Electronic component and communication device

Abstract

The present application relates to the technical field of communications, and provides an electronic component and a communication device, capable of improving the heat dissipation effect of the communication device, and thereby maintaining stability of the communication device and prolonging an electronic service life. The electronic component comprises a housing. An interior of the housing comprises a power component, a thermally conductive module and a cold plate, the cold plate having a groove, and the thermally conductive module being located inside the groove. When the power component is located between the thermally conductive module and the housing, the thermally conductive module is in an elastically compressed state along a direction perpendicular to the surface of the cold plate.

Description

Electronic device and communication device

[0001] The present application claims priority to the Chinese patent application No. 202410950551.8, filed on July 15, 2024, and entitled "Electronic device and communication device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of communication, and in particular to an electronic device and a communication device. BACKGROUND

[0003] With the rapid development of technology, the size of communication devices tends to be miniaturized, and the system tends to be complex, and the heat density of communication devices is also getting larger and larger. In order to maintain the stability of the communication device and prolong the service life of the communication device, it is necessary to dissipate heat for the communication device. Heat dissipation refers to the transfer of heat generated by the communication device during operation to other media. Since the heat in the communication device is mainly generated by power devices such as hard disks, magnetic disks, and optical modules, the heat dissipation of the communication device is mainly for the heat dissipation of these power devices.

[0004] In order to dissipate heat for the power device, a heat dissipation module can be configured, which can include a cold plate and a heat pipe. The heat pipe is located between the power device and the cold plate. The heat pipe can receive the heat of the power device, and then transfer the heat to the cold plate, and then transfer the heat of the cold plate to the outside of the communication device through the refrigerant. However, in this way, the thermal resistance between the cold plate and the power device is relatively large, which causes poor heat dissipation effect. SUMMARY

[0005] The electronic device and the communication device provided by the embodiments of the present application can improve the heat dissipation effect of the communication device, thereby maintaining the stability of the communication device and prolonging the service life of the electronic device.

[0006] In a first aspect, the embodiments of the present application provide an electronic device, which includes a shell, the inside of the shell including a power device, a heat conduction module, and a cold plate, or the shell, the power device, the heat conduction module, and the cold plate are arranged in sequence along a direction perpendicular to the shell, or the power device, the heat conduction module, and the cold plate are located between multiple shells; the cold plate has a groove, the heat conduction module is located inside the groove, or a part of the heat conduction module is inserted into the groove, and another part of the heat conduction module is located outside the groove; in the case that the power device is located between the heat conduction module and the shell, the heat conduction module is in an elastically compressed state along a direction perpendicular to the surface of the cold plate.

[0007] Based on the scheme in the first aspect, first, compared with a non-embedded contact scheme, such as a scheme in which a heat pipe is arranged between the cold plate and the power device, in which the heat pipe is not embedded in the cold plate but only in contact with the cold plate, in the first aspect, the heat conduction module is also arranged between the cold plate and the power device, and the cold plate is provided with a groove, and the heat conduction module is inserted into the groove. It can be seen that the heat conduction module in the first aspect is embedded in the cold plate. This embedded design can shorten the distance between the end of the heat conduction module facing the power device and the cold plate, thereby reducing the thermal resistance, so that when the end of the heat conduction module facing the power device receives heat from the power device, the heat can be transferred to the cold plate more quickly, thereby improving the heat dissipation effect. In addition, in the first aspect, when the power device is located between the heat conduction module and the shell, the heat conduction module is in an elastically compressed state in a direction perpendicular to the surface of the cold plate. It can be seen that the heat conduction module in the first aspect is elastic. When the heat conduction module is in the elastically compressed state, the force generated by the elasticity will make the contact between the heat conduction module and the cold plate, and the heat conduction module and the power device more closely, which is beneficial to the transfer of heat and can improve the heat dissipation effect.

[0008] Based on the first aspect, in an optional implementation, the electronic device further includes a movable plate located between the power device and the heat conduction module. The movable plate and the groove wall jointly form a containing space for accommodating the heat conduction module, and the movable plate and the groove wall have a gap therebetween.

[0009] Based on the above implementation, since the movable plate and the groove wall of the cold plate have a gap therebetween, the movable plate can slide. For example, when the power device is pulled out from between the heat conduction module and the shell, the contact pressure between the power device and the movable plate disappears due to the lack of contact therebetween, and at this time the movable plate moves away from the heat conduction module. When the power device is inserted between the heat conduction module and the shell, the power device can contact the movable plate, and due to the contact pressure, the movable plate moves towards the heat conduction module and contacts the heat conduction module, thereby causing the heat conduction module to be in an elastically compressed state. At this time, due to the elastic force of the heat conduction module, the contact between the heat conduction module and the movable plate, the heat conduction module and the cold plate, or the movable plate and the power device is more closely, thereby shortening the distance between the power device and the movable plate, reducing the thermal resistance between the power device and the movable plate, and improving the efficiency of heat dissipation of the power device.

[0010] Optionally, the movable plate can include a first part and a second part, wherein the first part is located outside the groove of the cold plate, and the second part is located inside the groove of the cold plate. Optionally, when the power device is located between the heat conduction module and the shell, the first part is in contact with the power device near the outer surface of the power device, and the second part is in contact with the cold plate, so that the first part can receive the heat transferred by the power device, and then transfer the heat to the second part, and then transfer the heat to the cold plate by the second part.

[0011] Optionally, the movable plate can be a convex structure, wherein the part protruding from the cold plate is the first part, and the part located in the cold plate is the second part.

[0012] Based on the first aspect, in an optional implementation, the surface of the heat conduction module facing the movable plate includes N first sub-regions, and the surface of the movable plate facing the heat conduction module includes N second sub-regions, each of the N first sub-regions is in contact with one of the N second sub-regions.

[0013] Based on the above implementation, at least N sub-regions between the heat conduction module and the movable plate are in contact, so that the contact between the heat conduction module and the movable plate is sufficient. Further, the heat conduction module and the movable plate need to be topographically matched, that is, the shape of the contact surface of the heat conduction module and the movable plate should be as consistent as possible, for example, when the heat conduction module is cylindrical, the movable plate should also be cylindrical, and when the heat conduction module is a cuboid, the movable plate should also be a cuboid. Thus, the contact area between the heat conduction module and the movable plate can be expanded, so that when the heat conduction module and the movable plate are in contact, heat can be quickly transferred from the heat conduction module to the movable plate; and the contact reliability between the heat conduction module and the movable plate can be improved, so that when the heat conduction module is in an elastic compression state, the interface between the heat conduction module and the movable plate does not separate.

[0014] Based on the first aspect, in an optional implementation, the surface of the cold plate facing the heat conduction module includes M third sub-regions, and the surface of the heat conduction module facing the cold plate includes M fourth sub-regions, each of the M third sub-regions is in contact with one of the M fourth sub-regions; and the contact reliability between the heat conduction module and the cold plate can be improved, so that when the heat conduction module is in an elastic compression state, the interface between the heat conduction module and the cold plate does not separate.

[0015] Based on the above implementation manner, the heat conduction module and the cold plate are in contact with at least M sub-regions, so that the contact between the heat conduction module and the movable plate is sufficient. Further, the heat conduction module and the cold plate need to be topographically matched, that is, the shape of the contact surface of the heat conduction module and the cold plate should be as consistent as possible. For example, when the surface of the heat conduction module and the cold plate in contact is a semi-cylindrical shape, the surface of the cold plate in contact with the heat conduction module should also be a semi-cylindrical shape. For example, when the surface of the heat conduction module and the cold plate in contact is a cuboid shape, the surface of the cold plate in contact with the heat conduction module should also be a cuboid shape. Through this design, the contact area between the heat conduction module and the cold plate can be expanded, so that when the heat conduction module and the cold plate are in contact, heat can be quickly transferred from the heat conduction module to the cold plate, and the contact reliability between the heat conduction module and the cold plate can be improved, so that when the heat conduction module is in an elastic compression state, the interface between the heat conduction module and the cold plate does not separate.

[0016] Based on the first aspect, in an optional implementation manner, the groove wall of the cold plate forms a limiting arm in a direction towards the power device, the movable plate forms a resisting arm in a direction towards the groove wall, the power device, the limiting arm and the resisting arm are arranged in sequence in a direction perpendicular to the cold plate, and the resisting arm and the limiting arm resist each other in a case that the power device is not located between the heat conduction module and the shell.

[0017] Based on the above implementation manner, in a case that the power device is not located between the heat conduction module and the shell, for example, when the power device is extracted, the contact between the power device and the movable plate disappears, and the contact pressure therebetween disappears. At this time, the movable plate moves in a direction towards the power device. Since the power device, the limiting arm and the resisting arm are arranged in sequence, the resisting action between the limiting arm and the resisting arm limits the resisting arm from moving beyond the horizontal plane where the limiting arm is located, thereby limiting the movable plate from moving further in the direction towards the power device, and preventing the movable plate from falling off and being stuck.

[0018] Optionally, as described above, the movable plate can have a convex structure, and the part of the movable plate that is not convex can constitute the resisting arm.

[0019] Optionally, the limiting arm can be a baffle or a fixed-length screw.

[0020] Optionally, the limiting arm can be in contact with the outer surface of the cold plate close to the power device, and the limiting arm can protrude or extend from the cold plate in a direction towards the movable plate, thereby forming an arm structure. Alternatively, the cold plate includes a groove for inserting the limiting arm in addition to the groove for inserting the heat conduction module, wherein a part of the limiting arm is inserted into the groove, and another part of the limiting arm can protrude or extend from the cold plate in a direction towards the movable plate, thereby forming an arm structure.

[0021] Optionally, the shell further comprises a protection part, the power device is located in the protection part, and the protection part is a shell structure and is located between the movable plate and the shell. For example, when the power device is an optical module, the protection part is an optical cage for protecting the optical module, and the optical cage is located between the movable plate and the shell.

[0022] Based on the above manner, by arranging the protection part, the power device can be protected, and the loss of the power device is reduced. For example, the protection part can be made of a material that is waterproof, moisture-proof, or friction-proof, so as to protect the power device.

[0023] Optionally, the protection part has heat conduction capability. For example, the protection part can be made of a metal material with good heat conduction, so that the heat generated during power supply can be quickly transmitted to the heat conduction module through the protection part.

[0024] Optionally, the electronic device further comprises a stud, and the shell and the cold plate are fixed together through the stud. Thus, the positions of the shell and the cold plate can be fixed, so that a stable structure is formed between the shell and the cold plate.

[0025] Based on the first aspect, in an optional implementation, the heat conduction module comprises a plurality of heat conduction subparts, and each heat conduction subpart is in an elastically compressed state when the power device is located between the heat conduction module and the shell.

[0026] Based on the above implementation, by arranging a plurality of heat conduction subparts, the heat can be distributed to the plurality of heat conduction subparts. Compared with heat conduction through one heat conduction subpart, the heat conduction efficiency of the manner of distributing a plurality of heat conduction subparts is higher.

[0027] Optionally, in order to arrange as many heat conduction subparts as possible, on one hand, the area of the heat conduction subpart should be as small as possible, that is, the area of the heat conduction subpart should be less than a threshold value; on the other hand, the accommodation space formed by the movable plate and the groove wall together should be as large as possible.

[0028] Based on the first aspect, in an optional implementation, the heat conduction module comprises an elastic part and a heat conduction part, the heat conduction part is inserted into the groove, and the elastic part is located in the heat conduction part. When the power device is located between the heat conduction module and the shell, the elastic part is in an elastically compressed state.

[0029] Based on the above implementation manner, the heat conduction module includes two parts, one is an elastic part for increasing the elasticity of the heat conduction module, and the other is a heat conduction part for increasing the heat conduction performance of the heat conduction part. Since the elastic part is located inside the heat conduction part, that is, the heat conduction part wraps the elastic part, when the heat conduction part receives heat from the power device, the heat can be transmitted to the shell through the heat conduction part. Since the elastic part has elasticity, the elastic part will be in an elastic compression state when the power device is located between the heat conduction module and the shell, and thus a counterforce will be provided to the heat conduction part. Due to the action of the counterforce, the heat conduction module where the heat conduction part is located is in effective contact with the cold plate and the sliding part, thereby improving the efficiency of heat transfer. The present application embodiment proposes this structure of the heat conduction module, which can solve the problem that the traditional interface heat conduction material is difficult to compress and rebound.

[0030] Optionally, the elastic part in the present application embodiment can have various shapes, for example, it can be π-shaped or S-shaped.

[0031] Optionally, in the present application embodiment, the heat conduction part can have a film structure, and the heat conduction part can be columnar or cuboid. The heat conduction part has multiple contact surfaces with the outer surface of the elastic part.

[0032] Optionally, the outer surface of the heat conduction part can further include a groove, which can be used for inserting a cold plate or a movable plate.

[0033] Optionally, the elastic part in the present application embodiment can have various shapes, for example, it can be π-shaped or S-shaped.

[0034] Optionally, in the present application embodiment, the heat conduction part can have a film structure, and the heat conduction part can be columnar or cuboid. The heat conduction part has multiple contact surfaces with the outer surface of the elastic part.

[0035] Optionally, the outer surface of the heat conduction part can further include a groove, which can be used for inserting a cold plate or a movable plate.

[0036] Optionally, a single-layer heat conduction part can be provided, or a multi-layer heat conduction part can be provided.

[0037] Based on the first aspect, in an optional implementation manner, the material of the elastic part includes: beryllium copper alloy, tin phosphorus alloy, phosphor bronze, stainless steel or copper titanium alloy.

[0038] Based on the above implementation manner, the elastic part can be made of metal alloys such as beryllium copper alloy and tin phosphorus alloy. On the one hand, beryllium copper alloy and tin phosphorus alloy have good heat conduction performance, which is beneficial to heat transfer of the heat conduction module. On the other hand, such metal alloys have good elasticity, so that the elastic part has good elastic force.

[0039] Optionally, the elastic part can be made of other materials with good elasticity, such as stainless steel, rubber, spring steel, spring copper or spring aluminum, in addition to the beryllium copper alloy, tin phosphorus alloy and other metal alloys mentioned above.

[0040] In an optional implementation based on the first aspect, the material of the heat-conducting part includes graphene, a carbon-based heat-conducting pad, a silicon-based heat-conducting pad, or carbon fiber.

[0041] Compared with water vapor injected into a heat pipe, the heat-conducting part of the present application is made of graphene, a carbon-based heat-conducting pad, a silicon-based heat-conducting pad, or carbon fiber, which has better heat-conducting performance and is more stable, thereby improving the heat transfer efficiency and stability of the heat-conducting part.

[0042] Optionally, the groove of the cold plate includes three parts, i.e., the parts on the left and right sides located on the same horizontal plane, and the middle part higher than the horizontal plane on the left and right sides, i.e., the middle protruding part. The middle protruding part and the movable plate jointly form a containing space for accommodating the heat-conducting module. The parts on the left and right sides have a gap with the resisting arms of the movable plate. The existence of the gap prevents the sliding of the movable plate from being stuck.

[0043] In a second aspect, the present application provides a communication device including a circuit board and an electronic device. The electronic device is as described in any one of the first aspect. The power device of the electronic device is electrically connected to the circuit board. The specific structure of the communication device and the beneficial effects are described in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0044] FIG. 1 is an example diagram of a structure of an optical network;

[0045] FIG. 2 is another example diagram of a structure of an optical network;

[0046] FIG. 3 is an example diagram of a structure of an electronic device provided by the present application;

[0047] FIG. 4 is an example diagram of an optional module or structure of an electronic device provided by the present application;

[0048] FIG. 5 is an example diagram of a structure of a module for heat dissipation in an electronic device provided by the present application;

[0049] FIG. 6 is an example diagram of a cross section of a heat-conducting module, a cold plate and a contact surface provided by the present application;

[0050] FIG. 7 is an example diagram of a structure of a heat-conducting module provided by the present application;

[0051] FIG. 8 is an example diagram of a structure of an electronic device in an embodiment provided by the present application.

[0052] Specific implementation method

[0053] First, some terms used in the embodiments of this application will be explained to facilitate understanding by those skilled in the art.

[0054] 1. Liquid cooling

[0055] Liquid cooling design utilizes the higher heat transfer efficiency of liquids compared to gases, and is a thermal management solution developed after electronic products reached a certain stage of power consumption. If a large amount of liquid is involved in the heat transfer process, it can be considered a liquid cooling design. Liquid cooling designs can be divided into direct liquid cooling and indirect liquid cooling. Direct liquid cooling, also known as immersion liquid cooling, involves directly immersing electronic devices in liquid for cooling. Indirect liquid cooling is essentially a common design using a cold plate or cold head + radiator. The heat generated by the device, or its components or modules, is carried away by a continuously flowing liquid through the cold plate. As the liquid flows through the radiator, the heat dissipates, and the temperature decreases. The cooled fluid then returns to the cold plate to continue absorbing heat, thus completing the cycle. Indirect liquid cooling technology is one of the most widely deployed and applied liquid cooling solutions in the industry.

[0056] Because liquids offer significant advantages in heat dissipation compared to cold air—for example, a liquid can remove 3,000 times more heat than air of the same volume; its thermal conductivity is 25 times that of air; and at the same heat dissipation level, liquid cooling systems produce much lower noise than air cooling systems, whether under no-load or full-load conditions, with laboratory data showing an average reduction of 10-15 dB—liquid cooling technology has promising prospects in many fields, such as optical networks and data centers. Taking optical networks as an example, the high thermal conductivity of water or other liquids can be used to establish a direct heat conduction path between the optical module and the heat sink, thereby rapidly dissipating the heat from the optical module.

[0057] 2. Thermal Interface Material (TIM)

[0058] Thermal interface materials are a general term for materials used to coat between heat dissipation devices and heat generation devices to reduce the contact thermal resistance between them. Thermal interface materials are also known as thermally conductive interface materials.

[0059] 3. The terms "first", "second", and the like in the description and in the claims of the present application and above-described drawings are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the present application are capable of functioning in other sequences than described or otherwise illustrated herein. Furthermore, the terms "comprise", "comprising", "include", "including", and the like are intended to cover a non-exclusive inclusion such that process steps, methods, systems, products, or devices that comprise, have, or include an item or list of items for performing an activity or making a function or output do not by virtue of that use of the terms exclude or deny the presence or addition of one or more other items or steps that are needed to complete or facilitate that activity or function or output.

[0060] 4. As used herein, the terms "substantially", "about", and the like are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be perceived by those of ordinary skill in the art, considering the typical measurements and calculated values associated with the same. Further, use of "may" when describing embodiments of the present application means that one or more embodiments of the present application "can" include, "might" or "will" include, but do not or will not necessarily include, the features so described.

[0061] The network system based on which the embodiments of the present application are applied is exemplified as follows. The embodiments of the present application can be applied to various communication systems, such as optical network communication systems, microwave communication systems or satellite communication systems, such as analog communication systems or digital communication systems, such as telephone communication systems, image communication systems or data communication systems, such as wired communication systems or wireless communication systems, such as baseband transmission systems or band-pass (modulation) transmission systems, such as long-wave communication, medium-wave communication or short-wave communication, such as frequency-division multiplexing communication, time-division multiplexing communication or code-division multiplexing communication. The embodiments of the present application are exemplified as being applied to optical network communication as follows:

[0062] FIG. 1 is an example diagram of a structure of an optical network. The registration method of an optical network and related device provided by the embodiments of the present application can be applied to various optical networks. For example, the type of the optical network 100 shown in the example is a passive optical network (PON). Then the optical network 100 includes an optical line termination device 101, an optical distribution network (ODN) 110, and at least one optical network termination device 102. The optical line termination device 101 is connected to the at least one optical network termination device 102 through the ODN 110. The number of the optical network termination devices 102 included in the optical network is not limited in the example. The ODN 110 includes a passive splitter, a feeder connected between the optical line termination device 101 and the passive splitter, and a drop connected between the optical network termination device 102 and the passive splitter. Wherein, the optical line termination device 101 sends optical signals to the optical network termination device 102 through the ODN, which is called downstream, and the optical network termination device 102 sends optical signals to the optical line termination device 101 through the ODN, which is called upstream. Specifically, when transmitting downstream data, the ODN 110 transmits the downstream data from the optical line termination device 101 to each optical network termination device 102 through the splitter. When transmitting upstream data, the ODN 110 combines the upstream data from multiple optical network termination devices 102 into one optical signal by time division multiplexing (TDM), and sends the optical signal to the optical line termination device 101. Each optical network termination device 102 sends in turn according to the order specified by the optical line termination device 101, so as to avoid conflicts between the optical network termination devices 102.

[0063] The optical network terminal device 102 shown in the example can be an optical network unit (ONU) or an optical network terminal (ONT), and the optical network terminal device 101 is an optical line terminal (OLT). The optical network terminal device 101 is connected to a network side device (such as a switch, a router, etc.) in an upper layer. The optical network terminal device 102 can be connected to a user side device, for example, the optical network terminal device 102 provides an Ethernet user port or a plain old telephone service (POTS) user port to connect the user side device. It should be noted that the description of the optical network type shown in FIG. 1 is an optional example and is not limited, for example, the optical network can also be applied to an optical transport network (OTN), and the optical network terminal device 101 and the optical network terminal device 102 are OTN devices. If the optical network 100 is applied to a wireless mesh network (Mesh) also known as a multi-hop network. The Mesh includes a plurality of transmission devices with Mesh functions. The optical network terminal device 101 and the optical network terminal device 102 are any two connected transmission devices in the plurality of transmission devices. The optical network 100 shown in the example can also be applied to any one or a combination of data center network (DCN), metropolitan area network (MAN), optical access network (OAN), city area network (MAN), synchronous digital hierarchy (SDH), gigabit-capable PON (GPON), Ethernet passive optical network (EPON), evolved GPON (10-Gigabit-capable symmetric passive optical network, XGS-PON), Ethernet, or flex Ethernet (FlexE), wavelength division multiplexing (WDM) network, etc. The specific implementation is not limited. The method shown in the example is taken as an example of application to a 50G PON.

[0064] Taking the optical network terminal device 102 as an example, the device type of the optical network terminal device 102 is not limited in the example, and the device type of the optical network terminal device 102 can be different as the optical network application scene is different. For example, the optical network terminal device 102 can be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc., and can also be a computing server (usually referred to as a server), a high-performance computer (HPC), a storage server, or a memory resource pool, etc. The type of the optical network terminal device 102 is not limited in the example, as long as the optical network terminal device 102 has an electro-optical conversion function and has an optical interface capable of connecting an optical fiber. For the type of the optical network terminal device 101, please refer to the description of the optical network terminal device 102, and details are not described herein.

[0065] Take the optical network terminal device as an example. The optical network terminal device 102 includes a device single board 111 and one or more optical transceivers 112. The optical transceiver can also be referred to as an optical-electric conversion module, an optical transceiver module, or an optical module, etc. The type and packaging form of the optical transceiver are not limited in this example. The packaging form of the optical transceiver can be an optical transceiver board (OTB), a near package optics (NPO), an on board optics (OBO) based on optical input&output (OIO) technology, or a co-package optics (CPO), etc. The number of device single boards 111 included in the optical network terminal device 102 is not limited in this example. The device single board 111 is integrated with the optical network terminal device 102, or the device single board 111 is an independent pluggable single board. The number of optical transceivers 112 included in the optical network terminal device 102 is not limited in this example. The optical transceiver 112 can be integrated with the device single board 111 or pluggable on the single board of the device single board 111, etc., and the specific implementation is not limited. Specifically, the device single board 111 has a processor and a connector for connecting the processor and the optical transceiver 112. The processor can be one or more chips, or one or more integrated circuits. For example, the processor can be one or more optical digital signal processors (oDSP), digital signal processors (DSP), field-programmable gate arrays (FPGA), application specific integrated circuits (ASIC), system on chips (SoC), central processing units (CPU), network processors (NP), microcontroller units (MCU), programmable logic devices (PLD), network card chips, storage interface chips, or other integrated chips, or any combination of the above chips or processing modules, and the specific implementation is not described herein. The processor has a sending interface connected with the connector. The connector is used to provide an electrical interface to realize pluggable connection with the optical transceiver 112.The optical network terminal device 101 comprises a device single board and one or more optical transceivers. For details, refer to the description of the optical network terminal device 102, which will not be repeated here.

[0066] Fiber to the home (FTTH) is a transmission mode of fiber communication. The access network part of the optical network can achieve wider coverage of the optical network through the FTTH mode. In addition, fiber to the office (FTTO), fiber to the building (FTTB) and the like are also proposed, which are the same or similar communication transmission modes, and can also be the application architecture of the method provided in the present application. The example shown in FIG. 1 is exemplarily introduced based on FTTH.

[0067] On the basis of FTTH, in order to solve the problem of wireless fidelity (WIFI) coverage of the home network, the optical fiber can be further extended to the room of the user. The optical terminal device providing WiFi access is installed in the room, so as to reduce the distance between the user terminal and the WiFi access point and improve the signal quality. This application scenario is referred to as fiber to the room (FTTR).

[0068] FIG. 2 is another structural example diagram of the optical network. Specifically, FIG. 2 is a schematic diagram of the system architecture of FTTR. The FTTR network and the FTTH network can be regarded as a cascaded PON system. The OLT in FTTH is deployed in the center office (CO), and the ONU is deployed in the information box of the home. The master device in FTTR can replace the ONU in FTTH. The master device has similar functions to the OLT in the FTTH scenario, and also has similar functions to the ONU in the FTTH scenario. That is to say, the master device in FTTR is a device with OLT and ONU functions, which can serve as a network device between FTTH and FTTR. The slave device in FTTR can be deployed in each room of the home and used to connect with the user terminal. The slave device and the ONU in FTTH are similar network devices in nature. The slave device in FTTR enters each room and also has the function of an access point (AP) and can directly connect with the user terminal through WiFi. The user terminal can access the slave device and perform data transmission through the WiFi connection established with the slave device.

[0069] It should be understood that multiple slave devices can be deployed in the FTTR, each of which is connected with a corresponding downstream port on the master device, and the master device can implement unified management and configuration of all slave devices. It should be noted that the master device can also be referred to as a "master gateway", a "master optical cat" or a "master FTTR device", etc., and the slave device can also be referred to as a "slave gateway", a "slave optical cat" or a "slave FTTR device", etc., and the specific name is not limited in the present application. The optical network terminal device shown in FIG. 1 can also be a master device under the FTTR architecture, and the optical network terminal device shown in FIG. 1 can also be a slave device under the FTTR architecture.

[0070] In combination with the architecture of the foregoing FIG. 2, in some scenarios, when the slave device in the FTTR provides services for the user terminal, the data transmission manner of the user terminal accessing the slave device can be different from the data transmission manner of the devices in the FTTH and the FTTR. For example, the FTTH or the FTTR communicates internally through an optical fiber, and the slave device and the terminal can communicate through a wireless network, which can include but is not limited to WiFi, near field communication (NFC), infrared, Bluetooth or ZigBee, etc.

[0071] It can be understood that FIG. 1 and FIG. 2 are only schematic diagrams, and the optical network can further include other devices, such as a wavelength division device, an optical amplifier device, more optical network terminal devices, etc., which are not shown in FIG. 1 and FIG. 2.

[0072] In the above optical network, with the rapid increase of bandwidth and speed, the heat dissipation problem of power devices in optical devices is becoming more and more prominent, wherein the optical devices include: the optical network terminal device 101, the ODN 110, the optical network terminal device 102, the master device, the slave device or the user terminal in the FTTR, etc. For example, high temperature can cause the performance of the optical module to decrease, and even damage the device, thereby affecting the normal operation of the entire data center. In addition to optical devices, other communication devices also generate a large amount of heat during operation. In order to maintain the stability of the communication device and prolong the service life of the communication device, the communication device needs to be cooled. Cooling refers to transferring the heat generated by the communication device during operation to other media. Since the heat in the communication device is mainly generated by the power device, the cooling of the communication device is mainly the cooling of these power devices.

[0073] Traditional heat dissipation methods for power devices mainly use passive heat dissipation methods such as heat dissipation fins and fans, but are limited by air flow and cannot effectively reduce the temperature. Liquid cooling technology can improve the defects of this traditional heat dissipation method, especially when dissipating heat from optical modules. Compared with passive heat dissipation methods, liquid cooling technology is a better choice to improve the performance of data centers and cloud computing. When dissipating heat from power devices through liquid cooling technology, a heat dissipation module can be configured, which can include a cold plate and a heat pipe. The heat pipe is located between the power device and the cold plate. The heat pipe can receive heat from the power device and then transfer the heat to the cold plate. The heat from the cold plate is then transferred to the communication equipment through the coolant. However, the thermal resistance between the cold plate and the power device in this method is relatively large, which results in poor heat dissipation effect.

[0074] To improve the heat dissipation effect of the power device 302, an electronic device 300 is provided in an embodiment of the present application. For example, as shown in FIG. 3, the electronic device 300 includes a housing 301, the housing 301 includes a power device 302, a heat conduction module 303, and a cold plate 304 inside, or the housing 301, the power device 302, the heat conduction module 303, and the cold plate 304 are arranged in sequence along a direction perpendicular to the housing 301, or the power device 302, the heat conduction module 303, and the cold plate 304 are located between multiple housings 301.

[0075] It should be noted that FIG. 3 is an example in which the number of power devices 302 is 2. In the present application, the number of power devices 302 can also be other numbers, for example, the number of power devices 302 can also be 1 or 3, etc. Optionally, when there are multiple power devices 302, for example, when there are two power devices 302, the heat conduction module 303 and the cold plate 304 can be located between the two power devices 302 and can be used for heat dissipation of the two power devices 302. In the present application, the power device 302 can include various types of modules or devices. For example, a typical application scenario of the present application is the heat dissipation of a draw-eject module, wherein the power device 302 includes the draw-eject module. The draw-eject module refers to a module that can be inserted into a communication device and can also be pulled out of the communication device. For example, the draw-eject module can be a hard disk, a single board, a magnetic disk, or an optical module, etc.

[0076] It should be noted that the housing 301 in FIG. 3 includes two plate-shaped parts as an example. The housing 301 in the present application can also have other types, for example, the housing 301 can also have a block structure. The number of housings 301 in the present application can be other numbers, for example, the number of housings 301 can be 1.

[0077] To help understand the structure of the electronic device 300, for example, the power device 302 generates heat during operation, and since the power device 302 is in contact with the cold plate, the heat of the power device 302 can be transferred to the heat conduction module 303, and then the heat conduction module 303 can transfer the heat to the cold plate 304, and then the heat of the cold plate 304 can be transferred to the device in which the electronic device 300 is located by the coolant, such as water and fluoride.

[0078] In the embodiment of the present application, the cold plate 304 has a recess, and the heat conduction module 303 is inserted into the recess, or part of the heat conduction module 303 is inserted into the recess and the other part is located outside the recess. Since all or part of the heat conduction module 303 is inserted into the recess in the cold plate 304, it can be considered that the heat conduction module 303 is embedded in the cold plate 304, and the two are integrated structures, so the heat conduction module 303 can also be considered as part of the cold plate 304, and the whole formed by the heat conduction module 303 and the cold plate 304 can also be called a cold plate. Alternatively, the coolant can flow through the whole of the heat conduction module 303 and the cold plate 304 to transfer the heat in the heat conduction module 303 and the cold plate 304 to the device in which the electronic device 300 is located.

[0079] Based on the above scheme, compared with the non-embedded contact scheme, such as the scheme of arranging a heat pipe between the cold plate and the power device, the heat pipe is not embedded in the cold plate but only in contact with the cold plate, and in the embodiment of the present application, the heat conduction module 303 is embedded in the cold plate 304, and this embedded design can shorten the distance between the end of the heat conduction module 303 facing the power device 302 and the cold plate 304, so as to reduce the thermal resistance, so that when the end of the heat conduction module 303 facing the power device 302 receives the heat of the power device 302, the heat can be transferred to the cold plate 304 more quickly, thereby improving the heat dissipation effect.

[0080] In the embodiment of the present application, when the power device 302 is located between the heat conduction module 303 and the shell 301, the heat conduction module 303 is in an elastically compressed state in the direction perpendicular to the surface of the cold plate 304, or when the power device 302 is located between the heat conduction module 303 and the shell 301, the heat conduction module 303 is in an elastically compressed state in the direction perpendicular to the surface of the power device 302.

[0081] Based on the above technical scheme, since the heat conduction module 303 is in an elastic compression state, the elastic force of the heat conduction module 303 can make the heat conduction module 303 and the power device 302 effectively contact. For example, when the heat conduction module 303 is in the elastic compression state, a contact pressure can be generated on the power device 302. Due to the pressure, the power device 302 moves towards the shell 301 until the power device 302 contacts the shell 301. At this time, due to the contact, the shell 301 generates a pressure on the power device 302, which is perpendicular to the direction of the shell 301 and away from the shell 301. The pressure of the shell 301 on the power device 302, the contact pressure generated by the heat conduction module 303 on the power device 302, and the elastic force of the heat conduction module 303 itself make the contact between the power device 302 and the heat conduction module 303 more closely, which is beneficial to the heat of the power device 302 being transferred to the heat conduction module 303 more quickly, thereby improving the heat dissipation effect of the power device 302.

[0082] It should be noted that the heat conduction module 303 is located between the heat dissipation device (cold plate 304) and the heat generating device (power device 302), and can reduce the thermal contact resistance. Therefore, the heat conduction module 303 can also be referred to as a thermal interface material part 303. However, the heat conduction module 303 in the embodiment of the application has elasticity, so that when the power device 302 is located between the heat conduction module 303 and the shell 301, the heat conduction module 303 is in an elastic compression state along a direction perpendicular to the surface of the power device 302.

[0083] In order to further improve the heat dissipation effect of the electronic device 300, in addition to the shell 301, the power device 302, the heat conduction module 303 and the cold plate 304, the embodiment of the application also provides several optional modules or structures located in the electronic device 300, as follows:

[0084] In an optional implementation, as shown in FIG. 4, the electronic device 300 further includes a movable plate 401 located between the power device 302 and the heat conduction module 303. The movable plate 401 and the groove wall jointly form a containing space for accommodating the heat conduction module 303, and the movable plate 401 and the groove wall have a gap therebetween.

[0085] Based on the above implementation, taking FIG. 4 as an example, since there is a gap between the movable plate 401 and the groove wall of the cold plate 304, the movable plate 401 can slide, for example, when the power device 302 is pulled out from between the heat conduction module 303 and the shell 301, since the power device 302 is no longer in contact with the movable plate 401, the contact pressure between them disappears, at this time the movable plate 401 will move away from the heat conduction module 303. When the power device 302 is inserted between the heat conduction module 303 and the shell 301, the power device 302 can be in contact with the movable plate 401, due to the contact pressure, the movable plate 401 will move towards the heat conduction module 303, thereby contacting the heat conduction module 303, thereby causing the heat conduction module 303 to be in an elastic compression state. At this time, due to the elastic force of the heat conduction module 303, the contact between the heat conduction module 303 and the movable plate 401, the heat conduction module 303 and the cold plate 304, or the movable plate 401 and the power device 302 will be more closely, thereby shortening the distance between the power device 302 and the movable plate 401, reducing the thermal resistance between the power device 302 and the movable plate 401, and improving the efficiency of heat dissipation of the power device 302.

[0086] Optionally, the movable plate 401 can include a first part and a second part, wherein the first part is located outside the groove of the cold plate 304, and the second part is located inside the groove of the cold plate 304. Optionally, when the power device 302 is located between the heat conduction module 303 and the shell 301, the first part is in contact with the outer surface of the power device 302, and the second part can be in contact with the cold plate 304, so that the first part can receive heat transmitted by the power device 302, and then transmit the heat to the second part, and then transmit the heat to the cold plate 304. Taking FIG. 5 as an example, FIG. 5 is an example diagram of a module for heat dissipation, which includes a movable plate 401, a cold plate 403, a heat conduction module 303, and a limiting arm 402. As shown in FIG. 5, the part above the dashed line in the movable plate 401 is the first part, and the part below the dashed line in the movable plate 401 is the second part.

[0087] Optionally, the movable plate 401 can be a convex structure, and the part of the convex structure protruding from the cold plate 304 is the first part, and the part located in the cold plate 304 is the second part.

[0088] The above introduces that the electronic device 300 in the embodiment of the application can include a heat conduction module 303 and a movable plate 401, in order to improve the heat transfer efficiency between the heat conduction module 303 and the movable plate 401, and between the cold plate 304 and the movable plate 401, the contact area between the heat conduction module 303 and the movable plate 401, and between the cold plate 304 and the movable plate 401 can be increased, which can be implemented as follows:

[0089] In an optional implementation, the surface of the heat conduction module 303 facing the movable plate 401 includes N first sub-regions, the surface of the movable plate 401 facing the heat conduction module 303 includes N second sub-regions, and each of the N first sub-regions is in contact with one of the N second sub-regions.

[0090] It can be understood that, since the movable plate 401 can slide, the above-mentioned “one of the N second sub-regions is in contact” means that, when the movable plate 401 slides to be in contact with the heat conduction module 303, one of the N second sub-regions is in contact.

[0091] Based on the above implementation, at least N sub-regions between the heat conduction module 303 and the movable plate 401 are in contact, so that the contact between the heat conduction module 303 and the movable plate 401 is sufficient. Further, the heat conduction module 303 and the movable plate 401 need to be topographically matched, that is, the shape of the contact surface of the heat conduction module 303 and the movable plate 401 should be as consistent as possible, for example, when the heat conduction module 303 is a cylinder, the movable plate 401 should also be a cylinder, and when the heat conduction module 303 is a cuboid, the movable plate 401 should also be a cuboid. Thus, the contact area between the heat conduction module 303 and the movable plate 401 can be expanded, so that when the heat conduction module 303 is in contact with the movable plate 401, heat can be quickly transferred from the heat conduction module 303 to the movable plate 401; and the contact reliability between the heat conduction module 303 and the movable plate 401 can be improved, so that when the heat conduction module 303 is in an elastic compression state, the interface between the heat conduction module 303 and the movable plate 401 does not separate.

[0092] In an optional implementation, the surface of the cold plate 304 facing the heat conduction module 303 includes M third sub-regions, the surface of the heat conduction module 303 facing the cold plate 304 includes M fourth sub-regions, and each of the M third sub-regions is in contact with one of the M fourth sub-regions; and the contact reliability between the heat conduction module 303 and the cold plate 304 can be improved, so that when the heat conduction module 303 is in an elastic compression state, the interface between the heat conduction module 303 and the cold plate 304 does not separate.

[0093] Based on the above implementation manner, the heat conduction module 303 and the cold plate 304 are in contact with at least M sub-regions, so that the contact between the heat conduction module 303 and the movable plate 401 is sufficient. Further, the heat conduction module 303 and the cold plate 304 need to be topographically matched, that is, the shape of the contact surface of the heat conduction module 303 and the cold plate 304 should be as consistent as possible. For example, when the surface in contact with the heat conduction module 303 and the cold plate 304 is a semi-cylindrical shape, the surface in contact with the heat conduction module 303 and the cold plate 304 should also be a semi-cylindrical shape. For example, when the surface in contact with the heat conduction module 303 and the cold plate 304 is a cuboid shape, the surface in contact with the heat conduction module 303 and the cold plate 304 should also be a cuboid shape. Through this design, the contact area between the heat conduction module 303 and the cold plate 304 can be expanded, so that when the heat conduction module 303 and the cold plate 304 are in contact, heat can be quickly transferred from the heat conduction module 303 to the cold plate 304, and the contact reliability between the heat conduction module 303 and the cold plate 304 can be improved, so that when the heat conduction module 303 is in an elastic compression state, the interface between the heat conduction module 303 and the cold plate 304 does not separate.

[0094] Taking FIG. 6 as an example, the upper left of FIG. 6 is an example diagram of the heat conduction module 303, the upper right is the movable plate 401, and the cross-sectional view of the heat conduction module 303 and the cold plate 304, wherein the upper cross section of the cross-sectional view is the cross section of the movable plate 401, the middle is the cross section of the heat conduction module 303, and the lower is the cross section of the cold plate 304. As shown in FIG. 6, the shape of the contact surface of the movable plate 401 and the heat conduction module 303 is highly consistent with the shape of the contact surface of the heat conduction module 303 and the movable plate 401, that is, the movable plate 401 and the heat conduction module 303 are topographically matched, and the shape of the contact surface of the cold plate 304 and the heat conduction module 303 is highly consistent with the shape of the contact surface of the heat conduction module 303 and the cold plate 304, that is, the cold plate 304 and the heat conduction module 303 are topographically matched. The lower part of FIG. 6 shows the cross-sectional view of the movable plate 401, the heat conduction module 303 and the cold plate 304 when there are multiple heat conduction sub-components in the heat conduction module 303. The upper left of FIG. 6 is an enlarged view of the structure of the heat conduction module 303, and the upper right of FIG. 6 is an enlarged view of one cross section of the movable plate 401, the heat conduction module 303 and the cold plate 304. As shown in FIG. 6, when there are multiple heat conduction sub-components, the heat conduction module 303 and the movable plate 401, and the heat conduction module 303 and the cold plate 304 are topographically matched.

[0095] In an alternative implementation, the groove wall of the cold plate 304 forms a limiting arm 402 in a direction towards the power device 302, the movable plate 401 forms a resisting arm 404 in a direction towards the groove wall, the power device 302, the limiting arm 402 and the resisting arm 404 are arranged in sequence in a direction perpendicular to the cold plate 304, and the resisting arm 404 and the limiting arm 402 abut each other in the case that the power device 302 is not located between the heat conduction module 303 and the shell 301.

[0096] As shown in FIG. 4, the limiting arm 402 can be located between the resisting arm 404 of the movable plate 401 and the power device 302, and the limiting arm 402 can be an arm-shaped structure in the plane of the cold plate 304 and the end of the groove towards the power device 302. The resisting arm can be located between the plane of the groove away from the power device 302 and the limiting arm 402.

[0097] Based on the above implementation, in the case that the power device 302 is not located between the heat conduction module 303 and the shell 301, for example, when the power device 302 is extracted, the contact between the power device 302 and the movable plate 401 disappears, and the contact pressure therebetween disappears. At this time, the movable plate 401 moves in a direction towards the power device 302. Since the power device 302, the limiting arm 402 and the resisting arm 404 are arranged in sequence, the resisting action between the limiting arm 402 and the resisting arm limits the sliding resisting arm from exceeding the horizontal plane where the limiting arm 402 is located. This can limit the movable plate 401 from moving further in a direction towards the power device 302, thereby preventing the movable plate 401 from falling off and jamming.

[0098] Optionally, as described above, the movable plate 401 can have a convex structure, as shown in FIG. 4, and the non-convex part of the movable plate 401 can constitute the resisting arm.

[0099] Optionally, the limiting arm 402 can be a baffle or a fixed screw.

[0100] Optionally, as shown in FIG. 4, the limiting arm 402 can contact the outer surface of the cold plate 304 close to the power device 302, and the limiting arm 402 can protrude or extend from the cold plate 304 in a direction towards the movable plate 401, thereby forming an arm-shaped structure. Alternatively, the cold plate 304 includes a groove for inserting the limiting arm 402 in addition to the groove for inserting the heat conduction module 303, wherein a part of the limiting arm 402 is inserted into the groove, and the other part can protrude or extend from the cold plate 304 in a direction towards the movable plate 401, thereby forming an arm-shaped structure.

[0101] Optionally, the shell 301 further comprises a protection part inside, the power device 302 can be located inside the protection part, the protection part can be a shell structure, and the protection part is located between the movable plate 401 and the shell 301. For example, when the power device 302 is an optical module, the protection part can be an optical cage for protecting the optical module, and the optical cage is located between the movable plate 401 and the shell 301.

[0102] Based on the above manner, by setting the protection part, the power device 302 can be protected, and the loss of the power device 302 can be reduced. For example, the protection part can be made of waterproof, moisture-proof or anti-friction material, so as to protect the power device 302.

[0103] Optionally, the protection part has heat conduction capacity. For example, the protection part can be made of metal material with good heat conduction, so that the heat generated during power supply can be quickly transmitted to the heat conduction module 303 through the protection part.

[0104] Optionally, as shown in FIG. 4, the electronic device 300 further comprises a stud 403, and the shell 301 and the cold plate 304 are fixed together through the stud 403. Thus, the positions of the shell 301 and the cold plate 304 can be fixed, so that a stable structure is formed between the shell 301 and the cold plate 304.

[0105] Optionally, when the shell 301 has multiple shell subparts, multiple studs 403 can be provided. As shown in FIG. 4, when there are two shell subparts, for example, shell subpart A and shell subpart B, two studs 403 can be provided, which are respectively used to fix the cold plate 304 and the shell subpart A, and the cold plate 304 and the shell subpart B together.

[0106] The overall structure of the electronic device 300 is introduced, and the internal structure of the part modules, modules or devices constituting the electronic device 300 is introduced.

[0107] First, the structure of the heat conduction module 303 is introduced.

[0108] In an optional implementation manner, the heat conduction module 303 comprises multiple heat conduction subparts, and each heat conduction subpart is in an elastic compression state when the power device 302 is located between the heat conduction module 303 and the shell 301.

[0109] For example, as shown in FIG. 5, the heat conduction module 303 can comprise six heat conduction subparts, and the six heat conduction subparts all have elasticity. When the power device 302 is located between the heat conduction module 303 and the shell 301, each heat conduction subpart in the six heat conduction subparts is in an elastic compression state.

[0110] Based on the above implementation manner, by setting multiple heat conduction sub-components, heat can be dispersed to multiple heat conduction sub-components. Compared with heat transfer through one heat conduction sub-component, the mode of setting multiple heat conduction sub-components can increase the heat conduction area, so that the heat dissipation efficiency is higher.

[0111] Optionally, in order to set as many heat conduction sub-components as possible, on the one hand, the area of the heat conduction sub-component should be as small as possible, that is, the area of the heat conduction sub-component should be less than a threshold value, for example, when the area of the groove of the cold plate 304 is 9 square centimeters, the area of the heat conduction sub-component should be less than 2 square centimeters; on the other hand, the space enclosed by the movable plate 401 and the groove wall should be as large as possible, for example, the area of the groove of the cold plate 304 can be increased.

[0112] In an optional implementation manner, the heat conduction module 303 includes an elastic part and a heat conduction part, the heat conduction part is inserted into the groove, and the elastic part is located in the heat conduction part. In the case that the power device 302 is located between the heat conduction module 303 and the shell 301, the elastic part is in an elastically compressed state.

[0113] Based on the above implementation manner, the heat conduction module 303 includes two parts, one is an elastic part for increasing the elasticity of the heat conduction module 303, and the other is a heat conduction part for increasing the heat conduction performance of the heat conduction part. Since the elastic part is located inside the heat conduction part, that is, the heat conduction part wraps the elastic part, when the heat conduction part receives heat from the power device 302, the heat can be transferred to the shell 301 through the heat conduction part. Since the elastic part has elasticity, in the case that the power device 302 is located between the heat conduction module 303 and the shell 301, the elastic part will be in an elastically compressed state, thus providing a counterforce to the heat conduction part. Due to the action of the counterforce, the heat conduction module 303 where the heat conduction part is located is in effective contact with the cold plate 304 and the sliding part, thereby improving the efficiency of heat transfer. The present application embodiment proposes this structure of the heat conduction module 303, which can solve the problem that the traditional interface heat conduction material is difficult to compress and rebound.

[0114] Examples of shapes and structures of the elastic part and the heat conduction part:

[0115] Optionally, the elastic part in the present application embodiment can have various shapes. Taking FIG. 7 as an example, FIG. 7 shows schematic diagrams of two forms of heat conduction modules 303, where the elastic part has two examples. In the left example, the elastic part is π-shaped, and in the right example, the elastic part is S-shaped.

[0116] Optionally, in the present application embodiment, the heat conduction part can have a film-like structure. The heat conduction part can be columnar or cuboid. The heat conduction part and the outer surface of the elastic part have multiple contact surfaces. Taking FIG. 7 as an example, the heat conduction part can wrap the elastic part.

[0117] Optionally, as shown in FIG. 7, the outer surface of the heat-conducting part can also include a groove, which can be used to insert the cold plate 304 or the movable plate 401, etc.

[0118] Optionally, a single-layer heat-conducting part can be provided, or a multi-layer heat-conducting part can be provided.

[0119] Examples of the materials of the elastic part and the heat-conducting part:

[0120] In an optional implementation, the material of the elastic part includes beryllium copper alloy, tin phosphorus alloy, phosphor bronze, stainless steel, or copper-titanium alloy.

[0121] Based on the above implementation, the elastic part can be made of metal alloys such as beryllium copper alloy and tin phosphorus alloy. On the one hand, these metal alloys have good heat-conducting performance, which is conducive to heat transfer of the heat-conducting module 303. On the other hand, these metal alloys have good elasticity, so that the elastic part has good elasticity.

[0122] Optionally, in addition to the above-mentioned metal alloys such as beryllium copper alloy and tin phosphorus alloy, the material of the elastic part in the embodiments of the present application can also be other materials with good elasticity, such as stainless steel, rubber, spring steel, spring copper, or spring aluminum.

[0123] In an optional implementation, the material of the heat-conducting part includes graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad, or carbon fiber.

[0124] Based on the above implementation, compared with water vapor injected into a heat pipe, the heat-conducting part of the embodiments of the present application is made of materials such as graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad, or carbon fiber, which have better heat-conducting performance and are more stable, thereby improving the heat transfer efficiency and stability of the heat-conducting part.

[0125] Optionally, in addition to the above-mentioned materials such as graphene, carbon-based heat-conducting pad, silicon-based heat-conducting pad, or carbon fiber, the heat-conducting part can also be made of other materials with good heat-conducting performance.

[0126] The structure of the cold plate 304 in the present application will be introduced as follows:

[0127] As described above, the cold plate 304 has a groove. Optionally, as shown in FIG. 5, the groove includes three parts, i.e., the parts on the left and right sides located on the same horizontal plane, and the part in the middle higher than the horizontal plane on the left and right sides, i.e., the part protruding in the middle. The part protruding in the middle and the movable plate 401 together enclose a containing space for accommodating the heat-conducting module 303. The parts on the left and right sides have a gap with the resisting arms of the movable plate 401. It is because of the existence of the gap that the sliding of the movable plate 401 will not be stuck.

[0128] For the convenience of understanding, the above electronic device will be introduced below in combination with specific examples.

[0129] The above electronic device is applied to an optical device, and the power device is taken as an example of an optical module. The heat conduction module and the cold plate are used for heat dissipation of the optical module.

[0130] Referring to FIG. 8, which is a schematic diagram of one embodiment provided by the present application, the electronic device 800 includes an upper shell 801, an upper optical cage 802, an upper movable plate 803, a cold plate 804, an upper heat conduction module 805, a lower heat conduction module 806, a lower movable plate 807, a lower shell 808, a lower optical cage 809, an upper stud 810 or a lower stud 811.

[0131] In the present embodiment, the upper optical cage 802 includes an upper optical module 812 (not shown in FIG. 8), and the lower optical cage 809 includes a lower optical module 813 (not shown in FIG. 8). The upper optical cage 802, the upper optical module 812 and the upper shell 801 together constitute an upper single board, and the lower optical cage 809, the lower optical module 813 and the lower shell 808 together constitute a lower single board. The upper shell 801 and the lower shell 808 are arranged in the middle of the upper optical module 812, the lower optical module 813, the upper heat conduction module 805, the lower heat conduction module 806 and the cold plate 804, and further include the upper optical cage 802 and the lower optical cage 809. The upper shell 801, the upper optical cage 802, the upper movable plate 803, the cold plate 804, the upper heat conduction module 805, the lower heat conduction module 806, the lower movable plate 807, the lower shell 808 and the lower optical cage 809 are arranged in sequence in a direction perpendicular to the upper shell 801.

[0132] In the present embodiment, the cold plate 804 has two grooves, and the upper heat conduction module 805 and the lower heat conduction module 806 are respectively inserted into the two grooves. In the case that the upper optical module 812 is located between the upper heat conduction module 805 and the upper shell 801, the upper heat conduction module 805 is in an elastically compressed state in a direction perpendicular to the surface of the cold plate 804. In the case that the lower optical module 813 is located between the lower heat conduction module 806 and the lower shell 808, the lower heat conduction module 806 is in an elastically compressed state in a direction perpendicular to the surface of the cold plate 804.

[0133] In the embodiment, the upper movable plate 803 and the upper groove wall of the cold plate 804 jointly form a receiving space for accommodating the upper heat conduction module 805, and the upper movable plate 803 and the upper groove wall have a gap. The lower movable plate 807 and the lower groove wall of the cold plate 804 jointly form a receiving space for accommodating the lower heat conduction module 806, and the lower movable plate 807 and the upper groove wall have a gap. For example, the upper movable plate 803 and the lower movable plate 807 are both convex structures or concave structures, that is, the middle part has a part that is higher than the two side parts, so that the middle part is convex or concave. The cold plate 804 also has a groove, so that the convex or concave part of the middle part of the upper movable plate 803 and the lower movable plate 807 and the groove of the cold plate 804 jointly form a receiving space for accommodating the upper heat conduction module 805 or the lower heat conduction module 806.

[0134] In the embodiment, the groove wall of the cold plate 804 forms an upper limiting arm (not shown in FIG. 8) in the direction towards the upper movable plate 803, and the groove wall of the cold plate 804 forms a lower limiting arm (not shown in FIG. 8) in the direction towards the lower movable plate 807. In FIG. 8, the position of the upper movable plate 803 and the spacing distance between the lower movable plate 807 and the cold plate 804 are described to be relatively large for the convenience of description, and the position of the upper movable plate 803 and the lower movable plate 807 can be inserted into the groove of the cold plate 804, and the gap between the two can be smaller. As shown in FIG. 8, the upper movable plate 803 and the lower movable plate 807 form abutting arms in the direction towards the groove wall of the cold plate 804.

[0135] In the embodiment, the upper stud 810 is used to fix the upper shell 801 and the cold plate 804 together, and the lower stud 811 is used to fix the lower shell 808 and the cold plate 804 together.

[0136] In the embodiment, the upper heat conduction module 805 and the cold plate 804 are topographically matched. As shown in FIG. 8, the upper surface of the cold plate 804 is groove-shaped, and the groove-shaped structure is matched with the shape of the outer surface of the upper heat conduction module 805, so as to accommodate the upper heat conduction module 805 and make the contact surfaces of the two match, thereby improving the contact stability. Similarly, the lower surface of the cold plate 804 and the shape of the outer surface of the lower heat conduction module are also matched.

[0137] In the embodiment, the upper heat conduction module 805 includes an elastic part and a heat conduction part. The heat conduction part is inserted into the groove of the cold plate 804, and the elastic part is located in the heat conduction part. In the case that the upper light module 812 is located between the upper heat conduction module 805 and the upper shell 801, the elastic part is in an elastically compressed state. The material of the elastic part can be beryllium copper alloy, tin phosphorus alloy, phosphor bronze, copper titanium alloy or stainless steel, etc. The material of the heat conduction part can be graphene, carbon-based heat conduction pad, silicon-based heat conduction pad or carbon fiber.

[0138] In the embodiments of the present application, in order to improve the heat dissipation efficiency, as shown in FIG. 8, eight upper movable plates 803 and eight lower movable plates 807 are arranged in the electronic device 800, and six upper heat conduction modules 805 and six lower heat conduction modules 806 are arranged.

[0139] Through the above embodiments, when the optical module (for example, the upper optical module 812) is inserted into the optical cage (for example, the upper optical cage 802), the optical module will be in contact with the movable plate (for example, the upper movable plate 803) due to the blocking of the shell. Due to the contact pressure, the movable plate will move towards the direction of the heat conduction module, increasing the contact pressure between the movable plate and the heat conduction module. Since the elastic part in the heat conduction module has elasticity, the heat conduction module will be in an elastic compression state at this time. Due to the elasticity of the heat conduction module and the contact pressure between the movable plate and the heat conduction module, the contact between the heat conduction module and the movable plate will be more closely. In addition, due to the elasticity of the heat conduction module, a counterforce will be applied to the movable plate and the cold plate, so that the movable plate and the optical module, and the heat conduction module and the cold plate are in effective contact. The embodiments of the present application solve the problem that the traditional thermal interface material cannot be compressed and does not have elasticity, and propose a composite structure of the heat conduction module. On the one hand, as mentioned above, the heat conduction module has elastic compression capability, which can enable the movable plate and the optical module, the heat conduction module and the movable plate, and the heat conduction module and the cold plate to be in effective contact, so that the heat is more effectively transferred from the optical module to the cold plate, improving the heat dissipation effect of the optical module. In addition, since the heat conduction part of the heat conduction module has strong heat conduction capability, it can reduce the thermal resistance between the optical module and the cold plate, thereby improving the efficiency of the optical module heat dissipation. Through calculation, when five heat conduction modules are arranged in the accommodating space surrounded by the movable plate and the cold plate, the comprehensive surface thermal resistance between the optical module and the cold plate is 4.6k / wCM2, which can meet the heat dissipation requirement of an 18W optical module. If the heat conduction capability of a single heat conduction module is continuously improved or the number of arrangements is increased, the heat dissipation capability can be further improved. On the other hand, since the heat conduction module has elasticity, and the movable plate and the optical module, the heat conduction module and the movable plate, and the heat conduction module and the cold plate can be in effective contact, the influence of the assembly tolerance between the optical module and the cold plate can be reduced.

[0140] In addition, in the embodiment of the present application, the movable plate is arranged between the optical module and the heat conduction module. On the one hand, since there is a gap between the movable plate and the groove of the cold plate, the movable plate can slide. When the optical module is inserted into the optical cage, heat is generated due to the operation of the optical module. Due to the force of the optical module on the movable plate, the movable plate slides towards the heat conduction module. This sliding can make the heat conduction module elastically compressed. As described above, the elastic compression can improve the heat dissipation of the optical module and accelerate the heat dissipation. When the optical module is pulled out of the optical cage, the optical module does not need to be cooled. Due to the elimination of the force between the movable plate and the optical module, the movable plate slides towards the optical module, so that the elastic compression of the heat conduction module is released. It can be seen that the electronic device of the present application can flexibly cool the optical module due to the up and down sliding of the movable plate, and the heat dissipation effect of the optical module is improved. On the other hand, the heat conduction module is located in the accommodating space surrounded by the movable plate and the cold plate. Therefore, the movable plate can protect the heat conduction module in a manner similar to a "shell" to prevent the heat conduction module from being damaged during the insertion and extraction of the optical module.

[0141] Furthermore, compared with a non-embedded contact scheme, such as a scheme in which a heat pipe is arranged between the cold plate and the power device, in which the heat pipe is not embedded in the cold plate but only in contact with the cold plate, in the embodiment of the present application, the heat conduction module is also arranged between the cold plate and the power device. The cold plate is provided with a groove, and the heat conduction module is inserted into the groove. It can be seen that the heat conduction module in the embodiment of the present application is embedded in the cold plate. This embedded design can shorten the distance between the end of the heat conduction module facing the power device and the cold plate, thereby reducing the thermal resistance. Therefore, when the end of the heat conduction module facing the power device receives heat from the power device, the heat can be transferred to the cold plate more quickly, thereby improving the heat dissipation effect.

[0142] The electronic device 300 provided by the embodiment of the present application is introduced above. In addition, the present application also provides a communication device, which comprises a circuit board and the electronic device as in any one of the possible implementation manners of FIG. 3. The power device of the electronic device is connected to the circuit board. For example, when the communication device is an optical device, the power device can be an optical module. For example, when the communication device is a computer, the power device can be a hard disk or a magnetic disk, etc.

Claims

1. An electronic device, characterized by comprising: The electronic device comprises a shell, a power device, a heat conduction module and a cold plate, the cold plate has a groove, the heat conduction module is located inside the groove, and the power device is located between the heat conduction module and the shell, and the heat conduction module is in an elastic compression state in a direction perpendicular to the surface of the cold plate.

2. Electronic device according to claim 1, characterized in that The electronic device further comprises a movable plate located between the power device and the heat conduction module, the movable plate and the groove wall jointly form a containing space for accommodating the heat conduction module, and the movable plate and the groove wall have a gap therebetween.

3. Electronic device according to claim 2, characterized in that The groove wall forms a limiting arm in a direction towards the movable plate, the movable plate forms a resisting arm in a direction towards the groove wall, the power device, the limiting arm and the resisting arm are arranged in sequence in a direction perpendicular to the cold plate, and the resisting arm and the limiting arm resist each other when the power device is not located between the heat conduction module and the shell.

4. Electronic device according to claim 2 or 3, characterized in that, A surface of the heat conduction module facing the movable plate comprises N first sub-regions, a surface of the movable plate facing the heat conduction module comprises N second sub-regions, each of the N first sub-regions is in contact with one of the N second sub-regions.

5. Electronic device according to any one of claims 1 to 4, characterized in that A surface of the cold plate facing the heat conduction module comprises M third sub-regions, a surface of the heat conduction module facing the cold plate comprises M fourth sub-regions, each of the M third sub-regions is in contact with one of the M fourth sub-regions.

6. Electronic device according to any one of claims 1 to 5, characterized in that, The heat conduction module comprises an elastic part and a heat conduction part, the heat conduction part is inserted into the groove, and the elastic part is located in the heat conduction part, and the elastic part is in an elastic compression state when the power device is located between the heat conduction module and the shell.

7. Electronic device according to claim 6, characterized in that The material of the elastic part comprises beryllium copper alloy, tin phosphorus alloy, phosphor bronze, stainless steel or copper titanium alloy.

8. Electronic device according to claim 6 or 7, characterized in that The material of the heat conduction part comprises graphene, carbon-based heat conduction pad, silicon-based heat conduction pad or carbon fiber.

9. Electronic device according to any one of claims 1 to 8, characterized in that The heat conduction module comprises a plurality of heat conduction sub-components, and each of the heat conduction sub-components is in an elastic compression state when the power device is located between the heat conduction module and the shell.

10. A communication device, characterized by The electronic device comprises a circuit board and the electronic device as claimed in any one of claims 1 to 9, and the power device of the electronic device is connected to the circuit board.

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