Housing apparatus and electronic device

Abstract

The present application provides a housing apparatus and an electronic device. The housing apparatus comprises a middle frame, a rear cover, a loudspeaker module, and a heat dissipation device. The rear cover is fixedly connected to the periphery of the middle frame, and encloses an internal space together with the middle frame. The loudspeaker module and the heat dissipation device both are arranged in the internal space. A sound outlet hole of the middle frame is communicated with the internal space of the housing apparatus and an external space of the housing apparatus. The loudspeaker module comprises a first cavity and a second cavity that are insulated from each other, and the first cavity of the loudspeaker module is communicated with the sound outlet hole. The housing apparatus further comprises a power device, and the outlet of the second cavity is arranged closer to the power device than the heat dissipation device. Alternatively, the housing apparatus further comprises a power device and a first heat conducting member, the outlet of the second cavity is arranged closer to the heat dissipation device than the power device, a portion of the first heat conducting member is connected to the power device, and a portion of the first heat conducting member is arranged closer to the outlet of the second cavity than the heat dissipation device. The housing apparatus of the present application can improve the heat dissipation efficiency and save the internal space of the whole apparatus.

Description

Housing device and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411001073.2, filed on July 24, 2024, entitled "Housing device and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of electronic devices, and in particular, to a housing device and an electronic device. BACKGROUND

[0003] Currently, electronic devices on the market usually have a fan or a heat conduction device arranged inside the electronic device for heat dissipation. In order to meet the increasing heat dissipation demand of the electronic device, a larger fan or heat conduction device needs to be used to improve the heat dissipation efficiency, which increases the space ratio of the fan or heat conduction device in the whole machine. SUMMARY

[0004] Embodiments of the present application provide a housing device and an electronic device, which can balance the heat dissipation efficiency and save the internal space of the whole machine.

[0005] In a first aspect, a housing device is provided. The housing device includes a middle frame, a back cover, a loudspeaker module, and a heat dissipation device. The back cover is fixedly connected to the periphery of the middle frame and surrounds an internal space of the housing device with the middle frame, the loudspeaker module and the heat dissipation device are arranged in the internal space, the middle frame has a sound hole, the sound hole communicates the internal space of the housing device with an external space of the housing device, the loudspeaker module includes a first cavity and a second cavity which are isolated from each other, and the first cavity of the loudspeaker module communicates with the sound hole. The housing device further includes a power device, and an outlet of the second cavity is arranged closer to the power device than to the heat dissipation device; or the housing device further includes a power device and a first heat conduction device, an outlet of the second cavity is arranged closer to the heat dissipation device than to the power device, a part of the first heat conduction device is connected to the power device, and a part of the first heat conduction device is arranged closer to the outlet of the second cavity than to the heat dissipation device.

[0006] It can be understood that the loudspeaker module of the embodiment includes a first cavity and a second cavity which are isolated from each other. The first cavity is in communication with the external environment through the sound hole, and the second cavity is in communication with the internal space of the shell device, and the outlet of the second cavity is arranged close to the power device or the first heat conduction member compared with the heat dissipation member. In this way, when the loudspeaker module works and the first cavity inhales air from the external environment, the second cavity will exhaust air to the internal space of the shell device, and the exhaust air can flow through the power device or the first heat conduction member and absorb part of the heat generated by the power device to form hot air. The formed hot air can be discharged to the external environment through the heat dissipation member to achieve heat dissipation of the power device.

[0007] In this way, compared with the general electronic device which only increases the size of the heat dissipation member to improve the heat dissipation efficiency of the heat generating device, the large size of the heat dissipation member will occupy more internal space of the electronic device. In the embodiment, the loudspeaker module is arranged to cooperate with the heat dissipation member to dissipate heat of the power device, and the loudspeaker module is used to blow air to the power device or the first heat conduction member to improve the air flow in the internal space of the shell device, so that the heat generated by the power device can be more easily absorbed by the heat dissipation member and discharged to the external environment, thereby improving the heat dissipation efficiency of the power device without increasing the size of the heat dissipation member. At the same time, the loudspeaker module in the embodiment can realize the function of external playing and heat dissipation of the power device, and the loudspeaker module can realize "one thing with multiple functions", so that the heat dissipation of the power device and the saving of the internal space of the electronic device can be considered. In other words, the electronic device of the embodiment can improve the heat dissipation efficiency of the power device while saving the internal space of the whole machine.

[0008] In a possible implementation, the outlet of the second cavity of the loudspeaker module is arranged towards the power device or the first heat conduction member. In this way, by arranging the outlet of the second cavity towards the power device or the first heat conduction member, the contact area between the air blown out of the outlet of the second cavity of the loudspeaker module and the power device or the first heat conduction member can be increased, thereby improving the heat dissipation efficiency.

[0009] In a possible implementation, the heat dissipation member has an inlet, and the inlet is arranged towards the power device or the first heat conduction member. In this way, the air exhausted by the loudspeaker module into the internal space of the shell device can flow through the power device or the first heat conduction member and enter the heat dissipation member more quickly, thereby effectively improving the heat dissipation efficiency and reducing the time for the hot air formed by absorbing the heat generated by the power device or the first heat conduction member to stay in the internal space of the shell device, so as to avoid the temperature of the electronic device rising due to the hot air staying in the internal space of the shell device for a long time, thereby affecting the user experience.

[0010] In one possible implementation, the back cover has ventilation holes, and the heat dissipation device also has an outlet facing the back cover and connected to the ventilation holes. This allows the air exhausted by the heat dissipation device to be quickly discharged from the housing through the ventilation holes, achieving heat dissipation and improving heat dissipation efficiency.

[0011] In one possible implementation, the power device is located between the inlet and the outlet of the second cavity; or, at least part of the first heat-conducting element is located between the inlet and the outlet of the second cavity. In this way, the air discharged from the speaker module into the internal space of the housing can pass more quickly through the power device or the first heat-conducting element and enter the heat dissipation device, thereby effectively improving heat dissipation efficiency and reducing the time that hot air generated by absorbing heat from the heat-generating device remains in the internal space of the housing. This prevents the temperature of the electronic device from rising due to prolonged stagnation of hot air in the internal space of the housing, thus avoiding negative impacts on the user experience.

[0012] In one possible implementation, the housing assembly further includes a shielding cover. The shielding cover is fixed to the mid-frame and surrounds the power devices. The shielding cover has an air inlet and an air outlet. The outlet of the second cavity of the speaker module connects to the air inlet. The air outlet connects to the internal space. Thus, by guiding the air exhausted from the speaker module into the interior of the shielding cover, allowing it to directly contact the power devices, the contact area between the flowing air and the power devices is increased, thereby effectively improving the heat dissipation efficiency of the speaker module for the power devices.

[0013] In one possible implementation, the air outlet is positioned closer to the heat dissipation device than the power device. This allows the heat inside the shielding to be dissipated more quickly by the heat dissipation device, improving heat dissipation efficiency.

[0014] In one possible implementation, the speaker module includes a module housing and a speaker. A first cavity and a second cavity are located inside the module housing. The module housing has an air outlet, and the second cavity connects to the internal space of the housing through the air outlet, which constitutes the outlet of the second cavity. The speaker is located in the internal space, and the speaker diaphragm is used to push the air in the first cavity or the second cavity when vibrating. Thus, by vibrating the diaphragm of the speaker inside the speaker module, the air in the first cavity or the second cavity can be pushed. When the diaphragm vibrates and causes the first cavity to draw in air from the external environment, the second cavity exhausts air into the internal space of the housing. The exhausted air can flow through the power device or the first heat-conducting component and absorb some of the heat generated by the power device, forming hot air. The formed hot air can be exhausted to the external environment through a heat dissipation device, thereby cooling the power device. The speaker module can achieve "multi-purpose functionality," thus saving internal space of the electronic device while simultaneously cooling the power device. In other words, the electronic device of this embodiment can achieve efficient heat dissipation of the power device while saving internal space of the entire device.

[0015] In one possible implementation, the module housing includes a cover plate, a frame, and a mounting bracket. The mounting bracket is fixed to the middle frame and has mounting holes. The speaker is fixed to the mounting holes, and the speaker, mounting bracket, and middle frame together enclose a first cavity. The frame is fixed to the middle frame and surrounds the mounting bracket and speaker. The cover plate is fixedly connected to the periphery of the frame, and the cover plate, frame, mounting bracket, speaker, and middle frame together enclose a second cavity. In this way, by using the module housing and middle frame to enclose mutually isolated first and second cavities, the overall structure of the speaker module is more compact, which helps to save internal space in the housing device.

[0016] In one possible implementation, the speaker module further includes a conduit located in the second cavity. The conduit has an inlet end and an outlet end. The inlet end is spaced apart from the speaker, and the outlet end is fixed to the module housing and covers the air outlet. The opening of the outlet end is connected to the air outlet.

[0017] It is understood that in this embodiment, a pipe is provided in the second cavity. This pipe can act as a bass reflex port to increase the vibration displacement of the speaker diaphragm, thereby effectively increasing the exhaust volume of the second cavity and improving heat dissipation efficiency under the same power conditions. In other words, the speaker module in this embodiment can save power consumption while achieving high heat dissipation efficiency by providing a pipe in the second cavity.

[0018] In one possible implementation, the radial dimension of the outlet gradually increases along the direction closest to the power device or the first heat-conducting component. This creates a horn-shaped outlet, increasing the contact area between the air blown out by the speaker module and the power device or the first heat-conducting component, thereby improving heat dissipation efficiency.

[0019] In one possible implementation, the loudspeaker further includes a rear housing and a magnetic circuit assembly. The diaphragm is fixedly connected to the rear housing and together with the rear housing encloses the rear cavity of the loudspeaker. The magnetic circuit assembly is disposed in the rear cavity. The rear housing has a vent that connects a second cavity to the rear cavity. In this way, the loudspeaker module can utilize the vibration of the loudspeaker diaphragm to push the air in the rear cavity of the loudspeaker.

[0020] In one possible implementation, the housing device further includes a second heat-conducting element fixed to the middle frame. The second heat-conducting element and the power device are located on the same side of the middle frame, with a portion of the second heat-conducting element located within the first cavity. The second heat-conducting element is used to transfer heat from the heat-generating device to the first cavity. Thus, when the diaphragm pushes the air in the first cavity to exhaust to the external environment, it can carry away some of the heat transferred to the first cavity by the power device through the second heat-conducting element, thereby achieving heat dissipation for the power device. In other words, by setting the second heat-conducting element to transfer part of the heat from the power device to the first cavity, the speaker module can dissipate heat from the power device during the same vibration cycle of the diaphragm, whether the first cavity is drawing in or expelling air from the external environment, resulting in high heat dissipation efficiency for the speaker module.

[0021] In one possible implementation, the second heat-conducting component is connected to the power device; alternatively, the second heat-conducting component is spaced apart from the power device, the middle frame is made of metal, and the heat from the power device is transferred to the second heat-conducting component through the middle frame. This results in a higher thermal conductivity of the second heat-conducting component in transferring heat from the power device to the first cavity, which is beneficial for improving the heat dissipation efficiency of the speaker module using the exhaust from the first cavity to cool the power device.

[0022] In one possible implementation, the middle frame includes a middle plate and a side frame. The side frame is fixedly connected to the periphery of the middle plate, and the rear cover is located on the side of the side frame facing away from the middle plate and is fixedly connected to the periphery of the side frame. The middle plate has a connecting hole that connects to the first cavity. The housing also includes a second heat-conducting element, located on the side of the middle plate facing away from the rear cover and fixedly connected to the middle plate. Part of the second heat-conducting element is exposed relative to the connecting hole. The second heat-conducting element is used to transfer heat from the power device to the first cavity. Thus, when the diaphragm pushes the air in the first cavity to exhaust to the external environment, it can carry away some of the heat transferred from the power device to the first cavity through the second heat-conducting element, thereby achieving heat dissipation for the power device. In other words, by setting the second heat-conducting element to transfer part of the heat from the power device to the first cavity, the speaker module can dissipate heat from the power device during the same vibration cycle of the diaphragm, whether the first cavity is drawing in air or expelling air from the external environment, resulting in high heat dissipation efficiency for the speaker module.

[0023] In one possible implementation, the diaphragm and the second heat-conducting element are positioned opposite each other. This increases the contact area between the air in the first cavity propelled by the diaphragm's vibration and the second heat-conducting element, thereby improving heat dissipation efficiency.

[0024] In one possible implementation, the housing device includes a processor and a power amplifier. The processor is electrically connected to the power amplifier and a speaker, and the power amplifier is electrically connected to the speaker. The speaker has an external playback mode and a heat dissipation mode. When the speaker is in external playback mode, the processor transmits a first signal to the power amplifier, and the power amplifier transmits a second signal to the speaker according to the first signal. The speaker then operates according to the second signal. When the speaker is in heat dissipation mode, the processor transmits a third signal to the speaker, and the speaker then operates according to the third signal. It is understood that the speaker in this embodiment, in addition to operating in external playback mode to allow the user to listen to audio while dissipating heat from the power device, can also operate in a heat dissipation mode independent of the external playback mode when the user does not need the device to play sound externally, in order to dissipate heat from the power device and meet the heat dissipation requirements of the electronic device.

[0025] In one possible implementation, when the speaker is in heat dissipation mode, the speaker's operating frequency is greater than 20 Hz, or the speaker's operating frequency is in the range of 70 Hz to 200 Hz. In this way, the operating frequency of the speaker in heat dissipation mode is more moderate, which can make the speaker emit less heat dissipation noise, which is not easily heard by the user, while increasing the vibration displacement of the diaphragm and increasing the exhaust volume of the second cavity, thereby improving the speaker's heat dissipation efficiency for power devices.

[0026] In one possible implementation, the speaker has two diaphragms. When the speaker is in cooling mode, the two diaphragms vibrate in the same direction; when the speaker is in external playback mode, the two diaphragms vibrate in opposite directions. By setting the two diaphragms to vibrate in the same direction when the speaker is in cooling mode, the stiffness of the speaker's rear cavity can be canceled out by the co-vibrating diaphragms. This helps to increase the diaphragm vibration displacement at lower operating frequencies, thereby increasing the exhaust volume of the second cavity and improving the heat dissipation efficiency of the speaker module. Simultaneously, the co-vibration of the two diaphragms can also cancel out far-field sounds, reducing heat dissipation noise in cooling mode and effectively improving the user experience. In other words, the speaker module in this embodiment can achieve both high heat dissipation efficiency and low heat dissipation noise, resulting in a better user experience.

[0027] Secondly, a housing device is provided. The housing device includes a shell, a speaker, a mounting bracket, and a conduit. The shell has a sound outlet and a heat dissipation hole. The shell includes a middle frame and a rear cover. The rear cover is fixedly connected to the periphery of the middle frame and, together with the middle frame, encloses the internal space of the housing device. The sound outlet and the heat dissipation hole both connect the internal space of the housing device to the external space of the housing device. The mounting bracket is fixed to the middle frame and has mounting holes. The speaker is fixed to the mounting holes. The speaker, the mounting bracket, and the middle frame together divide the internal space into a first cavity and a second cavity. The diaphragm of the speaker is used to push the air in the first cavity or the air in the second cavity when vibrating. The conduit is disposed in the second cavity and has an inlet end and an outlet end. The opening of the outlet end connects to the heat dissipation hole. The housing device also includes a power device, which is disposed in the second cavity. The inlet end is disposed closer to the power device than the speaker. Alternatively, the housing device also includes a power device and a first heat-conducting element. The power device is spaced apart from the speaker. At least part of the first heat-conducting element is located in the second cavity. The first heat-conducting element is used to transfer the heat of the power device to the second cavity. The inlet end is disposed closer to the first heat-conducting element than the speaker.

[0028] Understandably, in this embodiment, by fixing the mounting bracket to the middle frame and the speaker to the mounting bracket, the speaker, mounting bracket, and middle frame together divide the internal space of the housing into a first cavity and a second cavity that are isolated from each other, and a pipe is provided in the second cavity. Simultaneously, the power device or at least part of the first heat-conducting component is located in the second cavity. Thus, when the diaphragm vibrates and the first cavity draws air from the external environment, the second cavity exhausts air to the external environment to dissipate heat from the power device or the first heat-conducting component, thereby achieving heat dissipation for the power device. Compared to conventional electronic devices that use large fans or heat-conducting components to dissipate heat from the power device, which occupies a significant amount of internal space, this embodiment utilizes a speaker module to dissipate heat from the power device. The speaker module can achieve "multi-purpose use," thus simultaneously achieving heat dissipation for the power device while saving internal space in the electronic device.

[0029] Secondly, in this embodiment, a pipe is provided within the second cavity. This pipe can act as a bass reflex port to increase the vibration displacement of the speaker diaphragm, thereby effectively increasing the exhaust volume of the second cavity and improving heat dissipation efficiency while maintaining the same power output. In other words, the speaker module in this embodiment, by incorporating a pipe within the second cavity, can achieve high heat dissipation efficiency while saving power consumption.

[0030] Furthermore, unlike some speaker module ducts where the inlet opening does not face the power device or the first heat-conducting component, resulting in limited heat dissipation from the power device or the first heat-conducting component when the second cavity exhausts air to the external environment, this embodiment allows the inlet opening of the duct to face the power device or the first heat-conducting component. This means that when the second cavity exhausts air to the external environment, the air inside first passes through the power device or the first heat-conducting component, absorbing some of its heat to form hot air, which is then finally discharged to the external environment through the ventilation holes. In other words, when the second cavity exhausts air to the external environment, a large amount of heat from the power device can be discharged simultaneously, significantly improving the heat dissipation capacity of the power device.

[0031] In one possible implementation, the housing device further includes a heat dissipation device positioned closer to the outlet end of the pipe than the power device or the first heat-conducting element. The heat dissipation device has an inlet and an outlet, with the outlet opening facing the heat dissipation device and connecting to the inlet, and the outlet connecting to a heat dissipation hole. In this way, by using a heat dissipation device in conjunction with the speaker module for heat dissipation, the heat dissipation efficiency of the power device can be effectively improved.

[0032] Thirdly, a housing device is provided. The housing device includes a shell and a speaker module. The shell has a sound outlet and a heat dissipation hole. The shell includes a middle frame and a rear cover. The rear cover is fixedly connected to the periphery of the middle frame and, together with the middle frame, encloses the internal space of the housing device. The sound outlet and the heat dissipation hole both connect the internal space of the housing device to the external space of the housing device. The speaker module is disposed in the internal space. The speaker module includes a module housing, a speaker, and a conduit. The module housing has a first cavity and a second cavity that are isolated from each other. The first cavity connects to the sound outlet. The speaker is disposed inside the module housing, and the speaker diaphragm is used to push the sound outlet within the first cavity during vibration. Air or air propelling the second cavity, a pipe is provided in the second cavity, the pipe has an inlet end and an outlet end, the outlet end is fixedly connected to the module housing, and the opening of the outlet end is connected to the heat dissipation hole; the housing device also includes a power device, the power device is provided in the second cavity, and the inlet end is located closer to the power device than the speaker; or, the housing device also includes a power device and a first heat-conducting element, the power device is spaced apart from the speaker module, part of the first heat-conducting element is located in the second cavity, the first heat-conducting element is used to transfer the heat of the power device to the second cavity, and the inlet end is located closer to the first heat-conducting element than the speaker.

[0033] It is understood that the speaker module in this embodiment has a first cavity and a second cavity that are isolated from each other. The electronic device also includes a conduit, which can be located in the second cavity. The heat-generating device (in this embodiment, also known as a power device or part of the first heat-conducting component) can be located in the second cavity. The inlet end of the conduit can be positioned closer to the heat-generating device than the speaker, and the outlet end of the conduit can connect to the heat dissipation holes of the outer casing. Thus, when the diaphragm vibrates and the first cavity draws air from the external environment, the second cavity exhausts air to the external environment, dissipating the heat from the power device or the first heat-conducting component, thereby achieving heat dissipation for the power device. Compared to conventional electronic devices that use large fans or heat-conducting components to dissipate heat from the power device, which takes up considerable internal space, this embodiment utilizes a speaker module to dissipate heat from the power device. The speaker module can serve multiple purposes, thus simultaneously dissipating heat from the power device and saving internal space in the electronic device.

[0034] Secondly, in this embodiment, a pipe is provided within the second cavity. This pipe can act as a bass reflex port to increase the vibration displacement of the speaker diaphragm, thereby effectively increasing the exhaust volume of the second cavity and improving heat dissipation efficiency while maintaining the same power output. In other words, the speaker module in this embodiment, by incorporating a pipe within the second cavity, can achieve high heat dissipation efficiency while saving power consumption.

[0035] Furthermore, unlike some speaker module ducts where the inlet opening does not face the power device or the first heat-conducting component, resulting in limited heat dissipation from the power device or the first heat-conducting component when the second cavity exhausts air to the external environment, this embodiment allows the inlet opening of the duct to face the power device or the first heat-conducting component. This means that when the second cavity exhausts air to the external environment, the air inside first passes through the power device or the first heat-conducting component, absorbing some of its heat to form hot air, which is then finally discharged to the external environment through the ventilation holes. In other words, when the second cavity exhausts air to the external environment, a large amount of heat from the power device can be discharged simultaneously, significantly improving the heat dissipation capacity of the power device.

[0036] In one possible implementation, the module housing includes a cover plate, a frame, and a mounting bracket. The mounting bracket is fixed to the middle frame and has mounting holes. The speaker is fixed to the mounting holes. The speaker, the mounting bracket, and the middle frame together enclose a first cavity, which is connected to a sound outlet. The frame is fixed to the middle frame and surrounds the mounting bracket and the speaker. The cover plate is fixedly connected to the periphery of the frame. The cover plate, the frame, the mounting bracket, the speaker, and the middle frame together enclose a second cavity. In this way, by using the module housing and the middle frame to enclose mutually isolated first and second cavities, the overall structure of the speaker module is more compact, which helps to save internal space of the housing device.

[0037] In one possible implementation, the housing device further includes a heat dissipation device disposed within the internal space and spaced apart from the speaker module. The heat dissipation device has an inlet and an outlet, with the outlet opening facing the heat dissipation device and communicating with the inlet, and the outlet communicating with a heat dissipation hole. Thus, by using a heat dissipation device in conjunction with the speaker module for heat dissipation, the heat dissipation efficiency of the power devices can be effectively improved.

[0038] In one possible implementation, the inlet opening faces the power device or the first heat-conducting component. It is understood that, compared to some speaker module pipes where the inlet opening does not face the power device or the first heat-conducting component, this means that when the second cavity exhausts air to the external environment, most of the air in the second cavity can be directly exhausted through the pipe, limiting the amount of heat that can be expelled from the power device or the first heat-conducting component, thus limiting the heat dissipation capacity of the power device. In this embodiment, however, the inlet opening of the pipe can face the power device or the first heat-conducting component. Thus, when the second cavity exhausts air to the external environment, the air inside the second cavity can first pass through the power device or the first heat-conducting component, absorbing some of the heat from the power device or the first heat-conducting component to form hot air, which is then finally discharged to the external environment through the heat dissipation hole via the pipe. That is, when the second cavity exhausts air to the external environment, a large amount of heat from the power device can be expelled simultaneously, which is beneficial for improving the heat dissipation capacity of the power device.

[0039] In one possible implementation, the housing device further includes a second heat-conducting element fixed to the middle frame. The second heat-conducting element and the power device are located on the same side of the middle frame, with a portion of the second heat-conducting element located in the first cavity. The second heat-conducting element is used to transfer heat from the power device to the first cavity. In contrast, in general electronic devices without a second heat-conducting element, when the diaphragm vibrates within the same vibration cycle, the speaker module only dissipates heat from the power device when the second cavity exhausts air to the external environment, resulting in limited heat dissipation capacity for the power device. In this embodiment, by providing a second heat-conducting element, a portion of the heat from the power device is transferred to the first cavity. When the speaker diaphragm vibrates within the same vibration cycle, the speaker module can dissipate heat from the power device both when the first cavity draws air from the external environment (i.e., when the second cavity exhausts air from the external environment) and when the first cavity exhausts air from the external environment (i.e., when the second cavity draws air from the external environment), effectively improving the heat dissipation efficiency of the speaker module. In other words, in this embodiment, the speaker module can dissipate heat from the power devices during the same vibration cycle of the diaphragm, whether the first cavity is drawing air into the external environment or expelling air from the external environment, resulting in high heat dissipation efficiency of the speaker module.

[0040] In one possible implementation, the second heat-conducting component is connected to the power device; alternatively, the second heat-conducting component is spaced apart from the power device, the middle frame is made of metal, and the heat from the power device is transferred to the second heat-conducting component through the middle frame. This results in a higher thermal conductivity of the second heat-conducting component in transferring heat from the power device to the first cavity, which is beneficial for improving the heat dissipation efficiency of the speaker module using the exhaust from the first cavity to cool the power device.

[0041] In one possible implementation, the middle frame includes a middle plate and a side frame. The side frame is fixedly connected to the periphery of the middle plate, and the rear cover is located on the side of the side frame facing away from the middle plate and is fixedly connected to the periphery of the side frame. The middle plate has a connecting hole that connects to the first cavity. The housing also includes a second heat-conducting element, located on the side of the middle plate facing away from the rear cover and fixedly connected to the middle plate. Part of the second heat-conducting element is exposed relative to the connecting hole. The second heat-conducting element is used to transfer heat from the power device to the first cavity. Thus, when the diaphragm pushes the air in the first cavity to exhaust to the external environment, it can carry away some of the heat transferred from the power device to the first cavity through the second heat-conducting element, thereby achieving heat dissipation for the power device. In other words, by setting the second heat-conducting element to transfer part of the heat from the power device to the first cavity, the speaker module can dissipate heat from the power device during the same vibration cycle of the diaphragm, whether the first cavity is drawing in air or expelling air from the external environment, resulting in high heat dissipation efficiency for the speaker module.

[0042] In one possible implementation, the diaphragm and the second heat-conducting element are positioned opposite each other. This increases the contact area between the air in the first cavity propelled by the diaphragm's vibration and the second heat-conducting element, thereby improving heat dissipation efficiency.

[0043] In one possible implementation, the housing device further includes a processor and a power amplifier. The processor is electrically connected to the power amplifier and a speaker, and the power amplifier is electrically connected to the speaker and the processor. The speaker has an external playback mode and a heat dissipation mode. When the speaker is in external playback mode, the processor transmits a first signal to the power amplifier, and the power amplifier transmits a second signal to the speaker according to the first signal, causing the speaker to operate according to the second signal. When the speaker is in heat dissipation mode, the processor transmits a third signal to the speaker, causing the speaker to operate according to the third signal. It is understood that the speaker in this embodiment, in addition to operating in external playback mode to allow users to listen to audio while dissipating heat from the power device, can also operate in a heat dissipation mode independent of the external playback mode when the user does not need the device to play sound externally, in order to dissipate heat from the power device and meet the heat dissipation requirements of the electronic device.

[0044] In one possible implementation, when the speaker is in heat dissipation mode, the speaker's operating frequency is greater than or equal to 20 Hz, or the speaker's operating frequency is in the range of 70 Hz to 200 Hz. This provides a more moderate operating frequency for the speaker in heat dissipation mode, resulting in lower heat dissipation noise that is less likely to be heard by the user. Simultaneously, it increases the diaphragm's vibration displacement and the exhaust volume of the second cavity, thereby improving the speaker's heat dissipation efficiency for the power devices.

[0045] Fourthly, an electronic device is provided. The electronic device includes a screen and the aforementioned housing, with the screen mounted on the housing. The electronic device in this embodiment can achieve both efficient heat dissipation for power devices and save internal space. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0047] Figure 1 is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;

[0048] Figure 2 is an exploded structural diagram of the electronic device shown in Figure 1 in some embodiments;

[0049] Figure 3 is an exploded structural diagram of the housing device shown in Figure 2 in some embodiments;

[0050] Figure 4 is a structural schematic diagram of the housing device shown in Figure 2 from another perspective;

[0051] Figure 5 is a structural schematic diagram of the housing device shown in Figure 4 from another perspective;

[0052] Figure 6 is a partial cross-sectional structural diagram of one embodiment of the electronic device shown in Figure 1, cut along point AA;

[0053] Figure 7 is a schematic diagram comparing the diaphragm vibration displacement of the loudspeaker in the electronic device shown in Figure 1 with that of the loudspeaker in a general electronic device.

[0054] Figure 8a is a schematic diagram of the structure shown in Figure 5 in some other embodiments;

[0055] Figure 8b is a schematic diagram of the structure shown in Figure 5 in some other embodiments;

[0056] Figure 9 is a schematic diagram of the electronic device shown in Figure 1 in another embodiment;

[0057] Figure 10 is an exploded structural diagram of the housing device of the electronic device shown in Figure 9 in some embodiments.

[0058] Figure 11 is an exploded structural diagram of the speaker module shown in Figure 10 in some embodiments;

[0059] Figure 12 is a structural schematic diagram of the main body of the module housing shown in Figure 11 from another perspective;

[0060] Figure 13 is a schematic diagram of the assembly structure of the main body and sealing auxiliary components shown in Figure 12 in some embodiments;

[0061] Figure 14 is a schematic diagram of the electronic device shown in Figure 9 from another perspective;

[0062] Figure 15 is a schematic cross-sectional view of one embodiment of the electronic device shown in Figure 9, cut along BB.

[0063] Figure 16 is a schematic cross-sectional view of one embodiment of the electronic device shown in Figure 9, cut along CC.

[0064] Figure 17 is a schematic cross-sectional view of one embodiment of the electronic device shown in Figure 9, cut along DD.

[0065] Figure 18 is a schematic diagram of the electronic device shown in Figure 1 in another embodiment;

[0066] Figure 19 is an exploded structural diagram of the electronic device shown in Figure 18 in some embodiments;

[0067] Figure 20 is an exploded structural diagram of the speaker module shown in Figure 19 in some embodiments;

[0068] Figure 21 is a schematic diagram of part of the speaker module shown in Figure 19 from another perspective;

[0069] Figure 22 is a structural schematic diagram of the housing device shown in Figure 18 from another perspective;

[0070] Figure 23 is a schematic cross-sectional view of one embodiment of the electronic device shown in Figure 18, cut along EE.

[0071] Figure 24 is a schematic cross-sectional view of one embodiment of the electronic device shown in Figure 18, cut along FF.

[0072] Figure 25 is a schematic diagram of the electronic device shown in Figure 9 in another embodiment. Detailed Implementation

[0073] The embodiments of this application are described below with reference to the accompanying drawings.

[0074] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0075] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0076] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0077] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in another embodiment" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0078] It is understood that the specific embodiments described herein are merely for explaining the relevant invention and not for limiting the invention. It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0079] Figure 1 is a structural schematic diagram of the electronic device 1000 provided in some embodiments of this application. Figure 2 is an exploded structural schematic diagram of the electronic device 1000 shown in Figure 1 in some embodiments. Figure 3 is an exploded structural schematic diagram of the housing device shown in Figure 2 in some embodiments.

[0080] As shown in Figures 1 to 3, the electronic device 1000 can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR headset, virtual reality (VR) glasses, or VR headset, or any other device with external sound output functionality. Figure 1 illustrates the electronic device 1000 using a mobile phone as an example. It should be noted that Figures 1 to 3 and the related accompanying figures below only schematically show some components of the electronic device 1000; the actual shape, size, position, and structure of these components are not limited by Figure 1 and the accompanying figures below. For ease of description, the length direction of the electronic device 1000 is defined as the X-axis, the width direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system of the electronic device 1000 can be flexibly set according to specific practical needs.

[0081] For example, the electronic device 1000 may include a housing device 100 and a screen 200. The screen 200 may be located on one side of the housing device 100 and fixed to the housing device 100. The housing device 100 may include a housing 10, a speaker module 20, a heat sink 30, and a power device 40. The heat sink 30, the speaker module 20, and the power device 40 may all be installed inside the housing 10.

[0082] Exemplarily, the housing 10 may include a middle frame 11 and a rear cover 12. The middle frame 11 may include a side frame 111 and a middle plate 112. The side frame 111 may be fixedly connected to the periphery of the middle plate 112. The rear cover 12 may be fixedly connected to the periphery of the side frame 111. In this case, the rear cover 12, together with the side frame 111 and the middle plate 112, can enclose the internal space of the housing device 100. The screen 200 may be located on the side of the middle plate 112 facing away from the rear cover 12 and fixedly connected to the rear cover 12. The side frame 111 may be provided with a sound outlet 111a. The rear cover 12 may be provided with a heat dissipation hole 121. Both the sound outlet 111a and the heat dissipation hole 121 can communicate with the internal space of the housing device 100 and the external space of the housing device 100. The sound outlet 111a and / or the heat dissipation hole 121 may each consist of a single hole or multiple holes spaced apart. In other embodiments, the heat dissipation hole 121 may also be formed in the side frame 111. The sound outlet 111a can also be formed on the back cover 12.

[0083] For example, the electronic device 1000 may also include multiple components (not shown in the figure), which are installed inside the housing device 100. These components may include, for example, a processor, internal memory, an external memory interface, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a receiver, a microphone, a headphone jack, a sensor module, buttons, a motor, an indicator, and a user identification module (SIM) card interface, etc.

[0084] In other embodiments, when the electronic device 1000 is a device of other types, the electronic device 1000 may not include the screen 200.

[0085] Figure 4 is a structural schematic diagram of the housing device 100 shown in Figure 2 from another perspective. Figure 5 is a structural schematic diagram of the housing device 100 shown in Figure 4 from another perspective. Figure 6 is a partial cross-sectional structural schematic diagram of one embodiment of the electronic device 1000 shown in Figure 1 cut along point AA. For ease of understanding, the structure of the rear cover 12 is hidden in Figure 4, and the structures of the rear cover 12 and the cover plate 211 of the module housing 21 are hidden in Figure 5.

[0086] As shown in Figures 4 to 6, the speaker module 20 can be fixed to the middle frame 11. The speaker module 20 may have a portion with a sound outlet 111a near the side frame 111. The speaker module 20 may include a module housing 21 and a speaker 22. The module housing 21 may include a cover plate 211 and a main body 212. The main body 212 may include a frame 213 and a first support 214. The frame 213 can be fixedly connected to the middle frame 112. The cover plate 211 can be fixedly connected to the periphery of the frame 213, and together with the frame 213 and the middle frame 112, encloses the internal space 20a of the speaker module 20. The frame 213 may have a first vent 213a (see Figure 3). The first vent 213a can communicate with the sound outlet 111a. Exemplarily, the portion of the frame 213 with a first air outlet 213a can be connected to the sound outlet 111a of the frame 111. The first air outlet 213a can communicate with the sound outlet 111a. Exemplarily, the frame 213 can cover the sound outlet 111a. In other embodiments, the frame 213 can also be spaced apart from the frame 111.

[0087] It should be noted that in this embodiment, the frame 213 and the first support 214 can be integrally formed, that is, the main body 212 can be an integrally formed structure. For easy distinction, the frame 213 and the first support 214 are schematically divided by dashed lines in Figure 5. In other embodiments, the speaker module 20 may also include a base plate (not shown). The base plate and the cover plate 211 can be fixed to the opposite sides of the frame 213, and together with the frame 213, they enclose the internal space 20a of the speaker module 20.

[0088] For example, one end of the first branch 214 can be fixedly connected to the inner peripheral side of the frame 213, and the other end of the first branch 214 can be spaced apart from the frame 213 and the speaker 22. The first branch 214 can be fixedly connected between the cover plate 211 and the middle plate 112 of the middle frame 11. At this time, the first branch 214, the frame 213, the middle plate 112, and the cover plate 211 can jointly enclose the flow channel. The portion of the first branch 214, the frame 213, the middle plate 112, and the cover plate 211 used to enclose the flow channel can jointly constitute the pipe 23. The pipe 23 can include an inlet end 231 and an outlet end 232. The inlet end 231 can be spaced apart from the frame 213 and communicate with the internal space 20a of the speaker module 20.

[0089] Exemplarily, the frame 213 may also have a second vent 213b. The second vent 213b may be spaced apart from the first vent 213a. The second vent 213b may communicate with the internal space 100a of the housing device 100. The outlet end 232 of the pipe 23 may be fixedly connected to the frame 213. The opening of the outlet end 232 may communicate with the second vent 213b. Exemplarily, the outlet end 232 of the pipe 23 may cover the second vent 213b. In other embodiments, the main body 212 of the module housing 21 may not include the first support 214. The speaker module 20 may also include the pipe 23. In this case, the pipe 23 may be an independent structural component and is disposed within the internal space 20a of the speaker module 20.

[0090] Exemplarily, the loudspeaker 22 may include a diaphragm 221, a voice coil (not shown), a magnetic circuit assembly (not shown), and a rear housing 222. The diaphragm 221 may be located on one side of the rear housing 222 and fixed to it. In this case, the rear housing 222 and the diaphragm 221 may enclose the rear cavity 223 of the loudspeaker 22. Both the voice coil and the magnetic circuit system may be located in the rear cavity 223 of the loudspeaker 22. The voice coil is fixedly connected to the diaphragm 221. Part of the voice coil may be located in the magnetic gap of the magnetic circuit system. When the voice coil is energized, it can move under the action of the magnetic circuit assembly and push the diaphragm 221 to move. The rear housing 222 may be provided with a vent 222a. The vent 222a may connect the internal space 20a of the loudspeaker module 20 and the rear cavity 223 of the loudspeaker 22.

[0091] Exemplarily, the speaker module 20 may further include a mounting bracket 24. The mounting bracket 24 may be fixed to the middle plate 112. The device rear shell 222 of the speaker 22 may be fixed to the mounting bracket 24. In this case, the speaker 22, the mounting bracket 24, and the middle frame 11 may together enclose the first cavity 25. The speaker 22, the mounting bracket 24, the middle frame 11, the frame 213, and the cover plate 211 may together enclose the second cavity 26. The first cavity 25 and the second cavity 26 may be isolated from each other within the module housing 21, that is, the first cavity 25 and the second cavity 26 are not connected. The first vent 213a may be connected to the first cavity 25. That is, the first cavity 25 may be connected to the sound outlet 111a through the first vent 213a. The conduit 23 may be located within the second cavity 26. The second cavity 26 may be connected to the internal space 100a of the housing device 100 through the conduit 23 and the second vent 213b. At this time, the second air outlet 213b can constitute the outlet of the second cavity 26. In other embodiments, the fixing frame 24 can also be integrally formed with the middle frame 11.

[0092] Exemplarily, the diaphragm 221 of the speaker 22 can face the first cavity 25. The diaphragm 221 can be opposite to and spaced apart from the middle plate 112 of the middle frame 11. In this case, the diaphragm 221 can isolate the first cavity 25 from the rear cavity 223 of the speaker 22. The first cavity 25 can serve as the front cavity of the speaker 22. That is, the speaker 22 can be an open front cavity design. In other embodiments, the speaker 22 can also include a device front shell (not shown). The device front shell can be located on the side of the diaphragm 221 facing away from the device rear shell 222, and is fixedly connected to the periphery of the diaphragm 221. In this case, the device front shell and the diaphragm 221 can surround the front cavity of the speaker 22. The device front shell can be opposite to and spaced apart from the middle plate 112 of the middle frame 11. The device front shell can also be provided with a sound outlet. The sound outlet can connect the front cavity of the speaker 22 and the first cavity 25.

[0093] For example, when the voice coil is energized, it can move under the action of the magnetic circuit assembly, thus driving the diaphragm 221 to move. Specifically, applying current in different directions to the voice coil can drive the diaphragm 221 to move in different directions. That is, by applying periodic currents in different directions to the voice coil, the diaphragm 221 can produce periodic reciprocating vibrations, emitting sound. The sound emitted by the speaker 22 can propagate through the sound outlet 111a to the external space of the housing device 100.

[0094] Please refer again to Figures 4 to 6. The heat dissipation device 30 can be a fan or other device with heat dissipation function. In this embodiment, a fan is used as an example to illustrate the heat dissipation device 30. The heat dissipation device 30 can be fixed to the middle plate 112 of the middle frame 11. The heat dissipation device 30 can include a peripheral side surface 31 and a first surface 32 facing the rear cover 12. The first surface 32 can be fixedly connected to the periphery of the peripheral side surface 31. The heat dissipation device 30 can include an inlet 33 and an outlet 34. The inlet 33 can be formed on the peripheral side surface 31. The outlet 34 can be formed on the first surface 32. The outlet 34 can be disposed opposite to the first air outlet 213a of the rear cover 12 and communicate with the heat dissipation hole 121 of the rear cover 12. That is, the air discharged by the heat dissipation device 30 through the outlet 34 can be discharged to the external space of the housing device 100 through the heat dissipation hole 121 of the rear cover 12. For example, when the heat dissipation device 30 is a fan, the inlet of the heat dissipation device 30 is also the air inlet of the fan, and the outlet of the heat dissipation device 30 is also the air outlet of the fan.

[0095] For example, the power device 40 can be a system-on-a-chip (SOC), a central processing unit (CPU), or other devices with high power consumption that can generate heat during operation. For example, the power device 40 can include a circuit board (not shown) and electronic components (not shown). There can be multiple electronic components. These multiple electronic components can be fixed to the circuit board by means of soldering or other methods. The power device 40 can be fixed to the middle plate 112 of the middle frame 11 and is spaced apart from the speaker module 20 and the heat sink 30.

[0096] For example, the electronic device 1000 may also include a shielding cover 70. The shielding cover 70 may be made of a metallic material. The shielding cover 70 may be fixed to the middle plate 112 and surround the power device 40. It should be understood that the power device 40 shielded by the shielding cover 70 is indicated by dashed lines in FIG4 and subsequent figures.

[0097] For example, the outlet of the second cavity 26 of the speaker module 20 may be positioned closer to the shielding cover 70 than the heat sink 30, that is, closer to the power device 40. Similarly, the outlet end 232 of the pipe 23 may be positioned closer to the power device 40 than the heat sink 30. For example, the opening of the outlet end 232 of the pipe 23 may face the shielding cover 70.

[0098] Please refer again to Figures 4 to 6. When the diaphragm 221 moves toward the rear cavity 223 of the speaker 22, air from the external environment will enter the first cavity 25 through the heat dissipation holes 121 of the module housing 21 via the sound outlet 111a. That is, the first cavity 25 will draw air from the external environment. The air in the rear cavity 223 of the speaker 22 and the air in the second cavity 26 will be compressed by the diaphragm 221 and enter the flow channel inside the pipe 23 through the inlet end 231 of the pipe 23. Finally, the air will enter the internal space 100a of the housing device 100 through the second air outlet 213b of the frame 213 via the outlet end 232 of the pipe 23. That is, the second cavity 26 will exhaust air into the internal space 100a of the housing device 100. The air discharged from the speaker module 20 into the internal space 100a of the housing device 100 can pass through the shielding cover 70, and then enter the interior of the heat dissipation device 30 through the inlet 33 of the heat dissipation device 30, and finally enter the external environment through the outlet 34 of the heat dissipation device 30 and the heat dissipation hole 121 of the rear cover 12.

[0099] The shield 70 can absorb some of the heat generated by the power device 40. When the air discharged from the speaker module 20 into the internal space 100a of the housing device 100 flows through the shield, the flowing air can carry away some of the heat from the shield 70, that is, the heat generated by the power device 40, forming hot air. At this time, the power device 40 can constitute a heat-generating device. The formed hot air can be discharged into the external environment through the heat dissipation device 30. That is, when the speaker 22 is working, the vibration of the diaphragm 221 can compress the air in the second cavity 26 and discharge it into the internal space 100a of the housing device 100. The air discharged from the speaker module 20 into the internal space 100a of the housing device 100 can absorb the heat generated by the power device 40, and then be discharged through the heat dissipation hole 121 of the rear cover 12 through the heat dissipation device 30, thereby achieving heat dissipation for the power device 40.

[0100] In some embodiments, the outlet of the second cavity 26 may also be positioned closer to the heat dissipation device 30 than the power device 40. The electronic device 1000 may also include a first thermally conductive element (not shown). The first thermally conductive element may be positioned closer to the outlet of the second cavity 26 than the power device 40. The first thermally conductive element can be used to transfer heat from the power device 40 to the outlet of the second cavity 26. In this case, the portion of the first thermally conductive element near the outlet of the second cavity 26 can constitute a heat-generating device. Exemplarily, the first thermally conductive element may be connected to the power device 40. A portion of the first thermally conductive element may be located between the outlet of the second cavity 26 of the speaker module 20 and the inlet 33 of the heat dissipation device 30.

[0101] In other embodiments, the electronic device 1000 may not include the shielding cover 70. When the speaker module 20 exhausts air into the internal space 100a of the housing device 100, the exhaust air can directly contact the power device 40 and carry away some of the heat generated by the power device 40.

[0102] Figure 7 is a schematic diagram comparing the vibration displacement of the diaphragm 221 of the loudspeaker 22 in the electronic device 1000 shown in Figure 1 with the vibration displacement of the diaphragm of a loudspeaker in a general electronic device. Curve 1 represents the vibration displacement of the diaphragm 221 of the loudspeaker 22 in the electronic device 1000 shown in Figure 1. Curve 2 represents the vibration displacement of the diaphragm of a loudspeaker in a general electronic device.

[0103] As shown in Figure 7, the speaker module in a typical electronic device does not include a conduit. In this case, the displacement of the speaker diaphragm, especially at lower operating frequencies, is small, limiting the volume of air that the diaphragm can push inside the second cavity. This results in a limited volume of airflow discharged from the second cavity into the internal space of the housing. Consequently, the amount of heat carried away by the airflow discharged from the second cavity is limited, failing to meet the heat dissipation requirements of the heat-generating components.

[0104] In this embodiment, the electronic device 1000 provides a pipe 23 within the second cavity 26. This pipe 23 acts as a bass reflex port, increasing the displacement of the diaphragm 221 when the speaker 22 operates at lower frequencies. This allows for an increase in the volume of air pushed by the diaphragm 221 within the second cavity 26, thereby increasing the exhaust volume of the second cavity 26 while maintaining the same speaker 22 power. In other words, under the same speaker 22 power conditions, this embodiment effectively increases the exhaust volume of the second cavity 26 and improves heat dissipation efficiency by providing the pipe 23 within the second cavity 26.

[0105] Exemplarily, the housing device 100 may further include a processor (not shown) and a power amplifier (not shown). The processor may be electrically connected to the power amplifier and the speaker 22. The power amplifier may also be electrically connected to the speaker 22. The speaker 22 may include an external playback mode and a heat dissipation mode. When the speaker 22 is in external playback mode, the processor may transmit a first signal to the power amplifier. The power amplifier may transmit a second signal to the speaker 22 according to the first signal. The speaker 22 may operate according to the second signal. The power amplifier may amplify the first signal to form the second signal. The speaker 22 emits a sound that can be heard by the human ear by receiving the signal amplified by the power amplifier (i.e., the second signal in this embodiment), thereby realizing the external playback function of the electronic device 1000. When the speaker 22 is in heat dissipation mode, the processor may transmit a third signal to the speaker 22. The speaker 22 may operate according to the third signal. At this time, since the third signal has not been amplified by the power amplifier, the sound emitted by the speaker 22 is not easily heard by the human ear, thus achieving heat dissipation while reducing heat dissipation noise, which is beneficial to improving the user experience.

[0106] For example, the operating frequency of the speaker 22 in heat dissipation mode can be greater than 20 Hz. When the speaker 22 is in heat dissipation mode, its operating frequency is low, and the sound emitted is relatively soft, making it difficult for the human ear to hear. This allows for heat dissipation of the power device 40 without affecting the user's audiovisual experience. When the speaker 22 is in external playback mode, its operating frequency is high, and the sound emitted is loud, making it easier for the user to listen to the audio. Simultaneously, in external playback mode, the diaphragm 221 of the speaker 22 can still push the air in the second cavity 26 and discharge it into the internal space 100a of the housing device 100. The air discharged into the internal space 100a of the housing device 100 can still absorb some of the heat from the power device 40 and is ultimately discharged from the electronic device 1000 by the heat dissipation device 30, thereby achieving heat dissipation for the heat-generating device. In other words, the speaker 22 in this embodiment can not only work in external playback mode to allow users to listen to audio while dissipating heat from the power device 40, but also work in a heat dissipation mode independent of the external playback mode when the user does not need the device to play sound externally, so as to dissipate heat from the power device 40 and meet the heat dissipation requirements of the electronic device 1000.

[0107] For example, the operating frequency of the speaker 22 in external playback mode can be in the range of 70 Hz to 3000 Hz. In other embodiments, the operating frequency of the speaker 22 in external playback mode can also be in other ranges.

[0108] For example, the operating frequency of the speaker 22 in heat dissipation mode can also be in the range of 70 Hz to 200 Hz. This provides a more moderate operating frequency for the speaker 22 in heat dissipation mode, resulting in less heat dissipation noise that is less likely to be heard by the user. Simultaneously, it increases the vibration displacement of the diaphragm 221 and the exhaust volume of the second cavity 26, thereby improving the heat dissipation efficiency of the speaker 22 for the power device 40. In other words, by operating the speaker 22 in heat dissipation mode within the range of 70 Hz to 200 Hz, the speaker 22 achieves high heat dissipation efficiency for the power device 40 while also considering the user experience.

[0109] It is understood that the speaker module 20 of this embodiment includes a first cavity 25 and a second cavity 26 that are isolated from each other. The first cavity 25 is connected to the external environment through a sound outlet 111a, and the second cavity 26 is connected to the internal space 100a of the housing device 100. The outlet of the second cavity 26 (which in this embodiment is also the second air outlet 213b of the frame 213) is located closer to the heat-generating device than the heat sink 30. Thus, when the diaphragm 221 of the speaker 22 vibrates, causing the first cavity 25 to draw air from the external environment, the second cavity 26 will exhaust air into the internal space 100a of the housing device 100. The exhausted air can flow through the heat-generating device and absorb some of the heat generated by the power device 40, forming hot air. The formed hot air can be exhausted to the external environment through the heat sink 30, thereby dissipating heat from the power device 40.

[0110] In this way, compared to general electronic devices that simply increase the size of the heat sink to improve the heat dissipation efficiency of heat-generating components, which would take up a lot of internal space, this embodiment uses a speaker module 20 in conjunction with the heat sink 30 to dissipate heat from the power device 40. The speaker module 20 blows air onto the heat-generating component, increasing airflow within the internal space 100a of the housing 100. This allows more heat generated by the heat-generating component to be absorbed by the heat sink 30 and expelled to the external environment, thereby improving the overall heat dissipation efficiency of the power device 40 without increasing the size of the heat sink 30. Simultaneously, the speaker module 20 in this embodiment can both provide external playback and dissipate heat from the power device 40, achieving a "multi-purpose" function. This allows for both heat dissipation of the power device 40 and saving internal space in the electronic device 1000. In other words, the electronic device 1000 of this embodiment can achieve efficient heat dissipation of the power device 40 while saving overall internal space.

[0111] Secondly, in this embodiment, a conduit 23 is provided within the second cavity 26. The conduit 23 can act as a bass reflex port to increase the vibration displacement of the diaphragm 221 of the speaker 22. This allows the speaker 22 to effectively increase the exhaust volume of the second cavity 26 and improve heat dissipation efficiency under the same power conditions. In other words, the speaker module 20 in this embodiment can save power consumption while achieving high heat dissipation efficiency by providing the conduit 23 within the second cavity 26. For example, by providing the conduit 23 within the second cavity 26, the vibration displacement of the diaphragm 221 of the speaker 22 can be increased when operating at low frequencies (e.g., when the speaker 22 operates at frequencies between 70 Hz and 200 Hz).

[0112] In some embodiments, the radial dimension of the outlet end 232 of the pipe 23 can gradually increase along the direction close to the power device 40. In this case, the outlet end 232 can be approximately horn-shaped. In this way, the horn-shaped outlet end 232 can increase the contact area between the air blown out by the speaker module 20 and the power device 40 or the first heat-conducting element, thereby improving heat dissipation efficiency.

[0113] In some embodiments, the heat sink 30 may also be located on the side of the heat-generating device (i.e., the power device 40 in this embodiment) facing away from the heat dissipation hole 121. For example, the inlet 33 of the heat sink 30 may be positioned facing the heat-generating device. In this way, the air discharged from the speaker module 20 into the internal space 100a of the housing device 100 can pass through the heat-generating device and enter the heat sink 30 more quickly, thereby effectively improving heat dissipation efficiency and reducing the time that hot air formed by absorbing the heat generated by the heat-generating device stays in the internal space 100a of the housing device 100. This avoids the temperature of the electronic device 1000 rising due to the hot air staying in the internal space 100a of the housing device 100 for a long time, which would affect the user experience.

[0114] In some embodiments, the inlet 33 of the heat dissipation device 30, the heat-generating device, and the outlet 232 of the pipe 23 can be located on the same straight line. The heat-generating device can be located between the inlet 33 of the heat dissipation device 30 and the outlet 232 of the pipe 23. In this way, the air discharged from the speaker module 20 into the internal space 100a of the housing device 100 flows through the heat-generating device and the inlet 33 of the heat dissipation device 30 in sequence, resulting in a shorter flow path and higher heat dissipation efficiency.

[0115] In some embodiments, please refer to Figure 8a, which is a schematic diagram of the structure shown in Figure 5 in another embodiment. For ease of understanding, the cover plate 211 of the module housing 21 is hidden in Figure 8a. The shield 70 may also have an air inlet 71 and an air outlet 72. The frame 213 may be fixedly connected to the shield 70. The outlet of the second cavity 26 may be connected to the air inlet 71 of the shield 70. The air outlet 72 of the shield 70 may be positioned closer to the inlet 33 of the heat sink 30 than the power device 40. The air exhausted from the speaker module 20 may directly enter the interior of the shield 70 through the air inlet 71 of the shield 70, directly contacting the power device 40 to absorb the heat generated by the power device 40. Subsequently, the hot air may be exhausted through the air outlet 72 of the shield 70 and finally enter the heat sink 30 for heat dissipation. In this way, by guiding the air exhausted from the speaker module 20 into the interior of the shield 70, so that it directly contacts the power device 40, the contact surface between the flowing air and the power device 40 is increased, thereby effectively improving the heat dissipation efficiency of the speaker module 20 on the power device 40.

[0116] In some embodiments, please refer to FIG8b, which is a schematic diagram of the structure shown in FIG5 in some embodiments. For ease of understanding, the cover plate 211 of the module housing 21 is hidden in FIG8b. The outlet of the second cavity 26 of the speaker module 20 may be positioned relative to the inlet 33 of the heat dissipation device 30 as close as possible to the power device 40. The electronic device 1000 may also include a first heat-conducting element 51. A portion of the first heat-conducting element 51 may be located within the second cavity 26. The portion of the first heat-conducting element 51 located within the second cavity 26 may be positioned relative to the inlet end 231 of the pipe 23 as close as possible to the speaker 22. In this way, a portion of the heat from the power device 40 can be directly absorbed and dissipated by the heat dissipation device 30, and a portion of the heat from the power device 40 can also be transferred to the second cavity 26 of the speaker module 20 through the first heat-conducting element 51, and then transferred to the heat dissipation device 30 through the pipe 23 for dissipation, thereby effectively improving the heat dissipation efficiency of the heat dissipation device 30 for the power device 40.

[0117] In some embodiments, the housing device 100 may further include a second heat-conducting element (not shown). A portion of the second heat-conducting element may be located within the first cavity 25. The second heat-conducting element can be used to transfer heat from the power device 40 to the first cavity 25. Thus, when the diaphragm 221 pushes the air in the first cavity 25 to exhaust to the external environment, it can carry away some of the heat transferred from the power device 40 to the first cavity 25 through the second heat-conducting element, thereby achieving heat dissipation for the power device 40. In other words, by providing the second heat-conducting element to transfer a portion of the heat from the power device 40 to the first cavity 25, the speaker module 20 can dissipate heat from the power device 40 during the same vibration cycle of the diaphragm 221, whether the first cavity 25 is drawing in air or expelling air from the first cavity 25 to the external environment, resulting in high heat dissipation efficiency for the speaker module 20.

[0118] Next, we will introduce another electronic device, 1000.

[0119] Figure 9 is a structural schematic diagram of the electronic device 1000 shown in Figure 1 in another embodiment. Figure 10 is an exploded structural schematic diagram of the housing device 100 of the electronic device 1000 shown in Figure 9 in some embodiments.

[0120] As shown in Figures 9 and 10, the structure of the electronic device 1000 in this embodiment is largely the same as that of the electronic device 1000 shown in Figure 1, and the similarities will not be repeated. The following mainly describes some differences between the two. For example, the electronic device 1000 may not include a heat dissipation device. The heat dissipation device can be installed in the second cavity 26 of the speaker module 20. The heat dissipation hole 121 can also be formed in the frame 111 of the middle frame 11. The heat dissipation hole 121 can be spaced apart from the sound outlet hole 111a. The middle plate 112 of the middle frame 11 can also be provided with a connecting hole 112a. Both the sound outlet hole 111a and the heat dissipation hole 121 can include multiple small holes. The sound outlet hole 111a and the heat dissipation hole 121 can be located on the same side of the frame 111. For ease of understanding, the sound outlet hole 111a and the heat dissipation hole 121 are schematically outlined with dashed lines in Figure 10 and subsequent figures.

[0121] Figure 11 is an exploded structural diagram of the speaker module 20 shown in Figure 10 in some embodiments. Figure 12 is a structural diagram of the main body 212 of the module housing 21 shown in Figure 11 from another perspective. Figure 13 is an assembly structural diagram of the main body 212 and the sealing auxiliary member 60 shown in Figure 12 in some embodiments.

[0122] As shown in Figures 11 to 13, the speaker module 20 may include a speaker 22 and a module housing 21. The module housing 21 may include a cover plate 211 and a main body 212. The main body 212 may include a frame 213, a mounting bracket 24, a first support 214, and a second support 215. The cover plate 211 may be fixedly connected to the periphery of the frame 213. The mounting bracket 24 may be located inside the frame 213 and fixedly connected to the inner surface of the frame 213.

[0123] For example, the first branch 214 can be generally L-shaped. One end of the first branch 214 can be fixedly connected to the inner peripheral side of the frame 213, and the other end can be spaced apart from the frame 213 and the speaker 22. The second branch 215 can also be generally L-shaped. One end of the second branch 215 can be fixedly connected to the inner peripheral side of the frame 213, and the other end can be spaced apart from the frame 213 and the speaker 22. The first branch 214 and the second branch 215 can be parallel and spaced apart. In this case, a gap is formed between the first branch 214 and the second branch 215. A partial cover plate 211 can be located on the same side of the first branch 214 and the second branch 215, and fixedly connected to the first branch 214 and the second branch 215.

[0124] Exemplarily, the mounting bracket 24 can be fixedly connected to the inner peripheral side of the frame 213. A portion of the surface of the mounting bracket 24 facing away from the cover plate 211 can be recessed in the direction toward the cover plate 211, forming a groove 241. The mounting bracket 24 can also have a mounting hole 242. The mounting hole 242 can communicate with the groove 241. Exemplarily, the frame 213 can have a first vent 213a. The first vent 213a can communicate with the groove 241 of the mounting bracket 24.

[0125] For example, the electronic device 1000 may also include a sealing aid 60 (the structure of the sealing aid 60 is also shown in FIG10). The sealing aid 60 may be fixedly connected to the surface of the main body 212 facing away from the cover plate 211. For example, the sealing aid 60 may be fixedly connected to the mounting bracket 24, the first branch 214, and the second branch 215 of the main body 212 facing away from the cover plate 211.

[0126] It should be noted that in this embodiment, the frame 213, the first support 214, the second support 215, and the fixing frame 24 can be integrally formed. For ease of distinction, the frame 213, the first support 214, the second support 215, and the fixing frame 24 are schematically divided by dashed lines in the following figures. In other embodiments, the frame 213, the first support 214, the second support 215, and the fixing frame 24 can also be separate components. This application does not specifically limit this.

[0127] Figure 14 is a structural schematic diagram of the electronic device 1000 shown in Figure 9 from another perspective. Figure 15 is a cross-sectional schematic diagram of one embodiment of the electronic device 1000 shown in Figure 9 cut along BB. Figure 16 is a cross-sectional schematic diagram of one embodiment of the electronic device 1000 shown in Figure 9 cut along CC. Figure 17 is a cross-sectional schematic diagram of one embodiment of the electronic device 1000 shown in Figure 9 cut along DD. It should be noted that, for ease of understanding, the structure of the back cover 12 and the cover plate 211 of the module housing 21 are hidden in Figure 14.

[0128] As shown in Figures 14 to 17, the frame 213 can be fixedly connected to the middle plate 112 and the side frame 111 of the middle frame 11. The fixing bracket 24 can be fixedly connected to the middle plate 112. Part of the fixing bracket 24 can extend into the communicating hole 112a of the middle plate 112 and is fixedly connected to the wall of the communicating hole 112a. The speaker 22 can be fixed to the mounting hole 242 of the fixing bracket 24 and cover the mounting hole 242. At this time, the speaker 22, the fixing bracket 24, and the middle frame 11 can jointly enclose the first cavity 25. The groove 241 of the fixing bracket 24 can form at least a part of the first cavity 25. In this way, by providing the communicating hole 112a in the middle plate 112 of the middle frame 11, and by providing part of the fixing bracket 24 into the communicating hole 112a, the speaker module 20 can utilize the thickness of the middle plate 112 to achieve space reuse, which is beneficial to the thinner design of the electronic device 1000. In other embodiments, the middle plate 112 may not have the communicating hole 112a. The mounting bracket 24 can be fixedly connected to the surface of the middle plate 112 facing the rear cover 12, and together with the middle plate 112 and the speaker 22, it encloses the first cavity 25. In other embodiments, the mounting bracket 24 may also be of other shapes.

[0129] For example, the frame 213 may cover the sound outlet 111a of the frame 111. The first vent 213a of the frame 213 may be connected to the sound outlet 111a. At this time, the first cavity 25 may be connected to the external environment of the electronic device 1000 in sequence through the first vent 213a and the sound outlet 111a.

[0130] For example, the mounting bracket 24, speaker 22, frame 213, cover plate 211, and middle frame 11 can collectively enclose the second cavity 26. The second cavity 26 can be spaced apart from the first cavity 25 and isolated from each other. The frame 213 can also have a second vent 213b. The second vent 213b can be spaced apart from the first vent 213a. The frame 213 can also be disposed close to the frame 111 and cover the heat dissipation holes 121 of the frame 111. The second vent 213b of the frame 213 can communicate with the heat dissipation holes 121. At this time, the second cavity 26 can be connected to the external environment of the electronic device 1000 through the second heat dissipation hole 121 and the heat dissipation hole 121 in sequence.

[0131] For example, the power device 40 may include a circuit board 41 and electronic components 42. There may be multiple electronic components 42. These multiple electronic components 42 may be fixed to the circuit board 41 by means of soldering or the like. The circuit board 41 may be fixed to the middle plate 112 of the middle frame 11 and located within the second cavity 26. The multiple electronic components 42 may be located within the second cavity 26. The power device 40 may be spaced apart from the speaker 22.

[0132] For example, a portion of the first branch 214 may be located within the connecting hole 112a of the middle frame 11 and fixedly connected to the middle plate 112. A portion of the first branch 214 may overlap the surface of the circuit board 41 facing the cover plate 211. A portion of the second branch 215 may be located within the connecting hole 112a of the middle frame 11 and fixedly connected to the middle plate 112. A portion of the second branch 215 may overlap the surface of the circuit board 41 facing the cover plate 211. The cover plate 211 may be fixedly connected to the surface of the first branch 214 and the second branch 215 facing away from the middle plate 112. At this time, the first branch 214, the second branch 215, the frame 213, the middle plate 112, and the circuit board 41 can jointly enclose a flow channel. The portion of the first branch 214, the second branch 215, the frame 213, the middle plate 112, and the circuit board 41 used to enclose the flow channel can jointly constitute a pipe 23. The pipe 23 may include an inlet end 231 and an outlet end 232. The inlet end 231 of the conduit 23 can be positioned close to the power device 40 relative to the speaker 22. The outlet end 232 of the conduit 23 can be fixedly connected to the frame 213. The outlet end 232 can cover the second vent 213b of the frame 213. The opening of the outlet end 232 of the conduit 23 can connect to the second vent 213b. That is, the second cavity 26 can connect to the second vent 213b of the frame 213 through the conduit 23, thereby connecting to the external environment of the electronic device 1000. In other embodiments, the main body 212 may not include the first branch 214 and the second branch 215. The speaker module 20 may also include the conduit 23. The conduit 23 can be an independent structural component and is disposed within the second cavity 26 of the speaker module 20.

[0133] As shown in Figures 14 to 17, the electronic device 1000 may further include a second heat-conducting element 52. The second heat-conducting element 52 can be a vapor chamber (VC), graphite sheet, or other heat-conducting device. The second heat-conducting element 52 can be fixed to the surface of the middle plate 112 of the middle frame 11 facing away from the rear cover 12. The screen 200 can be located on the side of the second heat-conducting element 52 facing away from the middle frame 11 and is fixedly connected to the middle frame 11. The projection of the second heat-conducting element 52 onto the plane of the middle plate 112 can at least partially overlap with the projection of the power device 40 along a first direction onto the plane of the middle plate 112. In this way, the second heat-conducting element 52 can dissipate heat from the power device 40, which is beneficial to improving the heat dissipation efficiency of the power device 40.

[0134] Exemplarily, a portion of the second heat-conducting element 52 may be exposed relative to the connecting hole 112a of the middle frame 11. A portion of the second heat-conducting element 52 may be disposed opposite to the speaker 22. A sealing auxiliary element 60 may be fixedly connected between the mounting bracket 24 and the second heat-conducting element 52. The sealing auxiliary element 60 may be sealing foam. In this case, the second heat-conducting element 52 and the screen 200 can enclose and seal the first cavity 25 and the second cavity 26. Thus, by providing the sealing auxiliary element 60, gaps between the mounting bracket 24 and the second heat-conducting element 52 due to assembly tolerances or other factors can be avoided, preventing interference with the isolation between the first cavity 25 and the second cavity 26. In other embodiments, the electronic device 1000 may not include the sealing auxiliary element 60. The mounting bracket 24 may also be directly fixedly connected to the second heat-conducting element 52.

[0135] Please refer again to Figures 14 to 17. When the diaphragm 221 moves towards the rear cavity 223 of the speaker 22, air from the external environment enters the first cavity 25 through the sound outlet 111a and the first air outlet 213a, meaning the first cavity 25 draws air from the external environment. The air in the rear cavity 223 and the air in the second cavity 26 are compressed by the diaphragm 221 and pass sequentially through the power device 40, the pipe 23, and the second air outlet 213b, finally entering the external environment through the heat dissipation hole 121, meaning the second cavity 26 exhausts air to the external environment. When the air in the second cavity 26 flows past the power device 40, the flowing air can carry away some of the heat generated by the power device 40, forming hot air, which exchanges with the cold air in the external environment, thereby dissipating heat from the power device 40. At this time, the power device 40 can constitute a heat-generating device. That is, when the speaker 22 is working, the vibration of the diaphragm 221 can compress the air in the second cavity 26, and the air flows through the heating device and the pipe 23 in sequence, and is finally discharged through the heat dissipation hole 121, thereby achieving heat dissipation for the heating device.

[0136] In some embodiments, the power device 40 may also be fixed to the middle plate 112 and spaced apart from the speaker module 20. In this case, the power device 40 may be spaced apart from the second cavity 26 and the first cavity 25. The electronic device 1000 may also include a first heat-conducting element (not shown). A portion of the first heat-conducting element may be located within the second cavity 26. The first heat-conducting element may be used to transfer heat from the power device 40 to the second cavity 26. In this case, the portion of the first heat-conducting element located within the second cavity 26 may constitute a heat-generating device. Exemplarily, the second heat-conducting element may be connected to the power device 40 to transfer heat from the power device 40 to the second cavity 26. In other embodiments, the projection of the second heat-conducting element onto the plane of the middle plate 112 may at least partially overlap with the projection of the power device 40 onto the plane of the middle plate 112 along a first direction.

[0137] Please refer again to Figures 14 to 17. When the diaphragm 221 moves towards the first cavity 25, air from the external environment enters the second cavity 26 and the rear cavity 223 through the heat dissipation hole 121, the second air outlet 213b, and the pipe 23. In other words, the second cavity 26 draws air from the external environment. The air inside the first cavity 25 is compressed by the diaphragm 221 and enters the external environment through the first air outlet 213a and the sound outlet 111a. In other words, the first cavity 25 exhausts air to the external environment. When the diaphragm 221 pushes and compresses the air inside the first cavity 25, the air pushed by the diaphragm 221 comes into contact with the second heat conductor 52 and carries away some of the heat absorbed by the second heat conductor 52, forming hot air. The hot air inside the first cavity 25 can exchange with the cold air from the external environment through the sound outlet 111a, thereby dissipating heat from the second heat conductor 52. That is, when the speaker 22 is working, the vibration of the diaphragm 221 can also compress the air in the first cavity 25. After the air passes through the second heat conductor 52, it is discharged through the sound outlet 111a, and some of the heat of the second heat conductor 52 is removed, thereby realizing heat dissipation of the second heat conductor 52, that is, realizing indirect heat dissipation of the heat-generating device (i.e., the power device 40 in this embodiment).

[0138] It is understood that the speaker module 20 in this embodiment has a first cavity 25 and a second cavity 26 that are isolated from each other. The electronic device 1000 also includes a conduit 23, which can be located in the second cavity 26. The heat-generating device (in this embodiment, the power device 40 or part of the first heat-conducting component) can be located in the second cavity 26. The inlet end 231 of the conduit 23 can be positioned closer to the heat-generating device than the speaker 22, and the outlet end 232 of the conduit 23 can connect to the heat dissipation hole 121 of the housing 10. When the diaphragm 221 vibrates and causes the first cavity 25 to draw air from the external environment, the second cavity 26 will exhaust air to the external environment to dissipate the heat from the power device 40 or the first heat-conducting component, thereby achieving heat dissipation for the power device 40. This method, compared to conventional electronic devices that use large fans or heat-conducting components to dissipate heat from the power device, occupies more internal space in the electronic device. In this embodiment, the speaker module 20 is used to dissipate heat from the power device 40. The speaker module 20 can achieve "multi-purpose use", thus saving internal space of the electronic device 1000 while simultaneously dissipating heat from the power device 40.

[0139] Secondly, in this embodiment, a conduit 23 is provided within the second cavity 26. The conduit 23 can act as a bass reflex port to increase the vibration displacement of the diaphragm 221 of the speaker 22. This allows the speaker 22 to effectively increase the exhaust volume of the second cavity 26 and improve heat dissipation efficiency under the same power conditions. In other words, the speaker module 20 in this embodiment can save power consumption while achieving high heat dissipation efficiency by providing the conduit 23 within the second cavity 26. For example, by providing the conduit 23 within the second cavity 26, the vibration displacement of the diaphragm 221 of the speaker 22 can be increased when operating at low frequencies (e.g., when the speaker 22 operates at frequencies between 70 Hz and 200 Hz).

[0140] Furthermore, unlike some speaker module pipes where the inlet opening of the pipe does not face the heat-generating device, allowing most of the air in the second cavity to be directly exhausted to the external environment when the second cavity exhausts air, thus limiting the amount of heat that the second cavity can expel from the heat-generating device and its heat dissipation capacity, the inlet opening 231 of the pipe 23 in this embodiment can face the heat-generating device. This allows the air inside the second cavity 26 to first pass through the heat-generating device, absorbing some of its heat to form hot air, before finally being exhausted to the external environment through the heat dissipation hole 121 via the pipe 23. In other words, when the second cavity 26 exhausts air to the external environment, it can also expel a large amount of heat from the power device 40, which is beneficial for improving the heat dissipation capacity of the power device 40.

[0141] Furthermore, the electronic device 1000 in this embodiment also includes a second heat-conducting element 52. The second heat-conducting element 52 can be used to transfer the heat of the heat-generating device to the first cavity 25. In this way, compared with general electronic devices that do not have a second heat-conducting element, when the diaphragm vibrates within the same vibration cycle, the speaker module only dissipates heat from the heat-generating device when the second cavity exhausts air to the external environment, and the speaker module's heat dissipation capacity for the power device is limited. However, in this embodiment, by setting the second heat-conducting element 52, a portion of the heat of the power device 40 is transferred to the first cavity 25. When the diaphragm 221 of the speaker 22 vibrates within the same vibration cycle, the speaker module 20 can dissipate heat from the power device 40 both when the first cavity 25 draws air from the external environment (i.e., when the second cavity 26 exhausts air from the external environment) and when the first cavity 25 exhausts air from the external environment (i.e., when the second cavity 26 draws air from the external environment), effectively improving the heat dissipation efficiency of the speaker module 20. In other words, in this embodiment, the speaker module 20 can dissipate heat from the power device 40 during the same vibration cycle of the diaphragm 221, whether the first cavity 25 is drawing air into the external environment or expelling air from the first cavity 25 into the external environment, and the speaker module 20 has high heat dissipation efficiency.

[0142] In some embodiments, the speaker module 20 may not include a module housing. The mounting bracket 24, the speaker 22, and the heating element can all be located within the internal space 100a of the housing device 100. The speaker 22, the mounting bracket 24, and the middle frame 11 can collectively enclose a first cavity 25. The speaker 22, the mounting bracket 24, the middle frame 11, and the rear cover 12 can collectively enclose a second cavity 26. That is, the mounting bracket 24 and the speaker 22 can collectively divide the internal space 100a of the housing device 100 into the first cavity 25 and the second cavity 26.

[0143] In some other embodiments, the electronic device 1000 may further include a heat dissipation device. The heat dissipation device may be disposed within the internal space 100a of the housing 100 and spaced apart from the speaker 22. The heat dissipation device may be positioned relative to the power device 40 near the outlet end 232 of the conduit 23. The heat dissipation device may have an inlet and an outlet. The opening of the outlet end 232 of the conduit 23 may face and communicate with the inlet 33 of the heat dissipation device 30. The outlet of the heat dissipation device may communicate with the heat dissipation hole 121. Thus, by using a heat dissipation device in conjunction with the speaker module 20 for heat dissipation, the heat dissipation efficiency of the power device 40 can be effectively improved.

[0144] Figure 18 is a structural schematic diagram of the electronic device 1000 shown in Figure 1 in another embodiment. Figure 19 is an exploded structural schematic diagram of the electronic device 1000 shown in Figure 18 in some embodiments. Figure 20 is an exploded structural schematic diagram of the speaker module 20 shown in Figure 19 in some embodiments. Figure 21 is a structural schematic diagram of a portion of the speaker module 20 shown in Figure 19 from another perspective.

[0145] As shown in Figures 18 to 21, the structure of the electronic device 1000 in this embodiment is largely the same as that of the electronic device 1000 shown in Figure 9, and the similarities will not be repeated. The following mainly describes some differences between the two. For example, the number of diaphragms 221 of the speaker 22 can be two, for example, it can include a first diaphragm 2211 and a second diaphragm 2212. The number of fixing brackets 24 can also be two, for example, it can include a first fixing bracket 24a and a second fixing bracket 24b. The first fixing bracket 24a can be fixedly connected to the second heat-conducting component 52. The second fixing bracket 24b can be fixedly connected to the cover plate 211 of the module housing 21. For example, the first fixing bracket 24a can be integrally formed with the second heat-conducting component 52. The second fixing bracket 24b can be integrally formed with the cover plate 211. In other embodiments, when the middle plate 112 of the middle frame 11 does not include the connecting hole 112a, the first fixing bracket 24a can also be fixedly connected to the middle plate 112 of the middle frame 11.

[0146] Figure 22 is a structural schematic diagram of the housing device 100 shown in Figure 18 from another perspective. Figure 23 is a cross-sectional schematic diagram of one embodiment of the electronic device 1000 shown in Figure 18 cut along EE. Figure 24 is a cross-sectional schematic diagram of one embodiment of the electronic device 1000 shown in Figure 18 cut along FF. For ease of understanding, the rear cover 12, the cover plate 211 of the module housing 21, and the second fixing bracket 24b are hidden in Figure 22. The structure of the rear cover 12 is hidden in both Figures 23 and 24.

[0147] As shown in Figures 22 to 24, the speaker 22 can be located between the first fixing frame 24a and the second fixing frame 24b, and is fixedly connected to the first fixing frame 24a, the second fixing frame 24b, and the frame 213. In this case, the speaker 22, the first fixing frame 24a, the middle frame 11, and the second heat-conducting component 52 can together enclose the first sub-cavity 251. The speaker 22, the second fixing frame 24b, and the cover plate 211 can together enclose the second sub-cavity 252. The first sub-cavity 251 can be isolated from the second sub-cavity 252. The first sub-cavity 251 and the second sub-cavity 252 can together constitute the first cavity 25.

[0148] Exemplarily, the first diaphragm 2211 and the second diaphragm 2212 can be fixed to opposite sides of the device rear shell 222. The first diaphragm 2211, the device rear shell 222, and the second diaphragm 2212 can together enclose the rear cavity 223 of the speaker 22. The rear cavity 223 of the speaker 22 can communicate with the second cavity 26 of the speaker module 20. Exemplarily, the first diaphragm 2211 can be opposite to and spaced apart from the second heat-conducting element 52. The second diaphragm 2212 can be opposite to and spaced apart from the cover plate 211.

[0149] Exemplarily, the first vent 213a of the frame 213 may include a first sub-vent 2131 and a second sub-vent 2132. The frame 213 may be disposed close to the edge 111 of the middle frame 11 and cover the sound hole 111a. The first sub-vent 2131 may connect to a portion of the sound hole 111a, and the second sub-vent 2132 may connect to another portion of the sound hole 111a. The first sub-cavity 251 of the speaker 22 may connect to the first sub-vent 2131. The second sub-cavity 252 may connect to the second sub-vent 2132. That is, the first sub-cavity 251 can connect to the sound hole 111a through the first sub-vent 2131 to connect to the external environment. The second sub-cavity 252 can connect to the sound hole 111a through the second sub-vent 2132 to connect to the external environment.

[0150] For example, when the speaker 22 is in heat dissipation mode, the two diaphragms 221 of the speaker 22 can vibrate in the same direction. By setting the two diaphragms 221 to vibrate in the same direction when the speaker 22 is in heat dissipation mode, the stiffness of the rear cavity 223 of the speaker 22 can be canceled out by the co-vibrating diaphragms 221. This helps to increase the vibration displacement of the diaphragms 221 at lower operating frequencies (i.e., in heat dissipation mode in this embodiment), thereby increasing the exhaust volume of the second cavity 26 and improving the heat dissipation efficiency of the speaker module 20. Simultaneously, the co-vibration of the two diaphragms 221 can also cancel out far-field sounds, reducing heat dissipation noise in heat dissipation mode and effectively improving the user experience. In other words, the speaker module 20 in this embodiment can achieve both efficient heat dissipation and low heat dissipation noise, resulting in a better user experience.

[0151] For example, when the speaker 22 is in external playback mode, the two diaphragms 221 of the speaker 22 can vibrate in opposite directions, that is, the vibration directions of the two diaphragms 221 can be opposite. In this way, the two diaphragms 221 vibrating in opposite directions can make the sounds emitted by the two diaphragms 221 superimpose in the same direction, thereby improving the sound quality in external playback mode and improving the user experience.

[0152] In some embodiments, the main body 212 of the module housing 21 can also be hollowed out internally. This can reduce the weight of the module housing 21, which is beneficial for achieving a lightweight design of the electronic device 1000.

[0153] In some embodiments, please refer to FIG25, which is a structural schematic diagram of the electronic device 1000 shown in FIG9 in another embodiment. Exemplarily, the electronic device 1000 may further include multiple speaker modules 20. The multiple speaker modules 20 may be arranged in an array. When the multiple speaker modules 20 are in heat dissipation mode, the phase of the speakers within the multiple speaker modules 20 can be controlled by a controller (not shown) to cancel low-frequency sounds, reduce heat dissipation noise, and improve the user experience.

[0154] For example, the number of speaker modules 20 can be four, such as a first speaker module 201, a second speaker module 202, a third speaker module 203, and a fourth speaker module 204. The four speaker modules 20 can be located at the four corners of the housing device 100. When the multiple speaker modules 20 are in heat dissipation mode, the phase of the first speaker module 201 can be opposite to the phase of the second speaker module 202 and the third speaker module 203. The phase of the first speaker module 201 can also be the same as the phase of the fourth speaker module. That is, the first speaker module 201 can be opposite to the phase of the nearest speaker module 20 and the same as the phase of the remaining speaker modules 20.

[0155] It should be noted that, in the absence of conflict, the features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0156] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0157] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing device (100), characterized in that, The shell device (100) comprises a middle frame (11), a back cover (12), a loudspeaker module (20) and a heat dissipation device (30), the back cover (12) is fixedly connected to the periphery of the middle frame (11) and surrounds the internal space (100a) of the shell device (100) with the middle frame (11), the loudspeaker module (20) and the heat dissipation device (30) are arranged in the internal space (100a), the middle frame (11) has a sound hole (111a) which communicates the internal space (100a) of the shell device (100) with the external space of the shell device (100), the loudspeaker module (20) comprises a first cavity (25) and a second cavity (26) which are isolated from each other, and the first cavity (25) of the loudspeaker module (20) communicates with the sound hole (111a). The shell device (100) further comprises a power device (40), and the outlet of the second cavity (26) is arranged closer to the power device (40) than to the heat dissipation device (30). Alternatively, the shell device (100) further comprises a power device (40) and a first heat conduction device (51), the outlet of the second cavity (26) is arranged closer to the heat dissipation device (30) than to the power device (40), and a part of the first heat conduction device (51) is connected to the power device (40) and arranged closer to the outlet of the second cavity (26) than to the heat dissipation device (30).

2. The housing device (100) according to claim 1, characterized in that The outlet of the second cavity (26) of the loudspeaker module (20) is arranged towards the power device (40) or the first heat conduction device (51).

3. The housing device (100) according to claim 1 or 2, characterized in that The heat dissipation device (30) has an inlet (33) arranged towards the power device (40) or the first heat conduction device (51).

4. The housing device (100) according to claim 3, characterized in that The back cover (12) has a heat dissipation hole (121), and the heat dissipation device (30) further has an outlet (34) arranged towards the back cover (12) and communicating with the heat dissipation hole (121).

5. The housing device (100) according to claim 3 or 4, characterized in that The power device (40) is located between the inlet (33) and the outlet (34) of the second cavity (26). Alternatively, at least part of the first heat conduction device (51) is located between the inlet (33) and the outlet (34) of the second cavity (26).

6. The housing device (100) according to any one of claims 1 to 5, characterized in that The shell device (100) further comprises a shielding cover (70) fixed to the middle frame (11) and surrounding the power device (40), the shielding cover (70) has an air inlet (71) and an air outlet (72), the outlet of the second cavity (26) of the loudspeaker module (20) communicates with the air inlet (71), and the air outlet (72) communicates with the internal space (100a).

7. The housing device (100) according to claim 6, characterized in that The air outlet (72) is arranged closer to the heat dissipation device (30) than to the power device (40).

8. The housing device (100) according to any one of claims 1 to 6, characterized in that The loudspeaker module (20) comprises a module housing (21) and a loudspeaker (22), the first cavity (25) and the second cavity (26) are located inside the module housing (21), the module housing (21) has an air outlet, the second cavity (26) communicates with the internal space (100a) of the housing device (100) through the air outlet, and the air outlet constitutes an outlet (34) of the second cavity (26). The loudspeaker (22) is arranged in the internal space (100a), and a diaphragm of the loudspeaker (22) is used to push air in the first cavity (25) or air in the second cavity (26) when vibrating.

9. The housing device (100) according to claim 8, characterized in that The module housing (21) comprises a cover plate (211), a frame (213) and a fixing frame (24), the fixing frame (24) is fixed to the middle frame (11), the fixing frame (24) has a mounting hole (242), the loudspeaker (22) is fixed to the mounting hole (242), and the loudspeaker (22), the fixing frame (24) and the middle frame (11) jointly enclose the first cavity (25). The frame (213) is fixed to the middle frame (11) and surrounds the fixing frame (24) and the loudspeaker (22), the cover plate (211) is fixedly connected to the periphery of the frame (213), and the cover plate (211), the frame (213), the fixing frame (24), the loudspeaker (22) and the middle frame (11) jointly enclose the second cavity (26).

10. The housing device (100) according to claim 8 or 9, characterized in that The loudspeaker module (20) further comprises a pipeline (23), the pipeline (23) is arranged in the second cavity (26), the pipeline (23) has an inlet end (231) and an outlet end (232), the inlet end (231) is arranged in a spaced manner with the loudspeaker (22), the outlet end (232) is fixed to the module housing (21) and covers the air outlet, and an opening of the outlet end (232) communicates with the air outlet.

11. The housing device (100) according to any one of claims 8 to 10, characterized in that The radial dimension of the outlet end (232) gradually increases in a direction close to the power device (40) or the first heat conduction member (51).

12. The housing device (100) according to any one of claims 8 to 11, characterized in that The loudspeaker (22) further comprises a device rear shell (222) and a magnetic circuit assembly, the diaphragm (221) is fixedly connected to the device rear shell (222) and encloses a rear cavity (223) of the loudspeaker (22) together with the device rear shell (222), the magnetic circuit assembly is arranged in the rear cavity (223), the device rear shell (222) has a gas leakage port (222a), and the gas leakage port (222a) communicates the second cavity (26) with the rear cavity (223).

13. The housing device (100) according to any one of claims 8 to 12, characterized in that The shell device (100) further comprises a second heat conduction member (52), the second heat conduction member (52) is fixed to the middle frame (11), the second heat conduction member (52) is located on the same side of the middle frame (11) as the power device (40), part of the second heat conduction member (52) is located in the first cavity (25), and the second heat conduction member (52) is used for transmitting heat of the power device (40) to the first cavity (25).

14. The housing device (100) according to claim 13, characterized in that The second heat conduction member (52) is connected to the power device (40). Alternatively, the second heat conduction member (52) is arranged in a spaced manner with the power device (40), the middle frame (11) is made of a metal material, and heat of the power device (40) is transmitted to the second heat conduction member (52) through the middle frame (11).

15. The housing device (100) according to any one of claims 8 to 12, characterized in that The middle frame (11) comprises a middle plate (112) and a frame (111), the frame (111) is fixedly connected to the periphery of the middle plate (112), the back cover (12) is located on the side of the frame (111) away from the middle plate (112) and is fixedly connected to the periphery of the frame (111), and the middle plate (112) is provided with a communication hole (112a) communicating with the first cavity (25). The shell device (100) further comprises a second heat conduction member (52), the second heat conduction member (52) is located on the side of the middle plate (112) away from the back cover (12) and is fixedly connected to the middle plate (112), part of the second heat conduction member (52) is exposed relative to the communication hole (112a), and the second heat conduction member (52) is used for transmitting heat of the power device (40) to the first cavity (25).

16. The housing device (100) according to any one of claims 13 to 15, characterized in that The diaphragm (221) is arranged opposite to the second heat conduction member (52).

17. The housing device (100) according to any one of claims 5 to 13, characterized in that The shell device (100) comprises a processor and a power amplifier, the processor is electrically connected to the power amplifier and the loudspeaker (22), and the power amplifier is electrically connected to the loudspeaker (22). The loudspeaker (22) has an external playing mode and a heat dissipation mode, when the loudspeaker (22) is in the external playing mode, the processor transmits a first signal to the power amplifier, the power amplifier transmits a second signal to the loudspeaker (22) according to the first signal, and the loudspeaker (22) works according to the second signal; When the loudspeaker (22) is in the heat dissipation mode, the processor transmits a third signal to the loudspeaker (22), and the loudspeaker (22) works according to the third signal.

18. The housing device (100) according to claim 17, characterized in that When the loudspeaker (22) is in the heat dissipation mode, the working frequency of the loudspeaker (22) is greater than 20 Hz, or the working frequency of the loudspeaker (22) is in the range of 70 Hz to 200 Hz.

19. The housing device (100) according to claim 17 or 18, characterized in that The number of diaphragms (221) of the loudspeaker (22) is two, when the loudspeaker (22) is in the heat dissipation mode, the vibration directions of the two diaphragms (221) are the same, and when the loudspeaker (22) is in the external playing mode, the vibration directions of the two diaphragms (221) are opposite.

20. A housing device (100), characterized by The shell device (100) comprises a shell (10), a loudspeaker (22), a fixing frame (24) and a duct (23), the shell (10) has a sound hole (111a) and a heat dissipation hole (121), the shell (10) comprises a middle frame (11) and a back cover (12), the back cover (12) is fixedly connected to the periphery of the middle frame (11) and surrounds an inner space (100a) of the shell device (100) with the middle frame (11), the sound hole (111a) and the heat dissipation hole (121) both communicate the inner space (100a) of the shell device (100) with the outer space of the shell device (100); The fixing frame (24) is fixed to the middle frame (11), the fixing frame (24) has a mounting hole (242), the loudspeaker (22) is fixed to the mounting hole (242), the loudspeaker (22), the fixing frame (24) and the middle frame (11) jointly divide the inner space (100a) into a first cavity (25) and a second cavity (26), a diaphragm (221) of the loudspeaker (22) is used to push the air in the first cavity (25) or the air in the second cavity (26) when vibrating, the duct (23) is arranged in the second cavity (26), the duct (23) has an inlet end (231) and an outlet end (232), an opening of the outlet end (232) communicates with the heat dissipation hole (121); The shell device (100) further comprises a power device (40), the power device (40) is arranged in the second cavity (26), the inlet end (231) is arranged close to the power device (40) compared with the loudspeaker (22); Alternatively, the shell device (100) further comprises a power device (40) and a first heat conduction device (51), the power device (40) is arranged apart from the loudspeaker (22), at least part of the first heat conduction device (51) is located in the second cavity (26), the first heat conduction device (51) is used to transfer the heat of the power device (40) to the second cavity (26), the inlet end (231) is arranged close to the first heat conduction device (51) compared with the loudspeaker (22).

21. The housing device (100) according to claim 20, characterized in that The shell device (100) further comprises a heat dissipation device (30), the heat dissipation device (30) is arranged close to the outlet end (232) of the duct (23) compared with the power device (40) or the first heat conduction device (51), the heat dissipation device (30) has an inlet (33) and an outlet (34), the opening of the outlet end (232) is arranged towards the heat dissipation device (30) and communicates with the inlet (33), the outlet (34) communicates with the heat dissipation hole (121).

22. A housing device (100), characterized by The shell device (100) comprises a shell (10) and a speaker module (20), the shell (10) has a sound hole (111a) and a heat dissipation hole (121), the shell (10) comprises a middle frame (11) and a back cover (12), the back cover (12) is fixedly connected to the periphery of the middle frame (11) and surrounds an inner space (100a) of the shell device (100) with the middle frame (11), the sound hole (111a) and the heat dissipation hole (121) both communicate the inner space (100a) of the shell device (100) with the outer space of the shell device (100), and the speaker module (20) is arranged in the inner space (100a); The speaker module (20) comprises a module shell (21), a speaker (22) and a pipe (23), the inner part of the module shell (21) has a first cavity (25) and a second cavity (26) which are isolated from each other, the first cavity (25) communicates with the sound hole (111a), the speaker (22) is arranged in the inner part of the module shell (21), the diaphragm (221) of the speaker (22) is used to push the air in the first cavity (25) or the air in the second cavity (26) when vibrating, and the pipe (23) is arranged in the second cavity (26), the pipe (23) has an inlet end (231) and an outlet end (232), the outlet end (232) is fixedly connected to the module shell (21), and the opening of the outlet end (232) communicates with the heat dissipation hole (121); The shell device (100) further comprises a power device (40), the power device (40) is arranged in the second cavity (26), and the inlet end (231) is arranged closer to the power device (40) than the speaker (22); Alternatively, the shell device (100) further comprises a power device (40) and a first heat conduction device (51), the power device (40) is arranged separately from the speaker module (20), part of the first heat conduction device (51) is located in the second cavity (26), the first heat conduction device (51) is used to transfer the heat of the power device (40) to the second cavity (26), and the inlet end (231) is arranged closer to the first heat conduction device (51) than the speaker (22).

23. The housing device (100) according to claim 22, characterized in that The module shell (21) comprises a cover plate (211), a frame body (213) and a fixing frame (24), the fixing frame (24) is fixed to the middle frame (11), the fixing frame (24) has a mounting hole (242), the speaker (22) is fixed to the mounting hole (242), the speaker (22), the fixing frame (24) and the middle frame (11) jointly surround the first cavity (25), and the first cavity (25) communicates with the sound hole (111a). The frame (213) is fixed to the middle frame (11) and surrounds the fixing frame (24) and the loudspeaker (22), the cover plate (211) is fixedly connected to the periphery of the frame (213), and the cover plate (211), the frame (213), the fixing frame (24), the loudspeaker (22) and the middle frame (11) jointly enclose a second cavity (26).

24. The housing device (100) according to claim 22 or 23, characterized in that The shell device (100) further comprises a heat dissipation device (30), the heat dissipation device (30) is arranged in the internal space (100a) and is arranged in a spaced manner with the loudspeaker module (20), the heat dissipation device (30) has an inlet (33) and an outlet (34), the opening of the outlet end (232) is arranged towards the heat dissipation device (30) and is communicated with the inlet (33), and the outlet (34) is communicated with the heat dissipation hole (121).

25. The housing device (100) according to any one of claims 20 to 24, characterized in that The opening of the inlet end (231) is arranged towards the power device (40) or the first heat conduction device (51).

26. The housing device (100) according to any one of claims 20 to 25, characterized in that The shell device (100) further comprises a second heat conduction device (52), the second heat conduction device (52) is fixed to the middle frame (11), the second heat conduction device (52) is located on the same side of the middle frame (11) as the power device (40), part of the second heat conduction device (52) is located in the first cavity (25), and the second heat conduction device (52) is used for transmitting heat of the power device (40) to the first cavity (25).

27. The housing device (100) according to claim 26, characterized in that The second heat conduction device (52) is connected to the power device (40). Alternatively, the second heat conduction device (52) is arranged in a spaced manner with the power device (40), the middle frame (11) is made of a metal material, and heat of the power device (40) is transmitted to the second heat conduction device (52) through the middle frame (11).

28. The housing device (100) according to any one of claims 20 to 25, characterized in that The middle frame (11) comprises a middle plate (112) and a frame (111), the frame (111) is fixedly connected to the periphery of the middle plate (112), the back cover (12) is located on the side of the frame (111) away from the middle plate (112) and is fixedly connected to the periphery of the frame (111), the middle plate (112) is provided with a communication hole (112a), and the communication hole (112a) is communicated with the first cavity (25). The shell device (100) further comprises a second heat conduction device (52), the second heat conduction device (52) is located on the side of the middle plate (112) away from the back cover (12) and is fixedly connected to the middle plate (112), part of the second heat conduction device (52) is exposed relative to the communication hole (112a), and the second heat conduction device (52) is used for transmitting heat of the power device (40) to the first cavity (25).

29. The housing device (100) according to any one of claims 26 to 28, characterized in that The diaphragm (221) is arranged in a spaced manner relative to the second heat conduction device (52).

30. The housing device (100) according to any one of claims 20 to 29, characterized in that, The shell device (100) further comprises a processor and a power amplifier, the processor is electrically connected to the power amplifier and the loudspeaker (22), and the power amplifier is electrically connected to the loudspeaker (22) and the processor. The loudspeaker (22) has an external playing mode and a heat dissipation mode, when the loudspeaker (22) is in the external playing mode, the processor transmits a first signal to the power amplifier, the power amplifier transmits a second signal to the loudspeaker (22) according to the first signal, and the loudspeaker (22) works according to the second signal; When the loudspeaker (22) is in the heat dissipation mode, the processor transmits a third signal to the loudspeaker (22), and the loudspeaker (22) works according to the third signal.

31. The housing device (100) according to claim 30, characterized in that When the loudspeaker (22) is in the heat dissipation mode, the working frequency of the loudspeaker (22) is greater than or equal to 20 Hz, or the working frequency of the loudspeaker (22) is in the range of 70 Hz to 200 Hz.

32. An electronic device (1000), characterized by, A housing device (100) according to any one of claims 1 to 31 and a screen (200) mounted to the housing device (100).

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