Method for producing a cooling plate for a heat exchanger

Abstract

The invention relates to a method (1) for producing a cooling plate (2) for a heat exchanger in an installation (7). In the method, a base plate (3), a channel plate (4), and an adhesion layer (5) are continuously conveyed through at least one temperature-control module (8) and at least one pressure-generating module (10) of the installation (7), thereby producing the cooling plate (2). The invention also relates to the installation (7) for carrying out the method (1) and to the cooling plate (2) produced in the method (1).

Description

[0001] Method for manufacturing a cooling plate for a heat exchanger

[0002] The invention relates to a method for manufacturing a cooling plate for a heat exchanger in a system. The invention also relates to the system for manufacturing the cooling plate and the cooling plate manufactured by the method.

[0003] To maintain the performance of a traction battery in a battery-powered vehicle, the battery cells are typically cooled. This is achieved by attaching cooling plates to the battery cells, allowing a fluid to flow through them. Each cooling plate usually comprises a flat base plate and a corrugated channel plate, which are bonded together. The channel plate protrudes from the base plate in certain areas, creating channels between them. Typically, the base plate and channel plate are made of aluminum and soldered or welded together. Soldering reduces the strength of the aluminum, necessitating thicker base and channel plates than necessary. This, unfortunately, results in a heavier cooling plate.Furthermore, the production of large-area cooling plates is not economically viable due to the need for a correspondingly large brazing furnace. Welding is a relatively slow process for manufacturing the cooling plate, and the plate heats up considerably. Additionally, welding involves a significant investment in equipment.

[0004] The object of the invention is therefore to provide an improved or at least alternative embodiment of a method of the generic type, in which the described disadvantages are overcome. The object of the invention is also to provide a suitable apparatus for carrying out the method and also the cooling plate produced in the method. This object is achieved according to the invention by the subject matter of the independent claims. Advantageous embodiments are the subject matter of the dependent claims.

[0005] The present invention is based on the basic idea of ​​manufacturing the cooling plate by gluing in a continuous system in order to reduce manufacturing times and manufacturing costs.

[0006] The method according to the invention is designed for manufacturing a cooling plate with at least one fluid channel through which a fluid can flow for a heat exchanger in a system. The method includes measures a), b), c), and d). In measure a), a base plate, a channel plate, and an adhesive layer are provided. The channel plate has at least one channel section or recess for forming the at least one fluid channel of the cooling plate and at least two joining sections for bonding or connecting it to the base plate. The adhesive layer is arranged between the base plate and the channel plate and is formed by an adhesive.In measure b), the base plate, the channel plate, and the adhesion layer are arranged in the system and continuously transported in one direction by means of a conveying unit of the system through at least one temperature control module and at least one pressure generation module of the system. In measure c), the base plate, the channel plate, and the adhesion layer are heated in the at least one temperature control module of the system, so that the adhesion layer between the base plate and the channel plate is activated or liquefied.In measure d), the base plate, the channel plate, and the adhesion layer are pressed together in the at least one pressure generation module of the system, so that in the area of ​​the at least two joining sections of the channel plate between the base plate and the channel plate a material-bonded connection is formed by means of the activated adhesion layer, and in the area of ​​the at least one channel section of the channel plate the at least one fluid channel of the cooling plate is formed.

[0007] In the inventive method, conveying by means of the system's conveying unit in the conveying direction is continuous, so that the production of the cooling plate in the system is continuous. In step a), an arrangement consisting of the loose base plate, the loose channel plate, and the adhesive layer is arranged in the system, and in step d), the cooling plate is removed from the system. This significantly simplifies the production of the cooling plate. In particular, the semi-finished cooling plates do not need to be transported between individual production stations, thus reducing, and in particular eliminating, the effort required for unloading / loading the individual production stations as well as for storing / transporting the semi-finished cooling plates between the individual production stations.

[0008] By utilizing the adhesive layer formed by the adhesive, the need for special ovens and type-specific racks, as required for soldering, is eliminated. Furthermore, the base plate and the channel plate can be thinner than when soldered. The adhesive layer between the base plate and the channel plate also allows for a reliable and rapid creation of a material-bonded connection. Additionally, the base plate and the channel plate can be made of different materials, which is difficult to achieve with soldering. In particular, materials such as plastic, paper, ceramic, and / or metal—aluminum, steel, or others—can be joined together. Moreover, the adhesive layer can compensate for manufacturing tolerances between the base plate and the channel plate during the formation of the material-bonded connection.In the manufactured cooling plate, the adhesion layer can also compensate for the thermal expansion of the base plate and the channel plate.

[0009] In the process, measure a) provides the base plate, the channel plate, and the adhesive layer. The channel plate extends away from the base plate in at least one channel section and rests against the base plate in at least two joining sections. The adhesive layer is positioned between the base plate and the channel plate, so that the channel plate rests against the base plate via the adhesive layer. To simplify the handling of the base plate, the channel plate, and the adhesive layer in measure b), the base plate and the channel plate can be detachably or permanently attached to one another.

[0010] In one possible embodiment, measure a) provides a channel plate such that measure d) forms at least two, preferably more, fluid channels of the cooling plate. The joining sections and the channel sections of the channel plate can alternate in a direction parallel to the surface of the base plate. Each fluid channel of the cooling plate can be delimited on one side by the base plate and on the other side by the channel section of the channel plate. The individual fluid channels adjacent in the direction of extension can be fluidically separated from one another by the joining sections of the channel plate, which are materially bonded to the base plate.

[0011] In one possible embodiment, the adhesion layer can be provided in the form of an adhesive film in measure a).

[0012] In one possible embodiment, measure a) alternatively provides the adhesive layer in the form of an adhesive layer applied to the base plate and / or the channel plate. The adhesive layer can be applied to the base plate and / or the channel plate completely or only in certain areas. On the base plate, for example, the adhesive layer can be applied completely or only in the areas where the base plate and the channel plate will later be joined. On the channel plate, the adhesive layer can be applied completely or only in the joining sections of the channel plate. The adhesive layer can be applied to the entire base plate and / or the channel plate. Alternatively or additionally, the adhesive layer can be applied exclusively in the joining sections of the channel plate on the base plate and / or the channel plate.

[0013] The adhesive film or layer significantly reduces material consumption, especially compared to applying adhesive beads. Furthermore, it can reduce the adhesive's curing time to under 10 minutes. This allows for faster continuous conveying within the system and simplifies the overall manufacturing process of the cooling plate. Additionally, the adhesive application can be highly automated. The adhesive film also eliminates the need for liquid adhesive, thus removing the need for machinery such as pumps, nozzles, and valves.

[0014] In one possible embodiment, measure a) may provide the adhesive layer from an adhesive based on a thermoplastic adhesive, a polyolefin-based adhesive, a crosslinking adhesive, a hot melt adhesive, a polyolefin-based hot melt adhesive, an epoxy adhesive, a polyurethane adhesive, a silane-modified adhesive, or an acrylate adhesive. Adhesives, for example, from the group of crosslinking adhesives such as acrylates, epoxies, silicones, or MS polymers and combinations thereof, and especially thermoplastic adhesives, exhibit good media resistance.The thermoplastic adhesive is also environmentally friendly and, after the cooling plate's life cycle has ended, allows for the separation of the different materials of the cooling plate by sorting them according to type under low temperatures. Furthermore, no extraction system is necessary to ensure adequate occupational safety when using these adhesives. Additionally, these adhesives can be cured in a single step.

[0015] In measure b) of the process, the base plate, the channel plate, and the adhesion layer are arranged in the system and continuously transported in the conveying direction through the at least one temperature control module and the at least one pressure generation module of the system by means of the system's conveying unit. The conveying unit can, for example, comprise a track moving in the conveying direction and at least one drive unit powering the track. The conveying unit transports the base plate, the channel plate, and the adhesion layer in the conveying direction through all temperature control modules and all pressure generation modules. As described in more detail below, the system can comprise multiple temperature control modules and / or multiple pressure generation modules.The individual temperature control modules and pressure generation modules can alternate in the conveying direction, so that the base plate, the channel plate, and the adhesion layer pass through the individual temperature control modules and pressure generation modules sequentially and alternately in the conveying direction. In measure c) of the process, the base plate, the channel plate, and the adhesion layer are heated in the at least one temperature control module of the system, so that the adhesion layer between the base plate and the channel plate is activated. The activation of the adhesion layer is achieved in particular by liquefying the adhesive forming the adhesion layer, so that the adhesive can spread in the area of ​​the joining sections of the channel plate between the base plate and the channel plate and, upon solidification, form a material-bonded connection between the base plate and the channel plate.

[0016] In one possible embodiment, the base plate, the channel plate, and the adhesive layer in measure c) can be heated in the at least one temperature control module to a temperature of at least 80°C, preferably to a temperature between 120°C and 300°C, and particularly preferably between 150°C and 220°C. This activates the adhesive layer and liquefies the adhesive forming the adhesive layer. At the aforementioned temperatures, it can be ensured, in particular, that the adhesive liquefies sufficiently to spread between the base plate and the channel plate across the at least two joining sections of the channel plate and subsequently form a secure, material-bonded connection between the base plate and the channel plate.

[0017] In one possible embodiment, the at least one temperature control module can have at least one heating unit. Then, in measure c), the base plate, the channel plate, and the adhesion layer can be conveyed and heated below or above the at least one heating unit and adjacent to it. The respective temperature control module can, in particular, have exactly one heating unit or exactly two heating units. If the temperature control module has exactly one heating unit, the heating unit can be arranged in the system such that the base plate, the channel plate, and the adhesion layer are conveyed below or above the heating unit. If the temperature control module has exactly two heating units, the heating units can be arranged opposite each other in the system such that the base plate, the channel plate, and the adhesion layer are conveyed between the heating units.The respective heating unit can be designed, for example, by a heating unit through which a temperature control fluid flows and / or an inductive heating unit and / or an infrared heating unit and / or by a resistance heater.

[0018] In the process, in measure d), the base plate, the channel plate, and the adhesion layer are pressed together in the at least one pressure generation module of the system. This creates a material-bonded connection between the base plate and the channel plate in the area of ​​the at least two joining sections of the channel plate by means of the activated adhesion layer, and in the area of ​​the at least one channel section of the channel plate, the at least one fluid channel of the cooling plate is formed.

[0019] In one possible embodiment, the base plate, the channel plate, and the adhesion layer in measure d) can be subjected to a pressure between 0.05 N / cm² in the area of ​​the at least two joining sections in the at least one pressure generation module. 2 and 60 N / cm 2 , preferably between 10 N / cm 2 and 55 N / cm 2 , are pressed together. With the aforementioned printing methods, it can be ensured in particular that the base plate and the channel plate are pressed together with sufficient force to form a secure, material-bonded connection via the adhesive of the adhesion layer.

[0020] In one possible embodiment, the at least one pressure generation module can have at least one roller oriented transversely to the conveying direction, wherein, in measure d), the base plate, the channel plate, and the adhesion layer are guided against the roller and pressed together. Alternatively or additionally, it can be provided that the at least one pressure generation module has two rollers opposite each other transversely to the conveying direction. Then, in measure d), the base plate, the channel plate, and the adhesion layer can be guided between the rollers of the at least one pressure generation module and thus pressed together. The pressure to be generated in the pressure generation module can be adjusted, for example, by the distance of the roller to the cooling plate and / or the distance between the rollers themselves.

[0021] In one possible embodiment, measure c) can be carried out at least twice in each of the at least two temperature control modules, alternating with measure d), and / or measure d) can be carried out at least twice in each of the at least two pressure generation modules, alternating with measure c). Such an alternation of measures c) and d) can achieve a particularly reliable, material-bonded connection between the channel plate and the base plate. Different sequences of measures c) and d) are conceivable. To realize this, the system can have several temperature control modules and / or several pressure generation modules. Within the system, the temperature control modules and the pressure generation modules can then alternate in the direction of conveyance. This allows measures c) and d) to be carried out sequentially and alternately.

[0022] In one possible embodiment, the system can have at least one cooling module. Then, in one of the steps following measure d) and e), the base plate, the channel plate, and the adhesion layer can be conveyed through the at least one cooling module and cooled within it. This cooling process shortens the processing time of the cooling plate in the system and thus simplifies its manufacture.

[0023] In one possible embodiment, the base plate, the channel plate, and the adhesive layer in measure e) can be cooled in the at least one cooling module to a temperature of no more than 120°C, preferably to a temperature between 10°C and 90°C. At these temperatures, it can be ensured, in particular, that the adhesive of the adhesive layer is already fixed and that the base plate and the channel plate have formed a secure, material-bonded connection. This simplifies and ensures reliable further processing of the cooling unit.

[0024] In one possible embodiment, the at least one cooling module can have at least one cooling unit through which a cooling fluid flows. Then, in measure e), the base plate, the channel plate, and the adhesion layer can be conveyed below or above the at least one cooling unit and adjacent to it, and thus cooled. The respective cooling module can, in particular, have exactly one cooling unit or exactly two cooling units. If the respective cooling module has exactly one cooling unit, the cooling unit can be arranged in the system such that the base plate, the channel plate, and the adhesion layer are conveyed below or above the cooling unit.If the respective cooling module has exactly two cooling units, the cooling units can be arranged opposite each other in the system such that the base plate, the channel plate, and the adhesion layer between the cooling units are conveyed. The cooling fluid, which can be air or coolant, flows through each cooling unit. The invention also relates to a system for manufacturing a cooling plate with at least one fluid channel for a heat exchanger through which a fluid can flow. The system comprises at least one temperature control module, at least one pressure generation module, and a conveying unit. According to the invention, the system is designed to carry out the method described above. To avoid repetition, reference is made to the above explanations.

[0025] The invention also relates to a cooling plate with at least one fluid channel through which a fluid can flow for a heat exchanger. The cooling plate comprises a base plate and a channel plate, and an adhesive layer arranged between the base plate and the channel plate, formed by an adhesive. Furthermore, the channel plate includes at least two joining sections and at least one channel section. In the at least one channel section, the channel plate projects from the base plate, thereby forming the at least one fluid channel of the cooling plate. In the at least two joining sections, the channel plate rests against the base plate and is connected to the base plate by means of a material-bonded connection via the adhesive layer. According to the invention, the cooling plate is manufactured using the method described above. To avoid repetition, reference is made to the above explanations.

[0026] Further important features and advantages of the invention will become apparent from the dependent claims, the drawings and the associated description of the figures based on the drawings.

[0027] It is understood that the features mentioned above and those to be explained below can be used not only in the combinations specified, but also in other combinations or individually, without departing from the scope of the present invention. Preferred embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description, where identical reference numerals refer to identical, similar, or functionally equivalent components.

[0028] They show, schematically, each one

[0029] Fig. 1 shows an exploded view of a cooling plate according to the invention and produced in a method according to the invention;

[0030] Fig. 2 shows a view of the cooling plate according to the invention and produced using the inventive method;

[0031] Fig. 3 shows a view of a system according to the invention for carrying out the method according to the invention in a first embodiment;

[0032] Fig. 4 shows a view of the inventive system for carrying out the inventive method in a second embodiment.

[0033] Fig. 1 shows an exploded view of a cooling plate 2 for a heat exchanger according to the invention and produced by a method 1 according to the invention. The cooling plate 2 has a flat base plate 3, a shaped channel plate 4, and an adhesive layer 5. The channel plate 4 comprises several joining sections 4a and several channel sections 4b, which alternate in a direction ER of the cooling plate 2. The adhesive layer 5 is arranged between the base plate 3 and the channel plate 4. In this embodiment, the adhesive layer 5 is formed by an adhesive film. Alternatively, the adhesive layer 5 can be applied as an adhesive layer to the base plate 3 and / or the channel plate 4.

[0034] Fig. 2 shows a view of the cooling plate 2 according to the invention and produced in the inventive method 1. In the joining sections 4a, the channel plate 4 rests against the base plate 3, and in the channel sections 4b, the channel plate 4 projects from the base plate 3. In the joining sections 4b, the base plate 3 and the channel plate 4 are bonded together by means of the adhesive layer 5. In the channel sections 4b, several fluid channels 6 of the cooling plate 2, through which a fluid can flow, are formed between the base plate 3 and the channel plate 4. The individual fluid channels 6 adjacent in the direction of extension ER are fluidically separated from each other in the direction of extension ER by the joining sections 4a. The individual fluid channels 6 adjacent in the direction of extension ER are also fluid-tightly bounded to the outside transversely to the direction of extension ER by the channel plate 4 and the base plate 3.

[0035] Fig. 3 shows a view of a system 7 according to the invention for carrying out the method 1 according to the invention in a first embodiment. The system 7 comprises two temperature control modules 8, two pressure generation modules 10, a cooling module 12, and a conveying unit 14. The conveying unit 14 conveys the base plate 3, the channel plate 4, and the adhesion layer 5 through the temperature control modules 8, the pressure generation modules 10, and the cooling module 12 in a conveying direction BR. The conveying unit 14 has a track 15 and two drive units 15a and 15b that drive the track 15.

[0036] Each temperature control module 8 has exactly two heating units 9a and 9b. The heating units 9a and 9b of each temperature control module 8 are arranged in the system 7 such that the base plate 3, the channel plate 4, and the adhesion layer 5 are conveyed between the two heating units 9a and 9b of the respective temperature control module 8 by the conveying unit 14. The heating units 9a and 9b of each temperature control module 8 are arranged adjacent to the conveyed cooling plate 2, so that the base plate 3, the channel plate 4, and the adhesion layer 5 can be heated on both sides within the respective temperature control module 8. The temperature control modules 8 are arranged sequentially in the conveying direction BR and alternately with the pressure generation modules 10.

[0037] Each pressure generation module 10 has two rollers 11a and 11b arranged opposite each other transversely to the conveying direction BR. The rollers 11a and 11b of the respective pressure generation module 10 are arranged in the system 7 such that the base plate 3, the channel plate 4, and the adhesion layer 5 are conveyed by the conveying unit 14 between the two rollers 11a and 11b. This allows the base plate 3, the channel plate 4, and the adhesion layer 5 to be compressed together in the respective pressure generation module 10. The pressure generation modules 10 are arranged sequentially in the conveying direction BR and alternately with the temperature control modules 8.

[0038] The cooling module 12 has exactly two plate-shaped cooling units 13a and 13b, which are arranged opposite each other transversely to the conveying direction BR. In system 7, the cooling units 13a and 13b are arranged such that the base plate 3, the channel plate 4, and the adhesion layer 5 are conveyed between the two cooling units 13a and 13b by the conveying unit 14. The base plate 3, the channel plate 4, and the adhesion layer 5 can be cooled on both sides within the cooling module 12. The cooling module 12 is arranged downstream of the temperature control modules 8 and the pressure generation modules 10 in the conveying direction BR. In system 7 according to the first embodiment, the pressure generation modules 10 and the temperature control modules 8 alternate in the conveying direction BR.The base plate 3, the channel plate 4, and the adhesion layer 5 pass through the first temperature control module 8 (in the conveying direction BR), the first pressure generation module 10 (in the conveying direction BR), the second temperature control module 8 (in the conveying direction BR), the second pressure generation module 10 (in the conveying direction BR), and the cooling module 12 one after the other.

[0039] Fig. 4 shows a view of the inventive system 7 for carrying out the inventive method 1 in a second embodiment. In contrast to the first embodiment, the system 7 here has exactly three temperature control modules 8 and exactly two cooling modules 12. In the system 7 according to the second embodiment, the pressure generation modules 10 alternate with the temperature control modules 8 in the conveying direction BR. The base plate 3, the channel plate 4, and the adhesion layer 5 pass successively through the first and second temperature control modules 8 in the conveying direction BR, the first pressure generation module 10 in the conveying direction BR, the third temperature control module 8 in the conveying direction BR, the second pressure generation module 10 in the conveying direction BR, and the first and second cooling modules 12 in the conveying direction BR. Otherwise, the two embodiments of the system 7 are identical.

[0040] The cooling plate 2 is manufactured according to the inventive method 1. The inventive method 1 is carried out in the system 7. The inventive method is explained below with reference to Figures 3 and 4. In step a) of the method 1, the base plate 3, the channel plate 4, and the adhesion layer 5 are provided. In step b) of the method 1, the base plate 3, the channel plate 4, and the adhesion layer 5 are arranged in the system 7 and conveyed in the conveying direction BR through all temperature control modules 8, all pressure generation modules 10, and all cooling modules 12. In step c) of the method 1, the base plate 3, the channel plate 4, and the adhesion layer 5 are heated in the respective temperature control module 8, thereby activating or liquefying the adhesion layer 5 between the base plate 3 and the channel plate 4 – see also Figures 1 and 2.In step d) of method 1, the base plate 3, the channel plate 4, and the adhesion layer 5 are pressed together in the respective pressure generation module 10, so that the base plate 3 and the channel plate 4 are bonded in the area of ​​the joining sections 4a of the channel plate 4 – see also Fig. 1 and Fig. 2 – by means of the activated or liquefied adhesion layer 5. In step e) of method 1, the base plate 3, the channel plate 4, and the adhesion layer 5 are cooled in the respective cooling module 12, so that the activated or liquefied adhesion layer 5 solidifies.

[0041] In method 1, measures c) and d) can be carried out multiple times and alternately. Thus, in the first and second embodiments of Annex 7 according to Figures 3 and 4, measures a), b), c), d), c), d), and e) follow one another sequentially. In contrast to the first embodiment of Annex 7 according to Figure 3, in the second embodiment of Annex 7 according to Figure 4, the first measure c) is carried out in two stages using two temperature control modules 8, and measure e) is carried out in two stages using two cooling modules 12.

[0042] In Figures 3 and 4, the cooling plate 2 is arranged on the track 15 of the conveying unit 14. The base plate 3 is in direct contact with the track 15, and the channel plate 4 is located above the base plate 3. However, it is also conceivable that the cooling plate 2 and the channel plate 4 are arranged together on the track 15 of the conveying unit 14. In this case, the channel plate 4 is in direct contact with the track 15, and the base plate 3 is located above the channel plate 4. Furthermore, in Figures 3 and 4, the cooling plate 2 is arranged in the system 7 such that its extension direction ER coincides with the conveying direction BR. However, it is also conceivable that the cooling plate 2 is arranged in the system 7 such that its extension direction ER and conveying direction BR are perpendicular to each other.The cooling plate 2 is always arranged lying on track 15 with the base plate 3 or the channel plate 4.

Claims

Claims 1. Method (1) for manufacturing a cooling plate (2) with at least one fluid channel (6) through which a fluid can flow for a heat exchanger in a system (7), comprising the following measures: a) providing a base plate (3) and a channel plate (4) and an adhesion layer (5) arranged between the base plate (3) and the channel plate (4), wherein the channel plate (4) has a channel section (4b) for forming the at least one fluid channel (6) of the cooling plate (2) and at least two joining sections (4a) for joining materially with the base plate (3); b) Arranging the base plate (3) and the channel plate (4) and the adhesion layer (5) in the system (7) and continuously conveying them by means of a conveying unit (14) of the system (7) in a conveying direction (BR) through at least one temperature control module (8) of the system (7) and through at least one pressure generation module (10) of the system (7);c) Heating the base plate (3), the channel plate (4), and the adhesion layer (5) in the at least one temperature control module (8) of the system (7) such that the adhesion layer (5) between the base plate (3) and the channel plate (4) is activated, and d) Pressing the base plate (3), the channel plate (4), and the adhesion layer (5) together in the at least one pressure generation module (10) of the system (7) such that a material-bonded connection is formed in the area of ​​the at least two joining sections (4a) of the channel plate (4) between the base plate (3) and the channel plate (4) by means of the activated adhesion layer (5), and in the area of ​​the channel section (4b) of the channel plate (4) the at least one fluid channel (6) is formed.

2. Method (1) according to claim 1, characterized in that measure c) is carried out at least twice in each of the at least two temperature control modules (8) of the system (7) and alternately with measure d) or / and measure d) is carried out at least twice in each of the at least two pressure generation modules (8) of the system (7) and alternately with measure c).

3. Method (1) according to claim 1 or 2, characterized in that in measure c) the base plate (3) and the channel plate (4) and the adhesion layer (5) are heated in the at least one temperature control module (8) to a temperature of at least 80°C, preferably to a temperature between 120°C and 300°C, particularly preferably between 150°C and 220°C.

4. Method (1) according to one of the preceding claims, characterized in that the at least one temperature control module (8) has at least one heating unit (9a, 9b), wherein in measure c) the base plate (3) and the channel plate (4) and the adhesion layer (5) are conveyed below or above the at least one heating unit (9a, 9b) and adjacent to the at least one heating unit (9a, 9b) and are thus heated.

5. Method (1) according to one of the preceding claims, characterized in that in measure d) the base plate (3) and the channel plate (4) and the adhesion layer (5) in the area of ​​the at least two joining sections (4a) in the at least one pressure generation module (10) are subjected to a pressure between 0.05 N / cm 2 and 60 N / cm 2 , preferably between 10 N / cm 2 and 55 N / cm 2 , are compressed.

6. Method (1) according to one of the preceding claims, characterized in that - that the at least one pressure generation module (10) has at least one roller (11a, 11b) oriented transversely to the conveying direction (BR), wherein in measure d) the base plate (3) and the channel plate (4) and the adhesion layer (5) are guided and pressed together on the roller (11a, 11b), and / or - that at least one pressure generation module (10) has two rollers (11a, 11b) opposite each other transversely to the conveying direction (BR), wherein in measure d) the base plate (3) and the channel plate (4) and the adhesion layer (5) are guided between the rollers (11a, 11b) and thus pressed together.

7. Method (1) according to one of the preceding claims, characterized in that the system (7) has at least one cooling module (12), wherein in one of the measures following measure d) e) the base plate (3) and the channel plate (4) and the adhesion layer (5) are conveyed through the at least one cooling module (12) and cooled in the at least one cooling module (12).

8. Method (1) according to claim 7, characterized in that in measure e) the base plate (3) and the channel plate (4) and the adhesion layer (5) in the at least one cooling module (12) are cooled to a temperature of at most 120°C, preferably to a temperature between 10°C and 90°C.

9. Method (1) according to claim 7 or 8, characterized in that the at least one cooling module (12) has at least one cooling unit (13a, 13b) through which a cooling fluid flows, wherein in measure e) the base plate (3) and the channel plate (4) and the adhesion layer (5) are conveyed below or above the at least one cooling unit (13a, 13b) and adjacent to the at least one cooling unit (13a, 13b) and are thus cooled.

10. Method (1 ) according to one of claims 7 to 9, characterized in that in measure a) such a channel plate (4) is provided such that in measure d) at least two fluid channels (6) of the cooling plate (2) are formed.

11. Method (1) according to one of the preceding claims, characterized in that - that in measure a) the adhesion layer (5) is provided in the form of an adhesive film, or - that in measure a) the adhesion layer (5) is provided in the form of an adhesive layer applied to the base plate (3) and / or to the channel plate (4).

12. Method (1) according to one of the preceding claims, characterized in that in measure a) the adhesion layer (5) is made of: - an adhesive based on a thermoplastic adhesive, or - an adhesive based on a polyolefin-based adhesive, or - an adhesive based on a cross-linking adhesive, or - an adhesive based on a hot melt adhesive, or - an adhesive based on a polyolefin-based hot melt adhesive, or - an adhesive based on an epoxy adhesive, or - an adhesive based on a polyurethane adhesive, or - an adhesive based on a silane-modified adhesive, or - is provided with an adhesive based on an acrylate adhesive.

13. System (7) for manufacturing a cooling plate (2) with at least one fluid channel (6) through which a fluid can flow for a heat exchanger, - wherein the system (7) comprises at least one temperature control module (8), at least one pressure generation module (10) and one conveying unit (14), and - wherein the system (7) is designed to carry out the method (1) according to any one of claims 1 to 12.

14. Cooling plate (2) with at least one fluid channel (6) through which a fluid can flow for a heat exchanger, - wherein the cooling plate (2) comprises a base plate (3), a channel plate (4) and an adhesion layer (5) arranged between the base plate (3) and the channel plate (4) and formed by an adhesive, - wherein the channel plate (4) has at least one channel section (4b) and at least two joining sections (4a), - wherein in at least one channel section (4b) the channel plate (4) protrudes from the base plate (3) and thereby forms at least one fluid channel (6), - wherein in at least two joining sections (4a) the channel plate (4) is connected to the base plate (3) by means of a material-bonded connection via the adhesion layer (5), and - wherein the cooling plate (2) is manufactured in the method (1) according to any one of claims 1 to 12.

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