Display panel, preparation method for display panel, and electronic device

Abstract

The present application relates to a display panel, a manufacturing method for the display panel, and an electronic device. The display panel comprises a substrate, isolation structures, light-emitting units, encapsulation units, and a protection structure. The isolation structures are located on one side of the substrate, the isolation structures enclose to form isolation openings, and an isolation recess is provided on the side of each isolation structure distant from the substrate. At least part of each light-emitting unit is located in the corresponding isolation opening, each encapsulation unit is located on the side of the corresponding light-emitting unit distant from the substrate, at least part of each encapsulation unit extends from the side surface of the corresponding isolation structure facing the corresponding isolation opening to the side of the isolation structure distant from the substrate, the protection structure is located on the side of the isolation structure distant from the substrate, and the orthographic projection of the protection structure on the substrate covers at least part of the orthographic projection of the isolation recesses on the substrate. In the present application, the encapsulation units of the light-emitting units are not prone to damage, thereby improving the encapsulation effect of the display panel.

Description

Display panel, display panel manufacturing method and electronic device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411832173.X, filed on December 10, 2024, entitled “Display panel, display panel manufacturing method and electronic device,” and to Chinese Patent Application No. 202411024616.2, filed on July 26, 2024, entitled “Display panel, display panel manufacturing method and electronic device,” the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the technical field of display, in particular to a display panel, a display panel manufacturing method and device. BACKGROUND

[0004] Organic Light Emitting Diode (OLED) and flat display devices based on Light Emitting Diode (LED) technology have been widely used in mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display panels.

[0005] However, there are still some problems in display panels that need to be solved. SUMMARY

[0006] In order to overcome the technical problems mentioned in the above technical background, the embodiments of the first aspect of the present application provide a display panel, comprising:

[0007] a substrate;

[0008] an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure having an isolation groove away from the one side of the substrate;

[0009] a light emitting unit at least partially located in the isolation opening;

[0010] an encapsulation unit located away from the substrate on the side of the light emitting unit;

[0011] a protection structure located away from the substrate on the side of the isolation structure, a projection of the protection structure on the substrate covering at least part of a projection of the isolation groove on the substrate.

[0012] According to any one of the preceding embodiments of the first aspect of the present application, the protection structure comprises a protection layer of the same material as the packaging unit, and a projection of the isolation groove on the substrate is located within a projection of the protection layer on the substrate;

[0013] According to any one of the preceding embodiments of the first aspect of the present application, the protection layer is connected to the packaging unit.

[0014] A minimum distance between an edge of a projection of the isolation groove on the substrate and an edge of a projection of the protection layer on the substrate is greater than or equal to 0 μm.

[0015] According to any one of the preceding embodiments of the first aspect of the present application, a minimum distance between an edge of a projection of a bottom wall of the isolation groove on the substrate and an edge of a projection of the protection layer on the substrate is greater than or equal to 0.5 μm and less than or equal to 8 μm.

[0016] According to any one of the preceding embodiments of the first aspect of the present application, the protection structure further comprises a first auxiliary protection layer between the protection layer and the isolation structure.

[0017] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the first auxiliary protection layer on the substrate covers at least part of a projection of the isolation groove on the substrate.

[0018] According to any one of the preceding embodiments of the first aspect of the present application, the first auxiliary protection layer contacts a side of the isolation structure away from the substrate.

[0019] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the first auxiliary protection layer on the substrate covers a projection of the isolation groove on the substrate.

[0020] According to any one of the preceding embodiments of the first aspect of the present application, the light-emitting unit comprises a first electrode, a light-emitting part and a second electrode stacked on one side of the substrate, and the first auxiliary protection layer is arranged in the same layer as the light-emitting part.

[0021] According to any one of the preceding embodiments of the first aspect of the present application, a material of the first auxiliary protection layer is the same as a material of the light-emitting part.

[0022] According to any one of the preceding embodiments of the first aspect of the present application, the first auxiliary protection layer is arranged apart from the light-emitting part.

[0023] According to any one of the preceding embodiments of the first aspect of the present application, the protection structure further comprises a second auxiliary protection layer between the protection layer and the first auxiliary protection layer.

[0024] According to any one of the preceding embodiments of the first aspect of the present application, a normal projection of the second auxiliary protective layer on the substrate covers at least part of a normal projection of the isolation groove on the substrate;

[0025] According to any one of the preceding embodiments of the first aspect of the present application, the second auxiliary protective layer is in contact with the protective layer on the side close to the substrate;

[0026] According to any one of the preceding embodiments of the first aspect of the present application, a normal projection of the second auxiliary protective layer on the substrate covers a normal projection of the isolation groove on the substrate;

[0027] According to any one of the preceding embodiments of the first aspect of the present application, the second auxiliary protective layer is disposed in the same layer as the second electrode;

[0028] According to any one of the preceding embodiments of the first aspect of the present application, the second auxiliary protective layer is made of the same material as the second electrode;

[0029] According to any one of the preceding embodiments of the first aspect of the present application, the second auxiliary protective layer is disposed apart from the second electrode.

[0030] According to any one of the preceding embodiments of the first aspect of the present application, the light-emitting unit comprises a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, the packaging unit comprises a first packaging unit corresponding to the first light-emitting unit, a second packaging unit corresponding to the second light-emitting unit, and a third packaging unit corresponding to the third light-emitting unit; the protective layer comprises at least one protective layer corresponding to one of the first packaging unit, the second packaging unit, and the third packaging unit, respectively, and one of the at least one protective layer covers the isolation groove corresponding to one, two, or three of the light-emitting units;

[0031] According to any one of the preceding embodiments of the first aspect of the present application, the protective layer comprises at least two protective layers corresponding to one of the first packaging unit, the second packaging unit, and the third packaging unit, respectively, and at least two of the at least two protective layers partially overlap;

[0032] According to any one of the preceding embodiments of the first aspect of the present application, the light-emitting unit comprises a first electrode, a light-emitting part, and a second electrode disposed in a stacked manner away from the substrate, and along the thickness direction of the substrate, a first gap is present between overlapping portions of the protective layer corresponding to the first packaging unit and the second packaging unit; along the thickness direction of the substrate, the height of the first gap is within the range of 80%-120% of the sum of the thicknesses of the light-emitting part of the second light-emitting unit and the second electrode;

[0033] According to any one of the foregoing embodiments of the first aspect of the present application, a second gap is formed between the overlapping portions of the protective layer corresponding to the second encapsulation unit and the third encapsulation unit along the thickness direction of the substrate; the height of the second gap along the thickness direction of the substrate is within the range of 80%-120% of the sum of the thicknesses of the light emitting part of the third light emitting unit and the second electrode;

[0034] According to any one of the foregoing embodiments of the first aspect of the present application, the light emitting colors of the first light emitting unit, the second light emitting unit, and the third light emitting unit are all different.

[0035] According to any one of the foregoing embodiments of the first aspect of the present application, the light emitting units include a first light emitting unit, a second light emitting unit, and a third light emitting unit, the encapsulation units include a first encapsulation unit corresponding to the first light emitting unit, a second encapsulation unit corresponding to the second light emitting unit, and a third encapsulation unit corresponding to the third light emitting unit; the isolation grooves include a first isolation groove corresponding to the first light emitting unit, a second isolation groove corresponding to the second light emitting unit, and a third isolation groove corresponding to the third light emitting unit.

[0036] According to any one of the foregoing embodiments of the first aspect of the present application, the protective layer includes a first protective layer corresponding to the first encapsulation unit, a second protective layer corresponding to the second encapsulation unit, and a third protective layer corresponding to the third encapsulation unit; the first protective layer covers the first isolation groove, the second protective layer covers the second isolation groove, and the third protective layer covers the third isolation groove.

[0037] According to any one of the foregoing embodiments of the first aspect of the present application, the protective layer includes a first protective layer, the first protective layer includes a first protective part, a second protective part, and a third protective part, the first protective part covers the first isolation groove, the second protective part covers the second isolation groove, and the third protective part covers the third isolation groove.

[0038] According to any one of the foregoing embodiments of the first aspect of the present application, the first protective layer is connected to the first encapsulation unit.

[0039] According to any one of the foregoing embodiments of the first aspect of the present application, the second protective layer is connected to the second encapsulation unit.

[0040] According to any one of the foregoing embodiments of the first aspect of the present application, the third protective layer is connected to the third encapsulation unit.

[0041] According to any one of the foregoing embodiments of the first aspect of the present application, the second isolation groove is located on the side of the second light emitting unit close to the first light emitting unit, and the first protective part and the second protective part are in an integral structure.

[0042] According to any one of the preceding embodiments of the first aspect of the application, the second isolation groove is located on a side of the second light emitting unit close to the first light emitting unit, the third isolation groove is located on a side of the third light emitting unit close to the first light emitting unit, and the first protection part, the second protection part and the third protection part are in an integrated structure;

[0043] According to any one of the preceding embodiments of the first aspect of the application, the first isolation groove and the second isolation groove are located between the first light emitting unit and the second light emitting unit, and the first protection part and the second protection part are in an integrated structure;

[0044] According to any one of the preceding embodiments of the first aspect of the application, the second isolation groove and the third isolation groove are located between the second light emitting unit and the third light emitting unit, and the second protection part and the third protection part are in an integrated structure;

[0045] According to any one of the preceding embodiments of the first aspect of the application, the first protection layer is of the same layer and material as the first packaging unit.

[0046] According to any one of the preceding embodiments of the first aspect of the application, the protection layer further comprises a second protection layer, the second protection layer comprises a fourth protection part corresponding to the first packaging unit, a fifth protection part corresponding to the second packaging unit, and a sixth protection part corresponding to the third packaging unit, the fourth protection part covers the first isolation groove, the fifth protection part covers the second isolation groove, and the sixth protection part covers the third isolation groove, the fourth protection part is located on a side of the first protection part away from the substrate, the fifth protection part is located on a side of the second protection part away from the substrate, and the sixth protection part is located on a side of the third protection part away from the substrate;

[0047] According to any one of the preceding embodiments of the first aspect of the application, the second isolation groove is located on a side of the second light emitting unit close to the first light emitting unit, and the fourth protection part and the fifth protection part are in an integrated structure;

[0048] According to any one of the preceding embodiments of the first aspect of the application, the second isolation groove is located on a side of the second light emitting unit close to the first light emitting unit, the third isolation groove is located on a side of the third light emitting unit close to the first light emitting unit, and the fourth protection part, the fifth protection part and the sixth protection part are in an integrated structure;

[0049] According to any one of the preceding embodiments of the first aspect of the application, the first isolation groove and the second isolation groove are located between the first light emitting unit and the second light emitting unit, and the fourth protection part and the fifth protection part are in an integrated structure;

[0050] According to any one of the preceding embodiments of the first aspect of the application, the second isolation groove and the third isolation groove are located between the second light emitting unit and the third light emitting unit, and the fifth protection portion and the sixth protection portion are in an integral structure.

[0051] According to any one of the preceding embodiments of the first aspect of the application, the second protection layer is of the same layer and material as the second packaging unit.

[0052] According to any one of the preceding embodiments of the first aspect of the application, the protection layer further comprises a second protection layer and a third protection layer, the second protection layer comprises a fourth protection portion corresponding to the first packaging unit and a fifth protection portion corresponding to the second packaging unit, and the third protection layer comprises a seventh protection portion corresponding to the third packaging unit, the fourth protection portion covers the first isolation groove, the fifth protection portion covers the second isolation groove, and the seventh protection portion covers the third isolation groove, the fourth protection portion is located on a side of the first protection portion away from the substrate, the fifth protection portion is located on a side of the second protection portion away from the substrate, and the seventh protection portion is located on a side of the third protection portion away from the substrate.

[0053] According to any one of the preceding embodiments of the first aspect of the application, the first isolation groove and the third isolation groove are located between the first light emitting unit and the third light emitting unit, and the third protection portion and the first protection portion are in an integral structure.

[0054] According to any one of the preceding embodiments of the first aspect of the application, the third protection layer is of the same layer and material as the third packaging unit.

[0055] According to any one of the preceding embodiments of the first aspect of the application, the protection layer comprises a first protection layer, the first protection layer comprises a first protection portion corresponding to the first packaging unit and a second protection portion corresponding to the second packaging unit, the first protection portion covers the first isolation groove and the second isolation groove, and the second protection portion covers the third isolation groove.

[0056] According to any one of the preceding embodiments of the first aspect of the application, the protection layer comprises a first protection layer, the first protection layer comprises a first protection portion corresponding to the first packaging unit and a second protection portion corresponding to the second packaging unit, the first protection portion covers the first isolation groove, and the second protection portion covers the second isolation groove and the third isolation groove.

[0057] According to any one of the preceding embodiments of the first aspect of the present application, the protective layer comprises a first protective layer, the first protective layer comprises a first protective portion corresponding to the first encapsulation unit; the first protective portion covers the first isolation groove, the second isolation groove, and the third isolation groove.

[0058] According to any one of the preceding embodiments of the first aspect of the present application, the substrate comprises a substrate, a circuit structure layer, and an insulating layer on one side of the substrate, the circuit structure layer comprises a circuit structure, the insulating layer is provided with a via hole penetrating through the insulating layer, the light emitting unit comprises a first electrode, the first electrode is electrically connected to the circuit structure through the via hole, and a projection of the isolation groove on the substrate is located within a projection of the via hole on the substrate;

[0059] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises a pixel definition layer between the insulating layer and the isolation structure, a second groove is provided on a side of the pixel definition layer away from the substrate, and a projection of the isolation groove on the substrate is located within a projection of the second groove on the substrate.

[0060] According to any one of the preceding embodiments of the first aspect of the present application, a fifth groove is provided on a side of the protective layer away from the substrate, and a projection of the fifth groove on the substrate corresponds to a projection of the isolation groove on the substrate.

[0061] According to any one of the preceding embodiments of the first aspect of the present application, the isolation structure comprises a first isolation portion and a second isolation portion which are sequentially stacked in a direction away from the substrate, a projection of a side of the first isolation portion away from the substrate on the substrate is located within a projection of the second isolation portion on the substrate, and the isolation groove is located on a side of the second isolation portion away from the substrate.

[0062] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the via hole on the substrate is located within a projection of the first isolation portion on the substrate and close to a side of the corresponding light emitting unit.

[0063] According to any one of the preceding embodiments of the first aspect of the present application, a distance between a projection of the via hole on the substrate and a projection of an end surface edge of the corresponding first isolation portion away from the substrate on the substrate is greater than 0.5 μm.

[0064] According to any one of the preceding embodiments of the first aspect of the present application, a third groove is further provided on a side of the first isolation portion away from the substrate, and a projection of the isolation groove on the substrate is located within a projection of the third groove on the substrate.

[0065] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation structure further comprises a third isolation portion located on the side of the first isolation portion facing the substrate, a fourth groove is formed on the side of the third isolation portion away from the substrate, the orthogonal projection of the third groove on the substrate is located within the orthogonal projection of the fourth groove on the substrate, and the orthogonal projection of the fourth groove on the substrate is located within the orthogonal projection of the second groove on the substrate.

[0066] The embodiments of the second aspect of the present application also provide a display panel, comprising:

[0067] a substrate;

[0068] an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening, and the isolation structure having an isolation groove on the side thereof away from the substrate;

[0069] a light emitting unit located at least partially within the isolation opening;

[0070] an encapsulation unit located on the side of the light emitting unit away from the substrate;

[0071] a protection portion located on the side of the isolation structure away from the substrate and connected to the encapsulation unit, and the orthogonal projection of the protection portion on the substrate covering at least part of the orthogonal projection of the isolation groove on the substrate.

[0072] The embodiments of the third aspect of the present application also provide a method for manufacturing a display panel, the method comprising:

[0073] providing a substrate;

[0074] forming an isolation structure on one side of the substrate, the isolation structure having an isolation groove formed on the side thereof away from the substrate, and an isolation opening formed on the isolation structure;

[0075] forming a light emitting unit located at least partially within the isolation opening, an encapsulation unit located on the side of the light emitting unit away from the substrate, and a protection structure located on the side of the isolation structure away from the substrate, and causing the orthogonal projection of the protection structure on the substrate to cover at least part of the orthogonal projection of the isolation groove on the substrate.

[0076] According to any one of the foregoing embodiments of the third aspect of the present application, the step of forming the light emitting unit located at least partially within the isolation opening, the encapsulation unit located on the side of the light emitting unit away from the substrate, and the protection structure located on the side of the isolation structure away from the substrate comprises:

[0077] forming a first light emitting material layer located at least partially within a first isolation opening of the isolation opening, the first light emitting material layer comprising a light emitting functional layer and a second electrode layer.

[0078] forming a first encapsulation unit material layer on a side of the first light emitting material layer away from the substrate;

[0079] forming a patterned first etching protection layer on a side of the first encapsulation unit material layer of the first light emitting unit away from the substrate, a footprint of the first etching protection layer on the substrate covering a footprint of the corresponding first light emitting unit and the first isolation groove on the substrate;

[0080] etching to remove the first encapsulation unit material layer and the first light emitting material layer not covered by the first etching protection layer, and then removing the first etching protection layer, thereby forming a light emitting part of the first light emitting unit, a second electrode, a first encapsulation unit and a first protection layer of the first light emitting unit at least partially located in the first isolation groove, a footprint of the first protection layer on the substrate covering a footprint of the first isolation groove on the substrate.

[0081] According to any one of the preceding embodiments of the third aspect of the present application, a footprint of the first etching protection layer on the substrate further covers a footprint of the corresponding second isolation groove and third isolation groove on the substrate;

[0082] The first protection layer comprises a first protection part, a second protection part and a third protection part; a footprint of the first protection part on the substrate covers a footprint of the first isolation groove on the substrate, a footprint of the second protection part on the substrate covers the second isolation groove, and a footprint of the third protection part on the substrate covers a footprint of the third isolation groove on the substrate;

[0083] According to any one of the preceding embodiments of the third aspect of the present application, at least two of the first protection part, the second protection part and the third protection part are an integral structure.

[0084] According to any one of the preceding embodiments of the third aspect of the present application, after the step of etching to remove the first encapsulation unit material layer and the first light emitting material layer not covered by the first etching protection layer, and then removing the first etching protection layer, the method further comprises:

[0085] forming a second light emitting material layer partially located in the second isolation groove;

[0086] forming a second encapsulation unit material layer on a side of the second light emitting material layer away from the substrate;

[0087] forming a patterned second etching protection layer on a side of the second encapsulation unit material layer away from the substrate, a footprint of the second etching protection layer on the substrate covering footprints of the corresponding second light emitting unit, the first isolation groove, the second isolation groove and the third isolation groove on the substrate;

[0088] etching to remove the second encapsulation unit material layer and the second light emitting material layer not covered by the second etching protection layer, and then removing the second etching protection layer, thereby forming a light emitting part of the second light emitting unit at least partially located in the second isolation groove, a second electrode, a second encapsulation unit and a second protection layer;

[0089] the second protection layer comprises a fourth protection part, a fifth protection part and a sixth protection part; a footprint of the fourth protection part on the substrate covers a footprint of the first isolation groove on the substrate, a footprint of the fifth protection part on the substrate covers the second isolation groove, and a footprint of the sixth protection part on the substrate covers a footprint of the third isolation groove on the substrate;

[0090] According to any one of the preceding embodiments of the third aspect of the present application, the fourth protection part overlaps the first protection part; the fifth protection part overlaps the second protection part; and the sixth protection part overlaps the third protection part.

[0091] According to any one of the preceding embodiments of the third aspect of the present application, at least two of the fourth protection part, the fifth protection part and the sixth protection part are an integral structure.

[0092] According to any one of the preceding embodiments of the third aspect of the present application, the light emitting unit comprises a first light emitting unit, a second light emitting unit and a third light emitting unit, the isolation groove comprises a first isolation groove corresponding to the first light emitting unit, a second isolation groove corresponding to the second light emitting unit and a third isolation groove corresponding to the third light emitting unit.

[0093] the step of forming the light emitting unit at least partially located in the isolation groove, the encapsulation unit on a side of the light emitting unit away from the substrate and the protection structure on a side of the isolation structure away from the substrate comprises:

[0094] forming a first light emitting material layer, a first encapsulation unit material layer and a patterned fourth etching protection layer at least partially located in the first isolation groove, a footprint of the fourth etching protection layer on the substrate covering footprints of the corresponding first light emitting unit, the first isolation groove and the second isolation groove on the substrate;

[0095] etching the first encapsulation unit material layer and the first luminescent material layer not covered by the fourth etching protection layer, and then removing the fourth etching protection layer, so as to form a light emitting part of the first luminescent unit, a second electrode, a first encapsulation unit and a first protection layer of the first luminescent unit at least partially located in the first isolation opening, a projection of the first protection layer on the substrate covering projections of the first isolation groove and the second isolation groove on the substrate;

[0096] forming a second luminescent unit at least partially located in the second isolation opening, and a second encapsulation unit and a second protection layer located on a side of the second luminescent unit away from the substrate, a projection of the second protection layer on the substrate covering a projection of the third isolation groove on the substrate;

[0097] forming a third luminescent unit at least partially located in the third isolation opening, and a third encapsulation unit located on a side of the third luminescent unit away from the substrate.

[0098] According to any one of the foregoing embodiments of the third aspect of the present application, the luminescent unit comprises a first luminescent unit, a second luminescent unit and a third luminescent unit, the isolation opening comprises a first isolation opening, a second isolation opening and a third isolation opening, and the isolation groove comprises a first isolation groove corresponding to the first luminescent unit, a second isolation groove corresponding to the second luminescent unit and a third isolation groove corresponding to the third luminescent unit;

[0099] The step of forming the luminescent unit at least partially located in the isolation opening, the encapsulation unit located on a side of the luminescent unit away from the substrate, and the protection structure located on a side of the isolation structure away from the substrate comprises:

[0100] forming a first luminescent unit at least partially located in the first isolation opening, and a first encapsulation unit and a first protection layer located on a side of the first luminescent unit away from the substrate, a projection of the first protection layer on the substrate covering projections of the first isolation groove, the second isolation groove and the third isolation groove on the substrate;

[0101] forming a second luminescent unit at least partially located in the second isolation opening, and a second encapsulation unit located on a side of the second luminescent unit away from the substrate;

[0102] forming a third luminescent unit at least partially located in the third isolation opening, and a third encapsulation unit located on a side of the third luminescent unit away from the substrate.

[0103] According to any one of the foregoing embodiments of the third aspect of the present application, after the step of forming the light-emitting unit at least partially located in the isolation opening, the encapsulation unit located on the side of the light-emitting unit away from the substrate, and the protection structure located on the side of the isolation structure away from the substrate, the method further comprises:

[0104] removing the protection structure.

[0105] Embodiments of the fourth aspect of the present application also provide an electronic device comprising the display panel described in the present application or comprising the display panel prepared by the preparation method of the display panel described in the present application.

[0106] The display panel, the preparation method of the display panel and the electronic device provided by the embodiments of the present application can protect the isolation structure at the isolation groove by making the orthographic projection of the protection structure on the substrate cover the orthographic projection of the at least partially isolated groove on the substrate, so as to reduce the etching damage of the isolation structure at the isolation groove, and the encapsulation unit of the light-emitting unit is not easily damaged, thereby improving the encapsulation effect of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0107] Features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings, which are not drawn to scale.

[0108] FIG. 1 is a cross-sectional schematic view of a display panel provided by an embodiment of the present application, in which a protection structure is arranged on an isolation groove;

[0109] FIG. 2 is a cross-sectional schematic view of a display panel provided by an embodiment of the present application, in which the protection structure comprises a protection layer;

[0110] FIG. 3 is a cross-sectional schematic view of a display panel provided by an embodiment of the present application, in which the protection structure further comprises a first auxiliary protection layer and a second auxiliary protection layer;

[0111] FIG. 4 is a top view schematically showing a relationship between an encapsulation unit and an isolation groove according to an embodiment of the present application;

[0112] FIG. 5 is a cross-sectional schematic view of M-M in FIG. 4 according to an embodiment of the present application;

[0113] FIG. 6 is a top view schematically showing a relationship between an encapsulation unit and an isolation groove according to another embodiment of the present application;

[0114] FIG. 7 is a cross-sectional schematic view of A-A in FIG. 6 according to an embodiment of the present application;

[0115] FIG. 8 is a top view schematically showing a relationship between an encapsulation unit and an isolation groove according to a further embodiment of the present application;

[0116] FIG. 9 is a cross-sectional view of B-B in FIG. 8 according to an embodiment of the present application;

[0117] FIG. 10 is a top view of a fourth embodiment of the relationship between the packaging units and the isolation grooves according to an embodiment of the present application;

[0118] FIG. 11 is a cross-sectional view of C-C in FIG. 10 according to an embodiment of the present application;

[0119] FIG. 12 is a top view of a fifth embodiment of the relationship between the packaging units and the isolation grooves according to an embodiment of the present application;

[0120] FIG. 13 is a cross-sectional view of D-D in FIG. 12 according to an embodiment of the present application;

[0121] FIG. 14 is a cross-sectional view of E-E in FIG. 12 according to an embodiment of the present application;

[0122] FIG. 15 is a top view of a sixth embodiment of the relationship between the packaging units and the isolation grooves according to an embodiment of the present application;

[0123] FIG. 16 is a cross-sectional view of F-F in FIG. 15 according to an embodiment of the present application;

[0124] FIG. 17 is a cross-sectional view of G-G in FIG. 15 according to an embodiment of the present application;

[0125] FIG. 18 is a cross-sectional view of F-F in FIG. 15 according to an embodiment of the present application;

[0126] FIG. 19 is a cross-sectional view of G-G in FIG. 15 according to an embodiment of the present application;

[0127] FIG. 20 is a cross-sectional view of G-G in FIG. 15 according to an embodiment of the present application;

[0128] FIG. 21 is a cross-sectional view of a fifth groove on a side of a packaging unit away from a substrate according to an embodiment of the present application;

[0129] FIG. 22 is a cross-sectional view of a two-layer isolation structure according to an embodiment of the present application;

[0130] FIG. 23 is a cross-sectional view of a three-layer isolation structure according to an embodiment of the present application;

[0131] FIG. 24 is a cross-sectional view of a display panel including a second packaging layer and a third packaging layer according to an embodiment of the present application;

[0132] FIG. 25 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;

[0133] FIG. 26 is a cross-sectional schematic view of sequentially forming a circuit structure layer, an insulating layer and a first electrode layer on one side of a substrate according to an embodiment of the present application;

[0134] FIG. 27 is a cross-sectional schematic view of forming a pixel defining material layer on the side of the first electrode layer away from the substrate according to an embodiment of the present application;

[0135] FIG. 28 is a cross-sectional schematic view of forming an isolation material layer on the side of the pixel defining material layer away from the substrate according to an embodiment of the present application;

[0136] FIG. 29 is a cross-sectional schematic view of sequentially patterning the isolation material layer and the pixel defining material layer according to an embodiment of the present application;

[0137] FIG. 30 is a cross-sectional schematic view of forming a first light emitting material layer in a first isolation opening according to an embodiment of the present application;

[0138] FIG. 31 is a cross-sectional schematic view of forming a first encapsulation unit material layer on the side of the first light emitting material layer away from the substrate according to an embodiment of the present application;

[0139] FIG. 32 is a cross-sectional schematic view of forming a first etching protection layer on the side of the first encapsulation unit material layer located in the first light emitting unit away from the substrate according to an embodiment of the present application;

[0140] FIG. 33 is a cross-sectional schematic view of removing the first encapsulation unit material layer and the first light emitting material layer not covered by the first etching protection layer according to an embodiment of the present application;

[0141] FIG. 34 is a cross-sectional schematic view of forming a second light emitting material layer in a second isolation opening according to an embodiment of the present application;

[0142] FIG. 35 is a cross-sectional schematic view of forming a first encapsulation unit material layer on the side of the second light emitting material layer away from the substrate according to an embodiment of the present application;

[0143] FIG. 36 is a cross-sectional schematic view of forming a second etching protection layer on the side of the first encapsulation unit material layer located in the second light emitting unit away from the substrate according to an embodiment of the present application;

[0144] FIG. 37 is a cross-sectional schematic view of removing the first encapsulation unit material layer and the second light emitting material layer not covered by the second etching protection layer according to an embodiment of the present application;

[0145] FIG. 38 is a cross-sectional schematic view of forming a third light emitting material layer in a third isolation opening according to an embodiment of the present application;

[0146] FIG. 39 is a cross-sectional schematic view of forming a first encapsulation unit material layer on the side of the third light emitting material layer away from the substrate according to an embodiment of the present application;

[0147] FIG. 40 is a cross-sectional schematic view of forming a third etching protection layer on a side of a first encapsulation unit material layer of a third light emitting unit away from the substrate according to an embodiment of the present application;

[0148] FIG. 41 is a cross-sectional schematic view of sequentially forming a first light emitting material layer, a first encapsulation unit material layer and a fourth etching protection layer in a first isolation opening in a direction away from the substrate according to an embodiment of the present application;

[0149] FIG. 42 is a cross-sectional schematic view of removing the first encapsulation unit material layer and the first light emitting material layer not covered by the fourth etching protection layer and removing the fourth etching protection layer according to an embodiment of the present application;

[0150] FIG. 43 is a cross-sectional schematic view of forming a second light emitting unit and an encapsulation unit on a side of the second light emitting unit away from the substrate in a second isolation opening according to an embodiment of the present application;

[0151] FIG. 44 is a cross-sectional schematic view of forming a first light emitting unit and an encapsulation unit on a side of the first light emitting unit away from the substrate in a first isolation opening according to an embodiment of the present application;

[0152] FIG. 45 is a cross-sectional schematic view of forming a second light emitting unit and an encapsulation unit on a side of the second light emitting unit away from the substrate in a second isolation opening according to an embodiment of the present application;

[0153] FIG. 46 is a cross-sectional schematic view of forming a first light emitting unit and an encapsulation unit, a first covering portion and a second covering portion on a side of the first light emitting unit away from the substrate in a first isolation opening according to an embodiment of the present application;

[0154] FIG. 47 is a cross-sectional schematic view of forming a second light emitting unit and an encapsulation unit on a side of the second light emitting unit away from the substrate in a second isolation opening according to an embodiment of the present application;

[0155] FIG. 48 is a cross-sectional schematic view of forming a third light emitting unit and an encapsulation unit on a side of the third light emitting unit away from the substrate in a third isolation opening according to an embodiment of the present application;

[0156] FIG. 49 is a cross-sectional schematic view of a display panel with a protection structure removed according to an embodiment of the present application.

[0157] Explanation of reference numerals in the attached drawings: 1. Substrate; 101. Substrate; 2. Pixel defining layer; 201. Pixel opening; 202. Second groove; 3. Isolation structure; 301. Isolation groove; 3011. First isolation groove; 3012. Second isolation groove; 3013. Third isolation groove; 31. First isolation portion; 311. Third groove; 32. Second isolation portion; 33. Third isolation portion; 331. Fourth groove; 4. First electrode; 5. Light-emitting portion; 6. Second electrode; 7. Light-emitting unit; 8. Isolation opening; 81. First isolation opening; 82. Second isolation opening; 83. Third isolation opening; 91. Encapsulation unit; 9001. Protective portion; 901. Fifth groove; 911. First encapsulation unit; 912. Second encapsulation unit; 913. Third encapsulation unit; 10. Groove; 12. Circuit structure layer; 121. Circuit structure; 13. Insulation Layers; 131. Via; 14. Second encapsulation layer; 15. Third encapsulation layer; 16. Pixel defining material layer; 17. Isolation material layer; 18. First encapsulation unit material layer; 19. First etch protection layer; 20. Second etch protection layer; 21. Third etch protection layer; 22. Fourth etch protection layer; 23. Protective structure; 231. Protective layer; 2311. First protective layer; 23111. First protective part; 23112. Second protective part; 23113. Third protective part; 2312. Second protective layer; 23121. Fourth protective part; 23122. Fifth protective part; 23123. Sixth protective part; 2313. Third protective layer; 23131. Seventh protective part; 232. First auxiliary protective layer; 233. Second auxiliary protective layer; 25. Second encapsulation unit material layer; 26. Third encapsulation unit material layer. Detailed Implementation

[0158] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0159] To better understand this application, the display panel, the method for manufacturing the display panel, and the electronic device provided in the embodiments of this application will be described in detail below with reference to Figures 1 to 49.

[0160] Increasing the density of light-emitting units (i.e., pixel density) in a display panel is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in light-emitting unit density. Through long-term research, the inventors discovered that to address this technical challenge, some display panels incorporate isolation structures. During the full-layer deposition of the light-emitting functional layer and the second electrode, the light-emitting functional layer and the second electrode can be disconnected at the isolation structure. Through multiple deposition and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed within different isolation openings.

[0161] Among them, patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN20241099419, and PCT / CN20241099072 describe relevant technical solutions for isolation structures and encapsulation layers, the contents of which are incorporated herein by reference.

[0162] The display panel in the related technology includes a substrate and an isolation structure located on one side of the substrate. The isolation structure encloses and forms an isolation opening. The side of the isolation structure away from the substrate has a groove. During the formation of the light-emitting unit, the second electrode of the light-emitting unit is relatively thin at the groove. During the patterning of the light-emitting unit, the second electrode at the groove cannot effectively block the etching of the isolation structure. After further etching, the isolation structure may be etched to form a hole, which will eventually damage the encapsulation layer of the light-emitting unit, causing the encapsulation of the light-emitting unit to fail, thereby affecting the display effect of the display panel.

[0163] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the above solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below should be considered contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0164] Please refer to Figure 1. This embodiment provides a display panel, which includes a substrate, an isolation structure 3, a light-emitting unit 7, an encapsulation unit 91, and a protective structure 23.

[0165] The isolation structure 3 is located on one side of the substrate, and the isolation structure 3 encloses and forms an isolation opening 8. The side of the isolation structure 3 away from the substrate has an isolation groove 301.

[0166] At least some of the light-emitting units 7 are located within the isolation opening 8, and the encapsulation unit 91 is located on the side of the light-emitting unit 7 away from the substrate.

[0167] The protective structure 23 is located on the side of the isolation structure 3 away from the substrate, and the orthographic projection of the protective structure 23 on the substrate covers at least part of the orthographic projection of the isolation groove 301 on the substrate.

[0168] The light-emitting unit 7 includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. Since the orthogonal projection of the protective structure 23 on the substrate covers at least part of the orthogonal projection of the isolation groove 301 on the substrate, the protective structure 23 can protect the isolation structure 3 at the isolation groove 301 during the formation of the second light-emitting unit and the third light-emitting unit. It plays an etching blocking role for the isolation structure 3 at the isolation groove 301, making it less likely for the isolation structure 3 at the isolation groove 301 corresponding to the first light-emitting unit to be over-etched. This makes it less likely for the packaging unit 91 corresponding to the first light-emitting unit to be damaged, and less likely for the packaging of the first light-emitting unit to fail.

[0169] Similarly, since the orthographic projection of the protective structure 23 on the substrate covers at least part of the orthographic projection of the isolation groove 301 on the substrate, the protective structure 23 can protect the isolation structure 3 at the isolation groove 301 during the formation of the third light-emitting unit, so that the isolation structure 3 at the isolation groove 301 corresponding to the second light-emitting unit is less likely to be over-etched, thereby making it less likely to damage the encapsulation unit 91 corresponding to the second light-emitting unit and less likely to cause the second light-emitting unit to fail to encapsulate, ultimately improving the display effect of the display panel.

[0170] Based on the above design, this embodiment protects the isolation structure 3 at the isolation groove 301 by making the orthogonal projection of the protective structure 23 on the substrate cover at least part of the orthogonal projection of the isolation groove 301 on the substrate. This reduces the etching damage to the isolation structure 3 at the isolation groove 301 and makes it less likely to damage the packaging unit 91 of the light-emitting unit 7, thereby improving the packaging effect of the display panel.

[0171] According to any of the foregoing embodiments of the first aspect of this application, referring to FIG2, the protective structure 23 includes a protective layer 231 of the same material as the encapsulation unit 7, and the orthographic projection of the isolation groove 301 on the substrate is located within the orthographic projection of the protective layer 231 on the substrate. Thus, the protective effect of the protective layer 231 on the isolation structure 3 at the isolation groove 301 makes the isolation structure 3 at the isolation groove 301 less prone to over-etching, thereby further preventing the light-emitting unit 7 from failing to encapsulate.

[0172] According to any of the foregoing embodiments of the first aspect of this application, the protective layer 231 is connected to the packaging unit 7. The protective layer 231 can be regarded as an extension of the packaging unit 7, thereby improving the stability of the protective layer 231.

[0173] According to any of the foregoing embodiments of the first aspect of this application, referring again to FIG2, the minimum distance D1 between the edge of the orthographic projection of the isolation groove 301 on the substrate and the edge of the orthographic projection of the protective layer 231 on the substrate is greater than or equal to 0 μm. For example, the minimum distance D1 can be 0, 0.5 μm, 0.6 μm, 0.7 μm, etc. In this way, the protective layer 231 can completely cover the corresponding isolation groove 301.

[0174] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance D2 between the edge of the orthographic projection of the bottom wall of the isolation groove 301 onto the substrate and the edge of the orthographic projection of the protective layer 231 onto the substrate is greater than or equal to 0.5 μm and less than or equal to 8 μm. For example, the minimum distance D2 can be 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm, 2 μm, 5 μm, 7 μm, 7.5 μm, 7.8 μm, or 8 μm, etc. By reasonably setting the minimum distance D2, the protective effect of the protective layer 231 on the isolation structure 3 at the isolation groove 301 can be further improved, making the light-emitting unit 7 less prone to encapsulation failure.

[0175] In some possible implementations, please refer to FIG3, the protective structure 23 further includes a first auxiliary protective layer 232 located between the protective layer 231 and the isolation structure 3, the orthographic projection of the first auxiliary protective layer 232 on the substrate 1 covering at least a portion of the orthographic projection of the isolation groove 301 on the substrate 1.

[0176] Thus, the protective layer 231 and the first auxiliary protective layer 232 together protect the isolation groove 301, thereby further improving the protection effect of the isolation structure 3 at the isolation groove 301.

[0177] According to any of the foregoing embodiments of the first aspect of this application, the first auxiliary protective layer 232 is in contact with the side of the isolation structure 3 away from the substrate 1;

[0178] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the first auxiliary protective layer 232 on the substrate 1 completely covers the orthographic projection of the isolation groove 301 on the substrate 1.

[0179] According to any of the foregoing embodiments of the first aspect of this application, the light-emitting unit 7 includes a first electrode 4, a light-emitting part 5, and a second electrode 6 stacked on one side of the substrate 1, and a first auxiliary protective layer 232 is disposed on the same layer as the light-emitting part 5.

[0180] According to any of the foregoing embodiments of the first aspect of this application, the material of the first auxiliary protective layer 232 is the same as the material of the light-emitting part 5.

[0181] In this way, the first auxiliary protective layer 232 can be formed at the same time as the light-emitting part 5, so there is no need to set up a special process to form the first auxiliary protective layer 232, thereby reducing the cost of forming the first auxiliary protective layer 232.

[0182] According to any of the foregoing embodiments of the first aspect of this application, the first auxiliary protective layer 232 is disposed at a distance from the light-emitting part 5. Thus, the first auxiliary protective layer 232 will not affect the light-emitting part 5, thereby minimizing its impact on the light-emitting effect of the light-emitting unit 7.

[0183] In some possible implementations, referring again to FIG3, the protective structure 23 further includes a second auxiliary protective layer 233 located between the protective layer 231 and the first auxiliary protective layer 232, the orthographic projection of the second auxiliary protective layer 233 on the substrate 1 covering at least a portion of the orthographic projection of the isolation groove 301 on the substrate 1.

[0184] Thus, the protective layer 231, the first auxiliary protective layer 232, and the second auxiliary protective layer 233 together protect the isolation groove 301, thereby further improving the protection effect of the isolation structure 3 at the isolation groove 301.

[0185] According to any of the foregoing embodiments of the first aspect of this application, the second auxiliary protective layer 233 is in contact with the protective layer 231 on the side near the substrate 1.

[0186] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the second auxiliary protective layer 233 on the substrate 1 completely covers the orthographic projection of the isolation groove 301 on the substrate 1.

[0187] According to any of the foregoing embodiments of the first aspect of this application, the second auxiliary protective layer 233 is disposed in the same layer as the second electrode 6.

[0188] According to any of the foregoing embodiments of the first aspect of this application, the material of the second auxiliary protective layer 233 is the same as the material of the second electrode 6.

[0189] Thus, the second auxiliary protective layer 233 can be formed at the same time as the second electrode 6, thereby eliminating the need for a special process to form the second auxiliary protective layer 233 and reducing the cost of forming the second auxiliary protective layer 233.

[0190] According to any of the foregoing embodiments of the first aspect of this application, the second auxiliary protective layer 233 is disposed at a distance from the second electrode 6. Thus, the second auxiliary protective layer 233 will not affect the second electrode 6, thereby minimizing its impact on the light-emitting effect of the light-emitting unit 7.

[0191] In some possible implementations, referring again to FIG3, the display panel further includes a pixel defining layer 2 located on the side of the first electrode 4 away from the substrate, and an isolation structure 3 located on the side of the pixel defining layer 2 away from the substrate; the pixel defining layer 2 includes a pixel opening 201 that exposes at least a portion of the first electrode 4, and the orthographic projection of the isolation structure 3 on the substrate is located between the orthographic projections of two adjacent pixel openings 201 on the substrate; the orthographic projection of the pixel opening 201 on the substrate is located within the orthographic projection of the isolation opening 8 on the substrate.

[0192] The isolation structure 3 allows the display panel to form film layers of different colors of light-emitting units 7 in different isolation openings 8 without the need for a fine metal mask. When forming the light-emitting functional layer, the isolation structure 3 separates the light-emitting functional layer into multiple spaced light-emitting portions 5. When forming the second electrode layer, the isolation structure 3 separates the second electrode layer into multiple spaced second electrodes 6. The isolation structure 3 includes a conductive material, and the second electrodes 6 are electrically connected to the isolation structure 3. One first electrode 4, one light-emitting portion 5, and one second electrode 6 form one light-emitting unit 7. The first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0193] In this way, different light-emitting units 7 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting functional layer and the second electrode layer in each color light-emitting unit 7 of the display panel can be fabricated and patterned on the entire surface first, thereby eliminating the need for a fine metal mask and saving on the manufacturing cost of the display panel.

[0194] According to any of the foregoing embodiments of the first aspect of this application, please refer again to FIG3, the substrate 1 includes a substrate 101, a circuit structure layer and an insulating layer 13 located on one side of the substrate 101. The circuit structure layer includes a circuit structure 121. A via 131 penetrating the insulating layer 13 is provided on the insulating layer 13. The orthographic projection of the isolation groove 301 on the substrate 101 is located within the orthographic projection of the via 131 on the substrate 101. A second groove 202 is provided on the side of the pixel defining layer 2 away from the substrate 101. The orthographic projection of the second groove 202 on the substrate 101 is located within the orthographic projection of the via 131 on the substrate 101. The orthographic projection of the isolation groove 301 on the substrate 101 is located within the orthographic projection of the second groove 202 on the substrate 101. The first electrode 4 is electrically connected to the circuit structure 121 through the via 131.

[0195] In this embodiment, the circuit structure 121 can be the fourth conductive layer in the display panel. Since the insulating layer 13 has a via 131 connecting the first electrode 4 and the circuit structure 121, a second groove 202 will naturally form on the pixel defining layer 2 at the via 131. An isolation groove 301 will naturally form on the side of the isolation structure 3 away from the substrate 101 at the location of the second groove 202. The orthographic projection of the second groove 202 on the substrate 101 is located within the orthographic projection of the via 131 on the substrate 1. The orthographic projection of the isolation groove 301 on the substrate 101 is located within the orthographic projection of the second groove 202 on the substrate 101.

[0196] Please refer to Figures 4 and 5. The light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit all emit different colors. The encapsulation unit 91 includes a first encapsulation unit 911, a second encapsulation unit 912, and a third encapsulation unit 913. The first encapsulation unit 911 is located on the side of the first light-emitting unit away from the substrate 1. The second encapsulation unit 912 is located on the side of the second light-emitting unit away from the substrate 1. The third encapsulation unit 913 is located on the side of the third light-emitting unit away from the substrate 1. The isolation opening 8 includes a first isolation opening 811, a second isolation opening 822, and a third isolation opening 833. The first light-emitting unit is located in the first isolation opening 811. The second light-emitting unit is located in the second isolation opening 812. The third light-emitting unit is located in the third isolation opening 813.

[0197] In some possible implementations, please refer to Figures 4 and 5. The protective layer 231 includes at least one protective layer 231 corresponding to one of the first packaging unit 911, the second packaging unit 912, and the third packaging unit 913. One of the at least one protective layer 231 covers the isolation grooves 301 corresponding to one, two, or three light-emitting units 7. Specifically, the isolation groove 301 corresponding to the through-hole 131 of the first electrode 4 of the first light-emitting unit is one type of isolation groove 301; the isolation groove 301 corresponding to the through-hole 131 of the first electrode 4 of the second light-emitting unit is another type of isolation groove 301; and the isolation groove 301 corresponding to the through-hole 131 of the first electrode 4 of the third light-emitting unit is yet another type of isolation groove 301, for a total of three types of light-emitting units and three types of isolation grooves 301. That is, the product may have only one protective layer, which protects the isolation grooves corresponding to one, two, or three light-emitting units; or the product may have two or three protective layers, which together protect the isolation grooves corresponding to one, two, or three light-emitting units.

[0198] According to any of the foregoing embodiments of the first aspect of this application, the protective layer 231 includes at least two protective layers 231 corresponding to one of the first packaging unit 911, the second packaging unit 912, and the third packaging unit 913, and at least two of the at least two protective layers 231 partially overlap.

[0199] During the manufacturing process of the display panel, the light-emitting part and the second electrode of the second light-emitting unit between the second packaging unit and the first packaging unit are removed. Therefore, the height H1 of the first gap is within the range of 80%-120% of the sum of the thicknesses of the light-emitting part and the second electrode of the second light-emitting unit. For example, the height H1 is 80%, 90%, 100%, 110%, or 120% of the sum of the thicknesses of the light-emitting part and the second electrode of the second light-emitting unit.

[0200] According to any of the foregoing embodiments of the first aspect of this application, a second gap H2 is provided between the second packaging unit and the third packaging unit in the overlapping portion along the thickness direction Z of the substrate.

[0201] According to any of the foregoing embodiments of the first aspect of this application, along the thickness direction Z of the substrate, the height H2 of the second gap is in the range of 80%-120% of the sum of the thickness of the light-emitting part of the third light-emitting unit and the thickness of the second electrode. For example, the height H2 is 80%, 90%, 100%, 110%, or 120% of the sum of the thickness of the light-emitting part of the third light-emitting unit and the thickness of the second electrode, etc.

[0202] During the manufacturing process of the display panel, the light-emitting part and the second electrode of the third light-emitting unit between the second packaging unit and the third packaging unit are removed. Therefore, the height H2 of the second gap is in the range of 80%-120% of the sum of the thickness of the light-emitting part and the second electrode of the third light-emitting unit.

[0203] The isolation groove 301 includes a first isolation groove 3011 corresponding to the first light-emitting unit, a second isolation groove 3012 corresponding to the second light-emitting unit, and a third isolation groove 3013 corresponding to the third light-emitting unit. Specifically, the groove 301 corresponding to the through hole 131 of the first electrode 4 of the first light-emitting unit is the first isolation groove 3011 corresponding to the first light-emitting unit; the groove 301 corresponding to the through hole 131 of the first electrode 4 of the second light-emitting unit is the second isolation groove 3012 corresponding to the second light-emitting unit; and the groove 301 corresponding to the through hole 131 of the first electrode 4 of the third light-emitting unit is the third isolation groove 3013 corresponding to the third light-emitting unit. Several optional embodiments of the protective layer 231 covering the isolation groove 301 are described below.

[0204] In a first embodiment, referring to Figures 6 and 7, the protective layer 231 includes a first protective layer 2311 corresponding to the first packaging unit 911, a second protective layer 2312 corresponding to the second packaging unit 912, and a third protective layer 2313 corresponding to the third packaging unit 913. The first protective layer 2311 covers the first isolation groove 3011, the second protective layer 2312 covers the second isolation groove 3012, and the third protective layer 2313 covers the third isolation groove 3013. The first protective layer 2311 is connected to the first packaging unit 911, therefore, the first protective layer 2311 corresponds to the first packaging unit 911; the second protective layer 2312 is connected to the second packaging unit 912, therefore, the second protective layer 2312 corresponds to the second packaging unit 912; and the third protective layer 2313 is connected to the third packaging unit 913, therefore, the third protective layer 2313 corresponds to the third packaging unit 913.

[0205] In the second embodiment, please refer again to Figures 6 and 7. The first protective layer 2311 includes a first protective portion 23111 corresponding to the first packaging unit 911, a second protective portion 23112 corresponding to the second packaging unit 912, and a third protective portion 23113 corresponding to the third packaging unit 913. The first protective portion 23111 covers the first isolation groove 3011, the second protective portion 23112 covers the second isolation groove 3012, and the third protective portion 23113 covers the third isolation groove 3013.

[0206] In the third embodiment, please refer to Figures 8-9. The first protective part 23111 covers the first isolation groove 3011 and the second isolation groove 3012, and the second protective part 23112 covers the third isolation groove 3013.

[0207] In the fourth embodiment, please refer to Figures 10-11. The first protective part 23111 covers the first isolation groove 3011, and the second protective part 23112 covers the second isolation groove 3012 and the third isolation groove 3013.

[0208] In the fifth embodiment, please refer to Figures 12-14. The first protective part 23111 covers the first isolation groove 3011, the second isolation groove 3012, and the third isolation groove 3013.

[0209] In the sixth embodiment, please refer to Figures 15-17. The second isolation groove 3012 is located on the side of the second light-emitting unit close to the first light-emitting unit, and the first protective part 23111 and the second protective part 23112 are integrally structured.

[0210] Optionally, the second isolation groove 3012 is located on the side of the second light-emitting unit closer to the first light-emitting unit, and the third isolation groove 3013 is located on the side of the third light-emitting unit closer to the first light-emitting unit. The first protective part 23111, the second protective part 23112, and the third protective part 23113 are integrally formed. In this way, the connection between the first protective part 23111, the second protective part 23112, and the third protective part 23113 is more stable, thereby providing more effective protection for the first isolation groove 3011, the second isolation groove 3012, and the third isolation groove 3013.

[0211] According to any of the foregoing embodiments of the first aspect of this application, the first isolation groove 3011 and the second isolation groove 3012 are located between the first light-emitting unit and the second light-emitting unit, and the first protective part 23111 and the second protective part 23112 are integrally structured.

[0212] According to any of the foregoing embodiments of the first aspect of this application, the second isolation groove 3012 and the third isolation groove 3013 are located between the second light-emitting unit and the third light-emitting unit, and the second protective part 23112 and the third protective part 23113 are integrally structured.

[0213] By concentrating the first isolation groove 3011, the second isolation groove 3012, and the third isolation groove 3013 together, the protective effect of the first protective part 23111, the second protective part 23112, and the third protective part 23113 on the first isolation groove 3011, the second isolation groove 3012, and the third isolation groove 3013 can be improved.

[0214] According to any of the foregoing embodiments of the first aspect of this application, the first protective layer 231 and the first encapsulation unit 911 are of the same layer and the same material.

[0215] In this embodiment, the first protective part 23111, the second protective part 23112, and the third protective part 23113 can be formed simultaneously with the formation of the first packaging unit 911, thereby eliminating the need for a dedicated process for forming the first protective part 23111, the second protective part 23112, and the third protective part 23113, and thus reducing the cost of forming the first protective part 23111, the second protective part 23112, and the third protective part 23113.

[0216] In the seventh embodiment, please refer to Figures 15, 18-19. Based on the sixth embodiment, the second protective layer 2312 includes a fourth protective portion 23121 corresponding to the first packaging unit 911, a fifth protective portion 23122 corresponding to the second packaging unit 912, and a sixth protective portion 23123 corresponding to the third packaging unit 913. The fourth protective portion 23121 covers the first isolation groove 3011, the fifth protective portion 23122 covers the second isolation groove 3012, and the sixth protective portion 23123 covers the third isolation groove 3013. The fourth protective portion 23121 is located on the side of the first protective portion 23111 away from the substrate 1, the fifth protective portion 23122 is located on the side of the second protective portion 23112 away from the substrate 1, and the sixth protective portion 23123 is located on the side of the third protective portion 23113 away from the substrate 1.

[0217] Thus, the fourth protective part 23121 and the first protective part 23111 jointly protect the first isolation groove 3011, the fifth protective part 23122 and the second protective part 23112 jointly protect the second isolation groove 3012, and the sixth protective part 23123 and the third protective part 23113 jointly protect the third isolation groove 3013, thereby further improving the protection effect on the first isolation groove 3011, the second isolation groove 3012 and the third isolation groove 3013.

[0218] According to any of the foregoing embodiments of the first aspect of this application, the second isolation groove 3012 is located on the side of the second light-emitting unit close to the first light-emitting unit, and the fourth protective part 23121 and the fifth protective part 23122 are integrally structured.

[0219] According to any of the foregoing embodiments of the first aspect of this application, the second isolation groove 3012 is located on the side of the second light-emitting unit close to the first light-emitting unit, the third isolation groove 3013 is located on the side of the second light-emitting unit close to the first light-emitting unit, and the fourth protection part 23121, the fifth protection part 23122 and the sixth protection part 23123 are integrally structured.

[0220] In this way, the stability of the fourth protective part 23121, the fifth protective part 23122 and the sixth protective part 23123 can be improved, thereby further improving the protection effect on the first isolation groove 3011, the second isolation groove 3012 and the third isolation groove 3013.

[0221] According to any of the foregoing embodiments of the first aspect of this application, the first isolation groove 3011 and the second isolation groove 3012 are located between the first light-emitting unit and the second light-emitting unit, and the fourth protection part 23121 and the fifth protection part 23122 are integrally structured.

[0222] In this way, by bringing the first isolation groove 3011 and the second isolation groove 3012 together, the protective effect of the first isolation groove 3011 and the second isolation groove 3012 can be improved.

[0223] Optionally, the second isolation groove 3012 and the third isolation groove 3013 are located between the second light-emitting unit and the third light-emitting unit, and the fifth protection part 23122 and the sixth protection part 23123 are integrally structured.

[0224] In this way, by bringing the second isolation groove 3012 and the third isolation groove 3013 together, the protective effect on the second isolation groove 3012 and the third isolation groove 3013 can be improved.

[0225] According to any of the foregoing embodiments of the first aspect of this application, the second protective layer 2312 and the second encapsulation unit 912 are of the same layer and material.

[0226] In this embodiment, the second protective layer 2312 can be formed at the same time as the second packaging unit 912, so there is no need to set up a special process to form the second protective layer 2312.

[0227] In the eighth embodiment, please refer to Figures 15, 17, and 20. Based on the sixth embodiment, the second protective layer 2312 includes a fourth protective portion 23121 corresponding to the first packaging unit 91 and a fifth protective portion 23122 corresponding to the second packaging unit 912. The third protective layer 2313 includes a seventh protective portion 23131 corresponding to the third packaging unit 913. The fourth protective portion 23121 covers the first isolation groove 3011, the fifth protective portion 23122 covers the second isolation groove 3012, and the seventh protective portion 23131 covers the third isolation groove 3013. The fourth protective portion 23121 is located on the side of the first protective portion 23111 away from the substrate 1, the fifth protective portion 23122 is located on the side of the second protective portion 23112 away from the substrate 1, and the seventh protective portion 23131 is located on the side of the third protective portion 23113 away from the substrate 1.

[0228] Thus, the fourth protective part 23121 and the first protective part 23111 jointly protect the first isolation groove 3011, the fifth protective part 23122 and the second protective part 23112 jointly protect the second isolation groove 3012, and the seventh protective part 23131 and the third protective part 23113 jointly protect the third isolation groove 3013, thereby further improving the protection effect on the first isolation groove 3011, the second isolation groove 3012 and the third isolation groove 3013.

[0229] According to any of the foregoing embodiments of the first aspect of this application, the first isolation groove 3011 and the third isolation groove 3013 are located between the first light-emitting unit and the third light-emitting unit, and the third protection part 23113 and the first protection part 23111 are integrally structured.

[0230] According to any of the foregoing embodiments of the first aspect of this application, the third protective layer 2313 and the third encapsulation unit 91 are of the same layer and the same material.

[0231] In this embodiment, a third protective layer 2313 can be formed at the same time as the third packaging unit 91, so there is no need to set up a special process to form the third protective layer 2313.

[0232] All of the above different implementation methods can enable the protective layer 231 to more effectively protect the corresponding isolation groove 301, making the isolation structure 3 at the isolation groove 301 less likely to be over-etched, thereby further making the light-emitting unit 7 less likely to fail to be encapsulated.

[0233] According to any of the foregoing embodiments of the first aspect of this application, please refer to FIG21, the protective layer 231 has a fifth groove 901 on the side away from the substrate 1, and the orthographic projection of the fifth groove 901 on the substrate corresponds to the orthographic projection of the isolation groove 901 on the substrate.

[0234] Since an isolation groove 301 is formed on the side of the isolation structure 3 away from the substrate, the protective layer 231 on the side of the isolation structure 3 away from the substrate will be recessed towards the substrate 1 at the isolation groove 301. Therefore, a fifth groove 901 will be formed at the position of the packaging unit 91 corresponding to the isolation groove 301, and the shape of the fifth groove 901 is similar to that of the isolation groove 301.

[0235] In some possible implementations, please refer to FIG22. The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked sequentially along the direction away from the substrate. The orthographic projection of the side of the first isolation portion 31 away from the substrate on the substrate is located within the orthographic projection of the second isolation portion 32 on the substrate. The isolation groove 301 is located on the side of the second isolation portion 32 away from the substrate. The side of the first isolation portion 31 away from the substrate is also provided with a third groove 311. The orthographic projection of the isolation groove 301 on the substrate is located within the orthographic projection of the third groove 311 on the substrate.

[0236] Since the second isolation portion 32 is located on the side of the first isolation portion 31 away from the substrate, and the lateral width of the second isolation portion 32 is greater than the lateral width of the first isolation portion 31, the second isolation portion 32 will disconnect the light-emitting functional layer and the second electrode layer at the isolation structure 3. Thus, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 makes it easier to independently package each light-emitting unit 7, thereby improving the packaging yield of the display panel.

[0237] A third groove 311 is naturally formed on the side of the first isolation portion 31 at the second groove 202 on the pixel defining layer 2 away from the substrate, and an isolation groove 301 is naturally formed on the side of the second isolation portion 32 at the third groove 311 away from the substrate. Therefore, the orthogonal projection of the isolation groove 301 on the substrate is located within the orthogonal projection of the third groove 311 on the substrate.

[0238] According to any of the foregoing embodiments of the first aspect of this application, please refer again to FIG21, the orthographic projection of the via 131 on the substrate is located on the orthographic projection of the first isolation portion 31 on the substrate and is close to the side of the corresponding light-emitting unit.

[0239] For example, the first light-emitting unit and the second light-emitting unit are arranged adjacent to each other. The distance between the via 131 corresponding to the second light-emitting unit and the second light-emitting unit is closer than the distance between the via 131 corresponding to the second light-emitting unit and the first light-emitting unit. In this way, the encapsulation unit 91 corresponding to the second light-emitting unit can cover the corresponding via 131 by extending a shorter distance, thereby better protecting the isolation structure at the corresponding isolation groove 301.

[0240] According to any of the foregoing embodiments of the first aspect of this application, the distance D3 between the orthographic projection of the via 131 on the substrate and the orthographic projection of the corresponding first isolation portion 31 at the edge of the end face away from the substrate on the substrate is greater than 0.5 μm.

[0241] For example, in Figure 22, the end face of the first isolation portion 31 away from the substrate has two edges. The distance between the via 131 and one edge of the corresponding end face of the first isolation portion 31 away from the substrate is distance D3, and the distance between the via 131 and the other edge of the end face of the first isolation portion 31 away from the substrate is distance D4.

[0242] In this embodiment, the distance between the orthographic projection of the via 131 on the substrate and the orthographic projection of the corresponding edge of the first isolation portion 31 away from the substrate on the substrate refers to the distance D3 that is closer to the edge of the first isolation portion 31 away from the substrate. The distance D3 can be 0.6μm, 0.7μm, 0.8μm, 0.9μm, or 1μm, etc. Properly setting the distance D3 can improve the protection effect of the packaging unit 91 on the corresponding isolation structure.

[0243] According to any of the foregoing embodiments of the first aspect of this application, please refer again to FIG22, the second electrode 6 of the light-emitting unit 7 is electrically connected to the first isolation portion 31. The first isolation portion 31 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the sidewall of the first isolation portion 31, so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the first isolation portion 31.

[0244] In some other embodiments, please refer to FIG23, the isolation structure 3 further includes a third isolation portion 33 located on the side of the first isolation portion 31 facing the substrate. The side of the third isolation portion 33 away from the substrate is provided with a fourth groove 331. The orthographic projection of the third groove 311 on the substrate is located within the orthographic projection of the fourth groove 331 on the substrate. The orthographic projection of the fourth groove 331 on the substrate is located within the orthographic projection of the second groove 202 on the substrate.

[0245] A fourth groove 331 is naturally formed on the side of the third isolation portion 33 at the second groove 202 on the pixel defining layer 2 away from the substrate, and a third groove 311 is naturally formed on the side of the first isolation portion 31 at the fourth groove 331 away from the substrate. Therefore, the orthographic projection of the third groove 311 on the substrate is located within the orthographic projection of the fourth groove 331 on the substrate, and the orthographic projection of the fourth groove 331 on the substrate is located within the orthographic projection of the second groove 202 on the substrate.

[0246] Please refer to Figure 23 again. The second electrode 6 of the light-emitting unit 7 is electrically connected to the third isolation part 33. The third isolation part 33 includes a conductive material. The second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the third isolation part 33 so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the third isolation part 33.

[0247] Specifically, the material of the third isolation portion 33 includes molybdenum metal; and / or, the material of the first isolation portion 31 includes aluminum metal; and / or, the material of the second isolation portion 32 includes titanium metal. Thus, when the isolation structure 3 isolates the second electrode layer into the second electrode 6, the second electrode 6 is more easily electrically connected to the first isolation portion 31 and / or the third isolation portion 33.

[0248] In some possible implementations, please refer again to FIG23, a plurality of packaging units 91 are spaced apart on the side of the isolation structure 3 away from the substrate, and there is a gap between the portion of the packaging units 91 on the side of the isolation structure 3 away from the substrate and the side of the isolation structure 3 away from the substrate. The orthographic projection of the packaging unit 91 on the substrate covers the orthographic projection of the isolation opening 8 on the substrate and covers the orthographic projection of the portion of the isolation structure 3 on the substrate.

[0249] During the patterning process of the light-emitting unit 7, the encapsulation unit 91 is disconnected at the isolation structure 3 to form the encapsulation unit 91. The encapsulation unit 91 can completely and independently encapsulate the corresponding light-emitting unit 7, thereby improving the display characteristics of the display panel.

[0250] In some possible implementations, please refer to FIG24, the display panel further includes a second encapsulation layer 14 located on the side of the encapsulation unit 91 away from the substrate and a third encapsulation layer 15 located on the side of the second encapsulation layer 14 away from the substrate. The materials of the encapsulation unit 91 and the third encapsulation layer 15 both include inorganic materials, and the material of the second encapsulation layer 14 includes organic materials.

[0251] For example, the encapsulation unit 91 and the third encapsulation layer 15 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 14 can be formed by inkjet printing (IJP). The second encapsulation layer 14 and the third encapsulation layer 15 can achieve a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0252] Please refer again to Figure 2. An embodiment of the second aspect of this application also provides a display panel, including a substrate 1, an isolation structure 3, a light-emitting unit 7, an encapsulation unit 91, and a protective part 9001.

[0253] The isolation structure 3 is located on one side of the substrate 1. The isolation structure 3 encloses and forms an isolation opening 8. The side of the isolation structure 3 away from the substrate 1 has an isolation groove 301. At least a portion of the light-emitting units 7 are located within the isolation opening 8.

[0254] The encapsulation unit 91 is located on the side of the light-emitting unit 7 away from the substrate 1.

[0255] The protective part 9001 is located on the side of the isolation structure 3 away from the substrate 1 and is connected to the packaging unit 91. The orthographic projection of the protective part 9001 on the substrate 1 covers at least part of the orthographic projection of the isolation groove 301 on the substrate 1.

[0256] While forming the encapsulation unit 91, a protective part 9001 can be formed. The protective part 9001 can protect the isolation structure 3 at the isolation groove 301 and play the role of etching and blocking the isolation structure 3 at the isolation groove 301, so that the isolation structure 3 at the isolation groove 301 corresponding to the light-emitting unit is not prone to over-etching, thereby making it less likely to damage the encapsulation unit 91 corresponding to the light-emitting unit and less likely to cause the light-emitting unit encapsulation to fail.

[0257] Please refer to Figure 25. An embodiment of the third aspect of this application also provides a method for manufacturing a display panel, the method comprising:

[0258] S10: Provides a substrate.

[0259] S11: An isolation structure 3 is formed on one side of the substrate. An isolation groove 301 is formed on the side of the isolation structure 3 away from the substrate 1. An isolation opening 8 is provided on the isolation structure 3.

[0260] S12: A light-emitting unit 7 is formed, which is at least partially located within the isolation opening 8; an encapsulation unit is located on the side of the light-emitting unit 7 away from the substrate 1; and a protective structure is located on the side of the isolation structure 3 away from the substrate 1. The orthogonal projection of the protective structure on the substrate 1 covers at least a portion of the orthogonal projection of the isolation groove 301 on the substrate 1. At least a portion of the encapsulation unit 91 extends from the side of the isolation structure 3 toward the isolation opening 8 to the side of the isolation structure 3 away from the substrate.

[0261] The light-emitting unit 7 includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the isolation opening 8 includes a first isolation opening 811, a second isolation opening 822, and a third isolation opening 833.

[0262] Please refer to Figure 26. The substrate includes a substrate 101. A circuit structure layer 12 is formed on one side of the substrate 101. The circuit structure layer 12 includes a plurality of circuit structures 121 spaced apart. An insulating layer 13 is formed on the side of the circuit structure layer 12 away from the substrate. Vias 131 are formed on the insulating layer 13 to expose at least a portion of the circuit structures 121. A first electrode layer is formed on the side of the insulating layer 13 away from the substrate 1. The first electrode layer includes a plurality of first electrodes 4 spaced apart. The first electrodes 4 are electrically connected to the circuit structures 121 through the vias 131.

[0263] Please refer to Figure 27. A pixel defining material layer 16 is formed on the side of the first electrode layer away from the substrate 1. A second groove 202 is formed on the side of the pixel defining material layer 16 away from the substrate 1 at the position corresponding to the via 131.

[0264] Please refer to Figure 28. An isolation material layer 17 is formed on the side of the pixel defining material layer 16 away from the substrate. An isolation groove 301 is formed on the side of the isolation material layer 17 away from the substrate at the position corresponding to the second groove 202.

[0265] Please refer to Figure 29. The isolation material layer 17 and the pixel defining material layer 16 are patterned sequentially to form the isolation structure 3 and the pixel defining layer 2, respectively. The isolation groove 301 is located on the side of the isolation structure 3 away from the substrate, and the second groove 202 is located on the side of the pixel defining layer 2 away from the substrate.

[0266] The following provides a detailed description of different embodiments that form the light-emitting unit 7 and the corresponding encapsulation unit 91.

[0267] In a first embodiment, referring to FIG30, a first light-emitting material layer is formed in the first isolation opening 811. The first light-emitting material layer extends into the second isolation opening 822 and the third isolation opening 833. The first light-emitting material layer includes a light-emitting functional layer and a second electrode layer that are sequentially stacked in the direction away from the substrate by the first light-emitting unit.

[0268] The light-emitting functional layer is broken at the isolation structure 3, so that at least part of the light-emitting functional layer is located in the isolation opening 8 to form the light-emitting part 5. By controlling the evaporation angle, the light-emitting part 5 can be prevented from contacting the isolation structure 3.

[0269] The second electrode layer is broken at the isolation structure 3, so that at least part of the second electrode layer is located within the isolation opening 8 to form the second electrode 6. By controlling the evaporation angle, the second electrode 6 can extend from the isolation opening 8 to make electrical contact with the isolation structure 3, so as to connect to adjacent second electrodes 6 or connect the second electrode 6 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0270] Please refer to Figure 31, where a first encapsulation unit material layer 18 is formed on the side of the first light-emitting material layer away from the substrate.

[0271] Please refer to Figure 32. A first etched protective layer 19 is formed on the side of the first packaging unit material layer 18 located away from the substrate 1. The orthographic projection of the first etched protective layer 19 on the substrate 1 covers the orthographic projection of the first isolation groove 3011 on the isolation structure 3 corresponding to the first light-emitting unit on the substrate 1.

[0272] The first etched protective layer 19 can protect the corresponding light-emitting functional layer, the second electrode layer, and the first encapsulation unit material layer 18 of the first light-emitting unit.

[0273] Please refer to Figure 33. The first packaging unit material layer 18 and the first light-emitting material layer not covered by the first etch protection layer 19 are etched away. Then the first etch protection layer 19 is removed, thereby forming the light-emitting part 5, the second electrode 6, the first packaging unit 911, and the first protective layer 2311, which are at least partially located within the first isolation opening 811. The orthographic projection of the first protective layer 2311 on the substrate covers the orthographic projection of the first isolation groove 3011 on the substrate 1. The first protective layer 2311 is connected to the first packaging unit 911.

[0274] After removing the first encapsulation unit material layer 18, the light-emitting functional layer, and the second electrode layer that are not covered by the first etched protective layer 19, the first electrode 4, the light-emitting part 5 of the first light-emitting unit, and the second electrode 6 form the first light-emitting unit. The first light-emitting unit is completely covered by the encapsulation unit 91, thereby reducing the risk of the vapor-deposited material entering the vapor-deposited equipment after being exposed to the air, causing equipment contamination and film breakage.

[0275] In this way, without the need for a precision mask, the light-emitting part 5, the second electrode 6 and the encapsulation unit 91 can be formed only in the first isolation opening 811 corresponding to the first light-emitting unit, and the second electrode 6 can be electrically connected to the isolation structure 3, thereby enabling the first light-emitting unit to be formed in the first isolation opening 811 corresponding to the first light-emitting unit at a lower cost.

[0276] Since the orthographic projection of the first etched protective layer 19 on the substrate 1 covers the orthographic projection of the first isolation groove 3011 on the substrate, the orthographic projection of the first protective layer 2311 on the substrate 1 covers the orthographic projection of the first isolation groove 3011 on the substrate 1.

[0277] Please refer to Figure 34. A second light-emitting material layer is formed within the second isolation opening 822. The second light-emitting material layer extends to the side of the first light-emitting unit away from the substrate and into the third isolation opening 833. The second light-emitting material layer includes a light-emitting functional layer and a second electrode layer that are sequentially stacked in the direction away from the substrate.

[0278] Please refer to Figure 35, where a second encapsulation unit material layer 25 is formed on the side of the second light-emitting material layer away from the substrate.

[0279] Please refer to Figure 36. A second etch protection layer 20 is formed on the side of the second packaging unit material layer 25 located away from the substrate in the second light-emitting unit. The second etch protection layer 20 covers the second light-emitting unit and the second isolation groove 3012.

[0280] Please refer to Figure 37. Remove the second packaging unit material layer 25 and the second light-emitting material layer that are not covered by the second etch protection layer 20, and remove the second etch protection layer 20. Then, form the light-emitting part 5 of the second light-emitting unit, the second electrode 6, the second packaging unit 912, and the second protective layer 2312 in the second isolation opening 822. The orthographic projection of the second protective layer 2312 on the substrate covers the orthographic projection of the second isolation groove 3012 on the substrate 1. The second protective layer 2312 is connected to the second packaging unit 912.

[0281] Since the orthographic projection of the first protective layer 2311 on the substrate 1 covers the orthographic projection of the first isolation groove 3011 on the substrate 1, the first protective layer 2311 can protect the isolation structure 3 at the first isolation groove 3011 during the process of removing the second packaging unit material layer 25 and the second light-emitting material layer that are not covered by the second etched protective layer 20, making it less likely to be over-etched, thus making it less likely to damage the first packaging unit 911, thereby improving the packaging effect of the first light-emitting unit.

[0282] Since the orthographic projection of the second etched protective layer 20 on the substrate 1 covers the orthographic projection of the second isolation groove 3012 on the substrate 1, the orthographic projection of the second protective layer 2312 on the substrate 1 covers the orthographic projection of the second isolation groove 3012 on the substrate 1.

[0283] Please refer to Figure 38. A third light-emitting material layer is formed within the third isolation opening 833. The third light-emitting material layer extends to the side of the first light-emitting unit and the second light-emitting unit away from the substrate. The third light-emitting material layer includes a light-emitting functional layer and a second electrode layer that are sequentially stacked in the direction away from the substrate.

[0284] Please refer to Figure 39, where a third encapsulation unit material layer 26 is formed on the side of the third light-emitting material layer away from the substrate.

[0285] Please refer to Figure 40. A third etch protection layer 21 is formed on the side of the third packaging unit material layer 26 located in the third light-emitting unit away from the substrate 1. The orthographic projection of the third etch protection layer 21 on the substrate covers the orthographic projection of the third light-emitting unit and the third isolation groove 3013 on the substrate 1.

[0286] Please refer to Figure 7 again. Remove the third packaging unit material layer 26 and the third light-emitting material layer that are not covered by the third etch protection layer 21, and remove the third etch protection layer 21. Then, form the light-emitting part 5, the second electrode 6, the third packaging unit 913 and the third protection layer 2313 of the third light-emitting unit in the third isolation opening 833. The orthographic projection of the third protection layer 2313 on the substrate covers the orthographic projection of the third isolation groove 3013 on the substrate 1. The third protection layer 2313 is connected to the third packaging unit 913.

[0287] Since the orthographic projection of the first protective layer 2311 on the substrate covers the orthographic projection of the first isolation groove 3011 on the substrate 1, and the orthographic projection of the second protective layer 2312 on the substrate covers the orthographic projection of the second isolation groove 3012 on the substrate 1, during the process of removing the second encapsulation material layer and the third light-emitting material layer not covered by the third etched protective layer 21, the first protective layer 2311 can protect the isolation structure 3 at the first isolation groove 3011, and the second protective layer 2312 can protect the isolation structure 3 at the second isolation groove 3012, making it less likely for the isolation structure 3 at the first isolation groove 3011 and the second isolation groove 3012 to be over-etched, thereby making it less likely to damage the encapsulation unit 91 of the first light-emitting unit and the second light-emitting unit, and thus improving the encapsulation effect of the first light-emitting unit and the second light-emitting unit.

[0288] Since the third etched protective layer 21 covers the third isolation groove 3013, the orthogonal projection of the third protective layer 2313 on the substrate covers the orthogonal projection of the third isolation groove 3013 on the substrate 1. The third protective layer 2313 can protect the isolation structure 3 at the third isolation groove 3013, thereby improving the third light-emitting unit.

[0289] In this embodiment, the orthographic projection of the protective layer of the encapsulation unit 91 of each light-emitting unit 7 in the display panel formed by the above method onto the substrate 1 covers the orthographic projection of the isolation groove 301 corresponding to the light-emitting unit 7 onto the substrate. This makes it less likely that the isolation structure 3 at the isolation groove 301 corresponding to the light-emitting unit 7 will be over-etched, thereby making it less likely to damage the encapsulation unit 91 of the light-emitting unit 7. This can improve the encapsulation effect of the light-emitting unit 7 and ultimately improve the display effect of the display panel.

[0290] In the second embodiment, please refer to FIG41. A first light-emitting material layer, a first encapsulation unit material layer and a fourth etch protection layer 22 are sequentially formed in the first isolation opening 81 in a direction away from the substrate. The orthogonal projection of the fourth etch protection layer 22 on the substrate covers the orthogonal projections of the first light-emitting unit, the first isolation groove 3011 and the second isolation groove 3012 on the substrate 1.

[0291] Please refer to Figure 42. Remove the first packaging unit material layer and the first light-emitting material layer that are not covered by the fourth etched protective layer 22, and then remove the fourth etched protective layer 22. Thus, the light-emitting part of the first light-emitting unit, the second electrode, and the first protective part 23111 of the first packaging unit and the first protective layer 23111 are formed in the first isolation opening 81. The orthogonal projection of the first protective part 23111 of the first protective layer 23111 on the substrate covers the orthogonal projection of the first isolation groove 3011 and the second isolation groove 3012 on the substrate 1.

[0292] Please refer to Figure 43. A second light-emitting unit and a second encapsulation unit 912 and a fifth protective portion 9122 of the second protective layer 2312 are formed in the second isolation opening 82. The orthographic projection of the fifth protective portion 9122 of the second protective layer 2312 on the substrate covers the orthographic projection of the third isolation groove 3013 on the substrate 1.

[0293] In this embodiment, the orthographic projection of the first protective part 23111 on the substrate in the display panel formed by the above method covers the orthographic projection of the first isolation groove 3011 and the second isolation groove 3012 on the substrate 1, and the orthographic projection of the fifth protective part 9122 on the substrate covers the orthographic projection of the third isolation groove 3013 on the substrate 1. This makes it less likely that the isolation structure 3 at the isolation groove 301 corresponding to the light-emitting unit 7 will be over-etched, thereby making it less likely to damage the packaging unit 91 of the light-emitting unit 7. This can improve the packaging effect of the light-emitting unit 7 and ultimately improve the display effect of the display panel.

[0294] In the third embodiment, please refer to FIG44, a first light-emitting unit is formed at least partially located in the first isolation opening 81, and a first packaging unit 911 and a first protective part 23111 are located on the side of the first light-emitting unit away from the substrate. The orthogonal projection of the first protective part 23111 on the substrate covers the orthogonal projection of the first isolation groove 3011 on the substrate 1.

[0295] Please refer to Figure 45. A second light-emitting unit and a second encapsulation unit 91 and a fifth protective part 9122 are formed in the second isolation opening 82. The orthogonal projection of the fifth protective part 9122 on the substrate covers the orthogonal projections of the second isolation groove 3012 and the third isolation groove 3013 on the substrate 1.

[0296] A third light-emitting unit and a third encapsulation unit 913 are formed in the third isolation opening 83. The orthogonal projection of the encapsulation unit 91 of the third light-emitting unit on the substrate is outside the orthogonal projection of the isolation groove 301 on the substrate.

[0297] In this embodiment, the orthographic projection of the first protective part 23111 on the substrate in the display panel formed by the above method covers the orthographic projection of the first isolation groove 3011 on the substrate 1, and the orthographic projection of the fifth protective part 9122 on the substrate covers the orthographic projections of the second isolation groove 3012 and the third isolation groove 3013 on the substrate. This makes it less likely that the isolation structure 3 at the isolation groove 301 corresponding to the light-emitting unit 7 will be over-etched, thereby making it less likely to damage the packaging unit 91 of the light-emitting unit 7. This can improve the packaging effect of the light-emitting unit 7 and ultimately improve the display effect of the display panel.

[0298] In the fourth embodiment, referring to FIG46, a first light-emitting unit and a first encapsulation unit 911 are formed in the first isolation opening 81. The first protective layer 23111 has a first protective portion 23111, a second protective portion 23112, and a third protective portion 23113. The orthographic projection of the first protective portion 23111 on the substrate covers the orthographic projection of the first isolation groove 3011 on the substrate 1. The orthographic projection of the second protective portion 23112 on the substrate 1 covers the orthographic projection of the second isolation groove 3012 on the substrate 1. The orthographic projection of the third protective portion 23113 on the substrate 1 covers the orthographic projection of the third isolation groove 3013 on the substrate 1. The first protective portion 23111, the second protective portion 23112, and the third protective portion 23113 are disposed in the same layer as the first encapsulation unit 911, so the first protective portion 23111, the second protective portion 23112, and the third protective portion 23113 can be formed at the same time as the first encapsulation unit 911.

[0299] Please refer to Figure 47. A second light-emitting unit and a second packaging unit 912 are formed in the second isolation opening 82. The orthographic projection of the second packaging unit 912 on the substrate 1 is outside the orthographic projection of the second isolation groove 3012 on the substrate 1.

[0300] Please refer to Figure 48. A third light-emitting unit and a third packaging unit 913 are formed in the third isolation opening 83. The orthographic projection of the third packaging unit 913 on the substrate 1 is outside the orthographic projection of the third isolation groove 3013 on the substrate 1.

[0301] In this embodiment, the orthographic projections of the first protective part 23111, the second protective part 23112, and the third protective part 23113 on the substrate in the display panel formed by the above method respectively cover the orthographic projections of the first isolation groove 3011, the second isolation groove 3012, and the third isolation groove 3013 on the substrate 1. This makes it less likely that the isolation structure 3 at the isolation groove 301 corresponding to the light-emitting unit 7 will be over-etched, thereby making it less likely to damage the packaging unit 91 of the light-emitting unit 7. This can improve the packaging effect of the light-emitting unit 7 and ultimately improve the display effect of the display panel.

[0302] Based on the above method, the orthogonal projection of the first etched protective layer 19 on the substrate 1 can also cover the orthogonal projections of the corresponding second isolation groove 3012 and third isolation groove 3013 on the substrate 1, ultimately forming the display panel shown in Figures 15-17.

[0303] The orthogonal projection of the second etched protective layer 20 on the substrate 1 can cover the orthogonal projections of the corresponding second light-emitting unit, the first isolation groove 3011, the second isolation groove 3012 and the third isolation groove 3013 on the substrate 1, and finally form the display panel shown in Figures 18 and 19.

[0304] In one possible implementation, after forming the light-emitting unit at least partially located within the isolation opening, the encapsulation unit 91 located on the side of the light-emitting unit away from the substrate 1, and the protective structure 23 located on the side of the isolation structure 3 away from the substrate 1, the method further includes:

[0305] After removing the protective structure 23, the final display panel shown in Figure 49 is formed.

[0306] An embodiment of the fourth aspect of this application also provides an electronic device, which includes the display panel described in this application, or includes a display panel prepared by the method described in this application. This electronic device may include a device with image processing capabilities, such as a server, personal computer, laptop computer, etc. Because this electronic device includes the display panel described in this application, it has better packaging and display quality.

[0307] Those skilled in the art will understand that the above embodiments are exemplary and not restrictive. Different technical features appearing in different embodiments can be combined to achieve beneficial effects. Based on a study of the drawings, specification, and claims, those skilled in the art should be able to understand and implement other variations of the disclosed embodiments. In the claims, the term "comprising" does not exclude other means or steps; "article" without the use of a quantifier is intended to include one or more articles and can be used interchangeably with "one or more articles"; the terms "first" and "second" are used to identify names and not to indicate any particular order. Any reference numerals in the claims should not be construed as limiting the scope of protection. The functionality of multiple parts appearing in the claims can be implemented by a single hardware or software module. The appearance of certain technical features in different dependent claims does not mean that these technical features cannot be combined to achieve beneficial effects.

Claims

1. A display panel, comprising: a substrate; an isolation structure located on a side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure having an isolation groove on a side away from the substrate; a light emitting unit located at least partially in the isolation opening; an encapsulation unit located on a side of the light emitting unit away from the substrate; a protection structure located on a side of the isolation structure away from the substrate, a footprint of the protection structure on the substrate covering at least partially a footprint of the isolation groove on the substrate.

2. The display panel of claim 1, wherein, the protection structure comprises a protection layer of a same material as the encapsulation unit, the footprint of the isolation groove on the substrate being located within the footprint of the protection layer on the substrate; a minimum distance between an edge of the footprint of the isolation groove on the substrate and an edge of the footprint of the protection layer on the substrate is greater than or equal to 0 pm.

3. The display panel of claim 2, wherein, the protection structure further comprises a first auxiliary protection layer located between the protection layer and the isolation structure; a footprint of the first auxiliary protection layer on the substrate covers at least partially the footprint of the isolation groove on the substrate; the light emitting unit comprises a first electrode, a light emitting part and a second electrode stacked on a side of the substrate; a material of the first auxiliary protection layer is the same as a material of the light emitting part.

4. The display panel of claim 3, wherein, the protection structure further comprises a second auxiliary protection layer located between the protection layer and the first auxiliary protection layer; a footprint of the second auxiliary protection layer on the substrate covers at least partially the footprint of the isolation groove on the substrate; a material of the second auxiliary protection layer is the same as a material of the second electrode.

5. The display panel of claim 1, wherein, the light emitting unit comprises a first light emitting unit, a second light emitting unit and a third light emitting unit, the encapsulation unit comprises a first encapsulation unit corresponding to the first light emitting unit, a second encapsulation unit corresponding to the second light emitting unit and a third encapsulation unit corresponding to the third light emitting unit; the protection layer comprises at least one of the protection layer corresponding to one of the first encapsulation unit, the second encapsulation unit and the third encapsulation unit, one of the at least one of the protection layer covering the isolation groove corresponding to one, two or three of the light emitting unit; the protection layer comprises two of the protection layer corresponding to one of the first encapsulation unit, the second encapsulation unit and the third encapsulation unit, the two of the protection layer partially overlapping.

6. The display panel of claim 1, wherein, the light emitting unit comprises a first light emitting unit, a second light emitting unit and a third light emitting unit, the encapsulation unit comprises a first encapsulation unit corresponding to the first light emitting unit, a second encapsulation unit corresponding to the second light emitting unit and a third encapsulation unit corresponding to the third light emitting unit; the isolation groove comprises a first isolation groove corresponding to the first light emitting unit, a second isolation groove corresponding to the second light emitting unit and a third isolation groove corresponding to the third light emitting unit.

7. The display panel of claim 6, wherein, The protection layer comprises a first protection layer, a second protection layer and a third protection layer; the first protection layer covers the first isolation groove, the second protection layer covers the second isolation groove, and the third protection layer covers the third isolation groove.

8. The display panel of claim 6, wherein, The protection layer comprises a first protection layer, a second protection layer and a third protection layer; the first protection layer covers the first isolation groove, the second protection layer covers the second isolation groove, and the third protection layer covers the third isolation groove. The second isolation groove is located on the side of the second light emitting unit close to the first light emitting unit, and the first protection part and the second protection part are in an integrated structure; or the second isolation groove is located on the side of the second light emitting unit close to the first light emitting unit, and the third isolation groove is located on the side of the third light emitting unit close to the first light emitting unit, and the first protection part, the second protection part and the third protection part are in an integrated structure.

9. The display panel of claim 8, wherein, The protection layer further comprises a second protection layer, and the second protection layer comprises a fourth protection part corresponding to the first packaging unit, a fifth protection part corresponding to the second packaging unit and a sixth protection part corresponding to the third packaging unit; the fourth protection part covers the first isolation groove, the fifth protection part covers the second isolation groove, and the sixth protection part covers the third isolation groove; the fourth protection part is located on the side of the first protection part away from the substrate, the fifth protection part is located on the side of the second protection part away from the substrate, and the sixth protection part is located on the side of the third protection part away from the substrate. The second isolation groove is located on the side of the second light emitting unit close to the first light emitting unit, and the first protection part and the second protection part are in an integrated structure; or the second isolation groove is located on the side of the second light emitting unit close to the first light emitting unit, and the third isolation groove is located on the side of the third light emitting unit close to the first light emitting unit, and the first protection part, the second protection part and the third protection part are in an integrated structure.

10. The display panel of claim 8, wherein, The protection layer further comprises a second protection layer and a third protection layer, the second protection layer comprises a fourth protection part corresponding to the first packaging unit and a fifth protection part corresponding to the second packaging unit, and the third protection layer comprises a seventh protection part corresponding to the third packaging unit; the fourth protection part covers the first isolation groove, the fifth protection part covers the second isolation groove, and the seventh protection part covers the third isolation groove; the fourth protection part is located on the side of the first protection part away from the substrate, the fifth protection part is located on the side of the second protection part away from the substrate, and the seventh protection part is located on the side of the third protection part away from the substrate.

11. The display panel of claim 6, wherein, The protection layer comprises a first protection layer, the first protection layer comprises a first protection part corresponding to the first packaging unit and a second protection part corresponding to the second packaging unit; the first protection part covers the first isolation groove and the second isolation groove, and the second protection part covers the third isolation groove.

12. The display panel of claim 6, wherein, The protection layer comprises a first protection layer, the first protection layer comprises a first protection part corresponding to the first packaging unit and a second protection part corresponding to the second packaging unit; the first protection part covers the first isolation groove and the second isolation groove, and the second protection part covers the third isolation groove.

13. The display panel of claim 6, wherein, The protection layer comprises a first protection layer, the first protection layer comprises a first protection part corresponding to the first packaging unit and a second protection part corresponding to the second packaging unit; the first protection part covers the first isolation groove and the second isolation groove, and the second protection part covers the third isolation groove.

14. The display panel of claim 1, wherein, The substrate comprises a substrate, a circuit structure layer, and an insulating layer on one side of the substrate, the circuit structure layer comprises a circuit structure, the insulating layer is provided with a via hole penetrating through the insulating layer, the light emitting unit comprises a first electrode, the first electrode is electrically connected with the circuit structure through the via hole, and the orthogonal projection of the isolation groove on the substrate is located in the orthogonal projection of the via hole on the substrate. The display panel further comprises a pixel definition layer between the insulating layer and the isolation structure, a second groove is arranged on the side of the pixel definition layer away from the substrate, and the orthogonal projection of the isolation groove on the substrate is located in the orthogonal projection of the second groove on the substrate. The protection layer has a fifth groove on the side away from the substrate, and the orthogonal projection of the fifth groove on the substrate corresponds to the orthogonal projection of the isolation groove on the substrate.

15. The display panel of claim 14, wherein, The isolation structure comprises a first isolation part and a second isolation part which are sequentially stacked in the direction away from the substrate, the orthogonal projection of the side of the first isolation part away from the substrate on the substrate is located in the orthogonal projection of the second isolation part on the substrate, and the isolation groove is located on the side of the second isolation part away from the substrate. The orthogonal projection of the via hole on the substrate is located in the orthogonal projection of the first isolation part on the substrate and close to the side of the corresponding light emitting unit.

16. A display panel, comprising: a substrate; an isolation structure on one side of the substrate, the isolation structure enclosing an isolation opening, and the side of the isolation structure away from the substrate having an isolation groove; a light emitting unit at least partially located in the isolation opening; a packaging unit on the side of the light emitting unit away from the substrate; a protection part on the side of the isolation structure away from the substrate and connected with the packaging unit, and the orthogonal projection of the protection part on the substrate covering at least part of the orthogonal projection of the isolation groove on the substrate.

17. A preparation method of a display panel, comprising: providing a substrate; forming an isolation structure on one side of the substrate, the side of the isolation structure away from the substrate being provided with an isolation groove, and an isolation opening being arranged on the isolation structure; forming a light emitting unit at least partially located in the isolation opening, a packaging unit located on a side of the light emitting unit away from the substrate, and a protection structure located on a side of the isolation structure away from the substrate, wherein a footprint of the protection structure on the substrate covers at least partially a footprint of the isolation groove on the substrate.

18. The method of producing a display panel according to claim 17, wherein The steps of forming the light emitting unit at least partially located in the isolation opening, the packaging unit located on a side of the light emitting unit away from the substrate, and the protection structure located on a side of the isolation structure away from the substrate include: forming a first light emitting material layer partially located in a first isolation opening of the isolation opening, the first light emitting material layer including a light emitting functional layer and a second electrode layer; forming a first packaging unit material layer on a side of the first light emitting material layer away from the substrate; forming a patterned first etching protection layer on a side of the first packaging unit material layer of the first light emitting unit away from the substrate, wherein a footprint of the first etching protection layer on the substrate covers a footprint of the corresponding first light emitting unit and the first isolation groove on the substrate; etching to remove the first packaging unit material layer and the first light emitting material layer not covered by the first etching protection layer, and then removing the first etching protection layer, thereby forming a light emitting part of the first light emitting unit at least partially located in the first isolation opening, a second electrode, a first packaging unit, and a first protection layer, wherein a footprint of the first protection layer on the substrate covers a footprint of the first isolation groove on the substrate.

19. The method of producing a display panel according to claim 18, wherein, The footprint of the first etching protection layer on the substrate also covers a footprint of the corresponding second isolation groove and third isolation groove on the substrate; The first protection layer includes a first protection part, a second protection part, and a third protection part. The footprint of the first protection part on the substrate covers the footprint of the first isolation groove on the substrate, the footprint of the second protection part on the substrate covers the second isolation groove, and the footprint of the third protection part on the substrate covers the footprint of the third isolation groove on the substrate. At least two of the first protection part, the second protection part, and the third protection part are an integral structure.

20. The method of producing a display panel according to claim 19, wherein, After the step of etching to remove the first packaging unit material layer and the first light emitting material layer not covered by the first etching protection layer, and then removing the first etching protection layer, the method further includes: forming a second light emitting material layer partially located in the second isolation opening; forming a second packaging unit material layer on a side of the second light emitting material layer away from the substrate; forming a patterned second etching protection layer on a side of the second packaging unit material layer away from the substrate, wherein a footprint of the second etching protection layer on the substrate covers a footprint of the corresponding second light emitting unit, the first isolation groove, the second isolation groove, and the third isolation groove on the substrate; etching to remove the second encapsulation unit material layer and the second luminescent material layer not covered by the second etching protection layer, and then removing the second etching protection layer, so as to form a light emitting part of a second luminescent unit, a second electrode, a second encapsulation unit and a second protection layer of the second luminescent unit at least partially located in the second isolation recess; the second protection layer comprises a fourth protection part, a fifth protection part and a sixth protection part; a normal projection of the fourth protection part on the substrate covers a normal projection of the first isolation groove on the substrate, a normal projection of the fifth protection part on the substrate covers the second isolation groove, and a normal projection of the sixth protection part on the substrate covers a normal projection of the third isolation groove on the substrate; the fourth protection part overlaps the first protection part; the fifth protection part overlaps the second protection part; and the sixth protection part overlaps the third protection part.

21. The method of producing a display panel according to claim 17, wherein the luminescent unit comprises a first luminescent unit, a second luminescent unit and a third luminescent unit, the isolation recess comprises a first isolation groove corresponding to the first luminescent unit, a second isolation groove corresponding to the second luminescent unit and a third isolation groove corresponding to the third luminescent unit; the step of forming the luminescent unit at least partially located in the isolation recess, the encapsulation unit located on a side of the luminescent unit away from the substrate and the protection structure located on a side of the isolation structure away from the substrate comprises: forming a first luminescent material layer, a first encapsulation unit material layer and a patterned fourth etching protection layer at least partially located in the first isolation recess, a normal projection of the fourth etching protection layer on the substrate covering a normal projection of the corresponding first luminescent unit, the first isolation groove and the second isolation groove on the substrate; etching to remove the first encapsulation unit material layer and the first luminescent material layer not covered by the fourth etching protection layer, and then removing the fourth etching protection layer, so as to form a light emitting part of the first luminescent unit, a second electrode, a first encapsulation unit and a first protection layer of the first luminescent unit at least partially located in the first isolation recess, a normal projection of the first protection layer on the substrate covering a normal projection of the first isolation groove and the second isolation groove on the substrate; forming a second luminescent unit at least partially located in the second isolation recess, and a second protection layer and a second encapsulation unit located on a side of the second luminescent unit away from the substrate, a normal projection of the second protection layer on the substrate covering a normal projection of the third isolation groove on the substrate; forming a third luminescent unit at least partially located in the third isolation recess, and a third encapsulation unit located on a side of the third luminescent unit away from the substrate.

22. The method of producing a display panel according to claim 17, wherein The light emitting units include a first light emitting unit, a second light emitting unit, and a third light emitting unit, the isolation openings include a first isolation opening, a second isolation opening, and a third isolation opening; the isolation grooves include a first isolation groove corresponding to the first light emitting unit, a second isolation groove corresponding to the second light emitting unit, and a third isolation groove corresponding to the third light emitting unit; The step of forming the light emitting units at least partially located in the isolation openings, the encapsulation units located on a side of the light emitting units away from the substrate, and the protection structures located on a side of the isolation structures away from the substrate, includes: forming a first light emitting unit at least partially located in the first isolation opening, and a first protection layer and a first encapsulation unit located on a side of the first light emitting unit away from the substrate, a normal projection of the first protection layer on the substrate covering normal projections of the first isolation groove, the second isolation groove, and the third isolation groove on the substrate; forming a second light emitting unit at least partially located in the second isolation opening, and a second encapsulation unit located on a side of the second light emitting unit away from the substrate; forming a third light emitting unit at least partially located in the third isolation opening, and a third encapsulation unit located on a side of the third light emitting unit away from the substrate.

23. The method of producing a display panel according to claim 17, wherein After the step of forming the light emitting units at least partially located in the isolation openings, the encapsulation units located on a side of the light emitting units away from the substrate, and the protection structures located on a side of the isolation structures away from the substrate, further includes: removing the protection structures.

24. An electronic device comprising the display panel of claim 1.

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