Heat control device, control method, and recording medium

Abstract

[Problem] To provide: a heat control device which can be easily installed on a manufacturing line; a control method for controlling the operation of the heat control device; a recording medium; and the like. [Solution] One embodiment of the present invention provides a heat control device which is equipped with a heat control member, a sensor, wiring, and a power source. The heat control member heats or cools an object, the sensor outputs heat information related to the heat acting on the object, the wiring electrically connects the heat control member and the sensor, and the power source applies a voltage to the heat control member and the sensor through the wiring.

Description

Thermal control device, control method, and recording medium

[0001] The present invention relates to a thermal control device, a control method, and a recording medium.

[0002] Patent Document 1 discloses a heater control device.

[0003] This heater control device includes a heater, temperature detection means, temperature control means, and a switch for starting operation. The temperature control means starts operation when the switch is turned on, compares the detected temperature obtained from the temperature detection means with a predetermined target temperature, and controls the on / off operation of the power supply to the heater to maintain the object to be heated at the target temperature. If the detected temperature exceeds the target temperature and the heater is not powered, the temperature control means forcibly powers the heater for a predetermined time period from immediately after the switch is turned on, regardless of the detected temperature.

[0004] JP 2009-283333 A

[0005] However, the heater control device disclosed in Patent Document 1 requires wiring to be connected to each of the temperature detection means, temperature control means, and switch in order to control the heater, and each of these wirings must be routed, making it difficult to install on a production line.

[0006] In view of the above circumstances, the present invention provides a thermal control device that can be easily installed on a manufacturing line, a control method for controlling the operation of the thermal control device, a recording medium, and the like.

[0007] According to one aspect of the present invention, there is provided a thermal control device comprising a thermal control element, a sensor, wiring, and a power supply, wherein the thermal control element heats or cools an object, the sensor outputs thermal information regarding heat acting on the object, the wiring electrically connects the thermal control element and the sensor, and the power supply applies a voltage to the thermal control element and the sensor via the wiring.

[0008] According to this aspect, the thermal control device can be easily installed on a production line.

[0009] 1 is a diagram showing the configuration of the thermal control device 100. FIG. 2 is a circuit diagram showing the configuration of the thermal control device 100. FIG. 3 is a block diagram showing the configuration of the thermal control device 100. FIG. 4 is a block diagram showing functions realized by the thermal control device 100 (control unit 150). FIG. 5 is an activity diagram showing the flow of a control method executed by the thermal control device 100. FIG. 6 is a circuit diagram showing the configuration of the thermal control device 101. FIG. 7(A): A graph showing the monitored voltage of the thermal control device 101, and FIG. 7(B): A graph showing the monitored current of the thermal control device 101. FIG. 8(A): A graph showing the monitored voltage of the thermal control device 101, and FIG. 8(B): A graph showing the monitored current of the thermal control device 101, taking into account the transient response of the heat flow sensor 121. FIG. 9 is a circuit diagram showing the configuration of the thermal control device 102. FIG. 10(A): A graph showing the monitored voltage of the thermal control device 102, and FIG. 10(B): A graph showing the monitored current of the thermal control device 102. FIG. 11(A): A graph showing the monitored voltage of the thermal control device 102, and FIG. 11(B): A graph showing the monitored current of the thermal control device 102. Fig. 12(A): A graph of monitored voltage of the thermal control device 102, Fig. 12(B): A graph of monitored current of the thermal control device 102. Circuit diagram showing the configuration of the thermal control device 103. Fig. 14(A): A graph of monitored voltage of the thermal control device 103, Fig. 14(B): A graph of monitored current of the thermal control device 103. A diagram showing the configuration of the thermal control device 104. A diagram showing the configuration of the thermal control device 105.

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings. Various features shown in the following embodiments can be combined with each other.

[0011] Incidentally, a program for realizing the software appearing in one embodiment may be provided as a non-transitory computer-readable recording medium, or may be provided so as to be downloadable from an external server, or may be provided so that the program is started on an external computer and its functions are realized on a client terminal (so-called cloud computing).

[0012] Furthermore, various information processing according to an embodiment may realize input and output corresponding to the input. Here, the form of information referenced in such information processing (hereinafter referred to as reference information) is not limited as long as an output is obtained as a result of the input. The reference information may be, for example, rule-based information such as a database, a lookup table, or a predetermined function (including a decision formula such as a regression formula constructed using a statistical method), a trained model that has previously trained the correlation between input and output, or a large-scale language model that can output a desired result by inputting a prompt.

[0013] In one embodiment, the term "unit" may include, for example, a combination of hardware resources implemented by a circuit in the broad sense and software information processing that can be specifically realized by these hardware resources. In one embodiment, various information is handled, and this information is represented, for example, by physical values ​​of signal values ​​representing voltage or current, high or low signal values ​​as a binary bit set consisting of 0 or 1, or quantum superposition (so-called quantum bits), and communication and calculations can be performed on the circuit in the broad sense.

[0014] Furthermore, a circuit in a broad sense is a circuit realized by at least an appropriate combination of a circuit, circuitry, a processor, a memory, etc. The processor may be a general-purpose processor or a dedicated circuit. That is, it includes application specific integrated circuits (ASICs), programmable logic devices (e.g., simple programmable logic devices (SPLDs), complex programmable logic devices (CPLDs), and field programmable gate arrays (FPGAs)), etc.

[0015] 1. Configuration In Section 1, the configuration of the thermal control device in this embodiment will be described.

[0016] Fig. 1 is a diagram showing the configuration of the thermal control device 100. Fig. 2 is a circuit diagram showing the configuration of the thermal control device 100. Fig. 3 is a block diagram showing the configuration of the thermal control device 100. The thermal control device 100 includes a heater 110 (thermal control element), a heat flow sensor 121 (sensor), a temperature sensor 122 (sensor), wiring 131, wiring 132, a power supply 141, a control unit 150, an ammeter 161, a voltmeter 162, a memory unit 170, a communication unit 180, and a communication bus 190.

[0017] The heater 110 heats the workpiece 210 (object) via the copper plate 220. The heater 110 may be a ceramic heater, a Peltier heater, or the like. The copper plate 220 is an example of a thermal conductor, and is necessary when heating the workpiece 210 using the heater 110. The heater 110 is of a two-wire type.

[0018] The heat flow sensor 121 is disposed in contact with the heater 110. The heat flow sensor 121 outputs a voltage corresponding to the heat flow that has passed through the heat flow sensor 121, i.e., the heat flow acting on the workpiece 210. The value of the voltage output from the heat flow sensor 121 is an example of "thermal information" in the claims. The heat flow sensor 121 is of a two-wire type.

[0019] The temperature sensor 122 is disposed in contact with the heater 110. The temperature sensor 122 may be a thermistor, a diode 123 (described later), an integrated circuit 124, or the like. The temperature sensor 122 outputs a voltage or current corresponding to the temperature acting on the workpiece 210. The voltage or current output from the temperature sensor 122 is an example of "thermal information" in the claims. The temperature sensor 122 is of a two-wire type.

[0020] One side of the wiring 131 connects the positive terminals of the heater 110, the heat flow sensor 121, and the temperature sensor 122, and the other side is connected to the positive terminal of the power source 141. One side of the wiring 131 connects the positive terminals of the heater 110, the heat flow sensor 121, and the temperature sensor 122 in the internal space of the heater 110. In other words, the wiring 131 commonizes the positive terminals of the heater 110, the heat flow sensor 121, and the temperature sensor 122. That is, the wiring 131 electrically connects the heater 110, the heat flow sensor 121, and the temperature sensor 122 inside the heater 110.

[0021] One side of the wiring 132 connects the negative terminals of the heater 110, the heat flow sensor 121, and the temperature sensor 122, and the other side is connected to the negative terminal of the power source 141. One side of the wiring 132 connects the negative terminals of the heat flow sensor 121 and the temperature sensor 122 in the internal space of the heater 110. In other words, the wiring 132 commonizes the negative terminals of the heater 110, the heat flow sensor 121, and the temperature sensor 122. That is, the wiring 132 electrically connects the heater 110, the heat flow sensor 121, and the temperature sensor 122 inside the heater 110.

[0022] In this way, since the heater 110, the heat flow sensor 121, and the temperature sensor 122 are of a two-wire type, the total number of wires for the heater 110, the heat flow sensor 121, and the temperature sensor 122 can be reduced to two wires (minimum).

[0023] The power supply 141 is electrically connected to the heater 110, the heat flow sensor 121, and the temperature sensor 122 via wiring 131 and wiring 132. The power supply 141 is a DC power supply. The power supply 141 is driven and controlled by the control unit 150 using a pulse modulation method such as PWM, PDM, or PAM. The power supply 141 applies a voltage to the heater 110, the heat flow sensor 121, and the temperature sensor 122 via wiring 131 and wiring 132.

[0024] The control unit 150 processes and controls the overall operation of the thermal control device 100. The control unit 150 is, for example, a central processing unit (CPU) (not shown). The control unit 150 realizes various functions related to the thermal control device 100 by reading out predetermined programs stored in the storage unit 170. In other words, information processing by software stored in the storage unit 170 is specifically realized by the control unit 150, which is an example of hardware, and can be executed as each functional unit included in the control unit 150. This will be further explained in Section 2. Note that the control unit 150 is not limited to being a single unit, and multiple control units 150 may be provided for each function. A combination of these may also be used.

[0025] The control unit 150 calculates the heat flow value and temperature (degree of heat) acting on the workpiece 210 based on the voltage value (heat information) output from the heat flow sensor 121, the voltage or current value (heat information) output from the temperature sensor 122, and the first reference information stored in the storage unit 170. Here, the first reference information is information indicating the relationship between the voltage value output from the heat flow sensor 121, the voltage or current value (heat information) output from the temperature sensor 122, and the heat flow value and temperature (degree of heat) acting on the workpiece 210.

[0026] Furthermore, the control unit 150 controls the operation of the power supply 141 based on the heat flow value and temperature (degree of heat) acting on the workpiece 210 and the second reference information stored in the storage unit 170. Here, the second reference information is information indicating the relationship between the heat flow value and temperature (degree of heat) acting on the workpiece 210 and the operation of the power supply 141. The second reference information sets a desired temperature of the object (e.g., 100°C) depending on the type of object, and sets the operation state of the power supply so as to approach the desired temperature. For example, the control unit 150 controls the width and interval of the pulse voltage from the power supply 141 so as to bring the temperature acting on the workpiece 210 close to 100°C.

[0027] According to this aspect, feedback control can be performed according to the degree of heat acting on the object.

[0028] The ammeter 161 is connected in series and measures the current flowing through the thermal control device 100 .

[0029] A voltmeter 162 is connected in parallel to measure the voltage generated across the thermal control device 100 .

[0030] The memory unit 170 stores various information necessary for information processing of the thermal control device 100. This may be implemented, for example, as a storage device such as a solid state drive (SSD) that stores various programs related to the thermal control device 100 executed by the control unit 150, or as a memory such as a random access memory (RAM) that stores temporarily required information related to program calculations (arguments, arrays, etc.), or may be a combination of these.

[0031] The communication unit 180 is preferably a wired communication means such as USB, IEEE 1394, Thunderbolt (registered trademark), or wired LAN network communication, but may also include wireless LAN network communication, mobile communication such as 5G / LTE / 3G, Bluetooth (registered trademark), etc. as necessary. In other words, it is more preferable to implement it as a collection of multiple communication means. In other words, the thermal control device 100 communicates various information over a network via the communication unit 180.

[0032] The communication bus 190 electrically connects the control unit 150, the storage unit 170, and the communication unit 180, enabling electrical signals to be exchanged among them.

[0033] The configuration of the thermal control device 100 reduces the number of required wires, making it easy to install on a manufacturing line. Furthermore, by electrically connecting the heater 110, the heat flow sensor 121, and the temperature sensor 122 inside the heater 110, the exposed wires are reduced, making it easier to install on a manufacturing line.

[0034] The configuration of the heat flow sensor 121 is not particularly limited, but from the viewpoint of responsiveness, it is preferable that the heat flow sensor be a thin-film type heat flow sensor based on the anomalous Nernst effect. The element of the heat flow sensor 121, i.e., the thermoelectric conversion element, may be made of an alloy or compound that exhibits the anomalous Nernst effect. The element of the heat flow sensor 121 may be made of, for example, a topological ferromagnet or topological antiferromagnet called a Weyl semimetal, or may be made of a ferrimagnet, or a combination thereof. The topological ferromagnet is Co ２ Co such as MnGa ２ The metal may have a TX composition (where X is any one of Si, Ge, Sn, Al, and Ga), and the composition formula is Fe ３ The topological antiferromagnet may be an alloy of a known topological ferromagnet, such as a metal represented by X (X is a stoichiometric composition of a typical element or transition element such as Al or Ga). ３ The heat flow sensor 121 may be a known topological antiferromagnetic material such as X (where X is one or more elements selected from Sn, Ge, Ga, Pt, Ir, and Rh, or a compound thereof). The compound constituting the element of the heat flow sensor 121 may be, for example, an alloy containing a transition metal, and the alloy may be a compound having a crystal structure with Kagome lattice planes of the transition metal and exhibiting the anomalous Nernst effect. The ferrimagnetic material is also not particularly limited as long as it exhibits the anomalous Nernst effect. The structure of the element of the heat flow sensor 121 is not particularly limited, and known materials can be used. The element of the heat flow sensor 121 may also be formed by sputtering, vapor deposition, MBE, plating, granulation, 3D printing, melting, sintering, printing, pasting, or the like.

[0035] 2. Functional Configuration The functional configuration of this embodiment will be described in Section 2. As described above, information processing by software stored in the storage unit 170 is specifically realized by the control unit 150, which is an example of hardware, and can be executed as each functional unit included in the control unit 150.

[0036] 4 is a block diagram showing functions realized by the thermal control device 100 (controller 150). The thermal control device 100 (controller 150) is configured to execute each step of the control method of this embodiment. Here, the control method of this embodiment includes an application step, an acquisition step, a calculation step, and a drive control step. The thermal control device 100 (controller 150) includes an application unit 151, an acquisition unit 152, a calculation unit 153, and a drive controller 154, corresponding to each step of the control method of this embodiment.

[0037] The application unit 151 is configured to control the driving of the power supply 141. The application unit 151 is configured to execute an application step. For example, the application unit 151 causes the power supply 141 to apply voltage to the heater 110, the heat flow sensor 121, and the temperature sensor 122.

[0038] The acquisition unit 152 is configured to acquire various types of information. The acquisition unit 152 is configured to execute an acquisition step. For example, the acquisition unit 152 acquires a voltage value (thermal information) output by the heat flow sensor 121. The acquisition unit 152 also acquires a voltage or current value (thermal information) output by the temperature sensor 122.

[0039] The calculation unit 153 is configured to calculate various information. The calculation unit 153 is configured to execute a calculation step. For example, the calculation unit 153 calculates the heat flow value and temperature (degree of heat) acting on the workpiece 210 based on the voltage value from the heat flow sensor 121 and the voltage value from the temperature sensor 122, and the first reference information. Here, the first reference information is information indicating the relationship between the heat information and the degree of heat.

[0040] The drive control unit 154 is configured to control the drive of the power supply 141. The drive control unit 154 is configured to execute a drive control step. For example, the drive control unit 154 controls the drive of the power supply 141 based on the calculated heat flow value and temperature and second reference information. Here, the second reference information is information indicating the relationship between the degree of heat and the drive of the power supply 141.

[0041] 3. Control Method In Section 3, a flow of the control method for the thermal control device 100 will be described. This control method is a control method for controlling the operation of the thermal control device 100.

[0042] 5 is an activity diagram showing the flow of a control method executed by the thermal control device 100. Below, an explanation will be given along with each activity in this activity diagram.

[0043] First, the application unit 151 causes the power supply 141 to apply a voltage to the heater 110, the heat flow sensor 121, and the temperature sensor 122 (activity A110). In other words, this activity can be expressed as a step. In the application step, the power supply 141 applies a voltage to the heater 110, the heat flow sensor 121, and the temperature sensor 122.

[0044] Next, the acquisition unit 152 acquires the voltage value (thermal information) output by the heat flow sensor 121 (activity A120). The acquisition unit 152 also acquires the voltage or current value (thermal information) output by the temperature sensor 122 (activity A120). In other words, this activity is a step, and in the acquisition step, the thermal information output by the heat flow sensor 121 and the temperature sensor 122 (sensors) is acquired.

[0045] Next, the calculation unit 153 calculates the heat flow value and temperature (degree of heat) acting on the workpiece 210 based on the voltage value output by the heat flow sensor 121, the voltage or current value output by the temperature sensor 122, and the first reference information (activity A130). Rephrasing this activity as a step, in the calculation step, the calculation unit 153 calculates the heat flow value and temperature (degree of heat) acting on the workpiece 210 (object) based on the voltage value (heat information) output by the heat flow sensor 121, the voltage or current value (heat information) output by the temperature sensor 122, and the first reference information. Here, the first reference information is information indicating the relationship between the voltage value (heat information) output by the heat flow sensor 121, the voltage or current value (heat information) output by the temperature sensor 122, and the heat flow value and temperature (degree of heat) acting on the workpiece 210 (object).

[0046] Next, the drive control unit 154 controls the drive of the power supply 141 based on the heat flow value and temperature (degree of heat) acting on the workpiece 210 and the second reference information (activity A140). In other words, this activity can be expressed as a step. In the drive control step, the drive of the power supply 141 is controlled based on the heat flow value and temperature (degree of heat) acting on the workpiece 210 and the second reference information. Here, the second reference information is information indicating the relationship between the heat flow value and temperature (degree of heat) acting on the workpiece 210 and the drive of the power supply 141.

[0047] According to this control method, feedback control can be performed on the thermal control device 100 with a reduced number of wires.

[0048] 4. Second Embodiment In Section 4, a second embodiment of the present invention will be described.

[0049] FIG. 6 is a circuit diagram showing the configuration of the thermal control device 101. The thermal control device 101 differs from the thermal control device 100 in that it does not include a temperature sensor 122. Specifically, the thermal control device 101 includes a heat flow sensor 121 as the "sensor" in the claims. The control unit 150 acquires the voltage value (thermal information) output by the heat flow sensor 121 when the output impedance of the power supply 141 exceeds a threshold value. The output impedance is calculated, for example, using the voltage value and current value output from the power supply 141. Here, the threshold value can be set arbitrarily depending on the configuration of the thermal control device 101. The timing when the output impedance of the power supply 141 exceeds the threshold value is, for example, when no voltage is applied by the power supply 141, as shown in sections (b) and (d) of FIG. 7A. According to this aspect, the heat flow value can be acquired by the heat flow sensor 121.

[0050] 7A shows a graph of the voltage of the thermal control device 101 monitored, and FIG. 7B shows a graph of the current of the thermal control device 101 monitored. First, when the power supply 141 is turned on and a voltage to operate the heater 110 is applied (section (a) of FIG. 7A), the value of the current flowing through the thermal control device 101 is measured (section (a) of FIG. 7B). Next, when the power supply 141 is turned off, no current is measured (section (b) of FIG. 7B), but the voltage output from the heat flow sensor 121 is measured (section (b) of FIG. 7A). Next, when the power supply 141 is turned on and a voltage to operate the heater 110 is applied (section (c) of FIG. 7A), the value of the current flowing through the thermal control device 101 is measured (section (c) of FIG. 7B). Next, when the power supply 141 is turned OFF, no current is measured (section (d) in FIG. 7B), but the voltage output from the heat flow sensor 121 is measured (section (d) in FIG. 7A). Next, when the power supply 141 is turned ON and a voltage is applied to operate the heater 110 (section (e) in FIG. 7A), the value of the current flowing through the thermal control device 101 is measured (section (e) in FIG. 7B).

[0051] In this way, since the voltage output from the heat flow sensor 121 is measured when the power supply 141 is turned off, the value of the heat flow that has passed through the heat flow sensor 121 can be calculated using this voltage.

[0052] In other words, in the acquisition step, the voltage value (thermal information) output by the heat flow sensor 121 is acquired when the output impedance of the power supply 141 becomes equal to or greater than a threshold value. Here, the threshold value can be set arbitrarily depending on the configuration of the thermal control device 101, as described above. Also, in the acquisition step, the voltage value output from the heat flow sensor 121 is acquired. In the calculation step, the heat flow value acting on the workpiece 210 (object) is calculated based on the acquired voltage value and the first reference information. According to this aspect, feedback control can be performed on the thermal control device using the heat flow sensor.

[0053] 5. Third Embodiment In Section 5, a third embodiment of the present invention will be described.

[0054] The configuration of the thermal control device in the third embodiment is similar to that of the thermal control device 101. Here, the "sensor" in the claims includes the heat flow sensor 121. The control unit 150 acquires a transient response of the heat flow sensor 121. The control unit 150 calculates the temperature of at least one of the workpiece 210 (object) and the heater 110 (thermal control element) based on the acquired transient response and the first reference information. Here, the acquired transient response is an example of "thermal information" in the claims. According to this aspect, the heat flow sensor can calculate the temperature in addition to the heat flow value.

[0055] 8A is a graph of the monitored voltage of the thermal control device 101, and FIG. 8B is a graph of the monitored current of the thermal control device 101, both of which take into account the transient response of the heat flow sensor 121. The heat flow sensor 121 generates a transient response due to the generation of a back electromotive force when the power supply 141 is turned on and off. Here, if the time change in the transient current due to the transient response is defined as time constant τ, then τ is expressed as τ = L / R. Here, L is the inductance of the heat flow sensor 121, and R is the resistance of the heat flow sensor 121. Since the time constant τ depends on the temperature, the temperature can be calculated from the time constant τ.

[0056] In other words, the acquisition step acquires a transient response of the heat flow sensor 121. The calculation step calculates the temperature of at least one of the workpiece 210 (object) and the heater 110 (thermal control member) based on the transient response and the first reference information. According to this aspect, the temperature can be calculated using the heat flow sensor.

[0057] 6. Fourth Embodiment In Section 6, a fourth embodiment of the present invention will be described.

[0058] 9 is a circuit diagram showing the configuration of the thermal control device 102. The thermal control device 102 differs from the thermal control device 100 in that it uses a diode 123 as a temperature sensor and a power supply 142 capable of applying positive and negative voltages. That is, the "sensor" in the claims includes the diode 123. According to this embodiment, the temperature can be obtained by the diode.

[0059] 10A shows a graph of the voltage of the thermal control device 102, and FIG. 10B shows a graph of the current of the thermal control device 102. First, when the power supply 142 is turned on and a positive voltage is applied to operate the heater 110 (section (a) of FIG. 10A), the value of the positive current flowing through the thermal control device 102 is measured (section (a) of FIG. 10B). Next, when the power supply 142 is turned off, no current is measured (section (b) of FIG. 10B), but the positive voltage output from the heat flow sensor 121 is measured (section (b) of FIG. 10A). Next, when the power supply 142 is turned on and a negative voltage is applied to operate the heater 110 (section (c) of FIG. 10A), the value of the negative current flowing through the thermal control device 102 is measured (section (c) of FIG. 10B). Next, when the power supply 142 is turned OFF, no current is measured (section (d) in FIG. 10B), but a positive voltage is measured (section (d) in FIG. 10A) output from the heat flow sensor 121. Next, when the power supply 142 is turned ON and a positive voltage is applied to operate the heater 110 (section (e) in FIG. 10A), the value of the positive current flowing through the thermal control device 102 is measured (section (e) in FIG. 10B).

[0060] Here, current I1 in Figure 10(B) represents the sum of the current flowing through the heater 110, the current flowing through the diode 123, and the current flowing through the heat flow sensor 121. Current I2 in Figure 10(B) represents the sum of the current flowing through the heater 110 and the current flowing through the heat flow sensor 121. The difference between current I1 and current I2 is generated by the rectification action of diode 123. Therefore, the current flowing through diode 123 can be calculated by I1 - I2. The current flowing through diode 123 calculated in this way has temperature dependency, which can be used to measure temperature.

[0061] In other words, in the application step, the power supply 142 alternately applies a positive voltage and a negative voltage. In the calculation step, the value of the current flowing through the diode 123 is calculated based on the value of the current flowing due to the application of a positive voltage and the value of the current flowing due to the application of a negative voltage. In the calculation step, the temperature of at least one of the workpiece 210 (object) and the heater 110 (thermal control member) is calculated based on the calculated current value and the first reference information. According to this aspect, the temperature can be calculated by utilizing the properties of the diode.

[0062] 11A shows a graph of the voltage of the thermal control device 102, and FIG. 11B shows a graph of the current of the thermal control device 102. First, when the power supply 142 is turned on and a positive voltage is applied to operate the heater 110 (section (a) of FIG. 11A), the value of the positive current flowing through the thermal control device 102 is measured (section (a) of FIG. 11B). Next, when the forward voltage (VF) of the diode 123 is applied (section (b) of FIG. 11A), the value of the positive current flowing through the thermal control device 102 is measured (section (b) of FIG. 11B). Next, when the power supply 142 is turned off, no current is measured (section (c) of FIG. 11B), but the positive voltage output from the heat flow sensor 121 is measured (section (c) of FIG. 11A). Next, when the power supply 142 is turned on and a negative voltage is applied to operate the heater 110 (section (d) in FIG. 11A), the value of the negative current flowing through the heat control device 102 is measured (section (d) in FIG. 11B). Next, when a reverse voltage (VR, here a voltage with a negative sign of the forward voltage) equal to or less than the reverse withstand voltage of the diode 123 is applied (section (e) in FIG. 11A), the value of the negative current flowing through the heat control device 102 is measured (section (e) in FIG. 11B). Next, when the power supply 142 is turned off, no current is measured (section (f) in FIG. 11B), but a positive voltage output from the heat flow sensor 121 is measured (section (f) in FIG. 11A). Next, when the power supply 142 is turned on and a positive voltage is applied to operate the heater 110 (section (g) in Figure 11(A)), the value of the positive current flowing through the thermal control device 102 is measured (section (g) in Figure 11(B)).

[0063] Here, current I3 in FIG. 11B indicates the sum of the current flowing through the heater 110, the current flowing through the diode 123, and the current flowing through the heat flow sensor 121. Current I4 in FIG. 11B indicates the sum of the current flowing through the heater 110 and the current flowing through the heat flow sensor 121. The difference between current I3 and current I4 is generated by the rectification action of diode 123. In other words, the current flowing through diode 123 is calculated as I3 - I4. The current flowing through diode 123 calculated in this way has temperature dependency, which can be used to measure temperature.

[0064] In this way, by providing a section (section (b) in FIG. 11) in which a forward voltage of the diode 123 that is lower than the drive voltage of the heater 110 is applied, the value of the current flowing through the heater 110 becomes small in this section. In other words, the current I3 corresponding to section (b) in FIG. 11 contains a relatively large amount of current derived from the diode 123.

[0065] Furthermore, by providing a section (section (e) in FIG. 11) in which a reverse voltage (here, a voltage with a negative sign of the forward voltage) that is lower than the drive voltage of the heater 110 and equal to or lower than the reverse withstand voltage of the diode 123 is applied, the value of the current flowing through the heater 110 is similarly reduced in this section.

[0066] Therefore, according to this aspect, it is possible to improve the accuracy of temperature acquisition by utilizing the properties of the diode.

[0067] In other words, in the application step, a first voltage and a second voltage are applied by the power supply 142. The first voltage is a voltage that drives the heater 110 (thermal control element). The second voltage is a forward voltage of the diode 123. In the calculation step, the temperature of at least one of the workpiece 210 (object) and the heater 110 (thermal control element) is calculated based on the current values ​​(currents I3 and I4 in this case) that flow due to the application of the second voltage and the first reference information.

[0068] 12A shows a graph of the voltage of the thermal control device 102, and FIG. 12B shows a graph of the current of the thermal control device 102. First, when the power supply 142 is turned on and a positive voltage is applied to operate the heater 110 (section (a) of FIG. 12A), the value of the positive current flowing through the thermal control device 102 is measured (section (a) of FIG. 12B). Next, when the forward voltage (VF) of the diode 123 is applied (section (b) of FIG. 12A), the value of the positive current flowing through the thermal control device 102 is measured (section (b) of FIG. 12B). Next, when the power supply 142 is turned off, no current is measured (section (c) of FIG. 12B), but the positive voltage output from the heat flow sensor 121 is measured (section (c) of FIG. 12A). Next, when the power supply 142 is turned on and a positive voltage is applied to operate the heater 110 (section (d) in FIG. 12A), the value of the positive current flowing through the heat control device 102 is measured (section (d) in FIG. 12B). Next, when a forward voltage is applied to the diode 123 (section (e) in FIG. 12A), the value of the positive current flowing through the heat control device 102 is measured (section (e) in FIG. 12B). Next, when the power supply 142 is turned off, no current is measured (section (f) in FIG. 12B), but the positive voltage output from the heat flow sensor 121 is measured (section (f) in FIG. 12A). Next, when the power supply 142 is turned on and a positive voltage is applied to operate the heater 110 (section (g) in FIG. 11A), the value of the positive current flowing through the heat control device 102 is measured (section (g) in FIG. 11B).

[0069] Here, current I5 in FIG. 12(B) represents the sum of the current flowing through the heater 110 and the heat flow sensor 121 when voltage V5 is applied. Current I6 in FIG. 12(B) represents the sum of the current flowing through the heater 110, the current flowing through the diode 123, and the current flowing through the heat flow sensor 121 when voltage V6 is applied. Here, when calculating the current flowing through diode 123, current I5 and current I6 depend on the corresponding voltage (voltage V5 or voltage V6), so they must be scaled accordingly. That is, the current flowing through diode 123 can be calculated as I6-I5×V6 / V5. The current flowing through diode 123 calculated in this manner has temperature dependency, which can be used to measure temperature.

[0070] In other words, in the application step, the power supply 142 applies a third voltage (voltage V6) and a fourth voltage (voltage V5). The third voltage is a voltage that drives the heater 110 (thermal control element). The fourth voltage is a forward voltage of the diode 123. In the calculation step, the temperature of at least one of the workpiece 210 (object) and the heater 110 (thermal control element) is calculated based on the value of the third voltage, the value of the fourth voltage, the value of the current (current I6) that flows due to the application of the third voltage, the value of the current (current I5) that flows due to the application of the fourth voltage, and the first reference information. This aspect can improve the accuracy of temperature acquisition by utilizing the properties of the diode.

[0071] 7. Fifth Embodiment In Section 7, a fifth embodiment of the present invention will be described.

[0072] 13 is a circuit diagram showing the configuration of the thermal control device 103. The thermal control device 103 differs from the thermal control device 100 in that it uses an integrated circuit 124 as a temperature sensor and a power supply 142 capable of applying positive and negative voltages. That is, the "sensor" in the claims includes the integrated circuit 124. The integrated circuit 124 alternately turns ON and OFF when a voltage is applied, and outputs a current consumption corresponding to the ON state and a current consumption corresponding to the OFF state. According to this embodiment, the temperature can be obtained by the integrated circuit 124.

[0073] 14A shows a graph of the voltage of the thermal control device 103 monitored, and FIG. 14B shows a graph of the current of the thermal control device 103 monitored. First, when the power supply 142 is turned on and a voltage to operate the heater 110 is applied (section (a) of FIG. 14A), the value of the current flowing through the thermal control device 103 is measured (section (a) of FIG. 14B). Next, when the power supply 142 is turned off, no current is measured (section (b) of FIG. 14B), but the voltage output from the heat flow sensor 121 is measured (section (b) of FIG. 14A). Next, when the power supply 142 is turned on and a voltage to operate the heater 110 is applied (section (c) of FIG. 14A), the value of the current flowing through the thermal control device 103 is measured (section (c) of FIG. 14B). Next, when the power supply 142 is turned OFF, no current is measured (section (d) in FIG. 14B), but the voltage output from the heat flow sensor 121 is measured (section (d) in FIG. 14A). Next, when the power supply 142 is turned ON and a voltage is applied to operate the heater 110 (section (e) in FIG. 14A), the value of the current flowing through the heat control device 103 is measured (section (e) in FIG. 14B).

[0074] 14(B) shows current in each section with peaks and valleys formed by the pulsed current output from the integrated circuit 124. These peaks and valleys indicate the current consumption of the integrated circuit 124. The control unit 150 inputs a current consumption value indicating the current consumption of the integrated circuit 124 to the integrated circuit 124 via the communication unit 180, and causes the integrated circuit 124 to calculate the temperature of at least one of the workpiece 210 and the heater 110.

[0075] In other words, the acquisition step acquires a current consumption value indicating the current consumption of the integrated circuit 124. The calculation step inputs the current consumption value into the integrated circuit 124, and causes the integrated circuit 124 to calculate the temperature of at least one of the workpiece 210 (object) and the heater 110 (thermal control member). According to this aspect, the temperature can be calculated by utilizing the properties of the integrated circuit.

[0076] 8. Sixth Embodiment In Section 8, a sixth embodiment of the present invention will be described.

[0077] 15 is a diagram showing the configuration of the thermal control device 104. The thermal control device 104 differs from the thermal control device 100 in that the heater 110, the heat flow sensor 121, and the temperature sensor 122 are arranged with the workpiece 210 sandwiched between them.

[0078] 15 , the heater 110 may be disposed apart from the heat flow sensor 121 and the temperature sensor 122. In this case, the wiring 131 and the wiring 132 are disposed so as to electrically connect the heater 110 to the heat flow sensor 121 and the temperature sensor 122, for example, by avoiding the space in which the workpiece 210 is disposed and going around the space.

[0079] 9. Seventh Embodiment In Section 9, a seventh embodiment of the present invention will be described.

[0080] FIG. 16 is a diagram showing the configuration of the thermal control device 105. The thermal control device 105 calculates the temperature T1 of a measurement point 211 on the workpiece 210. The measurement point 211 is an arbitrary point on the workpiece 210. The temperature T1 of the measurement point 211 is an example of the "degree of heat" in the claims. When the temperature T2 of the heater 110 is measured by the temperature sensor 122, a temperature difference occurs between the temperature T2 and the temperature T1 due to differences in distance from the heater 110, which is the heat source. Therefore, T1 can be calculated using the heat flow value Q measured by the heat flow sensor 121 and the thermal resistance θ, which is the sum of the thermal resistance of the copper plate 220, the thermal resistance at the interface between the copper plate 220 and the workpiece 210, and the thermal resistance of the workpiece 210 from the interface to the measurement point 211, as expressed by T1 = T2 + Q × θ.

[0081] In other words, the above is expressed as steps: in the acquisition step, a voltage or current value (thermal information) output by the temperature sensor 122 is acquired; in the calculation step, temperature information indicating the temperature of the heater 110 (thermal control element) is calculated based on the voltage or current value (thermal information) and first reference information; in the calculation step, the temperature (degree of heat) at the measurement point 211 (arbitrary location) is calculated based on the temperature information, the calculated heat flow value, the thermal resistance value from the heater 110 (thermal control element) to the measurement point 211 (arbitrary location) on the workpiece 210 (object), and third reference information; here, the third reference information is information indicating the relationship between the temperature of the heater 110 (thermal control element), the heat flow value, the thermal resistance value, and the temperature at the arbitrary location. According to this aspect, the temperature at the arbitrary location on the object can be calculated.

[0082] Although the embodiment of the present invention has been described above, the present invention is not limited to this and can be modified as appropriate within the scope of the technical idea of ​​the invention.

[0083] 10. Modifications Modifications of this embodiment will be described in Section 10. The following modifications can be combined as appropriate.

[0084] An aspect of this embodiment may be a program that causes a computer to execute each step of the control method of this embodiment.

[0085] An aspect of the present embodiment may be a recording medium. The recording medium is a non-transitory computer-readable recording medium. The recording medium records a program that causes a computer to execute each step of the control method of the present embodiment.

[0086] The control unit 150 performs writing (storing) and reading processes for various data and information to the memory unit 170, but this is not limited to this, and for example, the control unit 150 may use a register or cache memory within the control unit 150 to perform information processing for each activity.

[0087] In this embodiment, the heater 110 has been described as an example of a thermal control element, but the present invention is not limited to this. For example, a cooler that cools an object may be used as a thermal control element.

[0088] In the present embodiment, an example in which the current is monitored when the device is driven at a constant voltage has been described, but the present invention is not limited to this. It is also possible to monitor the voltage when the device is driven at a constant current.

[0089] In the present embodiment, an example has been described in which the diodes 123 or the integrated circuits 124 are connected in parallel, but the present invention is not limited to this. The diodes 123 or the integrated circuits 124 may be connected in series.

[0090] The heat flow sensor 121 and the temperature sensor 122 have such high impedance that almost no current flows when a voltage is applied, but a small amount of current flows when the heater 110 is driven. Therefore, the heat flow sensor 121 and the temperature sensor 122 may self-heat when the heater 110 is driven. Therefore, the voltage and current values ​​of the thermal control device 100 may be acquired when the self-heating of the heat flow sensor 121 and the temperature sensor 122 disappears. In other words, in the acquisition step, thermal information is acquired a predetermined time after the application of voltage by the power supply 141. This aspect can reduce measurement errors caused by self-heating of the sensors.

[0091] Similarly, the degree of heat may be calculated in consideration of the amounts of self-heating of the heat flow sensor 121 and the temperature sensor 122. In other words, in the calculation step, the degree of heat is calculated based on the thermal information, the amount of self-heating of the sensor, and the fourth reference information. Here, the fourth reference information is information indicating the relationship between the thermal information, the amount of self-heating, and the degree of heat. This aspect can reduce measurement errors due to self-heating of the sensor.

[0092] In this embodiment, the copper plate 220 is described as an example of a thermal conductor, but the thermal conductor is not limited to this. For example, the thermal conductor may be steel, stainless steel, aluminum, ceramic, or the like.

[0093] 11. Others The present invention may be provided in the following forms.

[0094] (1) A thermal control device comprising a thermal control element, a sensor, wiring, and a power supply, wherein the thermal control element heats or cools an object, the sensor outputs thermal information regarding heat acting on the object, the wiring electrically connects the thermal control element and the sensor, and the power supply applies a voltage to the thermal control element and the sensor via the wiring.

[0095] According to this aspect, the number of required wires can be reduced, and therefore the device can be easily installed on a manufacturing line.

[0096] (2) The thermal control device according to (1) above, wherein the wiring electrically connects the thermal control element and the sensor inside the thermal control element.

[0097] According to this aspect, the exposed wiring is reduced, making it easier to install in a manufacturing line.

[0098] (3) In the thermal control device described in (1) or (2) above, the thermal control element and the sensor are of a two-wire type.

[0099] According to this embodiment, the number of wires can be reduced to two (minimum).

[0100] (4) The thermal control device according to any one of (1) to (3) above, wherein the sensor includes a heat flow sensor.

[0101] According to this aspect, the heat flow value can be obtained by the heat flow sensor.

[0102] (5) The thermal control device according to any one of (1) to (4) above, wherein the sensor includes a diode.

[0103] According to this aspect, the temperature can be obtained by the diode.

[0104] (6) The thermal control device according to any one of (1) to (5) above, wherein the sensor includes an integrated circuit.

[0105] According to this aspect, the temperature can be acquired by the integrated circuit.

[0106] (7) A thermal control device according to any one of (1) to (6) above, further comprising a control unit, wherein the control unit calculates the degree of heat acting on the object based on the thermal information and first reference information, the first reference information being information indicating the relationship between the thermal information and the degree of heat, and the control unit controls the operation of the power supply based on the degree of heat and second reference information, the second reference information being information indicating the relationship between the degree of heat and the operation of the power supply.

[0107] According to this aspect, feedback control can be performed according to the degree of heat acting on the object.

[0108] (8) In the thermal control device described in (7) above, the sensor includes a heat flow sensor, the control unit acquires a transient response of the heat flow sensor, and the control unit calculates the temperature of at least one of the object and the thermal control element based on the transient response and the first reference information.

[0109] According to this aspect, the heat flow sensor can calculate the temperature in addition to the heat flow value.

[0110] (9) In the thermal control device described in (7) or (8) above, the sensor includes a heat flow sensor, and the control unit acquires the thermal information output by the heat flow sensor at the timing when the output impedance of the power supply becomes greater than or equal to a threshold value.

[0111] According to this aspect, for example, the heat flow value can be calculated using the voltage value (heat information) output from the heat flow sensor when the power is off.

[0112] (10) A control method for controlling the operation of a thermal control device described in any one of (1) to (9) above, comprising an application step, an acquisition step, a calculation step, and a drive control step, wherein in the application step, the voltage is applied by the power supply, in the acquisition step, the thermal information output by the sensor is acquired, in the calculation step, the degree of heat acting on the object is calculated based on the thermal information and first reference information, the first reference information being information indicating the relationship between the thermal information and the degree of heat, and in the drive control step, the drive of the power supply is controlled based on the degree of heat and second reference information, and the second reference information being information indicating the relationship between the degree of heat and the drive of the power supply.

[0113] According to this aspect, feedback control can be performed on a thermal control device with a reduced number of wires.

[0114] (11) In the control method described in (10) above for controlling the operation of the thermal control device described in (4) above, the acquisition step acquires a voltage value output from the heat flow sensor, and the calculation step calculates a heat flow value acting on the object based on the voltage value and the first reference information.

[0115] According to this aspect, feedback control can be performed on the thermal control device using the heat flow sensor.

[0116] (12) In the control method described in (10) or (11) above for controlling the operation of the thermal control device described in (4) above, the acquisition step acquires a transient response of the heat flow sensor, and the calculation step calculates the temperature of at least one of the object and the thermal control element based on the transient response and the first reference information.

[0117] According to this aspect, the temperature can be calculated using the heat flow sensor.

[0118] (13) In the control method described in any one of (10) to (12) above, which controls the operation of the thermal control device described in (5) above, in the application step, the power supply applies a positive voltage and a negative voltage alternately, in the calculation step, the value of the current flowing through the diode is calculated based on the value of the current flowing due to the application of the positive voltage and the value of the current flowing due to the application of the negative voltage, and in the calculation step, the temperature of at least one of the object and the thermal control element is calculated based on the calculated current value and the first reference information.

[0119] According to this aspect, the temperature can be calculated by utilizing the properties of the diode.

[0120] (14) In the control method described in any one of (10) to (13) above, which controls the operation of the thermal control device described in (5) above, in the application step, a first voltage and a second voltage are applied by the power source, the first voltage is a voltage that drives the thermal control element, and the second voltage is a forward voltage of the diode, and in the calculation step, the temperature of at least one of the object and the thermal control element is calculated based on the current value that flows due to the application of the second voltage and the first reference information.

[0121] According to this aspect, it is possible to improve the accuracy of temperature acquisition by utilizing the properties of the diode.

[0122] (15) In the control method described in any one of (10) to (13) above, which controls the operation of the thermal control device described in (5) above, in the application step, a third voltage and a fourth voltage are applied by the power supply, the third voltage is a voltage that drives the thermal control element, and the fourth voltage is a forward voltage of the diode, and in the calculation step, the temperature of at least one of the object and the thermal control element is calculated based on the value of the third voltage, the value of the fourth voltage, the value of the current that flows due to the application of the third voltage, the value of the current that flows due to the application of the fourth voltage, and the first reference information.

[0123] According to this aspect, it is possible to improve the accuracy of temperature acquisition by utilizing the properties of the diode.

[0124] (16) In a control method described in any one of (10) to (15) above for controlling the operation of the thermal control device described in (6) above, the acquisition step acquires a current consumption value indicating the current consumption of the integrated circuit, and the calculation step inputs the current consumption value into the integrated circuit, causing the integrated circuit to calculate the temperature of at least one of the object and the thermal control element.

[0125] According to this aspect, the temperature can be calculated by utilizing the properties of the integrated circuit.

[0126] (17) In the control method described in (11) above, the sensor further includes a temperature sensor, and in the acquisition step, the thermal information output by the temperature sensor is acquired, and in the calculation step, temperature information indicating the temperature of the thermal control element is calculated based on the thermal information and the first reference information, and in the calculation step, the temperature at the arbitrary location is calculated based on the temperature information, the heat flow value, the thermal resistance value from the thermal control element to the arbitrary location in the object, and third reference information, and the third reference information is information indicating the relationship between the temperature of the thermal control element, the heat flow value, the thermal resistance value, and the temperature at the arbitrary location.

[0127] According to this aspect, it is possible to calculate the temperature of any location on the object.

[0128] (18) In the control method according to any one of (10) to (17) above, in the acquiring step, the thermal information is acquired after a predetermined time has elapsed since the application of the voltage.

[0129] According to this aspect, it is possible to reduce measurement errors caused by self-heating of the sensor.

[0130] (19) In the control method described in any one of (10) to (17) above, in the calculation step, the degree of heat is calculated based on the thermal information, the amount of self-heating of the sensor, and fourth reference information, and the fourth reference information is information indicating the relationship between the thermal information, the amount of self-heating, and the degree of heat.

[0131] According to this aspect, it is possible to reduce measurement errors caused by self-heating of the sensor.

[0132] (20) In a control method described in any one of (10) to (19) above, which controls the operation of the thermal control device described in (9) above, the acquisition step acquires the thermal information output by the heat flow sensor at a timing when the output impedance of the power supply becomes greater than or equal to a threshold value.

[0133] According to this aspect, for example, the heat flow value can be calculated using the voltage value (heat information) output from the heat flow sensor when the power is off.

[0134] (21) A non-transitory computer-readable recording medium having a program recorded thereon that causes the computer to execute each step of the control method described in any one of (10) to (20) above.

[0135] According to this aspect, it is possible to execute feedback control on a thermal control device with a reduced number of wires.

[0136] 100: Thermal control device, 101: Thermal control device, 102: Thermal control device, 103: Thermal control device, 104: Thermal control device, 105: Thermal control device, 110: Heater, 121: Heat flow sensor, 122: Temperature sensor, 123: Diode, 124: Integrated circuit, 131: Wiring, 132: Wiring, 141: Power supply, 142: Power supply, 150: Control unit, 151: Application unit, 152: Acquisition unit, 153: Calculation unit, 154: Drive control unit, 161: Ammeter, 162: Voltmeter, 170: Memory unit, 180: Communication unit, 190: Communication bus, 210: Workpiece, 211: Measurement point, 220: Copper plate, I1: Current, I2: Current, I3: Current, I4: Current, I5: Current, I6: Current, V5: Voltage, V6: Voltage

Claims

1. A thermal control device comprising a thermal control element, a sensor, wiring, and a power supply, wherein the thermal control element heats or cools an object, the sensor outputs thermal information relating to heat acting on the object, the wiring electrically connects the thermal control element and the sensor, and the power supply applies a voltage to the thermal control element and the sensor via the wiring.

2. A thermal control device according to claim 1, wherein the wiring electrically connects the thermal control element and the sensor inside the thermal control element.

3. A thermal control device according to claim 1 or 2, wherein the thermal control member and the sensor are of a two-wire type.

4. A thermal control device according to any one of claims 1 to 3, wherein the sensor includes a heat flow sensor.

5. A thermal control device according to any one of claims 1 to 4, wherein the sensor includes a diode.

6. A thermal control device according to any one of claims 1 to 5, wherein the sensor includes an integrated circuit.

7. A thermal control device according to any one of claims 1 to 6, further comprising a control unit, wherein the control unit calculates the degree of heat acting on the object based on the thermal information and first reference information, the first reference information being information indicating the relationship between the thermal information and the degree of heat, and the control unit controls the operation of the power supply based on the degree of heat and second reference information, and the second reference information being information indicating the relationship between the degree of heat and the operation of the power supply.

8. A thermal control device according to claim 7, wherein the sensor includes a heat flow sensor, the control unit acquires a transient response of the heat flow sensor, and the control unit calculates the temperature of at least one of the object and the thermal control member based on the transient response and the first reference information.

9. A thermal control device according to claim 7 or 8, wherein the sensor includes a heat flow sensor, and the control unit acquires the thermal information output by the heat flow sensor at the timing when the output impedance of the power supply becomes equal to or greater than a threshold value.

10. A control method for controlling the operation of a thermal control device according to any one of claims 1 to 9, comprising an application step, an acquisition step, a calculation step, and a drive control step, wherein in the application step, the voltage is applied by the power supply, the acquisition step acquires the thermal information output by the sensor, the calculation step calculates the degree of heat acting on the object based on the thermal information and first reference information, the first reference information being information indicating the relationship between the thermal information and the degree of heat, and in the drive control step, the drive of the power supply is controlled based on the degree of heat and second reference information, and the second reference information being information indicating the relationship between the degree of heat and the drive of the power supply.

11. A control method as claimed in claim 10 for controlling the operation of the thermal control device as claimed in claim 4, wherein the acquisition step acquires a voltage value output from the heat flow sensor, and the calculation step calculates a heat flow value acting on the object based on the voltage value and the first reference information.

12. A control method as claimed in claim 10 or 11 for controlling the operation of the thermal control device as claimed in claim 4, wherein the acquisition step acquires a transient response of the heat flow sensor, and the calculation step calculates the temperature of at least one of the object and the thermal control element based on the transient response and the first reference information.

13. A control method according to any one of claims 10 to 12 for controlling the operation of a thermal control device according to claim 5, wherein in the applying step, a positive voltage and a negative voltage are alternately applied by the power supply; in the calculating step, a value of a current flowing through the diode is calculated based on a value of a current flowing due to application of the positive voltage and a value of a current flowing due to application of the negative voltage; and in the calculating step, a temperature of at least one of the object and the thermal control element is calculated based on the calculated current value and the first reference information.

14. A control method according to any one of claims 10 to 13 for controlling the operation of a thermal control device according to claim 5, wherein in the applying step, a first voltage and a second voltage are applied by the power supply, the first voltage is a voltage that drives the thermal control element, and the second voltage is a forward voltage of the diode, and in the calculating step, the temperature of at least one of the object and the thermal control element is calculated based on the value of the current that flows due to the application of the second voltage and the first reference information.

15. A control method according to any one of claims 10 to 13 for controlling the operation of the thermal control device of claim 5, wherein in the applying step, a third voltage and a fourth voltage are applied by the power supply, the third voltage is a voltage that drives the thermal control element, and the fourth voltage is a forward voltage of the diode, and in the calculating step, the temperature of at least one of the object and the thermal control element is calculated based on the value of the third voltage, the value of the fourth voltage, the value of the current that flows due to the application of the third voltage, the value of the current that flows due to the application of the fourth voltage, and the first reference information.

16. A control method according to any one of claims 10 to 15, for controlling the operation of the thermal control device according to claim 6, wherein the acquisition step acquires a current consumption value indicating the current consumption of the integrated circuit, and the calculation step inputs the current consumption value into the integrated circuit, causing the integrated circuit to calculate the temperature of at least one of the object and the thermal control member.

17. A control method according to claim 11, wherein the sensor further includes a temperature sensor; the acquisition step acquires the thermal information output by the temperature sensor; the calculation step calculates temperature information indicating the temperature of the thermal control element based on the thermal information and the first reference information; and the calculation step calculates the temperature at the arbitrary location based on the temperature information, the heat flow value, the thermal resistance value from the thermal control element to the arbitrary location in the object, and third reference information, wherein the third reference information is information indicating the relationship between the temperature of the thermal control element, the heat flow value, the thermal resistance value, and the temperature at the arbitrary location.

18. A control method according to any one of claims 10 to 17, wherein in the acquisition step, the thermal information is acquired after a predetermined time has elapsed since the application of the voltage.

19. A control method according to any one of claims 10 to 17, wherein in the calculation step, the degree of heat is calculated based on the thermal information, the amount of self-heating of the sensor, and fourth reference information, and the fourth reference information is information indicating the relationship between the thermal information, the amount of self-heating, and the degree of heat.

20. A control method according to any one of claims 10 to 19, for controlling the operation of the thermal control device according to claim 9, wherein in the acquisition step, the thermal information output by the heat flow sensor is acquired at a timing when the output impedance of the power supply becomes equal to or greater than a threshold value.

21. A non-transitory computer-readable recording medium having recorded thereon a program for causing the computer to execute each step of the control method according to any one of claims 10 to 20.

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