Scrubbing apparatus

Abstract

A scrubbing apparatus of the present invention comprises: a scrubbing chamber defining a scrubbing space; a first scrubbing plate disposed in the scrubbing chamber; a plurality of first scrubbing holes formed through the first scrubbing plate; a second scrubbing plate disposed on the first scrubbing plate; a plurality of second scrubbing holes formed through the second scrubbing plate; a first spray nozzle disposed between the first scrubbing plate and the second scrubbing plate to supply a first scrubbing solution onto the upper surface of the first scrubbing plate; and a second spray nozzle disposed on the upper surface of the second scrubbing plate to supply a second scrubbing solution onto the upper surface of the second scrubbing plate, wherein some impurities contained in the gas rise and pass through the first scrubbing holes and are dissolved in the first scrubbing solution, and other impurities contained in the gas rise and pass through the second scrubbing holes and are dissolved in the second scrubbing solution.

Description

scrubbing device

[0001] The present invention relates to a scrubbing device. Specifically, the invention relates to a scrubbing device that improves scrubbing efficiency by increasing the contact area between a scrubbing solution and a gas, and improves stability by providing the scrubbing solution in a spray form.

[0002]

[0003] Modern industry produces a wide variety of air pollutants, many of which have very low permissible human concentrations. Therefore, removing and controlling air pollutants from gases emitted by various industries is a critical issue.

[0004] Current air pollution control equipment includes dust collectors and scrubbers. Their efficiency is determined by the type of pollutant being treated. Scrubbers are widely used because they can simultaneously treat dust, exhaust gases, and high-temperature gases.

[0005] Specifically, scrubbers are classified into dry, wet, and plasma types depending on the method of treating the exhaust gas, and among these, wet scrubbers are used in a process of dissolving water-soluble components in the gas into the liquid by contacting the exhaust gas with a liquid.

[0006] Wet scrubbers typically use a cleaning solution to effectively remove harmful components from the exhaust gas. The cleaning solution neutralizes and removes harmful components upon contact with them, so it's crucial to select a solution that best reacts with the harmful components in the exhaust gas. The performance of a wet scrubber depends on the ability of the cleaning solution to effectively contact the exhaust gas. Therefore, conventional methods typically involve installing a filler to ensure sufficient contact between the cleaning solution and the exhaust gas, and installing spray nozzles to supply the cleaning solution with fine particles.

[0007] Recently, other technologies are being studied to improve the contact area between the cleaning solution and the exhaust gas.

[0008]

[0009] The technical problem to be solved by the present invention is to provide a scrubbing device that improves scrubbing efficiency by increasing the contact area between the scrubbing solution and gas, and improves stability by providing the scrubbing solution in a spray form.

[0010] The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0011]

[0012] According to some embodiments of the present invention for achieving the above technical problem, a scrubbing device includes a scrubbing chamber defining a scrubbing space for scrubbing impurities included in a gas, a first scrubbing plate disposed within the scrubbing chamber, a plurality of first scrubbing holes penetrating the first scrubbing plate, a second scrubbing plate disposed within the scrubbing chamber and disposed on the first scrubbing plate, a plurality of second scrubbing holes penetrating the second scrubbing plate, a first spray nozzle disposed between the first scrubbing plate and the second scrubbing plate and supplying a first scrubbing solution to an upper surface of the first scrubbing plate, and a second spray nozzle disposed on an upper surface of the second scrubbing plate and supplying a second scrubbing solution to an upper surface of the second scrubbing plate, wherein a part of the impurities included in the gas are dissolved in the first scrubbing solution by passing upwardly through the first scrubbing holes, and another part of the impurities included in the gas are dissolved in the first scrubbing solution by passing upwardly through the second scrubbing holes. Dissolves in the second scrubbing solution.

[0013] As spray nozzles are arranged on the upper surfaces of each of the first scrubbing plate and the second scrubbing plate, the height of bubbles formed on the upper surfaces of each scrubbing plate can be controlled.

[0014] In some embodiments, the diameter of each of the plurality of first scrubbing holes is larger than the diameter of each of the plurality of second scrubbing holes. Since the amount of scrubbing solution discharged onto the upper surface of the first scrubbing plate is greater than the amount of scrubbing solution discharged onto the upper surface of the second scrubbing plate, the diameter of the first scrubbing hole is larger than the diameter of the second scrubbing hole.

[0015] In some embodiments, from a planar perspective, the area of ​​the plurality of first scrubbing holes relative to the area of ​​the first scrubbing plate is greater than the area of ​​the plurality of second scrubbing holes relative to the area of ​​the second scrubbing plate.

[0016] In some embodiments, the size of the diameter of each of the plurality of first scrubbing holes is the same as the size of the diameter of each of the plurality of second scrubbing holes.

[0017] In some embodiments, the number of the plurality of first scrubbing holes is greater than the number of the plurality of second scrubbing holes.

[0018] A scrubbing device according to some embodiments further comprises a scrubbing solution storage tank disposed at a lower portion of the scrubbing chamber and storing a scrubbing solution in which the impurities are dissolved, and a first recycle pipe having one end connected to the scrubbing solution storage tank and the other end connected to the first spray nozzle, wherein the first spray nozzle provides the scrubbing solution in which the impurities are dissolved, stored in the scrubbing solution storage tank, to the upper surface of the first scrubbing plate through the first recycle pipe.

[0019] In some embodiments, the amount of scrubbing solution used can be reduced by recycling the scrubbing solution in which the impurities have been dissolved.

[0020] In some embodiments, the second scrubbing solution is water that does not contain the impurities.

[0021] In some embodiments, the scrubbing device further comprises a second recycle pipe having one end connected to the scrubbing solution storage tank and the other end connected to the second spray nozzle, wherein the second spray nozzle provides the scrubbing solution, in which the impurities stored in the scrubbing solution storage tank are dissolved, to the upper surface of the second scrubbing plate through the second recycle pipe.

[0022] In some embodiments, the amount of scrubbing solution used can be reduced by recycling the scrubbing solution in which the impurities have been dissolved.

[0023] In some embodiments, a scrubbing device further comprises a third scrubbing plate disposed within the scrubbing chamber and disposed on the second scrubbing plate, a plurality of third scrubbing holes penetrating the third scrubbing plate, and a third spray nozzle disposed on an upper surface of the third scrubbing plate and supplying a third scrubbing solution to an upper surface of the third scrubbing plate, wherein the third spray nozzle provides the third scrubbing solution in a spray form, and another portion of impurities contained in the gas rises and passes through the plurality of third scrubbing holes and is dissolved in the third scrubbing solution.

[0024] In some embodiments, the diameter of each of the plurality of second scrubbing holes is larger than the diameter of each of the plurality of third scrubbing holes, and the diameter of each of the plurality of first scrubbing holes is larger than the diameter of each of the plurality of second scrubbing holes.

[0025] In some embodiments, the diameter of each of the plurality of second scrubbing holes is greater than the diameter of each of the plurality of third scrubbing holes, and the diameter of each of the plurality of first scrubbing holes is less than the diameter of each of the plurality of second scrubbing holes.

[0026] In some embodiments, the concentration of the impurity in the third scrubbing solution is less than the concentration of the impurity in the second scrubbing solution.

[0027] In some embodiments, the first scrubbing solution is the same as the second scrubbing solution.

[0028] In some embodiments, a scrubbing device further comprises a second scrubbing wall disposed on one end of the second scrubbing plate, a portion of which protrudes from an upper surface of the second scrubbing plate, wherein the second scrubbing solution discharged to the upper surface of the second scrubbing plate is discharged over the second scrubbing wall to an upper surface of the first scrubbing plate, and another portion of the impurities contained in the gas are dissolved in the second scrubbing solution that passes upward through the first scrubbing hole and over the second scrubbing wall.

[0029] In some embodiments, the first spray nozzle sprays the first scrubbing solution onto the upper surface of the first scrubbing plate, and the second spray nozzle sprays the second scrubbing solution onto the upper surface of the second scrubbing plate. Accordingly, the height of the bubbles formed on the upper surface of the scrubbing plate can be controlled.

[0030] Specific details of other embodiments are included in the description and drawings of the invention.

[0031]

[0032] The scrubbing device of the present invention comprises at least one scrubbing plate. Scrubbing holes are formed within the scrubbing plate, penetrating the scrubbing plate. As gas rises and passes through the scrubbing holes, bubbles may be formed within the scrubbing solution flowing on the upper surface of the scrubbing plate.

[0033] As the bubbles form, the contact area between the scrubbing solution and the gas increases. This increased contact area allows more hydrophilic impurities in the gas to dissolve in the scrubbing solution. Consequently, the gas, free of contaminants (impurities), can be discharged outside the scrubbing device.

[0034] Additionally, a spray nozzle is arranged on the upper surface of each scrubbing plate to spray a scrubbing solution. As the scrubbing solution with small particles is provided on the upper surface of each scrubbing plate, the height of bubbles formed on the upper surface of each scrubbing plate can be controlled.

[0035]

[0036] FIG. 1 is a drawing briefly illustrating a scrubbing system including a scrubbing device according to some embodiments of the present invention.

[0037] Fig. 2 is an exemplary perspective view for explaining the scrubbing device of Fig. 1.

[0038] Fig. 3 is an exemplary cross-sectional view for explaining the scrubbing device of Fig. 1.

[0039] Figure 4 is an enlarged view of the P1 area, the P2 area, and the P3 area of ​​Figure 3.

[0040] FIGS. 5 to 10 are drawings illustrating a scrubbing device according to some other embodiments of the present invention.

[0041] FIG. 11 and FIG. 12 are drawings for explaining an operating method of a scrubbing device according to some embodiments of the present invention.

[0042]

[0043] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described in detail below together with the attached drawings. However, the present invention is not limited to the embodiments described below, but can be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

[0044] In addition, the terminology used in this specification is used to describe embodiments and is not intended to limit and / or restrict the disclosed invention. The singular expression includes plural expression unless the context clearly indicates otherwise. In this specification, the terms "comprise" or "have" and the like are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0045] Additionally, terms including ordinal numbers such as “first,” “second,” etc. used herein may be used to describe various components, but the components are not limited by the terms, and the terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. The term “and / or” includes any combination of a plurality of related listed items or any item among a plurality of related listed items.

[0046] Meanwhile, the terms “upper”, “lower”, “side wall”, “top surface” and “lower surface” used in the description below are defined based on the drawing, and the shape and position of each component are not limited by these terms.

[0047] The terminology used herein is for the purpose of describing embodiments only and is not intended to limit the present invention. In this specification, the singular also includes the plural unless the context clearly dictates otherwise. As used herein, the terms "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components, steps, operations, and / or elements.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in their common sense to those of ordinary skill in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. In describing with reference to the attached drawings, identical or corresponding components are given the same reference numerals regardless of the drawing symbols, and redundant descriptions thereof will be omitted.

[0050]

[0051] Hereinafter, a scrubbing system (1000) including a scrubbing device (20) according to some embodiments of the present invention will first be described with reference to FIG. 1. FIG. 1 is a drawing for briefly explaining a scrubbing system including a scrubbing device according to some embodiments of the present invention.

[0052] Referring to FIG. 1, a scrubbing system (1000) according to some embodiments of the present invention may include a process chamber (10), a scrubbing device (20), an exhaust gas discharge chamber (30), and a scrubbing solution discharge chamber (40).

[0053] The process chamber (10) may be a chamber utilized in various industrial fields. The various industrial fields may be a plant field, a battery field, a thermal power plant field, a steel field, a semiconductor field, a chemical field, and / or an oil and gas plant field.

[0054] If the scrubbing system (1000) is utilized in the semiconductor field, the process chamber (10) may be a chamber where semiconductor processes are performed. To manufacture a semiconductor device, various semiconductor processes must be performed on a wafer. For example, a film must be deposited on the wafer (deposition process), and the film must be etched (etch process) to form a pattern included in the semiconductor device. Furthermore, after the deposition process and / or etching process are performed, a cleaning process must be performed to clean the wafer and / or the process chamber (10).

[0055] The deposition process may include, for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), and / or atomic layer deposition (ALD). The etching process may include, for example, a dry etching process, a wet etching process, and / or an ashing process. The cleaning process may include, for example, a wet cleaning process, a dry cleaning process, and / or a vapor cleaning process.

[0056] If the scrubbing system (1000) is utilized in the oil and gas plant industry, the process chamber (10) may be a chamber in which a plant process is performed.

[0057] When various processes are performed within a process chamber (10), byproducts may be generated. These byproducts may contain substances harmful to the human body. If these byproducts contain substances harmful to the human body, they must be removed and discharged. A scrubbing device (20) can be used to remove substances harmful to the human body from the byproducts generated within the process chamber (10).

[0058] A first pipe (11) may be arranged between the process chamber (10) and the scrubbing device (20). One end of the first pipe (11) may be connected to the process chamber (10), and the other end of the first pipe (11) may be connected to the scrubbing device (20). A gas (G) discharged from the process chamber (10) may be provided to the scrubbing device (20) through the first pipe (11) (see drawing reference numeral 50). The gas (G) may contain impurities. The impurities may be substances harmful to the human body. The impurities may include hydrophilic substances.

[0059] In some embodiments, a first valve (12) may be connected to the first pipe (11). The first valve (12) may control the pressure and flow rate of gas (G) provided to the scrubbing device (20) through the first pipe (11).

[0060] The scrubbing device (20) can scrub the gas (G) provided from the process chamber (10). Impurities contained in the gas (G) can be dissolved in a scrubbing solution and stored in a scrubbing solution discharge chamber (40). The gas (G') from which impurities have been removed can be stored in an exhaust gas discharge chamber (30). A detailed description of the scrubbing device (20) will be described later with reference to FIGS. 2 to 10.

[0061] The scrubbing solution discharge chamber (40) can be connected to the scrubbing device (20). The scrubbing solution discharge chamber (40) and the scrubbing device (20) can be connected to each other through a second pipe (21). One end of the second pipe (21) can be connected to the scrubbing device (20), and the other end of the second pipe (21) can be connected to the scrubbing solution discharge chamber (40). The scrubbing solution (S) in which impurities are dissolved can move from the scrubbing device (20) to the scrubbing solution discharge chamber (40) through the second pipe (21) (see drawing reference numeral 60).

[0062] In some embodiments, a second valve (22) may be connected to the second pipe (21). The second valve (22) may control the pressure and flow rate of the scrubbing solution (S) with dissolved impurities provided to the scrubbing solution discharge chamber (40) through the second pipe (21).

[0063] The exhaust gas discharge chamber (30) may be connected to the scrubbing device (20). The exhaust gas discharge chamber (30) and the scrubbing device (20) may be connected to each other through a third pipe (23). One end of the third pipe (23) may be connected to the scrubbing device (20), and the other end of the third pipe (23) may be connected to the exhaust gas discharge chamber (30). Through the third pipe (23), the gas (G') from which impurities have been removed may move from the scrubbing device (20) to the exhaust gas discharge chamber (30) (see drawing reference numeral 70).

[0064] In some embodiments, a third valve (24) may be connected to the third pipe (23). The third valve (24) may control the pressure and flow rate of the impurity-free gas (G') provided to the exhaust gas discharge chamber (30) through the third pipe (23).

[0065] In some embodiments, the scrubbing device (20) may further include a gas inlet (25) and a gas outlet (26). Gas (G) may be introduced into the scrubbing device (20) through the gas inlet (25). Gas (G') from which impurities have been removed may be discharged to the outside of the scrubbing device (20) through the gas outlet (26).

[0066] When a scrubbing device (20) according to some embodiments of the present invention is utilized in the aforementioned industrial fields, contaminants generated after a process can be effectively separated and removed. Consequently, environmental pollution problems can be reduced.

[0067]

[0068] Hereinafter, a scrubbing device according to some embodiments of the present invention will be described in detail with reference to FIGS. 2 to 4.

[0069] Fig. 2 is an exemplary perspective view for explaining the scrubbing device of Fig. 1. Fig. 3 is an exemplary cross-sectional view for explaining the scrubbing device of Fig. 1. Fig. 4 is an enlarged view of areas P1, P2, and P3 of Fig. 3.

[0070] Referring to FIGS. 2 to 4, a scrubbing device (20) according to some embodiments of the present invention may include a scrubbing chamber (210), a separating wall (220), a first scrubbing plate (230), a second scrubbing plate (240), a third scrubbing plate (250), a first spray nozzle (223), a second spray nozzle (225), a third spray nozzle (227), a fourth spray nozzle (221), and a demister (260).

[0071] First, a scrubbing chamber (210) may be provided. The scrubbing chamber (210) may be an external housing of the scrubbing device (20). A gas (G in FIG. 1) may be provided into the scrubbing chamber (210). The gas may contain impurities. For example, the gas (G in FIG. 1) may be provided into the scrubbing chamber (210) through a gas inlet (25 in FIG. 1). The gas inlet may be formed in an upper wall of the scrubbing chamber (210) or a side wall of the scrubbing chamber (210). In addition, the gas inlet may be formed in an upper portion of a side wall of the scrubbing chamber (210) or a lower portion of the side wall.

[0072] Impurities contained in the gas (G in FIG. 1) may be dissolved in a scrubbing solution inside the scrubbing chamber (210). The scrubbing chamber (210) may define a scrubbing space (215). The scrubbing space (215) may be a space where a scrubbing process is performed, in which impurities contained in the gas (G in FIG. 1) are dissolved in a scrubbing solution.

[0073] In some embodiments, the scrubbing space (215) may include a first sub-space (215a) and a second sub-space (215b). The first sub-space (215a) and the second sub-space (215b) may be separated by a separation wall (220). The first sub-space (215a) and the second sub-space (215b) may be defined by the separation wall (220).

[0074] A separating wall (220) may be positioned inside the scrubbing chamber (210). In some embodiments, the separating wall (220) may be attached to an upper wall of the scrubbing chamber (210). The separating wall (220) may extend from the upper wall of the scrubbing chamber (210) in a second direction (D2). The second direction (D2) may be a direction perpendicular to the ground.

[0075] In some embodiments, the separating wall (220) may have a bar shape in a plan view. The separating wall (220) may extend in a third direction (D3) in a plan view. One end of the separating wall (220) may be in contact with and connected to the third inner wall of the scrubbing chamber (210), and the other end of the separating wall (220) may be in contact with and connected to the fourth inner wall of the scrubbing chamber (210). The separating wall (220) may include a long side extending in the third direction (D3) and a short side extending in the first direction (D1), but the technical idea of ​​the present invention is not limited thereto.

[0076] In some embodiments, the scrubbing chamber (210) may include a first inner wall (210SW1), a second inner wall (210SW2), a third inner wall, and a fourth inner wall.

[0077] The first inner wall (210SW1) of the scrubbing chamber (210) may face the separating wall (220). The second inner wall (210SW2) of the scrubbing chamber (210) may face the first inner wall (210SW1) of the scrubbing chamber (210) in the first direction (D1). The third inner wall and the fourth inner wall may face each other in the third direction (D3) and may intersect the first inner wall (210SW1) and the second inner wall (210SW2), respectively.

[0078] The separation wall (220) can define a first sub-space (215a) and a second sub-space (215b). The separation wall (220) can separate the scrubbing space (215) into a first sub-space (215a) and a second sub-space (215b).

[0079] A first scrubbing process may be performed in the first sub-space (215a). A second scrubbing process may be performed in the second sub-space (215b). The first scrubbing process may be a process in which a portion of the impurities are dissolved in the fourth scrubbing solution (281). The second scrubbing process may be a process in which another portion of the impurities are dissolved in the first to third scrubbing solutions (283, 285, 287).

[0080] In this specification, the first direction (D1) and the third direction (D3) may intersect with each other. The first direction (D1) and the second direction (D2) may intersect with each other. The second direction (D2) and the third direction (D3) may intersect with each other. That is, in this specification, the first direction (D1), the second direction (D2), and the third direction (D3) may be substantially perpendicular to each other.

[0081] A first scrubbing plate (230), a second scrubbing plate (240), and a third scrubbing plate (250) may be arranged inside the scrubbing space (215). Specifically, the first scrubbing plate (230), the second scrubbing plate (240), and the third scrubbing plate (250) may be arranged inside the second sub-space (215b).

[0082] In FIGS. 2 to 4, the scrubbing device (20) of the present invention is illustrated as including three scrubbing plates, but the technical concept of the present invention is not limited thereto. The scrubbing device (20) according to some embodiments of the present invention may include two or more scrubbing plates. That is, the scrubbing plates may be arranged in two or four or more within the second sub-space (215b).

[0083] If four or more scrubbing plates are arranged within the second sub-space (215b), a spray nozzle may be arranged on each scrubbing plate. Accordingly, the scrubbing solution may be sprayed onto the upper surface of each scrubbing plate. However, the technical concept of the present invention is not limited thereto.

[0084] The first scrubbing plate (230) may be disposed at the lowest position among the scrubbing plates disposed inside the second sub-space (215b). One end of the first scrubbing plate (230) may be connected to and fixed to the partition wall (220). Specifically, one end of the first scrubbing plate (230) may be connected to and fixed to a side wall of the partition wall (220) facing the second sub-space (215b). The first scrubbing plate (230) may be connected to the partition wall (220) and extend in a first direction (D1) intersecting the partition wall (220). More specifically, the first scrubbing plate (230) may be placed on a plane along which the first direction (D1) and the third direction (D3) extend.

[0085] In some embodiments, another portion of the first scrubbing plate (230) may be connected and fixed to the inner walls of the scrubbing chamber (210). Specifically, the first scrubbing plate (230) may be connected to the separating wall (220) in the second sub-space (215b), the third inner wall of the scrubbing chamber (210), and the fourth inner wall of the scrubbing chamber (210).

[0086] However, the first scrubbing plate (230) may not be connected to and fixed to the second inner wall (210SW2) of the scrubbing chamber (210). The first scrubbing plate (230) may be spaced apart from the second inner wall (210SW2) of the scrubbing chamber (210) in the first direction (D1). The space from the other end of the first scrubbing plate (230) to the second inner wall (210SW2) of the scrubbing chamber (210) may be a space in which the first scrubbing solution (283) or the first to third scrubbing solutions (283, 285, 287) to be described later flow downward (for example, in the second direction (D2)).

[0087] In some embodiments, a first spray nozzle (223) may be disposed on the first scrubbing plate (230). The first spray nozzle (223) may be provided between the first scrubbing plate (230) and the second scrubbing plate (240). The first spray nozzle (223) may supply a first scrubbing solution (283) to the upper surface of the first scrubbing plate (230). Specifically, the first spray nozzle (223) may supply the first scrubbing solution (283) to the central portion of the upper surface of the first scrubbing plate (230). The first spray nozzle (223) may supply the first scrubbing solution (283) having small particles. As the first scrubbing solution (283) having small particles is provided, the height of the first bubble (BBL1) formed on the upper surface of the first scrubbing plate (230) may be controlled.

[0088] The scrubbing device (20) according to some embodiments may further include a first scrubbing hole (230H) and a first scrubbing wall (235).

[0089] The first scrubbing hole (230H) may be formed inside the first scrubbing plate (230). The first scrubbing hole (230H) may extend from the lower surface of the first scrubbing plate (230) to the upper surface of the first scrubbing plate (230). That is, the first scrubbing hole (230H) may penetrate the first scrubbing plate (230) in the second direction (D2). Gas (G in FIG. 1) may rise in the second direction (D2) by passing through the first scrubbing hole (230H) (see reference numeral 230u).

[0090] The upper surface of the first scrubbing plate (230) can face the demister (260) to be described later, and the lower surface of the first scrubbing plate (230) can face the scrubbing solution storage tank (270) to be described later.

[0091] A first scrubbing wall (235) may be attached to the other end of the first scrubbing plate (230). The first scrubbing wall (235) may be interposed between the first scrubbing plate (230) and the second inner wall (210SW2) of the scrubbing chamber (210). The first scrubbing wall (235) may extend in a second direction (D2). In some embodiments, a portion of the first scrubbing wall (235) may protrude from the upper surface of the first scrubbing plate (230) in the second direction (D2). Another portion of the first scrubbing wall (235) may protrude from the lower surface of the first scrubbing plate (230) in the second direction (D2).

[0092] The length in the second direction (D2) of the portion protruding in the second direction (D2) from the upper surface of the first scrubbing plate (230) among the first scrubbing walls (235) may be smaller than the length in the second direction (D2) of the portion protruding in the second direction (D2) from the lower surface of the first scrubbing plate (230), but the technical idea of ​​the present invention is not limited thereto.

[0093] In some embodiments, at least a portion of the first scrubbing plate (230) of the first scrubbing wall (235) protruding in the second direction (D2) from the lower surface thereof may be placed in the scrubbing solution (275) in which impurities are dissolved, but the technical idea of ​​the present invention is not limited thereto.

[0094] The second scrubbing plate (240) may be disposed on the first scrubbing plate (230). Specifically, the second scrubbing plate (240) may be disposed on the upper surface of the first scrubbing plate (230). One end of the second scrubbing plate (240) may be connected to and fixed to the second inner wall (210SW2) of the scrubbing chamber (210). The second scrubbing plate (240) may be connected to the second inner wall (210SW2) of the scrubbing chamber (210) and may extend in a first direction (D1) intersecting the second inner wall (210SW2) of the scrubbing chamber (210). More specifically, the second scrubbing plate (240) may be placed on a plane in which the first direction (D1) and the third direction (D3) extend.

[0095] Likewise, the second scrubbing plate (240) may be connected and fixed to the third inner wall of the scrubbing chamber (210) and the fourth inner wall of the scrubbing chamber (210). However, the other end of the second scrubbing plate (240) may not be connected and fixed to the separating wall (220). The other end of the second scrubbing plate (240) may be spaced apart from the separating wall (220) in the first direction (D1). The space from the other end of the second scrubbing plate (240) to the separating wall (220) may be a space in which the second scrubbing solution (285) or the third scrubbing solution (287), which will be described later, flows downward (for example, in the second direction (D2)).

[0096] In some embodiments, a second spray nozzle (225) may be disposed on the second scrubbing plate (240). The second spray nozzle (225) may be provided between the second scrubbing plate (240) and the third scrubbing plate (250). The second spray nozzle (225) may supply a second scrubbing solution (285) to the upper surface of the second scrubbing plate (240). Specifically, the second spray nozzle (225) may supply the second scrubbing solution (285) to the central portion of the upper surface of the second scrubbing plate (240). The second spray nozzle (225) may supply the second scrubbing solution (285) having small particles. As the second scrubbing solution (285) having small particles is provided, the height of the second bubble (BBL2) formed on the upper surface of the second scrubbing plate (240) may be controlled.

[0097] The scrubbing device (20) according to some embodiments may further include a second scrubbing hole (240H) and a second scrubbing wall (245).

[0098] The second scrubbing hole (240H) may be formed inside the second scrubbing plate (240). The second scrubbing hole (240H) may extend from the lower surface of the second scrubbing plate (240) to the upper surface of the second scrubbing plate (240). The second scrubbing hole (240H) may penetrate the second scrubbing plate (240) in a second direction (D2). A gas (G in FIG. 1) may rise in the second direction (D2) by passing through the second scrubbing hole (240H) (see reference numeral 240u).

[0099] The upper surface of the second scrubbing plate (240) can face the demister (260) to be described later, and the lower surface of the second scrubbing plate (240) can face the upper surface of the first scrubbing plate (230).

[0100] A second scrubbing wall (245) may be attached to the other end of the second scrubbing plate (240). The second scrubbing wall (245) may be interposed between the second scrubbing plate (240) and the separating wall (220). The second scrubbing wall (245) may extend in a second direction (D2). In some embodiments, a portion of the second scrubbing wall (245) may protrude from the upper surface of the second scrubbing plate (240) in the second direction (D2). Another portion of the second scrubbing wall (245) may protrude from the lower surface of the second scrubbing plate (240) in the second direction (D2).

[0101] The length in the second direction (D2) of the portion protruding in the second direction (D2) from the upper surface of the second scrubbing plate (240) among the second scrubbing walls (245) may be shorter than the length in the second direction (D2) of the portion protruding in the second direction (D2) from the lower surface of the second scrubbing plate (240), but the technical idea of ​​the present invention is not limited thereto.

[0102] In some embodiments, the first scrubbing plate (230) and the second scrubbing plate (240) do not completely overlap in the second direction (D2). The first scrubbing plate (230) and the second scrubbing plate (240) may be arranged in a zigzag manner. Accordingly, the second scrubbing solution (285) that flows downward over the second scrubbing wall (245) may be discharged onto the upper surface of the first scrubbing plate (230). In other words, the center of the first scrubbing plate (230) and the center of the second scrubbing plate (240) may be offset from each other.

[0103] The third scrubbing plate (250) may be placed on the second scrubbing plate (240). Specifically, the third scrubbing plate (250) may be placed on the upper surface of the second scrubbing plate (240). One end of the third scrubbing plate (250) may be connected to and fixed to the separating wall (220).

[0104] Specifically, one end of the third scrubbing plate (250) may be connected to and fixed to a side wall of the partition wall (220) facing the second sub-space (215b). The third scrubbing plate (250) may be connected to the partition wall (220) and may extend in a first direction (D1) intersecting the partition wall (220). More specifically, the third scrubbing plate (250) may be placed on a plane along which the first direction (D1) and the third direction (D3) extend. Similarly, the third scrubbing plate (250) may be connected to and fixed to the third inner side wall of the scrubbing chamber (210) and the fourth inner side wall of the scrubbing chamber (210).

[0105] However, the other end of the third scrubbing plate (250) may not be connected to and fixed to the second inner wall (210SW2) of the scrubbing chamber (210). The other end of the third scrubbing plate (250) may be spaced apart from the second inner wall (210SW2) of the scrubbing chamber (210) in the first direction (D1). The space from the other end of the third scrubbing plate (250) to the second inner wall (210SW2) of the scrubbing chamber (210) may be a space in which the third scrubbing solution (287), which will be described later, flows downward (for example, in the second direction (D2)).

[0106] In some embodiments, a third spray nozzle (227) may be disposed on the third scrubbing plate (250). The third spray nozzle (227) may be provided between the second scrubbing plate (240) and the third scrubbing plate (250). The third spray nozzle (227) may supply a third scrubbing solution (287) to the upper surface of the third scrubbing plate (250). Specifically, the third spray nozzle (227) may supply the third scrubbing solution (287) to the central portion of the upper surface of the third scrubbing plate (250). The third spray nozzle (227) may supply the third scrubbing solution (287) having small particles. As the third scrubbing solution (287) having small particles is provided, the height of the third bubble (BBL3) formed on the upper surface of the third scrubbing plate (250) may be controlled.

[0107] The scrubbing device (20) according to some embodiments may further include a third scrubbing hole (250H) and a third scrubbing wall (255).

[0108] The third scrubbing hole (250H) may be formed inside the third scrubbing plate (250). The third scrubbing hole (250H) may extend from the lower surface of the third scrubbing plate (250) to the upper surface of the third scrubbing plate (250). The third scrubbing hole (250H) may penetrate the third scrubbing plate (250) in the second direction (D2). Gas (G in FIG. 1) may rise in the second direction (D2) by passing through the third scrubbing hole (250H) (see reference numeral 250u).

[0109] The upper surface of the third scrubbing plate (250) can face the demister (260) to be described later, and the lower surface of the third scrubbing plate (250) can face the upper surface of the second scrubbing plate (240).

[0110] The third scrubbing wall (255) can be attached to the other end of the third scrubbing plate (250). The third scrubbing wall (255) can be interposed between the third scrubbing plate (250) and the second inner wall (210SW2) of the scrubbing chamber (210). The third scrubbing wall (255) can extend in the second direction (D2).

[0111] In some embodiments, a portion of the third scrubbing wall (255) may protrude in the second direction (D2) from the upper surface of the third scrubbing plate (250). Another portion of the third scrubbing wall (255) may protrude in the second direction (D2) from the lower surface of the third scrubbing plate (250).

[0112] The length in the second direction (D2) of the portion protruding in the second direction (D2) from the upper surface of the third scrubbing plate (250) among the third scrubbing walls (255) may be smaller than the length in the second direction (D2) of the portion protruding in the second direction (D2) from the lower surface of the third scrubbing plate (250), but the technical idea of ​​the present invention is not limited thereto.

[0113] In some embodiments, the third scrubbing plate (250) and the second scrubbing plate (240) do not completely overlap in the second direction (D2). The third scrubbing plate (250) and the second scrubbing plate (240) may be arranged in a zigzag manner. The third scrubbing solution (287) that flows downward beyond the third scrubbing wall (255) may be discharged onto the upper surface of the second scrubbing plate (240). In other words, the center of the third scrubbing plate (250) and the center of the second scrubbing plate (240) may be offset from each other.

[0114] However, the third scrubbing plate (250) and the first scrubbing plate (230) can completely overlap in the second direction (D2). That is, the center of the third scrubbing plate (250) and the center of the first scrubbing plate (230) can overlap in the second direction (D2).

[0115] In some embodiments, the first to third scrubbing holes (230H, 240H, 250H) may completely overlap in the second direction (D2). However, the technical idea of ​​the present invention is not limited thereto. It goes without saying that the first to third scrubbing holes (230H, 240H, 250H) may not completely overlap in the second direction (D2), and may only partially overlap.

[0116] In some embodiments, the first to third scrubbing solutions (283, 285, 287) may be water. The first to third scrubbing solutions (283, 285, 287) may all be the same. The concentrations of impurities contained in the first to third scrubbing solutions (283, 285, 287) may all be the same. For example, the first to third scrubbing solutions (283, 285, 287) may be pure water containing no impurities. However, the technical idea of ​​the present invention is not limited thereto.

[0117] The third scrubbing solution (287) may be discharged onto the upper surface of the third scrubbing plate (250) and then flow from the upper surface of the third scrubbing plate (250) toward the third scrubbing wall (255) while the second scrubbing process is being performed. At this time, the third scrubbing solution (287) does not flow downward through the third scrubbing hole (250H). The third scrubbing solution (287) may flow beyond the third scrubbing wall (255) to the lower portion of the scrubbing chamber (210).

[0118] Since the third scrubbing solution (287) is provided in a spray form, the height of the third bubble (BBL3) formed on the upper surface of the third scrubbing plate (250) can be controlled. Specifically, when the third bubble (BBL3) is formed high, the discharge amount of the third scrubbing solution (287) can be increased to reduce the height of the third bubble (BBL3).

[0119] The third scrubbing solution (287) that has passed the third scrubbing wall (255) is discharged again to the upper surface of the second scrubbing plate (240). The third scrubbing solution (287) can flow from the upper surface of the second scrubbing plate (240) toward the second scrubbing wall (245) while the second scrubbing process is performed.

[0120] At this time, the second spray nozzle (225) can provide the second scrubbing solution (285) to the upper surface of the second scrubbing plate (240). By providing the second scrubbing solution (285), the height of the second bubble (BBL2) formed on the second scrubbing plate (240) can be controlled. Specifically, when the second bubble (BBL2) is formed high, the height of the second bubble (BBL2) can be reduced by discharging the second scrubbing solution (285). When the second bubble (BBL2) is formed high, the discharge amount of the second scrubbing solution (285) can be increased to reduce the height of the second bubble (BBL2).

[0121] The third scrubbing solution (287) and the second scrubbing solution (285) disposed on the upper surface of the second scrubbing plate (240) do not flow downward through the second scrubbing hole (240H). The third scrubbing solution (287) and the second scrubbing solution (285) can flow beyond the second scrubbing wall (245) to the lower portion of the scrubbing chamber (210).

[0122] Likewise, the third scrubbing solution (287) and the second scrubbing solution (285) that have passed the second scrubbing wall (245) are discharged again to the upper surface of the first scrubbing plate (230). The third scrubbing solution (287) and the second scrubbing solution (285) can flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) while the second scrubbing process is performed.

[0123] At this time, the first spray nozzle (223) can provide the first scrubbing solution (283) to the upper surface of the first scrubbing plate (230). By providing the first scrubbing solution (283), the height of the first bubble (BBL1) formed on the first scrubbing plate (230) can be controlled. Specifically, when the first bubble (BBL1) is formed high, the discharge amount of the first scrubbing solution (283) can be increased to reduce the height of the first bubble (BBL1).

[0124] At this time, the first to third scrubbing solutions (283, 285, 287) do not flow downward through the first scrubbing hole (230H). The first to third scrubbing solutions (283, 285, 287) can flow beyond the first scrubbing wall (235) to the lower part of the scrubbing chamber (210).

[0125] Finally, the first to third scrubbing solutions (283, 285, 287) that have passed the first scrubbing month (235) may be stored in a scrubbing solution storage tank (270) provided at the bottom of the scrubbing chamber (210). The scrubbing solution storage tank (270) may store a scrubbing solution (275) in which impurities are dissolved. For example, the scrubbing solution (275) in which impurities are dissolved may be a solution in which a hydrophilic gas is dissolved in the first to third scrubbing solutions (283, 285, 287).

[0126] In some embodiments, the hydrophilic gas may be isopropyl alcohol (IPA) and / or ammonia, but the technical idea of ​​the present invention is not limited thereto.

[0127] A demister (260) may be placed above the scrubbing chamber (210). The demister (260) may be used to remove moisture from the gas after the first scrubbing process and the second scrubbing process are performed. After the first scrubbing process and the second scrubbing process are performed, a gas (G' in FIG. 1) from which impurities have been removed may be provided. That is, moisture may be removed from the gas (G' in FIG. 1) from which impurities have been removed after the first scrubbing process and the second scrubbing process are performed using the demister (260).

[0128] The demister (260) can be connected to the gas exhaust port (26). The gas filtered through the demister (260) can be discharged to the outside of the scrubbing chamber (210) through the gas exhaust port (26).

[0129] When using a scrubbing device (20) according to some embodiments, gases harmful to the human body (e.g., impurities) can be dissolved in the scrubbing solution. Accordingly, gases harmful to the human body can be removed from byproducts generated after various processes in various industrial fields and discharged outside the scrubbing chamber (210).

[0130] In some embodiments, the first sub-space (215a) may be defined by the first inner wall (210SW1) of the scrubbing chamber (210) and the separating wall (220). For example, the first sub-space (215a) may be defined by the first inner wall (210SW1) of the scrubbing chamber (210), the third inner wall of the scrubbing chamber (210), the fourth inner wall of the scrubbing chamber (210), and the separating wall (220).

[0131] The first scrubbing process can be performed in the first sub-space (215a).

[0132] Specifically, the fourth scrubbing solution (281) can be provided into the interior of the scrubbing chamber (210) through the fourth spray nozzle (221). The fourth scrubbing solution (281) can be provided into the first sub-space (215a) through the fourth spray nozzle (221).

[0133] A fourth scrubbing solution (281) is provided from the upper part to the lower part of the first sub-space (215a), and while the gas (G in FIG. 1) flows from the upper part to the lower part of the first sub-space (215a), at least some of the impurities contained in the gas may be dissolved in the fourth scrubbing solution (281). In some embodiments, the fourth scrubbing solution (281) may include water. However, the technical idea of ​​the present invention is not limited thereto.

[0134] In some embodiments, the fourth spray nozzle (221) may be a spray nozzle. The fourth spray nozzle (221) may supply the fourth scrubbing solution (281) with small particles to the first sub-space (215a). Accordingly, the contact area between the fourth scrubbing solution (281) and the gas may be increased. Accordingly, a scrubbing device (20) with improved scrubbing efficiency may be provided.

[0135] The fourth spray nozzle (221) may be installed at the top of the scrubbing chamber (210). Although not shown, the fourth spray nozzle (221) may be connected to a pipe installed outside the scrubbing chamber (210).

[0136] In some embodiments, a gas inlet may be installed on one side of the first sub-space (215a). A gas (G in FIG. 1) to be introduced into the interior of the scrubbing chamber (210) may be introduced into the interior of the scrubbing chamber (210) through the gas inlet. The gas inlet may be connected to a first pipe (11), and since the other side of the first pipe (11) is connected to a process chamber (10 in FIG. 1), the gas (G in FIG. 1) introduced into the gas inlet may be provided from the process chamber.

[0137] In some embodiments, a negative pressure may be provided to the scrubbing space (215) through the gas inlet and the gas outlet (26). For example, the pressure at the gas inlet and the pressure at the gas outlet (26) may be different from each other. Accordingly, the gas (G in FIG. 1) may flow from the gas inlet toward the gas outlet (26). The first scrubbing process and the second scrubbing process may be performed by utilizing the difference between the pressure at the gas inlet and the pressure at the gas outlet (26).

[0138] In some embodiments, the first sub-space (215a) and the second sub-space (215b) may be connected to each other at the bottom of the scrubbing chamber (210). The first sub-space (215a) and the second sub-space (215b) may be connected to each other above the scrubbing solution storage tank (270).

[0139] That is, the gas introduced into the first sub-space (215a) can flow from the upper part of the first sub-space (215a) to the lower part of the first sub-space (215a) and be introduced into the second sub-space (215b) from the lower part of the scrubbing chamber (210). In the second sub-space (215b), the gas (G in FIG. 1) can rise in the second direction (D2).

[0140] When using a scrubbing device (20) according to some embodiments, the contact area of ​​a gas in contact with a scrubbing solution can be improved. Specifically, the contact area between the scrubbing solution and the gas can be improved by forming bubbles within the scrubbing solution.

[0141] For example, in FIG. 4, gas (G in FIG. 1) can pass through the first scrubbing hole (230H) and rise in the second direction (D2) (see drawing symbol 230u).

[0142] After the gas (G in FIG. 1) passes upwardly through the first scrubbing hole (230H), a first bubble (BBL1) may be formed on the upper surface of the first scrubbing plate (230). The first bubble (BBL1) may be formed inside the first scrubbing solution (283). The first bubble (BBL1) may be a bubble generated due to the pressure of the gas trying to rise in the second direction (D2) inside the first scrubbing solution (283).

[0143] At the point where the first bubble (BBL1) and the first scrubbing solution (283) come into contact, impurities contained in the gas may be dissolved in the first scrubbing solution (283). In some embodiments, the scrubbing solution provided on the upper surface of the first scrubbing plate (230) may be a mixture of the first to third scrubbing solutions (283, 285, 287).

[0144] In some embodiments, the first scrubbing solution (283) is provided in a spray form on the upper surface of the first scrubbing plate (230). As the first scrubbing solution (283) is provided on the upper surface of the first scrubbing plate (230), the height of the first bubble (BBL1) formed can be controlled. If the first bubble (BBL1) is formed higher than a preset height, the discharge amount of the first scrubbing solution (283) can be increased to reduce the height of the first bubble (BBL1).

[0145] In addition, as the first scrubbing solution (283) having small particles is provided, the contact area between the first scrubbing solution (283) and the gas is improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency can be provided.

[0146] Next, the gas (G in FIG. 1) can rise in the second direction (D2) by passing through the first scrubbing hole (230H) and then passing through the second scrubbing hole (240H) (see drawing symbol 240u).

[0147] After the gas (G in FIG. 1) passes upwardly through the second scrubbing hole (240H), a second bubble (BBL2) may be formed on the upper surface of the second scrubbing plate (240). The second bubble (BBL2) may be formed inside the second scrubbing solution (285). The second bubble (BBL2) may be a bubble generated due to the pressure of the gas trying to rise in the second direction (D2) inside the second scrubbing solution (285).

[0148] At the point where the second bubble (BBL2) and the second scrubbing solution (285) come into contact, impurities contained in the gas may be dissolved in the second scrubbing solution (285). In some embodiments, the scrubbing solution provided on the upper surface of the second scrubbing plate (240) may be a mixture of the second and third scrubbing solutions (285, 287).

[0149] In some embodiments, a second scrubbing solution (285) is provided in a spray form on the upper surface of the second scrubbing plate (240). As the second scrubbing solution (285) is provided, the height of the second bubble (BBL2) formed can be controlled. If the second bubble (BBL2) is formed higher than a preset height, the discharge amount of the second scrubbing solution (285) can be increased to reduce the height of the second bubble (BBL2).

[0150] In addition, as the second scrubbing solution (285) having small particles is provided, the contact area between the second scrubbing solution (285) and the gas is improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency can be provided.

[0151] Likewise, after the gas (G in FIG. 1) passes upwardly through the second scrubbing hole (240H), it may pass upwardly through the third scrubbing hole (250H) and rise in the second direction (D2) (see reference numeral 250u). After the gas (G in FIG. 1) passes upwardly through the third scrubbing hole (250H), a third bubble (BBL3) may be formed on the upper surface of the third scrubbing plate (250).

[0152] After the gas (G in FIG. 1) passes upwardly through the third scrubbing hole (250H), a third bubble (BBL3) may be formed on the upper surface of the third scrubbing plate (250). The third bubble (BBL3) may be formed inside the third scrubbing solution (287). The third bubble (BBL3) may be a bubble generated due to the pressure of the gas trying to rise in the second direction (D2) inside the third scrubbing solution (287).

[0153] At the point where the third bubble (BBL3) and the third scrubbing solution (287) come into contact, impurities contained in the gas can be dissolved in the third scrubbing solution (287).

[0154] In some embodiments, a third scrubbing solution (287) is provided in a spray form on the upper surface of the third scrubbing plate (250). As the third scrubbing solution (287) is provided, the height of the third bubble (BBL3) formed can be controlled. If the third bubble (BBL3) is excessively formed, the third bubble (BBL3) may be formed up to the demister (260). If the third bubble (BBL3) is formed high, the height of the third bubble (BBL3) must be reduced.

[0155] When the third bubble (BBL3) is formed higher than the preset height, the discharge amount of the third scrubbing solution (287) can be increased to reduce the height of the third bubble (BBL3). By controlling the height of the third bubble (BBL3), a scrubbing device (20) with improved stability can be provided.

[0156] In addition, as the third scrubbing solution (287) having small particles is provided, the contact area between the third scrubbing solution (287) and the gas is improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency can be provided.

[0157] When first to third bubbles (BBL1, BBL2, BBL3) are formed within first to third scrubbing solutions (283, 285, 287), the contact area between the gas and the scrubbing solution can be improved. Accordingly, a scrubbing device (20) with improved scrubbing efficiency can be provided.

[0158] In some embodiments, the first scrubbing hole (230H) may have a first diameter (d1). The first diameter (d1) may be the width of the first scrubbing hole (230H) in the first direction (D1) or the third direction (D3) from a cross-sectional perspective. The first scrubbing hole (230H) may have a circular shape from a planar perspective. In this case, the first diameter (d1) may be the diameter of the first scrubbing hole (230H). However, the technical idea of ​​the present invention is not limited thereto.

[0159] Similarly, the second scrubbing hole (240H) may have a second diameter (d2), and the third scrubbing hole (250H) may have a third diameter (d3).

[0160] The size of the first diameter (d1), the size of the second diameter (d2), and the size of the third diameter (d3) may all be the same. That is, the cross-sectional area of ​​the first scrubbing hole (230H), the cross-sectional area of ​​the second scrubbing hole (240H), and the cross-sectional area of ​​the third scrubbing hole (250H) may all be the same. In addition, the volume of the first scrubbing hole (230H), the volume of the second scrubbing hole (240H), and the volume of the third scrubbing hole (250H) may all be the same.

[0161] In this case, the number of first scrubbing holes (230H) is greater than the number of second scrubbing holes (240H). In addition, the number of second scrubbing holes (240H) is greater than the number of third scrubbing holes (250H).

[0162] This may be because the amount of scrubbing solution provided on the second scrubbing plate (240) is greater than the amount of scrubbing solution provided on the third scrubbing plate (250), and because the amount of scrubbing solution provided on the first scrubbing plate (230) is greater than the amount of scrubbing solution provided on the second scrubbing plate (240).

[0163] Specifically, only the third scrubbing solution (287) is provided on the third scrubbing plate (250), while the third scrubbing solution (287) and the second scrubbing solution (285) are provided on the second scrubbing plate (240). The first to third scrubbing solutions (283, 285, 287) are provided on the first scrubbing plate (230).

[0164] At this time, the gas passing through the second scrubbing hole (240H) must pass through a larger amount of scrubbing solution than the gas passing through the third scrubbing hole (250H), and the gas passing through the first scrubbing hole (230H) must pass through a larger amount of scrubbing solution than the gas passing through the second scrubbing hole (240H). Therefore, the number of first scrubbing holes (230H) may be greater than the number of second scrubbing holes (240H), and the number of second scrubbing holes (240H) may be greater than the number of third scrubbing holes (250H).

[0165] In other words, the total area of ​​the plurality of first scrubbing holes (230H) relative to the area of ​​the first scrubbing plate (230) is larger than the total area of ​​the plurality of second scrubbing holes (240H) relative to the area of ​​the second scrubbing plate (240). In addition, the total area of ​​the plurality of second scrubbing holes (240H) relative to the area of ​​the second scrubbing plate (240) is larger than the total area of ​​the plurality of third scrubbing holes (250H) relative to the area of ​​the third scrubbing plate (250). However, the technical idea of ​​the present invention is not limited thereto.

[0166] In some embodiments, the size of the second diameter (d2) of each of the plurality of second scrubbing holes (240H) may be larger than the size of the third diameter (d3) of each of the plurality of third scrubbing holes (250H), and the size of the first diameter (d1) of each of the plurality of first scrubbing holes (230H) may be smaller than the size of the second diameter (d2) of each of the plurality of second scrubbing holes (240H).

[0167]

[0168] Hereinafter, a scrubbing device according to several other embodiments of the present invention will be described with reference to FIGS. 5 to 10. For convenience of explanation, any content overlapping with that described using FIGS. 2 to 4 will be briefly described or omitted.

[0169] FIGS. 5 to 10 are drawings for explaining a scrubbing device according to several other embodiments of the present invention. For reference, FIG. 5 may be an enlarged view of areas P1, P2, and P3 of FIG. 3, and FIGS. 6 to 10 may each be cross-sectional views of a scrubbing device according to several other embodiments of the present invention.

[0170] First, referring to FIG. 5, the sizes of the first diameter (d1), the second diameter (d2), and the third diameter (d3) may be different from each other. For example, the size of the first diameter (d1) may be larger than the size of the second diameter (d2). The size of the second diameter (d2) may be larger than the size of the third diameter (d3).

[0171] The cross-sectional area of ​​each first scrubbing hole (230H) may be larger than the cross-sectional area of ​​each second scrubbing hole (240H). The cross-sectional area of ​​each second scrubbing hole (240H) may be larger than the cross-sectional area of ​​each third scrubbing hole (250H). The volume of each first scrubbing hole (230H) may be larger than the volume of each second scrubbing hole (240H). The volume of each second scrubbing hole (240H) may be larger than the volume of each third scrubbing hole (250H).

[0172] At this time, the number of first scrubbing holes (230H) may be greater than, equal to, or less than, the number of second scrubbing holes (240H).

[0173] In addition, the total area of ​​the plurality of first scrubbing holes (230H) relative to the area of ​​the first scrubbing plate (230) is larger than the total area of ​​the plurality of second scrubbing holes (240H) relative to the area of ​​the second scrubbing plate (240), and the total area of ​​the plurality of second scrubbing holes (240H) relative to the area of ​​the second scrubbing plate (240) is larger than the total area of ​​the plurality of third scrubbing holes (250H) relative to the cross-sectional area of ​​the third scrubbing plate (250).

[0174] Unlike the drawing, the size of the first diameter (d1) is larger than the size of the second diameter (d2), but the size of the second diameter (d2) may be the same as the size of the third diameter (d3). In addition, the size of the first diameter (d1) is the same as the size of the second diameter (d2), but the size of the second diameter (d2) may be larger than the size of the third diameter (d3).

[0175] Referring to FIG. 6, the scrubbing device (20) according to some embodiments may not include the first spray nozzle (223). That is, the first scrubbing solution may not be provided on the upper surface of the first scrubbing plate (230). That is, when the second scrubbing process is performed, the third scrubbing solution (287) may be provided in a spray form on the upper surface of the third scrubbing plate (250), and the second scrubbing solution (285) may be provided in a spray form on the upper surface of the second scrubbing plate (240). However, the first scrubbing solution is not provided in a spray form on the upper surface of the first scrubbing plate (230). Impurities may be dissolved in the second scrubbing solution (285) and the third scrubbing solution (287) discharged to the upper surface of the first scrubbing plate (230).

[0176] In Fig. 6, the scrubbing device (20) is illustrated as including three scrubbing plates, but the technical idea of ​​the present invention is not limited thereto. The scrubbing device (20) may include four or more scrubbing plates.

[0177] If the scrubbing device (20) includes four or more scrubbing plates, a spray nozzle may be arranged on the upper surface of the scrubbing plate arranged at the top, and spray nozzles may or may not be arranged on the upper surfaces of the remaining scrubbing plates. For example, a spray nozzle may be arranged on the upper surface of the scrubbing plate arranged at the top, no spray nozzle may be arranged on the upper surface of the scrubbing plate arranged at the bottom, and a spray nozzle may be arranged on the upper surface of a scrubbing plate arranged between the top and bottom.

[0178] Referring to FIG. 7, the scrubbing device (20) according to some embodiments may not include a second spray nozzle (225). That is, the second scrubbing solution may not be provided on the upper surface of the second scrubbing plate (240). However, the first scrubbing solution (283) is provided on the upper surface of the first scrubbing plate (230). That is, when the second scrubbing process is performed, the third scrubbing solution (287) may be provided in a spray form on the upper surface of the third scrubbing plate (250), and the first scrubbing solution (283) may be provided in a spray form on the upper surface of the first scrubbing plate (230). However, the second scrubbing solution is not provided in a spray form on the upper surface of the second scrubbing plate (240).

[0179] In Fig. 7, the scrubbing device (20) is illustrated as including three scrubbing plates, but the technical idea of ​​the present invention is not limited thereto. The scrubbing device (20) may include four or more scrubbing plates.

[0180] If the scrubbing device (20) includes four or more scrubbing plates, a spray nozzle may be arranged on the upper surface of the scrubbing plate arranged at the top, and spray nozzles may or may not be arranged on the upper surfaces of the remaining scrubbing plates. For example, a spray nozzle may be arranged on the upper surface of the scrubbing plate arranged at the top, a spray nozzle may be arranged on the upper surface of the scrubbing plate arranged at the bottom, and no spray nozzle may be arranged on the upper surface of the scrubbing plate arranged between the top and bottom.

[0181] Referring to FIG. 8, the scrubbing device (20) according to some embodiments may further include a first recycle pipe (291) and a second recycle pipe (292).

[0182] One end of the first recycle pipe (291) may be connected to a scrubbing solution storage tank (270). The other end of the first recycle pipe (291) may be connected to a first spray nozzle (223). One end of the second recycle pipe (292) may be connected to the scrubbing solution storage tank (270). The other end of the second recycle pipe (292) may be connected to a second spray nozzle (225).

[0183] In some embodiments, the first scrubbing solution (283) may be the solution (275) stored in the scrubbing solution storage tank (270). That is, in the scrubbing device (20) according to some embodiments, the scrubbing solution (275) with impurities dissolved may be recycled and used as the first scrubbing solution (283). Similarly, the second scrubbing solution (285) may be the solution (275) stored in the scrubbing solution storage tank (270). That is, in the scrubbing device (20) according to some embodiments, the scrubbing solution (275) with impurities dissolved may be recycled and used as the second scrubbing solution (285).

[0184] At this time, the third scrubbing solution (287) may be a new scrubbing solution. The concentration of impurities contained in the gas decreases as it passes upward through the scrubbing hole. For example, the concentration of impurities contained in the gas that has passed upward through the second scrubbing hole (240H) is lower than the concentration of impurities contained in the gas that has passed upward through the first scrubbing hole (230H). The concentration of impurities contained in the gas that has passed upward through the third scrubbing hole (250H) is lower than the concentration of impurities contained in the gas that has passed upward through the second scrubbing hole (240H).

[0185] In other words, the concentration of the impurity in the third scrubbing solution (287) may be less than the concentration of the impurity in the second scrubbing solution (285), and the concentration of the impurity in the third scrubbing solution (287) may be less than the concentration of the impurity in the first scrubbing solution (283). However, the technical idea of ​​the present invention is not limited thereto.

[0186] Therefore, in order to scrub impurities contained in the gas passing through the third scrubbing hole (250H), a scrubbing solution in which the impurities are not dissolved must be used. Conversely, in order to scrub impurities contained in the gas passing through the first scrubbing hole (230H) and the second scrubbing hole (240H), a scrubbing solution in which the impurities are partially dissolved may be used.

[0187] That is, according to some embodiments, it is possible to determine whether to recycle the scrubbing solution (275) in which the impurities are dissolved by considering the concentration of the impurities contained in the gas and the number of scrubbing plates contained in the scrubbing device (20).

[0188] In some embodiments, the first scrubbing solution (283) may be a solution (275) stored in a scrubbing solution storage tank (270), and the second scrubbing solution (285) may be a new scrubbing solution. Conversely, the first scrubbing solution (283) may be a new scrubbing solution, and the second scrubbing solution (285) may be a solution (275) stored in a scrubbing solution storage tank (270).

[0189] The scrubbing device (20) according to some embodiments can recycle previously used scrubbing solution. Accordingly, the amount of new scrubbing solution used can be reduced.

[0190] Referring to FIG. 9, the scrubbing device according to some embodiments may include only a first scrubbing plate (230) and a second scrubbing plate (240). That is, the scrubbing device (20) may include a first scrubbing plate (230) and a second scrubbing plate (240).

[0191] A second scrubbing plate (240) may be placed on the first scrubbing plate (230). The second scrubbing plate (240) may be placed on the upper surface of the first scrubbing plate (230). The first scrubbing plate (230) may be placed on the lower surface of the second scrubbing plate (240). No other scrubbing plate may be placed on the upper surface of the second scrubbing plate (240).

[0192] In some embodiments, the second scrubbing solution (285) may be supplied from the second spray nozzle (225) and discharged onto the upper surface of the second scrubbing plate (240). Specifically, the second scrubbing solution (285) may be discharged onto the center of the upper surface of the second scrubbing plate (240).

[0193] The discharged second scrubbing solution (285) can flow from the upper surface of the second scrubbing plate (240) toward the second scrubbing wall (245) while the second scrubbing process is being performed. The second scrubbing solution (285) can flow downward over the second scrubbing wall (245). At this time, the second scrubbing solution (285) does not flow downward through the second scrubbing hole (240H). The second scrubbing solution (285) that has flowed downward over the second scrubbing wall (245) can be discharged onto the upper surface of the first scrubbing plate (230).

[0194] The first scrubbing solution (283) can be supplied from the first spray nozzle (223) and discharged onto the upper surface of the first scrubbing plate (230). Specifically, the first scrubbing solution (283) can be discharged onto the center of the upper surface of the first scrubbing plate (230).

[0195] Likewise, the first scrubbing solution (283) may flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) while the second scrubbing process is being performed. At this time, the first scrubbing solution (283) does not flow downward through the first scrubbing hole (230H). The first scrubbing solution (283) may flow beyond the first scrubbing wall (235) to the lower portion of the scrubbing chamber (210).

[0196] Although not shown, the first scrubbing solution (283) may be a scrubbing solution (275) in which impurities are dissolved, and the second scrubbing solution (285) may be a new scrubbing solution.

[0197] The scrubbing device (20) illustrated in FIG. 9 includes only two scrubbing plates (230, 240). Therefore, the height of the scrubbing device (20) in the second direction (D2) can be reduced. That is, when using the scrubbing device (20) according to some embodiments of the present invention, space efficiency can be improved.

[0198] Referring to FIG. 10, in a scrubbing device (20) according to some embodiments, the shape of the first scrubbing plate (230) and the shape of the second scrubbing plate (240) may be different from each other.

[0199] For example, the two ends of the first scrubbing plate (230) may be spaced apart from the separating wall (220) and the second inner wall (210SW2), respectively. Specifically, the first scrubbing plate (230) may not be in contact with and connected to both the separating membrane (220) and the second inner wall (210SW2). Although not shown, the first scrubbing plate (230) may be in contact with and connected to the third inner wall and the fourth inner wall.

[0200] A pair of first scrubbing walls (235) may be arranged at one end and the other end of the first scrubbing plate (230). Some of the pair of first scrubbing walls (235) may be interposed between the first scrubbing plate (230) and the separating wall (220). Others of the pair of first scrubbing walls (235) may be interposed between the first scrubbing plate (230) and the second inner wall (210SW2).

[0201] The space between the first scrubbing wall (235) and the separation wall (220) and the space between the first scrubbing wall (235) and the second inner wall (210SW2) may each be a space in which the second scrubbing solution (285) flows downward (e.g., in the second direction (D2)).

[0202] The two ends of the second scrubbing plate (240) may be connected to and in contact with the separating wall (220) and the second inner wall (210SW2), respectively. The second scrubbing plate (240) may have a structure in which the central portion is open. That is, the second scrubbing plate (240) may include an opening, and the opening is formed in the central portion of the second scrubbing plate (240) and may extend in a third direction (D3). The opening may expose at least a portion of the upper surface of the first scrubbing plate (230). That is, the opening may overlap at least a portion of the upper surface of the first scrubbing plate (230) in the second direction (D2).

[0203] A pair of second scrubbing walls (245) may each be arranged in the central portion of the second scrubbing plate (240). A pair of second scrubbing walls (245) may each be arranged in the opening.

[0204] A pair of second scrubbing walls (245) may be spaced apart from each other in a first direction (D1). The space between the pair of second scrubbing walls (245) may be a space through which the second scrubbing solution (285) flows downward (e.g., in the second direction (D2)). That is, the second scrubbing solution (285) may flow downward through the opening.

[0205] In some embodiments, the second scrubbing solution (285) may be discharged to both ends of the second scrubbing plate (240) and the central portion of the second scrubbing plate (240). Since the second scrubbing plate (240) has a structure in which the central portion is open, the second scrubbing solution (285) discharged to the central portion of the second scrubbing plate (240) may be discharged directly to the upper surface of the first scrubbing plate (230).

[0206] The second scrubbing solution (285) can be discharged to an area adjacent to the separating wall (220) of the second scrubbing plate (240) and an area adjacent to the second inner wall (210SW2) of the second scrubbing plate (240).

[0207] The second scrubbing solution (285) discharged to the upper surface of the second scrubbing plate (240) can flow to the central portion of the second scrubbing plate (240). The second scrubbing solution (285) discharged to the upper surface of the second scrubbing plate (240) can flow to the opening. While the second scrubbing solution (285) flows to the central portion of the second scrubbing plate (240), impurities can be dissolved in the second scrubbing solution (285). The second scrubbing solution (285) can be discharged to the upper surface of the first scrubbing plate (230) over the second scrubbing wall (245). The second scrubbing solution (285) discharged to the upper surface of the first scrubbing plate (230) can flow to both ends of the first scrubbing plate (230).

[0208] In Fig. 10, the scrubbing device (20) is illustrated as including two scrubbing plates, but the technical idea of ​​the present invention is not limited thereto. If the scrubbing device (20) includes three scrubbing plates, the shape of the third scrubbing plate may be identical to the shape of the first scrubbing plate (230). The third scrubbing plate may be placed on the second scrubbing plate (240).

[0209] If the scrubbing device (20) includes four scrubbing plates, the shape of the third scrubbing plate may be the same as the shape of the first scrubbing plate (230), and the shape of the fourth scrubbing plate may be the same as the shape of the second scrubbing plate (240). The third scrubbing plate may be disposed on the second scrubbing plate (240), and the fourth scrubbing plate may be disposed on the third scrubbing plate.

[0210]

[0211] Hereinafter, an operating method of a scrubbing device according to some embodiments of the present invention will be described with reference to FIGS. 11 and 12. For reference, FIG. 11 may be an exemplary flowchart for explaining an operating method of a scrubbing device according to some embodiments of the present invention.

[0212] FIG. 11 and FIG. 12 are drawings for explaining an operating method of a scrubbing device according to some embodiments of the present invention.

[0213] First, referring to FIG. 11, an operating method of a scrubbing device according to some embodiments of the present invention may include providing a gas containing impurities to a scrubbing chamber (S100), providing a first scrubbing solution in a spray form to the upper surface of a first scrubbing plate, allowing the gas to rise and pass through the first scrubbing hole so that some of the impurities are dissolved in the first scrubbing solution (S200), providing a second scrubbing solution in a spray form to the upper surface of a second scrubbing plate, allowing the gas to rise and pass through the second scrubbing hole so that some of the impurities are dissolved in the second scrubbing solution (S300), and discharging a gas from which impurities have been removed to the outside of the scrubbing chamber (S400). The concentration of impurities contained in the gas discharged to the outside of the scrubbing chamber may be very low.

[0214] Specifically, referring to FIGS. 1 and 12, a gas (G) containing impurities may be provided from a process chamber (10) to a scrubbing device (20). The gas (G) containing impurities may pass through a first pipe (11) and be introduced into the interior of the scrubbing device (20) through a gas inlet (25). The gas (G) containing impurities may be introduced into a first sub-space (215a). For example, the gas (G) containing impurities may move to the lower portion of the first sub-space (215a).

[0215] In some embodiments, a first scrubbing process may be performed in a first sub-space (215a).

[0216] Specifically, a fourth scrubbing solution (281) can be supplied to the first sub-space (215a) through the fourth spray nozzle (221) (see drawing reference numeral 310). The fourth scrubbing solution (281) may be water, but the technical idea of ​​the present invention is not limited thereto.

[0217] In FIG. 12, the fourth scrubbing solution (281) is depicted as being sprayed vertically in the second direction (D2), but the technical idea of ​​the present invention is not limited thereto.

[0218] The fourth spray nozzle (221) can supply a fourth scrubbing solution (281) having small particles. As the gas (G) containing impurities moves to the lower part of the first sub-space (215a), the impurities contained in the gas (G) can be dissolved in the fourth scrubbing solution (281). The first scrubbing process may be a process in which the impurities contained in the gas (G) are dissolved in the fourth scrubbing solution (281).

[0219] The gas (G) from which some of the impurities have been removed may be supplied to a second sub-space (215b) (see drawing reference numeral 410). A second scrubbing process may be performed in the second sub-space (215b). The second scrubbing process may be a process in which the impurities contained in the gas (G) are dissolved in the first to third scrubbing solutions (283, 285, 287).

[0220] While the second scrubbing process is being performed, the third spray nozzle (227) can supply a third scrubbing solution (287) to the upper surface of the third scrubbing plate (250) (see drawing reference numeral 320). The third scrubbing solution (287) can be supplied in a spray form. The third scrubbing solution (287) can be provided to the central portion of the third scrubbing plate (250).

[0221] The third scrubbing solution (287) initially supplied can flow downward through the third scrubbing hole (250H), the second scrubbing hole (240H), and the first scrubbing hole (230H). That is, in the initial state, the third scrubbing solution (287) can flow downward through the scrubbing holes (250H, 240H, 230H).

[0222] While the second scrubbing process is being performed, the gas (G) can rise in the second direction (D2). The gas (G) can rise in the second direction (D2) by passing through the first scrubbing hole (230H) (drawing reference numeral 420), can rise in the second direction (D2) by passing through the second scrubbing hole (240H) (drawing reference numeral 430), and can rise in the second direction (D2) by passing through the third scrubbing hole (250H) (drawing reference numeral 440).

[0223] Specifically, referring to FIG. 4, the gas (G) can pass upwardly through the first to third scrubbing holes (230H, 240H, 250H). As the gas (G) rises in the second direction (D2), first to third bubbles (BBL1, BBL2, BBL3) can be formed within the first to third scrubbing solutions (283, 285, 287). Impurities included in the gas (G) can be dissolved in the first to third scrubbing solutions (283, 285, 287) at the contact surfaces where the first to third bubbles (BBL1, BBL2, BBL3) and the first to third scrubbing solutions (283, 285, 287) come into contact.

[0224] While the above second scrubbing process is performed, the third scrubbing solution (287) does not flow downward through the third scrubbing hole (250H). This may be due to the pressure of the gas (G) passing upwardly through the third scrubbing hole (250H). As the gas passes upwardly through the third scrubbing hole (250H), a third bubble (BBL3) may be formed on the upper surface of the third scrubbing plate (250). The third bubble (BBL3) is formed within the third scrubbing solution (287). The height of the third bubble (BBL3) can be controlled by adjusting the discharge amount of the third scrubbing solution (287).

[0225] While the above second scrubbing process is being performed, the third scrubbing solution (287) can flow from the upper surface of the third scrubbing plate (250) toward the third scrubbing wall (255), and can flow over the third scrubbing wall (255) to the upper surface of the second scrubbing plate (240) (see drawing symbol 330).

[0226] Next, while the second scrubbing process is being performed, the second spray nozzle (225) can supply the second scrubbing solution (285) to the upper surface of the second scrubbing plate (240) (see drawing reference numeral 340). The second scrubbing solution (285) can be supplied in a spray form. The second scrubbing solution (285) can be provided to the central portion of the second scrubbing plate (240).

[0227] As the gas rises and passes through the second scrubbing hole (240H), a second bubble (BBL2) may be formed on the upper surface of the second scrubbing plate (240). The second bubble (BBL2) is formed in the second scrubbing solution (285) or the third scrubbing solution (287). The height of the second bubble (BBL2) can be controlled by adjusting the discharge amount of the second scrubbing solution (285).

[0228] The second scrubbing solution (285) can flow from the upper surface of the second scrubbing plate (240) toward the second scrubbing wall (245) and can flow over the second scrubbing wall (245) to the upper surface of the first scrubbing plate (230) (see drawing symbol 350).

[0229] Next, while the second scrubbing process is being performed, the first spray nozzle (223) can supply the first scrubbing solution (283) to the upper surface of the first scrubbing plate (230) (see drawing reference numeral 360). The first scrubbing solution (283) can be provided to the central portion of the first scrubbing plate (230).

[0230] A gas may rise and pass through the first scrubbing hole (230H) to form a first bubble (BBL1) on the upper surface of the first scrubbing plate (230). The first bubble (BBL1) is formed in the first scrubbing solution (283), the second scrubbing solution (285), or the third scrubbing solution (287). The height of the first bubble (BBL1) can be controlled by adjusting the discharge amount of the first scrubbing solution (283).

[0231] The first scrubbing solution (283) can flow from the upper surface of the first scrubbing plate (230) toward the first scrubbing wall (235) and can flow beyond the first scrubbing wall (235) to the lower portion of the scrubbing chamber (210) (see drawing symbol 370).

[0232] Impurities can be dissolved in the first to fourth scrubbing solutions (283, 285, 287, 281) and stored in the scrubbing solution storage tank (270).

[0233] As the gas (G) passes upward through the scrubbing holes (250H, 240H, 230H), impurities can be dissolved in the first to third scrubbing solutions (283, 285, 287).

[0234] Next, the gas (G') from which impurities have been removed can pass through the demister (260) and be discharged outside the scrubbing chamber (210) (see drawing symbol 450). The gas (G') discharged through the gas discharge port (26) may have almost no impurities remaining.

[0235] In this way, when using the scrubbing device (20) of the present invention, the contact area between the gas and the scrubbing solution can be increased, thereby improving scrubbing efficiency. In addition, stability can be improved by controlling the height of the bubbles formed on the upper surface of the scrubbing plate.

[0236] Although embodiments of the present invention have been described with reference to the attached drawings, the present invention is not limited to the above embodiments, but can be manufactured in various different forms. Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential characteristics of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A scrubbing chamber defining a scrubbing space for scrubbing impurities contained in the gas; A first scrubbing plate disposed within the scrubbing chamber; A plurality of first scrubbing holes penetrating the first scrubbing plate; A second scrubbing plate disposed within the scrubbing chamber and disposed on the first scrubbing plate; A plurality of second scrubbing holes penetrating the second scrubbing plate; A first spray nozzle disposed between the first scrubbing plate and the second scrubbing plate and supplying a first scrubbing solution to the upper surface of the first scrubbing plate; and A second spray nozzle is disposed on the upper surface of the second scrubbing plate and supplies a second scrubbing solution to the upper surface of the second scrubbing plate, Some of the impurities contained in the gas pass through the first scrubbing hole and are dissolved in the first scrubbing solution, A scrubbing device, wherein another portion of the impurities contained in the gas passes upward through the second scrubbing hole and is dissolved in the second scrubbing solution.

2. In paragraph 1, A scrubbing device, wherein the diameter of each of the plurality of first scrubbing holes is larger than the diameter of each of the plurality of second scrubbing holes.

3. In paragraph 1, A scrubbing device, wherein, from a planar perspective, the area of ​​the plurality of first scrubbing holes relative to the area of ​​the first scrubbing plate is greater than the area of ​​the plurality of second scrubbing holes relative to the area of ​​the second scrubbing plate.

4. In paragraph 3, A scrubbing device, wherein the diameter of each of the plurality of first scrubbing holes is the same as the diameter of each of the plurality of second scrubbing holes.

5. In paragraph 1, A scrubbing device, wherein the number of the plurality of first scrubbing holes is greater than the number of the plurality of second scrubbing holes.

6. In paragraph 1, A scrubbing solution storage tank disposed at the bottom of the scrubbing chamber and storing the scrubbing solution in which the impurities are dissolved; Further comprising a first recycle pipe having one end connected to the scrubbing solution storage tank and the other end connected to the first spray nozzle; A scrubbing device wherein the first spray nozzle provides the scrubbing solution in which the impurities are dissolved, stored in the scrubbing solution storage tank, to the upper surface of the first scrubbing plate through the first recycle pipe.

7. In paragraph 6, A scrubbing device wherein the second scrubbing solution is water that does not contain the impurities.

8. In paragraph 6, Further comprising a second recycle pipe having one end connected to the scrubbing solution storage tank and the other end connected to the second spray nozzle; A scrubbing device wherein the second spray nozzle provides the scrubbing solution in which the impurities stored in the scrubbing solution storage tank are dissolved to the upper surface of the second scrubbing plate through the second recycle pipe.

9. In paragraph 1, A third scrubbing plate disposed within the scrubbing chamber and disposed on the second scrubbing plate, A plurality of third scrubbing holes penetrating the third scrubbing plate, Further comprising a third spray nozzle disposed on the upper surface of the third scrubbing plate and supplying a third scrubbing solution to the upper surface of the third scrubbing plate; The third spray nozzle provides the third scrubbing solution in a spray form, A scrubbing device wherein another portion of the impurities contained in the gas passes upward through the plurality of third scrubbing holes and is dissolved in the third scrubbing solution.

10. In paragraph 9, The size of the diameter of each of the plurality of second scrubbing holes is larger than the size of the diameter of each of the plurality of third scrubbing holes, A scrubbing device, wherein the diameter of each of the plurality of first scrubbing holes is larger than the diameter of each of the plurality of second scrubbing holes.

11. In paragraph 9, The size of the diameter of each of the plurality of second scrubbing holes is larger than the size of the diameter of each of the plurality of third scrubbing holes, A scrubbing device, wherein the diameter of each of the plurality of first scrubbing holes is smaller than the diameter of each of the plurality of second scrubbing holes.

12. In paragraph 9, A scrubbing device, wherein the concentration of the impurity in the third scrubbing solution is lower than the concentration of the impurity in the second scrubbing solution.

13. In paragraph 12, A scrubbing device wherein the first scrubbing solution is the same as the second scrubbing solution.

14. In paragraph 1, further comprising a second scrubbing wall disposed on one end of the second scrubbing plate, a portion of which protrudes from the upper surface of the second scrubbing plate; The second scrubbing solution discharged onto the upper surface of the second scrubbing plate is discharged over the second scrubbing wall onto the upper surface of the first scrubbing plate, A scrubbing device wherein another portion of the impurities contained in the gas are dissolved in the second scrubbing solution that passes through the first scrubbing hole and passes over the second scrubbing wall.

15. In paragraph 1, The first spray nozzle provides the first scrubbing solution in a spray form to the upper surface of the first scrubbing plate, A scrubbing device wherein the second spray nozzle provides the second scrubbing solution in a spray form to the upper surface of the second scrubbing plate.

Images