Electronic device comprising heat diffusion members

Abstract

This electronic device comprises: a printed circuit board; one or more electronic components on the printed circuit board; a bracket including a first surface that supports the printed circuit board, and a second surface opposite to the first surface; a first heat diffusion member extending in a first direction on the second surface; and a second heat diffusion member extending in a second direction on the second surface of the bracket and intersecting with the first heat diffusion member. The first heat diffusion member is located in a first region of the second surface, which overlaps the printed circuit board. The second heat diffusion member is located in the first region of the second surface and a second region of the second surface, which is different from the first region of the second surface.

Description

Electronic devices including heat spreading elements

[0001] The present disclosure relates to an electronic device including heat spreading members.

[0002] Electronic devices may include electronic components to provide various functions. When these electronic components operate, heat may be generated. If the heat generated from these components is not diffused but rather concentrated in a localized area within the electronic device, a temperature rise in the electronic device may result in failure and / or malfunction. Electronic devices may include a heat diffusion member for heat diffusion and cooling.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a printed circuit board. The electronic device may include one or more electronic components arranged on the printed circuit board. The electronic device may include a bracket having a first surface supporting the printed circuit board and a second surface opposite the first surface. The electronic device may include a first heat spreading member extending in a first direction on the second surface of the bracket and configured to spread heat from the one or more electronic components. The electronic device may include a second heat spreading member extending in a second direction on the second surface of the bracket, intersecting the first heat spreading member, and configured to spread the heat from the one or more electronic components. The first heat spreading member may be positioned within a first region of the second surface overlapping the printed circuit board when the second surface of the bracket is viewed from above. The second heat diffusion member may be positioned in a second region of the second surface that is different from the first region of the second surface and the first region of the second surface when the second surface of the bracket is viewed from above.

[0005] An electronic device is provided. The electronic device may include a printed circuit board. The electronic device may include a main processor disposed on the printed circuit board. The electronic device may include a bracket having a first surface supporting the printed circuit board and a second surface opposite the first surface. The electronic device may include a first heat spreading member extending in a first direction on the second surface of the bracket. The electronic device may include a second heat spreading member extending in a second direction on the second surface of the bracket and intersecting the first heat spreading member. A portion where the first heat spreading member and the second heat spreading member intersect may at least partially overlap the main processor on the printed circuit board when the second surface of the bracket is viewed from above.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] Figure 2 illustrates an electronic device according to one embodiment.

[0008] Figure 3 is an exploded perspective view of an electronic device according to one embodiment.

[0009] FIG. 4 is a front view of a bracket of an electronic device according to one embodiment in which a display is omitted.

[0010] FIG. 5 is a rear view of a bracket of an electronic device according to one embodiment omitting the rear cover and printed circuit board.

[0011] FIG. 6 is a part of a cross-sectional view taken along line A-A' of the electronic device of FIG. 4.

[0012] Figure 7 is a cross-sectional view of an electronic device according to one embodiment.

[0013] FIGS. 8, 9, and 10 illustrate electronic devices according to various embodiments.

[0014] Fig. 11 is a graph showing the heat dissipation effect of an electronic device according to one embodiment.

[0015] FIGS. 12, 13, 14, 15, and 16 illustrate electronic devices according to various embodiments.

[0016] Figure 17 is a cross-sectional view of an electronic device according to one embodiment.

[0017] Figure 18 is a cross-sectional view of an electronic device that does not include a second opening.

[0018] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0021] The auxiliary processor (123) may, for example, take the place of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or may be

[0022] While the processor (121) is in an active (e.g., application execution) state, the processor (121) may control, together with the main processor (121), at least a portion of functions or states related to at least one component (e.g., display module (160), sensor module (176), or communication module (190)) of the electronic device (101). According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as a part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) itself on which artificial intelligence is performed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be one of, but is not limited to, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above.An artificial intelligence model may additionally or alternatively include a software structure in addition to or in addition to a hardware structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] Figure 2 illustrates an electronic device according to one embodiment.

[0043] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) surrounding a space between the first side (200A) and the second side (200B).

[0044] An electronic device (101) according to one embodiment may include a display (201) (e.g., a display module (160) of FIG. 1). The display (201) may include a substantially transparent window (e.g., a window (201b) of FIG. 3). The window (201b) may form at least a portion of the first surface (200A). For example, the window (201b) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0045] An electronic device (101) according to one embodiment may include a substantially opaque rear cover (211). According to one embodiment, the rear cover (211) may form at least a portion of the second surface (200B). According to one embodiment, the rear cover (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0046] An electronic device (101) according to one embodiment may include an edge part (218). The edge part (218) may be combined with a window (201b) and / or a rear cover (211) to form at least a portion of a third side (200C) of the electronic device (101). For example, the edge part (218) may form the entire third side (200C) of the electronic device (101). For example, the edge part (218) may form the third side (200C) of the electronic device (101) together with the window (201b) and / or the rear cover (211).

[0047] An electronic device (101) according to one embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)) or may additionally include other components.

[0048] In one embodiment, at least a portion of the display (201) may be viewed through a window (201b) forming the first surface (200A). In one embodiment, the display (201) may include a display panel (e.g., display panel (201a) of FIG. 3) disposed on the back surface of the window (201b).

[0049] According to one embodiment, the display (201) may include a display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the display area (201A).

[0050] In one embodiment, the display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0051] According to one embodiment, the display (201) may include an area where a first camera module (205) (e.g., the camera module (180) of FIG. 1) is positioned. According to one embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). The display area (201A) may surround at least a portion of an edge of the opening. According to one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). The display (201) may provide visual information to a user through the area, and additionally, the first camera module (205) may acquire an image corresponding to a direction facing the first surface (200A) through the area of ​​the display (201).

[0052] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0053] According to one embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0054] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the third surface (200C) and / or a second microphone hole (204) formed in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0055] According to one embodiment, the second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0056] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (101). In one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, this is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the display (201) and the edge part (218).

[0057] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0058] According to one embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] According to one embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0060] According to one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include one camera.

[0061] According to one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0062] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0063] According to one embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0064] According to one embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0065] According to one embodiment, the edge part (218) may include a vent hole (206). For example, air outside the housing (210) may be introduced into the housing (210) through the vent hole (206). For example, air inside the housing (210) may be discharged out of the housing (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0066] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0067] Figure 3 is an exploded perspective view of an electronic device according to one embodiment.

[0068] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0069] Referring to FIG. 3, an electronic device (101) according to one embodiment may include an edge part (218), a bracket (243), printed circuit boards (250), a cover plate (260), and / or a battery (270). The printed circuit boards (250) may include a printed circuit board (251), which is a main board, and a sub-printed circuit board (252), which is a sub-board.

[0070] An electronic device (101) according to one embodiment may include an edge part (218) forming an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a bracket (243) coupled to the inner side of the edge part (218). According to one embodiment, the edge part (218) and the bracket (243) may be positioned between a display (201) and a rear cover (211). For example, the edge part (218) may surround a space between the rear cover (211) and the display (201). A window (201b) may be attached to the edge part (218).

[0071] In one embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the bracket (243) facing one direction (e.g., +z direction), and a portion of the display (201) may be supported by the bracket (243). For example, a printed circuit board (251), a sub-printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the bracket (243) facing the opposite direction (e.g., -z direction). For example, the printed circuit board (251), the sub-printed circuit board (252), the battery (270), and the second camera module (212) may be respectively seated in recesses defined by the edge part (218) and / or the bracket (243).

[0072] According to one embodiment, the printed circuit board (251), the sub-printed circuit board (252), and the battery (270) may be placed on the bracket (243). For example, the printed circuit board (251) and the sub-printed circuit board (252) may be fixed to the bracket (243) through a joining member such as a screw. For example, the battery (270) may be fixed to the bracket (243) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0073] In one embodiment, the cover plate (260) may be disposed between the printed circuit board (251) and the rear cover (211). In one embodiment, the cover plate (260) may be disposed on the printed circuit board (251). For example, the cover plate (260) may be disposed on a surface of the printed circuit board (251) facing the -z direction.

[0074] According to one embodiment, the cover plate (260) may at least partially overlap the printed circuit board (251) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the printed circuit board (251). In this way, the cover plate (260) may protect the printed circuit board (251) from physical impact.

[0075] According to one embodiment, the cover plate (260) may be secured to the printed circuit board (251) via a joining member (e.g., a screw), or may be joined to the bracket (243) together with the printed circuit board (251) via the joining member.

[0076] According to one embodiment, the display panel (201a) may be positioned between the bracket (243) and the window (201b). For example, the window (201b) may be positioned on one side (e.g., in the +z direction) of the display panel (201a), and the bracket (243) may be positioned on the other side (e.g., in the -z direction) of the display panel (201a).

[0077] According to one embodiment, the window (201b) may be coupled with the display panel (201a). For example, the window (201b) and the display panel (201a) may be adhered to each other through an optical adhesive material (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0078] According to one embodiment, the window (201b) may be coupled with the edge part (218). For example, the window (201b) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the edge part (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the window (201b) and the edge part (218). However, the present invention is not limited to the above-described example.

[0079] According to one embodiment, one or more electronic components (280), such as a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or interface (e.g., interface (177) of FIG. 1), may be disposed on the printed circuit board (251) and / or the sub-printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the printed circuit board (251) and the sub-printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0080] In one embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the printed circuit board (251) and / or the sub-printed circuit board (252).

[0081] An electronic device (101) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to one embodiment, the antenna module may be disposed between a rear cover (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0082] According to one embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the bracket (243) such that the lens can receive external light through a portion (e.g., the camera area (237)) of the window (201b) (e.g., the front (200A) of FIG. 2).

[0083] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the bracket (243) and the rear cover (211). In one embodiment, the second camera module (212) may be electrically connected to a printed circuit board (251) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that a lens can receive external light through a camera area (284) of the rear cover (211) of the electronic device (101).

[0084] According to one embodiment, the camera area (284) may be formed on a surface of the rear cover (211) (e.g., the rear surface (200B) of FIG. 2). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear cover (211) by a predetermined height. However, the present invention is not limited thereto, and according to one embodiment, the camera area (284) may form a plane that is substantially the same as the surface of the rear cover (211).

[0085] According to one embodiment, the housing (210) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the window (201b), the edge part (218), the bracket (243), and / or the rear cover (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0086] One or more electronic components (280) arranged on a printed circuit board (251) may operate by consuming power provided from a battery (270). When one or more electronic components (280) operate, heat may be generated. For example, when current passes through one or more electronic components (280), heat may be generated due to resistance included in one or more electronic components (280). If the heat caused from one or more electronic components (280) is locally concentrated, it may cause overheating of the electronic device (101). The overheating may cause damage or malfunction of the electronic components and may result in an accident such as a fire. For the usability and safety of the electronic device (101), heat dissipation from one or more electronic components (280) may be required.

[0087] An electronic device (101) according to one embodiment may include heat dissipation members for dissipating heat generated from one or more electronic components (280). For example, the electronic device (101) may include heat spreading members (e.g., a first heat spreading member (310) and a second heat spreading member (320) of FIG. 4) for dissipating heat from one or more electronic components (280) and releasing the heat into the surrounding air of the electronic device (101). For example, the heat spreading members (310, 320) may be disposed between a bracket (243) and a display. The bracket (243) may include openings. The openings may provide a path through which heat from one or more electronic components (280) is transferred to the heat spreading members (310, 320). The heat spreading members (310, 320) can be configured to spread heat from one or more electronic components (280), thereby suppressing an increase in the internal temperature of the electronic device (101) and reducing damage and malfunction of the electronic components.

[0088] Hereinafter, heat diffusion members (310, 320) of an electronic device (101) according to one embodiment are described. Components identical to the components described above may be assigned the same reference numerals, and redundant descriptions may be omitted. In the present disclosure, relative terms such as front, back, top, and bottom may be used to describe relative positions between components. For example, if the electronic device (101) illustrated in the drawing is flipped over, the front and back may be interchanged. For example, if the electronic device (101) illustrated in the drawing is flipped over, the top and bottom may be interchanged.

[0089] Fig. 4 is a front view of a bracket of an electronic device according to one embodiment omitting a display. Fig. 5 is a rear view of a bracket of an electronic device according to one embodiment omitting a rear cover and a printed circuit board.

[0090] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a printed circuit board (251) (e.g., the printed circuit board (251) of FIG. 3), one or more electronic components (280) (e.g., one or more electronic components (280) of FIG. 3), a bracket (243), a first heat spreading member (310), and a second heat spreading member (320).

[0091] According to one embodiment, the electronic device (101) may further include one or more third heat spreading members (e.g., one or more third heat spreading members (1210) of FIG. 12) overlapping the first heat spreading member (310) and the second heat spreading member (320) and positioned on a second surface of the bracket (243) (e.g., the second surface (243b) of FIG. 5).

[0092] According to one embodiment, the printed circuit board (251) may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the plurality of conductive layers. The printed circuit board (251) may provide electrical connections between various electronic components arranged on the printed circuit board (251) and / or the exterior of the printed circuit board (251) using wires and conductive vias formed on the conductive layers. The printed circuit board (251) may be supported by a bracket (243). As described above, one or more electronic components (e.g., one or more electronic components (280) of FIG. 3) may be arranged on the printed circuit board (251).

[0093] According to one embodiment, the bracket (243) may include a first side (e.g., the first side (243a) of FIG. 5) and a second side (243b) opposite the first side (243a). The first side (243a) of the bracket (243) may be a side of the bracket (243) that faces the rear side of the electronic device (101). For example, the first side (243a) of the bracket (243) may be disposed on (e.g., in the +z direction) a rear cover (e.g., the rear cover (211) of FIG. 3) and may face the rear cover (211). The second side (243b) of the bracket (243) may be a side of the bracket (243) that faces the front side of the electronic device (101). For example, the second side (243b) may be positioned below (e.g., in the -z direction) a display (e.g., display (201) of FIG. 3) and facing the display (201).

[0094] According to one embodiment, the first heat spreading member (310) and the second heat spreading member (320) may be disposed on the second surface (243b) of the bracket (243). For example, the first heat spreading member (310) and the second heat spreading member (320) may be disposed between the second surface (243b) of the bracket (243) and a display (e.g., the display (201) of FIG. 3). The first heat spreading member (310) and the second heat spreading member (320) may be configured to diffuse heat from one or more electronic components (280) disposed on the printed circuit board (251).

[0095] For example, heat generated when one or more electronic components (280) operate can be transferred to heat diffusing members (310, 320) through the bracket (243). The heat diffusing members (310, 320) can be configured to spread the heat so that the heat is not concentrated in a local area inside the electronic device (101) and to release the heat to the outside of the electronic device (101). As the heat is released to the outside of the electronic device (101), overheating of the electronic device (101) and damage and malfunction of electronic components can be reduced. The heat diffusing members (310, 320) can be formed of a material with high thermal conductivity so as to be able to spread the heat.

[0096] According to one embodiment, each of the first heat diffusion member (310) and the second heat diffusion member (320) may be formed to be elongated in order to diffuse heat from one or more electronic components (280). For example, the first heat diffusion member (310) may extend in a first direction on the second surface (243b) of the bracket (243). For example, the first direction may be a direction substantially parallel to the x-axis of FIG. 4, but is not limited thereto. For example, the second heat diffusion member (320) may extend in a second direction on the second surface (243b) of the bracket (243). For example, the second direction may be a direction substantially parallel to the y-axis of FIG. 4, but is not limited thereto.

[0097] According to one embodiment, the first heat diffusion member (310) and the second heat diffusion member (320) may be arranged to intersect with each other. The structure in which the first heat diffusion member (310) and the second heat diffusion member (320) intersect with each other may be referred to as a structure in which the extension direction of the first heat diffusion member (310) (e.g., the first direction) and the extension direction of the second heat diffusion member (320) intersect with each other. As illustrated in FIG. 4, the second heat diffusion member (320) may be arranged to intersect with the first heat diffusion member (310) substantially perpendicularly, but is not limited thereto.

[0098] An electronic device (101) according to one embodiment can spread heat from one or more electronic components (280) over a relatively wide range through a first heat spreading member (310) and a second heat spreading member (320). For example, when the electronic device (101) includes only a second heat spreading member (320), heat from an electronic component (e.g., a first electronic component (281) of FIG. 6) positioned within an area covered by the second heat spreading member (320) (e.g., an area overlapping the second heat spreading member (320)) can be spread through the second heat spreading member (320), but heat from an electronic component (e.g., a second electronic component (282) of FIG. 6) positioned within an area not covered by the second heat spreading member (320) (e.g., an area not overlapping the second heat spreading member (320)) may have difficulty being spread through the second heat spreading member (320). Since various electronic components may be arranged on the printed circuit board (251) to provide various functions, heat dissipation over a relatively wide range may be required for heat dissipation of the electronic device (101). According to one embodiment, the electronic device (101) may include a first heat diffusion member (310) and a second heat diffusion member (320) arranged to intersect each other to provide heat dissipation over a wide range through the heat diffusion members (310, 320).

[0099] In one embodiment, the thermal characteristics of the first heat diffusion member (310) and the thermal characteristics of the second heat diffusion member (320) may be different from each other. In one embodiment, the heat dissipation performance of the second heat diffusion member (320) may be superior to the heat dissipation performance of the first heat diffusion member (310). For example, the thermal conductivity of the second heat diffusion member (320) may be higher than the thermal conductivity of the first heat diffusion member (310).

[0100] In one embodiment, the second heat diffusion member (320) may include a vapor chamber or heat pipe containing an enclosure and a fluid contained within the enclosure. For example, when heat from one or more electronic components (280) is transferred to the vapor chamber or heat pipe, the heat may vaporize the fluid. As the fluid vaporizes, the heat may be cooled because it absorbs thermal energy from the surroundings. When the heat is released to the outside of the electronic device (101), the vaporized fluid may be liquefied again. The second heat diffusion member (320) may include a wick for moving the liquid-state fluid. Since the second heat diffusion member (320) diffuses and cools heat by utilizing a phase change of the fluid, it may have relatively high heat dissipation performance.

[0101] According to one embodiment, the first heat spreading member (310) may include a conductive plate formed of a thermally conductive material. The conductive plate may be thin, flexible, and have high thermal conductivity. For example, the first heat spreading member (310) may include, but is not limited to, a copper sheet, a graphite sheet, or a silicon sheet. For example, when heat from one or more electronic components is transferred to the conductive plate, the heat may be conducted along the conductive plate having high thermal conductivity. As the heat is conducted along the longitudinal direction of the conductive plate (e.g., the first direction), the heat may be widely spread rather than locally concentrated. Since the first heat spreading member (310) spreads heat using thermal conductivity, it may have relatively lower heat dissipation performance compared to the second heat spreading member (320).

[0102] When both the first heat diffusion member (310) and the second heat diffusion member (320) are provided as vapor chambers or heat pipes to have substantially equivalent or similar heat dissipation performance, the heat dissipation performance of the electronic device (101) may be improved, but the space of the electronic device (101) for arranging the heat diffusion members (310, 320) may be insufficient. According to one embodiment, in order to provide portability of the electronic device (101), since the size and thickness of the electronic device (101) are limited, in order to provide an efficient arrangement structure, the first heat diffusion member (310) and the second heat diffusion member (320) may be provided as heat dissipation members of different shapes.

[0103] According to one embodiment, the first heat spreading member (310) and the second heat spreading member (320) may cover different regions. For example, the second surface (243b) of the bracket (243) may be divided into a first region (341) that overlaps with a printed circuit board (251) supported by the second surface (243b) of the bracket (243), and a second region (342) that is different from the first region (341). The second region (342) may be referred to as a region that does not overlap with the printed circuit board (251). The first region (341) of the second surface (243b) may overlap with the printed circuit board (251) when the second surface (243b) of the bracket (243) is viewed from above (e.g., when the second surface (243b) is viewed in the -z direction). The second area (342) of the second surface (243b) is a different area from the first area (341), and may not overlap the printed circuit board (251) when the second surface (243b) of the bracket (243) is viewed from above.

[0104] According to one embodiment, the first heat diffusion member (310) may be positioned within the first region (341) of the second surface (243b) of the bracket (243) when viewed from above. According to one embodiment, the second heat diffusion member (320) may be positioned within the first region (341) and the second region (342) when viewed from above the second surface (243b) of the bracket (243).

[0105] For example, a first direction in which the first heat diffusion member (310) extends may be substantially parallel to the x-axis of FIG. 4. For example, a second direction in which the second heat diffusion member (320) extends may be substantially parallel to the y-axis of FIGS. 4 and 5. The first heat diffusion member (310) having relatively low heat dissipation performance may be arranged within the first region (341) among the first region (341) and the second region (342). The second heat diffusion member (310) having relatively high heat dissipation performance may be arranged across both the first region (341) and the second region (342). Since the second heat diffusion member (320) is positioned within the first region (341) and the second region (342), and the first heat diffusion member (310) is positioned within the first region (341), the portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect can be positioned within the first region (341).

[0106] Referring to FIG. 5, the bracket (243) may include openings. The openings may provide a path for heat from one or more electronic components (e.g., one or more electronic components (280) of FIG. 6) to be transferred to the heat spreading members (310, 320). The openings may face one or more electronic components (280). In one embodiment, the openings may include, but are not limited to, a first opening (351), a second opening (352), and / or a third opening (353). For example, a space in which the second heat spreading member (320) is disposed may be formed by forming a thickness of a portion of the bracket (243) thinner than another thickness of the bracket (243) without penetrating the bracket (243). A portion of the second heat diffusion member (320) may be placed on the above-mentioned portion of the bracket (243) having a relatively thin thickness, and in this case, the opening (353) may be replaced with the above-mentioned portion.

[0107] According to one embodiment, the first opening (351) and the second opening (352) can be disposed within the first region (341). The second opening (352) can be spaced apart from the first opening (351) in a first direction in which the first heat spreading member (310) extends. For example, the second opening (352) can be spaced apart from the first opening (351) in the -x direction. For example, the first heat spreading member (310) can be disposed to cover the first opening (351) and the second opening (352). Portions of the first heat spreading member (310) that overlap the first opening (351) and the second opening (352) (e.g., the first bending portion (311) and the second bending portion (312) of FIG. 6) can be at least partially bent so as to be inserted into the first opening (351) and the second opening (352).

[0108] In one embodiment, the third opening (353) can extend in a second direction in which the second heat spreading member (320) extends within the second region (342). For example, the third opening (353) can be aligned with the second opening (352). For example, the third opening (353) can be spaced apart from the second opening (352) in the second direction. For example, the third opening (353) can be spaced apart from the second opening (352) in the -y direction. The second heat spreading member (320) extending in the second direction can be arranged to cover the second opening (352) and the third opening (353) that are spaced apart from each other.

[0109] According to one embodiment, the second heat spreading member (320) may intersect the first heat spreading member (310) above (e.g., in the +z direction) a portion of the first heat spreading member (310) inserted into the second opening (352) (e.g., the second bending portion (312) of FIG. 6). The portion (330) where the first heat spreading member (310) and the second heat spreading member (320) intersect may overlap the second opening (352).

[0110] According to one embodiment, since the electronic device (101) includes a first heat diffusion member (310) and a second heat diffusion member (320), the internal space of the electronic device (101) may be narrow. A battery (e.g., battery (270) of FIG. 3) may be placed on the bracket (243) and supported by the bracket (243). If the first heat diffusion member (310) and the second heat diffusion member (320) do not intersect but are arranged parallel or spaced apart from each other, the area of ​​the bracket (243) for supporting the battery may be reduced due to the space occupied by the first heat diffusion member (310). According to one embodiment, since the first heat diffusion member (310) and the second heat diffusion member (320) are arranged to intersect, the area of ​​the bracket (243) for supporting the battery may be secured.

[0111] FIG. 6 is a part of a cross-sectional view taken along line A-A' of the electronic device of FIG. 4.

[0112] Referring to FIG. 6, one or more electronic components (280) may be arranged on a printed circuit board (251). According to one embodiment, the one or more electronic components (280) may include a first electronic component (281) and a second electronic component (282) spaced apart from the first electronic component (281). For example, the first electronic component (281) may include a main processor (e.g., the main processor (121) of FIG. 1). For example, the second electronic component (282) may include a charger integrated circuit (640). However, the first electronic component (281) and the second electronic component (282) are not limited to the main processor (120) or the charger integrated circuit (640), respectively. One or more electronic components (280) may be arranged on one side (251a) of a printed circuit board (251) facing in a direction (e.g., +z direction) toward the front side of the electronic device (101). For example, a display (201) may form the front side of the electronic device (101).

[0113] The main processor (121) may include a processing circuit. The main processor (121) may be configured to control the operation of the electronic device (101). Any function or operation of the electronic device (101) may be processed by one processor or a combination of processors. One processor or a combination of processors is a circuit that performs processing, and may include an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (e.g., a GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless-fidelity (Wi-Fi) chip, and Bluetooth. TMIt may include a chip, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor (410) controller, a touch controller, a finger-print sensor controller, a display drive integrated circuit (DDI), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, or a similar circuit.

[0114] An electronic device (101) according to one embodiment may include a shield can (610) and / or a thermal interface material (TIM) (620). The shield can (610) may be disposed on one surface (251a) of a printed circuit board (251). The shield can (610) may cover one or more electronic components (280) disposed on the printed circuit board (251) to reduce the influence of electromagnetic waves emitted from the electronic components on other electronic components, and / or to reduce the influence of electromagnetic waves emitted from other electronic components on one or more electronic components (280). Since the one or more electronic components (280) are covered by the shield can (610), interference by electromagnetic waves may be reduced.

[0115] The thermally conductive material (620) may include a polymer composite material, a thermally conductive filler, and / or a dispersant. The thermally conductive filler may be referred to as a heat dissipating particle. For example, the thermally conductive filler may include, but is not limited to, at least one of aluminum oxide (Al2O3), aluminum nitride (AlN), magnesium oxide (MgO), or boron nitride (BN). For example, the thermally conductive material (620) may be disposed between one or more electronic components (280) and the shield can (610) to transfer heat generated from the one or more electronic components (280) to the outside of the shield can (610). The electronic device (101) may include a conductive sheet (630) disposed between the shield can (610) and the first surface (243a) of the bracket (243). Heat from one or more electronic components (280) can be conducted to heat spreading members (310, 320) through a heat transfer material (620), a shield can (610), and / or a conductive sheet (630). For example, the conductive sheet (630) can be a shielding sheet for shielding electromagnetic waves emitted from one or more electronic components (280).

[0116] For example, the main processor (121) may be an electronic component for controlling the operation of the electronic device (101) and processing data. For example, the main processor (121) may be a single chip including control units such as a CPU, a GPU, an NPU, and / or a memory controller. Since the main processor (121) performs many operations for the operation of the electronic device (101), it may emit relatively much heat. In order to quickly dissipate heat from the main processor (121), the shield can (610) may include an opening (e.g., the opening (611) of FIG. 8) aligned with the main processor (121). A heat transfer material (620) disposed on the main processor (121) may contact the conductive sheet (630) through the opening.

[0117] According to one embodiment, the first heat diffusion member (310) and the second heat diffusion member (320) may be arranged to intersect each other. For example, at a portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect, the second heat diffusion member (320) may be positioned above (e.g., in the +z direction) the first heat diffusion member (310). For example, the display (201) may be arranged above (e.g., in the +z direction) the first heat diffusion member (310) and the second heat diffusion member (320). For example, the portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect may at least partially overlap the first electronic component (281). For example, when the second surface (243b) of the bracket (243) is viewed from above (e.g., when the second surface (243b) is viewed in the -z direction), the intersecting portion (330) of the first heat diffusion member (310) and the second heat diffusion member (320) may at least partially overlap the first electronic component (281). For example, when the first electronic component (281) includes the main processor (121), the intersecting portion (330) and the main processor (121) may overlap each other so that heat from the main processor (121) can be quickly diffused since the main processor (121) emits relatively much heat. Since heat from the main processor (121) can be diffused through the first heat diffusion member (310) and the second heat diffusion member (320), damage and malfunction of the main processor (121) due to overheating can be reduced.

[0118] According to one embodiment, an adhesive member may be disposed at a portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect each other. For example, the adhesive member may be disposed between the first heat diffusion member (310) and the second heat diffusion member (320). The adhesive member may firmly adhere the first heat diffusion member (310) and the second heat diffusion member (320). According to one embodiment, the adhesive member may include a conductive tape formed of a material having high thermal conductivity. Through the adhesive member disposed at the portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect each other, heat conduction between the first heat diffusion member (310) and the second heat diffusion member (320) may be improved, thereby improving the heat dissipation effect.

[0119] According to one embodiment, the first heat diffusion member (310) and the second heat diffusion member (320), which are arranged to intersect each other, may extend in different directions. As described above, the first heat diffusion member (310) may extend in a first direction, and the second heat diffusion member (320) may extend in a second direction different from the first direction. The second direction may be substantially perpendicular to the first direction. For example, the first direction may be substantially parallel to the x-axis of FIG. 6, and the second direction may be substantially parallel to the y-axis of FIG. 6, but is not limited thereto.

[0120] For example, the charger integrated circuit (640) may be configured to perform operations related to charging a battery of the electronic device (101) (e.g., the battery (270) of FIG. 3). The charger integrated circuit (640) may be configured to monitor voltage, current, or temperature of the battery and control charging of the battery based on the monitoring results. The charger integrated circuit (640) may be configured to release heat when performing operations related to charging the battery.

[0121] According to one embodiment, the second electronic component (282) may be spaced apart from the first electronic component (281) on one side (251a) of the printed circuit board (251). For example, the second electronic component (282) may be spaced apart from the first electronic component (281) in a first direction. As the second electronic component (282) is spaced apart from the first electronic component (281) in the first direction, the second electronic component (282) may not overlap the second heat spreading member (320) extending in the second direction. For example, if the first electronic component (281) includes the main processor (121) and the second electronic component (282) includes the charging integrated circuit (640), the portion (330) where the first heat spreading member (310) and the second heat spreading member (320) intersect overlaps the main processor (121), the second heat spreading member (320) extends in the second direction, and the charging integrated circuit (640) is spaced apart from the main processor (121) in the second direction, so the second heat spreading member (320) may not overlap the charging integrated circuit (640).

[0122] When the electronic device (101) includes only the second heat spreading member (320), the heat from the second electronic component (282) (e.g., the charging integrated circuit (640)) may not be quickly spread through the second heat spreading member (320) because the second electronic component (282) (e.g., the charging integrated circuit (640)) does not overlap the second heat spreading member (320).

[0123] According to one embodiment, the first heat spreading member (310) can be at least partially overlapped with the second electronic component (282). For example, when the second surface (243b) of the bracket (243) is viewed from above (e.g., when the second surface (243b) is viewed in the -z direction), the second electronic component (282) can be at least partially overlapped with the first heat spreading member (310) among the first heat spreading member (310) and the second heat spreading member (320). For example, when the second electronic component (282) includes a charger integrated circuit (640), heat from the charger integrated circuit (640) can be transferred to the first heat spreading member (310) and spread by being conducted along the first heat spreading member (310). Since heat from the charging integrated circuit (640) can be spread through the first heat spreading member (310), damage and malfunction of the charging integrated circuit (640) due to overheating can be reduced.

[0124] In one embodiment, the bracket (243) may include a first opening (351) and a second opening (352) arranged in a first direction. For example, the first heat spreading member (310) may be positioned to cover the first opening (351) and the second opening (352). As described above, the first heat spreading member (310) may include a thin, flexible conductive plate. For example, a portion of the conductive plate may include portions that are at least partially bendable so as to be inserted into the first opening (351) and the second opening (352).

[0125] According to one embodiment, the first heat diffusion member (310) may include a first bending portion (311) and / or a second bending portion (312). The first bending portion (311) may be at least partially bent so as to be inserted into the first opening (351). The second bending portion (312) may be at least partially bent so as to be inserted into the second opening (352). If the first heat diffusion member (310) is not inserted into the first opening (351) and the second opening (352) and is flat overall, the thickness of the electronic device (101) may increase due to the second heat diffusion member (320) disposed above (e.g., in the +z direction) the first heat diffusion member (310). The increased thickness of the electronic device (101) may deteriorate the portability and aesthetics of the electronic device (101). As the first bending portion (311) and the second bending portion (312) of the first heat diffusion member (310) are inserted into the first opening (351) and the second opening (352), respectively, a space can be secured for placing the second heat diffusion member (320) placed on the first heat diffusion member (310).

[0126] According to one embodiment, the second heat spreading member (320) may intersect the first heat spreading member (310) above the second bending portion (312) of the first heat spreading member (310) (e.g., in the +z direction) that is disposed within the second opening (352). For example, the portion (330) where the first heat spreading member (310) and the second heat spreading member (320) intersect may overlap the second opening (352). Since, among the one or more electronic components (280), the first electronic component (281) that emits relatively more heat overlaps the intersecting portion (330), the second opening (352) may overlap the first electronic component (281). For example, when the first electronic component (281) includes the main processor (121), the second opening (352) may face the main processor (121). Since the second bending portion (312) can be inserted into the second opening (352), the distance between the intersecting portion (330) and the main processor (121) can be reduced by the second opening (352). As the distance between the intersecting portion (330) and the main processor (121) is reduced, heat from the main processor (121) can be quickly conducted to and diffused by the first heat spreading member (310) and the second heat spreading member (320). According to one embodiment, the heat dissipation effect of the main processor (121) can be improved by the second opening (352).

[0127] In one embodiment, the first opening (351) may overlap the second electronic component (282). For example, if the second electronic component (282) includes a charger integrated circuit (640), the first opening (351) may face the charger integrated circuit (640). Since a portion of the first heat spreading member (310) (e.g., the first bending portion (311)) is inserted into the first opening (351), a distance between the first heat spreading member (310) and the charger integrated circuit (640) may be reduced by the first opening (351). As the distance between the first bending portion (311) and the charger integrated circuit (640) is reduced, heat from the charger integrated circuit (640) may be quickly conducted to and diffused by the first heat spreading member (310). According to one embodiment, the heat dissipation effect of the charging integrated circuit (640) can be improved by the first opening (351).

[0128] Figure 7 is a cross-sectional view of an electronic device according to one embodiment.

[0129] Referring to FIG. 7, an electronic device (101) according to one embodiment may include a thermally conductive tape (710). According to one embodiment, the thermally conductive tape (710) may be placed on a shield can (610) so that heat from one or more electronic components (280) may be more quickly conducted from the shield can (610) to the bracket (243). The thermally conductive tape (710) may be referred to as a heat transfer material having adhesive properties.

[0130] In one embodiment, the thermally conductive tape (710) can be disposed within the first opening (351) between the shield can (610) and the first heat spreading member (310). Because the thermally conductive tape (710) is disposed within the first opening (351) that at least partially overlaps the second electronic component (282), the thermally conductive tape (710) can at least partially overlap the second electronic component (282). For example, when the second electronic component (282) includes a charger integrated circuit (640), heat generated from the charger integrated circuit (640) can be conducted to the shield can (610) through the heat transfer material (620) disposed on the charger integrated circuit (640) and to the first heat spreading member (310) through the thermally conductive tape (710) disposed on the shield can (610). The above heat can be diffused through the first heat diffusion member (310).

[0131] FIGS. 8, 9, and 10 illustrate electronic devices according to various embodiments.

[0132] Referring to FIG. 8, an electronic device (101) according to one embodiment may include a heat transfer material (810) in a semi-solid (e.g., gel) state having fluidity. For example, the heat transfer material (810) may be interposed between a conductive sheet (630) and a first heat diffusion member (310), and / or may be interposed between the first heat diffusion member (310) and the second heat diffusion member (320). The heat transfer material (810) may quickly diffuse heat by better transferring heat from one or more electronic components to the first heat diffusion member (310) and the second heat diffusion member (320). The heat dissipation sheet (820) may be disposed on the first heat diffusion member (310) (e.g., in the +z direction). For example, a heat transfer material (810) may be interposed between a heat dissipation sheet (820) and a second heat spreading member (320).

[0133] The shield can (610) may include an opening (611) aligned with a first electronic component (281) (e.g., the main processor (121) of FIG. 1). A heat transfer material (620) disposed on the first electronic component (281) may contact a conductive sheet (630) through the opening (611). For example, heat may be dissipated depending on the operation of the main processor (121) at least partially overlapping the second opening (352). The heat may be conducted to the conductive sheet (630) through the heat transfer material (620) disposed on the main processor (121). The heat can be conducted from the conductive sheet (630) to the second bend portion (312) of the first heat diffusion member (310) through the heat transfer material (810) interposed between the conductive sheet (630) and the first heat diffusion member (310) and can be spread along the first heat diffusion member (310). In the second opening (352), the second heat diffusion member (320) intersects the first heat diffusion member (310), so that a portion of the heat conducted to the second bend portion (312) of the first heat diffusion member (310) can be conducted to the second heat diffusion member (320) through the heat transfer material (810) interposed between the first heat diffusion member (310) and the second heat diffusion member (320) and can be spread along the second heat diffusion member (320). The heat transfer material (810) can improve the heat dissipation effect of the first heat diffusion member (310) and the second heat diffusion member (320) by quickly conducting heat from the main processor (121).

[0134] Referring to FIG. 9, a heat dissipation sheet (820) may be disposed on a first bending portion (311) of a first heat diffusion member (310). An electronic device (101) according to one embodiment may include a heat transfer material (910) interposed between the first bending portion (311) and the heat dissipation sheet (820). For example, the heat transfer material (910) may be in a liquid state. Since the first bending portion (311) is at least partially bent to be inserted into the first opening (351), a step may be formed due to a height difference between a flat portion of the first heat diffusion member (310) and the first bending portion (311). The heat transfer material (910) in a liquid state may fill the space between the first heat diffusion member (310) and the heat dissipation sheet (820) by filling the step due to the height difference.

[0135] For example, heat may be released according to the operation of a second electronic component (282) (e.g., a charger integrated circuit (640)) that at least partially overlaps the first opening (351). The heat may be conducted to the conductive sheet (630) through a heat transfer material (620) disposed on the charger integrated circuit (640). The heat may be conducted from the conductive sheet (630) to the first bending portion (311) of the first heat diffusion member (310) and may spread along the first heat diffusion member (310). Since a liquid heat transfer material (910) is disposed on the first bending portion (311), a portion of the heat conducted from the conductive sheet (630) to the first heat diffusion member (310) may be conducted to the heat dissipation sheet (820) through the liquid heat transfer material (910) and then spread along the heat dissipation sheet (820). The heat transfer material (910) can improve the heat dissipation effect by conducting heat from the charging integrated circuit (640) to the heat dissipation sheet (820).

[0136] Referring to FIG. 10, an electronic device (101) according to one embodiment may include a thermally conductive tape (1010) interposed between a conductive sheet (630) and a first heat diffusion member (310). The thermally conductive tape (1010) may be disposed within a first opening (351). For example, the thermally conductive tape (1010) may be referred to as a heat transfer material having adhesive strength. For example, the height of the thermally conductive tape (1010) may substantially correspond to the height of the first opening (351). The first heat diffusion member (310) disposed on the second surface (243b) of the bracket (243) may be disposed on the thermally conductive tape (1010) disposed within the first opening (351). Since the thermally conductive tape (1010) has a height substantially corresponding to the height of the first opening (351), the first heat spreading member (310) can be substantially flat without being at least partially bent within the first opening (351).

[0137] In one embodiment, the thermally conductive tape (1010) can be configured to transfer heat from a second electronic component (282) (e.g., a charger integrated circuit (640)) that at least partially overlaps the first opening (351) to the first heat spreading member (310). For example, heat may be dissipated depending on the operation of the charger integrated circuit (640). The heat may be conducted to the conductive sheet (630) through the thermally conductive material (620) disposed on the charger integrated circuit (640). The heat may be conducted from the conductive sheet (630) to the first heat spreading member (310) through the thermally conductive tape (1010) disposed within the first opening (351). The heat conducted to the first heat spreading member (310) may be spread along the first heat spreading member (310). When a portion of the first heat diffusion member (310) is not inserted into the first opening (351), the distance between the charging integrated circuit (640) and the first heat diffusion member (310) may be increased compared to the distance between the charging integrated circuit (640) and the first heat diffusion member (310) when the first bending portion (311) is formed. Even when the distance is increased, heat from the charging integrated circuit (640) can be quickly conducted to the first heat diffusion member (310) through the thermal conductive tape (1010). The thermal conductive tape (1010) can enhance the heat dissipation effect by conducting heat from the charging integrated circuit (640) to the heat dissipation sheet (820).

[0138] Fig. 11 is a graph showing the heat dissipation effect of an electronic device according to one embodiment.

[0139] The graph (1100) illustrated in FIG. 11 represents the results of measuring the temperature of an electronic device while charging a battery (e.g., battery (270) of FIG. 3). The x-axis of the graph (1100) represents time (unit: seconds), and the y-axis of the graph (1100) represents temperature (unit: degrees Celsius).

[0140] The first graph (1101) of FIG. 11 shows a temperature change of an electronic device over time while charging a battery of an electronic device according to a comparative example with 25 W of power. The electronic device according to the comparative example may be referred to as an electronic device that includes only a second heat spreading member (e.g., the second heat spreading member (320) of FIG. 4). The second heat spreading member may be overlapped with a main processor (e.g., the main processor (121) of FIG. 6), but may not be overlapped with a charging integrated circuit (e.g., the charging integrated circuit (640) of FIG. 6) that is separate from the main processor.

[0141] A second graph (1102) of FIG. 11 illustrates a temperature change of an electronic device (e.g., the electronic device (101) of FIG. 4) over time while charging a battery of the electronic device with 25 W of power according to an embodiment. The electronic device according to an embodiment may be referred to as an electronic device including a first heat spreading member (e.g., the first heat spreading member (310) of FIG. 4) and a second heat spreading member. The first heat spreading member may be arranged to intersect the second heat spreading member and overlap the charging integrated circuit. The thickness of the first heat spreading member is about 70 μm. Except that the electronic device according to an embodiment further includes the first heat spreading member, the remaining conditions may be the same.

[0142] Comparing the first graph (1101) and the second graph (1102), the temperature increase rate over time and the maximum temperature of the first graph (1101) are higher than the temperature increase rate over time and the maximum temperature of the first graph (1101). For example, after charging starts, the increase rate of the first graph (1101) is higher than the increase rate of the second graph (1102). For example, the maximum temperature of the first graph (1101) is about 37.9°C, and the maximum temperature of the second graph (1102) is about 37.5°C. Since heat from the charger integrated circuit can be diffused by the first heat diffusion member overlapping the charger integrated circuit (640), the temperature of the electronic device according to one embodiment can be lower than the temperature of the electronic device according to the comparative example. The maximum temperature can be reduced by about 0.4°C, and the temperature increase rate can be reduced by the first heat diffusion member. According to one embodiment, the heat dissipation effect can be improved by the first heat diffusion member and the second heat diffusion member intersecting each other.

[0143] FIGS. 12, 13, 14, 15, and 16 illustrate electronic devices according to various embodiments.

[0144] The bracket (243) can support a battery (e.g., battery (270) of FIG. 2). The bracket (243) can include a wall that divides a space in which the battery is placed and a space in which a printed circuit board (e.g., printed circuit board (251) of FIG. 2) is placed. In the embodiments described below, heat diffusion members (e.g., first heat diffusion member (310), fourth heat diffusion member (1410), and a plurality of fifth heat diffusion members (1420) of FIG. 14) placed in a first direction (e.g., x-axis direction) can be placed in the space in which the printed circuit board is placed or the space in which the battery is placed, respectively. The heat diffusion members placed in the first direction can be placed so as not to interfere with the wall, thereby providing rigidity to the bracket (243).

[0145] Referring to FIG. 12, an electronic device (101) according to one embodiment may include one or more third heat spreading members (1210). The one or more third heat spreading members (1210) may be substantially parallel to a first heat spreading member (310) and spaced apart from the first heat spreading member (310) in a second direction. The one or more third heat spreading members (1210) may intersect a second heat spreading member (320) extending in the second direction. The one or more third heat spreading members (1210) may be disposed within a first region (341).

[0146] According to one embodiment, one or more electronic components (280) disposed on the printed circuit board (251) may include a third electronic component (283) spaced apart from the first electronic component (281) and the second electronic component (282). For example, the third electronic component (283) may include a power amplifier module (PAM) (1220) including a power amplifier. The power amplifier may be configured to amplify the output of a radio frequency (RF) signal. The PAM (1220) may include a control circuit for controlling the power amplifier and a filter circuit for filtering the RF signal. For example, the PAM (1220) may be spaced apart from the main processor (121) and the charger integrated circuit (640) on the printed circuit board (251).

[0147] According to one embodiment, one or more third heat spreading members (1210) can be positioned on the second face (243b) of the bracket (243) to overlap the PAM (1220). For example, when looking at the second face (243b) of the bracket (243) from above (e.g., when looking at the second face (243b) in the -z direction), the one or more third heat spreading members (1210) can overlap the PAM (1220) that includes the power amplifier. Heat from the PAM (1220) can be spread through the one or more third heat spreading members (1210). The bracket (243) can include an opening that overlaps the PAM (1220) that includes the power amplifier, and the one or more third heat spreading members (1210) can be at least partially bent so as to be inserted into the opening that overlaps the PAM (1220).

[0148] Referring to FIG. 13, the first heat spreading member (310) may have a size that can cover both the second electronic component (282) (e.g., the charger integrated circuit (640)) and the third electronic component (283) (e.g., the PAM (1220) including a power amplifier). For example, the first heat spreading member (310) may overlap both the charger integrated circuit (640) and the PAM (1220). When the second surface (243b) of the bracket (243) is viewed from above (e.g., when the second surface (243b) is viewed in the -z direction), the first heat spreading member (310) may overlap both the charger integrated circuit (640) and the PAM (1220) including a power amplifier. Heat from the charging integrated circuit (640) and heat from the PAM (1220) can be spread through the first heat spreading member (310) having a large size.

[0149] Referring to FIG. 14, the one or more third heat spreading members (1210) may include a plurality of heat spreading members (1410, 1420). For example, the one or more third heat spreading members (1210) may include a fourth heat spreading member (1410) disposed on a first region (341) of the second surface (243b) and overlapping the third electronic component (283) (e.g., PAM (1220)), and a plurality of fifth heat spreading members (1420) disposed on a second region (342) of the second surface (243b) and spaced apart from each other. The fourth heat spreading member (1410) may be configured to spread heat from the PAM (1220)). The plurality of fifth heat spreading members (1420) may be configured to spread heat from electronic components overlapping the plurality of fifth heat spreading members (1420) in the second region (342), and / or to spread a portion of heat spread in the second direction through the second heat spreading member (320) in the first direction.

[0150] Referring to FIG. 15, the one or more third heat spreading members (1210) may include a plurality of heat spreading members (1410, 1510). For example, the one or more third heat spreading members (1210) may include a fourth heat spreading member (1410) disposed on a first region (341) of the second surface (243b) and overlapping a third electronic component (283) (e.g., PAM (1220)), and a sixth heat spreading member (1510) disposed on a second region (342) of the second surface (243b). The fourth heat spreading member (1410) may be configured to spread heat from a power amplifier. The sixth heat spreading member (1510) may be configured to spread heat from electronic components overlapping the sixth heat spreading member (1510) in the second region (342), and / or to spread a portion of heat spread in the second direction through the second heat spreading member (320) in the first direction. The size of the sixth heat spreading member (1510) may be larger than the size of the first heat spreading member (310) and the size of the fourth heat spreading member (1410).

[0151] In the embodiments described above, the second heat spreading member (320) is illustrated as having a relatively narrow width and overlapping a portion of the first electronic component (281) (e.g., the main processor (121)), but embodiments of the present disclosure are not limited thereto. Referring to FIG. 16, the second heat spreading member (320) may have a width wider than the width of the main processor (121). The second heat spreading member (320) may improve the heat dissipation effect of the electronic device (101) by covering a wider area.

[0152] Figure 17 is a cross-sectional view of an electronic device according to one embodiment.

[0153] In the embodiments described above, the second heat diffusion member (320) is described as being positioned above the first heat diffusion member (310) (e.g., in the +z direction) and intersecting with the first heat diffusion member (310), but embodiments of the present disclosure are not limited thereto.

[0154] Referring to FIG. 17, the second heat diffusion member (320) may be positioned below (e.g., in the -z direction) the first heat diffusion member (310). For example, at a portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect, the second heat diffusion member (320) may be positioned below the first heat diffusion member (310). When the first heat diffusion member (310) and the second heat diffusion member (320) intersect within the second opening (352), the second heat diffusion member (320) may be positioned below the first heat diffusion member (310) within the second opening (352), and may be positioned close to the main processor (121). The first bending portion (311) of the first heat spreading member (310) inserted into the first opening (351) can be overlapped with the charging integrated circuit (640).

[0155] Figure 18 is a cross-sectional view of an electronic device that does not include a second opening.

[0156] Referring to FIG. 18, the portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect may not be disposed within the opening. For example, the bracket (243) may not include the second opening (352). For example, the portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect may be disposed on the second surface (243b) of the bracket (243). For example, when the second heat diffusion member (320) is positioned below (e.g., in the -z direction) the first heat diffusion member (310), the second heat diffusion member (320) may be positioned on the second surface (243b) of the bracket (243), and the first heat diffusion member (310) may intersect the second heat diffusion member (320) above (e.g., in the +z direction) the second heat diffusion member (320). In this case, the first heat diffusion member (310) may be bent to correspond to the shape of the second heat diffusion member (320). As described above, the relative positional relationship between the first heat diffusion member (310) and the second heat diffusion member (320) may be changed. For example, a first heat diffusion member (310) may be placed on a second surface (243b) of a bracket (243), and a second heat diffusion member (320) may intersect the first heat diffusion member (310) above the first heat diffusion member (310).

[0157] An electronic device (101) is provided. The electronic device (101) may include a printed circuit board (251). The electronic device (101) may include one or more electronic components (280) arranged on the printed circuit board (251). The electronic device (101) may include a bracket (243) having a first surface (243a) supporting the printed circuit board (251) and a second surface (243b) opposite the first surface (243a). The electronic device (101) may include a first heat spreading member (310) extending in a first direction on the second surface (243b) of the bracket (243) and configured to spread heat from the one or more electronic components (280). The electronic device (101) may include a second heat spreading member (320) extending in a second direction on the second surface (243b) of the bracket (243), intersecting the first heat spreading member (310), and for spreading the heat from the one or more electronic components (280). The first heat spreading member (310) may be positioned within a first area (341) of the second surface (243b) of the bracket (243) that overlaps the printed circuit board (251) when the second surface (243b) of the bracket (243) is viewed from above. The second heat diffusion member (320) may be positioned within the first region (341) of the second surface (243b) and the second region (342) of the second surface (243b) that is different from the first region (341) of the second surface (243b) when the second surface (243b) of the bracket (243) is viewed from above. According to one embodiment of the present disclosure, the first heat diffusion member (310) and the second heat diffusion member (320) cover different regions, thereby allowing heat from various electronic components to be diffused.

[0158] According to one embodiment, the thermal conductivity of the second heat spreading member (320) may be higher than the thermal conductivity of the first heat spreading member (310).

[0159] According to one embodiment, the bracket (243) may include a first opening (351) disposed within the first region (341) and facing the one or more electronic components (280). The bracket (243) may include a second opening (352) disposed within the first region (341), spaced apart from the first opening (351) in the first direction, and facing the one or more electronic components (280). The first heat spreading member (310) may include a first bending portion (311) that is at least partially bent so as to be inserted into the first opening (351). The first heat spreading member (310) may include a second bending portion (312) that is at least partially bent so as to be inserted into the second opening (352). According to one embodiment of the present disclosure, the first heat spreading member (310) can be positioned close to one or more electronic components (280) by the first bending portion (311) and the second bending portion (312). The thickness increase of the electronic device (101) due to the intersection of the first heat spreading member (310) and the second heat spreading member (320) can be reduced.

[0160] According to one embodiment, the bracket (243) may include a third opening (353) disposed within the second region (342), spaced apart from the second opening (352) in the second direction, and extending in the second direction. At least a portion of the second heat spreading member (320) may cover the second opening (352) and the third opening (353).

[0161] According to one embodiment, the first heat spreading member (310) and the second heat spreading member (320) may overlap each other within the second opening (352).

[0162] According to one embodiment, the first heat spreading member (310) may include a conductive plate.

[0163] According to one embodiment, the bracket (243) may include a third opening (353) disposed within the second region (342) and extending in the second direction. At least a portion of the second heat spreading member (320) may cover the third opening (353).

[0164] According to one embodiment, the second heat spreading member (320) may include a vapor chamber or heat pipe containing an enclosure and a fluid contained within the enclosure.

[0165] According to one embodiment, the one or more electronic components (280) may include a first electronic component (281). The first electronic component (281) may at least partially overlap the first heat diffusion member (310) and the second heat diffusion member (320) when the second surface (243b) of the bracket (243) is viewed from above.

[0166] According to one embodiment, the one or more electronic components (280) may include a second electronic component (282) spaced apart from the first electronic component (281) in the first direction. The second electronic component (282) may at least partially overlap the first heat diffusion member (310) among the first heat diffusion member (310) and the second heat diffusion member (320) when the second surface (243b) of the bracket (243) is viewed from above.

[0167] According to one embodiment, the electronic device (101) may further include one or more third heat spreading members (1210) extending in the second direction on the second face (243b) of the bracket (243), intersecting the second heat spreading member (320), and spaced apart from the first heat spreading member (310). The one or more electronic components (280) may include a third electronic component (283) spaced apart from the first electronic component (281) and the second electronic component (282). The third electronic component (283) may at least partially overlap the one or more third heat spreading members (1210) when the second face (243b) of the bracket (243) is viewed from above.

[0168] According to one embodiment, the first electronic component (281) may include a main processor (121). The second electronic component (282) may include a charging integrated circuit (640). The third electronic component (283) may include a power amplifier module (PAM) (1220) including a power amplifier.

[0169] According to one embodiment, a portion of the second heat spreading member (310) may be positioned above the first heat spreading member (310).

[0170] According to one embodiment, the electronic device (101) may further include a shield can (610) disposed on the printed circuit board (251) and covering the one or more electronic components (280).

[0171] According to one embodiment, the electronic device (101) may further include a thermal interface material (TIM) (620) disposed between the one or more electronic components (280) and the shield can (610). Heat from the one or more electronic components (280) may be configured to be conducted to the first heat spreading member (310) and the second heat spreading member (320) through the heat spreading material (620), the shield can (610), and the bracket (243).

[0172] An electronic device (101) is provided. The electronic device (101) may include a printed circuit board (251). The electronic device (101) may include a main processor (121) disposed on the printed circuit board (251). The electronic device (101) may include a bracket (243) including a first surface (243a) supporting the printed circuit board (251) and a second surface (243b) opposite to the first surface (243a). The electronic device (101) may include a first heat spreader (310) extending in a first direction on the second surface (243b) of the bracket (243). The electronic device (101) may include a second heat diffusion member (320) extending in a second direction on the second surface (243b) of the bracket (243) and intersecting the first heat diffusion member (310). A portion (330) where the first heat diffusion member (310) and the second heat diffusion member (320) intersect may at least partially overlap the main processor (121) on the printed circuit board (251) when the second surface (243b) of the bracket (243) is viewed from above.

[0173] According to one embodiment, the thermal conductivity of the second heat spreading member (320) may be higher than the thermal conductivity of the first heat spreading member (310).

[0174] According to one embodiment, the bracket (243) may include a first opening (351) disposed within the first region (341). The bracket (243) may include a second opening (352) disposed within the first region (341) and spaced apart from the first opening (351) in the first direction. The first heat spreading member (310) may include a first bending portion (311) that is at least partially bent so as to be inserted into the first opening (351). The first heat spreading member (310) may include a second bending portion (312) that is at least partially bent so as to be inserted into the second opening (352).

[0175] According to one embodiment, the bracket (243) may include a third opening (353) disposed within the second region (342), spaced apart from the second opening (352) in the second direction, and extending in the second direction. At least a portion of the second heat diffusing member (320) may cover the second opening (352) and the third opening (353). The portion (330) where the first heat diffusing member (310) and the second heat diffusing member (320) intersect may overlap the second opening (351) when the second surface (243b) of the bracket (243) is viewed from above.

[0176] In one embodiment, the first heat spreading member (310) may include a conductive plate. The second heat spreading member (320) may include a vapor chamber or heat pipe including an enclosure and a fluid contained within the enclosure.

[0177] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0178] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0179] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0180] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0181] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or an intermediary server.

[0182] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, printed circuit board; One or more electronic components arranged on the printed circuit board; A bracket comprising a first surface supporting the printed circuit board and a second surface opposite to the first surface; On the second surface of the bracket, a first heat spreading member extending in a first direction and configured to spread heat from the one or more electronic components; and On the second surface of the bracket, a second heat spreading member extending in a second direction, intersecting the first heat spreading member, and for spreading the heat from the one or more electronic components, The above first heat diffusion member is, When the second side of the bracket is viewed from above, it is located within the first area of ​​the second side that overlaps the printed circuit board, The above second heat diffusion member is, When the second surface of the bracket is viewed from above, the first area of ​​the second surface and the second area of ​​the second surface are located in a different area from the first area of ​​the second surface. Electronic devices.

2. In paragraph 1, The thermal conductivity of the above second heat diffusion member is: Higher than the thermal conductivity of the first heat diffusion member, Electronic devices.

3. In paragraph 1 or 2, The above brackets are, a first opening disposed within the first region and facing the one or more electronic components, and a second opening disposed within the first region, spaced apart from the first opening in the first direction, and facing the one or more electronic components; The above first heat diffusion member is, a first bending portion that is at least partially bent to be inserted into the first opening, and comprising a second bending portion that is at least partially bent to be inserted into the second opening; Electronic devices.

4. In paragraph 3, The above brackets are, a third opening disposed within the second region, spaced apart from the second opening in the second direction, and extending in the second direction; At least a portion of the second heat diffusion member, Covering the second opening and the third opening, Electronic devices.

5. In paragraph 4, The first heat diffusion member and the second heat diffusion member are, Within the above second opening, overlapping each other, Electronic devices.

6. In any one of paragraphs 1 to 5, The above first heat diffusion member is, including a conductive plate, Electronic devices.

7. In any one of paragraphs 1 to 6, The above brackets are, a third opening disposed within the second region and extending in the second direction; At least a portion of the second heat diffusion member, Covering the third opening above, Electronic devices.

8. In any one of paragraphs 1 to 7, The above second heat diffusion member is, Comprising an enclosure and a vapor chamber or heat pipe containing a fluid contained within the enclosure; Electronic devices.

9. In any one of paragraphs 1 to 8, One or more of the above electronic components, Contains a first electronic component, The above first electronic component, When the second surface of the bracket is viewed from above, at least partially overlapping the first heat diffusion member and the second heat diffusion member, Electronic devices.

10. In paragraph 9, One or more of the above electronic components, including a second electronic component spaced apart from the first electronic component in the first direction; The above second electronic component, When the second surface of the bracket is viewed from above, the first heat diffusion member and the second heat diffusion member at least partially overlap the first heat diffusion member, Electronic devices.

11. In paragraph 10, On the second surface of the bracket, further comprising one or more third heat diffusion members extending in the second direction, intersecting the second heat diffusion member, and spaced apart from the first heat diffusion member; One or more of the above electronic components, A third electronic component is included, spaced apart from the first electronic component and the second electronic component, The above third electronic component is, When the second surface of the bracket is viewed from above, at least partially overlapping the one or more third heat diffusion members, Electronic devices.

12. In paragraph 11, The above first electronic component, Contains the main processor, The above second electronic component, Contains a charging integrated circuit, The above third electronic component is, Including a power amplifier module (PAM) including a power amplifier, Electronic devices.

13. In any one of paragraphs 1 to 12, A part of the above second heat diffusion member, located above the first heat diffusion member, Electronic devices.

14. In any one of paragraphs 1 to 13, Further comprising a shield can disposed on the printed circuit board and covering the one or more electronic components. Electronic devices.

15. In paragraph 14, Further comprising a thermal interface material (TIM) disposed between the one or more electronic components and the shield can, Heat from one or more of the above electronic components, configured to conduct heat to the first heat spreading member and the second heat spreading member through the heat transfer material, the shield can, and the bracket. Electronic devices.

Images