Substrate carrier, substrate, and method for coating a substrate

Abstract

The invention relates to a substrate carrier (10) for carrying at least one substrate (11) at least during a coating process, the carrier comprising a main body (12), wherein at least one primary recess (14) for form-fittingly receiving at least one substrate (11) is formed on a front face (13) of the main body (12), wherein at least one secondary recess (16) is formed in a bottom surface (15) of the primary recess (14) such that a bottom surface (17) of the secondary recess (16) is lowered with respect to the bottom surface (15) of the primary recess (14) and the bottom surface (15) of the primary recess (14) forms a supporting surface, which surrounds the secondary recess (16), for at least partially supporting the substrate (11).

Description

[0001] SUBSTRATE CARRIER, SUBSTRATE AND METHOD FOR COATING A SUBSTRATE

[0002] Description

[0003] The invention relates to a substrate carrier with the features of independent claim 1, a method with the features of independent claim 11 and a substrate with the features of independent claim 15.

[0004] Substrate carriers are used to fix substrates during a coating process. To apply a coating to a substrate, at least one substrate is fixed in position on the substrate carrier. The coating is then applied to the substrates mounted on the substrate carrier.

[0005] Known substrate carriers have recesses into which the substrates can be inserted from the back of the carrier. On the front of the substrate carrier, opposite the back, collars are provided in the area of ​​the recesses to prevent the substrates from slipping through the recesses and falling out of the carrier. A coating is then applied, with the front of the substrate carrier oriented towards the coating material. The aforementioned collar inevitably creates a coating edge on the substrate surface to be coated, i.e., an area where no coating is applied.

[0006] For edge-free coating of substrate surfaces, they can be fixed to a flat surface on the front of a substrate carrier using adhesive or tape. This generally allows for edge-free coating of the substrate surface. However, a disadvantage has been observed: the adhesive outgasses during the coating process, negatively impacting the coating quality. This leads to delamination of the coating from the substrate, particularly at the substrate edge, which is intended to form the coating edge. Furthermore, achieving a perfectly flat surface for the substrate on the substrate carrier is difficult. Warping of the tape or an uneven distribution of the adhesive can result in the substrate not being fully in contact with the substrate carrier, allowing the coating material to also reach the back of the substrate.This results, at least in certain sections, in an unwanted coating of the back side of the substrate, which faces the surface to be coated. This leads to a reduction in substrate quality, potentially rendering the coated substrate unusable.

[0007] It is therefore an object of the present invention to overcome at least one of the disadvantages described above, at least partially. In particular, it is an object of the invention to provide a substrate carrier and a method for using a substrate carrier that enable edgeless coating of a substrate with simultaneously high coating quality. Furthermore, it is an object of the invention to provide a substrate with an edgeless coating and high coating quality.

[0008] The foregoing problem is solved by a substrate carrier having the features of independent claim 1, by a method having the features of independent claim 11, and by a substrate having the features of independent claim 15. Further features and details of the invention will become apparent from the dependent claims, the description, and the drawings. Features and details described in connection with the substrate carrier according to the invention naturally also apply in connection with the method and / or the substrate according to the invention, and vice versa, so that the disclosure of the individual aspects of the invention always makes, or can make, reciprocal references.

[0009] According to the invention, a substrate carrier for carrying at least one substrate at least during a coating process is provided, comprising a base body, wherein at least one primary recess for the positive-locking reception of at least one substrate is formed on a front side of the base body, wherein at least one secondary recess is formed in a bottom surface of the primary recess, such that a bottom surface of the secondary recess is lowered relative to the bottom surface of the primary recess and the bottom surface of the primary recess forms a bearing surface surrounding the secondary recess, in particular completely, for the bearing of the substrate, at least partially.

[0010] The substrate can be applied directly to the floor surface. However, it can also be applied indirectly, with at least one additional layer or coating between the substrate and the floor surface.

[0011] In other words, a substrate carrier for supporting at least one substrate during a coating process is proposed. The substrate carrier comprises a base body with a front face, wherein at least one primary recess or cavity for the positive-locking reception of at least one substrate is formed in the front face of the base body. In particular, the primary recess does not penetrate the base body.

[0012] A secondary recess is formed within the base surface of the primary recess, such that the base surface of the secondary recess is lower than the base surface of the primary recess. Starting from the front of the base body, the base surface of the secondary recess is therefore positioned lower than the base surface of the primary recess. In particular, the secondary recess does not penetrate the base body. Furthermore, the base surface of the primary recess is designed to form a bearing surface and / or sealing surface surrounding the secondary recess, in particular a completely circumferential one, for the bearing and / or sealing of the substrate, at least in sections.

[0013] A substrate carrier according to the invention enables edge-free coating of a substrate arranged in the primary recess, since the substrate surface to be coated is not obscured by the substrate carrier at the edge, but is completely accessible to the coating material. The substrate is positioned with its back side, opposite the surface to be coated, in contact with the base surface of the primary recess surrounding the secondary recess. Due to the secondary recess, the substrate only rests on this contact surface at its edge. The base surface of the primary recess can be manufactured with low surface roughness and tight tolerances, thus ensuring reliable contact between the substrate and the substrate carrier along the contact area formed by the base surface of the primary recess.This prevents the coating material from reaching the back of the substrate during the coating process (sealing function). Unwanted coating of the substrate's back side is thus avoided.

[0014] The front of the base body is defined as the side facing the coating material during the coating process. The back of the base body is defined as the side opposite the front, which therefore faces away from the coating material during the coating process.

[0015] Within the scope of the invention, it may preferably be provided that at least one primary recess has a depth of a maximum of 10 mm, in particular a maximum of 5 mm. It may be particularly preferred that at least one primary recess has a depth of a maximum of 1 mm, in particular a maximum of 0.5 mm, preferably a maximum of 0.3 mm or exactly 0.3 mm. Preferably, it may be provided that at least one secondary recess has a depth that is equal to or less than the depth of at least one primary recess.

[0016] It is possible that a plurality of primary and / or secondary recesses are provided. In particular, it is conceivable that at least two or all primary recesses are identical or substantially identical. Additionally or alternatively, it is conceivable that at least two or all secondary recesses are identical or substantially identical. The term "substantially" refers to deviations due to manufacturing tolerances.

[0017] In particular, it can be provided that at least two or more than two secondary recesses are formed in the base surface of at least one primary recess, wherein the base surfaces of the secondary recesses are recessed relative to the base surface of the primary recess, particularly with respect to the front of the base body. Preferably, in this context, it can be provided that the base surface of the primary recess forms a bearing surface circumferentially around all secondary recesses, in particular completely, for the support, at least partially, of a substrate. Several substrates can then be arranged side by side in the primary recess, with a secondary recess being provided below each substrate or each substrate covering a secondary recess.This allows several substrates to be arranged on the substrate carrier and coated simultaneously, resulting in a high coating quality for each of the substrates.

[0018] In relation to the present invention, it can be advantageous for the bottom surface of the primary recess to be provided, at least partially, with a coating. The coating can be bonded to the bottom surface, at least partially. Alternatively, the coating can be formed by an insert, the insert being arranged on the bottom surface of the primary recess. The coating can preferably be, at least partially, a coating of a plastic, in particular PTFE, a rubber coating, and / or a metal coating, in particular a copper coating. The coating can comprise one or more recesses, in particular recesses penetrating the coating. The recesses can, in particular, be formed or arranged in overlapping fashion with at least one solvent opening and / or retaining medium opening.The use of a coating allows for a particularly advantageous substrate contact and improved sealing function.

[0019] Within the scope of the invention, it can be advantageous for a retaining element opening, preferably penetrating the base body, to be formed in the base surface of at least one secondary recess, wherein a retaining element movable between a contact position and a release position, particularly relative to the base body, is arranged in the retaining element opening, wherein, particularly in the contact position, a retaining surface of the retaining element, pointing towards the front of the base body, is arranged below the base surface of the primary recess. It can preferably be provided that at least one retaining element opening is arranged centrally in the base surface of a secondary recess. It can preferably be provided that at least two retaining elements are connected to each other, at least partially.In other words, with regard to the present invention, it is conceivable that at least one retaining opening for receiving at least one retaining element is formed in the base surface of at least one secondary recess, and in particular in the base surface of at least two or all secondary recesses. In particular, at least one retaining opening penetrates the base body from the base surface towards a rear side opposite the front of the base body. A retaining element is arranged in the retaining opening, which is movable between a contact position and a release position, in particular relative to the base body.

[0020] Preferably, in the contact position, a retaining surface of the retaining element, pointing towards the front of the base body, is arranged below the bottom surface of the primary recess. Thus, in the contact position, the retaining surface of the retaining element is positioned lower than the bottom surface of the primary recess, relative to the front of the base body. In particular, it is possible for the contact surface of the retaining element to be arranged between the bottom surface of the primary recess and the bottom surface of the secondary recess in the contact position.

[0021] The contact position is understood here as a position of the holding element relative to the base body in which the holding element can be brought into contact with a substrate arranged in the primary recess via its holding surface. This contact can be indirect, between the substrate and the holding surface of the holding element, particularly via an adhesive placed between the holding surface and the substrate. The arrangement of the holding surface below the base of the primary recess takes into account the space required for the adhesive between the holding element and the substrate, so that contact between the holding element and the substrate can be established without lifting the substrate out of the primary recess when the holding element is in the contact position.

[0022] The release position is defined here as the position of the retaining element on the base body in which, during intended use of the substrate carrier, the retaining element is not in contact with a substrate arranged in the primary recess. Thus, by moving the retaining element from the contact position to the release position, contact between the retaining element and the substrate can be broken. Preferably, in the release position, the retaining surface of the retaining element is positioned further below the bottom surface of the primary recess than in the contact position. In particular, starting from the front of the base body, the retaining surface of the retaining element is positioned lower in the release position than in the contact position.

[0023] The use of a holding device opening or a holding device offers the advantage of reliable and simple fixation of the substrate to the substrate carrier. Furthermore, the holding device can be fixed using a comparatively small contact area. This reduces the amount of adhesive required. If an adhesive is used as the adhesive, outgassing during the coating process can be quantitatively reduced, thus minimizing its impact on the coating result. This particularly reduces the risk of coating delamination at the substrate's edges.

[0024] The holding surface of at least one holding means can preferably be designed as a surface facing the bottom surface of the primary recess and / or oriented parallel or substantially parallel to the bottom surface of the primary recess.

[0025] Within the scope of the invention, it is conceivable that at least one holding element comprises a tool attachment, wherein the tool attachment is accessible from a rear side of the substrate carrier opposite the front side. Preferably, an assembly movement can be introduced into the holding element via the tool attachment in order to move the holding element between the release position and the contact position. In this context, a tool attachment is understood to be an interface designed to be brought into a form-fit and / or force-fit with a tool in order to introduce an assembly movement into the holding element by means of the tool. At least one tool attachment can, for example, be provided as a screw drive profile, in particular an external hexagon, internal hexagon, slotted, Phillips, or Torx drive. Further tool attachments are not excluded from the concept of the invention.

[0026] Within the scope of the invention, it can be advantageous if at least one retaining element is designed as a screw, in particular a setscrew. In the present case, a setscrew has proven to be a particularly space-saving and convenient variant of a retaining element with regard to the use of the substrate carrier. The setscrew can have a flat retaining surface at one end facing the bottom surface of the primary recess, in particular a surface parallel or substantially parallel to the bottom surface of the primary recess. Additionally or alternatively, the setscrew can have a tool projection, in particular an internal hexagon, at one end facing away from the bottom surface of the primary recess.

[0027] Within the scope of the invention, it can be provided that the contact position of at least one retaining element is an end position, such that movement of the retaining element towards the front of the base body is limited by the contact position. This has the advantage of preventing excessive movement of the retaining element towards a substrate arranged in the primary recess. Unwanted displacement of the substrate relative to the base body can thus be effectively prevented. In this context, for example, it can be provided that a collar is formed on the retaining element, wherein the collar, in the contact position of the retaining element, rests, at least partially, on the rear of the substrate carrier and prevents further movement of the retaining element towards the front of the substrate carrier or the bottom surface of the primary recess.

[0028] At least one holding element can preferably be designed as a piston, wherein the piston is movable between the contact position and the release position by applying a force, in particular an axial force. It can be provided that the piston can be pre-tensioned by moving it from the release position to the contact position, and that a movement from the contact position to the release position can be effected by this pre-tension. For this purpose, at least one holding element can comprise a pre-tensioning element, in particular a spring.

[0029] It may be provided that at least one holding element is designed in multiple parts. At least one holding element may, for example, comprise a piston and an adjusting element, wherein the adjusting element allows the piston to be moved axially, at least partially, within the holding element opening, or allows a force, particularly an axial force, to be applied to the piston. In this way, the piston can be moved between the contact position and the release position via the adjusting element. At least one adjusting element may be designed as a setscrew. Additionally or alternatively, it may be provided that at least one holding base is formed on the base surface of at least one secondary recess. The holding base is preferably designed as a locally raised accumulation of material relative to the base surface. The holding base may be made of the same material as the base body or of a different material.In particular, at least one retaining base can be formed by a retaining element fixed in a retaining element opening. Preferably, a retaining surface of the retaining element facing the front of the base body is arranged below the bottom surface of the primary recess or flush with the bottom surface of the primary recess. In a flush arrangement, the retaining base serves as a spacer to the substrate and to define a material thickness of an adhesive, in particular a glue, arranged in the secondary recess.

[0030] It is also conceivable that an adhesive is arranged on the holding surface of at least one holding element and / or holding base. This allows a reliable adhesive bond to be established between the holding element and the substrate in preparation for a coating process. The adhesive can be designed as a glue or as an adhesive tape with an adhesive applied to a surface of the tape. Additionally or alternatively, the adhesive can be designed as a magnet. This represents a preferred embodiment with regard to the coating of magnetic substrates.

[0031] It is particularly preferred that the adhesive be adhesive-free. In particular, it is conceivable that the adhesive be designed as a nano-tape or a suction cup. A nano-tape (also called gecko tape) enables the creation of an adhesive-free, force-fit connection between the holding agent and the substrate. This offers the advantage that outgassing of an adhesive during a coating process can be completely avoided. This further reduces or even eliminates the risk of coating delamination at the edges of the substrate surface to be coated. The nano-tape can preferably comprise a multitude of nanotubes, especially carbon nanotubes, on a side facing away from the holding surface. Nanotubes are tubes with diameters in the nanometer range. A connection between the substrate and the holding agent can be established via van der Waals forces using the nanotubes.Within the scope of the invention, it is optionally possible that at least one solvent opening, preferably penetrating the base body, is formed in the base surface of at least one secondary recess, through which a solvent can be introduced into the secondary recess from a rear side of the substrate carrier opposite the front side. In other words, with regard to the present invention, it is conceivable that at least one solvent opening for introducing a solvent into the secondary recess is formed in the base surface of at least one secondary recess, and in particular in the base surface of at least two or all secondary recesses. Specifically, the solvent opening penetrates the base body from the base surface of the secondary recess towards a rear side opposite the front side of the base body.

[0032] When using an adhesive or tape as the bonding agent, a solvent can be introduced into the secondary recess through the solvent opening after the coating process. Acetone and / or isopropanol (2-propanol), for example, can be used as the solvent. The solvent gently breaks the bond between the bonding agent and the substrate, allowing the bonding agent to then be moved from the contact to the release position. This results in a particularly gentle removal of a coated substrate from the substrate carrier. Furthermore, the solvent opening allows any outgassing from the adhesive during the coating process to escape. This reduces or completely eliminates the influence of these outgassings on the quality of the substrate coating.Simultaneously, pressure equalization is created between the substrate surface and the substrate back, which does not reduce the adhesive forces. The solvent opening can also serve as an overflow channel for excess adhesive. By using a suitable thickness of the substrate holder and appropriate shape and depth of the solvent openings, coating condensation on the back of the substrate can be prevented. Additionally, the back of the substrate holder can be fitted with a baffle (shielding plate with a minimal gap to the substrate holder back), which collects any coating condensate while still ensuring continuous evacuation of the substrate back space through the solvent openings.Furthermore, the invention may provide that at least one solvent opening has a cross-section that varies along its central axis, at least partially, with the cross-section increasing in particular towards the rear of the substrate support. This has proven to provide particularly efficient dissipation of outgassing from an adhesive during a coating process. Preferably, at least one solvent opening may be conical, at least partially. The angle enclosed by the cone may preferably be between 10° and 20°, particularly between 12° and 18°, and most preferably 15° or substantially 15°.

[0033] With regard to the present invention, it is conceivable that at least two solvent openings are formed in the base surface of at least one secondary recess, wherein, in particular, the central axes of the solvent openings and a central axis of the retaining opening can be connected by a straight line. In particular, it can be provided that the retaining opening is arranged centrally between the two solvent openings. This arrangement has proven to be particularly advantageous with regard to the reliable usability of the substrate carrier.

[0034] Furthermore, it is conceivable that at least one locking element is included, wherein the locking element engages positively in the primary recess and is, at least partially, displaceable relative to the base body, such that the locking element can be brought into contact with at least one substrate arranged in the primary recess and wherein the locking element can be fixed to the base body. The locking element can rest, at least partially, on the front surface of the base body. Movement of the locking element relative to the base body can be guided by the positive engagement of the locking element in the primary recess. In particular, the positive engagement can be designed such that the locking element is guided within the primary recess with respect to movement of the locking element along its longitudinal extent.By using a locking element, several substrates arranged in the primary recess can be clamped together. This ensures a fixed position for the substrates within the primary recess and prevents unwanted displacement of the substrates during handling of the substrate carrier during coating. Multiple locking elements can be used. In particular, with respect to at least one primary recess, a locking element can be arranged at opposite ends of the primary recess.

[0035] The invention may provide for the base body to be formed in one piece. In particular, the base body may be made of a metal, preferably steel or aluminum. Alternatively, the base body may be formed in multiple parts. Additionally or alternatively, the base body may be formed as a milled part.

[0036] The above problem is further solved by a method according to the invention for using a substrate carrier according to the invention, in particular a substrate carrier according to any one of claims 1 to 11, comprising:

[0037] Form-fitting arrangement of at least one substrate in a primary recess of the substrate carrier, such that the substrate rests on the bottom surface of the primary recess, in particular completely, and covers a secondary recess formed in the bottom surface of the primary recess, in particular completely.

[0038] - Applying at least one coating to the substrate, removing the substrate from the substrate support.

[0039] This results in the same advantages with regard to a method according to the invention as have already been described with regard to a substrate carrier according to the invention.

[0040] Preferably, the substrate can be arranged such that a back side of the substrate opposite the surface to be coated rests on the bottom surface of the primary recess.

[0041] It can be advantageously provided that the material thickness of the substrate and the depth of the primary recess are coordinated such that the substrate surface to be coated and the front of the substrate carrier are flush or substantially flush. This also shields the substrate from the coating material on its side surfaces and effectively prevents the coating material from reaching the back of the substrate. Within the scope of the invention, it can be advantageous that the arrangement of at least one substrate on the substrate carrier comprises at least one of the following:

[0042] Moving a holding agent from the release position to the contact position and creating a bond between the holding agent and the substrate by means of an adhesive and / or

[0043] - Securing the substrate against displacement relative to the base body by means of at least one securing element.

[0044] Within the scope of the invention, it is conceivable that the application of at least one coating to the substrate comprises at least one of the following:

[0045] - Application of the coating by physical vapor deposition and / or

[0046] - Application of the coating by chemical vapor deposition.

[0047] In connection with these coating processes, the substrate carrier has proven to be particularly advantageous.

[0048] Physical vapor deposition can preferably be carried out by thermal evaporation, electron beam evaporation, laser beam evaporation, arc evaporation, molecular beam epitaxy, sputtering, ion plating, and / or ICB (ionized cluster beam deposition). Chemical vapor deposition can be plasma-enhanced.

[0049] Within the scope of the invention, it may be provided that the process of detaching the substrate from the substrate support comprises at least one of the following:

[0050] Moving the holding device from the contact position to the release position,

[0051] Breaking the bond between the holding agent and the substrate using a solvent and / or

[0052] Removing the substrate from the primary recess.

[0053] In particular, it can be provided that, to detach the substrate from the substrate support, at least one solvent is introduced through at least one solvent opening into at least one secondary recess. For this purpose, the substrate support can preferably be immersed in a solvent bath. This allows for a particularly simple and rapid introduction of the solvent.

[0054] The coating applied to the substrate can preferably be a coating of at least one metal oxide and / or metal fluoride and / or semiconductor material. Preferably, the coating can comprise at least one layer of germanium and / or germanium nitride and / or silicon monoxide and / or aluminum oxide and / or silicon dioxide and / or magnesium fluoride.

[0055] The above-mentioned problem is further solved by a substrate according to the invention, which is produced according to a method according to the invention, in particular according to a method according to one of claims 11 to 13. This results in the same advantages with respect to a substrate according to the invention as have already been described with respect to a substrate carrier and / or a method according to the invention. By producing a substrate according to a method according to the invention, a substrate can be realized which has a borderless coating of particularly high quality on a surface to be coated. In particular, such a substrate shows no or only negligible delamination of the coating in the outermost edge region of the coated surface.Furthermore, the substrate shows no or only negligible deposits of the coating material on the reverse side of the substrate opposite the surface to be coated.

[0056] Further advantages, features, and details of the invention will become apparent from the following description, in which several exemplary embodiments of the invention are described in detail with reference to the drawings. The features mentioned in the claims and in the description can each be essential to the invention individually or in any combination.

[0057] Fig. 1 shows a schematic view of a substrate carrier,

[0058] Fig. 2 shows a schematic view of a substrate carrier,

[0059] Fig. 3 a schematic view of a substrate support, Fig. 4 a schematic sectional view of a substrate support,

[0060] Fig. 5 shows a schematic sectional view of a substrate carrier,

[0061] Fig. 6 shows a schematic sectional view of a substrate carrier,

[0062] Fig. 7 shows a schematic sectional view of a substrate carrier,

[0063] Fig. 8 shows a schematic sectional view of a substrate carrier,

[0064] Fig. 9 shows a schematic view of a substrate carrier,

[0065] Fig. 10 shows a schematic view of a process and

[0066] Fig. 11 shows a schematic view of a substrate.

[0067] The figures use identical reference numerals for the same technical features, even for different embodiments.

[0068] Figures 1 and 2 show a schematic isometric view of a substrate support 10 for carrying at least one substrate 11. The substrate support 10 comprises a base body 12 with a front face 13 and a rear face 21 opposite the front face 13. In Figure 1, the view is essentially directed towards the front face 13, while in Figure 2, the view is essentially directed towards the rear face 21 opposite the front face 13. Figure 3 further shows an enlarged section from Figure 3 for a clearer illustration of various aspects of the invention. Figure 4 further shows a sectional view of the substrate support shown in Figures 1 and 2. The section plane runs along the longitudinal extent of a primary recess 14 and is orthogonal to the front face 13 and rear face 21 of the substrate support 10. Figure 5 shows an enlarged section from this sectional view for a clearer illustration of various aspects of the invention.5 also shows a substrate 11 arranged in the substrate carrier 10.

[0069] As can be seen from Figures 1 to 5, the substrate carrier 10 comprises a base body 12, wherein at least one primary recess 14 is formed on the front face 13 of the base body 12 for the form-fitting reception of at least one substrate 11. Furthermore, at least one secondary recess 16 is formed in a base surface 15 of the primary recess 14, wherein a base surface 17 of the secondary recess 16 is lowered relative to the base surface 15 of the primary recess 14. The base surface 15 of the primary recess 14 forms a bearing surface that completely surrounds the secondary recess 16 for the, at least partial, support of a substrate 11.

[0070] A substrate carrier 10 according to the invention enables edge-free coating of a substrate 11 arranged in the primary recess 14, since the substrate carrier 10 does not obstruct the surface of the substrate 11 to be coated at the edge, but rather allows it to be fully accessed by the coating material. The substrate 11 is positioned with its back side, opposite the surface of the substrate to be coated, in contact with the base surface 15 of the primary recess 14 surrounding the secondary recess 16. This arrangement of the substrate 11 on the substrate carrier 10 prevents the coating material from coming into contact with the back side of the substrate 11 during the coating process. Unwanted coating of the back side of the substrate 11 is thus avoided.

[0071] The substrate carrier 10 has two primary recesses 14, each of which contains several secondary recesses 16 in its base 15. The primary recesses 14 and the secondary recesses 16 have an identical or substantially identical structure.

[0072] It can further be seen from Figures 1 to 5 that a retaining opening 18, penetrating the base body 12, is formed in at least one secondary recess 16 in the base surface 17 to receive a retaining element 24. Figures 6 and 7 show the section depicted in Figure 5, but unlike Figure 5, a retaining element 24 is arranged in the retaining opening 18. The retaining element 24 is movable relative to the base body 12 between a contact position I and a release position II, with contact position I shown in Figure 7 and release position II in Figure 6. It is understood that the structure shown in Figures 6 and 7 can be transferred to further primary and secondary recesses 14 and 16. It can be seen from Fig. 7 that in contact position I a holding surface 19 of the holding means 24 pointing towards the front 13 of the base body 12 is arranged below the bottom surface 15 of the primary recess 14.The holding surface 19 is designed as a surface facing the floor surface 15 of the primary recess 14 and oriented parallel or substantially parallel to the floor surface 15 of the primary recess 14.

[0073] The use of a holding element opening 18 or a holding element 24 offers the advantage of reliable and simple fixation of the substrate 11 from the substrate support 10. The arrangement of the holding surface 19 below the base surface 15 of the primary recess 14 takes into account the space required for an adhesive 25 between the holding element 24 and the substrate 11, so that contact between the holding element 24 and the substrate 11 can be established without the substrate 11 being lifted out of the primary recess 14 when the holding element 24 is in contact position I.

[0074] Figures 6 and 7 further show that an adhesive 25 is arranged on the holding surface 19 of the holding means 24, which in this case is designed as an adhesive-free nano-tape and enables the substrate 11 to adhere to the holding means 24 via van der Waals forces.

[0075] The retaining element 24 is designed as a setscrew and includes a tool projection 20, which is designed as an internal hexagon. The contact position I of the retaining element 24 (Fig. 7) is an end position of the retaining element 24, such that movement of the retaining element 24 towards the front 13 of the base body 12 is limited by contact position I. For this purpose, the retaining element 24 includes a collar 26, which rests on the rear 21 of the base body 12 in contact position I and prevents further movement of the retaining element 24 towards the bottom surface 15 of the primary recess 14.

[0076] Figures 1 to 3 further show that at least one solvent opening 22 penetrating the base body 12 is formed in at least one secondary recess 16 in the base surface 17, through which a solvent can be introduced from the rear side 21 of the substrate carrier 10, opposite the front side 13, into the secondary recess 16. Figure 8 shows such a solvent opening 22 in an enlarged section as a sectional view. The section plane is oriented orthogonally or substantially orthogonally to the front side 13 of the substrate carrier 10 and is oriented such that it passes through only one of the two solvent openings 22 per secondary recess 16 shown in Figures 1-3, and not through the retaining opening 18.

[0077] When using an adhesive or adhesive tape as the adhesive 25, a solvent can be introduced into the secondary recess 16 through the solvent opening 22 after the coating process and the substrate 11 can be gently detached from the holding agent 24.

[0078] As can be seen from Fig. 8, the solvent opening 22 has a cross-section that varies along its central axis M, at least in sections, with the cross-section increasing towards the rear side 21 of the substrate support 10. This has proven to be a particularly efficient means of discharging outgassing from an adhesive 25 during a coating process. In this case, the solvent opening 22 is conical, at least in sections.

[0079] Figures 1 to 3 further show that at least two solvent openings 22 are formed in at least one secondary recess 16 in the base surface 17, wherein the central axes M of the solvent openings 22 and a central axis M of the retaining opening 18 can be connected by a straight line. In the present case, the retaining opening 18 is arranged centrally between the two solvent openings 22, and the central axes M of the retaining opening 18 and of the solvent openings 22 can be connected by a straight line running diagonally through the secondary recess 16 in the plane of the base surface 17.

[0080] Fig. 9 shows the substrate carrier 10 as shown in Fig. 1, wherein at least one locking element 23 is arranged at opposite ends of at least one primary recess 14. This locking element engages positively in the primary recess 14, is displaceable relative to the base body 12, and can be fixed to the base body 12. By using the locking elements 23, several substrates 11 arranged in the primary recess 14 can be clamped together. This ensures a fixed position for the substrates 11 in the primary recess 14 and prevents unwanted displacement of the substrates 11 during handling of the substrate carrier 10 during coating.

[0081] Fig. 10 further shows a schematic view of a method 100 for using a substrate carrier 10 according to one of the preceding claims, comprising: Form-fitting arrangement 110 of at least one substrate 11 in a primary recess 14 of the substrate carrier 10, such that the substrate 11 rests on the bottom surface 15 of the primary recess 14, in particular completely, and covers a secondary recess 16 formed in the bottom surface 15 of the primary recess 14, in particular completely.

[0082] - Applying 120 at least one coating 27 to the substrate 11, removing 130 the substrate 11 from the substrate support 10.

[0083] Fig. 11 further shows a schematic view of a substrate 11 with a borderless coating 27, which was produced by the method 100 shown schematically in Fig. 10.

[0084] Bezu qszei che nli ste

[0085] 10 substrate carriers

[0086] 11 Substrat

[0087] 12 basic shapes

[0088] 13 Front

[0089] 14 primary recess

[0090] 15 Floor area (of the primary recess)

[0091] 16 secondary recesses

[0092] 17 Floor area (of the secondary recess)

[0093] 18 Holding device opening

[0094] 19 holding area

[0095] 20 Tool approach

[0096] 21 Back

[0097] 22 Solvent opening

[0098] 23 Safety element

[0099] 24 Holding devices

[0100] 25 Adhesive

[0101] 26 collars

[0102] 27 Coating

[0103] 100 procedures

[0104] 110 Order

[0105] 120 Apply

[0106] 130 Solve

[0107] M Central axis

[0108] I Contact position

[0109] II Release position

Claims

Patent claims 1. Substrate carrier (10) for supporting at least one substrate (11) at least during a coating process, comprising a base body (12), wherein at least one primary recess (14) for the positive-locking reception of at least one substrate (11) is formed on a front side (13) of the base body (12), wherein at least one secondary recess (16) is formed in a bottom surface (15) of the primary recess (14), such that a bottom surface (17) of the secondary recess (16) is lowered relative to the bottom surface (15) of the primary recess (14) and the bottom surface (15) of the primary recess (14) forms a bearing surface surrounding the secondary recess (16) for the support, at least partially, of the substrate (11).

2. Substrate carrier (10) according to claim 1, characterized in that a retaining opening (18) penetrating the base body (12) is formed in at least one secondary recess (16) in the base surface (17), wherein a retaining means (24) movable between a contact position (I) and a release position (II) relative to the base body (12) is arranged in the retaining opening (18), wherein in the contact position (I) a retaining surface (19) of the retaining means (24) pointing towards the front (13) of the base body (12) is arranged below the base surface (15) of the primary recess (14).

3. Substrate carrier (10) according to claim 2, characterized in that at least one retaining means (24) comprises a tool extension (20), wherein the tool extension (20) is accessible from a rear side (21) of the substrate carrier (10) opposite the front side (13).

4. Substrate carrier (10) according to claim 2 or 3, characterized in that, in at least one retaining means (24), the contact position (I) is an end position, such that a movement of the retaining means (24) in the direction of the front (13) of the base body (12) is limited by the contact position (I).

5. Substrate carrier (10) according to one of claims 2 to 4, characterized in that an adhesive (25) is arranged on the holding surface (19) of at least one holding means (24).

6. Substrate carrier (10) according to claim 5, characterized in that the adhesive (25) is adhesive-free, in particular as a nano-tape.

7. Substrate carrier (10) according to one of the preceding claims, characterized in that at least one solvent opening (22) penetrating the base body (12) is formed in at least one secondary recess (16) in the base surface (17), through which a solvent can be introduced from a rear side (21) of the substrate carrier (10) opposite the front side (13) into the secondary recess (16).

8. Substrate carrier (10) according to claim 7, characterized in that at least one solvent opening (22) has a cross-section that varies along its central axis (M), at least sectionally, wherein in particular the cross-section increases in the direction of the rear (21) of the substrate carrier (10).

9. Substrate carrier (10) according to claim 7 or 8, characterized in that at least two solvent openings (22) are formed in at least one secondary recess (16) in the base surface (17), wherein in particular the central axes (M) of the solvent openings (22) and a central axis (M) of the holding means opening (18) can be connected by a straight line.

10. Substrate carrier (10) according to one of the preceding claims, characterized in that at least one locking element (23) is included, wherein the locking element (23) engages in a form-fitting manner in the primary recess (14) and is displaceable, at least partially, relative to the base body (12), so that the locking element (23) can be brought into contact with at least one substrate (11) arranged in the primary recess (14) and wherein the locking element (23) can be fixed to the base body (12).

11. Method (100) for using a substrate carrier (10) according to one of the preceding claims, comprising: Form-fitting arrangement (110) of at least one substrate (11) in a primary recess (14) of the substrate support (10), such that the substrate (11) rests on the bottom surface (15) of the primary recess (14), in particular completely, and covers a secondary recess (16) formed in the bottom surface (15) of the primary recess (14), in particular completely, - Applying (120) at least one coating (27) to the substrate (11), removing (130) the substrate (11) from the substrate support (10).

12. Method (100) according to claim 11, characterized in that the arrangement (110) of at least one substrate (11) on the substrate carrier (10) comprises at least one of the following: Moving a holding agent (24) from the release position (II) to the contact position (I) and creating a connection between the holding agent (24) and the substrate (11) by means of an adhesive (25) and / or - Securing the substrate (11) against displacement relative to the base body (12) by at least one securing element (23).

13. Method (100) according to one of claims 11 or 12, characterized in that the application (120) of at least one coating (27) to the substrate (11) comprises at least one of the following: - Application of the coating (27) by physical vapor deposition and / or - Application of the coating (27) by chemical vapor deposition.

14. Method (100) according to one of claims 11 to 13, characterized in that the loosening (130) of the substrate (11) from the substrate support (10) comprises at least one of the following: Moving the holding device (24) from the contact position (I) to the release position (II), Dissolving a bond between the holding agent (24) and the substrate (11) by a solvent and / or Removing the substrate (11) from the primary recess (14).

15. Substrate (11) produced according to a method (100) according to any one of claims 11 to 14.

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