Antenna module and electronic device

Abstract

The present application provides an antenna module. The antenna module comprises a first antenna, a second antenna, a reflective substrate, and an isolation module; the first antenna is used for sending a wireless signal to the reflective substrate in a maximum radiation direction of the first antenna; the reflective substrate is used for reflecting the wireless signal to the second antenna in a maximum radiation direction of the second antenna; the second antenna is used for receiving the wireless signal reflected by the reflective substrate; and the isolation module is used for hermetically isolating the first antenna from the second antenna. The included angle between the maximum radiation direction of the first antenna and a first direction is the same as or different from the included angle between the maximum radiation direction of the second antenna and the first direction, and the first direction is perpendicular to the radiation surface of the first antenna and the radiation surface of the second antenna. The technical solution can expand the operating bandwidth of on-chip wireless communication antennas.

Description

Antenna module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411020950.0, filed on July 26, 2024, and entitled "Antenna module and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of antennas, in particular to an antenna module and an electronic device. BACKGROUND

[0003] With the development of indoor wireless communication, antennas have been developed to achieve better system performance. Compared with the traditional wired communication mode, the wireless communication mode can avoid the disadvantages such as high delay, high crosstalk, limited bandwidth and parasitic effect introduced by the transmission line.

[0004] On-chip wireless communication refers to the use of on-chip antennas or near-field coupling and other wireless interconnection methods to realize data exchange and wireless communication between different modules within or between chips. By integrating on-chip antennas in the chip, the signal transmission mode can be optimized from traditional wired transmission to wireless transmission within and between chips, thereby forming an on-chip network with flexible architecture and avoiding the limitations of wired interconnection layout.

[0005] However, how to improve the working bandwidth of the on-chip wireless communication antenna has become a problem to be solved at present. SUMMARY

[0006] The present application provides an antenna module, which can improve the working bandwidth of the on-chip wireless communication antenna.

[0007] In a first aspect, an antenna module is provided, comprising: a first antenna, a second antenna, and a reflective substrate, the first antenna being configured to transmit a wireless signal along a maximum radiation direction of the first antenna to the reflective substrate, the reflective substrate being configured to reflect the wireless signal along a maximum radiation direction of the second antenna to the second antenna, and the second antenna being configured to receive the wireless signal reflected by the reflective substrate, wherein an angle between the maximum radiation direction of the first antenna and a first direction and an angle between the maximum radiation direction of the second antenna and the first direction are the same or different, and the first direction is perpendicular to a radiation surface of the first antenna and the second antenna.

[0008] In the present application, the reflective substrate is arranged on a side away from the first antenna and the second antenna.

[0009] It should be understood that the reflective substrate can be a metal plate, or can also be a printed circuit board coated with a metal layer, or can also be a substrate coated with a metal material on the surface, and the present application does not limit this.

[0010] In the technical solution of the present application, the first antenna sends a wireless signal along a maximum radiation direction to the reflecting substrate, the reflecting substrate reflects the wireless signal along a maximum radiation direction of the second antenna to the second antenna, and the second antenna receives the wireless signal along its maximum radiation direction. The technical solution can achieve the required operating bandwidth of the system. Moreover, the reflecting substrate is used to reflect the wireless signal transmitted by the first antenna to the second antenna, without the need for direct transmission between the first antenna and the second antenna, thereby reducing transmission loss. In addition, the antenna module provided by the present application does not require a transmission cable and can be implemented using only one pair of antennas, thereby further reducing manufacturing costs.

[0011] In combination with the first aspect, in some implementations of the first aspect, the reflecting substrate includes any one of the following: a metal plate, a printed circuit board coated with a metal layer, and a substrate coated with a metal material on the surface. Based on the above technical solution, the operating bandwidth of the on-chip wireless communication antenna can be improved.

[0012] In combination with the first aspect, in some implementations of the first aspect, the isolation module is further configured to hermetically isolate the first antenna and the second antenna. Based on the above technical solution, the first antenna and the second antenna can be hermetically protected.

[0013] In combination with the first aspect, in some implementations of the first aspect, one end of the isolation module is located on the reflecting substrate side.

[0014] In combination with the first aspect, in some implementations of the first aspect, one end of the isolation module is fixed to the reflecting substrate.

[0015] In combination with the first aspect, in some implementations of the first aspect, one end of the isolation module is fixed to the reflecting substrate in at least one of the following ways: mechanically, by welding, or by adhesion.

[0016] In combination with the first aspect, in some implementations of the first aspect, one end of the isolation module is fixed to the reflecting substrate in at least one of the following ways: mechanically, by welding, or by adhesion.

[0017] In combination with the first aspect, in some implementations of the first aspect, the isolation module is made of a hermetically isolating material.

[0018] In combination with the first aspect, in some implementations of the first aspect, the isolation module is further configured to guide the reflected wireless signal to the second antenna. Based on the above technical solution, the signal transmission between the first antenna and the second antenna can be strengthened, and the reflection loss can be reduced.

[0019] With reference to the first aspect, in some implementations of the first aspect, the directing module is located on a side of the isolation module close to the second antenna, and the directing module is located on a side of the isolation module away from the second antenna and close to the reflecting substrate.

[0020] In the present application, the directing module can be at an angle with the isolation module.

[0021] With reference to the first aspect, in some implementations of the first aspect, an angle between a maximum radiation direction of the first antenna and the first direction and an angle between a maximum radiation direction of the second antenna and the first direction is in a range of [30°, 80°].

[0022] With reference to the first aspect, in some implementations of the first aspect, the reflecting substrate is inclined on a side away from the first antenna and the second antenna. Based on the above technical solution, the reflecting substrate can be parallel or inclined above the first antenna and the second antenna, and flexible transmission architecture can be achieved.

[0023] With reference to the first aspect, in some implementations of the first aspect, the first antenna and the second antenna are located on the same horizontal plane, or the first antenna and the second antenna are located on different horizontal planes.

[0024] With reference to the first aspect, in some implementations of the first aspect, the first antenna and / or the second antenna is an antenna with a substrate integrated waveguide (SIW) structure. Based on the above technical solution, the transmission path of the signal can be shortened, and the transmission loss can be reduced.

[0025] With reference to the first aspect, in some implementations of the first aspect, the first antenna and / or the second antenna further includes one or more parasitic antennas. Based on the above technical solution, direct transmission between the first antenna and the second antenna can be avoided, and the return loss can be reduced.

[0026] With reference to the first aspect, in some implementations of the first aspect, the first antenna and / or the second antenna further includes one or more monopole antennas. Based on the above technical solution, direct transmission between the first antenna and the second antenna can be avoided, and the return loss can be reduced.

[0027] The second aspect provides an electronic device including the antenna module according to the first aspect and any possible implementation thereof.

[0028] The specific description and beneficial effects of the second aspect can refer to the first aspect, and will not be repeated here.

[0029] In a third aspect, a communication method is provided, which is applied to an antenna module, the antenna module comprising: a first antenna and a second antenna, the first antenna and the second antenna being airtightly isolated; the first antenna sending a wireless signal to a reflecting substrate along a maximum radiation direction of the first antenna, the wireless signal being reflected to the second antenna along a maximum radiation direction of the second antenna, the second antenna receiving the reflected wireless signal, wherein the maximum radiation direction of the first antenna and the maximum radiation direction of the second antenna are the same or different from a first direction, the first direction being perpendicular to a radiation surface of the first antenna and the second antenna.

[0030] The specific description and beneficial effects of the third aspect can refer to the first aspect, which will not be repeated here.

[0031] In combination with the third aspect, in some implementations of the third aspect, the reflecting substrate comprises any one of: a metal plate, a printed circuit board coated with a metal layer, and a substrate coated with a metal material.

[0032] In combination with the third aspect, in some implementations of the third aspect, the first antenna and the second antenna are airtightly isolated by an isolation module.

[0033] In combination with the third aspect, in some implementations of the third aspect, one end of the isolation module is located on the side of the reflecting substrate.

[0034] In combination with the third aspect, in some implementations of the third aspect, one end of the isolation module is fixed to the reflecting substrate.

[0035] In combination with the third aspect, in some implementations of the third aspect, one end of the isolation module is fixed to the reflecting substrate in at least one of the following ways: mechanically, by welding, and by bonding.

[0036] In combination with the third aspect, in some implementations of the third aspect, one end of the isolation module is fixed to the reflecting substrate in at least one of the following ways: mechanically, by welding, and by bonding.

[0037] In combination with the third aspect, in some implementations of the third aspect, the isolation module is made of a material that is airtight.

[0038] In combination with the third aspect, in some implementations of the third aspect, the method further comprises: guiding the reflected wireless signal to the second antenna.

[0039] In combination with the third aspect, in some implementations of the third aspect, the reflected wireless signal is guided to the second antenna by a guiding module.

[0040] With reference to the third aspect, in some implementations of the third aspect, the directing module is located on a side of the isolating module close to the second antenna, and the directing module is located on a side of the isolating module away from the second antenna and close to the reflecting substrate.

[0041] With reference to the third aspect, in some implementations of the third aspect, an angle between a maximum radiation direction of the first antenna and the first direction and an angle between a maximum radiation direction of the second antenna and the first direction is in a range of [30°, 80°].

[0042] With reference to the third aspect, in some implementations of the third aspect, the reflecting substrate is located on a side away from the first antenna and the second antenna.

[0043] With reference to the third aspect, in some implementations of the third aspect, the first antenna and the second antenna are located on the same horizontal plane.

[0044] With reference to the third aspect, in some implementations of the third aspect, the first antenna and the second antenna are located on different horizontal planes.

[0045] With reference to the third aspect, in some implementations of the third aspect, the first antenna and / or the second antenna is an antenna with a SIW structure.

[0046] With reference to the third aspect, in some implementations of the third aspect, the first antenna and / or the second antenna further comprises one or more parasitic antennas.

[0047] With reference to the third aspect, in some implementations of the third aspect, the first antenna and / or the second antenna further comprises one or more monopole antennas. BRIEF DESCRIPTION OF DRAWINGS

[0048] FIG. 1 is a schematic diagram of an application scenario according to an embodiment of the present application.

[0049] FIG. 2 is a schematic structural diagram of an antenna module 200 according to an embodiment of the present application.

[0050] FIG. 3 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application.

[0051] FIG. 4 is a structural diagram of a first antenna and a second antenna according to an embodiment of the present application.

[0052] FIG. 5 is a three-dimensional radiation pattern diagram of the first antenna and the second antenna.

[0053] FIG. 6 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application.

[0054] FIG. 7 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application.

[0055] Fig. 8 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application.

[0056] Fig. 9 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application.

[0057] Fig. 10 is a port return loss curve obtained by simulation based on the antenna module 200 shown in Fig. 8.

[0058] Fig. 11 is a transmission curve obtained by simulation based on the antenna module 200 shown in Fig. 8.

[0059] Fig. 12 is a group delay curve obtained by simulation based on the antenna module 200 shown in Fig. 8.

[0060] Fig. 13 is a schematic flow chart of a communication method according to an embodiment of the present application.

[0061] Reference signs: 100-terminal device; 110-chip; 120-chip; 200-antenna module; 210-first antenna; 220-second antenna; 230-reflective substrate; 240-monopole antenna; 241-metal short-circuit wall; 250-parasitic antenna; 260-isolation module; 270-directivity module. DETAILED DESCRIPTION

[0062] The technical solutions in the present application will be described below with reference to the accompanying drawings.

[0063] In order to facilitate understanding of the embodiments of the present application, the following explanations are made.

[0064] First, in the textual explanations of the embodiments of the present application shown below or the terms in the accompanying drawings, “first”, “second”, and the like as well as various numerical designations are only used for differentiation for the convenience of description, and are not intended to limit the scope of the embodiments of the present application. For example, the first antenna and the second antenna are different antennas, and the first direction and the second direction are different directions.

[0065] Second, the terms “include” and “have” and any variations thereof in the embodiments of the present application shown below are intended to cover the inclusions without exclusivity, for example, a system, a product, or a device including a series of units does not have to be limited to only those clearly listed, but can include other units not clearly listed or inherent to such products or devices.

[0066] Third, in the embodiments of the present application, the words such as "exemplary" or "for example" are used to mean example, illustration, or description, and the embodiments or design solutions described as "exemplary" or "for example" should not be interpreted as being more preferred or having more advantages than other embodiments or design solutions. The words such as "exemplary" or "for example" are intended to present related concepts in a specific manner and facilitate understanding.

[0067] Fourth, the parallel, vertical, same (for example, the same angle, etc.) and the like mentioned in the embodiments of the present application are all for the current process level, and are not strictly defined in the mathematical sense. For example, there can be a deviation of a predetermined angle (for example, ±2°, ±5°, etc.) between the isolation module and the guide module perpendicular to each other.

[0068] Fifth, the present application relates to an antenna module 200 applied in an electronic device, and the electronic device can be an optical network terminal (ONT), a mobile terminal, customer premise equipment (CPE), an access point (AP), etc. The electronic device can be a network working in the form of a plurality of APs, such as an access controller (AC) + AP, a wireless mesh network (WMN), and a mobile room network, applied in fiber to the room (FTTR), power line communication (PLC), or the like. The antenna provided by the present application can be an antenna with a three-dimensional structure built in the electronic device, can be an on-chip antenna, and the antenna can be hung on the inner surface of the shell of the electronic device or a support in the shell, or the antenna can be fixedly connected to a circuit board in the electronic device.

[0069] Sixth, unless otherwise defined, all terms (including technical and scientific terms) used in the present application have the same meaning as commonly understood by those skilled in the art to which the present application belongs. It should also be understood that the terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0070] In order to facilitate understanding of the present application, the technical terms related to the present application are described in detail below.

[0071] 1. On-chip wireless communications (OWC): refers to the use of on-chip antennas or near-field coupling and other wireless interconnection methods to realize data exchange and wireless communication between chips or between different modules within a chip. The transmission distance is usually short, such as less than 1 cm, with the advantages of low loss, high transmission rate, and high integration.

[0072] 2. Substrate integrated waveguide (SIW): a microwave integration technology that uses thin sheet dielectric as a transmission structure instead of traditional cables or hollow waveguides. By adjusting the shape, size, and feed port position of the SIW-based antenna, the antenna radiation pattern can be controlled to make the signal skew towards a specific angle.

[0073] 3. Adhesive method: adhesive is a method of connecting the same or different materials firmly together by using the adhesive force generated on the surface of the solid. For example, there are roughly the following types of adhesive methods:

[0074] (1) Hot melt adhesive: refers to the use of heating to soften and bond specific types of plastics or other materials, such as hot melt glue guns.

[0075] (2) Solvent adhesive: refers to the use of solvents to form temporary or permanent chemical bonds between the surfaces of two parts, such as epoxy resin.

[0076] (3) Glue adhesive: refers to the use of various glues such as structural glue, instant glue, etc. to firmly connect the surfaces of two parts together, suitable for a variety of materials such as metal, plastic, and wood.

[0077] The application scenarios of on-chip wireless communications are very wide, such as in the field of internet of things (IoT), which can realize the interconnection of smart chips, smart devices, and wearable devices, greatly improve communication efficiency, and reduce wiring complexity. On-chip wireless communications are especially suitable for millimeter wave, terahertz, and other high-frequency short-range wireless transmission systems.

[0078] FIG. 1 is a schematic diagram of an application scenario provided by an embodiment of the present application. As shown in FIG. 1, inside a terminal device 100, there are a chip 110 and a chip 120, and high-speed short-range wireless communication between the chip 110 and the chip 120 needs to be implemented, and the system requires that the operating bandwidth of the antenna should be more than 40% (for example, D-band 110 GHz-170 GHz). However, the operating bandwidth of the existing on-chip antenna technology is low, and even the operating bandwidth of the new on-chip antenna using bump radiation is only 7%, which cannot meet the current system requirement of the operating bandwidth. Moreover, the existing on-chip antenna technology mostly adopts an end-fire or side-fire mode, and direct transmission between antennas is required, which has a large transmission loss.

[0079] Therefore, the present application aims to provide an antenna module 200, which can improve the operating bandwidth of the on-chip wireless communication antenna.

[0080] The embodiments of the present application will be described in detail below with reference to specific drawings.

[0081] FIG. 2 is a schematic structural diagram of an antenna module 200 provided by an embodiment of the present application. It should be noted that the antenna module 200 can be applied to the scenario shown in FIG. 1. As shown in FIG. 2, the antenna module 200 can specifically include a first antenna 210, a second antenna 220, and a reflective substrate 230, wherein the reflective substrate 230 is arranged on a side far away from the first antenna 210 and the second antenna 220.

[0082] With reference to FIGS. 1 and 2, taking the chip 110 as a chip for transmitting a signal and the chip 120 as a chip for receiving a signal as an example. The chip 110 generates a wireless signal and transmits the wireless signal to the first antenna 210. After receiving the wireless signal, the first antenna 210 transmits the wireless signal to the reflective substrate 230 along the maximum radiation direction (for example, direction 1 shown in FIG. 2) of the first antenna 210. After receiving the wireless signal, the reflective substrate 230 reflects the wireless signal to the second antenna 220 along the maximum radiation direction of the second antenna 220. The second antenna 220 receives the wireless signal reflected by the reflective substrate 230 along direction 2 shown in the figure, and transmits the wireless signal to the chip 120. After receiving the wireless signal, the chip 120 performs subsequent signal processing (such as filtering, down-conversion, analog-to-digital conversion, etc.), thereby completing the wireless signal transmission from the chip 110 to the chip 120.

[0083] It should be understood that the aforementioned reflection of the reflective substrate 230 of the wireless signal to the second antenna 220 along the maximum radiation direction of the second antenna 220 can be understood as the reflection of the reflective substrate 230 of the wireless signal to the second antenna 220 along the direction opposite to the maximum radiation direction of the second antenna 220, and the present application does not limit this.

[0084] Continuing to refer to FIG. 2, the first direction is perpendicular to the radiation surfaces of the first antenna 210 and the second antenna 220. In the present application, the angle (e.g., angle a in the figure) between the maximum radiation direction of the first antenna 210 and the first direction is in the range of [30°, 80°], and the angle (e.g., angle b in the figure) between the maximum radiation direction of the second antenna 220 and the first direction is also in the range of [30°, 80°]. It should be understood that the maximum radiation direction of the second antenna 220 (i.e., direction 3) is the direction opposite to direction 2 shown in FIG. 2, and will not be described hereinafter.

[0085] In one possible implementation, the angle between the maximum radiation direction of the first antenna 210 and the first direction and the angle between the maximum radiation direction of the second antenna 220 and the first direction can be the same. For example, the angle between the maximum radiation direction of the first antenna 210 and the first direction is 40°, and the angle between the maximum radiation direction of the second antenna 220 and the first direction is 40°.

[0086] In one possible implementation, the angle between the maximum radiation direction of the first antenna 210 and the first direction and the angle between the maximum radiation direction of the second antenna 220 and the first direction can also be different. For example, the angle between the maximum radiation direction of the first antenna 210 and the first direction is 40°, and the angle between the maximum radiation direction of the second antenna 220 and the first direction is 60°.

[0087] Optionally, in one possible implementation, the chip 110 and the chip 120 can be transceivers.

[0088] It should be noted that the aforementioned reflective substrate 230 can be a metal plate, or can be a printed circuit board coated with a metal ground layer, or can be a substrate coated with a metal material on the surface, and it should be understood that the present application does not limit this.

[0089] The metal plate can be understood as a flat plate made of pure metal, such as a copper flat plate, an aluminum flat plate, etc. Alternatively, the metal plate can also be understood as a flat plate made of composite metal, such as a flat plate made of brass, etc.

[0090] It should be understood that the aforementioned metal ground layer can also be referred to as a metal ground layer, a ground layer, a metal layer, etc., and the metal ground layer can be made of a conductive material. The conductive material can be any one of the following materials: copper, aluminum, gold, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate, and tin-plated copper, graphite powder impregnated cloth, graphite coated substrate, copper plated substrate, brass plated substrate, and aluminum plated substrate.

[0091] Those skilled in the art can understand that the above is only an example, and in the present application, the metal ground plane described above can also be made of other conductive materials.

[0092] It should also be understood that the substrate with the surface coated with the metal material can be understood as the substrate with the surface subjected to a metallization process. The metal material can adopt at least one of the following materials: copper, aluminum, stainless steel, brass and their alloys, copper foil, aluminum foil, gold foil, silver-plated copper, silver-plated copper foil, silver foil, and tin-plated copper, etc.

[0093] In the present application, the reflective substrate 230 is located on the side away from the first antenna 210 and the second antenna 220, which can be understood as the following two implementation manners:

[0094] For example, in a possible implementation manner, the reflective substrate 230 is located on the side away from the first antenna 210 and the second antenna 220 in parallel, that is, the plane where the reflective substrate 230 is located is parallel to the horizontal plane of the first antenna 210 and the second antenna 220. As shown in FIG. 2, the reflective substrate 230 is located above the first antenna 210 and the second antenna 220 in parallel.

[0095] For example, in another possible implementation manner, the reflective substrate 230 is located on the side away from the first antenna 210 and the second antenna 220 in an inclined manner, that is, the plane where the reflective substrate 230 is located is at a certain angle with the horizontal plane of the first antenna 210 and the second antenna 220. FIG. 3 is a schematic structural diagram of the antenna module 200 provided by another embodiment of the present application. As shown in FIG. 3, the reflective substrate 230 is located above the first antenna 210 and the second antenna 220 in an inclined manner.

[0096] It should be noted that in the present application, “located on” can be replaced by “disposed on”, for example, the reflective substrate 230 is disposed on the side away from the first antenna 210 and the second antenna 220 in parallel, or the reflective substrate 230 is disposed on the side away from the first antenna 210 and the second antenna 220 in an inclined manner. For the convenience of understanding, the following will not be described in detail.

[0097] In addition, in the present application, the first antenna 210 and the second antenna 220 can be located on the same horizontal plane, as shown in FIG. 2, or the first antenna 210 and the second antenna 220 can be located on different horizontal planes, as shown in FIG. 3.

[0098] In order to enable the first antenna 210 to send wireless signals along the maximum radiation direction, and enable the second antenna 220 to receive wireless signals along the maximum radiation direction, the first antenna 210 and the second antenna 220 can be implemented by using a packaging substrate process, wherein the first antenna 210 and the second antenna 220 are antennas with SIW structure. The related description of the SIW structure can refer to the prior art, which will not be described in detail here.

[0099] FIG. 4 is a structural diagram of the first antenna 210 or the second antenna 220 according to an embodiment of the present application. As shown in FIG. 4, the feeding of the first antenna 210 and the second antenna 220 can adopt a SIW structure. It should be noted that in the present application, the feeding of the first antenna 210 and the second antenna 220 can also adopt a CPW (coplanar waveguide) structure or a strip line structure, and it should be understood that the present application does not limit this.

[0100] Optionally, in a possible implementation, the first antenna 210 and the second antenna 220 can further include one or more monopole antennas 240. For example, as shown in FIG. 4, the end of the dielectric substrate integrated waveguide has an opening, a circular patch is loaded at the opening, and the substrate of the dielectric substrate integrated waveguide extends along the transmission direction for a certain length. It should be understood that the first part of the circular patch is the monopole antenna 240, and the monopole antenna 240 is used to enhance the forward transmission capability of the electromagnetic wave.

[0101] Optionally, a metal short-circuit wall 241 can also be arranged on the other side of the monopole antenna 240. The metal short-circuit wall 241 is used to strengthen the electromagnetic wave radiation along the maximum direction and reduce the back radiation.

[0102] Optionally, in a possible implementation, the first antenna 210 and the second antenna 220 can further include one or more parasitic antennas 250. As shown in FIG. 4, in order to improve the beam tilting characteristics of the wireless signals emitted by the first antenna 210 and the second antenna 220, one or more parasitic antennas 250 are additionally added, which can better realize the beam tilting emission and reception of the first antenna 210 and the second antenna 220.

[0103] FIG. 5 is a three-dimensional radiation pattern of the first antenna 210 and / or the second antenna 220. As can be seen from FIG. 5, the first antenna 210 and / or the second antenna 220 have a tilted beam radiation characteristic. It should be noted that by arranging a coupler between the SIW structures, the first antenna 210 and the second antenna 220 can also have a tilted beam radiation characteristic, and it should be understood that the present application does not limit the method of making the first antenna 210 and the second antenna 220 have a tilted beam radiation characteristic.

[0104] Optionally, in a possible implementation, as shown in FIG. 6, the antenna module 200 can further include an isolation module 260, which is used to realize the airtight protection of the first antenna 210 and the second antenna 220, or in other words, the isolation module 260 is used to airtightly isolate the first antenna 210 and the second antenna 220. Wherein, the isolation module 260 can also realize the airtight protection of the chip 110 and the chip 120.

[0105] The specific arrangement of the isolation module 260 can refer to FIG. 6 and FIG. 7, FIG. 6 is a schematic structural diagram of an antenna module 200 provided in another embodiment of the present application. As shown in FIG. 6, the isolation module 260 is located between the first antenna 210 and the second antenna 220, and one end of the isolation module 260 is fixed to the reflecting substrate 230. In the present application, one end of the isolation module 260 is fixed to the reflecting substrate 230, which can be understood as the following two cases:

[0106] One case: as shown in FIG. 6, one end of the isolation module 260 is combined with the reflecting substrate 230 close to one side of the first antenna 210 and / or the second antenna 220.

[0107] Another case: as shown in FIG. 7, one end of the isolation module 260 penetrates through and is fixed to the reflecting substrate 230.

[0108] In the present application, one end of the isolation module 260 can be fixed to the reflecting substrate 230 by at least one of the following ways: mechanical way, welding way, and bonding way. The mechanical way can include at least one of the following: threaded connection, wire connection, riveting, etc. The welding way can include at least one of the following: soldering, laser welding, ultrasonic welding, etc. The bonding way can include at least one of the following: hot melt bonding, solvent bonding, glue bonding, pressure sensitive bonding, etc. The specific description of the bonding way can refer to the foregoing, which will not be repeated here.

[0109] It should be understood that the isolation module 260 described in the foregoing is made of a medium substrate with good airtight isolation, such as polytetrafluoroethylene (PTFE), silicone, carbon-fiber reinforced plastics (CFRP), ethylene propylene diene monomer (EPDM) rubber, etc.

[0110] It should also be understood that the isolation module 260 described in the foregoing can also be referred to as an airtight isolation module 260, a sealed medium, etc., which is not limited in the present application.

[0111] It should be noted that the specific structure of the isolation module 260 needs to be determined according to the specific application scenario, and FIG. 7 is simplified as a cuboid block with a certain thickness for ease of example, and it should be understood that in the present application, the shape of the isolation module 260 can also be a medium block with a certain thickness in S shape, or can also be a medium block with a certain thickness in triangular shape, which is not limited in the present application.

[0112] FIG. 8 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application. As shown in FIG. 8, the antenna module 200 further comprises a directing module 270, which is located on the side of the isolation module 260 close to the second antenna 220, and is located on the side of the isolation module 260 away from the second antenna 220 and close to the reflecting substrate 230. It can be understood that the side of the directing module 270 away from the second antenna 220 and close to the reflecting substrate 230 means that the directing module 270 is located above the second antenna 220 and below the reflecting substrate 230. It should be understood that the isolation module 260 and the directing module 270 are included between the wireless transmission channels of the first antenna 210 and the second antenna 220, so that the air-tight protection of the first antenna 210 and the second antenna 220 can be achieved, and the transmission performance of the wireless signal can be improved.

[0113] In addition, the directing module 270 can be at an angle with the isolation module 260. For example, the extending direction of the isolation module 260 is a second direction, and the extending direction of the directing module 270 is a third direction. In the present application, the angle between the second direction and the third direction (for example, angle γ in FIG. 8) is in the range of [0°, 90°].

[0114] For example, when the angle between the second direction and the third direction is 90°, as shown in FIG. 8, the directing module 270 is perpendicular to the isolation module 260. In this case, in order to achieve the function of guiding the transmission of the wireless signal more optimally, the thickness, length and height of the directing module 270 away from the second antenna 220 have their optimal value ranges.

[0115] For example, as shown in FIG. 8, the thickness t of the directing module 270 is in the range of 0.1-0.3 mm, the length L is in the range of 0.4-1 mm, and the height H away from the receiving antenna is in the range of 0.1-0.5 mm. It should be understood that the above value ranges are only illustrative, and the present application is not limited thereto.

[0116] FIG. 9 is a schematic structural diagram of an antenna module 200 according to another embodiment of the present application. As shown in FIG. 9(a), for example, the angle between the second direction and the third direction is 0°, and the directing module 270 is parallel to the isolation module 260.

[0117] For example, as shown in FIG. 9(b), the angle between the second direction and the third direction is greater than 0° and less than 90°, and the directing module 270 is inclinedly arranged on the isolation module 260.

[0118] It should be noted that the guiding module 270 can be one or multiple. In the case of multiple guiding modules 270, the included angle between each guiding module 270 and the isolation module 260 can be the same or different. It should be understood that the present application does not limit this.

[0119] It should also be noted that in the present application, the isolation module 260 can be one or multiple, and the present application does not limit the number of isolation modules 260. In the case of multiple isolation modules 260, the multiple isolation modules 260 need to be closely connected to achieve air-tight isolation of the first antenna 210 and the second antenna 220.

[0120] The simulation results of the antenna module 200 shown in FIG. 8 will be described below in conjunction with FIGS. 10-12.

[0121] FIG. 10 is a port return loss curve obtained by simulation based on the antenna module 200 shown in FIG. 8. As can be seen from the simulation results of FIG. 10, the return loss of the antenna module 200 is better than -10 dB in the frequency range of 110 GHz-170 GHz.

[0122] FIG. 11 is a transmission curve obtained by simulation based on the antenna module 200 shown in FIG. 8. As can be seen from the simulation results of FIG. 11, the transmission amplitude of the antenna module 200 is greater than -10 dB in the range of 110 GHz-170 GHz.

[0123] FIG. 12 is a group delay curve obtained by simulation based on the antenna module 200 shown in FIG. 8. As can be seen from the simulation results of FIG. 12, the group delay jitter of the antenna module 200 is less than 10 ps in the range of 110 GHz-170 GHz.

[0124] In summary, FIGS. 10-12 show that the simulation results of the antenna module shown in FIG. 8 have a working bandwidth of more than 40%, achieving the required working bandwidth of the system. In the wireless signal transmission in the antenna module provided by the present application, there is no need for transmission between antennas, which can reduce transmission loss. In addition, the antenna module provided by the present application does not need a transmission cable and can be implemented with only one pair of antennas, which can further reduce manufacturing costs.

[0125] According to the antenna provided by the embodiments of the present application, the present application further provides an electronic device, which includes any one of the antennas of the present application. The electronic device can be a mobile phone terminal, a CPE, an AP, an ONT, and an FTTR device, etc.

[0126] The communication method provided by the embodiment of the present application is described in detail below with reference to FIG. 13. It should be noted that the communication method can be applicable to the application scenario shown in FIG. 1, or can be applicable to other application scenarios, and it should be understood that the present application does not limit this.

[0127] FIG. 13 is a schematic flowchart of a communication method 300 provided by the embodiment of the present application. As shown in FIG. 13, the method at least includes the following steps.

[0128] In S310, the first antenna transmits a wireless signal to the reflecting substrate along the maximum radiation direction of the first antenna, and correspondingly, the reflecting substrate receives the wireless signal.

[0129] In S320, the reflecting substrate transmits a wireless signal to the second antenna along the maximum radiation direction of the second antenna, and correspondingly, the second antenna receives the reflected wireless signal.

[0130] With reference to FIG. 1, taking the chip 110 as a chip for transmitting a signal and the chip 120 as a chip for receiving a signal as an example. The chip 110 transmits a wireless signal to the first antenna, and correspondingly, the first antenna receives the wireless signal and transmits the received wireless signal to the reflecting substrate along the maximum radiation direction of the first antenna. After receiving the wireless signal, the reflecting substrate transmits the wireless signal to the second antenna along the maximum radiation direction of the second antenna. After receiving the wireless signal reflected by the reflecting substrate, the second antenna transmits the wireless signal to the chip 120, so that the chip 120 performs subsequent signal processing.

[0131] In the present application, the included angle between the maximum radiation direction of the first antenna and the first direction is in the range of [30°, 80°], and the included angle between the maximum radiation direction of the second antenna and the first direction is also in the range of [30°, 80°]. With reference to FIG. 2, the first direction is the direction perpendicular to the radiation surface of the first antenna and the second antenna. For the included angle between the maximum radiation direction of the first antenna and the first direction and the included angle between the maximum radiation direction of the second antenna and the first direction, refer to the foregoing description, which is not repeated here.

[0132] Optionally, in a possible implementation, the chip 110 and the chip 120 can be transceivers.

[0133] It should be noted that the reflecting substrate described above can be a metal plate, or can be a printed circuit board coated with a metal layer, or can be a substrate coated with a metal material on the surface, and it should be understood that the present application does not limit this. For the description of the reflecting substrate, refer to the foregoing description, which is not repeated here.

[0134] Optionally, in a possible implementation, the reflecting substrate is parallel to the side away from the first antenna and the second antenna. As shown in FIG. 2, the reflecting substrate is parallel to the upper side of the first antenna and the second antenna.

[0135] Optionally, in another possible implementation manner, the reflection substrate is inclined at a side far away from the first antenna and the second antenna, as shown in FIG. 3, or the reflection substrate is inclined above the first antenna and the second antenna.

[0136] In the present application, the first antenna and the second antenna can be located in the same horizontal plane, as shown in FIG. 2, or the first antenna and the second antenna can be located in different horizontal planes, as shown in FIG. 3.

[0137] In order to enable the first antenna to send wireless signals along the maximum radiation direction, and enable the second antenna to receive wireless signals along the maximum radiation direction, the first antenna and the second antenna can be implemented by using a packaging substrate process, wherein the first antenna and the second antenna are antennas with SIW structures. The related description of the SIW structure can refer to the prior art, which is not described here in detail.

[0138] It should be noted that, in the present application, the feed of the first antenna 210 and the second antenna 220 can also adopt a CPW (coplanar waveguide) structure or a strip line structure, and it should be understood that the present application does not limit this.

[0139] Optionally, in a possible implementation manner, the first antenna and the second antenna can include one or more monopole antennas.

[0140] Optionally, in a possible implementation manner, the first antenna and the second antenna can also include one or more parasitic antennas.

[0141] The specific structure of the first antenna and the second antenna can refer to the description of FIG. 4, which is not described here in detail.

[0142] Optionally, in a possible implementation manner, the antenna module can further include an isolation module, which is used for air-tight protection of the first antenna and the second antenna, or in other words, the isolation module is used for air-tight isolation of the first antenna and the second antenna. The isolation module can also simultaneously realize air-tight protection of the chip 110 and the chip 120. The related description of the isolation module can refer to the description of FIG. 6, which is not described here in detail.

[0143] Optionally, in a possible implementation manner, the antenna module further includes a directing module to strengthen the transmission of wireless signals, and the directing module is used for guiding the reflected wireless signals to the second antenna. The related description of the directing module can refer to the description of FIG. 8 and FIG. 9, which is not described here in detail.

[0144] According to the technical scheme provided in the application, the working bandwidth of the antenna module can exceed 40%, and the working bandwidth required by the system is realized. In the wireless signal transmission in the antenna module provided in the application, transmission between antennas is not required, and the transmission loss can be reduced. In addition, the antenna module provided in the application does not require a transmission cable, and only one pair of antennas is required to realize, and the manufacturing cost can be further reduced.

[0145] Those skilled in the art can clearly understand that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical scheme. A person skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the application.

[0146] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

[0147] In several embodiments provided in the application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interface, device or unit, and can be electrical, mechanical or other forms.

[0148] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0149] In addition, each functional unit in each embodiment of the application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit.

[0150] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the parts that contribute to the prior art or parts of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0151] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An antenna module, characterized by Comprising: a first antenna, a second antenna, a reflecting substrate and an isolation module, the first antenna is configured to transmit wireless signals along a maximum radiation direction of the first antenna to the reflecting substrate, the reflecting substrate is configured to reflect the wireless signals along a maximum radiation direction of the second antenna to the second antenna, the second antenna is configured to receive the reflected wireless signals, and the isolation module is configured to air-tightly isolate the first antenna and the second antenna; wherein the angle between the maximum radiation direction of the first antenna and a first direction is the same as or different from the angle between the maximum radiation direction of the second antenna and the first direction, and the first direction is perpendicular to the radiation surface of the first antenna and the second antenna.

2. The antenna module of claim 1, wherein, One end of the isolation module is located on the reflecting substrate side.

3. The antenna module according to claim 1 or 2, characterized in that, One end of the isolation module is fixed to the reflecting substrate.

4. The antenna module according to any one of claims 1 to 3, wherein one end of the isolation module is fixed to the reflecting substrate; or one end of the isolation module is combined with the reflecting substrate near the side of the reflecting substrate close to the first antenna and / or the second antenna.

5. The antenna module of any one of claims 1 to 4, wherein, One end of the isolation module is fixed to the reflecting substrate in at least one of the following ways: mechanically, by welding, or by adhesion.

6. The antenna module of any one of claims 1 to 5, wherein, The isolation module is made of air-tight material.

7. The antenna module of any one of claims 1 to 6, wherein, Further comprising a directing module, the directing module is configured to direct the reflected wireless signals to the second antenna.

8. The antenna module of claim 7, wherein, The directing module is located on the side of the isolation module close to the second antenna, and the directing module is located on the side of the isolation module away from the second antenna and close to the reflecting substrate.

9. The antenna module of any one of claims 1 to 8, wherein, The angle between the maximum radiation direction of the first antenna and the first direction and the angle between the maximum radiation direction of the second antenna and the first direction are in the range of [30°, 80°].

10. The antenna module of any one of claims 1 to 9, wherein, The reflecting substrate is arranged on the side away from the first antenna and the second antenna.

11. The antenna module of any one of claims 1 to 10, wherein, The first antenna and the second antenna are located on the same horizontal plane.

12. The antenna module of any one of claims 1 to 10, wherein, The first antenna and the second antenna are located on different horizontal planes.

13. The antenna module of any one of claims 1 to 12, wherein, The first antenna and / or the second antenna are antennas with a substrate integrated waveguide (SIW) structure.

14. The antenna module of any one of claims 1 to 13, wherein, The first antenna and / or the second antenna further comprise one or more parasitic antennas.

15. The antenna module of any one of claims 1 to 14, wherein, The first antenna and / or the second antenna further comprise one or more monopole antennas.

16. An electronic device, comprising: The method is applied to an antenna module, the antenna module comprising: a first antenna and a second antenna, the first antenna and the second antenna being air-tightly isolated; 17. A method of communication, comprising: the first antenna transmits wireless signals along a maximum radiation direction of the first antenna to a reflecting substrate, the reflecting substrate reflects the wireless signals along a maximum radiation direction of the second antenna to the second antenna, the second antenna receives the reflected wireless signals, wherein the angle between the maximum radiation direction of the first antenna and a first direction is the same as or different from the angle between the maximum radiation direction of the second antenna and the first direction, and the first direction is perpendicular to the radiation surface of the first antenna and the second antenna. Further comprising:

18. The communication method according to claim 17, wherein, directing the reflected wireless signals to the second antenna. ​ 19. The communication method according to claim 17 or 18, wherein, The included angle between the maximum radiation direction of the first antenna and the first direction and the included angle between the maximum radiation direction of the second antenna and the first direction are in the range of [30°, 80°]. The included angle between the maximum radiation direction of the first antenna and the first direction and the included angle between the maximum radiation direction of the second antenna and the first direction are in the range of [30°, 80°].

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