Optoelectronic component and optoelectronic assembly

Abstract

An optoelectronic component comprises a connection interface. The connection interface comprises a first electrical contact pad, a second electrical contact pad, a first thermal contact pad area, and a second thermal contact pad area, The first electrical contact pad and the second electrical contact pad are arranged between the first thermal contact pad area and the second thermal contact pad area.

Description

[0001] OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC ASSEMBLY

[0002] DESCRIPTION

[0003] The present invention relates to an optoelectronic component and to an optoelectronic assembly .

[0004] This patent application claims the priority of German patent application 10 2024 121 197 . 0 , the disclosure content of which is hereby incorporated by reference .

[0005] Optoelectronic components and optoelectronic assemblies comprising such optoelectronic components are known in the state of the art . Known optoelectronic components comprise connection interfaces with one or more contact pads .

[0006] It is an obj ect of the present invention to provide an optoelectronic component . It is a further obj ect of the present invention to provide an optoelectronic assembly . These obj ectives are accomplished by an optoelectronic component and by an optoelectronic assembly as disclosed in the independent claims . Di f ferent variants are disclosed in the dependent claims .

[0007] An optoelectronic component comprises a connection interface . The connection interface comprises a first electrical contact pad, a second electrical contact pad, a first thermal contact pad area, and a second thermal contact pad area . The first electrical contact pad and the second electrical contact pad are arranged between the first thermal contact pad area and the second thermal contact pad area .

[0008] In the connection interface of this optoelectronic component , the first electrical contact pad and the second electrical contact pad are arranged near a center of the connection interface . This ensures that mechanical stress acting on the electrical contact pads which is caused by di f ferent thermal expansions is low . Advantageously, this increases the relia- bility of the optoelectronic component .

[0009] In a variant of the optoelectronic component , the first thermal contact pad area, the first electrical contact pad, and the second thermal contact pad area are arranged one behind the other along a first line which is parallel to a first direction . The first thermal contact pad area, the second electrical contact pad, and the second thermal contact pad area are arranged one behind the other along a second line which is parallel to the first direction . This allows for a compact arrangement , where the electrical contact pads are arranged between the thermal contact pad areas .

[0010] In a variant of the optoelectronic component , the first electrical contact pad and the second electrical contact pad are arranged one behind the other along a third line which is perpendicular to the first direction . This arrangement allows to place the electrical contact pads particularly close to the center of the connection interface .

[0011] In a variant of the optoelectronic component , the first electrical contact pad and the second electrical contact pad have the same si ze . This allows for a symmetric design of the connection interface of the optoelectronic component .

[0012] In a variant of the optoelectronic component , the first thermal contact pad area is formed by a first thermal contact pad and the second thermal contact pad area is formed by a second thermal contact pad which is separate from the first thermal contact pad . Advantageously, this allows to place the electrical contact pads between the separate thermal contact pads .

[0013] In a variant of the optoelectronic component , the first thermal contact pad and the second thermal contact pad have the same si ze . Advantageously, this allows for a symmetric design of the connection interface . In a variant of the optoelectronic component , the first thermal contact pad is larger than the first electrical contact pad . Advantageously, this makes it possible to remove a lot of heat from the optoelectronic component via the first thermal contact pad .

[0014] In a variant of the optoelectronic component , the first thermal contact pad has rounded corners . Corners of the first thermal contact pad facing away from the first electrical contact pad and the second electrical contact pad have a larger curvature radius than other corners of the first thermal contact pad . Advantageously, rounded corners having a large curvature radius reduce a risk of a damage of a solder connection caused by mechanical stress . Advantageously, this increases the reliability of the optoelectronic component .

[0015] In a variant of the optoelectronic component , the first thermal contact pad area and the second thermal contact pad area are connected by a third thermal contact pad area and a fourth thermal contact pad area . The first electrical contact pad and the second electrical contact pad are arranged between the third thermal contact pad area and the fourth thermal contact pad area . Advantageously, this arrangement also allows to place the first electrical contact pad and the second electrical contact pad closed to the center of the connection interface .

[0016] In a variant of the optoelectronic component , the first thermal contact pad area, the second thermal contact pad area, the third thermal contact pad area, and the fourth thermal contact pad area are formed by a ring-shaped thermal contact pad . Advantageously, this arrangement allows for a compact and symmetric design of the connection interface .

[0017] In a variant of the optoelectronic component , the first thermal contact pad area and the second thermal contact pad area are connected by a third thermal contact pad area . The third thermal contact pad area is arranged between the first elec- trical contact pad and the second electrical contact pad . Advantageously, this arrangement allows to connect the thermal contact pad areas which supports a thermal equalisation between the di f ferent thermal contact pad areas .

[0018] In a variant of the optoelectronic component , the first thermal contact pad area, the second thermal contact pad area, and the third thermal contact pad area are formed by an Jishaped thermal contact pad . Advantageously, this arrangement provides a compact and symmetric design of the connection interface .

[0019] In a variant of the optoelectronic component , the connection interface is mirror symmetric with respect to a first symmetry axis . The first symmetry axis can be parallel to the first direction, for example .

[0020] In a variant of the optoelectronic component , the connection interface is mirror symmetric with respect to a second symmetry axis . The second symmetry axis can be perpendicular to the first direction, for example .

[0021] One variant of the optoelectronic component comprises an optoelectronic semiconductor chip . The optoelectronic semiconductor chip may be a light-emitting diode chip ( LED-chip ) , for example .

[0022] One variant of the optoelectronic component is a surfacemount device . Advantageously, this allows to mount the optoelectronic component in an automated way .

[0023] An optoelectronic assembly comprises a carrier and an optoelectronic component as described above . The first electrical contact pad, the second electrical contact pad, the first thermal contact pad area, and the second thermal contact pad area of the optoelectronic component are connected to contact pads arranged on a surface of the carrier . The electrical contact pads of the optoelectronic component of this optoelectronic assembly are placed near a center of the connection interface of the optoelectronic component . This ensures that mechanical stress acting on the electrical contact pads of the optoelectronic component and caused by di f ferent thermal expansions of the optoelectronic component and the carrier of the optoelectronic assembly is low even in the case that the coef ficients of thermal expansion ( GTE ) of the optoelectronic component and the carrier are mismatched . This reduces a risk of the connections between the electrical contact pads of the optoelectronic component and the contact pads of the carrier getting damaged due to the mechanical stress .

[0024] The contact pads arranged on the surface of the carrier can be designed complementarily to the connection interface of the optoelectronic component .

[0025] The above-described properties , features , and advantages of this invention, as well as the manner in which they are achieved, will become more clearly and comprehensively understandable through the following description of exemplary variants . These variants will be explained in more detail in conj unction with the drawings , in which, in schematic representation :

[0026] Fig . 1 shows an optoelectronic assembly;

[0027] Fig . 2 shows a first variant of a connection interface of an optoelectronic component ;

[0028] Fig . 3 shows a second variant of the connection interface ; and

[0029] Fig . 4 shows a third variant of the connection interface . Fig . 1 shows a schematic side view of an optoelectronic assembly 100 . The optoelectronic assembly 100 comprises an optoelectronic component 200 and a carrier 110 .

[0030] The optoelectronic component 200 can be a light-emitting or a light-detecting component , for example . To this end, the optoelectronic component 200 can comprise an optoelectronic semiconductor chip 210 which may be a light-emitting chip or a light-detecting chip, for example . In one example , the optoelectronic semiconductor chip 210 is a light-emitting diode chip ( LED chip ) .

[0031] The optoelectronic component 200 may comprise a package that includes a substrate which forms a connection interface 300 at a lower side of the optoelectronic component 200 . The substrate can be a ceramic substrate , for example . The ceramic substrate may comprise AIN, for example . In other variants , the connection interface 300 can be formed directly on the optoelectronic semiconductor chip 210 .

[0032] The carrier 110 of the optoelectronic assembly 100 can be a printed circuit board ( PCB ) , for example . The carrier 110 has a surface 111 . The optoelectronic component 200 is arranged on the surface 111 of the carrier 110 such that the connection interface 300 of the optoelectronic component 200 is oriented towards the surface 111 .

[0033] Fig . 2 , Fig . 3 , and Fig . 4 show schematic representations of three examples of the connection interface 300 of the optoelectronic component 200 . In each example , the connection interface 300 comprises a first electrical contact pad 410 , a second electrical contact pad 420 , a first thermal contact pad area 510 , and a second thermal contact pad area 520 .

[0034] The first electrical contact pad 410 and the second electrical contact pad 420 are separate and spaced apart from each other and from the first thermal contact pad area 510 and the second thermal contact pad area 520 . The first electrical contact pad 410 and the second electrical contact pad 420 are electrically isolated from each other and from the first thermal contact pad area 510 and the second thermal contact pad area 520 .

[0035] The first electrical contact pad 410 and the second electrical contact pad 420 are provided for connecting the optoelectronic component 200 electrically to supply the optoelectronic component 200 with an electric voltage and with electric current . The first thermal contact pad area 510 and the second thermal contact pad area 520 are provided for connecting the optoelectronic component 200 thermally to remove heat from the optoelectronic component 200 .

[0036] In the optoelectronic assembly 100 shown in Fig . 1 , the first electrical contact pad 410 , the second electrical contact pad 420 , the first thermal contact pad area 510 , and the second thermal contact pad area 520 of the optoelectronic component 200 are connected to contact pads 120 arranged on the surface 111 of the carrier 110 . The connections can be made using a solder or a conductive glue , for example .

[0037] The contact pads 120 arranged on the surface 111 of the carrier 110 can be designed complementarily to the first electrical contact pad 410 , the second electrical contact pad 420 , the first thermal contact pad area 510 , and the second thermal contact pad area 520 of the connection interface 300 of the optoelectronic component 200 such that the contact pads 120 are mirror symmetric with respect to the first electrical contact pad 410 , the second electrical contact pad 420 , the first thermal contact pad area 510 , and the second thermal contact pad area 520 . In other variants , the contact pads 120 can be slightly larger or smaller than the first electrical contact pad 410 , the second electrical contact pad 420 , the first thermal contact pad area 510 , and the second thermal contact pad area 520 or can di f fer in other ways . The optoelectronic component 200 can be a surface-mount device . In this case , the optoelectronic component 200 can be connected to the carrier 110 by surface-mount technology .

[0038] In all examples of the connection interface 300 , the first electrical contact pad 410 and the second electrical contact pad 420 are arranged between the first thermal contact pad area 510 and the second thermal contact pad area 520 . In particular, the first thermal contact pad area 510 , the first electrical contact pad 410 , and the second thermal contact pad area 520 are arranged one behind the other along a first line 311 which is parallel to a first direction 301 in the plane of the connection interface 300 . The first thermal contact pad area 510 , the second electrical contact pad 420 , and the second thermal contact pad area 520 are arranged one behind the other along a second line 312 which is also parallel to the first direction 301 . This allows the first electrical contact pad 410 and the second electrical contact pad 420 to be placed close to a center of the connection interface 300 . Near the center of the connection interface 300 , mechanical stress caused by di f ferent thermal expansions of the optoelectronic component 200 and the carrier 110 of the optoelectronic assembly 100 is relatively low, even in the case that the coef ficients of thermal expansion ( GTE ) of the optoelectronic component 200 and the carrier 110 are mismatched .

[0039] In the examples of the connection interface 300 shown in Figs . 2 and 3 , the first electrical contact pad 410 and the second electrical contact pad 420 are arranged one behind the other along a third line 313 which is parallel to a second direction 302 which is perpendicular to the first direction 301 in the plane of the connection interface 300 . In the third example of the connection interface 300 shown in Fig . 4 , the first electrical contact pad 410 and the second electrical contact pad 420 are also arranged one behind the other along the third line 313 , but a third thermal contact pad area 530 is arranged between the first electrical contact pad 410 and the second electrical contact pad 420 . In all depicted examples of the connection interface 300 , the first electrical contact pad 410 and the second electrical contact pad 420 have the same si ze . There may be other variants of the connection interface 300 , however, where the first electrical contact pad 410 and the second electrical contact pad 420 have di f ferent si zes .

[0040] All depicted examples of the connection interface 300 are mirror symmetric with respect to a first symmetry axis 321 which is parallel to the first direction 301 and with respect to a second symmetry axis 322 which is parallel to the second direction 302 . Other variants of the connection interface 300 , however, may be mirror symmetric with respect to only a single symmetry axis 321 , 322 or may have no mirror symmetry at all .

[0041] In the first example of the connection interface 300 shown in Fig . 2 , the first thermal contact pad area 510 is formed by a first thermal contact pad 610 . The second thermal contact pad area 520 is formed by a second thermal contact pad 620 which is separate from the first thermal contact pad 610 . The first thermal contact pad 610 and the second thermal contact pad 620 are separate and spaced apart from each other and from the first electrical contact pad 410 and the second electrical contact pad 420 .

[0042] In the example shown in Fig . 2 , the first thermal contact pad 610 and the second thermal contact pad 620 have the same si ze . The first thermal contact pad 610 is larger than the first electrical contact pad 410 . In other variants , however, the first thermal contact pad 610 and the second thermal contact pad 620 may have di f ferent si zes . In some variants of the connection interface 300 , the first thermal contact pad 610 may have the same si ze as the first electrical contact pad 410 or may be smaller . In the example shown in Fig . 2 , the first thermal contact pad

[0043] 610 has rounded corners 611 . Outer corners 611 , 612 of the first thermal contact pad 610 facing away from the first electrical contact pad 410 and the second electrical contact pad 420 have a larger curvature radius than the other corners

[0044] 611 of the first thermal contact pad 610 . The second thermal contact pad 620 is designed accordingly in a mirror symmetric way . The large curvature radius of the outer corners 612 of the first thermal contact pad 610 may reduce a risk that a solder connection between the first thermal contact pad 610 and a contact pad 120 of the carrier 110 of the optoelectronic assembly 100 breaks due to shear forces . The corner 611 of the first thermal contact pad 610 and the second thermal contact pad 620 may be designed di f ferently in other variants of the connection interface 300 of the optoelectronic component 200 , however .

[0045] In the second example of the connection interface 300 of the optoelectronic component 200 shown in Fig . 3 , the first thermal contact pad area 510 and the second thermal contact pad area 520 are connected by a third thermal contact pad area 530 and a fourth thermal contact pad area 540 . The first electrical contact pad 410 and the second electrical contact pad 420 are arranged between the third thermal contact pad area 530 and the fourth thermal contact pad area 540 . In this example , the first thermal contact pad area 510 , the second thermal contact pad area 520 , the third thermal contact pad area 530 , and the fourth thermal contact pad area 540 are formed by a single ring-shaped thermal contact pad 630 such that the first thermal contact pad area 510 , the second thermal contact pad area 520 , the third thermal contact pad area 530 , and the fourth thermal contact pad area 540 are all connected to each other .

[0046] In the third example of the connection interface 300 of the optoelectronic component 200 shown in Fig . 4 , the first thermal contact pad area 510 and the second thermal contact pad area 520 are connected by the third thermal contact pad area 530 that is arranged between the first electrical contact pad 410 and the second electrical contact pad 420 in this case . In this example , the first thermal contact pad area 510 , the second thermal contact pad area 520 , and the third thermal contact pad area 530 are formed by a single H-shaped thermal contact pad 640 such that the first thermal contact pad area 510 , the second thermal contact pad area 520 , and the third thermal contact pad area 530 are all connected to each other . The invention has been illustrated and described in more detail with the aid of exemplary variants . The invention is not , however, restricted to the examples disclosed . Rather, other variants may be derived therefrom by the person skilled in the art .

[0047] REFERENCE SYMBOLS optoelectronic assembly carrier surface contact pad optoelectronic component optoelectronic semiconductor chip connection interface first direction second direction f irst line second line third line first symmetry axis second symmetry axis first electrical contact pad second electrical contact pad first thermal contact pad area second thermal contact pad area third thermal contact pad area fourth thermal contact pad area first thermal contact pad corner outer corner second thermal contact pad ring-shaped thermal contact pad H-shaped thermal contact pad

Claims

CLAIMS1. An optoelectronic component (200) comprising a connection interface (300) , the connection interface (300) comprising a first electrical contact pad (410) , a second electrical contact pad (420) , a first thermal contact pad area (510) , and a second thermal contact pad area (520) , wherein the first electrical contact pad (410) and the second electrical contact pad (420) are arranged between the first thermal contact pad area (510) and the second thermal contact pad area (520) .

2. The optoelectronic component (200) according to claim 1, wherein the first thermal contact pad area (510) , the first electrical contact pad (410) , and the second thermal contact pad area (520) are arranged one behind the other along a first line (311) which is parallel to a first direction (301) , wherein the first thermal contact pad area (510) , the second electrical contact pad (420) , and the second thermal contact pad area (520) are arranged one behind the other along a second line (312) which is parallel to the first direction (301) .

3. The optoelectronic component (200) according to claim 2, wherein the first electrical contact pad (410) and the second electrical contact pad (420) are arranged one behind the other along a third line (313) which is perpendicular to the first direction.

4. The optoelectronic component (200) according to any one of the preceding claims, wherein the first electrical contact pad (410) and the second electrical contact pad (420) have the same size.

5. The optoelectronic component (200) according to any one of the preceding claims, wherein the first thermal contact pad area (510) is formed by a first thermal contact pad (610) and the second thermal contact pad area (520) is formed by a second thermal contact pad (620) which is separate from the first thermal contact pad (610) .

6. The optoelectronic component (200) according to claim 5, wherein the first thermal contact pad (610) and the second thermal contact pad (620) have the same size.

7. The optoelectronic component (200) according to any one of claims 5 and 6, wherein the first thermal contact pad (610) is larger than the first electrical contact pad (410) .

8. The optoelectronic component (200) according to any one of claims 5 to 7, wherein the first thermal contact pad (610) has rounded corners (611) , wherein corners (611, 612) of the first thermal contact pad (610) facing away from the first electrical contact pad (410) and the second electrical contact pad (420) have a larger curvature radius than other corners (611) of the first thermal contact pad (610) .

9. The optoelectronic component (200) according to any one of claims 1 to 4, wherein the first thermal contact pad area (510) and the second thermal contact pad area (520) are connected by a third thermal contact pad area (530) and a fourth thermal contact pad area (540) , wherein the first electrical contact pad (410) and the second electrical contact pad (420) are arranged between the third thermal contact pad area (530) and the fourth thermal contact pad area (540) .

10. The optoelectronic component (200) according to claim 9, wherein the first thermal contact pad area (510) , the second thermal contact pad area (520) , the third thermal contact pad area (530) , and the fourth thermal contact pad area (540) are formed by a ring-shaped thermal contact pad ( 630 ) .

11. The optoelectronic component (200) according to any one of claims 1 to 4, wherein the first thermal contact pad area (510) and the second thermal contact pad area (520) are connected by a third thermal contact pad area (530) , wherein the third thermal contact pad area (530) is arranged between the first electrical contact pad (410) and the second electrical contact pad (420) .

12. The optoelectronic component (200) according to claim 11, wherein the first thermal contact pad area (510) , the second thermal contact pad area (520) , and the third thermal contact pad area (530) are formed by an H-shaped thermal contact pad (640) .

13. The optoelectronic component (200) according to any one of the preceding claims, wherein the connection interface (300) is mirror symmetric with respect to a first symmetry axis (321) .

14. The optoelectronic component (200) according to any one of the preceding claims, wherein the connection interface (300) is mirror symmetric with respect to a second symmetry axis (322) .

15. The optoelectronic component (200) according to any one of the preceding claims, wherein the optoelectronic component (200) comprises an optoelectronic semiconductor chip (210) .

16. The optoelectronic component (200) according to any one of the preceding claims, wherein the optoelectronic component (200) is a surfacemount device.

17. An optoelectronic assembly (100) comprising a carrier (110) and an optoelectronic component (200) as claimed in any one of the preceding claims, wherein the first electrical contact pad (410) , the sec- ond electrical contact pad (420) , the first thermal contact pad area (510) , and the second thermal contact pad area (520) of the optoelectronic component (200) are connected to contact pads (120) arranged on a surface (111) of the carrier (110) .

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