Circuit board, electronic module, and electronic device

Abstract

An electronic device. The electronic device comprises an electronic module; the electronic module comprises a circuit board; and the circuit board comprises a substrate, a pad, a pin connector, and a conductive via hole. A circuit is integrated on the substrate, and the pad is soldered to the outer surface of the substrate; the conductive via hole runs through the pad and the substrate, and the pad is conductively connected to the circuit through the conductive via hole; the pin connector is mounted on the pad and conductively connected to the pad; and the projection of the conductive via hole in the axial direction of the conductive via hole does not overlap with that of the pin connector in the axial direction of the conductive via hole.

Description

Circuit boards, electronic modules and electronic devices

[0001] Cross-references to related applications

[0002] This disclosure claims priority to Chinese Patent Application No. 202410947974.4, filed on July 15, 2024, entitled "Circuit Board, Electronic Module and Electronic Device", the entire contents of which are incorporated herein by reference.

[0003] This disclosure claims priority to Chinese Patent Application No. 202421673540.1, filed on July 15, 2024, entitled "Circuit Board, Electronic Module and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0004] This disclosure relates to the field of circuit board technology, and more specifically, to a circuit board, an electronic module, and an electronic device. Background Technology

[0005] A circuit board includes a substrate, pads connected to the substrate, circuits, pin connectors, and electronic components. For circuit boards with multiple wiring layers, conductive vias need to be made on the substrate to connect electronic components to different wiring layers. The conductive vias on the substrate are connected to the pads and circuits respectively, thereby realizing the connection between electronic components and the circuits of the wiring layers. Summary of the Invention

[0006] The purpose of this disclosure is to provide a subframe assembly and a vehicle to solve the technical problems existing in the related art.

[0007] To achieve the above objectives, a first aspect of this disclosure provides a circuit board comprising:

[0008] A substrate on which circuitry is integrated;

[0009] The solder pads are soldered to the outer surface of the substrate.

[0010] A pin connector, mounted on the pad and electrically connected to the pad; and

[0011] A conductive via is provided, which penetrates the pad and the substrate. The pad is electrically connected to the circuit through the conductive via. The projection of the conductive via along its axial direction does not coincide with the projection of the pin connector along the axial direction of the conductive via.

[0012] Optionally, the distance between the pin connector and the conductive via is between a first preset distance and a second preset distance.

[0013] Optionally, the conductive via includes a first segment and a second segment, the first segment penetrating the pad and the second segment penetrating the substrate, the first segment being close to the edge of the pad.

[0014] Optionally, the conductive via and the pad form an L-shape.

[0015] Optionally, the wall of the conductive via has a conductive layer, and the pad is electrically connected to the circuit through the conductive layer.

[0016] Optionally, the circuit includes multiple wiring layers, which are stacked along the thickness direction of the substrate. The multiple wiring layers include a top wiring layer, a bottom wiring layer, and at least one inner wiring layer located between the top wiring layer and the bottom wiring layer. The pad is electrically connected to at least one inner wiring layer through the conductive via, or the pad is electrically connected to the bottom wiring layer through the conductive via.

[0017] Optionally, at least a portion of the conductive via is filled with a via-filling material; the via-filling material fills the portion of the conductive via away from the pad.

[0018] The plugging material is an insulating material.

[0019] Optionally, the pin connector includes a connecting portion and an extension portion. The connecting portion is connected to the side of the pad away from the substrate, and the extension portion is connected to the end of the connecting portion away from the conductive via and extends obliquely in the direction away from the substrate.

[0020] According to a second aspect of this disclosure, an electronic module is provided, including the circuit board as described above.

[0021] According to a third aspect of this disclosure, an electronic device is provided, including the electronic module described above.

[0022] Through the above technical solution, conductive vias penetrate the pads and the substrate, and the pads can be electrically connected to the circuits through the conductive vias. On the one hand, since the conductive vias are opened on the pads, they do not occupy space other than the pads (i.e., there is no need to pre-set space on the substrate for the conductive vias to pass through), thus making the arrangement of related structures on the circuit board more compact, thereby improving the integration rate of the circuit board. Furthermore, opening the above-mentioned conductive vias on the pads will not be affected by the interference or interference of the electronic components or substrate size near the pads, thus enabling the pin connectors to adapt to different assembly scenarios.

[0023] In addition, the projection of the conductive via along its axial direction does not coincide with the projection of the pin connector along the axial direction of the conductive via. In other words, the pin connector does not cover the conductive via. This avoids the problem of the solder paste flowing into the conductive via being vaporized in the reflow oven and causing the gas generated to impact the pin connector, resulting in misalignment of the pin connector. Furthermore, since the above problem does not exist, there is no need to perform an electroplating filling process on the conductive via, thus reducing the processing cost of the circuit board.

[0024] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 is a cross-sectional schematic diagram of a circuit board provided in an exemplary embodiment of the present disclosure, wherein via plugging material partially fills the conductive vias.

[0027] Figure 2 is a structural block diagram of an electronic module provided in an exemplary embodiment of this disclosure.

[0028] Figure 3 is a structural block diagram of an electronic device provided in an exemplary embodiment of this disclosure. Detailed Implementation

[0029] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0030] In this disclosure, unless otherwise stated, the orientation terms used indicate orientations or positional relationships defined based on the drawing directions shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational construction and operation. Therefore, they should not be construed as limitations on this disclosure. The terms "inner" and "outer" refer to the inner and outer contours of the corresponding structures.

[0031] Additionally, the "thickness direction" can be seen in the orientation shown in Figure 1. It should also be noted that terms such as "first" and "second" are used to distinguish one element from another and do not indicate sequence or importance. Furthermore, in the description referring to the accompanying drawings, the same reference numerals in different drawings denote the same element.

[0032] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connect," "link," and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0033] To save space on the substrate, the inventors discovered an improvement by creating conductive vias on the pads. While this method solves the problem of conductive vias occupying substrate space, solder paste on the substrate can easily flow into the conductive vias. When the circuit board passes through the reflow oven, the solder paste in the conductive vias vaporizes into gas, impacting the pin connectors connected to the pads, thus affecting the stability and lifespan of the circuit board. Referring to Figure 1, according to a first aspect of this disclosure, a circuit board 1 is provided, including a substrate 10, pads 20, and pin connectors 30. Circuitry 11 is integrated on the substrate 10, and pads 20 are soldered to the outer surface of the substrate 10. The circuit board 1 has conductive vias 40 that penetrate the pads 20 and the substrate 10. The pads 20 are conductively connected to the circuitry 11 through the conductive vias 40. The pin connectors 30 are mounted on the pads 20 and conductively connected to them. The projection of the conductive vias 40 along their axial direction does not coincide with the projection of the pin connectors 30 along the axial direction of the conductive vias 40.

[0034] Through the above technical solution, the conductive via 40 penetrates the pad 20 and the substrate 10, and the pad 20 can be electrically connected to the line 11 through the conductive via 40. On the one hand, since the conductive via 40 is opened on the pad 20, the conductive via 40 will not occupy space other than the pad 20 (that is, there is no need to pre-set space on the substrate 10 for the conductive via 40 to pass through), so that the arrangement of related structures on the circuit board 1 can be more compact, thereby improving the integration rate of the circuit board 1. On the other hand, the conductive via 40 opened on the pad 20 will not be affected by the interference or interference of the electronic components and the size of the substrate 10 near the pad 20, so that the pin connector 30 can adapt to different assembly scenarios.

[0035] Furthermore, since the conductive via 40 is located at the end of the pin connector 30, the stub length can be shortened, thereby improving the signal integrity and performance of the circuit board design, reducing interference and loss during signal transmission, and thus improving the reliability and stability of the system. In addition, the projection of the conductive via 40 along its axial direction does not coincide with the projection of the pin connector 30 along the axial direction of the conductive via 40. In other words, the pin connector 30 does not cover the conductive via 40. This avoids the problem of the solder paste flowing into the conductive via 40 vaporizing and causing gas to impact the pin connector 30, resulting in misalignment. Moreover, because the above problem does not exist, there is no need to perform an electroplating filling process on the conductive via 40, thus reducing the processing cost of the circuit board 1.

[0036] To prevent the conductive via 40 from detaching from the pad 20 due to an excessively large distance between it and the pin connector 30, the distance between the pin connector 30 and the conductive via 40 provided in this disclosure should be within a preset range. Specifically, in this disclosure, the distance between the pin connector 30 and the conductive via 40 is located between a first preset distance and a second preset distance. This can be understood as the distance between the conductive via 40 and the pin connector 30 being within a range greater than the first preset distance and less than the second preset distance. Within this range, the space occupied on the circuit board 1 can be reduced, and the distance between the conductive via 40 and the pin connector 30 can be reduced or prevented from causing the solder paste flowing into the conductive via 40 to vaporize and impact the pin connector 30 during reflow oven operation, thus preventing misalignment of the pin connector 30 and improving the stability and accuracy of the pin connector 30 during use.

[0037] To further reduce the impact of the gas generated by the vaporization of solder paste flowing into the conductive via 40 during reflow oven on the pin connector 30, the distance between the pin connector 30 and the conductive via 40 should be large enough, provided that space on the substrate 10 allows.

[0038] Optionally, the conductive via 40 may include a first segment and a second segment, with the first segment penetrating the pad 20 and the second segment penetrating the substrate 10, and the first segment being close to the edge of the pad 20. In this way, without occupying the area of ​​the substrate 10, the conductive via 40 is positioned as close as possible to the edge of the pad 20, thereby increasing the distance between the first segment of the conductive via 40 and the pin connector 30, which is also located on the pad 20, and reducing the impact of gases generated when the solder paste is heated on the pin connector 30.

[0039] In one exemplary embodiment provided in this disclosure, as shown in FIG1, the conductive via 40 can form an L-shape with the pad 20. In this case, when both the conductive via 40 and the pin connector 30 are provided on the pad 20, the distance between the conductive via 40 and the pin connector 30 provided on the pad 20 can be maximized.

[0040] To facilitate the connection of the pad 20 to the circuit 11 via the conductive via 40, as shown in FIG1, the wall of the conductive via 40 has a conductive layer 41, through which the pad 20 can be electrically connected to the circuit 11. The conductive layer 41 can be deposited on the wall of the conductive via 40 by electroplating.

[0041] This disclosure does not limit the specific material of the conductive layer 41. For example, in one exemplary embodiment provided in this disclosure, the conductive layer 41 may optionally be a copper layer. Copper has advantages such as good conductivity, high current carrying capacity, good stability, oxidation resistance, and corrosion resistance, which can provide a better connection effect between the pad 20 and the line 11.

[0042] In other embodiments provided in this disclosure, the conductive layer 41 may also be made of conductive metal materials such as aluminum or iron, which will not be elaborated here.

[0043] Optionally, as shown in Figure 1, the circuit 11 includes multiple wiring layers 12, which are stacked along the thickness direction of the substrate 10. Each wiring layer 12 includes a top wiring layer 121, a bottom wiring layer 122, and at least one inner wiring layer 123 located between the top and bottom wiring layers 121 and 122. The pads 20 are electrically connected to at least one inner wiring layer 123 via conductive vias 40, or the pads 20 are electrically connected to the bottom wiring layer 122 via conductive vias 40. In this way, operators can electrically connect the pads 20 to the inner wiring layer 123 or the bottom wiring layer 122 as needed to meet the connection requirements of different electronic components to different wiring layers.

[0044] In an embodiment where the pad 20 is connected to the circuit 11 via the conductive layer 41 of the conductive via 40, the conductive layer 41 extending along the thickness direction of the substrate 10 can be selectively connected to the inner wiring layer 123 or the bottom wiring layer 122.

[0045] To further improve the stability of the circuit board 1, optionally, at least a portion of the conductive vias 40 are filled with via-filling material 50. The via-filling material 50 filling the conductive vias 40 can prevent solder paste on the pads 20 from flowing into the conductive vias 40 during reflow soldering of the circuit board 1, thereby avoiding the problem of cold solder joints caused by insufficient solder on the pads 20.

[0046] Optionally, the via plugging material 50 is an insulating material. In this way, the via plugging material 50 can prevent the solder paste from entering the conductive via 40 during reflow soldering, thereby avoiding the risk of insufficient solder on the pad 20 and resulting in cold solder joints, and further improving the stability and yield of the circuit board 1.

[0047] In one exemplary embodiment provided in this disclosure, the pore-filling material 50 is green oil, or in another exemplary embodiment provided in this disclosure, the pore-filling material 50 may also be resin. In short, this disclosure does not limit the pore-filling material 50, as long as it can meet the corresponding pore-filling effect.

[0048] When plugging the conductive via 40, either a full plugging or a partial plugging method can be used. Specifically, when a partial plugging operation is required for the conductive via 40, the plugging material 50 can be ink or resin. When a full plugging operation is required for the conductive via 40, resin can be used as the plugging material 50. In the case of a partial plugging operation, in this disclosure, the plugging material 50 can fill the portion of the conductive via 40 away from the pad 20.

[0049] Optionally, as shown in FIG1, the pin connector 30 may include a connecting portion 31 and an extension portion 32. The connecting portion 31 is connected to the side of the pad 20 away from the substrate 10, and the extension portion 32 is connected to the end of the connecting portion 31 away from the conductive via 40 and extends obliquely in the direction away from the substrate 10.

[0050] It should be noted that, as shown in Figure 1, in the embodiment where the first section of the conductive via 40 is located near the edge of the pad 20, the connecting portion 31 should be connected to the other edge of the pad 20 away from the conductive via 40, thereby increasing the distance between the conductive via 40 and the connecting portion 31 and reducing the impact of the gas generated by the solder paste when heated on the connecting portion 31.

[0051] Additionally, it should be noted that, for the embodiment of the pin connector 30 including the connecting portion 31 and the extension portion 32, the aforementioned projection of the conductive via 40 along its axial direction does not coincide with the projection of the pin connector 30 along the axial direction of the conductive via 40. This means that the projection of the conductive via 40 along its axial direction does not coincide with the projection of the connecting portion 31 along the axial direction of the conductive via 40. In other words, the distance between the connecting portion 31 of the pin connector 30 and the conductive via 40 is greater than or equal to zero.

[0052] Similarly, in the embodiment where the pin connector 30 includes a connecting portion 31 and an extension portion 32, electronic components can be electrically connected to the connecting portion 31 through the extension portion 32, thereby achieving electrical connection between the pad 20 and the conductive via 40 connected to the connecting portion 31.

[0053] As shown in FIG2, according to a second aspect of the present disclosure, an electronic module 100 is provided, including the circuit board 1 as described above.

[0054] As shown in Figure 3, according to a third aspect of this disclosure, an electronic device 200 is provided, including the electronic module 100 as described above. This electronic device 200 possesses all the beneficial effects of the electronic module 100 and the circuit board 1, which will not be elaborated upon further in this disclosure.

[0055] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0056] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0057] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A circuit board (1), characterized in that, The circuit board (1) comprises: a substrate (10) having a circuit (11) integrated thereon; a pad (20) welded on an outer surface of the substrate (10); a pin connector (30) mounted on the pad (20) and electrically connected with the pad (20); and a conductive via (40) penetrating the pad (20) and the substrate (10), the pad (20) being electrically connected with the circuit (11) through the conductive via (40), and a projection of the conductive via (40) along an axial direction thereof does not coincide with a projection of the pin connector (30) along an axial direction of the conductive via (40). A distance between the pin connector (30) and the conductive via (40) is between a first preset distance and a second preset distance.

2. The circuit board (1) according to claim 1, characterized in that The conductive via (40) comprises a first segment penetrating the pad (20) and a second segment penetrating the substrate (10), and the first segment is close to an edge of the pad (20).

3. The circuit board (1) according to claim 1 or 2, characterized in that The conductive via (40) and the pad (20) form an L shape.

4. The circuit board (1) according to claim 3, characterized in that A hole wall of the conductive via (40) has a conductive layer (41), and the pad (20) is electrically connected with the circuit (11) through the conductive layer (41).

5. The circuit board (1) according to any one of claims 1-4, characterized in that, The circuit (11) comprises a plurality of wiring layers (12) stacked along a thickness direction of the substrate (10), and the plurality of wiring layers (12) comprise a top wiring layer (121), a bottom wiring layer (122), and at least one inner wiring layer (123) between the top wiring layer (121) and the bottom wiring layer (122), the pad (20) is electrically connected with at least one of the inner wiring layers (123) through the conductive via (40), or the pad (20) is electrically connected with the bottom wiring layer (122) through the conductive via (40).

6. The circuit board (1) according to any one of claims 1-5, characterized in that At least part of the conductive via (40) is filled with a plug material (50), and the plug material (50) is filled in a portion of the conductive via (40) away from the pad (20).

7. The circuit board (1) according to any one of claims 1-6, characterized in that, The plug material (50) is an insulating material. The pin connector (30) comprises a connecting portion (31) connected to a side of the pad (20) away from the substrate (10), and an extending portion (32) connected to an end of the connecting portion (31) away from the conductive via (40) and extending in a direction away from the substrate (10).

8. The circuit board (1) according to any one of claims 1-7, characterized in that The circuit board (1) according to any one of claims 1-8.

9. An electronic module (100), characterized by The electronic module (100) according to claim 9.

10. An electronic device (200), characterized by ​

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