Electronic device comprising antenna

Abstract

This wearable electronic device may comprise: a display; a housing including a rear cover; a printed circuit board (PCB) disposed between the display and the rear cover; a metal component disposed on the rear surface of the PCB; an antenna radiator disposed between the PCB and the rear cover, the antenna radiator including a first end connected to an antenna feed of the PCB, a second end connected to a ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator; a sensor circuit configured to obtain sensor data related to a part of the body of a user wearing the wearable electronic device; and a flexible printed circuit board (FPCB). At least a portion of the FPCB may be disposed between the antenna radiator and the metal component. At least a portion of the connected portions may overlap the curved portion of the antenna radiator.

Description

Electronic device including an antenna

[0001] The descriptions below relate to electronic devices that include antennas.

[0002] Electronic devices may utilize antennas to transmit signals. For example, wearable electronic devices, such as smart watches, may include an antenna used for communication with external electronic devices. In addition to the antenna, multiple electronic components for various functions of the wearable electronic device may be positioned within the housing of the wearable electronic device.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In embodiments of the present disclosure, a wearable electronic device is provided. The wearable electronic device may include a display; a housing including a rear cover; a printed circuit board (PCB) disposed between the display and the rear cover; a metal component disposed on a rear surface of the PCB; an antenna radiator disposed between the PCB and the rear cover, the antenna radiator including a first end connected to an antenna feed of the PCB, a second end connected to a ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator, the sensor circuit configured to acquire sensor data related to a portion of a body of a user wearing the wearable electronic device; and a flexible printed circuit board (FPCB). At least a portion of the FPCB may be disposed between the antenna radiator and the metal component. The FPCB may include a first end electrically connected to the PCB, a second end connected to the sensor circuit, and a connection portion disposed between the first end of the FPCB and the second end of the FPCB. At least a portion of the above connecting portion may overlap with a curved portion of the antenna radiator.

[0005] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a front plate; a back plate; a printed circuit board (PCB), the PCB including a first side facing the front plate and a second side facing the back plate; a metal component disposed on the second side of the PCB; an antenna radiator; a conductive connection structure including a portion disposed between the metal component and the antenna radiator; and a sensor circuit connected to the conductive connection structure. The antenna radiator may be arranged to at least partially overlap the conductive connection structure when viewed from the first side or the second side of the PCB. A first area of ​​the conductive connection structure overlapping the antenna radiator may be arranged in front of a second area of ​​the antenna radiator overlapping the conductive connection structure.

[0006] In embodiments of the present disclosure, a wearable device is provided. The wearable device may include a front plate; a display disposed under the front plate; a printed circuit board (PCB) disposed under the display, the PCB including a first side facing the front plate and a second side opposite the first side; a shield can disposed on the second side of the PCB; a printed circuit board (FPCB) including a connection portion disposed under the PCB and connected to the PCB; an antenna radiator connected to the PCB and including a conductive portion disposed under the PCB; a sensor circuit connected to the FPCB; and a rear plate disposed under the sensor circuit. The antenna radiator may be disposed to at least partially overlap the FPCB when the front of the electronic device is viewed. A second area of ​​the antenna radiator overlapping the FPCB may be disposed behind a first area of ​​the FPCB overlapping the antenna radiator.

[0007] In embodiments of the present disclosure, a wearable electronic device is provided. The wearable electronic device may include a display; a back cover; a printed circuit board (PCB) disposed between the display and the back cover; a metal component disposed on a back surface of the PCB; an antenna radiator disposed between the PCB and the back cover, a sensor circuit configured to acquire sensor data of a portion of a user's body in contact with the back cover; and a flexible printed circuit board (FPCB) electrically connecting the sensor circuit to the PCB. The antenna radiator may include a first end connected to an antenna feed of the PCB, a second end connected to a ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator. The FPCB may include a first end electrically connected to the PCB, a second end connected to the sensor circuit, and a connection portion formed between the first end of the FPCB and the second end of the FPCB. At least a portion of the above connecting portion may overlap with a curved portion of the antenna radiator and be positioned behind the metal component and in front of the antenna radiator.

[0008] In embodiments of the present disclosure, an electronic device is provided. The electronic device may include a printed circuit board (PCB) including a surface facing a rear side of the electronic device; a metal component disposed on the surface of the PCB; an antenna radiator disposed under the metal component, the antenna radiator including a first end connected to an antenna feed of the PCB, a second end connected to a ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator; a sensor circuit disposed under the metal component, the sensor circuit configured to acquire sensor data of a portion of a user's body that makes contact with the rear side of the electronic device; and a flexible printed circuit board (FPCB) connecting the PCB and the sensor circuit. At least a portion of the FPCB may be bent along the curved portion of the antenna radiator so as to overlap with the curved portion of the antenna radiator.

[0009] Figure 1 is a front perspective view of an exemplary electronic device.

[0010] Figure 2 is a rear perspective view of an exemplary electronic device.

[0011] Figure 3 is a perspective view of an exemplary electronic device.

[0012] Figure 4 shows an exemplary cross-section of an electronic device.

[0013] FIG. 5 shows an example of a conductive connection structure and an antenna radiator when viewed from the front of an electronic device.

[0014] FIGS. 6A, 6B, and 6C illustrate examples of electronic devices including at least partially overlapping conductive connection structures and antenna radiators.

[0015] FIGS. 7A, 7B, and 7C illustrate examples of electronic devices including at least partially overlapping conductive connecting structures and antenna radiators.

[0016] Figure 8 shows the radiation performance of an antenna radiator that at least partially overlaps a conductive connecting structure.

[0017] Figure 9 is a cross-sectional view of an exemplary electronic device.

[0018] Figure 10 shows an example of a conductive connecting structure that functions as a stub.

[0019] Figures 11a and 11b illustrate examples of electronic devices including conductive plates.

[0020] Figure 12 is a block diagram of an electronic device within a network environment.

[0021] The terms used in this disclosure are used only to describe specific embodiments and may not be intended to limit the scope of other embodiments. The singular expression may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Terms defined in general dictionaries among the terms used in this disclosure may be interpreted as having the same or similar meaning in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this disclosure. In some cases, even if a term is defined in this disclosure, it cannot be interpreted to exclude embodiments of the present disclosure.

[0022] The various embodiments of the present disclosure described below illustrate a hardware-based approach as an example. However, since the various embodiments of the present disclosure include techniques utilizing both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0023] Terms referring to parts of electronic devices used in the following description (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), printed board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, component, or device), terms referring to antennas (e.g., antenna radiator, radiator, conductive part, conductive line pattern, coil, conductive member, radiating member, radiating material, radiating part, antenna structure, antenna structure), terms referring to the location of components (e.g., part, location, area, point), terms referring to the shape of components (e.g., structure, structure, support, contact, or protrusion), terms referring to connections between structures (e.g., connecting part, contact part, supporting part, connecting member, contact member, supporting member, contact, contact structure, conductive member, or assembly), terms referring to open structures (e.g., slot, slit, or opening), terms referring to circuits (e.g., PCB, FPCB, signal line, ground line), Feeding lines, data lines, RF signal lines, antenna lines, RF paths, RF modules, RF circuits, splitters, dividers, couplers, or combiners are examples for convenience of explanation. Therefore, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. In addition, terms such as '... part', '... device', '... object', or '... body' used below may mean at least one shape structure or a unit that processes a function.

[0024] In addition, in the present disclosure, expressions such as more than or less than may be used to determine whether a specific condition is satisfied or fulfilled, but this is only a description to express an example and does not exclude descriptions such as more than or less than. A condition described as 'more than' may be replaced with 'more than', a condition described as 'less than' may be replaced with 'less than', and a condition described as 'more than and less than' may be replaced with 'more than and less than'. In addition, hereinafter, 'A' to 'B' mean at least one of the elements from A to (including A) and from B to (including B). Hereinafter, 'C' and / or 'D' mean at least one of 'C' or 'D', that is, including {'C', 'D', 'C' and 'D'}. In addition, hereinafter, the meaning of 'about E' may be replaced with a value within a margin of error of ±5% or ±10% based on E.

[0025] Figure 1 is a front perspective view of an exemplary electronic device. Figure 2 is a rear perspective view of an exemplary electronic device. According to one embodiment, the electronic device may include a wearable device worn on a portion of a user's body. For example, the wearable device may be referred to as a wrist-wearable electronic device or a smartwatch.

[0026] Referring to FIGS. 1 and 2 , an electronic device (100) according to one embodiment (e.g., electronic device (1201) of FIG. 12 ) may include a housing (110) forming a front side (110A), a rear side (110B), and a side side (110C) surrounding a space between the front side (110A) and the rear side (110B), and a fastening member (150, 160) (e.g., a strap) connected to at least a portion of the housing (110) and configured to detachably fasten the electronic device (100) to a part of a user's body (e.g., a wrist, etc.). The straps may be fastened to each other through the fastening member, thereby fastening the wearable device to a part of the user's body (e.g., a wrist). In FIGS. 1 and 2 , the fastening member is illustrated as being disposed at an end of one of the straps and inserted into a fastening hole included in another one of the straps, but is not limited thereto.

[0027] The housing (110) may refer to a structure forming at least a portion of the front (110A), the back (110B), and the side (110C). In one embodiment, the front (110A) may be formed by a front plate (101) at least a portion of which is formed substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The back (110B) may be formed by a substantially opaque back plate (107). The back plate (107) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (110C) may be formed by a frame (106) coupled to the front plate (101) and the back plate (107). The frame (106) may be formed of metal. The frame (106) may be referred to as a 'metal frame', a 'side member', or a 'side bezel structure'.

[0028] The above-mentioned fastening member (150, 160) may be formed of various materials and shapes. For example, the fastening member (150, 160) may be formed of a woven material, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the above-mentioned materials, such that an integral or multiple unit links can float with each other.

[0029] According to one embodiment, the electronic device (100) may include at least one of a display (120), an audio module (e.g., an audio output module (1255) and / or an audio module (1270) of FIG. 12), a sensor module (111), key input devices (102, 103, 104), and a connector hole (109). In some embodiments, the electronic device (100) may omit at least one of the components (e.g., the key input devices (102, 103, 104), the connector hole (109), or the sensor module (111)), or may additionally include other components.

[0030] The display (120) may be exposed, for example, through a significant portion of the front plate (101). The shape of the display (120) may correspond to the shape of the front plate (101), and may be in various shapes such as circular, oval, or polygonal. The display (120) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0031] The above audio module may include a microphone hole (105) and a speaker hole (108). A microphone may be placed inside the microphone hole (105) to acquire external sounds. The microphone may include multiple microphones to detect the direction of sounds, but is not limited thereto. The speaker hole (108) may be used as an external speaker and a receiver for calls. In some embodiments, the speaker hole (108) may be integrated into the microphone hole (105) so that the speaker hole (108) and the microphone hole (105) are implemented as a single hole, or a speaker may be included without the speaker hole (108) (e.g., a piezo speaker).

[0032] The sensor module (111) can generate an electric signal or data value corresponding to the internal operating state of the electronic device (100) or the external environmental state. The sensor module (111) can include, for example, a sensor module (111) (e.g., a heart rate monitor (HRM) sensor) arranged on the rear surface (110B) of the housing (110). The electronic device (100) can further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The key input devices (102, 103, 104) may include a wheel key (102) disposed on the front surface (110A) of the housing (110) and rotatable in at least one direction, and key buttons (102, 103) disposed on the side surface (110C) of the housing (110). The wheel key (102) may have a shape corresponding to the shape of the front plate (101). In other embodiments, the electronic device (100) may not include some or all of the above-mentioned key input devices (102, 103, 104). For example, the electronic device (100) may not include the wheel key (102), and the wheel key (102) that is not included may be implemented in another form, such as a soft key, on the display (120).

[0034] The connector hole (109) can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device. The electronic device (100) may further include a connector cover (not shown) that covers at least a portion of the connector hole (109) and blocks the inflow of external foreign substances into the connector hole, for example. In another embodiment, the electronic device (100) may not include the connector hole (109), in which case the electronic device (100) may transmit and receive power and / or data with the external electronic device using wireless communication.

[0035] The fastening member (150, 160) can be detachably fastened to at least a portion of the housing (110) using the locking member (151, 161). The fastening member (150, 160) can include at least one of a fixing member (152), a fixing member fastening hole (153), a band guide member (154), and a band fastening ring (155).

[0036] The fixing member (152) may be configured to fix the housing (110) and the fastening members (150, 160) to a part of the user's body (e.g., wrist, etc.). The fastening member fastening hole (153) may correspond to the fastening member (152) to fasten the housing (110) and the fastening members (150, 160) to a part of the user's body. The band guide member (154) may be configured to limit the range of motion of the fastening member (152) when the fastening member (152) is fastened to the fastening member fastening hole (153), thereby allowing the fastening members (150, 160) to be fastened in close contact with a part of the user's body. The band fixing ring (155) may limit the range of motion of the fastening members (150, 160) when the fastening member (152) and the fastening member fastening hole (153) are fastened.

[0037] FIG. 3 is an exploded perspective view of an exemplary electronic device (e.g., electronic device (100)). A first direction (D1) illustrated in FIG. 3 may indicate a direction toward the front of the electronic device (100). A second direction (D2) may indicate a direction toward the rear of the electronic device (100). The second direction (D2) illustrated in FIG. 3 may be an opposite direction to the first direction (D1). Hereinafter, the front direction may be a direction toward the front of the electronic device (100) and may correspond to the first direction (D1). The rear direction may be a direction toward the rear of the electronic device (100) and may correspond to the second direction (D2). Although not illustrated in FIG. 3, the electronic device (100) may include a front plate facing the first direction and a rear plate facing the second direction. Hereinafter, redundant descriptions of components having the same reference numerals as the aforementioned components may be omitted.

[0038] Referring to FIG. 3, the electronic device (100) may include a display (120). The display (120) may face the front. For example, a front plate (e.g., the front plate (101) of FIG. 1) of the electronic device (100) positioned in front of the display (120) may form the front of the electronic device (100). A rear plate (e.g., the rear plate (107) of FIG. 1) of the electronic device (100) may form the rear of the electronic device (100). The electronic device (100) may include a frame (106). The frame (106) may be a side bezel structure and may form a side of the electronic device (100). A front plate (e.g., the front plate (101) of FIG. 1) of the electronic device (100) may form the front of the electronic device (100).

[0039] The electronic device (100) may include a conductive plate (320). The conductive plate (320) may be disposed between the display (120) and the battery (325). The conductive plate (320) may be used to reduce the influence of electromagnetic waves generated from the battery (325) on the display (120). The conductive plate (320) may be disposed behind the display (120) and in front of the battery (325) disposed above the bracket (330). The conductive plate (320) may be referred to as a bracket plate, a battery plate, a battery suspension (stainless steel, SUS) suspension plate, and / or equivalent technical / structural terms in addition to the conductive plate. The electronic device (100) may include the battery (325). The battery (325) is a device for supplying power to at least one component of the electronic device (100) and may include, for example, a rechargeable secondary battery. The battery (325) can be accommodated in a space formed within the bracket (330).

[0040] The electronic device (100) may include a bracket (330). For example, the bracket (330) may be disposed within the frame (106). The bracket (330) may be positioned between the display (120) and a printed circuit board (PCB) (340). For example, the display (120) may be disposed on one side of the bracket (e.g., a side facing a first direction (D1)), and the PCB (340) may be disposed on the other side (e.g., a side facing a second direction (D2)). The bracket (330) may support the display (120) and the printed circuit PCB (340). The bracket (330) may be formed of a metallic material and / or a non-metallic (e.g., a polymer) material.

[0041] The electronic device (100) may include a printed circuit board (PCB) (340). The PCB (340) may include a first side (e.g., a side facing a first direction (D1)) and a second side (e.g., a side facing a second direction (D2)). A processor (e.g., a processor (1220) of FIG. 12), a memory (e.g., a memory (1230) of FIG. 12), and / or an interface (e.g., an interface (1277) of FIG. 12) may be mounted on the PCB (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor, a sensor processor, or a communication processor. The memory may include, for example, a volatile memory or a nonvolatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface), an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, a wireless communication circuit for transmitting or receiving a wireless signal may be disposed on the PCB (340). For example, the wireless communication circuit may include a wireless communication circuit for processing a signal in a cellular frequency band. As an example, the wireless communication circuit may include a wireless communication circuit configured to process a signal in a low frequency band (e.g., less than about 1.2 GHz) (e.g., Band 14). As an example, the wireless communication circuit may include a wireless communication circuit configured to process a signal in an intermediate frequency band (e.g., more than about 1.2 GHz and less than 2.3 GHz).For example, the wireless communication circuit may include a wireless communication circuit configured to process a signal in a high frequency band (e.g., about 2.3 GHz or higher, about 2.3 GHz or higher). For example, the wireless communication circuit may include a wireless communication circuit for processing a signal in a global positioning system (GPS) frequency band (e.g., L1 band, L5 band). According to one embodiment, a shield can may be placed on the PCB (340). The shield can may be used to protect electronic components (e.g., chips, circuits) on the PCB (340) and for electromagnetic shielding.

[0042] The electronic device (100) may include a non-conductive support portion (350). The non-conductive support portion (350) may be positioned in a space corresponding to the second direction (D2) from the PCB (340). The non-conductive support portion (350) may be used to support components at the rear of the electronic device (100).

[0043] The electronic device (100) may include an antenna radiator (360). The antenna radiator (360) may include a conductive member. The electronic device (100) may be configured to transmit a signal or receive a signal through the antenna radiator (360). A signal provided from a PCB (340) may be supplied to the antenna radiator (360). The antenna radiator (360) may be electrically connected to a ground of the PCB (340). According to one embodiment, the antenna radiator (360) may function as an inverted F antenna (IFA) type antenna.

[0044] The electronic device (100) may include a conductive connection structure (345) and a sensor circuit (380). The conductive connection structure (345) may be used to structurally / electrically connect the processing circuit of the PCB (340) and the sensor circuit (380). For example, the conductive connection structure (345) may include an FPCB. The sensor circuit (380) may be referred to as a sensor module. The sensor circuit (380) may be referred to as the sensor module (111) of FIG. 1. The sensor circuit (380) may be used to detect biometric information of a user. For example, the sensor circuit (380) may include an optical sensor for detecting a heart rate and / or oxygen saturation of a user in contact with a plate (not shown) on the back of the electronic device (100). As an example, the sensor circuit (380) may include a heart rate monitor (HRM) module.

[0045] An electronic device according to embodiments of the present disclosure (e.g., the electronic device (100) of FIGS. 1, 2, and 3) can transmit a wireless signal. The electronic device (100) can transmit or receive a signal through an antenna radiator (e.g., the antenna radiator (360)). The electronic device (100) can include a conductive connection structure (345) and a sensor circuit (380). In various embodiments of the present disclosure, a technique is described for improving radiation performance by overlapping an electrical material (e.g., the conductive connection structure (345)) including a ground and an antenna (e.g., the antenna radiator (360)) instead of arranging the antenna at a location spaced apart from the electrical material, in order to reduce performance degradation and noise due to the occurrence of parasitic resonance. For example, the electronic device can provide improved radiation efficiency through a structure in which a ground portion of an FPCB connecting an HRM module at least partially overlaps an antenna pattern.

[0046] FIG. 4 illustrates an exemplary cross-section of an electronic device (e.g., electronic device (100)).

[0047] Referring to FIG. 4, an electronic device (100) according to one embodiment may include a PCB (340), a shield can (440), a conductive connection structure (345), a non-conductive support portion (350), an antenna radiator (360), and / or a sensor circuit (380). The PCB (340) may include a first surface facing the front (e.g., in the (+) z-axis direction) and a second surface facing the rear (e.g., in the (-) z-axis direction). One or more electronic components may be arranged on the first surface of the PCB (340). One or more electronic components may be arranged on the second surface of the PCB (340). When the space on the first surface of the PCB (340) is limited, the electronic components may be arranged on the second surface of the PCB (340). Hereinafter, an area corresponding to the second side of the PCB (340) (e.g., a side of the PCB (340) facing the (-) z-axis) may be referred to as a rear area. A shield can (440), a conductive connection structure (345), a non-conductive support portion (350), an antenna radiator (360), and a sensor circuit (380) may be placed in the rear area.

[0048] In the present disclosure, when describing the arrangement between components, the first component being positioned 'above' the second component may indicate that the first component is above the second component when looking at the electronic device (100) in one direction (e.g., the (-) x-axis direction). For example, the first component being positioned 'above' the second component may indicate that the first component is positioned in front of the second component between the front plate (e.g., the front plate (101)) and the rear plate (e.g., the rear plate (107)). The first component being positioned 'below' the second component may indicate that the first component is positioned behind the second component when looking at the electronic device (100) in one direction (e.g., the (-) x-axis direction). For example, positioning the first component 'below' the second component may indicate that the first component is positioned behind the second component between the front plate (e.g., front plate (101)) and the back plate (e.g., back plate (107)).

[0049] When the electronic device (100) is viewed in one direction (e.g., in the (-) x-axis direction), a shield can (440) may be placed on the second surface of the PCB (340). The shield can (440) may be used to reduce electromagnetic interference (EMI) interference to electronic components (e.g., wireless communication circuits, chips, processing circuits, or RFICs) on the second surface of the PCB (340). The shield can (440) may be used to physically surround the electronic components (e.g., wireless communication circuits, chips, processing circuits, or RFICs) placed on the second surface of the PCB (340) to protect them from external electromagnetic waves and to prevent electromagnetic waves generated inside from being emitted to the outside. The shield can (440) may be formed of a metal material. A conductive connection structure (345) may be placed under the shield can (440) (e.g., in the (-) z-axis direction). The conductive connection structure (345) may be used to electrically connect the sensor circuit (380) and the processing circuit of the PCB (340). For example, the conductive connection structure (345) may include an FPCB. For example, in terms of being used to connect an HRM module, the conductive connection structure (345) may be referred to as an HRM FPCB. The conductive connection structure (345) may include a signal portion and a ground portion. The signal portion may be referred to as a signal line or a signal area, and the ground portion may be referred to as a ground line or a ground area. A non-conductive support portion (350) may be disposed below the conductive connection structure (345) (e.g., in the (-) z-axis direction). The non-conductive support portion (350) is an injection-molded portion and may be disposed within the electronic device (100) to support components of the electronic device (100). The non-conductive support portion (350) may include one or more holes. An antenna radiator (360) may be placed under the non-conductive support portion (350) (e.g., in the (-)z-axis direction).A sensor circuit (380) may be placed below the antenna radiator (360) (e.g., in the (-)z-axis direction).

[0050] In FIG. 4, the conductive connection structure (345) is illustrated as being positioned above the non-conductive support portion (350) (e.g., in the (+) z-axis direction). However, the example illustrated in FIG. 4 is only one cross-section of the electronic device (100), and the conductive connection structure (345) is not entirely positioned above the non-conductive support portion (350). A portion of the conductive connection structure (345) may pass through a hole in the non-conductive support portion (350) and be connected to a sensor circuit (380) positioned below the non-conductive support portion (350). In FIG. 4, the antenna radiator (360) is illustrated as being positioned below the non-conductive support portion (350). However, the example illustrated in FIG. 4 is only one cross-section of the electronic device (100), and the antenna radiator (360) is not entirely positioned below the non-conductive support portion (350). A portion of the antenna radiator (360) may be connected to a PCB (340) positioned on top of the antenna radiator (360) through a hole in the non-conductive support portion (350). For example, the antenna radiator (360) may be electrically connected to a wireless communication circuit positioned on the PCB (340) and / or a ground of the PCB (340).

[0051] A metal component (e.g., a shield can (440), a display connector, etc.) placed on one side (e.g., the second side) of the PCB (340) may affect the performance of the antenna radiator (360). The antenna radiator (360) may function as an IFA type antenna (e.g., a PIFA type antenna). Generally, in an IFA type antenna, the performance of the antenna may depend on the separation distance between the radiating portion and the ground, or a conductive material such as a metal component. For example, the performance of the antenna may be improved as the separation distance between the radiating portion and the ground increases. For example, the less the radiating portion of the antenna radiator (360) is affected by the conductive electronic components of the PCB (340), the better the antenna performance may be. The electronic device (100) according to embodiments of the present disclosure may include a structure in which a conductive connection structure (345) is disposed between the metal component (e.g., shield can (440)) on the PCB (340) and the antenna radiator (360) in order to reduce the influence between the metal component and the antenna radiator (360). According to one embodiment, when the electronic device (100) is viewed in one direction (e.g., (-) z-axis or (+) z-axis), the conductive connection structure (345) may at least partially overlap the antenna radiator (360). For example, a ground portion of the conductive connection structure (345) may at least partially overlap the antenna radiator (360). As the portion of the conductive connection structure (345) that overlaps the antenna radiator (360) is disposed between the shield can (440) and the antenna radiator (360), the influence of the shield can (440) on the antenna radiator (360) may be reduced. The radiation performance of the antenna radiator (360) can be improved by the conductive connection structure (345). In one aspect of improving the radiation performance, a coupling can be formed between the conductive connection structure (345) and the antenna radiator (360). It can be understood that the radiation performance is improved as the radiator area increases due to the coupling.In one aspect of improving radiation performance, the arrangement of the conductive connection structure (345) may reduce influence from other antennas. For example, interference from other antennas or other electronic components may be reduced as the ground portion of the conductive connection structure (345) at least partially overlaps the radiating portion of the antenna radiator (360). Isolation performance may be improved as the conductive connection structure (345) functions as a shield.

[0052] FIG. 5 illustrates an example of a conductive connection structure (e.g., a conductive connection structure (345)) and an antenna radiator (e.g., an antenna radiator (360)) when viewed from the front of an electronic device (e.g., an electronic device (100)). FIG. 5 is provided to explain the arrangement between the conductive connection structure (345) and the antenna radiator (360), and the arrangement of other structures is exemplary and is not to be construed as limiting other embodiments of the present disclosure.

[0053] Referring to FIG. 5, the electronic device (100) may include a non-conductive support portion (350) and a conductive rear housing (550) in a rear area (e.g., an area corresponding to the (-) z-axis direction from the second PCB (340)). When looking at the front of the electronic device (100), a sensor circuit (380) may be arranged in a central area of ​​the non-conductive support portion (350). The conductive rear housing (550) may be arranged to surround the periphery of the non-conductive support portion (350). With respect to one direction (e.g., the (+) z-axis direction), an antenna radiator (360) may be arranged above the sensor circuit (380) (e.g., the (+) z-axis direction), and a conductive connection structure (345) may be arranged above the antenna radiator (360) (e.g., the (+) z-axis direction).

[0054] The antenna radiator (360) may include a conductive member. The antenna radiator (360) may include a first end (510), a second end (520), and a curved portion (530) formed between the first end (510) and the second end (520) of the antenna radiator (360). The first end (510) of the antenna radiator (360) may be electrically connected to a feeding unit (591) (e.g., an antenna feed of a PCB (340), a feeding line connected to a wireless communication circuit on the PCB (340). The electronic device (100) may be configured to radiate an RF signal to the outside by feeding the RF signal from the feeding unit (591) to the antenna radiator (360). In addition, the electronic device (100) may be configured to transmit a wireless signal received through the antenna radiator (360) to the feeding unit (591). The second end (520) of the antenna radiator (360) can be electrically connected to a ground (592) (e.g., a ground of the PCB (340), a ground layer grounded to the frame (106)).

[0055] According to one embodiment, the antenna radiator (360) may function as an IFA type antenna. In order to sufficiently secure the radiation performance of the antenna radiator (360) within a limited space of the electronic device (100), an IFA type antenna may be used. For the IFA type antenna, the second end (520) may be electrically connected to the ground (502) (e.g., a region connected to the ground layer of the PCB (340)) through a connecting member (e.g., a C-clip, a conductive pattern). The second end (520) may be referred to as a ground point of the IFA type antenna. For the IFA type antenna, the first end (510) of the antenna radiator (360) may be electrically connected to a feeder (591) of the electronic device (100) (e.g., a feed line connected to a wireless communication circuit on the PCB (340)). The region may be referred to as a feed point of the IFA type antenna. For the IFA type antenna, the antenna radiator (360) may include an open area. The open area may refer to an area including an end point on the side opposite to the side where a ground point or a feed point is formed among the antenna radiator (360). The end point may be referred to as an open point of the IFA type antenna. For example, a separate feed point or a ground point may not be formed within the open area. At least a portion of the antenna radiator (360) may have an area in one plane (e.g., an xy plane). The antenna radiator (360) may correspond to a planar inverted F antenna (PIFA) type antenna as an example of an IFA type antenna. In one embodiment, the antenna radiator (360) may be implemented as a flexible printed circuit board (FPCB).

[0056] According to one embodiment, the antenna radiator (360) may be electrically connected to the ground (592) of the PCB (340). For example, in order to form a resonance in a low frequency band (e.g., less than about 1.2 GHz), the antenna radiator (360) may have a 'U' shape. In order to function as an IFA type antenna, the antenna radiator (360) may include a region connected to the feed portion (591) and the ground (592) at a position adjacent to one side of the electronic device (100) (e.g., the side facing the (-) x-axis direction), and may include an open region at a position adjacent to the other side of the electronic device (100) (e.g., the side facing the (+) x-axis direction). The distance from the ground point (e.g., the second end (520)) to the open point is approximately / 4 or more is required, an area corresponding to the open point may be arranged adjacent to the second side (412) of the electronic device (100). In order to secure sufficient electrical length in a limited space, the antenna radiator (360) may include a curved portion (530). At least a portion of the curved portion (530) may have a curved shape. For example, the curved portion (530) may be formed along one direction (e.g., clockwise) from the first end (510) to the second end (520). For example, at least a portion of the curved portion (530) may have a 'U' shape. In addition to the curved portion (530), the antenna radiator (360) may further include an outer curved portion (533). The outer curved portion (533) may be used to expand the radiation pattern. The antenna radiator (360) may include a first leg portion (581) and a second leg portion (582). The outer curved portion (533) may be physically and / or electrically connected to the curved portion (530) through the first leg portion (581) and the second leg portion (582). At least a portion of the outer curved portion (533) may have a 'U' shape. The curved portion (530) may be referred to as an inner curved portion (530) in terms of being located inward from the outer curved portion (533). Meanwhile, the structure of the antenna radiator (360) including the outer curved portion (533) illustrated in FIG. 5 is an embodiment, and an antenna radiator (360) that does not include the first leg portion (581), the second leg portion (582), and the outer curved portion (533) may also be understood as an embodiment of the present disclosure.

[0057] A conductive connection structure (345) may be used to connect a sensor circuit (380) and a PCB (e.g., PCB (340)). Through the conductive connection structure (345), the sensor circuit (380) and a processing circuit (e.g., processor (1220) of FIG. 12) on the PCB (340) may be electrically connected. The sensor circuit (380) may be configured to acquire sensor data for a part of a user's body (e.g., wrist) that contacts the rear surface (e.g., rear plate (107), rear cover) of the electronic device (100). For example, the sensor circuit (380) may be disposed between the PCB (340) and the rear plate (107), and may be positioned adjacent to the rear plate (107). In order to improve radiation performance at the antenna radiator (360), the conductive connection structure (345) for the sensor circuit (380) may be disposed to overlap with the antenna radiator (360). In other words, the conductive connection structure (345) may be arranged so that not only the sensor circuit (380) and the PCB (340) are connected, but also a portion of the conductive connection structure (345) overlaps a portion of the antenna radiator (360) (e.g., a curved portion (530)). For example, a portion of the conductive connection structure (345) may be curved along a portion of the antenna radiator (360) (e.g., a curved portion (530)). When viewed from a direction facing the front (or rear) of the electronic device (100), the conductive connection structure (345) may overlap the antenna radiator (360). For example, the portion of the conductive connection structure (345) that overlaps the antenna radiator (360) may be located above (e.g., located at a higher position in the (+) z-axis direction) the portion of the antenna radiator (360) that overlaps the conductive connection structure (345). The overlapping area in the conductive connection structure (345) may be located behind the metal part (e.g., the shield can (440) of FIG. 4) (e.g., below in the z-axis direction) and in front of the antenna radiator (360) (e.g., above in the z-axis direction).Below, the overlap between the conductive connection structure (345) and the antenna radiator (360) is described through FIGS. 6a, 6b, 6c, 7a, 7b, and 7c.

[0058] Figures 6a, 6b, and 6c illustrate examples of electronic devices (e.g., electronic devices (100)) that include at least partially overlapping conductive connection structures (e.g., conductive connection structures (345)) and antenna radiators (e.g., antenna radiators (360)). Like reference numerals may represent like descriptions.

[0059] Referring to FIG. 6A, an example (600) illustrates an overlap between a conductive connection structure (345) and an antenna radiator (360). An example (650) illustrates components of the conductive connection structure (345). The conductive connection structure (345) may be an FPCB. The conductive connection structure (345) may include a first end (601) and a second end (602). The conductive connection structure (345) may be electrically connected to a processing circuit of a PCB (340) (e.g., a processor (1220) of FIG. 12). The first end (601) of the conductive connection structure (345) may be connected to the PCB (340). As an example, the first end (601) may include a connector. The conductive connection structure (345) may be electrically connected to a sensor circuit (380). The second end (602) of the conductive connection structure (345) may be connected to a sensor circuit (380). As an example, the second end (602) may include a connector. As a non-limiting example, the conductive connection structure (345) may further include an additional end (699). The additional end (699) may be electrically connected to another sensor circuit (e.g., a body temperature sensor).

[0060] According to one embodiment, the antenna radiator (360) may include a first end (510), a second end (520), a curved portion (530), and an outer curved portion (533). The first end (510) may be electrically connected to a feeding portion of a PCB (340) (e.g., a feeding portion (591) of FIG. 5). The second end (520) may be connected to a ground of the PCB (340) (e.g., a ground (592) of FIG. 5). The curved portion (530) and the outer curved portion (533) may be conductive portions that may be used to transmit a signal provided through the first end (510) to the outside. The curved portion (530) and the outer curved portion (533) may be radiating portions that may be spaced apart from a second surface (442) of the PCB (340) by a predetermined distance or more. For example, the antenna radiator (360) can function as a PIFA antenna. For example, the length from the second end (520) to the radiating portion (e.g., an area of ​​the outer curved portion (533) (e.g., an open point of the IFA antenna, or a maximum distance from the second end (520)) is / 4( ) can be greater than the wavelength of the signal.

[0061] In one embodiment, the conductive connection structure (345) may include a connection portion (603) between the first end (601) and the second end (602). The connection portion (603) may include a signal portion (611) and a ground portion (612). For example, the conductive connection structure (345) may include multiple layers (e.g., two layers). As an example, each layer may include a signal portion (611) and a ground portion (612). As another example, one layer may include the signal portion (611) and another layer may include the ground portion (612). The signal portion (611) may be used to transmit a signal between the processing circuit and the sensor circuit (380). The signal portion (611) may include signal lines for transmitting an electrical signal. As a non-limiting example, the signal portion (611) may be formed of a copper material. The ground portion (612) may be used to reduce electromagnetic interference and / or noise. The ground portion (612) may be arranged around the signal lines and may be used to provide stable performance of signal transmission through the signal lines. As a non-limiting example, the ground portion (612) may be formed of a copper material. The ground portion (612) may be configured to suppress noise in the signal portion (611) and reduce external electromagnetic waves that may affect the signal portion (611).

[0062] In one embodiment, the conductive connection structure (345) may include a region (613). The region (613) may be a region extending from the ground portion (612) and may correspond to a portion of the ground portion (612). When the electronic device (100) is viewed in one direction (e.g., the (-) z-axis direction), the conductive connection structure (345) including the region (613) of the ground portion (612) may overlap with the antenna radiator (360). In order to overlap with the curved portion (530) of the antenna radiator (360), the ground portion (612) of the connection portion (603) may be extended. As the ground portion (612) of the connection portion (603) extends beyond the region of the signal portion (611), the extended ground portion (612) may overlap with the curved portion (530) of the antenna radiator (360). The extended ground portion (612) may include a region that is bent along the curved portion (530) to overlap with the curved portion (530) of the antenna radiator (360). For example, at least a portion of the connection portion (603) may be arranged to overlap with an area of ​​a certain percentage or more of the curved portion (530) of the antenna radiator (360). When the electronic device (100) is viewed from the front, the connection portion (603) may be arranged in a manner that at least a portion of the connection portion (603) covers a certain percentage or more of the curved portion (530) of the antenna radiator (360). According to one embodiment, an area corresponding to the ground portion (612) among the areas overlapping with the antenna radiator (360) in the conductive connection structure (345) may be wider than an area corresponding to the signal portion (611) among the areas overlapping with the antenna radiator (360) in the conductive connection structure (345). Due to the large ground area, higher isolation performance can be provided.

[0063] Although FIG. 6A illustrates that the ground portion (612) is extended to overlap the antenna radiator (360) and the conductive connection structure (345), embodiments of the present disclosure are not limited thereto. If at least a portion of the conductive connection structure (345) for connecting the sensor circuit (380) and the PCB (340) is bent along the curved portion (530) of the antenna radiator (360), it can be understood as one embodiment of the present disclosure. In one embodiment, instead of the ground portion (612) being extended, the conductive connection structure (345) may be arranged to overlap the curved portion (530) of the antenna radiator (360). At least a portion of the connection portion (603) may be arranged to bend along the curved portion (530), without a separate extended region (e.g., region (613)). For example, the connecting portion (603) of the conductive connecting structure (345) may be arranged to overlap with the curved portion (530) of the antenna radiator (360). The size of the overlapping area of ​​the curved portion (530) may be a certain ratio or more of the curved portion (530). In one embodiment, instead of the ground portion (612) being expanded, the conductive connecting structure (345) itself may be expanded. The expansion of the conductive connecting structure (345) may be understood as an increase in the width of the conductive connecting structure (345). As the width of the conductive connecting structure (345) is increased, at least a portion of the conductive connecting structure (345) may overlap with the curved portion (530) of the antenna radiator (360). The portion overlapping with the curved portion (530) of the antenna radiator (360) may include a signal portion (611) (e.g., signal lines) and / or a ground portion (612) (e.g., a ground area). In one embodiment, a separate metal structure (e.g., LDS, metal plate, conductive tape) may be used instead of or in addition to the conductive connection structure (345).If the conductive connection structure (345) does not sufficiently overlap the curved portion (530) of the antenna radiator (360) (for example, if the curved portion (530) does not overlap by a certain percentage or more simply by arranging the conductive connection structure (345), the metal structure may be arranged to overlap the curved portion (530). The metal structure may be arranged between the metal part (440) and the curved portion (530) of the antenna radiator (360).

[0064] Referring to FIG. 6B, example (670) is a drawing looking at the rear of the electronic device (100). When the electronic device (100) is viewed in one direction (e.g., in the (-) z-axis direction), the conductive connection structure (345) may overlap with the antenna radiator (360). The area of ​​the conductive connection structure (345) overlapping with the antenna radiator (360) may be located above the area of ​​the antenna radiator (360) overlapping with the conductive connection structure (345) (e.g., located at a higher position in the (+) z-axis direction). Due to the overlapping, the radiation performance may be improved. For example, the isolation performance of the antenna radiator (360) may be improved due to the conductive connection structure (345). For example, the conductive connection structure (345) may be coupled with the antenna radiator (360). Due to the coupling, the size of the radiator may increase.

[0065] Referring to FIG. 6C, an example (690) is a side view of an electronic device (100). The electronic device (100) may include a frame (106), a PCB (340), a conductive connection structure (345), a non-conductive support portion (350), and / or a conductive rear housing (550). FIG. 6C may illustrate a cross-section of a laminated structure of the electronic device (100). The frame (106) may form a side of the electronic device (100). As an example, a first portion (106a) and a second portion (106b) of the frame (106) may represent a left side and a right side of the electronic device (100), respectively. Components of the electronic device (100) (e.g., a battery (325) or a PCB (340)) may be placed within a space formed by the frame (106). The first direction (D1) of FIG. 3 may be the (+) z-axis direction. The second direction (D2) of FIG. 3 may be the (-) z-axis direction. The PCB (340) may include a first surface (441) facing the front (e.g., a surface facing the (+) z-axis direction) and a second surface facing the rear (e.g., a surface facing the (-) z-axis direction). A non-conductive support portion (350) may be disposed below the second surface of the PCB (340). An area corresponding to the second surface of the PCB (340) (e.g., a surface facing the (-) z-axis among the surfaces of the PCB (340)) may be referred to as a rear surface area. A conductive connection structure (345), a non-conductive support portion (350), an antenna radiator (360), and a sensor circuit (380) may be disposed in the rear surface area. For example, the conductive rear housing (550) may be arranged to surround the periphery of the non-conductive support portion (350). The first portion (550a) and the second portion (550b) of the conductive rear housing (550) may correspond to the left and right sides of the non-conductive support portion (350), respectively. The antenna radiator (360) may be electrically connected to a feeding portion (591) of the PCB (340) (e.g., a feeding line connected to a wireless communication circuit).The antenna radiator (360) may be electrically connected to the ground (592) of the PCB (340) (e.g., a ground layer grounded to the frame (106)). For example, the antenna radiator (360) may function as a PIFA type antenna.

[0066] FIGS. 7A, 7B, and 7C illustrate examples of electronic devices (e.g., electronic devices (100)) including at least partially overlapping conductive connection structures (e.g., conductive connection structures (345)) and antenna radiators (e.g., antenna radiators (360)). Like reference numerals may represent like descriptions.

[0067] Referring to FIG. 7A, an example (700) illustrates an overlap between a conductive connection structure (345) and an antenna radiator (360). An example (750) illustrates components of the conductive connection structure (345). The conductive connection structure (345) may be an FPCB. The conductive connection structure (345) may include a first end (701) and a second end (702). The conductive connection structure (345) may be electrically connected to a processing circuit of a PCB (340) (e.g., a processor (1220) of FIG. 12). The first end (701) of the conductive connection structure (345) may be connected to the PCB (340). As an example, the first end (701) may include a connector. The conductive connection structure (345) may be electrically connected to a sensor circuit (380). The second end (702) of the conductive connection structure (345) can be connected to a sensor circuit (380). For example, the second end (702) can include a connector.

[0068] According to one embodiment, the antenna radiator (360) may include a first end (761), a second end (762), and a radiating portion (763). The first end (761) may be electrically connected to a feed portion of the PCB (340) (e.g., feed portion (591) of FIG. 5). For the first end (761), reference may be made to the description of the first end (510) of FIG. 5. The second end (762) may be connected to a ground of the PCB (340) (e.g., ground (592) of FIG. 5). For the second end (762), reference may be made to the description of the second end (520) of FIG. 5. The radiating portion (763) is a conductive portion that may be used to transmit a signal provided through the first end (761) to the outside. For the radiating portion (763), reference may be made to the description of the curved portion (530) of FIG. 5. The radiating portion (763) may have a curved shape in at least one area to secure an electrical length while connecting the first end (761) and the second end (762) located on one side. For example, at least a portion of the radiating portion (763) may include a 'U' shape. The radiating portion (763) may be spaced apart from the second surface (442) of the PCB (340) by a certain distance or more. For example, the antenna radiator (360) may function as a PIFA antenna. For the radiating portion (763), reference may be made to the description of the curved portion (530) and the outer curved portion (533) of FIG. 5. For example, the length from the second end (762) to an area of ​​the radiating portion (763) (e.g., the open point of the IFA antenna, or the maximum distance from the second end (762)) is approximately / 4( ) can be greater than the wavelength of the signal.

[0069] In one embodiment, the conductive connection structure (345) may include a connection portion (703) between the first end (701) and the second end (702). The connection portion (703) may include a signal portion (711) and a ground portion (712). For example, the conductive connection structure (345) may include multiple layers (e.g., two layers). As an example, each layer may include a signal portion (711) and a ground portion (712). As another example, one layer may include the signal portion (711) and another layer may include the ground portion (712). The signal portion (711) may be used to transmit a signal between the processing circuit and the sensor circuit (380). The signal portion (711) may include signal lines for transmitting an electrical signal. As a non-limiting example, the signal portion (711) may be formed of a copper material. The ground portion (712) may be used to reduce electromagnetic interference and / or noise. The ground portion (712) may be arranged around the signal lines and may be used to provide stable performance of signal transmission through the signal lines. As a non-limiting example, the ground portion (712) may be formed of a copper material. The ground portion (712) may be configured to suppress noise in the signal portion (711) and reduce external electromagnetic waves that may affect the signal portion (711).

[0070] In one embodiment, the conductive connection structure (345) may include a region (713). The region (713) may be a region extending from the ground portion (712) and may be included as a part of the ground portion (712). When the electronic device (100) is viewed in one direction (e.g., the (-) z-axis direction), the conductive connection structure (345) including the region (713) of the ground portion (712) may overlap with the antenna radiator (360). In order to overlap with the radiating portion (763) of the antenna radiator (360), the ground portion (712) of the connection portion (703) may be extended. As the ground portion (712) of the connection portion (703) extends beyond the region of the signal portion (711), the extended ground portion (712) may overlap with the radiating portion (763) of the antenna radiator (360). The extended ground portion (712) may include a region that is curved along the radiating portion (763) to overlap with the radiating portion (763) of the antenna radiator (360). For example, at least a portion of the connection portion (703) may be arranged to overlap with an area of ​​a certain percentage or more of the radiating portion (763) of the antenna radiator (360). When the electronic device (100) is viewed from the front, the connection portion (703) may be arranged such that at least a portion of the connection portion (703) covers a certain percentage or more of the radiating portion (763) of the antenna radiator (360). According to one embodiment, an area corresponding to the ground portion (712) among the areas overlapping with the antenna radiator (360) in the conductive connection structure (345) may be wider than an area corresponding to the signal portion (711) among the areas overlapping with the antenna radiator (360) in the conductive connection structure (345). Due to the wide ground area, high isolation performance can be provided.

[0071] Although FIG. 7A illustrates that the ground portion (712) is extended to overlap the antenna radiator (360) and the conductive connection structure (345), embodiments of the present disclosure are not limited thereto. If at least a portion of the conductive connection structure (345) for connecting the sensor circuit (380) and the PCB (340) is bent along the radiating portion (763) of the antenna radiator (360), it can be understood as an embodiment of the present disclosure. According to one embodiment, instead of the ground portion (712) being extended, the conductive connection structure (345) can be arranged to overlap the radiating portion (763) of the antenna radiator (360). At least a portion of the connection portion (703) can be arranged to bend along the radiating portion (763) without a separate extended area (e.g., area (713)). For example, the connecting portion (703) of the conductive connecting structure (345) may be arranged to overlap with the radiating portion (763) of the antenna radiator (360). The size of the overlapping area of ​​the radiating portion (763) may be a certain ratio or more of the radiating portion (763). In one embodiment, instead of the ground portion (712) being expanded, the conductive connecting structure (345) itself may be expanded. The expansion of the conductive connecting structure (345) may be understood as an increase in the width of the conductive connecting structure (345). As the width of the conductive connecting structure (345) is increased, at least a portion of the conductive connecting structure (345) may overlap with the radiating portion (763) of the antenna radiator (360). The portion overlapping with the radiating portion (763) of the antenna radiator (360) may include a signal portion (711) (e.g., signal lines) and / or a ground portion (712) (e.g., a ground area). In one embodiment, a separate metal structure (e.g., LDS, metal plate, conductive tape) may be used instead of or in addition to the conductive connection structure (345).If the conductive connection structure (345) does not sufficiently overlap the radiating portion (763) of the antenna radiator (360) (for example, if the radiating portion (763) does not overlap by a certain percentage or more due to the arrangement of the conductive connection structure (345), the metal structure may be arranged to overlap the radiating portion (763). The metal structure may be arranged between the metal component (440) and the radiating portion (763) of the antenna radiator (360).

[0072] Referring to FIG. 7B, an example (770) is a drawing looking at the rear of the electronic device (100). When the electronic device (100) is viewed in one direction (e.g., in the (-) z-axis direction), the conductive connection structure (345) may overlap with the antenna radiator (360). The area of ​​the conductive connection structure (345) overlapping with the antenna radiator (360) may be located above the area of ​​the antenna radiator (360) overlapping with the conductive connection structure (345) (e.g., located at a higher position in the (+) z-axis direction). Due to the overlapping, the radiation performance may be improved. For example, the isolation performance of the antenna radiator (360) may be improved due to the conductive connection structure (345). For example, the conductive connection structure (345) may be coupled with the antenna radiator (360). Due to the coupling, the size of the radiator may increase.

[0073] Referring to FIG. 7C, an example (790) is a side view of an electronic device (100). For example, the electronic device (100) may include a frame (106), a PCB (340), a conductive connection structure (345), and a non-conductive support portion (350). FIG. 7C may illustrate a cross-section of a laminated structure of the electronic device (100). The frame (106) may form a side of the electronic device (100). For example, a first portion (106a) and a second portion (106b) of the frame (106) may represent a left side and a right side of the electronic device (100), respectively. Components of the electronic device (100) (e.g., a battery (325) or a PCB (340)) may be placed within a space formed by the frame (106). The PCB (340) may include a first surface (441) facing the front (e.g., a surface facing the (+) z-axis direction) and a second surface (442) facing the rear (e.g., a surface facing the (-) z-axis direction). A non-conductive support portion (350) may be disposed below the second surface of the PCB (340). An area corresponding to the second surface of the PCB (340) (e.g., a surface facing the (-) z-axis among the surfaces of the PCB (340)) may be referred to as a rear surface area. A conductive connection structure (345), a non-conductive support portion (350), an antenna radiator (360), and a sensor circuit (380) may be disposed in the rear surface area. The antenna radiator (360) may be electrically connected to a feed portion (591) of the PCB (340) (e.g., a feed line connected to a wireless communication circuit). The antenna radiator (360) may be electrically connected to the ground (592) of the PCB (340) (e.g., a ground layer grounded to the frame (106)). For example, the antenna radiator (360) may function as a PIFA type antenna.

[0074] FIG. 8 illustrates the radiation performance of an antenna radiator (e.g., antenna radiator (360)) that at least partially overlaps a conductive connection structure.

[0075] Referring to FIG. 8, a graph (800) represents radiation efficiency with respect to frequency. The horizontal axis of the graph (800) represents frequency (unit: GHz (gigahertz)) and the vertical axis of the graph (800) represents radiation efficiency (unit: dB (decibel)). A first line (801) represents the radiation efficiency of an antenna radiator (360) without a conductive connection structure (345) and a shield can (440). A second line (802) represents the radiation efficiency of an antenna radiator (360) without a conductive connection structure (345) and with a shield can (440). A third line (803) represents the radiation efficiency of an antenna radiator (360) with a conductive connection structure (345) and a shield can (440).

[0076] Electronic components may be arranged on the second surface of the PCB (340). A shield can (440) for the electronic components may be arranged on the second surface of the PCB (340). Comparing the second line (802) and the third line (803), it can be confirmed that radiation efficiency is improved as the conductive connection structure (345) is arranged between the shield can (440) and the antenna radiator (360) according to one embodiment. Even if the shield can (440) is arranged on the second surface of the PCB (340) and the distance between the antenna radiator (360) and the shield can (440) becomes shorter, the conductive connection structure (345) is arranged between the antenna radiator (360) and the shield can (440), so that the influence of the conductive connection structure (345) by the shield can (440) can be reduced. In addition, the size of the radiator can be expanded through coupling between the conductive connection structure (345) and the antenna radiator (360), thereby improving radiation efficiency.

[0077] Although not described in FIGS. 4 to 8, the electronic device (100) may further include a switching circuit. For example, the switching circuit may be disposed on the PCB (340). The switching circuit may be configured to electrically connect one of a plurality of elements to the antenna radiator (360). The resonant frequency of the antenna radiator (360) may be changed according to a change in the matching element. Through the switching circuit (e.g., an aperture switch) connected to an end of the antenna radiator (360), the electronic device (100) may transmit a signal in a first frequency band (e.g., a cellular frequency band in a low frequency range (e.g., less than about 1 GHz), Band 14 (FDD (frequency division duplex), UL: 788-798 MHz, or DL: 758-768 MHz)) or transmit a signal in a second frequency band (e.g., GPS L5 band). For example, when a signal of the first frequency band is to be transmitted, the switching circuit may be controlled to electrically connect the first element and the antenna radiator (360). For example, when a signal of the second frequency band is to be transmitted, the switching circuit may be controlled to electrically connect the second element, which is different from the first element, and the antenna radiator (360).

[0078] FIG. 9 is a cross-sectional view of an exemplary electronic device (e.g., electronic device (100)). Like reference numerals may represent like descriptions.

[0079] Referring to FIG. 9, an example (900) is a drawing of an electronic device (100) viewed in the (-) axis direction. The electronic device (100) may include a PCB (340). The PCB (340) may include a first surface (441) (e.g., a surface facing the (+) z-axis) and a second surface (442) (e.g., a surface facing the (-) z-axis). One or more electronic components may be arranged on the first surface (441) of the PCB (340). A battery (325) may be arranged on the first surface (441) of the PCB (340). One or more electronic components may be arranged on the second surface (442) of the PCB (340). Since the space on the first surface (441) of the PCB (340) is limited, the electronic components may be arranged on the second surface (442) of the PCB (340). For example, a shield can (440) may be placed on the second side (442) of the PCB (340) to protect electronic components placed on the second side (442) of the PCB (340).

[0080] According to one embodiment, the electronic device (100) may include a conductive connection structure (345), a non-conductive support portion (350), an antenna radiator (360), and a sensor circuit (380). Although not shown in FIG. 9, the conductive connection structure (345) may be physically and electrically connected to the sensor circuit (380). For example, the sensor circuit (380) may be an HRM module disposed on the back plate (107). The sensor circuit (380) may be electrically connected to a processing circuit (e.g., a processor (1220) of FIG. 12) on the PCB (340) via the conductive connection structure (345). A portion (950) of the non-conductive support portion (350) may include a surface facing one direction (e.g., the (-) z-axis direction) for supporting the component. A portion (950) of the non-conductive support portion (350) may be disposed on an area (e.g., a rear area) facing the second surface (442) of the PCB (340). At least a portion (e.g., a radiating portion or an end of a PIFA antenna) of the antenna radiator (360) may be disposed on the surface of the portion (950) of the non-conductive support portion (350). As the distance between the antenna radiator (360) and the shield can (440) decreases, the radiation performance of the antenna radiator (360) may deteriorate. To reduce this problem, according to embodiments of the present disclosure, a conductive connection structure (345) may be disposed between the antenna radiator (360) and the shield can (440). Due to the arrangement of the conductive connection structure (345), the influence caused by the shield can (440) may be reduced. Additionally, the amount of radiation may increase due to the coupling of the conductive connection structure (345) and the antenna radiator (360).

[0081] In FIG. 9, the conductive connection structure (345) is depicted as being positioned above a portion (950) of the non-conductive support portion (350) (e.g., positioned in the (+) z-axis direction). However, the conductive connection structure (345) is required to be physically connected to the sensor circuit (380) which is positioned below a portion (950) of the non-conductive support portion (350) (e.g., positioned in the (-) z-axis direction). Accordingly, a portion of the conductive connection structure (345) may pass through a hole (not shown) of the non-conductive support portion (350). A portion of the conductive connection structure (345) may pass through the hole of the non-conductive support portion (350) and be connected to the sensor circuit (380).

[0082] Although not shown in FIG. 9, a portion of the antenna radiator (360) may pass through a hole (not shown) of the non-conductive support portion (350) to be connected to a feed portion (e.g., feed portion (591)) and a ground (e.g., ground (592)) of the PCB (340). A portion of the antenna radiator (360) may pass through the hole of the non-conductive support portion (350) and then be connected to the PCB (340) via a connecting member (e.g., a C-clip). Another portion of the antenna radiator (360) may pass through the hole of the non-conductive support portion (350) and then be connected to the PCB (340) via a connecting member (e.g., a C-clip).

[0083] Figure 10 illustrates an example of a conductive connection structure (e.g., conductive connection structure (345)) that functions as a stub. Like reference numerals may represent like descriptions.

[0084] Referring to FIG. 10, an electronic device (100) according to one embodiment may include a PCB (340), a shield can (440), a conductive connection structure (345), an antenna radiator (360), and a sensor circuit (380). A part of a user's body (1003) (e.g., a hand) may come into contact with a conductive housing that accommodates the sensor circuit (380). The conductive connection structure (345), which is a conductor located between the antenna radiator (360) and the PCB (340), may be coupled with the antenna radiator (360). Through the coupling, the conductive connection structure (345) may function as a stub circuit. Impedance matching for the antenna radiator (360) may be performed through a capacitance for coupling between the conductive connection structure (345) and the antenna radiator (360) and an inductance for the length of the conductive connection structure (345). For example, the capacitance and / or inductance may vary depending on the length, width, and / or position of the conductive connecting structure (345). Through this, an antenna can be designed that takes into account impedance matching for the antenna radiator (360).

[0085] FIGS. 11A and 11B illustrate examples of electronic devices (e.g., electronic devices (100)) including conductive plates. Like reference numerals may represent like descriptions. To improve the radiation performance of an antenna radiator (360) disposed on a rear surface of the electronic device (100) (e.g., an inner surface facing the second surface (442) of the PCB (340), coupling may be utilized. In FIGS. 4 to 10 , coupling between a conductive connection structure (345) (e.g., FPCB) connected to a sensor circuit (380) and an antenna radiator (360) is described. Since the coupling increases the area of ​​the conductor for radiation, the radiation performance is improved. This technical principle may be implemented through a separate conductive plate in addition to the conductive connection structure (345).

[0086] Referring to FIG. 11A, the electronic device (100) may include a conductive plate (1145). The antenna radiator (360) may be electrically connected to a feed portion (591) of a PCB (340) through a connecting member (1110) (e.g., a C-clip, a pogo pin, a conductive pattern, or a conductive via). The conductive plate (1145) may be electrically connected to a ground (592) of the PCB (340) through a connecting member (1120) (e.g., a C-clip, a pogo pin, a conductive pattern, or a conductive via). The conductive plate (1145) may be disposed below the antenna radiator (360) (e.g., in the (-) z-axis direction). The conductive plate (1145) may be coupled with a signal applied to the antenna radiator (360). Due to the above coupling, the conductive plate (1145) can also function as a radiator. As a non-limiting example, unlike that shown in FIG. 11A, a portion of the antenna radiator (360) can be connected to the ground of the PCB (340) via a connecting member (not shown).

[0087] Referring to FIG. 11B, the electronic device (100) may include a conductive plate (1145). The antenna radiator (360) may be electrically connected to the feed portion (591) of the PCB (340) through a connecting member (1110) (e.g., a C-clip, a pogo pin, a conductive pattern, or a conductive via). The conductive plate (1145) may not be connected to the PCB (340), but may be disposed adjacent to the antenna radiator (360) simply for coupling purposes. For example, the conductive plate (1145) may be disposed between the PCB (340) and the antenna radiator (360). The conductive plate (1145) may be coupled with a signal applied to the antenna radiator (360). Due to the coupling, the conductive plate (1145) may also function as a radiator.

[0088] Although an example in which a conductive plate (1145) is placed instead of a conductive connection structure (345) connected to a sensor circuit (380) is described in FIGS. 11A and 11B , embodiments of the present disclosure are not limited thereto. A structure in which a conductive connection structure (345) is placed between a PCB (340) and an antenna radiator (360) and additionally a conductive plate (1145) is placed adjacent to the antenna radiator (360) can also be understood as an embodiment of the present disclosure.

[0089] The electronic device (100) described above with reference to FIGS. 1 to 11b may be understood as an example of an electronic device described below. Below, possible components of the electronic device or components of an electronic device connectable to the electronic device are described with reference to FIG. 12.

[0090] Figure 12 is a block diagram of an electronic device within a network environment.

[0091] Referring to FIG. 12, in a network environment (1200), an electronic device (1201) may communicate with an electronic device (1202) via a first network (1298) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1204) or a server (1208) via a second network (1299) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1201) may communicate with the electronic device (1204) via the server (1208). According to one embodiment, the electronic device (1201) may include a processor (1220), a memory (1230), an input module (1250), an audio output module (1255), a display module (1260), an audio module (1270), a sensor module (1276), an interface (1277), a connection terminal (1278), a haptic module (1279), a camera module (1280), a power management module (1288), a battery (1289), a communication module (1290), a subscriber identification module (1296), or an antenna module (1297). In some embodiments, the electronic device (1201) may omit at least one of these components (e.g., the connection terminal (1278)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1276), camera module (1280), or antenna module (1297)) may be integrated into a single component (e.g., display module (1260)).

[0092] The processor (1220) may control at least one other component (e.g., hardware or software component) of the electronic device (1201) connected to the processor (1220) by executing, for example, software (e.g., program (1240)), and may perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1220) may store commands or data received from other components (e.g., sensor module (1276) or communication module (1290)) in volatile memory (1232), process the commands or data stored in volatile memory (1232), and store result data in non-volatile memory (1234). According to one embodiment, the processor (1220) may include a main processor (1221) (e.g., a central processing unit or an application processor) or a secondary processor (1223) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1221). For example, when the electronic device (1201) includes the main processor (1221) and the secondary processor (1223), the secondary processor (1223) may be configured to use less power than the main processor (1221) or to be specialized for a given function. The secondary processor (1223) may be implemented separately from the main processor (1221) or as a part thereof.

[0093] The auxiliary processor (1223) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1260), the sensor module (1276), or the communication module (1290)) of the electronic device (1201), for example, on behalf of the main processor (1221) while the main processor (1221) is in an inactive (e.g., sleep) state, or together with the main processor (1221) while the main processor (1221) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1223) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1280) or a communication module (1290)). In one embodiment, the auxiliary processor (1223) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1201) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1208)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0094] The memory (1230) can store various data used by at least one component (e.g., the processor (1220) or the sensor module (1276)) of the electronic device (1201). The data can include, for example, software (e.g., the program (1240)) and input data or output data for commands related thereto. The memory (1230) can include a volatile memory (1232) or a non-volatile memory (1234).

[0095] The program (1240) may be stored as software in memory (1230) and may include, for example, an operating system (1242), middleware (1244), or an application (1246).

[0096] The input module (1250) can receive commands or data to be used in a component of the electronic device (1201) (e.g., a processor (1220)) from an external source (e.g., a user) of the electronic device (1201). The input module (1250) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0097] The audio output module (1255) can output audio signals to the outside of the electronic device (1201). The audio output module (1255) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0098] The display module (1260) can visually provide information to an external party (e.g., a user) of the electronic device (1201). The display module (1260) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1260) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0099] The audio module (1270) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1270) can acquire sound through the input module (1250), output sound through the sound output module (1255), or an external electronic device (e.g., electronic device (1202)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1201).

[0100] The sensor module (1276) can detect the operating status (e.g., power or temperature) of the electronic device (1201) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1276) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0101] The interface (1277) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1201) with an external electronic device (e.g., the electronic device (1202)). In one embodiment, the interface (1277) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0102] The connection terminal (1278) may include a connector through which the electronic device (1201) may be physically connected to an external electronic device (e.g., the electronic device (1202)). According to one embodiment, the connection terminal (1278) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0103] The haptic module (1279) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1279) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0104] The camera module (1280) can capture still images and videos. According to one embodiment, the camera module (1280) may include one or more lenses, image sensors, image signal processors, or flashes.

[0105] The power management module (1288) can manage power supplied to the electronic device (1201). According to one embodiment, the power management module (1288) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0106] A battery (1289) may power at least one component of the electronic device (1201). In one embodiment, the battery (1289) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0107] The communication module (1290) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1201) and an external electronic device (e.g., electronic device (1202), electronic device (1204), or server (1208)), and the performance of communication through the established communication channel. The communication module (1290) may operate independently from the processor (1220) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1290) may include a wireless communication module (1292) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1294) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1204) via a first network (1298) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1299) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1292) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1296) to verify or authenticate the electronic device (1201) within a communication network such as the first network (1298) or the second network (1299).

[0108] The wireless communication module (1292) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1292) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1292) can support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1292) can support various requirements specified in the electronic device (1201), an external electronic device (e.g., the electronic device (1204)), or a network system (e.g., the second network (1299)). According to one embodiment, the wireless communication module (1292) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0109] The antenna module (1297) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1297) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1297) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1298) or the second network (1299), may be selected from the plurality of antennas by, for example, the communication module (1290). A signal or power may be transmitted or received between the communication module (1290) and the external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1297).

[0110] According to various embodiments, the antenna module (1297) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0111] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0112] According to one embodiment, commands or data may be transmitted or received between the electronic device (1201) and an external electronic device (1204) via a server (1208) connected to a second network (1299). Each of the external electronic devices (1202 or 104) may be the same or a different type of device as the electronic device (1201). According to one embodiment, all or part of the operations executed in the electronic device (1201) may be executed in one or more of the external electronic devices (1202, 104, or 108). For example, when the electronic device (1201) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1201) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1201). The electronic device (1201) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1201) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1204) may include an Internet of Things (IoT) device. The server (1208) may be an intelligent server utilizing machine learning and / or a neural network.In one embodiment, an external electronic device (1204) or server (1208) may be included within the second network (1299). The electronic device (1201) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0113] In the present disclosure, a PIFA type antenna using an antenna radiator (360) disposed on a rear area of ​​an electronic device (100) (e.g., an inner area facing a second surface of a PCB (340)) is described. Due to the limited space of the electronic device (100), interference problems may occur between the antenna and electronic components. To solve this problem, a conductive connection structure (345) is disposed between the antenna radiator (360) and the PCB (340), thereby improving the radiation performance of the PIFA type antenna within the limited space.

[0114] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0115] In embodiments, an electronic device (100) is provided. The electronic device (100) may include a front plate; a rear plate; a printed circuit board (PCB) (340), the PCB (340) including a first side facing the front plate and a second side facing the rear plate; a metal component (440) disposed on the second side of the PCB (340); an antenna radiator (360); a conductive connection structure (345) including a portion disposed between the metal component (440) and the antenna radiator (360); and a sensor circuit (380) connected to the conductive connection structure (345). The antenna radiator (360) may be disposed to at least partially overlap the conductive connection structure (345) when the first side or the second side of the PCB (340) is viewed. The first region of the conductive connection structure (345) that overlaps with the antenna radiator (360) may be positioned in front of the second region of the antenna radiator (360) that overlaps with the conductive connection structure (345).

[0116] For example, the conductive connection structure (345) may include a flexible printed circuit board (FPCB). The conductive connection structure (345) may include a signal portion and a ground portion. A first region of the conductive connection structure (345) that overlaps the antenna radiator (360) may include at least a portion of the ground portion.

[0117] For example, in the conductive connection structure (345), a second portion corresponding to the ground portion among the first areas overlapping with the antenna radiator (360) may be wider than a first portion corresponding to the signal portion among the first areas overlapping with the antenna radiator (360) in the conductive connection structure (345).

[0118] For example, the electronic device (100) may include a processing circuit arranged on the PCB (340). The conductive connection structure (345) may include a first end (601; 701) electrically connected to the processing circuit and a second end (602; 702) electrically connected to the sensor circuit (380).

[0119] For example, the electronic device (100) may include a non-conductive support portion (350). A portion of the antenna radiator (360) may be disposed between the non-conductive support portion (350) and the rear plate. Another portion of the antenna radiator (360) may be disposed between the non-conductive support portion (350) and the second surface of the PCB (340).

[0120] For example, the sensor circuit (380) may be positioned behind the non-conductive support portion (350). The conductive connection structure (345) may be connected to the sensor circuit (380) by passing through a hole of the non-conductive support portion (350) from the processing circuit of the PCB (340).

[0121] For example, the electronic device (100) may include a wireless communication circuit disposed on the PCB (340). The antenna radiator (360) may include a feeding portion electrically connected to the wireless communication circuit, a ground portion connected to the ground of the PCB (340), and a conductive portion disposed between the feeding portion and the ground portion. At least a portion of the conductive portion may overlap the conductive connection structure (345).

[0122] For example, the electronic device (100) may include a switching circuit disposed on the PCB (340). The switching circuit may be configured to electrically connect one of a plurality of elements to the antenna radiator (360). The plurality of elements may include a first element and a second element. The first element may be used for the antenna radiator (360) to transmit or receive a signal in a first frequency band. The second element may be used for the antenna radiator (360) to transmit or receive a signal in a second frequency band different from the first frequency band.

[0123] For example, the first frequency band may be a cellular frequency band less than about 1.2 GHz (gigahertz). The second frequency band may be an L5 band for a global positioning system (GPS).

[0124] For example, the antenna radiator (360) may be coupled with at least a portion of the conductive connection structure (345). The antenna radiator (360) may be configured to transmit or receive a signal at a frequency of Band 14.

[0125] For example, the metal component (440) may include a shield can (440). The sensor circuit (380) may be used for heart rate monitoring (HRM).

[0126] For example, the electronic device (100) may include a conductive plate. The conductive plate may be positioned between the metal component (440) and the antenna radiator (360). The conductive plate may be electrically connected to the ground of the PCB (340).

[0127] For example, the electronic device (100) may include a conductive plate. The conductive plate may be placed between the antenna radiator (360) and the rear plate of the electronic device (100).

[0128] For example, the electronic device (100) may include a non-conductive support portion (350). A first region of the conductive connection structure (345) that overlaps the antenna radiator (360) may be disposed between the non-conductive support portion (350) and the PCB (340). A second region of the antenna radiator (360) that overlaps the conductive connection structure (345) may be disposed between the non-conductive support portion (350) and the rear plate.

[0129] In embodiments, a wearable device (100) is provided. The wearable device (100) may include a front plate; a display disposed under the front plate; a printed circuit board (PCB) (340) disposed under the display, the PCB (340) including a first side facing the front plate and a second side opposite the first side; a shield can (440) disposed on the second side of the PCB (340); a printed circuit board (FPCB) including a connection portion (603; 703) disposed under the PCB (340) and connected to the PCB (340); an antenna radiator (360) connected to the PCB (340) and including a conductive portion disposed under the PCB (340); a sensor circuit (380) connected to the FPCB; and a rear plate disposed under the sensor circuit (380). The antenna radiator (360) may be positioned so as to at least partially overlap the FPCB when looking at the front of the electronic device (100). The second region of the antenna radiator (360) that overlaps the FPCB may be positioned behind the first region of the FPCB that overlaps the antenna radiator (360).

[0130] For example, the FPCB may include a signal portion and a ground portion. An area overlapping the antenna radiator (360) in the FPCB may include at least a portion of the ground portion.

[0131] For example, in the FPCB, a second portion corresponding to the ground portion among the first areas overlapping with the antenna radiator (360) may be wider than a first portion corresponding to the signal portion among the first areas overlapping with the antenna radiator (360) in the FPCB.

[0132] For example, the wearable device (100) may include a processing circuit arranged on the PCB (340). The FPCB may include a first end (601; 701) electrically connected to the processing circuit, a second end (602; 702) electrically connected to the sensor circuit (380), and a connection portion (603; 703) formed between the first end (601; 701) and the second end (602; 702).

[0133] For example, the wearable device (100) may include a non-conductive support portion (350). A portion of the antenna radiator (360) may be disposed between the non-conductive support portion (350) and the rear plate. Another portion of the antenna radiator (360) may be disposed between the non-conductive support portion (350) and the second surface of the PCB (340).

[0134] For example, the sensor circuit (380) may be positioned behind the non-conductive support portion (350). The conductive connection structure (345) may be connected to the sensor circuit (380) by passing through a hole of the non-conductive support portion (350) from the processing circuit of the PCB (340).

[0135] In embodiments, a wearable electronic device (100) is provided. The wearable electronic device (100) may include a display; a rear cover; a printed circuit board (PCB) (340) disposed between the display and the rear cover; a metal part (440) disposed on a rear surface (442) of the PCB (340); an antenna radiator (360) disposed between the PCB (340) and the rear cover; a sensor circuit (380) configured to acquire sensor data of a part of a user's body in contact with the rear cover; and a flexible printed circuit board (FPCB) (345) electrically connecting the sensor circuit (380) to the PCB (340). The antenna radiator (360) may include a first end (510; 761) connected to the antenna feed of the PCB (340), a second end (520; 762) connected to the ground of the PCB (340), and a curved portion (530; 763) formed between the first end (510; 761) of the antenna radiator (360) and the second end (520; 762) of the antenna radiator (360). The FPCB (345) may include a first end (601; 701) electrically connected to the PCB (340), a second end (602; 702) connected to the sensor circuit (380), and a connecting portion (603; 703) formed between the first end (601; 701) of the FPCB (345) and the second end (602; 702) of the FPCB (345). At least a portion of the connecting portion (603; 703) may overlap with a curved portion (530; 763) of the antenna radiator (360) and may be positioned behind the metal part (440) and in front of the antenna radiator (360).

[0136] For example, the connecting portion (603; 703) of the FPCB (345) is bent along the curved portion (530; 763) of the antenna radiator (360) so as to overlap with the curved portion (530; 763) of the antenna radiator (360).

[0137] For example, the FPCB (345) may include at least one signal line and at least one ground portion. The at least one ground portion may be formed to extend beyond the area of ​​the at least one signal line such that the at least one ground portion overlaps the curved portion (530; 763) of the antenna radiator (360).

[0138] For example, the ground area of ​​at least a portion of the connecting portion (603; 703) that overlaps the curved portion (530; 763) of the antenna radiator (360) may be wider than the signal area of ​​at least a portion of the connecting portion (603; 703) that overlaps the curved portion (530; 763) of the antenna radiator (360).

[0139] For example, the antenna radiator (360) may include an outer curved portion formed outside the curved portion (530; 763), a first leg portion, and a second leg portion. The outer curved portion may be connected to the curved portion (530; 763) through the first leg portion and the second leg portion.

[0140] For example, the wearable electronic device (100) may include a non-conductive support portion disposed between the PCB (340) and the rear cover. The sensor circuit (380) may be disposed between the non-conductive support portion and the rear cover. The FPCB (345) may be connected from the PCB (340) to the sensor circuit (380) by passing through a hole in the non-conductive support portion.

[0141] For example, a portion of the antenna radiator (360) may be positioned between the non-conductive support portion and the rear cover. Another portion of the antenna radiator (360) may be positioned between the non-conductive support portion and the rear surface of the PCB (340).

[0142] For example, the wearable electronic device (100) may include a wireless communication circuit disposed on the PCB (340). The antenna feed of the PCB (340) may be electrically connected to the wireless communication circuit. For example, the wearable electronic device (100) may further include a switching circuit disposed on the PCB (340). The switching circuit may be configured to electrically connect one of a plurality of elements to the antenna radiator (360). The plurality of elements may include a first element and a second element. The first element may be used for the antenna radiator (360) to transmit or receive a signal in a first frequency band. The second element may be used for the antenna radiator (360) to transmit or receive a signal in a second frequency band different from the first frequency band.

[0143] For example, the first frequency band may be a cellular frequency band less than about 1.2 GHz (gigahertz). The second frequency band may be an L5 band for a global positioning system (GPS).

[0144] For example, the antenna radiator (360) may be coupled with at least a portion of the conductive connection structure. The antenna radiator (360) may be configured to transmit or receive a signal at a frequency of Band 14.

[0145] For example, the metal component (440) may include a shield can. The sensor circuit (380) may be used for heart rate monitoring (HRM).

[0146] For example, the wearable electronic device (100) may include a metal structure disposed adjacent to the FPCB (345) to overlap with the antenna radiator (360). At least a portion of the metal structure may be disposed between the metal component (440) and the antenna radiator (360).

[0147] For example, the wearable electronic device (100) may include a first connection portion (603; 703) that contacts a first end (510; 761) of the antenna radiator (360) and is disposed on a rear surface (442) of the PCB (340); and a second connection portion (603; 703) that contacts a second end (520; 762) of the antenna radiator (360) and is disposed on a rear surface (442) of the PCB (340). The antenna radiator (360) may be arranged such that the first end (510; 761) and the second end (520; 762) of the antenna radiator (360) are adjacent to the first side of the wearable electronic device (100) and a portion of the curved portion (530; 763) of the antenna radiator (360) is adjacent to the second side opposite to the first side of the wearable electronic device (100).

[0148] In embodiments, an electronic device (100) is provided. The electronic device (100) includes a printed circuit board (PCB) (340) including a surface (442) facing the rear side of the electronic device (100); a metal component (440) disposed on the surface (442) of the PCB (340); an antenna radiator (360) including a first end (510; 761) connected to an antenna feed of the PCB (340), a second end (520; 762) disposed below the metal component (440) and connected to a ground of the PCB (340), and a curved portion (530; 763) formed between the first end (510; 761) of the antenna radiator (360) and the second end (520; 762) of the antenna radiator (360); A sensor circuit (380) arranged under the metal part (440) and configured to acquire sensor data of a part of a user's body that comes into contact with the rear surface of the electronic device (100); and a flexible printed circuit board (FPCB) (345) connecting the PCB (340) and the sensor circuit (380). At least a portion of the FPCB (345) may be bent along the curved portion (530; 763) of the antenna radiator (360) so as to overlap with the curved portion (530; 763) of the antenna radiator (360).

[0149] For example, the FPCB (345) may include at least one signal line and at least one ground portion. The at least one ground portion may be formed to extend beyond the area of ​​the at least one signal line such that the at least one ground portion overlaps the curved portion (530; 763) of the antenna radiator (360).

[0150] For example, the ground area of ​​at least a portion of the connecting portion (603; 703) that overlaps the curved portion (530; 763) of the antenna radiator (360) may be wider than the signal area of ​​at least a portion of the connecting portion (603; 703) that overlaps the curved portion (530; 763) of the antenna radiator (360).

[0151] For example, the electronic device (100) may include a first connection portion (603; 703) that contacts a first end (510; 761) of the antenna radiator (360) and is disposed on the surface (442) of the PCB (340); and a second connection portion (603; 703) that contacts a second end (520; 762) of the antenna radiator (360) and is disposed on the surface (442) of the PCB (340). The antenna radiator (360) may be arranged such that the first end (510; 761) and the second end (520; 762) of the antenna radiator (360) are adjacent to the first side of the wearable electronic device (100) and a portion of the curved portion (530; 763) of the antenna radiator (360) is adjacent to the second side opposite to the first side of the wearable electronic device (100).

[0152] For example, the electronic device (100) may include a non-conductive support portion. The sensor circuit (380) may be positioned between the non-conductive support portion and the rear cover. The FPCB (345) may be connected from the PCB (340) to the sensor circuit (380) by passing through a hole in the non-conductive support portion.

[0153] For example, a portion of the antenna radiator (360) may be positioned between the non-conductive support portion and the rear cover. Another portion of the antenna radiator (360) may be positioned between the non-conductive support portion and the surface of the PCB (340).

[0154] In embodiments, a wearable electronic device is provided. The wearable electronic device may include a display; a housing including a rear cover; a printed circuit board (PCB) disposed between the display and the rear cover; a metal component disposed on a rear surface of the PCB; an antenna radiator disposed between the PCB and the rear cover, the antenna radiator including a first end connected to an antenna feed of the PCB, a second end connected to a ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator, the sensor circuit configured to acquire sensor data related to a portion of a body of a user wearing the wearable electronic device; and a flexible printed circuit board (FPCB). At least a portion of the FPCB may be disposed between the antenna radiator and the metal component. The FPCB may include a first end electrically connected to the PCB, a second end connected to the sensor circuit, and a connection portion disposed between the first end of the FPCB and the second end of the FPCB. At least a portion of the above connecting portion may overlap with a curved portion of the antenna radiator.

[0155] For example, the connecting portion of the FPCB may include a curved portion shaped to overlap with the curved portion of the antenna radiator.

[0156] For example, the FPCB may include a first curved portion including at least one signal line and a ground portion, and a second curved portion including a ground portion without any signal line. The second curved portion may extend from the first curved portion and be configured to overlap the curved portion of the antenna radiator.

[0157] For example, the wearable electronic device may include a watch strap coupled to the housing, the watch strap being configured to be worn on the wrist of the user wearing the wearable electronic device. The sensor circuit may be positioned on the user's wrist through the rear cover to obtain the sensor data by transmitting or receiving light when the wearable electronic device is worn.

[0158] For example, the metal component may include a shield can. The sensor data acquired by the sensor circuit may be used for heart rate monitoring (HRM).

[0159] For one or more embodiments, at least one of the components described in one or more of the preceding drawings may be configured to perform one or more operations, techniques, processes, and / or methods as described herein. For example, a processor (e.g., a baseband processor) described herein with respect to one or more of the preceding drawings may be configured to operate according to one or more examples described herein. For another example, circuitry associated with a user equipment (UE), a base station, a network element, and the like, as described above with respect to one or more of the preceding drawings, may be configured to operate according to one or more examples described herein.

[0160] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless explicitly stated otherwise. The foregoing description of one or more implementations provides examples and descriptions, but is not intended to be exhaustive or limit the scope of the embodiments to the precise forms disclosed. Modifications and variations are possible in light of the above teachings or may be learned from practicing various embodiments.

[0161] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0162] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0163] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0164] Various embodiments of the present document may be implemented as software (e.g., a program (1240)) including one or more instructions stored in a storage medium (e.g., an internal memory (1236) or an external memory (1238)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (1220)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0165] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0166] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In wearable electronic devices, display; Housing including rear cover; A printed circuit board (PCB) positioned between the display and the rear cover; A metal component placed on the rear surface of the PCB; An antenna radiator disposed between the PCB and the rear cover, the antenna radiator including a first end connected to an antenna feed of the PCB, a second end connected to a ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator, A sensor circuit configured to acquire sensor data related to a part of a body of a user wearing the wearable electronic device; and Includes FPCB (flexible printed circuit board), At least a portion of the FPCB is disposed between the antenna radiator and the metal component, The FPCB includes a first end electrically connected to the PCB, a second end connected to the sensor circuit, and a connecting portion disposed between the first end of the FPCB and the second end of the FPCB. At least a portion of the above connecting portion overlaps with the curved portion of the antenna radiator, Wearable electronic devices.

2. In claim 1, The connecting portion of the FPCB includes a curved portion shaped to overlap with the curved portion of the antenna radiator. Wearable electronic devices.

3. In claim 1, The FPCB includes a first curved portion including at least one signal line and a ground portion and a second curved portion including a ground portion without any signal line, The second curved portion extends from the first curved portion and is configured to overlap the curved portion of the antenna radiator. Wearable electronic devices.

4. In claim 1, the ground area of ​​at least a portion of the connecting portion overlapping with the curved portion of the antenna radiator is wider than the signal area of ​​at least a portion of the connecting portion overlapping with the curved portion of the antenna radiator. Wearable electronic devices.

5. In claim 1, The antenna radiator further includes an outer curved portion formed outside the curved portion, a first leg portion, and a second leg portion, The above outer curved portion is connected through the above curved portion and the first leg portion and the second leg portion, Wearable electronic devices.

6. In claim 1, Further comprising a non-conductive support portion disposed between the PCB and the rear cover, The sensor circuit is disposed between the non-conductive support portion and the rear cover, The above FPCB is connected from the PCB to the sensor circuit through a hole in the non-conductive support portion. Wearable electronic devices.

7. In claim 6, A portion of the above antenna radiator is disposed between the non-conductive support portion and the rear cover, Another portion of the antenna radiator is disposed between the non-conductive support portion and the rear surface of the PCB. Wearable electronic devices.

8. In claim 1, Further comprising a watch strap coupled to the housing, the watch strap being configured to be worn on the wrist of the user wearing the wearable electronic device, The sensor circuit is located on the user's wrist through the rear cover to obtain the sensor data by transmitting or receiving light when the wearable electronic device is worn. Wearable electronic devices.

9. In claim 1, Further comprising a switching circuit arranged on the PCB, The above switching circuit is configured to electrically connect one of the plurality of elements to the antenna radiator, The above plurality of elements include a first element and a second element, The first element is used to transmit or receive a signal of the first frequency band by the antenna radiator, The second element is used to transmit or receive a signal of a second frequency band different from the first frequency band by the antenna radiator. Wearable electronic devices.

10. In claim 1, The above first frequency band is a cellular frequency band of less than about 1.2 GHz (gigahertz), The above second frequency band is the L5 band for GPS (global positioning system). Wearable electronic devices.

11. In claim 1, The antenna radiator is coupled with at least a portion of the conductive connecting structure, The above antenna radiator is configured to transmit or receive a signal of a frequency of Band 14. Wearable electronic devices.

12. In claim 1, The above metal part includes a shield can, The sensor data acquired by the sensor circuit is used for heart rate monitoring (HRM). Wearable electronic devices.

13. In claim 1, In order to overlap with the above antenna radiator, it further includes a metal structure placed adjacent to the FPCB, At least a portion of the metal structure is disposed between the metal component and the antenna radiator. Wearable electronic devices.

14. In claim 1, A first connecting portion that contacts the first end of the antenna radiator and is arranged on the rear surface of the PCB; and Further comprising a second connecting portion that is in contact with the second end of the antenna radiator and is arranged on the rear surface of the PCB, The antenna radiator is arranged such that the first end and the second end of the antenna radiator are adjacent to the first side of the wearable electronic device and a portion of the curved portion of the antenna radiator is adjacent to the second side of the wearable electronic device opposite to the first side. Wearable electronic devices.

15. In electronic devices, A printed circuit board (PCB) including a surface facing the rear of the electronic device; A metal component placed on the surface of the PCB; An antenna radiator disposed under the metal component, the antenna radiator including a first end connected to the antenna feed of the PCB, a second end connected to the ground of the PCB, and a curved portion formed between the first end of the antenna radiator and the second end of the antenna radiator; A sensor circuit arranged under the metal part and configured to acquire sensor data of a part of the user's body that comes into contact with the rear surface of the electronic device; and Includes a flexible printed circuit board (FPCB) connecting the PCB and the sensor circuit, At least a portion of the FPCB is bent along the curved portion of the antenna radiator so as to overlap with the curved portion of the antenna radiator. Electronic devices.

Images