Substrate processing system and substrate processing method using same

Abstract

Disclosed are a substrate processing system and a substrate processing method using same. A substrate processing system according to an embodiment of the present invention may include: a loading section which is moved in a first direction by an elevating module and has a loading stacker capable of loading multiple carriers; a processing section in which multiple process chambers are continuously arranged in a second direction orthogonal to the first direction; and a transfer module for moving the position of the carrier along the loading section and the processing section.

Description

Substrate processing system and substrate processing method using the same

[0001] The present invention relates to process technology, and more specifically, to a substrate process system and a substrate process method using the same.

[0002]

[0003] Various processes occur on substrates. Among them, a deposition device is used to form a film on the substrate. Films can be formed by sequentially depositing different targets on the substrate. During the film formation process, the substrate is transported using a transport module, facing the target, to form a film on the substrate.

[0004] Conventional deposition devices are divided into a unidirectional deposition method in which deposition is performed while the substrate moves along a conveyor, and a bidirectional deposition method in which deposition is performed while one substrate is repeatedly moved in both directions.

[0005] The unidirectional deposition method restricts substrate movement to the direction of the conveyor belt's travel because substrates are continuously fed in. If the target film thickness exceeds the allowable deposition thickness for a single scan, the substrate must be reinserted into the deposition device after one scan for further deposition. This method has the disadvantage of delaying deposition times and reducing productivity.

[0006] Korean Patent Publication No. 10-2022-0048141 (publication date: 2022.04.19.) had a problem in that the production volume of substrates per hour was low because in order to form a film of a certain thickness or more using a bidirectional deposition method, one substrate had to monopolize the deposition device for a long time.

[0007]

[0008] The technical problem to be solved by the present invention relates to a substrate processing system and a substrate processing method using the same, which can increase substrate production while forming a film with a desired thickness by resolving the problems of a continuous substrate processing process.

[0009]

[0010] To solve the above technical problem, the present invention provides a substrate processing system.

[0011] A substrate processing system according to one embodiment of the present invention may include a loading section having a loading stacker that moves in a first direction by a lifting / lowering module and is capable of loading a plurality of carriers; a processing section having a plurality of processing chambers arranged in series in a second direction orthogonal to the first direction; and a transport module that moves the carriers in position along the loading section and the processing section.

[0012] According to one embodiment, the carrier is a transport unit in the first direction or the second direction, and in the process section, a film can be formed on a substrate mounted on the carrier transported inline by the transport module.

[0013] According to one embodiment, in the process section, a predetermined film can be formed on the substrate by physical vapor deposition using a plurality of filler material portions.

[0014] According to one embodiment, the process section may further include a carrier return module capable of returning the carrier from the unloading section provided in parallel to the loading section.

[0015] According to one embodiment, the method may include a thickness measurement module capable of measuring the thickness of the film formed on the substrate; and a controller capable of controlling the operation of the carrier return module when the measured value of the thickness measurement module is smaller than a reference thickness value.

[0016] According to one embodiment, the carrier may include a process carrier having a substrate mounting portion formed thereon, on which a substrate can be mounted; and a dummy carrier having no substrate mounting portion formed thereon.

[0017] According to one embodiment, in the first process unit, at least two process carriers are provided, and in the first process unit, the dummy carrier can be arranged spaced apart from other dummy carriers with the process carrier therebetween.

[0018] According to one embodiment, the substrate mounting portion supports an end of the substrate by making surface contact, and a portion of the upper and lower surfaces of the substrate may be exposed to the air environment without making surface contact.

[0019] According to one embodiment, the method further comprises a buffer section positioned between the loading section and the process section, wherein the buffer section comprises a buffer stacker capable of moving the carrier in the first direction (at a first height) by a lifting / lowering module and loading the carrier, which moves in the second direction.

[0020] In one embodiment, the buffer stacker can load the same number of carriers as the loading stacker.

[0021] In one embodiment, the transfer module can move the carrier located at the first height from the loading stacker to the buffer stacker.

[0022] According to one embodiment, the buffer stacker can move in the first direction and load the carrier in a first-in, last-out (FILO) manner.

[0023] In one embodiment, the buffer section may be provided with different pressure conditions from the loading section or the process section.

[0024] According to one embodiment, the apparatus may further include a passing section positioned between the buffer section and the process section and capable of accelerating or decelerating the moving speed of the carrier.

[0025] To solve the above technical problem, the present invention provides a substrate processing method.

[0026] A substrate processing method according to one embodiment of the present invention may include a loading section loading step of loading a carrier on which a substrate is mounted into a loading section and capable of being loaded in multiple layers onto a loading stacker; a buffer section loading step of loading the carrier from the loading section into a buffer section and capable of being loaded in multiple layers onto a buffer stacker; a passing section loading step of loading the carrier from the buffer section into a passing section; a process section loading step of loading the carrier from the passing section into a process section and capable of performing a film forming process on the substrate in a plurality of process chambers; a passing section loading step of loading the carrier from the process section into the passing section; a buffer section loading step of loading the carrier from the passing section into the buffer section and capable of being loaded in multiple layers onto a buffer stacker; and an unloading section loading step of loading the carrier from the buffer section into an unloading section and capable of being loaded in multiple layers onto an unloading stacker.

[0027]

[0028] According to an embodiment of the present invention, by including a loading stacker, a buffer stacker, and an elevation module, there is an advantage in that the production volume of substrates processed in one process unit is improved.

[0029] According to one embodiment of the present invention, by including a loading stacker, a buffer stacker, an elevating module, and a transport module, continuous film formation on a substrate is performed several times, thereby providing an advantage in that a film of a desired thickness can be formed on the substrate.

[0030] According to another embodiment of the present invention, by separating one dummy carrier from the other dummy carriers with two or more process carriers interposed therebetween and positioning them at the beginning and the end in one process unit, there is an advantage in that the film formation non-uniformity on the substrate due to initial process impurities and mixing ratio instability and acceleration / deceleration non-stability in the substrate process system, particularly in the process section, can be improved.

[0031] According to another embodiment of the present invention, in one process unit where constant pressure conditions are maintained, a carrier is bidirectionally transported by a bidirectional transport module in a process chamber provided with a pair of filler material portions at the upper and lower ends facing each other on both sides of a substrate, thereby repeatedly performing the process, thereby forming a film on each of one side and each side of the substrate to a desired thickness, thereby having the advantage of increasing manufacturing efficiency and production performance.

[0032] According to another embodiment of the present invention, by returning a carrier from which a substrate has been separated from a loading section to a loading section by a carrier return module, there is an advantage of increasing space efficiency and production efficiency due to multiple carrier uses.

[0033]

[0034] FIG. 1 is a schematic diagram of a substrate processing system according to one embodiment of the present invention.

[0035] FIG. 2 is a schematic diagram of a substrate processing system according to one embodiment of the present invention.

[0036] FIG. 3 is a schematic diagram showing the transport paths of a unidirectional transport module and a bidirectional transport module according to one embodiment of the present invention.

[0037] FIG. 4(a) is a drawing schematically showing a spatial separation state by different load locks according to one embodiment of the present invention, and FIG. 4(b) is a drawing schematically showing a process state between carriers of a first process unit, a second process unit, and a third process unit according to one embodiment of the present invention.

[0038] FIG. 5(a) is a schematic drawing of a process carrier according to one embodiment of the present invention, FIG. 5(b) is a schematic drawing of a dummy carrier according to one embodiment of the present invention, and FIG. 5(c) is a drawing showing a loading stacker on which a plurality of carriers are mounted according to one embodiment of the present invention.

[0039] FIGS. 6(a) to 6(f) are schematic drawings showing the process state between the loading section and the buffer section according to one embodiment of the present invention.

[0040] FIG. 7(a) to FIG. 7(f) are schematic drawings showing process states between a buffer section, a passing section, and a process section according to one embodiment of the present invention.

[0041] FIGS. 8(a) to 8(f) are schematic drawings showing the process state between the process section, the passing section, and the buffer section according to one embodiment of the present invention.

[0042] FIGS. 9(a) to 9(f) are schematic drawings showing process states between a buffer section and an unloading section according to one embodiment of the present invention.

[0043] FIG. 10(a) to FIG. 10(f) are schematic drawings showing a substrate removal process and a process state between an unloading section and a loading section according to one embodiment of the present invention.

[0044] Figure 11 is a flowchart showing a substrate processing method according to one embodiment of the present invention.

[0045] 10: Substrate Process System

[0046] 21: Loading Section 110: Loading Stacker

[0047] 120: Lifting / Lowing Module

[0048] 22, 26: Buffer section 210, 410: Buffer stacker

[0049] 220, 420: Lifting and lowering module

[0050] 23, 25: Passing Section

[0051] 24: Process Sections 310, 320, 330, 340: Process Chamber

[0052] 311, 321, 331, 341: Filler Material Department

[0053] 27: Unloading Section 510: Unloading Stacker

[0054] 520: Elevation module

[0055] 28, 29, 30, 31: Roadlock

[0056] 600: Transfer module 610: Unidirectional transfer module

[0057] 620: Bidirectional transfer module

[0058] 700: Carrier Return Module

[0059] 800: Thickness measurement module

[0060] 900: Controller

[0061] U1: First process unit U2: Second process unit

[0062] U3: Third process unit

[0063] C: Carrier C1: Process carrier

[0064] C11: Substrate mounting part C2: Dummy carrier

[0065] S: substrate

[0066] H1: First height

[0067]

[0068] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, the technical concept of the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed content is thorough and complete and to sufficiently convey the spirit of the present invention to those skilled in the art.

[0069] In this specification, when a component is referred to as being on another component, it means that it can be formed directly on the other component, or a third component may be interposed between them. In addition, in the drawings, shapes and sizes are exaggerated for the purpose of effectively explaining the technical contents.

[0070] Additionally, although terms such as first, second, and third have been used to describe various components in various embodiments of this specification, these components should not be limited by these terms. These terms are merely used to distinguish one component from another. Thus, what is referred to as a first component in one embodiment may be referred to as a second component in another embodiment. Each embodiment described and illustrated herein also includes its complementary embodiments. Furthermore, the term "and / or" has been used herein to mean including at least one of the components listed before and after.

[0071] In the specification, singular expressions include plural expressions unless the context clearly dictates otherwise. In addition, terms such as "comprise" or "have" are intended to specify the presence of a feature, number, step, component, or combination thereof described in the specification, and should not be construed as excluding the presence or addition of one or more other features, numbers, steps, components, or combinations thereof. In addition, the term "connection" is used in the present specification to mean both indirectly connecting multiple components and directly connecting them.

[0072] In addition, when describing the present invention below, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

[0073]

[0074] For convenience of explanation, the first direction refers to the Z-axis of the orthogonal coordinate system, the second direction refers to the X-axis of the orthogonal coordinate system, and the third direction refers to the Y-axis of the orthogonal coordinate system. In this case, the first, second, and third directions are orthogonal to each other.

[0075]

[0076] FIG. 1 is a schematic diagram of a substrate process system (10) according to one embodiment of the present invention, FIG. 2 is a schematic diagram of a substrate process system (10) according to one embodiment of the present invention, FIG. 3 is a schematic diagram showing a transport path of a unidirectional transport module (610) and a bidirectional transport module (620) according to one embodiment of the present invention, FIG. 4(a) is a schematic diagram showing a spatial separation state by different load locks (28, 29, 30, 31, 32, 33) according to one embodiment of the present invention, FIG. 4(b) is a schematic diagram showing a process state between carriers (C) of a first process unit (U1), a second process unit (U2), and a third process unit (U3) according to one embodiment of the present invention, FIG. 5(a) is a schematic diagram showing a process carrier (C1) according to one embodiment of the present invention, and FIG. 5(b) is a schematic diagram showing a dummy carrier (C2) according to one embodiment of the present invention, and FIG. 5(c) is a drawing showing a loading stacker (110) equipped with a plurality of carriers (C) according to one embodiment of the present invention, FIGS. 6(a) to 6(f) are drawings schematically showing a process sequence between a loading section (21) and a buffer section (22) according to one embodiment of the present invention, FIGS. 7(a) to 7(f) are drawings schematically showing a process sequence between a buffer section (22), a passing section (23), and a process section (24) according to one embodiment of the present invention, FIGS. 8(a) to 8(f) are drawings schematically showing a process sequence between a process section (24), a passing section (25), and a buffer section (26) according to one embodiment of the present invention, FIGS. 9(a) to 9(f) are drawings schematically showing a process sequence between a buffer section (26) and an unloading section (27) according to one embodiment of the present invention, and FIGS. 10(a) to 10(f) are drawings schematically showing a process sequence between a buffer section (26) and an unloading section (27) according to one embodiment of the present invention. This is a drawing schematically showing the process sequence between the unloading section (27) and the loading section (21).Figure 11 is a drawing schematically showing the sequence of each process of the substrate (S) removal process in the unloading section (27) according to one embodiment of the present invention.

[0077]

[0078] Hereinafter, the configuration and operational relationship of a substrate process system (10) according to one embodiment of the present invention will be examined with reference to FIGS. 1 to 10(f).

[0079]

[0080] The substrate process system (10) can form a film on a predetermined substrate by transporting it through a series of processes. The substrate process system (10) can be divided into a plurality of sections that are parallel to at least one direction, and each process can be performed continuously. Referring to FIGS. 1 and 2, the substrate process system (10) according to one embodiment may have a shape in the shape of the letter '-' in a plan view by arranging a plurality of sections parallel to one direction. The substrate process system (10) according to another embodiment may have a shape in the shape of the letter 'ㄷ' in a plan view by arranging most of the processes parallel to one direction, but some processes are arranged in a direction orthogonal to the one direction, but is not limited thereto.

[0081]

[0082] Referring to FIGS. 1 to 4(b), the substrate process system (10) includes a loading section (21), a process section (24), a transport module (600), and may further include a carrier return module (700), a thickness measurement module (800), a controller (900), buffer sections (22, 26), passing sections (23, 25), and load locks (28, 29, 30, 31, 32, 33).

[0083]

[0084] Referring again to FIGS. 1 and 2, the substrate processing system (10) according to one embodiment of the present invention can perform a substrate process through a series of sections from the time it is imported to the time it is exported. More specifically, the substrate processing system (10) can perform a film formation process of the substrate along a loading section (21), a buffer section (22), a passing section (23), a processing section (24), a passing section (25), a buffer section (26), and an unloading section (27).

[0085]

[0086] Referring to FIGS. 1 to 4(b), 6(a) to 6(f), and 10(a) to 10(f), the loading section (21) may be an area where multiple carriers (C) are sequentially loaded. The loading section (21) may include a loading stacker (110) and an elevating / lowering module (120).

[0087] The loading stacker (110) can load multiple carriers (C).

[0088] The lifting / lowering module (120) can move the loading stacker (110) in the first direction.

[0089] The carrier (C) loaded on the loading stacker (110) in the loading section (21) can be moved in the first direction and the second direction by the lifting / lowering module (120) and the transport module (600), respectively.

[0090]

[0091] Referring to FIGS. 5(a) to 5(c), the carrier (C) may be a transport unit in the first direction, the second direction, or even the third direction. Referring to FIGS. 5(a) and 5(b), the carrier (C) may include a process carrier (C1) and a dummy carrier (C2).

[0092] A substrate mounting portion (C11) may be formed on the process carrier (C1). A substrate (S) may be mounted on the substrate mounting portion (C11). The substrate mounting portion (C11) may support an end of the substrate (S) by making surface contact. The substrate mounting portion (C11) may expose a portion of the upper and lower surfaces of the substrate (S) to the process environment without making surface contact. The substrate mounting portion (C11) may expose the upper and lower surfaces, including the central region of the substrate (S), to the process environment so that a film may be formed on the upper and lower surfaces by supporting the side surfaces and some of the upper and lower surfaces of the substrate (S).

[0093] Referring again to FIG. 5(a), the process carrier (C1) may be formed with a plurality of substrate mounting portions (C11) to mount a plurality of substrates (S).

[0094]

[0095] Referring again to FIG. 5(b), the dummy carrier (C2) may not have a substrate mounting portion (C11) formed.

[0096]

[0097] According to one embodiment, as illustrated in FIGS. 4(a) and 4(b), 5(c), and 6(a) to 6(f), a plurality of carriers (C) may be provided in one process unit (U1, U2, or U3). The number of carriers (C) corresponding to one process unit may be mounted on the loading stacker (110).

[0098] In one process unit (U1, U2, or U3), at least two process carriers (C1) may be provided. In one process unit (U1, U2, or U3), a dummy carrier (C2) may be arranged spaced apart from other dummy carriers (C2) with the process carrier (C1) interposed therebetween.

[0099] The dummy carrier (C2) is positioned at the beginning and the end of one process unit (U1, U2, or U3) with two or more process carriers (C1) interposed therebetween, thereby improving the non-uniformity of film formation on the substrate (S) due to impurities at the beginning of the process, instability in the mixing ratio, and unstability in acceleration and deceleration.

[0100]

[0101] With one process unit (U1, U2, or U3), the vacuum state of the substrate process system (10) can be controlled. A plurality of carriers (C) can be processed as one process unit (U1, U2, or U3) from the time they are brought into the substrate process system (10) until they are taken out. Referring again to FIG. 5(c), a total of six carriers (C) are mounted on the loading stacker (110) according to one embodiment, and a total of six carriers (C) can be processed as one process unit (U1, U2, or U3) for each of the buffer section (22), the passing section (23), the process section (24), the passing section (25), the buffer section (26), and the unloading section (27) described below.

[0102] According to one embodiment, FIG. 4(b) shows a process state in which a plurality of carriers (C) constituting the first process unit (U1) are settled on the buffer stacker (210), but according to one embodiment, a plurality of carriers (C) moving along the bidirectional transport module (620) in FIGS. 8(a) to 8(f) may also be included in the first process unit (U1), or according to one embodiment, a plurality of carriers (C) moving along the unidirectional transport module (610) in FIGS. 9(a) to 9(f) may also be included in the first process unit (U1).

[0103]

[0104] Referring to FIGS. 1 to 4(b), 6(a) to 6(f), 7(a) to 7(f), and 8(a) to 8(f), the buffer section (22) may be located between the loading section (21) and the process section (24). The buffer section (22) may include a buffer stacker (210) and an elevating module (220).

[0105] The buffer stacker (210) can load multiple carriers (C). According to one embodiment, the buffer stacker (210) can load the same number of carriers (C) as the loading stacker (110).

[0106] The ascending / descending module (220) can move the buffer stacker (210) in the first direction.

[0107] The buffer stacker (210) is moved in a first direction by the lifting / lowering module (220), and the carrier (C) located at a first height (H1) in the first direction can be moved from the loading section (21) to the buffer section (22) by the transfer module (600) described later. More specifically, the carrier (C) located at the first height (H1) can be moved in a second direction by the transfer module (600) from the loading stacker (110) of the loading section (21) to the buffer stacker (210) of the buffer section (22).

[0108] According to one embodiment, the buffer stacker (410) can load the carrier (C) in a first-in, last-out (FILO) manner. Referring to FIGS. 4(a) to 5(f), the buffer stacker (410) is moved in the first direction by the lifting / lowering module (220), and the carrier (C) that is transferred from the loading section (21) and loaded most recently can be moved to the position before the carrier (C) that is transferred by the transfer module (600) and loaded first to the passing section (23).

[0109] The carrier (C) loaded on the buffer stacker (210) in the buffer section (22) can be moved in the first direction and the second direction by the lifting / lowering module (220) and the transport module (600), respectively.

[0110] The buffer section (22) can be provided with different pressure conditions from the loading section (21) or the process section (24).

[0111]

[0112] Referring to FIGS. 1 to 4(b), 7(a) to 7(f), and 8(a) to 8(f), the passing section (23) can be positioned between the buffer section (22) and the process section (24). In the passing section (23), the transport speed of the bidirectional transport module (620) can be adjusted. In the passing section (23), the transport speed of the bidirectional transport module (620) can be increased or decreased according to the process speed in the process section (24), thereby increasing or decreasing the transport speed of the carrier (C).

[0113]

[0114] Referring to FIGS. 1 to 4(b), 7(a) to 7(f), and 8(a) to 8(f), the process section (24) may include a plurality of process chambers. In the process section (24), a plurality of process chambers may be arranged sequentially in the second direction. Referring to FIG. 2, the process section (24) may arrange a first process chamber (310), a second process chamber (320), a third process chamber (330), and a fourth process chamber (340) sequentially. The number of process chambers may correspond to the number of process carriers (C1) mounted as one process unit (U1, U2, or U3).

[0115] Any one of the process chambers (310, 320, 330, 340) may include one filler material section (311, 321, 331, 341). A film may be formed on a substrate (S) mounted on a carrier (C) transported by a transport module (600) along the first to fourth process chambers (310, 320, 330, 340).

[0116] More specifically, in the process chamber (310, 320, 330, 340), a pair of filler material parts (311, 321, 331, 341) are provided at the upper and lower ends so as to face each other on both sides of the substrate (S), so that a film can be formed on one side and the other side of the substrate (S).

[0117] In the process section (24), a predetermined film can be formed on the substrate (S) by physical vapor deposition using a plurality of filler material sections (311, 321, 331, 341).

[0118] More specifically, in each process chamber (310, 320, 330, or 340) constituting the process section (24), a predetermined film can be formed by physical vapor deposition on the substrate (S) by a pair of filler material parts (311, 321, 331, or 341) arranged to face each other on both sides of the substrate (S).

[0119]

[0120] The passing section (25) may be located between the process section (24) and the buffer section (26). The passing section (25) transfers individual carriers (C) to the buffer section (26) and may accelerate or decelerate the transfer speed of the carriers (C).

[0121]

[0122] Referring to FIGS. 1 to 4(b), 6(a) to 6(f), 7(a) to 7(f), and 8(a) to 8(f), a buffer section (26) may be positioned between a process section (24) and an unloading section (27). The buffer section (26) may include a buffer stacker (410) and an elevating module (420).

[0123] The buffer stacker (410) can load a plurality of carriers (C). According to one embodiment, the buffer stacker (410) can load the same number of carriers (C) as the unloading stacker (510) described below.

[0124] The ascending / descending module (420) can move the buffer stacker (410) in the first direction.

[0125] By means of the lifting / lowering module (420), the buffer stacker (410) is moved in a first direction, and the carrier (C) located at a first height (H1) in the first direction can be moved from the buffer section (26) to the unloading section (27) by means of the transport module (600) described later. More specifically, the carrier (C) located at the first height (H1) can be moved in a second direction by means of the transport module (600) from the buffer stacker (410) of the buffer section (26) to the unloading stacker (510) of the unloading section (27).

[0126] The carrier (C) loaded on the buffer stacker (410) in the buffer section (26) can be moved in the first direction and the second direction by the lifting / lowering module (420) and the transport module (600), respectively.

[0127]

[0128] Referring to FIGS. 1 to 4(b), 9(a) to 9(f), and 10(a) to 10(f), an unloading section (27) may be provided parallel to the process section (24). The unloading section (27) may be an area from which a plurality of carriers (C) are sequentially unloaded. The unloading section (27) may include an unloading stacker (510) and an elevating module (520).

[0129] The unloading stacker (510) can load multiple carriers (C).

[0130] The lifting / lowering module (520) can move the unloading stacker (510) in the first direction.

[0131] The carrier (C) loaded on the unloading stacker (510) in the unloading section (27) can be moved in the first direction and the second direction by the lifting / lowering module (520) and the transport module (600), respectively.

[0132]

[0133] Referring to Fig. 4(a), the load lock (28) is interposed between the outside air and the loading section (21), and can connect or separate the outside air and the loading section (21). By opening the load lock (28) to the outside, i.e., opening the loading section (21) to the outside air, the carrier (C) can be brought into the loading section (21).

[0134]

[0135] Referring to FIGS. 4(a) and 4(b), 7(a) to 7(f), and 8(a) to 8(f), the load lock (29) is interposed between the loading section (21) and the buffer section (22), and can connect or separate the loading section (21) and the buffer section (22). The load lock (29) can separate the space between the loading section (21) and the buffer section (22) by shielding the connection between the loading section (21) and the buffer section (22). The load lock (29) can separate the space so that the loading section (21) and the buffer section (22) are provided with different pressure conditions.

[0136] According to one embodiment, the buffer section (22) spatially separated from the loading section (21) by the load lock (29) can be formed under a lower pressure condition than the loading section (21).

[0137] According to one embodiment, when space is separated by a load lock (29), the buffer section (22) is connected to the passing section (23) so that the substrate process of the first process unit can be performed, and at the same time, the carrier (C) to be processed in the second process unit can be provided in the loading section (21).

[0138]

[0139] Referring to FIGS. 4(a) and 4(b) and FIGS. 6(a) to 6(f), a load lock (30) is interposed between a buffer section (22) and a passing section (23), and can connect or separate the buffer section (22) and the passing section (23). The load lock (30) can separate the space between the buffer section (22) and the passing section (23) by shielding the connection between the buffer section (22) and the passing section (23). The load lock (30) can separate the space so that the buffer section (22) and the passing section (23) are provided with different pressure conditions.

[0140] Referring again to FIG. 4(a), the buffer section (22) can be formed with the same pressure conditions as either the loading section (21) or the passing section (23) by being selectively connected or separated from at least either the loading section (21) or the passing section (23) by the load lock (29) and the load lock (30).

[0141]

[0142] According to one embodiment, the buffer section (22) may be spatially separated from the passing section (23) by a load lock (30) and connected to the loading section (21). While the substrate (S) is being loaded into the loading section (21), the buffer section (21) may be formed under the same pressure condition as the loading section (21), and the passing section (23), which is spatially separated by the load lock (30), may be formed under a lower pressure condition than the buffer section (21).

[0143] The load lock (28) can connect or disconnect the loading section (21) from the outside. When the carrier (C) moves from the loading section (21) to the buffer section (22), the loading section (21) is shielded from the outside by the load lock (28), but the vibration can be adjusted so that the pressure difference between the loading section (21) and the buffer section (22) is reduced.

[0144]

[0145] Referring to FIGS. 4(a) and 4(b) and FIGS. 9(a) to 9(f), a load lock (31) is interposed between the passing section (25) and the buffer section (26), and can connect or separate the passing section (25) and the buffer section (26). The load lock (31) can separate the space between the passing section (25) and the buffer section (26) by shielding the connection between the passing section (25) and the buffer section (26). The load lock (31) can separate the space so that the passing section (25) and the buffer section (26) are provided with different pressure conditions.

[0146] Referring again to FIG. 4(a), the buffer section (26) can be formed with the same pressure conditions as either the passing section (25) or the unloading section (27) by being selectively connected or separated from at least either the passing section (25) or the unloading section (27) by the load lock (31) and the load lock (32).

[0147] According to one embodiment, the buffer section (26) may be spatially separated from the passing section (25) by a load lock (31) and connected to the unloading section (27). While the substrate (S) is transported to the unloading section (27), the buffer section (26) may be formed under the same pressure condition as the unloading section (27), and the passing section (25), which is spatially separated by the load lock (31), may be formed under a lower pressure condition than the buffer section (26).

[0148] The load lock (33) can connect or disconnect the unloading section (27) from the outside. When the carrier (C) moves from the buffer section (26) to the unloading section (27), the unloading section (27) is shielded from the outside by the load lock (33), but the pressure between the load lock (33) and the outside air can be adjusted to decrease.

[0149]

[0150] Referring to FIGS. 4(a) and 4(b), 7(a) to 7(f), and 8(a) to 8(f), a load lock (32) is interposed between the buffer section (26) and the unloading section (27), and can connect or separate the buffer section (26) and the unloading section (27). The load lock (32) can separate the space between the buffer section (26) and the unloading section (27) by shielding the connection between the buffer section (26) and the unloading section (27). The load lock (32) can separate the space so that the buffer section (26) and the unloading section (27) are provided with different pressure conditions.

[0151] According to one embodiment, the buffer section (26) spatially separated from the unloading section (27) by the load lock (32) can be formed under a lower pressure condition than the unloading section (27).

[0152] According to one embodiment, when space is separated by a load lock (32), the buffer section (26) is connected to the passing section (25) so that the substrate process of the first process unit can be performed, and at the same time, the carrier (C) to be processed in the third process unit can be provided in the unloading section (27).

[0153]

[0154] Referring to Fig. 4(a), the load lock (33) is interposed between the unloading section (27) and the outside air, and can connect or separate the unloading section (27) and the outside air. By opening the load lock (33), i.e., opening the unloading section (27) to the outside air, the carrier (C) can be taken out from the unloading section (27) to the outside.

[0155]

[0156] Referring to FIGS. 1 and 3, FIGS. 6(a) to 6(f), FIGS. 7(a) to 7(f), FIGS. 8(a) to 8(f), and FIGS. 9(a) to 9(f), the transport module (600) can transport the carrier (C) in one direction. According to one embodiment, the transport module (600) can irreversibly transport the carrier (C) in a positive direction in the second direction. The transport module (600) can transport the carrier (C) in single sheet units. The transport module (600) can positionally move the carrier (C) along the loading section (21) and the process section (24) in the second direction. The transport module (600) can transport the carrier (C) in an inline manner.

[0157] A transport module (600) according to one embodiment may include a shaft (not shown) and a roller (not shown). The shaft (not shown) may face a third direction orthogonal to the transport direction in the second direction. A plurality of shafts (not shown) may be arranged in parallel in the second direction. The roller (not shown) is supported on the shaft (not shown), rotates on the shaft (not shown), and may move the carrier (C).

[0158] As the shaft (not shown) and the roller (not shown) rotate by the driving force of the power source (not shown), the carrier (C) can be moved in the second direction.

[0159] The transport module (600) may include a unidirectional transport module (610) and a bidirectional transport module (620).

[0160] The unidirectional transport module (610) can unidirectionally move the carrier (C) from the loading section (21) to the buffer section (22).

[0161] The bidirectional transport module (620) can move the carrier (C) in both directions.

[0162] A bidirectional transport module (620) according to one embodiment can bidirectionally move a carrier (C) between sections of a buffer section (22), a passing section (23), a process section (24), a passing section (25), and a buffer section (26).

[0163] According to one embodiment, the transfer module (600) can move the carrier (C) located at the first height (H1) from the loading stacker (110) of the loading section (21) to the buffer stacker (210) of the buffer section (22). According to one embodiment, the transfer module (600) can move the carrier (C) located at the first height (H1) from the buffer stacker (210) of the buffer section (22) to the passing section (23). According to one embodiment, the transfer module (600) can move the carrier (C) located at the first height (H1) from the passing section (23) to the process section (24) and then to the passing section (25). According to one embodiment, the transfer module (600) can be moved from the buffer stacker (410) of the buffer section (26) to the unloading stacker (510) of the unloading section (27) to the buffer stacker (210).

[0164]

[0165] Referring to FIG. 1 and FIG. 10(a) to FIG. 10(f), the carrier return module (700) can provide a return path for the carrier (C) from the unloading section (27) to the loading section (21). The carrier return module (700) can separate the substrate (S) whose process on the substrate process system (10) has been completed from the carrier (C), and then transport and return the carrier (C), including the process carrier (C1) on which the substrate (S) is not installed, from the unloading section (27) to the loading section (21).

[0166]

[0167] Referring to FIG. 1, a thickness measurement module (800) according to one embodiment can measure the thickness of a film formed on a substrate (S). The thickness measurement module (800) may be an optical sensor or an ultrasonic sensor, but is not limited thereto.

[0168]

[0169] Referring to FIGS. 1 and 2 to 10(f), a controller (900) according to one embodiment can control to extend the process residence time of the substrate (S) on the buffer section (22, 26), the passing section (23, 25), and the process section (24) by comparing the measured value of the thickness measurement module (800) with a reference thickness value and, if the measured value is smaller than the reference thickness value, extending the process residence time of the substrate (S) on the buffer section (22, 26), the passing section (23, 25), and the process section (24).

[0170] According to one embodiment, the controller (900) can control the process residence time of the substrate (S) on the buffer section (22, 26), the passing section (23, 25), and the process section (24) to a preset arbitrary time.

[0171] The controller (900) can control the loading section (21), the unloading section (27), the buffer sections (22, 26), the passing sections (23, 25), and the process section (24) under different pressure conditions. According to one embodiment, the controller (900) can control the loading section (21) and the unloading section (27) under atmospheric pressure conditions. According to one embodiment, the controller (900) can control the buffer sections (22, 26) under medium vacuum pressure conditions. According to one embodiment, the controller (900) can control the pressure conditions of the buffer sections (22, 26) to be lower than the loading section (21) and higher than the process section (24). According to one embodiment, the controller (900) can control the passing sections (23, 25) and the process section (24) to be low vacuum pressure conditions.

[0172] The controller (900) can control the unit section-by-section transfer speed of the bidirectional transfer module (620) in the passing section (23).

[0173]

[0174] Figure 11 is a flowchart showing a substrate processing method according to one embodiment of the present invention.

[0175]

[0176] Hereinafter, a substrate processing method using a substrate processing system according to one embodiment of the present invention will be described in detail in a time series manner.

[0177]

[0178] Referring to FIG. 11, the substrate processing method may include a loading section loading step (S100), a buffer section loading step (S200), a passing section loading step (S300), a processing section loading step (S400), a passing section loading step (S500), a buffer section loading step (S600), and an unloading section loading step (S700).

[0179]

[0180] In the loading section bringing-in step (S100), carriers with mounted substrates can be brought into the loading section and loaded in multiple layers onto a loading stacker.

[0181] Buffer section import step: The material can be imported into the buffer section from the loading section and loaded in multiple layers using a buffer stacker.

[0182] In the passing section import step (S300), it can be imported from the buffer section to the passing section.

[0183] In the process section import step (S400), the substrate is imported from the passing section to the process section, and a film formation process can be performed on the substrate in multiple process chambers.

[0184] In the passing section import step (S500), it can be imported from the process section to the passing section.

[0185] In the buffer section loading step (S600), the material can be loaded from the passing section to the buffer section and loaded in multiple layers onto the buffer stacker.

[0186] In the unloading section loading step (S700), materials can be loaded from the buffer section to the unloading section and loaded in multiple layers onto the unloading stacker.

[0187] In the loading section re-introduction (S800), a carrier on which a film-formed substrate is placed or a carrier from which a substrate is separated can be brought from the unloading section to the loading section and loaded in multiple layers onto a loading stacker.

[0188]

[0189] While the present invention has been described in detail using preferred embodiments, the scope of the present invention is not limited to the specific embodiments and should be construed in accordance with the appended claims. Furthermore, those skilled in the art will appreciate that numerous modifications and variations are possible without departing from the scope of the present invention.

Claims

1. A loading section having a loading stacker that moves in the first direction by a lifting / lowering module and is capable of loading multiple carriers; A process section in which a plurality of process chambers are sequentially arranged in a second direction orthogonal to the first direction; and A substrate processing system comprising a transport module for positionally moving the carrier along the loading section and the processing section.

2. In paragraph 1, The carrier is a transport unit in the first direction or the second direction, In the above process section, A substrate processing system capable of forming a film on a substrate mounted on the carrier transported inline by the transport module.

3. In paragraph 2, In the above process section, A substrate process system capable of forming a predetermined film on the substrate by physical vapor deposition using a plurality of filler material sections.

4. In paragraph 2, A substrate processing system further comprising a carrier return module capable of returning the carrier to the loading section from an unloading section provided parallel to the process section.

5. In paragraph 4, A thickness measurement module capable of measuring the thickness of the film formed on the substrate; and A substrate processing system including a controller capable of controlling the operation of the carrier return module when the measured value of the thickness measurement module is less than the reference thickness value.

6. In paragraph 1, The above carrier, A process carrier having a substrate mounting portion formed on which a substrate can be mounted; and A substrate processing system comprising a dummy carrier in which the substrate mounting portion is not formed.

7. In paragraph 6, In the first process unit, at least two process carriers are provided, A substrate processing system, wherein in the first process unit, the dummy carrier can be positioned spaced apart from other dummy carriers with the process carrier in between.

8. In paragraph 6, A substrate processing system in which the substrate mounting portion supports an end of the substrate by making surface contact, and a portion of the upper and lower surfaces of the substrate are not in surface contact and are exposed to the air environment.

9. In paragraph 1, Further comprising a buffer section positioned between the loading section and the process section, In the above buffer section, A substrate processing system comprising a loadable buffer stacker, wherein the carrier, which moves in the second direction, is moved in the first direction (at a first height) by a lifting / lowering module.

10. In paragraph 9, The above buffer stacker, A substrate processing system capable of loading the same number of carriers as the above loading stacker.

11. In paragraph 9, The above transport module, A unidirectional transfer module for unidirectionally moving the carrier from the loading section to the buffer section; and A substrate processing system comprising a bidirectional transport module for bidirectionally moving the carrier.

12. In paragraph 9, The above buffer stacker, A substrate processing system capable of moving in the first direction and loading the carrier in a first-in, last-out (FILO) manner.

13. In paragraph 9, The above buffer section is, A substrate processing system capable of providing different pressure conditions from the above loading section or the above processing section.

14. In paragraph 9, A substrate processing system further comprising a passing section positioned between the buffer section and the processing section and capable of increasing or decreasing the moving speed of the carrier.

15. Loading section loading step where the carrier with the substrate mounted is brought into the loading section and can be loaded in multiple layers onto the loading stacker; A step of loading a buffer section into the buffer section in the above loading section and loading a buffer section capable of being stacked in multiple layers onto a buffer stacker; A passing section import step for importing from the above buffer section to the passing section; A process section introduction step in which a film forming process is performed on the substrate in a plurality of process chambers by introducing the substrate into the process section from the above-mentioned passing section; A passing section import step for importing from the above process section to the passing section; A step of loading a buffer section capable of being loaded in multiple layers onto a buffer stacker by loading it into a buffer section from the above-mentioned passing section; and A substrate processing method comprising an unloading section loading step in which the substrate is loaded into the unloading section from the above buffer section and loaded into an unloading stacker in multiple layers.

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