Apparatus and method for separating an electronics component from a flexible, adhesive film

Abstract

The present disclosure relates to the field of electronics component handling, in particular to the separation of an individual electronics component from a flexible, adhesive film positioned on a support platform with the use of an ejector needle and a component pick up unit. A control unit operates at least the component pick up unit and the at least one ejector needle, such, that, in a first operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at a component separation section, the support platform and the at least one ejector needle are displaced with respect from each other, causing the ejector needle to move through the corresponding through opening and against the flexible, adhesive film, thereby elevating the electronics component to be separated at a separation level above the support platform, and, in a second operation conditional condition, the component pick up unit is positioned at a pick up level above the elevated electronics component to be separated without contacting the elevated electronics component.

Description

[0001] TITLE

[0002] APPARATUS AND METHOD FOR SEPARATING AN ELECTRONICS COMPONENT FROM A FLEXIBLE, ADHESIVE FILM

[0003] TECHNICAL FIELD

[0004] The present disclosure relates to the field of electronics component handling, in particular to the separation of an individual electronics component from a flexible, adhesive tape.

[0005] BACKGROUND OF THE DISCLOSURE

[0006] Conventional semiconductor chip manufacturing involves the processing of semiconductor wafers with on one side an array of semiconductor devices. These wafers are then sliced into individual chips or dies using known dicing techniques after being mounted on flexible, adhesive wafer handling tape or film. The flexible, adhesive film holds the plurality of individual semiconductor dies and aids in transport during the subsequent semiconductor die handling and mounting process steps.

[0007] The individual semiconductor dies are separated from the flexible, adhesive tape by a separating apparatus, and the separated semiconductor dies are subsequently handled separated by pick-and-place equipment, e.g. placed on a lead frame etc.

[0008] The separation of an individual semiconductor die from the flexible, adhesive film and its subsequent handling is susceptible to die-crack. Die-crack is a well-known failure mode in thin chip die bonding applications. Wafers with a thickness smaller than 70 pm run a high risk of die crack occurrences under mechanical or thermal stress from the handling or the processing. Because the wafer thickness relates to the product power performance, a thinner wafer improves the electrical resistance of the chip (RDSon) and minimizes the power loss.

[0009] Accordingly, in view of the need for semiconductor chips in MOSFET, SiC and GaN power applications having an even more thinner wafer thickness, it is a goal of the present disclosure to provide an improved apparatus and method for separating an individual electronics component from a flexible, adhesive film. It is noted, that the disclosure is not limited to separating semiconductor dies from a flexible, adhesive film, but is also applicable for any similar process of handling a large number of individual electronics components arranged on a flexible, adhesive film, such as capacitors, resistors, LEDs, etc. etc.

[0010] SUMMARY OF THE DISCLOSURE

[0011] According to a first example of the disclosure, an apparatus for separating an electronics component from a flexible, adhesive film is proposed. The apparatus comprises a support platform with a support surface provided with a component separation section having at least one through opening. The support platform is structured - during use - to accommodate on the support surface a flexible, adhesive film with at least one electronics component to be separated being oriented at the component separation section.

[0012] Furthermore, the apparatus is provided with a needle ejector unit comprising at least one ejector needle as well as a component pick up unit mounted above the support platform and movable with respect to the component separation section. A control unit operates at least the component pick up unit and the at least one ejector needle, such, that, in a first operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, the support platform and the at least one ejector needle are displaced with respect from each other, causing the ejector needle to move through the corresponding through opening and against the flexible, adhesive film, thereby elevating the electronics component to be separated at a separation level above the support platform, and, in a second operation conditional condition, the component pick up unit is positioned at a pick up level above the elevated electronics component to be separated without contacting the elevated electronics component.

[0013] In particular, a distance gap between the pick up level and the elevation level is sufficiently small, such that the component pick up unit is capable of separating the elevated electronics component from the flexible, adhesive film.

[0014] As outlined in the introduction, the electronics component pick-up process is the most critical phase to induce mechanical stress in the die chip. In conventional needle pick-up application, power chips are clamped between push-up needles and the component pick up unit, resulting in a pick-up force on the die chip. For a reliable and fast process, clamping forces in the range of 0.3 - 3 Newton will induce stresses in the separated electronics components depending on the contact area, the die material, the geometrical properties of the component pick up unit, and the exact separation-and-pick up process sequence.

[0015] With the apparatus according to the disclosure the above drawbacks are obviated. After the ejector needle has moved against the flexible, adhesive film, and elevated the electronics component to be separated, the flexible, adhesive film will have been peeled off from the bottom side of the electronics component to be separated. The component pick up unit is then able to lift the electronics component from the elevated ejector needle(s) with minimal mechanical stresses induced. This will reduce the chance of die damage or failure.

[0016] In order to facilitate the separation of the electronics component from the flexible, adhesive film in the most efficient way, the distance gap amounts 0.1 - 1 mm.

[0017] To assist in an efficient release of the electronics component from the flexible, adhesive film without the occurrence of any adverse mechanical stresses, the control unit is furthermore structured, in the second operation condition, to displace the support platform in a direction away from the component pick up unit. Herewith, it is achieved that the electronics component, being engaged by the component pick up unit, is peeled off from the flexible, adhesive film.

[0018] In a further advantageous example according to the disclosure, the component pick up unit is provided with suction means for separating, in the second operational condition, the elevated electronics component from the flexible, adhesive film, e.g. using an under pressure. The vacuum force applied by the component pick up unit is much stronger than the remaining adhesive force between the flexible, adhesive film and the elevated electronics component to be separated, allowing the separation of the electronics component with minimal mechanical stresses induced.

[0019] In particular, the vacuum force creates an airflow in the defined gap between the component pick-up unit and the upper surface side of the electronics component. The resulting under pressure - and subsequent lift occurs because of Bernoulli principle: high air velocity means low pressure at the upper surface side, P1. At the bottom surface side of the electronics component resting on the elevated ejector needles, the environmental pressure is still present, P0. When the lift force created (P0-P1 * Surface Area of the Electronics Component) is larger than the remaining adhesion force from the flexible, adhesive film, the electronics component releases from the flexible, adhesive film.

[0020] In a further example, the control unit is structured, in the first operation condition, to position the component pick up unit at a position level significantly larger than the separation level above the support platform. Herewith it is avoided that the component pick up unit adversely contacts the electronics component during its initial elevation on the ejector needles.

[0021] In particular, the needle ejector unit comprises a plurality of ejector needles and the component separation section is provided with a corresponding plurality of through openings. The use of multiple ejector needles for elevating the flexible, adhesive film together with the electronics component to be separated results in a proper force equilibrium with no excessive pressure points, thus minimizing any mechanical stress in the material of the electronics component.

[0022] According to a further example according to the disclosure, the apparatus further comprises a vacuum unit structured to fixate, in the first operational condition, the flexible, adhesive film on the supporting surface using an under pressure. Herewith the flexible, adhesive film is properly stabilized and fixated on the support platform allowing a proper releasing of the electronics component from the flexible, elastic film upon elevation.

[0023] In particular, a part of the support platform adjacent to or surrounding the component separation section is provided with a plurality of suction openings operatively connected with the vacuum unit. Accordingly, the flexible, adhesive film on the supporting surface is fixated using an under pressure, whereas the part of the flexible, adhesive film together with the electronics component to be separated atop the component separation section is not fixated. Likewise, only the flexible, adhesive film atop the component separation section can be effectively pushed-up by the ejector needle(s) for elevating the electronics components, allowing a proper releasing of the electronics component from the flexible, elastic film upon elevation. In particular, the flexible, elastic film is peeled off from the electronics component upon elevation.

[0024] The apparatus may further comprise an XY-displacement unit for orienting, prior to the first operation condition, the flexible, adhesive film with the electronics component to be separated relative to the component separation section. This facilitates a proper elevation of the electronics component to be separated. The disclosure also pertains to a method of separating an electronics component from a flexible, adhesive film using an apparatus according to any one of more of the preceding claims. The method comprising the steps of: i) providing a flexible, adhesive film with at least one electronics component to be separated on the support platform; ii) orienting the at least one electronics component to be separated at the component separation section; iii) moving the support platform and the at least one ejector needle with respect from each other, causing the at least one ejector needle to move through the corresponding through opening and against the flexible, adhesive film, thereby elevating the electronics component to be separated at a separation level above the support platform, iv) positioning the component pick up unit at a pick up level above the elevated electronics component to be separated without contacting the elevated electronics component, wherein v) separating, using the component pick up unit, the elevated electronics component from the flexible, adhesive film.

[0025] Herewith it is possible to lift the electronics component from the elevated ejector needle(s) with minimal mechanical stresses induced. This will reduce the chance of die damage or failure.

[0026] According to a further detail of the method according to the disclosure, it comprises the step, prior to step iii) but after step ii), of vi) fixating the flexible, adhesive film on the supporting surface using an under pressure. This allows for an effective stabilization and fixation of the flexible, adhesive film on the support platform allowing a proper releasing of the electronics component from the flexible, elastic film upon elevation.

[0027] Furthermore, step v) may comprise the step of separating the elevated electronics component from the flexible, adhesive film using an under pressure. The under pressure force applied - by the component pick up unit - is much stronger than the remaining adhesive force between the flexible, adhesive film and the elevated electronics component to be separated, allowing the separation of the electronics component with minimal mechanical stresses induced.

[0028] In particular, the vacuum force creates an airflow in the defined gap between the component pick-up unit and the upper surface side of the electronics component. The resulting under pressure - and subsequent lift occurs because of Bernoulli principle: high air velocity means low pressure at the upper surface side, P1. At the bottom surface side of the electronics component resting on the elevated ejector needles, the environmental pressure is still present, PO. When the lift force created (P0-P1 * Surface Area of the Electronics Component) is larger than the remaining adhesion force from the flexible, adhesive film, the electronics component releases from the flexible, adhesive film.

[0029] In a detail of the method according to the disclosure, step iv) comprises the step of setting a distance gap between the pick up level and the separation level above the support platform between 0.1 - 1 mm.

[0030] BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The disclosure will now be discussed with reference to the drawings, which show in:

[0032] Figures 1 A-1 D an example of an apparatus for separating an electronics component from a flexible, adhesive film according to the state of the art, depicting various known method steps of separating an electronics component from a flexible, adhesive film;

[0033] Figures 2A-2D an example of an apparatus for separating an electronics component from a flexible, adhesive film according to the disclosure, depicting various method steps according to the disclosure of separating an electronics component from a flexible, adhesive film;

[0034] Figure 3 a further detail of an apparatus for separating an electronics component from a flexible, adhesive film according to the disclosure.

[0035] DETAILED DESCRIPTION OF THE DISCLOSURE

[0036] For a proper understanding of the disclosure, in the detailed description below corresponding elements or parts of the disclosure will be denoted with identical reference numerals in the drawings.

[0037] Figures 1a-1d depict a known apparatus for separating an electronics component from a flexible, adhesive film. As outlined in the introduction, in pick-and-place processing large number of individual electronics components arranged on a flexible, adhesive film, such as capacitors, resistors, LEDs, etc. etc. are to be separated from the flexible, adhesive film in an automated manner and there is ongoing need to avoid any damage to the separated electronics component during the separation process.

[0038] An example of such process is the handling of individual chips or dies mounted on flexible, adhesive wafer handling tape or film. The flexible, adhesive film holds the plurality of individual semiconductor dies and aids in transport during the subsequent semiconductor die handling and mounting process steps. The separation of each individual semiconductor die from the flexible, adhesive tape is done with the assistance of a separating apparatus, and a recurring risk of the separation of an individual semiconductor die from the flexible, adhesive film and its subsequent handling is die-crack.

[0039] An example of the occurrence of die-crack is shown in relation to Figures 1A-1 D. Reference numeral 10 denotes a flexible, adhesive film with a first, adhesive film surface 10a and a second, bottom film surface 10b, opposite to the first film surface 10a. The first, adhesive film surface 10a carries a large number of electronics components 11 (11 and 11’ in Figure 3) often arranged in an array, e.g. a semiconductor die or another type of electronics component (resistor, LED, etc. etc.). For the sake of clarity, the disclosure will be explained with the processing or separation of semiconductors dies 11 (11-11’ in Figure 3) from the flexible, adhesive film 10. Furthermore, for the sake of simplicity for clarifying the phenomenon of diecrack (or electronics component damage during separation) and the improved separation principle of the present disclosure, Figures 1A-1 D and 2A-2D depict the flexible, adhesive film 10 having only one electronics component 11 to be separated.

[0040] The electronics component 11 (semiconductors die) has a first component side 11a and a second component side 11b, opposite to the first component side 11a. For a proper understanding of the disclosure, it is noted that the electronics component 11 is adhered to the first, adhesive film surface 10a of the flexible, adhesive film 10 with its second component side 11 b, whereas the exposed first component side 11a is intended to be grasped in a suitable manner by a component pick up unit and separated from the flexible, adhesive film 10.

[0041] In Figure 1A, an apparatus 100 for separating an electronics component 11 from a flexible, adhesive film 10 is disclosed. The electronics component separation apparatus 100 is centered around a support platform 110 with a support surface 110a. The support surface 110a includes a component separation section 111. For separating a particular electronics component 11 from the flexible, adhesive film 10, the flexible, adhesive film 10 is oriented on the support surface 110a with the respective electronics component 11 to be separated being oriented atop the component separation section 111.

[0042] The support platform 110 is provided in the component separation section 111 with at least one through opening 112 through which a corresponding ejector needle 131 of a needle ejector unit 130 is slidable accommodated. Usually, various through openings 112 are present in the support platform 110 / component separation section 111 , and through each of the through openings 112 an ejector needle 131 is slidable accommodated. The needle ejector unit 130 is capable of actuating the various ejector needles 131 in an upward and downward movement, causing the ejector needles 131 to slide within their through openings 112 and to extend above the support surface 110a (and the component separation section 111).

[0043] A component pick up unit 120 mounted above the support platform 110 and is movable using suitable actuating means (not shown and less relevant for the understanding of the present disclosure) with respect to the support platform 110 and in particular to the component separation section 111. The component pick up unit 120 is provided with a pick-up surface 120a, which serves to interact with and to separate and pick up the individual electronics component 11 , the latter being oriented within the component separation section 111. After separation and pick-up, the component pick up unit 120 will subsequently remove the separated electronics component 11 out of the sphere of the support platform 110 (sic. the component separation section 111) and towards a next process station for further processing and handling (not relevant for a proper understanding of the disclosure).

[0044] In the prior art separation techniques, the component pick up unit 120 is actuated and moved into the sphere of the support platform 110 and positioned at a certain height above the component separation section 111 and the electronics component 11 to be separated. This situation is depicted in Figure 1A.

[0045] Next, see Figure 1 B, the component pick up unit 120 is moved (clarified with the downward pointing arrow F) towards the electronics component 11 , such that the pick-up surface 120a engages the upper, exposed electronics component side 11a. Simultaneously, see Figure 1C, the various ejector needles 131 are actuate by the ejector needle unit 130 and contact the second, bottom film surface 10b of the flexible, adhesive film 10. The needles 131 push the flexible, adhesive film 10 together with the electronics component 11 in an upward manner against the component pick up unit 120, thereby facilitating a proper adhering of the electronics component 11 with the pick-up surface 120a, in particular with the assistance of air suction through vacuum nozzles (not shown) present in the pick-up surface 120a.

[0046] As shown in Figure 1 D, the now separated electronics component 11 can be removed out of the sphere of the support platform 110.

[0047] The combined action of the component pick up unit 120 moving in a downward direction and the flexible, adhesive film 10 being pushed in an upward direction by means of the ejector needles 131 results in a clamping effect, which is illustrated in Figure 1C by means of pressure points 20 at the locations where the ejector needles 131 press through the flexible, adhesive film 10 against the second, bottom component side 11 b. These localized pressure points are the main cause for damage to the electronics component, in particular causing die crack in the semiconductor die 11 to be separated.

[0048] The present disclosure presents a solution for the above die-crack phenomenon. See Figures 2A-2D. The electronics component separation apparatus 1000 according to the disclosure implements a control unit 140 which operates at least the component pick up unit 120 and the ejector needle unit 130 with the at least one ejector needle 131. In particular the control unit 140 actuates, via a suitable control line 130z, the ejector needle unit 130, in a first operational condition with the flexible, adhesive film 10 accommodated on the support platform 110 with the at least one electronics component 11 to be separated being oriented atop the component separation section 111 , such that the ejector needle(s) 131 are moved through their corresponding through opening 112 and against the first, bottom film surface 10b of the flexible, adhesive film 10.

[0049] The actuation of the ejector needle unit 130 and the various ejector needles 131 by the control unit 140 cause a local deformation and elevation of the flexible, adhesive film 10 and the electronics component 11 to be separated towards an elevation level or separation level Ls above the support platform 110, see Figure 2B. Note that in the first operation condition depicted in both Figure 2A and 2B, during the elevation of the flexible, adhesive film 10 and the electronics component 11 towards the height of the separation level Ls, the component pick up unit 120 is positioned or oriented outside the sphere of the component separation section 111 or in the situation that the component pick up unit 120 is positioned or oriented inside the sphere of the component separation section 111 , its position (orientation) is at least at a height position level Ah above the support platform 110 (see Figure 2A), which height position level Ah is significantly larger (greater) than the separation level Ls.

[0050] Alternatively, the control unit 140 displaces the support platform 110 with respect to the ejector needle unit 140, wherein the latter stays stationary and the support platform 110 is moved away from the ejector needle unit 140. This version of actuation also causes the ejector needle(s) 131 to move through their corresponding through opening 112 and against the first, bottom film surface 10b of the flexible, adhesive film 10.

[0051] In all examples, typical needle speeds may be from 1 mm / s up to 50 mm / s, in some cases up to 100 mm / s. The speed of the component pickup unit 120 may be up to a few 100 mm / s.

[0052] Accordingly, unlike the prior art separation technique, wherein the component pick up unit 120 moving in a downward direction towards the flexible, adhesive film 10 being pushed in an upward direction thereby clamping the electronics component, in the present disclosure no such clamping takes place.

[0053] Next, Figures 2C and 2D depict a second operation conditional condition of the electronics component separation apparatus 1000 according to the disclosure. In the second operation conditional condition, the control unit 140 actuates the component pick up unit 120 via a suitable control line 120z, and moves the component pick up unit 120 within the component separation section 111 towards a pick up level LP above the elevated electronics component 11 to be separated without contacting the elevated electronics component 11. In particular, the positioning of the component pick up unit 120 at the pick up level LP, which level is slightly greater than the elevation level Ls ensures a distance gap Ag to exist between the pick up level LP and the elevation level Ls. The control unit 140 controls the component pick up unit 120 towards its the pick up level LP, such that the distance gap Ag sufficiently small, such that the component pick up unit 120 is capable of separating the elevated electronics component 11 from the flexible, adhesive film 10.

[0054] In order to facilitate the separation of the electronics component from the flexible, adhesive film in the most efficient way, the distance gap Ag amounts 0.1 -1 mm.

[0055] As the ejector needles 131 have moved against the second, bottom film surface of the flexible, adhesive film 10, the electronics component 11 to be separated is elevated and part of the flexible, adhesive film 10 has been peeled off from the bottom component side 11 b of the electronics component 11. The component pick up unit 120 is able to lift the electronics component 11 from the elevated ejector needle(s) 131 with minimal mechanical stresses induced. This will reduce the chance of die damage or failure.

[0056] In particular, the component pick up unit 120 is configured as a die collet pick up tool provided with suction means 121 , which in turn are controlled by the control unit 140 via a suitable control line 121z. The suction means 121 separate, in the second operational condition, the elevated electronics component 11 from the flexible, adhesive film 10, e.g. using an under pressure. The vacuum force (arrow P in Figure 2C) applied by the suction means 121 is much stronger than the remaining adhesive force between the flexible, adhesive film 10 and the elevated electronics component 11 to be separated.

[0057] The vacuum force creates an airflow (denoted with AIR in Figure 2C) in the defined gap Ag between the die collet pick-up unit 120 and the upper surface side 11a of the electronics component 11 . The resulting under pressure - and subsequent lift occurs because of Bernoulli principle: high air velocity means low pressure at the top surface side, P1. At the bottom surface side 11 b of the electronics component 11 resting on the elevated ejector needles 131 , the environmental pressure is still present, P0. When the lift force created (P0-P1 * Surface Area of the Electronics Component) is larger than the remaining adhesion force from the flexible, adhesive film 10, the electronics component 11 releases from the flexible, adhesive film 10. Herewith separation of the electronics component 11 is achieved with minimal mechanical stresses induced.

[0058] Typically, the under pressure being generated amounts approximately 0.7 bar. Up to 0.3 bar under pressure can also be applicable

[0059] Similarly, the needle ejector unit 130 preferably comprises a plurality of ejector needles 131 and the component separation section 111 is accordingly provided with a corresponding plurality of through openings 112, which allow for a proper force equilibrium during elevation with no excessive pressure points. This minimizes any mechanical stress in the material of the electronics component 11.

[0060] Reference numeral 150 denotes a vacuum unit of the apparatus 1000, which is structured to fixate, in the first and second operational condition, the flexible, adhesive film 10 on the supporting surface 110a using an under pressure. The support platform 110 is provided with various vacuum suction opening 151 , which are operatively in air suction communication with the vacuum unit 150 via corresponding suction line 151z. The vacuum unit 150 is likewise actuated and controlled by the control unit 140 by means of a suitable control line 150z. Herewith the flexible, adhesive film 11 is properly stabilized and fixated on the support platform 110 allowing a proper releasing of the electronics component 11 from the flexible, elastic film 10 upon elevation.

[0061] In particular, the various suction openings 151 are positioned at a location of the support platform which is not part of the component separation section 111. Preferably, the various suction openings 151 are located in the support surface 110a adjacent to or surrounding the component separation section 111. This ensures, that the flexible, adhesive film 10 on the supporting surface 110a is fixated using an under pressure, whereas the part of the flexible, adhesive film 10 together with the electronics component 11 to be separated atop the component separation section 111 is not fixated. Herewith, only the flexible, adhesive film 10 atop the component separation section 111 can be effectively pushed-up by the ejector needle(s) 131 for elevating the electronics component 11 , allowing a proper releasing of the electronics component 11 from the flexible, elastic film 10 upon elevation.

[0062] To assist in an efficient release of the electronics component 11 from the flexible, adhesive film 10 without the occurrence of any adverse mechanical stresses, in an alternative example the control unit 140 is structured, in the second operation condition, to displace the support platform 110 in a direction away from the component pick up unit 120. Accordingly, the apparatus 1000 implements a platform displacement unit 160 (see Figure 2D), which is controlled by the control unit 140 via a control line 160z. The platform displacement unit 160 actuates in response to a control signal from the control unit 140, in the second operational condition, by means of actuating line 161z the support platform 110 in a direction away from the component pick up unit 120. As the flexible, adhesive film 10 is being held on the support surface 110a by means of the vacuum applied through the suction openings 151 of the vacuum unit 150z, the flexible, adhesive film 10 is likewise retracted in a direction away from the component pick up unit 120 and the electronics component 11 being engaged by the component pick up unit 120. Herewith, it is achieved that the various contact points between the flexible, adhesive film 10 and the electronics component 11 are interrupted and the electronics component 11 is peeled off from the flexible, adhesive film 10.

[0063] Although not shown in the Figures, the apparatus 1000 according to the disclosure may further comprise an XY-displacement unit for orienting, prior to the first operation condition, the flexible, adhesive film 10 with the electronics component 11 to be separated relative to the component separation section 111. This facilitates a proper elevation of the electronics component to be separated.

[0064] The disclosure also pertains to a method of separating an electronics component 11 from a flexible, adhesive film 10 using an apparatus 1000 according to disclosure. The method comprising the steps of: i) providing a flexible, adhesive film 10 with at least one electronics component 11 to be separated on the support platform 110 of the apparatus 1000; ii) orienting the at least one electronics component 11 to be separated being oriented at the component separation section 111 of the support platform; iii) moving the support platform 110 and the at least one ejector needle 131 with respect from each other, causing the at least one ejector needle 131 to move through the corresponding through opening 112 and against the flexible, adhesive film 10, thereby elevating the electronics component 11 to be separated at a separation level Ls above the support platform 110, iv) positioning the component pick up unit 120 at a pick up level LP above the elevated electronics component 11 to be separated without contacting the elevated electronics component 11 , v) separating, using the component pick up unit 120, the elevated electronics component 11 from the flexible, adhesive film 10.

[0065] In particular, step iv) comprises the step of setting a distance gap Ag between the pick up level LP and the separation level Ls above the support platform 110 between 0.1 - 1 mm.

[0066] Furthermore, step v) may comprise the step of separating the elevated electronics component 11 from the flexible, adhesive film 10 using an under pressure. The under pressure force applied - by the component pick up unit 120 - is much stronger than the remaining adhesive force between the flexible, adhesive film 10 and the elevated electronics component 11 to be separated, allowing the separation of the electronics component with minimal mechanical stresses induced. The airflow into the distance gap Ag creates an under pressure and the electronics component 11 is airlifted and transferred from the adhesive film 10 to the component pick-up unit 120, and after contact held by the vacuum force of the component pick-up unit 120.

[0067] According to a further detail of the method according to the disclosure, it comprises the step, prior to step iii) but after step ii), of vi) fixating the flexible, adhesive film 10 on the supporting surface 110a using an under pressure. This allows for an effective stabilization and fixation of the flexible, adhesive film 10 on the support platform 110 allowing a proper releasing of the electronics component 11 from the flexible, elastic film 10 upon elevation.

[0068] Figure 3 depicts in more detail an example of the electronics component separation apparatus 1000 according to the disclosure. It depicts the support platform 110, the component pick up unit 120 and the ejector needle unit 130 with a number of ejector needles 131. The support platform 110 has a component separation section 111 provided with through openings 112 for the ejector needles 131.

[0069] A flexible, adhesive film 10 is provided with a large number of electronics components 11 ’ which are arranged in an array on top of the first, adhesive film surface 10a. The flexible, adhesive film 10 has to be accommodated on the support platform 110 such that the electronics component 11 to be separated is oriented at the component separation section 111. This centring can be done by means of an XY- displacement unit (not shown). The flexible, adhesive film 10 can be fixated on the supporting surface 110a using an under pressure by means of the vacuum unit 150 (not shown). This ensures a proper stabilization and fixation on the support platform 110, thereby allowing a proper releasing of the electronics component 11 from the flexible, elastic film 10 upon elevation.

[0070] As shown in Figure 3, the actuation of the ejector needle unit 130 and the various ejector needles 131 cause a local deformation and elevation of the flexible, adhesive film 10 and the electronics component 11 to be separated towards an elevation level above the support platform 110. It is shown that the elevation of the electronics component 11 cause the adhesive film surface 10a of the flexible, adhesive film 10 to release locally from the second, bottom component side 11b of the electronics component 11.

[0071] The electronics component 11 only contacts the flexible, adhesive film 10 at the contact points caused by the elevated ejector needles 131. This minimal contact between the flexible, adhesive film 10 and the component 11 results in a minimal adhesive force between the flexible, adhesive film 10 and the elevated electronics component 11 . This minimal adhesive force can easily be overcome by the vacuum force (under pressure) generated by the suction means 121 in the distance gap Ag between the pick up surface 120a of the pick up unit 120 and the first, top component side 11 a of the electronics component 11. LIST OF REFERENCE NUMERALS USED

[0072] 10 flexible, adhesive film

[0073] 10a first, adhesive film surface

[0074] 10b second, bottom film surface

[0075] 11 electronics component

[0076] 11a first component surface

[0077] 11b second component surface

[0078] 20 pressure point

[0079] 100 electronics component separation apparatus

[0080] 110 support platform

[0081] 110a support surface

[0082] 111 component separation section

[0083] 112 through opening

[0084] 120 component pick up unit

[0085] 120a pick up surface

[0086] 120z signal line for component pick up unit

[0087] 121 suction means of component pick up unit

[0088] 130 needle ejector unit

[0089] 131 ejector needle

[0090] 130z control line for needle ejector unit

[0091] 140 control unit

[0092] 150 vacuum unit

[0093] 150z vacuum unit control line

[0094] 151 suction opening

[0095] 151z suction line

[0096] 160 platform displacement unit

[0097] 160z control line for platform displacement unit

[0098] 161z actuating line for platform displacement unit

[0099] Ls elevation level or level of separation

[0100] LP pick up level

[0101] Ag distance gap between the pick up level and the elevation level

[0102] Ah initial pick up level

Claims

CLAIMS1. An apparatus for separating an electronics component, such as an electronics component or a light emitting device, LED, from a flexible, adhesive film, the apparatus comprising: a support platform having a support surface provided with a component separation section having at least one through opening; a needle ejector unit comprising at least one ejector needle; a component pick up unit mounted above the support platform and movable with respect to the component separation section, as well as a control unit for operating at least the component pick up unit and the at least one ejector needle, wherein the control unit is structured, in a first operational condition with the flexible, adhesive film accommodated on the support platform with the at least one electronics component to be separated being oriented at the component separation section, to• displace the support platform and the at least one ejector needle with respect from each other, causing the ejector needle to move through the corresponding through opening and against the flexible, adhesive film, thereby elevating the electronics component to be separated at a separation level above the support platform, and structured, in a second operation conditional condition, to• position the component pick up unit at a pick up level above the elevated electronics component to be separated, wherein a distance gap between the pick up level and the elevation level is sufficiently small, such that the component pick up unit is capable of separating the elevated electronics component from the flexible, adhesive film.

2. The apparatus according to claim 1 , wherein the distance gap amounts 0.1 - 1 mm.

3. The apparatus according to claim 1 or 2, wherein the component pick up unit is provided with suction means for separating, in the second operational condition, the elevated electronics component from the flexible, adhesive film.

4. The apparatus according to any one or more of the preceding claims, wherein the control unit is structured, in the second operation condition, to displace the support platform in a direction away from the component pick up unit.

5. The apparatus according to any one or more of the preceding claims, wherein the control unit is structured, in the first operation condition, to orient the component pick up unit at a position level significantly larger than the separation level above the support platform.

6. The apparatus according to any one or more of the preceding claims, wherein the needle ejector unit comprises a plurality of ejector needles and the component separation section is provided with a corresponding plurality of through openings.

7. The apparatus according to any one or more of the preceding claims, wherein the apparatus further comprises a vacuum unit structured to fixate, in the first operational condition, the flexible, adhesive film on the supporting surface.

8. The apparatus according to claim 6, wherein part of the support platform adjacent to or surrounding the component separation section is provided with a plurality of suction openings operatively connected with the vacuum unit.

9. The apparatus according to any one or more of the preceding claims, wherein the apparatus further comprises an XY-displacement unit for orienting, prior to the first operation condition, the flexible, adhesive film with the electronics component to be separated relative to the component separation section.

10. A method of separating an electronics component from a flexible, adhesive film using an apparatus according to any one of more of the preceding claims, the method comprising the steps of: i) providing a flexible, adhesive film with at least one electronics component to be separated on the support platform; ii) orienting the at least one electronics component to be separated being oriented at the component separation section; iii) moving the at least one ejector needle through the corresponding through opening and against the flexible, adhesive film, thereby elevating the electronics component to be separated at a separation level above the support platform, iv) positioning the component pick up unit at a pick up level above the elevated electronics component to be separated without contacting the elevated electronics component, wherein v) separating, using the component pick up unit, the elevated electronics component from the flexible, adhesive film.

11. The method according to claim 10, further comprising the step, prior to step iii) but after step ii), of vi) fixating the flexible, adhesive film on the supporting surface using an under pressure.

12. The method according to claim 10 or 11 , wherein step v) comprises the step of separating the elevated electronics component from the flexible, adhesive film using an under pressure.

13. The method according to any one or more of the claims 10-12, wherein step iv) comprises the step of setting a distance gap between the pick up level and the separation level above the support platform between 0.1 - 1 in mm.

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