Lighting device

Abstract

A lighting device according to an embodiment comprises: a heat dissipation plate including a recess; a circuit board disposed in the recess; a light source part disposed on the heat dissipation plate and including a plurality of light-emitting elements; connection members connecting the circuit board and the light source part; and a sealing part disposed so as to surround and cover the connection members, wherein the sealing part is formed of a resin composition comprising an oligomer having a glass transition temperature (Tg) of -50°C or lower.

Description

lighting device

[0001] An embodiment of the present invention relates to a lighting device.

[0002] Lighting applications include vehicle lighting, display, and signage backlights. Light-emitting diodes (LEDs) offer the advantages of low power consumption, a semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to light sources such as fluorescent and incandescent lamps. These LEDs are used in various lighting devices, such as various display devices, indoor lights, and outdoor lights. Recently, lamps employing LEDs have been proposed as vehicle light sources. Compared to incandescent lamps, LEDs have the advantage of lower power consumption.

[0003] Furthermore, the small size of LEDs allows for greater design freedom in lamps, and their semi-permanent lifespan makes them economical. However, because the light emitted from LEDs has a small angle of incidence, there is a need to increase the light-emitting area of ​​LED lamps when using them in vehicle lamps.

[0004] As a prior art for a lighting device, Korean Patent Publication No. KR10-2023-0010550 (2023.01.19) is disclosed.

[0005] The embodiment provides a lighting device having improved reliability.

[0006] A lighting device according to an embodiment comprises: a heat dissipation plate including a recessed portion; a circuit board disposed in the recessed portion; a light source portion disposed on the heat dissipation plate and including a plurality of light-emitting elements; a connecting member connecting the circuit board and the light source portion; and a sealing member disposed to surround and cover the connecting member, wherein the sealing member is formed of a resin composition including an oligomer having a glass transition temperature (Tg) of -50°C or less.

[0007] The oligomer having a glass transition temperature (Tg) of -50°C or lower may be, for example, one or more selected from among isoprene oligomers, polydimethylsiloxane oligomers, polyisobutylene oligomers, polybutadiene oligomers, ethylene-propylene oligomers, polyether oligomers, modified oligomers of the above oligomers, and copolymers thereof, but is not limited thereto.

[0008] More specific examples of the above oligomers include, but are not limited to, polyether silane-terminated polymers, methacryloxypropyl-terminated polydimethylsiloxanes, (3-acryloxy-2-hydroxypropoxy propyl)-terminated polydimethyl siloxanes, (methacryloxypropyl)methylsiloxane-dimethylsiloxane copolymers, isoprene oligomers, and combinations thereof.

[0009] The resin composition of the above sealing portion may further include an acrylate monomer having a glass transition temperature (Tg) of -50°C or lower.

[0010] The acrylate monomer having a glass transition temperature (Tg) of -50°C or lower may be selected from at least one of dodecyl acrylate, 2-ethylhexyl acrylate, caprolactone acrylate, 2-(2-ethoxyethoxy)ethyl acrylate, isobornyl acrylate, and n-butyl acrylate, but is not limited thereto.

[0011] The resin composition of the above sealing portion may further include at least one selected from an oxygen inhibitor and a filler.

[0012] The above oxygen inhibitor may be a secondary thiol compound.

[0013] The above secondary thiol compound may be selected from at least one of pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyroyloxy)butane, 1,3,5-tris[2-(3-mercaptobutanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and trimethylol propane tris(3-mercaptobutyrate).

[0014] The above filler may be selected from at least one of silica or alumina having a diameter of 500 ㎛ or less.

[0015] Based on 100 parts by weight of the resin composition, the composition may include 60 to 75 parts by weight of the oligomer, 10 to 20 parts by weight of the acrylate monomer, 2 to 5 parts by weight of the oxygen inhibitor, and 4 to 9 parts by weight of the filler.

[0016] The viscosity of the above resin composition may be in the range of 14,000 to 19,000 cps.

[0017] The thixotropic index (TI) of the above resin composition may be in the range of 3 to 5.

[0018] The thickness of the above sealing portion may be in the range of 100 ㎛ to 200 ㎛.

[0019] The sealing portion includes a first sealing portion forming an outer rim; and a second sealing portion arranged inside the outer rim, and the first sealing portion and the second sealing portion may each be independently formed of a resin composition including an oligomer having a glass transition temperature (Tg) of -50°C or lower. In addition, the first sealing portion and the second sealing portion may each be independently formed of a resin composition further including an acrylate monomer having a glass transition temperature (Tg) of -50°C or lower.

[0020] The first sealing portion and the second sealing portion may be formed of the same resin composition.

[0021] The maximum height of the second sealing portion may be more than 1 to 5 times the maximum height of the first sealing portion.

[0022] The second sealing portion and the connecting member are spaced apart by a first gap, the first gap being defined as a gap between a maximum height of the connecting member and the second sealing portion, and the first gap may be 100 μm to 200 μm.

[0023] The light emitted from the light emitting element and the first sealing portion form a first angle, the light emitted from the light emitting element and the second sealing portion form a second angle, and at least one of the first angle and the second angle may be 30° or less.

[0024] A lighting device according to an embodiment includes a sealing member. The sealing member is arranged to surround and cover the connecting member, thereby protecting the connecting member. Accordingly, the connecting member can be prevented from being damaged by external impact. This enhances the reliability of the lighting device.

[0025] The above sealing portion is formed of a resin composition including an oligomer having a glass transition temperature (Tg) of -50°C or lower, and the resin composition may further include an acrylate monomer having a glass transition temperature (Tg) of -50°C or lower. In addition, the resin composition may further include one or more additives selected from an oxygen inhibitor and a filler.

[0026] In some embodiments, when an oligomer and an acrylate monomer having a glass transition temperature (Tg) of -50°C or lower are used as a base resin to form a sealing portion, the sealing portion can sufficiently protect the wire from external force even at room temperature because there is almost no change in hardness depending on temperature. For example, the glass transition temperature (Tg) of isoprene acrylate is -50°C or lower, and thus its thermal impact reliability is also excellent.

[0027] The resin composition forming the sealing portion may include a thiol compound as a reduction of oxygen inhibition agent, and may further include a filler such as silica or alumina.

[0028] Based on 100 parts by weight of the resin composition, the resin composition may include 60 to 75 parts by weight of an oligomer, 10 to 20 parts by weight of an acrylate monomer, 2 to 5 parts by weight of an oxygen inhibitor, and 4 to 9 parts by weight of a filler. By adjusting the contents of the oligomer having a glass transition temperature (Tg) of -50°C or lower, the acrylate monomer, the oxygen inhibitor, and the filler, the rheological properties such as elasticity, viscosity, or thixotropic index (TI) of the resin composition can be controlled.

[0029] The sealing portion includes a first sealing portion and a second sealing portion. The first sealing portion forms an outer rim of the sealing portion. The second sealing portion is disposed within the outer rim. The first sealing portion and the second sealing portion are formed by a resin composition.

[0030] In detail, the resin composition can satisfy the thixotropic properties required by the first sealing portion. In addition, the resin composition can satisfy the elasticity required by the second sealing portion. Therefore, the first sealing portion and the second sealing portion can be formed by the same resin composition. In addition, the first sealing portion and the second sealing portion can be formed by the same process. Accordingly, the process efficiency of forming the sealing portion is improved. In addition, the height of the first sealing portion and the height of the second sealing portion have a set size. In addition, the first sealing portion and the light-emitting element are spaced apart by a set interval. In addition, the second sealing portion and the connecting member are spaced apart by a set interval. Accordingly, the reliability of the lighting device can be improved and its size can be reduced.

[0031] Fig. 1 is a perspective view of a lighting device according to an embodiment (the second sealing portion is omitted).

[0032] Figure 2 is a side cross-sectional view of the lighting device of Figure 1.

[0033] Fig. 3 is a partially enlarged view of the lighting device of Fig. 1 (the second sealing portion is omitted).

[0034] Figures 4 and 5 are plan views of the lighting device of Figure 3.

[0035] Fig. 6 is a side cross-sectional view for explaining the connection of the light source unit, wires, and heat dissipation plate of the lighting device of Fig. 5.

[0036] Figure 7 is an enlarged view of area A of Figure 6.

[0037] Fig. 8 is a photograph showing a light source, wires, and a heat dissipation plate connected to a lighting device according to an embodiment.

[0038] Fig. 9 is a drawing for explaining the thickness ratio of the sealing portion in the AA' area of ​​Fig. 9.

[0039] Fig. 10 is another plan view of the lighting device of Fig. 3.

[0040] Fig. 11 is a side cross-sectional view for explaining the connection of the light source unit, wires, and heat dissipation plate of the lighting device of Fig. 10.

[0041] Figure 12 is an enlarged view of area B of Figure 11.

[0042] Fig. 13 is a perspective view of a headlamp to which a lighting device according to an embodiment is applied.

[0043] Figure 14 is a graph showing the change in hardness according to temperature in Example (a) and Comparative Example (b).

[0044] Figure 15 is a graph showing the results of thermal shock reliability according to the glass transition temperature (Tg) of the example.

[0045] A lighting device according to an embodiment comprises: a heat dissipation plate including a recessed portion; a circuit board disposed in the recessed portion; a light source portion disposed on the heat dissipation plate and including a plurality of light-emitting elements; a connecting member connecting the circuit board and the light source portion; and a sealing member disposed to surround and cover the connecting member, wherein the sealing member is formed of a resin composition including an oligomer having a glass transition temperature (Tg) of -50°C or less.

[0046] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to the described embodiments, but may be implemented in various different forms. Within the scope of the technical concept of the present invention, one or more of the components of the embodiments may be selectively combined or substituted for use.

[0047] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0048] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0049] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0050] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

[0051] These terms are intended only to distinguish one component from another, and are not intended to limit the nature, order, or sequence of the component.

[0052] And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, it may include not only cases where the component is directly connected, coupled or connected to the other component, but also cases where the component is 'connected', 'coupled' or 'connected' by another component between the component and the other component.

[0053] Additionally, when described as being formed or arranged "above or below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below", it can include the meaning of a downward direction as well as an upward direction based on one component.

[0054] Below, a lighting device according to an embodiment is described with reference to the drawings.

[0055] Referring to FIGS. 1 to 9, a lighting device according to an embodiment may include a heat dissipation plate (101), a circuit board (110) disposed on the heat dissipation plate (101), a light source unit (130) disposed on the heat dissipation plate (101) and including a plurality of light emitting elements (131), a connecting member (141, 142) connecting the light source unit (130) and the circuit board (110), and a sealing member (200) sealing the connecting member (141, 142).

[0056] The above lighting device is applied to various lamp devices that require lighting. For example, the lighting device can be applied to vehicle lamps, household lighting devices, and industrial lighting devices. For example, the lighting device can be applied to the vehicle lamp. The lighting device can be applied to head lamps, side mirror lights, side marker lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, and backup lamps. The lighting device can also be applied to indoor or outdoor advertising devices, display devices, and electric vehicle fields.

[0057] The heat dissipation plate (101) supports a circuit board (110). Heat generated in the circuit board (110) can be transferred by the heat dissipation plate (101). The heat dissipation plate (101) includes a metal. For example, the heat dissipation plate (101) may be formed with a laminated structure of a plurality of metal layers. The heat dissipation plate (101) may be formed as a single layer or multiple layers. The heat dissipation plate (101) may include a ceramic material, AlN, or an aluminum material having an anodized surface layer. The metal layer may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, or Au.

[0058] The heat dissipation plate (101) includes a heat dissipation portion (102) and a side portion (103). The heat dissipation portion (102) includes a recess portion (108). The circuit board (110) is disposed in the recess portion (108). The area of ​​the heat dissipation portion (102) may be larger than the area of ​​the circuit board (110). The side portion (103) is bent backward from an edge of the heat dissipation portion (102). One or more side portions (103) may be disposed along the outer side of the heat dissipation portion (102). An empty space (109) may be provided on the inner side of the side portion (103) and the lower side of the heat dissipation portion (102), or other structures may be combined therewith.

[0059] The recessed portion (108) is formed at a predetermined depth on the upper surface of the heat dissipation portion (102) of the heat dissipation plate (101). The depth of the recessed portion (108) may be the same as or different from the thickness of the circuit board (110). The top view shape of the recessed portion (108) may be the same as the top view shape of the circuit board (110). For example, the top view shape of the recessed portion (108) may include a polygonal shape.

[0060] The circuit board (110) is inserted into the recessed portion (108). The circuit board (110) and the bottom surface of the recessed portion (108) can be bonded to each other by an adhesive member (155). The adhesive member (155) can include a thermally conductive adhesive. The upper surface of the circuit board (110) can be arranged on the same plane as the upper surface of the heat dissipation plate (101). Alternatively, the upper surface of the circuit board (110) can be arranged higher than the upper surface of the heat dissipation plate (101). As shown in Fig. 6, the adhesive member (155) is arranged on the outer periphery of the recessed portion (108). Accordingly, the surface of the heat dissipation portion (102) can be bonded to the circuit board (110).

[0061] The circuit board (110) may include a resin material or a metal material. For example, the circuit board (110) may include any one of a ceramic-based PCB, a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB), and a resin-based PCB.

[0062] The circuit board (110) may include a metal layer at the bottom, a circuit layer having a pad at the top, a protective layer made of an insulating material for protecting the circuit layer at the top, and an insulating layer between the metal layer and the circuit layer. The circuit board (110) may be provided as an MCPCB having a metal layer at the bottom. In addition, the circuit board (110) may transfer heat to the heat dissipation plate (101).

[0063] The circuit board (110) can be fastened to the heat dissipation unit (102) by a fastening means (119). The fastening means (119) can include one or more screws. The circuit board (110) and the heat dissipation unit (102) can be fastened and tightly attached by the screws. When the circuit board (110) is fixed by the fastening means (119), the adhesive member (155) can be removed. Accordingly, the circuit board (110) can be easily separated.

[0064] The circuit board (110) may include a plurality of pads. The pads (111, 112) may include a first pad (111) and a second pad (112) that are spaced apart from each other. The first pad (111) and the second pad (112) may be connected to a connector (115) disposed on an upper portion of the circuit board (110) by a circuit layer of the circuit board (110). The connector (115) may receive a driving signal and power from the outside. The pads (111, 112) and the connector (115) may be disposed on both edges of the circuit board (110). The fastening means (119) may be disposed in an area between the pads (111, 112) and the connector (115).

[0065] The first pad (111) and the second pad (112) are arranged adjacent to one side of the circuit board (110). The pads (111, 112) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and optional alloys thereof.

[0066] The light source unit (130) may be placed on the heat dissipation unit (102). The light source unit (130) may be adjacent to the recessed unit (108). The light source unit (130) may be adjacent to one side of the circuit board (110). One side of the circuit board (110) may be placed between the pad (111, 112) and the light source unit (130).

[0067] The light source unit (130) may include a support member (133) and at least one light-emitting element (131) disposed on the support member (133). A plurality of light-emitting elements (131) may be sealed by a resin member (132). The support member (133) may include a ceramic substrate or a semiconductor substrate. The support member (133) may support the plurality of light-emitting elements (131). In addition, the support member (133) may include a conductive pattern. The plurality of light-emitting elements (131) may be electrically connected by the conductive pattern.

[0068] A protection element (not shown) for protecting the light-emitting elements (131) may be placed on the support member (133). The protection element may be implemented as a thyristor, a zener diode, or a TVS (transient voltage suppression). As a result, the light-emitting elements (131) can be protected from ESD (electro static discharge).

[0069] The above support member (133) may be formed of a ceramic material or an MCPCB material. The light source unit (130) may transfer heat generated from the light emitting elements (131) to the heat dissipation plate (101) by the support member (133). The support member (133) and the heat dissipation plate (101) may be bonded by an adhesive. The adhesive (138) may include a thermally conductive adhesive having metal powder or inorganic powder in a resin material. For example, the adhesive (138) may include a TIM (Thermal interface material).

[0070] The adhesive (138) may be arranged along the lower surface and the lower side surface of the support member (133). The adhesive (138) may be arranged on the outer side surface of the support member (133) and may be in contact with each side surface of the support member (133).

[0071] The plurality of light-emitting elements (131) are arranged in one direction or are arranged in at least one row. The plurality of light-emitting elements (131) may be connected to each other in series. The plurality of light-emitting elements (131) may include at least one of a blue, green, or red LED chip. The plurality of light-emitting elements (131) may be flip-chip or wire-bonded. The light-emitting element (131) may include a plurality of semiconductor layers made of a compound semiconductor of group II and group VI elements or / and a compound semiconductor of group III and group V elements. At least one or all of the plurality of semiconductor layers may include a compound semiconductor of a series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs.

[0072] The resin member (132) may include silicone or epoxy. The resin member (132) may include a transparent layer and / or a phosphor layer (not shown) on the light-emitting element (131). A reflective wall (not shown) may be included around the transparent layer and / or the phosphor layer. The resin member (132) may further include a convex lens (not shown). The phosphor layer may include at least one or two or more of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor.

[0073] Referring to FIGS. 3 to 5, the light emitting element (131) is disposed on an upper portion of one side of the support member (133). Bonding pads (134, 135) are exposed on an upper portion of the other side of the support member (133). The bonding pads (134, 135) may include a first bonding pad (134) connected to cathodes of a plurality of light emitting elements (131) and a second bonding pad (135) connected to anodes of the plurality of light emitting elements (131).

[0074] The first bonding pad (134) may have a color-coded mark and function as a cathode terminal, and the second bonding pad (135) may function as an anode terminal. The first bonding pad (134) and the second bonding pad (135) may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof.

[0075] The first bonding pad (134) and the first pad (111) are connected by a first connecting member (141), and the second bonding pad (135) and the second pad (112) are connected by a second connecting member (142). The first connecting member (141) and the second connecting member (142) may be formed of a wire. The first connecting member (141) and the second connecting member (142) may include at least one of Au, Al, Ag, and Ni.

[0076] The first connecting member (141) and the second connecting member (142) have one end (41) bonded to the first bonding pad (134) and the second bonding pad (135), respectively, and the other end (43) bonded to the first pad (111) and the second pad (112), respectively. The first connecting member (141) and the second connecting member (142) include a center portion (42) extending from the one end (41) toward the other end (43). The center portion (42) may extend from the other side of the light source portion (130) to one side of the circuit board (110). The center portion (42) may extend onto a recess portion (108) between the circuit board (110) and the heat dissipation portion (102).

[0077] The height of the above-mentioned end (41) may be arranged higher than the height of the other end (43). The height of the center portion (42) may be arranged higher than the above-mentioned end (41).

[0078] The light source unit (310) and the circuit board (110) are electrically connected by the first connecting member (141) and the second connecting member (142). The connecting members (141, 142) include wires. Accordingly, the connecting members (141, 142) may be damaged by external impact. In addition, when the connecting members (141, 142) are exposed to the outside, they may react with substances in the air and corrode. Accordingly, the electrical connection characteristics of the light source unit (310) and the circuit board (110) may be reduced.

[0079] To prevent the above-described problem, the lighting device according to the embodiment includes a sealing portion.

[0080] Referring to FIGS. 4 to 7, a lighting device according to an embodiment includes the sealing portion (200). The sealing portion (200) is positioned on the connecting member (141, 142). The sealing portion (200) is formed to surround and cover the connecting member (141, 142).

[0081] The above sealing portion (200) is formed from a resin composition. The resin composition forming the sealing portion is selected in consideration of whether it can secure reliability, such as rheological properties, low-temperature elasticity, and thermal shock resistance, suitable for the manufacturing process.

[0082] The resin composition according to the embodiment is characterized in that it includes an oligomer having a glass transition temperature (Tg) of -50°C or lower.

[0083] The resin composition forming the sealing portion comprises, in addition to the above oligomer, an acrylate monomer, and may further comprise one or more additives selected from among oxygen inhibitors and fillers. Furthermore, the resin composition according to the embodiment may optionally further comprise a photoinitiator or antioxidant. All components included in the resin composition may be used alone or in combination of one or more.

[0084] The sealing resin composition according to the embodiment is characterized in that it includes an oligomer having a glass transition temperature (Tg) of -50°C or lower and an acrylate monomer as a base resin, and can be cured by a photocuring reaction.

[0085] The base resin functions to ensure that the sealing portion maintains an appropriate hardness within the reliability test temperature range. To achieve this, the oligomer may be selected from among photocurable liquid oligomers with a glass transition temperature (Tg) of -50°C or lower.

[0086] The oligomer having a glass transition temperature (Tg) of -50°C or lower may be selected from one or more of isoprene oligomers, polydimethylsiloxane oligomers, polyisobutylene oligomers, polybutadiene oligomers, ethylene-propylene oligomers, polyether oligomers, modified oligomers of the above oligomers, and copolymers thereof, but is not limited thereto, and any oligomer having a glass transition temperature (Tg) of -50°C or lower may be used.

[0087] Specific examples of the above oligomers include, but are not limited to, one or more selected from polyether silane-terminated polymers, methacryloxypropyl-terminated polydimethylsiloxanes, (3-acryloxy-2-hydroxypropoxypropyl)-terminated polydimethylsiloxanes, (methacryloxypropyl) methylsiloxane-dimethylsiloxane copolymers, and isoprene oligomers.

[0088] <Tg -50℃ 이하인 올리고머의 예시>

[0089] 1) UV curable Liquid polyisoprene (Tg: -60℃ ~ -65℃)

[0090] [Chemical Formula 1]

[0091]

[0092] 2) polyether-based silane-terminated polymer (GENOSIL STP-E10)

[0093] [Chemical Formula 2]

[0094]

[0095] 3) Methacryloxypropyl-Terminated Polydimethylsiloxanes

[0096] [Chemical Formula 3]

[0097]

[0098] 4) (3-Acryloxy-2-hydroxypropoxypropyl)Terminated PolyDimethylsiloxane

[0099] [Chemical Formula 4]

[0100]

[0101] 5) (Methacryloxypropyl)methylsiloxane-Dimethylsiloxane Copolymers

[0102] [Chemical Formula 5]

[0103]

[0104] According to an embodiment, the oligomer having a glass transition temperature (Tg) of -50°C or lower may be included in an amount of 60 to 75 parts by weight based on 100 parts by weight of the resin composition. If the content of the oligomer is less than 60 parts by weight, the hardness (shore A) may become 50 or higher, which may lower reliability, and if it exceeds 75 parts by weight, the hardness may be low, which may cause a problem of vulnerability to external force on the wire after encapsulation. If the content of the oligomer is included in an amount of 60 to 75 parts by weight, the viscosity of the resin composition after curing may be reduced and elasticity may be increased.

[0105] The sealing resin composition according to the embodiment includes an acrylate monomer as a base resin together with an oligomer having a glass transition temperature (Tg) of -50°C or lower. The acrylate monomer has a function of controlling the hardness, viscosity, and photocuring properties of the resin composition. It is also preferable that the glass transition temperature (Tg) of the acrylate monomer included in the resin composition is -50°C or lower. As a specific example, at least one of dodecyl acrylate (Tg: -65°C), 2-ethylhexylacrylate (Tg: -65°C), caprolactone acrylate (Tg: -50 to -60°C), 2-(2-ethoxyethoxy)ethyl acrylate (Tg: -56°C), isobornyl acrylate (Tg: -53°C), and n-butyl acrylate (Tg: -54°C) may be selected and used, but is not particularly limited thereto.

[0106] According to an embodiment, the acrylate monomer may be included in an amount ranging from 10 to 20 parts by weight based on 100 parts by weight of the sealing portion resin composition, and the mixing ratio may be adjusted within the above range depending on the content of the oligomer used together. When the content of the monomer is included in the above range, the viscosity of the resin composition after curing is reduced. In addition, the adhesive strength between the sealing portion (200) and the heat dissipation plate (101) and the circuit board (110) is increased.

[0107] Another characteristic of the resin composition forming the sealing portion is that it contains a thiol compound as an oxygen inhibition inhibitor. The thiol compound functions to prevent inhibition of the curing reaction due to reaction with atmospheric oxygen. It is more preferable that the thiol compound used as the oxygen inhibition inhibitor be a secondary thiol compound.

[0108] The thiol compound may be selected from, but is not particularly limited to, one or more of pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyroyloxy)butane, 1,3,5-tris[2-(3-mercapto butanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and trimethylol propane tris(3-mercaptobutyrate).

[0109] According to an embodiment, the thiol compound, which is an oxygen inhibitor, may be included in an amount ranging from 2 to 5 parts by weight based on 100 parts by weight of the sealing resin composition. If the content of the thiol compound is less than 2 parts by weight, there is a problem of low UV photocuring rate, and if it exceeds 5 parts by weight, it is not suitable because it may cause yellowing of the resin after a reliability test.

[0110] The sealing resin composition may further include a filler. The filler is dispersed within the base resin. The filler may be selected from a metal or non-metal. Examples of the filler include ceramic materials such as silica and alumina, and the average diameter is preferably 500 μm or less.

[0111] The filler may be included in an amount ranging from 2 to 5 parts by weight based on the entire resin composition of the sealing portion. The filler serves to control the viscosity and thixotropic index (TI) of the resin composition. When the filler is included in the above range, the thixotropic index of the resin composition before curing increases, thereby facilitating the manufacturing process of the sealing portion. In addition, the viscosity of the resin composition after curing is reduced.

[0112] In the resin composition forming the sealing portion, it is preferable to adjust the respective contents of the oligomer, monomer, oxygen inhibitor, and filler in consideration of the rheological properties of the resin composition so that the viscosity is in the range of 14,000 to 19,000 cPs and the thixotropic index (TI) is in the range of 3 to 5.

[0113] Specifically, based on 100 parts by weight of the resin composition, it may include 60 to 75 parts by weight of isoprene oligomer, 10 to 20 parts by weight of acrylate monomer, 2 to 5 parts by weight of oxygen inhibitor, and 4 to 9 parts by weight of filler.

[0114] In addition, the sealing resin composition may further include a photoinitiator or antioxidant in addition to the above-mentioned main components. The photoinitiator and antioxidant may be materials used in general resin compositions, and there are no special limitations. Based on 100 parts by weight of the sealing resin composition, the content of the photoinitiator may be 1 to 4 parts by weight, and the content of the antioxidant may be 1 to 7 parts by weight, and the content may be adjusted taking reliability into consideration.

[0115] The present invention is described in more detail below through examples of resin compositions containing isoprene oligomers. These examples are provided for illustrative purposes only to aid understanding of the present invention and should not be construed as limiting the scope of the present invention.

[0116] Example 1

[0117] A resin composition was prepared by mixing 60 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0118] Example 2

[0119] A resin composition was prepared by mixing 65 parts by weight of a polyether-based silane-terminated polymer oligomer, 15 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0120] Example 3

[0121] A resin composition was prepared by mixing 70 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0122] Example 4

[0123] A resin composition was prepared by mixing 60 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0124] Example 5

[0125] A resin composition was prepared by mixing 65 parts by weight of a polyether-based silane-terminated polymer oligomer, 15 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0126] Example 6

[0127] A resin composition was prepared by mixing 70 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0128] Example 7

[0129] A resin composition was prepared by mixing 65 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 5 parts by weight of silica.

[0130] Example 8

[0131] A resin composition was prepared by mixing 65 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,3,5-tris[2-(3-mercaptobutanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and 5 parts by weight of silica.

[0132] Example 9

[0133] A resin composition was prepared by mixing 65 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of alumina.

[0134] Example 10

[0135] A resin composition was prepared by mixing 65 parts by weight of a polyether-based silane-terminated polymer oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 5 parts by weight of alumina.

[0136] Example 11

[0137] A resin composition was prepared by mixing 60 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0138] Example 12

[0139] A resin composition was prepared by mixing 65 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 15 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0140] Example 13

[0141] A resin composition was prepared by mixing 70 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0142] Example 14

[0143] A resin composition was prepared by mixing 60 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0144] Example 15

[0145] A resin composition was prepared by mixing 65 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 15 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0146] Example 16

[0147] A resin composition was prepared by mixing 70 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0148] Example 17

[0149] A resin composition was prepared by mixing 65 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 5 parts by weight of silica.

[0150] Example 18

[0151] A resin composition was prepared by mixing 65 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,3,5-tris[2-(3-mercaptobutanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and 5 parts by weight of silica.

[0152] Example 19

[0153] A resin composition was prepared by mixing 65 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of alumina.

[0154] Example 20

[0155] A resin composition was prepared by mixing 65 parts by weight of methacryloxypropyl-terminated polydimethylsiloxane oligomer, 20 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 5 parts by weight of alumina.

[0156] Example 21

[0157] A resin composition was prepared by mixing 60 parts by weight of isoprene oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0158] Example 22

[0159] A resin composition was prepared by mixing 65 parts by weight of isoprene oligomer, 15 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0160] Example 23

[0161] A resin composition was prepared by mixing 70 parts by weight of isoprene oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0162] Example 24

[0163] A resin composition was prepared by mixing 60 parts by weight of isoprene oligomer, 20 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0164] Example 25

[0165] A resin composition was prepared by mixing 65 parts by weight of isoprene oligomer, 15 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0166] Example 26

[0167] A resin composition was prepared by mixing 70 parts by weight of isoprene oligomer, 20 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0168] Example 27

[0169] A resin composition was prepared by mixing 65 parts by weight of isoprene oligomer, 20 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 5 parts by weight of silica.

[0170] Example 28

[0171] A resin composition was prepared by mixing 65 parts by weight of isoprene oligomer, 20 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of 1,3,5-tris[2-(3-mercapto butanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and 5 parts by weight of silica.

[0172] Example 29

[0173] A resin composition was prepared by mixing 65 parts by weight of isoprene oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of alumina.

[0174] Example 30

[0175] A resin composition was prepared by mixing 65 parts by weight of isoprene oligomer, 20 parts by weight of 2-ethylhexyl acrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 5 parts by weight of alumina.

[0176] Example 31

[0177] A resin composition was prepared by mixing 60 parts by weight of (3-acryloxy-2-hydroxypropoxypropyl) terminal polydimethylsiloxane oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0178] Example 32

[0179] A resin composition was prepared by mixing 65 parts by weight of (3-acryloxy-2-hydroxypropoxypropyl) terminal polydimethylsiloxane oligomer, 15 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 7 parts by weight of silica.

[0180] Example 33

[0181] A resin composition was prepared by mixing 70 parts by weight of (3-acryloxy-2-hydroxypropoxypropyl) terminal polydimethylsiloxane oligomer, 20 parts by weight of caprolactone acrylate, 3 parts by weight of 1,3,5-tris[2-(3-mercapto butanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione) and 4 parts by weight of alumina.

[0182] Example 34

[0183] A resin composition was prepared by mixing 70 parts by weight of (3-acryloxy-2-hydroxypropoxypropyl) terminal polydimethylsiloxane oligomer, 20 parts by weight of 2-(2-ethoxyethoxy)ethyl acrylate, 3 parts by weight of trimethylolpropane tris(3-mercaptobutyrate), and 9 parts by weight of alumina.

[0184] Example 35

[0185] A resin composition was prepared by mixing 60 parts by weight of (methacryloxypropyl) methylsiloxane-dimethylsiloxane copolymer oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0186] Example 36

[0187] A resin composition was prepared by mixing 65 parts by weight of (methacryloxypropyl) methylsiloxane-dimethylsiloxane copolymer oligomer, 15 parts by weight of 2-ethylhexylacrylate, 3 parts by weight of 1,4-bis(3-mercaptobutyroyloxy)butane, and 7 parts by weight of silica.

[0188] Example 37

[0189] A resin composition was prepared by mixing 70 parts by weight of (methacryloxypropyl) methylsiloxane-dimethylsiloxane copolymer oligomer, 20 parts by weight of caprolactone acrylate, 3 parts by weight of 1,3,5-tris[2-(3-mercapto butanoyloxy) ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione), and 4 parts by weight of alumina.

[0190] Example 38

[0191] A resin composition was prepared by mixing 70 parts by weight of (methacryloxypropyl) methylsiloxane-dimethylsiloxane copolymer oligomer, 20 parts by weight of 2-(2-ethoxyethoxy)ethyl acrylate, 3 parts by weight of trimethylol propane tris(3-mercaptobutyrate), and 9 parts by weight of alumina.

[0192] Comparative Example 1

[0193] A resin composition was prepared by mixing 60 parts by weight of urethane oligomer, 20 parts by weight of dodecyl acrylate, 3 parts by weight of pentaerythritol tetrakis(3-mercaptobutylate), and 5 parts by weight of silica.

[0194] The results of measuring the change in hardness of isoprene acrylate according to the example and urethane acrylate according to the comparative example are as follows.

[0195] Example (a) Comparative Example (b) Measurement Temperature (℃) Isoprene acrylateUrethane acrylateShore AShore A-4041790414325417125410

[0196] As shown in the above [Table 1] and FIG. 14, when forming a sealing part using urethane acrylate as a base resin according to Comparative Example (b), the Tg of urethane acrylate can be lowered to -25°C, but there is a problem that it is difficult to protect the wire from external force during the product assembly process or actual use because the hardness at room temperature is too low. On the other hand, when forming a sealing part using isoprene acrylate as a base resin according to Example (a), it can be confirmed that there is no problem in the function of protecting the wire from external force even at room temperature because there is almost no change in hardness depending on temperature.

[0197] Tg (℃)Thermal shock reliability (cycle)-521500-25100005001030057150

[0198] A severe thermal shock reliability test was performed on a module including a sealing portion formed using a resin composition according to an embodiment under the conditions of -40°C ↔ 125°C, dwell time of 15 min, and 150 to 1000 cycles. Thermal shock reliability is dependent on the Tg of the resin, and it is suitable that the Tg is lower than the thermal shock temperature. As shown in [Table 2] and Fig. 15, isoprene acrylate has excellent thermal shock reliability because its Tg is -50°C or lower.

[0199] Referring to FIG. 4, the sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220).

[0200] The first sealing portion (210) is arranged at the edge of the sealing portion (200). The first sealing portion (210) can form an outer rim of the sealing portion (200). The sealing portion (200) can form an inner region in which the second sealing portion (220) is arranged by the first sealing portion (210).

[0201] The above first sealing portion (210) is divided into a 1-1 sealing portion (211), a 1-2 sealing portion (212), and a 1-3 sealing portion (213) depending on the location.

[0202] The first-first sealing portion (211) is positioned close to the light source portion (130). The first-first sealing portion (211) is positioned close to the first end (41). The first-second sealing portion (212) is positioned close to the circuit board (110). The first-second sealing portion (213) is positioned close to the other end (43). The first-third sealing portion (213) connects the first-first sealing portion (211) and the first-second sealing portion (212).

[0203] The above 1-1 sealing portion (211), the 1-2 sealing portion (212), and the 1-3 sealing portion (213) are distinguished by their positions and are formed as one piece. The 1-1 sealing portion (211), the 1-2 sealing portion (212), and the 1-3 sealing portion (213) form an outer edge of the sealing portion (200). Accordingly, the 1-1 sealing portion (210) can function as a dam of the sealing portion (200).

[0204] The first sealing portion (210) includes the resin composition. Specifically, the first sealing portion (210) is formed by curing the resin composition. The resin composition has the physical properties described above. Specifically, the resin composition has thixotropic properties within a set range. Accordingly, the flowability of the first sealing portion (210) can be controlled before curing the first sealing portion. Accordingly, after the second sealing portion (220) is arranged on the inside of the first sealing portion (210), the first sealing portion (210) and the second sealing portion (220) can be cured simultaneously. In addition, the material of the first sealing portion (210) and the material of the second sealing portion (220) can be used as the same material.

[0205] Therefore, the process efficiency of forming the sealing portion (200) can be improved.

[0206] When the thixotropic property of the resin composition is 2 or less, when the second sealing portion (220) is placed on the inside of the first sealing portion (210), the first sealing portion (210) may be pushed outward. Accordingly, it becomes difficult for the first sealing portion (210) to function as a dam. Accordingly, a process of separately curing the first sealing portion (210) is required. Alternatively, a process of increasing the height of the first sealing portion (210) is required. As a result, the process efficiency of forming the sealing portion (200) may be reduced.

[0207] In addition, when the thixotropic property of the resin composition exceeds 4, the viscosity and modulus of the cured resin composition may change. As a result, the sealing portion (200) may be damaged by external impact.

[0208] The second sealing portion (220) is disposed in the inner region of the sealing portion (200). Specifically, the second sealing portion (220) is disposed in the inner region of the first sealing portion (210). The first sealing portion (210) forms an outer edge of the sealing portion (200). The second sealing portion (220) is disposed inside the outer edge.

[0209] The second sealing portion (220) may be a protective layer that protects the connecting member (141, 142). The second sealing portion (220) is arranged to surround the connecting member (141, 142). This prevents the connecting member (141, 142) from being damaged by external impact.

[0210] The second sealing portion (220) includes the resin composition. Specifically, the second sealing portion (220) is formed by curing the resin composition. Specifically, the resin composition forming the second sealing portion (220) is the same as the resin composition forming the first sealing portion (210).

[0211] The above resin composition has the physical properties described above. Specifically, the resin composition has a viscosity and modulus within a set range. Specifically, the modulus of the second sealing portion (220) formed by curing the resin composition may be 100 MPa to 8000 MPa. Accordingly, the elasticity of the second sealing portion can be controlled. Accordingly, the connecting members (141, 142) can be protected by the sealing portion (200). That is, since the sealing portion (200) is protected from external impact, the connecting members (141, 142) can be easily protected by the sealing portion (200).

[0212] In addition, the first sealing portion (210) and the second sealing portion (220) are formed of the same resin composition. In detail, the resin composition has thixotropy, viscosity, and modulus within a set range. Accordingly, the resin composition can satisfy both the physical properties required by the first sealing portion (210) and the physical properties required by the second sealing portion (220). In detail, the resin composition satisfies the thixotropy required by the first sealing portion (210). In addition, the resin composition satisfies the modulus required by the second sealing portion (220).

[0213] Accordingly, the first sealing portion (210) and the second sealing portion (220) can be formed in the same process using the same resin composition. For example, the first sealing portion (210) is applied to form the outer edge of the sealing portion (200). Then, the second sealing portion (220) is applied to the inside of the outer edge. Then, the first sealing portion (210) and the second sealing portion (220) can be cured simultaneously.

[0214] Accordingly, the process time for forming the sealing portion (200) is shortened. Accordingly, process efficiency is improved.

[0215] The first sealing portion (210) and the second sealing portion (220) may have set heights. The height of the first sealing portion (210) may be defined by the thickness of the first sealing portion. In addition, the height of the second sealing portion (220) may be defined by the thickness of the second sealing portion.

[0216] The height of the first sealing portion and the height (H2) of the second sealing portion may be different. In detail, the height (H2) of the second sealing portion is greater than the height of the first sealing portion. In detail, the maximum height of the second sealing portion is greater than the maximum height of the first sealing portion.

[0217] The height (H2) of the second sealing portion may be at least two, three, or four times the height of the first sealing portion. In detail, the height (H2) of the second sealing portion may be at least one to five times the height of the first sealing portion.

[0218] If the height (H2) of the second sealing portion is less than one time the height of the first sealing portion, the second sealing portion (220) may not completely surround the connecting member (141, 142). As a result, the connecting member (141, 142) may cause the sealing portion (200) to be exposed to the outside. Alternatively, if the height (H2) of the second sealing portion is less than one time the height of the first sealing portion, the distance between the connecting member (141, 142) and the second sealing portion (220) may become small. As a result, an external impact may be transmitted to the connecting member (141, 142). As a result, the connecting member (141, 142) may be damaged by the external impact.

[0219] The height (H1-1) of the first sealing portion and the height (H1-2) of the first sealing portion may be the same or different. For example, the height (H1-2) of the first sealing portion may be greater than or equal to the height (H1-1) of the first sealing portion. That is, the height (H1-2) of the first sealing portion may be the same as or greater than the height (H1-1) of the first sealing portion.

[0220] In detail, the height (H1-2) of the 1-2 sealing portion may be 1 to 1.5 times, 1 to 2 times, or 1 to 2.5 times the height (H1-1) of the 1-1 sealing portion.

[0221] If the height (H1-1) of the first sealing portion and the height (H1-2) of the first sealing portion are formed to be the same or similar, the process of forming the first sealing portion (210) can be facilitated.

[0222] In addition, if the height (H1-2) of the 1-2 sealing portion is made greater than the height (H1-1) of the 1-1 sealing portion, the height deviation of the 2nd sealing portion is reduced. The 1-1 sealing portion (211) is arranged higher than the 1-2 sealing portion (212). Accordingly, a step may be formed in the outer region of the 2nd sealing portion (220). Since the height (H1-2) of the 1-2 sealing portion is arranged greater than the height (H1-1) of the 1-1 sealing portion, the height difference of the 2nd sealing portion (220) may be reduced.

[0223] The second sealing portion (220) and the connecting member (141, 142) may be spaced apart from each other. The distance between the second sealing portion (220) and the connecting member (141, 142) may be defined as a first gap (G1). The first gap (G1) is defined as a gap in the height direction of the second sealing portion (220). The first gap (G1) may be defined as a gap between the maximum height of the connecting member (141, 142) and the second sealing portion (220).

[0224] The above first gap (G1) may be 100 μm or more. In detail, the first gap (G1) may be 100 μm to 200 μm, 120 μm to 180 μm, or 140 μm to 160 μm.

[0225] If the first gap (G1) is less than 100 μm, the amount of sealing portion arranged between the second sealing portion (220) and the connecting member (141, 142) becomes small. Accordingly, an external impact may pass through the second sealing portion (220) and be transmitted to the connecting member (141, 142). Therefore, the reliability of the lighting device may be reduced.

[0226] In addition, when the first gap (G1) exceeds 200 μm, the height of the second sealing portion (220) increases. As a result, the thickness of the roughening device can be increased by the second sealing portion (220).

[0227] The above 1-1 sealing portion (211) and the light-emitting element (131) can be spaced apart. The distance between the 1-1 sealing portion (211) and the light-emitting element (131) can be defined as a second gap (G2). It is defined as the gap in the longitudinal direction of the connecting members (141, 142).

[0228] The second gap (G2) may be 0.8 mm or more. In detail, the second gap (G2) may be 0.8 mm to 1 mm.

[0229] If the second gap (G2) is less than 0.8 mm, the first-first sealing portion (211) may also be placed in an area where the light-emitting element (131) is placed during the process of forming the sealing portion. In addition, if the second gap (G2) exceeds 1 mm, the gap between the light-emitting element (131) and the bonding pads (134, 135) may increase. As a result, the size of the light source portion (130) may increase. As a result, the size of the lighting device may increase.

[0230] The height of the first sealing portion and the height (H2) of the second sealing portion are limited by the light-direction angle of the light-emitting element (131). In detail, the light-direction angle of the light-emitting element (131) may be 120° or more. Accordingly, the first angle (θ1) formed between the light emitted from the light-emitting element (131) and the first sealing portion (210) may be 30° or less. In addition, the second angle (θ2) formed between the light emitted from the light-emitting element (131) and the second sealing portion (220) may be 30° or less. Accordingly, the Lambertian emission of the light-emitting element (131) is not interfered with by the sealing portion (200). Therefore, the brightness and light efficiency of the lighting device may be improved.

[0231] FIG. 8 and FIG. 9 are drawings for explaining a sealing portion of a lighting device according to an embodiment and a thickness profile of the sealing portion.

[0232] Referring to FIGS. 8 and 9, the sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220). The first sealing portion (210) and the second sealing portion (220) are formed of the same resin composition. However, the first sealing portion (210) and the second sealing portion (220) have different application orders. In addition, the first sealing portion (210) and the second sealing portion (220) are arranged at different heights. Therefore, they are distinguished by the boundary between the first sealing portion (210) and the second sealing portion (220).

[0233] Referring to Fig. 9, the maximum height of the second sealing portion is greater than the height of the first sealing portion. Specifically, the height of the second sealing portion in contact with the first sealing portion is less than the height of the first sealing portion. However, the height of the second sealing portion gradually increases and becomes greater than the height of the first sealing portion. The second sealing portion is arranged in a shape that gradually increases and then decreases.

[0234] The first sealing portion is formed by the resin composition. Accordingly, the first sealing portion has a thixotropic property within a set range before curing. Accordingly, when the second sealing portion is filled, the first sealing portion does not collapse. Accordingly, the second sealing portion does not overflow outside the first sealing portion. Accordingly, the second sealing portion is not disposed outside the first sealing portion.

[0235] A lighting device according to an embodiment includes a sealing member. The sealing member protects the connecting member. Accordingly, the connecting member can be prevented from being damaged by external impact. This improves the reliability of the lighting device.

[0236] The above sealing portion includes a first sealing portion and a second sealing portion. The first sealing portion forms an outer rim of the sealing portion. The second sealing portion is disposed within the outer rim.

[0237] The first sealing portion and the second sealing portion are formed by a resin composition. The resin composition includes an oligomer, a monomer, a photoinitiator, and a filler. The oligomer, the monomer, the photoinitiator, and the filler are included in a set weight %. Accordingly, the thixotropic property and elasticity of the resin composition can be controlled. Specifically, the resin composition can satisfy the thixotropic property required by the first sealing portion. In addition, the resin composition can satisfy the elasticity required by the second sealing portion.

[0238] Therefore, the first sealing portion and the second sealing portion can be formed using the same resin composition. In addition, the first sealing portion and the second sealing portion can be formed using the same process.

[0239] Accordingly, the process efficiency of forming the sealing portion is improved.

[0240] In addition, the height of the first sealing portion and the height of the second sealing portion have a set size. In addition, the first sealing portion and the light emitting element are spaced apart at a set interval. In addition, the second sealing portion and the connecting member are spaced apart at a set interval.

[0241] Accordingly, the reliability of the lighting device can be improved and its size can be reduced.

[0242] Hereinafter, a lighting device according to another embodiment will be described with reference to FIGS. 10 to 12. Descriptions of the same content as those of the lighting device according to the previously described embodiment will be omitted. In addition, the same drawing reference numerals are assigned to the same components.

[0243] Referring to FIGS. 10 to 12, the lighting device includes the sealing portion (200). The sealing portion (200) includes a first sealing portion (210) and a second sealing portion (220).

[0244] The above first sealing portion (210) is divided into a 1-1 sealing portion (211), a 1-2 sealing portion (212), and a 1-3 sealing portion (213) depending on the location.

[0245] The first-first sealing portion (211) is positioned close to the light source portion (130). The first-first sealing portion (211) is positioned close to the first end (41). The first-second sealing portion (212) is positioned close to the circuit board (110). The first-second sealing portion (213) is positioned close to the other end (43). The first-third sealing portion (213) connects the first-first sealing portion (211) and the first-second sealing portion (212).

[0246] The above 1-1 sealing portion (211), the 1-2 sealing portion (212), and the 1-3 sealing portion (213) are distinguished by their positions and are formed as one piece. The 1-1 sealing portion (211), the 1-2 sealing portion (212), and the 1-3 sealing portion (213) form an outer edge of the sealing portion (200). Accordingly, the 1-1 sealing portion (210) can function as a dam of the sealing portion (200).

[0247] The above 1-1 sealing portion (211), the 1-2 sealing portion (212), and the 1-3 sealing portion (213) may each include two sealing portions.

[0248] For example, the 1-1 sealing portion (211) may include the 1-1a sealing portion (211a) and the 1-1b sealing portion (211b). The 1-1a sealing portion (211a) is disposed inside the 1-1b sealing portion (211b). In detail, the 1-1a sealing portion (211a) is disposed closer to the end (41) than the 1-1b sealing portion (211b). In detail, the 1-1b sealing portion (211b) is disposed closer to the light source portion (130) than the 1-1a sealing portion (211a).

[0249] In detail, the 1-2 sealing portion (212) may include the 1-2a sealing portion (212a) and the 1-2b sealing portion (221b). The 1-2a sealing portion (212a) is positioned inside the 1-2b sealing portion (212b). In detail, the 1-2a sealing portion (212a) is positioned closer to the other end (43) than the 1-2b sealing portion (212b).

[0250] The above 1-3 sealing portion (213) may include the 1-3a sealing portion and the 1-3b sealing portion. The 1-3a sealing portion (213a) is positioned inside the 1-3b sealing portion (213b).

[0251] The above 1-1a sealing portion (211a), the 1-2a sealing portion (212a), and the 1-3a sealing portion are connected. The 1-1a sealing portion (211a), the 1-2a sealing portion (212a), and the 1-3a sealing portion are formed integrally. The first sealing portion (210) forms a first outer edge by the 1-1a sealing portion (211a), the 1-2a sealing portion (212a), and the 1-3a sealing portion.

[0252] The above 1-1b sealing portion (211b), the 1-2b sealing portion (212b), and the 1-3b sealing portion are connected. The 1-1b sealing portion (211b), the 1-2b sealing portion (212b), and the 1-3b sealing portion are formed integrally. The first sealing portion (210) forms a second outer edge by the 1-1b sealing portion (211b), the 1-2b sealing portion (212b), and the 1-3b sealing portion.

[0253] The first outer border and the second outer border are spaced apart. The first outer border is positioned inwardly relative to the second outer border. That is, the first outer border is positioned closer to the first end (41) and the end (43) than the second outer border.

[0254] The second sealing portion (220) is arranged inside the first outer rim. The first outer rim prevents the second sealing portion (220) from overflowing to the outside of the first sealing portion (210). The second outer rim further prevents the second sealing portion (220) from overflowing. When applying the second sealing portion, an error in the application amount of the resin composition may occur. As a result, the second sealing portion (220) may overflow to the outside of the first outer rim. The resin composition overflowing to the outside of the first outer rim is prevented from flowing to the outside of the first sealing portion (210) by the second outer rim.

[0255] Accordingly, it is possible to prevent the resin composition from flowing into the light source unit (130) during the process.

[0256] The height of the 1-1a sealing portion (211a) and the height of the 1-1b sealing portion (211b) may be the same. The height of the 1-2a sealing portion (212a) and the height of the 1-2b sealing portion (211b) may be the same. The height of the 1-3a sealing portion and the height of the 1-3b sealing portion may be the same.

[0257] Alternatively, the height of the 1-1a sealing portion (211a) and the height of the 1-1b sealing portion (211b) may be different. In detail, the height of the 1-1a sealing portion (211a) may be greater than the height of the 1-1b sealing portion (211b). The height of the 1-2a sealing portion (212a) and the height of the 1-2b sealing portion (211b) may be different. In detail, the height of the 1-2a sealing portion (212a) may be greater than the height of the 1-2b sealing portion (211b). The height of the 1-3a sealing portion and the height of the 1-3b sealing portion may be different. In detail, the height of the 1-3a sealing portion may be greater than the height of the 1-3b sealing portion.

[0258] That is, the height of the first outer border may be greater than the height of the second outer border.

[0259] The first outer rim acts as a main dam. In addition, the second outer rim acts as an auxiliary dam. Accordingly, the height of the first outer rim is increased to prevent overflow of the second sealing portion. In addition, the height of the second outer rim is made relatively small. This additionally prevents overflow of the second sealing portion. In addition, the size of the sealing portion can be reduced.

[0260] A lighting device according to another embodiment includes a plurality of outer frames. Accordingly, overflow of the second sealing portion caused by an error in the amount applied during the process can be prevented. Accordingly, the reliability of the lighting device according to another embodiment can be improved.

[0261] Referring to FIG. 13, a vehicle headlamp (90) having a lighting device according to an embodiment includes a light source module (10) and a housing (92). The light source module (10) is disposed inside the housing (92) and radiates light in a lateral direction. The radiated light can be reflected in an exit direction through an inner surface (92A) of the housing (92). The light source module (10) includes the lighting device described above.

[0262] The housing (92) may include a metallic or non-metallic material. The non-metallic material may include a plastic material. The housing (92) may be a reflector of a headlamp. The inner surface (92A) of the housing (92) may be a surface coated with a highly reflective material or may include a reflective layer having an anti-reflection (AR) material. For example, the highly reflective material includes at least one metal, such as Al, Ag, and Au. The anti-reflection material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, and ZrO2. The reflective layer of the inner surface (92A) may be a single layer or a multi-layer.

[0263] The above headlamp (90) may include an inner lens and / or an outer lens that projects light emitted through the housing (92). Depending on the shape of the inner lens or the number of light source units, the light distribution pattern of light emitted from the light source module (10) may be adjusted. The light source module (10) selectively irradiates light of a high beam distribution pattern and a low beam distribution pattern. The high beam distribution pattern or the low beam distribution pattern may be automatically turned on and off depending on the driving mode or driving situation.

[0264] An inner surface (92A) of the housing (92) may comprise a partially domed or partially elliptical paraboloid. The inner surface (92A) may have a plurality of facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a free-form portion, and / or a flat portion, and / or a curved portion (e.g., any combination thereof). In some embodiments, the facets (or at least the inwardly facing surfaces on the facets) may be at least approximated or otherwise defined by algebraic equations. For example, the shape or inwardly facing surfaces of the facets may be expressed by one or more fifth-order algebraic equations (although other equations of any order are also possible). In at least one exemplary embodiment, the surfaces (or, for example, coatings) of the facets have a high reflectivity (e.g., a reflectivity of greater than 80%). Non-limiting examples of facets and / or coatings on the facets include aluminum and silver, although other reflective materials may be used.

[0265] The inner surface (92A) of the housing (92) is spaced laterally from the light source module (10), and light emitted from the light source module (10) can be reflected by the inner surface (92A) and focused toward the emission side of the housing (92), and can be irradiated as a high beam or a low beam.

[0266] The exterior of the housing (92) may include various features and accessories for mounting or connecting the headlamp (90) to the interior of the vehicle. In addition, the exterior of the housing (92) may have an electrical interface, such as a socket, for connecting power and / or signals. The housing (92) and cavity (95) described above are examples and may be changed into various shapes. The housing (92) according to an embodiment may function as a reflector for the left / right headlamps (90).

[0267] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by a person having ordinary skill in the art to which the embodiments belong. Therefore, the contents related to such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0268] In addition, although the above has been described focusing on embodiments, these are merely examples and do not limit the present invention, and those skilled in the art to which the present invention pertains will recognize that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included in the scope of the present invention defined in the appended claims.

Claims

1. A heat dissipation plate including a recessed portion; A circuit board placed in the above recessed portion; A light source unit disposed on the heat dissipation plate and including a plurality of light emitting elements; A connecting member connecting the circuit board and the light source unit; and Including a sealing portion arranged to cover and surround the above connecting member, A lighting device in which the sealing portion is formed of a resin composition containing an oligomer having a glass transition temperature (Tg) of -50°C or lower.

2. In paragraph 1, A lighting device wherein the above oligomer is at least one selected from isoprene oligomers, polydimethylsiloxane oligomers, polyisobutylene oligomers, polybutadiene oligomers, ethylene-propylene oligomers, polyether oligomers, modified oligomers of the above oligomers, and copolymers thereof.

3. In paragraph 1, A lighting device wherein the resin composition further comprises an acrylate monomer having a glass transition temperature (Tg) of -50°C or lower.

4. In paragraph 1, A lighting device wherein the resin composition further comprises at least one selected from an oxygen inhibitor and a filler, and comprises 60 to 75 parts by weight of the oligomer, 10 to 20 parts by weight of the acrylate monomer, 2 to 5 parts by weight of the oxygen inhibitor, and 4 to 9 parts by weight of the filler based on 100 parts by weight of the resin composition.

5. In paragraph 4, A lighting device wherein the oxygen inhibitor is a secondary thiol compound.

6. In paragraph 5, A lighting device wherein the secondary thiol compound is at least one selected from pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyroyloxy)butane, 1,3,5-tris[2-(3-mercaptobutanoyloxy)ethyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and trimethylol propane tris(3-mercaptobutyrate).

7. In paragraph 4, A lighting device wherein the above filler is at least one selected from silica or alumina having a diameter of 500 ㎛ or less.

8. In paragraph 1, A lighting device wherein the thixotropic index (TI) of the resin composition is in the range of 3 to 5.

9. In paragraph 1, A lighting device comprising: a first sealing portion forming an outer rim; and a second sealing portion disposed inside the outer rim, wherein the first sealing portion and the second sealing portion are each independently formed of a resin composition including an oligomer having a glass transition temperature (Tg) of -50°C or less.

10. In paragraph 9, A lighting device wherein the first sealing portion and the second sealing portion are formed of the same resin composition.

Images