Device, system and method for punching electronic components

Abstract

The invention relates to a device for punching electronic components included in a carrier with electronic components, comprising two relative displaceable press parts each carrying a punching tool part; a punching tool with two co-operating punching tool parts, wherein at least one of the at least two co-operating punching tool parts comprises a punch tool part, and wherein another of the at least two co-operating punching tool parts comprises a die tool part for supporting and holding the electronic component, whereby each of the press parts; and a position (height) adjustment for a punching tool part. The invention also relates to a system for in-line punching electronic components and to a method for punching electronic components.

Description

[0001] Device, system and method for punching electronic components

[0002] The present invention relates to a device for punching electronic components included in a carrier with electronic components, comprising; at least two press parts which are displaceable relative to each other; a guide for guiding carriers between the press parts; and a punching tool having at least two co-operating punching tool parts, whereby each of the press parts carries a punching tool part. The invention also relates to a system for in-line punching electronic components, and to a method for punching electronic components in a carrier with electronic components with such a punching device.

[0003] During the process of manufacturing electronic components, these are usually manufactured in larger units (assemblies) of joined electronic components which units subsequently are divided into smaller units of one or several individual electronic components. Electronic components are in relation to the present invention envisaged as semiconductors (chips, although LED’s are in this respect also deemed semiconductors) or other smaller passive or active electronic components. Examples of larger units with electronic components are packages with a plurality of optionally wholly or partially encapsulated electronic components placed on a carrier or strip, like for instance a leadframe. The dividing of the electronic components in smaller or individual units and / or the forming and deforming of the connections / contact elements (e.g. leads), or other leadframe parts, of the electronic component, also with the electronic components after the processing still being connected into the carrier or strip, may be realised with a process that is referred to as “punching”. In the scope of the present invention specifically also the pitch correction of electronic components in a frame by deforming parts of the frame is defined as “punching”. In a further embodiment the connection to be formed (punched) may be fixed on its outer end so that the electronic component attached to the connection will move sidewards over a certain distance (dependent on the deforming of the connection) and thus changing the pitch of electronic components in the carrier. Punching is typically realised with two punching tool parts; normally one punching tool part with one or more punches and one punching tool part forming at least one die, however the punching tool parts may also have punches and dies on both sides. While the punch / punches enter the die / dies the connections may be bent, formed and / or cut as to be formed in a desired shape and / or length.

[0004] With the present method of punching electronic components it is difficult to realise a requested high level of accuracy in the punching of electronic components due to for instance size and quality variations in the electronic components to be processed and / or variations over time in the punching equipment. According to the prior art the adjustment and / or setting of a punching device is a cumbersome and time consuming process.

[0005] The present invention has for its object to provide alternative punching equipment and an alternative method for punching electronic components that enables to enhance the punching accuracy and punching process control.

[0006] The invention provides for this purpose a device for punching electronic components included in a carrier with electronic components, comprising; at least two press parts which are displaceable relative to each other; a punching tool having at least two co-operating punching tool parts, wherein at least one of the at least two co-operating punching tool parts comprises a punch tool part, and wherein another of the at least two co-operating punching tool parts comprises a die tool part for supporting and holding the electronic component, whereby each of the press parts carries a, in particular at least one of the at least two co-operating, punching tool part; and a position (height) adjustment allocated between , in particular at least one of the at least two, a press part and a punching tool part carried by that press part. For feeding the electronic components into the punching device the punching device may also comprise a guide for guiding carriers with electronic components between the press parts. Throughout this document the “press parts” can be understood as parts that are moveable with respect to each other. It is conceivable that the press parts may be part of a bigger press, but the press parts are not limited thereto. By the inclusion of an position (height) adjustment between a press part and the punching tool part carried by that press part it is simple to adjust (the allocation of) the work range of the punching tool, also referred to as a “controlled punching stroke allocation” (as the punch(es) and counterpunch(es) may be moveable between different operative positions) without adjustment of the stroke of the press parts, of which the adjustment of the stroke is relatively complex. As an additional advantage the present invention may also enable to adjust the work range so that the punch and / or counterpunch alternatively are brought in an inoperative position. Adjustment of the working range of the punching tool according the present invention also requires only limited time as no disassembling of the punching device is required, which adds to a higher yield. Also the exchange of parts to adapt the working range of the punching tool, which was practised according to the prior art, may be limited or may even made superfluous with the present invention. Further advantages of the present invention are that (fine) adjustment of the punching tool is possible enhancing the process control and thus the quality of the punching results and that adjustment is possible while punching a single carrier with electronic components (e.g. with several punching steps on a single carrier (leadframe) while turning and / or shifting the carrier). The punching device is especially suited for a forming, trimming and / or loosening operation on (the connections or other parts of the carrier of) electronic components fed in an interconnected state or, alternatively in an individualised (singulated) state. In a common punching tool at least one punch is carried by a first press part, which at least one punch is co-operating with at least one counterpunch carried by a second press part. Typically, at least one of the at least two co-operating punching tool parts comprises a punch tool part, and wherein another of the at least two co-operating punching tool parts comprises a die tool part for supporting and holding the electronic component. The die tool part can support and hold an electronic component. The die tool part can have one or more openings. The punch tool part that is typically arranged on an opposite press part, can be at least partially accommodated in the one or more openings, in particular during a relative movement of the punch tool part and the die tool part towards each other. This allows the electronic component that is held by the die tool part to be punched, for example to process, such as to bend, the wires of that electronic component. By adjusting the allocation (of the stroke) of the punch(es) and / or the allocation of the counterpunch(es) the result of the punching process is easy influenced. For instance when the connections of an electronic component are not bent enough or when they are bent excessively the punching result of subsequent punching operations may simply be adjusted by activating the position (height) adjustment. The position (height) adjustment may allocated intermediate the first press part and the punch(es) and / or between the counterpunch(es) and the second press part dependent on the situational circumstances like for instance compensation of the variation in the dimensions of the electronic components to be punched. The position (height) adjustment may comprise plural moveable support levels, whereby the allocation of the various support levels between the first press part and the punches tool part is adjustable and preferably a single active support level of the position (height) adjustment while the other support levels are inactive. The total variation of the position (height) differences to be compensated are in the order of less than 0,2, mm or even more likely less than 0.1 mm. With plural support levels a discrete number of support levels may be referred to, but also a continuous transition of the support levels is optional. The support level steps may for instance be in the range of [0.02 - 0.07] mm. Having various support levels the adjustment may be simplified and / or standardised while there is still the flexibility to adjust in case the situation requires so. Hereby the allocation of the variable support level of the position (height) adjustment preferably is in the position between a press part and the punching tool part carried by that press part. With respect to the plural moveable support levels at least two support levels are understood, but in practise more support levels will enhance the flexibility in settings.

[0007] The at least two press parts may be - directly or indirectly - coupled with a drive for moving the press parts towards and away from each other. In the context of the present invention, a drive is to be interpreted broadly. It is conceivable that the punching device is, at least partially, arranged or placed in a bigger press unit for driving the press parts towards and away from each other. In such an embodiment, the press unit may comprise a drive, for instance an electric or hydraulic drive, that directly or indirectly (e.g. with an intermediate transmission like for instance a rod / lever system) drives the movement of the press parts.

[0008] The position (height) adjustment may comprise a rotatable rotor including the various support levels, which rotatable rotor is moveable in between a press part and the punching tool part carried by that press part such that a single variable support level is allocated between the press part and the punching tool part. Rotating a rotor is a simple action that requires only a limited (low) adjustment force and by rotating the desired support level may be selected to be brought in an “active state” between a press part and the punching tool part carried by that press part. An advantage of this embodiment is that the allocation (positioning) of the selected support level is relatively simple as only a single freedom of movement is required for the positioning of the support level (the rotational movement). Also a rotational movement is easy to be carried out manually and easy to automate. From this rotatable rotor including the various support levels the axis of rotation may be parallel and / or perpendicular to the guide for guiding carriers, ideally with the axis of rotation not loaded with the forces exerted by the punching tool parts. Such orientation facilitates a simple construction and ease of use of the rotor.

[0009] As an alternative the position (height) adjustment may comprise a slideable carriage including the various support levels, which slideable carriage is moveable in between a press part and the punching tool part carried by that press part such that a single variable support level is allocated between the press part and the punch tool part. As an alternative for a rotatable rotor also a slideable carriage may be use, which may for instance be beneficial in case of limited installation space.

[0010] Dependant on the level of automation of the punching device and the required number of varied support level settings the position (height) adjustment may be manually or mechanically moveable, or the mechanically moveable position (height) adjustment may even be controlled automatically, whereby for instance an automatic feedback system with results of performed punching operations automatically coupled back for automatically controlling the active support level of the position (height) adjustment between a press part and the punch tool part carried by that press part. An intelligent control system may be configured to use the quality information obtained during one operation performed on the carrier with electronic components to set the position (height) of the punching tool part during a first punching operation and to use the quality information obtained during another operation performed on the carrier with electronic components to set the punching tool part position (height) during a successive punching operation.

[0011] In a preferred embodiment the punching device is a unit for forming the connections or other parts of carriers of semiconductors, as such specific punching device in practise requires regular position adjustment of the punching stroke as minimal differences in the (product and / or environmental) circumstances may result in the punched carrier parts formed in inaccurate and / or unwanted shapes. A simple adjustment in the allocation of the stroke of a punching tool part enables to simply adjust the working of the punching tool and thus to control the production results (shape of the punched carrier parts).

[0012] The present invention also provides a system for in-line punching electronic components from a carrier with electronic components, comprising at least one punching device according to the present invention and as described above, and at least a loader and / or off-loader for carriers with electronic components. Such in-line punching system enables an efficient and scalable punching process for electronic components with the advantages of the punching device according to the present invention and here also included in relation to the system for in-line punching electronic components according to the present invention by reference. Such a punching system may also comprise at least one inspection unit for inspection of the punched electronic components, which enables to provide feedback on the punching quality and - if expedient - to adapt / change the position (height) of one of the punching tool parts.

[0013] The present invention furthermore provides a method for punching electronic components in a carrier with electronic components with a punching device according to the present invention and as described above, comprising the processing steps: A) moving the press parts away from each other; B) adjusting the position (height) of a punching tool part relative to the press part carrying the punching tool part by moving the position (height) adjustment allocated between the press part and the punching tool part carried by the press part; C) feeding a carrier with electronic components over a controlled distance forwards between the moved apart press parts; and D) moving the press parts towards each other such that the punches locally punch sections of the carrier with electronic components with a controlled punching stroke allocation. Hereby the position of a punching tool part relative to the press part carrying the punching tool part during an execution of step B) may be based on quality information obtained during a previous operation performed on a comparable carrier with electronic components. Also in relation to the punching method according to the present invention reference is made to the advantages mentioned above in relation to the punching device according to the present invention and here also included in relation to the punching method according to the present invention by reference. In a specific embodiment of the method according to the present invention a shifting displacement in the carrier of at least one row of electronic components may be realised during process step D) by punching of sections of the carrier with electronic components. With the local deformation of specific sections of the carrier a displacement in the plane of the carrier of one or more rows of electronic components may be realised supporting efficient and effective further processing of the carrier with electronic components (e.g. sawing). As in this process the displacement of the electronic components resulting from the punched carrier parts deformation requires a very accurate control of allocation of the punching stroke the control of the allocation of the press stroke is critical. Especially for this “in carrier electronic component displacement” the present invention is favourable.

[0014] The present invention will be further elucidated on the basis of the non-limitative exemplary embodiments shown in the following figures. Herein shows: figure 1 a schematic side view on the process of punching a connection of an electronic component; figure 2 a cross-sectional sideview of a punching device according to the invention; figure 3 a top view on the rotatable wheel that is part of the punching device as shown in figure 2; and figure 4 a cross-sectional sideview of an alternative embodiment of a punching device according to the invention; and figure 5 a cross-sectional sideview of an alternative embodiment of a punching device according to the invention.

[0015] Figure 1 shows a part of the housing 1 of an electronic component with a connection (or connection bar, or lead or any other type of carrier part) 2. On the connection 2 are two punching tools parts 3, 4 acting; a back and forward moveable (see arrow Pi) punch tool part 5 and a die tool part 6 supporting and holding the die in position while the back and forward moveable punch tool part 5 deforms the connection 2. As the connection 2 on its outer end is held by the die tool part 6 the housing 1 of the electronic component will move towards (see arrow P2) clamped outer end of the connection 2 during the deformation of the connection 2. Figure 2 shows a cross-sectional sideview of a punching device 10 according to the invention in an opened position wherein a connection 11 of an electronic component 12 is not punched yet. The punching device 10 has two relative displaceable press parts 13, 14 (here and upper press part 13 and a lower press part 14) at least one of the press parts 13, 14 being moveable by a drive unit (not shown here) moving the press parts 13, 14 towards and away from each other. The upper press part 13 carries a punching tool part 15 (the punch) and the lower press part 14 carries also a punching tool part 16 (the die). Both the punching tool parts 15, 16 are cooperating as demonstrated in figure 1 . Between the (upper) press part 13 and the punching tool part 15 (the punch) carried by the (upper) press part 13 is a position (height) adjustment 17 allocated, here in the embodiment of a rotatable (see arrow P3) wheel 18. Only a segment of the wheel 18 supports the punching tool part 15 and these segments have various heights. By rotating the wheel 18 the height of the active (supporting) wheel segment may be varied and thus the support level is varied. By varying the support level of the punching tool part 15 also the working range of the punching tool 15 is varied.

[0016] Figure 3 shows a top view on the rotatable wheel 15 as shown in figure 2 the wheel is divided in multiple (here ten) segments 19 with variable heights. The heights of the various wheel segments 19 is displayed by a number indicating the difference in height (in mm) relative to the starting segment indicating 0.

[0017] Figure 4 shows a cross-sectional sideview through an alternative embodiment of a punching device 20 according to the invention in an opened position wherein the technical features that are identical to the corresponding features of the embodiment shown in figure 2 have identical reference numbers. Also here the punching device 10 has two displaceable press parts 13, 14 whereby the upper press part 13 carries punching tool part 15 (the punch) and the lower press part 14 carries punching tool part 16 (the die). Between the upper press part 13 and the punching tool part 15 is a position (height) adjustment 21 allocated, here in the embodiment of a vertical rotatable (see arrow P4) wheel 22 whereby the height of the wheel 22 (that is the distance of the axis of rotation of the wheel 22 to the position where the rotatable wheel 22 supports the punching tool part 15 varies. Different from the embodiment of the punching device 10 shown in figure 2 is the orientation of the wheel 22 here vertical while the wheel 18 in figure 2 is horizontal oriented. The axis of rotation of the wheel 22 in Figure 2 may be seen substantially vertical, in particular parallel to a moving direction of the press parts 13,14. The axis of rotation of wheel 18 of Figure 4 may be seen a substantially horizontal, in particular perpendicular to a moving direction of the press parts.

[0018] Figure 5 shows a cross-sectional sideview through an alternative embodiment of a punching device 30 according to the invention in an opened position wherein the technical features that are identical to the corresponding features of the embodiment shown in figure 4 have identical reference numbers. Also here the punching device 30 has two displaceable press parts 13, 14 whereby the upper press part 13 carries punching tool part 15 (the punch) and the lower press part 14 carries punching tool part 16 (the die). Between the upper press part 13 and the punching tool part 15 is a position (height) adjustment 21 allocated. The position (height) adjustment 21 comprises two slidable carriages 27. Alternatively, it is conceivable that one or more than two slidable carriages 27 are implemented. The slidable carriages 27 have various support levels 31 . The slidable carriages 31 are relatively moveable with respect to each other in a back and forth movement (indicated by arrow P5). Such a movement adjusts the position (height) of at least one of the punching tool parts 15 with respect to the press part 13 carrying that punching tool 15. In order to process the electronic components 30 between the two co-operating punch tool parts 15, 16, the electronic components 30 are forwarded between said punch tool parts 15, 16 by a guide 28 that can guide the carriers 29 with electronic components 32 between the press parts 13, 14.

Claims

Claims1 . Device for punching electronic components included in a carrier with electronic components, comprising; at least two press parts which are displaceable relative to each other; a punching tool having at least two co-operating punching tool parts, wherein at least one of the at least two co-operating punching tool parts comprises a punch tool part, and wherein another of the at least two cooperating punching tool parts comprises a die tool part for supporting and holding the electronic component, whereby each of the press parts carries a punching tool part; and a position (height) adjustment allocated between a press part and a punching tool part carried by that press part.

2. Punching device according to claim 1 , characterised in that the position (height) adjustment comprises plural moveable support levels, whereby the allocation of the various support levels between the press part and the punching tool part is adjustable.

3. Punching device according to claim 2, characterised in that the position (height) adjustment comprises a rotatable rotor including the various support levels, which rotatable rotor is moveable in between a press part and the punching tool part carried by that press part such that a single variable support level is allocated between the press part and the punching tool part.

4. Punching device according to claim 3, characterised in that the axis of rotation of the rotatable rotor including the various support levels is parallel to the guide for guiding carriers.

5. Punching device according to claim 3, characterised in that the axis of rotation of the rotatable rotor including the various support levels is perpendicular to the guide for guiding carriers.

6. Punching device according to claim 2, characterised in that the position (height) adjustment comprises a slideable carriage including the various support levels, which slideable carriage is moveable in between a press part and the punching tool part carried by that press part such that a single variable support level is allocated between the press part and the punch tool part.

7. Punching device according to any of the claims 2 - 6, characterised in that the position (height) adjustment is manually moveable.

8. Punching device according to any of the claims 2 - 6, characterised in that the position (height) adjustment is mechanically moveable.

9. Punching device according to claim 8, characterised in that the mechanically moveable position (height) adjustment is automatically controlled.

10. Punching device according to any of the preceding claims, characterised in that the punching device is a unit for positioning the connections of semiconductors.11 . System for in-line punching electronic components within a carrier with electronic components, comprising at least one punching device according to any of the preceding claims, and at least a loader and / or off-loader for carriers with electronic components.

12. System for in-line punching electronic components according to claim 10, characterised in that the system also comprises at least one inspection unit for inspection of the punched electronic components.

13. Method for punching electronic components in a carrier with electronic components with a punching device according to any of the claims 1 - 10, comprising the processing steps:A) moving the press parts away from each other;B) adjusting the position (height) of a punching tool part relative to the press part carrying the punching tool part by moving the position (height)adjustment allocated between the press part and the punching tool part carried by the press part;C) feeding a carrier with electronic components over a controlled distance forwards between the moved apart press parts; and D) moving the press parts towards each other such that the punches locally punch sections of the carrier with electronic components with a controlled punching stroke allocation.

14. Method according to claim 13, characterised in that the position (height) of a punching tool part relative to the press part carrying the punching tool part during an execution of step B) is based on quality information obtained during a previous operation performed on a comparable carrier with electronic components.

15. Method according to claim 13 of 14, characterised in that during process step D) the punching of sections of the carrier with electronic components cause a shifting displacement in the carrier of at least one row of electronic components.

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