Method for mounting components and device suitable therefor

Abstract

The invention relates to a method for reducing position-dependent placement errors during the bonding of a component on a substrate using a device (100) having a mounting head carrier (200), a carriage (210), and a shuttle carriage (220), which comprises an optical alignment device (400) and a mounting head (150), wherein repeatable movements of the shuttle carriage (220) between two positions enable a higher positioning accuracy and / or positioning speed.

Description

[0001] Method for component assembly and suitable device for this purpose

[0002] Technical field

[0003] The invention relates to a method for component assembly and a device suitable for carrying out the method for component assembly, for example for assembling a chip, the use of which reduces device-related placement errors and / or increases the assembly speed.

[0004] State of the art

[0005] Similar devices are known from the prior art. For example, US 10861819 B1 describes a method and device for positioning an assembly head. After a chip has been picked up by a bonding head, a first optical system observes and determines the position and orientation of the chip relative to the bonding head. Separately, a second optical system observes and determines the position and orientation of the bonding site, also called the bond position, when the focal plane of the second optical system is configured at a first distance from the second optical system. After the bonding head has been moved close to the second optical system, the second optical system is able to observe and determine the position and orientation of the assembly head when the focal plane of the second optical system is configured at a second distance from the second optical system.The position and orientation of the chip then make it possible to correct a relative offset between the chip and the bonding site before the chip is placed on the bonding position.

[0006] Also known from US 10973158 B2 is a device and a method for mounting components onto a substrate. The component mounting device comprises a bonding head with a component gripper, a first drive system for moving a carrier over longer distances, a second drive system attached to the carrier for moving the bonding head back and forth between a nominal working position and a standby position, a drive attached to the bonding head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier, and at least one component camera. Either the second drive system is also designed for high-precision corrective movements with the bonding head, or a third drive system is provided that performs high-precision corrective movements with the substrate. At least one component camera is mounted on the bonding head or on the component gripper.Reference mark attached.

[0007] Other similar systems are also known from patent specifications DE 10 2022 135 081 A1 , JP 2002-176 291 A , DE 10 2014 103 373 A1 , WO 2020 / 026563A1 or JP 2000-114 787 A.

[0008] Common portal-type systems comprise an X-beam running along the X-axis of an XY coordinate system and a Y-beam running along the Y-axis of the same system. The Y-beam is mounted on the X-beam in a movable and / or traversable manner. Several system components are typically attached to the Y-beam, including assembly tools, a complete assembly head with tools, or specialized assembly heads such as a bonding head. The alignment of the assembly tool, and ultimately the component itself, to the substrate on which it is to be placed and mounted is generally achieved using upward- and / or downward-facing cameras.

[0009] A major problem with all portal-type systems is the deformation of their X and / or Y beams due to factors such as weight, distortion, bending, torsion, temperature, so-called bimetallic effects, or other disturbances, which can also affect the beams from the external environment. This type of deformation impairs the linearity of the positioning system itself and thus leads to fixture-related placement errors when positioning components. Furthermore, system components mounted directly in the working area of ​​an assembly fixture, such as cameras in optical positioning systems, cause strong non-linear effects, which make position correction significantly more complex and further limit the achievable performance of portal-type systems.

[0010] Task

[0011] One objective of the invention is to provide an improved method for component assembly and a suitable device for this purpose in order to reduce device-related placement errors and / or increase the assembly speed.

[0012] Solution to the task

[0013] This problem is solved by the technical method and the technical device according to the independent claims. Technically advantageous embodiments of the method and the device are the subject of the dependent claims, the description, and the drawings.

[0014] Invention description

[0015] In a first aspect, a method for component assembly at a component placement position on a substrate is provided, which uses a device suitable for component assembly for its execution.

[0016] A device suitable for carrying out the method for component assembly comprises a mounting head for the component to which it can be releasably attached. The mounting head is configured and arranged so that it can be positioned at the component placement position. In this context, a position refers to a predetermined setpoint within the range of a drive or actuator. In the case of interconnected drives or actuators, a position refers to a predetermined setpoint within the combined operating range of the combined drives or actuators.

[0017] An assembly head preferably comprises one or more, in particular interchangeable, assembly tools for mounting components. Embodiments of an assembly head which, for example, include specific tools for bonding, for instance by means of thermocompression, are specifically referred to as bond heads.

[0018] The device for component assembly also includes an assembly head carrier which is designed and arranged to move the assembly head along a first direction and to position and place the component at the component placement position.

[0019] The mounting head support comprises a carriage designed and arranged for moving the mounting head a first path length along the first direction. The mounting head support also comprises a pendulum carriage designed and arranged for moving the mounting head a second path length along the first direction. The mounting head support further comprises an optical alignment device for determining the component placement position, wherein the optical alignment device and the mounting head are spaced apart from each other by a predetermined distance along the first direction.In one aspect of the method for assembling one or more components and one or more substrates, the first step is to move the pendulum carriage into a predetermined first working position, followed by a step of moving the carriage along the first direction, preferably the first, so that the component placement position lies within the field of view of the optical alignment device. The next steps are to determine the component placement position and to move the pendulum carriage along the first direction from the first working position by the predetermined distance into a second working position in order to move the assembly head to the previously determined component placement position.The next step, preferably a further movement of the pendulum carriage and / or the carriage along the first direction to move the assembly head to the previously determined component placement position, has the advantage, in the preferred case of a further movement of the pendulum carriage and / or the carriage by the predetermined distance, that it is a corrective movement resulting from the determination of the component's position at the placement position. This corrective movement, according to the invention, is significantly smaller than the preferred first movement, which is achieved by moving the pendulum carriage along the first direction from the first working position by the predetermined distance to a second working position. Preferably, the further movement is in a size ratio of 1:50 to 1:100 to 1:1000 relative to the first movement.The next step, at the component placement position, is the assembly of the component onto the substrate.

[0020] The consistent, repeatable movement of the pendulum carriage increases positioning accuracy, as the motion sequence and the use of the assembly head carrier can be optimized to ensure a high degree of positional stability and accuracy at at least two positions. For example, a predefined first pendulum carriage position is used to determine the position of one or more components and to define one or more component placement positions, while a predefined second pendulum carriage position is used for processing, such as picking up or placing one or more components. Additional first and / or second positions are possible for further efficiency gains.

[0021] The identical, repeatable movement of the pendulum carriage also enables an increase in positioning speed due to a reduced settling time at the at least two positions. Additionally, positioning accuracy at at least two positions is significantly improved by using only one measurement for alignment at a position within the work area, followed by a predefined, repeatable movement.

[0022] Additionally or alternatively, moving the pendulum carriage along the first direction from the first pendulum carriage position by the specified distance to a second pendulum carriage position can also be advantageous, because the movement can be carried out in such a way that it is performed together with a corrective movement of the carriage along the first path length in order to reduce an effect on positioning accuracy due to a degree of deformation along the first path length.

[0023] Additionally or alternatively, the corrective movement can also be carried out by moving the pendulum carriage along the first direction.

[0024] Additionally or alternatively, moving the shuttle carriage along the first direction from the first position by a predetermined distance to a second position can also be advantageous because the movement of the shuttle carriage can be calibrated at least partially at a first position along the first path length, and a similar or identical movement of the shuttle carriage at a second position along the first path length can be performed, thus maintaining a high degree of positioning accuracy. Preferably, therefore, complete calibration at the second position along the first path length is not required for these steps. Optionally, the degree of positioning accuracy can be increased by at least partial calibration of the movement of the shuttle carriage at the second position along the first path length.

[0025] Additionally or alternatively, the positioning speed can be further increased by using a lightweight design for the pendulum carriage, as the movement can be performed with a reduced travel distance of the carriage along the first path length compared to the previous travel distance. Such a lightweight design utilizes materials of low density and preferably high stiffness.

[0026] In another aspect of the process, prior to mounting the component at the component placement position on the substrate, the mounting head and / or the substrate are additionally moved along a second direction to move the mounting head to the previously determined component placement position.

[0027] The degree of positioning accuracy can be increased by providing one or more movements along the second direction. One or more movements along the first direction can be performed before one or more movements along the other one or more directions.

[0028] Additionally or alternatively, one or more movements along the first direction can be made after one or more movements along one or more other directions.

[0029] Additionally or alternatively, one or more movements along the first direction can be performed at approximately the same time as one or more movements along one or more other directions. Additionally or alternatively, one or more movements along the first direction can be performed simultaneously with one or more movements along one or more other directions.

[0030] In another aspect of the procedure, the movement of the pendulum carriage is relative to the running carriage, and the first path length is greater than the second path length.

[0031] In a further optional aspect of the process, the component assembly device also includes a component holding position. The process further comprises the following steps: Moving the pendulum carriage to the first working position and moving the trolley along the first direction so that the component holding position lies within the field of view of the optical alignment device for determining the component's position on the holding position. Determining the component's position on the holding position. Moving the pendulum carriage along the first direction from the first working position by the predetermined distance to a second working position to move the assembly head to the previously determined position of the component on the holding position. Moving the pendulum carriage and / or moving the trolley along the first direction to move the assembly head to the previously determined component holding position and releasably securing the component on the assembly head.

[0032] In a further optional aspect of the process, the mounting head is also designed and arranged in such a way that it is movable along a third direction, the third direction being perpendicular to the first direction and perpendicular to the second direction.

[0033] In a further optional aspect of the procedure, the process also includes the step of determining the position using one or more alignment markers. Figure description

[0034] Further advantages and features of the invention will become apparent from the following figures, namely:

[0035] FIG. 1A schematically shows a component assembly device;

[0036] FIG. 1 B schematically shows a component assembly device in which the pendulum carriage is positioned at a first working position;

[0037] FIG. 1 C schematically shows a component assembly device in which the pendulum carriage is positioned at a second working position;

[0038] FIG. 2A and FIG. 2B schematically show a component assembly device for mounting one or more components and one or more substrates, in which at least partially the method for bonding one or more components and one or more substrates is carried out near a bonding position;

[0039] FIG. 3A and FIG. 3B schematically show a component assembly device for mounting one or more components and one or more substrates, in which at least partially the method for picking up one or more components and one or more substrates is carried out near a picking position.

[0040] The figures show a first axis 910, a second axis 920, and a third axis 930 to facilitate the comparison of the different views and parts. The first axis 910 is perpendicular to the second axis 920, and the third axis 930 is perpendicular to both the first axis 910 and the second axis 920. It is assumed that, in use, the first axis 910 runs in a Y direction, the second axis 920 in an X direction, and the third axis 930 in a Z direction. Typically, the Y-axis 910 and the X-axis 920 are essentially horizontal, horizontal, or nearly horizontal in use. In operation, the X-axis 920 and the Y-axis 910 can be interchanged. Conventionally, the Z-axis 930 is essentially vertical, vertical, or nearly vertical in use.To clarify the description of the various components, the illustrations show parts in these conventional orientations. To further clarify the description of the different components, some relative terms, such as top, side, and bottom, have been used to adhere to this convention.

[0041] The device described in this disclosure can be designed and arranged by a person skilled in the art to operate with various deviations from the conventional orientations and nominal coordinate axes.

[0042] Detailed description of the figures

[0043] FIG. 1A shows a schematic top view of a first embodiment of a component mounting device 100 for mounting one or more components 600 onto one or more substrates 300. The component mounting device 100 can, for example, be a chip component mounting device. The chips are generally rectangular, but other polygonal or round shapes are also possible.

[0044] The component assembly method for mounting one or more components 600 on preferably a substrate 300 is not limited to chips as such. For the purposes of the invention, the assembly of one or more components 600 also includes components selected from the group comprising one or more dies, one or more semiconductor packages, one or more processed semiconductor substrates with integrated circuits, one or more optical elements, as well as one or more further substrates themselves for mounting on the substrate 300, or any combination thereof.

[0045] In a first embodiment of the method, a component is bonded to a substrate.

[0046] In a second embodiment of the method, one or more components are bonded to a substrate. In a third embodiment of the method, a component is bonded to one or more substrates.

[0047] In a fourth embodiment of the method, the number of components bonded to each substrate is specified.

[0048] In a fifth embodiment of the method, the number of components bonded to each substrate is controlled during the process.

[0049] In a sixth embodiment of the method, the number of substrates to be connected to each component is controlled during use.

[0050] In a seventh embodiment of the method, one or more of embodiments one, two, three, four, five, or six are combined. The one or more substrates 300 used for the method of assembling one or more components 600 can be one or more metallic substrates, also referred to as one or more leadframes, on which the components are bonded onto islands arranged sequentially and optionally side by side. However, the method of assembling one or more components 600 and one or more substrates 300 is not limited to leadframes. Therefore, the one or more substrates 300 can be any object that has at least one bondable surface and at least one component placement position.For example, one or more substrates 300 can be selected from the group comprising one or more metallic substrates, one or more substrate strips, one or more conductor frames, one or more printed circuit boards, one or more wafers, one or more other components 600, or any combination thereof. The one or more substrates 300 can also be referred to as one or more media. The one or more substrates can be any suitable substrate comprising one or more semiconductor materials and / or one or more glasses. FIG.Figure 1A shows a schematic top view of the relevant parts of the first embodiment of the component assembly device 100 when viewed from a plane that includes the X-axis 920, which is nominally shown to have a positive direction from right to left, and the Y-axis 90, which is nominally shown to have a positive direction from bottom to top.

[0051] FIG. 1A also shows the Z-axis 920, which is nominally depicted as a positive direction extending outwards from the side. FIG. 1A therefore represents a schematic top view of the plane encompassing the X-axis 920 and the Y-axis 910, seen in the direction of the negative Z-axis 930.

[0052] FIG. 1A also shows a schematic top view of a component placement position 800 included in the first embodiment of the component assembly device 100, wherein the component placement position 800 is configured and arranged to receive, provide, and / or release one or more substrates 300 for bonding to one or more components 600. The assembly head carrier 200 is arranged such that it is movable along the first axis 910 in the positive direction towards the component placement position 800 to a substrate position 850 along the first path length 710.

[0053] FIG. 1A also shows a schematic top view of a component holding position 820 included in the first embodiment of the component assembly device 100, wherein the component holding position 820 is configured and arranged to receive, hold, and / or release one or more components 600 for bonding onto one or more substrates 300. In the first embodiment of the component assembly device 100, the one or more components 600 can be provided, for example, by a component feeding system (not shown), such as a wafer, a storage area, or a belt. The assembly head carrier 200 is arranged to be movable along the first axis 910 in the negative direction relative to the component holding position 820 at a component position 840 along the first path length 710. The one or more components 600 can be held on the component holding position 820 using suitable means.For example, one or more components 600 can be held releasably by using a certain degree of vacuum by providing one or more vacuum grooves (not shown) in a base at the component holding position 820.

[0054] The one or more substrates 300 can be held at the component placement position 800 using any suitable means. For example, the one or more substrates 300 can be releasably held by using a certain degree of vacuum, by providing one or more vacuum grooves (not shown) in a base at the component placement position 800, or by using a mechanical hold-down device at the component placement position 800. The first embodiment of the component assembly device 100 is configured and arranged such that at least part of a bonding process (not shown) is provided at the component placement position 800.During at least one part of the bonding process, the one or more components 600 are in contact with the one or more substrates 300, such that one or more parts of a bonding process can be carried out on at least one part of the one or more bonding surfaces of the component 600 and / or the one or more substrates 300 (not shown). The one or more bonding surfaces are typically at least part of a mutual area of ​​contact between the component 600 and / or one or more substrates 300.

[0055] As shown in FIG. 1A, the first embodiment of the component assembly device 100 comprises a mounting head 150 for releasable attachment to the one or more components 600, which is configured and arranged so that it can be positioned at the component placement position 800.

[0056] As shown in FIG. 1A, the first embodiment of the component assembly device 100 also includes an assembly head carrier 200, which is configured and arranged to move the assembly head 150 and an optical alignment device 400 along the Y-axis 910 (the first direction 910) to insert the one or more components 600 at the component placement position 800.

[0057] As shown in FIG. 1A, the mounting head support 200 comprises a carriage 210, which is designed and arranged for the movement of the mounting head 150 and the optical alignment device 400 in a positive and / or negative direction along the first direction 910 over a first path length 710. The mounting head support 200 also comprises a pendulum carriage 220, which is attached to the carriage 210.

[0058] The assembly head carrier 200, like all other figures, is movable in a positive direction along the first axis 910 to a first carriage position 217 on the carriage encoder 215 of the carriage carrier 500, i.e., over the first path length 710, and the pendulum carriage 220 is movable in a positive direction along the first axis 910 relative to the carriage 210 to the first pendulum carriage position 227 on the pendulum carriage encoder 225 of the pendulum carriage 210, i.e., over the second path length 720, as can be seen for all other figures.

[0059] All other figures also share with FIG. 1A the feature that the optical alignment device 400 is located directly above the component placement position 800 at the first carriage position 217 on the first path length 710 and at the first pendulum carriage position 227 on the second path length 720. In general, the position of the optical alignment device 400 along the first axis 910 is determined by a suitable combination of the first carriage position 217 on the first path length 710 and the first pendulum carriage position 227 on the second path length 720.

[0060] FIG. 1B and FIG. 1C show the same mounting head support 200 as depicted in FIG. 1A, but with a clearer illustration of a possible sequence of relative movements that can be made between the pendulum carriage 220 and the trolley 210. The mounting head support 200 is arranged to be movable along the first axis 910 to a first trolley position 217 over the first path length 710 in a positive and / or negative direction. As shown in FIG. 1B and FIG. 1C, the mounting head support 200 also includes a pendulum carriage 220, which is designed and arranged for the movement of the mounting head 150 and the optical alignment device 400 in a positive and / or negative direction along the first axis 910 over a second path length 720.The pendulum carriage 220 is arranged to be movable in a positive and / or negative direction along the first axis 910 relative to the carriage 210 to a first pendulum carriage position 227 in the second path length 720 and to a second pendulum carriage position 228 in the second path length 720. The mounting head 150 and the optical alignment device 400 are rigidly attached to the pendulum carriage 220 to be arranged to be moved in a positive and / or negative direction along the first axis 910 relative to the carriage 210 over the second path length 720.

[0061] FIGS. 1B and 1C show an embodiment of a mounting head carrier 200, in which the mounting head 150 and the optical alignment device 400 are arranged along the first axis on the pendulum carriage 220 such that, by displacing the pendulum carriage 220 along the first axis, either the mounting head 150 or the optical alignment device 400, depending on the direction of displacement, assumes the original position of the optical alignment device 400 or the mounting head 150 before the displacement of the mounting head 150 or the optical alignment device 400, wherein the distance between the mounting head 150 and the optical alignment device 400 is in each case less than the second path length 720.

[0062] Figure 1B shows the positioning of the pendulum carriage 220 at the pendulum carriage position 227. The optical alignment device 400 is positioned at an arbitrary, but known, position P along the first axis.

[0063] In FIG. 1 C, the positioning of the pendulum carriage 220 at the pendulum carriage position 228 is shown after a displacement of the pendulum carriage 220 along the first axis in a positive direction by a distance of 730, so that the mounting head 150 is now at position P, i.e. at the original position of the optical alignment device 400.

[0064] Preferably, the pendulum carriage 220 and the running carriage 210 are designed and arranged such that they have similar coefficients of thermal expansion.

[0065] As shown in FIG. 1A, the mounting head carrier 200 is also arranged to move at least two positions of the pendulum carriage 220 along the first axis 910 in the negative direction relative to the component holding position 820 at component position 840 on the carriage carrier 500 by a first travel length 710. In the illustrated example, the mounting head carrier 200 is arranged to move the mounting head 150 and the optical alignment device 400 along the first axis 910 in the negative direction relative to the component holding position 820 at component position 840 by the first travel length 710.

[0066] As shown in FIGS. 1A and 1B, the mounting head carrier 200 also includes the optical alignment device 400, which is configured and arranged to detect the position of one or more first alignment marks at the component placement position 800, wherein the optical alignment device 400 and the mounting head 150 are spaced apart by a predetermined distance 730 along the first direction 910. As shown in FIGS. 1A and 1B, in the first embodiment of the component mounting device 100, the optical alignment device 400 is also configured and arranged to detect the position of one or more second alignment marks of the component 600 at the component receiving position 820.

[0067] The optical alignment device 400 and the one or more first alignment marks and / or the one or more second alignment marks are preferably configured and arranged such that sufficiently accurate optical alignment is possible to ensure reliable production within the required bond accuracy. For example, a camera can be used as the optical alignment device. In particular, CMOS-based optical detection devices can also be used.

[0068] The one or more first alignment marks at the component placement position 800 can be any suitable alignment marks. For example, the one or more first alignment marks can be selected from the group that includes: one or more physical features of at least a part of a substrate 300, one or more optical features of at least a part of a substrate 300, one or more physical features of the component placement position 800, one or more optical features of the component placement position 800, at least a part of an alignment mark, or any combination thereof.

[0069] The one or more second alignment marks of the component at the component receiving position 820 can be any suitable alignment mark. The one or more second alignment marks can, for example, be selected from the group comprising: one or more physical features of at least a part of a component 600, one or more optical features of at least a part of a component 600, at least a part of an alignment mark, or any combination thereof. The optical alignment device 400 and the one or more first alignment marks and / or the one or more second alignment marks are preferably designed and arranged to provide optical alignment with high accuracy. For example, one or more alignment marks can be provided at the component placement position 820 and / or on the component 600 at the component receiving position 800.

[0070] For example, surface structures can be used for position detection using one or more physical features. Surface structures can also be used for position detection using one or more optical features. For example, alignment marks can be provided on component 600 at component pick-up position 820 and / or component drop-down position 800 for position detection. These alignment marks can be provided on component 600 at component pick-up position 820 and / or component drop-down position 800 and used in combination with one or more physical features. Similarly, alignment marks can be provided on component 600 at component pick-up position 820 and / or component drop-down position 800 and used in combination with one or more optical features.For example, alignment marks can be provided to component 600 at component pickup position 820 and / or component placement position 800 and can be used in combination with one or more optical features and in combination with one or more physical features.

[0071] For example, at least part of the surface structure of component 600 at component holding position 820 is used to determine the center position of component 600, for example the center position of a chip, before component 600 is attached to the mounting head 150.

[0072] For example, at the component placement position 800, at least part of the surface structure of the substrate 300, such as a target die on a wafer, is used to determine the target die center position before bonding the component 600.

[0073] For example, at component placement position 800, one or more optical alignment marks can be provided on one or more substrates 300 next to the nominal component placement position and used for position determination. Optionally, the information about the substrate geometry can be used to calculate the axis movements after alignment.

[0074] The specified distance 730 can be determined at any suitable time and in any suitable manner. For example, during the manufacture of the mounting head carrier 200, the distance along the first direction 910 between the optical alignment device 400 and the mounting head 150 can be measured. Alternatively, the distance along the first direction 910 between the optical alignment device 400 and the mounting head 150 can be measured before use in production. Finally, the distance along the first direction 910 between the optical alignment device 400 and the mounting head 150 can be estimated from CAD or simulation data before use in production. The first embodiment of the component mounting device 100 can also include one or more alignment marks for calibration.For example, the distance along the first direction 910 between the optical alignment device 400 and the mounting head 150 can be configured and arranged so that it is mechanically adjustable before use in production. For example, the distance along the first direction 910 between the optical alignment device 400 and the mounting head 150 can be configured and arranged so that it is controllable during production.

[0075] For example, the relevant positions 227 and 228 of the pendulum carriage 220 and a predetermined distance 730 can be determined in a calibration step. For this calibration step, the pendulum carriage is moved to a position 220 in which at least one position and / or orientation of the mounting head 150 can be at least partially captured by a camera arranged as a bottom-view camera. Similarly, the pendulum carriage can be moved to a position in which at least one position and / or orientation of the optical alignment device 400 can be at least partially captured by a camera arranged as a bottom-view camera.

[0076] For example, the relevant positions 227 and 228 of the pendulum carriage 220 and a predefined distance 730 can also be determined in a calibration step in which the carriage 210 is moved to a position that allows the mounting head 150 and the optical alignment device 400 to be positioned simply by moving the pendulum carriage over a camera arranged as a bottom-view camera. In this calibration step, for example, the pendulum carriage can be moved to a first calibration position, at which the position and / or orientation of the optical alignment device 400 can be measured with the camera arranged as a bottom-view camera. Using the first calibration position and / or the detected position and / or orientation of the optical alignment device 400, the first pendulum carriage position 227 can be determined and stored.Similarly, the pendulum carriage can be moved to a second calibration position, at which the position and / or orientation of the mounting head 150 can be recorded using the camera arranged as a bottom-view camera. Using the second calibration position and / or the recorded position and / or orientation of the mounting head 150, the second pendulum carriage position 228 can be determined and stored. From the first pendulum carriage position 227 and the second pendulum carriage position 228, the predetermined distance 730 can be determined.

[0077] As shown in FIGS. 1B and 1C, the mounting head carrier 200 included in the first embodiment of the component assembly device 100 also comprises a pendulum carriage drive 230, which is configured and arranged such that the pendulum carriage 220 is movable in a positive and / or negative direction relative to the carriage 210 along the second path length 720 to a first pendulum carriage position 227 relative to the carriage 210 and to a second pendulum carriage position 228 relative to the carriage 210. For example, a linear drive can be used as the pendulum carriage drive 230. The drive can provide linear or rotary motion. In addition, a method for controlling the temperature of the linear drive and / or the pendulum carriage 220 can be applied to reduce temperature-related influences that lead to inaccuracies in placement.

[0078] As shown in FIGS. 1B and 1C, the mounting head carrier 200, which is included in the first embodiment of the component mounting device 100, also comprises a carriage drive 250 configured and arranged to move the carriage 210 by a first path length 710 along the first direction 910 on the carriage carrier 500. For example, a linear drive can be used as the carriage drive 250. The carriage drive 250 can provide linear or rotary motion. Additionally, a method for controlling the temperature of the linear drive and / or the pendulum carriage 220 can be applied to reduce temperature-related influences that lead to placement inaccuracies.

[0079] The first embodiment of the component assembly device 100 is designed and arranged in such a way that it provides a movement of the pendulum carriage 220 relative to the running carriage 210.

[0080] The first embodiment of the component assembly device 100 is also designed and arranged such that it provides a first path length 710 that is longer than the second path length 720. For example, if the second area 720 is designed and arranged such that it only provides movement over the predetermined distance 730, the first path length 710 is preferably designed and arranged such that it provides movement over the entire working area. The first embodiment of the component assembly device 100 shown in FIGS. 1A, 1B, and 1C can be designed and arranged such that it performs an embodiment of the method for bonding one or more components 600 and one or more substrates 300.

[0081] FIGS. 2A and 2B are schematic top views of the relevant parts of a first embodiment of the component assembly device 100 during two key moments in the execution of the ninth embodiment of the method for bonding one or more components 600 and one or more substrates 300, as shown in FIGS. 2A and 2B, after picking up the one or more components 600 with the assembly head 150.

[0082] The component 600, not shown, is attached to the mounting head 150.

[0083] As shown in FIG. 2A, the mounting head carrier 200 is moved in a positive direction along the first axis 910 to a first carriage position 217 on the carriage encoder 215 of the carriage carrier 500, i.e. over the first path length 710, and the pendulum carriage 220 is moved in a positive direction along the first axis 910 relative to the carriage 210 to the first pendulum carriage position 227 on the pendulum carriage encoder 225 of the pendulum carriage 210, i.e. over the second path length 720. At this first carriage position 217 on the first path length 710 and at this first pendulum carriage position 227 on the second path length 720, the optical alignment device 400 is located directly above the component placement position 800. In general, the position along the first axis 910 of the optical alignment device 400 is determined by a suitable combination of the first carriage position 217 on the first path length 710 and the first pendulum carriage position 227 on the second path length 720.

[0084] As shown in FIG. 2A, the position of one or more first alignment marks at the component placement position 800 is determined using the optical alignment device 400. Optionally, the accuracy can be further improved by determining the position of more than one first alignment mark. Optionally, the optical alignment device 400 can be configured and arranged to detect the orientation of one or more first alignment marks. Optionally, the optical alignment device 400 can be configured and arranged to detect more than one orientation of one or more first alignment marks. Furthermore, the carriage 210 is preferably movable to accommodate the measured correction of the optical alignment.Optionally, an additional corrective movement of the carriage 210 and / or the pendulum carriage 220 is possible and advantageous if the position of one or more first alignment marks exceeds a certain limit, or as long as possible and can be carried out as long as the limit is exceeded.

[0085] Additionally, further movements along the first direction 910 can be provided to optimize the determination of one or more positions or orientations of the second alignment markers. Optionally, further movements along the second direction 920 can be provided to optimize the determination of one or more positions or orientations of the second alignment markers.

[0086] As shown in FIG. 2B, the mounting head carrier 200 is not moved significantly along the first path length 710, and the carriage 210 remains at the same carriage position 217 as shown in FIG. 2A.

[0087] However, as shown in FIG. 2B, the pendulum carriage 220 is moved in a positive direction along the first axis 910 relative to the carriage 210 to the second pendulum carriage position 228 on the second path length 720, thereby moving the pendulum carriage 220 by the predetermined distance 730 along the first direction 910, thus moving the mounting head 150 to the component placement position. In general, the position along the first axis 910 of the mounting head 150 is determined by a suitable combination of the first carriage position 217 on the first path length 710 and the second pendulum carriage position 228 on the second path length 720. Preferably, the first embodiment of the component mounting device 100 is configured and arranged such that the mounting head 150 is positioned directly above a target position for the component on the substrate for receiving the component.

[0088] The component 600, which is not shown here, is then detached from the mounting head 150 and placed on the substrate, which is also not shown, and subsequently connected to the substrate, preferably by gluing, soldering, welding or by means of a thermocompression process, in a force-fit and / or form-fit manner.

[0089] The same, repeatable movement of the pendulum carriage 220 over a predetermined distance 730 can increase the positioning accuracy, since the mounting head carrier 200 can be optimized to provide a high degree of positional stability and accuracy at at least two positions, corresponding to a first pendulum carriage position 227 and a second pendulum carriage position 228, and the subsequent machining position. This can also increase the positioning speed, since the mounting head carrier 200 can be optimized to provide a reduced settling time at only two positions.

[0090] Additionally, the positional accuracy at the second position, where machining usually takes place, is improved by determining the component placement position 800 at a first carriage position 217 without moving the carriage 210 or the pendulum carriage 220, even if more than one image is acquired, followed by a predefined, repeatable movement to the second pendulum carriage position 228. The use of only one measurement differs from conventional gantry systems, which typically use measurements at two or more positions in the work area, where the accuracy of each measurement can be affected differently depending on one or more local deformations. Optionally, when attaching a component 600 to the mounting head 150 at the component holding position 820, movements analogous to those shown in FIGS. 2A and 2B can be performed. This is shown in FIGS.3A and 3B dargestellt.

[0091] In the first of two phases shown in FIG. 3A, the mounting head carrier 200 can be moved in the negative direction along the first axis 910 to a second carriage position 218 on the first path length 710 near the component holding position 820. The pendulum carriage 220 can be moved in the negative direction along the first axis 910 relative to the carriage 210 to the first pendulum carriage position 227 on the second path length 720 near the component holding position 820. At this second carriage position 218 on the first path length 710 and at the first pendulum carriage position 227 on the second path length 720, the optical alignment device 400 is located directly above the component holding position 820.In general, the position along the first axis 910 of the optical alignment device 400 is determined by a suitable combination of the second carriage position 218 on the first path length 710 and the first pendulum carriage position 227 on the second path length 720.

[0092] The position of one or more secondary alignment marks of component 600 on the component holding position 820 is determined using the optical alignment device 400. Optionally, the accuracy can be further improved by determining the position of more than one secondary alignment mark. Optionally, the optical alignment device 400 can be configured and arranged to detect the orientation of one or more secondary alignment marks. Optionally, the optical alignment device 400 can be configured and arranged to detect more than one orientation of one or more secondary alignment marks.

[0093] Additionally, further movements along the first direction 910 can be provided to optimize the determination of one or more positions or orientations of the second alignment markers. Optionally, further movements along the second direction 920 can be provided to optimize the determination of one or more positions or orientations of the second alignment markers.

[0094] In the second phase shown in FIG. 3B, the mounting head carrier 200 is not moved significantly along the first path length 710, and the carriage 210 remains at the same second carriage position 218 as described in the first phase. However, the pendulum carriage 220 can be moved in a positive direction along the first axis 910 relative to the carriage 210 to the second pendulum carriage position 228 in the second path length 720 near the component holding position 820. This causes the pendulum carriage 220 to move along the first direction 910 by the predetermined distance 730, thereby moving the mounting head 150 to the component holding position 820 along the first direction 910. The first embodiment of the component mounting device 100 is designed and arranged such that the mounting head 150 is positioned directly above a component 600 to be mounted.In general, the position along the first axis 910 of the mounting head 150 is determined by a suitable combination of the second carriage position 218 on the first path length 710 and the second pendulum carriage position 228 on the second path length 720.

[0095] A second embodiment of the component assembly device 100 is the same as the first embodiment of the component assembly device 100, except that the second embodiment includes alternative and / or not shown means of component feeding to provide one or more components 600. The second embodiment of the component assembly device 100 therefore does not include a component receiving position 820. The second embodiment of the component assembly device 100 therefore does not include one or more second alignment marks. The second embodiment of the component assembly device 100 can be configured and arranged to perform a ninth embodiment of the method for bonding one or more components 600 and one or more substrates 300, which describes the process steps of the eighth embodiment of the method, as shown in FIGS. 2C and 2D.

[0096] A third embodiment of the component assembly device 100 corresponds to the first or second embodiment of the component assembly device 100, except that the third embodiment comprises an assembly head carrier 200 which is designed and arranged to move the assembly head 150 along the first direction 910, and which is also designed and arranged to move the assembly head 150 along the second direction 920 (not shown) in order to place the one or more components 600 at the component placement position 800.

[0097] The third embodiment of the component assembly device 100 comprises a carriage 210 designed and arranged to move the assembly head 150 positively and / or negatively along the first direction 910 over the first path length 710, and furthermore to move the assembly head 150 positively and / or negatively along the second direction 920 (not shown). Any suitable carriage drive that provides sufficient movement along the second direction 920 can be used, or a second dedicated drive, such as another linear drive, can be provided. The carriage drive can provide linear or rotary movement. Temperature control of the linear drive and / or the carriage 210 allows for adjustments to further reduce placement inaccuracies.

[0098] The third embodiment of the component assembly device 100 can be configured and arranged to perform the ninth embodiment of the method for bonding one or more components 600 and one or more substrates 300, as shown in FIG. 2C and 2D, after the one or more components 600 have been picked up by the assembly head 150, as shown in FIG. 2A and 2B.

[0099] The movement along the second direction 920 also enables optimization of the positioning of the alignment device 400 and / or the assembly head 150 relative to the component 600 at the component pick-up position 820 and / or at the component drop-off position 800. Optionally, the optimization of the positioning along the second direction 920 can also be further optimized to avoid positioning errors of the second direction 920 after the pendulum carriage 220 has moved over the specified distance 730 along the first direction 910.

[0100] A fourth embodiment of the component assembly device 100 is the same as the first, second or third embodiment of the component assembly device 100, except that the fourth embodiment comprises an assembly head carrier 200 which is designed and arranged to move the assembly head 150 along the first direction 910, and is also designed and arranged to move the assembly head 150 along the second direction 920 (not shown) in order to insert the one or more components 600 at the component placement position 800.

[0101] The fourth embodiment of the component assembly device 100 comprises a pendulum carriage 220, which is designed and arranged to move the assembly head 150 positively and / or negatively along the first direction 910 across the second area 720, and which is further designed and arranged to move the assembly head 150 positively and / or negatively along the second direction 920 (not shown). Any suitable pendulum carriage drive 230 and / or trolley drive 250 that provides a corresponding movement along the second direction 920 can be used, or a second dedicated drive, such as another linear drive, can be provided. The drive can provide linear or rotary movement. The temperature of the linear drive and / or the pendulum carriage 220 can be controlled to further reduce placement inaccuracies.

[0102] The fourth embodiment of the component assembly device 100 can be configured and arranged to perform the ninth embodiment of the method for bonding one or more components 600 and one or more substrates 300, as shown in FIG. 2C and 2D, after the one or more components 600 have been picked up by the assembly head 150, as shown in FIG. 2A and 2B.

[0103] The movement along the second direction 920 also enables optimization of the positioning of the alignment device 400 and / or the assembly head 150 relative to the component 600 at the component pick-up position 820 and / or at the component drop-off position 800. Optionally, positioning errors along the second direction 920 after moving the pendulum carriage 220 over a predetermined distance 730 along the first direction 910 can be avoided by also moving the pendulum carriage 220 over a predetermined distance 730 along the second direction 920.

[0104] The first, second, third and fourth embodiments of the component assembly device 100 may optionally include an assembly head carrier 200, which is also configured and arranged to allow a rotation of the assembly head 150 in a positive and / or negative direction about the Z-axis 930 (not shown).

[0105] The first, third and fourth embodiments of the component assembly device 100 can be designed and arranged such that they perform one or more of the first, second, third, fourth, fifth, sixth, seventh, eighth or ninth embodiments of the method.

[0106] The second embodiment of the component assembly device 100 can be designed and arranged to perform one or more of the first, second, third, fourth, fifth, sixth, seventh, or ninth embodiments of the method. In summary, conventional portal-type systems according to the prior art with X and / or Y beams suffer from deformations due to weight, bending, torsion, temperature, etc. Position-dependent placement errors are reduced by providing a component assembly method for assembly using a component assembly device 100 with an assembly head carrier 200, which includes a carriage 210 that enables movement by a first path length 710 along the first direction 910, and a pendulum carriage 220 that enables movement by a second path length 720 along the first direction 910 over the same, repeatable predetermined distance 730.The pendulum carriage 220 comprises an optical alignment device 400 and a mounting head 150, separated by a predetermined distance 730. Providing the same, repeatable movement of the pendulum carriage 220 between only two positions enables higher positioning accuracy and / or positioning speed.

[0107] Likewise, the mounting device reduces 100 position-dependent placement errors that can occur in conventional systems due to deformation of the Y-beam when determining or calibrating the distance between the optical alignment device 400 and the mounting head 150 via a camera arranged as a bottom-view camera, if this distance is applied at a different position of the Y-beam.

[0108] At any position of the carriage 210, the optical alignment device 400 and the mounting head 150 can be alternately moved over the same position by a repeatable movement of the pendulum carriage 220, without the carriage 210 itself having to move. This means that deformation of the Y-beam when applying, for example, a distance determined during calibration between the optical alignment device 400 and the mounting head 150 does not affect a position-dependent placement error. The embodiments described above relate to component assembly methods for mounting one or more components 600 and one or more substrates 300 using a component assembly device 100, to provide an example.The component assembly methods and the component assembly device described above can be adapted with obvious modifications to provide any desired machining methods and devices, including determining a component placement position followed by movement over the same repeatable path to one of the machining positions. In other words, a first embodiment of a method for machining one or more objects using a first embodiment of a machining device, wherein the machining device comprises a machining head for releasable attachment to the one or more objects, designed and arranged such that it can be positioned at one of the respective machining positions.Furthermore, a machining device comprises a machining head carrier configured and arranged to move the machining head along a Y-axis and / or an X-axis and / or a Z-axis to position one or more objects at one of the respective machining positions. The machining head carrier includes a carriage configured and arranged for moving the machining head along the Y-axis over a first section, and a pendulum carriage configured and arranged for moving the machining head along the Y-axis over a second section. The machining head carrier also includes an optical alignment device configured and arranged to detect a position from one or more first alignment marks of the respective machining position, wherein the optical alignment device and the machining head are separated from each other by a distance along the Y-axis.The procedure also includes the steps of moving the carriage along the Y-axis, thereby moving the optical alignment device to the respective machining position, determining a position of one or more first alignment marks of the component 600 at the respective machining position using the optical alignment device, and moving the pendulum carriage by the distance along the Y-axis, thereby moving the machining head to the respective machining position along the Y-axis.

[0109] A second embodiment of the component assembly device 100 can further comprise a component receiving position, wherein the optical alignment device is also designed and arranged such that it detects the position of one or more secondary alignment marks at the receiving position. A second embodiment of the processing method can further comprise the steps of moving the carriage along the Y-axis, thereby moving the optical alignment device to the component receiving position, determining the position of one or more secondary alignment marks of the component at the component receiving position using the optical alignment device, and moving the pendulum carriage by the distance along the Y-axis, thereby moving the processing head to the component receiving position along the Y-axis.

[0110] Preferred embodiments are designed to carry out the following steps of a component assembly method for mounting a component 600 at a component placement position 800 on a substrate 300 using a component assembly device 100:

[0111] (A) Moving the pendulum carriage 220 to a predetermined first carriage position 227 and moving the carriage 210 along the first direction 910, so that the component placement position 800 is in the field of view of the optical alignment device 400;

[0112] (B) Determining the component placement position 800;

[0113] (C) Moving the shuttle carriage 220 along the first direction 910 from the first carriage position 227 by the specified distance 730 to the second carriage position 228 in order to move the assembly head 150 to the previously determined component placement position 800;

[0114] (D) Moving the pendulum carriage 220 and / or moving the trolley 210 along the first direction 910 to move the assembly head 150 to the previously determined component placement position 800; and

[0115] (E) Mounting of component 600 at component placement position 800 on substrate 300.

[0116] Preferred component assembly methods also include the following optional step (F) in which, prior to the assembly of the component 600 at the component placement position 800 on the substrate 300, the assembly head 150 and / or the substrate 300 are additionally moved along a second direction 920 to move the assembly head 150 to the previously determined component placement position 800.

[0117] Preferred component assembly methods also include the following optional steps (G) to (K), namely:

[0118] (G) Moving the pendulum carriage 220 to the first pendulum carriage position 227 and moving the carriage 210 along the first direction 910, so that the component receiving position 820 is in the field of view of the optical alignment device 400 for determining the position of the component 600 on the component receiving position 820;

[0119] (H) Determining the position of component 600 on component holding position 820;

[0120] (I) Moving the pendulum carriage 220 along the first direction 910 from the first pendulum carriage position 227 by the predetermined distance 730 to the second pendulum carriage position 228 in order to move the assembly head 150 to the previously determined position of the component 600 on the component holding position 820; (J) Moving the pendulum carriage 220 and / or moving the carriage 210 along the first direction 910 in order to move the assembly head 150 to the previously determined position of the component 600 on the component holding position 820; and (K) releasable mounting of the component 600 on the assembly head 150.

[0121] Preferred component assembly methods also include a subsequent optional step (L) in which the step of determining the position of component 600 is carried out using one or more secondary alignment marks.

[0122] Reference symbol list

[0123] 100 component assembly devices

[0124] 150 Mounting head

[0125] 200 mounting head carriers

[0126] 210 trolleys

[0127] 215 trolley encoders

[0128] 217 Carriage position at the component placement position

[0129] 218 Carriage position at the component holding position

[0130] 220 shuttle cars

[0131] 225 Shuttle car encoders

[0132] 227 First shuttle car position

[0133] 228 Second shuttle car position

[0134] 230 shuttle car drive

[0135] 250 trolley drive

[0136] 300 substrate

[0137] 400 optical alignment device

[0138] 470 first alignment position

[0139] 480 second alignment position

[0140] 500 trolley carriers

[0141] 600 components

[0142] 710 first path length

[0143] 720 second path length

[0144] 730 specified distance

[0145] 800 Component placement position

[0146] 820 Component mounting position

[0147] 840 Component position

[0148] 850 substrate position

[0149] 910 first axis (Y)

[0150] 920 second axis (X)

[0151] 930 third axis (Z)

[0152] P Position

Claims

Patent claims 1. Device (100) for mounting a component (600) at a component placement position (800) on a substrate (300), comprising a mounting head (150) for releasably attaching the component (600) thereto, which is configured and arranged so that it can be positioned at the component placement position (800), and comprising a mounting head carrier (200) which is designed and arranged to move the mounting head (150) along a first direction (910) and to position and place the component (600) at the component placement position (800), wherein the mounting head carrier (200) comprises a carriage (210) which is designed and arranged for moving the mounting head (150) by a first path length (710) along the first direction (910), and a pendulum carriage (220) which is in operative connection with the carriage (210).which is designed and arranged for the movement of the mounting head (150) by a second path length (720) along the first direction (910), and includes an optical alignment device (400) for determining the component placement position (800).

2. Device (100) according to claim 1, wherein the optical alignment device (400) and the mounting head (150) are spaced apart from each other by a predetermined distance (730) along the first direction (910).

3. Device according to claim 1 or claim 2, wherein the pendulum carriage (220) is movable relative to the carriage (210) for the movement of the mounting head (150).

4. Device according to one of the preceding claims, wherein the first path length (710) is longer than the second path length (720).

5. Method for mounting a component (600) at a component placement position (800) on a substrate (300) using a device (100) according to any one of claims 1 to 4, wherein the method comprises the following steps: - Moving the pendulum carriage (220) to a predetermined first pendulum carriage position (227) and moving the carriage (210) along the first direction (910) so that the component placement position (800) is in the field of view of the optical alignment device (400); - Determining the component placement position (800); - Moving the pendulum carriage (220) along the first direction (910) from the first pendulum carriage position (227) by the specified distance (730) to a second pendulum carriage position (228) in order to move the assembly head (150) to the previously determined component placement position (800); - Moving the pendulum carriage (220) and / or moving the trolley (210) and / or moving the substrate (300) along the first direction (910) to move the assembly head (150) to the previously determined component placement position (800); and - Mounting of the component (600) at the component placement position (800) on the substrate (300).

6. Method according to claim 5, wherein, prior to mounting the component (600) on the component placement position (800) on the substrate (300), the mounting head (150) and / or the substrate (300) are additionally moved along a second direction (920) to move the mounting head (150) to the previously determined component placement position (800).

7. Method according to one of claims 5 or 6, wherein the movement of the pendulum carriage (220) is relative to the running carriage (210) and the first path length (710) is longer than the second path length (720).

8. Method according to any one of claims 5 to 7, wherein determining the component placement position (800) comprises the additional steps: - Taking an image with the optical alignment device (400), wherein one or more first alignment marks of the component placement position (800) are located in the field of view of the optical alignment device (400); - Detecting one or more initial alignment marks of the component placement position (800) within the field of view of the optical alignment device (400); and - Determining the position of the component placement position (800) based on the detected one or more first alignment marks of the component placement position (800).

9. Method according to any one of claims 5 to 8, wherein the component assembly device (100) further comprises a component receiving position (820) and wherein the method further comprises: - Moving the pendulum carriage (220) to the first carriage position (217) and moving the carriage (210) along the first direction (910) so that the component receiving position (820) is in the field of view of the optical alignment device (400) for determining the position of the component (600) on the component receiving position (820); - Determining the position of the component (600) on the component holding position (820); - Moving the pendulum carriage (220) along the first direction (910) from the first pendulum carriage position (227) by the specified distance (730) to the second pendulum carriage position (228) in order to move the assembly head (150) to the previously determined position of the component (600) on the component holding position (820); - Moving the shuttle carriage (220) and / or moving the trolley (210) along the first direction (910) around the to move the mounting head (150) to the previously determined position of the component (600) on the component holding position (820); and - Releasable mounting of the component (600) on the mounting head (150).

10. Method according to claim 9, wherein, prior to receiving the component (600) on the component receiving position (820), the mounting head (150) and / or the component (600) are additionally moved along the second direction (920) in order to move the mounting head (150) to the previously determined position of the component (600) on the component receiving position (800).

11. Method according to claim 9, wherein determining the position of the component (600) on the component receiving position (820) comprises the additional steps: - Taking an image with the optical alignment device (400), wherein one or more second alignment marks of the component (600) are located at the component pickup position (820) in the field of view of the optical alignment device (400); - Detecting one or more second alignment marks of the component (600) in the field of view of the optical alignment device (400); and - Determining the position of the component (600) on the component recording position (820) based on the detected one or more second alignment marks of the component (600).

12. Method according to one of the preceding claims, wherein the mounting head (150) is movable along a third direction (930), wherein the third direction (930) is perpendicular to the first direction (910) and perpendicular to the second direction (920).

13. Method according to any one of the preceding claims, wherein the one or more components (600) are selected from the group comprising one or more dies, one or more semiconductors, one or more chips, one or more integrated circuits, one or more further substrates (300), one or more optical elements or any combination thereof 14. A method according to any one of the preceding claims, wherein the one or more substrates (300) are selected from the group comprising one or more metallic substrates, one or more comprising substrate strips, one or more conductor frames, one or more printed circuit boards, one or more wafers, one or more other components (600) or any combination thereof.

Images