flow from the liquid distribution cavity 541 of each liquid flow cavity 540 into the corresponding heat exchange cavity 543 along the Z-axis direction (i.e., the thickness direction of the radiator 20) through the jet hole 547. The cooling medium in the multiple heat exchange cavities 543 can perform overall heat dissipation on the multiple power units 10 one by one, which is beneficial to improving the heat dissipation efficiency of each power unit 10. Moreover, it is beneficial to increase the flow rate of the cooling medium from the liquid distribution cavity 541 of each liquid flow cavity 540 into the corresponding heat exchange cavity 543, which is beneficial to increase the heat exchange capacity of the cooling medium in each heat exchange cavity 543, and is beneficial to improve the heat dissipation efficiency of the multiple power units 10. Since multiple fluid flow chambers 540 are arranged sequentially along the X-axis (i.e., the length direction of the heat sink 20), the power module 200 can avoid occupying too large a size in the Z-axis (i.e., the thickness direction of the heat sink 20), which is beneficial to reducing the size of the heat sink 20 in the Z-axis (i.e., the thickness direction of the heat sink 20), and is beneficial to the miniaturization design of the heat sink 20 and the power module 200.

[0131] It can be understood that most of the heat generated when the power device 12 is working is transferred along the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​through the substrate 11 to the cooling medium in the heat exchange cavity 543, and then transferred to the external environment through the cooling medium, thereby achieving heat dissipation for the power device 12. The design of the projection of the power device 12 in the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​overlapping with the projection of the jet hole 547 in the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​is beneficial to improving the heat dissipation efficiency of the cooling medium flowing into the heat exchange cavity 543 from the jet hole 547 for the power device 12, and is beneficial to improving the heat dissipation efficiency of the power module 200.

[0132] In this embodiment, the projections of multiple first jet holes 547a in the Z-axis direction overlap one-to-one with the projections of multiple first power devices 12a in the Z-axis direction, and the projections of multiple second jet holes 547b in the Z-axis direction overlap one-to-one with the projections of multiple second power devices 12b in the Z-axis direction. This design ensures that the multiple cooling media flowing into the heat exchange cavity 543 from the multiple first jet holes 547a can dissipate heat from the multiple first power devices 12a, which is beneficial to improving the heat dissipation efficiency of the multiple first power devices 12a. Similarly, ensuring that the multiple cooling media flowing into the heat exchange cavity 543 from the multiple second jet holes 547b can dissipate heat from the multiple second power devices 12b is beneficial to improving the heat dissipation efficiency of the multiple second power devices 12b, and thus improving the overall heat dissipation efficiency of the power module 200.

[0133] In other words, the design of the first jet hole 547a and the second jet hole 547b ensures that the cooling medium can flow from the liquid distribution chamber 541 to the heat exchange chamber 543 through the first jet hole 547a and the second jet hole 547b respectively. The cooling medium flowing into the heat exchange chamber 543 from the first jet hole 547a can dissipate heat on the first power device 12, and the cooling medium flowing into the heat exchange chamber 543 from the second jet hole 547b can dissipate heat on the second power device 12b. The cooling medium flowing into the heat exchange chamber 543 from the first jet hole 547a and the second jet hole 547b can dissipate heat on different heat sources of the power unit 10 respectively, which is beneficial to improving the overall heat dissipation efficiency of the power unit 10.

[0134] The substrate 11 is fixedly stacked on one side of the second plate 40 and faces away from the first plate 30. That is, the power unit 10 is fixedly stacked on one side of the second plate 40 and faces away from the first plate 30. This design is beneficial to increasing the contact area between the power unit 10 and the second plate 40, which is beneficial to increasing the efficiency of the heat generated by the power unit 10 during operation to the cooling medium in the heat exchange chamber 543 through the second plate 40, and is beneficial to improving the heat dissipation efficiency of the power unit 10.

[0135] As shown in Figures 3, 9, and 11, the design of the first flow hole 548a and the second flow hole 548b ensures that the cooling medium can flow from the heat exchange chamber 543 to the liquid collection chamber 542 through the first flow hole 548a and the second flow hole 548b, respectively. This is beneficial to increasing the flow rate of the cooling medium flowing from the heat exchange chamber 543 into the liquid collection chamber 542, increasing the flow rate of the cooling medium in the heat exchange chamber 543, reducing the flow resistance of the cooling medium in the heat exchange chamber 543, improving the heat exchange efficiency per unit flow resistance, and reducing the cost of driving the flow of the cooling medium.

[0136] The design of the liquid collecting chamber 542 having a larger dimension in the thickness direction of the radiator 20 than the liquid distributing chamber 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20) ensures that the volume of the liquid collecting chamber 542 can be larger than the volume of the liquid distributing chamber 541. This helps to reduce the flow resistance of the cooling medium in the liquid collecting chamber 542, improve the heat exchange efficiency per unit flow resistance, and reduce the cost of driving the flow of the cooling medium.

[0137] The design of the gradually decreasing size of the corresponding mating cavity 57 in the Z-axis direction (i.e., the thickness direction of the radiator 20) from the liquid inlet cavity 56 toward the first liquid cavity 54a is beneficial to reducing the pressure difference resistance of the cooling medium flowing from the liquid inlet cavity 56 into the liquid distribution cavity 541 of the first liquid cavity 54a through the corresponding mating cavity 57, which is beneficial to reducing the flow resistance of the cooling medium in the liquid inlet cavity 56, improving the heat exchange efficiency per unit flow resistance, and reducing the cost of driving the flow of the cooling medium.

[0138] The design of the gradually decreasing size of the mating cavity 55 in the Z-axis direction (i.e., the thickness direction of the radiator 20) from the liquid collecting cavity 542 adjacent to the mating cavity 55 toward the liquid distributing cavity 541 adjacent to the mating cavity 55 is beneficial to reducing the pressure difference resistance of the cooling medium flowing from the liquid collecting cavity 542 adjacent to the mating cavity 55 through the mating cavity 55 into the liquid distributing cavity 541 adjacent to the mating cavity 55, which is beneficial to reducing the flow resistance of the cooling medium in the liquid collecting cavity 542, which is beneficial to improving the heat exchange efficiency per unit flow resistance, and which is beneficial to reducing the cost of driving the flow of the cooling medium.

[0139] As shown in Figures 3, 7, and 9, in some embodiments, each liquid chamber 54 has a first flow guide 5412 in its dispensing chamber 541. Specifically, in the Z-axis direction, the first flow guide 5412 is disposed on one side of the dispensing chamber wall 5411 and faces away from the heat exchange chamber 543. The first flow guide 5412 is fixedly stacked on one side of the dispensing chamber wall 5411 and faces away from the heat exchange chamber 543. The first flow guide 5412 extends along the Z-axis direction. The first flow guide 5412 extends along the X-axis direction. The first flow guide 5412 is spaced apart from the first jet hole 547a and the second jet hole 547b. In the Z-axis direction, the first flow guide 5412 abuts against the first plate 30.

[0140] For example, the first guide section 5412 includes a first sub-guide section 5412a and a second sub-guide section 5412b. There are eight first sub-guide sections 5412a. In the Y-axis direction, four first sub-guide sections 5412a are arranged at intervals to form one row of first sub-guide sections 5412a. In the X-axis direction, two rows of first sub-guide sections 5412a are arranged at intervals. In the X-axis direction, the two rows of first sub-guide sections 5412a are located between a plurality of first jet holes 547a and a plurality of second jet holes 547b, and both rows of first sub-guide sections 5412a are spaced apart from both the plurality of first jet holes 547a and the plurality of second jet holes 547b. The projections of the plurality of first sub-guide sections 5412a in each row of first sub-guide sections 5412a in the X-axis direction correspond one-to-one with the projections of the plurality of first jet holes 547a in the X-axis direction. Furthermore, the projections of the multiple first sub-guide sections 5412a in the X-axis direction of each column of first sub-guide sections 5412a overlap one-to-one with the projections of the multiple second jet holes 547b in the X-axis direction.

[0141] There are 15 second sub-guide sections 5412b. In the Y-axis direction, 5 second sub-guide sections 5412b are arranged at intervals to form one row of second sub-guide sections 5412b. In the X-axis direction, one row of second sub-guide sections 5412b is located on one side of two rows of first sub-guide sections 5412a and faces multiple first jet holes 547a, one row of second sub-guide sections 5412b is located between two rows of first sub-guide sections 5412a, and one row of second sub-guide sections 5412b is located on one side of two rows of first sub-guide sections 5412a and faces multiple second jet holes 547b.

[0142] In the Y-axis direction, each column of second sub-guide sections 5412b is located one-to-one with a plurality of first jet holes 547a, and each column of second sub-guide sections 5412b is located one-to-one with a plurality of second jet holes 547b. In some other embodiments, the number of first sub-guide sections 5412a and the number of second sub-guide sections 5412b may be one, two, or more. The second sub-guide section 5412b or the first sub-guide section 5412a may also be omitted.

[0143] In the X-axis direction, the cooling medium flows into the distribution chamber 541 from the side opposite to the multiple first jet holes 547a to the multiple second jet holes 547b. The cooling medium first flows through the multiple first jet holes 547a and then into the heat exchange chamber 543; the cooling medium then flows through the multiple second jet holes 547b and then into the heat exchange chamber 543. The design of the multiple second sub-guide sections 5412b ensures that the cooling medium can flow evenly from the distribution chamber 541 into the heat exchange chamber 543 through the multiple first jet holes 547a and through the multiple second jet holes 547b, achieving uniform distribution of the cooling medium and improving the heat dissipation efficiency of the power unit 10.

[0144] The design of multiple first sub-guide sections 5412a guides the cooling medium flowing between multiple first jet holes 547a and multiple second jet holes 547b, which helps to improve the uniformity of the cooling medium flowing from the liquid distribution chamber 541 into the heat exchange chamber 543 through multiple second jet holes 547, and helps to improve the heat dissipation efficiency of the power unit 10.

[0145] As shown in Figures 7, 9, and 11, in some embodiments, the intermediate structure 50 is provided with a partition portion 549. In other words, the housing 1 is provided with a partition portion 549. The partition portion 549 is received in the liquid collection cavity 542. Specifically, the partition portion 549 is received in the first segment 5421 of the liquid collection cavity 542. In the Y-axis direction (i.e., the width direction of the radiator 20), the partition portion 549 is located between the first sub-segment 5422a and the second sub-segment 5422b. That is to say, the partition portion 549 is located between the first flow hole 548a and the second flow hole 548b. The partition portion 549 extends along the Z-axis direction and also extends along the X-axis direction (i.e., the length direction of the radiator 20). In the Z-axis direction, the partition portion 549 abuts against the first plate 30.

[0146] For example, there are three partitions 549. In some other embodiments, there may be one, two, or more partitions 549. The three partitions 549 are a first partition 549a, a second partition 549b, and a third partition 549c. A portion of the first partition 549a is housed in the first segment 5421 of the liquid collection chamber 542 of the first liquid chamber 54a. Another portion of the first partition 549a is housed in the mating cavity 55 between the first liquid chamber 54a and the second liquid chamber 54b. Specifically, in the X-axis direction, the first partition 549a is fixedly stacked on one side of the connecting sub-wall 544 of the first liquid chamber 54a and faces the first segment 5421 of the first liquid chamber 54a. In the Z-axis direction, the first partition portion 549a is fixedly stacked on one side of the liquid collection chamber wall 5423 of the first liquid chamber 54a and faces away from the second mounting surface 52. The first partition portion 549a is also fixedly stacked on one side of the mating wall 551 of the mating cavity 55 between the first liquid chamber 54a and the second liquid chamber 54b and faces away from the second mounting surface 52. In the Y-axis direction, the first partition portion 549a is located between the first sub-segment 5422a and the second sub-segment 5422b of the first liquid chamber 54a. In some other embodiments, the first partition portion 549a may also be entirely housed within the first segment 5421 of the liquid collection chamber 542 of the first liquid chamber 54a.

[0147] A portion of the second partition 549b is housed in the first segment 5421 of the collection chamber 542 of the second liquid chamber 54b. Another portion of the second partition 549b is housed in the mating cavity 55 between the second liquid chamber 54b and the third liquid chamber 54c. In the Y-axis direction, the second partition 549b is located between the first sub-segment 5422a and the second sub-segment 5422b of the second liquid chamber 54b. In some other embodiments, the second partition 549b may also be entirely housed in the first segment 5421 of the second liquid chamber 54b. For details, please refer to the description of the first partition 549a; further elaboration is omitted here.

[0148] The third partition portion 549c is entirely housed within the first segment 5421 of the collection chamber 542 of the third liquid chamber 54c. Specifically, in the X-axis direction, the third partition portion 549c is fixedly stacked on one side of the connecting sub-wall 544 of the third liquid chamber 54c and faces the first segment 5421 of the collection chamber 542, with the third partition portion 549c spaced apart from the second mating hole 59. In the Z-axis direction, the third partition portion 549c is fixedly stacked on one side of the collection chamber wall surface 5423 of the third liquid chamber 54c and faces away from the second mounting surface 52. In the Y-axis direction, the third partition portion 549c is located between the first sub-segment 5422a and the second sub-segment 5422b of the third liquid chamber 54c.

[0149] The design of the baffle 549 can prevent the cooling medium flowing into the first section 5421 from flowing into the first section 5421 from flowing into the first section 5421 from flowing into the second section 5422b. This avoids fluid collision between the cooling medium flowing into the liquid collecting chamber 542 from flowing into the first flow hole 548a and flowing into the liquid collecting chamber 542 from flowing into the second flow hole 548b. This helps to reduce the flow resistance of the cooling medium flowing into the liquid collecting chamber 542 from flowing into the first flow hole 548a, reduces the flow resistance of the cooling medium flowing into the liquid collecting chamber 542 from flowing into the second flow hole 548b, reduces the flow resistance of the cooling medium in the liquid collecting chamber 542, improves the heat exchange efficiency per unit flow resistance, and reduces the cost of driving the flow of the cooling medium.

[0150] As shown in Figures 3, 7, and 9, in some embodiments, the intermediate structure 50 is provided with a second flow guide 501. In other words, the housing 1 is provided with a second flow guide 501. The second flow guide 501 is at least partially housed in the liquid collection chamber 542. Specifically, the second flow guide 501 is at least partially housed in the first segment 5421. The second flow guide 501 is used to guide the cooling working fluid flowing from the second segment 5422 into the first segment 5421 of the liquid collection chamber 542. Specifically, the second flow guide 501 of the first liquid chamber 54a includes a third sub-flow guide 501a and a fourth sub-flow guide 501b. The third sub-flow guide 501a is entirely housed in the first segment 5421 of the liquid collection chamber 542. In the Y-axis direction, the third sub-flow guide 501a is located on one side of the partition 549 of the first liquid chamber 54a and faces the second segment 5422 of the first liquid chamber 54a, and the third sub-flow guide 501a is spaced apart from the partition 549. In the X-axis direction, the third sub-guide section 501a is located on one side of the second segment 5422 of the first liquid cavity 54a and faces the first segment 5421 of the first liquid cavity 54a. The third sub-guide section 501a is inclined relative to the partition portion 549 of the first liquid cavity 54a. Specifically, in the X-axis direction, the end of the third sub-guide section 501a facing away from the second segment 5422 of the first liquid cavity 54a is close to the partition portion 549 of the first liquid cavity 54a along the Y-axis direction.

[0151] The fourth sub-guide section 501b is partially housed in the first segment 5421 of the collection chamber 542 of the first liquid chamber 54a, and partially housed in the mating cavity 55 between the first liquid chamber 54a and the second liquid chamber 54b. In the Y-axis direction, the fourth sub-guide section 501b is located between the partition portion 549 of the first liquid chamber 54a and the third sub-guide section 501a, and is spaced apart from both the partition portion 549 and the third sub-guide section 501a. The fourth sub-guide section 501b extends along the X-axis direction. In some other embodiments, the fourth sub-guide section 501b may also be entirely disposed within the first segment 5421 of the collection chamber 542 of the first liquid chamber 54a. The cooling medium flowing from the second section 5422 of the first liquid chamber 54a into the first section 5421 is guided by the second guide section 501 of the first liquid chamber 54a, allowing it to flow quickly and smoothly from the first section 5421 of the first liquid chamber 54a into the distribution chamber 541 of the second liquid chamber 54b. This helps reduce the flow resistance of the cooling medium in the collection chamber 542 of the first liquid chamber 54a, reduces the flow resistance of the cooling medium in the heat exchange chamber 543, improves the heat exchange efficiency per unit flow resistance, and reduces the cost of driving the flow of the cooling medium. The configuration of the second guide section 501 of the second liquid chamber 54b can be referred to the relevant description of the first liquid chamber 54a, and will not be repeated here.

[0152] The second flow guide portion 501 of the third liquid chamber 54c is entirely housed within the first section 5421 of the third liquid chamber 54c. In the Y-axis direction, the second flow guide portion 501 of the third liquid chamber 54c is located on one side of the partition portion 549 of the third liquid chamber 54c and faces the flow hole 548 of the third liquid chamber 54c; the second flow guide portion 501 and the partition portion 549 of the third liquid chamber 54c are spaced apart. In the X-axis direction, the second flow guide portion 501 of the third liquid chamber 54c is located between the second section 5422 of the third liquid chamber 54c and the second mating hole 59. The second flow guide portion 501 of the third liquid chamber 54c is inclined relative to the partition portion 549 of the third liquid chamber 54c. In the X-axis direction, the second flow guide portion 501 of the third liquid chamber 54c faces away from the end of the second section 5422 of the third liquid chamber 54c and is close to the partition portion 549 of the third liquid chamber 54c along the Y-axis direction.

[0153] The cooling medium flowing from the second section 5422 of the third liquid chamber 54c into the first section 5421 is guided by the second guide section 501 of the third liquid chamber 54c, and can quickly and smoothly flow out of the radiator 20 from the liquid collection chamber 542 of the third liquid chamber 54c through the liquid outlet channel 301. This helps to reduce the flow resistance of the cooling medium in the liquid collection chamber 542 of the third liquid chamber 54c, helps to reduce the flow resistance of the cooling medium in the heat exchange chamber 543, helps to improve the heat exchange efficiency per unit flow resistance, and helps to reduce the cost of driving the flow of the cooling medium.

[0154] In some embodiments, the intermediate structure 50 is provided with a third flow guide 59a. In other words, the housing 1 is provided with a third flow guide 59a. The third flow guide 59a is housed in the liquid inlet chamber 56 and the corresponding mating chamber 57. The third flow guide 59a is located outside the first mating hole 58. Exemplarily, there are multiple third flow guides 59a. Multiple third flow guides 59a are spaced apart around the first mating hole 58. The third flow guides 59a can guide the cooling medium flowing from the liquid inlet chamber 56 into the liquid distribution chamber 541 of the first liquid chamber 54a, which helps to improve the uniformity of the cooling medium flowing into the heat exchange chamber 543 from the multiple first jet holes 547a, and helps to improve the heat dissipation efficiency of the power unit 10.

[0155] Please refer to Figure 12, and in conjunction with Figures 4 and 9. Figure 12 is a partial structural diagram of the intermediate structure 50 shown in Figure 7 from another angle.

[0156] In some embodiments, the isolation wall 546 is provided with a first partition 5434, which is housed in the heat exchange chamber 543. Specifically, in the Z-axis direction, the first partition 5434 is disposed on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541, and the first partition 5434 is fixedly stacked on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541. In the X-axis direction, the first partition 5434 is located between a plurality of first jet holes 547a and a plurality of second jet holes 547b. That is, in the X-axis direction (the length direction of the radiator 20), the first partition 5434 is located between the first jet holes 547a and the second jet holes 547b. In the Y-axis direction, the first partition 5434 is located between the first flow hole 548a and the second flow hole 548b. Specifically, in the Y-axis direction (i.e., the width direction of the heat sink 20), the first partition 5434 is located on one side of the flow hole 548 and is spaced apart from the flow hole 548. The first partition 5434 extends along the Y-axis direction (i.e., the width direction of the heat sink 20). In the Z-axis direction, the first partition 5434 abuts against the second plate 40.

[0157] The design of the first partition 5434 can prevent the cooling medium flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 547a from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 543 from flowing into the heat exchange cavity 547b from flowing into the heat exchange cavity 543 ...

[0158] In some embodiments, the first partition 5434 includes a main body segment 5434a and an arc segment 5434b. The main body segment 5434a extends along the Y-axis direction. In the Y-axis direction (i.e., the width direction of the heat sink 20), the arc segment 5434b is disposed on one side of the main body segment 5434a and faces the flow hole 548. Specifically, in the Y-axis direction (i.e., the width direction of the heat sink 20), the arc segment 5434b is fixedly stacked on one side of the main body segment 5434a and faces the flow hole 548. For example, there are two arc segments 5434b. In the Y-axis direction, one arc segment 5434b is fixedly stacked on one side of the main body segment 5434a and faces the first flow hole 548a, and the other arc segment 5434b is fixedly stacked on one side of the main body segment 5434a and faces the second flow hole 548b. Each arc segment 5434b is positioned away from the multiple first jet holes 547a along the X-axis relative to the main body segment 5434a. That is, the arc segment 5434b is positioned away from the first jet holes 547a along the X-axis relative to the main body segment 5434a (i.e., the length direction of the radiator 20). It can be understood that both ends of the first partition 5434 bend towards the second jet hole 547b along the X-axis (i.e., the length direction of the radiator 20).

[0159] The design of the two ends of the first partition 5434 bending towards the second jet hole 547b along the X-axis direction (i.e., the length direction of the radiator 20) ensures that the arc segment 5434b (the first partition 5434) can guide the cooling medium flowing into the heat exchange chamber 543 from the first jet hole 547a. This facilitates the rapid and smooth flow of the cooling medium into the heat exchange chamber 543 from the first jet hole 547a to the flow hole 548. This helps to reduce the flow resistance of the cooling medium flowing into the heat exchange chamber 543 from the first jet hole 547a, which in turn helps to reduce the flow resistance of the cooling medium in the heat exchange chamber 543, which helps to improve the heat exchange efficiency per unit flow resistance, and which helps to reduce the cost of driving the flow of the cooling medium.

[0160] In some embodiments, each flow hole 548 includes a mating hole wall 5481. That is, the flow hole 548 includes a mating hole wall 5481. In the X-axis direction (i.e., the length direction of the radiator 20), the mating hole wall 5481 faces away from the liquid collection cavity 542 and away from the first segment 5421. The mating hole wall 5481 is provided with a mating arc portion 5482. The mating arc portion 5482 is received in the flow hole 548, and the mating arc portion 5482 is away from the second segment 5422 in the Y-axis direction relative to the mating hole wall 5481, and away from the liquid collection cavity 542 in the Y-axis direction (i.e., the width direction of the radiator 20) relative to the mating hole wall 5481. The design of the arc portion 5482 being positioned relative to the mating hole wall 5481 along the Y-axis direction (i.e., the width direction of the radiator 20) away from the liquid collection cavity 542 is beneficial to enhancing the mixing of hot and cold flow of the cooling medium flowing into the heat exchange cavity 543 from the second jet hole 547b, thereby improving the heat exchange capacity of the cooling medium in the heat exchange cavity 543 and improving the heat dissipation efficiency of the power unit 10.

[0161] In some embodiments, the isolation wall 546 is provided with a second partition 5435. In other words, the intermediate structure 50 is provided with a second partition 5435. The second partition 5435 is housed in the heat exchange chamber 543. Specifically, in the Z-axis direction, the second partition 5435 is disposed on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541, and the second partition 5435 is fixedly stacked on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541. In the X-axis direction, the second partition 5435 is disposed on one side of the second wall surface 5432 and faces the third wall surface 5433, and the second partition 5435 is fixedly stacked on one side of the second wall surface 5432 and faces the third wall surface 5433. The second partition 5435 extends along the X-axis direction (i.e., the length direction of the radiator 20).

[0162] In the Y-axis direction (i.e., the width direction of the heat sink 20), the second partition 5435 is located between two adjacent first jet holes 547a. For example, there are multiple second partitions 5435, each including a first sub-partition 5435a and a second sub-partition 5435b. There are four first sub-partitions 5435a. In the Y-axis direction, two first sub-partitions 5435a, two second sub-partitions 5435b, and two more first sub-partitions 5435a are sequentially spaced apart, with each of the first sub-partitions 5435a and second sub-partitions 5435b correspondingly positioned between multiple first jet holes 547a. In the X-axis direction, each first sub-partition 5435a is spaced apart from a first partition 5434, and the second sub-partition 5435b is fixedly stacked with the first partition 5434. In some other embodiments, the second sub-separator 5435b may also be spaced apart from the first separator 5434. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), each second separator 5435 abuts against the second plate 40.

[0163] The design of the second partition 5435 can prevent the multiple cooling media flowing into the heat exchange chamber 543 from the multiple first jet holes 547a from flowing into the heat exchange chamber 543. This helps to reduce the flow resistance of the cooling media flowing into the heat exchange chamber 543 from the first jet holes 547a, which helps to reduce the flow resistance of the cooling media in the heat exchange chamber 543, which helps to improve the heat exchange efficiency per unit flow resistance, and which helps to reduce the cost of driving the flow of the cooling media.

[0164] In some embodiments, the isolation wall 546 is provided with a third partition 5436. In other words, the intermediate structure 50 is provided with a third partition 5436. The third partition 5436 is housed in the heat exchange chamber 543. Specifically, in the Z-axis direction, the third partition 5436 is disposed on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541, and the third partition 5436 is fixedly stacked on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541. In the X-axis direction, the third partition 5436 is disposed on one side of the third wall surface 5433 and faces the second wall surface 5432, and the third partition 5436 is fixedly stacked on one side of the third wall surface 5433 and faces the second wall surface 5432. The third partition 5436 extends along the X-axis direction (i.e., the length direction of the radiator 20).

[0165] In the Y-axis direction (i.e., the width direction of the heat sink 20), the third partition 5436 is located between two adjacent second jet holes 547b. For example, there are multiple third partitions 5436, each including a third sub-partition 5436a and a fourth sub-partition 5436b. There are four third sub-partitions 5436a. In the Y-axis direction, two third sub-partitions 5436a, a fourth sub-partition 5436b, and two more third sub-partitions 5436a are sequentially spaced apart, with each of the third sub-partitions 5436a and fourth sub-partitions 5436b correspondingly positioned between multiple second jet holes 547b. In the X-axis direction, each third sub-partition 5436a is spaced apart from a first partition 5434, and the fourth sub-partition 5436b is fixedly stacked with the first partition 5434. In some other embodiments, the fourth sub-separator 5436b may also be spaced apart from the first separator 5434. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), each third separator 5436 abuts against the second plate 40.

[0166] The design of the third partition 5436 can prevent the multiple cooling media flowing into the heat exchange cavity 543 from the multiple second jet holes 547b from flowing into the heat exchange cavity 543. This helps to reduce the flow resistance of the cooling media flowing into the heat exchange cavity 543 from the second jet holes 547b, which helps to reduce the flow resistance of the cooling media in the heat exchange cavity 543, which helps to improve the heat exchange efficiency per unit flow resistance, and which helps to reduce the cost of driving the flow of the cooling media.

[0167] In some embodiments, the partition wall 546 is provided with at least one heat dissipation tooth 5437. Each heat dissipation tooth 5437 is received in the heat exchange chamber 543. Specifically, in the Z-axis direction, each heat dissipation tooth 5437 is disposed on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541, and each heat dissipation tooth 5437 is fixedly stacked on one side of the first wall surface 5431 and faces away from the liquid distribution chamber 541. In other words, the intermediate structure 50 is provided with at least one heat dissipation tooth 5437 on the side facing the second plate 40. Each heat dissipation tooth 5437 is received in the heat exchange chamber 543. Each heat dissipation tooth 5437 is located outside the jet hole 547. Each heat dissipation tooth 5437 is spaced apart from the first partition 5434, the second partition 5435 and the third partition 5436. Each heat dissipation tooth 5437 extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and abuts against the second plate 40.

[0168] The design of the heat dissipation teeth 5437 ensures that the heat generated by the power unit 10 during operation can be transferred not only through the second plate 40 to the cooling medium in the heat exchange cavity 543, but also through the second plate 40 and the heat dissipation teeth 5437 to the cooling medium in the heat exchange cavity 543. This is beneficial to improving the efficiency of transferring the heat generated by the power unit 10 during operation to the cooling medium in the heat exchange cavity 543, and thus improving the heat dissipation efficiency of the power unit 10.

[0169] For example, there are multiple heat dissipation fins 5437, and each of the multiple heat dissipation fins 5437 corresponds one-to-one with a multiple jet holes 547. Each heat dissipation fin 5437 includes a first sub-heat dissipation fin 5437a and a second sub-heat dissipation fin 5437b. There are multiple first sub-heat dissipation fins 5437a and multiple second sub-heat dissipation fins 5437b. The number of first sub-heat dissipation fins 5437a is equal to the number of second sub-heat dissipation fins 5437b. In some other embodiments, the number of first sub-heat dissipation fins 5437a and the number of second sub-heat dissipation fins 5437b may not be equal.

[0170] In the Y-axis direction, multiple first sub-heat dissipation teeth 5437a are located on one side of the jet hole 547, and multiple second sub-heat dissipation teeth 5437b are located on the other side of the jet hole 547. That is, in the Y-axis direction (i.e., the width direction of the radiator 20), multiple heat dissipation teeth 5437 are located on both sides of the jet hole 547. In the X-axis direction (i.e., the length direction of the radiator 20), multiple first sub-heat dissipation teeth 5437a are sequentially spaced apart, and multiple second sub-heat dissipation teeth 5437b are sequentially spaced apart. It can be understood that there are multiple heat dissipation teeth 5437 located on one side of the jet hole 547, and these multiple heat dissipation teeth 5437 located on one side of the jet hole 547 are spaced apart along the X-axis direction (i.e., the length direction of the radiator 20).

[0171] The projections of multiple first sub-heat dissipation teeth 5437a in the Y-axis direction overlap one-to-one with the projections of multiple second sub-heat dissipation teeth 5437b in the Y-axis direction. The projections of the first sub-heat dissipation teeth 5437a and the second sub-heat dissipation teeth 5437b in the Y-axis direction also overlap. In some other embodiments, they may not overlap. In the X-axis direction, the multiple first sub-heat dissipation teeth 5437a and the multiple second sub-heat dissipation teeth 5437b may also be sequentially fixed and stacked. That is, the number of first sub-heat dissipation teeth 5437a and the number of second sub-heat dissipation teeth 5437b may also be one. In the Y-axis direction, the intervals between the jet hole 547 and the multiple first sub-heat dissipation teeth 5437a are relatively arranged, and the intervals between the jet hole 547 and the multiple second sub-heat dissipation teeth 5437b are relatively arranged.

[0172] In this design, a flow channel 5438 is formed between multiple first sub-heat dissipation teeth 5437a and multiple second sub-heat dissipation teeth 5437b in the Y-axis direction. Specifically, a flow channel 5438 is formed between the heat dissipation teeth 5437 located on one side of the jet hole 547 and the heat dissipation teeth 5437 located on the other side of the jet hole 547. The flow channel 5438 extends along the X-axis direction (i.e., the length direction of the radiator 20). The flow channel 5438 is connected to the intervals between the multiple first sub-heat dissipation teeth 5437a and the intervals between the flow channel 5438 and the multiple second sub-heat dissipation teeth 5437b. In other words, the flow channel 5438 is connected to the intervals between the multiple heat dissipation teeth 5437 located on one side of the jet hole 547. The flow channel 5438 is connected to both the jet hole 547 and the flow hole 548. Specifically, the flow channel 5438 is connected to one jet hole 547 and one flow hole 548.

[0173] The design of the flow channel 5438 communicating with the jet hole 547 and the flow hole 548 ensures that the cooling medium flowing into the heat exchange chamber 543 from the jet hole 547 can flow stably and quickly to the flow hole 548 along the flow channel 5438. The first sub-heat dissipation tooth 5437a and the second sub-heat dissipation tooth 5437b play a guiding role in the flow of the cooling medium. That is, the heat dissipation teeth 5437 located on both sides of the jet hole 547 play a guiding role in the flow of the cooling medium, which is conducive to increasing the flow velocity of the cooling medium in the heat exchange chamber 543 flowing out of the heat exchange chamber 543 through the flow hole 548, which is conducive to improving the heat exchange capacity of the cooling medium in the heat exchange chamber 543, and is conducive to improving the heat dissipation efficiency of the power unit 10.

[0174] The flow channel 5438 is connected to the multiple first sub-heat dissipation teeth 5437a through gaps, and the flow channel 5438 is also connected to the multiple second sub-heat dissipation teeth 5437b through gaps. This design ensures that the cooling medium flowing into the heat exchange chamber 543 from the jet hole 547 can pass through the flow channel 5438, through the gaps between the multiple first sub-heat dissipation teeth 5437a, and between the multiple second sub-heat dissipation teeth 5437b. The multiple first sub-heat dissipation teeth 5437a and multiple second sub-heat dissipation teeth 5437b are spaced apart and flow towards the flow hole 548, ensuring that they can strongly disturb the flow of the cooling medium. This also ensures that the multiple heat dissipation teeth 5437 located on both sides of the jet hole 547 can strongly disturb the flow of the cooling medium, which is beneficial for increasing the fluid turbulence of the cooling medium flowing into the heat exchange cavity 543 from the jet hole 547, thereby improving the heat exchange efficiency of the cooling medium in the heat exchange cavity 543 and the heat dissipation efficiency of the power unit 10. In some other embodiments, the second plate 40 may also be provided with corresponding heat dissipation teeth. In the Z-axis direction, the corresponding heat dissipation teeth are disposed on one side of the second plate 40 and face the heat exchange cavity 543. In the Z-axis direction, the corresponding heat dissipation teeth abut against the heat dissipation teeth 5437. Alternatively, in the Z-axis direction, the corresponding heat dissipation teeth and the heat dissipation teeth 5437 are fixedly connected by means including but not limited to welding or adhesive bonding.

[0175] In the heat dissipation teeth 5437 corresponding to the first jet holes 547a located between two adjacent second partitions 5435, a plurality of first sub-heat dissipation teeth 5437a include first pin teeth 5437c, first strip teeth 5437d, and first auxiliary pin teeth 5437e. The dimension of the first strip tooth 5437d in the X-axis direction is greater than twice the dimension of the first pin tooth 5437c in the X-axis direction, and the dimension of the first auxiliary pin tooth 5437e in the X-axis direction is equal to the length of the first pin tooth 5437c. The dimension of the first auxiliary pin tooth 5437e in the X-axis direction is less than half the dimension of the first strip tooth 5437d in the X-axis direction. In some other embodiments, the dimension of the first auxiliary pin tooth 5437e in the X-axis direction may not be equal to the dimension of the first pin tooth 5437c in the X-axis direction. The dimension of the first strip tooth 5437d in the X-axis direction may also be equal to twice the dimension of the first pin tooth 5437c in the X-axis direction. The dimension of the first auxiliary pin tooth 5437e in the X-axis direction can also be equal to half the dimension of the first strip tooth 5437d in the X-axis direction. It can be understood that the dimension of the first strip tooth 5437d in the X-axis direction is greater than or equal to twice the dimension of the first pin tooth 5437c in the X-axis direction.

[0176] For example, there are multiple first needle teeth 5437c. In some other embodiments, there may be only one. There are multiple first auxiliary needle teeth 5437e. In some other embodiments, there may be only one. In the X-axis direction, multiple first needle teeth 5437c, first strip teeth 5437d, and multiple first auxiliary needle teeth 5437e are arranged sequentially at intervals. In the X-axis direction, the first strip teeth 5437d and the multiple first auxiliary needle teeth 5437e are located on one side of the multiple first needle teeth 5437c and away from the jet hole 547. That is to say, in the X-axis direction (i.e., the length direction of the heat sink 20), the first strip teeth 5437d are located on one side of the first needle teeth 5437c and away from the jet hole 547, and the first strip teeth 5437d and the first needle teeth 5437c are arranged at intervals.

[0177] It is understood that the multiple heat dissipation teeth 5437 located on one side of the jet hole 547 include needle teeth and strip teeth. The size of the strip teeth in the X-axis direction (i.e., the length direction of the radiator 20) is greater than or equal to twice the size of the needle teeth in the X-axis direction (i.e., the length direction of the radiator 20). In the X-axis direction (i.e., the length direction of the radiator 20), the strip teeth are located on one side of the needle teeth and away from the jet hole 547. The strip teeth and needle teeth are spaced apart.

[0178] The second sub-heat dissipation tooth 5437b includes a second pin tooth 5437f, a second strip tooth 5437g, and a second auxiliary pin tooth 5437h. The dimension of the second strip tooth 5437g in the X-axis direction is greater than twice the dimension of the second pin tooth 5437f in the X-axis direction, and the dimension of the second auxiliary pin tooth 5437h in the X-axis direction is equal to the dimension of the second pin tooth 5437f in the X-axis direction. The dimension of the second auxiliary pin tooth 5437h in the X-axis direction is less than half the dimension of the second strip tooth 5437g in the X-axis direction. In some other embodiments, the dimension of the second auxiliary pin tooth 5437h in the X-axis direction may not be equal to the dimension of the second pin tooth 5437f in the X-axis direction. The dimension of the second strip tooth 5437g in the X-axis direction may also be equal to twice the dimension of the second pin tooth 5437f in the X-axis direction. The dimension of the second auxiliary pin tooth 5437h in the X-axis direction may also be equal to half the dimension of the second strip tooth 5437g in the X-axis direction. It can be understood that the dimension of the second strip tooth 5437g in the X-axis direction is greater than or equal to twice the dimension of the second needle tooth 5437f in the X-axis direction.

[0179] For example, there are multiple second pin teeth 5437f. In some other embodiments, there may be only one. There are multiple second auxiliary pin teeth 5437h. In some other embodiments, there may be only one. In the X-axis direction, multiple second pin teeth 5437f, second strip teeth 5437g, and multiple second auxiliary pin teeth 5437h are arranged sequentially at intervals. That is, in the X-axis direction (i.e., the length direction of the heat sink 20), the second strip teeth 5437g and the second pin teeth 5437f are arranged at intervals.

[0180] The projections of multiple second pin teeth 5437f in the Y-axis direction overlap one-to-one with the projections of multiple first pin teeth 5437c in the Y-axis direction. In the Y-axis direction (i.e., the width direction of the heat sink 20), the second pin teeth 5437f and first pin teeth 5437c are opposite to each other and spaced apart. The projection of the second strip tooth 5437g in the Y-axis direction overlaps with the projection of the first strip tooth 5437d in the Y-axis direction. In the Y-axis direction (i.e., the width direction of the heat sink 20), the second strip tooth 5437g and first strip tooth 5437d are opposite to each other and spaced apart. The projections of multiple second auxiliary pin teeth 5437h in the Y-axis direction overlap one-to-one with the projections of multiple first auxiliary pin teeth 5437e in the Y-axis direction. In the Y-axis direction (i.e., the width direction of the heat sink 20), the second auxiliary pin teeth 5437h and first auxiliary pin teeth 5437e are opposite to each other and spaced apart.

[0181] The flow channel 5438 is connected to the intervals between the plurality of first needle teeth 5437c, the intervals between the first needle teeth 5437c and the first strip teeth 5437d, the intervals between the first strip teeth 5437d and the first auxiliary needle teeth 5437e, the intervals between the plurality of first auxiliary needle teeth 5437e, the intervals between the plurality of second needle teeth 5437f, the intervals between the second needle teeth 5437f and the second strip teeth 5437g, the intervals between the second strip teeth 5437g and the second auxiliary needle teeth 5437h, and the intervals between the plurality of second auxiliary needle teeth 5437h. It can be understood that the flow channel 5438 is connected to the intervals between the needle teeth and strip teeth located on one side of the jet orifice 547. The cooling medium flowing into the flow channel 5438 may first flow out of the flow channel 5438 from the gaps between the multiple first needle teeth 5437c, the gap between the first needle teeth 5437c and the first strip tooth 5437d, the gaps between the multiple second needle teeth 5437f, and the gap between the second needle teeth 5437f and the second strip tooth 5437g, and then flow into the gap between the first strip tooth 5437d and the second strip tooth 5437g from between the first needle teeth 5437c and the second needle teeth 5437f.

[0182] The cooling medium flowing between the first strip tooth 5437d and the second strip tooth 5437g flows into the space between the first auxiliary needle tooth 5437e and the second auxiliary needle tooth 5437h, and then flows out of the flow channel 5438; a portion flows out of the flow channel 5438 through the gap between the first strip tooth 5437d and the first auxiliary needle tooth 5437e, the gap between multiple first auxiliary needle teeth 5437e, the gap between the second strip tooth 5437g and the second auxiliary needle tooth 5437h, and the gap between multiple second auxiliary needle teeth 5437h.

[0183] In other words, the cooling medium flowing into the flow channel 5438 can first flow out of the flow channel 5438 from the gap between the needle teeth and the strip teeth on one side of the jet hole 547 and the gap between the needle teeth and the strip teeth on the other side of the jet hole 547, and then flow into the gap between the strip teeth on one side of the jet hole 547 and the strip teeth on the other side of the jet hole 547, and then flow out of the flow channel 5438.

[0184] The intervals between the multiple first needle teeth 5437c, the intervals between the first needle teeth 5437c and the first strip teeth 5437d, the intervals between the second needle teeth 5437f and the second strip teeth 5437g, and the intervals between the multiple second needle teeth 5437f all strongly disturb the flow of the cooling medium. This is beneficial for increasing the turbulence of the cooling medium flowing into the heat exchange cavity 543 from the jet orifice 547, thereby improving the heat transfer efficiency of the cooling medium in the heat exchange cavity 543 and the heat dissipation efficiency of the power unit 10. In other words, the intervals between the needle teeth and strip teeth strongly disturb the flow of the cooling medium, thereby increasing the turbulence of the cooling medium flowing into the heat exchange cavity 543 from the jet orifice 547, improving the heat transfer efficiency of the cooling medium in the heat exchange cavity 543, and improving the heat dissipation efficiency of the power unit 10.

[0185] Furthermore, the design that the dimension of the first strip tooth 5437d in the X-axis direction is greater than or equal to twice the dimension of the first needle tooth 5437c in the X-axis direction, and the dimension of the second strip tooth 5437g in the X-axis direction is greater than or equal to twice the dimension of the second needle tooth 5437f in the X-axis direction, i.e., the dimension of the strip tooth in the X-axis direction (i.e., the length direction of the radiator 20) is greater than or equal to twice the dimension of the needle tooth in the X-axis direction (i.e., the length direction of the radiator 20), is beneficial to increasing the flow rate of the cooling medium flowing into the first strip tooth 5437d (the strip tooth located on one side of the jet hole 547) and the second strip tooth 5437g (the strip tooth located on the other side of the jet hole 547), is beneficial to increasing the flow rate of the cooling medium in the heat exchange cavity 543 flowing out of the heat exchange cavity 543 through the flow hole 548, is beneficial to increasing the heat exchange capacity of the cooling medium in the heat exchange cavity 543, and is beneficial to improving the heat dissipation efficiency of the power unit 10. The structure of the heat dissipation teeth 5437 corresponding to the other jet holes 547 can be referred to above and will not be repeated here.

[0186] Please refer to Figure 13, and in conjunction with Figures 4 and 12. Figure 13 is a schematic diagram of the intermediate structure 50 shown in Figure 12 in another embodiment.

[0187] In some other embodiments, the arcuate portion 5482 may be omitted. The isolation wall 546 is only provided with a plurality of first jet holes 547a, a plurality of second jet holes 547b, and heat dissipation teeth 5437. It is understood that the first partition portion 5434, the second partition portion 5435, and the third partition portion 5436 may be omitted. The plurality of first jet holes 547a and the plurality of second jet holes 547b all penetrate the isolation wall 546 along the Z-axis direction. Each first jet hole 547a is equally connected to the liquid chamber 541 and the heat exchange chamber 543, and each second jet hole 547b is equally connected to the liquid chamber 541 and the heat exchange chamber 543. The plurality of heat dissipation teeth 5437 are housed in the heat exchange chamber 543. The plurality of heat dissipation teeth 5437 are spaced apart and evenly arranged. That is, the plurality of heat dissipation teeth 5437 are spaced apart and evenly arranged in the heat exchange chamber 543. Multiple heat dissipation teeth 5437 surround multiple first jet holes 547a and multiple second jet holes 547b. In the Y-axis direction, the multiple heat dissipation teeth 5437 are located between the first flow hole 548a and the second flow hole 548b. Each heat dissipation tooth 5437 extends along the Z-axis direction and abuts against the second plate 40.

[0188] In this way, the heat generated by the power unit 10 during operation is ensured to be transferred not only to the cooling medium in the heat exchange cavity 543 via the second plate 40, but also via the second plate 40 and the heat dissipation teeth 5437. The design of multiple heat dissipation teeth 5437 spaced apart and evenly arranged in the heat exchange cavity 543 improves the efficiency of heat transfer from the power unit 10 during operation to the cooling medium in the heat exchange cavity 543, thereby improving the heat dissipation efficiency of the power unit 10.

[0189] Please refer to Figures 14 and 15, and in conjunction with Figures 3, 7, and 8. Figure 14 is a schematic diagram of the intermediate structure 50 shown in Figure 7 in another embodiment. Figure 15 is a schematic diagram of the intermediate structure 50 shown in Figure 14 from another angle.

[0190] As shown in Figures 3, 7, and 14, in some other embodiments, each liquid chamber 54's distribution chamber 541 may also include a first sub-distribution chamber 5413, a second sub-distribution chamber 5414, and a third sub-distribution chamber 5415. In other words, the distribution chamber 541 includes a first sub-distribution chamber 5413, a second sub-distribution chamber 5414, and a third sub-distribution chamber 5415. In the Y-axis direction (i.e., the width direction of the radiator 20), the first sub-distribution chamber 5413 and the second sub-distribution chamber 5414 are spaced apart. In the X-axis direction, the third sub-distribution chamber 5415 is located on one side of the first sub-distribution chamber 5413 and the second sub-distribution chamber 5414, and the third sub-distribution chamber 5415 communicates with the first sub-distribution chamber 5413 and the second sub-distribution chamber 5414. In the X-axis direction, the third sub-liquid chamber 5415 is located on one side of the first sub-liquid chamber 5413 and the second sub-liquid chamber 5414 and is close to the inlet chamber 56.

[0191] In the X-axis direction, the collection chamber 542 is located on one side of the distribution chamber 541 and is spaced apart from it. Specifically, in the X-axis direction, the collection chamber 542 is located on one side of the first sub-distribution chamber 5413 and the second sub-distribution chamber 5414 and away from the third sub-distribution chamber 5415, and is spaced apart from the first sub-distribution chamber 5413 and the second sub-distribution chamber 5414. Specifically, the collection chamber 542 includes a first segment 5421 and a second segment 5422. In the X-axis direction, the second segment 5422 is located on one side of the first segment 5421 and is connected to the first segment 5421. There are three second segments 5422. The three second segments 5422 are respectively the first sub-segment 5422a, the second sub-segment 5422b, and the third sub-segment 5422c. In the Y-axis direction, the first sub-segment 5422a, the third sub-segment 5422c, and the second sub-segment 5422b are arranged at intervals.

[0192] In the X-axis direction, the first segment 5421 is located on one side of the first sub-dispensing chamber 5413 and the second sub-dispensing chamber 5414 and is away from the third sub-dispensing chamber 5415. The first segment 5421 is spaced apart from the first sub-dispensing chamber 5413 and the second sub-dispensing chamber 5414. In the X-axis direction, the first sub-segment 5422a, the second sub-segment 5422b, and the third sub-segment 5422c are all located on one side of the first segment 5421 and are close to the third sub-dispensing chamber 5415. In the Y-axis direction, the first sub-segment 5422a is located on one side of the first sub-dispensing chamber 5413 and is away from the second sub-dispensing chamber 5414. The first sub-segment 5422a is spaced apart from the first sub-dispensing chamber 5413. In the Y-axis direction, the second sub-segment 5422b is located on one side of the second sub-dispensing chamber 5414 and is away from the first sub-dispensing chamber 5413. The second sub-segment 5422b is spaced apart from the second sub-dispensing chamber 5414. In the Y-axis direction, the third sub-segment 5422c is located between the first sub-dispensing chamber 5413 and the second sub-dispensing chamber 5414, and is spaced apart from both the first and second sub-dispensing chambers 5413 and 5414. The first segment 5421 does not penetrate the intermediate structure 50 along the Z-axis direction, while the first sub-segment 5422a, the second sub-segment 5422b, and the third segment 5422c all penetrate the intermediate structure 50 along the Z-axis direction. In some other embodiments, the first sub-segment 5422a, the second sub-segment 5422b, and the third segment 5422c may also not penetrate the intermediate structure 50 along the Z-axis direction. In this embodiment, the first guide portion 5412 (as shown in FIG. 7), the partition portion 549, and the second guide portion 501 can all be omitted.

[0193] As shown in Figures 3, 14, and 15, in the Y-axis direction, the heat exchange chamber 543 is located on one side of the liquid distribution chamber 541 and is spaced apart from it. In the X-axis direction, the heat exchange chamber 543 is located on one side of the liquid collection chamber 542 and close to the liquid distribution chamber 541, with the heat exchange chamber 543 and the liquid collection chamber 542 spaced apart. Specifically, the heat exchange chamber 543 includes a first sub-heat exchange chamber 543a and a second sub-heat exchange chamber 543b. In the Y-axis direction, the first sub-heat exchange chamber 543a and the second sub-heat exchange chamber 543b are spaced apart. The projection of the first sub-heat exchange chamber 543a in the Z-axis direction overlaps with the projection of the first sub-liquid distribution chamber 5413 in the Z-axis direction. The projection of the second sub-heat exchange chamber 543b in the Z-axis direction overlaps with the projection of the second sub-liquid distribution chamber 5414 in the Z-axis direction. In the Y-axis direction, the first sub-heat exchange cavity 543a is located between the first sub-segment 5422a and the third sub-segment 5422c, and is spaced apart from the first sub-segment 5422a and the third sub-segment 5422c. In the Y-axis direction, the second sub-heat exchange cavity 543b is located between the second sub-segment 5422b and the third sub-segment 5422c, and is spaced apart from the second sub-segment 5422b and the third sub-segment 5422c. The projection of the first sub-heat exchange cavity 543a in the Z-axis direction overlaps with the projection of the power unit 10 in the Z-axis direction, and the projection of the second sub-heat exchange cavity 543b in the Z-axis direction also overlaps with the projection of the power unit 10 in the Z-axis direction. In this embodiment, as shown in Figures 8 and 15, the first partition 5434, the second partition 5435, the third partition 5436, and the heat dissipation teeth 5437 can all be omitted.

[0194] As shown in Figures 3, 14, and 15, the intermediate structure 50 is provided with jet holes 547. The jet holes 547 include a first jet hole 547a and a second jet hole 547b. The first jet hole 547a extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and communicates with the first sub-liquid distribution chamber 5413 and the first sub-heat exchange chamber 543a, that is, the first jet hole 547a communicates with the heat exchange chamber 543. Exemplarily, there are multiple first jet holes 547a. In the X-axis direction, the multiple first jet holes 547a are spaced apart. In some other embodiments, the number of first jet holes 547a may also be one. The second jet hole 547b extends along the Z-axis direction (i.e., the thickness direction of the radiator 20) and communicates with the second sub-liquid distribution chamber 5414 and the second sub-heat exchange chamber 543b. For example, there are multiple second jet holes 547b. In the X-axis direction, the multiple second jet holes 547b are spaced apart. In some other embodiments, the number of second jet holes 547b may also be one.

[0195] The intermediate structure 50 is provided with a flow hole 548. The flow hole 548 includes a first flow hole 548a, a second flow hole 548b, a third flow hole 548c, and a fourth flow hole 548d. The first flow hole 548a extends along the Y-axis and communicates with the first sub-heat exchange chamber 543a and the first sub-segment 5422a. The second flow hole 548b extends along the Y-axis and communicates with the first sub-heat exchange chamber 543a and the third sub-segment 5422c. The third flow hole 548c extends along the Y-axis and communicates with the second sub-heat exchange chamber 543b and the third sub-segment 5422c. The fourth flow hole 548d extends along the Y-axis and communicates with the second sub-heat exchange chamber 543b and the second sub-segment 5422b.

[0196] The cooling medium can flow from the third sub-dispensing chamber 5415 into the first sub-dispensing chamber 5413 and the second sub-dispensing chamber 5414. The cooling medium in the first sub-dispensing chamber 5413 flows into the first sub-heat exchange chamber 543a through the first jet hole 547a. The cooling medium in the first sub-heat exchange chamber 543a flows into the first sub-section 5422a through the first flow hole 548a. The cooling medium in the first sub-heat exchange chamber 543a flows into the third sub-section 5422c through the second flow hole 548b. The cooling medium in the first sub-heat exchange chamber 543a flows into the collecting chamber 542 through the first flow hole 548a and the second flow hole 548b.

[0197] The cooling medium in the second sub-dispensing chamber 5414 flows into the second sub-heat exchange chamber 543b through the second jet hole 547b. The cooling medium in the second sub-heat exchange chamber 543b flows into the third sub-section 5422c through the third flow hole 548c. The cooling medium in the second sub-heat exchange chamber 543b flows into the second sub-section 5422b through the fourth flow hole 548d. The cooling medium in the second sub-heat exchange chamber 543b flows into the liquid collection chamber 542 through the third flow hole 548c and the fourth flow hole 548d.

[0198] In the Y-axis direction (i.e., the width direction of the radiator 20), the first sub-dispensing chamber 5413 and the second sub-dispensing chamber 5414 are spaced apart. The first jet hole 547a is connected to the first sub-dispensing chamber 5413 and the first sub-heat exchange chamber 543a (i.e., heat exchange chamber 543), and the second jet hole 547b is connected to the second sub-dispensing chamber 5414 and the second sub-heat exchange chamber 543b (i.e., heat exchange chamber 543). This design ensures that the cooling medium can flow from the first sub-dispensing chamber 5413 to the second sub-dispensing chamber 5414. 413 flows into the first sub-heat exchange chamber 543a (i.e., heat exchange chamber 543) through the first jet hole 547a, ensuring that the cooling working medium can flow from the second sub-liquid distribution chamber 5414 into the second sub-heat exchange chamber 543b (i.e., heat exchange chamber 543) through the second jet hole 547b. This is beneficial for uniformly distributing the flow rate of the cooling working medium flowing into the heat exchange chamber 543 from the first jet hole 547a and the second jet hole 547b, and is beneficial for improving the heat dissipation efficiency of the power unit 10.

[0199] Please refer to Figures 16 and 17, and in conjunction with Figures 3, 6, and 11. Figure 16 is a structural schematic diagram of the power module 200 shown in Figure 2 cut along line AA in another embodiment. Figure 17 is a structural schematic diagram of the power module 200 shown in Figure 16 cut along line GG.

[0200] As shown in Figures 11, 16, and 17, in some other embodiments, the power unit 10 includes a first power unit 10a and a second power unit 10b. There are multiple first power units 10a and multiple second power units 10b. In other words, the power module 200 includes multiple first power units 10a and multiple second power units 10b. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the first power units 10a are fixedly stacked on one side of the first plate 30 and face away from the second plate 40. In the X-axis direction, the multiple first power units 10a are arranged sequentially at intervals. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the second power units 10b are fixedly stacked on one side of the second plate 40 and face away from the first plate 30. In the X-axis direction, the multiple second power units 10b are arranged sequentially at intervals. That is to say, multiple first power units 10a are disposed on the side of the first plate 30 away from the intermediate structure 50, and multiple second power units 10b are disposed on the side of the second plate 40 away from the intermediate structure 50.

[0201] In this embodiment, the intermediate structure 50 includes a first sub-intermediate structure 50a and a second sub-intermediate structure 50b. In the Z-axis direction (i.e., the thickness direction of the heat sink 20), the first sub-intermediate structure 50a and the second sub-intermediate structure 50b are fixedly stacked and positioned opposite each other. In the Z-axis direction, a first plate 30 is disposed on one side of the second sub-intermediate structure 50b and faces away from the first sub-intermediate structure 50a; the first plate 30 is fixedly stacked on one side of the second sub-intermediate structure 50b and faces away from the first sub-intermediate structure 50a. In the Z-axis direction, a second plate 40 is disposed on one side of the first sub-intermediate structure 50a and faces away from the second sub-intermediate structure 50b; the second plate 40 is fixedly stacked on one side of the first sub-intermediate structure 50a and faces away from the second sub-intermediate structure 50b. The structures of the first sub-intermediate structure 50a and the second sub-intermediate structure 50b can be referred to the relevant descriptions of the embodiments shown in Figures 3 and 11. The first sub-intermediate structure 50a and the second sub-intermediate structure 50b are each provided with a first liquid chamber 54a, a second liquid chamber 54b, a third liquid chamber 54c, a jet orifice 547, a flow orifice 548, a first mating orifice 58, and a second mating orifice 59. Each liquid chamber 54 includes a flow chamber 540 and a heat exchange chamber 543. The flow chamber 540 includes a liquid distribution chamber 541 and a liquid collection chamber 542 arranged at intervals. The liquid distribution chamber 541 and the heat exchange chamber 543 are connected through the jet orifice 547, and the heat exchange chamber 543 and the liquid collection chamber 542 are connected through the flow orifice 548.

[0202] The dispensing chamber 541 of the first liquid cavity 54a of the first sub-intermediate structure 50a is connected to the dispensing chamber 541 of the first liquid cavity 54a of the second sub-intermediate structure 50b. The collecting chamber 542 of the first liquid cavity 54a of the first sub-intermediate structure 50a is connected to the collecting chamber 542 of the first liquid cavity 54a of the second sub-intermediate structure 50b. The dispensing chamber 541 of the second liquid cavity 54b of the first sub-intermediate structure 50a is connected to the dispensing chamber 541 of the second liquid cavity 54b of the second sub-intermediate structure 50b. The collecting chamber 542 of the second liquid cavity 54b of the first sub-intermediate structure 50a is connected to the collecting chamber 542 of the second liquid cavity 54b of the second sub-intermediate structure 50b. The dispensing chamber 541 of the third liquid cavity 54c of the first sub-intermediate structure 50a is connected to the dispensing chamber 541 of the third liquid cavity 54c of the second sub-intermediate structure 50b. The collection chamber 542 of the third liquid chamber 54c of the first sub-intermediate structure 50a is connected to the collection chamber 542 of the third liquid chamber 54c of the second sub-intermediate structure 50b. In some embodiments, the dispensing chamber 541 and the collection chamber 542 of the first sub-intermediate structure 50a may be omitted. Alternatively, the dispensing chamber 541 and the collection chamber 542 of the second sub-intermediate structure 50b may be omitted.

[0203] It is understood that the intermediate structure 50 is provided with multiple liquid flow chambers 540, which are arranged sequentially along the X-axis direction (the length direction of the radiator 20). Each liquid flow chamber 540 includes a liquid distribution chamber 541 and a liquid collection chamber 542 that are spaced apart from each other. In two adjacent liquid flow chambers 540, the liquid collection chamber 542 of one liquid flow chamber 540 is connected to the liquid distribution chamber 541 of the other liquid flow chamber 540.

[0204] The first plate 30 covers the heat exchange chamber 543 of each liquid cavity 54 in the second sub-intermediate structure 50b. Multiple first heat exchange chambers 543c (i.e., heat exchange chambers 543 located in the second sub-intermediate structure 50b) are formed between the first plate 30 and the second sub-intermediate structure 50b, and multiple first heat exchange chambers 543c are formed between the first plate 30 and the intermediate structure 50. Each of the multiple first heat exchange chambers 543c corresponds one-to-one with a multiple liquid flow chamber 540 (i.e., multiple liquid flow chambers 540 located in the second sub-intermediate structure 50b). The first heat exchange chambers 543c and the liquid distribution chamber 541 are connected through a jet hole 547 located in the second sub-intermediate structure 50b. The first heat exchange chambers 543c and the liquid collection chamber 542 are connected through a flow hole 548 located in the second sub-intermediate structure 50b (as shown in Figure 11).

[0205] The inlet channel 201 and inlet port 60 of the first connector 2 (as shown in Figure 6) are sequentially connected to the first mating hole 58 of the second sub-intermediate structure 50b. The outlet channel 301 and outlet port 70 of the second connector 3 (as shown in Figure 6) are sequentially connected to the second mating hole 59 of the second sub-intermediate structure 50b. It can be understood that the inlet port 60 is connected to the distribution chamber 541 of one of the multiple flow chambers 540 (i.e., the flow chamber 540 of the first liquid chamber 54a). The outlet port 70 is connected to the collection chamber 542 of another flow chamber 540 (i.e., the flow chamber 540 of the third liquid chamber 54c).

[0206] The second plate 40 covers the heat exchange chamber 543 of each liquid cavity 54 in the first sub-intermediate structure 50a. Multiple second heat exchange chambers 543d are formed between the second plate 40 and the first sub-intermediate structure 50a (i.e., heat exchange chambers 543 located in the first sub-intermediate structure 50a), and multiple second heat exchange chambers 543d are formed between the second plate 40 and the intermediate structure 50. Each of the multiple second heat exchange chambers 543d corresponds one-to-one with a multiple liquid flow chamber 540 (i.e., multiple liquid flow chambers 540 located in the first sub-intermediate structure 50a). The second heat exchange chambers 543d are connected to the liquid distribution chamber 541 through a jet hole 547 located in the first sub-intermediate structure 50a. The second heat exchange chambers 543d are connected to the liquid collection chamber 542 through a flow hole 548 located in the first sub-intermediate structure 50a (as shown in Figure 11).

[0207] It can be understood that the multiple first heat exchange chambers 543c, the multiple liquid flow chambers 540 disposed in the first sub-intermediate structure 50a, the multiple liquid flow chambers 540 disposed in the second sub-intermediate structure 50b, and the multiple second heat exchange chambers 543d correspond one-to-one. That is, the multiple first heat exchange chambers 543c, the multiple liquid flow chambers 540, and the multiple second heat exchange chambers 543d correspond one-to-one. The projection of the liquid distribution chamber 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlaps with the projection of the first heat exchange chamber 543c in the Z-axis direction (i.e., the thickness direction of the radiator 20), and also overlaps with the projection of the second heat exchange chamber 543d in the Z-axis direction (i.e., the thickness direction of the radiator 20). The liquid distribution chamber 541 is connected to the first heat exchange chamber 543c and the second heat exchange chamber 543d respectively through the jet hole 547, and the liquid collection chamber 542 is connected to the first heat exchange chamber 543c and the second heat exchange chamber 543d respectively through the flow hole 548. The second plate 40 covers the first mating hole 58 of the first sub-intermediate structure 50a. The second plate 40 covers the second mating hole 59 of the first sub-intermediate structure 50a.

[0208] It is understood that multiple first power units 10a are disposed on one side of the first plate 30 and facing away from the second sub-intermediate structure 50b. The projections of the multiple first power units 10a in the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​overlap one-to-one with the projections of the multiple first heat exchange cavities 543c in the Z-axis direction (i.e., the thickness direction of the heat sink 20). Multiple second power units 10b are disposed on one side of the second plate 40 and facing away from the first sub-intermediate structure 50a. The projections of the multiple second power units 10b in the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​overlap one-to-one with the projections of the multiple second heat exchange cavities 543d in the Z-axis direction (i.e., the thickness direction of the heat sink 20).

[0209] As shown in Figures 11, 16 and 17, in the power module 200 provided in this embodiment, the cooling medium can flow into the radiator 20 from the inlet 60 (as shown in Figure 6) and then flow out of the radiator 20 from the outlet 70 (as shown in Figure 6). The cooling medium flows from the inlet 60 into the distribution chamber 541 of a flow chamber 540, and from the distribution chamber 541 through the jet hole 547 into the first heat exchange chamber 543c and the second heat exchange chamber 543d corresponding to the flow chamber 540. The cooling medium in the first heat exchange chamber 543c and the second heat exchange chamber 543d flows into the collection chamber 542 through the flow hole 548, and then into the distribution chamber 541 of another flow chamber 540. The cooling medium in the distribution chamber 541 flows from the jet hole 547 into the first heat exchange chamber 543c and the second heat exchange chamber 543d corresponding to the flow chamber 540. The cooling medium in the first heat exchange chamber 543c and the second heat exchange chamber 543d flows into the collection chamber 542 through the flow hole 548, and then flows out of the collection chamber 542 from the outlet 70.

[0210] Since the projections of multiple first power units 10a on the Z-axis direction (i.e., the thickness direction of the radiator 20) overlap one-to-one with the projections of multiple first heat exchange chambers 543c on the Z-axis direction (i.e., the thickness direction of the radiator 20), the heat generated by the multiple first power units 10a during operation is transferred one-to-one to the cooling medium in the multiple first heat exchange chambers 543c along the Z-axis direction (i.e., the thickness direction of the radiator 20). The cooling medium flowing out of the radiator 20 from the first heat exchange chambers 543c can transfer the heat generated by the multiple first power units 10a during operation to the external environment, thereby achieving rapid heat dissipation of the multiple first power units 10a.

[0211] Since the projections of multiple second power units 10b on the Z-axis direction (i.e., the thickness direction of the radiator 20) overlap one-to-one with the projections of multiple second heat exchange chambers 543d on the Z-axis direction (i.e., the thickness direction of the radiator 20), the heat generated by the multiple second power units 10b during operation is transferred one-to-one to the cooling medium in the multiple second heat exchange chambers 543d along the Z-axis direction (i.e., the thickness direction of the radiator 20). The cooling medium flowing out of the radiator 20 from the second heat exchange chambers 543d can transfer the heat generated by the multiple second power units 10b during operation to the external environment, thereby achieving rapid heat dissipation of the multiple second power units 10b.

[0212] Compared to the existing power module 200, in the power module 200 provided in this embodiment, since the projection of the heat exchange chamber 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlaps with the projection of the liquid distribution chamber 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20), the cooling medium can flow from the liquid distribution chamber 541 of each liquid flow chamber 540 into the corresponding heat exchange chamber 543 along the Z-axis direction (i.e., the thickness direction of the radiator 20). The cooling medium in the multiple first heat exchange chambers 543c can provide overall heat dissipation for the multiple first power units 10a in a one-to-one correspondence, and the cooling medium in the multiple second heat exchange chambers 543d... Each of the multiple second power units 10b can be cooled as a whole in a one-to-one correspondence, which is beneficial to improving the heat dissipation efficiency of each first power unit 10a and each second power unit 10b. Moreover, it is beneficial to increase the flow rate of the cooling medium from the distribution chamber 541 of each flow chamber 540 into the corresponding first heat exchange chamber 543c and second heat exchange chamber 543d, which is beneficial to improving the heat exchange capacity of the cooling medium in each first heat exchange chamber 543c and each second heat exchange chamber 543d, and thus improving the heat dissipation efficiency of the first power unit 10a and second power unit 10b. Since the multiple flow chambers 540 are arranged sequentially along the length of the heat sink 20, the power module 200 can avoid occupying an excessively large size in the thickness direction of the heat sink 20, which is beneficial to reducing the size of the heat sink 20 in the thickness direction, and thus to the miniaturization design of the heat sink 20 and the power module 200.

[0213] The design of multiple first power units 10a being disposed on the side of the first plate 30 away from the intermediate structure 50, and multiple second power units 10b being disposed on the side of the second plate 40 away from the intermediate structure 50, ensures that the heat generated by the multiple first power units 10a and the multiple second power units 10b during operation can be transferred along the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​to the heat sink 20, and then transferred to the external environment through the heat sink 20, achieving rapid heat dissipation for the multiple first power units 10a and the multiple second power units 10b. It can be understood that the heat sink 20 can dissipate heat from both sides, which is beneficial to improving the heat dissipation capacity of the heat sink 20. Moreover, the heat dissipation of multiple first power units 10a and multiple second power units 10b can be achieved through a single heat sink 20, avoiding the need for additional heat sinks 20 to dissipate heat from the first power units 10a and the second power units 10b separately, which helps reduce the processing cost of the power module 200 and facilitates the miniaturization design of the power module 200.

[0214] Please refer to Figures 18 and 19, and in conjunction with Figure 3. Figure 18 is a structural schematic diagram of the power module 200 shown in Figure 2, cut along line AA in another embodiment. Figure 19 is an exploded three-dimensional structural schematic diagram of the power module 200 shown in Figure 18.

[0215] In some other embodiments, there are two heat sinks 20. The two heat sinks 20 are a first heat sink 20c and a second heat sink 20d. In other words, the heat sink 20 includes a first heat sink 20c and a second heat sink 20d. In the Z-axis direction, the first heat sink 20c and the second heat sink 20d are fixedly stacked on both sides of the plurality of power units 10. The first heat sink 20c and the second heat sink 20d are disposed on both sides of the power unit 10.

[0216] Each power unit 10 includes a substrate 11 and a power device 12. The substrate 11 includes a first substrate 11a and a second substrate 11b. In the Z-axis direction, the power device 12 is fixedly stacked between the first substrate 11a and the second substrate 11b. The power device 12 is disposed between the first substrate 11a and the second substrate 11b. The first substrate 11a is fixedly stacked with the first heat sink 20c, and the second substrate 11b is fixedly stacked with the second heat sink 20d.

[0217] Each heat sink 20 includes a first plate 30, a second plate 40, and an intermediate structure 50. In the Z-axis direction, the first plate 30 and the second plate 40 are fixedly stacked on both sides of the intermediate structure 50. The intermediate structure 50 is provided with multiple corresponding mounting holes 53, multiple liquid chambers 54, multiple mating chambers 55, a liquid inlet chamber 56, a corresponding mating chamber 57, a first mating hole 58, and a second mating hole 59. Specifically, the intermediate structure 50 is provided with multiple corresponding mounting holes 53, a first liquid chamber 54a, a second liquid chamber 54b, a third liquid chamber 54c, multiple mating chambers 55, a liquid inlet chamber 56, a corresponding mating chamber 57, a first mating hole 58, and a second mating hole 59. The structure and mating relationships of the above features can be referred to the relevant description of the embodiment shown in Figure 3, and will not be repeated here.

[0218] Each liquid chamber 54 includes a dispensing chamber 541, a collecting chamber 542, and a heat exchange chamber 543. In the X-axis direction, the collecting chamber 542 is located to one side of the dispensing chamber 541 and is spaced apart from it. The heat exchange chamber 543 is located to one side of the collecting chamber 542 and close to the dispensing chamber 541, and is spaced apart from it. In the Z-axis direction, the heat exchange chamber 543 is located to one side of the dispensing chamber 541 and is spaced apart from it. Liquid distribution chamber 541 extends along the Z-axis and has a mounting opening 5410. Liquid collection chamber 542 extends along the Z-axis and has a mounting opening 5420. Heat exchange chamber 543 extends along the Z-axis and has a mounting opening 5430. The mounting openings 5410 and 5420 of liquid distribution chamber 541 and liquid collection chamber 542 both face the first plate 30, and the mounting opening 5430 of heat exchange chamber 543 faces the second plate 40. Liquid distribution chamber 541 and heat exchange chamber 543 are connected through a jet hole 547. Heat exchange chamber 543 and liquid collection chamber 542 are connected through a flow hole 548.

[0219] The mating relationships between the mating cavity 55, the liquid inlet cavity 56, the corresponding mating cavity 57, the first mating hole 58, and the second mating hole 59 and each liquid cavity 54 can be referred to the relevant description of the embodiment shown in FIG3. Each mating cavity 55 extends along the Z-axis direction and has a mating opening 550, which faces the first plate 30. The liquid inlet cavity 56 extends along the Z-axis direction and has a liquid inlet opening 560, which faces the first plate 30. The corresponding mating cavity 57 extends along the Z-axis direction and has a corresponding mating opening 570, which faces the first plate 30.

[0220] The first plate 30 covers the mounting opening 5410 of the dispensing chamber 541 and the mounting opening 5420 of the collecting chamber 542 of each liquid chamber 54. The first plate 30 covers the mating opening 550 of each mating chamber 55. The first plate 30 covers the inlet port 560 of the inlet chamber 56. The first plate 30 covers the corresponding mating opening 570 of the corresponding mating chamber 57. The second plate 40 covers the mounting opening 5430 of the heat exchange chamber 543 of each liquid chamber 54.

[0221] It is understood that the first heat sink 20c includes a first plate 30c, a second plate 40c, and an intermediate structure 50c. The specific mating relationships can be found in the relevant description of the heat sink 20 in this embodiment, and will not be repeated here. Specifically, the first mating hole 58 and the second mating hole 59 of the intermediate structure 50c are both exposed outside the first plate 30c and the second plate 40c. The liquid inlet chamber 56 of the intermediate structure 50c is partially exposed outside the first plate 30c and extends from the first mating hole 58 to the outside of the second plate 40c. The liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c is partially exposed outside the first plate 30c and extends from the second mating hole 59 to the outside of the second plate 40c.

[0222] The second heat sink 20d includes a first plate 30d, a second plate 40d, and an intermediate structure 50d. The specific mating relationships can be found in the relevant description of the heat sink 20 in this embodiment, and will not be repeated here. The first mating hole 58 and the second mating hole 59 of the intermediate structure 50d are partially exposed outside the second plate 40d. The liquid inlet chamber 56 of the intermediate structure 50d is partially exposed outside the second plate 40d through the first mating hole 58. The liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50d is partially exposed outside the second plate 40d through the second mating hole 59.

[0223] In the Z-axis direction, the second plate 40c and the second plate 40d are positioned opposite each other and spaced apart. The first plate 30c and the intermediate structure 50c are located on one side of the second plate 40c and facing away from the second plate 40d, while the first plate 30d and the intermediate structure 50d are located on one side of the second plate 40d and facing away from the second plate 40c. That is, in the Z-axis direction, the intermediate structure 50c and the intermediate structure 50d are positioned opposite each other. Multiple power units 10 are fixedly stacked between the second plate 40c (i.e., the second plate 40 of the first heat sink 20c) and the second plate 40d (i.e., the second plate 40 of the second heat sink 20d), and the power units 10 are fixedly stacked between the second plate 40c (i.e., the second plate 40 of the first heat sink 20c) and the second plate 40d (i.e., the second plate 40 of the second heat sink 20d). Specifically, the first substrate 11a of each power unit 10 is fixedly stacked with the second plate 40c, and the second substrate 11b is fixedly stacked with the second plate 40d. That is to say, in the Z-axis direction (i.e., the thickness direction of the heat sink 20), the power unit 10 is disposed between the second plate 40c (i.e., the second plate 40 of the first heat sink 20c) and the second plate 40d (i.e., the second plate 40 of the second heat sink 20d).

[0224] It can be understood that, in the Z-axis direction (i.e., the thickness direction of the radiator 20), the heat exchange chamber 543 of the first radiator 20c is located on one side of the liquid distribution chamber 541 of the first radiator 20c and close to the power unit 10, and the heat exchange chamber 543 of the second radiator 20d is located on one side of the liquid distribution chamber 541 of the second radiator 20d and close to the power unit 10.

[0225] In this embodiment, a plurality of fasteners 4 are provided between the first heat sink 20c and the second heat sink 20d, and the first heat sink 20c and the second heat sink 20d are assembled together by the plurality of fasteners 4. Specifically, both the second plate 40c and the second plate 40d are provided with a plurality of mounting holes 41. The plurality of mounting holes 41 of the second plate 40c, the plurality of corresponding mounting holes 53 of the intermediate structure 50c, the plurality of mounting holes 41 of the second plate 40d, and the plurality of corresponding mounting holes 53 of the intermediate structure 50d are connected in a one-to-one manner. In the Z-axis direction, the plurality of fasteners 4 abut against the second plate 40c and the second plate 40d. In the Z-axis direction, one side of each of the multiple fasteners 4 is inserted into one of the multiple mounting holes 41 of the second plate 40c and one of the corresponding mounting holes 53 of the intermediate structure 50c; the other side of each of the multiple fasteners 4 is inserted into one of the multiple mounting holes 41 of the second plate 40d and one of the corresponding mounting holes 53 of the intermediate structure 50d. The multiple fasteners 4 are spaced apart from the multiple power units 10.

[0226] Thus, the first heat sink 20c and the second heat sink 20d are assembled together by multiple fasteners 4, which helps to improve the structural stability of the power module 200. Moreover, the design of the fasteners 4 abutting between the second plate 40c and the second plate 40d ensures that the fasteners 4 can support the first plate 30c and the second plate 40d, avoiding damage to the power unit 10 caused by being clamped by the first plate 30c and the second plate 40d, which helps to improve the service life and performance of the power unit 10.

[0227] In this embodiment, the first plate 30c is provided with a first liquid inlet 60c. In other words, the first radiator 20c is provided with a liquid inlet 60, and the liquid inlet 60 of the first radiator 20c (i.e., the first liquid inlet 60c) is disposed on the first plate 30 (i.e., the first plate 30c) of the first radiator 20c. The first liquid inlet 60c penetrates the first plate 30c along the Z-axis direction, and the projection of the first liquid inlet 60c in the Z-axis direction overlaps with the projection of the first mating hole 58 of the intermediate structure 50c in the Z-axis direction. The first liquid inlet 60c communicates with the liquid inlet cavity 56 of the intermediate structure 50c, and the first liquid inlet 60c communicates with the liquid distribution cavity 541 of the first liquid cavity 54a of the intermediate structure 50c.

[0228] The first plate 30c is provided with a first liquid outlet 70c. In other words, the first radiator 20c is provided with a liquid outlet 70, and the liquid outlet 70 of the first radiator 20c (i.e., the first liquid outlet 70c) is located on the first plate 30 of the first radiator 20c (i.e., the first plate 30c). The first liquid outlet 70c penetrates the first plate 30c along the Z-axis direction. The projection of the first liquid outlet 70c in the Z-axis direction overlaps with the projection of the second mating hole 59 of the intermediate structure 50c in the Z-axis direction. The first liquid outlet 70c communicates with the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c.

[0229] In this embodiment, the first radiator 20c further includes a first connector 2 and a second connector 3. A portion of the first connector 2 is inserted into the first liquid inlet 60c; the other portion is located outside the first liquid inlet 60c, on one side of the first plate 30c and facing away from the second plate 40c. The first connector 2 is provided with a liquid inlet channel 201. The liquid inlet channel 201 extends through the first connector 2 along the Z-axis and communicates with the liquid inlet cavity 56 of the intermediate structure 50c.

[0230] A portion of the second connector 3 is inserted into the first liquid outlet 70c; the other portion is located outside the first liquid outlet 70c, on one side of the first plate 30c and facing away from the second plate 40c. The second connector 3 is provided with a liquid outlet channel 301. The liquid outlet channel 301 extends through the second connector 3 along the Z-axis and communicates with the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c.

[0231] The second plate 40c is provided with a first through hole 42a and a second through hole 43a, both of which penetrate the second plate 40c along the Z-axis direction. The projection of the first through hole 42a in the Z-axis direction overlaps with the projection of the first mating hole 58 of the intermediate structure 50c in the Z-axis direction, and the first through hole 42a communicates with the first mating hole 58 of the intermediate structure 50c. The projection of the second through hole 43a in the Z-axis direction overlaps with the projection of the second mating hole 59 of the intermediate structure 50c in the Z-axis direction, and the second through hole 43a communicates with the second mating hole 59 of the intermediate structure 50c.

[0232] The first plate 30d is provided with a second liquid inlet 60d. In other words, the second radiator 20d is provided with a liquid inlet 60, and the liquid inlet 60 of the second radiator 20d (i.e., the second liquid inlet 60d) is located on the first plate 30 of the second radiator 20d (i.e., the first plate 30d). The second liquid inlet 60d penetrates the first plate 30d along the Z-axis direction. The projection of the second liquid inlet 60d in the Z-axis direction overlaps with the projection of the first mating hole 58 of the intermediate structure 50d in the Z-axis direction. The second liquid inlet 60d communicates with the liquid inlet cavity 56 of the intermediate structure 50d and with the liquid distribution cavity 541 of the first liquid cavity 54a of the intermediate structure 50d. The projection of the second liquid inlet 60d in the Z-axis direction overlaps with the projection of the first through hole 42a of the second plate 40c in the Z-axis direction.

[0233] The first plate 30d is provided with a second liquid outlet 70d. In other words, the second radiator 20d is provided with a liquid outlet 70, and the liquid outlet 70 of the second radiator 20d (i.e., the second liquid outlet 70d) is located on the first plate 30 (i.e., the first plate 30d) of the second radiator 20d. The second liquid outlet 70d penetrates the first plate 30d along the Z-axis direction. The projection of the second liquid outlet 70d in the Z-axis direction overlaps with the projection of the second mating hole 59 of the intermediate structure 50d in the Z-axis direction. The second liquid outlet 70d communicates with the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50d. The projection of the second liquid outlet 70d in the Z-axis direction overlaps with the projection of the second through hole 43a of the second plate 40c in the Z-axis direction.

[0234] In this embodiment, the second radiator 20d further includes a third connector 5 and a fourth connector 6. In the Z-axis direction, one side of the third connector 5 is inserted into the first through hole 42a of the second plate 40c, and the other side is fixedly stacked with the second plate 40d. The third connector 5 is provided with a first channel 502. The first channel 502 extends through the third connector 5 along the Z-axis direction, communicating with the liquid inlet chamber 56 of the intermediate structure 50c and the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50c. The first channel 502 also communicates with the second liquid inlet 60d, the liquid inlet chamber 56 of the intermediate structure 50d, and the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50d. Thus, the liquid inlet channel 201, the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50c, the first channel 502, the second liquid inlet 60d, and the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50d are connected. The first liquid inlet 60c, the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50c, the first channel 502, the second liquid inlet 60d, and the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50d are connected.

[0235] It can be understood that, through the third connector 5, the liquid inlet 60 (i.e., the first liquid inlet 60c) of the first radiator 20c, the liquid distribution chamber 541 of the first radiator 20c (i.e., the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50c), the liquid inlet 60 (i.e., the second liquid inlet 60d) of the second radiator 20d, and the liquid distribution chamber 541 of the second radiator 20d (i.e., the liquid distribution chamber 541 of the first liquid chamber 54a of the intermediate structure 50d) are interconnected. That is, the liquid inlet 60 (i.e., the second liquid inlet 60d) of the second radiator 20d is connected to the liquid inlet 60 (i.e., the first liquid inlet 60c) of the first radiator 20c.

[0236] In the Z-axis direction, one side of the fourth connector 6 is inserted into the second through hole 43a of the second plate 40c, and the other side is fixedly stacked with the second plate 40d. The fourth connector 6 is provided with a second channel 601. The second channel 601 extends through the fourth connector 6 along the Z-axis direction and communicates with the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c. The second channel 601 communicates with the second liquid outlet 70d and the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50d. Thus, the liquid outlet channel 301, the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c, the second channel 601, the second liquid outlet 70d, and the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c are interconnected. The first liquid outlet 70c, the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c, the second channel 601, the second liquid outlet 70d, and the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50d are connected.

[0237] It can be understood that, through the fourth connector 6, the liquid collection chamber 542 of the second radiator 20d (i.e., the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50d), the liquid outlet 70 of the second radiator 20d (i.e., the second liquid outlet 70d), the liquid collection chamber 542 of the first radiator 20c (i.e., the liquid collection chamber 542 of the third liquid chamber 54c of the intermediate structure 50c), and the liquid outlet 70 of the first radiator 20c (i.e., the first liquid outlet 70c) are interconnected. That is, the liquid outlet 70 of the second radiator 20d (i.e., the second liquid outlet 70d) is connected to the liquid outlet 70 of the first radiator 20c (i.e., the first liquid outlet 70c).

[0238] The cooling medium flows into the first radiator 20c from the inlet channel 201 of the first connector 2. The cooling medium flows out of the first radiator 20c from the first radiator 20c via the outlet channel 301 of the second connector 3. The cooling medium flows into the second radiator 20d from the inlet channel 201 of the first connector 2, through the first radiator 20c and the first channel 502 of the third connector 5. The cooling medium flows into the first radiator 20c from the second radiator 20d via the second channel 601 of the fourth connector 6, and then flows out of the first radiator 20c from the first radiator 20c via the outlet channel 301 of the second connector 3. The flow of the cooling medium in the first radiator 20c and the flow of the cooling medium in the second radiator 20d can be referred to the relevant description of the embodiment shown in Figure 3, and will not be repeated here.

[0239] The heat generated by the power unit 10 during operation can be transferred through the second plate 40 (i.e., the second plate 40c) of the first heat sink 20c to the cooling medium flowing within the first heat sink 20c, thereby transferring the heat generated by the power unit 10 to the external environment. Furthermore, the heat generated by the power unit 10 during operation can also be transferred through the second plate 40 (i.e., the second plate 40d) of the second heat sink 20d to the cooling medium flowing within the second heat sink 20d, thereby transferring the heat generated by the power unit 10 to the external environment. Double-sided heat dissipation of the power unit 10 is achieved through the first heat sink 20c and the second heat sink 20d.

[0240] It is understandable that the design of the power unit 10 being positioned between the second plate (i.e., the second plate 40c) of the first heat sink 20c and the second plate 40 (i.e., the second plate 40d) of the second heat sink 20d in the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​ensures that the heat generated when the power device 12 is working can be transferred along the Z-axis direction through the first substrate 11a to the first heat sink 20c, and the heat generated when the power device 12 is working can be transferred along the Z-axis direction through the second substrate 11b to the second heat sink 20d. This ensures that the heat generated when the power unit 10 is working can be transferred along the Z-axis direction (i.e., the thickness direction of the heat sink 20) ​​to the first heat sink 20c and the second heat sink 20d respectively, and then transferred to the external environment through the first heat sink 20c and the second heat sink 20d, thereby achieving double-sided heat dissipation of the power unit 10 and improving the heat dissipation efficiency of the power unit 10.

[0241] Please refer again to Figures 2, 3, 4, 6, and 18. This application embodiment provides a power module 200. The power module 200 includes multiple power units 10 and a heat sink 20. The heat sink 20 includes a first plate 30, an intermediate structure 50, a second plate 40, a liquid inlet 60, and a liquid outlet 70. The intermediate structure 50 is disposed between the first plate 30 and the second plate 40. Each power unit 10 is disposed on the side of the second plate 40 away from the intermediate structure 50. Multiple liquid flow chambers 540 are formed between the first plate 30 and the intermediate structure 50. The multiple liquid flow chambers 540 are arranged sequentially along the X-axis direction (i.e., the length direction of the heat sink 20). Each liquid flow chamber 540 includes a distributing chamber 541 and a collecting chamber 542 spaced apart from each other. In two adjacent liquid flow chambers 540, the collecting chamber 542 of one liquid flow chamber 540 is connected to the distributing chamber 541 of the other liquid flow chamber 540. The inlet 60 is connected to the distribution chamber 541 of one of the multiple flow chambers 540 (i.e., the flow chamber 540 of the first liquid chamber 54a). The outlet 70 is connected to the collection chamber 542 of another flow chamber 540 (i.e., the flow chamber 540 of the third liquid chamber 54c).

[0242] Multiple heat exchange chambers 543 are formed between the intermediate structure 50 and the second plate 40. Each heat exchange chamber 543 corresponds to a liquid flow chamber 540. The projection of the heat exchange chamber 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlaps with the projection of the liquid distribution chamber 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20). The intermediate structure 50 is provided with jet holes 547 and flow holes 548. The liquid distribution chamber 541 and the heat exchange chamber 543 are connected through the jet holes 547, and the liquid collection chamber 542 and the heat exchange chamber 543 are connected through the flow holes 548. The projections of multiple power units 10 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlap one-to-one with the projections of multiple heat exchange chambers 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20).

[0243] In the power module 200 provided in this application embodiment, the cooling medium flows into the radiator 20 from the inlet 60 (as shown in Figure 6) and then flows out of the radiator 20 from the outlet 70. Specifically, the cooling medium flows from the inlet 60 into the distribution chamber 541 of a flow chamber 540 (i.e., the flow chamber 540 of the first liquid chamber 54a), flows from the distribution chamber 541 into the heat exchange chamber 543 corresponding to the flow chamber 540 through the jet hole 547, flows from the heat exchange chamber 543 into the collection chamber 542 through the flow hole 548, then flows into the distribution chamber 541 of another flow chamber 540 (i.e., the flow chamber 540 of the third liquid chamber 54c), flows from the distribution chamber 541 into the heat exchange chamber 543 corresponding to the flow chamber 540 through the jet hole 547, flows from the heat exchange chamber 543 into the collection chamber 542 through the flow hole 548, and then flows out of the collection chamber 542 from the outlet 70.

[0244] Since the projections of multiple power units 10 on the Z-axis direction (i.e., the thickness direction of the radiator 20) overlap one-to-one with the projections of multiple heat exchange chambers 543 on the Z-axis direction (i.e., the thickness direction of the radiator 20), the heat generated by the multiple power units 10 during operation is transferred one-to-one to the cooling medium in the multiple heat exchange chambers 543 along the Z-axis direction (i.e., the thickness direction of the radiator 20). The cooling medium flowing out of the radiator 20 from the heat exchange chambers 543 can transfer the heat generated by the multiple power units 10 during operation to the external environment, thereby achieving rapid heat dissipation of the multiple power units 10.

[0245] Compared to the existing power module 200, in the power module 200 provided in this application embodiment, since the projection of the heat exchange cavity 543 in the Z-axis direction (i.e., the thickness direction of the radiator 20) overlaps with the projection of the liquid distribution cavity 541 in the Z-axis direction (i.e., the thickness direction of the radiator 20), and the heat exchange cavity 543 is connected to the liquid distribution cavity 541 through the jet hole 547, the cooling medium can flow from the liquid distribution cavity 541 of each liquid flow cavity 540 into the corresponding heat exchange cavity 543 along the Z-axis direction (i.e., the thickness direction of the radiator 20) through the jet hole 547. The cooling medium in the multiple heat exchange cavities 543 can perform overall heat dissipation on the multiple power units 10 one by one, which is beneficial to improving the heat dissipation efficiency of each power unit 10. Moreover, it is beneficial to increase the flow rate of the cooling medium from the liquid distribution cavity 541 of each liquid flow cavity 540 into the corresponding heat exchange cavity 543, which is beneficial to increase the heat exchange capacity of the cooling medium in each heat exchange cavity 543, and is beneficial to improve the heat dissipation efficiency of the multiple power units 10. Since multiple fluid flow chambers 540 are arranged sequentially along the X-axis (i.e., the length direction of the heat sink 20), the power module 200 can avoid occupying too large a size in the Z-axis (i.e., the thickness direction of the heat sink 20), which is beneficial to reducing the size of the heat sink 20 in the Z-axis (i.e., the thickness direction of the heat sink 20), and is beneficial to the miniaturization design of the heat sink 20 and the power module 200.

Claims

1. A power module, characterized in that, The power module includes: Multiple power units; and A radiator includes a first plate, an intermediate structure, a second plate, an inlet, and an outlet. The intermediate structure is disposed between the first plate and the second plate. Each power unit is disposed on the side of the second plate away from the intermediate structure. A plurality of liquid flow chambers are formed between the first plate and the intermediate structure. The plurality of liquid flow chambers are arranged sequentially along the length of the radiator. Each liquid flow chamber includes a liquid distribution chamber and a liquid collection chamber that are spaced apart from each other. In two adjacent liquid flow chambers, the liquid collection chamber of one liquid flow chamber is connected to the liquid distribution chamber of the other liquid flow chamber. The inlet is connected to the distribution chamber of one of the plurality of flow chambers, and the outlet is connected to the collection chamber of another flow chamber among the plurality of flow chambers. Multiple heat exchange cavities are formed between the intermediate structure and the second plate. Each heat exchange cavity corresponds to a liquid flow cavity. The projection of the heat exchange cavity in the thickness direction of the radiator overlaps with the projection of the liquid distribution cavity in the thickness direction of the radiator. The intermediate structure is provided with jet holes and flow holes. The liquid distribution cavity and the heat exchange cavity are connected through the jet holes, and the liquid collection cavity and the heat exchange cavity are connected through the flow holes.

2. The power module according to claim 1, characterized in that, The projections of the multiple power units in the thickness direction of the radiator correspond one-to-one with the projections of the multiple heat exchange cavities in the thickness direction of the radiator.

3. The power module according to claim 1, characterized in that, The size of the liquid collection chamber in the thickness direction of the radiator is larger than the size of the liquid distribution chamber in the thickness direction of the radiator.

4. The power module according to claim 3, characterized in that, A mating cavity is provided between two adjacent flow chambers. The mating cavity is located between the liquid collection cavity of one flow chamber and the liquid distribution cavity of the other flow chamber. From the liquid collection cavity adjacent to the mating cavity toward the liquid distribution cavity adjacent to the mating cavity, the size of the mating cavity gradually decreases in the thickness direction of the radiator.

5. The power module according to any one of claims 1 to 4, characterized in that, The flow holes include a first flow hole and a second flow hole. In the width direction of the radiator, the first flow hole and the second flow hole are located on both sides of the heat exchange cavity. The intermediate structure is provided with a partition, which is housed in the liquid collection cavity. In the width direction of the radiator, the partition is located between the first flow hole and the second flow hole.

6. The power module according to any one of claims 1 to 4, characterized in that, The intermediate structure has at least one heat dissipation tooth on the side facing the second plate. Each heat dissipation tooth is housed in the heat exchange cavity. Each heat dissipation tooth is located outside the jet hole. Each heat dissipation tooth extends along the thickness direction of the radiator and abuts against the second plate.

7. The power module according to claim 6, characterized in that, In the width direction of the radiator, a plurality of heat dissipation teeth are located on both sides of the jet hole, and a flow channel is formed between the heat dissipation teeth on one side of the jet hole and the heat dissipation teeth on the other side of the jet hole, and the flow channel is connected to the jet hole and the flow hole.

8. The power module according to claim 7, characterized in that, The number of heat dissipation teeth located on one side of the jet hole is multiple, and the multiple heat dissipation teeth located on one side of the jet hole are spaced apart along the length direction of the radiator.

9. The power module according to claim 8, characterized in that, The plurality of heat dissipation teeth located on one side of the jet hole include needle teeth and strip teeth. The size of the strip teeth in the length direction of the heat sink is greater than or equal to twice the size of the needle teeth in the length direction of the heat sink. In the length direction of the heat sink, the strip teeth are located on one side of the needle teeth and away from the jet hole. The strip teeth and the needle teeth are spaced apart.

10. The power module according to claim 1, characterized in that, The jet orifice includes a first jet orifice and a second jet orifice. In the length direction of the radiator, the first jet orifice is located on one side of the flow hole and away from the liquid collection chamber, and the second jet orifice is located on one side of the flow hole and away from the first jet orifice.

11. The power module according to claim 10, characterized in that, The intermediate structure is provided with a first partition, which is housed in the heat exchange cavity. The first partition is located between the first jet hole and the second jet hole and extends in the width direction of the radiator. The first partition abuts against the second plate.

12. The power module according to claim 11, characterized in that, Both ends of the first partition bend toward the second jet hole along the length of the heat sink.

13. The power module according to claim 10, characterized in that, The flow hole includes a mating hole wall. In the length direction of the radiator, the mating hole wall faces the first jet hole. The mating hole wall is provided with a mating arc portion, which is received in the flow hole. The mating arc portion is opposite to the liquid collection chamber along the width direction of the radiator relative to the mating hole wall.

14. The power module according to any one of claims 10 to 13, characterized in that, The number of first jet holes is multiple. In the width direction of the radiator, the multiple first jet holes are spaced apart. The intermediate structure is provided with a second partition. The second partition is housed in the heat exchange cavity. In the width direction of the radiator, the second partition is located between two adjacent first jet holes. The second partition abuts against the second plate.

15. The power module according to any one of claims 1 to 4, characterized in that, The radiator includes a first radiator and a second radiator. In the thickness direction of the radiator, the power unit is disposed between the second plate of the first radiator and the second plate of the second radiator. The liquid inlet of the second radiator is connected to the liquid inlet of the first radiator, and the liquid outlet of the second radiator is connected to the liquid inlet of the first radiator.

16. A power module, characterized in that, The power module includes: Multiple first power units; Multiple second power units; and A radiator includes a first plate, an intermediate structure, a second plate, an inlet, and an outlet. The intermediate structure is disposed between the first plate and the second plate. A plurality of first power units are disposed on the side of the first plate away from the intermediate structure, and a plurality of second power units are disposed on the side of the second plate away from the intermediate structure. The intermediate structure includes multiple liquid flow chambers arranged sequentially along the length of the radiator. Each liquid flow chamber includes a distribution chamber and a collection chamber spaced apart from each other. In two adjacent liquid flow chambers, the collection chamber of one liquid flow chamber is connected to the distribution chamber of the other liquid flow chamber. The liquid inlet is connected to the distribution chamber of one of the multiple liquid flow chambers. The liquid outlet is connected to the collection chamber of another of the multiple liquid flow chambers. A plurality of first heat exchange cavities are formed between the first plate and the intermediate structure, and a plurality of second heat exchange cavities are formed between the second plate and the intermediate structure. The plurality of first heat exchange cavities, the plurality of liquid flow cavities, and the plurality of second heat exchange cavities correspond one-to-one. The projection of the liquid distribution cavity in the thickness direction of the radiator overlaps with the projection of the first heat exchange cavity in the thickness direction of the radiator, and also overlaps with the projection of the second heat exchange cavity in the thickness direction of the radiator. The intermediate structure is provided with jet holes and flow holes. The liquid distribution cavity is connected to the first heat exchange cavity and the second heat exchange cavity respectively through the jet holes, and the liquid collection cavity is connected to the first heat exchange cavity and the second heat exchange cavity respectively through the flow holes.

17. The power module according to claim 16, characterized in that, The projections of the plurality of first power units in the thickness direction of the radiator overlap one-to-one with the projections of the plurality of first heat exchange cavities in the thickness direction of the radiator, and the projections of the plurality of second power units in the thickness direction of the radiator overlap one-to-one with the projections of the plurality of second heat exchange cavities in the thickness direction of the radiator.

18. A power conversion device, characterized in that, The power conversion device includes a control circuit board and a power module as described in any one of claims 1 to 17, wherein the power module is mounted on the control circuit board.

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