Flexible, customized 3D heat pipe, preparation method therefor, and use thereof

By using flexible, customized 3D heat pipes and photopolymerization 3D printing technology to manufacture flexible shells and liquid wicks, the problem of insufficient heat management of traditional heat pipes in complex electronic devices is solved, achieving efficient and low-cost three-dimensional heat transfer.

WO2026016404A1PCT designated stage Publication Date: 2026-01-22XIAMEN UNIV
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Patent Information

Application Number
PCT/CN2024/140193
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-19
Filing Date
2024-12-18
Publication Date
2026-01-22

AI Technical Summary

Technical Problem

Existing heat pipe technology struggles to achieve effective heat management in complex electronic devices, especially in complex electronic devices such as AR/VR devices, where traditional heat pipes cannot effectively manage heat to the space outside the plane where the electronic components are located.

Method used

The flexible, customized 3D heat pipe, consisting of a flexible shell and a liquid wick, is manufactured using photopolymerization 3D printing technology. The working fluid flows within the flexible shell, while the flexible liquid wick absorbs and transfers heat through capillary action, adapting to any three-dimensional path of electronic devices.

Benefits of technology

It enables efficient heat transfer to any area of ​​electronic devices without occupying additional space, reducing the weight and cost of heat pipes and increasing design freedom.

✦ Generated by Eureka AI based on patent content.

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    Figure CN2024140193_22012026_PF_FP_ABST
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Abstract

The present application discloses a flexible, customized 3D heat pipe, a preparation method therefor, and a use thereof. Part of a customized 3D heat pipe is in contact with a control chip to absorb heat generated by the control chip, the remaining part of the customized 3D heat pipe can be laid along any three-dimensional path of an electronic device according to requirements, and then the heat accumulated by the control chip is transferred to any space region in the electronic device where the customized 3D heat pipe is laid. The heat dissipation area of the heat pipe is maximized without affecting the volume of the electronic device and the mounting space of other components, and compared with a conventional 2D flat heat pipe, more efficient thermal management of the electronic device can be achieved.
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Description

Flexible customized 3D heat pipe and preparation method and application thereof TECHNICAL FIELD

[0001] The application belongs to the technical field of two-phase circulation heat management devices, and particularly relates to a flexible customized 3D heat pipe and a preparation method and application thereof. BACKGROUND

[0002] Most of the emerging electronic devices have the characteristics of small size, high integration and irregular shape, so that most heat management schemes are difficult to be directly applied due to limited installation space. The heat pipe technology has become the mainstream heat dissipation scheme for solving the problem of high heat flux density of small electronic devices due to its small space ratio, high heat transfer efficiency and low application cost.

[0003] However, due to the device requirement of high sealing of the heat pipe, the complexity and customization of the form pose great challenges to the sealing processing of the heat pipe, which makes most of the micro heat pipes maintain a simple geometric shape of one dimension and two dimensions. Although significant application has been achieved in the application of smart phones, notebook computers and other flat devices, in more electronic equipment with complex form such as AR / VR eyes and cameras, heat management can only be managed within the plane where the electronic components are located, and there is still a great space for heat distribution.

[0004] Additive manufacturing technology is one of the effective solutions to the customization problem. Most studies focus on using additive manufacturing characteristics to manufacture wick structures with controllable capillary characteristics, and limited studies directly form complete structures including shells and wicks. The device characteristics of the heat pipe require the manufacturing process to meet the characteristics of strong sealing, high thermal conductivity, low cost and light weight. However, under the technical limitations of SLM at the present stage, the heat management device manufactured by SLM technology has a cost and weight that exceeds the electronic equipment itself, which is unacceptable. SUMMARY

[0005] The purpose of the present application is to provide a flexible customized 3D heat pipe and a preparation method and application thereof, wherein the customized 3D heat pipe can be laid along any three-dimensional path of the electronic equipment as needed, and the space of the electronic equipment is fully utilized for heat management.

[0006] The technical scheme of the present application is as follows:

[0007] A flexible customized 3D heat pipe is arranged in an electronic equipment and partially contacts a control chip of the electronic equipment, and comprises a flexible shell, a flexible wick and a working medium.

[0008] The working medium flow channel is formed in the flexible shell, and the flexible wick is arranged in the working medium flow channel. In any cross section of the working medium flow channel perpendicular to the extension direction thereof, the flexible wick respectively contacts the top surface and the bottom surface of the working medium flow channel.

[0009] The working medium flows in the working medium flow channel, the flexible wick absorbs the liquid working medium by capillary action, the liquid working medium absorbs the heat dissipated by the control chip, evaporates into gaseous state, and then dissipates heat through the top surface and the bottom surface of the working medium flow channel to condense into liquid state and return to the flexible wick.

[0010] In some possible implementation manners, the cross section of the flexible wick perpendicular to the extending direction of the flexible wick is a periodic function curve, and the periodic function is a trigonometric function, a polynomial function or a Gaussian function.

[0011] In some possible implementation manners, the wavelength of the periodic function is 0.1-2.5 mm, and the amplitude of the periodic function is 0.05-0.75 mm.

[0012] The width of the working medium flow channel is 5-40 mm, and the height of the working medium flow channel is 0.1-1.5 mm.

[0013] In some possible implementation manners, the material of the flexible wick is a hydrophilic treated copper wire mesh, a stainless steel wire mesh or a Fe-Cr-Al wire mesh.

[0014] The flexible shell is composed of two polymer layers and a metal layer arranged between the two polymer layers, the material of the metal layer is copper, aluminum or stainless steel, and the material of the polymer layer is low-density polyethylene terephthalate, polypropylene or polyethylene.

[0015] In some possible implementation manners, the flexible wick is obtained by stacking and pressing a plurality of layers of hydrophilic treated copper wire mesh, stainless steel wire mesh or Fe-Cr-Al wire mesh.

[0016] The method of hydrophilic treatment is a coating method, an anodic oxidation method or a chemical deposition method.

[0017] The working medium of the customized 3D heat pipe is not limited in the application, and any working medium commonly used by those skilled in the art and not reacting with the flexible wick and the flexible shell can be selected. For example, the working medium can be selected from at least one of deionized water, ethanol and methanol.

[0018] A preparation method of the customized 3D heat pipe is provided, and the preparation method comprises the following steps:

[0019] (1) converting a target model into point cloud data, and then planning a shape trajectory of the customized 3D heat pipe along a two-phase circulation direction of the customized 3D heat pipe according to the point cloud data;

[0020] The flexible shell is sealed by covering the upper shell and the lower shell, and the upper shell and the lower shell form two ports after being covered, and the upper shell and the lower shell are respectively provided with seal edges capable of being heat-sealed at corresponding positions of the outer edges except the ports.

[0021] The morphological trajectory includes a sealing edge and a region of curvature discontinuity of the customized 3D heat pipe;

[0022] (2) Extracting three-dimensional point coordinates in the morphological trajectory, generating a three-dimensional surface from three-dimensional sheets along adjacent morphological trajectories in three-dimensional modeling software, converting the three-dimensional surface into a two-dimensional unfolded plane through a two-dimensional mapping algorithm, and then preparing an upper shell sheet, a lower shell sheet, a liquid absorption core sheet, and a flexible heater with the same shape as the sealing edge along the two-dimensional unfolded plane;

[0023] (3) Generating a three-dimensional model of a shaping mold of the flexible liquid absorption core and a three-dimensional model of a pre-sealing mold of the customized 3D heat pipe in combination with the three-dimensional surface and the morphological trajectory, and then printing the shaping mold and the pre-sealing mold through a light-cured 3D printing technology;

[0024] The shaping mold includes a shaping upper mold and a shaping lower mold, and the middle part of the mating surface of the shaping upper mold and the shaping lower mold is the same as the shape of the flexible liquid absorption core;

[0025] The pre-sealing mold includes a pre-sealing upper mold and a pre-sealing lower mold, and the middle part of the mating surface of the pre-sealing upper mold and the pre-sealing lower mold is the same as the shape of the customized 3D heat pipe;

[0026] (4) Stacking multiple liquid absorption core sheets between the shaping upper mold and the shaping lower mold, and the mating surface of the shaping upper mold and the shaping lower mold applies a normal force to the liquid absorption core sheet to obtain a three-dimensional liquid absorption core, and then performing hydrophilic treatment on the three-dimensional liquid absorption core to obtain a flexible liquid absorption core;

[0027] (5) Stacking the pre-sealing upper mold, the flexible heater, the upper shell sheet, the flexible liquid absorption core, the lower shell sheet, and the pre-sealing lower mold in sequence, and the mating surface of the pre-sealing upper mold and the pre-sealing lower mold applies a normal force to the upper shell sheet and the lower shell sheet, and heats the flexible heater to seal the sealing edge to obtain a pre-sealing heat pipe, and the outer edge of the pre-sealing heat pipe not sealed by the sealing edge forms two ports;

[0028] (6) Processing one of the ports as a drainage port, and then sealing the other port, vacuumizing and filling the working medium through the port processed as the drainage port, and finally sealing the port processed as the drainage port to obtain the customized 3D heat pipe.

[0029] In the above steps, step (1) is performed by a three-dimensional data processing software, step (2) is performed by a three-dimensional modeling software, and step (3) is performed by a computer-aided design software. The present application does not limit the software and algorithms used in the preparation method, as long as the corresponding functions can be achieved. Exemplarily, the three-dimensional data processing software can be MeshLab, CloudCompare, Autodesk Recap or Blender; the three-dimensional modeling software can be Matlab, Autodesk 3ds Max or Rhinoceros; the two-dimensional mapping algorithm can be the minimum energy unfolding method, conformal mapping method or equidistant mapping method; and the computer-aided design software can be Solidworks, UG or Catia.

[0030] In some possible implementations, the light-curing 3D printing technology is stereolithography (SLA), digital light processing (DLP), continuous liquid interface production (CLIP) or mask stereolithography (MSLA).

[0031] In some possible implementations, the materials of the shaping mold and the pre-packaging mold are independently selected from epoxy-based resin, phenolic-based resin or ceramic-based resin.

[0032] In some possible implementations, the operation of applying a normal force to the liquid absorption chip by matching the upper shaping mold and the lower shaping mold is as follows: the upper shaping mold and the lower shaping mold are matched and locked by bolts and nuts, and then are left to stand for 30 seconds to 30 minutes.

[0033] The operation of applying a normal force to the upper shell sheet and the lower shell sheet by matching the upper pre-packaging mold and the lower pre-packaging mold is as follows: the upper pre-packaging mold and the lower pre-packaging mold are matched and locked by bolts and nuts, and then are left to stand for 30 seconds to 30 minutes.

[0034] In some possible implementations, the specific operation of the drainage port processing is as follows: a copper pipe is arranged on the port by hot pressing.

[0035] In some possible implementations, the morphological trajectory is arranged along the contour of the electronic device.

[0036] In some possible implementations, the method for preparing the upper shell sheet, the lower shell sheet, the liquid absorption chip and the flexible heater with the same shape as the sealing edge along the two-dimensional development plane is prepared by a planar cutting process, which can be laser cutting, die cutting or knife cutting.

[0037] In some possible implementations, the flexible heater is in the shape of a long strip, which is a carbon cloth heater or a polyimide heater.

[0038] An electronic device comprising the customized 3D heat pipe and dissipating heat through the customized 3D heat pipe.

[0039] The customized 3D heat pipe can be used for heat dissipation of any electronic device, and is particularly suitable for some emerging electronic devices with complex configurations, such as VR headsets, AR glasses, cameras and drones.

[0040] The present application has at least the following beneficial effects:

[0041] 1. The customized 3D heat pipe of the present application is in contact with the control chip to absorb the heat generated by the control chip. The remaining part of the customized 3D heat pipe can be laid along any three-dimensional path of the electronic device as needed, and then the heat accumulated by the control chip is transferred to any spatial region of the electronic device where the customized 3D heat pipe is laid. Without affecting the volume of the electronic device and the installation space of other components, the heat dissipation area of the customized 3D heat pipe is maximized, and compared with the traditional 2D flat heat pipe, more efficient space heat management of the electronic device can be achieved.

[0042] 2. In some possible implementations, the customized 3D heat pipe of the present application comprises a flexible wick of metal and a flexible shell composed of a metal layer and a polymer layer. The wall thickness of the traditional metal heat pipe is mostly in millimeter level to ensure the sealing performance of the heat pipe, resulting in a relatively large overall quality. However, the composite film of the present application introduces a polymer layer (made of high-temperature-resistant plastic) to ensure the sealing performance while greatly reducing the quality of the customized 3D heat pipe, improving the flexibility of the customized 3D heat pipe and reducing the cost, so that it is possible to manufacture the customized 3D heat pipe with complex shape by 3D printing technology.

[0043] 3. The preparation method of the present application prints the plastic shaping mold and the pre-sealing mold by light-cured 3D printing technology, and then uses the plastic shaping mold and the pre-sealing mold to realize the plastic shaping of the flexible wick and the pre-sealing of the customized 3D heat pipe. Compared with the mainstream technical solution of directly using SLM for heat pipe printing, the use cost of 3D printing technology is reduced, the cost of materials is reduced, the quality of the customized 3D heat pipe is reduced, the design freedom is improved, and the cost required for customization is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0044] Fig. 1 is a VR headset device and a customized 3D heat pipe for the VR headset device;

[0045] Fig. 2 is a structure schematic view of the cross section of the customized 3D heat pipe perpendicular to its extension direction;

[0046] Fig. 3 is a plastic shaping assembly drawing of the flexible wick;

[0047] Fig. 4 is an assembly drawing when preparing a pre-sealing heat pipe;

[0048] Fig. 5 is a comparison diagram of heat dissipation effects of the customized 3D heat pipe and the traditional heat pipe in the VR head-mounted device.

[0049] Reference signs: 1 - customized 3D heat pipe; 11 - flexible shell; 111 - working fluid flow channel; 12 - flexible wick; 21 - shaping upper mold; 22 - shaping lower mold; 23 - wick sheet; 31 - pre-encapsulation upper mold; 32 - pre-encapsulation lower mold; 33 - flexible heater; 34 - upper shell sheet; 35 - lower shell sheet; 41 - screw hole; 42 - nut; 43 - bolt; 5 - VR head-mounted device; 51 - body; 52 - fixing band. DETAILED DESCRIPTION

[0050] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described in more detail below with reference to the drawings and specific embodiments, but the protection scope of the present application is not limited to these embodiments. The same reference signs in the text always represent the same elements, and similar reference signs represent similar elements.

[0051] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", "vertical", "top", "bottom", "inner" and "outer" and the like indicate the orientation or positional relationship shown in the perspective view in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0052] The shaping upper mold 21, the shaping lower mold 22, the pre-encapsulation upper mold 31, the pre-encapsulation lower mold 32, the flexible heater 33, the upper shell sheet 34, the lower shell sheet 35 and the flexible wick 12 in Fig. 4 and Fig. 5 are in the shape of long wavy lines, which is only to show that the above-mentioned elements can be designed into any shape as needed, and not to limit the shape of the above-mentioned elements.

[0053] The technical solutions of the present application will be further described and explained below through examples.

[0054] Example 1

[0055] In this embodiment, a customized 3D heat pipe 1 for a VR head-mounted device 5 is prepared, the VR head-mounted device 5 includes a body 51 and a fixing band 52, and the body 51 is provided with a control chip. As can be seen from Fig. 1, the shape of the customized 3D heat pipe 1 is partly fitted with the body 51, and a large part of the shape is the same as that of the fixing band 52. In actual assembly, part of the customized 3D heat pipe 1 is arranged in the body 51 and in contact with the control chip, and the remaining part is arranged in the fixing band 52 to maximize the space for heat management.

[0056] As shown in FIG. 2, the flexible customized 3D heat pipe 1 comprises a flexible shell 11, a flexible wick 12 and a working fluid (not shown in the figure); the working fluid flow channel 111 is formed in the flexible shell 11, and the flexible wick 12 is arranged in the working fluid flow channel 111; in any cross section of the working fluid flow channel 111 perpendicular to the extending direction thereof, the flexible wick 12 is in contact with the top surface and the bottom surface of the working fluid flow channel 111 respectively; the working fluid flows in the working fluid flow channel 111; the flexible wick 12 absorbs the liquid working fluid by capillary action; the liquid working fluid absorbs the heat generated by the chip, evaporates into gaseous state, and then dissipates heat through the top surface and the bottom surface of the working fluid flow channel 111 to condense into liquid state and return to the flexible wick 12. The above arrangement realizes the gas-liquid coplanar two-phase circulation of the working fluid, so that the customized 3D heat pipe 1 has a smaller thickness.

[0057] Specifically, in the embodiment, the cross section of the flexible wick 12 is a curve of a polynomial function, the period of the polynomial function is 1.5 mm, and the amplitude is 0.5 mm (the thickness of the flexible wick 12 is twice the amplitude, i.e. 1 mm).

[0058] In the embodiment, the flexible shell 11 is a metal plastic film material composed of two polymer layers and a metal layer sandwiched between the two polymer layers, wherein the material of the polymer layer is polypropylene, and the material of the metal layer is aluminum; the flexible wick 12 is a multi-layer self-supporting copper wire mesh subjected to hydrophilic treatment.

[0059] The preparation method of the customized 3D heat pipe 1 in the embodiment comprises the following steps:

[0060] (1) importing the target three-dimensional model in STL format into a three-dimensional data processing software, converting the target model into point cloud data by the three-dimensional data processing software, and then planning the morphological trajectory of the customized 3D heat pipe 1 along the two-phase circulation direction of the customized 3D heat pipe 1 according to the point cloud data;

[0061] The flexible shell 11 of the customized 3D heat pipe 1 comprises an upper shell and a lower shell (not shown in the figure) which are overlapped and sealed, and the upper shell and the lower shell form two ports (not shown in the figure) after being overlapped, and the upper shell and the lower shell are respectively provided with sealing edges which can be heat-sealed at the corresponding positions of the outer edges thereof except the ports;

[0062] The morphological trajectory comprises the sealing edges and the regions with sudden changes in curvature of the customized 3D heat pipe 1.

[0063] In the above steps, the three-dimensional data processing software is CloudCompare.

[0064] (2) Extract the three-dimensional point coordinates in the morphological trajectory, generate a three-dimensional surface from the three-dimensional sheet along the adjacent morphological trajectory in the three-dimensional modeling software, convert the three-dimensional surface into a two-dimensional unfolded plane through a two-dimensional mapping algorithm, and then cut the upper shell sheet 34, the lower shell sheet 35, the liquid absorption core sheet 23, and the flexible heater 33 with the same shape as the sealing edge along the two-dimensional unfolded plane by laser cutting. In this embodiment, the flexible heater 33 is a carbon cloth heater, which generates heat by applying a voltage to the flexible heater 33.

[0065] In the above steps, the three-dimensional modeling software is Matlab, and the two-dimensional mapping algorithm is the conformal mapping method.

[0066] (3) Generate a three-dimensional model of the shaping mold of the flexible liquid absorption core 12 and a three-dimensional model of the pre-packaging mold of the customized 3D heat pipe 1 in the computer-aided design software combined with the three-dimensional surface and the morphological trajectory, and then print the shaping mold and the pre-packaging mold by the light-cured 3D printing technology;

[0067] Among them, the shaping mold includes a shaping upper mold 21 and a shaping lower mold 22, and the middle part of the mating surface of the shaping upper mold 21 and the shaping lower mold 22 is the same as the shape of the flexible liquid absorption core 12;

[0068] The pre-packaging mold includes a pre-packaging upper mold 31 and a pre-packaging lower mold 32, and the middle part of the mating surface of the pre-packaging upper mold 31 and the pre-packaging lower mold 32 is the same as the shape of the customized 3D heat pipe 1;

[0069] In the above steps, the computer-aided design software is Solidworks, the light-cured 3D printing technology is digital light processing, and the material of the shaping mold and the pre-packaging mold is phenolic-based high-temperature-resistant photosensitive resin.

[0070] (4) Stack multiple liquid absorption core sheets 23 between the shaping upper mold 21 and the shaping lower mold 22, and the mating surface of the shaping upper mold 21 and the shaping lower mold 22 applies a normal force to the liquid absorption core sheet 23 to obtain a three-dimensional liquid absorption core, and then performs hydrophilic treatment on the three-dimensional liquid absorption core to obtain a flexible liquid absorption core 12;

[0071] (5) Stack the pre-packaging upper mold 31, the flexible heater 33, the upper shell sheet 34, the flexible liquid absorption core 12, the lower shell sheet 35, and the pre-packaging lower mold 32 in sequence, and the mating surface of the pre-packaging upper mold 31 and the pre-packaging lower mold 32 applies a normal force to the upper shell sheet 34 and the lower shell sheet 35, and heats the flexible heater 33 to seal the sealing edge to obtain a pre-packaged heat pipe, and the outer edge of the pre-packaged heat pipe not sealed by the sealing edge forms two ports;

[0072] (6) draining the one port, then sealing the other port, vacuumizing and filling the pre-packaged heat pipe from the drained port, and finally sealing the drained port to obtain the customized 3D heat pipe 1.

[0073] Steps (4) and (5) are further described below with reference to FIGS. 3 and 4.

[0074] Firstly, referring to FIG. 3, the mating surfaces of the upper and lower shaping molds 21 and 22 have periodic profiled surfaces obtained by scanning a periodic function along a planned trajectory, the periodic function having a period of 1.5 mm and an amplitude of 0.5 mm, and the non-mating surfaces of the upper and lower shaping molds 21 and 22 are straight lines forming free surfaces scanned along the planned trajectory. The upper and lower shaping molds 21 and 22 are provided with screw holes 41 on both sides thereof along the extending direction thereof, which are matched with each other, and the upper and lower shaping molds 21 and 22 can be locked by bolts 43 and nuts 42.

[0075] The liquid-absorbing chip material 23 is placed between the upper and lower shaping molds 21 and 22, and then the nuts 42 are sequentially screwed into the screw holes 41 on the upper and lower shaping molds 21 and 22, and the upper and lower shaping molds 21 and 22 are locked by the bolts 43 and nuts 42 to apply a normal force to the liquid-absorbing chip material 23. After 2 minutes, the bolts 43 and nuts 42 are loosened, and the liquid-absorbing chip material 23 is shaped by the upper and lower shaping molds 21 and 22 to obtain a three-dimensional liquid-absorbing core having a periodic profiled surface. The three-dimensional liquid-absorbing core is subjected to hydrophilic treatment to obtain the flexible liquid-absorbing core 12.

[0076] As shown in FIG. 4, the mating surfaces of the upper and lower pre-packaging molds 31 and 32 are formed with a curved rectangular groove extending along a planned trajectory in the middle part thereof, and the upper and lower pre-packaging molds 31 and 32 are formed with contact surfaces contacting each other on both sides thereof along the extending direction thereof, the curved rectangular groove has a width of 15 mm and a height of 1 mm, and the non-mating surfaces of the upper and lower pre-packaging molds 31 and 32 are straight lines forming free surfaces scanned along the planned trajectory. The upper and lower pre-packaging molds 31 and 32 are provided with screw holes 41 on the contact surfaces thereof, which are matched with each other, and the upper and lower pre-packaging molds 31 and 32 can be locked by bolts 43 and nuts 42.

[0077] The upper and lower shell materials 34 and 35 have a width slightly larger than that of the curved rectangular groove, so that the portions of the upper shell material 34 on both sides thereof as sealing edges of the upper shell do not enter the curved rectangular groove and do not contact the screw holes 41, and the lower shell is the same.

[0078] The pre-packaged upper mold 31, the flexible heater 33, the upper shell sheet 34, the flexible wick 12, the lower shell sheet 35 and the pre-packaged lower mold are stacked in sequence, wherein the shape and position of the flexible heater 33 correspond to the sealing edge, then the nut 42 is sequentially threaded through the pre-packaged upper mold 31 and the pre-packaged upper mold 31, and the bolt 43 and the nut 42 are locked by cooperation to apply a normal force to the upper shell sheet 34 and the lower shell sheet 35, the bolt 43 and the nut 42 are loosened after standing for 15 min, and the upper shell sheet 34 and the lower shell sheet 35 are shaped to form an upper shell and a lower shell, and a working fluid flow groove containing the flexible wick 12 is formed between the upper shell and the lower shell. Then the sealing edge of the upper shell sheet 34 and the lower shell sheet 35 is sealed by heating the flexible heater 33, and a pre-packaged heat pipe is obtained, and the side edges of the pre-packaged heat pipe are sealed except for two ports.

[0079] One of the ports is treated as a drain port, and the other port is sealed, the pre-packaged heat pipe is vacuumed and filled with working fluid through the drain port treated port, and finally the drain port treated port is sealed, that is, the customized 3D heat pipe 1 of the embodiment is obtained.

[0080] Figure 5 is a comparison diagram of the heat dissipation effect of the customized 3D heat pipe 1 and several existing heat pipes in the VR head-mounted device 5, it can be seen that under the same heating power, the customized 3D heat pipe 1 can reduce the absolute temperature by about 40% to 50%, and increase the limit heating power by 3 to 5 times.

[0081] The above is only a preferred embodiment of the present application, and therefore cannot limit the scope of the present application, that is, equivalent changes and modifications made according to the scope and content of the present patent application should still be within the scope of the present application.

Claims

1. A flexible, customized 3D heat pipe, characterized in that, A flexible shell, a flexible wick and a working medium are arranged in an electronic device and partially contact a control chip of the electronic device; A working medium flow channel is formed in the flexible shell, and the flexible wick is arranged in the working medium flow channel; in any cross section of the working medium flow channel perpendicular to the extending direction of the working medium flow channel, the flexible wick respectively contacts the top surface and the bottom surface of the working medium flow channel; The working medium flows in the working medium flow channel, and the flexible wick absorbs the liquid working medium by capillary action; the liquid working medium absorbs heat emitted by the control chip, evaporates into gaseous state, and then is condensed into liquid state by the top surface and the bottom surface of the working medium flow channel and flows back to the flexible wick.

2. The customized 3D heat pipe of claim 1, wherein, The cross section of the flexible wick perpendicular to the extending direction of the flexible wick is a periodic function curve, and the periodic function is a trigonometric function, a polynomial function or a Gaussian function.

3. The customized 3D heat pipe of claim 2, wherein, The wavelength of the periodic function is 0.1-2.5 mm, and the amplitude of the periodic function is 0.05-0.75 mm. The width of the working medium flow channel is 5-40 mm, and the height of the working medium flow channel is 0.1-1.5 mm.

4. The customized 3D heat pipe according to any one of claims 1 to 3, wherein, The material of the flexible wick is a hydrophilic treated copper wire mesh, a stainless steel wire mesh or an iron-chromium-aluminum wire mesh. The flexible shell is obtained by compounding two polymer layers and a metal layer arranged between the two polymer layers, the material of the metal layer is copper, aluminum or stainless steel, and the material of the polymer layer is low-density polyethylene terephthalate, polypropylene or polyethylene.

5. The customized 3D heat pipe of claim 4, wherein, The flexible wick is obtained by stacking and pressing multiple layers of the hydrophilic treated copper wire mesh, the stainless steel wire mesh or the iron-chromium-aluminum wire mesh. The hydrophilic treatment method is a coating method, an anodic oxidation method or a chemical deposition method.

6. A method of manufacturing a customized 3D heat pipe according to any one of claims 1 to 5, characterized in that, The method comprises the following steps: (1) converting a target model into point cloud data, and then planning a shape trajectory of a customized 3D heat pipe according to the point cloud data along a two-phase circulation direction of the customized 3D heat pipe; The flexible shell is obtained by sealing the upper shell and the lower shell after being overlapped, wherein the upper shell and the lower shell form two ports after being overlapped, and the upper shell and the lower shell are respectively provided with seal edges capable of being heat-sealed at positions corresponding to the ports on the outer edges thereof; The shape trajectory includes the seal edges and regions with sudden changes in curvature of the customized 3D heat pipe; (2) extracting three-dimensional point coordinates in the shape trajectory, generating a three-dimensional surface from three-dimensional sheets along adjacent shape trajectories in a three-dimensional modeling software, expanding and converting the three-dimensional surface into a two-dimensional developed plane through a two-dimensional mapping algorithm, and then preparing an upper shell sheet, a lower shell sheet, a wick sheet and a flexible heater with the same shape as the seal edges along the two-dimensional developed plane; (3) combining the three-dimensional surface and the shape trajectory to generate a three-dimensional model of a plastic molding mold of the flexible wick and a three-dimensional model of a pre-packaging mold of the customized 3D heat pipe, and then printing the plastic molding mold and the pre-packaging mold through a light-curing 3D printing technology; The plastic molding mold comprises a plastic upper mold and a plastic lower mold, and the middle part of the fitting surface of the plastic upper mold and the plastic lower mold is the same as the shape of the flexible wick. The pre-packaging mold comprises a pre-packaging upper mold and a pre-packaging lower mold, and the middle part of the fitting surface of the pre-packaging upper mold and the pre-packaging lower mold is formed in the same shape as the customized 3D heat pipe; (4) Stack multiple pieces of the liquid absorption chip material between the shaping upper mold and the shaping lower mold, and the fitting surface of the shaping upper mold and the shaping lower mold applies a normal force to the liquid absorption chip material to obtain a three-dimensional liquid absorption core. The three-dimensional liquid absorption core is subjected to hydrophilic treatment to obtain the flexible liquid absorption core; (5) Stack the pre-packaging upper mold, the flexible heater, the upper shell sheet, the flexible liquid absorption core, the lower shell sheet and the pre-packaging lower mold in sequence, and the fitting surface of the pre-packaging upper mold and the pre-packaging lower mold applies a normal force to the upper shell sheet and the lower shell sheet. The flexible heater is heated to seal the sealing edge to obtain a pre-packaging heat pipe. The outer edge of the pre-packaging heat pipe that is not sealed by the sealing edge forms two ports; (6) One of the ports is subjected to a drainage port treatment, and then the other port is sealed. The pre-packaging heat pipe is subjected to vacuumizing and filling working medium through the port subjected to the drainage port treatment, and finally the port subjected to the drainage port treatment is sealed to obtain the customized 3D heat pipe.

7. The production method according to claim 6, wherein The light-curing 3D printing technology is stereolithography, digital light processing, continuous liquid interface production or mask stereolithography. And / or, the materials of the shaping mold and the pre-packaging mold are independently selected from epoxy-based resin, phenolic-based resin or ceramic-based resin.

8. The production method according to claim 6 or 7, characterized by, The operation of applying a normal force to the liquid absorption chip material by fitting the shaping upper mold and the shaping lower mold is to lock the shaping upper mold and the shaping lower mold by bolts and nuts, and then stand for 30s-30min; The operation of applying a normal force to the upper shell sheet and the lower shell sheet by fitting the pre-packaging upper mold and the pre-packaging lower mold is to lock the pre-packaging upper mold and the pre-packaging lower mold by bolts and nuts, and then stand for 30s-30min.

9. The production method according to claim 6 or 7, characterized by, The specific operation of the drainage port treatment is to set a copper pipe on the port by hot pressing.

10. An electronic device, comprising: The customized 3D heat pipe according to any one of claims 1-5 is included and heat dissipation is performed by the customized 3D heat pipe.

Citation Information

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